Semiconductor structure and method for fabricating same

Abstract

An embodiment of the present invention relates to a semiconductor field, and provides a semiconductor structure and a fabrication method thereof, in which the semiconductor structure includes a substrate, an active layer arranged on the substrate at intervals, and a plurality of bit lines, the plurality of bit lines are arranged at intervals along a first direction, the bit lines extend along a second direction, a first portion of each bit line covers a side surface of the active layer, and a second portion of each bit line is disposed within the active layer, the first direction and the second direction are both parallel to a surface of the substrate, and the first direction crosses the second direction, which can improve the reliability of the semiconductor structure.

Description

[Technical field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to a Chinese patent application filed with the China Patent Office on June 13, 2022, bearing application number 202210664897.2 and entitled "Semiconductor structure and method for fabricating same," the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE Embodiments of the present invention relate to the field of semiconductor technology, and more particularly to semiconductor structures and methods for their fabrication. [Background technology]

[0003] Memory is a storage component for storing programs and various data information. Random access memory (RAM) used in normal computer systems is divided into two types: dynamic random access memory (DRAM) and static random access memory (SRAM). Dynamic random access memory is a semiconductor memory device commonly used in computers and is composed of many overlapping memory cells.

[0004] A memory cell typically comprises a capacitor and a transistor, the drain electrode of the transistor being connected to a bit line and the source electrode being connected to the capacitor, the capacitor including a capacitive contact structure and a capacitor, and the word line of the memory cell can control the on / off of the channel area of ​​the transistor, thereby allowing data information stored in the capacitor to be read via the bit line or data information to be written and stored in the capacitor via the bit line.

[0005] However, at present, there is a problem in that it is difficult to form linearly connected bit lines. Summary of the Invention [Problem to be solved by the invention]

[0006] SUMMARY OF THE DISCLOSURE Embodiments of the present invention provide a semiconductor structure and method for fabricating the same that can reduce the difficulty of forming linearly connected bit lines. [Means for solving the problem]

[0007] According to some embodiments of the present invention, one aspect of the embodiments of the present invention provides a semiconductor structure comprising a substrate, an active layer arranged at intervals in the substrate, and a plurality of bit lines, the bit lines are arranged at intervals along a first direction, the bit lines extend along a second direction, a first portion of each of the bit lines covers a side of the active layer, and a second portion of each of the bit lines is disposed within the active layer, the first direction and the second direction are both parallel to a surface of the substrate, and the first direction intersects the second direction.

[0008] In some embodiments, the first portion includes two first conductive structures spaced apart and extending along the second direction, and the second portion includes a plurality of second conductive structures, the plurality of second conductive structures being disposed within the active layer, the plurality of second conductive structures being disposed between at least two of the first conductive structures, and each of the second conductive structures is in contact with and electrically connected to the first conductive structure.

[0009] In some embodiments, the second conductive structures are connected together along an extension direction of the bit line and extend through the active layer.

[0010] In some embodiments, the material of the second conductive structure comprises a metal silicide and the material of the first conductive structure comprises a conductive metal.

[0011] In some embodiments, the first conductive structure has a thickness in the first direction of between 1 nm and 3 nm.

[0012] In some embodiments, in a plane perpendicular to the substrate, a height of an overlapping portion between the projection of the second conductive structure and the projection of the first conductive structure is 0.5 to 1 times a height of the projection of the second conductive structure.

[0013] According to some embodiments of the present invention, another aspect of the embodiments of the present invention further provides a method for fabricating a semiconductor structure, the method including: providing a base; forming an active layer in the base, the active layer being spaced apart along a first direction; and forming a plurality of bit lines arranged at intervals along the first direction, the bit lines extending along a second direction, a first portion of each of the bit lines covering a side of the active layer, and a second portion of each of the bit lines being disposed within the active layer, the first direction and the second direction are both parallel to a surface of the base, and the first direction intersects the second direction.

[0014] In some embodiments, forming the plurality of bit lines includes forming a plurality of first conductive structures extending along the second direction, the first conductive structures being disposed on sides of the active layer spaced apart along the first direction, and forming a plurality of second conductive structures, the plurality of second conductive structures being disposed within the active layer, the second conductive structures being disposed between at least two of the first conductive structures and in contact with and electrically connected to the first conductive structures.

[0015] In some embodiments, forming the first conductive structure includes providing the base; patterning the base to form the active layers distributed at intervals along the first direction; forming a first isolation layer, the first isolation layer being disposed between adjacent active layers and a top surface of the first isolation layer being lower than a top surface of the active layers; and forming the first conductive structure on the first isolation layer.

[0016] In some embodiments, forming the first isolation layer includes forming a first mask layer on a surface of the base, and etching the first mask layer and the base to form a plurality of first trenches extending along the second direction, the first trenches being disposed between adjacent ones of the active layers, and forming the first isolation layer in the first trenches by filling the first trenches with an insulating material and removing a portion of the insulating material.

[0017] In some embodiments, forming the first conductive structures on the first isolation layer includes forming a second mask layer, the second mask layer being disposed on the first isolation layer and covering a sidewall of the active layer; removing a portion of the first isolation layer and a portion of the sidewall of the active layer under the second mask layer to form a first trench; depositing a first conductive material in the first trench and patterning the first conductive material to form spaced apart first conductive structures.

[0018] In some embodiments, forming the second conductive structure includes etching the active layer to form a plurality of second trenches extending along the first direction, where a bottom surface of the second trenches is higher than a top surface of the first conductive structure; forming a third mask layer in the second trenches, where the third mask layer covers a sidewall of the second trench; and depositing a second conductive material at the bottom of the second trenches and forming the second conductive structure by a rapid thermal process.

[0019] In some embodiments, the second conductive material includes a metal material, and during a rapid thermal processing process, the metal material diffuses into the active layer to form a metal silicide, and the metal silicide is disposed at least between two of the first conductive structures to form the second conductive structure.

[0020] In some embodiments, the rapid thermal processing temperature is between 400°C and 800°C.

[0021] In some embodiments, a plurality of the second conductive structures disposed between two of the first conductive structures are connected to each other and extend through the active layer along the second direction. Effect of the Invention

[0022] The technical solution according to the embodiment of the present invention has at least the following advantages: By providing a first part of the bit line covering the side of the active layer and a second part of the bit line disposed in the active layer, the bit line can be connected in a line in the second direction, thereby realizing the read and write function of the bit line and reducing the difficulty of forming the bit line. [Brief description of the drawings]

[0023] [Figure 1] 1 is a top view of a semiconductor structure according to one embodiment of the present invention. [Diagram 2] 1 is a cross-sectional view of a semiconductor structure according to one embodiment of the present invention. [Diagram 3] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 4] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Diagram 5] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 6] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 7] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 8] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 9] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 10] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 11] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 12] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 13] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 14] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 15] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 16] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. [Figure 17] 3A-3C are schematic diagrams of a structure corresponding to steps of a method for fabricating a semiconductor structure according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] One or more embodiments are illustratively described with reference to corresponding drawings, and these illustrative descriptions do not constitute limitations on the embodiments, and unless otherwise specified, the figures in the drawings do not constitute limitations on scale. In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced above. Obviously, the above drawings are only some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to these drawings without creative efforts.

[0025] An embodiment of the present invention provides a semiconductor structure having a first portion of a bit line on a side of an active layer and a second portion of the bit line within the active layer, such that the bit line is linearly connected in a second direction. The connection between the first and second portions can improve the reliability of the semiconductor structure and ensure the transmission function of the bit line.

[0026] Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings. However, as can be understood by those skilled in the art, although many technical details are provided in each embodiment of the present invention to allow the reader to better understand the present invention, the technical solutions claimed in the present invention can be realized without various changes and modifications based on these technical details and each embodiment below.

[0027] 1 and 2, FIG. 1 is a top view of a semiconductor structure according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the dashed line in FIG. 1 according to one embodiment of the present invention.

[0028] Referring to FIG. 1, the semiconductor structure includes a substrate 100, an active layer 110 arranged at intervals on the substrate 100, a plurality of bit lines 120, a plurality of word lines 130, and a dielectric layer 140, in which the plurality of bit lines 120 are arranged at intervals along a first direction X, the bit lines 120 extend along a second direction Y, the word lines 130 extend along the first direction X and are arranged at intervals along the second direction Y, the dielectric layer 140 is disposed on the sidewalls of the active layer 110 and is used to avoid direct contact between the word lines 130 and the active layer 110, the first direction X and the second direction Y are both parallel to the surface of the substrate 100, and the first direction X crosses the second direction Y.

[0029] In some embodiments, the material of the substrate 100 may be a material such as silicon, germanium, or silicon germanium, and the material of the substrate 100 may be doped. For example, the material of the substrate 100 is silicon, and a P-type base may be formed by doping the substrate 100 with a trace amount of a trivalent element such as boron, indium, gallium, or aluminum. Similarly, an N-type base may be formed by doping the substrate 100 with a trace amount of a pentavalent element such as phosphorus, antimony, or arsenic. The selection of the doping element of the substrate 100 may be determined by considering the actual needs and product performance, and the present invention is not limited to the material of the substrate 100 and the doped element.

[0030] In some embodiments, the word line 130 may be a multi-layer stack structure including, for example, a polysilicon layer, a metal layer, and a protective layer, where the polysilicon layer can avoid abnormalities that occur when the electrical signal of the base material is directly transmitted to the metal layer of the word line 130, the metal layer can improve the signal transmission speed of the word line 130, and the protective layer can avoid oxidation of the metal layer of the word line 130 due to contact with the outside world and avoid a decrease in the conductive ability of the word line 130 caused by oxidation of part of the metal layer.

[0031] In some embodiments, the material of the dielectric layer 140 is an insulating material, such as silicon oxide or silicon nitride, which can avoid semiconductor structure abnormalities due to direct contact between the word lines 130 and the active layer 110 .

[0032] Referring to FIG. 2, in some embodiments, a first portion of each bit line 120 covers a side surface of the active layer 110, and a second portion of each bit line 120 is disposed within the active layer 110, with the first portion being disposed to cover a side surface of the active layer 110 and the second portion being disposed within the active layer 110, such that the bit lines 120 become a continuous whole, thereby ensuring the continuity of signal transmission of the bit lines 120 and improving the reliability of the semiconductor structure.

[0033] In some embodiments, the first portion includes two first conductive structures 121 spaced apart and extending along the second direction Y, and the second portion includes a plurality of second conductive structures 122, the plurality of second conductive structures 122 being disposed in the active layer 110, the plurality of second conductive structures 122 being disposed at least between two of the first conductive structures 121, and each of the second conductive structures 122 being in contact with and electrically connected to the first conductive structures 121.

[0034] By providing the first conductive structure 121 so as to be in contact with and electrically connected to the second conductive structure 122, the bit line 120 can be made into a continuous whole, and by providing the first conductive structure 121 on both sidewalls of the active layer 110 spaced apart along the first direction X, the first conductive structure 121 and the second conductive structure 122 are connected at both sidewalls of the active layer 110 spaced apart along the first direction X, thereby improving the reliability of the conduction of the bit line 120.

[0035] In some embodiments, the multiple second conductive structures 122 are connected together along the extension direction of the bit lines 120 and penetrate the active layer 110; as can be understood, when the effect of the process of forming the second conductive structures 122 (e.g., a metal silicide process) is sufficiently good so that the second conductive structures 122 can penetrate the active layer 110 along the extension direction of the bit lines 120, the second conductive structures 122 can make the bit lines 120 form a continuous whole; in this case, the first conductive structure 121 can play the role of improving the conductive performance of the bit lines 120 and improving the connection reliability of the bit lines 120.

[0036] It should be noted that, since it is difficult to form the second conductive structure 122 penetrating the active layer 110 along the extension direction of the bit line 120 using the metal silicide process, the first conductive structure 121 is formed to connect the second conductive structures 122 arranged at intervals along the second direction to form a continuous bit line 120, thereby improving the reliability of the semiconductor structure.

[0037] In some embodiments, the material of the second conductive structure 122 may include a metal silicide, and the material of the first conductive structure 121 includes a conductive metal, such as titanium nitride, tungsten, or molybdenum. By using a metal silicide as the material of the second conductive structure 122, the contact resistance between the second conductive structure 122 and the active layer 110 can be reduced, and by using a metal material as the material of the first conductive structure 121, the transmission rate of the first conductive structure 121 can be improved.

[0038] In some embodiments, the thickness of the first conductive structure 121 in the first direction X is 1 nm to 3 nm, for example, the thickness of the first conductive structure 121 is 1.5 nm or 2 nm, etc. If the thickness of the first conductive structure 121 is less than 1 nm, the resistance of the first conductive structure 121 is relatively large, which may affect the conductivity of the bit line 120, and if the thickness of the first conductive structure 121 is more than 3 nm, it may cause the connection between adjacent bit lines 120 or mutual interference between adjacent bit lines 120. In some other embodiments, the thickness of the first conductive structure may be other sizes, and the thickness of the first conductive structure can be adjusted according to actual needs.

[0039] In some embodiments, in a plane perpendicular to the substrate 100, the height of the overlapping portion between the projection of the second conductive structure 122 and the projection of the first conductive structure 121 is 0.5 to 1 times the height of the projection of the second conductive structure 122. As can be understood, when the height of the overlapping portion between the projection of the second conductive structure 122 and the projection of the first conductive structure 121 is lower than 0.5 times the height of the projection of the second conductive structure 122, the interface contact resistance between the first conductive structure 121 and the second conductive structure 122 is relatively high, and by setting the height of the overlapping portion between the projection of the second conductive structure 122 and the projection of the first conductive structure 121 to 0.5 to 1 times the height of the projection of the second conductive structure 122, the interface contact resistance between the first conductive structure 121 and the second conductive structure 122 can be reduced. In some other embodiments, the height of the overlapping portion between the projection of the second conductive structure and the projection of the first conductive structure is 0.5 to 1 times the height of the projection of the first conductive structure.

[0040] As can be understood, in a direction perpendicular to the substrate 100, when the height of the second conductive structure 122 is equal to or less than the height of the first conductive structure 121 and the projection of the second conductive structure 122 is located within the projection of the first conductive structure 121, the height of the overlapping portion between the projection of the second conductive structure 122 and the projection of the first conductive structure 121 is one time the height of the projection of the second conductive structure 122. In a direction perpendicular to the substrate 100, when the height of the second conductive structure 122 is equal to or more than the height of the first conductive structure 121 and the projection of the first conductive structure 121 is located within the projection of the second conductive structure 122, the height of the overlapping portion between the projection of the second conductive structure 122 and the projection of the first conductive structure 121 is one time the height of the projection of the first conductive structure 121.

[0041] In some embodiments, the semiconductor structure further comprises a first isolation layer 170, a second isolation layer 200, a third isolation layer 240, and a fourth isolation layer 250, where the first isolation layer 170 is disposed on the surface of the substrate 100 and disposed between the active layers 110, the second isolation layer 200 is disposed on an upper surface of the first isolation layer 170, the third isolation layer 240 is disposed on an upper surface of the second conductive structure 122, the upper surface of the third isolation layer 240 is lower than the upper surface of the active layer 110 and higher than or flush with the upper surface of the first conductive structure 121, the fourth isolation layer 250 is disposed on an upper surface of the third isolation layer 240, and the fourth isolation layer 250 is disposed between adjacent word lines 130 and also disposed on the upper surfaces of the active layers 110 and the word lines 130.

[0042] In the semiconductor structure according to the embodiment of the present invention, a first portion of the bit line 120 is arranged to cover the side of the active layer 110, a second portion of the bit line 120 is arranged to be disposed within the active layer 110, and the first and second portions are electrically connected, so that the bit line 120 becomes a continuous whole in the second direction, thereby improving the stability of the transmission signal of the bit line 120 and further improving the reliability of the semiconductor structure.

[0043] Another embodiment of the present invention further provides a method for fabricating a semiconductor structure, which can be used to form the above-mentioned semiconductor structure. Hereinafter, the method for fabricating a semiconductor structure according to another embodiment of the present invention will be described with reference to the drawings. It should be noted that for parts that are the same as or corresponding to the above-mentioned embodiments, reference can be made to the corresponding descriptions of the above-mentioned embodiments, and will not be repeated below.

[0044] 3 and 4, a base 101 is provided, and active layers 110 are formed on the base 101, the active layers 110 being spaced apart from one another along a first direction X. As shown in FIG.

[0045] It should be noted that after the base 101 has been patterned, the portion of the base 101 that is at the bottom of the active layer 110 is referred to as the substrate 100 .

[0046] In some embodiments, forming the active layer 110 may include forming a first mask layer 150 on a surface of the base 101, and etching the first mask layer 150 and the base 101 to form a plurality of first trenches 160 extending along the second direction Y, the first trenches 160 being disposed between adjacent active layers 110. That is, the first trenches 160 and the active layer 110 are parts of the base 101 that are patterned and removed and formed in the same process, and the remaining base 101 surrounds the first trenches 160, and uses a part of the base 101 as the active layer 110. The formation of the first trenches 160 provides a process foundation for the subsequent formation of the first conductive structure.

[0047] In some embodiments, the active layer 110 can be formed by a self-aligned double patterning (SADP) process, and in other embodiments, the active layer 110 can be formed by a self-aligned quadruple patterning (SAQP) process. The SADP or SAQP technique can make the pattern of the active layer 110 more precise.

[0048] In some embodiments, after forming the active layer 110, the first mask layer 150 is left, and by leaving the first mask layer 150, the top surface of the formed active layer 110 can be protected, thereby preventing contamination of the top surface of the active layer 110 and improving the stability of the semiconductor structure. In some other embodiments, after forming the active layer, the method for fabricating the semiconductor structure can further include removing the first mask layer.

[0049] 5 and 6, a first isolation layer 170 is formed, the first isolation layer 170 is disposed between adjacent active layers 110, and the top surface of the first isolation layer 170 is lower than the top surface of the active layers 110.

[0050] Specifically, referring to FIG. 5, the first trench 160 is filled with an insulating material to form the first initial isolation layer 171. In some embodiments, the top surface of the first initial isolation layer 171 is higher than the top surface of the active layer 110, and a part of the first initial isolation layer 171 can be removed by patterning so that the top surface of the first initial isolation layer 171 is flush with the top surface of the active layer 110. It should be noted that flush here refers to the top surface of the first initial isolation layer 171 being completely flush with the top surface of the active layer 110. Alternatively, the top surface of the first initial isolation layer 171 can be considered to be flush with the top surface of the active layer 110 when the height difference between the top surface of the first initial isolation layer 171 and the top surface of the active layer 110 is within a tolerable range.

[0051] In some embodiments, the insulating material can be silicon oxide or silicon nitride, etc. For example, if the insulating material is silicon oxide, the material of silicon oxide is soft and convenient to fill and etch. Forming the first initial isolation layer 171 by filling with silicon oxide can further facilitate the subsequent patterning of the first initial isolation layer 171.

[0052] Referring to FIG. 6, a first isolation layer 170 is formed in the first trench 160 by removing a portion of the insulating material, and then removing the insulating material after filling the first trench 160. This allows the thickness of the first isolation layer 170 to be controlled, thereby allowing a more precise first isolation layer 170 to be formed.

[0053] In some embodiments, the first isolation layer 170 is formed by etching the first initial isolation layer 171 by wet etching, and the thickness of the first initial isolation layer 171 removed by etching can be controlled by controlling the concentration of the etching reagent and the etching time.

[0054] 7 to 16, a plurality of bit lines 120 are formed, the bit lines 120 being arranged at intervals along a first direction X, the bit lines 120 extending along a second direction Y, a first portion of each bit line 120 covering a side surface of the active layer 110, and a second portion of each bit line 120 being disposed within the active layer 110, the first direction X and the second direction Y being both parallel to the surface of the base 101, and the first direction X intersects with the second direction Y. By forming the bit lines 120 with the first portion covering the side surface of the active layer 110 and the second portion being disposed within the active layer 110, the bit lines 120 are made to be one continuous whole, thereby ensuring the continuity of signal transmission of the bit lines 120 and improving the reliability of the semiconductor structure.

[0055] 7 to 10, a plurality of first conductive structures 121 extending along a second direction Y are formed, the first conductive structures 121 being disposed on sides of the active layer 110 spaced apart along the first direction, and the plurality of first conductive structures 121 constituting a first portion of a bit line 120. The formation of the first conductive structures 121 may provide a basis for subsequently forming a continuous bit line 120 by connecting a second conductive structure, thereby improving the reliability of the semiconductor structure.

[0056] 7, a second initial mask layer 181 is formed, the second initial mask layer 181 is disposed on the top of the first isolation layer 170, and the second initial mask layer 181 covers the sidewall of the active layer 110. In some embodiments, the second initial mask layer 181 can be formed on the sidewall of the active layer 110, the top surface of the first isolation layer 170, the sidewall of the first mask layer 150 and the top surface of the first mask layer 150 by atomic layer deposition, and the second initial mask layer 181 can be used as a mask layer for subsequently etching the first isolation layer 170, and the second initial mask layer 181 formed by atomic layer deposition is relatively uniform, which is convenient for controlling the thickness of the second initial mask layer 181 to be formed.

[0057] In some embodiments, the material of the second initial mask layer 181 may be carbon or a carbon-containing organic material, etc., where the carbon or carbon-containing organic material is relatively soft, has a fast etching rate, and has a relatively precise pattern used as a mask, thereby improving the accuracy of the subsequently formed first conductive structure.

[0058] 8, the second initial mask layer 181 is patterned (see FIG. 7) and removed (see FIG. 7) from the upper surface of the first mask layer 150 and the surface of a portion of the first isolation layer 170 to form second mask layers 180 spaced apart in a first direction, the second mask layer 180 being disposed on the first isolation layer 170, and the second mask layer 180 covering the sidewalls of the active layer 110. The formation of the second mask layer 180 can be used as a mask for subsequently forming the spaced apart first conductive structures.

[0059] 9, a portion of the first isolation layer 170 and a portion of the sidewall of the active layer 110 disposed under the second mask layer 180 are removed to form a first groove 190. It should be noted that in the process of etching the first isolation layer 170, the etching reagent inevitably contacts the active layer 110, so that the etching reagent also etches a portion of the active layer 110. In some other embodiments, only a portion of the first isolation layer 170 may be etched. The formation of the first groove 190 provides a process basis for the subsequent formation of a first conductive structure. By etching a portion of the active layer 110, a larger space can be provided for the subsequently formed first conductive structure, thereby increasing the width of the first conductive structure and decreasing the resistance of the first conductive structure.

[0060] 10, a first conductive material is deposited in the first groove 190 to form a first initial conductive structure, and the first conductive material is patterned to form the spaced apart first conductive structures 121. In some embodiments, the spaced apart first conductive structures 121 can be formed by filling the first groove 190 with the first conductive material and patterning the first initial conductive structure using the second mask layer 180 as a mask. In other embodiments, the first conductive structures 121 can be formed on the bottom surface of the second mask layer by selective atomic layer deposition. The formation of the first conductive structures 121 provides a basis for the subsequent formation of bit lines that are linearly connected in the first direction.

[0061] As can be seen, the spaced apart first conductive structures 121 formed by patterning the first initial conductive structure are first conductive structures 121 of different bit lines, in other words, the first conductive structures 121 arranged on either side of the same active layer 110 are first portions of the same bit line.

[0062] 11 to 15, a plurality of second conductive structures 122 are formed, and the plurality of second conductive structures 122 are disposed in the active layer 110, and the second conductive structures 122 are disposed at least between two first conductive structures 121 and in contact with and electrically connected to the first conductive structures 121. By forming the second conductive structures 122 electrically connected to the first conductive structures 121, a continuous bit line 120 is formed, so that the bit line 120 is integrated as a whole, thereby improving the reliability of the semiconductor structure.

[0063] Specifically, referring to FIG. 11, the first mask layer 150 and the second mask layer 180 are removed to expose the upper surfaces of the active layer 110 and the first isolation layer 170.

[0064] Referring to FIG. 12 , a second isolation layer 200 is formed, the second isolation layer 200 is disposed on the upper surface of the first isolation layer 170, and the second isolation layer 200 is disposed between the active layers 110. By providing the second isolation layer 200, the first conductive structure 121 can be protected and the subsequently formed word line can be prevented from contacting the first conductive structure 121.

[0065] In some embodiments, forming the second separation layer 200 may include forming a second initial separation layer, the second initial separation layer covering the top surface of the active layer 110, patterning the second initial separation layer until the top surface of the active layer 110 is exposed, and using the remaining second initial separation layer as the second separation layer 200.

[0066] Referring to FIG. 13, the active layer 110 is etched to form a plurality of second trenches 210 extending along a first direction X, the bottom surfaces of the second trenches 210 being higher than the top surfaces of the first conductive structures 121, and the second trenches 210 being used to subsequently form a third mask layer, and forming the second trenches 210 provides a process foundation for the subsequent formation of the second conductive structures.

[0067] In some embodiments, the method of fabricating a semiconductor structure further comprises etching a portion of the second isolation layer 200 .

[0068] In some embodiments, the second trench 210 may be formed by forming a fourth mask layer 230 on the upper surface of the active layer 110 and patterning the active layer 110 using the fourth mask layer 230 as a mask, and the second trench 210 may have a more precise pattern depending on the manner in which the fourth mask layer 230 is formed. In other embodiments, other methods may be used to form the second trench.

[0069] In some embodiments, after forming the second trench 210, the fourth mask layer 230 is left, and by leaving the fourth mask layer 230, the active layer 110 can be protected from contamination in subsequent processes, thereby improving the reliability of the semiconductor structure.

[0070] In some embodiments, the material of the fourth mask layer 230 may be the same as the material of the first mask layer 150, and both may be materials such as silicon nitride.

[0071] 14, a third mask layer 220 is formed in the second trench 210, and the third mask layer 220 covers the sidewall of the second trench 210. By forming the third mask layer 220, the active layer 110 can be protected when forming the second conductive structure in a subsequent metal silicide process, thereby avoiding contamination of the inner wall of the second trench 210, and by forming the third mask layer 220, the reliability of the semiconductor structure is improved.

[0072] In some embodiments, forming the third mask layer 220 may include forming a third initial mask layer and patterning the third initial mask layer to form a separated third mask layer 220, where the third initial mask layer further covers the upper surface of the fourth mask layer 230 and the surface of the active layer 110. In the process of patterning the third initial mask layer, the fourth mask layer 230 can be used as an etching stop layer for etching the third initial mask layer, and the fourth mask layer 230 can avoid direct contact between the etching reagent and the upper surface of the active layer 110, thereby avoiding contamination of the upper surface of the active layer 110, and improving the reliability of the semiconductor structure.

[0073] In some embodiments, the material of the third mask layer 220 may be the same as the material of the second mask layer 180, and both may be carbon or carbon-containing organic, or the like.

[0074] 15, a second conductive material is deposited at the bottom of the second trench 210, and a second conductive structure 122 is formed by rapid thermal processing. In some embodiments, the second conductive material may include a metal material, and during the rapid thermal processing process, the metal material may diffuse into the active layer 110 to form a metal silicide, and the metal silicide may be disposed at least between two first conductive structures 121 to form the second conductive structure 122, that is, by adopting a metal silicide process to form the second conductive structure 122, the resistance during the formation of the second conductive structure 122 can be reduced, and the performance of the semiconductor structure can be further improved. After forming the second conductive structure 122, the method for fabricating the semiconductor structure further includes removing the second conductive material to expose an upper surface of the second conductive structure 122.

[0075] In some embodiments, the rapid thermal processing can be rapid thermal annealing (RTA), and in some embodiments, two rapid thermal annealing steps can be used to avoid shorting due to overgrowth of second conductive structure 122.

[0076] Specifically, forming the second conductive structure 122 may include the following steps: depositing a second conductive material at the bottom of the second trench 210, taking the second conductive material as titanium and the material of the active layer as single crystal silicon as an example, after depositing the second conductive material, a titanium nitride thin film is deposited on the surface of the titanium, and the titanium nitride thin film can prevent the titanium from flowing during the rapid thermal annealing process. A first rapid thermal annealing process is performed, and the titanium reacts with the single crystal silicon of the active layer 110 to form a high resistance metal silicide. The titanium and the titanium nitride thin film can be removed by selective wet etching. A second rapid thermal annealing process is performed, and the high resistance metal silicide can be converted into a low resistance metal silicide by the second rapid thermal annealing process. The low resistance metal silicide is the second conductive structure. It can be understood that the above titanium nitride thin film, titanium and single crystal silicon materials are merely examples for convenience of explanation, and do not limit the materials of the second conductive material, the thin film on the second conductive material and the active layer 110, which can be adjusted according to actual circumstances.

[0077] In some embodiments, the temperature of the rapid thermal processing may be 400°C to 800°C. If the temperature of the rapid thermal processing is lower than 400°C, the formation speed during the formation of the second conductive structure 122 is relatively slow, and the morphology of the formed second conductive structure 122 is not good. If the temperature of the rapid thermal processing is higher than 800°C, the formation of the second conductive structure 122 may affect the first conductive structure 121, which may cause abnormality of the first conductive structure 121. Therefore, by setting the temperature of the rapid thermal processing to 400°C to 800°C, the formation speed and morphology of the second conductive structure 122 can be ensured, while avoiding the influence of the semiconductor structure on other structures.

[0078] In some embodiments, the number of rapid thermal processes is two, and the temperature of the latter rapid thermal process may be higher than that of the former rapid thermal process.

[0079] In some embodiments, the multiple second conductive structures 122 disposed between the two first conductive structures 121 are connected to each other and penetrate the active layer 110 along the second direction Y. By forming the multiple second conductive structures 122 connected to each other, the formed bit line 120 becomes one continuous whole, which can improve the stability of signal transmission of the bit line 120 and further improve the reliability of the semiconductor structure.

[0080] It should be noted that the metal silicide process cannot ensure that a continuous whole is formed in the active layer 110 after the metal ions are diffused, so by forming the first conductive structure 121 first and then performing the metal silicide process, even if the metal silicide process does not form a continuous whole in the active layer 110, the interconnection between the first conductive structure 121 and the second conductive structure 122 makes the bit line 120 a continuous whole, thereby ensuring the stability of signal transmission of the bit line 120 and further improving the reliability of the semiconductor structure.

[0081] Referring to FIG. 16, the third mask layer 220 and the fourth mask layer 230 are removed to expose the top surfaces of the active layer 110 and the second conductive structure 122.

[0082] Referring to FIG. 17, forming the word lines 130, in some embodiments, forming the word lines 130 may include forming a third isolation layer 240 in the second trench 210, where an upper surface of the third isolation layer 240 is lower than an upper surface of the active layer 110 and higher than an upper surface of the first conductive structure or is flush with an upper surface of the first conductive structure 121; forming a dielectric layer 140, where the dielectric layer 140 is disposed on a sidewall of the active layer 110; forming the word lines 130, where the word lines 130 are disposed on the sidewalls of the dielectric layer 140 and adjacent word lines 130 are spaced apart in the second direction Y; and forming a fourth isolation layer 250, where the fourth isolation layer 250 fills the second trench 210 and covers the upper surfaces of the word lines 130 and the active layer 110.

[0083] In some embodiments, forming the third isolation layer 240 may include forming a third initial isolation layer, where an upper surface of the third initial isolation layer is flush with an upper surface of the active layer 110, patterning the third initial isolation layer, and using the remaining third initial isolation layer as the third isolation layer 240. By controlling the concentration of the etching reagent and the etching time when etching the third initial isolation layer, the height of the formed third isolation layer 240 in a direction perpendicular to the substrate 100 can be controlled. By forming the third isolation layer 240, contact between the word line 130 and the first conductive structure 121 can be avoided, and abnormalities in the semiconductor structure can be avoided, thereby improving the reliability of the semiconductor structure.

[0084] In some embodiments, forming the dielectric layer 140 may include forming the dielectric layer 140 by thermal oxidation, where the density of the dielectric layer 140 formed by thermal oxidation is relatively high, and the performance of the formed dielectric layer 140 is relatively good. In some other embodiments, the dielectric layer 140 may also be formed by a method of deposition followed by mask etching, where the method of deposition followed by mask etching can better control the width of the formed dielectric layer 140. By forming the dielectric layer 140, an anomaly in the semiconductor structure caused by direct contact between the active layer 110 and the word line 130 can be avoided, and the reliability of the semiconductor structure can be improved.

[0085] In some embodiments, forming the fourth isolation layer 250 may include depositing an insulating material on the entire surface of the semiconductor structure, and then removing the surface irregularities by chemical mechanical polishing to form the fourth isolation layer 250. In some embodiments, the material of the third isolation layer 240 and the fourth isolation layer 250 may be the same as the material of the first isolation layer 170, and both may be silicon oxide or silicon nitride materials. The formation of the fourth isolation layer 250 can separate adjacent word lines 130, thereby avoiding signal interference between adjacent word lines 130, and can also be used as a protection layer for the word lines 130 to avoid direct contact between the word lines 130 and the outside world.

[0086] In an embodiment of the present invention, when forming the bit line 120, the first conductive structure 121 is formed first, and then the second conductive structure 122 is formed. Even though the second conductive structure 122 is not connected to a continuous structure during the formation process, the electrical connection between the first conductive structure 121 and the second conductive structure 122 makes the bit line 120 into one continuous whole, thereby improving the stability of signal transmission of the bit line 120 and further improving the reliability of the semiconductor structure.

[0087] It is understood by those skilled in the art that the above embodiments are specific examples for implementing the present invention, and in practical application, various changes in form and details can be made without departing from the spirit and scope of the embodiments of the present invention. Those skilled in the art can make various modifications and modifications without departing from the spirit and scope of the embodiments of the present invention, and therefore the protection scope of the embodiments of the present invention shall be subject to the scope of the claims.

Claims

1. 1. A semiconductor structure comprising: A substrate; an active layer disposed on the substrate and spaced apart from one another; a plurality of bit lines, the plurality of bit lines being arranged at intervals along a first direction, the bit lines extending along a second direction, a first portion of each of the bit lines covering a side of the active layer, and a second portion of each of the bit lines being disposed within the active layer, the first direction and the second direction both being parallel to a surface of the substrate, and the first direction intersecting the second direction; A semiconductor structure, wherein the first portion includes two first conductive structures extending along the second direction spaced apart along the first direction, and the second portion includes a plurality of second conductive structures spaced apart along the second direction, the plurality of second conductive structures being disposed in the active layer, the plurality of second conductive structures being disposed between at least two of the first conductive structures, and each of the second conductive structures is in contact with and electrically connected to two of the first conductive structures.

2. the material of the second conductive structure comprises a metal silicide and the material of the first conductive structure comprises a conductive metal; The semiconductor structure of claim 1 .

3. In the first direction, the first conductive structure has a thickness of 1 nm to 3 nm. The semiconductor structure of claim 1 .

4. In a plane perpendicular to the substrate, a height of an overlapping portion between a projection of the second conductive structure and a projection of the first conductive structure is 0.5 to 1 times a height of the projection of the second conductive structure. The semiconductor structure of claim 1 .

5. 1. A method of fabricating a semiconductor structure, comprising: providing a base and forming active layers on the base, the active layers being spaced apart along a first direction; forming a plurality of bit lines spaced apart along the first direction, the bit lines extending along a second direction, a first portion of each of the bit lines covering a side of the active layer, a second portion of each of the bit lines being disposed within the active layer, the first direction and the second direction both being parallel to a surface of the base, and the first direction intersecting the second direction, the first portion including two first conductive structures, and the second portion including a plurality of second conductive structures; forming a plurality of the bit lines forming a plurality of the first conductive structures extending along the second direction and spaced apart along the first direction, where two of the first conductive structures located on opposite sides of the active layer in the first direction are first portions of the bit lines; forming a plurality of the second conductive structures spaced apart along the second direction, the plurality of second conductive structures being disposed within the active layer, the second conductive structures being disposed between and in contact with and electrically connected to at least two of the first conductive structures.

6. Forming the first conductive structure includes: Providing said base; patterning the base to form the active layers spaced apart along the first direction; forming a first isolation layer, the first isolation layer being disposed between adjacent ones of the active layers and a top surface of the first isolation layer being lower than a top surface of the active layers; forming the first conductive structure over the first isolation layer. A method for fabricating a semiconductor structure according to claim 5.

7. Forming the first separation layer includes: forming a first mask layer on a surface of the base, and etching the first mask layer and the base to form a plurality of first trenches extending along the second direction, the first trenches being disposed between adjacent ones of the active layers; filling the first trench with an insulating material and removing a portion of the insulating material to form the first isolation layer in the first trench.

7. A method for fabricating a semiconductor structure according to claim 6.

8. forming the first conductive structure on the first isolation layer, forming a second mask layer, the second mask layer being disposed on the first isolation layer and the second mask layer covering a sidewall of the active layer; removing a portion of the first isolation layer and a portion of a sidewall of the active layer under the second mask layer to form a first trench; depositing a first conductive material in the first trench and patterning the first conductive material to form first spaced apart conductive structures; 8. A method for fabricating a semiconductor structure according to claim 7.

9. Forming the second conductive structure includes: Etching the active layer to form a plurality of second trenches extending along the first direction, the bottom surfaces of the second trenches being higher than a top surface of the first conductive structure; forming a third mask layer in the second trench, the third mask layer covering a sidewall of the second trench; depositing a second conductive material at a bottom of the second trench and forming the second conductive structure by rapid thermal processing.

9. A method for fabricating a semiconductor structure according to claim 8.

10. the second conductive material includes a metal material, and during a rapid thermal processing process, the metal material diffuses into the active layer to form a metal silicide, and the metal silicide is disposed at least between two of the first conductive structures to form the second conductive structure; 10. A method for fabricating a semiconductor structure according to claim 9.

11. The temperature of the rapid thermal treatment is 400°C to 800°C.

10. A method for fabricating a semiconductor structure according to claim 9.

12. a plurality of the second conductive structures disposed between two of the first conductive structures are connected to each other and extend through the active layer along the second direction; A method for fabricating a semiconductor structure according to claim 5.

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