Capacitor Parts

Abstract

To provide a capacitor component having high strength property.SOLUTION: A capacitor component includes a body including dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and including a first face and a second face to face each other, a third face and a fourth face to be connected to the first face and the second face and to face each other, and a fifth face and a sixth face to be connected to the first face to the fourth face and to face each other; and first and second external electrodes disposed on the outside of the body and connected to the first and second internal electrodes, respectively. The body includes: a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween; cover portions formed above and below the capacitance forming portion; and margin portions formed on both side surfaces of the capacitance forming portion. One or more selected from the cover portions and the margin portions includes a plurality of graphenes.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a capacitor component. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), one of the capacitor components, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays an important role in charging and discharging electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small in size, high in capacitance, and easy to mount, and can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller in size and have higher capacitance.

[0004] Recently, the industry has shown an increasing interest in electrical components, and research is being actively conducted into optimizing multilayer ceramic capacitors for use in automobiles and infotainment systems. Compared to multilayer ceramic capacitors for IT applications, multilayer ceramic capacitors for electrical devices are used in harsher environments and pose a greater risk of personal injury, so they require long life, high reliability, and high strength characteristics. Summary of the Invention [Problem to be solved by the invention]

[0005] One of the objects of the present invention is to provide a capacitor component having high strength properties. [Means for solving the problem]

[0006] An embodiment of the present invention provides a capacitor component including: a body having a dielectric layer, the body including a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer therebetween, the body including first and second sides facing each other, third and fourth sides connected to the first and second sides and facing each other, and fifth and sixth sides connected to the first to fourth sides and facing each other; and a first external electrode and a second external electrode arranged on the outside of the body and connected to the first and second internal electrodes, respectively, the body including a capacitance forming portion including the first internal electrode and the second internal electrode arranged to face each other with the dielectric layer therebetween, cover portions formed on upper and lower parts of the capacitance forming portion, and margin portions formed on both side surfaces of the capacitance forming portion, at least one of the cover portion and the margin portion including a plurality of graphenes.

[0007] In one embodiment, the capacitance forming portion does not need to include graphene.

[0008] In one embodiment, selected one or more of the cover portion and the margin portion may include a plurality of dielectric crystal grains and grain boundaries formed between adjacent dielectric crystal grains, and the plurality of graphenes may be disposed at the grain boundaries.

[0009] In an embodiment, one surface of the graphene may be disposed along a surface of the crystal grain.

[0010] In an embodiment, of the plurality of graphenes, graphenes stacked in 10 layers or more may account for 5% or less of the total graphene.

[0011] In an embodiment, the content of the plurality of graphenes may be 0.05 wt % or more and less than 2.0 wt % based on at least one selected from the cover portion and the margin portion.

[0012] In one embodiment, at least one selected from the cover portion and the margin portion may have peaks detected in a D-band and a G-band during Raman analysis.

[0013] In one embodiment, in the capacitance forming portion, peaks may not be detected simultaneously in the D-band and the G-band during Raman analysis.

[0014] In one embodiment, some of the graphenes may be graphene oxide (GO) or reduced graphene oxide (RGO).

[0015] In one embodiment, the first and second internal electrodes may have a thickness of less than 1 μm, and the dielectric layer may have a thickness of less than 2.8 μm.

[0016] In an embodiment, when the thickness of the first internal electrode and the second internal electrode is defined as te, and the thickness of the dielectric layer is defined as td, td>2×te may be satisfied.

[0017] In one embodiment, the first external electrode and the second external electrode may include an electrode layer and a conductive resin layer disposed on the electrode layer.

[0018] In one embodiment, the electrode layer may include one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and glass.

[0019] In one embodiment, the conductive resin layer may include one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a base resin.

[0020] In one embodiment, the first external electrode is arranged on the third surface and includes a band portion extending to a portion of the first surface and the second surface, and a distance from the third surface to a tip of the band portion of the electrode layer is shorter than a distance from the third surface to a tip of the band portion of the conductive resin layer.

[0021] Another embodiment of the present invention provides a capacitor component including: a body having a dielectric layer, the body including first and second internal electrodes arranged to face each other with the dielectric layer therebetween, the body including first and second sides facing each other, third and fourth sides connected to the first and second sides facing each other, and fifth and sixth sides connected to the first to fourth sides facing each other; and first and second external electrodes arranged on the outside of the body and electrically connected to the first and second internal electrodes, respectively; the body including a capacitance forming portion including the first and second internal electrodes arranged to face each other with the dielectric layer therebetween, cover portions formed on upper and lower parts of the capacitance forming portion, and margin portions formed on both side surfaces of the capacitance forming portion, and at least one of the cover portion and the margin portion is detected to have a peak in a D-band and a G-band during Raman analysis.

[0022] In one embodiment, in the capacitance forming portion, peaks may not be detected simultaneously in the D-band and the G-band during Raman analysis.

[0023] In one embodiment, at least one selected from the cover portion and the margin portion includes a plurality of dielectric crystal grains and a grain boundary formed between adjacent dielectric crystal grains, and at the grain boundary, peaks can be detected simultaneously in a D-band and a G-band during Raman analysis.

[0024] In one embodiment, the D-band has a wavelength of 1200 to 1400 cm -1A peak was detected at 1500-1700 cm in the G-band. -1 A peak can be detected at

[0025] In one embodiment, at least one selected from the cover portion and the margin portion may have a peak at 120 to 140 ppm when analyzed by nuclear magnetic resonance spectroscopy.

[0026] In an embodiment, at least one selected from the cover portion and the margin portion includes a plurality of graphenes, and some of the plurality of graphenes may be graphene oxide or reduced graphene oxide.

[0027] In one embodiment, the first external electrode and the second external electrode include an electrode layer and a conductive resin layer disposed on the electrode layer, the electrode layer includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and glass, and the conductive resin layer includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a base resin. Effect of the Invention

[0028] According to an embodiment of the present invention, a capacitor component capable of efficiently ensuring high strength by including a plurality of graphenes in at least one selected from a cover portion and a margin portion can be provided. In addition, not only bending strength but also mechanical rigidity can be ensured, and the life span of the capacitor component can be improved.

[0029] However, the various and beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0030] [Figure 1] 1 is a perspective view showing a schematic configuration of a capacitor component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' in FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' in FIG. [Figure 4a] FIG. 2 is a diagram showing a ceramic green sheet on which a first internal electrode is printed. [Figure 4b] FIG. 13 is a diagram showing a ceramic green sheet on which second internal electrodes are printed. [Diagram 5] FIG. 2 is an enlarged view of a portion of the cover including graphene. [Figure 6] FIG. 6 is an enlarged view of the P3 region in FIG. 5. [Figure 7] FIG. 2 is a schematic diagram showing a shape in which graphene is distributed at crystal grain boundaries. [Figure 8] FIG. 1 is a diagram showing the structural formula of graphene. [Figure 9] 1 is a graph showing Raman analysis results for a dielectric grain boundary containing graphene (Examples 1 to 3) and a dielectric grain boundary containing graphite (Comparative Example 1). [Figure 10] 1 is a graph showing the analysis results of nuclear magnetic resonance spectroscopy on a dielectric grain boundary including graphene. [Figure 11] FIG. 3 is an enlarged view of the P1 region in FIG. [Figure 12] FIG. 3 is an enlarged view of the P2 region in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0032] In order to clearly explain the present invention, the drawings omit parts that are not relevant to the description, exaggerate the thickness to clearly show various layers and regions, and use the same reference numerals to refer to components that have the same function within the same concept. Furthermore, throughout the specification, the term "comprises" a certain component does not mean to exclude other components, but means that the other components can be further included, unless otherwise specified.

[0033] In the drawings, the X direction can be defined as the second direction, L direction or length direction, the Y direction can be defined as the third direction, W direction or width direction, and the Z direction can be defined as the first direction, stacking direction, T direction or thickness direction.

[0034] Capacitor Parts FIG. 1 is a perspective view showing a capacitor component according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line II-II' in FIG. 1, FIG. 4a is a diagram showing a ceramic green sheet on which a first internal electrode is printed, and FIG. 4b is a diagram showing a ceramic green sheet on which a second internal electrode is printed.

[0035] A capacitor component 100 according to one embodiment of the present invention will now be described with reference to Figures 1 to 4b.

[0036] The capacitor component 100 according to the embodiment of the present invention has a dielectric layer 111, and includes a first internal electrode and a second internal electrode 121, 122 arranged to face each other with the dielectric layer sandwiched therebetween. The capacitor component 100 includes a body 110 including first and second faces 1, 2 facing each other, third and fourth faces 3, 4 connected to the first and second faces and facing each other, and fifth and sixth faces 5, 6 connected to the first to fourth faces and facing each other, and a second internal electrode 121, 122 arranged outside the body 110 and connected to the first and second internal electrodes 121, 122, respectively. The body 110 includes a capacitance forming portion A including the first internal electrode 121 and the second internal electrode 122 arranged to face each other with the dielectric layer 111 therebetween, whereby a capacitance is formed, cover portions 112 and 113 formed on upper and lower portions of the capacitance forming portion, and margin portions 114 and 115 formed on both side surfaces of the capacitance forming portion, and at least one selected from the cover portions 112 and 113 and the margin portions 114 and 115 includes a plurality of graphenes.

[0037] The body 110 may be formed by alternately laminating dielectric layers 111 and internal electrodes 121, 122.

[0038] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawings, the body 110 may have a hexahedral shape or a shape similar thereto. The body 110 may have a substantially hexahedral shape, although it is not a hexahedral shape having perfect straight lines, due to shrinkage of the ceramic powder contained in the body 110 during the firing process.

[0039] The main body 110 may have a first surface and a second surface 1, 2 facing each other in the thickness direction (Z direction), a third surface and a fourth surface 3, 4 connected to the first surface and the second surface 1, 2 and facing each other in the length direction (X direction), and a fifth surface and a sixth surface 5, 6 connected to the first surface and the second surface 1, 2, connected to the third surface and the fourth surface 3, 4, and facing each other in the width direction (Y direction).

[0040] The multiple dielectric layers 111 forming the body 110 may be in a fired state, and the boundaries between adjacent dielectric layers 111 may be so integrated that they cannot be identified without the use of a scanning electron microscope (SEM).

[0041] According to one embodiment of the present invention, the material for forming the dielectric layer 111 is not particularly limited as long as it can obtain sufficient capacitance, and for example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used.

[0042] In addition, the material forming the dielectric layer 111 may be a powder of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0043] The internal electrodes 121, 122 are arranged to face each other with the dielectric layer 111 interposed therebetween.

[0044] The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122 that are alternately arranged to face each other with a dielectric layer interposed therebetween.

[0045] The first and second internal electrodes 121 and 122 may be exposed to a third and fourth surface 3 and 4 of the body 110, respectively.

[0046] 2, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. In addition, a first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0047] The first and second internal electrodes 121 and 122 may be electrically separated by a dielectric layer 111 disposed in the center. The body 110 may be formed by alternately stacking ceramic green sheets (FIG. 4a) on which the first internal electrode 121 is printed and ceramic green sheets (FIG. 4b) on which the second internal electrode 122 is printed in a thickness direction (Z direction) and then firing the stacked sheets.

[0048] The internal electrodes may be printed on the ceramic green sheets by screen printing, gravure printing or the like, but the present invention is not limited thereto.

[0049] The capacitor component 100 according to one embodiment of the present invention includes a capacitance forming portion A that is disposed inside the body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed facing each other with the dielectric layer 111 therebetween to form a capacitance, cover portions 112, 113 formed on the upper and lower parts of the capacitance forming portion A, and margin portions 114, 115 formed on the sides of the capacitance forming portion.

[0050] The capacitance forming portion A is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first internal electrodes and second internal electrodes 121, 122 with a dielectric layer 111 sandwiched therebetween.

[0051] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming portion A in the vertical direction, respectively.

[0052] The margin portions 114 , 115 include a margin portion 114 disposed on the sixth surface 6 of the main body 110 and a margin portion 115 disposed on the fifth surface 5 .

[0053] That is, the margins 114 and 115 may be disposed on both widthwise sides of the body 110 .

[0054] The cover parts 112, 113 and the margin parts 114, 115 basically serve to prevent damage to the internal electrodes due to physical or chemical stress, and to maintain the reliability of the capacitor components against external impacts.

[0055] In the present invention, a plurality of graphenes are included in one or more selected from among the cover parts 112, 113 and the margin parts 114, 115. That is, a plurality of graphenes may be included only in the cover parts 112, 113, or a plurality of graphenes may be included only in the margin parts 114, 115, or a plurality of graphenes may be included in all of the cover parts 112, 113 and the margin parts 114, 115.

[0056] FIG. 8 is a diagram showing the structural formula of graphene.

[0057] 8, graphene 11c is made of carbon atoms and is in the form of a thin film with a thickness of one atom. That is, graphene 11c has a two-dimensional plate-like structure. Graphene has a thickness of about 0.2 nm and is known to have very high physical and chemical stability, electrical conductivity 100 times higher than copper, and mechanical strength 200 times higher than steel.

[0058] Therefore, in the present invention, the strength can be improved by including a plurality of graphenes in one or more selected from among the cover portions 112 and 113 and the margin portions 114 and 115. In addition, not only the bending strength but also the mechanical rigidity can be secured, and the life of the capacitor component can be improved.

[0059] On the other hand, although graphene is a material with various advantages, as the graphene content of the dielectric composition increases during preparation of a slurry for forming a ceramic green sheet, the solid content must be reduced to ensure dispersibility, which may result in non-uniformity of the ceramic green sheet after forming and drying.

[0060] Furthermore, when the dielectric layer included in the capacitance forming part A contains graphene, some advantageous effects such as improved dielectric constant may be achieved. However, even if the dispersibility is ensured, it is difficult to control so that all of the graphene is present in the desired locations, which may result in problems such as deterioration of moisture resistance reliability and breakdown voltage.

[0061] In the present invention, the strength of the body 110 can be improved by including a plurality of graphenes in one or more selected from the cover parts 112, 113 and the margin parts 114, 115 without significantly changing the conventional capacitor manufacturing method. In addition, the composition of the capacitance forming part A is maintained as it is, and the amount of graphene used can be reduced, which not only provides excellent technical accessibility but also provides excellent commercial accessibility.

[0062] Therefore, according to the present invention, the capacitance forming portion A does not need to include graphene.

[0063] In addition, in order to control the content and position of graphene in the dielectric layer included in the capacitance forming portion A, it is necessary to change the binder, additives, etc., which makes it difficult to use conventional construction methods as they are.

[0064] For example, in order to control the content and position of graphene in the dielectric layer included in the capacitance forming part A, a method of using an acrylic binder composed of an acrylic copolymer / graphene composite instead of a polyvinyl butyral (PVB)-based binder that is generally used as a dielectric composition may be used.

[0065] However, in one embodiment of the present invention, since graphene is not included in the capacitance forming portion A, and graphene is included in one or more selected from the cover portions 112, 113 and the margin portions 114, 115, a PVB-based binder that has been commonly used in the past can be used, and a capacitor component can be manufactured without significantly changing the conventional manufacturing method.

[0066] Hereinafter, a case where the cover portions 112, 113 contain multiple graphenes will be described, however, the same can be applied to a case where the margin portions 114, 115 contain multiple graphenes, and further, the same can be applied to a case where all of the cover portions 112, 113 and the margin portions 114, 115 contain multiple graphenes.

[0067] FIG. 5 is an enlarged view of a portion of the cover portions 112 and 113 including graphene, and FIG. 6 is an enlarged view of the P3 region in FIG.

[0068] Referring to FIGS. 5 and 6, the cover parts 112, 113 may include a plurality of dielectric crystal grains 11a, grain boundaries 11b formed between adjacent dielectric crystal grains, and a plurality of graphenes 11c uniformly distributed within the grain boundaries.

[0069] Fig. 7 is a schematic diagram showing the shape of graphene distributed within the crystal grain boundaries. In Fig. 7, the crystal grain boundaries are omitted in order to clarify the distribution form related to the dielectric crystal grains 11a, and the dielectric crystal grains 11a are simply represented as polyhedrons, with the top and side surfaces of the polyhedrons shown.

[0070] 7, one surface of the graphene 11c may be disposed along the top surface and side surface of the dielectric crystal grain 11a. That is, one surface of the graphene 11c may be disposed along the surface of the dielectric crystal grain 11a.

[0071] Although a part of a plurality of graphenes may be present in a form stacked on each other, the graphene stacked with 10 or more layers may be 5% or less of the whole graphene. This is because, if the graphene stacked with 10 or more layers exceeds 5% of the whole graphene, the dispersibility of the graphene may be deteriorated, and the strength increasing effect may become non-uniform.

[0072] The material for forming the cover portions 112 and 113 containing a plurality of graphenes may be a powder such as barium titanate (BaTiO3) to which a plurality of graphenes have been added, and various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0073] On the other hand, the graphene content can be set in consideration of the target strength, the size of the capacitor component, and the number of layers, and does not need to be particularly limited.

[0074] However, the content of graphene in the cover is preferably 0.05 wt % or more and less than 2.0 wt % with respect to the barium titanate (BaTiO3) contained in the cover.

[0075] If the graphene content is less than 0.05 wt%, the strength increasing effect may be insufficient. If the graphene content exceeds 2.0 wt%, there are problems in that the dispersibility of graphene deteriorates during the material mixing process and the viscosity increases, making it difficult to distribute graphene uniformly.

[0076] In this case, in order to uniformly disperse graphene, the surface of graphene can be modified to control the instability index of graphene to be 0.1 or less. This is because, unless graphene is applied in a uniformly dispersed state to a slurry in a mixed solvent environment of ethanol and toluene, graphene that is uniformly distributed at the grain boundaries cannot be obtained after sintering.

[0077] The instability index is a measure by which dispersibility can be evaluated, and is a value measured using a LUMiSizer Dispersion Analyzer.

[0078] The external electrodes 131 and 132 are disposed outside the body 110 and are connected to the first and second internal electrodes 121 and 122. In other words, as shown in FIG. 2, the first external electrode 131 connected to the first internal electrode 121 and the second external electrode 132 connected to the second internal electrode 122 may be included.

[0079] The first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122, respectively, to form capacitance. Also, the second external electrode 132 may be connected to a different potential than the first external electrode 131.

[0080] The external electrodes 131 and 132 may include electrode layers 131a and 132a connected to the internal electrodes 121 and 122, and conductive resin layers 131b and 132b disposed on the electrode layers.

[0081] The conductive resin layers 131b and 132b can prevent the main body, which lacks ductility, from being broken by dispersing stress. That is, as described above, by including a plurality of graphenes in one or more selected from the cover parts 112 and 113 and the margin parts 114 and 115, strength can be improved, and by forming the conductive resin layers 131b and 132b on the external electrodes 131 and 132, not only bending strength but also mechanical rigidity can be secured, and the life of the capacitor components can be improved.

[0082] That is, in addition to increasing the rigidity of the body, the application of the conductive resin layer can also further improve the reliability of the capacitor body.

[0083] Furthermore, the external electrodes 131, 132 may further include Ni plating layers 131c, 132c disposed on the conductive resin layers 131b, 132b, and Sn plating layers 131d, 132d disposed on the Ni plating layers.

[0084] When the external electrodes 131, 132 include a first external electrode 131 and a second external electrode 132, the first external electrode 131 can include a first electrode layer 131a, a first conductive resin layer 131b, a first Ni plating layer 131c, and a first Sn plating layer 131d. Similarly, the second external electrode 132 can include a second electrode layer 132a, a second conductive resin layer 132b, a second Ni plating layer 132c, and a second Sn plating layer 132d.

[0085] The electrode layers 131a, 132a may include conductive metals and glasses.

[0086] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form capacitance, and may be, for example, one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0087] The electrode layers 131a and 132a can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0088] The conductive resin layers 131b and 132b are formed on the electrode layers 131a and 132a, and may be formed in such a way as to completely cover the electrode layers 131a and 132a.

[0089] The conductive resin layers 131b and 132b may contain a conductive metal and a base resin.

[0090] The base resin contained in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and impact absorbing properties and can be mixed with the conductive metal powder to form a paste, and may include, for example, an epoxy-based resin.

[0091] The conductive metal contained in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a, and may include, for example, one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0092] The Ni plating layers 131c and 132c are formed on the conductive resin layers 131b and 132b, and can be formed in such a way as to completely cover the conductive resin layers 131b and 132b.

[0093] The Sn plating layers 131d and 132d are formed on the Ni plating layers 131c and 132c, and may be formed in such a way as to completely cover the Ni plating layers 131c and 132c.

[0094] The Sn plating layers 131d and 132d serve to improve mounting characteristics.

[0095] The first external electrode 131 may include a connection portion C disposed on a third surface of the main body, and a band portion B extending from the connection portion to a portion of the first surface and a portion of the second surface. Similarly, the second external electrode 132 may include a connection portion disposed on a fourth surface of the main body, and a band portion extending from the connection portion to a portion of the first surface and a portion of the second surface.

[0096] At this time, the band portion B can extend not only to a part of the first surface and a part of the second surface 1, 2, but also from the connection portion C to a part of the fifth surface and a part of the sixth surface 5, 6.

[0097] Referring to FIG. 11, the first external electrode 131 may have a distance l1 from the third surface 3 of the main body 110 to the tip of the band portion B of the first electrode layer 131a that is shorter than the distance l2 to the tip of the band portion B of the first conductive resin layer 131b.

[0098] Similarly, in the second external electrode 132, the distance from the fourth surface 4 of the body 110 to the tip of the band portion of the second electrode layer 132a may be shorter than the distance to the tip of the band portion of the second conductive resin layer 132b.

[0099] As a result, the conductive resin layers 131b and 132b can be formed to completely cover the electrode layers 131a and 132a, thereby enhancing the bending strength characteristics and the adhesive strength between the external electrodes and the main body.

[0100] Referring to FIG. 12, in a capacitor component according to an embodiment of the present invention, the relationship between the thickness td of the dielectric layer 111 and the thickness te of the internal electrodes 121 and 122 may satisfy td>2×te.

[0101] That is, according to an embodiment of the present invention, the thickness td of the dielectric layer 111 is greater than twice the thickness te of the internal electrodes 121 and 122 .

[0102] Generally, a major problem with electronic components for high-voltage electrical equipment is reliability, which is caused by a decrease in dielectric breakdown voltage in a high-voltage environment.

[0103] In the capacitor component according to one embodiment of the present invention, in order to prevent a decrease in the breakdown voltage in a high voltage environment, the thickness td of the dielectric layer 111 is made greater than twice the thickness te of the internal electrodes 121, 122, thereby increasing the thickness of the dielectric layer, which is the distance between the internal electrodes, thereby improving the breakdown voltage characteristics.

[0104] If the thickness td of the dielectric layer 111 is equal to or less than twice the thickness te of the internal electrodes 121, 122, the thickness of the dielectric layer, which is the distance between the internal electrodes, is small, so that the breakdown voltage may decrease.

[0105] The thickness te of the internal electrodes may be less than 1 μm, and the thickness td of the dielectric layers may be less than 2.8 μm, but is not necessarily limited thereto.

[0106] Hereinafter, a capacitor component according to another embodiment of the present invention will be described in detail, except that the same configuration as that described above will be omitted to avoid duplication.

[0107] According to another embodiment of the present invention, there is provided a capacitor component having a dielectric layer, the capacitor component including a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer therebetween, the body including first and second sides facing each other, third and fourth sides connected to the first and second sides facing each other, and fifth and sixth sides connected to the first to fourth sides facing each other, and a first external electrode and a second external electrode arranged outside the body and electrically connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion including the first internal electrode and the second internal electrode arranged to face each other with the dielectric layer therebetween, a cover portion formed on an upper portion and a lower portion of the capacitance forming portion, and a margin portion formed on both sides of the capacitance forming portion, and at least one of the cover portion and the margin portion is detected as a peak in a D-band and a G-band during Raman analysis.

[0108] Graphene is difficult to clearly observe even with a transmission electron microscope (TEM) due to its extremely small size, and it is difficult to distinguish it from other carbon allotropes such as graphite.

[0109] FIG. 9 is a graph showing the results of Raman analysis of the dielectric slurries containing graphene (Examples 1 to 3) and the dielectric slurry containing graphite (Comparative Example 1) after heat treatment to volatilize organic matter.

[0110] Referring to FIG. 9, in the dielectric slurry containing graphene, peaks are detected in the D-band and G-band during Raman analysis.

[0111] In contrast, in a dielectric slurry containing graphite, which is a carbon allotrope of graphene, a peak is detected only in the G band, but not in the D band.

[0112] Therefore, the Raman analysis method can determine the presence or absence of graphene and distinguish it from other carbon allotropes. In the capacitor component according to another embodiment of the present invention, peaks are detected in the D-band and G-band during Raman analysis in the selected one or more of the cover portion and the margin portion, thereby confirming that the selected one or more of the cover portion and the margin portion contain graphene.

[0113] In the capacitance forming portion, peaks may not be detected simultaneously in the D-band and the G-band during Raman analysis, i.e., the capacitance forming portion may not include graphene.

[0114] In addition, in the D-band, the wavelength range is 1300 to 1400 cm -1 In the G-band, a peak can be detected at 1500 to 1600 cm -1 A peak can be detected at

[0115] FIG. 10 is a graph showing the results of nuclear magnetic resonance (NMR) spectroscopy analysis of a dielectric material including graphene.

[0116] In FIG. 10, the X-axis represents chemical shift and the Y-axis represents intensity, with the intensity being detected differently depending on the functional group of carbon.

[0117] Referring to Figure 10, a peak is observed at 120 to 140 ppm for pure C-bond. In other words, the presence of graphene can be confirmed by detecting a peak at 120 to 140 ppm.

[0118] In addition, since a portion of the graphenes of the present invention may include an oxidized region, it can be confirmed that a weak peak is detected even in the CO bond region of 50 to 80 ppm.

[0119] That is, some of the multiple graphenes of the present invention may be graphene oxide (GO) or reduced graphene oxide (RGO).

[0120] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0121] 100 Capacitor parts 110 Main unit 111 Dielectric layer 11a Dielectric crystal grains 11b Grain boundaries 11c Graphene A Capacitance forming part 112, 113 Cover part 114, 115 Margin 121 1st internal electrode 122 2nd internal electrode 131 1st external electrode 132 2nd external electrode

Claims

1. a main body having a dielectric layer, the main body including a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer therebetween, the main body including a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other; a first external electrode and a second external electrode disposed outside the body and connected to the first internal electrode and the second internal electrode, respectively; the body includes a capacitance forming portion including the first internal electrode and the second internal electrode arranged to face each other with the dielectric layer therebetween, whereby capacitance is formed, cover portions formed on upper and lower portions of the capacitance forming portion, and margin portions formed on both side surfaces of the capacitance forming portion, a capacitor component, wherein at least one of the cover portion and the margin portion includes a plurality of graphenes, and the capacitance forming portion includes a smaller amount of graphene than the graphene included in the at least one of the cover portion and the margin portion.

2. At least one selected from the cover portion and the margin portion includes a plurality of dielectric crystal grains and a grain boundary formed between adjacent dielectric crystal grains, The capacitor component of claim 1 , wherein the plurality of graphenes are disposed at the grain boundaries.

3. The capacitor component according to claim 2 , wherein one face of the plurality of graphenes is arranged along a surface of the plurality of dielectric crystal grains.

4. The capacitor component according to claim 2 , wherein, of the plurality of graphenes, graphenes stacked in 10 layers or more account for 5% or less of the total graphene.

5. The graphene contents are determined by the amount of barium titanate (BaTiO ３ 5. The capacitor part according to claim 1, wherein the content of the cations in the SiO2-containing layer is 0.05 wt % or more and less than 2.0 wt %.

6. The capacitor component according to any one of claims 1 to 5, wherein peaks are detected in a D-band and a G-band during Raman analysis in at least one of the cover portion and the margin portion.

7. The capacitor component according to claim 1 , wherein some of the graphenes are graphene oxide or reduced graphene oxide.

8. 8. The capacitor component according to claim 1, wherein the first and second internal electrodes have a thickness of less than 1 μm, and the dielectric layer has a thickness of less than 2.8 μm.

9. 9. The capacitor component according to claim 1, wherein, when a thickness of the internal electrode is defined as te and a thickness of the dielectric layer is defined as td, td>2×te is satisfied.

10. The capacitor component according to claim 1 , wherein the first external electrode and the second external electrode each include an electrode layer and a conductive resin layer disposed on the electrode layer.

11. 11. The capacitor component of claim 10, wherein the electrode layer comprises a plurality of conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof, and glass.

12. 12. The capacitor component according to claim 10, wherein the conductive resin layer contains a base resin and a plurality of conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.

13. the first external electrode includes a band portion disposed on the third surface and extending to a portion of the first surface and the second surface; The capacitor component according to claim 10 , wherein a distance from the third surface to a tip of the band portion of the electrode layer is shorter than a distance from the third surface to a tip of the band portion of the conductive resin layer.

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