Energy recovery from waste heat

Abstract

To provide a system for recovering waste heat.SOLUTION: A system for recovering waste heat includes: a first thermoelectric cooler 946a configured to remove heat from a first heat conductive member 948a, and transmit the heat to a second heat conductive member 948b; a second thermoelectric cooler 946b configured to remove heat from a third heat conductive member 948c, and transmit the heat to the second heat conductive member 948b; a first thermoelectric generator 944a arranged between the first heat conductive member 948a and a first body 940a, and configured to receive heat transmitted from fluid to the first body 940a; and a second thermoelectric generator 944b arranged between the third heat conductive member 948c and a second body 940b, and configured to receive heat transmitted from the fluid to the second body 940b.SELECTED DRAWING: Figure 10

Description

Content of disclosure

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Application No. 62 / 680,038, filed June 4, 2018, and U.S. Provisional Application No. 62 / 767,641, filed November 15, 2018, the disclosures of which are expressly incorporated by reference in their entireties herein.

[0002] [Technical field] The present subject matter relates generally to thermal management systems.

[0003] 〔background〕 Heat rejection systems remove unwanted heat from a heat source, ensuring that components are kept at proper operating temperatures. There are several different types of cooling solutions that are typically used, but most of them have a cooling unit and some form of thermal rejection system. The cooling unit typically provides cooling to the heat source by transferring heat from the air within the heat source to a fluid that flows through the cooling unit. Thermal rejection systems vary, but generally serve the purpose of rejecting heat from the fluid that flows through the cooling unit.

[0004] In some cases, the heat is rejected to the outside ambient air. Therefore, a large amount of energy is discarded as waste heat. Furthermore, the efficiency of the system strongly depends on the temperature of the ambient air.

[0005] 〔overview〕 In one aspect, an apparatus includes a body, at least one thermoelectric generator (TEG), and at least one thermoelectric cooler (TEC). The body is configured to receive heat from a fluid. The at least one thermoelectric generator (TEG) includes a first end and a second end, where the first end of the at least one TEG is thermally coupled to the body and configured to receive at least a portion of the heat from the fluid. The at least one thermoelectric cooler (TEC) includes a first end and a second end, where the second end of the at least one TEC is thermally coupled to the second end of the at least one TEG, and the at least one TEC is configured to receive electrical power to heat the first end of the at least one TEC and cool the second end of the at least one TEC, where the second end of the at least one TEC extracts heat from the second end of the at least one TEG.

[0006] One or more of the following features may be included in any feasible combination. For example, the system may include at least one thermally conductive member. The at least one TEG may be thermally coupled to a first side of the thermally conductive member, and the at least one TEC may be thermally coupled to a second side of the thermally conductive member. The at least one TEG may be disposed between and coupled to the body and the at least one thermally conductive member. The system may include at least one temperature sensor. The at least one temperature sensor may be disposed adjacent to one of the first end and the second end of the at least one TEG, and the at least one temperature sensor may be configured to measure a temperature of the capacitor at a location adjacent to one of the first end and the second end of the at least one TEG. The at least one temperature sensor may be positioned adjacent to one of the first end and the second end of the at least one TEC, and may be configured to measure a temperature of the capacitor at a location adjacent to one of the first end and the second end of the at least one TEC. The at least one temperature sensor may be embedded within the body.

[0007] In another aspect, an apparatus includes a first, second, and third thermally conductive member, a first thermoelectric cooler (TEC), a second thermoelectric cooler (second thermoelectric color), a first body, a second body, a first thermoelectric generator (TEG), and a second thermoelectric generator. The first thermoelectric cooler (TEC) is disposed between and coupled to the first thermally conductive member and the second thermally conductive member, the first TEC configured to remove heat from the first thermally conductive member and deliver heat to the second thermally conductive member. The second TEC is disposed between and coupled to the second thermally conductive member and the third thermally conductive member, the second TEC configured to remove heat from the third thermally conductive member and deliver heat to the second thermally conductive member. The first body includes a first passage extending therethrough, the first passage configured to receive a fluid, the first body configured to receive heat from the fluid. The second body includes a second passage extending therethrough, the second passage configured to receive a fluid from the first passage, the body configured to receive heat from the fluid. A first thermoelectric generator (TEG) is disposed between the first thermally conductive member and the first body, the first TEG configured to receive heat transferred from the fluid to the first body. A second TEG is disposed between the third thermally conductive member and the second body, the second TEG configured to receive heat transferred from the fluid to the second body.

[0008] In yet another aspect, a system includes a capacitor including a body, at least one thermoelectric generator (TEG), and at least one thermoelectric cooler (TEC). The body is configured to receive heat from a fluid. The at least one thermoelectric generator (TEG) includes a first end and a second end, the first end being thermally coupled to the body and configured to receive at least a portion of the heat from the fluid, thereby causing the at least one TEG to generate a first electrical power. The at least one thermoelectric cooler (TEC) includes a first end and a second end, the second end of the at least one TEC being thermally coupled to the second end of the at least one TEG, and the at least one TEC is configured to receive a second electrical power, thereby heating the first end of the at least one TEC and cooling the second end of the at least one TEC, and the second end of the at least one TEC extracting heat from the second end of the at least one TEG.

[0009] One or more of the following features may be included in any feasible combination. For example, the system may include a power management module. The power management module may be electrically coupled to the at least one TEG and may be configured to receive at least a portion of the first power. The power management module may be electrically coupled to the at least one TEC and may be configured to deliver at least a portion of the second power to the TEC. The system may include at least one temperature sensor disposed adjacent to at least one of the first and second ends of the at least one TEG and the first and second ends of the at least one TEC, the temperature sensor configured to measure a temperature of the capacitor at the location. The system may include a thermal management module configured to receive a temperature signal from the at least one temperature sensor and calculate a corresponding temperature.

[0010] In yet another aspect, a method includes delivering a fluid to a body of a heat exchanger; transferring heat from the fluid to the body; transferring heat from the body to a first end of a thermoelectric generator (TEG); delivering a first power to a thermoelectric cooler (TEC), causing the first end of the TEC to increase in temperature and the second end of the TEC to decrease in temperature; transferring heat from the second end of the TEG to the second end of the TEC; and creating a temperature gradient across a semiconductor of the TEG, thereby causing the TEG to generate a second power.

[0011] One or more of the following features may be included in any feasible combination. For example, the method may include delivering at least a portion of the second power to the TEC. The method may include storing at least a portion of the second power in a battery. The method may include measuring a temperature of a heat exchanger adjacent at least one of the first and second ends of the TEG and adjusting at least one of a voltage and a current of the first power delivered to the TEC based on the measured temperature. The method may include measuring a temperature of a heat exchanger adjacent at least one of the first and second ends of the TEC and adjusting at least one of a voltage and a current of the first power delivered to the TEC based on the measured temperature. The method may include delivering at least a portion of the second power to a compressor that compresses the fluid.

[0012] Another aspect of the present disclosure provides an apparatus for waste heat recovery. The apparatus can include a base block disposed adjacent to a heat source, a thermoelectric generator including a first end and a second end, the first end thermally coupled to the base block and configured to receive heat from the heat source, and a thermoelectric cooler including a third end and a fourth end, the third end thermally coupled to the second end. The thermoelectric cooler can be configured to receive an electric current, thereby cooling the third end and heating the fourth end, and the third end can conduct heat from the second end.

[0013] One or more of the following features may be included in any feasible combination. For example, the thermoelectric generator may be configured to generate electrical power, and at least a portion of the generated electrical power may be provided to the thermoelectric cooler for cooling. The heat source may include a kiln. The base block may include a heat exchanger on a side facing the heat source. A heat sink may be disposed at the fourth end. The device may include a temperature sensor that measures a temperature of a surface of the heat source. For example, the temperature sensor may be a thermocouple, a resistance temperature detector (RTD), or an infrared sensor. Upon detecting that the temperature of the surface of the heat source is higher than a predetermined temperature limit, an electrical current may be provided to the thermoelectric generator, and the first end may be cooled and the second end may be heated.

[0014] In another aspect, a system for waste heat recovery can include a kiln that includes a cylindrical shape, and a plurality of devices described herein can be arranged to surround the kiln and use the kiln as a heat source.

[0015] In yet another aspect, an apparatus for waste heat recovery may include a base block disposed above a heat source, a first vertical fin protruding from a top surface of the base block on a left side of the base block, a second vertical fin protruding from a top surface of the base block on a right side of the base block, a first thermoelectric generator thermally coupled to a right side of the first vertical fin, a second thermoelectric generator thermally coupled to a left side of the second vertical fin, a first thermoelectric cooler thermally coupled to the right side of the first thermoelectric generator, a second thermoelectric cooler thermally coupled to the left side of the second thermoelectric generator, and a heat sink disposed thermally coupled to both the right side of the first thermoelectric cooler and the left side of the second thermoelectric cooler.

[0016] One or more of the following features may be included in any feasible combination. For example, the first and second thermoelectric generators may be configured to generate electrical power, and at least a portion of the generated electrical power may be provided to the first and second thermoelectric coolers. The base block may include a heat exchanger on a side facing the heat source. The heat sink may include a plurality of heat dissipation fins.

[0017] In yet another aspect, a system for waste heat recovery can include a kiln that includes a cylindrical shape, and a plurality of devices described herein can be arranged to surround the kiln and use the kiln as a heat source.

[0018] In yet another aspect, a method for waste heat recovery can include receiving heat from a heat source, generating electricity with the received heat in a thermoelectric generator, and providing at least a portion of the generated electricity to a thermoelectric cooler. One or more of the following features can be included in any feasible combination. For example, the method can include measuring a temperature of a surface of the heat source and electrically disconnecting the thermoelectric generator in response to determining that the measured temperature is equal to or greater than a first preset temperature. The method can include providing electricity to the thermoelectric generator in response to determining that the measured temperature is equal to or greater than a second preset temperature such that the thermoelectric generator can be operated to cool the heat source.

[0019] Also described are non-transitory computer program products (i.e., physically embodied computer program products) that store instructions that, when executed by one or more data processors of one or more computing systems, cause at least one data processor to perform the operations described herein. Similarly, described are computer systems that can include one or more data processors and a memory coupled to the one or more data processors. The memory can store, either temporarily or permanently, instructions that cause at least one processor to perform one or more of the operations described herein. Furthermore, the methods can be implemented by one or more data processors in a single computing system or distributed among two or more computing systems. Such computing systems can be connected, such as via one or more connections including connections via a network (e.g., the Internet, a wireless wide area network, a local area network, a wide area network, a wired network, etc.), via a direct connection between one or more of the computing systems, and can exchange data and / or commands or other instructions, etc.

[0020] The details of one or more variations of the subject matter described herein are set forth in the accompanying drawings and the description below. Other features and advantages of the subject matter described herein will be apparent from the description and drawings, and from the claims. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 illustrates an embodiment of a cooling system. [Diagram 2] FIG. 13 is a diagram of another embodiment of a cooling system. [Diagram 3] FIG. 1 is a diagram of an embodiment of a thermoelectric system including a TEG. [Figure 4] FIG. 1 is a diagram of an embodiment of a thermoelectric system including a TEG. [Diagram 5]FIG. 1 illustrates an embodiment of a cooling system including an energy recovery (ER) condenser system. [Figure 6] FIG. 6 is a diagram of an embodiment of the ER capacitor system shown in FIG. [Figure 7A] FIG. 7 is a diagram showing an example of a power generation (P-Gen) capacitor of the ER capacitor system shown in FIG. 6. [Figure 7B] FIG. 7B is a diagram of the P-Gen capacitor shown in FIG. 7A including a temperature sensor. [Figure 7C] FIG. 7 is a diagram of an embodiment of the cooling system shown in FIG. 5 including the ER condenser system shown in FIG. [Figure 8] FIG. 13 is a diagram of another embodiment of a P-Gen capacitor. [Figure 9] FIG. 13 is a diagram of another embodiment of a P-Gen capacitor. [Figure 10] FIG. 1 is a side view of one embodiment of a multi-pass P-Gen condenser that can be used to recover energy from a refrigerant. [Figure 11] FIG. 1 is a diagram of an embodiment of a cooling system including an energy recovery (ER) condenser system and a scroll expander. [Figure 12] FIG. 2 is a diagram of another embodiment of a cooling system including an energy recovery (ER) condenser system and a scroll expander. [Figure 13] FIG. 2 is a diagram of another embodiment of a cooling system including an energy recovery (ER) condenser system and a scroll expander. [Figure 14] 1 illustrates an example of an ER capacitor system including a controller that can be configured to manage the load applied to the TEG and TEC of a P-Gen capacitor. [Figure 15] FIG. 1 is a cross-sectional view showing an example of a prior art cement kiln. [Figure 16] FIG. 1 illustrates a cross-sectional view of a waste heat recovery system according to an exemplary embodiment of the present disclosure. [Figure 17] FIG. 1 is a cross-sectional view of a thermoelectric generator (TEG) module according to an exemplary embodiment of the present disclosure. [Figure 18]FIG. 1 is a cross-sectional view of a thermoelectric cooler (TEC) module according to an exemplary embodiment of the present disclosure. [Figure 19] FIG. 2 is a cross-sectional view illustrating a waste heat recovery system according to another exemplary embodiment of the present disclosure. [Figure 20A] FIG. 1 is a diagram showing an example of an exhaust heat recovery system installed in the vicinity of a cement kiln. [Figure 20B] FIG. 1 is a diagram showing an example of an exhaust heat recovery system installed in the vicinity of a cement kiln. [Figure 20C] FIG. 1 is a diagram showing an example of an exhaust heat recovery system installed in the vicinity of a cement kiln. [Figure 20D] FIG. 1 is a diagram showing an example of an exhaust heat recovery system installed in the vicinity of a cement kiln. [Figure 21] FIG. 2 illustrates signal and power flows according to an exemplary embodiment of the present disclosure. [Figure 22] 1 is a flow chart illustrating a method of controlling a waste heat recovery system.

[0022] Detailed Description Certain exemplary embodiments will now be described to provide a general understanding of the principles of the structure, function, manufacture, and use of the systems, devices, and methods disclosed herein. One or more examples of these embodiments are illustrated in the accompanying drawings. Those skilled in the art will appreciate that the systems, devices, and methods specifically described herein and illustrated in the accompanying drawings are non-limiting exemplary embodiments, and the scope of the present invention is defined only by the claims. Features illustrated or described in connection with one exemplary embodiment may be combined with features of other embodiments. Such modifications and variations are intended to be included within the scope of the present invention. Furthermore, in this disclosure, similarly named components of an embodiment generally have similar characteristics, and therefore, within a particular embodiment, each feature of each similarly named component is not necessarily fully detailed.

[0023] In one aspect, the subject matter can include a capacitor for removing heat from the refrigerant. The capacitor can include one or more thermoelectric generators (TEGs) capable of converting heat into electrical energy. The TEGs can generate electrical energy as a result of a temperature gradient formed within the TEG. A portion of the heat from the refrigerant can be delivered to one or more TEGs, thereby generating a temperature gradient, and the TEGs can generate electrical energy. To optimize the efficiency of the TEGs, one or more thermoelectric coolers (TECs) can be utilized to manage the temperature gradient within the TEG. The subject matter can improve the efficiency of a cooling system, such as a refrigeration system. In some embodiments, the subject matter can allow all components of the cooling system to be located in the same general vicinity by reducing waste heat, thereby simplifying the design of the cooling system. In some embodiments, rather than using a TEC to manage the temperature gradient within the TEG, other heat removal devices can be used. For example, a combination of a fan and a heat sink can be used to provide controlled forced convection to manage the temperature gradient within the TEG.

[0024] FIG. 1 illustrates an embodiment of a cooling system 100 that can be used to cool at least a portion of a volume 101. The volume 101 can be or can include a data center, for example. The cooling system 100 can include a refrigerant supply system 102 that can introduce a refrigerant (e.g., R410, R312) into the cooling system 100 via a valve 104. Initially, a low pressure, low temperature refrigerant vapor can be delivered to a compression system 106. The compressor can be driven by an electric motor that can receive power 107 from an external power source. When the refrigerant leaves the compression system 106, the refrigerant can be in a high temperature, high pressure vapor state. The refrigerant can then flow to one or more condensers / aftercoolers 108 downstream of the compression system 106. The condenser 108 can facilitate a phase change of the refrigerant 109 from a vapor or mostly vapor to a primarily liquid state by removing excess heat generated during the compression process. Once at least a portion of the refrigerant is in a condensed state, the refrigerant can travel through an expansion valve 110, which can create a pressure drop that can bring at least a portion of the refrigerant to a low pressure, low temperature liquid state. The liquid refrigerant can then be delivered to a heat exchanger 112 (e.g., an evaporator) to cool incoming air 114 from the data center environment. The heat exchanger 112 can be, for example, a core plate and fin type heat exchanger. Alternatively, other heat exchangers (e.g., core, etched plate, diffusion bonded wound coil, shell and tube, plate and frame) can be used. The refrigerant can travel through cooling passages, cooling elements, or within the shell to cool a "hot fluid," such as air from the data center. As the air 116 travels through the heat exchanger 112, it can be cooled by exchanging heat with the refrigerant 118 in the heat exchanger 112. The air 120 can then be discharged from the heat exchanger 112 to cool the capacity 101, e.g., the data center. The refrigerant can then be sent back to the compression system 106, and the cycle can repeat.

[0025] In general, the heat absorbed in the condenser 108 may be released in several ways. In the illustrated embodiment, the condenser 108 may be located outside the volume 101, for example on the roof, and may release heat to the ambient air. One advantage of the cooling system 100 shown in FIG. 1 is that it is easy to maintain. However, the system is costly and difficult to design and implement, depending on the distance the pipes must travel, the height variations between the condenser 108 and other components of the system 100, and outdoor weather variations. To avoid the aforementioned drawbacks, it may be beneficial to design a cooling system in which the condenser is in close proximity to the other components of the cooling system.

[0026] 2 illustrates another embodiment of an exemplary cooling system 200 that may be used to cool at least a portion of a volume 201. Volume 201 may be or may include, for example, an indoor portion of a data center. Cooling system 200 may be generally similar to cooling system 100, but may have a first heat exchanger 208 that may transfer heat from a compressed refrigerant to a cooling fluid that may circulate between first heat exchanger 208 and a second heat exchanger 222.

[0027] The cooling system 200 can include a refrigerant supply system 202 that can introduce refrigerant into the cooling system 200 via a valve 204. The refrigerant is delivered to a compression system 206, which can receive power 207 from an external power source. The refrigerant can then travel to a first heat exchanger 208, also referred to as a condenser. The refrigerant can then travel through an expansion valve 210 and a heat exchanger 212 to cool the incoming air 214, as described above with respect to the cooling system 100. As the air 216 travels through the heat exchanger 212, it can be cooled by exchanging heat with the refrigerant 218 in the heat exchanger 212. The air 220 can then be discharged from the heat exchanger 212 to cool the volume 201. The refrigerant can then be sent back to the compression system 206, and the cycle can repeat.

[0028] In the illustrated example, heat from the refrigerant 224 in the first heat exchanger 208 is transferred to a cooling fluid 226, which may be circulated between the first heat exchanger 208 and the second heat exchanger 222. The cooling fluid may be, for example, water or another refrigerant, and may be pumped between the first heat exchanger 208 and the second heat exchanger 222 using a pump 228. As shown in FIG. 2, the pump 228 and the second heat exchanger 222 may be located outside the volume 201. The second heat exchanger 222 may be, for example, a cooling tower or an air-cooled condenser.

[0029] For both cooling systems 100, 200 shown in FIG. 1 and FIG. 2, the heat extracted from the refrigerant 109, 224 is ultimately dumped outside the volume 101, 201. This configuration therefore requires that fluid delivery lines extend between the indoor and outdoor components of the cooling system 100, 200. Such constraints can increase the complexity of the design of the cooling system and the complexity in implementing that design. Furthermore, a significant amount of energy can be wasted by dumping the heat from the refrigerant to the outdoor environment. Therefore, it can be beneficial to utilize a cooling system that includes a waste heat recovery system that can convert the heat from the compressed refrigerant into useful power. Such a system can allow all components of the cooling system to be located in the same general vicinity since there is less waste heat to manage.

[0030] In some embodiments, the waste heat recovery system may utilize at least one thermoelectric generator (TEG) and at least one thermoelectric cooler (TEC). The TEG, which may also be called a Seebeck generator, may be a solid-state device that utilizes the Seebeck effect to convert heat flux (temperature difference) into electrical energy. One side of the TEG may be coupled to a hot surface and the other side may be coupled to a cold surface.

[0031] FIG. 3 illustrates an example of a thermoelectric system 300 that can include a TEG 350. The thermoelectric system 300 can include a TEG 350 and a load 306. The TEG 350 can include a first thermally conductive element 302, which can be referred to as a "hot member" on a first end of the TEG 350, and a second thermally conductive element 304, which can be referred to as a "cold member" on a second end of the TEG 350. The TEG 350 can include at least one n-type semiconductor 352 and at least one p-type semiconductor 354, which can be disposed between the first thermally conductive element 302 and the second thermally conductive element 304 and can be coupled in series by a number of conductive members. The illustrated embodiment shows a first conductive member 356, a second conductive member 358, and a third conductive member 360. The first conductive member 356 is coupled to a first end of the p-type semiconductor 354, the third conductive member 360 is coupled to a first end of the n-type semiconductor, and the second conductive member 358 is coupled to second ends of the p-type semiconductor 354 and the n-type semiconductor 352 such that the p-type semiconductor 354 and the n-type semiconductor 352 are coupled in series. The first conductive member 356 and the third conductive member 360 may be electrically coupled to the load 306 such that power may be delivered from the TEG 350 to the load 306.

[0032] During operation, the first heat conducting element 302 can receive heat from an external heat source, the first heat conducting element 302 can be at a temperature T3a, and the second heat conducting element 304 can be at a temperature T3b, where T3a>T3b. In some embodiments, heat can be extracted from the second heat conducting element 304 to ensure that T3a>T3b. The first heat conducting element 302 and the second heat conducting element 304 can create a thermal gradient across the p-type semiconductor 354 and the n-type semiconductor 352, which can cause a majority of charge carriers in the p-type semiconductor 354 and the n-type semiconductor 352 to move away from the first heat conducting element 302 and toward the second heat conducting element 304, and a minority of charge carriers can move in the opposite direction. Thus, electrons in the n-type semiconductor 352 can move toward the second heat conducting element 304, and positively charged "holes" in the p-type semiconductor 354 can move toward the second heat conducting element 304. This charge movement can generate a voltage potential across each semiconductor 352, 354. Because the semiconductors 352, 354 are coupled in series in a circuit, a current can flow. Thus, electrons can travel from the n-type semiconductor 352, through the third conductive member 360, through the load 306, through the first conductive member 356, through the p-type semiconductor 354, to the second conductive member 358, and back to the n-type semiconductor 352, completing the circuit. Thus, the TEG 350 can generate power that can be delivered from the TEG 350 to the load 306. By controlling how much heat is delivered to the first thermal conductive element 302 and / or how much heat is extracted from the second thermal conductive element 304, the temperature gradient across the semiconductors 352, 354 can be controlled, the efficiency of the TEG can be optimized, and power generation can be controlled.

[0033] TECs, sometimes called Peltier elements, Peltier heat pumps, and solid-state refrigerators, are capable of receiving a DC electric current and can use the energy in the electric current to transfer heat from one side of the device to the other side of the device.

[0034] 4 illustrates an example of a thermoelectric system 400 that can include a TEC 450. The thermoelectric system 400 can include a TEC 450 and a power source 406. The TEC 450 can include a first heat conducting element 402 on a first end of the TEC 450 and a second heat conducting element 404 on a second end of the TEC 450. The TEC 450 can include at least one n-type semiconductor 452 and at least one p-type semiconductor 454, which can be disposed between the first heat conducting element 402 and the second heat conducting element 404. The n-type semiconductor 452 and the p-type semiconductor 454 can be coupled in series by a number of conductive members. The illustrated embodiment shows a first conductive member 456, a second conductive member 458, and a third conductive member 460, which may be coupled to the n-type semiconductor 452 and the p-type semiconductor 454 in a manner similar to that described above with respect to the first conductive member 356, the second conductive member 358, and the third conductive member 360 being coupled to the n-type semiconductor 352 and the p-type semiconductor 354.

[0035] In this case, the first conductive member 456 and the third conductive member 460 can be electrically coupled to the power source 406 such that a current can flow through the semiconductors 452, 454 at a predetermined voltage. In operation, a current can flow from the negative terminal of the power source 406, through the first conductive member 456, the p-type semiconductor 454, the second conductive member 458, the n-type semiconductor 452, the third conductive member 460, to the positive terminal of the power source 406. Thus, electrons in the n-type semiconductor 452 can move toward the second thermal conductive element 404, and positively charged "holes" in the p-type semiconductor 454 can move toward the second thermal conductive element 404. This charge motion creates a temperature gradient across each of the semiconductors 452, 454, and the cooled end corresponds to a directional charge motion of the majority of charge carriers relative to each of the semiconductors 452, 454. Thus, the current flowing through the TEC 450 can heat the first heat-conducting element 402 and cool the second heat-conducting element 404. Thus, the first heat-conducting element 402 can be heated to a temperature T4a and the second heat-conducting element 404 can be cooled to a temperature T4b, where T4a>T4b. By controlling the voltage and current, the temperature gradient across the semiconductors 452, 454 can be controlled. Thus, the temperatures T4a, T4b of the first heat-conducting element 402 and the second heat-conducting element 404 can be controlled.

[0036] TEGs can be used to convert heat into electrical power. However, the efficiency of a TEG can be sensitive to thermal gradients across the semiconductors used in the TEG. Therefore, a TEC can be used to manage the temperature gradient across the semiconductors in the TEG.

[0037] 5 illustrates an example of a cooling system 500 that can be used to cool at least a portion of a volume 501. The volume 501 can be, or can include, for example, an indoor portion of a data center. The cooling system 500 can be generally similar to the cooling system 100, but can include an energy recovery (ER) condenser system 600 that can remove heat from a compressed refrigerant and generate electrical energy. The cooling system 500 can include the ER condenser system 600, a refrigerant supply system 502, a valve 504, a compression system 506 that can receive electrical power 507 from an external power source, an expansion valve 510, and a heat exchanger 512 for cooling incoming air 514, as described above with respect to the cooling system 100. As the air 516 travels through the heat exchanger 512, it can be cooled by exchanging heat with a refrigerant 518 in the heat exchanger 512. The air 520 can then be discharged from the heat exchanger 512 to cool the volume 501.

[0038] 6 shows a schematic diagram of an ER capacitor system 600. The ER capacitor system 600 can include a power generation (P-Gen) capacitor 608, a power management module 630, and a thermal management module 632. The power management module 630 and the thermal management module 632 can each include at least one data processor capable of receiving, processing, determining, and delivering data. The power management module 630 and the thermal management module can be electrically coupled to the P-Gen capacitor 608 using coupling elements 634, 636. Additionally, the power management module 630 can be electrically coupled to the thermal management module 632 via coupling element 638.

[0039] The compressed refrigerant 503 may be delivered to the P-Gen condenser 608. As the refrigerant 509 travels through the P-Gen condenser 608, the P-Gen condenser 608 may facilitate a phase change of the refrigerant 509 from a vapor or mostly vapor to a primarily liquid state by removing excess heat generated during the compression process. The refrigerant 511 may then exit the P-Gen condenser 608 and travel through the remainder of the cooling system 500 as described above with respect to the cooling systems 100, 200 shown in Figures 1 and 2. As the refrigerant 509 passes through the P-Gen condenser 608, the TEG within the P-Gen condenser 608 may utilize the heat that may be transferred from the refrigerant 509 to generate power.

[0040] As discussed above, the efficiency of the TEG may be sensitive to thermal gradients across the semiconductors used within the TEG. Thus, the TEC may be used to manage temperature gradients across the semiconductors in the TEG. The power management module 630 may receive power from the TEG and may control the amount of power that may be delivered to the TEC, for example, via coupling element 634. The thermal management module 632 may monitor the temperature at various locations of the P-Gen capacitor 608 and may communicate with the power management module 630 to control the amount of power delivered to the TEC to optimize the efficiency of the TEG. The ER capacitor system 600 is described in further detail below.

[0041] In some embodiments, the power management module 630 and the thermal management module 632 can receive power 601, 603 from an external power source. The power 601, 603 can be used to power various components within the power management module 630 and the thermal management module 632.

[0042] 7A-7B show an enlarged side view of the P-Gen condenser 608. As shown in FIG. 7A, the P-Gen condenser 608 can include a thermally conductive condensing member 640, at least one TEG, and at least one TEC. In some embodiments, the condensing member 640 can be a thermally conductive plate that can have at least one passage 642 extending therethrough. As an example, in some embodiments, the condensing member 640 can be fabricated using additive manufacturing techniques. In some embodiments, the condensing member 640 can be made from a single piece of material. In some embodiments, the condensing member 640 can have multiple passages 642 that can extend therethrough in any number of configurations. The illustrated embodiment shows a first set of TEGs 644a and a second set of TEGs 644b, as well as a first TEC 646a and a second TEC 646b. The TEGs 644a, 644b may be generally similar to the TEG 350 shown in Figure 3, and the TECs 646a, 646b may be generally similar to the TEC 450 shown in Figure 4. The TEGs 644a, 644b and the TECs 646a, 646b may have thermally conductive members 648a, 648b, 648c, 648d coupled to their ends. In some embodiments, the thermally conductive members 648a, 648b, 648c, 648d may be in the form of thermally conductive plates.

[0043] As described above with respect to the TEG 350 shown in FIG. 3, the TEGs 644a, 644b can include a first thermally conductive element capable of transferring heat to a semiconductor in the TEGs 644a, 644b and a second thermally conductive element capable of transferring heat from a semiconductor in the TEGs 644a, 644b. Similarly, as described above with respect to the TEC 450 shown in FIG. 4, the TECs 646a, 646b can include a first thermally conductive element that can be heated when a current flows through the TECs 646a, 646b and a second thermally conductive element that can be cooled when a current flows through the TECs 646a, 646b. The TEGs 644a, 644b and the TECs 646a, 646b can be coupled to opposite sides of the thermally conductive members 648a, 648b, 648c, 648d.

[0044] The TEGs 644a, 644b and the TECs 646a, 646b may be oriented such that the second thermally conductive elements of the TEGs 644a, 644b and the TECs 646a, 646b may be coupled to both sides of the thermally conductive members 648a, 648b, 648c, 648d. Thus, the first thermally conductive elements of the TEGs 644a, 644b and the TECs 646a, 646b may be coupled to both sides of the thermally conductive members 648a, 648b, 648c, 648d.

[0045] The first set of TEGs 644a may be oriented such that a first heat transfer element is coupled to the condensation member 640 and a second heat transfer element is coupled to one side of the conductive member 648a. The first TEC 646a may be oriented such that a second heat transfer element is coupled to the opposite side of the conductive member 648a and a first heat transfer element is coupled to one side of another conductive member 648b. The second set of TEGs 644b may be oriented such that a first heat transfer element is coupled to the opposite side of the conductive member 648b and a second heat transfer element is coupled to one side of another conductive member 648c. The second TEC 646b may be oriented such that a second heat transfer element is coupled to the opposite side of the conductive member 648c and a first heat transfer element is coupled to one side of another conductive member 648d. Thus, the second heat conduction element of the TECs 646a, 646b can be thermally coupled to the second heat conduction element of the TEGs 644a, 644b, and the second heat conduction element of the TECs 646a, 646b can extract heat from the second heat conduction element of the TEGs 644a, 644b. Additionally, the first heat conduction element of the first TEC 646a can be thermally coupled to the first heat conduction element of the second pair of TEGs 644b, and the first heat conduction element of the first TEC 646a can deliver heat to the first heat conduction element of the second pair of TEGs 644b.

[0046] In some embodiments, the conductive members 648a, 648c can be the second thermally conductive element of the TEGs 644a, 644b and TECs 646a, 646b. The condensing member 640 can be the first thermally conductive element of the first pair of TEGs 644a, the conductive plate 648b can be the first thermally conductive element of the second pair of TEGs 644b and the first TEC 646a, and the conductive plate 648b can be the first thermally conductive element of the second TEC 646b.

[0047] As shown in FIG. 7B, the P-Gen capacitor 608 can also include one or more temperature sensors 650, 652, 654. The temperature sensors 650, 652, 654 can be, for example, thermocouples and / or resistance temperature detectors (RTDs). The temperature sensor 650 can be coupled to the condensing member 640 and / or the thermally conductive members 648a, 648b, 648c, 648d and can be disposed adjacent to at least one of the 644a, 644b and / or the TECs 646a, 646b. The temperature sensors 652, 654 can be coupled to the condensing member 640 and can be disposed within and / or adjacent to the passageway 642 to measure the temperature of the refrigerant as it passes through the passageway 642. In some embodiments, the one or more temperature sensors 652, 654 can be disposed at an inlet of the passageway 642 and the one or more temperature sensors can be disposed at an outlet of the passageway 642. In some embodiments, the temperature sensors 652 , 654 can be evenly spaced along the length of the passage 642 to measure the temperature of the refrigerant as it passes through the passage 642 .

[0048] In the illustrated example, the TEGs 644a, 644b are twice as large as the TECs 646a, 646b. However, the number of TEGs and TECs may vary depending on other design considerations. For example, the amount of heat desired to be extracted from the refrigerant may be used to determine the number of TEGs and TECs used in the P-Gen condenser 600. In some embodiments, the TEGs may be configured to generate different amounts of power. For example, the amount of heat desired to be extracted from the refrigerant and / or the temperature of the refrigerant may be used to determine the amount of power the TEGs are configured to generate. For example, a TEG located in a downstream portion of the P-Gen condenser 608 may be configured to generate less power than a TEG located in an upstream portion of the P-Gen condenser 608 when less heat is extracted downstream. Thus, the length of the passage 642 and the relative positions of the TEGs may be used to determine the amount of power the TEGs are configured to generate. As another example, the second set of TEGs 644b can be configured to generate less power than the first set of TEGs 644a because the temperature gradient across the second set of TEGs 644b can be less than the temperature gradient across the first set of TEGs 644a. Furthermore, the TEGs can be coupled in series and / or parallel depending on the desired output voltage and / or current. In a preferred embodiment, there can be more TEGs than TECs.

[0049] During operation, the refrigerant may enter the passageway 642 and travel through the P-Gen condenser 608, thereby transferring heat from the refrigerant to the condensing member 640. A portion of the heat from the refrigerant may be transferred from the condensing member 640 to a first end of the TEG 644a.

[0050] The power management module 630 can deliver power to the TECs 646a, 646b, which heats a first end of each TEC 646a, 646b and cools a second end of each TEC 646a, 646b. In some embodiments, the power delivered to the TECs 646a, 646b can be a portion of the power 603 that the power management module 630 receives from an external power source. Each TEC 646a, 646b can receive a different amount of power.

[0051] The second ends of TECs 646a, 646b can extract heat from conductive members 648a, 648c, and the first ends of TECs 646a, 646b deliver heat to conductive members 648b, 648d, thereby cooling conductive members 648a, 648c and heating conductive members 648b, 648d.

[0052] The cooled thermally conductive members 648a, 648c and the heated thermally conductive members 648b, 648d can extract heat from and transfer heat to both sides of the TEGs 644a, 644b, thereby creating a temperature gradient across the semiconductors in the TEGs 644a, 644b.

[0053] The TEGs 644a, 644b can generate power and deliver at least a portion of the power to the power management module 630. The amount of power that the TEGs 644a, 644b generate can depend on a temperature gradient within the semiconductor of the TEGs 644a, 644b.

[0054] The power management module 630 can measure the amount of power generated by the TEGs 644a, 644b and can store at least a portion of the power as electrical energy and / or deliver a portion of the power to the TECs 646a, 646b to power them. In some embodiments, the power management module 630 can store the electrical energy in a battery. Additionally, the power management module 630 can be electrically coupled to the compression system 506 via a coupling element 639, as shown in FIG. 7C, and can deliver a portion of the electrical energy to the compression system 506 to power the compressor.

[0055] In some embodiments, depending on the type of temperature sensors 650, 652, 654 used, the thermal management module 632 can deliver a portion of the power 601 to the temperature sensors 650, 652, 654 (e.g., via coupling element 636) to power them. Alternatively, or additionally, the power management module 630 can deliver a portion of the power 603 to the temperature sensors 650, 652, 654 (e.g., via coupling element 634) to power them.

[0056] Temperature sensors 650, 652, 654 can measure temperature at various locations of P-Gen capacitor 608 and can deliver temperature signals characterizing the measured temperatures to thermal management module 632 (e.g., via coupling element 636). As shown in FIG. 7B, temperature sensor 650 can measure temperatures of condensing member 640 and conductive members 648a, 648b, 648c, 648d at locations adjacent to TEGs 644a, 644b and TECs 646a, 646b. Temperature sensors 652, 654 can measure the temperature of the refrigerant in passage 642 and / or the temperature of condensing member 640 at locations adjacent passage 642. Thermal management module 632 can receive the temperature signals, calculate a corresponding temperature, and deliver one or more control signals characterizing the calculated temperatures to power management module 630. In some embodiments, thermal management module 632 can provide instructions to power management module 630. For example, the thermal management module 632 may provide instructions to the power management module 630 to increase or decrease the amount of power delivered to the TECs 646a, 646b based on the calculated temperature. For example, in some cases, the instructions may include data characterizing the change in voltage and / or current corresponding to the power delivered to the TECs 646a, 646b.

[0057] The power management module 630 can receive the control signals containing instructions, process them, and adjust the amount of power delivered to the TECs 646a, 646b based on the information provided with the control signals. Each TEC 646a, 646b can receive a different amount of power depending on the temperature measured by the temperature sensor 650.

[0058] In response to changes in temperature measured by the temperature sensors 650, 652, 654, the thermal management module 632 can deliver an adjusted storage signal to the power management module 630 to adjust the amount of electrical energy stored in the battery and / or can deliver an adjusted power delivery signal to the power management module 630 to adjust the rate at which electrical energy is delivered to the TECs 646a, 646b. As an example, the thermal management module 632 can deliver an adjusted power delivery signal to the power management module 630 to adjust the amount of power delivered to the TECs 646a, 646b. Changing the amount of power delivered to the TECs 646a, 646b can change the temperature of the conductive members 648a, 648b, 648c, 648d, thereby changing the amount of power the TEG generates.

[0059] The first TEC 646a can function to remove heat from conductive member 648a and deliver heat to conductive member 648b, thereby cooling conductive member 648a and heating conductive member 648b. Similarly, the second TEC 646b can transfer heat from conductive member 648c to conductive member 648d, thereby cooling conductive member 648c and heating conductive member 648d.

[0060] As previously described, the condensing member can receive heat J6 from the refrigerant, and the conductive members 648b, 648d can receive heat J6b, J6d from the TECs 646a, 646b. In some embodiments, the amount of heat received by each of the conductive members 648b, 648d can decrease with each successive layer of the TEG and TEC, such that J6>J6b>J6d. Thus, in some embodiments, the condensing member 640 can have an average temperature T6, the conductive member 648b can have an average temperature T6b, and the conductive member 648d can have an average temperature T6d, where T6>T6b>T6d. The temperatures at various locations on the conductive members 648a, 648b, 648c, 648d depend on the arrangement of the TEG and TEC and the amount of thermal resistance that may exist between the conductive members 648a, 648b, 648c, 648d and the TEGs 644a, 644b and TECs 646a, 646b.

[0061] In addition, the amount of heat available for the TEG to absorb may decrease with each successive layer of the TEG and TEC. Thus, the first pair of TEGs 644a may absorb more heat than the second pair of TEGs 644b. Thus, in some embodiments, the first thermally conductive element of the first pair of TEGs 644a may be at a higher temperature than the first thermally conductive element of the second pair of TEGs 644b.

[0062] In some embodiments, in addition to or as an alternative to using the TEGs 644a, 644b, an organic Rankine cycle can be used to recover waste heat from the condensation of the refrigerant. For example, the P-Gen condenser can include a turbine coupled thereto. High temperature and high pressure vapor refrigerant can be delivered to the turbine. As the refrigerant passes through the turbine, it can drive the shaft of the turbine. Mechanical work from the turbine shaft can be used directly, for example to drive the compressor of the compression system 506, or can be converted to electrical energy using a DC generator. The electrical energy can be delivered to the power management module 630, where it can be stored in a battery and / or distributed as desired. For example, a portion of the electrical energy can be delivered to the TECs 646a, 646b to power them. As another example, a portion of the electrical energy can be delivered to the compressor system 506 to power the compressor. The refrigerant can then be delivered to the condenser portion of the P-Gen condenser 608. The condenser system 600 can facilitate a phase change of the refrigerant from a vapor or mostly vapor to a primarily liquid state by removing excess heat generated during the compression process. The refrigerant can continue through the cooling system 500 as described above.

[0063] The ER condenser system 600 can provide many technical advantages. For example, by converting waste heat into electrical power, the efficiency of the cooling system 500 can be increased. Additionally, the ER condenser system 600 allows all components of the cooling system to be located in the same general vicinity because there is less waste heat to manage. The design of the cooling system can be simplified because the waste heat does not need to be discharged to the environment. This allows data centers to be built in buildings or locations that would not otherwise be a viable option due to the complex construction requirements and / or costs associated with building and maintaining a data center. The ER condenser system 600 cannot rely on heat exchange with the outside environment. Thus, the cooling system 500 is more efficient and stable than other cooling systems (e.g., cooling systems utilizing roof-mounted condensers) because the heat transfer from the condenser does not depend on the temperature of the outdoor environment. The technical advantages that apply to the ER condenser system 600 can also be applied to other subject matter described herein.

[0064] The amount of heat that conductive members 648b, 648d can receive from TECs 646a, 646b can depend on the thermal conductivity between a first thermally conductive element of TECs 646a, 646b and an adjacent surface of conductive members 648b, 648d. Similarly, the amount of heat that can be extracted from conductive members 648a, 648c can depend on the thermal conductivity between a second thermally conductive element of TECs 646a, 646b and an adjacent surface of conductive members 648a, 648c.

[0065] 8 illustrates another example of a P-Gen condenser 708 that may be used in an ER condenser system (e.g., ER condenser system 600 shown in FIG. 6) and may be used in a cooling system such as cooling system 500 shown in FIG. 5. The condenser 708 may be generally similar to the P-Gen condenser 608 shown in FIGS. 7A-7B, but may include a temperature sensor 750 that may be embedded within the condensing member 740 and within thermally conductive members 748a, 748b, 748c, 748d. The condenser 708 may include a condensing member 740 that may have passages 742 extending therethrough, thermally conductive members 748a, 748b, 748c, 748d, a first set of TEGs 744a and a second set of TEGs 744b, a first TEC 746a and a second TEC 746b, and the temperature sensor 750. 8, temperature sensors may be embedded within the condensing member 740 and within the conductive members 748a, 748b, 748c, 748d adjacent the ends of the TEGs 744a, 744b and TECs 746a, 746b. By embedding temperature sensors 750 within the conductive members 748a, 748b, 748c, 748d, the sensors may measure temperatures near the ends of the TEGs 744a, 744b and TECs 746a, 746b. The P-Gen condenser 708 may also include temperature sensors 752, 754, which may be configured to measure the temperature of the refrigerant within the passages 742 and / or the temperature of the condensing member 740 adjacent the passages 742. The temperature sensors 752, 754 may generally be similar to the temperature sensors 652, 654 described above, may be coupled to the condensing member 740, and may be positioned within and / or adjacent to the passage 742 to measure the temperature of the refrigerant as it passes through the passage 742.

[0066] FIG. 9 illustrates another example of a P-Gen capacitor 808. The capacitor 808 may be substantially similar to the P-Gen capacitor 608 illustrated in FIGS. 7A-7B, but may have a condensing member 840, which may include a tube 841 having a passageway 842 extending therethrough, with the tube 841 having fins 843 extending therefrom. In some embodiments, the tube 841 and fins may be made from a single piece of material. The capacitor 808 may include a condensing member 840, thermally conductive members 848a, 848b, 848c, 848d, a first set of TEGs 844a and a second set of TEGs 844b, and a first TEC 846a and a second TEC 846b. The configuration of the condensing member 840 may reduce the cost of the condensing member 840. Additionally, the fins 843 can improve heat transfer from the refrigerant to the first thermal conduction element of the first pair of TEGs 844a. The P-Gen condenser 808 can also include temperature sensors 852, 854 that can be configured to measure the temperature of the refrigerant in the passages 842 and / or the temperature of the condensing member 740 adjacent the passages 842. The temperature sensors 852, 854 can be generally similar to the temperature sensors 652, 654 described above and can be coupled to the condensing member 840 and positioned within and / or adjacent the passages 842 to measure the temperature of the refrigerant as it passes through the passages 842.

[0067] In some embodiments, as shown in FIG. 10, a multi-pass P-Gen condenser 908 can be used to recover energy from the refrigerant 903. The P-Gen condenser 908 can be part of a condenser system, such as the condenser system 600 described above, which can be used in a cooling system, such as the cooling system 500 shown in FIG. 5. In some cases, the multi-pass P-Gen condenser can be used in retrofitting an existing condenser, which can have a geometry that lends itself to creating a multi-pass P-Gen condenser. The P-Gen condenser 908 can include a first condensing member 940a, a second condensing member 940b, and a third condensing member 940c, which can have passages extending therethrough. The condensing members 940a, 940b, 940c can be generally similar to the condensing members 640, 740 shown in FIG. 7A and FIG. 8. In some embodiments, one or more of the condensing members 940a, 940b, 940c can be similar to the condensing member 840 shown in FIG. 9 and can include tubes with fins extending therethrough.

[0068] The P-Gen condenser 908 can include TEGs that can be coupled to condensing members 940a, 940b, 940c and can be configured to convert thermal energy into electrical energy. In the illustrated example, the P-Gen condenser 908 includes a first set of TEGs 944a, a second set of TEGs 944b, a third set of TEGs 944c, and a fourth set of TEGs 944d. These sets of TEGs 944a, 944b, 944c, 944d can be generally similar to the TEG 350 described above with respect to FIG.

[0069] As described above with respect to the TEG 350 shown in FIG. 3, each TEG 944a, 944b, 944c, 944d can include a first thermally conductive element capable of transferring heat to a semiconductor within the TEG 944a, 944b, 944c, 944d and a second thermally conductive element capable of transferring heat away from the semiconductor within the TEG 944a, 944b, 944c, 944d, thereby generating a thermal gradient across the semiconductor. The thermal gradient can generate charge movement within the semiconductor. The charge movement can generate a voltage potential across each semiconductor, allowing the TEG 944a, 944b, 944c, 944d to generate electrical power.

[0070] The P-Gen capacitor 908 may also include a first cooling stage 947a and a second cooling stage 947b, which may function to manage temperature gradients across the semiconductors in the TEGs 944a, 944b, 944c, 944d. As shown in FIG. 10, the first cooling stage 947a may include a first thermally conductive member 948a, a second thermally conductive member 948b, and a third thermally conductive member 948c, as well as a first TEC 946a and a second TEC 946b. The first TEC 946a may be located between the first thermally conductive member 948a and the second thermally conductive member 948b, and the second TEC 946b may be located between the second thermally conductive member 948b and the third thermally conductive member 948c. Similarly, the second cooling stage 947b can include a first thermally conductive member 949a, a second thermally conductive member 949b, and a third thermally conductive member 949c, and a first TEC 951a and a second TEC 951b. The TECs 946a, 946b, 951a, 951b can be generally similar to the TEC 450 described above with respect to FIG. 4. As an example, when retrofitting an existing condenser, the TEGs 944a, 944b, 944c, 944d can be coupled to the tubes and / or plates that form the first condensing member 940a, the second condensing member 940b, and the third condensing member 940c. As shown in FIG. 10, the first cooling stage 947a can be disposed between the first condensing member 940a and the second condensing member 940b, and the second cooling stage 947b can be disposed between the second condensing member 940b and the third condensing member 940c.

[0071] As described above with respect to TEC 450 shown in FIG. 4, TECs 946a, 946b, 951a, 951b may include a first thermally conductive element that may be heated when current flows through the TECs 946a, 946b, 951a, 951b, and a second thermally conductive element that may be cooled when current flows through the TECs 946a, 946b, 951a, 951b.

[0072] The TECs 946a, 946b of the first cooling stage 947a may be oriented such that, upon application of power, heat is transferred from the first thermally conductive member 948a and the third thermally conductive member 948c to the second thermally conductive member 948b, thereby cooling the first thermally conductive member 948a and the third thermally conductive member 948c. For example, the first TEC 946a may be oriented such that a second thermally conductive element of the TEC 946a is coupled to the first thermally conductive member 948a, and the second TEC 946b may be oriented such that a second thermally conductive element of the TEC 946b is coupled to the third thermally conductive member 948c. The first thermally conductive element of the TECs 946a, 946b may be coupled to the second thermally conductive member 948b.

[0073] The TECs 951a, 951b of the second cooling stage 947b may be oriented such that, upon application of power, heat is transferred from the first thermally conductive member 949a and the third thermally conductive member 949c to the second thermally conductive member 949b, thereby cooling the first thermally conductive member 949a and the third thermally conductive member 949c. For example, the first TEC 951a may be oriented such that a second thermally conductive element of the TEC 951a is coupled to the first thermally conductive member 949a, and the second TEC 951b may be oriented such that a second thermally conductive element of the TEC 951b is coupled to the third thermally conductive member 949c. The first thermally conductive element of the TECs 951a, 951b may be coupled to the second thermally conductive member 949b.

[0074] As shown in the depicted example, a first set of TEGs 944a can be disposed between the first condensing member 940a and the first cooling stage 947a. The TEGs 944a can be oriented such that a first thermally conductive element is coupled to the first condensing member 940a and a second thermally conductive element is coupled to a first thermally conductive member 948a of the first cooling stage 947a.

[0075] A second set of TEGs 944b can be disposed between the first cooling stage 947a and the second condensing member 940b. The TEGs 944b can be oriented such that a first thermally conductive element is coupled to the second condensing member 940b and a second thermally conductive element is coupled to a third thermally conductive member 948c of the first cooling stage 947a.

[0076] A third set of TEGs 944c can be disposed between the second condensing member 940b and the second cooling stage 947b. The TEGs 944c can be oriented such that a first thermally conductive element is coupled to the second condensing member 940b and a second thermally conductive element is coupled to a first thermally conductive member 949a of the second cooling stage 947b.

[0077] A fourth set of TEGs 944d can be disposed between the second cooling stage 947b and the third condensing member 940c. The TEGs 944d can be oriented such that a first thermally conductive element is coupled to the third condensing member 940c and a second thermally conductive element is coupled to a third thermally conductive member 949c of the second cooling stage 947b.

[0078] In operation, the P-Gen condenser 908 can receive refrigerant 903 from a compression system, such as the compression system 506 described above. The refrigerant 903a can flow through one or more passages of the first condensing member 940a, thereby transferring heat to the first condensing member 940a. The refrigerant 905 exiting the first condensing member 940a can be delivered to the second condensing member 940b. The refrigerant 905a can travel through one or more passages of the second condensing member 940b, thereby transferring heat to the second condensing member 940b. The refrigerant 909 exiting the second condensing member 940b can be delivered to the third condensing member 940c. The refrigerant 909a can travel through one or more passages of the third condensing member 940c, thereby transferring heat to the third condensing member 940c.

[0079] At least a portion of the heat transferred from the refrigerant 903a to the first condensing member 940a may be transferred to the first heat conducting element of the first set of TEG 944a. At least a portion of the heat transferred from the refrigerant 905a to the second condensing member 940b may be transferred to the first heat conducting element of the second set of TEG 944b and the third set of TEG 944c. At least a portion of the heat transferred from the refrigerant 909a to the third condensing member 940c may be transferred to the first heat conducting element of the fourth set of TEG 944d.

[0080] In some cases, the heat transferred to the TEGs 944a, 944b, 944c, 944d may be sufficient to create a temperature gradient across the semiconductors of the TEGs 944a, 944b, 944c, 944d such that the TEGs 944a, 944b, 944c, 944d can generate power. However, to improve the efficiency of the TEGs 944a, 944b, 944c, 944d, the TECs 946a, 946b, 951a, 951b may be used to control the temperature gradient across the semiconductors of the TEGs 944a, 944b, 944c, 944d. For example, the power management module (e.g., the power management module 630) can deliver power to the first TEC 946a and the second TEC 946b of the first cooling stage 947a, thereby heating the first thermal conductive element of the TECs 946a, 946b, which can be coupled to the second thermal conductive member 948b of the first cooling stage 947a, and cooling the second thermal conductive element of the TECs 946a, 946b, which can be coupled to the first thermal conductive member 948a and the third thermal conductive member 948c of the first cooling stage 947a, respectively. Thus, heat can be transferred from the first thermal conductive member 948a and the third thermal conductive member 948c to the TECs 946a, 946b, and heat can be transferred from the TECs 946a, 946b to the second thermal conductive member 948b. Thus, the first thermally conductive member 948a and the third thermally conductive member 948c can be cooled by the TECs 946a, 946b. The first thermally conductive member 948a and the third thermally conductive member 948c can be cooled to have a lower temperature than the temperature of the first condensing member 940a and the second condensing member 940b, respectively. Thus, the first thermally conductive member 948a and the third thermally conductive member 948c can function as a heat sink for the first set of TEGs 944a and the second set of TEGs 944b. For example, heat can be transferred from the second thermally conductive elements of the TEGs 944a, 944b to the first thermally conductive member 948a and the third thermally conductive member 948c, thereby generating a temperature gradient across the semiconductors of the TEGs 944a, 944b.

[0081] Similarly, the power management module (e.g., the power management module 630) can deliver power to the first TEC 951a and the second TEC 951b of the second cooling stage 947b, thereby heating the first thermal conductive element of the TEC 951a, 951b that can be coupled to the second thermal conductive member 949b of the second cooling stage 947b and cooling the second thermal conductive element of the TEC 951a, 951b that can be coupled to the first thermal conductive member 949a and the third thermal conductive member 949c of the second cooling stage 947b, respectively. Thus, heat can be transferred from the first thermal conductive member 949a and the third thermal conductive member 949c to the TECs 951a, 951b, and heat can be transferred from the TECs 951a, 951b to the second thermal conductive member 949b. Thus, the first thermally conductive member 949a and the third thermally conductive member 949c can be cooled by the TECs 951a, 951b. The first thermally conductive member 949a and the third thermally conductive member 949c can be cooled to have a lower temperature than the respective temperatures of the second condensing member 940b and the third condensing member 940c. Thus, the first thermally conductive member 949a and the third thermally conductive member 949c can function as a heat sink for the third set of TEGs 944c and the fourth set of TEGs 944d. For example, heat can be transferred from the second thermally conductive elements of the TEGs 944c, 944d to the first thermally conductive member 949a and the third thermally conductive member 949c, thereby generating a temperature gradient across the semiconductors of the TEGs 944a, 944b.

[0082] The power management module can control the amount of power delivered to each TEC 946a, 946b, 951a, 951b, as described above with respect to the capacitor system 600. The power management module can adjust the temperature gradient across the semiconductors of the TEGs 944a, 944b, 944c, 944d by varying the amount of power delivered to the TECs 946a, 946b, 951a, 951b. For example, to increase the temperature gradient across the semiconductors of the TEGs 944a, 944b, 944c, 944d, the power management module can deliver more power to the TECs 946a, 946b, 951a, 951b, thereby increasing the amount of heat drawn from the thermally conductive members 948a, 948c, 949a, 949c. Alternatively, to increase the temperature gradient across the semiconductors of the TEGs 944a, 944b, 944c, 944d, the power management module reduces the amount of power delivered to the TECs 946a, 946b, 951a, 951b, thereby reducing the amount of heat drawn from the thermally conductive members 948a, 948c, 949a, 949c.

[0083] As described above, the TEGs 944a, 944b, 944c, 944d can generate power as a result of a temperature gradient formed within the semiconductors of the TEGs 944a, 944b, 944c, 944d. The P-Gen condenser 908 can include a temperature sensor that can be configured to measure the temperature of the refrigerant within the passages of the condensing members 940a, 940b, 940c, as well as the temperature of other components of the P-Gen condenser 908. For example, the P-Gen condenser 908 can include a temperature sensor (e.g., which can be temperature sensors 652, 654) that can be disposed within and / or adjacent to the passages within the condensing members 940a, 940b, 940c. The P-Gen capacitor 908 may also include a temperature sensor (e.g., temperature sensor 650) that may be located adjacent to the TEGs 944a, 944b, 944c, 944d and / or the TECs 946a, 946b, 951a, 951b, as described above with respect to the P-Gen capacitor 608 shown in FIG. 7B. As another example, the P-Gen capacitor 908 may also include a temperature sensor (e.g., temperature sensor 750) that may be located within the thermally conductive members 948a, 948b, 948c of the first cooling stage 947a and within the thermally conductive members 949a, 949b, 949c of the second cooling stage 947b, as described above with respect to the P-Gen capacitors 608, 708. The sensors may be powered, monitored, and / or controlled by a thermal management module (e.g., thermal management module 632). The thermal management module can be in electronic communication with the power management module, as described above with respect to capacitor system 600. Similarly, the power management module can receive and / or distribute power generated by TEGs 944a, 944b, 944c, 944d, as described above with respect to capacitor system 600.

[0084] The amount of heat removed from the refrigerant 903a, 905a, 909a as it travels through the first condensing member 940a, the second condensing member 940b, and the third condensing member 940c can be controlled based on the temperature measured by the temperature sensor, and the temperature of the refrigerant 911 exiting the P-Gen condenser can be controlled. For example, the amount of power delivered to the TEC can be controlled to reduce the temperature of the refrigerant 903a, 905a, 909a by a particular amount as it travels through the first condensing member 940a, the second condensing member 940b, and the third condensing member 940c.

[0085] In some embodiments, the TEG and / or TEC of the P-Gen capacitor can be mechanically loaded to increase their efficiency. For example, opposing forces can be applied to the first and second thermal conduction elements (e.g., the first and second thermal conduction elements 302 and 304 of the TEG 350 and the first and second thermal conduction elements 402 and 404 of the TEC 450) such that the semiconductors of the TEG and / or TEC are compressed.

[0086] Loading the semiconductor can increase the electron / hole mobility in the semiconductor, thereby increasing the efficiency of the TEG and / or TEC during operation. In some cases, loading the TEG and / or TEC can reduce the thermal and / or electrical resistivity between components of the TEG and / or TEC. For example, loading the TEG and / or TEC can reduce the electrical resistivity between the semiconductor and the conductive members (e.g., conductive members 356, 358, 360 of TEG 350 and conductive members 456, 458, 460 of TEC 450). Loading the TEG and / or TEC can also reduce the thermal resistivity between the thermal conduction elements of the TEG and / or TEC, the conductive members, and the semiconductor.

[0087] In some embodiments, a mechanical load can be applied to the P-Gen condenser of the condenser system. For example, referring to the P-Gen condenser 608 shown in FIG. 7A, a load can be applied relative to the condenser member 640 and the thermally conductive member 648d, compressing the TEGs 644a, 644b and the TECs 646a, 646b between them. Loading the P-Gen condenser can reduce the thermal resistance between the condenser member 640 and the TEG 644a, and can also reduce the thermal resistance between the thermally conductive members 648a, 648b, 648c, 648d and the TEGs 644a, 644b and / or the TECs 646a, 646b. Reducing the thermal resistance between the components of the P-Gen condenser 608 can increase heat transfer and can increase the efficiency of the TEGs 644a, 644b and / or the TECSs 646a, 646b. In some embodiments, a load on the P-Gen capacitors can be used to control thermal gradients within the TEGs 644a, 644b and / or TECs 646a, 646b. Also, as described above, mechanical loading can increase electron / hole mobility in the semiconductor, thereby increasing the efficiency of the TEGs 644a, 644b and / or TECs 646a, 646b during operation.

[0088] In some embodiments, the mechanical loads of the TEG, TEC, and / or P-Gen capacitors can be actively controlled to optimize the performance of the P-Gen capacitors during operation. For example, the loads on individual TEGs and TECs and / or portions of the P-Gen capacitors can be controlled. In some cases, the loads can be adjusted to maximize the efficiency of the P-Gen capacitors. In other cases, the loads can be adjusted to maximize the effectiveness (e.g., heat extraction) of the P-Gen capacitors. As an example, a feedback control system can be implemented to optimize the efficiency and / or effectiveness of the P-Gen capacitors.

[0089] FIG. 14 illustrates an example of an ER capacitor system 1300 that includes a controller 1302 that can be configured to manage the loads applied to the TEG and TEC of the P-Gen capacitor 608. The capacitor system 1300 can be generally similar to the capacitor system 600, but can include a controller 1302 and a mechanical load system 1304 configured to apply a mechanical load to the TEG and TEC of the P-Gen capacitor. The controller 1302 can be electrically coupled to the power management module 630, the thermal management module 632, and the P-Gen capacitor 608, for example, via couplings 1306, 1308, 1310. During operation, the thermal management module 632 can monitor the temperature at various locations of the P-Gen capacitor 608 and can communicate with the power management module 630 to control how much power is delivered to the TECs 646a, 646b to optimize the efficiency of the TEGs 644a, 644b. In some cases, rather than adjusting the electrical power delivered to the TECs 646a, 646b, the mechanical power applied to the TECs 646a, 646b may be adjusted. As an example, the power management module 630 may receive instructions from the thermal management module 632 indicating that the cooling effect provided by the TECs 646a, 646b should be altered (e.g., increased or decreased).

[0090] In some cases, the power delivered to the TECs 646a, 646b can be adjusted (e.g., increased or decreased) to change the cooling effect provided by the TECs 646a, 646b. Alternatively, rather than increasing the power delivered to the TECs 646a, 646b, the mechanical power applied to the TECs 646a, 646b can be changed (e.g., increased or decreased). As an example, the power management module 630 can generate instructions that characterize the load applied to the TECs 646a, 646b and deliver the instructions to the controller 1302. In some cases, the TECs 646a, 646b can be calibrated to determine the effect of the mechanical load on the efficiency of the TECs 646a, 646b. Thus, the mechanical load can be correlated with an effective increase in the power delivered to the TECs 646a, 646b. The controller 1302 can receive instructions from the power management module 630 and can generate instructions that characterize the load applied to the TECs 646a, 646b. The controller 1302 can deliver instructions to a mechanical loading system 1304, which can apply a load to the TECs 646a, 646b.

[0091] In some cases, the controller 1302 can monitor the power generated by the TEGs 644a, 644b and can be configured to automatically adjust the mechanical load applied to the TEGs 644a, 644b to maximize the efficiency of the TEGs 644a, 644b. For example, the controller 1302 can deliver commands to the mechanical load system 1304 to increase the force applied to the TEGs 644a, 644b. The controller 1304 can monitor the power output from the TEGs 644a, 644b. If a load change increases the power output from the TEGs 644a, 644b, this process can be repeated until a specified maximum allowable load is achieved or until increasing the load on the TEGs 644a, 644b no longer increases the power output. Alternatively, if increasing the load on the TEGs 644a, 644b reduces the power output from the TEGs 644a, 644b, the controller 1302 can deliver commands to the mechanical loading system 1304 to reduce the load applied to the TEGs 644a, 644b. This process can be repeated until the power output from the TEGs 644a, 644b does not change with the reduction in load, changes by less than a predetermined amount, or a minimum predetermined load is achieved. Each of the cooling systems described herein that can operate using the condenser system 600 can also operate using the condenser system 1300.

[0092] In some embodiments, the cooling system may use one or more scroll expanders to reduce the pressure of the refrigerant rather than using an expansion valve (e.g., expansion valves 110, 510). FIG. 11 illustrates a cooling system 1000, which may be generally similar to cooling system 500, but may include a scroll expander 1010. The scroll expander 1010 may be configured to facilitate recovery of energy associated with the expansion of the refrigerant. In some embodiments, the scroll expander 1010 may be made from a scroll compressor. For example, a portion of a scroll compressor may be cut to form the scroll expander 1010.

[0093] Initially, the low pressure, low temperature refrigerant vapor can be delivered to a compression system 506. The compressor can be driven by an electric motor that can receive power 507 from an external power source. When the refrigerant exits the compression system 506, the refrigerant can be in a high temperature, high pressure vapor state. The refrigerant can then flow downstream of the compression system 506 to a P-Gen condenser (e.g., P-Gen condenser 608) of the condenser system 600. The condenser system 600 can facilitate a phase change of the refrigerant from a vapor or mostly vapor to a primarily liquid state by removing excess heat generated during the compression process. Once at least a portion of the refrigerant is in a condensed state, the refrigerant can travel through a scroll expander 1010, which can create a pressure drop that can bring at least a portion of the refrigerant to a low pressure, low temperature liquid state.

[0094] The scroll expander can include two interleaved scrolls that can facilitate the pressure drop of the refrigerant. For example, a first scroll can be fixed and a second scroll can eccentrically rotate around the second scroll without rotating, thereby reducing the pressure of the refrigerant as it moves between the scrolls. The second scroll can be mechanically coupled (e.g., via coupling element 1060) to the compressor of the compression system 506, such that mechanical energy from the orbital motion of the second scroll can be captured and utilized to drive the compressor, thereby increasing the efficiency of the cooling system 1000. The liquid refrigerant can then be delivered to a heat exchanger 512 (e.g., an evaporator) to cool the incoming air 514 from the data center environment. As the air 516 moves through the heat exchanger, the air can be cooled by exchanging heat with the refrigerant 518 moving through the heat exchanger 512. The air 520 can then be discharged from the heat exchanger 512 to cool the data center.

[0095] In some embodiments, mechanical energy from the orbital motion of the scroll of the scroll expander can be converted to electrical energy, which can be used to power various components of the cooling system. FIG. 12 illustrates a cooling system 1100, which may be generally similar to the cooling system 1000 illustrated in FIG. 11, but may include a direct current (DC) generator 1162 coupled to the scroll expander 1010 via a coupling element 1160. Mechanical energy from the orbital motion of the second scroll of the scroll expander 1010 can be delivered to the DC generator 1162 via the coupling element 1160. The DC generator can be electrically coupled to the compression system 506 via the coupling element 1164. As an example, the DC generator can convert mechanical energy from the scroll expander 1010 to electrical energy and provide power to the compression system 506 to power the compressor of the compression system 506 via the coupling element 1164. The power from the DC generator 1162 can supplement or replace the power 507 from the external power source.

[0096] Alternatively, in some embodiments, the power from the DC generator 1162 can be delivered to the power management module 630 as shown in the embodiment of the cooling system 1200 shown in FIG. 13. The cooling system 1200 shown in FIG. 13 can be generally similar to the cooling system 1100 shown in FIG. 11, but the DC generator 1162 can be electrically coupled to the power management module 630 via a coupling element 1264. The power from the DC generator 1162 can be delivered to the power management module 630. As an example, the electrical energy corresponding to this power can be stored in a battery. In some embodiments, the power management module 630 can deliver a portion of the power to the TECs 646a, 646b to power them. Additionally, the power management module 630 can deliver a portion of the electrical energy to the compression system 506 (e.g., via the coupling element 639) to power the compressor.

[0097] Exemplary technical effects of the subject matter described herein include the ability to convert waste heat into electrical power, thereby increasing the efficiency of the cooling system. Additionally, the subject matter described herein allows all components of the cooling system to be located in the same general vicinity since there is less waste heat to manage. The design of the cooling system can be simplified since there is no need to vent the waste heat to the environment. This allows data centers to be built in buildings or locations that would not otherwise be a viable option due to the complex construction requirements and / or costs associated with building and maintaining a data center. The subject matter described herein can facilitate the design of cooling systems that do not directly exchange heat with the outside environment. Thus, the cooling system can be more efficient and stable than other cooling systems (e.g., cooling systems utilizing roof-mounted condensers) since the heat transfer from the condenser is not dependent on the temperature of the outdoor environment. One skilled in the art will appreciate that the subject matter described herein is not limited to application within data centers, but may be applied within any refrigeration system to manage waste heat.

[0098] Some embodiments of the present subject matter can be used to recover waste heat from industrial facilities that generate large amounts of heat. For example, the following description includes an embodiment of an energy recovery system that utilizes waste heat from a cement kiln to generate electricity.

[0099] Cement kilns can be used in a dry reprocessing stage to produce various types of cement, where calcium carbonate reacts with minerals containing silica to form a mixture of calcium silicates. During dry reprocessing conditions, cement kilns dissipate a significant amount of heat through the kiln walls, which is rejected to the outside air. Thus, there is energy rejected as waste heat.

[0100] An aspect of the disclosure provides a system that can recover heat dissipated from a kiln to generate power using a thermoelectric generator (TEG) that can convert the heat to electrical energy. The TEG can generate electrical energy as a result of a temperature gradient in the TEG. A portion of the heat from the kiln can be delivered to one or more TEGs, which can generate a temperature gradient, and the TEG can generate electrical energy. To improve the power output and / or efficiency of the TEG, one or more thermoelectric coolers (TECs) can be included to manage the temperature gradient in the TEG. Recovering dissipated heat that would otherwise be wasted and converting it to electrical energy can reduce overall energy consumption. The generated electricity can be returned to the kiln system to operate various electrical systems, stored in various energy / electricity storage systems, e.g., batteries, and / or fed into conventional grid electricity. In another aspect of the disclosure, the system can provide temperature monitoring of the kiln surface. Monitoring the temperature of the kiln surface can improve operational safety. Additionally, the TEG can be operated to cool the kiln surface. For example, kiln surface cooling can be activated in the event of overheating of the kiln surface, improving safety. Cooling of the kiln surface by TEG can reduce the time required to cool the kiln for maintenance purposes, operational purposes or due to a breakdown.

[0101] In some embodiments, rather than using a TEC to manage temperature gradients within the TEG, other heat removal devices can be used, for example, a combination of a fan and a heat sink can be used to provide controlled forced convection to manage temperature gradients within the TEG.

[0102] The typical manufacturing process for cement involves grinding a mixture of limestone and clay or shale to form a fine "rawmix", heating the rawmix to sintering temperatures (up to about 1450 °C) in a cement kiln, and grinding the resulting clinker to produce cement. In the heating stage, the rawmix is ​​fed into the kiln where it is gradually heated in contact with hot gases from the combustion of kiln fuel. Typically, a peak temperature of 1400-1450 °C is required to complete the reaction. Partial melting causes the material to agglomerate into lumps or nodules, typically 1-10 mm in diameter, which are called "clinker". The hot clinker then falls into a cooler to recover most of its heat and cool the clinker to about 100 °C. At this temperature, the clinker can be conveniently transported to storage.

[0103] Several cement kiln systems are designed to accomplish these processes. The cement kiln may have (e.g., include) a cylindrical shape and may rotate about a central axis of the cylinder to facilitate mixing of the reactants. This type of kiln is also called a rotary kiln. Figure 15 is a cross-sectional view of one example of a cement kiln system that can perform this process.

[0104] In some embodiments, an exemplary waste heat recovery system can include at least one thermoelectric generator (TEG) and at least one thermoelectric cooler (TEC). A TEG, which may be called a Seebeck generator, may be a solid-state device that utilizes the Seebeck effect to convert heat flux (temperature difference) into electrical energy. One side of the TEG may be coupled to a hot surface and the other side to a cold surface. A TEC, which may be called a Peltier element, Peltier heat pump, and solid-state refrigerator, can receive a DC current and utilize the energy in the current to transfer heat from one side of the device to the other side of the device. A TEG can be used to convert heat into electrical power. However, the efficiency of a TEG can be sensitive to thermal gradients across the semiconductors used in the TEG. Thus, a TEC can be used to manage temperature gradients across the semiconductors in the TEG.

[0105] FIG. 16 is a cross-sectional view illustrating an exemplary embodiment of a waste heat recovery system 1600 that uses waste heat from a cement kiln. The waste heat recovery system 1600 can surround a heat source 1610. In an embodiment, the heat source 1610 can have a substantially cylindrical shape. The heat source 1610 can include a cement kiln. The waste heat recovery system 1600 can include a base block 1620 disposed around the heat source 1610. The base block 1620 can include (e.g., made of) anodized aluminum, aluminum, aluminum alloys, copper, copper alloys, and the like. The material of the base block 1620 is not limited thereto and can include other materials that generally have high thermal conductivity, high temperature operation, corrosion resistance, and the like. A thermoelectric generator (TEG) module 1630 has a first end and a second end, where the first end of the TEG module 1630 is thermally coupled to the base block 1620 and configured to receive at least a portion of the heat dissipated from the heat source 1610. A thermoelectric cooler (TEC) module 1640 can include a third end and a fourth end, where the third end of the TEC module 1640 is thermally coupled to the second end of the TEG module 1630. The TEC module 1640 can receive electrical power, whereby the third end of the TEC module 1640 can be cooled and the fourth end of the TEC module 1640 can be heated, whereby the third end of the TEC module 1640 can extract (e.g., receive; convey) heat from the second end of the TEG module 1630.

[0106] FIG. 17 illustrates an example of a TEG module 1630 that may include a TEG 1750. The TEG module 1630 may include a TEG 1750 and a load 1706. The TEG 1750 may include a first heat conducting element 1702, which may be referred to as a "hot member" on a first end of the TEG 1750, and a second heat conducting element 1704, which may be referred to as a "cold member" on a second end of the TEG 1750. The TEG 1750 may include at least one n-type semiconductor 1752 and at least one p-type semiconductor 1754, which may be disposed between the first heat conducting element 1702 and the second heat conducting element 1704 and coupled in series by a number of conductive members. The illustrated embodiment shows a first conductive member 1756, a second conductive member 1758, and a third conductive member 1760. The first conductive member 1756 may be coupled to a first end of the p-type semiconductor 354, the third conductive member 1760 may be coupled to a first end of the n-type semiconductor, and the second conductive member 1758 may be coupled to a second end of the p-type semiconductor 1754 and the n-type semiconductor 1752 such that the p-type semiconductor 1754 and the n-type semiconductor 1752 may be coupled in series. The first conductive member 1756 and the third conductive member 1760 may be electrically coupled to the load 1706 such that power may be delivered from the TEG 1750 to the load 1706. The load 1706 may include electrical circuits, devices, or systems that provide generated power to the kiln system to operate various electrical components, various energy / electrical storage systems such as batteries, and / or electrical circuits or systems that provide generated electricity to conventional grid electricity. However, the load 1706 is not limited thereto and the load 1706 may include any device or system that can utilize generated electricity.

[0107] During operation, the first heat conducting element 1702 can receive heat from an external heat source and can be at a temperature T17a, and the second heat conducting element 1704 can be at a temperature T17b, where T17a>T17b. In some embodiments, heat may be extracted from the second heat conducting element 1704 to ensure that T17a>T17b. The first heat conducting element 1702 and the second heat conducting element 1704 can form a thermal gradient across the p-type semiconductor 1754 and the n-type semiconductor 1752, which can cause a majority of charge carriers in the p-type semiconductor 1754 and the n-type semiconductor 1752 to move away from the first heat conducting element 1702 and toward the second heat conducting element 1704, and a minority of charge carriers to move in the opposite direction. Thus, electrons in the n-type semiconductor 1752 can move toward the second heat conducting element 1704, and positively charged "holes" in the p-type semiconductor 1754 can move toward the second heat conducting element 1704. This charge movement generates a voltage potential across each semiconductor 1752, 1754. Because the semiconductors 1752, 1754 are coupled in series in a circuit, a current can flow. Thus, electrons can move from the n-type semiconductor 1752, through the third conductive member 1760, through the load 1706, to the first conductive member 1756, through the p-type semiconductor 1754, to the second conductive member 1758, and back to the n-type semiconductor 1752, completing the circuit. Thus, the TEG 1750 can generate power that can be delivered from the TEG 1750 to the load 1706. By adjusting the amount of heat delivered to the first thermal conduction element 1702 and / or the amount of heat extracted from the second thermal conduction element 1704, the temperature gradient across the semiconductors 1752, 1754 can be adjusted, the efficiency and / or output power of the TEG can be optimized, and power generation can be adjusted.

[0108] 18 is a cross-sectional view of an example of a TEC module 1640 that can include a TEC 1850. The TEC module 1640 can include a TEC 1850 and a power source 1806. The TEC 1850 can include a first heat conducting element 1802 on a first end of the TEC 1850 and a second heat conducting element 1804 on a second end of the TEC 1850. The TEC 1850 can include at least one n-type semiconductor 1852 and at least one p-type semiconductor 1854, which can be disposed between the first heat conducting element 1802 and the second heat conducting element 1804. The n-type semiconductor 1852 and the p-type semiconductor 1854 can be coupled in series by a number of conductive members. The illustrated embodiment shows a first conductive member 1856, a second conductive member 1858, and a third conductive member 1860, which may be coupled to the n-type semiconductor 1852 and the p-type semiconductor 1854 in a manner similar to that described above with respect to the first conductive member 1756, the second conductive member 1758, and the third conductive member 1760 being coupled to the n-type semiconductor 1752 and the p-type semiconductor 1754.

[0109] In this case, the first conductive member 1856 and the third conductive member 1860 can be electrically coupled to the power supply 1806, and a current can flow through the semiconductors 1852, 1854 at a predetermined voltage. During operation, the current can flow from the positive terminal of the power supply 1806, through the third conductive member 1860, the n-type semiconductor 1852, the second conductive member 1858, the p-type semiconductor 1854, and the first conductive member 1856, to the negative terminal of the power supply 1806. Therefore, the electrons in the n-type semiconductor 1852 can move towards the second heat conduction element 1804, and the positive charges (holes) in the p-type semiconductor 1854 can move towards the second heat conduction element 1804. This charge movement generates a temperature gradient across each of the semiconductors 1852, 1854, and the cooled end corresponds to the directional charge movement of most of the charge carriers for each of the semiconductors 1852, 1854. Therefore, the current flowing through the TEC 1850 can cool the first heat conduction element 1802 and heat the second heat conduction element 1804. Therefore, the first heat conduction element 1802 is cooled to the temperature T18a, the second heat conduction element 1804 is heated to the temperature T18b, and T18a < T18b. By adjusting the voltage and current, the temperature gradient across the semiconductors 1852, 1854 can be adjusted. Therefore, the temperatures T18a, T18b of the first heat conduction element 1802 and the second heat conduction element 1804 can be adjusted.

[0110] During operation, the TEG module 1630 may generate power from the heat dissipated from the heat source 1610, and at least a portion of the generated power may be supplied to the TEC module 1640. Therefore, the TEC module 1640 can actively cool the low-temperature member of the TEG module 1630. Therefore, the output power and / or efficiency of the waste heat recovery system can be increased.

[0111] Referring again to FIG. 16, in some embodiments, the base block 1620 may include a heat exchanger 1650 disposed on the side facing the heat source 1610. The heat exchanger 1650 may facilitate more efficient heat transfer between the heat source 1610 (e.g., a kiln surface) and the base block 1620 via convection and radiation heat transfer. The heat exchanger 1650 may include (e.g., made of) anodized aluminum, aluminum, aluminum alloys, copper, copper alloys, and the like. The material of the heat exchanger 1650 may include, but is not limited to, other materials that generally have high thermal conductivity, high temperature operability, corrosion resistance, and the like. In some embodiments, a temperature sensor 1670 may be included to measure the temperature of the surface of the heat source 1610. The temperature sensor 1670 may be a thermocouple, a resistance temperature detector (RTD), an infrared sensor, and the like. If the temperature of the surface of the heat source 1610 is higher than the maximum operating temperature of the TEG, the electrical load may be disconnected from the TEG to prevent damage to the TEG due to high temperatures. The waste heat recovery system 1600 may also include a heat sink 1660 disposed at a second end of the TEC module 1640. The heat sink 1660 may facilitate rejecting heat from a hot surface of the TEC module 1640.

[0112] FIG. 19 is a cross-sectional view illustrating another exemplary embodiment of a waste heat recovery system. As shown in FIG. 19, the waste heat recovery system can be implemented in a vertical arrangement. The waste heat recovery system 1900 can include a base block 1920, which can include a first vertical fin 1921 and a second vertical fin 1922. A first TEG module 1931 can be arranged to be thermally coupled to the first vertical fin 1921, and a second TEG module 1932 can be arranged to be thermally coupled to the second vertical fin 1922. A first TEC module 1941 can be arranged to be thermally coupled to the first TEG module 1931, and a second TEC module 1942 can be arranged to be thermally coupled to the second TEG module 1932. The waste heat recovery system 1900 may also include a heat sink 1960 disposed between the first TEC module 1941 and the second TEC module 1942 and thermally coupled to both the first TEC module 1941 and the second TEC module 1942. The heat sink 1960 may also include a number of heat dissipation fins 1965 to more efficiently dissipate heat. The heat dissipation fins 1965 may be integrally formed with the heat sink 1960 or may be formed separately and thermally coupled to the heat sink 1960.

[0113] In some embodiments, the base block 1920 can include a heat exchanger 1950 disposed on the side facing the heat source 1910. The heat exchanger 1950 can facilitate more efficient heat transfer between the heat source 1910 (e.g., a kiln surface) and the base block 1920 via convection and radiation heat transfer. The bottom surface of the heat exchanger 1950 facing the heat source 1910 can include a curved surface that substantially corresponds to the curvature of the cylindrical heat source to better enclose the heat source. In some embodiments, the waste heat recovery system 1900 can also include an insulator 1980 disposed between the base block 1920 and the TEG-TEC module to thermally isolate the TEG-TEC module from the heat source 1910.

[0114] According to the exemplary embodiment shown in FIG. 19, by being implemented in a vertical arrangement, the waste heat recovery system 1900 is able to pack more TEG-TEC pairs in a smaller footprint and recover a greater amount of heat from the heat source, thereby increasing the overall system efficiency.

[0115] During operation, a heat source (e.g., a cement kiln) may require cooling for maintenance purposes, operational purposes, or due to a malfunction. When the heat source requires cooling, power can be provided to the TEG such that a first end of the TEG is cooled and a second end of the TEG is heated. Thus, the reverse operation of the TEG actively cools the surface of the heat source, allowing the heat source to cool more quickly.

[0116] In an embodiment, multiple waste heat recovery devices are positioned adjacent (e.g., around; near) the heat source (e.g., cement kiln) to surround the entire exterior surface of the heat source and maximize the portion of heat scavenged. The cement kiln provides heat input to the base block and can maintain the TEG hot member temperature at approximately 350° C. The TEC module can maintain the TEG cold member temperature at approximately 30° C. However, the operating temperature of the system is not so limited and can vary based on the amount of heat dissipated from the heat source, ambient conditions, etc.

[0117] 20A to 20D are diagrams showing examples of a power generation system installed around a cement kiln. FIG. 20A shows an example of a cement kiln without a power generation system installed therearound. FIG. 20B shows an example of a cement kiln with an exemplary embodiment of a power generation system installed around it. FIG. 20C shows the power generation system opened for demonstration. FIG. 20D shows the internal configuration of the power generation system as viewed from the base block 200 side.

[0118] FIG 21 is a diagram illustrating electrical connections according to an exemplary embodiment of the present disclosure. As shown in FIG 21, electricity generated by the TEG 2130 may be collected by a TEG driver 2150, which may provide a portion of the input power to a TEC driver 2160. The TEC driver 2160 may provide power to the TEC 2140 based on a TEC control signal generated by a controller 2170. The TEG driver 2150 may provide a power output to an external load 2120 to obtain a net power generation.

[0119] The controller 2170 can receive data from the environmental sensor 2190 and generate a control signal based on the environmental data. The environmental data can include ambient temperature, ambient humidity, wind speed, wind direction, precipitation data, etc. The controller 2170 can also receive kiln surface temperature data from the temperature sensor 2180. If the temperature data exceeds a first preset temperature, the controller 2170 can deliver a control signal to the TEG driver 2150, causing the TEG driver to electrically disconnect the TEG 2130 and stop extracting power from the TEG 2130. If the temperature data exceeds a second preset temperature, the controller 2170 can deliver a control signal to the TEG driver 2150, causing the TEG driver to supply electricity to the TEG 2130, which operates in a cooling mode and is used to cool the kiln surface. The second preset temperature can be higher than the first preset temperature. In some embodiments, the second preset temperature can be lower than the first preset temperature.

[0120] FIG. 22 is a flow chart illustrating a method of controlling a mode of operation of a waste heat recovery system according to an exemplary embodiment of the present disclosure. In step S100, the waste heat recovery system may receive heat from a heat source. In step S200, the received heat may be utilized to generate electricity in the TEG. In step S300, a portion of the generated electricity may be provided to the TEC to allow the TEC to cool a low temperature member of the TEG. Steps S100, S200, and S300 may be referred to as a power generation mode. In step S400, the temperature of the heat source may be monitored. If the measured temperature is less than a first preset temperature, the cycle may be repeated and the system may remain in the power generation mode. If the measured temperature is equal to or greater than the first preset temperature, the controller may then evaluate whether the temperature is greater than a second preset temperature (S500). If the measured temperature is less than the second preset temperature, the controller may electrically disconnect the TEG so that no power is generated from the TEG (S600). If the measured temperature is equal to or greater than the second preset temperature, the controller may activate a cooling mode, in which the controller may supply electricity to the TEG to operate the TEG so that the TEG cools the surface of the heat source (S700). The temperature monitoring loop (S400, S500, S600, and S700) may be repeated until the measured temperature is less than the first preset temperature, in which case the controller may operate the waste heat recovery system in a power generation mode. An alarm may be generated upon detecting that the measured temperature is higher than the first preset temperature or the second preset temperature. The alarm may be visual and / or audible and is not limited to any particular means. Any alarm known in the art may be used.

[0121] Exemplary technical effects of the subject matter described herein include the ability to remove and convert waste heat into electricity, thereby increasing overall energy utilization, for example, for a cement manufacturing process. Although several variations have been described in detail above, other modifications or additions are possible. For example, the subject matter described herein is not limited to application in cement kilns, but may be applied in any system for removing and recovering waste heat.

[0122] One or more aspects or features of the subject matter described herein may be implemented in digital electronic circuitry, integrated circuits, specially designed application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs) computer hardware, firmware, software, and / or combinations thereof. These various aspects or features may include implementation in one or more computer programs executable and / or interpretable on a programmable system including at least one programmable processor, which may be a special or general purpose programmable processor coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device. The programmable system or computing system may include clients and servers. Clients and servers are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

[0123] These computer programs, which may also be referred to as programs, software, software applications, applications, components, or codes, contain machine instructions for a programmable processor and may be implemented in high-level procedural languages, object-oriented programming languages, functional programming languages, logic programming languages, and / or assembly / machine languages. As used herein, the term "machine-readable medium" refers to any computer program product, apparatus, and / or device, e.g., magnetic disks, optical disks, memories, and programmable logic devices (PLDs), used to provide machine instructions and / or data to a programmable processor, including machine-readable media that receive machine instructions as machine-readable signals. The term "machine-readable signal" refers to any signal used to provide machine instructions and / or data to a programmable processor. Machine-readable media may store such machine instructions non-transitory, such as, for example, a non-transitory solid-state memory or a magnetic hard drive or any equivalent storage medium. Machine-readable media may alternatively or additionally store such machine instructions in a transitory manner, such as, for example, a processor cache or other random access memory associated with one or more physical processor cores.

[0124] To provide for interaction with a user, one or more aspects or features of the subject matter described herein can be implemented on a computer having a display device, such as a cathode ray tube (CRT) or liquid crystal display (LCD) or light emitting diode (LED) monitor, for displaying information to the user, as well as a keyboard and a pointing device, such as a mouse or trackball, by which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user. For example, feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or haptic feedback, and input from the user can be received in any format, including acoustic, voice, or tactile input. Other possible input devices include touch screens or other touch-sensitive devices, such as single-point or multi-point resistive or capacitive trackpads, voice recognition hardware and software, optical scanners, optical pointers, digital image capture devices and associated interpretation software, and the like.

[0125] In the above description and in the claims, phrases such as "at least one of" or "one or more of" may occur following a list of conjunctive elements or features. The term "and / or" may be present in a list of more than one element or feature. Unless otherwise implicitly or explicitly contradicted by the context of use, such a phrase is intended to mean any of the listed elements or features individually, or any of the listed elements or features in combination with any of the other listed elements or features. For example, the phrases "at least one of A and B," "one or more of A and B," and "A and / or B" are intended to mean "A alone, B alone, or A and B together," respectively. A similar interpretation is intended for lists containing more than two items. For example, the phrases "at least one of A, B, and C," "one or more of A, B, and C," and "A, B and / or C" are intended to mean "A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B and C together," respectively. Additionally, use of the term "based on" above and in the claims is intended to mean "based at least in part on," allowing for unrecited features or elements.

[0126] The subject matter described herein may be embodied in systems, devices, methods, and / or articles, depending on the desired configuration. The embodiments described in the foregoing description do not represent all embodiments consistent with the subject matter described herein. Instead, they are merely some examples consistent with aspects related to the described subject matter. Although some variations have been described in detail above, other modifications or additions are possible. In particular, further features and / or variations may be provided in addition to those described herein. For example, the above-described embodiments may be directed to various combinations and subcombinations of the disclosed features, and / or combinations and subcombinations of some further features disclosed above. Furthermore, the logic flow depicted in the accompanying drawings and / or described herein does not necessarily require the particular order shown or sequential order to achieve the desired results. Other embodiments may be within the scope of the claims.

[0127] [Embodiment] (1) In the device, a body configured to receive heat from a fluid; at least one thermoelectric generator (TEG) having a first end and a second end, the first end of the at least one TEG thermally coupled to the body and configured to receive at least a portion of the heat from the fluid; at least one thermoelectric cooler (TEC) having a first end and a second end, the second end of the at least one TEC thermally coupled to the second end of the at least one TEG, the at least one TEC configured to receive electrical power to heat the first end of the at least one TEC and to cool the second end of the at least one TEC such that the second end of the at least one TEC extracts heat from the second end of the at least one TEG; 13. An apparatus comprising: (2) The device described in embodiment 1, further comprising at least one thermally conductive member. (3) The device of embodiment 2, wherein the at least one TEG is thermally coupled to a first side of the thermally conductive member and the at least one TEC is thermally coupled to a second side of the thermally conductive member. (4) The device of embodiment 2, wherein the at least one TEG is disposed between and coupled to the body and the at least one thermally conductive member. (5) The device of embodiment 1, further comprising at least one temperature sensor.

[0128] (6) The apparatus of embodiment 5, wherein the at least one temperature sensor is disposed adjacent to one of the first end and the second end of the at least one TEG, and the at least one temperature sensor is configured to measure a temperature of a capacitor at a location adjacent to one of the first end and the second end of the at least one TEG. (7) The apparatus of embodiment 5, wherein the at least one temperature sensor is positioned adjacent to one of the first end and the second end of the at least one TEC and configured to measure a temperature of a capacitor at a location adjacent to one of the first end and the second end of the at least one TEC. (8) The device of embodiment 5, wherein the at least one temperature sensor is embedded within the body. (9) In the system, a first thermally conductive member, a second thermally conductive member, and a third thermally conductive member; a first thermoelectric cooler (TEC) disposed between and coupled to the first thermally conductive member and the second thermally conductive member, the first TEC configured to remove heat from the first thermally conductive member and deliver heat to the second thermally conductive member; and a second TEC disposed between and coupled to the second thermally conductive member and the third thermally conductive member, the second TEC configured to remove heat from the third thermally conductive member and deliver heat to the second thermally conductive member; and a first body having a first passageway extending therethrough, the first passageway configured to receive a fluid, the first body configured to receive heat from the fluid; a second body having a second passageway extending therethrough, the second passageway configured to receive the fluid from the first passageway, the body configured to receive heat from the fluid; a first thermoelectric generator (TEG) disposed between the first thermally conductive member and the first body, the first TEG configured to receive heat transferred from the fluid to the first body; a second TEG disposed between the third thermally conductive member and the second body, the second TEG configured to receive heat transferred from the fluid to the second body; and Including, the system. (10) In the system, a capacitor, the capacitor comprising: a body configured to receive heat from a fluid; at least one thermoelectric generator (TEG) having a first end and a second end, the first end thermally coupled to the body and configured to receive at least a portion of the heat from the fluid, thereby causing the at least one TEG to generate a first electrical power; at least one thermoelectric cooler (TEC) having a first end and a second end, the second end of the at least one TEC thermally coupled to the second end of the at least one TEG, the at least one TEC configured to receive a second power, thereby heating the first end of the at least one TEC and cooling the second end of the at least one TEC such that the second end of the at least one TEC extracts heat from the second end of the at least one TEG; Including, the system.

[0129] (11) The system of embodiment 9, further comprising a power management module. (12) The system of embodiment 11, wherein the power management module is electrically coupled to the at least one TEG and configured to receive at least a portion of the first power. (13) The system of embodiment 11, wherein the power management module is electrically coupled to the at least one TEC and configured to deliver at least a portion of the second power to the TEC. (14) The system of embodiment 9, further comprising at least one temperature sensor disposed adjacent to at least one of the first and second ends of the at least one TEG and the first and second ends of the at least one TEC, the temperature sensor configured to measure a temperature of a capacitor at the location. (15) The system of embodiment 9, further comprising a thermal management module configured to receive a temperature signal from the at least one temperature sensor and calculate a corresponding temperature.

[0130] (16) In the method, Delivering a fluid to a body of a heat exchanger; transferring heat from the fluid to the body; transferring heat from the body to a first end of a thermoelectric generator (TEG); delivering a first power to a thermoelectric cooler (TEC) such that a first end of the TEC increases a temperature and a second end of the TEC decreases a temperature; transferring heat from a second end of the TEG to a second end of the TEC; creating a temperature gradient across a semiconductor of the TEG, thereby causing the TEG to generate a second electrical power; A method comprising: (17) The method of embodiment 16, further comprising delivering at least a portion of the second power to the TEC. (18) The method of embodiment 16, further comprising storing at least a portion of the second power in a battery. (19) The method of embodiment 16, further comprising: measuring a temperature of the heat exchanger at a location adjacent at least one of the first end and the second end of the TEG; and adjusting at least one of a voltage and a current of the first power delivered to the TEC based on the measured temperature. (20) The method of embodiment 16, further comprising: measuring a temperature of the heat exchanger at a location adjacent at least one of the first end and the second end of the TEC; and adjusting at least one of a voltage and a current of the first power delivered to the TEC based on the measured temperature.

[0131] 21. The method of claim 16, further comprising delivering at least a portion of the second electrical power to a compressor that compresses the fluid. (22) In an apparatus, A base block disposed adjacent to the heat source; a thermoelectric generator including a first end and a second end, the first end thermally coupled to the base block and configured to receive heat from the heat source; a thermoelectric cooler including a third end and a fourth end, the third end thermally coupled to the second end, the thermoelectric cooler configured to receive an electric current thereby cooling the third end and heating the fourth end, the third end conducting heat from the second end; 13. An apparatus comprising: (23) The apparatus of claim 22, wherein the thermoelectric generator is configured to generate electrical power, and at least a portion of the generated electrical power is supplied to the thermoelectric cooler for cooling. 24. The apparatus of claim 22, wherein the heat source comprises a kiln. (25) The apparatus of claim 22, wherein the base block includes a heat exchanger on a side facing the heat source.

[0132] (26) The apparatus of claim 22, further comprising a heat sink disposed at the fourth end. (27) The apparatus of embodiment 22, further comprising a temperature sensor for measuring a temperature of a surface of the heat source. (28) The device of embodiment 27, wherein the temperature sensor is a thermocouple, a resistance temperature detector (RTD), or an infrared sensor. (29) The apparatus of embodiment 27, wherein in response to detecting that the temperature of the surface of the heat source is greater than a predetermined temperature limit, an electric current is supplied to the thermoelectric generator to cool the first end and heat the second end. (30) In the system, A kiln including a cylindrical shape; a plurality of the apparatus of claim 22 disposed around the kiln; and Including, The system wherein the kiln is a heat source.

[0133] (31) In an apparatus, A base block disposed above the heat source; a first vertical fin protruding from an upper surface of the base block on a left side of the base block; a second vertical fin protruding from an upper surface of the base block on a right side of the base block; a first thermoelectric generator thermally coupled to a right side of the first vertical fin; a second thermoelectric generator thermally coupled to a left side of the second vertical fin; a first thermoelectric cooler thermally coupled to a right side of the first thermoelectric generator; a second thermoelectric cooler thermally coupled to a left side of the second thermoelectric generator; a heat sink disposed in thermal coupling with both a right side of the first thermoelectric cooler and a left side of the second thermoelectric cooler; 13. An apparatus comprising: (32) The apparatus of embodiment 31, wherein the first and second thermoelectric generators are configured to generate electrical power, and at least a portion of the generated electrical power is supplied to the first and second thermoelectric coolers. (33) The apparatus of embodiment 31, wherein the base block includes a heat exchanger on a side facing the heat source. (34) The apparatus of embodiment 31, wherein the heat sink comprises a plurality of heat dissipating fins. (35) In the system, A kiln including a cylindrical shape; a plurality of the apparatus of claim 31 arranged to surround the kiln; Including, The system wherein the kiln is a heat source.

[0134] (36) A method comprising: Receiving heat from a heat source; generating electricity from the received heat in a thermoelectric generator; providing at least a portion of the generated electricity to a thermoelectric cooler; A method comprising: (37) Measuring the temperature of a surface of the heat source; and electrically disconnecting the thermoelectric generator in response to determining that the measured temperature is greater than or equal to a first preset temperature; 37. The method of embodiment 36, comprising: (38) Measuring the temperature of a surface of the heat source; and in response to determining that the measured temperature is greater than or equal to a second preset temperature, providing electricity to the thermoelectric generator such that the thermoelectric generator is operated to cool the heat source; and 37. The method of embodiment 36, comprising:

Claims

1. In the system, a first thermally conductive member, a second thermally conductive member, and a third thermally conductive member; a first thermoelectric cooler (TEC) disposed between and coupled to the first thermally conductive member and the second thermally conductive member, the first thermoelectric cooler (TEC) configured to remove heat from the first thermally conductive member and deliver heat to the second thermally conductive member; a second thermoelectric cooler (TEC) disposed between and coupled to the second thermally conductive member and the third thermally conductive member, the second thermoelectric cooler (TEC) configured to remove heat from the third thermally conductive member and deliver heat to the second thermally conductive member; a first body having a first passageway extending therethrough, the first passageway configured to receive a fluid, the first body configured to receive heat from the fluid; a second body having a second passageway extending therethrough, the second passageway configured to receive the fluid from the first passageway, the second body configured to receive heat from the fluid; a first thermoelectric generator (TEG) disposed between the first thermally conductive member and the first body, the first thermoelectric generator (TEG) configured to receive heat transferred from the fluid to the first body; a second thermoelectric generator (TEG) disposed between the third thermally conductive member and the second body, the second thermoelectric generator (TEG) configured to receive heat transferred from the fluid to the second body; Including, the system.

2. The system of claim 1 further comprising a power management module.

3. 3. The system of claim 2, wherein the power management module is electrically coupled to at least one of the first thermoelectric generator (TEG) and the second thermoelectric generator (TEG) and configured to receive at least a portion of a first electrical power.

4. 3. The system of claim 2, wherein the power management module is electrically coupled to at least one thermoelectric cooler (TEC) of the first and second thermoelectric coolers (TEC) and configured to deliver at least a portion of a second power to the at least one thermoelectric cooler (TEC).

5. 2. The system of claim 1, further comprising at least one temperature sensor disposed adjacent at least one of a first end and a second end of at least one of the first thermoelectric generator (TEG) and the second thermoelectric generator (TEG), the at least one temperature sensor configured to measure a temperature of at least one of the first body and the second body.

6. The system of claim 5 , further comprising a thermal management module configured to receive a temperature signal from the at least one temperature sensor and calculate a corresponding temperature.

7. In the apparatus, A base block disposed adjacent to the heat source; a thermoelectric generator including a first end and a second end, the first end thermally coupled to the base block and configured to receive heat from the heat source; a thermoelectric cooler including a third end and a fourth end, the third end thermally coupled to the second end, the thermoelectric cooler configured to receive an electric current thereby cooling the third end and heating the fourth end, the third end conducting heat from the second end; 13. An apparatus comprising:

8. The apparatus of claim 7 , wherein the thermoelectric generator is configured to generate electrical power, and at least a portion of the generated electrical power is provided to the thermoelectric cooler for cooling.

9. The apparatus of claim 7 , wherein the heat source comprises a kiln.

10. The apparatus of claim 7 , wherein the base block includes a heat exchanger on a side facing the heat source.

11. The apparatus of claim 7 including a heat sink disposed at the fourth end.

12. The apparatus of claim 7 including a temperature sensor for measuring a temperature of a surface of the heat source.

13. The apparatus of claim 12 , wherein the temperature sensor is a thermocouple, a resistance temperature detector (RTD), or an infrared sensor.

14. 13. The apparatus of claim 12, wherein in response to detecting that the temperature of the surface of the heat source is greater than a predetermined temperature limit, an electric current is supplied to the thermoelectric generator to cool the first end and heat the second end.

15. In the system, A kiln including a cylindrical shape; A plurality of the apparatuses according to claim 7 arranged to surround the kiln; Including, The system wherein the kiln is the heat source.

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