Vibration Device

Abstract

To provide a vibration device that is not easily affected by noise.SOLUTION: A vibration device includes a package that includes a base which is a semiconductor substrate and a lid which is a semiconductor substrate, and has an accommodating portion, a vibrating element and a passive element accommodated in the accommodating portion and arranged on the base, an oscillating circuit arranged on the base and electrically connected to the vibrating element, and a mounting terminals arranged in the package and electrically connected to the passive element, and at least one of the base and the lid is connected to a constant potential.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a vibration device. [Background technology]

[0002] Patent Document 1 describes a microcontroller having an oscillator circuit and a USB control unit as a transmission control unit that operates based on an oscillation signal from the oscillator circuit. In Patent Document 1, the vibrator is externally connected to the oscillator circuit. In addition, an IC including an application circuit that operates based on an oscillation signal from an oscillator circuit such as a USB control unit usually requires external components such as a capacitor, a chip resistor, an inductor, etc. to stabilize the circuit, and these external components are mounted on a board together with the IC. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-175127 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, due to the effect of electromagnetic noise applied from the outside to the external components and the mounting pads on which they are mounted, noise is superimposed on the wiring to which the external components are connected, and there is also the problem that electromagnetic noise radiated from the external components and the mounting pads on which they are mounted can adversely affect external circuits. [Means for solving the problem]

[0005] The resonation device according to the present invention includes a package having a base that is a semiconductor substrate and a lid that is also a semiconductor substrate, the package having a housing portion; a vibration element and a passive element housed in the housing and disposed on the base; an oscillation circuit disposed on the base and electrically connected to the vibration element; a mounting terminal disposed in the package and electrically connected to the passive element; At least one of the base and the lid is connected to a constant potential. [Brief description of the drawings]

[0006] [Figure 1] 1 is a cross-sectional view showing a vibration device according to a first embodiment. [Diagram 2] 2 is a plan view showing a vibration element and a passive element of the vibration device of FIG. 1. [Diagram 3] 2 is a plan view showing a circuit board on which the vibration device of FIG. 1 is mounted. [Figure 4] 4 is a block diagram of a circuit included in the circuit board of FIG. 3. [Diagram 5] FIG. 4 is a cross-sectional view showing a vibration device according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing a vibration device according to a third embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing a vibration device according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, a vibration device according to this application example will be described in detail based on an embodiment shown in the accompanying drawings.

[0008] First Embodiment Fig. 1 is a cross-sectional view showing a vibration device according to a first embodiment. Fig. 2 is a plan view showing a vibration element and a passive element of the vibration device of Fig. 1. Fig. 3 is a plan view showing a circuit board on which the vibration device of Fig. 1 is mounted. Fig. 4 is a block diagram of a circuit of the circuit board of Fig. 3.

[0009] FIG. 1 is a cross-sectional view taken along line AA in FIG. 2. For ease of explanation, each of FIGS. 1 and 2 illustrates three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis. The side toward which the arrow in the Z-axis direction points is also referred to as "upper", and the opposite side is also referred to as "lower". A plan view from the Z-axis direction is also simply referred to as a "plan view". In the following explanation, "disposed on the upper surface" includes not only a case where it is directly disposed on the upper surface, but also a case where it is disposed at a position spaced a predetermined distance from the upper surface, that is, a case where it is "disposed on the upper surface side". The same applies to the lower surface.

[0010] 1 includes a package 10 having an accommodation portion S therein, and a vibration element 4 and a passive element 5 accommodated in the accommodation portion S. The package 10 also includes a base 2 on which the vibration element 4 and the passive element 5 are arranged, and a lid 3 that covers the vibration element 4 and the passive element 5 and is bonded to an upper surface 2a of the base 2. An integrated circuit 6 is also formed on the base 2.

[0011] The base 2 is a silicon substrate, particularly a P-type silicon substrate. However, the base 2 is not particularly limited and may be an N-type silicon substrate. Also, a semiconductor substrate other than silicon, such as a semiconductor substrate of Ge, GaP, GaAs, InP, etc. may be used.

[0012] The base 2 is plate-shaped and has an upper surface 2a and a lower surface 2b, which are opposite surfaces. The surface of the base 2 is covered with an insulating film 20. An integrated circuit 6 electrically connected to the vibration element 4 is formed on the lower surface 2b of the base 2. By forming the integrated circuit 6 on the base 2 in this manner, the space of the base 2 can be effectively utilized. In particular, by forming the integrated circuit 6 on the lower surface 2b, a larger space can be secured for forming the integrated circuit 6, since there is no bonding area with the lid 3, compared to the case where the integrated circuit 6 is formed on the upper surface 2a. However, the integrated circuit 6 may be formed on the upper surface 2a of the base 2, instead of the lower surface 2b.

[0013] The integrated circuit 6 includes an oscillator circuit 6A that is electrically connected to the vibration element 4 and oscillates the vibration element 4 to generate an oscillation signal such as a clock signal. The integrated circuit 6 may include circuits other than the oscillator circuit 6A. Examples of such circuits include a processing circuit that processes an output signal from the oscillator circuit 6A, and examples of such processing circuits include a PLL circuit.

[0014] Further, a laminate 60 is provided on the lower surface 2b of the base 2, in which a wiring layer 62, an insulating layer 63, a passivation film 64, and a terminal layer 65 are laminated. A plurality of active elements (not shown) formed on the lower surface 2b are electrically connected via wiring included in the wiring layer 62 to configure the integrated circuit 6. Further, the terminal layer 65 has a plurality of mounting terminals 651. The plurality of mounting terminals 651 are electrically connected to the oscillation circuit 6A and the passive element 5, and include a terminal connected to a power supply, a terminal connected to a ground, a terminal to which an oscillation signal from the oscillation circuit 6A is output, a terminal electrically connected to the passive element 5, and the like. In particular, the terminal electrically connected to the passive element 5 is also referred to as a mounting terminal 651a below.

[0015] The insulating layer 63 is made of silicon oxide (SiO 2 ), and the wiring layer 62 and the terminal layer 65 are made of conductive materials such as conductive polysilicon and tungsten (W). However, the materials constituting these components are not particularly limited as long as they can perform their functions.

[0016] For convenience of explanation, the laminate 60 is configured to include one wiring layer 62, but the present invention is not limited to this, and multiple wiring layers 62 may be laminated with insulating layers 63 interposed therebetween. In other words, the wiring layers 62 and the insulating layers 63 may be alternately laminated multiple times. This can increase the degree of freedom in routing the wiring within the circuit and in installing multiple mounting terminals 651, for example.

[0017] Further, the base 2 is formed with a plurality of through holes 21 penetrating the base 2 in the thickness direction. A conductive material is filled in each of the through holes 21, thereby forming a through electrode 210. Further, as shown in FIG. 2, a plurality of wirings electrically connected to the vibration element 4 and the passive element 5 are arranged on the upper surface 2a of the base 2. Among these wirings, the wiring electrically connected to the vibration element 4 is electrically connected to the oscillation circuit 6A via the through electrode 210. Further, the wiring electrically connected to the passive element 5 is electrically connected to the mounting terminal 651a via the through electrode 210.

[0018] The lid 3 is a silicon substrate, like the base 2. This makes the linear expansion coefficients of the base 2 and the lid 3 equal, suppressing the generation of thermal stress caused by thermal expansion, and resulting in a resonator device 1 with excellent vibration characteristics. In addition, since the resonator device 1 can be formed by a semiconductor process, the resonator device 1 can be manufactured with high precision and can be made compact. However, the lid 3 is not particularly limited, and a semiconductor substrate other than silicon, such as a semiconductor substrate of Ge, GaP, GaAs, InP, etc., may be used.

[0019] As shown in FIG. 1, the lid 3 has an opening on its lower surface and a bottomed recess 31 for accommodating the vibration element 4 and the passive element 5 therein. The lid 3 is directly bonded at its lower surface to the upper surface 2a of the base 2 via a bonding member 7. This forms an accommodation section S, which is a space for accommodating the vibration element 4 and the passive element 5, between the lid 3 and the base 2. In this embodiment, the lid 3 and the base 2 are bonded using diffusion bonding that utilizes the diffusion between metals among other direct bonding methods. However, the method for bonding the lid 3 and the base 2 is not particularly limited.

[0020] The storage section S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum, which improves the oscillation characteristics of the vibration element 4. However, the atmosphere in the storage section S is not particularly limited, and may be, for example, an atmosphere filled with an inert gas such as nitrogen or Ar, or may be in an atmospheric pressure state or a pressurized state instead of a reduced pressure state.

[0021] Here, the bonding member 7 has conductivity. Therefore, the lid 3 is electrically connected to the base 2 via the bonding member 7. As described above, since the base 2 is a P-type silicon substrate, it is grounded when the resonator device 1 is driven. That is, it is connected to GND, which is a constant potential. Therefore, the lid 3 is also connected to GND. As a result, the entire package 10 is connected to GND, and the package 10 can function as a shield to block electromagnetic noise from the outside. Therefore, it is possible to effectively prevent electromagnetic noise from being superimposed on the passive element 5 in the housing section S and the wiring connected to the passive element 5. In addition, it is possible to block electromagnetic noise radiated from inside the housing section S, and it is possible to effectively prevent the electromagnetic noise from being superimposed on the passive element and wiring arranged outside the package 10. Therefore, the circuit characteristics are stabilized. In addition, since it is not easily affected by electromagnetic noise, various circuit components can be arranged close to the package 10, and the entire circuit including the resonator device 1 can be miniaturized.

[0022] In this embodiment, as described above, the base 2 and the lid 3 are connected to the GND, but this is not limiting, and it is sufficient that at least one of the base 2 and the lid 3 is connected to the GND. This allows the above-mentioned functions to be achieved.

[0023] As shown in FIG. 2, the vibration element 4 has a vibration substrate 41 and an electrode arranged on the surface of the vibration substrate 41. The vibration substrate 41 has a thickness shear vibration mode, and is formed of an AT-cut quartz substrate in this embodiment. The AT-cut quartz substrate has a third-order frequency temperature characteristic, and therefore the vibration element 4 has excellent temperature characteristics. The electrodes have an excitation electrode 421 arranged on the upper surface of the vibration substrate 41, and an excitation electrode 422 arranged on the lower surface opposite the excitation electrode 421. The electrodes also have a pair of terminals 423 and 424 arranged on the lower surface of the vibration substrate 41, a wiring 425 that electrically connects the terminal 423 and the excitation electrode 421, and a wiring 426 that electrically connects the terminal 424 and the excitation electrode 422.

[0024] The configuration of the vibration element 4 is not limited to the above-mentioned configuration. For example, the vibration element 4 may be a mesa type in which the vibration region sandwiched between the excitation electrodes 421 and 422 protrudes from its surroundings, or conversely, may be an inverted mesa type in which the vibration region is recessed from its surroundings. In addition, bevel processing for grinding the periphery of the vibration substrate 41, or convex processing for making the upper and lower surfaces into convex curved surfaces may be performed.

[0025] The vibration element 4 is not limited to one that vibrates in a thickness-shear vibration mode, and may be, for example, a vibration piece in which a plurality of vibrating arms vibrate in a flexural direction in the in-plane direction. That is, the vibration substrate 41 is not limited to one formed from an AT-cut quartz substrate, and may be formed from a quartz substrate other than an AT-cut quartz substrate, for example, an X-cut quartz substrate, a Y-cut quartz substrate, a Z-cut quartz substrate, a BT-cut quartz substrate, an SC-cut quartz substrate, an ST-cut quartz substrate, or the like. In the present embodiment, the vibration substrate 41 is made of quartz, but is not limited thereto, and may be made of a piezoelectric single crystal such as lithium niobate, lithium tantalate, lithium tetraborate, langasite, potassium niobate, or gallium phosphate, or may be made of a piezoelectric single crystal other than these. Furthermore, the vibration element 4 is not limited to a piezoelectric drive type vibration piece, and may be an electrostatic drive type vibration piece using electrostatic force.

[0026] Such a vibration element 4 is fixed to the upper surface 2a of the base 2 by a pair of conductive bonding members B1, and is electrically connected to wiring arranged on the upper surface 2a.

[0027] The passive elements 5 are elements that consume, store, and release supplied power, such as capacitors, inductors, and resistors. The number of passive elements 5 and what is used as the passive elements 5 can be appropriately set according to the application of the vibration device 1. Such passive elements 5 are chip-shaped, and are fixed to the upper surface 2a of the base 2 by a conductive bonding member B2 and are electrically connected to corresponding wiring.

[0028] The bonding members B1 and B2 are not particularly limited as long as they have both electrical conductivity and bonding properties, and may be, for example, various metal bumps such as gold bumps, silver bumps, copper bumps, solder bumps, etc., or conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic adhesives. When the former metal bumps are used as the bonding members B1 and B2, gas generation from the bonding members B1 and B2 can be suppressed, and environmental changes in the storage section S, particularly pressure increases, can be effectively suppressed. On the other hand, when the latter conductive adhesives are used as the bonding members B1 and B2, the bonding members B1 and B2 become softer than the metal bumps, and stress is less likely to be transmitted to the vibration element 4.

[0029] Above, we have described the resonator device 1. Next, we will explain the circuit board 100 on which the resonator device 1 is mounted. As shown in Fig. 3, the circuit board 100 has a printed wiring board 110, and a circuit element 120, a regulator circuit element 130, the resonator device 1, and a plurality of passive elements 140 mounted on the printed wiring board 110.

[0030] The circuit element 120 is a circuit that operates based on the oscillation signal generated by the oscillation circuit 6A. The circuit element 120 is not particularly limited, but in this embodiment, it is a USB controller IC that is a transmission circuit that controls the transmission and reception of signals through a USB connector. In this way, by using a transmission circuit as the circuit element 120, the vibration device 1 can be mounted on various electronic devices, and the convenience of the vibration device 1 is improved. The regulator circuit element 130 supplies a stable power supply to the circuit element 120 and the vibration device 1.

[0031] 4, the circuit element 120 has a pair of upstream terminals 121, 122, a pair of downstream terminals 123, 124, a power supply terminal 125, and a negative power supply terminal 126. The upper terminal Q1 is connected to the pair of upstream terminals 121, 122, and the peripheral terminal Q2 is connected to the pair of downstream terminals 123, 124. Such a circuit element 120 uses an oscillation signal from an oscillation circuit 6A so as to operate in synchronization with the transmission signals from the upper terminal Q1 and the peripheral terminal Q2. Note that, although a pair of downstream terminals 123, 124 is provided in this embodiment, multiple pairs of downstream terminals may be provided like a USB-HUB.

[0032] Furthermore, the multiple passive elements 140 are elements for stabilizing the characteristics of the circuit element 120, and are elements such as capacitors, inductors, resistors, etc. that consume, store, and release supplied power.

[0033] In this embodiment, the passive elements 140 include a capacitor C1 and an inductor I1 connected to the upstream terminal 121, a capacitor C2 and an inductor I2 connected to the upstream terminal 122, a capacitor C3 and an inductor I3 connected to the downstream terminal 123, and a capacitor C4 and an inductor I4 connected to the downstream terminal 124. This forms a common mode filter (noise reduction filter) that can remove noise from the signal transmitted via the circuit element 120, improving the characteristics of the circuit element 120.

[0034] Here, the passive element 5 of the vibration device 1 is a capacitor C5 connected to the regulator circuit element 130. This makes it possible to remove noise from the power supply voltage supplied from the outside, and to supply a stable power supply voltage to the oscillation circuit 6A and the circuit element 120.

[0035] As described above, the package 10 connected to the GND can block electromagnetic noise from the outside, and therefore it is possible to effectively prevent electromagnetic noise from being superimposed on the capacitor C5 in the housing section S and the wiring connected to the capacitor C5. In addition, it is possible to block electromagnetic noise emitted from the housing section S, and it is possible to effectively prevent the electromagnetic noise from being superimposed on the passive element 140 and the wiring connected thereto. This allows the circuit element 120 to be stably driven. In addition, since it is not easily affected by electromagnetic noise from the resonator device 1, it is possible to arrange the circuit element 120, the capacitors C1 to C4, and the inductors I1 to I4 in close proximity to the resonator device 1, and it is possible to miniaturize the circuit board 100.

[0036] The passive element 5 housed in the package 10 is not limited to the capacitor C5. For example, it may be at least one of the capacitors C1 to C4 and the inductors I1 to I4. For example, it may be the capacitors C1 and C2 and the inductors I1 and I2. In this case, it is preferable to symmetrically arrange the common mode filter for the upstream terminal 121 composed of the capacitor C1 and the inductor I1 and the common mode filter for the upstream terminal 122 composed of the capacitor C2 and the inductor I2, including the wiring connected to the upstream terminals 121 and 122.

[0037] The above describes the resonator device 1. As described above, the resonator device 1 includes a package 10 having a housing portion S, the base 2 being a semiconductor substrate and the lid 3 being a semiconductor substrate, the resonator element 4 and the passive element 5 housed in the housing portion S and disposed on the base 2, an oscillator circuit 6A disposed on the base 2 and electrically connected to the resonator element 4, and a mounting terminal 651a disposed on the package 10 and electrically connected to the passive element 5. At least one of the base 2 and the lid 3 is connected to GND as a constant potential.

[0038] According to such a configuration, the package 10 exhibits a shielding function and can shield electromagnetic noise from the outside. Therefore, it is possible to effectively prevent electromagnetic noise from being superimposed on the passive element 5 in the housing section S and the wiring connected to the passive element 5. In addition, it is possible to shield electromagnetic noise radiated from the housing section S, and it is possible to effectively prevent the electromagnetic noise from being superimposed on the passive element and wiring arranged outside the package 10. Therefore, the circuit characteristics are stabilized. In addition, since it is not easily affected by electromagnetic noise, various circuit components can be arranged close to the package 10, and the entire circuit including the resonator device 1 can be miniaturized.

[0039] As described above, the base 2 and the lid 3 are each connected to GND, which is a constant potential, thereby improving the shielding effect of the package 10 and making the above-mentioned effects more pronounced.

[0040] As described above, the oscillator circuit 6A is disposed on the bottom surface 2b, which is the surface opposite the housing portion S of the base 2. In this way, by forming the oscillator circuit 6A in the base 2, the space of the base 2 can be effectively utilized. In particular, by forming the oscillator circuit 6A on the bottom surface 2b, a larger space can be secured for forming the oscillator circuit 6A since there is no bonding area with the lid 3, compared to the case where the oscillator circuit 6A is formed on the top surface 2a.

[0041] <Second embodiment> FIG. 5 is a cross-sectional view showing a vibration device according to the second embodiment.

[0042] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 5, the same reference numerals are used for the same configurations as the previous embodiment.

[0043] 5, in the vibration device 1 of this embodiment, the lid 3 has two bottomed recesses 311, 312. Therefore, the accommodation section S has a first accommodation section S1 in which the vibration element 4 is accommodated, and a second accommodation section S2 in which the passive element 5 is accommodated. With this configuration, the vibration element 4 and the passive element 5 are separated by the lid 3, so that electromagnetic coupling between the vibration element 4 and the passive element 5 can be suppressed.

[0044] The second embodiment as described above can also achieve the same effects as the first embodiment described above.

[0045] <Third embodiment> FIG. 6 is a cross-sectional view showing a vibration device according to the third embodiment.

[0046] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 6, the same reference numerals are used for the same configurations as the previous embodiment.

[0047] As shown in FIG. 6, in the resonator device 1 of the present embodiment, the base 2 and the lid 3 are each plate-shaped. The package 10 has a spacer 9 that is interposed between the plate-shaped base 2 and the lid 3 and forms a storage section S between the base 2 and the lid 3. The spacer 9 is integrally formed with the resonator element 4. Specifically, the resonator device 1 has a quartz substrate 8 disposed between the base 2 and the lid 3, and the quartz substrate 8 is integrally formed with a resonator substrate 41, a frame-shaped spacer 9 surrounding the resonator substrate 41, and a connecting section 81 that connects the resonator substrate 41 and the spacer 9. The upper surface of the spacer 9 is bonded to the lid 3 via the bonding member 7, and the lower surface is bonded to the base 2 via the bonding member 7. With this configuration, it is not necessary to form a recess 31 in the lid 3, so that the resonator device 1 can be manufactured more easily.

[0048] As described above, the package 10 of the present embodiment has the spacer 9 interposed between the base 2 and the lid 3 and integrally formed with the vibration element 4. This eliminates the need to form the recess 31 in the lid 3, making it easier to manufacture the vibration device 1.

[0049] The third embodiment as described above can also achieve the same effects as the first embodiment described above.

[0050] <Fourth embodiment> FIG. 7 is a cross-sectional view showing a vibration device according to a fourth embodiment.

[0051] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 7, the same reference numerals are used for the same configurations as the previous embodiment.

[0052] As shown in FIG. 7, in the resonator device 1 of this embodiment, unlike the first embodiment in which the passive element 5 is bonded to the upper surface 2a of the base 2 via the conductive bonding member B2, the thin-film passive element 5 is integrally formed on the upper surface 2a of the base 2. More specifically, the capacitor C5, which is the passive element 5, is configured such that a dielectric layer C53 is sandwiched between a lower electrode C51 and an upper electrode C52, and these are laminated in order on the upper surface 2a. With this configuration, the process of positioning and mounting the passive element 5 is not required, making it easier to manufacture the resonator device 1. In addition, since the thickness of the passive element 5 can be suppressed, the resonator device 1 can be made lower in height than the first embodiment.

[0053] When the integrated circuit 6 is formed on the upper surface 2a of the base 2, the passive elements 5 may be formed within the integrated circuit 6.

[0054] As described above, the passive element 5 of this embodiment is a thin film integrally formed on the upper surface 2a, which is the surface on the housing section S side of the base 2. With this configuration, the process of positioning and mounting the passive element 5 is not required, making it easier to manufacture the vibration device 1. In addition, since the thickness of the passive element 5 can be reduced, the height of the vibration device 1 can be reduced compared to the first embodiment described above.

[0055] The fourth embodiment as described above can also achieve the same effects as the first embodiment described above.

[0056] Although the vibration device of the present invention has been described above based on the illustrated embodiment, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. In addition, any other configuration may be added to the present invention. In addition, each embodiment may be appropriately combined. [Explanation of symbols]

[0057] 1...vibration device, 2...base, 2a...upper surface, 2b...lower surface, 3...lid, 4...vibration element, 5...passive element, 6...integrated circuit, 7...bonding member, 8...quartz substrate, 9...spacer, 10...package, 20...insulating film, 21...through hole, 31...recess, 41...vibration substrate, 6A...oscillating circuit, 60...laminated body, 62...wiring layer, 63...insulating layer, 64...passivation film, 65...terminal layer, 81...connecting portion, 100...circuit substrate, 110...printed wiring board, 120...circuit element, 121,122...upstream terminal, 123,124...da downstream terminal, 125...power supply terminal, 126...negative power supply terminal, 130...regulator circuit element, 140...passive element, 210...through electrode, 311, 312...recess, 421, 422...excitation electrodes, 423, 424...terminal, 425, 426...wiring, 651, 651a...mounting terminal, B1, B2...jointing member, C1 to C5...capacitor, C51...lower electrode, C52...upper electrode, C53...dielectric layer, I1 to I4...inductor, S...housing portion, S1...first housing portion, S2...second housing portion, Q1...upper terminal, Q2...peripheral terminal

Claims

1. a package including a base that is a semiconductor substrate and a lid that is also a semiconductor substrate, the package having a receiving portion; a vibration element and a passive element housed in the housing and disposed on the base; an oscillation circuit disposed on the base and electrically connected to the vibration element; a mounting terminal disposed in the package and electrically connected to the passive element; The housing portion has a first housing portion in which the vibration element is housed and a second housing portion in which the passive element is housed, At least one of the base and the lid is connected to a constant potential; When viewed from a thickness direction of the base, the vibration element and the passive element are arranged side by side without overlapping each other, A vibration device, characterized in that the vibration element and the passive element overlap when viewed from a direction in which the vibration element and the passive element are arranged side by side.

2. The vibration device of claim 1 , wherein the base and the lid are each connected to the constant potential.

3. The resonator device according to claim 1 , wherein the oscillator circuit is disposed on a surface of the base opposite to the housing portion.

4. The vibration device according to claim 1 , wherein the package includes a spacer interposed between the base and the lid and formed integrally with the vibration element.

5. The resonator device according to claim 1 , wherein the passive element is a thin film integrally formed on a surface of the base facing the housing portion.

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