Vibration Device

Abstract

To provide a vibration device that can be miniaturized.SOLUTION: A vibration device includes a package that includes a base which is a semiconductor substrate and a lid which is a semiconductor substrate, and has an accommodating portion, a vibrating element and a passive element accommodated in the accommodating portion and arranged on the base, an oscillating circuit arranged on the base and electrically connected to the vibrating element, and a circuit arranged on the base or the lid, electrically connected to the passive element, and operated on the basis of an oscillation signal from the oscillating circuit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a vibration device. [Background technology]

[0002] Patent Document 1 describes a microcontroller having an oscillator circuit and a USB control unit as a transmission control unit that operates based on an oscillation signal from the oscillator circuit. In this microcontroller, a vibrator is externally connected to the oscillator circuit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-175127 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration of Patent Document 1, the USB control unit and the vibrator are separately mounted on the mounting board, which requires a large mounting area and makes it difficult to miniaturize the device. [Means for solving the problem]

[0005] The resonation device according to the present invention includes a package having a base that is a semiconductor substrate and a lid that is also a semiconductor substrate, the package having a housing portion; a vibration element and a passive element housed in the housing and disposed on the base; an oscillation circuit disposed on the base and electrically connected to the vibration element; A circuit is disposed on the base or the lid, is electrically connected to the passive element, and operates based on an oscillation signal from the oscillation circuit. [Brief description of the drawings]

[0006] [Figure 1] 1 is a cross-sectional view showing a vibration device according to a first embodiment. [Diagram 2] 2 is a plan view showing a vibration element and a passive element of the vibration device of FIG. 1. [Diagram 3] 2 is a block diagram showing a circuit configuration of the vibration device 1 of FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a vibration device according to a second embodiment. [Diagram 5] FIG. 11 is a cross-sectional view showing a vibration device according to a third embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing a vibration device according to a fourth embodiment. [Figure 7] FIG. 13 is a cross-sectional view showing a vibration device according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, a vibration device according to this application example will be described in detail based on an embodiment shown in the accompanying drawings.

[0008] First Embodiment Fig. 1 is a cross-sectional view showing a resonator device according to a first embodiment. Fig. 2 is a plan view showing a resonator element and a passive element included in the resonator device of Fig. 1. Fig. 3 is a block diagram showing a circuit configuration of the resonator device 1 of Fig. 1.

[0009] FIG. 1 is a cross-sectional view taken along line AA in FIG. 2. For ease of explanation, each of FIGS. 1 and 2 illustrates three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis. The side toward which the arrow in the Z-axis direction points is also referred to as "upper", and the opposite side is also referred to as "lower". A plan view from the Z-axis direction is also simply referred to as a "plan view". In the following explanation, "disposed on the upper surface" includes not only a case where it is directly disposed on the upper surface, but also a case where it is disposed at a position spaced a predetermined distance from the upper surface, that is, a case where it is "disposed on the upper surface side". The same applies to the lower surface.

[0010] 1 includes a package 10 having an accommodation section S therein, and a vibration element 4 and a plurality of passive elements 5 accommodated in the accommodation section S. The package 10 also includes a base 2 on which the vibration element 4 and the passive elements 5 are arranged, and a lid 3 that covers the vibration element 4 and the passive elements 5 and is bonded to an upper surface 2a of the base 2. An integrated circuit 6 is also formed on the base 2.

[0011] The base 2 is a silicon substrate, particularly a P-type silicon substrate. However, the base 2 is not particularly limited and may be an N-type silicon substrate. Also, a semiconductor substrate other than silicon, such as a semiconductor substrate of Ge, GaP, GaAs, InP, etc. may be used.

[0012] The base 2 is plate-shaped and has an upper surface 2a and a lower surface 2b, which are opposite surfaces. The surface of the base 2 is covered with an insulating film 20. An integrated circuit 6 electrically connected to the vibration element 4 and the passive element 5 is formed on the lower surface 2b of the base 2. By forming the integrated circuit 6 on the base 2 in this manner, the space of the base 2 can be effectively utilized. In particular, by forming the integrated circuit 6 on the lower surface 2b, a larger space can be secured for forming the integrated circuit 6, since there is no bonding area with the lid 3, compared to the case where the integrated circuit 6 is formed on the upper surface 2a. However, the integrated circuit 6 may be formed on the upper surface 2a of the base 2, instead of the lower surface 2b.

[0013] The integrated circuit 6 has an oscillator circuit 6A electrically connected to the vibration element 4, which oscillates the vibration element 4 to generate an oscillation signal such as a clock signal, a circuit 6B which operates based on the oscillation signal output from the oscillator circuit 6A, and a regulator circuit 6C for supplying a stable power supply to the oscillator circuit 6A and the circuit 6B. The circuit 6B is not particularly limited, but in this embodiment, it is a USB controller IC which is a transmission circuit that controls the transmission and reception of signals through a USB connector. In this way, by using a transmission circuit as the circuit 6B, the vibration device 1 can be mounted on various electronic devices, and the convenience of the vibration device 1 is improved. The integrated circuit 6 may include circuits other than these. For example, such a circuit may be a processing circuit that processes the oscillation signal from the oscillator circuit 6A, and further, for example, a PLL circuit may be used as the processing circuit.

[0014] In addition, a laminate 60 in which a wiring layer 62, an insulating layer 63, a passivation film 64, and a terminal layer 65 are laminated is provided on the lower surface 2b of the base 2. A plurality of active elements (not shown) formed on the lower surface 2b are electrically connected through the wiring included in the wiring layer 62 to configure the integrated circuit 6. In addition, the terminal layer 65 has a plurality of mounting terminals 651. The plurality of mounting terminals 651 are electrically connected to the integrated circuit 6 and the passive elements 5, and include, for example, a terminal connected to a power source, a terminal connected to a ground, a terminal electrically connected to an upstream upper terminal, and a terminal electrically connected to a downstream peripheral terminal. In this way, by having a plurality of mounting terminals 651 facing the outside of the package 10, the electrical connection between the vibration device 1 and an external device is facilitated.

[0015] The insulating layer 63 is made of silicon oxide (SiO2), and the wiring layer 62 and the terminal layer 65 are made of conductive materials such as conductive polysilicon and tungsten (W). However, the materials constituting these parts are not particularly limited as long as they can perform their functions.

[0016] In this embodiment, for convenience of explanation, the laminate 60 includes one wiring layer 62, but the present invention is not limited to this, and a plurality of wiring layers 62 may be laminated with insulating layers 63 interposed therebetween. In other words, the wiring layers 62 and the insulating layers 63 may be alternately laminated a plurality of times. This can increase the degree of freedom in routing the wiring within the circuit and in installing a plurality of mounting terminals 651, for example.

[0017] The base 2 is also formed with a plurality of through holes 21 penetrating the base 2 in the thickness direction. Each through hole 21 is filled with a conductive material, thereby forming a through electrode 210. As shown in FIG. 2, wiring electrically connected to the vibration element 4 and wiring electrically connected to each passive element 5 are arranged on the upper surface 2a of the base 2. Each of these wirings is electrically connected to the oscillation circuit 6A, the circuit 6B, and the circuit 6C via the through electrode 210.

[0018] As shown in Fig. 3, the circuit 6B has a pair of upstream terminals 6B1, 6B2, a pair of downstream terminals 6B3, 6B4, a power supply terminal 6B5, and a negative power supply terminal 6B6. An upper terminal Q1 is connected to the pair of upstream terminals 6B1, 6B2, and a peripheral terminal Q2 is connected to the pair of downstream terminals 6B3, 6B4. Such a circuit 6B uses an oscillation signal from an oscillation circuit 6A so as to operate in synchronization with the transmission signals from the upper terminal Q1 and the peripheral terminal Q2.

[0019] Each passive element 5 is an element that consumes, stores, and releases supplied power, such as a capacitor, inductor, or resistor. The number of passive elements 5 and what is used as the passive element 5 can be appropriately set according to the application of the vibration device 1. Each passive element 5 is chip-shaped, and is fixed to the upper surface 2a of the base 2 by a conductive bonding member B2 and is electrically connected to a corresponding wiring.

[0020] In this embodiment, the passive element 5 includes a capacitor C1 and an inductor I1 connected to the upstream terminal 6B1, a capacitor C2 and an inductor I2 connected to the upstream terminal 6B2, a capacitor C3 and an inductor I3 connected to the downstream terminal 6B3, and a capacitor C4 and an inductor I4 connected to the downstream terminal 6B4. This provides an electrostatic protection capacitor and a common mode filter (noise reduction filter), improving the electrostatic resistance of the vibration device 1 and removing noise from the signal transmitted through the circuit 6B, thereby improving the characteristics of the circuit 6B. In addition, the passive element 5 includes a capacitor C5 connected to the regulator circuit 6C. This allows noise to be removed from the power supply voltage supplied from the outside, and a stable power supply voltage can be supplied to the oscillation circuit 6A and the circuit 6B.

[0021] As described above, by forming the integrated circuit 6 on the base 2 and housing the passive element 5 in the housing portion S, that is, by mounting the integrated circuit 6 and the passive element 5 together in the package 10, the mounting area of ​​these can be reduced, and the overall device can be made smaller. In particular, according to the vibration device 1, the integrated circuit 6 and the passive element 5 can be arranged overlapping in the Z-axis direction, so that the planar spread in the X-axis direction and the Y-axis direction can be effectively suppressed. In addition, the length of the wiring connecting each part, particularly the wiring connecting the oscillation circuit 6A and the vibration element 4 and the wiring connecting the oscillation circuit 6A and the circuit 6B, can be shortened, so that noise is less likely to be mixed into these wirings, and the integrated circuit 6 can be driven more stably.

[0022] The lid 3 is a silicon substrate, like the base 2. This makes the linear expansion coefficients of the base 2 and the lid 3 equal, suppressing the generation of thermal stress caused by thermal expansion, and resulting in a resonator device 1 with excellent vibration characteristics. In addition, since the resonator device 1 can be formed by a semiconductor process, the resonator device 1 can be manufactured with high precision and can be made compact. However, the lid 3 is not particularly limited, and a semiconductor substrate other than silicon, such as a semiconductor substrate of Ge, GaP, GaAs, InP, etc., may be used.

[0023] As shown in FIG. 1, the lid 3 has an opening on its lower surface and a bottomed recess 31 for accommodating the vibration element 4 and the passive element 5 therein. The lid 3 is directly bonded at its lower surface to the upper surface 2a of the base 2 via a bonding member 7. This forms an accommodation section S, which is a space for accommodating the vibration element 4 and the passive element 5, between the lid 3 and the base 2. In this embodiment, the lid 3 and the base 2 are bonded using diffusion bonding that utilizes the diffusion between metals among other direct bonding methods. However, the method for bonding the lid 3 and the base 2 is not particularly limited.

[0024] The storage section S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum, which improves the oscillation characteristics of the vibration element 4. However, the atmosphere in the storage section S is not particularly limited, and may be, for example, an atmosphere filled with an inert gas such as nitrogen or Ar, or may be in an atmospheric pressure state or a pressurized state instead of a reduced pressure state.

[0025] Here, the bonding member 7 has conductivity. Therefore, the lid 3 is electrically connected to the base 2 via the bonding member 7. As described above, since the base 2 is a P-type silicon substrate, it is grounded when the resonator device 1 is driven. That is, it is connected to GND, which is a constant potential. Therefore, the lid 3 is also connected to GND. As a result, the entire package 10 is connected to GND, and the package 10 can function as a shield to block electromagnetic noise from the outside. Therefore, it is possible to effectively prevent electromagnetic noise from being superimposed on each passive element 5 in the housing section S and the wiring connected to each passive element 5. In addition, it is possible to block electromagnetic noise radiated from inside the housing section S, and it is possible to effectively prevent the electromagnetic noise from being superimposed on passive elements and wiring arranged outside the package 10. Therefore, it is possible to drive the integrated circuit 6 and the circuits arranged around the resonator device 1 more stably.

[0026] In this embodiment, the base 2 and the lid 3 are connected to the GND as described above, but the present invention is not limited to this, and it is sufficient that at least one of the base 2 and the lid 3 is connected to the GND. This allows the above-mentioned functions to be achieved.

[0027] As shown in FIG. 2, the vibration element 4 has a vibration substrate 41 and an electrode arranged on the surface of the vibration substrate 41. The vibration substrate 41 has a thickness shear vibration mode, and is formed of an AT-cut quartz substrate in this embodiment. The AT-cut quartz substrate has a third-order frequency temperature characteristic, and therefore the vibration element 4 has excellent temperature characteristics. The electrodes have an excitation electrode 421 arranged on the upper surface of the vibration substrate 41, and an excitation electrode 422 arranged on the lower surface opposite the excitation electrode 421. The electrodes also have a pair of terminals 423 and 424 arranged on the lower surface of the vibration substrate 41, a wiring 425 that electrically connects the terminal 423 and the excitation electrode 421, and a wiring 426 that electrically connects the terminal 424 and the excitation electrode 422.

[0028] The configuration of the vibration element 4 is not limited to the above-mentioned configuration. For example, the vibration element 4 may be a mesa type in which the vibration region sandwiched between the excitation electrodes 421 and 422 protrudes from its surroundings, or conversely, may be an inverted mesa type in which the vibration region is recessed from its surroundings. In addition, bevel processing for grinding the periphery of the vibration substrate 41, or convex processing for making the upper and lower surfaces into convex curved surfaces may be performed.

[0029] The vibration element 4 is not limited to one that vibrates in a thickness-shear vibration mode, and may be, for example, a vibration piece in which a plurality of vibrating arms vibrate in a flexural direction in the in-plane direction. That is, the vibration substrate 41 is not limited to one formed from an AT-cut quartz substrate, and may be formed from a quartz substrate other than an AT-cut quartz substrate, for example, an X-cut quartz substrate, a Y-cut quartz substrate, a Z-cut quartz substrate, a BT-cut quartz substrate, an SC-cut quartz substrate, an ST-cut quartz substrate, or the like. In the present embodiment, the vibration substrate 41 is made of quartz, but is not limited thereto, and may be made of a piezoelectric single crystal such as lithium niobate, lithium tantalate, lithium tetraborate, langasite, potassium niobate, or gallium phosphate, or may be made of a piezoelectric single crystal other than these. Furthermore, the vibration element 4 is not limited to a piezoelectric drive type vibration piece, and may be an electrostatic drive type vibration piece using electrostatic force.

[0030] Such a vibration element 4 is fixed to the upper surface 2a of the base 2 by a pair of conductive bonding members B1, and is electrically connected to wiring arranged on the upper surface 2a.

[0031] The bonding members B1 and B2 are not particularly limited as long as they have both electrical conductivity and bonding properties, and may be, for example, various metal bumps such as gold bumps, silver bumps, copper bumps, solder bumps, etc., or conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic adhesives. When the former metal bumps are used as the bonding members B1 and B2, gas generation from the bonding members B1 and B2 can be suppressed, and environmental changes in the storage section S, particularly pressure increases, can be effectively suppressed. On the other hand, when the latter conductive adhesives are used as the bonding members B1 and B2, the bonding members B1 and B2 become softer than the metal bumps, and stress is less likely to be transmitted to the vibration element 4.

[0032] The above describes the vibration device 1. As described above, the vibration device 1 includes a package 10 having a housing portion S, a vibration element 4 and a passive element 5 housed in the housing portion S and arranged on the base 2, an oscillation circuit 6A arranged on the base 2 and electrically connected to the vibration element 4, and a circuit 6B arranged on the base 2 or the lid 3, electrically connected to the passive element 5, and operated based on an oscillation signal from the oscillation circuit 6A. In this way, by mounting the oscillation circuit 6A, the circuit 6B, and the passive element 5 together on the package 10, the mounting area can be reduced, and the entire device can be made smaller. In addition, the length of the wiring connecting the oscillation circuit 6A and the vibration element 4 and the wiring connecting the oscillation circuit 6A and the circuit 6B can be shortened, so that noise is less likely to occur and the circuit 6B can be driven more stably.

[0033] As described above, the package 10 has a mounting terminal 651 that is electrically connected to the passive element 5 or the circuit 6B and faces the outside of the package 10. This facilitates electrical connection between the resonator device 1 and an external device.

[0034] As described above, the circuit 6B is disposed on the base 2. This allows the oscillator circuit 6A and the circuit 6B to be disposed closer to each other. This allows the wiring that electrically connects them to be shorter, making it difficult for noise to be introduced through the wiring. This makes the operation of the circuit 6B more stable.

[0035] As described above, the circuit 6B includes a transmission circuit that performs transmission processing of a pair of differential signals, thereby making the resonator device 1 highly convenient.

[0036] As described above, at least one of the base 2 and the lid 3, and in this embodiment, both, are connected to GND, which is a constant potential. This allows the package 10 to exhibit a shielding function and block electromagnetic noise from the outside. This effectively prevents electromagnetic noise from the outside from being superimposed on the passive elements 5 in the housing portion S and the wiring connected to the passive elements 5. This allows the circuit 6B to exhibit stable characteristics.

[0037] <Second embodiment> FIG. 4 is a cross-sectional view showing a vibration device according to the second embodiment.

[0038] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 4, the same reference numerals are used for the same configurations as the previous embodiment.

[0039] As shown in Fig. 4, in the vibration device 1 of this embodiment, the lid 3 has two bottomed recesses 311, 312. The accommodation section S has a first accommodation section S1 in which the vibration element 4 is accommodated, and a second accommodation section S2 in which a plurality of passive elements 5 are accommodated. With this configuration, the vibration element 4 and the passive element 5 are separated by the lid 3, so that electromagnetic coupling between the vibration element 4 and the passive element 5 can be suppressed. In addition, for example, when the bonding member B2 is a resin-based adhesive, it is also possible to suppress fluctuations and deterioration in the vibration characteristics of the vibration element 4 due to gas generated from the bonding member B2.

[0040] The second embodiment as described above can also achieve the same effects as the first embodiment described above.

[0041] <Third embodiment> FIG. 5 is a cross-sectional view showing a vibration device according to a third embodiment.

[0042] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 5, the same reference numerals are used for the same configurations as the previous embodiment.

[0043] As shown in FIG. 5, in the resonator device 1 of the present embodiment, the base 2 and the lid 3 are each plate-shaped. The package 10 has a spacer 9 that is interposed between the plate-shaped base 2 and the lid 3 and forms a storage section S between the base 2 and the lid 3. The spacer 9 is integrally formed with the resonator element 4. Specifically, the resonator device 1 has a quartz substrate 8 disposed between the base 2 and the lid 3, and the quartz substrate 8 is integrally formed with a resonator substrate 41, a frame-shaped spacer 9 surrounding the resonator substrate 41, and a connecting section 81 that connects the resonator substrate 41 and the spacer 9. The upper surface of the spacer 9 is bonded to the lid 3 via the bonding member 7, and the lower surface is bonded to the base 2 via the bonding member 7. With this configuration, it is not necessary to form a recess 31 in the lid 3, so that the resonator device 1 can be manufactured more easily.

[0044] As described above, the package 10 of the present embodiment has the spacer 9 interposed between the base 2 and the lid 3 and integrally formed with the vibration element 4. This eliminates the need to form the recess 31 in the lid 3, which makes it easier to manufacture the vibration device 1.

[0045] The third embodiment as described above can also achieve the same effects as the first embodiment described above.

[0046] <Fourth embodiment> FIG. 6 is a cross-sectional view showing a vibration device according to a fourth embodiment.

[0047] This embodiment is similar to the first embodiment described above, except for the configuration of the package 10. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 6, the same reference numerals are used for the same configurations as the previous embodiment.

[0048] As shown in FIG. 6, in the resonator device 1 of this embodiment, unlike the first embodiment in which the passive element 5 is bonded to the upper surface 2a of the base 2 via the conductive bonding member B2, the thin-film passive element 5 is integrally formed on the upper surface 2a of the base 2. More specifically, the capacitor C2, which is the passive element 5, is configured such that a dielectric layer C23 is sandwiched between a lower electrode C21 and an upper electrode C22, and these are stacked in order on the upper surface 2a. Although not shown, the other capacitors C1, C3 to C5 have the same configuration. In addition, the inductor I2, which is the passive element 5, is configured with a spiral wiring arranged on the upper surface 2a. Although not shown, the other inductors I1, I3, and I4 have the same configuration. According to this configuration, the process of positioning and mounting the passive element 5 is not required, so that the manufacturing of the resonator device 1 is easy. In addition, since the thickness of the passive element 5 can be suppressed, the resonator device 1 can be made low-profile.

[0049] When the integrated circuit 6 is formed on the upper surface 2a of the base 2, the passive elements 5 may be formed within the integrated circuit 6.

[0050] As described above, the passive element 5 of this embodiment is a thin film integrally formed on the upper surface 2a, which is the surface on the housing section S side of the base 2. With this configuration, the process of positioning and mounting the passive element 5 is not required, making it easier to manufacture the vibration device 1. In addition, since the thickness of the passive element 5 can be reduced, the height of the vibration device 1 can be reduced compared to the first embodiment described above.

[0051] The fourth embodiment as described above can also achieve the same effects as the first embodiment described above.

[0052] <Fifth embodiment> FIG. 7 is a cross-sectional view showing a vibration device according to a fifth embodiment.

[0053] This embodiment is similar to the first embodiment described above, except that a circuit 6B is formed on the lid 3. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In addition, in FIG. 7, the same reference numerals are used for the same configurations as the previous embodiment.

[0054] 7, in the vibration device 1 of this embodiment, an integrated circuit 6 is formed on the lower surface 2b of the base 2, and an integrated circuit 6' is formed on the upper surface 3a of the lid 3. An oscillation circuit 6A and a regulator circuit 6C are formed in the integrated circuit 6 on the base 2 side, and a circuit 6B is formed in the integrated circuit 6' on the lid 3 side. The integrated circuit 6' can be formed in the same manner as the integrated circuit 6.

[0055] Thus, in this embodiment, the circuit 6B is disposed on the lid 3. Therefore, for example, compared to the first embodiment described above, a larger space can be secured for forming the oscillator circuit 6A, the circuit 6B, and the regulator circuit 6C. This makes it easier to form these circuits. Also, since the integrated circuits 6 and 6' can be disposed overlapping in the Z-axis direction, for example, compared to the first embodiment described above, the planar spread of the resonator device 1 in the X-axis direction and the Y-axis direction can be suppressed. Therefore, the resonator device 1 can be made smaller in size.

[0056] Furthermore, the lid 3 is formed with a plurality of through electrodes 32 penetrating the lid 3 in the thickness direction, and the integrated circuits 6, 6' are electrically connected via these through electrodes 32.

[0057] The fifth embodiment can also achieve the same effects as the first embodiment described above.

[0058] Although the vibration device of the present invention has been described above based on the illustrated embodiment, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. In addition, any other configuration may be added to the present invention. In addition, each embodiment may be appropriately combined. [Explanation of symbols]

[0059] 1...vibration device, 2...base, 2a...upper surface, 2b...lower surface, 3...lid, 3a...upper surface, 4...vibration element, 5...passive element, 6,6'...integrated circuit, 6A...oscillating circuit, 6B...circuit, 6B1,6B2...upstream terminal, 6B3,6B4...downstream terminal, 6B5...power supply terminal, 6B6...negative power supply terminal, 6C...regulator circuit, 7...bonding member, 8...quartz substrate, 9...spacer, 10...package, 20...insulating film, 21...through hole, 31...recess, 32...through electrode, 41...vibration substrate, 60...laminated body , 62...wiring layer, 63...insulating layer, 64...passivation film, 65...terminal layer, 81...connecting portion, 210...through electrode, 311, 312...recess, 421, 422...excitation electrode, 423, 424...terminal, 425, 426...wiring, 651...mounting terminal, B1, B2...joint member, C1, C2, C3, C4, C5...capacitor, C21...lower electrode, C22...upper electrode, C23...dielectric layer, I1, I2, I3, I4...inductor, Q1...upper terminal, Q2...peripheral terminal, S...accommodating portion, S1...first housing portion, S2...second housing portion

Claims

1. a package including a base that is a semiconductor substrate and a lid that is also a semiconductor substrate, the package having a receiving portion; a vibration element and a passive element housed in the housing and disposed on the base; an oscillation circuit disposed on the base and electrically connected to the vibration element; a circuit disposed on the base or the lid, electrically connected to the passive element, and operated based on an oscillation signal from the oscillation circuit; The housing portion has a first housing portion in which the vibration element is housed and a second housing portion in which the passive element is housed, When viewed from a thickness direction of the base, the vibration element and the passive element are arranged side by side without overlapping each other, A vibration device, characterized in that the vibration element and the passive element overlap when viewed from a direction in which the vibration element and the passive element are arranged side by side.

2. The resonation device according to claim 1 , wherein the package has a mounting terminal that is electrically connected to the passive element or the circuit and that faces outside the package.

3. The vibration device according to claim 1 , wherein the circuit is disposed on the base.

4. The vibration device according to claim 1 , wherein the circuit is disposed on the lid.

5. The vibration device according to claim 1 , wherein the circuit includes a transmission circuit that performs transmission processing of a pair of differential signals.

6. The vibrating device according to claim 1 , wherein at least one of the base and the lid is connected to a constant potential.

7. The vibration device according to claim 1 , wherein the package includes a spacer interposed between the base and the lid and formed integrally with the vibration element.

8. The resonator device according to claim 1 , wherein the passive element is a thin film integrally formed on a surface of the base facing the housing portion.

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