Coil parts

Abstract

To increase a self-resonance frequency in a coil component having a structure in which a helical coil pattern is embedded in a resin body.SOLUTION: A coil component 1 includes: a resin body 10 comprising resin layers 11-14; a coil pattern C embedded in the resin body 10 and helically wound in a plurality of turns; and terminal electrodes E1, E2 formed on a surface of the resin body 10 and connected respectively to one and other ends of the coil pattern C. Of the coil pattern C, first horizontal sections 31-34 are embedded in the resin layer 12, and the second horizontal layers 41-45 are embedded in the resin layer 14. A resin-based insulating material constituting the resin layers 12, 14 is lower in relative permittivity than a resin-based insulating material constituting the resin layers 11, 13. Thus, sufficient mechanical strength can be ensured by the resin layers 11, 13, and floating capacitance can be reduced by the resin layers 12, 14. This can increase a self-resonance frequency.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a coil component, and more particularly to a coil component having a structure in which a helical coil pattern is embedded in a resin body. [Background technology]

[0002] 2. Description of the Related Art A coil component disclosed in Patent Document 1 is known as an example of a coil component having a structure in which a helical coil pattern is embedded in a resin body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-324489 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the coil component described in Patent Document 1, it is difficult to sufficiently increase the self-resonant frequency (SRF).

[0005] Therefore, an object of the present invention is to increase the self-resonant frequency in a coil component having a structure in which a helical coil pattern is embedded in a resin body. [Means for solving the problem]

[0006] The coil component according to the present invention comprises a resin body containing a first resin-based insulating material and a second resin-based insulating material having a lower dielectric constant than the first resin-based insulating material, a coil pattern embedded in the resin body and wound helically over a plurality of turns, and first and second terminal electrodes provided on the surface of the resin body and connected to one end and the other end, respectively, of the coil pattern, wherein the coil pattern has a portion covered with the first resin-based insulating material and a portion covered with the second resin-based insulating material.

[0007] According to the present invention, the first resin-based insulating material ensures sufficient mechanical strength, while the second resin-based insulating material with a low relative dielectric constant reduces stray capacitance, thereby enabling the self-resonant frequency to be increased.

[0008] In the present invention, the second resin-based insulating material may be provided between the first and second terminal electrodes and the coil pattern, which makes it possible to reduce stray capacitance occurring between the first and second terminal electrodes and the coil pattern.

[0009] In the present invention, the second resin-based insulating material may be provided between adjacent turns of the coil pattern, which makes it possible to reduce stray capacitance occurring between adjacent turns of the coil pattern.

[0010] In the present invention, the resin body may include a first resin layer, a second resin layer, and a third resin layer located between the first and second resin layers, and the coil pattern may include a plurality of first horizontal sections provided on the first resin layer and embedded in the third resin layer, a plurality of second horizontal sections provided on the third resin layer and embedded in the second resin layer, a plurality of first vertical sections provided through the third resin layer and connecting one ends of the plurality of first horizontal sections to one ends of the plurality of corresponding second horizontal sections, and a plurality of second vertical sections provided through the third resin layer and connecting the other ends of the plurality of first horizontal sections to the other ends of the plurality of corresponding second horizontal sections. This makes it possible to make the coil axis of the coil pattern perpendicular to the lamination direction of the resin layers.

[0011] In this case, the first and second terminal electrodes are provided on a second resin layer, and the second resin layer may be made of a second resin-based insulating material, or the third resin layer may have a portion in which the first horizontal sections are embedded made of the second resin-based insulating material and the remaining portion made of the first resin-based insulating material. The former makes it possible to reduce stray capacitance between the first and second terminal electrodes and the second horizontal sections of the coil pattern, and between adjacent second horizontal sections. The latter makes it possible to reduce stray capacitance between adjacent first horizontal sections.

[0012] In the present invention, the first and second terminal electrodes may be arranged in the axial direction of the coil pattern, which reduces the potential difference between the first and second terminal electrodes and the coil pattern, thereby further reducing stray capacitance.

[0013] In this case, the first and second terminal electrodes may be formed on a surface of the resin body along the axial direction, rather than on a surface perpendicular to the axial direction, which makes it possible to suppress the generation of eddy currents since magnetic flux is less likely to interfere with the first and second terminal electrodes.

[0014] In the present invention, a filler may be added to the first resin-based insulating material, and a filler may not be added to the second resin-based insulating material, which can increase the strength of the first resin-based insulating material and reduce the relative dielectric constant of the second resin-based insulating material. Effect of the Invention

[0015] According to the present invention, it is possible to increase the self-resonant frequency in a coil component having a structure in which a helical coil pattern is embedded in a resin body. [Brief description of the drawings]

[0016] [Figure 1]FIG. 1 is a schematic perspective view for explaining the configuration of a coil component 1 according to a first embodiment of the present invention, where (a) is a view from the top surface side, and (b) is a view from the mounting surface side. [Diagram 2] FIG. 2 is a schematic cross-sectional view taken along the line AA shown in FIG. [Diagram 3] FIG. 3 is a schematic perspective view illustrating the structure of the coil pattern C embedded in the resin body 10. As shown in FIG. [Figure 4] FIG. 4 is a schematic perspective plan view showing the coil pattern C as viewed from the z direction. [Diagram 5] FIG. 5 is a process diagram illustrating a method for manufacturing the coil component 1. [Figure 6] FIG. 6 is a process diagram illustrating a method for manufacturing the coil component 1. [Figure 7] FIG. 7 is a process diagram illustrating a method for manufacturing the coil component 1. [Figure 8] FIG. 8 is a process diagram illustrating a method for manufacturing the coil component 1. [Figure 9] FIG. 9 is a process diagram illustrating a method for manufacturing the coil device 1. [Figure 10] FIG. 10 is a process chart for explaining the method of manufacturing the coil component 1. [Figure 11] FIG. 11 is a process chart for explaining the method of manufacturing the coil device 1. [Figure 12] FIG. 12 is a schematic cross-sectional view illustrating the configuration of a coil device 2 according to a second embodiment of the present invention. [Figure 13] FIG. 13 is a schematic cross-sectional view illustrating the configuration of a coil device 3 according to a third embodiment of the present invention. [Figure 14] FIG. 14 is a schematic perspective view for explaining the configuration of a coil component 4 according to a fourth embodiment of the present invention, where (a) is a view from the top surface side, and (b) is a view from the mounting surface side. [Figure 15] FIG. 15 is a schematic perspective view illustrating a configuration of a coil component 5 according to a fifth embodiment of the present invention, where (a) is a view from the top surface side, and (b) is a view from the mounting surface side. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] <First embodiment> Fig. 1 is a schematic perspective view for explaining the configuration of a coil component 1 according to a first embodiment of the present invention, where (a) is a view from the top surface side and (b) is a view from the mounting surface side. Fig. 2 is a schematic cross-sectional view taken along line AA shown in Fig. 1(b).

[0019] The coil component 1 according to the first embodiment is a chip-type electronic component that can be surface mounted, and as shown in Figures 1 and 2, comprises a resin body 10, a coil pattern C embedded in the resin body 10, and terminal electrodes E1, E2 provided on the surface of the resin body 10.

[0020] The resin element 10 has a structure in which four resin layers 11 to 14 are laminated in this order in the z direction. Of these, the resin layers 11 and 13 are made of a resin-based insulating material in which a filler such as silica is added to an epoxy-based or acrylic-based resin material. The resin-based insulating material constituting the resin layer 11 and the resin-based insulating material constituting the resin layer 13 may be the same as each other or may be different from each other. In contrast, the resin layers 12 and 14 are made of a resin material that does not contain a filler, such as bismaleimide or liquid crystal polymer. The resin-based insulating material constituting the resin layer 12 and the resin-based insulating material constituting the resin layer 14 may be the same as each other or may be different from each other.

[0021] As a result, the resin-based insulating material constituting the resin layers 11, 13 has higher strength and is easier to process than the resin-based insulating material constituting the resin layers 12, 14. On the other hand, the resin-based insulating material constituting the resin layers 12, 14 is made of a resin material with a low relative dielectric constant and does not contain a filler such as silica, so that it has a lower relative dielectric constant than the resin-based insulating material constituting the resin layers 11, 13. As an example, the relative dielectric constant ε of the resin-based insulating material constituting the resin layers 11, 13 at 1 GHz is about 3.3, and the relative dielectric constant ε of the resin-based insulating material constituting the resin layers 12, 14 at 1 GHz is about 2.4.

[0022] Fig. 3 is a schematic perspective view for explaining the structure of the coil pattern C embedded in the resin body 10. Fig. 4 is a schematic perspective view showing the coil pattern C as viewed from the z direction. plane FIG.

[0023] As shown in Figures 2 to 4, the coil pattern C is composed of first horizontal sections 31 to 34 and second horizontal sections 41 to 45 extending in the xy plane, and first vertical sections 51 to 54 and second vertical sections 61 to 64 extending in the z direction. As shown in Figure 2, the first horizontal sections 31 to 34 are Resin layer The second horizontal sections 41 to 45 are provided on the surface of the first horizontal section 11 and embedded in the resin layer 12. Resin layer The first vertical sections 51 to 54 and the second vertical sections 61 to 64 are provided on the surface of the insulating layer 13 and embedded in the resin layer 14. Resin layer The first vertical sections 51-54 connect one end of the first horizontal sections 31-34 to one end of the corresponding second horizontal sections 41-44. The second vertical sections 61-64 connect the other ends of the first horizontal sections 31-34 to one end of the corresponding second horizontal sections 42-45.

[0024] With this configuration, a coil pattern C is formed that is helically wound over multiple turns. The coil axis of the coil pattern C is in the x direction. The other end of the second horizontal section 41 forms one end of the coil pattern C, and is connected to the terminal electrode E1 through a via conductor 71 provided to penetrate the resin layer 14. Meanwhile, one end of the second horizontal section 45 forms the other end of the coil pattern C, and is connected to the terminal electrode E2 through a via conductor 72 provided to penetrate the resin layer 14. The terminal electrodes E1 and E2 are bottom terminals formed only on the xy surface of the resin body 10. In other words, the terminal electrodes E1 and E2 do not cover the yz surface of the resin body 10, and therefore, when mounted on a circuit board using solder, the yz surface of the resin body 10 is not covered with a solder fillet. This makes it possible to increase the mounting density, and since the magnetic flux generated by the coil pattern C is less likely to interfere with the terminal electrodes E1 and E2 and the solder, it is possible to suppress the generation of eddy currents.

[0025] As shown in FIG. 4, the terminal electrode E1 overlaps at least with the second horizontal section 41, and the terminal electrode E2 overlaps at least with the second horizontal section 45. Therefore, stray capacitance occurs between the terminal electrode E1 and the second horizontal section 41, and between the terminal electrode E2 and the second horizontal section 45. However, in this embodiment, since the resin layer 14 located between them is made of a resin-based insulating material with a low relative dielectric constant, it is possible to reduce the stray capacitance occurring between the terminal electrodes E1, E2 and the second horizontal sections 41, 45. Moreover, since the second horizontal sections 41 to 45 are embedded in the resin layer 14, it is possible to reduce the stray capacitance between the second horizontal sections 41 to 45 adjacent to each other in the x direction, that is, the stray capacitance occurring between the adjacent turns of the coil pattern C. This makes it possible to prevent a decrease in the self-resonant frequency caused by the stray capacitance.

[0026] In this embodiment, the terminal electrode E1 also overlaps with a part of the second horizontal section 42, and the terminal electrode E2 also overlaps with a part of the second horizontal section 44. Therefore, stray capacitance occurs between the terminal electrode E1 and the second horizontal section 42, and between the terminal electrode E2 and the second horizontal section 44. Here, the second horizontal section 42 is farther away from the terminal electrode E1 than the second horizontal section 41 in wiring distance from the terminal electrode E1, and therefore, due to the influence of voltage drop, the stray capacitance per unit area between the terminal electrode E1 and the second horizontal section 42 is larger than the stray capacitance per unit area between the terminal electrode E1 and the second horizontal section 41. Similarly, the second horizontal section 44 is farther away from the terminal electrode E2 than the second horizontal section 45, and therefore, due to the influence of voltage drop, the stray capacitance per unit area between the terminal electrode E2 and the second horizontal section 44 is larger than the stray capacitance per unit area between the terminal electrode E2 and the second horizontal section 45. In this way, when each of the terminal electrodes E1, E2 overlaps with a plurality of second horizontal sections 41-45, the effect of using a resin-based insulating material with a low relative dielectric constant as the material for the resin layer 14 becomes greater.

[0027] Furthermore, in this embodiment, the first horizontal sections 31-34 are embedded in the resin layer 12, and the resin layer 12 is made of a resin-based insulating material with a low dielectric constant, so it is possible to reduce the stray capacitance between the first horizontal sections 31-34 adjacent in the x-direction, that is, the stray capacitance generated between adjacent turns of the coil pattern C.

[0028] Meanwhile, most of the first vertical sections 51-54 and the second vertical sections 61-64 are provided penetrating the high-strength resin layer 13, which makes it possible to ensure sufficient mechanical strength of the entire resin body 10. In order to ensure the mechanical strength of the resin body 10, it is preferable that the thickness T13 of the resin layer 13 is three or more times the thicknesses T12, T14 of the resin layers 12, 14. As an example, if T12 = approximately 20 μm, T13 = approximately 115 μm, and T14 = approximately 30 μm, it is possible to reduce stray capacitance while ensuring the mechanical strength of the resin body 10.

[0029] In this way, the coil component 1 according to the present embodiment has a structure in which the coil pattern C is embedded in the resin body 10, and the coil pattern C has portions covered with resin layers 11, 13 made of a high-strength resin-based insulating material and resin layers 12, 14 made of a resin-based insulating material with a low dielectric constant. Therefore, it is possible to prevent a decrease in the self-resonant frequency caused by stray capacitance while ensuring the mechanical strength of the resin body 10.

[0030] In addition, in this embodiment, since the terminal electrodes E1 and E2 are arranged in the axial direction (x direction) of the coil pattern C, the terminal electrode E1 does not overlap with the second horizontal section (e.g., the second horizontal section 44 or 45) that is distant from the wiring, and similarly, the terminal electrode E2 does not overlap with the second horizontal section (e.g., the second horizontal section 41 or 42) that is distant from the wiring. This reduces the potential difference between the terminal electrodes E1 and E2 and the second horizontal sections 41, 42, 44, and 45 that overlap with them, making it possible to further reduce stray capacitance compared to the case where the terminal electrodes E1 and E2 are arranged in the y direction.

[0031] Next, a method for manufacturing the coil component 1 according to the present embodiment will be described.

[0032] 5 to 11 are process diagrams illustrating a manufacturing method of the coil component 1 according to the present embodiment. In Fig. 6 to Fig. 11, (a) is a schematic perspective view, (b) is a schematic plan view, and (c) is a schematic cross-sectional view taken along line BB shown in (b).

[0033] First, as shown in FIG. 5, a support substrate 80 made of a ceramic material such as alumina or non-magnetic ferrite is prepared, and a resin layer 11 is formed on the surface of the support substrate 80. Next, as shown in FIG. 6, the first horizontal sections 31-34 are formed on the surface of the resin layer 11. The first horizontal sections 31-34 can be formed by forming a thin power supply film on the entire surface of the resin layer 11, attaching a photosensitive film, forming openings in the photosensitive film by exposure and development, and growing the first horizontal sections 31-34 in the openings by electrolytic plating. Here, since the resin layer 11 is made of a resin-based insulating material with high strength, it is possible to maintain high processing accuracy of the first horizontal sections 31-34 formed on the surface of the resin layer 11.

[0034] 7, a resin layer 12 is formed on the surface of the resin layer 11 so that the first horizontal sections 31-34 are embedded. As a result, the first horizontal sections 31-34 adjacent to each other in the x-direction are insulated by a resin-based insulating material with a low relative dielectric constant. Next, openings 31a-34a and 31b-34b are formed in the resin layer 12 to expose both ends of the first horizontal sections 31-34.

[0035] 8, first vertical sections 51-54 are formed, each connected to one end of the first horizontal sections 31-34 via the openings 31a-34a, and second vertical sections 61-64 are formed, each connected to the other end of the first horizontal sections 31-34 via the openings 31b-34b. The first vertical sections 51-54 and the second vertical sections 61-64 are formed by forming a thin power supply film on the entire surface of the resin layer 12, attaching a photosensitive film, forming openings in the photosensitive film by exposure and development, and growing the first vertical sections 51-54 and the second vertical sections 61-64 in the openings by electrolytic plating.

[0036] Next, as shown in FIG. 9, the resin layer 13 is formed so that the first vertical sections 51-54 and the second vertical sections 61-64 are embedded. The resin layer 13 can be formed by peeling off the photosensitive film used to form the first vertical sections 51-54 and the second vertical sections 61-64, laminating an uncured sheet constituting the resin layer 13, curing it, and polishing the surface to expose the tops of the first vertical sections 51-54 and the second vertical sections 61-64. Depending on the heights of the first vertical sections 51-54 and the second vertical sections 61-64, the process shown in FIG. 8 and the process shown in FIG. 9 may be repeated alternately multiple times. Here, since the resin layer 13 is made of a resin-based insulating material that is highly processable, it is possible to maintain high processing accuracy of the first vertical sections 51-54 and the second vertical sections 61-64.

[0037] 10, the second horizontal sections 41-45 are formed on the surface of the resin layer 13. The method for forming the second horizontal sections 41-45 may be the same as the method for forming the first horizontal sections 31-34 described above. Here, since the resin layer 13 is made of a high-strength resin-based insulating material, it is possible to maintain high processing precision for the second horizontal sections 41-45 formed on the surface thereof.

[0038] Next, as shown in FIG. 11, a resin layer 14 is formed on the surface of the resin layer 13 so that the second horizontal sections 41-45 are embedded. As a result, the second horizontal sections 41-45 adjacent to each other in the x-direction are insulated by a resin-based insulating material with a low dielectric constant. Next, openings 71a and 72a are formed in the resin layer 14 to expose the other end of the second horizontal section 41 and one end of the second horizontal section 45. Then, terminal electrodes E1 and E2 are formed at positions overlapping with the openings 71a and 72a, respectively, to complete the coil component 1 according to this embodiment.

[0039] In this way, according to the manufacturing method of the coil component 1 of this embodiment, the first horizontal sections 31-34 and the second horizontal sections 41-45 are formed on the surfaces of the resin layers 11, 13, which have high strength and processability, respectively, and the majority of the first vertical sections 51-54 and the second vertical sections 61-64 are provided penetrating the resin layer 13, which has high strength and processability. Therefore, it is possible to ensure high processing accuracy, unlike when the entire resin body 10 is constructed from a resin-based insulating material with a low dielectric constant.

[0040] <Second embodiment> FIG. 12 is a schematic cross-sectional view illustrating the configuration of a coil device 2 according to a second embodiment of the present invention.

[0041] 12, the coil component 2 according to the second embodiment differs from the coil component 1 according to the first embodiment in that the resin layer 12 is made of the same resin-based insulating material as the resin layers 11 and 13. Since the other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are given the same reference numerals and duplicated explanations are omitted. As exemplified by the coil component 2 according to this embodiment, it is not essential in the present invention that the first horizontal sections 31-34 are covered with a resin-based insulating material having a low dielectric constant.

[0042] <Third embodiment> FIG. 13 is a schematic cross-sectional view illustrating the configuration of a coil device 3 according to a third embodiment of the present invention.

[0043] 13, the coil component 3 according to the third embodiment differs from the coil component 1 according to the first embodiment in that the resin layer 14 is made of the same resin-based insulating material as the resin layers 11 and 13. Since the other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are given the same reference numerals and redundant explanations are omitted. As exemplified by the coil component 3 according to this embodiment, it is not essential in the present invention that the second horizontal sections 41-45 are covered with a resin-based insulating material having a low relative dielectric constant.

[0044] <Fourth embodiment> FIG. 14 is a schematic perspective view for explaining the configuration of a coil component 4 according to a fourth embodiment of the present invention, where (a) is a view from the top surface side, and (b) is a view from the mounting surface side.

[0045] 14, the coil component 4 according to the fourth embodiment differs from the coil component 1 according to the first embodiment in that the axial direction of the coil pattern C embedded in the resin body 10 is the z-direction. One end of the coil pattern C is connected to a terminal electrode E1 via a lead-out wiring Ca, and the other end of the coil pattern C is connected to a terminal electrode E2.

[0046] A resin-based insulating material with a low dielectric constant is used as the material for the resin layer 14 located between the terminal electrodes E1, E2 and the first turn of the coil pattern C starting from the terminal electrode E2. Most of the coil pattern C is embedded in a high-strength resin layer 13. Furthermore, a resin-based insulating material with a lower dielectric constant than the resin layer 13 is used for the resin layer 12 located between predetermined adjacent turns of the coil pattern C. This makes it possible to reduce the stray capacitance generated between the terminal electrodes E1, E2 and the first turn of the coil pattern C, and the stray capacitance generated between predetermined adjacent turns of the coil pattern C.

[0047] As exemplified by the coil component 4 according to this embodiment, in the present invention, the coil axis of the coil pattern C may be oriented in the lamination direction (z direction).

[0048] <Fifth embodiment> FIG. 15 is a schematic perspective view illustrating a configuration of a coil component 5 according to a fifth embodiment of the present invention, where (a) is a view from the top surface side, and (b) is a view from the mounting surface side.

[0049] 15, the coil component 5 according to the fifth embodiment differs from the coil component 4 according to the fourth embodiment in that the resin layer 12 is omitted. Other basic configurations are the same as those of the coil component 4 according to the fourth embodiment, so the same elements are given the same reference numerals and duplicated explanations are omitted. As exemplified by the coil component 5 according to the present embodiment, the entire coil pattern C may be embedded in the resin layer 13, and a resin layer 14 having a low relative dielectric constant may be disposed only between the terminal electrodes E1, E2 and the first turn of the coil pattern C.

[0050] Although a preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention, and it goes without saying that these modifications are also included within the scope of the present invention.

[0051] For example, in each of the above-described embodiments, a filler is added to the resin-based insulating material constituting the resin layers 11 and 13, but a filler is not added to the resin-based insulating material constituting the resin layers 12 and 14, but this is not essential to the present invention. Also, the same resin material may be used for the resin layers 11 and 13 and the resin layers 12 and 14, and while a filler may be added to the resin layers 11 and 13 to increase their strength, no filler may be added to the resin layers 12 and 14 so as not to increase their relative dielectric constant. [Explanation of symbols]

[0052] 1~5 Coil parts 10 Resin body 11~14 Resin layer 31~34 First horizontal section 31a~34a,31b~34b opening 41~45 Second horizontal section 51~54 First vertical section 61~64 Second vertical section 71,72 Via conductor 71a,72a opening 80 Support substrate C coil pattern Ca lead wire E1,E2 terminal electrode

Claims

1. a resin body including a first resin-based insulating material and a second resin-based insulating material having a relative dielectric constant lower than that of the first resin-based insulating material; a coil pattern embedded in the resin body and wound helically over a plurality of turns; a first terminal electrode and a second terminal electrode provided on a surface of the resin body and connected to one end and the other end of the coil pattern, respectively; the coil pattern has a portion covered with the first resin-based insulating material and a portion covered with the second resin-based insulating material, the second resin-based insulating material is provided between the first and second terminal electrodes and the coil pattern, and the first resin-based insulating material is not provided between the first and second terminal electrodes and the coil pattern; the first and second terminal electrodes are arranged in an axial direction of the coil pattern, A coil component characterized in that the first and second terminal electrodes are formed on a surface of the resin body that is aligned along the axial direction, rather than on a surface of the resin body that is perpendicular to the axial direction.

2. 2. The coil component according to claim 1, wherein the second resin-based insulating material is provided between adjacent turns of the coil pattern.

3. the resin body includes a first resin layer, a second resin layer, and a third resin layer located between the first resin layer and the second resin layer, The coil pattern is a plurality of first horizontal sections provided on the first resin layer and embedded in the third resin layer; a plurality of second horizontal sections provided on the third resin layer and embedded in the second resin layer; a plurality of first vertical sections provided through the third resin layer and connecting one ends of the plurality of first horizontal sections and one ends of the plurality of second horizontal sections corresponding to the first horizontal sections; 3. The coil component according to claim 1, further comprising: a plurality of second vertical sections that are provided through the third resin layer and connect the other ends of the plurality of first horizontal sections and the other ends of the plurality of second horizontal sections that correspond to the first horizontal sections.

4. the first and second terminal electrodes are provided on the second resin layer, The coil component according to claim 3 , wherein the second resin layer is made of the second resin-based insulating material.

5. A coil component as described in claim 3 or 4, characterized in that the portion of the third resin layer that embeds the multiple first horizontal sections is made of the second resin-based insulating material, and the remaining portion is made of the first resin-based insulating material.

6. 6. The coil component according to claim 1, wherein a filler is added to the first resin-based insulating material, and a filler is not added to the second resin-based insulating material.

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