HEAD CHIP, LIQUID JET HEAD AND LIQUID JET RECORDING APPARATUS

Abstract

A head chip, a liquid jet head, and a liquid jet recording apparatus capable of easily and inexpensively manufacturing a head chip in accordance with required ejection performance are provided. [Solution] A head chip according to one embodiment of the present disclosure includes a flow path defining section having a plurality of partition sections spaced apart in the X direction, and forming a plurality of individual flow paths between adjacent partition sections among the plurality of partition sections through which liquid can flow in the Y direction, and an actuator section that is overlaid on the flow path defining section so as to face each of the plurality of individual flow paths in the Z direction and is deformable to expand or reduce the inside of the individual flow path. A specified groove that connects the inside and outside of one individual flow path is formed in a part of the partition section in the Y direction. A nozzle hole that connects to the individual flow path at a position offset in the Y direction from the specified groove is formed in the individual flow path, and a nozzle plate is provided facing the flow path defining section.

Description

[Technical field]

[0001] The present disclosure relates to a head chip, a liquid jet head, and a liquid jet recording apparatus. [Background technology]

[0002] A head chip mounted on an inkjet printer comprises an actuator plate arranged facing multiple pressure chambers, and a nozzle plate in which multiple nozzle holes each communicating with each pressure chamber are formed (see, for example, Patent Document 1 below).

[0003] In this type of head chip, to eject ink, a voltage is applied to the drive electrode, generating an electric field in the actuator plate made of a piezoelectric material. This causes the actuator plate to deform, expanding or contracting the volume of the pressure chamber. This causes a pressure fluctuation in the pressure chamber, causing the ink contained in the pressure chamber to be ejected through the nozzle hole. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7220327 Summary of the Invention [Problem to be solved by the invention]

[0005] In the head chip, ink is ejected from the nozzle hole by a composite wave of a pressure wave generated by pressure fluctuations on one side of the nozzle hole in the length direction of the pressure chamber and a pressure wave generated by pressure fluctuations on the other side of the nozzle hole. Therefore, the length of the pressure chamber (pump length) is a factor that determines the ejection performance of the head chip. For example, the response to the applied waveform (pulse) changes depending on the length of the pressure chamber, which affects the ejection frequency, etc. However, manufacturing a head chip for each required ejection performance (length of pressure chamber) leads to a decrease in manufacturing efficiency and an increase in manufacturing costs.

[0006] The present disclosure provides a head chip, a liquid jet head, and a liquid jet recording apparatus that can easily and inexpensively manufacture a head chip that meets required ejection performance. [Means for solving the problem]

[0007] In order to solve the above problems, the present disclosure employs the following aspects. (1) A head chip according to one embodiment of the present disclosure comprises a flow path defining portion having a plurality of partition portions spaced apart in a first direction, and forming a plurality of individual flow paths between adjacent partition portions among the plurality of partition portions through which liquid can flow in a second direction intersecting the first direction, and an actuator portion that is overlaid on the flow path defining portion so as to face each of the plurality of individual flow paths in a third direction intersecting the second direction as viewed from the first direction, and is deformable to expand or reduce the interior of the individual flow paths, wherein a specified groove is formed in a portion of the partition portion in the second direction, connecting an inside of one of the individual flow paths with an outside of one of the individual flow paths, and an injection hole plate is formed in the individual flow paths, the specified groove being in communication with a position of the individual flow path that is offset in the second direction from the specified groove, and the actuator portion is provided opposite the flow path defining portion.

[0008] According to this aspect, by connecting the inside and outside of the individual flow path with the specified groove, the pressure fluctuation generated in the individual flow path due to the deformation of the actuator unit is released to the outside of the individual flow path through the specified groove. That is, the part of the individual flow path located on the ejection hole side with respect to the specified groove in the second direction functions as a pressure chamber capable of ejecting liquid, and the part located on the opposite side of the ejection hole side with respect to the specified groove in the second direction does not function as a pressure chamber. This makes it possible to adjust the length of the pressure chamber (pump length) without changing the dimensions of the flow path defining unit and the actuator unit in the second direction, and to adjust the ejection performance of the liquid ejected through the ejection hole. Therefore, it is not necessary to manufacture head chips with dimensions according to the ejection performance. Therefore, head chips according to the required ejection performance can be manufactured easily and at low cost.

[0009] (2) In the head chip according to the above aspect (1), it is preferable that the defining groove extends linearly in the first direction and connects adjacent ones of the individual flow paths. According to this aspect, by forming the defining grooves so as to connect the adjacent individual flow paths, the defining grooves can be formed in the flow path defining portion all at once by performing a dicing process or the like on the flow path defining portion, which can further improve manufacturing efficiency.

[0010] (3) In the head chip relating to the above aspect (2), it is preferable that the actuator section is provided with a driving electrode that generates an electric field in the actuator section, and that only electrodes of the same polarity among the driving electrodes are formed on a first surface of the actuator section that faces the individual flow path in the third direction. According to this aspect, since only electrodes of the same polarity are formed on the first surface, it is possible to suppress an increase in the risk of short circuit caused by the addition of the defining groove.

[0011] (4) In the head chip according to any one of the aspects of (3) above, it is preferable that the drive electrode formed on the first surface is a common electrode that serves as a reference potential. According to this aspect, even if the common electrodes provided in adjacent individual flow paths come into contact with each other via liquid, no potential difference is generated between the electrodes, so that short-circuiting of the drive electrodes can be suppressed.

[0012] (5) In the head chip according to any one of the above aspects (2) to (4), it is preferable that a common flow path extending in the first direction and communicating with the individual flow paths is provided on one side of the individual flow paths in the second direction, and the specified groove extends in the first direction and communicates with the common flow path at one end in the second direction. According to this aspect, it is possible to increase the flow path cross-sectional area of ​​the connection portion of the individual flow paths with the common flow path, thereby reducing pressure loss at the connection portion and allowing liquid to flow smoothly between the common flow path and the individual flow paths.

[0013] (6) In a head chip according to any one of aspects (2) to (5) above, it is preferable that a common flow path extending in the first direction and communicating with the plurality of individual flow paths is provided on one side of the individual flow paths in the second direction, and that the specified groove is provided in a position of the partition portion away from the common flow path in the second direction. According to this aspect, the position of the defining groove in the partition portion in the second direction can be easily set freely, thereby improving the degree of freedom in design.

[0014] (7) In a head chip relating to any one of aspects (2) to (6) above, it is preferable that the specified groove includes a first specified groove provided on a first side in the second direction relative to the ejection hole, and a second specified groove provided on a second side in the second direction relative to the ejection hole. According to this aspect, the position of the defining groove in the partition portion in the second direction can be easily set freely, thereby improving the degree of freedom in design.

[0015] (8) In the head chip according to any one of aspects (7) above, it is preferable that the distance between the ejection hole and the first defining groove in the second direction is equal to the distance between the ejection hole and the second defining groove. According to this aspect, the pressure fluctuations on both sides of the injection hole in the second direction can be made uniform, so that the injection performance can be improved.

[0016] (9) In a head chip relating to any one of aspects (2) to (8) above, when adjacent individual flow paths among the individual flow paths are defined as a first individual flow path and a second individual flow path, and when the injection hole among the injection holes that communicates with the first individual flow path is defined as a first injection hole and the injection hole that communicates with the second individual flow path is defined as a second injection hole, it is preferable that a portion of the first individual flow path located on a first side in the second direction with respect to the specified groove constitutes a first pressure chamber that communicates with the first injection hole, and a portion of the second individual flow path located on a second side in the second direction with respect to the specified groove constitutes a second pressure chamber that communicates with the second injection hole. According to this aspect, between adjacent individual flow paths, the ejection holes are distributed to both sides of the specified groove in the second direction. That is, the ejection holes adjacent in the first direction are arranged alternately in the second direction. Therefore, the ejection holes can be arranged in a staggered manner without changing the chip size in the second direction. Therefore, crosstalk between adjacent pressure chambers can be suppressed. In addition, by arranging the pressure chambers (ejection holes) in a staggered manner, it is easier to ensure the distance between the ejection holes arranged in the same row than by arranging the ejection holes in a single row. Therefore, when ejecting liquid from the ejection holes, it is possible to suppress the airflow generated between the head chip and the recording medium from affecting the liquid ejected from the surrounding ejection holes. As a result, even if the gap between the head chip and the recording medium is increased, the variation in the landing position of the liquid can be suppressed.

[0017] (10) In the head chip relating to the above aspect (9), it is preferable that the dimension in the first direction of the first pressure chamber is larger than the dimension in the first direction of a portion of the first individual flow path located on the second side in the second direction with respect to the specified groove, and the dimension in the first direction of the second pressure chamber is larger than the dimension in the first direction of a portion of the second individual flow path located on the first side in the second direction with respect to the specified groove. According to this aspect, it is possible to reduce pressure loss in each pressure chamber while maintaining the arrangement pitch between the individual flow paths, thereby allowing the liquid to flow smoothly in the pressure chamber.

[0018] (11) A liquid jet head according to an aspect of the present disclosure includes the head chip according to any one of the above aspects (1) to (10). According to this aspect, it is possible to provide a liquid jet head with excellent reliability.

[0019] (12) A liquid jet recording apparatus according to an aspect of the present disclosure includes the liquid jet head according to the aspect (11) above. According to this aspect, it is possible to provide a highly reliable liquid jet recording apparatus. Effect of the Invention

[0020] According to one aspect of the present disclosure, a head chip that meets the required ejection performance can be manufactured simply and at low cost. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic configuration diagram of an inkjet printer according to a first embodiment. [Diagram 2] FIG. 2 is a schematic configuration diagram of an inkjet head and an ink circulation mechanism according to the first embodiment. [Diagram 3] FIG. 2 is an exploded perspective view of the discharge unit according to the first embodiment. [Figure 4] FIG. 2 is an exploded perspective view of the head chip according to the first embodiment. [Diagram 5] 5 is a cross-sectional view of the head chip corresponding to the line VV in FIG. 4. [Figure 6] 6 is a cross-sectional view of the discharge unit taken along line VI-VI in FIG. 4. [Figure 7] 7 is a cross-sectional view of the discharge unit taken along line VII-VII in FIG. 5. [Figure 8] 8 is a cross-sectional view of the discharge unit taken along line VIII-VIII in FIG. 5. [Figure 9]6 is a cross-sectional view of the discharge unit taken along line IX-IX in FIG. 5. [Figure 10] FIG. 4 is a bottom view of the discharge unit according to the first embodiment showing the underside of the actuator plate. [Figure 11] FIG. 4 is a bottom view of the discharge unit according to the first embodiment showing the lower surface of the support plate. [Figure 12] FIG. [Figure 13] FIG. 2 is a plan view of the discharge unit according to the first embodiment, showing the top surface of the actuator plate. [Figure 14] 5 is a flowchart for explaining a manufacturing method of the discharge unit according to the first embodiment. [Figure 15] FIG. 6 is a process drawing for explaining a first actuator processing step, and is a cross-sectional view corresponding to FIG. 5. [Figure 16] FIG. 6 is a process drawing for explaining a first actuator processing step, and is a cross-sectional view corresponding to FIG. 5. [Figure 17] FIG. 8 is a process diagram for explaining a first processing step of the support plate, and is a cross-sectional view corresponding to FIG. 7. [Figure 18] FIG. 8 is a process diagram for explaining a first processing step of the support plate, and is a cross-sectional view corresponding to FIG. 7. [Figure 19] FIG. 8 is a process diagram for explaining a first processing step of the support plate, and is a cross-sectional view corresponding to FIG. 7. [Figure 20] FIG. 6 is a process diagram for explaining a first bonding step, and is a cross-sectional view corresponding to FIG. 5. [Figure 21] FIG. 6 is a process drawing for explaining a second actuator processing step, and is a cross-sectional view corresponding to FIG. 5. [Figure 22] FIG. 11 is a cross-sectional view of a head chip according to a second embodiment. [Diagram 23] FIG. 11 is a bottom view of a discharge unit according to a second embodiment, showing the underside of an actuator plate. [Figure 24] FIG. 11 is a bottom view of a discharge unit according to a second embodiment, showing the underside of an actuator plate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. In the embodiments and modified examples described below, the same reference numerals may be used to designate corresponding configurations, and the description may be omitted. In the following description, expressions indicating relative or absolute arrangements, such as "parallel," "orthogonal," "center," and "coaxial," not only strictly indicate such arrangements, but also indicate a state in which the components are relatively displaced with a tolerance or an angle or distance to the extent that the same function is obtained. In the following embodiment, an inkjet printer (hereinafter, simply referred to as a printer) that uses ink (liquid) to record on a recording medium will be taken as an example for description. In the drawings used in the following description, the scale of each component has been appropriately changed so that each component can be recognized.

[0023] (First embodiment) [Printer 1] FIG. 1 is a schematic diagram of a printer 1. A printer (liquid jet recording apparatus) 1 shown in FIG. 1 includes a pair of transport mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid jet head) 5, an ink circulation mechanism 6, and a scanning mechanism .

[0024] In the following explanation, an X, Y, Z Cartesian coordinate system is used as necessary. In this case, the X direction coincides with the transport direction (sub-scanning direction) of the recording medium P (e.g., paper, etc.). The Y direction coincides with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction indicates the height direction (gravity direction) perpendicular to the X and Y directions. In the following explanation, the X, Y, and Z directions will be explained with the arrows on the figures as the plus (+) side and the opposite side to the arrows as the minus (-) side. In this specification, the +Z side corresponds to the upward direction of gravity, and the -Z side corresponds to the downward direction of gravity.

[0025] The transport mechanisms 2 and 3 transport the recording medium P to the +X side. The transport mechanisms 2 and 3 each include a pair of rollers 11 and 12 extending in the Y direction, for example. The ink tanks 4 each contain ink of four colors, for example, yellow, magenta, cyan, and black. Each inkjet head 5 is configured to be capable of ejecting ink of one of the four colors, yellow, magenta, cyan, or black, according to the ink tank 4 connected thereto.

[0026] FIG. 2 is a schematic diagram of the ink-jet head 5 and the ink circulation mechanism 6. As shown in FIG. 1 and 2, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction pump 25 connected to the ink discharge pipe 22.

[0027] The pressure pump 24 pressurizes the inside of the ink supply pipe 21, and sends ink to the inkjet head 5 through the ink supply pipe 21. As a result, the ink supply pipe 21 side relative to the inkjet head 5 is under positive pressure. The suction pump 25 reduces the pressure inside the ink discharge tube 22 and sucks ink from the inkjet head 5 through the ink discharge tube 22. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. By driving the pressure pump 24 and the suction pump 25, the ink can be circulated between the inkjet head 5 and the ink tank 4 through the circulation flow path 23.

[0028] 1, the scanning mechanism 7 causes the inkjet head 5 to scan back and forth in the Y direction. The scanning mechanism 7 includes a guide rail 28 extending in the Y direction, and a carriage 29 movably supported by the guide rail 28.

[0029] <Inkjet head 5> The inkjet head 5 is mounted on a carriage 29. In the illustrated example, a plurality of inkjet heads 5 are mounted side by side in the Y direction on one carriage 29. The inkjet head 5 includes a discharge unit 30 (see FIG. 2), an ink supply unit (not shown) that connects the ink circulation mechanism 6 and the discharge unit 30, and a control unit (not shown) that applies a drive voltage to the discharge unit 30.

[0030] (First embodiment) [Discharge unit 30] FIG. 3 is an exploded perspective view of the discharge unit 30. As shown in FIG. 3 is a so-called circulation type side chute type discharge unit 30 that circulates ink between the ink tank 4 and discharges ink from the center of the pressure chamber 50 in the extension direction (Y direction). The discharge unit 30 includes a flow path frame member 31, a head chip 32, a flow path cover 34, and a flexible printed circuit board 35 (see FIG. 7).

[0031] <Flow path frame member 31> The flow path frame member 31 is formed in a rectangular frame shape with the thickness direction being the Z direction and the longitudinal direction being the X direction. The flow path frame member 31 defines a chip accommodating section 31a, an inlet common flow path 31b, and an outlet common flow path 31c. The chip accommodating section 31a, the inlet common flow path 31b, and the outlet common flow path 31c penetrate the flow path frame member 31 in the Z direction while communicating with each other.

[0032] The chip accommodating portion 31a is formed in the center in the Y direction of the flow path frame member 31. The chip accommodating portion 31a is formed in an elongated hole shape with the X direction as the longitudinal direction in a plan view. The inlet common flow channel 31b is formed in a portion of the flow channel frame member 31 that is located on the +Y side with respect to the chip accommodating portion 31a. The inlet common flow channel 31b is formed in an elongated hole shape with the X direction as the longitudinal direction, similar to the chip accommodating portion 31a. The +X side end of the inlet common flow channel 31b protrudes in the X direction with respect to the chip accommodating portion 31a. The outlet common flow channel 31c is formed in a portion of the flow channel frame member 31 that is located on the -Y side with respect to the chip storage section 31a. The outlet common flow channel 31c is formed in an elongated hole shape with the X direction as the longitudinal direction, similar to the inlet common flow channel 31b. The -X side end of the outlet common flow channel 31c protrudes in the X direction with respect to the chip storage section 31a.

[0033] <Head chip 32> FIG. 4 is an exploded perspective view of the head chip 32. As shown in FIG. 4, head chip 32 ejects ink from pressure chambers 50A, 50B through nozzle holes 39A, 39B that respectively communicate with pressure chambers 50A, 50B in response to pressure fluctuations within pressure chambers 50A, 50B. Head chip 32 includes a chip module 37 and a nozzle plate 39.

[0034] As shown in FIG. 3, the chip module 37 is formed in a block shape with the thickness direction being the Z direction and the longitudinal direction being the X direction. The chip module 37 is fitted into the chip accommodating section 31a. Specifically, the chip module 37 is formed so that the thickness in the Z direction is equal to that of the flow path frame member 31 and the planar shape is equal to that of the chip accommodating section 31a. In this case, the +X side end face of the chip module 37 is fixed by adhesion or the like to the surface facing the -X side of the inner surface of the chip accommodating section 31a, and the -X side end face is fixed by adhesion or the like to the surface facing the +X side of the inner surface of the chip accommodating section 31a. Therefore, in the flow path frame member 31, the inlet common flow path 31b and the outlet common flow path 31c are blocked by the chip module 37.

[0035] 4, the chip module 37 includes an actuator plate 41 and a support plate 42. In the following description, the direction from the actuator plate 41 to the support plate 42 in the Z direction (+Z side) may be referred to as the upper side, and the direction from the support plate 42 to the actuator plate 41 (-Z side) may be referred to as the lower side. In the first embodiment, the lower surface of the chip module 37 is disposed flush with the lower surface of the flow path frame member 31. On the other hand, the upper surface of the chip module 37 is disposed flush with the upper surface of the flow path frame member 31.

[0036] <Actuator plate 41> The actuator plate 41 is made of a piezoelectric material such as PZT (lead zirconate titanate). For example, a so-called monopole substrate having a polarization direction in one direction over the entire Z direction is used for the actuator plate 41. That is, the actuator plate 41 is formed integrally without a bonding interface. Note that the actuator plate 41 may be made of a so-called chevron substrate formed by stacking two piezoelectric plates having different polarization directions in the Z direction.

[0037] Fig. 5 is a cross-sectional view of head chip 32 corresponding to line VV in Fig. 4. Fig. 6 is a cross-sectional view of head chip 32 corresponding to line VI-VI in Fig. 4. Fig. 7 is a cross-sectional view corresponding to line VII-VII in Fig. 5. Fig. 8 is a cross-sectional view corresponding to line VIII-VIII in Fig. 5. Fig. 9 is a cross-sectional view corresponding to line IX-IX in Fig. 5. As shown in FIGS. 5 to 9, the actuator plate 41 includes an opposing portion 45 and a partition portion . The facing portion 45 is formed in a plate shape with its thickness direction aligned in the Z direction. The partitions 46 protrude downward from the opposing portion 45 and extend parallel to each other over the entire length of the opposing portion 45 in the Y direction. In the actuator plate 41, a portion surrounded by the opposing portion 45 and the adjacent partitions 46 constitutes an individual flow path 47. That is, a plurality of individual flow paths 47 are formed in the actuator plate 41 at intervals in the X direction. Each individual flow path 47 extends linearly in the Y direction over the entire length of the actuator plate 41. The +Y side opening of each individual flow path 47 is individually connected to the inlet common flow path 31b. The -Y side opening of each individual flow path 47 is individually connected to the outlet common flow path 31c. That is, the inlet common flow path 31b and the outlet common flow path 31c are connected via each individual flow path 47.

[0038] FIG. 10 is a bottom view of the discharge unit 30 showing the underside of the actuator plate 41. As shown in FIG. 5 to 10, the individual flow paths 47 in the first embodiment are divided into first individual flow paths 47a and second individual flow paths 47b. The first individual flow paths 47a and the second individual flow paths 47b are arranged alternately in the X direction. The first individual flow path 47a is formed by a first wide portion 47a1 formed on the +Y side of the center in the Y direction, and a first narrow portion 47a2 formed on the -Y side of the center in the Y direction. The width in the X direction of the first wide portion 47a1 is wider than the width in the X direction of the first narrow portion 47a2. The depth in the Z direction of the first wide portion 47a1 is equal to the depth in the Z direction of the first narrow portion 47a2.

[0039] The second individual flow path 47b is formed by a second narrow portion 47b1 formed on the +Y side of the center in the Y direction and a second wide portion 47b2 formed on the -Y side of the center in the Y direction. That is, the first individual flow path 47a and the second individual flow path 47b are formed such that the wide portions 47a1 and 47b2 and the narrow portions 47a2 and 47b1 are alternately formed. Therefore, in a portion of the actuator plate 41 located on the +Y side of the center in the Y direction, the first wide portion 47a1 and the second narrow portion 47b1 are alternately arranged in the X direction. In a portion of the actuator plate 41 located on the -Y side of the center in the Y direction, the first narrow portion 47a2 and the second wide portion 47b2 are alternately arranged in the X direction.

[0040] The dimensions in each direction of the second wide portion 47b2 are the same as those of the first wide portion 47a1. The dimensions in each direction of the second narrow portion 47b1 are the same as those of the first narrow portion 47a2. However, the dimensions in each direction may be different between the wide portions 47a1 and 47b2 and between the narrow portions 47a2 and 47b1.

[0041] A defining groove 49 is formed in the center of the actuator plate 41 in the Y direction. The defining groove 49 divides the individual flow paths 47 in the Y direction. Specifically, the defining groove 49 divides the first wide portion 47a1 and the first narrow portion 47a2 in the Y direction at a boundary between the first wide portion 47a1 and the first narrow portion 47a2 in the first individual flow path 47a. The defining groove 49 divides the second narrow portion 47b1 and the second wide portion 47b2 in the Y direction at a boundary between the second narrow portion 47b1 and the second wide portion 47b2 in the second individual flow path 47b. In the first embodiment, "disconnected" does not mean, for example, in the first individual flow path 47a, that the first wide portion 47a1 and the first narrow portion 47a2 are not in communication with each other, but means that the defining groove 49 crosses between the first wide portion 47a1 and the first narrow portion 47a2. In other words, the first wide portion 47a1 and the first narrow portion 47a2 are in communication with each other via the defining groove 49.

[0042] The defining groove 49 opens at the lower surface of the actuator plate 41 and extends across each partition portion 46 in the X direction. Therefore, the defining groove 49 communicates between adjacent individual flow paths 47. The depth of the defining groove 49 in the Z direction is set to be less than the height of the partition portion 46 in the Z direction. In the illustrated example, the depth of the defining groove 49 in the Z direction is set to be half or more of the height of the partition portion 46 in the Z direction.

[0043] The width of the defining groove 49 in the Y direction is set to a predetermined width including the center of the actuator plate 41 in the Y direction. In the illustrated example, the width of the defining groove 49 in the Y direction is narrower than the width of the individual flow paths 47 in the X direction. The defining groove 49 extends in the X direction so as to cross at least between all of the partition portions 46. That is, the defining groove 49 does not have to be open at both end faces of the actuator plate 41 in the X direction. The position of the defining groove 49 in the Y direction may be shifted with respect to the center of the actuator plate 41.

[0044] In the actuator plate 41 of this embodiment, a first pressure chamber row 55A and a second pressure chamber row 55B are formed. The first pressure chamber row 55A is formed in a portion of the actuator plate 41 located on the +Y side of the defined groove 49. The second pressure chamber row 55B is formed in a portion of the actuator plate 41 located on the -Y side of the defined groove 49. The configurations of the pressure chamber rows 55A and 55B will be described below using the first pressure chamber row 55A as an example. In the following description, among the pressure chamber rows 55A and 55B, the configuration related to the first pressure chamber row 55A is given the suffix A, and the configuration related to the second pressure chamber row 55B is given the suffix B, and the description of the same or corresponding configurations of the first pressure chamber row 55A and the second pressure chamber row 55B may be omitted. In addition, when it is not necessary to distinguish between row A and row B in each pressure chamber row 55A and 55B, the suffix A or B is omitted from the suffix of the reference numeral.

[0045] As shown in FIGS. 5 and 7 to 9, the first pressure chamber row 55A is configured such that pressure chambers 50A that eject ink and non-ejection grooves 51A that do not eject ink are alternately arranged in the X direction. 5, the pressure chamber 50A is formed in a stepped shape in which the width in the X direction at an upper portion is narrower than the width in the X direction at a lower portion. In the first embodiment, the pressure chamber 50A is defined by a first wide portion 47a1 and a first recess 52A formed in the opposing portion 45.

[0046] The first recess 52A opens at a portion facing the first wide portion 47a1 on the lower surface of the facing portion 45. The first recess 52A extends linearly in the Y direction over the entire length of the first wide portion 47a1 of the facing portion 45. The +Y side opening of the first recess 52A and the first wide portion 47a1 each communicate with the inlet common flow path 31b.

[0047] The width of the first recess 52A in the X direction is narrower than the distance between the partition 46 (+X side partition 46a) located on the +X side and the partition 46b (-X side partition 46b) located on the -X side among the partitions 46 forming one pressure chamber 50A. The first recess 52A is provided at a position that includes the center of the pressure chamber 50A (first wide portion 47a1) in the X direction and does not contact the partitions 46a, 46b. In the illustrated example, the width of the first recess 52A in the X direction is set to be equal to that of the first narrow portion 47a2 (and the second narrow portion 47b1). The depth of the first recess 52 in the Z direction is set to be half or more of the thickness of the opposing portion 45 in the Z direction and to be equal to or more than the height of the partition 46 in the Z direction. However, the depth of the first recess 52 in the Z direction can be changed as appropriate.

[0048] Among the non-ejection grooves 51A, the +X side non-ejection groove 51A1 located on the +X side of one pressure chamber 50A is formed between the +X side partition portion 46a forming one pressure chamber 50A and the -X side partition portion 46b forming the +X side pressure chamber 50A1 located on the +X side of one pressure chamber 50A. Among the non-ejection grooves 51A, the -X side non-ejection groove 51A2 located on the -X side of one pressure chamber 50A is formed between the -X side partition portion 46b forming one pressure chamber 50A and the +X side partition portion 46a forming the -X side pressure chamber 50A2 located on the -X side of one pressure chamber 50A. That is, in the first embodiment, the partition portion 46 is formed individually for each pressure chamber 50A, and the partition portion 46 is shared between adjacent pressure chambers 50A and non-ejection grooves 51A.

[0049] 5, the non-ejection groove 51A is formed in a stepped shape in which the width in the X direction at an upper portion is narrower than the width in the X direction at a lower portion. In the first embodiment, the non-ejection groove 51A is defined by the second narrow portion 47b1 and a second recess 53A formed in the opposing portion 45.

[0050] The second recess 53A opens at a portion facing the second narrow portion 47b1 on the lower surface of the facing portion 45. The second recess 53A extends linearly in the Y direction over the entire length of the second narrow portion 47b1 of the facing portion 45. The +Y side opening of the second recess 53A and the first narrow portion 47b1 each communicate with the inlet common flow path 31b.

[0051] The width in the X direction of the second recess 53A is narrower than the distance between, for example, the +X side partition 46a that forms one pressure chamber 50A and the -X side partition 46b that forms the +X side pressure chamber 50A1 (see FIG. 5). The width in the X direction of the second recess 53A is narrower than the width in the X direction of the first recess 52A. The depth in the Z direction of the second recess 53A is equal to the depth in the Z direction of the first recess 52A. However, the dimensions of the first recess 52A and the second recess 53A can be changed as appropriate.

[0052] In the opposing portion 45, a dividing groove 54A is formed in a portion located between the first recess 52A and the second recess 53A adjacent to each other in the X direction. The dividing groove 54A opens on the upper surface of the opposing portion 45 and extends linearly in the Y direction. Therefore, the first recess 52A, the second recess 53A, and the dividing groove 54A are arranged alternately in the X direction (at positions shifted from each other when viewed from the Z direction) and extend parallel to each other in a plan view. The length of the dividing groove 54A in the Y direction is shorter than that of the first recess 52A and the second recess 53A. Both ends of the dividing groove 54A in the Y direction are not opened at both end faces of the opposing portion 45 in the Y direction.

[0053] As shown in FIG. 5, the width of the dividing groove 54A in the X direction is less than the distance between the adjacent first recess 52A and second recess 53A. The dividing groove 54A is provided in a position that includes the center of the partition 46 in the X direction and does not contact the recesses 52A and 53A. In the first embodiment, the dividing groove 54A is formed such that the center in the X direction coincides with the center in the X direction of the partition 46 and the width in the X direction is narrower than the width in the X direction of the partition 46. Therefore, the entirety of the dividing groove 54A overlaps with the entirety of the partition 46 in a plan view. The width of the dividing groove 54A may be equal to or greater than the width of the partition 46. The partition 46 and the dividing groove 54A may at least partially overlap with each other in a plan view.

[0054] The depth of the dividing groove 54A in the Z direction is formed to be half or more of the thickness in the Z direction of the facing portion 45. Therefore, the dividing groove 54A and parts of the recesses 52A and 53A overlap each other when viewed from the X direction (they overlap in the Z direction).

[0055] A portion of the facing portion 45 located between the first recesses 52A and the dividing grooves 54A adjacent to each other in the X direction constitutes a first driving portion 59A. In a cross-sectional view perpendicular to the Y direction, the first driving portion 59A has a thickness equivalent to that of the facing portion 45. The width of the first driving portion 59A in the X direction is narrower than the recesses 52A and 53A, the dividing grooves 54A, and the partition portion 46. In the illustrated example, the first driving portion 59A is provided at a position that does not overlap with the entire partition portion 46 in a plan view. However, a portion of the first driving portion 59A may overlap with the partition portion 46 in a plan view.

[0056] The first drive units 59A are provided at positions corresponding to both ends in the X direction for one pressure chamber 50A. In the following description, the first drive unit 59A located at the +X side end of the pressure chamber 50A may be referred to as the +X side first drive unit 59A1, and the first drive unit 59A located at the -X side end of the pressure chamber 50A may be referred to as the -X side first drive unit 59A2.

[0057] A portion of the facing portion 45 located between the second recesses 53A and the dividing grooves 54A adjacent to each other in the X direction constitutes a second driving portion 69A. In a cross-sectional view perpendicular to the Y direction, the second driving portion 69A has a thickness equivalent to that of the facing portion 45. The width of the second driving portion 69A in the X direction is narrower than the recesses 52A and 53A, the dividing grooves 54A, and the partition portion 46. In the illustrated example, the second driving portion 69A is provided at a position that does not overlap with the entire partition portion 46 in a plan view. However, a portion of the second driving portion 69A may overlap with the partition portion 46 in a plan view.

[0058] The second drive units 69A are provided at positions corresponding to both ends in the X direction for one pressure chamber 50A. In the following description, the second drive unit 69A located between the +X side non-ejection groove 51A1 and the pressure chamber 50A may be referred to as the +X side second drive unit 69A1, and the second drive unit 69A located between the -X side non-ejection groove 51A2 and the pressure chamber 50A may be referred to as the -X side second drive unit 69A2.

[0059] As shown in Figs. 6 to 9, the second pressure chamber row 55B has pressure chambers 50B and non-ejection grooves 51B arranged alternately in the X direction. Specifically, the pressure chambers 50B are defined by the second wide portion 47b2 and the first recess 52B. The pressure chambers 50B face the non-ejection grooves 51A (second narrow portion 47b1) in the Y direction, with the defined groove 49 sandwiched therebetween. That is, of the second individual flow paths 47b, the -Y side with respect to the defined groove 49 functions as the pressure chambers 50B, and the +Y side with respect to the defined groove 49 functions as the non-ejection grooves 51A. The non-ejection groove 51B is defined by the first narrow portion 47b1 and the second recess 53B. The non-ejection groove 51B faces the pressure chamber 50A (first wide portion 47a1) in the Y direction, with the defined groove 49 sandwiched therebetween. That is, in the first individual flow path 47a, the +Y side with respect to the defined groove 49 functions as the pressure chamber 50A, and the -Y side with respect to the defined groove 49 functions as the non-ejection groove 51B.

[0060] In this way, the pressure chambers 50A of the first pressure chamber row 55A and the pressure chambers 50B of the second pressure chamber row 55B are arranged with a half pitch shift from the arrangement pitch of the adjacent pressure chambers 50A (or the pressure chambers 50B). In addition, the non-ejection grooves 51A of the first pressure chamber row 55A and the non-ejection grooves 51B of the second pressure chamber row 55B are also arranged with a half pitch shift from the arrangement pitch of the adjacent non-ejection grooves 51A (or the non-ejection grooves 51B). Therefore, the pressure chambers 50A of the first pressure chamber row 55A and the pressure chambers 50B of the second pressure chamber row 55B, and the non-ejection grooves 51A of the first pressure chamber row 55A and the non-ejection grooves 51B of the second pressure chamber row 55B are arranged in a staggered (alternate) pattern.

[0061] The -Y side opening of the first recess 52B and the second wide portion 47b2 are each connected to the outlet common flow path 31c. The -Y side opening of the second recess 53B and the first wide portion 47a2 are each connected to the outlet common flow path 31c.

[0062] <Support plate 42> As shown in FIGS. 5 to 9, the support plate 42 ensures the rigidity of the chip module 37, and is stacked on the actuator plate 41 to support the support plate 42 from above. The support plate 42 is in the form of a plate formed to have the same outer shape as the actuator plate 41 in a plan view. The support plate 42 is fixed to the upper surface of the actuator plate 41 (facing portion 45) by adhesion or the like. In the illustrated example, the support plate 42 is thicker than the actuator plate 41. However, the support plate 42 may be thinner than the actuator plate 41. The support plate 42 can be formed of, for example, a metal, a metal oxide, glass, a resin, ceramics, or the like.

[0063] FIG. 11 is a bottom view of the dispensing unit 30 showing the underside of the support plate 42. As shown in Figs. 5, 6 and 11, the support plate 42 has a deformable portion 60A formed at a position overlapping at least a part of the first drive portion 59A in a plan view. The deformable portion 60A is a groove that opens on the lower surface of the support plate 42. In a plan view, the deformable portion 60A extends linearly in the Y direction along the pressure chamber 50A at both ends (outer periphery) of the pressure chamber 50A in the X direction. Specifically, of the deformable portions 60A, the deformable portion 60A located on the +X side is formed so as to straddle (so as to overlap in a plan view) the entire +X side first drive portion 59A1, the separating groove 54A, and the +X side second drive portion 69A1 corresponding to one pressure chamber 50A in the X direction. Of the deformation allowing portions 60A, the deformation allowing portion 60A located on the -X side is formed so as to straddle (so as to overlap in a plan view) the entire -X side first driving portion 59A2, the separating groove 54A, and the -X side second driving portion 69A2 corresponding to one pressure chamber 50A in the X direction. Therefore, in the cross-sectional view shown in FIG. 5, the first driving portion 59A, the second driving portion 69A, and the separating groove 54A are not in contact with the support plate 42.

[0064] As shown in Figs. 7 to 9, the length of the deformation allowing portion 60A in the Y direction is shorter than the length of the pressure chamber 50A in the Y direction. That is, both ends of the deformation allowing portion 60A in the Y direction are not open to both end faces of the support plate 42 in the Y direction. In the Y direction, the deformation allowing portion 60A is formed to have the same length as the dividing groove 54A. In a plan view, the deformation allowing portion 60A overlaps with the entirety of the dividing groove 54A in the Y direction. Therefore, in the cross-sectional views shown in Figs. 7 to 9, the first driving portion 59A, the second driving portion 69A and the dividing groove 54A are not in contact with the support plate 42. However, the dimensions of the deformation allowing portion 60A can be changed as appropriate.

[0065] 7 to 9, a common conductive portion 61A and an individual conductive portion 62A are formed on the support plate 42. The common conductive portion 61A is provided at the +Y side end of the support plate 42. The individual conductive portion 62A is provided at the -Y side end of the support plate 42.

[0066] The common conductive portion 61A is formed in a portion of the support plate 42 that is located on the +Y side with respect to the deformation allowance portion 60A. The common conductive portion 61A includes a common recess 65A and a common wiring groove 66A. The common recess 65A is open on the upper surface of the support plate 42. The common recess 65 constitutes an upper end opening of the common conductive portion 61A. A plurality of common recesses 65A are provided at intervals in the X direction.

[0067] The common wiring groove 66A opens on the lower surface of the support plate 42 and extends linearly in the X direction. That is, the common wiring groove 66A constitutes the lower end opening of the common conductive portion 61A. The common wiring groove 66A is provided so as to cross between the multiple common recesses 65A in the X direction. The common wiring groove 66A communicates with each common recess 65A through a portion overlapping with the common recess 65A in a plan view. A portion of the common conductive portion 61A where the common recess 65A and the common wiring groove 66A communicate with each other constitutes a common through portion 67A that penetrates the support plate 42 in the Z direction. The common wiring groove 66A does not necessarily have to span all the common recesses 65A, but may at least span between adjacent common recesses 65A.

[0068] The individual conductive portion 62A is formed at a position overlapping, for example, the -Y side end portion of the deformation allowance portion 60A in a plan view of the support plate 42. The individual conductive portion 62A includes an individual recess 70A and an individual wiring groove 71A. The individual recess 70A opens on the upper surface of the support plate 42. The individual recess 70A constitutes the upper end opening of the individual conductive portion 62A. A plurality of individual recesses 70A are provided at intervals in the X direction. In the first embodiment, the common recess 65A and the individual recesses 70A are arranged at different positions in the Y direction and alternately in the X direction. However, the position of the common recess 65A relative to the individual recess 70A can be changed as appropriate.

[0069] The individual wiring groove 71A opens on the lower surface of the support plate 42 and extends linearly in the X direction. That is, the individual wiring groove 71A constitutes the lower end opening of the individual conductive portion 62A. The individual wiring groove 71A is provided so as to cross between the multiple individual recesses 70A in the X direction. The individual wiring groove 71A communicates with each individual recess 70A through a portion that overlaps with the individual recess 70A in a plan view. A portion of the individual conductive portion 62A where the individual recess 70A and the individual wiring groove 71A communicate with each other constitutes an individual through portion 73A that penetrates the support plate 42 in the Z direction. Note that the individual wiring groove 71A does not necessarily need to span all the individual recesses 70A, but may at least span between adjacent individual recesses 70A.

[0070] <Nozzle plate 39> As shown in Figs. 5 to 9, the nozzle plate 39 collectively covers the lower surface of the chip module 37 and the flow path frame member 31. The nozzle plate 39 is bonded to the actuator plate 41 and the lower surface of the flow path frame member 31 via an adhesive or the like. As a result, the nozzle plate 39 collectively covers the lower end openings of the inlet common flow path 31b and the outlet common flow path 31c, the individual flow paths 47a, 47b, and the lower end openings of the defined groove 49. The nozzle plate 39 is formed of, for example, a metal material (SUS, Ni-Pd, etc.). However, the nozzle plate 39 may be made of a resin material (polyimide, etc.), glass, silicon, etc., other than a metal material.

[0071] The nozzle plate 39 is formed with a plurality of nozzle holes 39A, 39B penetrating the nozzle plate 39 in the Z direction. The nozzle holes 39A, 39B are formed in a tapered shape, for example, with the inner diameter gradually decreasing from the top to the bottom. Each nozzle hole 39A overlaps with each pressure chamber 50A in a plan view. Each nozzle hole 39B overlaps with each pressure chamber 50B in a plan view. That is, each nozzle hole 39A, 39B is individually connected to the corresponding pressure chamber 50A, 50B. On the other hand, the nozzle holes 39A, 39B are not connected to the non-ejection grooves 51A, 51B.

[0072] Next, various wirings formed on the head chip 32 will be described. 5 and 6, the head chip 32 includes common wiring 81A, 81B and individual wiring 82A, 82B as drive wiring. In the following, the common wiring 81A and the individual wiring 82A corresponding to the first pressure chamber row 55A will be described as an example, and a description of the common wiring 81B and the individual wiring 82B corresponding to the second pressure chamber row 55B will be omitted as appropriate.

[0073] As shown in FIGS. 5, 9, and 10, the common wiring 81A includes a first common electrode 81Aa, a second common electrode 81Ab, an end surface wiring 81Ac, an upper surface wiring 81Ad, a through wiring 81Ae, and a common pad 81Af.

[0074] The first common electrode 81Aa is formed on at least the inner surface of each of the first recesses 52A on the lower surface of the facing portion 45. In the illustrated example, the first common electrode 81Aa is formed over the entire inner surface of the first recess 52A. That is, the entire first common electrode 81Aa faces the inside of the pressure chamber 50A. The second common electrode 81Ab is formed on at least the inner surface of each of the second recesses 53A on the lower surface of the facing portion 45. In the illustrated example, the second common electrode 81Ab is formed over the entire inner surface of the second recess 53A. That is, the entire second common electrode 81Ab faces the inside of the non-ejection grooves 51A.

[0075] The end face routing wiring 81Ac is formed on the +Y side end face of the opposing portion 45. In the first embodiment, the end face routing wiring 81Ac is formed across the entire +Y side end face of the opposing portion 45. The end face routing wiring 81Ac is connected to the first common electrode 81Aa and the second common electrode 81Ab at the boundary between the lower surface of the opposing portion 45 and the +Y side end face. The top surface wiring 81Ad is formed at the +Y side end of the top surface of the opposing portion 45. The top surface wiring 81Ad is formed in a strip shape extending in the X direction on the top surface of the opposing portion 45. The top surface wiring 81Ad is connected to the end surface wiring 81Ac at the boundary between the top surface of the opposing portion 45 and the +Y side end surface. The top surface wiring 81Ad is spaced apart in the Y direction from the dividing groove 54A.

[0076] The through wiring 81Ae is for connecting the upper surface wiring 81Ad and the common pad 81Af, and is provided to penetrate the support plate 42. The through wiring 81Ae is formed on the inner surface of the common through portion 67A. The through wiring 81Ae is connected to the upper surface wiring 81Ad at the lower end edge of the common through portion 67A. It is sufficient that the through wiring 81Ae is ensured to be conductive over the entire length in the Z direction of the inner surface of the common through portion 67A. In other words, the through wiring 81Ae may be formed, for example, over the entire circumferential direction of the inner surface of the common through portion 67A, or may be formed only in a part of the circumferential direction.

[0077] FIG. 12 is a plan view of the discharge unit 30. As shown in FIG. 4 and 12, the common pad 81Af is formed on the upper surface of the support plate 42. The common pad 81Af is connected to a through wire 81Ae at the edge of the upper opening of the common through portion 67A.

[0078] FIG. 13 is a plan view of the discharge unit 30 showing the upper surface of the actuator plate 41. As shown in FIG. As shown in Figures 5, 7, and 13, the individual wiring 82A includes an upper surface first individual electrode 82Aa, an upper surface second individual electrode 82Ab, an upper surface third individual electrode 82Ac, a groove first individual electrode 82Ad, a groove second individual electrode 82Ae, an upper surface routing wiring 82Af, a through wiring 82Ag, and an individual pad 82Ah.

[0079] The upper surface first individual electrodes 82Aa are formed on the upper surface of the facing portion 45 in a portion overlapping with each pressure chamber 50 in a planar view. In the first embodiment, the upper surface first individual electrodes 82Aa are formed on the upper surface of the facing portion 45 in a portion overlapping with the first recess 52A in a planar view. Therefore, the upper surface first individual electrodes 82Aa face the first common electrode 81Aa in the Z direction with the facing portion 45 sandwiched therebetween. On the upper surface of the facing portion 45, the +Y side end of the upper surface first individual electrode 82Aa is separated from the upper surface lead-out wiring 81Ad.

[0080] The upper surface second individual electrodes 82Ab are formed on the upper surface of the facing portion 45 in a portion that overlaps with the +X-side non-ejection groove 51A1 in a plan view. In the first embodiment, the upper surface second individual electrodes 82Ab are formed on the upper surface of the facing portion 45 in a portion that overlaps with the -X-side end of the second recess 53A in a plan view. Therefore, the upper surface second individual electrodes 82Ab face the second common electrode 81Ab formed on the inner surface of the +X-side non-ejection groove 51A1 in the Z direction with the facing portion 45 sandwiched therebetween. On the upper surface of the facing portion 45, the +Y-side end of the upper surface second individual electrodes 82Ab is separated from the upper surface lead-out wiring 81Ad.

[0081] The upper surface third individual electrodes 82Ac are formed on the upper surface of the facing portion 45 in a portion that overlaps with the -X side non-ejection groove 51A2 in a plan view. In the first embodiment, the upper surface third individual electrodes 82Ac are formed on the upper surface of the facing portion 45 in a portion that overlaps with the +X side end of the second recess 53A in a plan view. Therefore, the upper surface third individual electrodes 82Ac face the second common electrode 81Ab formed on the inner surface of the -X side non-ejection groove 51A2 in the Z direction with the facing portion 45 sandwiched therebetween. On the upper surface of the facing portion 45, the +Y side end of the upper surface third individual electrode 82Ac is separated from the upper surface lead-out wiring 81Ad.

[0082] The groove first individual electrode 82Ad is formed on the inner surface of the dividing groove 54A (+X side dividing groove 54A1) located on the +X side of the pressure chamber 50A. The second individual electrode 82Ab is formed over the entire inner surface of the +X side dividing groove 54A1. Therefore, the groove first individual electrode 82Ad faces the first common electrode 81Aa across the +X side first drive section 59A1. In addition, the groove first individual electrode 82Ad faces the second common electrode 81Ab formed on the inner surface of the +X side non-ejection groove 51A1 across the +X side second drive section 69A1.

[0083] The groove second individual electrode 82Ae is formed on the inner surface of the dividing groove 54A (-X side dividing groove 54A2) located on the -X side of the pressure chamber 50A. The groove second individual electrode 82Ae is formed over the entire inner surface of the -X side dividing groove 54A2. Therefore, the groove second individual electrode 82Ae faces the first common electrode 81Aa across the -X side first driving section 59A2. In addition, the groove second individual electrode 82Ae faces the second common electrode 81Ab formed on the inner surface of the -X side non-ejection groove 51b across the -X side second driving section 69A2.

[0084] 13, the upper surface wiring 82Af connects the upper surface first individual electrode 82Aa, the upper surface second individual electrode 82Ab, the upper surface third individual electrode 82Ac, the groove first individual electrode 82Ad, and the groove second individual electrode 82Ae provided corresponding to one pressure chamber 50A, respectively, on the upper surface of the facing portion 45. The upper surface wiring 82Af extends in a band shape in the X direction on the upper surface of the facing portion 45.

[0085] As shown in Figs. 7 to 9, the through wiring 82Ag is for connecting between the upper surface lead-out wiring 82Af and the individual pads 82Ah, and is provided to penetrate the support plate 42. The through wiring 82Ag is formed on the inner surface of the individual through portion 73A. The through wiring 82Ag is connected to the upper surface lead-out wiring 82Af at the lower end edge of the individual through portion 73A. Note that it is sufficient that the through wiring 82Ag is ensured to be conductive over the entire length in the Z direction of the inner surface of the individual through portion 73A. That is, the through wiring 82Ag may be formed, for example, over the entire circumferential direction of the inner surface of the individual through portion 73A, or may be formed only in a part of the circumferential direction.

[0086] 4 and 12, the individual pad 82Ah is formed on the upper surface of the support plate 42. The individual pad 82Ah is connected to the through wire 82Ag at the upper opening edge of the individual through portion 73A.

[0087] <Flow passage cover 34> 3 and 7, the flow path cover 34 sandwiches the flow path frame member 31 and the chip module 37 between itself and a reinforcing plate 38. The flow path cover 34 includes a cover base 90, an inlet port 91, and an outlet port 92. The cover base 90 is a rectangular plate whose planar outer shape is formed to be the same as that of the flow path frame member 31. The cover base 90 is overlaid on the upper surfaces of the flow path frame member 31 and the chip module 37. The cover base 90 is bonded to the upper surfaces of the flow path frame member 31 and the chip module 37 via an adhesive or the like, and is fastened to the flow path frame member 31 with screws or the like. As a result, the cover base 90 closes the upper end openings of the inlet common flow path 31b and the outlet common flow path 31c.

[0088] A slit 90a is formed in the center of the cover base 90 in the Y direction. The slit 90a penetrates the cover base 90 in the Z direction and extends in the X direction. The slit 90a is formed at a position overlapping the center of the chip module 37 (excluding the outer periphery) in a plan view. That is, the dimension of the slit 90a in the Y direction is smaller than the dimension of the chip module 37 in the Y direction. The dimension of the slit 90a in the X direction is smaller than the dimension of the chip module 37 in the X direction. The slit 90a exposes at least a portion of the common pads 81Af, 81Bf and the individual pads 82Ah, 82Bh on the upper surface of the support plate 42.

[0089] The inlet port 91 is located at the end of the cover base 90 on the +Y side and the +X side. The inlet port 91 protrudes upward from the cover base 90. The inlet port 91 communicates with the inlet common flow channel 31b through the +X side end of the inlet common flow channel 31b (the portion protruding toward the chip accommodation section 31a). That is, the ink flowing through the ink supply tube 21 is supplied to the inlet common flow channel 31b through the inlet port 91. The outlet port 92 is located at the end of the cover base 90 on the -Y side and the -X side. The outlet port 92 protrudes upward from the cover base 90. The outlet port 92 communicates with the outlet common flow path 31c through the -X side end of the outlet common flow path 31c (the portion protruding toward the chip housing portion 31a). That is, the ink flowing through the outlet common flow path 31c is discharged to the ink discharge tube 22 through the outlet port 92.

[0090] The flexible printed circuit board 35 is pressure-bonded to the upper surface of the support plate 42 through the slit 90a. The flexible printed circuit board 35 is connected to the common pads 81Af, 81Bf and the individual pads 82Ah, 82Bh on the upper surface of the support plate 42. The flexible printed circuit board 35 is pulled out upward and then connected to the control unit.

[0091] [Printer 1 operation method] Next, a case where characters, figures, etc. are recorded on a recording medium P using the printer 1 configured as described above will be described below. 1 are each fully filled with ink of a different color. Also, the ink in the ink tanks 4 is filled in the inkjet head 5 via the ink circulation mechanism 6.

[0092] When the printer 1 is operated in this initial state, the recording medium P is conveyed to the +X side while being sandwiched between the rollers 11 and 12 of the conveying mechanisms 2 and 3. At the same time, the carriage 29 moves in the Y direction, causing the inkjet head 5 mounted on the carriage 29 to move back and forth in the Y direction. While the inkjet heads 5 are moving back and forth, ink is appropriately ejected from each inkjet head 5 onto the recording medium P. In this way, characters, images, etc. can be recorded on the recording medium P.

[0093] The movement of each ink-jet head 5 will now be described in detail. In the inkjet head 5 of the circulation side shoot type as in the first embodiment, the pressurizing pump 24 and the suction pump 25 shown in FIG. 2 are first operated to circulate ink in the circulation flow path 23. In this case, the ink flowing through the ink supply pipe 21 is supplied into the inlet common flow path 31b through the inlet port 91. The ink supplied to the inlet common flow path 31b is distributed to each individual flow path 47. Of the ink distributed to each individual flow path 47, the ink distributed to the first individual flow path 47a is discharged to the outlet common flow path 31c through the pressure chamber 50A and the non-ejection groove 51B. Of the ink distributed to each individual flow path 47, the ink distributed to the second individual flow path 47b is discharged to the outlet common flow path 31c through the non-ejection groove 51A and the pressure chamber 50B. The ink discharged to the outlet common flow path 31c flows into the ink discharge pipe 22 through the outlet port 92 and is returned to the ink tank 4. In this way, the ink can be circulated between the inkjet head 5 and the ink tank 4.

[0094] Then, when the inkjet head 5 starts to move back and forth by the movement of the carriage 29 (see FIG. 1), a driving voltage is applied between the common electrodes 81Aa, 81Ab and the individual electrodes 82Aa to 82Ae, and between the common electrodes 81Ba, 81Bb and the individual electrodes 82Ba to 82Be via the flexible printed circuit board 35. At this time, the driving voltage is applied with the common electrodes 81Aa, 81Ab, 81Ba, and 81Bb as a reference potential GND, and the individual electrodes 82Aa to 82Ae and 82Ba to 82Be as a driving potential Vdd. Then, a potential difference is generated between the common electrodes 81Aa, 81Ab and the individual electrodes 82Aa to 82Ae, and between the common electrodes 81Ba, 81Bb and the individual electrodes 82Ba to 82Be, which face each other across the facing portion 45, and an electric field is generated in the facing portion 45.

[0095] For example, in the first pressure chamber row 55A, a potential difference occurs between the first common electrode 81Aa and the upper surface first individual electrode 82Aa in the Z direction. Due to the potential difference occurring in the Z direction, an electric field is generated in the facing portion 45 in a direction parallel to the polarization direction (Z direction). As a result, the facing portion 45 expands and contracts in the Z direction due to the bend mode. Furthermore, a potential difference occurs in the X direction between the first common electrode 81Aa and the groove first individual electrode 82Ad, and between the first common electrode 81Aa and the groove second individual electrode 82Ae. Due to the potential difference occurring in the X direction, an electric field is generated in the first driving portion 59A, and the first driving portion 59A undergoes thickness slip deformation in the Z direction due to the shear mode. As a result, the portions of the facing portion 45 corresponding to each pressure chamber 50A shear upward from both ends toward the center in the X direction.

[0096] Furthermore, a potential difference occurs in the Z direction between the second common electrode 81Ab and the upper surface second individual electrode 82Ab. Due to the potential difference occurring in the Z direction, the facing portion 45 expands and contracts in the Z direction in a bend mode. Furthermore, a potential difference occurs in the X direction between the second common electrode 81Ab and the groove first individual electrode 82Ad, and between the second common electrode 81Ab and the groove second individual electrode 82Ae. Due to the potential difference occurring in the X direction, an electric field is generated in the second driving portion 69A, and the second driving portion 69A undergoes thickness slip deformation in the Z direction in a shear mode. As a result, the portions of the facing portion 45 corresponding to each non-ejection groove 51A shear upward from both ends toward the center in the X direction.

[0097] That is, in the head chip 32 of the first embodiment, the deformations caused by the shear mode and bend mode of the actuator plate 41 both extend in the Z direction. Specifically, by applying a drive voltage, the actuator plate 41 (opposing portion 45) deforms so that the volume of the pressure chamber 50A (wide portion 47a1) expands. After that, when the drive voltage is set to zero, the opposing portion 45 is restored, and the volume of the pressure chamber 50A (wide portion 47a1) tries to return to the original volume. In the process of the actuator plate 41 being restored, the pressure in the pressure chamber 50A increases, and the ink in the pressure chamber 50A is ejected to the outside through the nozzle hole 39A. The ink ejected to the outside lands on the recording medium P, and print information is recorded on the recording medium P. In addition, a pressure fluctuation occurs in the pressure chamber 50B by an operation similar to that described above, and ink is ejected through the nozzle hole 39B.

[0098] <Method of Manufacturing Discharge Unit 30> Next, a description will be given of a method for manufacturing the above-mentioned discharge unit 30. Fig. 14 is a flow chart for explaining a method for manufacturing the discharge unit 30. 14, the manufacturing method of the discharge unit 30 includes a first actuator processing step S11, a first support plate processing step S12, a first joining step S13, a second actuator processing step S14, a second support plate processing step S15, an assembly step S16, and a second joining step S17. For convenience, the following description will be given taking as an example a case where the chip module 37 is manufactured at the chip level.

[0099] Figures 15 and 16 are process diagrams for explaining the actuator first processing step S11, and are cross-sectional views corresponding to Figure 5. In the actuator first processing step S11, the cross section corresponding to Figure 6 is omitted from the illustration because it is performed in the same manner as the cross section corresponding to Figure 5. 15, in the actuator first processing step S11, dividing grooves 54A are formed in the actuator plate 41 (dividing groove forming step). Specifically, the dividing grooves 54A are formed by performing a dicing process or the like on the upper surface of the actuator plate 41.

[0100] Next, in the first actuator processing step S11, as shown in FIG. 16, the portions of the drive wirings located on the upper surface of the actuator plate 41 (individual electrodes 82Aa-82Ae and upper surface lead-out wirings 81Ad, 82Af, etc.) are formed (first wiring formation step). In the first wiring formation step, first, a mask pattern having openings in areas where the drive wirings are to be formed is formed on the upper surface of the actuator plate 41. Next, an electrode material is formed on the actuator plate 41 by, for example, oblique deposition. The electrode material is formed on the actuator plate 41 through the openings in the mask pattern. As a result, the drive wirings are formed on the upper surface of the actuator plate 41 and on the inner surfaces of the dividing grooves 54A.

[0101] 17 to 19 are process drawings for explaining the first support plate processing step S12, and are cross-sectional views corresponding to FIG. As shown in FIG. 17, in the first support plate processing step S12, first, the conductive parts 61A, 61B, 62A, 62B are formed in the support plate 42. Specifically, the common recesses 65A, 65A and the individual recesses 70A, 70B are formed in the upper surface of the support plate 42 by sandblasting or the like. Then, as shown in FIG. 18, the common wiring grooves 66A, 66B and the individual wiring grooves 71A, 71B are formed in the lower surface of the support plate 42 by dicing or the like. At this time, the common wiring grooves 66A, 66B and the individual wiring grooves 71A, 71B are formed so that the common wiring grooves 66A, 66B and the common recesses 65A, 65B communicate with each other, and the individual wiring grooves 71A, 71B and the individual recesses 70A, 70B communicate with each other. As a result, the conductive parts 61A, 61B, 62A, 62B are formed.

[0102] Next, in the support plate first processing step S12, deformation allowance portions 60A, 60B are formed as shown in Fig. 19. The deformation allowance portions 60A, 60B are formed on the lower surface of the support plate 42 by a dicing process or the like.

[0103] Fig. 20 is a process diagram for explaining the first bonding step S13, and is a cross-sectional view corresponding to Fig. 5. In the first bonding step S13, the cross section corresponding to Fig. 6 is omitted from illustration because it is performed in the same manner as the cross section corresponding to Fig. 5. 20, in the first bonding process S13, the support plate 42 is attached to the upper surface of the actuator plate 41 with an adhesive or the like. In the first bonding process S13, excess adhesive is washed away when the actuator plate 41 and the support plate 42 are pressed together, and is accommodated in the common wiring grooves 66A, 66B, the individual wiring grooves 71A, 71B, and the deformation allowance portions 60A, 60B.

[0104] Fig. 21 is a process diagram for explaining the actuator second processing step S14, and is a cross-sectional view corresponding to Fig. 5. In the actuator second processing step S14, the cross section corresponding to Fig. 6 is not shown because it is processed in the same manner as the cross section corresponding to Fig. 5. In the actuator second processing step S14, as shown in FIG. 21, the lower surface of the actuator plate 41 is processed. In the actuator second processing step S14, first, recesses to become the first recesses 52A and the second recesses 53A of the pressure chambers 50A and the non-ejection grooves 51A are formed on the lower surface of the actuator plate 41 by dicing or the like. Next, the parts of the drive wiring located on the lower surface and +Y side end surface of the actuator plate 41 (common electrodes 81Aa, 81Ab, end surface wiring 81Ac, etc.) are formed by, for example, deposition or the like (second wiring formation step). After that, the parts of the pressure chambers 50A and the non-ejection grooves 51A corresponding to, for example, the individual flow paths 47 are formed on the lower surface of the actuator plate 41 by dicing or the like.

[0105] In the second actuator processing step S14, grinding or the like is appropriately performed to smooth the lower surface of the actuator plate 41. At this time, since the support plate 42 is laminated on the upper surface of the actuator plate 41, the lower surface of the actuator plate 41 is ground while being supported by the support plate 42.

[0106] In the second support plate processing step S15, the through wirings 81Ae, 82Ag and the pads 81Af, 82Ah of the drive wirings are formed on the support plate 42 (third wiring forming step). Specifically, a mask pattern having openings for the formation regions of the through wirings 81Ae, 82Ag and the pads 81Af, 82Ah is formed on the upper surface of the support plate 42. Next, an electrode material is formed on the support plate 42 by, for example, oblique deposition from the Y direction. The electrode material is formed on the support plate 42 through the openings of the mask pattern. As a result, the through wirings 81Ae, 82Ag and the pads 81Af, 82Ah are formed.

[0107] Thereafter, in an assembly process S16, the chip module 37 is assembled to the flow path frame member 31. Specifically, the chip module 37 is fitted into the chip accommodation portion 31a so that the lower surface of the flow path frame member 31 and the lower surface of the chip module 37 are flush with each other.

[0108] Next, in a second bonding process S17, a nozzle plate 39 is attached so as to cover the lower surface of the flow path frame member 31 and the lower surface of the chip module 37. Thereafter, a flow path cover 34 is attached to the upper surface of the flow path frame member 31. Through the above steps, the discharge unit 30 is completed.

[0109] As described above, the head chip 32 of the first embodiment includes an actuator plate (flow path defining portion) 41 having a plurality of partition portions 46 spaced apart in the X direction (first direction) and forming a plurality of individual flow paths 47 through which ink can flow in the Y direction (second direction) between adjacent partition portions 46, and an opposing portion (actuator portion) 45 of the actuator plate 41 that is overlapped with the partition portions 46 in the Z direction (third direction) and is deformable so as to expand or reduce the inside of the individual flow path 47. A prescribed groove 49 that connects the inside of one individual flow path 47 to the outside of one individual flow path 47 is formed in a part of the partition portion 46 in the Y direction. A nozzle hole (ejection hole) 39a that communicates with a position of the individual flow path 47 that is shifted in the Y direction from the prescribed groove 49 is formed in the individual flow path 47, and a nozzle plate (ejection hole plate) 39 is provided facing the opposing portion 45. According to this configuration, by connecting the inside and outside of the individual flow path 47 with each other through the specified groove 49, the pressure fluctuation occurring in the individual flow path 47 due to the deformation of the facing portion 45 is released to the outside of the individual flow path 47 through the specified groove 49. That is, the portion of the individual flow path 47 located on the nozzle hole 39A, 39B side with respect to the specified groove 49 in the Y direction functions as the pressure chambers 50A, 50B capable of ejecting ink, and the portion located on the opposite side of the nozzle hole 39A, 39B side with respect to the specified groove 49 in the Y direction functions as the non-ejection grooves 51A, 51B (no longer functions as a pressure chamber). This makes it possible to adjust the length (pump length) of the pressure chambers 50A, 50B without changing the dimension of the actuator plate 41 in the Y direction, and to adjust the ejection performance of the ink ejected through the nozzle holes 39A, 39B. Therefore, it is not necessary to manufacture the head chips 32 with dimensions according to the ejection performance. Therefore, the head chips 32 according to the required ejection performance can be manufactured easily and at low cost.

[0110] In head chip 32 according to the first embodiment, defining groove 49 extends linearly in the X direction and connects adjacent individual flow paths 47 to each other. According to this configuration, by forming the defining grooves 49 so as to communicate between the adjacent individual flow paths 47, the defining grooves 49 can be formed in the partition portion 46 all at once by performing a dicing process or the like on the partition portion 46. This makes it possible to further improve manufacturing efficiency.

[0111] In the head chip 32 according to the first embodiment, a driving electrode that generates an electric field in the facing portion 45 is provided in the facing portion 45, and only electrodes of the same polarity (common electrodes 81Aa, 81Ba) among the driving electrodes are formed on the lower surface (first surface) of the facing portion 45. According to this configuration, since only electrodes of the same polarity are formed on the lower surface of the facing portion 45, an increase in the risk of a short circuit due to the addition of the defining groove 49 can be suppressed.

[0112] In head chip 32 according to the first embodiment, the drive electrodes formed on the lower surface of facing portion 45 are common electrodes 81Aa and 81Ba that serve as reference potential GND. According to this configuration, even if the common electrodes 81Aa, 81Ba provided in adjacent individual flow paths 47 come into contact with each other via ink, no potential difference is generated between the electrodes, so that short-circuiting of the drive electrodes can be suppressed.

[0113] In the head chip 32 according to the first embodiment, an inlet common flow path 31b and an outlet common flow path 31c are provided on both sides of the individual flow paths 47 in the Y direction, the inlet common flow path 31b extending in the X direction and communicating with the multiple individual flow paths 47, and a specified groove 49 is provided in the partition portion 46 at a position spaced apart in the Y direction from the common flow paths 31b, 31c. According to this configuration, it is easy to freely set the position of the regulation groove 49 in the Y direction in the partition portion 46. This makes it possible to improve the degree of freedom in design.

[0114] In the head chip 32 according to the first embodiment, among the individual flow paths 47, adjacent individual flow paths 47 are defined as a first individual flow path 47a and a second individual flow path 47b, respectively, and among the nozzle holes 39A, 39B, the nozzle hole communicating with the first individual flow path 47a is defined as a nozzle hole (first injection hole) 39A, and the nozzle hole communicating with the second individual flow path 47b is defined as a nozzle hole (second injection hole) 39B. Then, of the first individual flow path 47a, a portion located on the +Y side (first side in the second direction) of the specified groove 49 constitutes a pressure chamber (first pressure chamber) 50A communicating with the nozzle hole 39A, and a portion of the second individual flow path 47b located on the -Y side (second side in the second direction) of the specified groove 49 constitutes a pressure chamber (second pressure chamber) 50B communicating with the nozzle hole 39B. According to this configuration, the nozzle holes 39A, 39B are distributed to both sides of the defined groove 49 in the Y direction between adjacent individual flow paths 47. That is, the nozzle holes 39A, 39B adjacent to each other in the X direction are arranged alternately in the Y direction. Therefore, the nozzle holes 39A, 39B can be arranged in a staggered manner without changing the chip size in the Y direction. Therefore, crosstalk between adjacent pressure chambers 50A, 50B can be suppressed. In addition, by staggering the pressure chambers 50A, 50B (nozzle holes 39A, 39B), it is easier to ensure the distance between the nozzle holes arranged on the same pressure chamber row 55A, 55B than by arranging the nozzle holes in a single row. Therefore, when ink is ejected from the nozzle holes 39A, 39B, it is possible to suppress the air flow generated between the head chip 32 and the recording medium P from affecting the ink ejected from the surrounding nozzle holes 39A, 39B. As a result, even if the gap between the head chip 32 and the recording medium P is increased, the variation in the ink landing position can be suppressed.

[0115] In the head chip 32 according to the first embodiment, the X-direction dimension of the pressure chamber 50A (wide portion 47a1) is larger than the X-direction dimension of the non-ejection groove 51B (narrow portion 47a2), and the X-direction dimension of the pressure chamber 50B (wide portion 47b2) is larger than the X-direction dimension of the non-ejection groove 51A (narrow portion 47b1). This configuration makes it possible to reduce pressure loss in each of the pressure chambers 50A, 50B while maintaining the arrangement pitch between the individual flow paths 47. This allows ink to flow smoothly in the pressure chambers 50A, 50B.

[0116] Since the inkjet head 5 and printer 1 of the first embodiment include the head chip 32 described above, it is possible to provide an inkjet head 5 and printer 1 with excellent reliability.

[0117] Second embodiment Fig. 22 is a cross-sectional view of head chip 32 according to the second embodiment. Fig. 23 is a bottom view of discharge unit 30 according to a third embodiment, showing the underside of actuator plate 41. Head chip 32 of the second embodiment differs from the above-described embodiments in that pressure chamber row 55 is in a single row. 22 and 23, the dimensions in each direction of the individual flow paths 47 are set to be equal. In the second embodiment, the nozzle hole 39a is provided at a position that overlaps with the center of each individual flow path 47 in the Y direction in a plan view.

[0118] 23, a first defining groove 149A and a second defining groove 149B are formed at both ends in the Y direction of the actuator plate 41. The first defining groove 149A is provided in a portion of the individual flow passage 47 that is located on the +Y side with respect to the nozzle hole 39a. The first defining groove 149A opens at the lower surface of the actuator plate 41 and extends so as to cross each partition portion 46 in the X direction. Therefore, the first defining groove 149A communicates between adjacent individual flow passages 47.

[0119] The second defining groove 149B is provided in a portion of the individual flow passage 47 that is located on the -Y side with respect to the nozzle hole 39a. The second defining groove 149B opens at the lower surface of the actuator plate 41 and extends so as to cross each partition portion 46 in the X direction. Therefore, the second defining groove 149B communicates between adjacent individual flow passages 47. The dimensions of the first defining groove 149A and the second defining groove 149B in each direction are set to be equal. However, the dimensions of the first defining groove 149A and the second defining groove 149B may be different.

[0120] In the head chip 32, the pressure chamber row 55 is configured with the pressure chambers 50 lined up in the X direction. The pressure chambers 50 are formed by the individual flow paths 47 and the first recesses 52, which are located between the first defined grooves 149A and the second defined grooves 149B. That is, the individual flow paths 47 and the first recesses 52, which are located outside the defined grooves 149A and 149B in the Y direction, function as non-pressure chambers separated from the pressure chambers 50. In the illustrated example, the dimension in the Y direction from the nozzle hole 39a to the first defined groove 149A is equal to the dimension in the Y direction from the nozzle hole 39a to the second defined groove 149B. That is, the nozzle hole 39a is located at the center of the pressure chambers 50 in the Y direction. Note that a non-ejection groove that does not communicate with the nozzle hole 39a may be formed between adjacent pressure chambers 50.

[0121] In the head chip 32 of the second embodiment, the inside and outside of the individual flow path 47 are communicated by the defined grooves 149A and 149B, so that the pressure fluctuation generated in the individual flow path 47 due to the deformation of the facing portion 45 is released to the outside of the individual flow path 47 through the defined grooves 149A and 149B. That is, the portion of the individual flow path 47 located on the nozzle hole 39a side in the Y direction with respect to the defined grooves 149A and 149B functions as a pressure chamber 50 capable of ejecting ink, and the portion located on the opposite side of the nozzle hole 39a side with respect to the defined grooves 149A and 149B in the Y direction functions as a non-pressure chamber (no longer functions as a pressure chamber). This makes it possible to adjust the length (pump length) of the pressure chamber 50 without changing the dimension of the actuator plate 41 in the Y direction, and to adjust the ejection performance of the ink ejected through the nozzle hole 39a. Therefore, it is not necessary to manufacture each head chip 32 with dimensions according to the ejection performance. Therefore, it is possible to easily and inexpensively manufacture the head chip 32 according to the required ejection performance. If the length of the pressure chamber 50 is short, it is easier to accommodate a high ejection frequency and it tends to eject ink droplets with a small drop volume, whereas if the length of the pressure chamber 50 is long, it tends to eject ink droplets with a large drop volume.

[0122] In head chip 32 of the second embodiment, the defining grooves include first defining groove 149A provided on the +Y side of nozzle hole 39a, and second defining groove 149B provided on the -Y side of nozzle hole 39a. According to this configuration, it is easy to freely set the positions of the regulating grooves 149A and 149B in the Y direction in the partition portion 46. This makes it possible to improve the degree of freedom in design.

[0123] In the head chip 32 of the second embodiment, the distance in the Y direction between the nozzle hole 39a and the first setting groove 149A is equal to the distance between the nozzle hole 39a and the second setting groove 149B. According to this configuration, pressure fluctuations on both sides of the nozzle hole 39a in the Y direction can be equalized, thereby improving the ejection performance. However, the distance in the Y direction between the nozzle hole 39a and the first defining groove 149A and the distance between the nozzle hole 39a and the second defining groove 149B may be different from each other.

[0124] Third embodiment FIG. 24 is a bottom view of the discharge unit 30 according to the third embodiment, showing the lower surface of the actuator plate 41. As shown in FIG. 24, the +Y side end of first defined groove 149A is open at the +Y side end face of actuator plate 41. That is, first defined groove 149A is connected to inlet common flow path 31b. The -Y side end of second defined groove 149B is open at the -Y side end face of actuator plate 41. That is, second defined groove 149B is connected to outlet common flow path 31c.

[0125] According to this configuration, the flow path cross-sectional area of ​​the connection portion of the individual flow path 47 with the common flow paths 31b, 31c can be increased, thereby reducing pressure loss at the connection portion and allowing ink to flow smoothly between the common flow paths 31b, 31c and the individual flow paths 47.

[0126] (Other variations) The technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present disclosure. For example, in the above embodiment, the inkjet printer 1 has been described as an example of a liquid jet recording apparatus, but the liquid jet recording apparatus is not limited to a printer. For example, the liquid jet recording apparatus may be a fax machine, an on-demand printer, or the like. In the above-described embodiment, a configuration in which the inkjet head moves relative to the recording medium during printing (so-called shuttle machine) has been described as an example, but the present disclosure is not limited to this configuration. The configuration according to the present disclosure may be adopted in a configuration in which the recording medium moves relative to the inkjet head while the inkjet head is fixed (so-called fixed head machine). In the above embodiment, the recording medium P is paper, but this is not limited to the above configuration. The recording medium P is not limited to paper, and may be a metal material, a resin material, or a food product. In the above-described embodiment, the liquid ejection head is mounted on the liquid ejection recording device, but the present invention is not limited to this configuration. In other words, the liquid ejected from the liquid ejection head is not limited to the liquid that is to be landed on the recording medium, and may be, for example, a medicinal liquid to be mixed in a medicine, a food additive such as a seasoning or a fragrance to be added to food, or an aromatic to be sprayed into the air.

[0127] In the above embodiment, the configuration has been described in which the Z direction coincides with the direction of gravity, but the present invention is not limited to this configuration, and the Z direction may be aligned with the horizontal direction.

[0128] In the above embodiment, the common electrodes 81a, 81b are formed on the lower surface side of the actuator plate 41, and the individual electrodes 82a to 82e are formed on the upper surface side of the actuator plate 41, but the present invention is not limited to this configuration. The individual electrodes may be formed on the lower surface side of the actuator plate 41, and the common electrode may be formed on the upper surface side of the actuator plate 41. Furthermore, the common electrode and the individual electrodes may be formed side by side on the same surface of the actuator plate 41. In the above embodiment, the actuator plate 41 is deformed in both the bend mode and the shear mode, but the present invention is not limited to this configuration. The actuator plate 41 may be deformed at least in the shear mode.

[0129] In the above embodiment, the configuration in which the facing portion 45 and the partition portion 46 are integrally formed has been described, but the present invention is not limited to this configuration. The facing portion 45 and the partition portion 46 may be formed as separate bodies. In this case, the actuator portion may be formed by the actuator plate 41, and the flow path defining portion may be formed by a flow path plate laminated on the actuator plate 41. In the above-described embodiment, the defining groove provides communication between adjacent individual flow paths, but the present invention is not limited to this configuration. The defining groove may provide communication between the individual flow paths and a common flow path (outside the individual flow paths).

[0130] In the above-described embodiment, the configuration in which one or two defining grooves communicate with one individual flow path has been described, but the present invention is not limited to this configuration. Three or more defining grooves may be formed. In the above embodiment, a configuration has been described in which one side of the defining groove 49 of one individual flow path 47 is a pressure chamber and the other side is a non-ejection groove, but this is not limited to the configuration. Both sides of the defining groove 49 may be pressure chambers. Furthermore, one individual flow path 47 may be divided into three or more pressure chambers (or non-ejection grooves).

[0131] In addition, within the scope of the present disclosure, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described modified examples may be combined as appropriate. [Explanation of symbols]

[0132] 1: Printer (liquid jet recording device) 5: Inkjet head (liquid ejection head) 31b: Inlet common flow channel (common flow channel) 31c: Outlet common flow path (common flow path) 32: Head chip 39: Nozzle plate (injection hole plate) 39a: Nozzle hole (injection hole) 39A: Nozzle hole (first nozzle hole) 39B: Nozzle hole (second nozzle hole) 41: Actuator plate (flow passage defining portion, actuator portion) 42: Support plate 45: Opposing part (actuator part) 46: Partition 46a: +X side partition (partition) 46b:-X side partition (partition) 47: Individual flow path 47a: First individual flow path 47b: Second individual flow path 49: Specified groove 50: Pressure chamber 50A: Pressure chamber (first pressure chamber) 50B: Pressure chamber (second pressure chamber) 81a: Common electrode (drive electrode) 81Aa, 81Ba: First common electrode (common electrode, driving electrode) 81Ab, 81Bb: second common electrode (common electrode, drive electrode) 149A: 1st regulation groove (regulation groove) 149B: 2nd regulation groove (regulation groove)

Claims

1. a flow path defining section having a plurality of partition sections spaced apart in a first direction, the flow path defining section defining a plurality of individual flow paths between adjacent partition sections among the plurality of partition sections, through which a liquid can flow in a second direction intersecting the first direction; an actuator unit that is superimposed on the flow path defining portion so as to face each of the plurality of individual flow paths in a third direction intersecting the second direction as viewed from the first direction, and that is deformable so as to enlarge or reduce an interior of each of the individual flow paths, a defining groove is formed in a portion of the partition portion in the second direction, the defining groove connecting an inside of one of the individual flow paths with an outside of the one of the individual flow paths; an injection hole plate is provided facing the actuator portion, the injection hole plate being formed with an injection hole communicating with the individual flow passage at a position shifted in the second direction from the specified groove, The defining groove extends linearly in the first direction and connects adjacent individual flow paths, a driving electrode for generating an electric field in the actuator section is provided in the actuator section; a head chip in which only electrodes of the same polarity among the driving electrodes are formed on a first surface of the actuator portion that faces the individual flow paths in the third direction;

2. 2. The head chip according to claim 1, wherein the drive electrode formed on the first surface is a common electrode that serves as a reference potential.

3. a common flow path extending in the first direction and communicating with the individual flow paths is provided on one side of the individual flow paths in the second direction; 3. The head chip according to claim 1, wherein the defining groove extends in the first direction and communicates with the common flow path at one end in the second direction.

4. a common flow path extending in the first direction and communicating with the individual flow paths is provided on one side of the individual flow paths in the second direction; 3. The head chip according to claim 1, wherein the defining groove is provided in the partition portion at a position spaced apart from the common flow path in the second direction.

5. A flow path defining section having a plurality of partition sections spaced apart in a first direction, the flow path defining section forming a plurality of individual flow paths between adjacent partition sections among the plurality of partition sections through which liquid can flow in a second direction intersecting the first direction; an actuator unit that is superimposed on the flow path defining portion so as to face each of the plurality of individual flow paths in a third direction intersecting the second direction as viewed from the first direction, and that is deformable so as to enlarge or reduce an interior of each of the individual flow paths, a defining groove is formed in a portion of the partition portion in the second direction, the defining groove connecting an inside of one of the individual flow paths with an outside of the one of the individual flow paths; an injection hole plate is provided facing the actuator portion, the injection hole plate being formed with an injection hole communicating with the individual flow passage at a position shifted in the second direction from the specified groove, The defining groove extends linearly in the first direction and connects adjacent individual flow paths, The defined groove is a first groove provided on a first side in the second direction with respect to the injection hole; a second groove provided on a second side in the second direction with respect to the injection hole.

6. The head chip according to claim 5 , wherein the distance between the ejection hole and the first defining groove in the second direction is equal to the distance between the ejection hole and the second defining groove.

7. A flow path defining section having a plurality of partition sections spaced apart in a first direction, the flow path defining section forming a plurality of individual flow paths between adjacent partition sections among the plurality of partition sections through which liquid can flow in a second direction intersecting the first direction; an actuator unit that is superimposed on the flow path defining portion so as to face each of the plurality of individual flow paths in a third direction intersecting the second direction as viewed from the first direction, and that is deformable so as to enlarge or reduce an interior of each of the individual flow paths, a defining groove is formed in a portion of the partition portion in the second direction, the defining groove connecting an inside of one of the individual flow paths with an outside of the one of the individual flow paths; an injection hole plate is provided facing the actuator portion, the injection hole plate being formed with an injection hole communicating with the individual flow passage at a position shifted in the second direction from the specified groove, The defining groove extends linearly in the first direction and connects adjacent individual flow paths, Among the individual flow paths, adjacent individual flow paths are defined as a first individual flow path and a second individual flow path, Among the injection holes, the injection hole communicating with the first individual flow path is referred to as a first injection hole, and the injection hole communicating with the second individual flow path is referred to as a second injection hole, a portion of the first individual flow path that is located on a first side in the second direction with respect to the defining groove constitutes a first pressure chamber that communicates with the first injection hole, a portion of the second individual flow path that is located on a second side in the second direction with respect to the defined groove constitutes a second pressure chamber that communicates with the second injection hole, a dimension in the first direction of the first pressure chamber is larger than a dimension in the first direction of a portion of the first individual flow path that is located on a second side in the second direction with respect to the specified groove, A head chip in which the dimension in the first direction of the second pressure chamber is larger than the dimension in the first direction of a portion of the second individual flow path that is located on a first side in the second direction with respect to the defined groove.

8. A liquid jet head comprising the head chip according to claim 1 or 2.

9. A liquid jet recording apparatus comprising the liquid jet head according to claim 8.

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