Sample Support

By designing sample support with pores and conductive layers, the analysis complexity and accuracy reduction caused by uneven sample adhesion is solved, and efficient and high-precision sample analysis is achieved.

JP7626666B2Active Publication Date: 2025-02-04HAMAMATSU PHOTONICS KK
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Patent Information

Application Number
JP2021094187
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-06-04
Publication Date
2025-02-04
Estimated Expiration
2041-06-04

AI Technical Summary

Technical Problem

In the prior art, when the sample is attached to multiple sample support, the amount and state of the sample are uneven, resulting in a decrease in the analysis accuracy and the analysis process is complicated.

Method used

A sample support is designed, a substrate with multiple holes, divided into a second measurement area without a conductive layer and a first measurement area with a conductive layer. By pressing the sample support at one time, the sample support can be attached to both areas at the same time, the conductive layer is used for efficient ionization analysis of the sample, and optical analysis is performed through the light-transmitting area.

Benefits of technology

It realizes efficient and high-precision sample analysis, reduces the unevenness of adhesion amount, and improves the accuracy and efficiency of the analysis.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a sample support which enables highly efficient and highly accurate analysis of a sample.SOLUTION: A sample support 1A includes a substrate 2. The substrate 2 has a first surface 2a and a plurality of holes 2c that open in the first surface 2a. The substrate 2 has a first measurement region R1 and a second measurement region R2. The first measurement region R1 includes a first surface region 21a of the first surface 2a. The second measurement region R2 includes a second surface region 22a of the first surface 2a. A conductive layer 5 is provided in the first surface region 21a so as not to block the holes 2c. The conductive layer 5 is not provided in the second surface region 22a.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present disclosure relates to a sample support. [Background technology]

[0002] There is known a technique related to a sample support used in mass spectrometry of a sample (see, for example, Patent Document 1). In the technique described in Patent Document 1, a laser beam is irradiated onto a sample attached to a fine uneven structure surface of a sample support, thereby ionizing the sample, and thereby mass spectrometry of the sample is performed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4674875 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned technique, when performing different analyses on a sample, the sample must be attached to each of a plurality of sample supports, which may make the work complicated. Furthermore, when the sample is attached to each of a plurality of sample supports, there may be variations in the amount of sample attached to each sample support or the state of the sample attached to each sample support, which may result in a decrease in the accuracy of the analysis of the sample.

[0005] An object of the present disclosure is to provide a sample support that enables highly efficient and highly accurate analysis of a sample. [Means for solving the problem]

[0006] A sample support according to one aspect of the present disclosure is a sample support used for ionizing a sample, comprising a substrate having a surface and a plurality of holes opening into the surface, the substrate having at least a first measurement region including a first surface region of the surface and a second measurement region including a second surface region of the surface, a first conductive layer being provided on the first surface region so as not to block the holes, and the second surface region not being provided with the first conductive layer.

[0007] In this sample support, the substrate has a first measurement region and a second measurement region. Thus, by pressing the sample support against the sample once, the sample can be attached to both the first measurement region and the second measurement region. Moreover, a first conductive layer is provided on the first surface region of the first measurement region, and the first conductive layer is not provided on the second surface region of the second measurement region. Thus, in the first measurement region, for example, mass analysis of the sample can be performed by irradiating the first surface region with an energy beam, and in the second measurement region, an analysis of the sample different from that in the first measurement region can be performed. In this way, according to this sample support, different analyses of the sample can be efficiently performed by one sample support. Furthermore, by pressing the sample support against the sample once, the sample can be attached to both the first measurement region and the second measurement region, so that the variation between the amount of the sample attached to the first measurement region and the amount of the sample attached to the second measurement region can be suppressed. Thus, the analysis in the first measurement region and the second measurement region can be performed with high accuracy. As described above, according to this sample support, it is possible to perform an analysis of the sample with high efficiency and high accuracy.

[0008] The first conductive layer may be made of a material suitable for mass analysis of a sample, which allows the mass analysis of the sample to be suitably carried out in the first measurement region.

[0009] The second measurement area is optically transparent, and the second surface area of ​​the second measurement area and the surface area of ​​the second measurement area opposite to the second surface area may be exposed, whereby the second measurement area transmits light, thereby enabling the light transmittance of the sample attached to the second measurement area to be analyzed.

[0010] The thickness of the substrate may be 5 μm to 50 μm, which ensures the strength of the substrate and the light transmittance of the second measurement region.

[0011] A second conductive layer may be provided on the second surface region of the second measurement region so as not to block the holes and which is made of a different material from the first conductive layer, thereby allowing a different analysis of the sample to be performed in the second measurement region than in the first measurement region.

[0012] The first and second measurement regions may be connected to each other, which can more reliably suppress variation in the amount of sample adhering to the first and second measurement regions while ensuring the areas of the first and second measurement regions.

[0013] The sample support may further include a partition provided between the first and second measurement regions, thereby making it possible to reinforce the strength of the substrate while clarifying the boundary between the first and second measurement regions.

[0014] The substrate may further have a third measurement area including a third surface area of ​​the surface, and the third surface area may be provided with a third conductive layer that does not block the holes and is made of a different material from the first conductive layer, thereby allowing an analysis of the sample to be performed in the third measurement area different from that in the first measurement area.

[0015] The substrate may be rectangular and have a plurality of calibration regions located at different corners of the substrate when viewed in the thickness direction of the substrate, thereby making it possible to perform calibration corresponding to analysis in each measurement region while ensuring the area of ​​each measurement region. Effect of the Invention

[0016] According to the present disclosure, it is possible to provide a sample support that enables highly efficient and highly accurate analysis of a sample. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a plan view of a sample support according to the first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view of the sample support taken along line II-II in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view of the sample support taken along line III-III in FIG. [Figure 4] FIG. 4 shows an enlarged image of the substrate of the sample support of FIG. [Diagram 5] FIG. 5 is a diagram showing a comparison result between the light transmittance of a portion including the first measurement region and the first conductive layer and the light transmittance of a second measurement region of the sample support in FIG. [Figure 6] FIG. 6 is a diagram showing some of the steps of a mass spectrometry method using the sample support of FIG. [Figure 7] FIG. 7 is a diagram showing some of the steps of a mass spectrometry method using the sample support of FIG. [Figure 8] FIG. 8 is a diagram showing some of the steps of a mass spectrometry method using the sample support of FIG. [Figure 9] FIG. 9 is a diagram showing some of the steps of a mass spectrometry method using the sample support of FIG. [Figure 10] FIG. 10 is a plan view of the sample support of the second embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12]FIG. 12 is a plan view of a sample support according to a first modified example. [Figure 13] FIG. 13 is a plan view of a sample support according to a second modified example. [Figure 14] FIG. 14 is a schematic cross-sectional view taken along line XIV-XIV in FIG. [Figure 15] FIG. 15 is a plan view of a sample support according to a third modified example. [Figure 16] FIG. 16 is a schematic cross-sectional view taken along line XVI-XVI in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted. Note that in the drawings, some parts are exaggerated in order to easily explain the characteristic parts according to the embodiment, and may differ from the actual dimensions.

[0019] [First embodiment] [Configuration of sample support] A sample support 1A of the first embodiment will be described with reference to Figs. 1 to 4. The sample support 1A is an ionization-assisting substrate used for ionizing a sample. In this embodiment, the sample support 1A is used for ionizing a sample applied to human skin (skin surface). More specifically, the sample support 1A is pressed against the sample applied to the human skin, thereby attaching the sample to the sample support 1A. Thereafter, the sample support 1A to which the sample is attached is ionized by irradiating an energy beam such as a laser beam. Examples of samples include medicines and cosmetics.

[0020] As shown in Figs. 1 to 3, the sample support 1A includes a substrate 2, a frame 3, and a conductive layer (first conductive layer) 5. As shown in Fig. 1, the sample support 1A has a substantially rectangular shape in a plan view. In this embodiment, the direction along the long side of the sample support 1A is represented as the X-axis direction, the direction along the short side of the sample support 1A is represented as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction (i.e., the thickness direction of the sample support 1A) is represented as the Z-axis direction. As an example, the length of the sample support 1A in the X-axis direction is about 3 cm, and the length in the Y-axis direction is about 2 cm.

[0021] The substrate 2 has a first surface 2a and a second surface 2b opposite to the first surface 2a. As shown in FIG. 3, a plurality of holes 2c are uniformly (uniformly distributed) formed in the substrate 2. Each hole 2c extends along the thickness direction D of the substrate 2 (the direction in which the first surface 2a and the second surface 2b face each other and coincide with the Z-axis direction) and opens in the first surface 2a and the second surface 2b. That is, each hole 2c is a through hole penetrating the substrate 2. Note that the holes 2c are not shown in FIG. 2. The first surface 2a is a surface that is irradiated with an energy beam such as a laser beam in a process of ionizing components of a sample attached to the sample support 1A.

[0022] The substrate 2 has a rectangular plate shape. When viewed from the thickness direction D, the length of one side of the substrate 2 is, for example, about several centimeters. The thickness of the substrate 2 is, for example, about 1 μm to 50 μm. As an example, the thickness of the substrate 2 is 5 μm to 50 μm. The thickness of the substrate 2 is preferably 5 μm to 20 μm. This can reliably ensure the light transmittance of the substrate 2, which will be described later. When viewed from the thickness direction D, the shape of the hole 2c is, for example, substantially circular. The width of the hole 2c is, for example, about 1 nm to 700 nm. The substrate 2 is made of an insulating material.

[0023] The width of the hole 2c is a value obtained as follows. First, images of the first surface 2a and the second surface 2b of the substrate 2 are obtained. FIG. 4 shows an example of an SEM image of a part of the first surface 2a of the substrate 2. In the SEM image, the black parts are the holes 2c, and the white parts are the partitions between the holes 2c. Next, the image of the first surface 2a obtained is subjected to, for example, a binarization process to extract a plurality of pixel groups corresponding to a plurality of first openings (openings of the holes 2c on the first surface 2a side) in the measurement region R, and the diameter of a circle having an average area of ​​the first openings is obtained based on the size per pixel. Similarly, the image of the second surface 2b obtained is subjected to, for example, a binarization process to extract a plurality of pixel groups corresponding to a plurality of second openings (openings of the holes 2c on the second surface 2b side) in the measurement region R, and the diameter of a circle having an average area of ​​the second openings is obtained based on the size per pixel. Then, the average value of the diameter of the circle obtained for the first surface 2a and the diameter of the circle obtained for the second surface 2b is obtained as the width of the hole 2c.

[0024] As shown in FIG. 4, a plurality of holes 2c having a substantially constant width are uniformly formed in the substrate 2. The substrate 2 shown in FIG. 4 is an alumina porous film formed by anodizing Al (aluminum). For example, an anodizing process is performed on an Al substrate, whereby a surface portion of the Al substrate is oxidized and a plurality of pores (portions to become the pores 2c) are formed in the surface portion of the Al substrate. The oxidized surface portion (anodized film) is then peeled off from the Al substrate, and a pore widening process is performed on the peeled anodized film to widen the pores, thereby obtaining the substrate 2. The substrate 2 may be formed by anodizing a valve metal other than Al, such as Ta (tantalum), Nb (niobium), Ti (titanium), Hf (hafnium), Zr (zirconium), Zn (zinc), W (tungsten), Bi (bismuth), or Sb (antimony), or may be formed by anodizing Si (silicon).

[0025] The frame 3 is provided on the first surface 2a of the substrate 2, and supports the substrate 2 on the first surface 2a side. The frame 3 has a first surface 3h facing the first surface 2a of the substrate 2, and a second surface 3g opposite to the first surface 3h. In this embodiment, the frame 3 is formed in a rectangular plate shape larger than the substrate 2 when viewed from the thickness direction D.

[0026] An opening 3a penetrating in the thickness direction of the frame 3 (i.e., thickness direction D) is formed in approximately the center of the frame 3. Openings 31b, 32b penetrating in the thickness direction of the frame 3 are formed in a pair of opposing corners of the frame 3. A recess 3d recessed inward in the X-axis direction is provided in the center of an edge 3c in the X-axis direction (i.e., an edge along the Y-axis direction) of the frame 3.

[0027] The opening 3a is formed in a substantially circular shape. In this embodiment, the opening 3a has a shape in which a part of a circle (parts facing each other in one direction) is cut out in an arch shape. Specifically, the opening 3a has a shape in which a part of a circle is cut out in an arch shape so that both edges in the Y-axis direction are parallel to the X-axis direction. As an example, the width of the opening 3a in the Y-axis direction is about 1.5 cm. The part of the substrate 2 corresponding to the opening 3a (i.e., the part overlapping with the opening 3a when viewed from the thickness direction D) functions as a measurement region R for measuring the sample. That is, the measurement region R is defined by the opening 3a provided in the frame 3. In other words, the opening 3a opens on the first surface 3h and the second surface 3g so as to correspond to the measurement region R. That is, the frame 3 is formed so as to surround the measurement region R of the substrate 2 when viewed from the thickness direction D.

[0028] The openings 31b and 32b are formed in a circular shape smaller than the opening 3a. As an example, the diameter of the openings 31b and 32b is about 1 mm. The portions of the substrate 2 corresponding to the openings 31b and 32b (i.e., the portions overlapping with the openings 31b and 32b when viewed from the thickness direction D) function as calibration regions C1 and C2 for calibration.

[0029] As described above, since the holes 2c are uniformly formed in the substrate 2, both the measurement region R and the calibration regions C1 and C2 are regions that include the holes 2c. The aperture ratio of the holes 2c in the measurement region R (the ratio of the holes 2c to the measurement region R when viewed from the thickness direction D) is practically 10 to 80%, and preferably 60 to 80%. The holes 2c may be of different sizes, or the holes 2c may be partially connected to each other. The same applies to the calibration regions C1 and C2.

[0030] The frame 3 is, for example, a metal or a ceramic. In this embodiment, the frame 3 is formed of a material that is non-magnetic and acid-resistant. Examples of such materials include titanium and stainless steel (SUS). In this embodiment, the frame 3 is formed of SUS. The outer shape of the sample support 1A is determined mainly by the frame 3. The length of the frame 3 in the X-axis direction is about 3 cm, and the length of the frame 3 in the Y-axis direction is about 2 cm. The thickness of the frame 3 is, for example, 3 mm or less. As an example, the thickness of the frame 3 is 0.2 mm.

[0031] 1, when viewed from the thickness direction D, the substrate 2 is contained between a pair of edges 3e along the X-axis direction of the frame 3, and is also contained between the bottoms 3f of a pair of recesses 3d of the frame 3. Portions of the substrate 2 other than the measurement region R and the calibration regions C1, C2 are joined to the frame 3 by an adhesive layer 6. By joining and supporting the substrate 2 to the frame 3 in this manner, handling of the sample support 1A is facilitated, and deformation of the substrate 2 due to temperature changes and the like is suppressed.

[0032] As shown in FIG. 3, the frame 3 is bonded to the first surface 2a of the substrate 2 by an adhesive layer 6. The adhesive layer 6 is formed between the first surface 2a of the substrate 2 and the first surface 3h of the frame 3, and bonds the substrate 2 and the frame 3. In FIG. 2, the adhesive layer 6 is omitted. The adhesive layer 6 may be formed of, for example, an adhesive that emits less gas (for example, low-melting-point glass, vacuum adhesive, etc.). The adhesive layer 6 may be formed of a conductive adhesive, or may be formed by applying a metal paste. The adhesive layer 6 may be formed of a UV-curable adhesive (photo-curable adhesive) or an inorganic binder, etc. Examples of the UV-curable adhesive include acrylic adhesives and epoxy adhesives. Examples of the inorganic binder include Ceramabond (registered trademark) manufactured by Odec Co., Ltd. and Aronceramic (registered trademark) manufactured by Toagosei Co., Ltd. As an example, in this embodiment, the adhesive layer 6 is formed of a UV-curable adhesive.

[0033] The conductive layer 5 is provided on the first surface 2a of the substrate 2. As shown in FIG. 3, the conductive layer 5 is formed continuously (integrally) on a part of the region of the first surface 2a of the substrate 2 corresponding to the opening 3a of the frame 3 (i.e., a part of the measurement region R), the inner surface of the opening 3a, and the second surface 3g of the frame 3 at the periphery of the opening 3a. The conductive layer 5 covers the part of the first surface 2a of the substrate 2 where the holes 2c are not formed in the measurement region R. That is, the conductive layer 5 is provided so as not to block each hole 2c. Therefore, in the measurement region R, each hole 2c is exposed to the opening 3a. The conductive layer 5 is also formed continuously (integrally) on the region of the first surface 2a of the substrate 2 corresponding to the opening 31b of the frame 3 (i.e., the calibration region C1), the inner surface of the opening 31b, and the second surface 3g of the frame 3 at the periphery of the opening 31b. The conductive layer 5 covers the part of the first surface 2a of the substrate 2 where the holes 2c are not formed in the calibration region C1. That is, the conductive layer 5 is provided so as not to block the holes 2c. Therefore, in the calibration region C1 as well, similarly to the measurement region R, the holes 2c are exposed to the openings 31b.

[0034] The conductive layer 5 is made of a conductive material. The conductive layer 5 is made of a material suitable for mass spectrometry of a sample. Specifically, the conductive layer 5 is made of, for example, Pt (platinum) or Au (gold). For the reasons described below, it is preferable to use, as the material of the conductive layer 5, a metal that has low affinity (reactivity) with the sample and high conductivity.

[0035] For example, if the conductive layer 5 is made of a metal such as Cu (copper) that has a high affinity with a sample such as a protein, the sample may be ionized in a state in which Cu atoms are added to the sample molecules during the ionization process described below, and the detection results may be shifted by the amount of the added Cu atoms in the mass spectrometry method described below. Therefore, it is preferable to use a metal that has a low affinity with the sample as the material for the conductive layer 5.

[0036] On the other hand, the higher the conductivity of the metal, the easier and more stable the application of a constant voltage. Therefore, when the conductive layer 5 is made of a metal with high conductivity, it becomes possible to uniformly apply a voltage to the first surface 2a of the substrate 2 in the measurement region R. In addition, the higher the conductivity of the metal, the higher the thermal conductivity tends to be. Therefore, when the conductive layer 5 is made of a metal with high conductivity, it becomes possible to efficiently transmit the energy of the laser light (energy ray) irradiated to the substrate 2 to the sample via the conductive layer 5. Therefore, it is preferable to use a metal with high conductivity as the material for the conductive layer 5.

[0037] From the above viewpoints, it is preferable to use, for example, Pt, Au, etc. as the material of the conductive layer 5. In this embodiment, the conductive layer 5 is Pt. The conductive layer 5 is formed to a thickness of about 1 nm to 350 nm by, for example, deposition or sputtering. Note that, for example, Cr (chromium), Ni (nickel), Ti (titanium), Ag (silver), etc. may be used as the material of the conductive layer 5.

[0038] The sample support 1A is fixed to a slide glass (reinforcing substrate) 8 by a conductive tape 4. The conductive tape 4 is made of a conductive material. The conductive tape 4 is, for example, an aluminum tape, a carbon tape, or the like. The thickness of the conductive tape 4 is, for example, 100 μm.

[0039] The conductive tape 4 is attached onto the second surface 3g of the frame 3. In this embodiment, the conductive tape 4 is provided on both sides of the frame 3 in the X-axis direction. Specifically, the conductive tape 4 has a conductive tape 41 provided on one side of the frame 3 in the X-axis direction (the left side in FIG. 1 ) and a conductive tape 42 provided on the other side of the frame 3 in the X-axis direction (the right side in FIG. 1 ).

[0040] The conductive tape 41 is provided on one side (the left side in FIG. 1) of the center in the X-axis direction of the frame 3 so as not to cover the measurement region R and the calibration region C2. The conductive tape 42 is provided with a circular opening 41a for exposing the calibration region C2. As shown in FIG. 1, in this embodiment, the edge of the conductive tape 41 is slightly spaced from the edges 3c and 3e of the frame 3, the edge of the opening 3a of the frame 3, and the edge of the opening 32b of the frame 3. On the other hand, the conductive tape 41 is also provided at a position overlapping with the space formed by the recess 3d of the frame 3 when viewed from the thickness direction D. That is, the conductive tape 41 has a portion 4b that does not overlap with the frame 3 when viewed from the thickness direction D (i.e., a portion that overlaps with the space formed by the recess 3d).

[0041] The conductive tape 42 is provided on the other side (the right side in FIG. 1) of the center in the X-axis direction of the frame 3 so as not to cover the measurement region R and the calibration region C1. The conductive tape 42 is provided with a circular opening 42a for exposing the calibration region C1. As shown in FIG. 1, in this embodiment, the edges of the conductive tape 42 are slightly spaced from the edges 3c and 3e of the frame 3, the edge of the opening 3a of the frame 3, and the edge of the opening 31b of the frame 3. On the other hand, the conductive tape 42 is also provided at a position overlapping the recess 3d of the frame 3 when viewed from the thickness direction D. That is, the conductive tape 42 has a portion 4b that does not overlap the frame 3 when viewed from the thickness direction D (i.e., a portion that overlaps with the space formed by the recess 3d). The portions 4b of the conductive tapes 41 and 42 are attached to the mounting surface 8a of the slide glass 8, thereby fixing the sample support 1A to the slide glass 8.

[0042] The slide glass 8 is a glass substrate on which a transparent conductive film such as an ITO (Indium Tin Oxide) film is formed, and the surface of the transparent conductive film serves as a mounting surface 8a. The slide glass 8 is fixed to the substrate 2 so as to cover at least the entire second surface 2b of the measurement region R of the substrate 2. As an example, the slide glass 8 has a rectangular shape larger than the outer shape of the frame 3 when viewed from the thickness direction D (Z-axis direction). That is, when viewed from the thickness direction D, all elements (substrate 2, frame 3, etc.) constituting the above-mentioned sample support 1A are contained within the slide glass 8. That is, the slide glass 8 covers not only the measurement region R but also the entire substrate 2. The sample support 1A is reinforced by the slide glass 8. Note that a substrate other than the slide glass 8 may be used as the reinforcing substrate of the sample support 1A.

[0043] Next, the substrate 2 and the measurement area R will be described in detail. The substrate 2 is optically transparent. Specifically, the partitions between the holes 2c of the substrate 2 are optically transparent. The substrate 2 is formed of an optically transparent material. The light is, for example, ultraviolet light or visible light. As described above, the measurement area R is defined by the opening 3a of the frame 3. The measurement area R is a part of the substrate 2. That is, the measurement area R includes a part of the first surface 2a, a part of the second surface 2b, and the plurality of holes 2c.

[0044] The measurement region R has a first measurement region R1 and a second measurement region R2. When viewed from the thickness direction D, the first measurement region R1 is approximately half of the measurement region R on one side (the lower side in FIG. 1) in the Y-axis direction. When viewed from the thickness direction D, the second measurement region R2 is approximately half of the measurement region R on the other side (the upper side in FIG. 1) in the Y-axis direction. The first measurement region R1 and the second measurement region R2 are connected to each other. Specifically, the first measurement region R1 and the second measurement region R2 are each a part of the substrate 2 that is continuous with each other. That is, the first measurement region R1 and the second measurement region R2 are not separated from each other. The first measurement region R1 and the second measurement region R2 are not separated from each other by any other region. The boundary line B between the first measurement region R1 and the second measurement region R2 extends linearly along the X-axis direction.

[0045] The first measurement region R1 includes the first surface region 21a of the first surface 2a. The first surface region 21a is provided with a conductive layer 5. The second measurement region R2 includes the second surface region 22a of the first surface 2a. The second surface region 22a is not provided with a conductive layer 5. The second surface region 22a is exposed. That is, no film is formed on the second surface region 22a. A surface region (a part of the second surface 2b of the substrate 2) on the opposite side to the second surface region 22a in the second measurement region R2 is exposed. That is, no film is formed on the surface region on the opposite side to the second surface region 22a in the second measurement region R2. In this embodiment, the entire second surface 2b of the substrate 2 is exposed. That is, no film is formed on the entire second surface 2b.

[0046] The portion of the sample support 1A corresponding to the second measurement region R2 transmits light. For example, light irradiated onto the second measurement region R2 from one side of the sample support 1A in the thickness direction D transmits through the sample support 1A and exits toward the other side of the sample support 1A in the thickness direction D. As shown in FIG. 5, the light transmittance of the portion of the sample support 1A corresponding to the second measurement region R2 is greater than the light transmittance of the portion of the sample support 1A corresponding to the first measurement region R1. This is because the light irradiated onto the second measurement region R2 transmits through the sample support 1A, whereas the light irradiated onto the first measurement region R1 is blocked by the conductive layer 5.

[0047] The calibration areas C1 and C2 are parts of the substrate 2. That is, the calibration areas C1 and C2 include a part of the first surface 2a, a part of the second surface 2b, and a plurality of holes 2c. The calibration areas C1 and C2 are located at different corners of the substrate 2. The calibration area C1 is adjacent to the first measurement area R1. Specifically, the calibration area C1 is located on the opposite side of the second measurement area R2 with respect to the boundary line B between the first measurement area R1 and the second measurement area R2 when viewed from the thickness direction D. The calibration area C1 is located at one corner of the substrate 2 adjacent to the first measurement area R1 when viewed from the thickness direction D. A conductive layer 5 is provided on the surface area (a part of the first surface 2a) of the calibration area C1.

[0048] The calibration area C1 can be used as an area for mass calibration. For example, before starting a sample measurement (mass spectrometry method described later), a mass calibration sample (e.g., peptides, etc.) is placed in the calibration area C1 and the measurement is performed, thereby making it possible to correct the mass spectrum. By performing such mass spectrum correction before the measurement of the sample to be measured, it becomes possible to obtain an accurate mass spectrum of the sample to be measured when the sample to be measured is measured.

[0049] The calibration region C2 is adjacent to the second measurement region R2. Specifically, when viewed from the thickness direction D, the calibration region C2 is located on the opposite side to the first measurement region R1 with respect to the boundary line B between the first measurement region R1 and the second measurement region R2. When viewed from the thickness direction D, the calibration region C2 is located at one corner of the substrate 2 adjacent to the second measurement region R2. The conductive layer 5 is not provided on the surface region of the calibration region C2 (part of the first surface 2a). The surface region of the calibration region C2 is exposed. In other words, no film is formed on the surface region of the calibration region C2.

[0050] The calibration area C2 can be used as a background measurement area. For example, the light transmittance of the calibration area C2 where no sample is attached and the slide glass 8 is measured, and the light transmittance of the second measurement area R2 where a sample is attached and the slide glass 8 is measured, and then the difference between these light transmittances is calculated to obtain the light transmittance of only the sample. Note that a part of the second measurement area R2 may be used as the background measurement area. In this case, it is preferable to provide a mask or the like in advance to prevent the sample from adhering to the background measurement area.

[0051] [Mass spectrometry method] Next, an example of a mass spectrometry method (including an ionization method) using the sample support 1A will be described with reference to Figures 6 to 9. Note that the hole 2c, the conductive layer 5, and the adhesive layer 6 are omitted from Figures 6 to 9.

[0052] First, the above-mentioned sample support 1A is prepared in advance. Then, as shown in FIG. 6, the sample S is applied onto the human skin 50 (the surface of the skin 50). The skin 50 is the skin of any part of the human body. The skin 50 can be determined according to the type and usage of the sample S. For example, if the sample S is a medicine or the like to be applied to the face, the skin 50 may be the skin of the forehead. Also, if the sample S is a sunscreen cream or the like, the skin 50 may be the skin of the arm. Also, before applying the sample S, the surface of the skin 50 may be disinfected with alcohol or the like. Alternatively, if the sample S is a cosmetic or the like and it is desired to analyze the state of the sample S during normal use (i.e., the state in which sebum and the sample S are mixed), the disinfection of the skin 50 before applying the sample S may not be performed.

[0053] Next, with the first surface 2a of the substrate 2 facing the sample S applied to the human skin 50, the sample support 1A is pressed against the skin 50 to attach the sample S to the measurement region R. In other words, the sample S is transferred to the measurement region R. For example, in order to attach a sufficient amount of sample to the measurement region R of the sample support 1A, it may be necessary to press the sample support 1A against the sample S with a relatively large force. Meanwhile, the substrate 2 of the sample support 1A is very thin. For this reason, if the force with which the sample support 1A is pressed against the sample S on the skin 50 is too strong, the substrate 2 (part of the measurement region R) may be damaged.

[0054] Since the sample support 1A is reinforced by the glass slide 8, damage to the sample support 1A (particularly the substrate 2) in the step of attaching the sample S to the sample support 1A can be effectively suppressed. More specifically, since the strength of the portion of the substrate 2 including the measurement region R can be increased by the glass slide 8 as a reinforcing substrate, damage to the sample support 1A (substrate 2) can be suitably suppressed in the step of attaching the sample S and in the subsequent step of detaching the sample support 1A from the skin 50.

[0055] As shown in FIG. 7, component S1, which is a part of sample S on skin 50, adheres to measurement region R. Component S1 adheres to both first measurement region R1 and second measurement region R2. Component S1 adheres to both first measurement region R1 and second measurement region R2 by one sampling, that is, by pressing sample support 1A against sample S once. Therefore, the amount of component S1 adhering to first measurement region R1 and the amount of component S1 adhering to second measurement region R2 are approximately the same. The amount of component S1 adhering to measurement region R refers to the amount of component S1 per unit area.

[0056] 8, the sample support 1A is mounted on the support portion 12 of the mass spectrometer 10 while being previously integrated with the slide glass 8. The sample support 1A may be fixed to the slide glass 8 by conductive tapes 41, 42, or may be fixed to the slide glass 8 via, for example, a double-sided tape or the like.

[0057] The mass spectrometer 10 includes a support 12, a sample stage 18, a camera 16, an irradiation unit 13, a voltage application unit 14, an ion detection unit 15, and a control unit 17. The support 12 is placed on the sample stage 18. The irradiation unit 13 irradiates an energy beam such as a laser beam L onto the first surface 2a of the sample support 1A. The voltage application unit 14 applies a voltage to the first surface 2a of the sample support 1A. The ion detection unit 15 detects components of the ionized sample S (sample ions S2). The camera 16 is a device for acquiring a camera image including the position irradiated with the laser beam L by the irradiation unit 13. The camera 16 is, for example, a small CCD camera associated with the irradiation unit 13.

[0058] The control unit 17 controls the operations of the sample stage 18, the camera 16, the irradiation unit 13, the voltage application unit 14, and the ion detection unit 15. The control unit 17 is, for example, a computer device including a processor (for example, a CPU, etc.) and a memory (for example, a ROM, a RAM, etc.).

[0059] Next, the voltage application unit 14 applies a voltage to the conductive layer 5 (see FIG. 2) of the sample support 1A via the mounting surface 8a of the slide glass 8 and the conductive tape 4. Next, the control unit 17 operates the irradiation unit 13 based on the image acquired by the camera 16. Specifically, the control unit 17 operates the irradiation unit 13 so that the laser light L is irradiated onto the first surface 2a within the laser irradiation range (for example, a region of the first measurement region R1 where the component S1 identified based on the image acquired by the camera 16 exists).

[0060] As an example, the control unit 17 moves the sample stage 18 and controls the irradiation operation (irradiation timing, etc.) of the laser light L by the irradiation unit 13. That is, the control unit 17 confirms that the sample stage 18 has moved a predetermined distance, and then causes the irradiation unit 13 to irradiate the laser light L. For example, the control unit 17 repeats the movement (scanning) of the sample stage 18 and the irradiation of the laser light L by the irradiation unit 13 so as to raster scan the laser irradiation range. Note that the irradiation position on the first surface 2a may be changed by moving the irradiation unit 13 instead of the sample stage 18, or by moving both the sample stage 18 and the irradiation unit 13.

[0061] In this manner, by applying a voltage to the conductive layer 5 and irradiating the first surface 2a within the laser irradiation range with the laser light L, the component S1 attached to the first measurement region R1 is ionized, and sample ions S2 (ionized component S1) are emitted. Specifically, energy is transferred from the conductive layer 5 that has absorbed the energy of the laser light L to the component S1 attached to the first measurement region R1, and the component S1 that has acquired the energy is vaporized and acquires an electric charge, becoming the sample ion S2. The above steps correspond to a method for ionizing component S1 using the sample support 1A (here, as an example, a laser desorption ionization method as part of a mass spectrometry method).

[0062] The released sample ions S2 move while accelerating toward a ground electrode (not shown) provided between the sample support 1A and the ion detection unit 15. That is, the sample ions S2 move while accelerating toward the ground electrode due to a potential difference generated between the conductive layer 5 to which a voltage is applied and the ground electrode. Then, the sample ions S2 are detected by the ion detection unit 15.

[0063] The detection result of the sample ions S2 by the ion detection unit 15 is associated with the irradiation position of the laser light L. Specifically, the ion detection unit 15 detects the sample ions S2 individually for each position within the laser irradiation range. As a result, a distribution image (MS mapping data) showing the mass distribution of the sample S is acquired. Furthermore, the two-dimensional distribution of the molecules constituting the sample S can be imaged. In other words, imaging mass analysis can be performed. Note that the mass spectrometer 10 here is a mass spectrometer that utilizes time-of-flight mass spectrometry (TOF-MS).

[0064] Next, the light transmittance of the component S1 attached to the second measurement region R2 is measured. Specifically, as shown in FIG. 9, the sample support 1A is placed on a support 23 of a light measurement device 20 while being fixed to a slide glass 8. The light measurement device 20 includes a light source 21, a light detection unit 22, and a support 23. The light source 21 irradiates light such as ultraviolet light U onto the first surface 2a of the sample support 1A. The light detection unit 22 detects the ultraviolet light U that has passed through the sample support 1A. The operations of the light source 21, the light detection unit 22, and the support 23 are controlled by a control unit. The control unit is a computer device having a configuration similar to that of the control unit 17.

[0065] Next, the light source 21 irradiates the surface region of the calibration region C2 and the second surface region 22a of the second measurement region R2 with ultraviolet light U. The ultraviolet light U irradiated to the surface region of the calibration region C2 passes through the calibration region C2 and the slide glass 8, and is then detected by the light detection unit 22. The ultraviolet light U irradiated to the second surface region 22a of the second measurement region R2 passes through the second measurement region R2, the component S1 attached to the second measurement region R2, and the slide glass 8, and is then detected by the light detection unit 22. Next, the difference between the light transmittance in the calibration region C2 and the light transmittance in the second measurement region R2 is calculated. This allows the light transmittance of the component S1 attached to the second measurement region R2 to be obtained. Next, the correlation between the results obtained using the first measurement region R1 (the results of imaging mass spectrometry) and the results obtained using the second measurement region R2 (the results of light transmittance) is analyzed.

[0066] As described above, in the sample support 1A, the substrate 2 has the first measurement region R1 and the second measurement region R2. This allows the sample S to be attached to both the first measurement region R1 and the second measurement region R2 by pressing the sample support 1A against the sample S once. Moreover, the conductive layer 5 is provided on the first surface region 21a of the first measurement region R1, and the conductive layer 5 is not provided on the second surface region 22a of the second measurement region R2. This allows the first surface region 21a to be irradiated with the laser light L in the first measurement region R1 to perform mass analysis of the sample S, and the second measurement region R2 to perform an analysis of the sample S different from that in the first measurement region R1. Furthermore, by analyzing the correlation between the results obtained using the first measurement region R1 and the results obtained using the second measurement region R2, a more detailed analysis of the sample S can be performed. In this way, the sample support 1A allows different analyses of the sample S to be efficiently performed using one sample support 1A. Furthermore, by pressing the sample support 1A against the sample S once (one sampling), the sample S can be attached to both the first measurement region R1 and the second measurement region R2, so that the variation between the amount of sample S attached to the first measurement region R1 and the amount of sample S attached to the second measurement region R2 can be suppressed. This makes it possible to perform analysis in the first measurement region R1 and the second measurement region R2 with high accuracy. If the variation between the amount of sample S attached to the first measurement region R1 and the amount of sample S attached to the second measurement region R2 is suppressed, the accuracy of the analysis of the correlation is further improved. As described above, the sample support 1A makes it possible to perform analysis of the sample S with high efficiency and high accuracy.

[0067] The conductive layer 5 is made of a material suitable for mass analysis of the sample S. This makes it possible to suitably perform mass analysis of the sample S in the first measurement region R1.

[0068] The second measurement region R2 is optically transparent. The second surface region 22a of the second measurement region R2 and the surface region opposite to the second surface region 22a in the second measurement region R2 (the second surface 2b of the substrate 2) are exposed. This allows light to pass through the second measurement region R2, thereby enabling the optical transmittance of the sample S attached to the second measurement region R2 to be analyzed.

[0069] The thickness of the substrate 2 is 5 μm to 50 μm, which ensures the strength of the substrate 2 and the light transmittance of the second measurement region R2.

[0070] The first measurement region R1 and the second measurement region R2 are connected to each other. This makes it possible to more reliably suppress the variation between the amount of sample S attached to the first measurement region R1 and the amount of sample S attached to the second measurement region R2 while ensuring the area of ​​the first measurement region R1 and the second measurement region R2. That is, the distance between the first measurement region R1 and the second measurement region R2 is closer than when the first measurement region R1 and the second measurement region R2 are separated from each other, so that the above-mentioned variation is suppressed. In addition, when the first measurement region R1 and the second measurement region R2 are connected to each other, each measuring device (e.g., a probe, etc.) can be brought closer to the first surface 2a over the entire measurement region R, and the accuracy of the measurement can be improved.

[0071] The substrate 2 has a rectangular plate shape. When viewed from the thickness direction D, the substrate 2 has calibration regions C1 and C2 located at different corners of the substrate 2. This allows calibration corresponding to analysis in each of the first measurement region R1 and the second measurement region R2 to be performed while ensuring the areas of the first measurement region R1 and the second measurement region R2.

[0072] [Second embodiment] A sample support 1B of the second embodiment will be described with reference to Figures 10 and 11. As shown in Figure 10, the sample support 1B includes a substrate 2B, a frame 3B, a conductive layer 5, a conductive layer (third conductive layer) 53, and a conductive layer 54. As an example, the length of the sample support 1B in the X-axis direction is about 5 cm, and the length in the Y-axis direction is about 2 cm. The length of the substrate 2B in the X-axis direction is greater than the length of the substrate 2 in the X-axis direction. The rest of the substrate 2B is the same as the substrate 2.

[0073] The length of frame 3B in the X-axis direction is greater than the length of frame 3 in the X-axis direction. Opening 3a of frame 3B is formed in a rectangular shape extending along the X-axis direction. In this embodiment, opening 3a is formed in a shape in which each corner of the rectangle is linearly cut out.

[0074] At each corner of the frame 3B, openings 31b, 32b, 33b, and 34b are formed penetrating the frame 3B in the thickness direction. Each of the openings 31b, 32b, 33b, and 34b is formed in a shape similar to that of the openings 31b and 32b of the frame 3. Portions of the substrate 2B corresponding to each of the openings 31b, 32b, 33b, and 34b function as calibration areas C1, C2, C3, and C4 for calibration. The rest of the frame 3B is the same as the frame 3. The sample support 1B is fixed to the slide glass 8 by the conductive tape 4, similar to the sample support 1A.

[0075] The conductive layers 53 and 54 are provided on the first surface 2a of the substrate 2B so as not to block the holes 2c, similar to the conductive layer 5. The conductive layers 53 and 54 are formed of a material different from that of the conductive layer 5. In this embodiment, the conductive layer 53 is, for example, Au, and the conductive layer 54 is, for example, Ag.

[0076] The substrate 2B further has a third measurement region R3 and a fourth measurement region R4 in addition to the first measurement region R1 and the second measurement region R2. In this embodiment, the first measurement region R1, the second measurement region R2, the third measurement region R3 and the fourth measurement region R4 are arranged in this order from one side (the left side in FIG. 10) of the sample support 1B in the X-axis direction to the other side (the right side in FIG. 10). The first measurement region R1 and the second measurement region R2 are connected to each other. The second measurement region R2 and the third measurement region R3 are connected to each other. The third measurement region R3 and the fourth measurement region R4 are connected to each other. The boundaries B1, B2, B3 of the first measurement region R1, the second measurement region R2, the third measurement region R3 and the fourth measurement region R4 extend linearly along the Y-axis direction.

[0077] The rest of the first measurement region R1 is the same as the first measurement region R1 of the first embodiment. The rest of the second measurement region R2 is the same as the second measurement region R2 of the first embodiment. The third measurement region R3 includes a third surface region 23a of the first surface 2a. A conductive layer 53 is provided in the third surface region 23a. The fourth measurement region R4 includes a fourth surface region 24a of the first surface 2a. A conductive layer 54 is provided in the fourth surface region 24a.

[0078] The calibration areas C1 and C2 are located at two corners of the substrate 2B adjacent to the first measurement area R1 when viewed from the thickness direction D. The calibration areas C2 and C3 are located at two corners of the substrate 2B adjacent to the fourth measurement area R4 when viewed from the thickness direction D.

[0079] A conductive layer 5 is provided on the surface region of the calibration region C1 (part of the first surface 2a). The conductive layers 5, 53, 54 are not provided on the surface region of the calibration region C2 (part of the first surface 2a). The surface region of the calibration region C2 is exposed. In other words, no film is formed on the surface region of the calibration region C2. A conductive layer 53 is provided on the surface region of the calibration region C3 (part of the first surface 2a). A conductive layer 54 is provided on the surface region of the calibration region C4 (part of the first surface 2a).

[0080] In the first measurement region R1 and the second measurement region R2, imaging mass analysis and analysis of the light transmittance of the sample S can be performed, respectively, in the same manner as in the sample support 1A. In the third measurement region R3, for example, imaging mass analysis different from that in the first measurement region R1 can be performed. In addition, in the third measurement region R3, for example, surface enhanced Raman scattering (SERS) can be generated. In the fourth measurement region R4, for example, imaging mass analysis different from that in the first measurement region R1 can be performed. In addition, in the fourth measurement region R4, for example, surface enhanced Raman scattering can be generated. In addition, in the fourth measurement region R4, for example, secondary ion mass spectrometry (SIMS) can be performed.

[0081] The conductive tape 41 is provided with circular openings 41a and 42a for exposing the calibration areas C1 and C2. The conductive tape 42 is provided with circular openings 43a and 44a for exposing the calibration areas C3 and C4.

[0082] As described above, the sample support 1B, like the sample support 1A, makes it possible to perform a highly efficient and highly accurate analysis of the sample S. Furthermore, in each of the third measurement region R3 and the fourth measurement region R4, an analysis of the sample S different from that in the first measurement region R1 can be performed.

[0083] [Variations] As shown in FIG. 12, in the sample support 1A, the boundary line B between the first measurement region R1 and the second measurement region R2 may extend linearly along the Y-axis direction. The arrangement of the first measurement region R1 and the second measurement region R2 may be set arbitrarily as necessary. In addition, a conductive layer 52 (second conductive layer) may be provided in the second surface region 22a of the second measurement region R2 so as not to block the hole 2c. The conductive layer 52 may be, for example, Al. In this case, the conductive layer 52 is provided in the surface region of the calibration region C2. With this configuration, for example, surface-enhanced Raman scattering can be generated in the second measurement region R2.

[0084] As shown in FIG. 13 and FIG. 14, in the sample support 1A, the first measurement region R1 and the second measurement region R2 may be separated from each other. Specifically, the frame 3 may have a partition wall portion 31. The partition wall portion 31 crosses the opening portion 3a. When viewed from the thickness direction D, the partition wall portion 31 extends linearly along the X-axis direction. The partition wall portion 31 is provided between the first measurement region R1 and the second measurement region R2. The portion of the substrate 2 that overlaps with the partition wall portion 31 is bonded to the partition wall portion 31 by the adhesive layer 6. With this configuration, the strength of the substrate 2 can be reinforced while clarifying the boundary between the first measurement region R1 and the second measurement region R2.

[0085] As shown in Figures 15 and 16, in the sample support 1B, the first measurement region R1 and the second measurement region R2 may be separated from each other. The second measurement region R2 and the third measurement region R3 may be separated from each other. The third measurement region R3 and the fourth measurement region R4 may be separated from each other. The third measurement region R3 and the fourth measurement region R4 may be separated from each other. Specifically, the frame 3B may have a plurality of partitions 31.

[0086] Each partition portion 31 crosses the opening 3a. When viewed from the thickness direction D, each partition portion 31 extends linearly along the Y-axis direction. When viewed from the thickness direction D, each partition portion 31 is lined up in the X-axis direction at a predetermined interval. Each partition portion 31 is provided between the first measurement region R1, the second measurement region R2, the third measurement region R3, and the fourth measurement region R4. The portions of the substrate 2B that overlap with each partition portion 31 are bonded to each partition portion 31 by an adhesive layer 6.

[0087] Although an example in which the sample S is applied onto human skin 50 has been shown, the sample S may not be a sample applied onto human skin 50. The sample S may be, for example, a biological sample, etc. The sample S may be, for example, a slice of an animal organ, a plant, etc.

[0088] In the above example, the sample support 1A is pressed against the skin 50 with the first surface 2a of the substrate 2 facing the sample S to attach the sample S to the measurement region R. However, the sample support 1A may be pressed against the skin 50 with the second surface 2b of the substrate 2 facing the sample S to attach the sample S to the measurement region R. This allows the component S1 of the sample S to move from the second surface 2b side to the first surface 2a side through the holes 2c by capillary action. As a result, the first surface 2a can be made suitable for ionizing the component S1 of the sample S. In such a case, the sample support 1A is not fixed to the slide glass 8.

[0089] Although an example has been shown in which each hole 2c is a through hole penetrating the substrate 2, each hole 2c does not have to penetrate the substrate 2. Each hole 2c does not have to open to, for example, the second surface 2b. In other words, the portion of each hole 2c on the second surface 2b side may be blocked. Each hole 2c only needs to open to at least the first surface 2a.

[0090] There is no limitation on the materials of the conductive layers 5, 52, 53, 54. As long as the conductive layers 52, 53, 54 are different from the conductive layer 5, the materials of each conductive layer 5, 52, 53, 54 may have various combinations.

[0091] The second measurement region R2 may be used for Desorption Electrospray Ionization (DESI), which is a method of desorbing and ionizing a sample by irradiating charged droplets. The second measurement region R2 may also be used for Nuclear Magnetic Resonance (NMR). In this case, if the partition 31 is provided, only the second measurement region R2 can be easily peeled off from the sample supports 1A and 1B. The second measurement region R2 may also be used for imaging analysis by Raman spectroscopy, or infrared spectroscopy.

[0092] The sample support 1B may have at least one of the second measurement region R2, the third measurement region R3, and the fourth measurement region R4. For example, the sample support 1B may not have at least one of the third measurement region R3 or the fourth measurement region R4.

[0093] The conductive layers 5, 53, 54 may be provided at least on the first surface 2a. The conductive layers 5, 53, 54 may be provided, for example, on the second surface 2b in addition to the first surface 2a, or on the entire or part of the inner surface of each hole 2c.

[0094] The target to which the voltage is applied by the voltage application unit 14 is not limited to the placement surface 8a. For example, the voltage may be applied directly to the frames 3 and 3B or the conductive layers 5, 53, and .

[0095] The mass spectrometer 10 may be a scanning type mass spectrometer or a projection type mass spectrometer. In the case of the scanning type, a signal of one pixel having a size corresponding to the spot diameter of the laser light L is acquired for each irradiation of the laser light L by the irradiation unit 13. That is, scanning (changing the irradiation position) and irradiation of the laser light L are performed for each pixel. On the other hand, in the case of the projection type, a signal of an image (multiple pixels) corresponding to the spot diameter of the laser light L is acquired for each irradiation of the laser light L by the irradiation unit 13. In the case of the projection type, when the spot diameter of the laser light L includes the entire measurement region R, imaging mass analysis can be performed by irradiating the laser light L once. Note that, in the case of the projection type, when the spot diameter of the laser light L does not include the entire measurement region R, a signal of the entire measurement region R can be acquired by scanning and irradiating the laser light L in the same manner as the scanning type. In addition, the above-mentioned ionization method can also be used for other measurements and experiments such as ion mobility measurement.

[0096] The use of the sample support is not limited to ionization of a sample by irradiation with laser light L. The sample support can be used for ionization of a sample by irradiation with an energy beam such as laser light, an ion beam, or an electron beam. In the above-mentioned ionization method and mass analysis method, the sample can be ionized by irradiation with such an energy beam. [Explanation of symbols]

[0097] 1A, 1B...sample support, 2...substrate, 2a...first surface, 2c...hole, 5...first conductive layer, 21a...first surface area, 22a...second surface area, 23a...third surface area, 24a...fourth surface area area, 31... partition part, 52... second conductive layer, 53... third conductive layer, C1, C2... calibration area, R1... first measurement area, R2... second measurement area, R3... third measurement area, S... sample.

Claims

1. A sample support for use in ionizing a sample, comprising: A substrate having a surface and a plurality of holes opening onto the surface, the substrate has at least a first measurement area including a first surface area of ​​the surface, and a second measurement area including a second surface area of ​​the surface; a first conductive layer is provided on the first surface region so as not to block the hole; The second surface region is free of the first conductive layer.

2. 2. The sample support of claim 1, wherein the first conductive layer is formed of Pt, Au, Cr, Ni, Ti or Ag.

3. The second measurement area has optical transparency, 3. The sample support according to claim 1, wherein the second surface area of ​​the second measurement area and a surface area of ​​the second measurement area opposite the second surface area are exposed.

4. The sample support according to claim 3, wherein the thickness of the substrate is between 5 μm and 50 μm.

5. The sample support according to claim 1 or 2, wherein a second conductive layer is provided on the second surface area of ​​the second measurement area so as not to block the hole and which is made of a different material from the first conductive layer.

6. 6. The sample support according to claim 1, wherein the first measurement area and the second measurement area are connected to each other.

7. 6. The sample support according to claim 1, further comprising a partition provided between the first measurement area and the second measurement area.

8. the substrate further comprises a third measurement area including a third surface area of ​​the surface; The sample support according to any one of claims 1 to 7, wherein the third surface region is provided with a third conductive layer formed of a material different from that of the first conductive layer so as not to block the holes.

9. The substrate has a rectangular plate shape, The sample support according to any one of claims 1 to 8, wherein the substrate has a plurality of calibration areas located at different corners of the substrate when viewed in a thickness direction of the substrate.

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