Electronic component manufacturing kits and their uses

Abstract

To stably manufacture electronic components on which fine conductive layers are accurately formed. [Solution] The kit for manufacturing electronic components disclosed herein includes a photosensitive glass paste and a photosensitive conductive paste. The photosensitive glass paste includes glass powder and an ultraviolet absorber, and the photosensitive conductive paste includes conductive powder and an ultraviolet absorber. In this kit for manufacturing electronic components, both the ultraviolet absorber in the photosensitive glass paste and the ultraviolet absorber in the photosensitive conductive paste contain an azo dye, and the content of the ultraviolet absorber in the photosensitive glass paste is 0.2 mass% or more. The photosensitive glass paste enables the formation of a cured glass film with precise grooves, and the photosensitive conductive paste prevents photocuring of paste adhered to the upper surface of the cured glass film. Then, by firing the cured glass film and the cured conductive film, an electronic component with a precise conductive layer can be manufactured.

Description

[Technical field]

[0001] The present invention relates to a kit for manufacturing electronic components, specifically, to a kit for manufacturing electronic components, including a photosensitive glass paste for forming a glass layer having grooves of a predetermined width on a surface of a substrate, and a photosensitive conductive paste for forming a conductive layer in the grooves of the glass layer. [Background technology]

[0002] A method of forming a conductive layer of an electronic component using a photosensitive conductive paste containing a conductive powder and a photocurable resin is widely known. One example of such a method is the photolithography method (see Patent Document 1). In this method, first, a photosensitive conductive paste is applied to the surface of a substrate, and then the paste is dried to form a film-like body containing a conductive powder (conductive film-like body). Next, a photomask having a slit (opening) of a predetermined pattern is placed over the conductive film-like body, and light is irradiated onto a part of the conductive film-like body exposed from the slit. This causes the photocurable resin to harden, forming a hardened film (conductive hardened film) containing a conductive powder. Next, the unexposed part (unhardened conductive film-like body) that was shielded by the photomask is removed with a developer. As a result, only the exposed conductive hardened film of the predetermined pattern remains on the surface of the substrate, and the desired conductive layer can be formed by baking this.

[0003] In recent years, the demand for miniaturization of electronic components has been increasing. To achieve such miniaturization of electronic components, it is necessary to reduce the L / S (line and space) which indicates the dimensional relationship between the line width L of the conductive layer and the width S of the gap (space) between adjacent conductive layers. For example, the L / S of the conductive layer of a conventional general electronic component was about 40 μm / 40 μm, but in recent years, it is required to form a fine conductive layer with an L / S of less than 30 μm / 30 μm. However, if a photomask with a small slit is used to form a fine conductive layer, the amount of light supplied to the conductive film in the exposure process is reduced, so that there is a possibility that the light will not reach the lower part (substrate side) of the conductive film. In this case, the lower part of the conductive film is not sufficiently cured and is removed in the development process, so that a conductive layer having an inverted trapezoid shape is formed in cross section. The formation of such an inverted trapezoid conductive layer is called "undercut" and can cause problems such as increased resistance of electronic components and disconnection of the conductive layer.

[0004] As a technique for forming a fine conductive layer without causing such undercuts, a photolithography method using a photosensitive glass paste has been proposed. In this method, a photosensitive glass paste is first applied to the surface of a substrate to form a glass film. Next, a photomask having a slit of a predetermined pattern is placed over the glass film, and the glass film exposed from the slit is exposed to light. Next, the uncured glass film is removed with a developer, and a glass cured film having a groove of a predetermined pattern is formed on the substrate surface. Next, a photosensitive conductive paste is filled in the groove of the glass cured film and exposed to light, thereby forming a conductive cured film in the groove of the glass cured film. Then, by baking these glass cured film and conductive cured film, an electronic component having a glass layer having a fine groove and a conductive layer formed in the groove of the glass layer can be manufactured. In this manufacturing technique, a glass film having high light transmission (transparency) is exposed to light to form a wiring pattern (groove pattern), so that even if the slit of the photomask becomes small and the supply of ultraviolet light is reduced, undercuts due to poor curing are unlikely to occur. Furthermore, it has an advantage that precise exposure and development are not required when forming a conductive cured film that contains conductive powder and is difficult to photo-cure. An example of a manufacturing technique using such a photosensitive glass paste is disclosed in Patent Document 2. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6694099 [Patent Document 2] Patent No. 5195432 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the manufacturing method using the photosensitive glass paste still has room for improvement, and it is difficult to apply it to actual manufacturing sites because it is not possible to stably form a precise conductive layer. Specifically, the photosensitive glass paste for forming the glass cured film has a strong light diffusion property and a high light transmittance, so there is a possibility that scattered light will occur inside the glass film-like body during the exposure process. In this case, the light-shielded part covered by the photomask will also be photocured, making it impossible to accurately form the desired groove part.

[0007] The present invention has been made to solve the above problems, and an object of the present invention is to provide a technique for stably manufacturing electronic components on which fine conductive layers are accurately formed. [Means for solving the problem]

[0008] In order to achieve the above object, the technology disclosed herein provides an electronic component manufacturing kit having the following configuration.

[0009] The electronic component manufacturing kit disclosed herein includes a photosensitive glass paste (A) for forming a glass layer having a groove of a predetermined width on a substrate surface, and a photosensitive conductive paste (B) for forming a conductive layer in the groove of the glass layer. The photosensitive glass paste (A) includes a glass powder (A1), a photocurable resin (A2), and an ultraviolet absorber (A3), and the photosensitive conductive paste (B) includes a conductive powder (B1), a photocurable resin (B2), and an ultraviolet absorber (B3). In the electronic component manufacturing kit disclosed herein, both the ultraviolet absorber (A3) of the photosensitive glass paste (A) and the ultraviolet absorber (B3) of the photosensitive conductive paste (B) contain an azo dye, and the content of the ultraviolet absorber (A3) is 0.2 mass% or more when the total weight of the photosensitive glass paste (A) is 100 mass%.

[0010] The technology disclosed herein uses an electronic component manufacturing kit having a photosensitive glass paste (A) and a photosensitive conductive paste (B) to manufacture an electronic component on which a fine conductive layer is formed accurately. Specifically, the photosensitive glass paste (A) uses an ultraviolet absorber (A3) containing an azo dye. This prevents scattered light from occurring inside the glass film during the exposure process, and suppresses photocuring of the light-shielded portion. According to experiments by the present inventors, the precision of the cured glass film after development is dramatically improved by adjusting the content of the ultraviolet absorber (A3) containing the azo dye to 0.2 mass % or more, and it becomes possible to clearly form fine grooves.

[0011] However, even if the above-mentioned hardened glass film having the precise grooves can be formed, it is difficult to accurately form a fine conductive layer along the precise grooves. The reason is as follows. When the photosensitive conductive paste (B) is applied inside the grooves, the photosensitive conductive paste (B) is printed and dried on the entire hardened glass film having the grooves. Therefore, a conductive film-like body made by drying the photosensitive conductive paste (B) is also formed on the upper surface of the hardened glass film. This conductive film-like body on the upper surface of the hardened glass film is shielded from light in the exposure process to make it an unexposed portion, and is removed in the development process. However, due to light scattering inside the conductive film-like body irradiated with light in the exposure process, a part of the unexposed portion on the hardened glass film is photocured, and is not removed in the development process, and may remain as a residue on the hardened glass film. In this case, even though a precise groove is formed in the hardened glass film, it may be difficult to accurately form a fine conductive layer. In contrast, in the electronic component manufacturing kit disclosed herein, an ultraviolet absorber (B3) containing an azo dye is also added to the photosensitive conductive paste (B), thereby preventing the photosensitive conductive paste (B) from being photocured on the glass cured film.

[0012] As described above, the electronic component manufacturing kit disclosed herein combines a photosensitive glass paste (A) that can dramatically improve the precision of the grooves of the cured glass film with a photosensitive conductive paste (B) that can prevent photocuring on the cured glass film to such an extent that no residue is generated during development. By using a manufacturing kit with such a configuration, electronic components with precisely formed fine conductive layers can be stably manufactured.

[0013] In a preferred embodiment of the kit for producing electronic components disclosed herein, the glass powder (A1) is 2 O 3 and SiO 2 B, which is the main component 2 O 3 -SiO 2 This includes B-type glass. 2 O 3 -SiO 2 Such glasses are suitable as glasses for firing, and can form glass layers that have excellent adhesion to the surface of substrates.

[0014] In addition, the above B 2 O 3 -SiO 2 In the embodiment using a B-based glass, 2 O 3 -SiO 2 The mass ratio of the oxide-based glass is B 2 O 3 Contains 5 to 20 mass% of SiO 2 It is preferable that the content is 20 to 70 mass %. This can further improve the adhesion to the substrate surface.

[0015] In a preferred embodiment of the kit for producing electronic components disclosed herein, the content of the glass powder (A1) is 30% by mass or more and 60% by mass or less when the total weight of the photosensitive glass paste (A) is taken as 100% by mass, which allows both the performance of the electronic components and the working efficiency to be favorably achieved.

[0016] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the content of the ultraviolet absorber (A3) is 1.0 mass% or less when the total weight of the photosensitive glass paste (A) is 100 mass%. As described above, in order to prevent the generation of scattered light inside the glass film, the photosensitive glass paste (A) only needs to contain 0.2 mass% or more of the ultraviolet absorber (A3), and the upper limit of the content of the ultraviolet absorber (A3) is not particularly limited. However, as the content of the ultraviolet absorber (A3) increases, the appropriate exposure time for the glass film tends to become longer. Therefore, from the viewpoint of improving manufacturing efficiency, it is preferable that the content of the ultraviolet absorber (A3) is 1.0 mass% or less.

[0017] In a preferred embodiment of the kit for producing electronic components disclosed herein, the azo dye includes at least one dye selected from the group consisting of yellow dyes and red dyes, which can more reliably prevent the light-shielded glass film from being photocured.

[0018] In a preferred embodiment of the kit for producing electronic components disclosed herein, the photosensitive glass paste (A) further contains a photopolymerization initiator (A4), which allows for better photocuring of the glass film.

[0019] In a preferred embodiment of the kit for producing electronic components disclosed herein, the photosensitive glass paste (A) further contains an organic binder (A5), which can improve the adhesion of the glass film to the surface of the substrate.

[0020] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the photosensitive glass paste (A) further contains a dispersion medium (A6), which imparts appropriate viscosity and fluidity to the photosensitive glass paste (A) and improves the handleability and printability of the paste.

[0021] In the embodiment in which the dispersion medium (A6) is added, the dispersion medium (A6) is preferably an organic solvent having a boiling point of 150° C. or more and 250° C. or less. This makes it possible to obtain a photosensitive glass paste (A) that can easily form a glass film body while having a certain level of paste storage stability or more.

[0022] In a preferred embodiment of the kit for producing electronic components disclosed herein, the conductive powder (B1) contains silver-based particles, which allows the production of electronic components with an excellent balance between cost and electrical resistance.

[0023] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the content of the conductive powder (B1) in the photosensitive conductive paste (B) is 74 mass% or more. This allows the formation of a dense and thick conductive layer, and allows the manufacture of low-resistance electronic components. As will be described in detail later, the technology disclosed herein can also effectively prevent the adverse effects caused by using a photosensitive conductive paste containing a high concentration of conductive powder as described above.

[0024] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the content of the ultraviolet absorber (B3) is 0.001% by mass or more and 0.2% by mass or less when the total weight of the photosensitive conductive paste (B) is taken as 100% by mass. This makes it possible to suppress the exposure time from being extended and to suitably prevent the photocuring of the conductive film-like body on the cured glass film.

[0025] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the photosensitive conductive paste (B) further contains a photopolymerization initiator (B4), which allows for better photocuring of the glass film.

[0026] In a preferred embodiment of the kit for producing electronic components disclosed herein, the photosensitive conductive paste (B) further contains an organic binder (B5), which can improve the adhesion of the conductive film to the surface of the substrate.

[0027] In a preferred embodiment of the electronic component manufacturing kit disclosed herein, the photosensitive conductive paste (B) further contains a dispersion medium (B6), which imparts appropriate viscosity and fluidity to the photosensitive conductive paste (B) and improves the handleability and printability of the paste.

[0028] In addition, as another aspect of the technology disclosed herein, a photosensitive glass paste is provided. The photosensitive glass paste includes a glass powder (A1), a photocurable resin (A2), and an ultraviolet absorber (A3). In the photosensitive glass paste disclosed herein, the ultraviolet absorber (A3) contains an azo dye, and the content of the ultraviolet absorber (A3) is 0.2 mass% or more when the total weight is 100 mass%. As described above, by using a photosensitive glass paste having such a configuration, the precision of the glass cured film after development is dramatically improved, and fine grooves can be clearly formed, which contributes to the stable production of electronic components having a precise conductive layer.

[0029] As another aspect of the technology disclosed herein, a composite that is a precursor of an electronic component is provided. The composite includes a green sheet that is a precursor of a substrate, a glass cured film that is arranged on the green sheet and is formed by photocuring the photosensitive glass paste (A) having the above-mentioned configuration, and a conductive cured film that is arranged on the green sheet and is formed by photocuring the photosensitive conductive paste (B) having the above-mentioned configuration. In the composite, a groove portion of a predetermined pattern is provided in the glass cured film, and a conductive cured film is formed inside the groove portion.

[0030] Furthermore, as another aspect of the technology disclosed herein, a fired electronic component is provided. The electronic component includes a substrate, a glass layer disposed on the substrate surface and made of a fired body of the photosensitive glass paste (A) having the above-mentioned configuration, and a conductive layer disposed on the substrate surface and made of a fired body of the photosensitive conductive paste (B) having the above-mentioned configuration. In the electronic component, a groove portion of a predetermined pattern is provided in the glass layer, and a conductive layer is formed inside the groove portion.

[0031] As another aspect of the technology disclosed herein, a method for manufacturing an electronic component is provided. The method for manufacturing an electronic component uses the electronic component manufacturing kit having the above-described configuration. The manufacturing method includes a step of forming a cured glass film having grooves of a predetermined pattern by applying a photosensitive glass paste (A) onto a green sheet and then performing exposure and development, a step of filling the grooves of the glass layer with a photosensitive conductive paste (B) and then performing exposure and development to form a conductive cured film, and a step of firing the green sheet, the cured glass film, and the conductive cured film. [Brief description of the drawings]

[0032] [Figure 1] 4A to 4C are cross-sectional views illustrating printing of a photosensitive glass paste in a method for manufacturing an electronic component according to an embodiment of the present invention. [Diagram 2] 4A to 4C are cross-sectional views illustrating exposure of a glass film in a method for manufacturing an electronic component according to an embodiment of the present invention. [Diagram 3] 4A to 4C are cross-sectional views illustrating development of a glass cured film in a method for producing an electronic component according to an embodiment. [Figure 4] 4A to 4C are cross-sectional views illustrating printing of a photosensitive conductive paste in a method for manufacturing an electronic component according to an embodiment. [Diagram 5] 4A to 4C are cross-sectional views illustrating exposure of a conductive film body in a method for manufacturing an electronic component according to an embodiment. [Figure 6] 4A to 4C are cross-sectional views illustrating development of a conductive cured film in a method for producing an electronic component according to an embodiment. [Figure 7] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 8] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 9] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 10] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 11] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 12] 1A to 1C are cross-sectional views illustrating a manufacturing procedure for the multilayer chip inductor. [Figure 13] 1 shows optical microscope photographs of each sample prepared in a test example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Preferred embodiments of the technology disclosed herein will be described below. Matters other than those specifically mentioned in this specification and necessary for implementing the technology disclosed herein can be understood based on the technical content taught by this specification and the general technical common sense of a person skilled in the art in the relevant field. The technology disclosed herein can be implemented based on the contents disclosed in this specification and the technical common sense of a person skilled in the art in the relevant field. In addition, the expression "A to B" (A and B are any numbers) indicating a range in this specification includes the meaning of "A or more and B or less" as well as "preferably greater than A" and "preferably smaller than B".

[0034] In this specification, the dried photosensitive glass paste is referred to as a "glass film", the glass film photocured is referred to as a "cured glass film", and the cured glass film baked is referred to as a "glass layer". Meanwhile, the dried photosensitive conductive paste is referred to as a "conductive film", the conductive film photocured is referred to as a "cured conductive film", and the conductive cured film baked is referred to as a "conductive layer".

[0035] 1. Electronic component manufacturing kit First, the electronic component manufacturing kit disclosed herein will be described. In this specification, the term "electronic component manufacturing kit" refers to a combination of multiple types of paste compositions used to form a conductive layer of an electronic component. In this specification, the term "paste" includes ink and slurry. The electronic component manufacturing kit disclosed herein has at least a photosensitive glass paste (A) and a photosensitive conductive paste (B). The components of each paste will be described below.

[0036] <Photosensitive glass paste (A)> The photosensitive glass paste (A) is a paste composition for forming a glass layer having a groove of a predetermined width on the surface of a substrate. The photosensitive glass paste (A) contains at least a glass powder (A1), a photocurable resin (A2), and an ultraviolet absorber (A3). The components contained in the photosensitive glass paste (A) are described below.

[0037] <Glass powder (A1)> The glass powder (A1) is an inorganic component that remains during firing and forms a glass layer on the surface of the substrate after firing. A preferred example of the glass powder (A1) is a boron component (B 2 O 3 ) and silicon component (SiO 2 ) as the main component B 2 O 3 -SiO 2 Such B-based glasses are 2 O 3 -SiO 2 By using the photosensitive glass paste (A) containing a photosensitive glass, a glass layer having excellent adhesion to the substrate surface can be formed.

[0038] Specifically, the boron component (B 2 O 3 ) contributes to increasing the fluidity during firing, and therefore improves the adhesion of the glass layer to the substrate surface. 2 O 3 -SiO 2 B in glass 2 O 3 The proportion of is preferably 1 mass% or more, more preferably 5 mass% or more, and particularly preferably 10 mass% or more, in terms of mass ratio of oxide. This makes it possible to more suitably improve the fixation of the glass layer after firing. 2 O 3 If the content of B is excessive, it may be difficult to maintain the shape of the glass layer during firing. 2 O 3 -SiO 2 B in glass 2 O3 The upper limit of the proportion of the silicon component (SiO 2 ) is a component that constitutes the skeleton of the glass layer after firing. SiO 2 B also has the function of improving adhesion to the substrate surface. 2 O 3 -SiO 2 SiO in glass 2 The proportion of SiO is preferably 10% by mass or more, more preferably 20% by mass or more, and particularly preferably 40% by mass or more, calculated as an oxide. This can further improve the fixation to the substrate surface. 2 The upper limit of the proportion of is preferably 80% by mass or less, more preferably 70% by mass or less, and particularly preferably 60% by mass or less. 2 O 3 -SiO 2 The glass is B 2 O 3 and SiO 2 Such other components include oxides of group 2 elements (RO: R is Mg, Ca, Sr, Ba, Ra, etc.), aluminum components (Al 2 O 3 ), zinc component (ZnO), etc. By adjusting the content of these other components, the heat resistance and chemical durability of the glass layer after firing can be improved.

[0039] The glass composition used in the glass powder (A1) is the same as that described above in B 2 O 3 -SiO 2 The glass powder (A1) is not limited to a SiO-based glass, and any conventionally known glass composition can be used without any particular limitation. 2 -RO glass, SiO 2 -RO-Al 2 O 3 Glasses based on SiO 2 -RO-Y 2 O 3 Glasses based on SiO 2 -RO-B 2 O 3Glasses based on SiO 2 -Al 2 O 3 Glasses based on SiO 2 -ZnO-based glass, SiO 2 -ZrO 2 based glass, RO based glass, lead based glass, lead-lithium based glass, etc.

[0040] The particle size of the glass powder (A1) is not particularly limited, but is preferably in the micron size. For example, in consideration of the variation in the lot size during paste production due to the aggregation of the glass powder (A1), the D 50 The particle size is preferably 0.3 μm or more, more preferably 0.7 μm or more, and particularly preferably 1.0 μm or more. On the other hand, in consideration of the surface smoothness of the glass layer after drying, the D 50 The upper limit of the particle size is preferably 8 μm or less, more preferably 5 μm or less, and particularly preferably 2 μm or less. 50 "Particle size" is the particle size that corresponds to 50% of the cumulative particle size from the smaller particle size side in the volume-based particle size distribution based on the laser diffraction / scattering method.

[0041] The content of the glass powder (A1) in the photosensitive glass paste (A) is preferably 25% by mass or more, more preferably 30% by mass or more, even more preferably 35% by mass or more, and particularly preferably 40% by mass or more. This allows the thickness of the glass layer after firing to be increased, and the conductive layer formed in the groove of the glass layer can be easily thickened. As a result, a conductive layer with low resistance is formed, and the performance of electronic components can be improved. On the other hand, from the viewpoint of suppressing an increase in the viscosity of the paste and preventing a decrease in work efficiency, the upper limit of the content of the glass powder (A1) is preferably 70% by mass or less, more preferably 65% ​​by mass or less, even more preferably 60% by mass or less, and particularly preferably 55% by mass or less. In this specification, the "content" refers to the mass ratio (% by mass) when the total weight of the paste is 100% by mass, unless otherwise specified.

[0042] <Photocurable resin (A2)> The photocurable resin (A2) is an organic compound that undergoes polymerization or crosslinking reactions when irradiated with light (ultraviolet rays) and hardens. The photocurable resin (A2) in the photosensitive glass paste (A) disclosed herein may be any conventionally known photocurable resin that can be used in a photosensitive paste, without any particular limitations. For example, the photocurable resin (A2) may be a relatively high molecular weight (e.g., a weight average molecular weight of 6000 or more) photocurable polymer, or a relatively low molecular weight (e.g., a weight average molecular weight of less than 6000) photocurable oligomer. When a photocurable polymer is used as the photocurable resin (A2), the fixation of the photosensitive glass paste (A) before photocuring can be improved. In addition, in consideration of the fixation to the substrate surface during printing, the weight average molecular weight Mw of the photocurable resin (A2) is preferably 500 or more, more preferably 750 or more, even more preferably 1000 or more, and particularly preferably 1500 or more. On the other hand, the upper limit of the weight average molecular weight Mw of the photocurable resin (A2) is preferably 60,000 or less, more preferably 50,000 or less, even more preferably 40,000 or less, and particularly preferably 30,000 or less.

[0043] An example of the photocurable resin (A2) is a (meth)acrylic resin. Such a (meth)acrylic resin has excellent conformability to the substrate, flexibility, and durability, and can therefore suppress peeling and damage of the cured glass film before baking. The term "(meth)acrylic resin" refers to a photocurable resin having a (meth)acryloyl group. The term "(meth)acryloyl group" refers to a "methacryloyl group (-C(=O)-C(CH 3 )=CH 2 )" and "Acryloyl group (-C(=O)-CH=CH 2) is a term that includes "alkyl (meth)acrylate homopolymers" and copolymers containing alkyl (meth)acrylate as a main monomer and a sub-monomer copolymerizable with the main monomer. Specific examples of the homopolymers include polymethyl (meth)acrylate, polyethyl (meth)acrylate, and polybutyl (meth)acrylate. Specific examples of the copolymers include block copolymers containing a methacrylic acid ester polymer and an acrylic acid ester polymer block as repeating units. Specific examples of the methacrylic acid esters include methyl methacrylate, propyl methacrylate, n-butyl methacrylate, and t-butyl methacrylate. Specific examples of the acrylic acid esters include methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate, t-butyl acrylate, and n-hexyl acrylate. The above "(meth)acrylate" is a term that includes "methacrylate" and "acrylate". In addition, from the viewpoint of improving photocurability, it is preferable that the (meth)acrylic resin has a (meth)acryloyl group (preferably an acryloyl group) in the side chain. As the (meth)acrylic resin as described above, commercially available resins can be used without particular limitation. As such commercially available (meth)acrylic resins, for example, those from Nippon Kayaku Co., Ltd., Kyoeisha Chemical Co., Ltd., Shin-Nakamura Chemical Co., Ltd., and Toagosei Co., Ltd. can be used.

[0044] The content of the photocurable resin (A2) in the photosensitive glass paste (A) is preferably 2% by mass or more, more preferably 4% by mass or more, and particularly preferably 6% by mass or more. This allows a cured glass film that is properly fixed to the substrate surface to be formed with a short exposure time. On the other hand, the upper limit of the content of the photocurable resin (A2) is preferably 30% by mass or less, more preferably 20% by mass or less, and particularly preferably 15% by mass or less. This reliably prevents photocuring of the light-shielded parts, and further improves the precision of the grooves of the cured glass film after development.

[0045] <Ultraviolet absorber (A3)> The photosensitive glass paste (A) of the electronic component manufacturing kit disclosed herein contains an azo dye as an ultraviolet absorber (A3). Such an azo dye is an aromatic compound in which two organic groups are linked via an azo group (-N=N-). Such an azo dye has an absorption peak at a wavelength of 10 nm to 500 nm, and therefore can appropriately absorb the scattered ultraviolet light generated inside the glass film. As a result, the light-shielded part of the glass film can be suitably prevented from being photocured, and fine grooves can be accurately formed in the cured glass film after exposure. Furthermore, since the azo dye is an organic dye, it also has the characteristic of not remaining in the glass layer after firing. As a result, it is possible to prevent the performance of electronic components from deteriorating due to the ultraviolet absorber remaining in the glass layer after firing. Examples of the azo dye include oil yellow, oil orange, oil violet, Sudan blue, Sudan red, Sudan II, Sudan III, and Sudan IV. Among these, from the viewpoint of more appropriately absorbing diffuse ultraviolet light, yellow dyes (oil yellow) and red dyes (Sudan red) are particularly preferred.

[0046] The ultraviolet absorber (A3) of the photosensitive glass paste (A) may contain a dye other than the azo dye. However, in consideration of the performance degradation caused by the dye remaining in the glass layer after firing, it is preferable to select an organic dye for the dye other than the azo dye. Examples of such organic dyes include aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinone dyes, benzophenone dyes, benzotriazole dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. However, from the viewpoint of more appropriately exerting the precision improvement effect of the azo dye, it is preferable that the ultraviolet absorber (A3) is mostly composed of azo dyes. Specifically, the content ratio of the azo dye to the total amount of the ultraviolet absorber (A3) is preferably 60 mass% or more, more preferably 70 mass% or more, even more preferably 80 mass% or more, and particularly preferably 90 mass% or more. The ultraviolet absorber (A3) may be entirely azo dyes (the content of azo dyes is 100% by mass).

[0047] In the photosensitive glass paste (A) disclosed herein, the content of the ultraviolet absorber (A3) is set to 0.2 mass% or more. According to the study by the present inventors, by adding 0.2 mass% or more of the ultraviolet absorber (A3) containing the azo dye, the light-shielded portion can be reliably prevented from being photocured in the exposure step, and the precision of the cured glass film after development can be significantly improved. From the viewpoint of further improving the precision of the cured glass film, the content of the ultraviolet absorber (A3) is preferably 0.25 mass% or more, more preferably 0.3 mass% or more, and particularly preferably 0.35 mass% or more. On the other hand, the upper limit of the content of the ultraviolet absorber (A3) is not particularly limited, and may be 5 mass% or less, 4 mass% or less, 3 mass% or less, or 2 mass% or less. However, if the content of the ultraviolet absorber (A3) is increased too much, the exposure time required for curing the glass film (forming the cured glass film) becomes longer, which may cause a decrease in production efficiency. From this viewpoint, the upper limit of the content of the ultraviolet absorber (A3) is preferably 1.5 mass % or less, more preferably 1 mass % or less, further preferably 0.75 mass % or less, particularly preferably 0.55 mass % or less.

[0048] <Photopolymerization initiator (A4)> The photosensitive glass paste (A) disclosed herein may contain a photopolymerization initiator (A4). The photopolymerization initiator (A4) is a component that decomposes upon irradiation with light (e.g., ultraviolet light) to generate active species such as radicals and cations, and promotes the polymerization reaction of the photocurable resin (A2). As the photopolymerization initiator (A4), one type may be used alone or two or more types may be used in appropriate combination from among conventionally known initiators depending on the type of the photocurable resin (A2). Suitable examples of the photopolymerization initiator (A4) include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,4-diethylthioxanthone, and benzophenone. The content of the photopolymerization initiator (A4) in the photosensitive glass paste (A) is preferably about 0.01% by mass to 5% by mass, typically 0.05% by mass to 3% by mass, for example 0.1% by mass to 2% by mass, which allows for better photocuring of the glass film.

[0049] <Organic binder (A5)> The organic binder (A5) refers to an organic compound that does not have photosensitivity (e.g. photocuring) among organic compounds that enhance the adhesion (fixing to the substrate surface) between the photosensitive glass paste (A) and the substrate. In other words, as described above, the photocurable resin (A2) such as a photocurable polymer also has the function of improving the fixing to the substrate surface. For this reason, if sufficient fixing is obtained only with the photocurable resin (A2), it is not necessary to add the organic binder (A5). On the other hand, it is preferable to add the organic binder (A5) when sufficient fixing is not obtained with other components, such as when a photocurable oligomer is used as the photocurable resin (A2). It is preferable that the organic binder (A5) is a water-soluble organic compound. This makes it possible to easily remove the uncured glass film-like body in the development process using a water-based developer.

[0050] A suitable example of the organic binder (A5) is a cellulose compound. Such a cellulose compound has a glucose ring, which is a repeating unit of cellulose. By adding the cellulose compound, the inorganic component (for example, the glass powder (A1)) and the photocurable resin (A2) become more compatible with each other, and the storage stability of the paste can be improved. In addition, the cellulose compound has a plurality of hydroxyl groups on the glucose ring and exhibits good water solubility, so that it can be easily removed with an aqueous developer. In this specification, the term "cellulose compound" includes cellulose, cellulose derivatives, and salts thereof. As such a cellulose compound, one type of known cellulose compound may be used alone, or two or more types may be used in appropriate combination. Suitable examples of the cellulose compound include hydroxyalkyl cellulose such as hydroxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, and hydroxypropyl methyl cellulose; alkyl cellulose such as methyl cellulose and ethyl cellulose; and carboxyalkyl cellulose such as carboxymethyl cellulose. In addition, the organic binder (A5) may contain an organic compound other than the cellulose compound. Other examples of the organic binder (A5) include acrylic resin, phenol resin, epoxy resin, polyester resin, polyamide resin, polycarbonate resin, etc. In addition, as the organic binder as described above, commercially available ones can be used without any particular restrictions. As the commercially available organic binder, for example, those from Shin-Nakamura Chemical Co., Ltd. and Mitsubishi Chemical Corporation can be used.

[0051] In addition, the content of the organic binder (A5) in the photosensitive glass paste (A) is not particularly limited, and can be appropriately adjusted in consideration of the fixation to the substrate surface. For example, the content of the organic binder (A5) may be 1 mass % or more, 3 mass % or more, or 5 mass % or more. In this way, by adding a certain amount or more of the organic binder (A5), the fixation to the substrate surface is improved, and the peeling of the glass film before firing can be suitably suppressed. In addition, by including a certain amount or more of the water-soluble organic binder, the uncured glass film in the development process can be easily removed, which can contribute to shortening the development time. On the other hand, the upper limit of the content of the organic binder (A5) may be 30 mass % or less, 20 mass % or less, or 15 mass % or less. As the content of the organic binder (A5) is reduced, the paste viscosity decreases, and the printability on the substrate surface tends to improve.

[0052] <Dispersion medium (A6)> The photosensitive glass paste (A) may also contain a dispersion medium (A6) that disperses the above-mentioned components. The dispersion medium (A6) is a liquid component that imparts appropriate viscosity and fluidity to the paste and improves handling and printability. The content of the dispersion medium (A6) in the photosensitive glass paste (A) can be appropriately adjusted in consideration of the viscosity and fluidity of the paste. The content of the dispersion medium (A6) can be approximately 1 to 50 mass%, typically 5 to 40 mass%, for example 10 to 30 mass%. As the dispersion medium (A5), a conventionally known liquid component can be used alone or in a mixture of two or more kinds. For example, as the organic dispersion medium, one type can be used alone or in a suitable combination of two or more kinds from among conventionally known ones depending on, for example, the type of photocurable resin. Examples of organic dispersion media include hydrocarbon solvents such as toluene and xylene; glycol solvents such as ethylene glycol, propylene glycol, and diethylene glycol; glycol ether solvents such as ethylene glycol monomethyl ether (methyl cellosolve), ethylene glycol monoethyl ether (cellosolve), diethylene glycol monobutyl ether (butyl carbitol), diethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether, dipropylene glycol methyl ether acetate, propylene glycol phenyl ether, and 3-methyl-3-methoxybutanol; ester solvents such as 1,7,7-trimethyl-2-acetoxy-bicyclo-[2,2,1]-heptane and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate; alcohol solvents such as terpineol, dihydroterpineol, dihydroterpineyl propionate, and benzyl alcohol; and other organic solvents having a high boiling point such as mineral spirits. The dispersion medium (A6) of the photosensitive glass paste (A) may be selected in consideration of its boiling point. For example, by using an organic solvent with a boiling point of 150°C or higher, natural evaporation of the dispersion medium (A6) can be prevented, improving the shelf life of the paste. On the other hand, by using an organic solvent with a boiling point of 250°C or lower, a glass film can be easily formed in the drying process after printing.

[0053] <Other added ingredients> In addition, the photosensitive glass paste (A) may contain components other than the above-mentioned components (A1) to (A6) as long as the effects of the technology disclosed herein are not significantly impaired. The other additive components are not particularly limited, and conventionally known additive components can be used alone or in combination of two or more. Examples of such other additive components include polymerization inhibitors, radical scavengers, antioxidants, plasticizers, surfactants, leveling agents, thickeners, dispersants, defoamers, gelling inhibitors, stabilizers, preservatives, etc. Although not particularly limited, the content of such other additive components is generally 5% by mass or less, typically 3% by mass or less, for example 2% by mass or less, and preferably 1% by mass or less.

[0054] <Photosensitive conductive paste (B)> Next, the photosensitive conductive paste (B) of the electronic component manufacturing kit disclosed herein will be described. The photosensitive conductive paste (B) is a paste composition for forming a conductive layer in the groove of the glass layer formed using the photosensitive glass paste (A). The photosensitive conductive paste (B) contains at least a conductive powder (B1), a photocurable resin (B2), and an ultraviolet absorber (B3). The components contained in the photosensitive conductive paste (B) will be described below.

[0055] <Conductive powder (B1)> The conductive powder (B1) is an inorganic component that remains during firing and imparts electrical conductivity to the conductive layer. The type of conductive powder (B1) is not particularly limited, and one type alone or two or more types in appropriate combination can be used from among conventionally known conductive materials according to the application. Suitable examples of the conductive powder (B1) include simple metals such as gold (Au), silver (Ag), copper (Cu), platinum (Pt), palladium (Pd), aluminum (Al), nickel (Ni), ruthenium (Ru), rhodium (Rh), tungsten (W), iridium (Ir), and osmium (Os), as well as mixtures and alloys thereof. Among these suitable examples, silver-based particles are more suitable. The term "silver-based particles" encompasses all particulate materials containing silver (Ag). Examples of such silver-based particles include simple silver, silver alloys, and core-shell particles containing silver components. Examples of silver alloys include silver-palladium (Ag-Pd), silver-platinum (Ag-Pt), and silver-copper (Ag-Cu). Examples of core-shell particles include silver-ceramic core-shell particles that have a core particle containing elemental silver and a ceramic shell that covers the core particle. These silver-based particles are relatively inexpensive and have high electrical conductivity, so they can contribute to the production of electronic components that have an excellent balance between electrical conductivity and cost.

[0056] Although not particularly limited, as the particle size of the conductive powder (B1) becomes smaller, it becomes easier to fill the grooves of the cured glass layer with the photosensitive conductive paste (B), and the density of the conductive layer after firing tends to improve. From this viewpoint, D of the conductive powder (B1) 50 The upper limit of the particle size is preferably 5 μm or less, more preferably 4.5 μm or less, and particularly preferably 4 μm or less. On the other hand, if the particle size of the conductive powder (B1) is too small, coarse particles are likely to be generated due to aggregation, and the filling ability of the hardened glass layer into the grooves may be decreased. From this viewpoint, the D of the conductive powder (B1) 50 The particle size is preferably 0.1 μm or more, more preferably 0.5 μm or more, and particularly preferably 1 μm or more.

[0057] In addition, the photosensitive conductive paste (B) preferably contains a high concentration of conductive powder (B1). This allows the formation of a dense and thick conductive layer, and allows the manufacture of low-resistance electronic components. Generally, a paste containing a high concentration of conductive powder (B1) makes it difficult for light to penetrate into the conductive film after drying, making it difficult to sufficiently photo-cure the film to the bottom layer, and making it easy for undercuts to occur after development. However, according to the technology disclosed herein, a precise conductive layer can be formed simply by filling the grooves of a previously formed glass hardened layer with the photosensitive conductive paste (B), so that a paste containing a high concentration of conductive powder (B1), which is difficult to use in the conventional technology, can be used. Specifically, the technology disclosed herein allows the content of conductive powder (B1) in the photosensitive conductive paste (B) to be 74 mass% or more. In addition, from the viewpoint of further reducing the resistance of electronic components, the content of the conductive powder (B1) is preferably 78% by mass or more, more preferably 79% by mass or more, even more preferably 80% by mass or more, and particularly preferably 81% by mass or more. According to the technology disclosed herein, a paste containing such a high concentration of conductive powder (B1) can also be used. However, if the concentration of the conductive powder (B1) is increased too much, the fluidity of the paste is greatly reduced, and it may become difficult to fill the grooves of the cured glass film with the photosensitive conductive paste (B) without gaps. For this reason, the content of the conductive powder (B1) is preferably 90% by mass or less, more preferably 85% by mass or less.

[0058] <Photocurable resin (B2)> Like the photosensitive glass paste (A), the photosensitive conductive paste (B) also contains a photocurable resin (B2). Note that the photocurable resin (B2) of the photosensitive conductive paste (B) can be the same type as the photocurable resin (A2) of the photosensitive glass paste (A) described above, without any particular restrictions, and therefore detailed explanation of the components will be omitted.

[0059] In addition, from the viewpoint of suitably preventing the photocuring of the photosensitive conductive paste (B) attached on the cured glass film, it is preferable that the photosensitive conductive paste (B) has a lower content of photocurable resin than the photosensitive glass paste (A) to reduce the photocurability. Specifically, the content of the photocurable resin (B3) in the photosensitive conductive paste (B) is preferably 15% by mass or less, more preferably 12% by mass or less, even more preferably 9% by mass or less, and particularly preferably 6% by mass or less. On the other hand, if the exposed portion of the conductive film body is poorly cured in the exposure step, the conductive film body (poorly cured conductive cured film) in the groove may be removed in the development step. From this viewpoint, the lower limit of the content of the photocurable resin (B3) is preferably 0.5% by mass or more, more preferably 1% by mass or more, even more preferably 2% by mass or more, and particularly preferably 3% by mass or more.

[0060] <Ultraviolet absorber (B3)> In the electronic component manufacturing kit disclosed herein, the photosensitive conductive paste (B) also contains an ultraviolet absorber (B3) containing an azo-based dye. This prevents the photosensitive conductive paste (B) (conductive film-like body) from being photocured on the glass cured film, thereby preventing the precision of the conductive layer (conductive cured film) from being reduced. Specifically, in the technology disclosed herein, the photosensitive conductive paste (B) is supplied to the grooves of the glass cured film formed using the photosensitive glass paste (A). In supplying the photosensitive conductive paste, it is difficult to fill only the grooves of the glass cured film with the entire amount of the photosensitive conductive paste, and it is common to apply the photosensitive conductive paste to an area including the upper surface of the glass cured film by screen printing or the like. Here, if a photosensitive conductive paste with excellent photocurability is used, there is a risk that the photosensitive conductive paste (conductive film-like body) attached to the upper surface of the glass cured film will be photocured by scattered light in the exposure process, even if the photosensitive conductive paste (conductive film-like body) attached to the upper surface of the glass cured film is shielded from light. In this case, even if precise grooves can be formed, the precision of the conductive layer of the electronic component after firing is greatly impaired. In contrast, the photosensitive conductive paste (B) used in the technology disclosed herein is different from conventional photosensitive conductive pastes in that the photocuring property is reduced by the ultraviolet absorber (B3). This effectively prevents the photocuring of the conductive film attached to the upper surface of the cured glass film, and realizes the accurate formation of a fine conductive layer.

[0061] Furthermore, if the ultraviolet absorber remains in the conductive layer after firing, it becomes an impurity that reduces the conductivity, making it difficult to manufacture high-performance electronic components. For this reason, in the technology disclosed herein, an azo dye is used as the ultraviolet absorber (B3) on the photosensitive conductive paste (B), which exhibits a sufficient hardening suppression effect in a small amount and is easily removed by firing. Note that, as for the azo dye and other organic dyes, those of the same type as the ultraviolet absorber (A3) in the photosensitive glass paste (A) can be used without any particular restrictions, and therefore detailed explanation of the components will be omitted.

[0062] The photocurability of the photosensitive conductive paste (B) may vary depending on the type (color) and content of the conductive powder (B1). For this reason, it is preferable to appropriately adjust the content of the ultraviolet absorber (B3) in the photosensitive conductive paste (B) according to the type and content of the conductive powder (B1). For example, when 74% by mass of silver-based particles are added as the conductive powder (B1), it is preferable to set the content of the ultraviolet absorber (B3) to 0.001% by mass or more. This can sufficiently suppress the photocuring of the conductive film-like body on the cured glass film. From the viewpoint of reliably preventing the photocuring of the conductive film-like body on the cured glass film, the content of the ultraviolet absorber (B3) in the photosensitive conductive paste (B) is preferably 0.005% by mass or more, more preferably 0.01% by mass or more, and particularly preferably 0.05% by mass or more. On the other hand, the upper limit of the content of the ultraviolet absorber (B3) in the photosensitive conductive paste (B) is not particularly limited, and may be 1% by mass or less, or may be 0.5% by mass or less. However, if the content of the ultraviolet absorber (B3) is increased too much, the exposure time may become longer, which may reduce the production efficiency. Therefore, the content of the ultraviolet absorber (B3) is preferably 0.2 mass% or less, more preferably 0.15 mass% or less, and particularly preferably 0.1 mass% or less.

[0063] <Photopolymerization initiator (B4)> Similarly to the photosensitive glass paste (A), the photosensitive conductive paste (B) may also contain a photopolymerization initiator (B4). The photopolymerization initiator (B4) of the photosensitive conductive paste (B) may be the same as that of the photosensitive glass paste (A) without any particular limitation. However, from the viewpoint of appropriately preventing the photocuring of the conductive film-like body on the glass cured film, the content of the photopolymerization initiator (B4) in the photosensitive conductive paste (B) is preferably less than the content of the photopolymerization initiator (A4) in the photosensitive glass paste (A). For example, the content of the photopolymerization initiator (B4) in the photosensitive conductive paste (B) is preferably 5% by mass or less, more preferably 4% by mass or less, even more preferably 3% by mass or less, and particularly preferably 2% by mass or less. On the other hand, from the viewpoint of realizing better photocuring, the content of the photopolymerization initiator (B4) is preferably 0.1 mass % or more, more preferably 0.3 mass % or more, even more preferably 0.5 mass % or more, and particularly preferably 1 mass % or more.

[0064] <Organic binder (B5)> The organic binder (B5) may be the same as the organic binder (A5) of the photosensitive glass paste (A) without any particular limitation. The performance required for the photosensitive conductive paste (B) of the electronic component manufacturing kit disclosed herein is more important in terms of filling the grooves of the cured glass film (fluidity of the paste) than in terms of fixation to the substrate surface. For this reason, the content of the organic binder (B5) in the photosensitive conductive paste (B) is preferably less than the organic binder (A5) in the photosensitive glass paste (A). Specifically, the content of the organic binder (B5) in the photosensitive conductive paste (B) is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 7% by mass or less. On the other hand, the lower limit of the content of the organic binder (B5) may be 0% by mass (not including the organic binder (B5)), may be more than 0% by mass, may be 1% by mass or more, may be 2% by mass or more, may be 3% by mass or more, may be 3% by mass or more.

[0065] <Dispersion medium (B6)> The dispersion medium (B6) may be the same as the dispersion medium (A6) of the photosensitive glass paste (A) without any particular restrictions. As described above, in consideration of filling the grooves of the cured glass film, the photosensitive conductive paste (B) of the electronic component manufacturing kit disclosed herein preferably has high fluidity. For example, the content of the dispersion medium (B6) in the photosensitive conductive paste (B) is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 5% by mass or more, and particularly preferably 7% by mass or more. On the other hand, the upper limit of the content of the organic binder (B5) in the photosensitive conductive paste (B) may be 30% by mass or less, 20% by mass or less, 15% by mass or less, or 12% by mass or less.

[0066] <Other added ingredients> In addition, the photosensitive conductive paste (B) may contain components other than the above-mentioned components (B1) to (B6) as long as the effects of the technology disclosed herein are not significantly impaired. The other additive components are not particularly limited, and conventionally known additive components can be used alone or in combination of two or more. Examples of such other additive components include polymerization inhibitors, radical scavengers, antioxidants, plasticizers, surfactants, leveling agents, dispersants, defoamers, gelling inhibitors, stabilizers, preservatives, etc. Although not particularly limited, the content of such other additive components is generally 5% by mass or less, typically 3% by mass or less, for example 2% by mass or less, and preferably 1% by mass or less.

[0067] <Summary of electronic component manufacturing kits> The configuration of the electronic component manufacturing kit disclosed herein has been described above. The photosensitive glass paste (A) of the electronic component manufacturing kit having the above configuration has a content of the ultraviolet absorber (A3) containing an azo dye set to 0.2 mass % or more. This prevents the light-shielded portion from being photocured by the diffused light inside the glass film-like body, so that a glass cured film having a precisely formed groove of a predetermined pattern can be produced. In the electronic component manufacturing kit disclosed herein, the photosensitive conductive paste (B) also contains the ultraviolet absorber (B3) containing an azo dye. This makes it possible to suitably prevent the conductive film-like body (dried film of the photosensitive conductive paste (B)) on the glass cured film from being photocured on the glass cured film. As described above, according to the electronic component manufacturing kit disclosed herein, by using the photosensitive glass paste (A) and the photosensitive conductive paste (B) having the above configuration in combination, an electronic component having a glass layer having a precise groove and a conductive layer filled without protruding from the precise groove of the glass layer can be easily manufactured. That is, the technique disclosed herein makes it possible to stably manufacture electronic components on which fine conductive layers are accurately formed.

[0068] In the electronic component manufacturing kit disclosed herein, the photosensitive glass paste (A) and the photosensitive conductive paste (B) can have the same components except for the inorganic components (glass powder (A1), conductive powder (B1)). In this way, when the components of the two pastes are the same, the filling property of the photosensitive conductive paste (B) into the grooves of the cured glass film can be improved. On the other hand, the components may be different in consideration of the role of each paste. For example, the photosensitive glass paste (A) tends to emphasize its fixation to the substrate surface, while the photosensitive conductive paste (B) tends to emphasize its fluidity. For this reason, a combination of adding an organic binder (A5) to the photosensitive glass paste (A) and not adding an organic binder (B5) to the photosensitive conductive paste (B) can be adopted.

[0069] 2. Uses of electronic component manufacturing kits As described above, the electronic component manufacturing kit disclosed herein enables stable manufacturing of electronic components having a conductive layer with a precise pattern. Hereinafter, applications of such an electronic component manufacturing kit will be described.

[0070] <Types of electronic components> First, the electronic component manufacturing kit disclosed herein can be used to manufacture various electronic components such as inductance components, capacitor components, and multilayer circuit boards. Typical examples of inductance components include high-frequency filters, common mode filters, inductors (coils) for high-frequency circuits, inductors (coils) for general circuits, high-frequency filters, choke coils, and transformers. The shape (structure) of such electronic components is not particularly limited, and may be a surface mount type, a through-hole mount type, or the like. The electronic components may be a laminated type in which multiple conductive layers are laminated, or a thin-film type with a single conductive layer.

[0071] An example of the electronic component is a ceramic electronic component. In this specification, the term "ceramic electronic component" refers to electronic components using a ceramic substrate in general. Typical examples of ceramic electronic components include high-frequency filters having a ceramic substrate, ceramic inductors (coils), ceramic capacitors, low-temperature co-fired ceramic substrates (LTCC substrates), and high-temperature co-fired ceramic substrates (HTCC substrates). Examples of the ceramic substrate include amorphous ceramic substrates (glass ceramic substrates) and crystalline (i.e., non-glass) ceramic substrates. When using a glass ceramic substrate, the photosensitive glass paste (A) may be printed and dried in a plate shape on a carrier sheet such as a PET film, and then the photosensitive glass paste (A) may be photocured to form a plate-shaped cured glass film into a green sheet, and the plate-shaped cured glass film may be fired to form a substrate. Examples of crystalline ceramic substrates include substrates containing oxide-based materials such as zirconium oxide (zirconia), magnesium oxide (magnesia), aluminum oxide (alumina), silicon oxide (silica), titanium oxide (titania), cerium oxide (ceria), yttrium oxide (yttria), and barium titanate; composite oxide-based materials such as cordierite, mullite, forsterite, steatite, sialon, zircon, and ferrite; nitride-based materials such as silicon nitride (silicon nitride) and aluminum nitride (aluminum nitride); carbide-based materials such as silicon carbide; and hydroxide-based materials such as hydroxyapatite.

[0072] <Electronic component manufacturing method> Next, an embodiment of a method for manufacturing an electronic component using the electronic component manufacturing kit disclosed herein will be described. Figures 1 to 6 are cross-sectional views illustrating each step of the method for manufacturing an electronic component according to this embodiment. Note that the dimensional relationships (length, width, thickness, etc.) in these figures do not necessarily reflect the actual dimensional relationships.

[0073] <Photosensitive glass paste printing S10> As shown in Fig. 1, in the manufacturing method according to this embodiment, the photosensitive glass paste (A) having the above-mentioned structure is applied (printed) onto the surface of a green sheet 10 as a base material, and then the photosensitive glass paste (A) is dried. As a result, a glass film 20 is formed on the green sheet 10. The drying temperature in this step is suitably about 30°C to 60°C, and the drying time is suitably about 5 minutes to 20 minutes. The raw materials and formation procedures of the green sheet 10 can be conventionally known without any particular restrictions, and detailed explanations are omitted since they do not limit the technology disclosed herein.

[0074] <Exposure of glass film S20> Next, in this embodiment, a photomask M1 having slits M1a of a predetermined pattern is placed on the glass film 20, and a part of the glass film 20 exposed from the slits M1a is exposed (see FIG. 2). As a result, the light-shielded part by the photomask M1 remains as the glass film 20, and the exposed part directly below the slits M1a is photocured to become the cured glass film 22. In this exposure process, an exposure machine that emits light rays (typically ultraviolet rays) in a wavelength range of, for example, 10 to 500 nm, for example, an ultraviolet irradiation lamp such as a high-pressure mercury lamp, a metal halide lamp, or a xenon lamp, can be used.

[0075] In the manufacturing method according to this embodiment, 0.2 mass % or more of an ultraviolet absorbing agent (A3) containing an azo dye is added to the photosensitive glass paste (A), which is the precursor of the glass film 20. This prevents ultraviolet rays from diffusing inside the glass film 20, and reliably prevents the light-shielding portion located directly below the photomask M1 from being photocured.

[0076] <Development of hardened glass film S30> Next, a developer having a predetermined composition is supplied onto the green sheet 10 to remove the uncured glass film 20. As a result, a cured glass film 22 having grooves 24 of a predetermined pattern is developed on the green sheet 10 (see FIG. 3). At this time, in the manufacturing method according to the present embodiment, the light-shielded portion by the photomask M1 is reliably prevented from being photocured in the above-mentioned exposure S20 of the glass film. Therefore, in this step, by removing the uncured glass film 20, a cured glass film 22 having fine grooves 24 accurately formed therein is generated. Note that an alkaline aqueous developer or the like can be used as the developer in this step. Examples of such an aqueous developer include an aqueous sodium hydroxide solution and an aqueous sodium carbonate solution. Note that the alkali concentration of these aqueous developers may be adjusted to, for example, 0.01 to 0.5% by mass.

[0077] <Printing photosensitive conductive paste S40> Next, in the manufacturing method according to the present embodiment, a photosensitive conductive paste (B) is printed so as to fill the grooves 24 of the cured glass film 22, and the photosensitive conductive paste (B) is dried. As a result, a conductive film body 30 is formed inside the grooves 24 of the cured glass film 22. The printing means in this step is not particularly limited. For example, as shown in FIG. 4, a means may be used in which the photosensitive conductive paste (B) is printed on the entire upper surface of the cured glass film 22 using screen printing.

[0078] <Exposure of conductive film body S50> Next, in this process, a photomask M2 having slits M2a of a predetermined pattern is placed on the conductive film 30 (see FIG. 5). Here, in this process, the position of the photomask M2 is adjusted so that the slits M2a of the photomask M2 are positioned on the conductive film 30 filled in the grooves 24, and the area above the cured glass film 22 is shaded by the photomask M2. Then, a part of the conductive film 30 exposed from the slits M2a is exposed to light. As a result, the conductive film 30 filled in the grooves 24 is photocured to become the cured conductive film 32.

[0079] If light scattering occurs inside the conductive film 30 during exposure S50 of the conductive film, a part of the unexposed portion covered by the photomask M2 may be photocured. In response to this, in the manufacturing method according to the present embodiment, an ultraviolet absorber (B3) containing an azo-based dye is also added to the conductive film 30. This makes it easier to maintain the conductive film 30 on the glass cured film 22, which is the light-shielding portion, in an unexposed state, and therefore makes it possible to suitably prevent the generation of residues on the upper surface of the glass cured film 22 after the development process described below is performed.

[0080] <Development of conductive cured film S60> Next, in the manufacturing method according to the present embodiment, the uncured conductive film 30 attached on the cured glass film 22 is removed using a developer having a predetermined composition. This forms a composite 1, which is a precursor of an electronic component. As shown in FIG. 6, the composite 1 includes a green sheet 10, which is a precursor of a substrate, a cured glass film 22 formed by photocuring a photosensitive glass paste (A), and a conductive cured film 32 formed by photocuring a photosensitive conductive paste (B). In the composite 1, grooves 24 of a predetermined pattern are precisely formed in the cured glass film 22, and a precise conductive cured film 32 is formed by filling the grooves 24.

[0081] By firing the composite 1, the glass cured film 22 is sintered to become a glass layer, and the conductive cured film 32 is sintered to become a conductive layer, thereby producing an electronic component. The electronic component thus produced has a glass layer having a precise groove and a conductive layer formed along the precise groove. The firing temperature (maximum temperature in the firing process) when firing the composite 1 is preferably about 600°C to 1000°C.

[0082] <Manufacturing of multilayer chip inductors> Furthermore, according to the technology disclosed herein, not only the thin-film electronic component having a single conductive layer as described above, but also an electronic component having multiple laminated conductive layers (multilayer chip inductor) can be easily manufactured. The procedure for manufacturing the multilayer chip inductor will be described below.

[0083] When manufacturing a multilayer chip inductor, first, a composite 1 (see FIG. 6) in which a cured glass film 22 and a conductive cured film 32 are formed on a green sheet 10 is produced according to the above-mentioned procedure. Then, as shown in FIG. 7, a photosensitive glass paste (A) is printed so as to cover the upper surfaces of the cured glass film 22 and the conductive cured film 32 of the composite 1, and then dried and exposed to light. As a result, a first layer L1 in which the conductive cured film 32 is covered with the cured glass film 22 is formed.

[0084] Next, a via hole 26 is formed in the glass cured film 22 forming the upper surface of the first layer L1 using a guide hole punch or the like, and a part of the upper surface of the conductive cured film 32 is exposed (see FIG. 8). Then, the via hole 26 is filled with a photosensitive conductive paste (B), which is then dried and exposed to light. As a result, a via 36 connected to the first layer of conductive cured film 32 is formed (see FIG. 9). At this time, it is preferable to use a photomask so that only the conductive film-like body (the dried photosensitive conductive paste (B)) in the via hole 26 is exposed to light.

[0085] Then, the above-mentioned steps of "printing photosensitive glass paste (A) S10" to "developing the cured glass film S30" are performed again to form the cured glass film 22 having the grooves 24 on the upper surface of the first layer L1 (see FIG. 10). Next, the above-mentioned steps of "printing photosensitive conductive paste (B) S40" to "developing the cured conductive film S60" are performed again to form the cured conductive film 32 inside the grooves 24 of the cured glass film 22 (see FIG. 11). As a result, the second layer L2 having the cured glass film 22 and the cured conductive film 32 is formed on the upper surface of the first layer L1. The cured conductive film 32 of the second layer L2 is connected to the cured conductive film 32 of the first layer L1 through the via 36.

[0086] In manufacturing the laminated chip inductor, the above-mentioned steps are repeated to produce a laminate 100 including a plurality of layers (first layer L1 to fourth layer L4 in FIG. 12) including a glass cured film 22 having a precise groove 24 and a conductive cured film 32 formed in the groove. In addition, in this laminate 100, the conductive cured films 32 of the first layer L1 to fourth layer L4 are connected through vias 36. A paste for forming external electrodes is applied to this laminate 100, and then a firing process is performed to manufacture a laminated chip inductor having a precise conductive layer.

[0087] [Test example] Test examples relating to the technology disclosed herein will be described below. Note that the following description is not intended to limit the technology disclosed herein to those shown in the test examples.

[0088] 1. Preparation of Photosensitive Glass Paste (1) Sample 1 A photosensitive glass paste was prepared by mixing glass powder, a photocurable resin, a photopolymerization initiator, and a dispersion medium as Sample 1. In Sample 1, glass powder (SiO 2 -B 2 O 3 -Al 2 O 3 -K 2As a photocurable resin, a urethane acrylate oligomer (polyfunctional urethane (meth)acrylate) was prepared. As an organic binder, a methylcellulose-based water-soluble resin and a water-soluble acrylic resin (methacrylic acid-methyl methacrylate copolymer) were prepared. As a photopolymerization initiator, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one was prepared. As a dispersion medium, a mixed solvent of diethylene glycol monoethyl ether acetate and ethylene glycol monobutyl ether was prepared. Then, the glass powder, photocurable resin, organic binder, and photopolymerization initiator prepared above were dissolved in the dispersion medium to prepare a photosensitive glass paste. In this sample, the amount of each component added was adjusted so that the glass powder content was 52 mass%, the photocurable resin content was 6 mass%, the organic binder content was 13 mass%, the photopolymerization initiator content was 3 mass%, and the remainder was the mixed solvent, relative to the total amount (100 mass%) of the photosensitive glass paste.

[0089] (2) Samples 2 to 6 A photosensitive glass paste was prepared with the same composition as Sample 1, except that an ultraviolet absorber was added. In Samples 2 to 6, a yellow azo dye, Oil Yellow (manufactured by Orient Chemical Industries Co., Ltd., model number: Oil Yellow 3G), was used as the ultraviolet absorber. In addition, the amount of the oil yellow added differs in Samples 2 to 6. The content (mass%) of the oil yellow in each sample is shown in Table 1. The increase due to the addition of the oil yellow was adjusted by reducing the content of the dispersion medium.

[0090] (3) Samples 7-8 A photosensitive glass paste was prepared with the same composition as Sample 1, except that a white dye, benzotriazole (ADEKA Corporation, model number: LA-24), was added as an ultraviolet absorber. The amounts of benzotriazole added differed between Samples 7 and 8. The benzotriazole content (mass%) in each sample is shown in Table 1.

[0091] 2.Evaluation Test In this test, the photosensitive glass pastes of Samples 1 to 8 were used to form a cured glass film having grooves of a predetermined pattern, and the precision of the cured glass film after formation was evaluated. First, in this test, a PET film was used as the printing target in order to easily visually evaluate the precision of the cured glass film after formation. Then, the photosensitive glass pastes (Samples 1 to 8) were applied to a PET film in a size of 4 cm x 4 cm using screen printing, and then dried at 45°C for 15 minutes to form a glass film. Then, a photomask having slits of a predetermined pattern was placed on the glass film, and then an exposure machine (illuminance 50 mJ / cm 2 , exposure dose 100mJ / cm 2 ) was used to irradiate light to harden the glass film placed directly under the slits of the photomask, forming a hardened glass film. The photomask used in this test had an L / S (line / space) setting of 20 μm / 20 μm.

[0092] Next, the glass film on the PET film and the cured glass film were treated with 0.1% by weight of alkaline Na 2 CO 3 An aqueous solution (developing solution) was sprayed until the break point (BP) + 5 seconds was reached (developing process). The BP refers to the time until it can be visually confirmed that the glass film in the light-shielding part has been removed by the developing solution. The BP in this test was 27 seconds. After removing the glass film in the light-shielding part, the substrate was washed with pure water and dried at room temperature. This resulted in the formation of a cured glass film having grooves in a predetermined pattern.

[0093] Next, in this test, the cured glass film formed on the PET film was observed with an optical microscope. Optical microscope photographs of each sample are shown in Figure 13. Then, in 20 fields of microscope observation, it was evaluated whether the grooves and outer edges of the cured glass film were precisely formed or not. The results of this evaluation are shown in the "Precision Evaluation" column in Table 1. The evaluation criteria in this evaluation are as follows: "◯": In all visual fields, the outer edge of the cured glass film was clearly formed, and adjacent cured glass films were securely separated by grooves. "X": No groove was formed, and an area where adjacent cured glass films were in contact was confirmed.

[0094] [Table 1]

[0095] First, as shown in Table 1 and Fig. 13, in Sample 1, no grooves were formed in the cured glass film after development, and the outer edge of the cured glass film was unclear with many irregularities formed. In this way, even though the glass film was covered with a photomask and exposed to light, the cured glass film reflecting the pattern of the photomask was not formed. This is because scattered light occurred inside the glass film, and the light reached the light-shielded parts.

[0096] Next, as shown in Samples 2 to 6, various amounts of azo dye (oil yellow) were added, and when the amount reached 0.2 mass% or more, the precision of the cured glass film after development was dramatically improved. On the other hand, as shown in Samples 7 and 8, when a non-azo dye ultraviolet absorber (benzotriazole) was used, even if the amount was significantly increased, areas where the cured glass films contacted each other were generated, and precise grooves could not be formed. From these experimental results, it was found that a cured glass film having precise grooves can be formed by using a photosensitive glass paste containing 0.2 mass% or more of an ultraviolet absorber containing an azo dye. And, if a photosensitive conductive paste can be applied to the upper surface of such a cured glass film and photocuring of the conductive film on the upper surface of the cured glass film can be prevented, it is understood that electronic components having precise conductive layers can be stably manufactured.

[0097] Although the present invention has been described in detail above, these are merely examples, and the present invention can be modified in various ways without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0098] 1. Complex 10 Green Sheet 20 Glass membrane 22 Glass hardening film 24 Groove 30 Conductive film 32 Conductive hardened film 36 Via

Claims

1. A method for manufacturing an electronic component using a photosensitive glass paste (A) and a photosensitive conductive paste (B), comprising: The photosensitive glass paste (A) is A glass powder (A1) containing B 2 O 3 —SiO 2 based glass mainly composed of B 2 O 3 and SiO 2 ; a photocurable resin (A2) containing a (meth)acrylic resin having a methacryloyl group (-C(=O)-C(CH3)=CH2) or an acryloyl group (-C(=O)-CH=CH2); An ultraviolet absorber (A3) containing an azo dye; Including, When the total weight of the photosensitive glass paste (A) is taken as 100 mass%, the contents of the glass powder (A1), the photocurable resin (A2), and the ultraviolet absorber (A3) are as follows: The glass powder (A1): 25% by mass or more and 70% by mass or less The photocurable resin (A2): 2% by mass or more and 30% by mass or less The ultraviolet absorber (A3): 0.2% by mass or more and 1.5% by mass or less The photosensitive conductive paste (B) is A conductive powder (B1) containing at least one metal element selected from the group consisting of gold (Au), silver (Ag), copper (Cu), platinum (Pt), palladium (Pd), aluminum (Al), nickel (Ni), ruthenium (Ru), rhodium (Rh), tungsten (W), iridium (Ir), and osmium (Os); a photocurable resin (B2) containing a (meth)acrylic resin having a methacryloyl group (-C(=O)-C(CH3)=CH2) or an acryloyl group (-C(=O)-CH=CH2); an ultraviolet absorber (B3) containing an azo dye; Including, When the total weight of the photosensitive conductive paste (B) is taken as 100 mass%, the contents of the conductive powder (B1), the photocurable resin (B2), and the ultraviolet absorber (B3) are as follows: The conductive powder (B1): 74% by mass or more and 90% by mass or less The photocurable resin (B2): 0.5% by mass or more and 15% by mass or less The ultraviolet absorber (B3): 0.001% by mass or more and 1% by mass or less The method for manufacturing the electronic component includes: applying the photosensitive glass paste (A) onto a green sheet, and then performing exposure and development to form a cured glass film having grooves of a predetermined pattern; a step of filling the grooves of the cured glass film with the photosensitive conductive paste (B), and then performing exposure and development to form a cured conductive film; Firing the green sheet, the cured glass film, and the cured conductive film; Including, The method for producing an electronic component, wherein the conductive powder (B1) in the photosensitive conductive paste (B) has a D 50 particle size of 0.1 μm or more and 5 μm or less.

2. A method for manufacturing an electronic component as described in claim 1, wherein the groove width of the glass hardened film is 30 μm or less.

3. A method for manufacturing an electronic component as described in claim 1 or 2, wherein the glass hardened film has a spacing width between adjacent groove portions of 30 μm or less.

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