LOADING AND / OR UNLOADING SYSTEM AND METHOD OF OPERATING SAME - Patent application

Abstract

To provide a positioning device, a loading and / or an unloading system, and a method for operating the positioning device.SOLUTION: The present invention proceeds from a positioning device, in particular, a wafer transportation container positioning device, for positioning a wafer transportation container (10a-d) at a loading and / or unloading position of a loading and / or unloading station (14a-d) which is configured at least for loading and / or unloading wafers (12a-d) from the wafer transportation container (10a-d). It is proposed that the positioning device, in particular, the wafer transportation container positioning device, comprises a positioning mechanism (16a-d) which is configured for contactless positioning of the wafer transportation container (10a-d) in a coupling processing between the wafer transportation container (10a-d) and the loading and / or unloading station (14a-d).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The invention relates to a positioning device according to the preamble of claim 1, in particular a wafer transport container positioning device, a loading and / or unloading system according to claim 19 as well as a method for operating a positioning device according to the preamble of claim 20. [Background technology]

[0002] Positioning devices have already been proposed for positioning a wafer-transport container at a loading and / or unloading position of a loading and / or unloading station that is configured for loading and / or unloading wafers from at least the wafer-transport container. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] DE 10348015 A1 [Patent Document 2] US Patent Application Publication No. 2016 / 276191 [Patent Document 3] US Patent Application Publication No. 2015 / 170948 [Patent Document 4] US Patent Application Publication No. 2008 / 063496 [Patent Document 5] Japanese Patent Publication No. 59-61921 [Patent Document 6] DE 102013011873 [Patent Document 7] JP 2010-258107 A [Patent Document 8] Japanese Patent Application Publication No. 11-067868 [Patent Document 9] Special Publication No. 2010-502001 [Patent Document 10] JP 2003-315197 A Summary of the Invention [Problem to be solved by the invention]

[0004] The object of the present invention includes providing a generic device with advantageous features, in particular with regard to positioning a wafer-transport container at a loading and / or unloading station for wafers from the wafer-transport container. This object is achieved according to the invention by the features of claims 1, 19 and 20, whereas advantageous designs and further developments of the invention can be found in the dependent claims. [Means for solving the problem]

[0005] The present invention extends to a positioning device, in particular a wafer transport container positioning device, for positioning a wafer transport container at a loading and / or unloading position of a loading and / or unloading station configured for loading and / or unloading wafers from at least the wafer transport container.

[0006] It is proposed that the positioning device, in particular the wafer-carrying container positioning device, comprises a positioning mechanism configured for contact-free positioning of the wafer-carrying container in a docking process between the wafer-carrying container and the loading and / or unloading station. As a result, advantageous properties can be achieved with regard to positioning the wafer-carrying container in the loading and / or unloading station for wafers from the wafer-carrying container. It is advantageously possible by means of the positioning mechanism to reduce and / or avoid particle generation during the docking process, in particular by avoiding external friction, in particular leading to particle generation, between the fixed bodies, in particular between the wafer-carrying container and the loading and / or unloading station. Avoidance of particles is particularly advantageous under clean room conditions. In particular, wafer manufacturing and / or wafer processing in wafer manufacturing plants is typically carried out under clean room conditions, since even the smallest particles of the wafers can cause damage. In addition, particles can impair the normal functioning of the vacuum seal and can in particular lead to a reduction in the tightness of the vacuum seal, for example by settling between vacuum seal elements. A corresponding reduction in the number of particles in the surrounding area of ​​the vacuum seal by avoiding particle generation can therefore advantageously enable a high level of tightness of the vacuum seal, especially in places where the vacuum seal is frequently opened and closed. Furthermore, by avoiding contact of surfaces as a result of the non-contact positioning, it is possible to reduce wear of the material, so that a long operating life can be advantageously achieved and a particularly high level of positioning accuracy is sustained over the operating life. The contact guide elements of the contact positioning mechanism can, for example, wear out over time, so that play can increase during positioning. Such effects can be advantageously avoided by the non-contact positioning. In addition, accelerations can become jerky, especially as a result of, for example, static friction and / or irregularities in at least one of the contact surfaces, so that a particularly uniform and / or jerky-free positioning can be enabled in an advantageous manner by the non-contact positioning mechanism, in contrast to contact positioning, in which the wafer supported in the wafer transport container can slide.As a result, damage to the wafer caused by slippage can be advantageously avoided.

[0007] The "positioning device", in particular the "wafer-carrying container positioning device", is configured for influencing, preferably steering and / or controlling, in particular at least two-dimensional, preferably three-dimensional movements of the wafer-carrying container, in particular in the docking process, in such a way that the wafer-carrying container assumes a provided spatial alignment when it is approaching and / or being placed in the loading and / or unloading position. The positioning device, in particular the wafer-carrying container positioning device, may be configured for performing at least one pre-positioning of the wafer-carrying container when it is approaching the loading and / or unloading position, in particular such that deviation of the alignment of the wafer-carrying container from an ideal alignment with respect to the loading and / or unloading position and / or from an ideal position of the wafer-carrying container in the loading and / or unloading position is as small as possible. The expression "as small as possible" is to be understood in particular as the wafer-carrying container being rotated by no more than 2°, preferably no more than 1°, advantageously no more than 0.6°, in a preferred manner no more than 0.3° and particularly preferably no more than 0.1° relative to the ideal loading and / or unloading position and / or the wafer-carrying container being offset in any direction relative to the ideal loading and / or unloading position by no more than 3 mm, preferably no more than 2 mm, advantageously no more than 1 mm, particularly preferably no more than 0.6 mm, in a preferred manner no more than 0.3 mm and in a particularly preferred manner no more than 0.1 mm. "Positioning" is to be understood in particular as rotational and / or translational positioning relative to the ideal loading and / or unloading position. In the case of ideal alignment and / or ideal positioning, the contact areas of the wafer-carrying container and the loading and / or unloading station that are configured for coupling completely overlap. Positioning is to be understood as a pre-positioning that is preferably performed after a particularly coarse positioning, which is achieved, for example, by delivery by a wafer-carrying container positioning system of a wafer fab.In addition, positioning, in particular pre-positioning, is performed before the final positioning. The final positioning can be achieved, for example, by positioning and / or guide pins, which are preferably configured to provide a secure, locking closure between the wafer-carrying container in the loading and / or unloading position and the loading and / or unloading station. The wafer-carrying container is placed in the ideal loading and / or unloading position, in particular after the final positioning. The term "configured" is to be understood in particular as being specially programmed, designed and / or equipped. An object configured for a particular function is to be understood in particular as an object that fulfills and / or performs said particular function in at least one application and / or operating state.

[0008] A "wafer transport container" is to be understood as a transport container having a particularly closable interior, which is configured to receive wafers. The wafer transport container is particularly configured to transport at least wafers having a diameter of at least 200 mm, preferably at least 300 mm and in a preferred manner at least 450 mm. The wafer transport container is particularly configured to transport at least one wafer, preferably at least three wafers, advantageously at least five wafers, particularly advantageously at least 10 wafers, in a preferred manner at least 25 wafers and in a particularly preferred manner up to 100 wafers. Alternatively or in addition to this, the wafer transport container is configured to receive at least one object realized differently from a wafer, for example an exposure mask. The wafer transport container is particularly realized to be portable. The wafer transport container is particularly realized to be closable in a vacuum-tight manner. The wafer transport container is preferably realized as a vacuum wafer transport container, which is particularly configured for providing and / or maintaining a vacuum atmosphere inside it. The wafer transport container is particularly configured for storing wafers in a vacuum atmosphere. "Vacuum atmosphere" refers in particular to a pressure of less than 300 hPa, preferably less than 1 hPa, and in a preferred manner less than 10 -3 hPa and 10 -6 The wafer transport container should be understood as an atmosphere having a pressure of less than 10 hPa. The wafer transport container includes a high level of tightness, especially in a vacuum atmosphere, and in particular the leakage rate of the wafer transport container is less than 10 -4 mbar*l / s, preferably less than 10 -5 mbar*l / s, preferably less than 10 -6 mbar*l / s, particularly preferably less than 10 -7 Less than mbar*l / s, 10 in the preferred method -8 mbar*l / s and in the particularly preferred mode 10 -9mbar*l / s. Alternatively, the wafer transport container can be configured to store and / or maintain the wafers in standard atmosphere and / or in a specially compiled atmosphere, for example a nitrogen atmosphere. The wafer transport container comprises an outer shell, which is in particular at least partially realized from a diamagnetic, paramagnetic or ferromagnetic material, which is preferably repelled and / or attracted by an external magnetic field.

[0009] A "loading and / or unloading position" is to be understood as a position of the wafer transport container relative to a loading and / or unloading station configured to reload at least one wafer from the wafer transport container to the loading and / or unloading station or configured to reload at least one wafer from the loading and / or unloading station to the wafer transport container. In the loading and / or unloading position, the wafer transport container, in particular the inside of the wafer transport container, is preferably vacuum-tightly connectable to the loading and / or unloading station, in particular the inside of the loading and / or unloading station. In particular, in the loading and / or unloading position, the wafer transport container opening element is releasable from the base body of the wafer transport container and in particular is at least partially lowerable into the inside of the loading and / or unloading station. In particular, the wafer transport container in the loading and / or unloading position can be securely fixed to a surface of the loading and / or unloading station, for example by vacuum clamping by a vacuum clamping device. In particular, the wafer-carrying container and the loading and / or unloading station are configured with the aim of realizing a common small environment, in particular in a coupled state in which the wafer-carrying container is fixed to a surface of the loading and / or unloading station in the loading and / or unloading position. A "small environment" is to be understood in particular as an enclosed space with an atmosphere isolated from the surrounding atmosphere, for example a vacuum. A "coupling process" is to be understood in this context in particular as a process of approaching the wafer-carrying container to the loading and / or unloading station and / or removing the wafer-carrying container from the loading and / or unloading station and subsequently fixing the wafer-carrying container to the loading and / or unloading station in the loading and / or unloading position.A "wafer" is to be understood in particular as a substrate of an electronic component. The loading and / or unloading station is further configured for advancing a wafer from a wafer transport container to a wafer processing module that is in particular configured to perform at least one processing and / or manufacturing step on the wafer and / or for directing a processed wafer from the wafer processing module to a wafer transport container for further transport, e.g. to a further wafer processing module.

[0010] The "positioning mechanism" is in particular configured for generating, controlling and / or adjusting forces and / or accelerations that serve to adjust the location and / or position of the wafer-transport container. A positioning mechanism that "contactlessly positions" the wafer-transport container is in particular to be understood as a force transmission of a positioning force of the positioning mechanism acting between the wafer-transport container and the loading and / or unloading station that is performed at least partially contactlessly, in particular without mutual contact points of the wafer-transport container and the loading and / or unloading station. In particular, the contactless positioning is independent from ropes and / or cables or from forces and / or accelerations generated by the ropes and / or cables, independent from the positioning of a wafer-transport container transport system that is in particular configured for the logistics of wafer-transport containers in a wafer fab, and / or independent from guiding elements and / or positive locking elements of the wafer-transport container and / or the loading and / or unloading station, such as guiding pins. The contactless positioning can be performed, for example, by magnetic forces, electrostatic forces and / or impulse forces of a flowing fluid, in particular a gas.

[0011] Positioning by the positioning mechanism is performed in particular in a plane that is at least substantially perpendicular to the coupling direction. The "coupling direction" is understood in particular as the main movement direction along which the wafer-carrying container moves during the coupling process. The coupling direction extends in particular at least substantially perpendicular to the main extension plane of the wafer-carrying container opening element. The coupling direction is preferably realized at least substantially parallel to the direction of gravity. The "main extension plane" of the structural unit is to be understood in particular as a plane that is parallel to the largest side surface of a smallest imaginary cube that barely completely surrounds the structural unit, in particular a plane that extends through the center point of the cube. "Substantially parallel" is to be understood here in particular as an alignment of a direction with respect to a reference direction, in particular in one plane, which direction includes a deviation in particular of less than 8°, advantageously less than 5° and particularly advantageously less than 2° with respect to the reference direction. The expression "substantially perpendicular" defines here in particular an alignment of the direction with respect to a reference direction, the direction and the reference direction enclosing an angle of 90°, in particular when viewed in one plane, which angle in particular includes a maximum deviation of less than 8°, advantageously less than 5° and particularly advantageously less than 2°. Alternatively or additionally, positioning by the positioning mechanism can be performed in a direction extending parallel to the coupling direction.

[0012] It is further proposed that the positioning mechanism is configured for positioning the wafer-carrying container in proximity to the loading and / or unloading position. A precise positioning, in particular a pre-positioning, of the wafer-carrying container in the loading and / or unloading position can advantageously be possible as a result. Furthermore, an already set positioning, in particular a pre-positioning, can advantageously be prevented from being readjusted in case of a subsequent further approach to the loading and / or unloading position as a result of positioning the wafer-carrying container in proximity to the loading and / or unloading station. As a result, a high level of effectiveness of the positioning can advantageously be achieved. Prior to positioning, a rapid coarse positioning is performed, in particular outside the proximity area. "Proximity positioning" means a positioning of the wafer-carrying container in particular in proximity to the loading and / or unloading position of the loading and / or unloading station. The positioning mechanism is arranged in particular in proximity to the loading and / or unloading station. The positioning mechanism is especially preferably configured for generating a force that acts in the vicinity of the loading and / or unloading station and / or develops its maximum effect in the vicinity of the loading and / or unloading station. "Proximity" to the object is especially to be understood as a region of a point in space, each point in space being moved by 1 m or less, preferably 20 cm or less, advantageously 10 cm or less, particularly advantageously 5 cm or less, in a preferred manner 2 cm or less, and in a particularly preferred manner 0.5 cm or less from a contact surface of the object, especially a loading and / or unloading station, which is preferably configured for contacting the object in a contact manner with the wafer-carrying container in the loading and / or unloading position. The wafer-carrying container and the loading and / or unloading station are free from contact with each other, especially in the immediate area. The immediate area is especially realized differently from the contact area where the wafer-carrying container and the loading and / or unloading station are in contact with each other.

[0013] It is further proposed that the positioning mechanism is configured in particular to position the wafer-carrying container such that the deviation from the ideal loading and / or unloading position in a plane perpendicular to the connection direction is no more than 3 mm, preferably no more than 2.5 mm, advantageously no more than 2 mm, in a preferred manner no more than 1.5 mm and in a particularly preferred manner no more than 1 mm. As a result, it is advantageously possible to achieve a particularly accurate positioning of the wafer-carrying container in the loading and / or unloading position. In particular, it is possible as a result to achieve a very accurate coincidence of the pre-positioning by the positioning mechanism with the final positioning mechanism including the positioning pins, so that it is advantageously possible to keep particle generation, in particular as a result of friction generated by the final positioning mechanism, low. Particularly advantageous properties regarding cleanroom compatibility and / or vacuum compatibility of the positioning mechanism can result. The positioning mechanism is configured in particular for generating a force, the effect of which and / or the gradient of which is adjustable in the millimeter range, in particular by a control and / or adjustment unit of the positioning device. A "control and / or adjustment unit" is to be understood as an electronic unit that is preferably configured in particular for controlling and / or adjusting at least the positioning mechanism, in particular at least one positioning element of the positioning mechanism. The control unit preferably comprises a computing unit and, in particular in addition to the computing unit, a storage unit for storing therein a control and / or adjustment program that is configured to be executed by the computing unit. An "ideal loading and / or unloading position" is to be understood in particular as a position of the wafer-carrying container, in which the contact areas of the wafer-carrying container, in particular of the wafer-carrying container opening elements, and the contact areas of the opening elements of the loading and / or unloading station, in particular ideally overlap in such a manner that a maximum tightness of the connection between the wafer-carrying container and the loading and / or unloading station is achieved.In particular the total overlap area, in particular as seen in the coupling direction, which is realised by the contact areas of the wafer transport container opening elements and by the contact areas of the opening elements of the loading and / or unloading station is minimised where there is an ideal overlap. A "deviation from the ideal final position" is to be understood as a deviation, in particular spatial and / or rotational, of the positioning set by the positioning mechanism from a final positioning set by a final positioning mechanism following the positioning mechanism.

[0014] It is further proposed that the positioning device comprises a control and / or adjustment unit configured to control and / or adjust the positioning of the wafer-carrying container by the positioning mechanism, in particular at least in a plane parallel to the loading and / or unloading position. A high level of precision of the positioning achievable by the positioning device may advantageously be possible as a result. In addition, it is advantageously possible to flexibly adapt the positioning for an initial positioning or a coarse positioning. In addition, it is advantageously possible to flexibly adapt the positioning for different, in particular differently formed, wafer-carrying containers. In particular, the control and / or adjustment unit is configured for controlling at least the magnetic field of the positioning mechanism. In particular, the control and / or adjustment unit is configured for the purpose of controlling at least the electrostatic field of the positioning mechanism. In particular, the control and / or adjustment unit is configured for the purpose of controlling at least the flow field of the flow fluid of the positioning mechanism. In particular, the control and / or adjustment unit is provided for at least the purpose of controlling and / or adjusting the strength, alignment, location and / or position of the magnetic field, electrostatic field and / or flow field.

[0015] It is further proposed that the positioning mechanism comprises at least one positioning element configured for generating at least one, in particular contactlessly transferable, positioning force field. As a result, it is possible to achieve advantageous properties with regard to positioning the wafer-carrying container in a loading and / or unloading station for wafers from the wafer-carrying container. In particular, the positioning mechanism advantageously allows reducing and / or avoiding particle generation during the connection process, by which external friction, in particular leading to particle generation, between solid bodies, in particular between the wafer-carrying container and the loading and / or unloading station, can be avoided. The positioning element is configured in particular for generating a magnetic field, an electric field, in particular an electrostatic field and / or a flow field. The positioning element in particular comprises at least one magnetic coil, at least one electrically chargeable, preferably electrically insulative conductor surface and / or at least one nozzle for fluids. The positioning element is in particular realized at least partially integrated with the loading and / or unloading station, in particular with the opening element of the loading and / or unloading station and / or with the wafer-carrying container. The positioning force field is in particular realized as a magnetic field, an electric field, an electrostatic field and / or a flow field of a fluid, in particular a gas. It is conceivable for a plurality of similar and / or different types of positioning force fields of one individual positioning element and / or of a plurality of positioning elements to overlap. It is in particular conceivable to realize at least one positioning force field of a positioning element in a controllable and / or adjustable manner. It is further conceivable to realize at least one positioning force field of a positioning element in a static manner. "Integral" is in particular to be understood as connected in at least a substantial bond, for example as a result of a welding process, a bonding process, an injection process and / or another process that the skilled person considers reasonable, and / or preferably formed in one piece, for example as a result of production from casting and / or as a result of production from a single blank, preferably using a single-piece or multi-piece injection molding process.

[0016] It is further proposed that the positioning mechanism comprises at least one further positioning element, preferably at least two further, in a preferred manner at least three further, and in a particularly preferred manner four or more further, in particular a contactlessly transferable positioning force field, which is configured for generating at least one further positioning force field, preferably at least two further, in a preferred manner at least three further, and in a particularly preferred manner four or more further. As a result, a particularly accurate positioning is advantageously possible. In particular, as a result, it is possible to achieve a particularly high level of precision of the control and / or adjustment of the positioning. As a result, it is advantageously possible to superimpose force fields of different and / or similar types, in particular for an increase in the control precision. In particular, the further positioning element can be realized as a positioning element corresponding to the positioning element. For example, it is conceivable that the positioning element arranged in the loading and / or unloading station generates a controllable and / or adjustable magnetic field by means of a magnetic coil which is realized as a permanent magnet and which is configured for interacting with a static magnetic field of a corresponding positioning element arranged in the wafer transport container.

[0017] If the positioning mechanism, in particular the positioning element, is configured for the purpose of generating at least one repulsive force acting in particular repulsively against the wafer-carrying container for positioning, the risk of unintentional particle-generating contact between the object positioned by the positioning mechanism and the positioning element and / or further objects, for example by inducing too much attractive force, is advantageously avoided, so that it is advantageously possible to keep the number of particles generated by the positioning mechanism low. A "repulsive force" is to be understood as a force configured for the purpose of displacing and / or pushing the wafer-carrying container in a direction aligned in particular towards and away from the positioning element generating the repulsive force.

[0018] It is further proposed that the at least one positioning element is configured at least for the purpose of generating at least one positioning force field realized as a magnetic field. As a result, it is possible to achieve an effective contactless force transmission, so that in particular particle generation can be reduced and / or avoided. Furthermore, in particular a magnetic field and / or a combination of magnetic fields can be easily and / or precisely controlled and / or adjusted, and the combination of magnetic fields can be particularly varied, in particular in small spaces.

[0019] If at least one, in particular the corresponding, positioning element is at least partially realized as a permanent magnet, it is advantageously possible to generate the positioning force field in a currentless manner. A positioning element realized as a permanent magnet advantageously enhances the reaction to changes in the positioning force field generated by the controllable positioning element and overlapping with the positioning force field of the positioning element realized as a permanent magnet, so that the power required to activate the positioning movement can be advantageously kept small. The positioning element realized as a permanent magnet is arranged in particular on the wafer transport container.

[0020] If at least one positioning element is at least partially realized integrally with the wafer transport container, a positioning mechanism of simple design is advantageously made possible. In particular, the positioning element realized integrally with the wafer transport container is realized as a permanent magnet and / or a diamagnetic, paramagnetic and / or ferromagnetic element. The positioning element is realized at least partially from a diamagnetic, paramagnetic and / or ferromagnetic material in particular. In particular, the positioning element realized integrally with the wafer transport container is realized integrally with a wafer transport container opening element and / or a base body of the wafer transport container. The wafer transport container preferably comprises a plurality of positioning elements, preferably at least some of which are realized at least partially integrally with the wafer transport container. It is further conceivable that an outer shell of the wafer transport container in particular realizes the corresponding positioning element.

[0021] It is further proposed that at least one positioning element is connected in a captive manner to the loading and / or unloading station. As a result, positioning with respect to the loading and / or unloading station, in particular the surface of the loading and / or unloading station, is advantageously made possible. The term "connected in a captive manner" is to be understood in particular as the positioning element and the loading and / or unloading station being connected together in any given operating state. In an advantageous manner, the positioning element and the loading and / or unloading station are separable from each other only by tools, only as a result of destruction and / or only by loss of function. The positioning element is preferably connected in a captive manner to a non-movable component of the loading and / or unloading station. Alternatively to this, the positioning element can also be connected in a captive manner to a movably supported component of the loading and / or unloading station, for example an opening element of the loading and / or unloading station.

[0022] If the positioning element is supported so as to be movable relative to the loading and / or unloading station, a particularly wide variety of positioning force fields can be advantageously made possible, as a result of which particularly accurate positioning of the wafer-carrying container can be made possible. It is conceivable that the positioning element is configured at least in part for following the vertical movement of the wafer-carrying container in the direction of the loading and / or unloading position or in the direction of the surface of the opening element of the loading and / or unloading unit, in particular during the coupling and / or decoupling process. The phrase "movably supported" means in particular at least translationally supported, at least pivotally supported and / or at least rotationally supported. The positioning element is preferably supported so as to be movable at least relative to the surface of the loading and / or unloading station and / or the opening element of the loading and / or unloading station. In particular, the positioning element is mounted so as to be pivotable around at least one, preferably at least two axes, preferably at least one axis aligned vertically or horizontally with respect to the surface of the loading and / or unloading station. In particular, the positioning element is supported so as to be translationally movable in at least one, preferably at least two, in a preferred manner at least three and in a particularly preferred manner at least four spatial directions, including at least one, in a preferred manner at least two directions extending parallel to the surface of the loading and / or unloading station, at least one direction extending perpendicular to the surface of the loading and / or unloading station and / or at least one direction extending circumferentially along the cylinder mantle of a virtual cylinder pointing perpendicularly away from the surface of the loading and / or unloading station.

[0023] It is further proposed that at least one, in particular one further positioning element is configured for generating at least one positioning force field realized as an electric field, in particular an electrostatic field, As a result, it is advantageously possible to achieve an effective contactless force transmission, as a result of which it is possible in particular to reduce and / or avoid particle generation.

[0024] It is further proposed that the at least one, in particular additional, further positioning element is configured for generating at least one positioning force field, which is realized as a flow field of the flowing gas. As a result, it is advantageously possible to achieve an effective contactless force transmission, as a result of which it is possible in particular to reduce and / or avoid particle generation.

[0025] It is further proposed that the positioning mechanism comprises at least one nozzle for generating an at least partially directed gas flow, and that the gas flow, in particular the average total gas flow of the flow field generated by the nozzle, is aligned at least substantially parallel to the connection direction of the positioning device. As a result, it is advantageously possible to guide the wafer-carrying container in the connection direction. The nozzle is arranged in particular on a surface of the loading and / or unloading station. The nozzle is arranged in particular circumferentially around the opening element of the loading and / or unloading station. The nozzle is preferably provided for the purpose of generating an air curtain around the opening element of the loading and / or unloading station. As a result of such an alignment of the gas flow perpendicular to the surface of the loading and / or unloading station, particles can be advantageously kept away from the surface of the loading and / or unloading station. The nozzle is configured in particular for a suction function. Alternatively to this, the nozzle can also be configured for a blowing function.

[0026] If at least one, in particular further gas flow, in particular the average total gas flow of the flow field, of the positioning element is aligned at least substantially perpendicular to the coupling direction of the positioning device, contactless positioning of the wafer-carrying container can be advantageously enabled in a plane parallel to the surface of the loading and / or unloading station. In particular, the positioning element comprises at least one nozzle, in particular configured for providing an outlet opening and / or an inlet opening for a flowing gas, in particular flowing air. The nozzle is in particular realized to be movable. In particular, the direction of the gas flow emerging from the nozzle is adjustable by the control and / or adjustment unit. The nozzle of the positioning element is in particular configured for a blowing function. In the case of the blowing function, the gas flow pushes the wafer-carrying container in particular in a direction directed away from the positioning element, in particular the nozzle. Alternatively to this, the nozzle can also be provided for a suction function. In the case of the suction function, the gas flow pulls the wafer-carrying container in particular in a direction directed towards the positioning element, in particular the nozzle.

[0027] It is further proposed that the positioning device comprises an inspection unit for a position check, in particular in three dimensions, in particular a real-time position check and / or a position adjustment, preferably controlled, of the wafer-carrying container during the docking process. As a result, it is advantageously possible to achieve a high level of positioning precision, in particular by actively controlling and / or adjusting the positioning process. Furthermore, it is likewise advantageously possible to increase the operational reliability as a result, by enabling a check of the performed positioning of the wafer-carrying container, in particular before opening the wafer-carrying container. In particular, the inspection unit is configured for detecting the current position of the wafer-carrying container and, if applicable, for actuating at least one positioning element for a position correction, in particular by changing the positioning force field of the positioning element and / or by changing the spatial position and / or spatial orientation of the positioning element. "Three-dimensional position check" is to be understood in particular as a position check of at least one of the spatial positions of the wafer-carrying container in a plane parallel to the surface of the loading and / or unloading station and / or a position check of the rotational position of the wafer-carrying container. "Real-time position inspection" is to be understood in particular as at least one position inspection, in which the actual spatial and / or rotational position of the wafer-carrying container detected by the inspection unit is directly read out by the control and / or adjustment unit, a particularly spatially and / or rotationally required position of the wafer-carrying container is then determined by the control and / or adjustment unit, and at least one control and / or adjustment command, in particular for a position correction of the actual position of the wafer-carrying container, is then output by the control and / or adjustment unit to at least one positioning element. "Position adjustment" is to be understood in particular as a process in which the actual position of the wafer-carrying container recognized by the inspection unit is moved closer to a predefined required position of the wafer-carrying container by controlling and / or adjusting at least one positioning force field.In particular, when the wafer transport container is connected to the loading and / or unloading station, the required position of the wafer transport container achieves an ideal loading and / or unloading position and / or a position where the wafer transport container and the loading and / or unloading station overlap in an ideal manner, in particular along the connection direction.

[0028] It is further proposed that the inspection unit comprises at least one sensor unit, which is realized at least partially integrally with the positioning mechanism, in particular with the positioning element. As a result, it is possible to reduce the complexity, in particular by being able to assign several tasks to one individual component. Two units realized "at least partially integrally" are to be understood in particular as a unit which comprises at least one, in particular at least two, advantageously at least three common elements which are component parts, in particular functionally significant component parts, of the two units. The sensor unit comprises in particular at least one sensor element. The sensor element is in particular configured at least for the purpose of sensing parameters of the positioning device, the wafer transport container and / or the loading and / or unloading station. The parameters of the positioning device may in particular include the rotational position and / or movement of the wafer transport container, the spatial position and / or movement of the wafer transport container and / or the distance and / or distance correction between the wafer transport container and the sensor element. The sensor element is preferably configured at least for the purpose of sensing the spatial position and / or movement of the wafer transport container relative to the surface of the loading and / or unloading station. In particular, the sensor element is realized as at least one magnetic coil, which is preferably configured for generating a positioning force field realized as a magnetic field. In particular, the sensor element is preferably configured for sensing a parameter of the positioning device by measuring a countercurrent induced by the magnetic field, in particular by superimposing the positioning force field, simultaneously with the generation of the positioning force field, in particular in the conductive path of the magnetic coil. Alternatively or additionally, the sensor unit may include at least one sensor element realized separately from the positioning mechanism, in particular the positioning element. In particular, the sensor unit may include at least one sensor element realized as an optical sensor, for example a camera and / or a light barrier.

[0029] If the positioning device comprises a final positioning mechanism, which is realized at least partially separately from the final positioning mechanism, it is possible to achieve advantageous properties with regard to positioning the wafer-carrying container at the loading and / or unloading station for wafers from the wafer-carrying container. In particular, it is advantageously possible to reduce particle generation during the coupling process by the positioning mechanism, since external friction, in particular between the solid bodies, in particular between the wafer-carrying container and the loading and / or unloading station, which leads in particular to particle generation, can be avoided by the positioning mechanism during positioning, in particular pre-positioning, and can preferably be limited to the final positioning mechanism. In particular as a result of the precise positioning until the final positioning is reached, friction during the final positioning can be minimized in an advantageous manner. The final positioning mechanism comprises a guiding unit which is configured in particular for the purpose of determining the final positioning of the wafer-carrying container in the ideal loading and / or unloading position, in particular by guiding a guiding element of the guiding unit in a guiding rail of the guiding unit. The guiding unit preferably comprises a plurality of guiding elements and guiding rails. In particular, the guiding unit and / or the guiding rail are arranged on a surface of the wafer-carrying container opening element, in particular on the outside of the wafer-carrying container, and on a surface of the loading and / or unloading station, in particular on the outside of the loading and / or unloading station and / or the opening element of the loading and / or unloading station. Furthermore, the positioning device comprises a coarse positioning mechanism realized at least partially separated from the positioning mechanism and / or the final positioning mechanism. In particular, the coarse positioning mechanism comprises a positioning by a wafer-carrying container transport system of a wafer fab, which in particular holds the wafer-carrying container by ropes and / or cables and coarsely positions it relative to the loading and / or unloading station.

[0030] Further proposed is a loading and / or unloading system for loading and / or unloading wafers from a wafer-carrying container, the loading and / or unloading system having a wafer-carrying container, a loading and / or unloading station and a positioning device, in particular a wafer-carrying container positioning device. As a result of the loading and / or unloading system according to the invention, it is possible to achieve advantageous properties with regard to positioning the wafer-carrying container at the loading and / or unloading station for wafers from the wafer-carrying container. In particular, particle generation can be advantageously reduced when the wafer-carrying container is positioned at the loading and / or unloading station.

[0031] Also proposed is a method of operating a positioning device, in particular a wafer transport container positioning device and / or a loading and / or unloading system, where in the case of a coupling process between the wafer transport container and the loading and / or unloading station, the wafer transport container is contactlessly positioned relative to the loading and / or unloading station, as a result of which low particle generation during positioning is possible.

[0032] It is further proposed that the wafer transport container is specifically positioned by the positioning device following an external coarse positioning, as a result of which a high efficiency of positioning can be advantageously achieved.

[0033] The positioning device according to the invention, in particular the wafer-carrying container positioning device, the loading and / or unloading system according to the invention and / or the method according to the invention are in this respect not limited to the above-mentioned applications and embodiments, in particular the positioning device according to the invention, in particular the wafer-carrying container positioning device, the loading and / or unloading system according to the invention and / or the method according to the invention may comprise a number of individual elements, components, units and method steps that deviate from the number described herein in order to fulfil the functions described herein.

[0034] Further advantages arise from the following description of the drawings. Four exemplary embodiments of the present invention are shown in the drawings. The drawings, description and claims contain a number of combinations of features. Those skilled in the art will conveniently view each feature individually and combine them to form further reasonable combinations. [Brief description of the drawings]

[0035] [Figure 1] 1 shows a schematic diagram of a loading and / or unloading system comprising a wafer transport container, comprising a loading and / or unloading station, and comprising a positioning device. [Diagram 2] 1 shows a flow diagram of a method for operating a positioning device. [Diagram 3] FIG. 1 shows a schematic diagram of an alternative loading and / or unloading system with an alternative positioning device. [Figure 4] 13 shows a schematic diagram of an alternative positioning element of an alternative positioning device; [Diagram 5] 13 shows a schematic diagram of a further alternative positioning element of a further alternative positioning device; [Figure 6] FIG. 13 shows a schematic top view of a further alternative loading and / or unloading station with a further alternative positioning element of a further further alternative positioning device; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] FIG. 1 shows a loading and / or unloading system 38a. The loading and / or unloading system 38a includes a wafer-transport container 10a. The wafer-transport container 10a is configured to transport and / or store a wafer 12a. The loading and / or unloading system 38a is configured to load and / or unload the wafer 12a from the wafer-transport container 10a. The wafer-transport container 10a includes a wafer-transport container opening element 62a. The wafer-transport container 10a includes a base body 64a. The wafer-transport container opening element 62a is configured to close an opening of the base body 64a of the wafer-transport container 10a. The wafer-transport container opening element 62a is realized to be removable from the base body 64a of the wafer-transport container 10a.

[0037] The loading and / or unloading system 38a includes a loading and / or unloading station 14a. The loading and / or unloading station 14a is configured to load and / or unload the wafer 12a from the wafer-transport container 10a. To load and / or unload the wafer 12a, the loading and / or unloading station 14a unloads the wafer-transport container 10a by releasing the wafer-transport container unsealing element 62a from the base body 64a of the wafer-transport container 10a. To unseal the wafer-transport container 10a, the loading and / or unloading station 14a moves the wafer-transport container unsealing element 62a in a loading and / or unloading direction 66a. The loading and / or unloading direction 66a extends at least substantially perpendicular to the main extension surface of the wafer-transport container unsealing element 62a. Once opened, the wafer-transport container opening element 62a is lowered by the loading and / or unloading station 14a into the inside of the loading and / or unloading station 14a. Once the wafer-transport container 10a is loaded and / or unloaded, the inside of the base body 64a of the wafer-transport container 10a is vacuum-tightly connected to the inside of the loading and / or unloading station 14a. The loading and / or unloading station 14a is configured to further transport the wafers 12a unloaded from the wafer-transport container 10a to at least one wafer processing module (not shown).

[0038] The loading and / or unloading station 14a includes a surface 40a configured to place the wafer-transport container 10a thereon in contact. The loading and / or unloading station 14a includes a loading and / or unloading position. The loading and / or unloading position is realized as a position where the wafer-transport container 10a is placed in the loading and / or unloading station 14a and can be loaded and / or unloaded by realizing a vacuum-tight connection between the inside of the loading and / or unloading station 14a and the inside of the wafer-transport container 10a. The loading and / or unloading position is located on the surface 40a of the loading and / or unloading station 14a. In the view shown in FIG. 1, the loading and / or unloading system 38a is located in a non-coupled state. The wafer-transport container 10a is not in contact with the loading and / or unloading station 14a. The wafer transport container 10a is located adjacent to a loading and / or unloading station 14a.

[0039] The loading and / or unloading system 38a includes a wafer transport container transport system 50a. The wafer transport container transport system 50a is configured to transport the wafer transport container 10a between different loading and / or unloading systems 38a and / or between further devices of a wafer fab. The wafer transport container transport system 50a is realized as a cleanroom compatible overhead hoist transport (OHT) system. Alternatively, the wafer transport container transport system 50a can be realized as another type of transport system for the wafer transport container 10a. For example, a system of self-flying drones can be configured to transport the wafer transport container 10a to or from the loading and / or unloading station 14a. The wafer transport container transport system 50a includes a rail system 56a. The rail system 56a includes at least one rail configured for predetermining a transport path.

[0040] The wafer-transport container transport system 50a includes a transport carriage 54a. The transport carriage 54a is configured to be moved or to move along rails of a rail system 56a. The transport carriage 54a includes a base body 70a. The transport carriage 54a includes a holder 58a. The holder 58a is configured to receive the wafer-transport container 10a. The holder 58a is configured to hold the wafer-transport container 10a during transport by the transport carriage 54a, during coarse positioning, during positioning, during pre-positioning and / or during final positioning. The holder 58a is configured to releasably hold the wafer-transport container 10a. The transport carriage 54a includes a plurality of holding elements 52a. The holding elements 52a are realized in an elongated manner. The holding elements 52a are realized in a flexible manner. The holding elements 52a are realized as cables and / or ropes. The holding element 52a realizes a connection between the holder 58a and the base body 70a of the transport carriage 54a. The distance between the base body 70a of the transport carriage 54a and the holder 58a is variable. The holding element 52a can be rolled up to vary the distance between the base body 70a of the transport carriage 54a and the holder 58a. The transport carriage 54a realizes a coarse positioning mechanism 60a of the wafer transport container 10a. The coarse positioning mechanism 60a is configured to coarsely position the wafer transport container 10a relative to the loading and / or unloading station 14a.

[0041] The transport carriage 54a includes a control unit 68a. The control unit 68a of the transport carriage 54a is configured to control and / or adjust the holder 58a, the holding element 52a, in particular the length of the holding element 52a. The control unit 68a of the transport carriage 54a is configured to control and / or adjust the coarse positioning mechanism 60a. The control unit 68a of the transport carriage 54a is configured to control and / or adjust the movement of the transport carriage 54a along the rail system 56a. The control unit 68a of the transport carriage 54a includes a communication module 74a. The communication module 74a of the control unit 68a of the transport carriage 54a is configured for receiving control and / or adjustment commands for controlling and / or adjusting the transport carriage 54a, the holder 58a and / or the holding element 52a. The communication module 74a of the control unit 68a of the transport carriage 54a is configured for the purpose of transmitting control and / or adjustment commands of the control unit 68a of the transport carriage 54a to further control units, for example of further transport carriages and / or further loading and / or unloading stations 14a.

[0042] The loading and / or unloading system 38a includes a positioning device. The positioning device realizes a wafer transport container positioning device. The positioning device is configured to position the wafer transport container 10a at the loading and / or unloading position. The positioning device is configured to pre-position the wafer transport container 10a at the loading and / or unloading position. The loading and / or unloading system 38a includes a positioning mechanism 16a. The positioning mechanism 16a is configured to position the wafer transport container 10a without contact in a coupling process between the wafer transport container 10a and the loading and / or unloading station 14a. The positioning mechanism 16a is configured for the purpose of generating a repulsive force and / or an attractive force for positioning. The positioning mechanism 16a is realized separately from the coarse positioning mechanism 60a. The positioning mechanism 16a is realized independently from the wafer transport container transport system 50a, in particular independently from the movement of the wafer transport container transport system 50a. The positioning mechanism 16a is realized independently from the holding element 52a.

[0043] The positioning mechanism 16a is configured to position the wafer-transport container 10a in the vicinity of the loading and / or unloading position. The positioning mechanism 16a is configured to position the wafer-transport container in a horizontal plane. The horizontal plane is located perpendicular to the connection direction 30a. The positioning mechanism 16a is configured for positioning the wafer-transport container 10a in such a manner that the deviation from the ideal loading and / or unloading position is not more than 3 mm. The positioning device includes a control and / or adjustment unit 18a. The control and / or adjustment unit 18a is configured for controlling and / or adjusting the positioning of the wafer-transport container 10a by the positioning mechanism 16a. The control and / or adjustment unit 18a is assigned to the loading and / or unloading station 14a. The control and / or adjustment unit 18a of the positioning mechanism 16a includes a communication module 72a. The communication module 72a of the control and / or adjustment unit 18a of the positioning mechanism 16a is configured for receiving control and / or adjustment commands for controlling the positioning process of the wafer transport container 10a, and the communication module 72a of the control and / or adjustment unit 18a of the positioning mechanism 16a is configured for transmitting control and / or adjustment commands of the control and / or adjustment unit 18a of the positioning mechanism 16a to a further control unit, for example of the transport carriage 54a.

[0044] The positioning device includes a final positioning mechanism 36a. The final positioning mechanism 36a is realized separately from the positioning mechanism 16a. The final positioning mechanism 36a is realized in contact. The loading and / or unloading system 38a includes a guide unit 42a. The guide unit 42a is the main functional component of the final positioning mechanism 36a. The guide unit 42a includes a guide element 44a. The guide element 44a is realized as a bolt-like protrusion. The guide element 44a is realized as a pin. The guide element 44a is realized in a tapered manner towards its end. The guide element 44a is arranged on a surface 40a of the loading and / or unloading station 14a. The guide unit 42a includes a guide rail 46a. The guide rail 46a is realized as a recess. The guide rail 46a is arranged on the outer surface of the wafer-transport container opening element 62a. The guide element 44a is configured for engaging in the guide rail 46a during final positioning. The guide rail 46a includes an outer shape that is complementary to the guide element 44a. The surface of the guide element 44a slides along the surface of the guide rail 46a, causing the final positioning mechanism 36a to align the wafer transport container 10a with respect to the loading and / or unloading station 14a by the guide unit 42a.

[0045] The positioning mechanism 16a comprises positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. The positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are each configured to generate a positioning force field. The positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are configured for generating a positioning force field realized as a magnetic field. Alternatively or additionally, the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are configured for generating a positioning force field realized as an electric field, in particular an electrostatic field. The three positioning elements 20a, 22a, 24a are arranged in the loading and / or unloading station 14a. The three positioning elements 20a, 22a, 24a arranged in the loading and / or unloading station 14a are connected in a captive manner to the loading and / or unloading station 14a. The three positioning elements 20a, 22a, 24a arranged in the loading and / or unloading station 14a are actively controllable and / or adjustable. The three positioning elements 20a, 22a, 24a arranged in the loading and / or unloading station 14a are operatively connected to a control and / or adjustment unit 18a. The control and / or adjustment unit 18a is configured for controlling and / or adjusting a positioning force field of the actively controllable and / or adjustable positioning elements 20a, 22a, 24a. The control and / or adjustment unit 18a is configured for controlling and / or adjusting a strength and / or a direction of the positioning force field. Each positioning element 20a, 22a, 24a is individually actuatable. The positioning force fields of the positioning elements 20a, 22a, 24a are each individually actuatable and / or adjustable, and actuation of the positioning elements 20a, 22a, 24a can be coordinated with control of the wafer-transport container transport system 50a via the communication module 72a of the control and / or adjustment unit 18a.

[0046] The three further positioning elements 20'a, 22'a, 24'a are realized as corresponding positioning elements 20'a, 22'a, 24'a. The further positioning elements 20'a, 22'a, 24'a are realized as passive positioning elements 20'a, 22'a, 24'a. The further positioning elements 20'a, 22'a, 24'a are realized as permanent magnets 26a. Alternatively or additionally, the further positioning elements 20'a, 22'a, 24'a are realized from a ferromagnetic material. The further positioning elements 20'a, 22'a, 24'a include a static positioning force field. The static positioning force field of the further positioning elements 20'a, 22'a, 24'a is configured for interacting with the actively adjustable and / or controllable positioning force field of the positioning elements 20a, 22a, 24a. The further positioning elements 20'a, 22'a, 24'a are arranged in the wafer transport container 10a. The further positioning elements 20'a, 22'a, 24'a are arranged in the wafer transport container opening element 62a. The further positioning elements 20'a, 22'a, 24'a are realized integrally with the wafer transport container 10a. The further positioning elements 20'a, 22'a, 24'a are realized integrally with the wafer transport container opening element 62a. The positioning force fields of the further positioning elements 20'a, 22'a, 24'a are realized independently of a power supply. Alternatively or additionally, it is conceivable to assign active positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a to the wafer transport container 10a and / or to assign passive positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a to the loading and / or unloading station 14a.

[0047] The positioning device includes an inspection unit 32a. The inspection unit 32a is configured for position inspection and / or position adjustment of the actual position of the wafer transport container 10a during the docking process. The inspection unit 32a includes a sensor unit 34a. The sensor unit 34a is realized integrally with the positioning mechanism 16a. The sensor unit 34a includes a sensor element 48a. The sensor element 48a is realized integrally with the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. Alternatively or additionally, the sensor unit 34a may include a sensor element 48a realized separately with the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. The sensor unit 34a transmits sensor data from the sensor element 48a to the control and / or adjustment unit 18a. The control and / or adjustment unit 18a is configured for performing a control and / or adjustment of the positioning force fields of the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a depending on the data from the sensor unit 34a. The control and / or adjustment unit 18a is configured for performing a comparison between the actual position of the wafer-transport container 10a and a requested position of the wafer-transport container 10a by means of the position data from the sensor unit 34a and for performing a controlled and / or adjusted positioning of the wafer-transport container 10a in the loading and / or unloading positions.

[0048] 2 shows a flow diagram of a method for operating the positioning device and / or the loading and / or unloading system 38a. In at least one method step 76a, the wafer-transport container 10a is delivered by the wafer-transport container transport system 50a to a connection part of the rail system 56a associated with the loading and / or unloading station 14a. In at least one further method step 78a, a coarse positioning of the wafer-transport container 10a with respect to the surface 40a of the loading and / or unloading station 14a is performed by the coarse positioning mechanism 60a. In this case, the wafer-transport container 10a is connected to the transport carriage 54a by means of a holder 58a and is lowered on the holding element 52a and suspended vertically along the connecting direction 30a until it is moved close to the loading and / or unloading station 14a. In at least one further method step 80a, the wafer-transport container 10a is positioned, in particular pre-positioned, after the coarse positioning. At the same time, during the coupling process between the wafer transport container 10a and the loading and / or unloading station 14a, the wafer transport container 10a is positioned, in particular pre-positioned, in a contact-free manner at the loading and / or unloading station 14a by the positioning mechanism 16a. In at least one further method step 82a, after positioning, in particular after pre-positioning, the wafer transport container 10a is finally positioned by the final positioning mechanism 36a. At the same time, the guide rails 46a of the already pre-positioned wafer transport container 10a are moved into engagement with the guide elements 44a of the loading and / or unloading station 14a. If slight deviations from the ideal loading and / or unloading position still exist after positioning by the positioning mechanism 16a, they are corrected by mutual engagement of the parts of the guide unit 42a.In at least one further method step 84a, the wafer transport container 10a is opened and the wafers 12a transported therein are reloaded to a wafer processing module via the loading and / or unloading station 14a. In at least one further method step 86a, the wafers 12a are loaded into the wafer transport container 10a via the loading and / or unloading station 14a. The opened wafer transport container 10a is docked to the loading and / or unloading station 14a and is closed again in a method step 86a. In at least one further method step 88a, the closed wafer transport container 10a is lifted by the wafer transport container transport system 50a and removed from the loading and / or unloading station 14a. In at least one further method step 90a, the wafer transport container 10a is moved by the wafer transport container transport system 50a from the connection part of the rail system 56a associated with the loading and / or unloading station 14a.

[0049] Figures 3-6 show three further exemplary embodiments of the present invention. The following description and figures are substantially limited to the differences between the exemplary embodiments, whereby reference to identically assigned components, in particular to components having the same reference numbers, may in principle be made to the drawings and / or descriptions of other exemplary embodiments, in particular the exemplary embodiments of Figures 1 and 2. In order to differentiate the exemplary embodiments, the reference numbers of the exemplary embodiments of Figures 1 and 2 are followed by the letter a. The letter a is replaced by the letters b-d in the exemplary embodiments of Figures 3-6.

[0050] FIG. 3 shows a schematic diagram of a loading and / or unloading system 38b having a wafer-transporting container 10b, a loading and / or unloading station 14b, and a positioning device. In the schematic diagram shown in FIG. 3, the loading and / or unloading system 38b is arranged in an uncoupled state. The wafer-transporting container 10b is not in contact with the loading and / or unloading station 14b. The wafer-transporting container 10b is arranged in a state close to the loading and / or unloading station 14b. The positioning device includes a positioning mechanism 16b. The positioning mechanism 16b includes positioning elements 20b, 22b, 24b, 92b. The positioning elements 20b, 22b, 24b, 92b are each configured for generating a positioning force field. The positioning elements 20b, 22b, 24b, 92b are configured for generating a positioning force field realized as a magnetic field. The positioning force field is configured for interacting with the wafer-transporting container 10b. The wafer-transport container 10b includes an outer shell 96b. The outer shell 96b is at least partially realized from a material that is repelled and / or attracted by an external magnetic field. The positioning force field is configured for interacting with the material of the outer shell 96b of the wafer-transport container 10b. Alternatively or additionally, the positioning elements 20b, 22b, 24b, 92b may be configured for generating a positioning force field realized as an electric field, in particular an electrostatic field.

[0051] The positioning device includes a coupling unit 94b. The coupling unit 94b is configured as a support structure for the loading and / or unloading station 14b of the positioning elements 20b, 22b, 24b, 92b. The coupling unit 94b includes two double rails that connect the positioning elements 20b, 22b, 24b, 92b to the loading and / or unloading station 14b in a captured manner. The positioning elements 20b, 22b, 24b, 92b are supported so as to be movable, in particular slidable and rotatable, relative to the surface 40b of the loading and / or unloading station 14b. The positioning elements 20b, 22b, 24b, 92b are configured for the purpose of at least partially following the movement of the wafer-transport container 10b when the wafer-transport container 10b moves in the coupling direction 30b. As a result, good stability can be achieved in the coupling process between the wafer transport container 10b and the loading and / or unloading station 14b in an advantageous manner of positioning by a positioning force field. The positioning device shown in Figure 3 comprises four positioning elements 20b, 22b, 24b, 92b, each mounted two by two on a double rail.

[0052] Alternatively, the positioning device may include more than four positioning elements 20b, 22b, 24b, 92b, more than two positioning elements 20b, 22b, 24b, 92b per double rail, and / or more than two double rails. Furthermore, the positioning elements 20b, 22b, 24b, 92b may be supported in another manner to be movable and / or rotatable relative to the loading and / or unloading station 14b, for example by a three-dimensionally rotatable and translationally slidably rotatable tilt table and / or swivel table, and / or by a displaceably supported ball joint (see also FIG. 4).

[0053] 4 shows a schematic diagram of a multi-directionally rotatable and translatable positioning element 20b, 22b, 24b, 92b. The positioning elements 20b, 22b, 24b, 92b shown are translatable, for example along three translation axes 98b in the x, y and z directions. The positioning elements 20b, 22b, 24b, 92b shown are rotatable, for example around four rotation axes 100b aligned at angles inclined ±45° to the horizontal, vertical and horizontal directions. Further rotation and / or translation axes are conceivable instead. In an advantageous manner, the greater the number of possible, particularly operable, rotation and / or translation positions of the positioning elements 20b, 22b, 24b, 92b, the greater the accuracy of the contactless positioning can be.

[0054] Fig. 5 shows a schematic diagram of a further alternative positioning element 20c, 22c, 24c, 92c of a further alternative positioning device. The positioning element 20c, 22c, 24c, 92c is configured for generating a positioning force field realized as a flow field of flowing gas. The positioning element 20c, 22c, 24c, 92c includes a nozzle 28c. The nozzle 28c is configured to generate a partially directed gas flow. The partially directed gas flow emerges from the nozzle 28c during active positioning. The gas flow of the nozzle 28c of the positioning element 20c, 22c, 24c, 92c is aligned substantially perpendicular to the coupling direction 30c of the positioning device. When the partially directed gas flow emerges from the nozzle 28c, the nozzle 28c is arranged in a blowing mode. In the blowing mode, the nozzle 28c is configured to push an object, in particular a wafer transport container 10c, away from the positioning element 20c, 22c, 24c, 92c. Alternatively or additionally, the nozzles 28c may be configured in a suction mode. In the suction mode, the gas flow is substantially directed to the nozzles 28c. The positioning element 20c, 22c, 24c, 92c may include five individual nozzles 28c. The nozzles 28c may be connectable to a common pump system for generating the gas flow and / or may include individual pump systems for at least two of the nozzles 28c. Alternatively, the positioning element 20c, 22c, 24c, 92c may include a plurality of nozzles 28c other than five.

[0055] FIG. 6 is a top schematic view of a further alternative loading and / or unloading station 14d of a loading and / or unloading system 38d. The loading and / or unloading system 38d includes a positioning device. The positioning device includes a positioning mechanism 16d. The positioning mechanism 16d includes a nozzle 28d. The nozzle 28d is configured to generate a partially directed gas flow. The gas flow is aligned substantially parallel to a coupling direction 30d of the positioning device. The coupling direction 30d is perpendicular to the drawing plane of FIG. 6. The nozzle 28d is realized in a ring-like form. The nozzle 28d realizes a closed annular form. Alternatively, the nozzle 28d can include a closed form that deviates from the annular form or a partially interrupted form that can be realized in a ring-like form and / or deviates from the annular form. The nozzle 28d is arranged in a ring-like form around an area of ​​the loading and / or unloading station 14d that is configured to receive the wafer-transport container 10d. The nozzle 28d is arranged in a ring-like form around an area of ​​the loading and / or unloading station 14d that is configured to be lowered into the interior space of the loading and / or unloading station 14d for opening the wafer-transport container 10d. The nozzle 28d is arranged in a ring-like form around the opening element 102d of the loading and / or unloading station 14d. The nozzle 28d is configured for the purpose of realizing an air curtain around the opening element 102d of the loading and / or unloading station 14d in an active operation. The nozzle 28d is configured for the purpose of realizing an air curtain around an area of ​​the loading and / or unloading station 14d that is configured to receive the wafer-transport container 10d in an active operation. The nozzle 28d is configured for the purpose of realizing an air curtain around an area of ​​the loading and / or unloading station 14d that is lowered into the interior space of the loading and / or unloading station 14d for opening the wafer-transport container 10d in an active operation. [Explanation of symbols]

[0056] 10...wafer transport container, 12...wafer, 14...loading and / or unloading station, 16...positioning mechanism, 18...control and / or adjustment unit, 20...positioning element, 22...positioning element, 24...positioning element, 26...permanent magnet, 28...nozzle, 30...coupling direction, 32...inspection unit, 34...sensor unit, 36...final positioning mechanism, 38...loading and / or unloading system, 40...surface, 42...guiding unit, 44...guiding element, 46...guiding rail, 48...sensor element, 50...wafer transport container transport system, 52...holding element, 54 ...transport carriage, 56...rail system, 58...holder, 60...coarse positioning mechanism, 62...wafer transport container opening element, 64...base body, 66...loading and / or unloading direction, 68...control unit, 70...base body, 72...communication module, 74...communication module, 76...method steps, 78...method steps, 80...method steps, 82...method steps, 84...method steps, 86...method steps, 88...method steps, 90...method steps, 92...positioning element, 94...coupling unit, 96...outer shell, 98...translation axis, 100...rotation axis, 102...opening element.

Claims

1. A loading and / or unloading system (38a-d) for loading and / or unloading wafers (12a-d) from a wafer transport container (10a-d), The system includes a wafer transport container (10a-d), a loading and / or unloading station (14a-d), and a positioning device for positioning the wafer transport container (10a-d) at a loading and / or unloading position of the loading and / or unloading station (14a-d), the positioning of the positioning device is performed by contactlessly controlling at least two-dimensional movements of the wafer transport container (10a-d) in such a manner that the wafer transport container (10a-d) assumes spatial alignment in a plane that is at least substantially perpendicular to a main movement direction along which the wafer transport container (10a-d) moves during a docking process when approaching the loading and / or unloading position where the wafer transport container (10a-d) is connectable in a vacuum-tight manner to the loading and / or unloading station (14a-d); The positioning device includes: said loading and / or unloading stations (14a-d) configured for loading and / or unloading wafers (12a-d) from at least said wafer transport containers (10a-d); a final positioning mechanism (36a-d) implemented in a contact manner, the final positioning mechanism (36a-d) including a guide rail (46a-d) of the guide unit (42a-d) and at least one guide protrusion slidably engageable with the guide rail (46a-d); a cleanroom-compatible pre-positioning mechanism (16a-d) configured to pre-position the wafer transport container (10a-d) in a non-contact manner during a coupling process between the wafer transport container (10a-d) and the loading and / or unloading station (14a-d), the cleanroom-compatible pre-positioning mechanism (16a-d) being independent of a wafer transport container transport system (50a-d) configured for logistics of the wafer transport container (10a-d); a controller including a computing unit and a storage unit storing therein a control and / or adjustment program executed by the computing unit, the controller being configured to control and / or adjust a pre-positioning mechanism (16a-d) suitable for the clean room to pre-position the wafer transport container (10a-d) in a non-contact manner in a docking process between the wafer transport container (10a-d) and the loading and / or unloading station (14a-d), A preliminary positioning mechanism (16a-d) suitable for the non-contact clean room is realized separately from the final positioning mechanism (36a-d); The pre-positioning mechanism (16a-d) suitable for the non-contact clean room includes: at least one positioning element (20'a-d, 22'a-d, 24'a-d), realized as a permanent magnet (26a-d), arranged in said wafer transport container (10a-d) and configured for generating at least one positioning force field; at least one further positioning element (20a-d, 22a-d, 24a-d), comprising at least one magnetic coil and configured for generating at least one contactlessly transmissible positioning force field, configured for generating a controllable and / or adjustable magnetic field by said magnetic coil for interacting with a static magnetic field of said at least one positioning element (20'a-d, 22'a-d, 24'a-d), a non-contact clean room-suitable pre-positioning mechanism (16a-d) is disposed adjacent to the loading and / or unloading station (14a-d) and configured to position the wafer transport container (10a-d) adjacent to the loading and / or unloading position; a non-contact cleanroom compatible pre-positioning mechanism (16a-d) configured for generating a force acting adjacent to the loading and / or unloading stations (14a-d); a pre-positioning mechanism (16a-d) configured to position the wafer transport container (10a-d) such that a deviation from a final position of the wafer transport container (10a-d) of 3 mm or less is achieved at the final position of the wafer transport container (10a-d) where a contact area of ​​the wafer transport container (10a-d) overlaps with a contact area of ​​an opening element of the loading and / or unloading station (14a-d), so that a maximum airtightness of the connection between the wafer transport container (10a-d) and the loading and / or unloading station (14a-d) is achieved.

2. The loading and / or unloading system (38a-d) according to claim 1, wherein the pre-positioning mechanism (16a-d) is configured for generating at least one repulsive force for pre-positioning.

3. The loading and / or unloading system (38a-d) according to claim 1, wherein said at least one positioning element (20'a, 22'a, 24'a) is realized at least partly integrally with said wafer transport container (10a-d).

4. 2. The loading and / or unloading system (38a-d) according to claim 1, characterized in that said at least one further positioning element (20a-d, 20'a-d, 22a-d, 22'a-d, 24a-d, 24'a-d, 92b-d) is connected in a captive manner to said loading and / or unloading station (14a-d).

5. A method for operating a loading and / or unloading system (38a-d) comprising a positioning device according to claim 1, comprising the steps of: in a coupling process between a wafer transport container (10a-d) and a loading and / or unloading station (14a-d), the wafer transport container (10a-d) is connectable in a vacuum-tight manner to the loading and / or unloading station (14a-d), the wafer transport container (10a-d) is pre-positioned in a non-contact manner with respect to the loading and / or unloading station (14a-d) by non-contact controlling at least two-dimensional movements of the wafer transport container (10a-d) in such a manner that the wafer transport container (10a-d) is spatially aligned when approaching a loading and / or unloading position of the loading and / or unloading station (14a-d), The method, wherein the non-contact pre-positioning is independent of a wafer-transport container transport system (50a-d) configured for logistics of the wafer-transport containers (10a-d).

6. The method of claim 5, wherein the wafer transport container (10a-d) is pre-positioned immediately after the outer coarse positioning.

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