Collector Flow Ring

Abstract

Systems, apparatus, and methods are provided for a collector flow ring (CFR) housing configured to mitigate fuel debris accumulation in an extreme ultraviolet (EUV) radiation system. An exemplary CFR housing can include a plurality of showerhead channel outlets configured to output a plurality of first gaseous fluid flows to a plurality of portions of a plasma-facing surface of the CFR housing. The exemplary CFR housing can further include a groove purge channel outlet configured to output a second gaseous fluid flow to a fuel debris-receiving surface of the CFR housing. The exemplary CFR housing can further include a shroud mounting structure configured to support a shroud assembly, a cooling channel configured to transport a fluid, and a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Application No. 62 / 953,067, entitled COLLECTOR FLOW RING, filed December 23, 2019, and also claims priority to U.S. Application No. 62 / 970,497, entitled COLLECTOR FLOW RING, filed February 5, 2020, both of which are incorporated by reference in their entireties herein.

[0002] This disclosure relates to collectors and collector flow rings for extreme ultraviolet (EUV) radiation systems. [Background technology]

[0003] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device, also referred to interchangeably as a mask or reticle, can be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g. comprising part of one or several dies) on the substrate (e.g. a silicon wafer). The transfer of the pattern is typically by imaging onto a layer of radiation-sensitive material (e.g. resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions which are successively patterned. Conventional lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion in one go, and so-called scanners, in which each target portion is irradiated by scanning the pattern with a radiation beam in a given direction (the "scan" direction) while synchronously scanning the substrate parallel or anti-parallel to the given direction (the "scan" direction), i.e. opposite to the given direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.

[0004]

[0004] Extreme ultraviolet (EUV) light, for example, electromagnetic radiation having a wavelength of approximately 50 nanometers (nm) or less (sometimes referred to as soft x-rays), including light with a wavelength of about 13 nm, may be used to generate extremely small features in or on a substrate, for example, a silicon wafer. Methods for generating EUV light include, but are not necessarily limited to, converting a material having an element, for example, xenon (Xe), lithium (Li), or tin (Sn), and having an emission line in the EUV range, into a plasma state. For example, in one such method, called laser-produced plasma (LPP), plasma can be generated by irradiating a target material, for example, in the form of a droplet, plate, tape, stream, or cluster of material, which is interchangeably referred to as fuel in the context of the LPP source, with an amplified light beam, which may be called a drive laser. For this process, the plasma is typically generated in a closed vessel, for example, a vacuum chamber, and monitored using various types of metrology instruments.

[0005] Inside a traditional tin-based radiation source vessel, many features such as protective hydrogen (H2) gas, heat shielding, and accurate shroud mounting must prevent tin buildup while also allowing for measurement field of view (FOV) and droplet path clearance. Currently, there are many separate modules used to address each of these issues individually. For example, an active heat shield absorbs unwanted heat flux, a peripheral flow ring collector module provides the shroud mounting and provides the peripheral H2 flow, and notches in these modules allow for measurement FOV and refract stray light. However, this traditional radiation source vessel does not have hardware to provide a showerhead flow below the flow vanes. Furthermore, there is no way to add either (i) a single module or (ii) a modification of the current modules that would allow for the addition of showerhead flow protection. Summary of the Invention

[0006]

[0006] The present disclosure describes various aspects of systems, apparatus, and methods for manufacturing and using collector flow ring (CFR) housings configured to mitigate fuel debris accumulation, remove heat, and provide optical metrology, as well as various other aspects in extreme ultraviolet (EUV) radiation systems.

[0007] In some aspects, the present disclosure describes a CFR housing configured to mitigate fuel debris accumulation in an EUV radiation system. The CFR housing may include a plurality of showerhead channel outlets configured to output a plurality of first gas fluid flows to a plurality of portions of the plasma-facing surface of the CFR housing. The CFR housing may further include a groove purge channel outlet configured to output a second gas fluid flow to the fuel debris receiving surface of the CFR housing. The CFR housing may further include a shroud mounting structure configured to support a shroud assembly. The CFR housing may further include a cooling channel configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generating operation of the EUV radiation system. The CFR housing may further include a plurality of optical metrology ports configured to receive a plurality of optical metrology tubes.

[0008]

[0008] In some aspects, the multiple showerhead channel outlets, the groove purge channel outlet, and the multiple optical measurement ports are disposed, i.e., formed, in the main body of the collector flow ring housing, which may be a single piece of material.

[0009] In some aspects, the present disclosure describes an EUV radiation source. The EUV radiation source may comprise a laser source configured to generate light pulses configured to illuminate a fuel material at an irradiation location configured to generate a plasma configured to emit EUV radiation. The EUV radiation source may further comprise a fuel source configured to deliver the fuel material to the irradiation location. The EUV radiation source may further comprise a CFR housing comprising a plurality of showerhead channel outlets configured to output a plurality of first gas fluid streams to a plurality of portions of the plasma-facing surface of the CFR housing. The CFR housing may further comprise a groove purge channel outlet configured to output a second gas fluid stream to the fuel debris receiving surface of the CFR housing. The CFR housing may further comprise a shroud mounting structure configured to support the shroud assembly. The CFR housing may further comprise a cooling channel configured to transport a liquid fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generating operation of the EUV radiation system. The CFR housing may further comprise a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes. The EUV radiation source may further comprise a controller configured to generate a first control signal configured to direct the laser source to generate light pulses. The controller may further be configured to generate a second control signal configured to direct the fuel source to deliver a fuel material. The controller may further be configured to generate a third control signal configured to direct the gas fluid source to control the output of the plurality of first gas fluid streams from the plurality of showerhead channel outlets. The third control signal may further be configured to direct the gas fluid source to control the output of the second gas fluid stream from the groove purge channel outlet. The controller may further be configured to generate a fourth control signal configured to direct the liquid fluid source to control the transport of liquid fluid in the cooling channel.

[0010] In some aspects, the disclosure describes a method of manufacturing a CFR housing configured to mitigate fuel debris accumulation in an extreme ultraviolet (EUV) radiation system. The method may include forming a plurality of showerhead channel outlets configured to output a plurality of first gas fluid flows to a plurality of portions of a plasma-facing surface of the CFR housing. The method may further include forming a groove purge channel outlet configured to output a second gas fluid flow to a fuel debris receiving surface of the CFR housing. The method may further include forming a shroud mounting structure configured to support a shroud assembly. The method may further include forming a cooling channel configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generating operation of the EUV radiation system. The method may further include forming a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes.

[0011]

[0011] Further features and the structure and operation of various embodiments are described in detail below with reference to the accompanying drawings. It should be noted that the present disclosure is not limited to the specific embodiments described herein. Such embodiments are shown herein for illustrative purposes only. Further embodiments will be apparent to those skilled in the art based on the teachings contained herein. [Brief description of the drawings]

[0012]

[0012] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate the present invention and, together with the description, serve to further explain the principles of aspects of the present disclosure and to enable those skilled in the art to make and use aspects of the present disclosure.

[0013] [Figure 1A]

[0013] FIG. 1 is a schematic diagram of an exemplary reflective lithographic apparatus according to some aspects of the present disclosure. [Figure 1B]

[0014] 1 is a schematic diagram of an exemplary transmissive lithographic apparatus according to some aspects of the present disclosure; [Diagram 2]

[0015] FIG. 1B is a more detailed schematic diagram of the reflective lithographic apparatus shown in FIG. 1A according to some embodiments of the present disclosure. [Diagram 3]

[0016] 1 is a schematic diagram of an exemplary lithography cell according to some aspects of the present disclosure. [Figure 4]

[0017] 1 is a schematic diagram of an exemplary radiation source of an exemplary reflective lithographic apparatus according to some aspects of the present disclosure. [Diagram 5]

[0018] FIG. 2 is a schematic diagram of an exemplary collector flow ring according to some aspects of the present disclosure. [Figure 6A]

[0019] 1A-1D are schematic diagrams of portions of an exemplary region of an exemplary collector flow ring in accordance with some aspects of the present disclosure. [Figure 6B]

[0019] FIG. 1 is a schematic diagram of portions of an exemplary region of an exemplary collector flow ring in accordance with some aspects of the present disclosure. [Figure 6C]

[0019] FIG. 1 is a schematic diagram of portions of an exemplary region of an exemplary collector flow ring in accordance with some aspects of the present disclosure. [Figure 6D]

[0019] FIG. 1 is a schematic diagram of portions of an exemplary region of an exemplary collector flow ring in accordance with some aspects of the present disclosure. [Figure 7]

[0020] 1 is a flow chart illustrating an example of a method for manufacturing a device or one or more portions thereof according to some aspects of the present disclosure.

[0014]

[0021] Features and advantages of the present invention will become more apparent from the detailed description set forth below when taken in conjunction with the drawings. In the drawings, like reference numbers generally indicate identical, functionally similar, and / or structurally similar elements, unless otherwise indicated. Furthermore, the leftmost digit(s) of a reference number generally identifies the drawing in which the reference number first appears. Unless otherwise indicated, the drawings provided throughout this disclosure should not be construed as drawings to scale. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015]

[0022] This specification discloses one or more embodiments incorporating the features of the present disclosure. The disclosed embodiment or embodiments are merely illustrative of the present disclosure. The scope of the present disclosure is not limited to the disclosed embodiment or embodiments. The breadth and scope of the present disclosure are defined by the claims appended hereto and their equivalents.

[0016]

[0023] Reference to one or more described embodiments, and to "one embodiment," "an embodiment," "an exemplary embodiment," "exemplary embodiment," or the like, herein indicates that the described embodiment may include a particular feature, structure, or characteristic, but each embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is understood that it is within the knowledge of one of ordinary skill in the art to implement such feature, structure, or characteristic in connection with other embodiments, whether or not explicitly described.

[0017]

[0024] Spatially relative terms such as "beneath," "below," "lower," "above," "on," "upper," and the like, may be used herein to facilitate describing the relationship of one element or feature to another element or features, as shown in the figures. The spatially relative terms are intended to encompass various orientations of the device in use or operation in addition to the orientation shown in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0018]

[0025] The term "about" as used herein refers to a given quantity value that may vary based on a particular technique. Based on a particular technique, the term "about" may refer to a given quantity value that may vary, for example, within 10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

[0019] Overview

[0026] In contrast to conventional radiation source enclosures, the present disclosure provides a radiation source enclosure with a collector flow ring (CFR) that integrates many separate modules into a single device, and in many cases many features form part of a single machined part that modularizes the radiation source enclosure. For example, the radiation source enclosure disclosed herein moves peripheral flow functionality from the radiation collector to the CFR, moves shroud attachment functionality from the radiation collector to the CFR, and adds purge flow functionality to the CFR. Furthermore, the radiation source enclosure disclosed herein adds showerhead flow functionality to keep the plasma-facing surface clean, and purge flow functionality to prevent tin from overflowing from the heated grooves below the flow vanes to the CFR. In some aspects, by moving the peripheral flow ring from the radiation collector to the CFR, and by integrating these functions into a single device, the radiation source enclosure disclosed herein improves maintainability and upgradeability, and reduces hardware costs.

[0020]

[0027] In some aspects, the CFRs disclosed herein integrate the functions of heat shielding, shrouding, stray light deflection, droplet passage, metrology FOV, plasma-facing surface degassing, flow guidance to grooves to prevent overflow, and other functions disclosed herein all into a single device. In some aspects, the CFRs disclosed herein provide an exhaust path for the metrology flow. In some aspects, the CFRs disclosed herein reserve space for a removable insert (referred to herein as a tin-writing insert) to clean the tin writing. In some aspects, the CFRs disclosed herein can handle higher power (e.g., 350 W) than that of conventional radiation source containers (e.g., 250 W). In some aspects, the CFRs disclosed herein can have a serviceability of less than about 2 hours for a 7-year life. In some aspects, the CFRs disclosed herein guide the radiation collector to avoid interference and precisely position the radiation collector.

[0021]

[0028] In some embodiments, the CFR disclosed herein integrates the following features into a single assembly: peripheral flow ring geometry for split peripheral flow, showerhead flow applied to the plasma-facing surface to keep the surface free of tin, groove purge flow applied to prevent tin from overflowing out of the flow vane grooves, providing showerhead and groove flows with non-uniformity of less than about 3%, metrology FOV for multiple metrology ports (e.g., 13 metrology ports), active cooling to remove heat, shroud mounting, stray light deflection, placeholder for tin-written insert design (e.g., providing ability to upgrade tin-written inserts), flexible seal includes metrology flow exhaust means and can accommodate misalignment of CFR position, and precision manufactured guide rails to provide installation paths for radiation collectors and alignment to within about 1 mm, 100 microns, about 10 microns, or about 1 micron.

[0022]

[0029] In some embodiments, the CFRs disclosed herein incorporate the following features:

[0030] 1. A single device that combines the functions of the modules mentioned above and includes a new function of showerhead flow, allowing for the integration of thermal cooling, gas flow, and precision alignment into a single device.

[0031] 2. Showerhead flow: H2 flow protection of plasma facing surfaces to keep them free of tin (Peclet).

[0032] 3. Groove purge flow: A flow used to prevent the tin flowing inside the flow vane groove from overflowing.

[0033] 4. Shared plenum for showerhead and gutter flows: A shared plenum of H2 by passive means and predictable and uniform flow outlet from a single inlet source.

[0034] 5. Single device design integrating heat shielding, precision mounting, collector guidance, flow delivery, droplet passing, and optical FOV passing.

[0035] 6. Collector Guidance: Guide rails that guide the radiation collector along a safe path to a precisely positioned mounting position (eg, within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron).

[0036] 7. Metering Stream Seal: A resistive seal capable of reducing the gap between the inner wall of the source vessel and the measuring tube of the CFR to within the positional tolerance of the CFR (e.g., within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron).

[0037] 8. Cooling water passages in the H2 plenum with combined O-ring and gasket seals that allow the thermal path to be shorter than traditional designs.

[0038] 9. Self-centering precision shroud installation. The shroud may be configured to protect the fuel target (e.g., droplets).

[0039] 10. Interference fit instrumentation tube sealing, which uses an insert instrumentation tube to seal against breakthroughs that may occur due to drilling operations to fit tubing (e.g., interference fit tubing for flow sealing between plenums)

[0040] 11. Choke / restricted flow configuration using one inlet and shared plenum to provide low non-uniformity.

[0041] 12. Stray light scattering in a measuring tube with custom threading.

[0023]

[0042] The radiation source enclosures and CFRs disclosed herein have many advantages and benefits. For example, various aspects of the present disclosure provide modularity (e.g., improved maintainability, increased upgradability), improved performance (e.g., more functionality contained in a single device), increased availability (e.g., less tin build-up and quicker maintainability than conventional radiation source enclosures), and cost savings (e.g., incorporating peripheral flow functionality into the CFR can be less expensive than incorporating peripheral flow functionality into the radiation collector as in conventional designs).

[0024]

[0043] Before describing such aspects in detail, it will be useful to provide an example environment in which embodiments of the invention may be practiced.

[0025] Exemplary Lithography System

[0044] 1A and 1B are schematic diagrams of lithographic apparatus 100 and lithographic apparatus 100', respectively, in which aspects of the present disclosure may be implemented. As shown in Figures 1A and 1B, lithographic apparatuses 100 and 100' are shown from a perspective (e.g., a side view) that is perpendicular to the XZ plane (e.g., the X axis points to the right and the Z axis points up), while patterning device MA and substrate W are shown from another perspective (e.g., a top view) that is perpendicular to the XY plane (e.g., the X axis points to the right and the Y axis points up).

[0026]

[0045] Lithographic apparatus 100 and lithographic apparatus 100' each comprise an illumination system IL (e.g. an illuminator) configured to condition a radiation beam B (e.g. a deep ultraviolet (DUV) radiation beam or an extreme ultraviolet (EUV) radiation beam), a support structure MT (e.g. a mask table) configured to support a patterning device MA (e.g. a mask, a reticle, or a dynamic patterning device) and connected to a first positioner PM configured to accurately position the patterning device MA, and a substrate holder such as a substrate table WT (e.g. a wafer table) configured to hold a substrate W (e.g. a resist coated wafer) and connected to a second positioner PW configured to accurately position the substrate W. Lithographic apparatus 100 and 100' also comprise a projection system PS configured to project a pattern imparted to the radiation beam B by the patterning device MA onto a target portion C of the substrate W (e.g. a portion comprising one or more dies). In lithographic apparatus 100, the patterning device MA and the projection system PS are reflective. In lithographic apparatus 100', the patterning device MA and the projection system PS are transmissive.

[0027]

[0046] The illumination system IL may include various types of optical components, such as refractive, reflective, catadioptric, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping or controlling the radiation beam B.

[0028]

[0047] The support structure MT holds the patterning device MA in a manner that depends on conditions such as an orientation of the patterning device MA relative to a reference frame, the design of at least one of the lithographic apparatuses 100 and 100', and whether or not the patterning device is held in a vacuum environment. The support structure MT may use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device MA. The support structure MT may be, for example, a frame or a table and may be fixed or movable as required. By using sensors the support structure MT can ensure that the patterning device MA is at a desired position, for example with respect to the projection system PS.

[0029]

[0048] The term "patterning device" MA should be interpreted broadly to refer to any device that can be used to impart a pattern to a radiation beam B in its cross-section, such as to create a pattern in a target portion C of a substrate W. The pattern imparted to the radiation beam B may correspond to a particular functional layer in a device being created in the target portion C to form an integrated circuit.

[0030]

[0049] The patterning device MA may be transmissive (as in lithographic apparatus 100' of FIG. 1B) or reflective (as in lithographic apparatus 100 of FIG. 1A). Examples of patterning devices MA include a reticle, a mask, a programmable mirror array, or a programmable LCD panel. Masks include mask types such as binary, alternating phase-shift, or attenuated phase-shift masks, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern to a radiation beam B that is reflected by the matrix of small mirrors.

[0031]

[0050] As used herein, the term "projection system" PS may include any type of projection system including refractive, reflective, magnetic, electromagnetic, electrostatic, or any combination thereof appropriate to the exposure radiation used or other factors such as the use of an immersion liquid or the use of a vacuum. A vacuum environment may be used for EUV or electron beam radiation, as other gases may absorb too much radiation or electrons. A vacuum environment may therefore be provided throughout the beam path using a vacuum wall and vacuum pumps.

[0032]

[0051] Lithographic apparatus 100 and / or lithographic apparatus 100' may be of a type having two (dual stage) or more substrate tables WT (and / or two or more mask tables). In such a "multi-stage" machine, the additional substrate tables WT may be used in parallel, or preparation steps may be carried out on one or more other tables whilst one or more substrate tables WT are being used for exposure. In some circumstances the additional tables may not be substrate tables WT.

[0033]

[0052] The lithographic apparatus may be of a type in which at least a portion of the substrate may be covered with a liquid having a relatively high refractive index, such as water, so as to fill a space between the projection system and the substrate. Immersion liquids may also be applied to other spaces in the lithographic apparatus, for example between the mask and the projection system. Immersion techniques provide for increasing the numerical aperture of projection systems. As used herein, the term "immersion" does not mean that a structure such as the substrate must be submerged in liquid, but rather that a liquid is present between the projection system and the substrate during exposure.

[0034]

[0053] 1A and 1B, the illumination system IL receives a radiation beam B from a radiation source SO. The source SO and the lithographic apparatus 100, 100' may be separate physical entities, for example if the source SO is an excimer laser. In this case, the source SO is not considered to form part of the lithographic apparatus 100 or 100' and the radiation beam B passes from the source SO to the illumination system IL via a beam delivery system BD (as shown in FIG. 1B), for example with suitable directing mirrors and / or beam expanders. In other cases, the source SO may be an integral part of the lithographic apparatus 100, 100', for example if the source SO is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD, if required, may be referred to as a radiation system.

[0035]

[0054] The illumination system IL may comprise an adjuster AD (e.g. as shown in FIG. 1B ) for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and / or inner radial extent (commonly referred to as "σ-outer" and "σ-inner", respectively) of the intensity distribution in a pupil plane of the illuminator may be adjusted. The illumination system IL may also comprise various other components (e.g. as shown in FIG. 1B ), such as an integrator IN and a radiation collector CO (e.g. a condenser or collector system). The illumination system IL may be used to adjust the radiation beam B to obtain a desired uniformity and intensity distribution in its cross-section.

[0036]

[0055] Referring to FIG. 1A, a radiation beam B is incident on a patterning device MA (e.g. a mask), which is held on a support structure MT (e.g. a mask table), and is patterned by the patterning device MA. In the lithographic apparatus 100, the radiation beam B is reflected from the patterning device MA. After being reflected from the patterning device MA, the radiation beam B passes through a projection system PS. The projection system PS focuses the radiation beam B onto a target portion C of a substrate W. With the aid of a second positioner PW and a position sensor IFD2 (e.g. an interferometric device, a linear encoder, or a capacitive sensor), the substrate table WT can be accurately moved (e.g. to position a different target portion C in the path of the radiation beam B). Similarly, the patterning device MA can be accurately positioned with respect to the path of the radiation beam B using a first positioner PM and another position sensor IFD1 (e.g. an interferometric device, a linear encoder, or a capacitive sensor). Mask alignment marks M1 and M2 and substrate alignment marks P1 and P2 may be used to align the patterning device MA and substrate W.

[0037]

[0056] Referring to Figure 1B, a radiation beam B is incident on a patterning device MA held on a support structure MT and is patterned by the patterning device MA. After traversing the patterning device MA, the radiation beam B passes through a projection system PS, which focuses the beam onto a target portion C of a substrate W. The projection system has a pupil PPU that is conjugate with the illumination system pupil IPU. A portion of the radiation originates from the intensity distribution in the illumination system pupil IPU and traverses the mask pattern without being subject to diffraction at the mask pattern to create an image of the intensity distribution in the illumination system pupil IPU.

[0038]

[0057] The projection system PS projects an image MP' of the mask pattern MP. The image MP' is formed on a resist layer coated on the substrate W by diffracted beams generated from the mask pattern MP by radiation from the intensity distribution. For example, the mask pattern MP may include an array of lines and spaces. Non-zero order diffraction of radiation at the array generates stimulated diffracted beams redirected perpendicular to the lines. Non-diffracted beams (e.g. so-called zero order diffracted beams) traverse the pattern without changing their propagation direction. The zero order diffracted beams traverse an upper lens or an upper lens group of the projection system PS upstream of the conjugate pupil PPU of the projection system PS and reach the conjugate pupil PPU. The part of the intensity distribution in the plane of the conjugate pupil PPU associated with the zero order diffracted beam is an image of the intensity distribution in the illumination system pupil IPU of the illumination system IL. The aperture device PD is arranged, for example, in a plane or substantially in a plane containing the conjugate pupil PPU of the projection system PS.

[0039]

[0058] The projection system PS is arranged to capture not only the zeroth order diffracted beam but also the first or higher order diffracted beams (not shown) using a lens or lens group L. In some embodiments, dipole illumination can be used to image a line pattern extending in a direction perpendicular to the line in order to take advantage of the resolution enhancing effect of dipole illumination. For example, a first order diffracted beam interferes with a corresponding zeroth order diffracted beam at the level of the substrate W to create an image of the mask pattern MP at the highest possible resolution and process window (e.g., usable depth of focus in combination with an acceptable exposure dose deviation). In some embodiments, astigmatism can be reduced by providing poles (not shown) in opposing quadrants of the illumination system pupil IPU. Furthermore, in some embodiments, astigmatism can be reduced by blocking the zeroth order beam in a conjugate pupil PPU of the projection system associated with the poles in the opposing quadrants. This is explained in more detail in U.S. Pat. No. 7,511,799, issued Mar. 31, 2009, which is incorporated herein by reference in its entirety.

[0040]

[0059] With the aid of the second positioner PW and a position sensor IFD (e.g. an interferometric device, a linear encoder or a capacitive sensor), the substrate table WT can be accurately moved (e.g. to position different target portions C in the path of the radiation beam B). Similarly, the patterning device MA can be accurately positioned with respect to the path of the radiation beam B using the first positioner PM and a further position sensor (not shown in FIG. 1B ) (e.g. after mechanical removal of the mask library or during a scan).

[0041]

[0060] In general, movement of the support structure MT may be realized with the aid of a long-stroke positioner (coarse positioning) and a short-stroke positioner (fine positioning), which form part of the first positioner PM. Similarly, movement of the substrate table WT may be realized using long-stroke and short-stroke positioners, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner), the support structure MT may be connected to a short-stroke actuator only, or may be fixed. The patterning device MA and substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. The substrate alignment marks as illustrated occupy dedicated target portions, but may also be located in spaces between the target portions (e.g. scribe line alignment marks). Similarly, in situations in which more than one die is provided on the patterning device MA, the mask alignment marks may be located between the dies.

[0042]

[0061] The support structure MT and patterning device MA may be within a vacuum chamber V. An in-vacuum robot IVR may be used to move a patterning device, such as a mask, in and out of the vacuum chamber. Alternatively, if the support structure MT and patterning device MA are outside the vacuum chamber, an ex-vacuum robot may be used for various transport operations, similar to the in-vacuum robot IVR. In some cases, both the in-vacuum and ex-vacuum robots need to be calibrated for smooth movement of any payload (e.g. a mask) to the fixed kinematic mount of the transfer station.

[0043]

[0062] The depicted lithographic apparatus 100 and 100' can be used in at least one of the following modes:

[0063] 1. In step mode, the support structure MT and substrate table WT are kept essentially stationary, while an entire pattern imparted to the radiation beam B is projected onto a target portion C in one go (i.e. a single static exposure), and the substrate table WT is then moved in the X and / or Y direction so that a different target portion C can be exposed.

[0064] 2. In scan mode, the support structure MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam B is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT relative to the support structure MT (e.g. mask table) can be determined by the (de-)magnification and image reversal characteristics of the projection system PS.

[0065] 3. In another mode, the support structure MT is held substantially stationary holding the programmable patterning device MA and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam B is projected onto a target portion C. A pulsed radiation source SO can be used and the programmable patterning device MA is updated as required after each movement of the substrate table WT, or between successive radiation pulses during a scan. This mode of operation is readily applicable to maskless lithography using a programmable patterning device such as a programmable mirror array.

[0044]

[0066] Combinations and / or variations on the above described modes of use or entirely different modes of use may also be employed.

[0045]

[0067] In a further aspect, the lithographic apparatus 100 comprises an EUV source configured to generate a beam of EUV radiation for EUV lithography. Typically, the EUV source is configured in a radiation system and a corresponding illumination system is configured to condition the EUV radiation beam of the EUV source.

[0046]

[0068] Figure 2 shows lithographic apparatus 100 in more detail, comprising a radiation source SO (e.g. a source collector apparatus), an illumination system IL, and a projection system PS. As shown in Figure 2, lithographic apparatus 100 is shown from a perspective (e.g. a side view) perpendicular to the XZ plane (e.g. the X-axis points to the right and the Z-axis points up).

[0047]

[0069] The radiation source SO is constructed and arranged to maintain a vacuum environment within the enclosed structure 220. The radiation source SO includes a source chamber 211 and a collector chamber 212 and is configured to generate and transmit EUV radiation. The EUV radiation may be generated by a gas or vapor, such as xenon (Xe) gas, lithium (Li) vapor, or tin (Sn) vapor, that is generated to cause an EUV radiation-emitting plasma 210 to emit radiation in the EUV range of the electromagnetic spectrum. The at least partially ionized EUV radiation-emitting plasma 210 may be generated by, for example, an electric discharge or a laser beam. For efficient radiation generation, for example, Xe gas, Li vapor, Sn vapor, or any other suitable gas or vapor may be used, with a partial pressure of about 10.0 Pascals (Pa). In some embodiments, an excited tin plasma is provided to generate the EUV radiation.

[0048]

[0070] Radiation emitted by the EUV radiation emitting plasma 210 is delivered from the source chamber 211 into the collector chamber 212 via an optional gas barrier or contaminant trap 230 (e.g., sometimes also referred to as a contaminant barrier or foil trap) located in or behind an opening in the source chamber 211. The contaminant trap 230 may include a channel structure. The contaminant trap 230 may also include a gas barrier or a combination of a gas barrier and a channel structure. The contaminant trap 230 as further illustrated herein includes at least a channel structure.

[0049]

[0071] The collector chamber 212 may comprise a radiation collector CO (e.g. a condenser or collector system), which may be a so-called grazing incidence collector. The radiation collector CO has an upstream radiation collector side 251 and a downstream radiation collector side 252. Radiation traversing the radiation collector CO may be reflected by a grating spectral filter 240 and focused into a virtual source point IF. The virtual source point IF is commonly referred to as an intermediate focus, and the source collector arrangement is arranged such that the virtual source point IF is located at or near the opening 219 of the closure structure 220. The virtual source point IF is an image of the EUV radiation emitting plasma 210. The grating spectral filter 240 is used in particular to suppress infrared (IR) radiation.

[0050]

[0072] The radiation subsequently traverses the illumination system IL, which may comprise a faceted field mirror device 222 and a faceted pupil mirror device 224 arranged to provide a desired angular distribution of the radiation beam 221 at the patterning device MA and to provide a desired radiation intensity uniformity at the patterning device MA. Upon reflection of the radiation beam 221 off the patterning device MA, which is held by the support structure MT, a patterned beam 226 is formed which is imaged by the projection system PS via reflective elements 228, 229 onto the substrate W held by a wafer stage or substrate table WT.

[0051]

[0073] In general, there may be more elements in the illumination system IL and projection system PS than are shown. A grating spectral filter 240 may optionally be present depending on the type of lithographic apparatus. Furthermore, there may be more mirrors than are shown in Figure 2. For example, there may be one to six additional reflective elements in the projection system PS compared to those shown in Figure 2.

[0052]

[0074] Radiation collector CO as shown in Figure 2 is shown as just one example of a collector (or collector mirror) and as a nested collector with grazing incidence reflectors 253, 254 and 255. Grazing incidence reflectors 253, 254 and 255 are arranged axially symmetrically about optical axis O, and this type of radiation collector CO is suitable for use in combination with a discharge produced plasma (DPP) source.

[0053] Exemplary Lithography Cell

[0075] FIG. 3 shows a lithography cell 300, sometimes called a lithocell or cluster. The lithography apparatus 100 or 100′ may form part of the lithography cell 300. The lithography cell 300 may also comprise one or more devices for performing pre-exposure and post-exposure processes on a substrate. For example, these devices may comprise a spin coater SC for depositing a resist layer, a developer DE for developing the exposed resist, a chill plate CH, and a bake plate BK. A substrate handler RO (e.g. a robot) picks up substrates from input / output ports I / O1 and I / O2, moves them between the various process devices, and delivers them to a loading bay LB of the lithography apparatus 100 or 100′. These devices are often collectively called a track and are under the control of a track control unit TCU. The TCU itself is controlled by a supervisory control system SCS, which also controls the lithography apparatus via a lithography control unit LACU. These various devices may thus be operated to maximize throughput and processing efficiency.

[0054] Exemplary Radiation Sources

[0076] One example of a radiation source SO for an exemplary reflective lithographic apparatus is shown in Figure 4. As shown in Figure 4, the radiation source SO is shown from a perspective that is perpendicular to the XY plane below (e.g., a top view).

[0055]

[0077] The radiation source SO shown in FIG. 4 is of a type that may be referred to as a laser-produced plasma (LPP) source. A laser system 401, which may comprise, for example, a carbon dioxide (CO2) laser, is arranged to impart energy via one or more laser beams 402 to a fuel target 403', such as one or more individual tin (Sn) droplets provided from a fuel target generator 403 (e.g., fuel emitter, droplet generator). According to some embodiments, the laser system 401 may be a pulsed continuous wave or quasi-continuous wave laser or may operate like a pulsed continuous wave or quasi-continuous wave laser. The trajectory of the fuel target 403' (e.g., droplets) emitted from the fuel target generator 403 may be parallel to the X-axis. According to some embodiments, the one or more laser beams 402 propagate in a direction parallel to a Y-axis that is perpendicular to the X-axis. The Z-axis is perpendicular to both the X-axis and the Y-axis and generally extends into (or towards) the page, although other configurations are used in other embodiments. In some embodiments, the laser beam 402 may propagate in a direction other than parallel to the Y-axis, i.e., other than perpendicular to the X-axis direction of the fuel target trajectory.

[0056]

[0078] Although the following description refers to tin, any suitable target material may be used. The target material may be, for example, in liquid form and may be, for example, a metal or alloy. The fuel target generator 403 may include a nozzle configured to direct, for example, tin in the form of fuel targets 403' (e.g., individual droplets) along a trajectory toward the plasma formation region 404. Throughout the remainder of the description, references to "fuel," "fuel target," or "fuel droplets" should be understood to refer to the target material (e.g., droplets) emitted by the fuel target generator 403. The fuel target generator 403 may include a fuel emitter. One or more laser beams 402 are incident on the target material (e.g., tin) in the plasma formation region 404. The accumulation of laser energy in the target material generates a plasma 407 in the plasma formation region 404. Radiation, including EUV radiation, is emitted from the plasma 407 during de-excitation and recombination of the ions and electrons of the plasma.

[0057]

[0079] The EUV radiation is collected and focused by a collector 405 (e.g., a radiation collector CO). In some embodiments, the collector 405 may include a near-normal incidence radiation collector (which may be more commonly referred to as a normal incidence radiation collector). The collector 405 may be a multi-layer mirror structure arranged to reflect the EUV radiation (e.g., EUV radiation having a desired wavelength, such as about 13.5 nm). According to some embodiments, the collector 405 may have an elliptical configuration with two foci. As discussed herein, the first focus may be at the plasma formation region 404 and the second focus may be at an intermediate focus 406.

[0058]

[0080] In some embodiments, the laser system 401 may be located relatively far away from the radiation source SO. In such cases, one or more laser beams 402 may be passed from the laser system 401 to the radiation source SO with the aid of a beam delivery system (not shown), e.g., comprising appropriate directing mirrors and / or beam expanders and / or other optics. The laser system 401 and the radiation source SO may collectively be considered a radiation system.

[0059]

[0081] Radiation reflected from the collector 405 forms a radiation beam B. The radiation beam B is focused to a point (e.g. intermediate focus 406) to form an image of the plasma formation region 404, which acts as a virtual radiation source for the illumination system IL (see FIG. 2). The point at which the radiation beam B is focused may be referred to as the intermediate focus (e.g. intermediate focus 406). The radiation source SO is positioned such that the intermediate focus 406 is located at or near an aperture 408 in an enclosure structure 409 of the radiation source SO.

[0060]

[0082] A radiation beam B passes from a radiation source SO into an illumination system IL. The illumination system IL is configured to condition the radiation beam B. The radiation beam B travels from the illumination system IL and is incident on a patterning device MA held by a support structure MT. The patterning device MA reflects and patterns the radiation beam B. After reflecting from the patterning device MA, the patterned radiation beam B enters a projection system PS. The projection system comprises a number of mirrors configured to project the radiation beam B onto a substrate W held on a substrate table WT. The projection system PS may apply a demagnification factor to the radiation beam to form an image having smaller features than corresponding features on the patterning device MA. For example a demagnification factor of 4 may be applied. Although the projection system PS is shown in Figure 2 as having two mirrors, the projection system could comprise any number of mirrors (for example six mirrors).

[0061]

[0083] The source SO may also include components not shown in Figure 4. For example, the source SO may be provided with a spectral filter that may be substantially transparent to EUV radiation but substantially blocks other radiation wavelengths, such as infrared radiation.

[0062]

[0084] The radiation source SO (or radiation system) may further comprise a fuel target imaging system for obtaining an image of the fuel target (e.g. droplets) in the plasma formation region 404, more specifically for obtaining a shadow image of the fuel target. The fuel target imaging system is capable of detecting light diffracted from the edge of the fuel target. References in the following to an image of the fuel target should be understood to also refer to a shadow image of the fuel target, or a diffraction pattern produced by the fuel target.

[0063]

[0085] The fuel target imaging system may comprise a photodetector such as a CCD array or a CMOS sensor, although it will be understood that any imaging device suitable for obtaining an image of the fuel target may be used. It will be understood that the fuel target imaging system may comprise optical components such as one or more lenses in addition to the photodetector. For example, the fuel target imaging system may comprise a camera 410, such as a combination of a light sensor (i.e., a light detector) and one or more lenses. The optical components may be selected such that the light sensor or camera 410 obtains a near-field image and / or a far-field image. The camera 410 may be located in any suitable location within the radiation source SO such that the camera has a line of sight to the plasma formation region 404 and one or more markers (not shown in FIG. 4 ) provided on the collector 405. However, to avoid damage to the camera 410, it may be necessary to locate the camera 410 away from the propagation path of the one or more laser beams 402 and the trajectory of the fuel target emitted from the fuel target generator 403. According to some embodiments, the camera 410 is configured to provide an image of the fuel target to the controller 411 via a connection 412. Although connection 412 is shown as a wired connection, it will be understood that connection 412 (as well as other connections mentioned herein) may be implemented as a wired connection, a wireless connection, or a combination thereof.

[0064]

[0086] As shown in FIG. 4, the radiation source SO may comprise a fuel target generator 403 configured to generate and emit fuel targets 403′ (e.g., individual tin droplets) towards a plasma formation region 404. The radiation source SO may further comprise a laser system 401 configured to impinge one or more of the fuel targets 403′ with one or more laser beams 402 to generate a plasma 407 in the plasma formation region 404. The radiation source SO may further comprise a collector 405 (e.g., a radiation collector CO) configured to collect radiation emitted by the plasma 407. In some embodiments, a collector flow ring CFR (not shown in FIG. 4 ) may be disposed adjacent to the collector 405 to mitigate the accumulation of fuel debris (e.g., tin) in the radiation source SO, among other features. The collector flow ring CFR may be disposed along an axis parallel to the X-axis (e.g., near the trajectory of the fuel targets 403′ emitted from the fuel target generator 403).

[0065] Exemplary Collector Flow Ring

[0087] 5 illustrates an exploded view of an exemplary collector flow ring (CFR) 500 that may be disposed adjacent to a radiation collector CO (e.g., collector 405 shown in FIG. 4 ) of a radiation source SO of an exemplary reflective lithographic apparatus to mitigate fuel debris (e.g., tin) buildup at the radiation source SO. The CFR 500 may be positioned to direct flow into the collector 405 to mitigate fuel debris (e.g., tin debris) buildup at the radiation source SO. In some embodiments, the total weight of the exemplary CFR 500 may be less than about 200 kilograms (kg) or less than about 150 kg. In some embodiments, without the cooling fluid supply 506 and the gas supply 524, the total size of the exemplary CFR 500 may be about 1.2 m×1.0 m×90 mm (e.g., thickness of the CFR housing 502). In some aspects, the total size of the exemplary CFR 500, including the cooling fluid supply 506 and the gas supply 524, may be approximately 1.2 m x 1.0 m x 800 mm, although other sizes are used in other embodiments.

[0066]

[0088] In some embodiments, the example CFR 500 can include a CFR housing 502 configured to mitigate the accumulation of fuel debris (e.g., tin) in an EUV radiation system (e.g., radiation source SO shown in FIGS. 1A and 4). In some embodiments, the CFR housing 502 can be formed of or include aluminum (Al). In some embodiments, the CFR housing 502 can include a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni).

[0067]

[0089] In some embodiments, the CFR housing 502 can include a plurality of showerhead channel outlets configured to output a plurality of first gas fluid flows (e.g., H2 flows) to a plurality of portions of a plasma-facing surface of the CFR housing 502. In some embodiments, the CFR housing 502 can include a groove purge channel outlet configured to output a second gas fluid flow (e.g., H2 flows) to a fuel debris receiving surface of the CFR housing 502. In some embodiments, the plurality of showerhead channel outlets and the groove purge channel outlet can be configured to be fluidly coupled to a gas fluid chamber configured to provide an aggregate non-uniformity of gas fluid flow of less than about 5 percent, less than about 3 percent, or less than about 1 percent between the plurality of first gas fluid flows and the second gas fluid flows.

[0068]

[0090] In some aspects, the CFR housing 502 can include a shroud attachment structure configured to support a shroud assembly 520 including, for example, but not limited to, a ceramic shroud that can be configured to protect a fuel target (e.g., fuel target 403′). In some aspects, the CFR housing 502 can include a cooling passage configured to transport a fluid (e.g., water, deionized water, a coolant, a nanofluid including nanoparticles, or any other suitable fluid) configured to remove heat from at least a portion of the CFR housing 502 during EUV radiation generating operation of the EUV radiation system. In some aspects, the CFR housing 502 can include a plurality of optical metrology ports configured to receive a plurality of optical metrology tubes. In some aspects, the CFR housing 502 can include a plurality of thermal metrology channels configured to support a plurality of thermal metrology devices (e.g., thermocouple-based devices). In some aspects, the CFR housing 502 can include a weight reduction cavity 522 configured to reduce the overall mass of the CFR housing 502 and alter the center of gravity of the CFR housing 502 (e.g., to balance the CFR housing 502).

[0069]

[0091] In some embodiments, the CFR housing 502 can include a plurality of collector guide rail mounting structures 540 configured to couple to a plurality of collector guide rails 542. In some embodiments, the plurality of collector guide rails 542 can be configured to guide the radiation collector CO along a safety path to a precisely positioned mounting location relative to a collector, such as the collector 405 of FIG. 4 (e.g., within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron). For example, the plurality of collector guide rails 542 can be a precisely manufactured pair of guide rails that provide the radiation collector CO with a mounting path and alignment within about 1 mm, 100 microns, about 10 microns, or about 1 micron. In some embodiments, the exemplary CFR 500 can include a plurality of CFR mounts 544 configured to couple to the plurality of collector guide rails 542 and mount the exemplary CFR 500 to the radiation collector CO (see FIG. 2).

[0070]

[0092] In some embodiments, the exemplary CFR 500 may comprise a cooling fluid channel assembly 504 (including, but not limited to, cooling fluid channels and cooling fluid connections, valves, or both), a cooling fluid supply 506 (e.g., a water supply), and a cooling fluid channel cover 508. In some embodiments, the cooling fluid channel assembly 504 may comprise cooling fluid channels within a gas plenum with an O-ring and gasket seal coupling that allows the thermal path to be shorter than conventional designs. In some embodiments, the cooling fluid channel assembly 504 provides active cooling to transfer heat away from the exemplary CFR 500, the CFR housing 502, or any components contained therein or mechanically connected thereto. In some embodiments, the cooling fluid channel assembly 504 may be bolted onto a flat interface surface of the CFR housing 502. In some embodiments, the bottom surface of the water channel bottom surface may be tin coated to enhance heat transfer effectiveness.

[0071]

[0093] In some embodiments, the example CFR 500 can include a tin-incompatible sheet 510. Optionally, the example CFR 500 can include a tin-written insert 512 or a placeholder for a tin-written insert design that provides the ability to upgrade the tin-written insert 512.

[0072]

[0094] In some embodiments, the exemplary CFR 500 can include a shroud assembly 520, which can be a precision shroud attachment configured to be self-centering. In some embodiments, the exemplary CFR 500 can include a gaseous fluid source, such as a gas supply 524 (e.g., an H2 supply). In some embodiments, the exemplary CFR 500 can include a thermocouple access panel 526, which can be removably attached to the CFR housing 502 and configured to provide access to multiple thermal measurement devices disposed in multiple thermal measurement channels of the CFR housing 502. For example, the exemplary CFR 500 can include four thermocouple devices (e.g., two thermocouple devices on each side of the exemplary CFR 500).

[0073]

[0095] In some aspects, the exemplary CFR 500 can include a plurality of optical metering tubes 528 configured to provide a metering FOV for a plurality of optical metering ports (e.g., 13 metering ports) disposed through the CFR housing 502. In some aspects, the exemplary CFR 500 can include a plurality of optical metering face seals 530, which can be resistive seals configured to reduce a gap between an inner surface of the CFR housing 502 and the optical metering tubes 528 within a positional tolerance of the exemplary CFR 500 (e.g., within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron). In some aspects, the plurality of optical metering face seals 530 can be flexible seals including metering flow exhaust means and can accommodate misalignment of the position of the exemplary CFR 500. In some aspects, the exemplary CFR 500 can provide an interference fit optical metering tube sealing that uses the inserted optical metering tube 528 to seal against breakthroughs that may occur due to a drilling operation that engages the optical metering tube 528 (e.g., an interference fit tube for sealing flow between plenums).

[0074]

[0096] 6A, 6B, 6C, and 6D are schematic diagrams of portions of example regions of an example CFR 600 according to some embodiments of the present disclosure.

[0075]

[0097] 6A illustrates a cutaway portion of a first exemplary region of an exemplary CFR 600 comprising a CFR housing 602 according to some aspects of the present disclosure. In some aspects, the overall size of the CFR housing 602 may be approximately 1.2m x 1.0m x 90mm, although various other suitable sizes are used in other embodiments.

[0076]

[0098] The CFR housing 602 can include a plurality of showerhead channel outlets 604 configured to output a plurality of first gas fluid flows to a plurality of portions of the plasma-facing surface 602a of the CFR housing 602. The CFR housing 602 can include a groove purge channel outlet 606 configured to output a second gas fluid flow to the fuel debris receiving surface 602b of the CFR housing 602.

[0077]

[0099] CFR housing 602 can include cooling passages 612 configured to transport a liquid fluid configured to remove heat from at least a portion of CFR housing 602 during EUV radiation generating operation of the EUV radiation system. CFR housing 602 can include cooling fluid channel cover 614 configured to seal (e.g., at least partially) cooling passages 612.

[0078]

[0100] The CFR housing 602 can include a number of optical metrology ports 616 configured to receive and support a number of optical metrology tubes 618. In some embodiments, the showerhead channel outlets 604, the groove purge channel outlets 606, and the optical metrology ports 616 can be disposed on the body of the CFR housing 602, which can be a single component or part.

[0079]

[0101] The CFR housing 602 can include a peripheral flow channel outlet 620 configured to output the peripheral gas fluid flow to a surface of a peripheral flow ring 622 of the CFR housing 602. The peripheral flow ring 622 can include a sieve ring of holes to regulate the peripheral gas fluid flow and promote uniformity. A peripheral skin plate 624 can be fused to the bottom of the CFR housing 602 with aeroprotrusions that provide rigidity and a consistent gap thickness so that the peripheral gas fluid flow is well developed and uniform.

[0080]

[0102] In some embodiments, the CFR housing 602 can include multiple collector guide rail mounting structures configured to couple to multiple collector guide rails, such as collector guide rail 626.

[0081]

[0103] 6B illustrates a cutaway portion of a second exemplary region of the exemplary CFR 600 according to some embodiments of the present disclosure. As shown in FIG. 6B, the CFR housing 602 can include a gas supply 628 (e.g., a source of gaseous fluid such as an H2 supply).

[0082]

[0104] 6C illustrates a cutaway portion of a third exemplary region of an exemplary CFR 600 according to some embodiments of the present disclosure. As shown in FIG. 6C, the CFR housing 602 can include an optical metering face seal 630 configured to attach one of a plurality of optical metering tubes 618 to the CFR housing 602.

[0083]

[0105] FIG. 6D illustrates a portion of a fourth exemplary region of an exemplary CFR 600 according to some embodiments of the present disclosure. As shown in FIG. 6D, the CFR housing 602 can include a showerhead flow distribution plenum 680, which can be a first chamber configured to receive one inlet fluidly connected to a gas supply 628 and spread the flow around the perimeter of the CFR as much as possible. The CFR housing 602 can include a showerhead flow expansion plenum 682, which can be configured to slow the flow, provide pressure buildup for the outlet flow, and aid in distribution to the furthest flow location. Although not shown in FIG. 6D, the showerhead flow distribution plenum 680 can be fluidly coupled to the showerhead flow expansion plenum 682. The CFR housing 602 can include a peripheral flow distribution plenum 684, which can be configured to receive the flow from one inlet and spread the flow as much as possible. The peripheral flow distribution plenum 684 can be machined and sealed from the bottom with an aluminum skin plate. The CFR housing 602 can include a peripheral flow expansion plenum 686 that can have a substantially similar function as the showerhead flow expansion plenum 682 (e.g., to slow down the gas, expand the gas for constant pressure buildup, and aid in distribution). The peripheral flow expansion plenum 686 can be machined and the bottom of the CFR housing 602 can be sealed with a peripheral skin plate 624 (e.g., an aluminum skin plate).

[0084]

[0106] 6D, the multiple showerhead channel outlets 604 and groove purge channel outlets 606 may be manufactured by any of a variety of suitable methods, such as machining counterbore holes at precise angles. Each hole angle determines a limiting length that must be equal through all holes for flow to be uniform. The counterbore provides a development length for the flow to fully develop and exit.

[0085]

[0107] In some embodiments, the gas fluid flow (e.g., H2 at about 0.5 bar generated by a gas fluid source) passing through (a) the showerhead flow distribution plenum 680, the showerhead flow extension plenum 682, the plurality of showerhead channel outlets 604, and the groove purge channel outlets 606, and (b) the peripheral flow distribution plenum 684, the peripheral flow extension plenum 686, and the peripheral channel outlets 620 may be configured to provide an aggregate non-uniformity of gas flow of less than about 5 percent, less than about 3 percent, or less than about 1 percent between the plurality of first gas fluid flows (e.g., output from the plurality of showerhead channel outlets 604 at about 15-50 standard liters per minute (slm)), the second gas fluid flow (e.g., output from the groove purge channel outlets 606 at about 15-50 slm), and the third gas fluid flow (e.g., output from the peripheral channel outlets 620 at about 50-130 slm). In some aspects, the gas fluid flows may be configured to provide a collective pressure drop between the plurality of first, second, and third gas fluid flows of less than about 15 kilopascals (kPa), 10 kPa, or 5 kPa. In some aspects, the gas fluid flows may be configured to provide flow distributions of the plurality of first and second gas fluid flows of about 70 percent and about 30 percent, respectively. In some aspects, the gas fluid flows may be configured to provide a flow distribution of the third gas fluid flow of about 50 percent upflow (e.g., across the plasma-facing surface 602a) and 50 percent flow toward the radiation collector CO. In other embodiments, various other flow rates and relative flow rates may be used.

[0086] Exemplary Process for Manufacturing a CFR Housing

[0108] 7 is an example method 700 for manufacturing a CFR housing (e.g., CFR housing 502 or 602) or portion(s) thereof configured to mitigate fuel debris accumulation in an EUV radiation system, according to some embodiments of the disclosure. The operations described with reference to example method 700 may be performed by or in accordance with any of the systems, apparatus, components, techniques, or combinations thereof described herein, such as those described with reference to FIGS. 1-6.

[0087]

[0109] In operation 702, the method can include forming a plurality of showerhead channel outlets (e.g., the plurality of showerhead channel outlets 604) configured to output a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface (e.g., the plasma-facing surface 602a) of the CFR housing. In some embodiments, forming the plurality of showerhead channel outlets can be accomplished using any suitable mechanical or other method and can include forming the plurality of showerhead channel outlets according to any embodiment or combination of embodiments described with reference to FIGS.

[0088]

[0110] In operation 704, the method may include forming a groove purge channel outlet (e.g., groove purge channel outlet 606) configured to output the second gaseous fluid flow to a fuel debris receiving surface (e.g., fuel debris receiving surface 602b) of the CFR housing. In some embodiments, forming the groove purge channel outlet may be accomplished using any suitable mechanical or other method and may include forming the groove purge channel outlet according to any embodiment or combination of embodiments described with reference to FIGS. 1-6.

[0089]

[0111] At operation 706, the method may include forming a shroud attachment structure configured to support a shroud assembly, such as shroud assembly 520. In some aspects, forming the shroud attachment structure is accomplished using any suitable mechanical or other method and may include forming the shroud attachment structure according to any aspect or combination of aspects described with reference to FIGS.

[0090]

[0112] In operation 708, the method may include forming a cooling channel (e.g., cooling channel 612) configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generating operation of the EUV radiation system. In some aspects, forming the cooling channel is accomplished using a suitable mechanical or other method and may include forming the cooling channel according to any aspect or combination of aspects described with reference to FIGS.

[0091]

[0113] At operation 710, the method may include forming a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes, such as the plurality of optical measurement ports 616. In some aspects, forming the plurality of optical measurement ports may be accomplished using any suitable mechanical or other method and may include forming the plurality of optical measurement ports according to any aspect or combination of aspects described with reference to FIGS.

[0092]

[0114] Optionally, the method can include forming a first gas fluid chamber (e.g., showerhead flow extension plenum 682) configured to be fluidly coupled to the plurality of showerhead channel outlets and groove purge channel outlets. Optionally, the method can further include forming a second gas fluid chamber (e.g., showerhead flow distribution plenum 680) configured to be fluidly coupled to the first gas fluid chamber. In some aspects, the gas fluid source can be configured to output a gas fluid (e.g., H2) that can be configured to flow through (i) the first gas fluid chamber, then (ii) the second gas fluid chamber, and finally (iii) the plurality of showerhead channel outlets and groove purge channel outlets to provide an aggregate non-uniformity of gas flow of less than about 5 percent, less than about 3 percent, or less than about 1 percent between the plurality of first gas fluid streams and the second gas fluid streams.

[0093]

[0115] Optionally, the method may include forming a weight reduction cavity (e.g., weight reduction cavity 522 of FIG. 5 ) configured to reduce the total mass of the CFR housing, change the center of gravity of the CFR housing, or both. Optionally, the method may include forming a plurality of thermal measurement channels configured to support a plurality of thermal measurement devices (e.g., thermocouple-based devices). Optionally, the method may include forming a plurality of collector guide rail mounting structures (e.g., a plurality of collector guide rail mounting structures 540) configured to couple to a plurality of collector guide rails (e.g., a plurality of collector guide rails 542). Optionally, the method may include forming the CFR housing of Al. Optionally, the method may further include forming a coating of at least one material selected from the group consisting of TiN, Sn, or Ni.

[0094] Exemplary EUV Radiation Source with CFR Housing

[0116] In some aspects, the present disclosure provides an EUV radiation source (e.g., radiation source SO) that includes a laser source (e.g., laser system 401) configured to generate light pulses (e.g., one or more laser beams 402) configured to illuminate a fuel material (e.g., one or more of fuel targets 403') at an irradiation location (e.g., plasma formation region 404) configured to generate a plasma (e.g., plasma 407) configured to emit EUV radiation.

[0095]

[0117] The EUV radiation source may further include a fuel source (eg, a fuel target generator 403) configured to deliver a fuel material to the irradiation location.

[0096]

[0118] The EUV radiation source may further comprise a CFR housing (e.g., CFR housing 502, 602). The CFR housing may comprise a plurality of showerhead channel outlets (e.g., a plurality of showerhead channel outlets 604) configured to output a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface (e.g., plasma-facing surface 602a) of the CFR housing. The CFR housing may further comprise a groove purge channel outlet (e.g., groove purge channel outlet 606) configured to output a second gas fluid stream to a fuel debris receiving surface (e.g., fuel debris receiving surface 602b) of the CFR housing. The CFR housing may further comprise a shroud mounting structure configured to support a shroud assembly (e.g., shroud assembly 520). The CFR housing may further comprise a cooling channel (e.g., cooling channel 612) configured to transport a liquid fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generating operation of the EUV radiation system. The CFR housing can further comprise a plurality of optical metering ports (e.g., a plurality of optical metering ports 616) configured to receive a plurality of optical metering tubes (e.g., a plurality of optical metering tubes 618). In some embodiments, the CFR housing can further comprise a weight reduction cavity (e.g., a plurality of weight reduction cavities 522) configured to reduce the overall mass of the CFR housing and alter the center of gravity of the CFR housing. In some embodiments, the CFR housing can further comprise a plurality of collector guide rail mounting structures (e.g., a plurality of collector guide rail mounting structures 540) configured to couple to a plurality of collector guide rails (e.g., a plurality of collector guide rails 542).

[0097]

[0119] In some embodiments, the plurality of showerhead flow channel outlets can be configured to be fluidly coupled to a gas fluid chamber (e.g., showerhead flow distribution plenum 680, showerhead flow extension plenum 682) configured to be fluidly coupled to a gas fluid source. In some embodiments, the groove purge flow channel is configured to be fluidly coupled to the gas fluid chamber. In some embodiments, the EUV radiation source can include a third control signal configured to direct the gas fluid source to control a third gas fluid flow through the gas fluid chamber. In some embodiments, the third gas fluid flow through the gas fluid chamber can be configured to provide an aggregate non-uniformity of gas fluid flow of less than about 5 percent between the plurality of first gas fluid flows and the second gas fluid flow.

[0098]

[0120] In some embodiments, the showerhead channel outlets, the groove purge channel outlets, and the optical metrology ports are disposed on the body (e.g., a single piece of material) of the collector flow ring housing. In some embodiments, the weight reduction cavity 522 of FIG. 5 is also formed in the body, e.g., a single piece of material. In some embodiments, the collector flow ring housing may include aluminum (Al). In some embodiments, the collector flow ring housing may include a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), or nickel (Ni).

[0099]

[0121] The EUV radiation source may further comprise a controller (e.g., controller 411) configured to generate a first control signal configured to instruct the laser source to generate a light pulse. The controller may further be configured to generate a second control signal configured to instruct the fuel source to deliver a fuel material. The controller may further be configured to generate a third control signal configured to instruct the gas fluid source (e.g., gas supply 524, 628) to control the output of the plurality of first gas fluid streams from the plurality of showerhead channel outlets. The third control signal may further be configured to instruct the gas fluid source to control the output of the second gas fluid stream from the groove purge channel outlet. The controller may further be configured to generate a fourth control signal configured to instruct the liquid fluid source (e.g., cooling fluid supply 506) to control the transport of liquid fluid in the cooling channel.

[0100]

[0122] The EUV radiation source may further comprise a plurality of thermal measurement devices (e.g., thermocouple-based devices) configured to generate a plurality of thermal measurement signals associated with the CFR housing and transmit the plurality of thermal measurement signals to the controller. The CFR housing may further comprise a plurality of thermal measurement channels configured to support the plurality of thermal measurement devices. The controller may further be configured to receive a plurality of thermal measurement signals from the plurality of thermal measurement devices and generate a plurality of thermal measurements (e.g., temperature values, temperature gradients, heat fluxes, and other suitable values) associated with the CFR housing based on the received plurality of thermal measurement signals.

[0101]

[0123] Although particular reference is made herein to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein has other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat panel displays, LCDs, thin film magnetic heads, and the like. In light of these alternative applications, those skilled in the art will recognize that the use of the terms "wafer" or "die" herein may be considered synonymous with the more general terms "substrate" or "target portion", respectively. The substrates described herein may be processed, before or after exposure, for example in a track unit (a tool that typically applies a layer of resist to the substrate and develops the exposed resist), a metrology unit, and / or an inspection unit. Where appropriate, the disclosure herein may be applied to these and other substrate processing tools. Furthermore, the substrate may be processed multiple times, for example to produce a multi-layer IC, and thus the term substrate as used herein may also refer to a substrate that already includes multiple processed layers.

[0102]

[0124] It is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, and thus, the terminology or terminology herein should be interpreted by one of skill in the art in light of the teachings herein.

[0103]

[0125] The term "substrate" as used herein describes a material onto which a layer of material is added. In some aspects, the substrate itself may be patterned, and the material added onto it may also be patterned or left unpatterned.

[0104]

[0126] The examples disclosed herein are illustrative but not limiting of embodiments of the disclosure, and other suitable modifications and adaptations of the variety of conditions and parameters normally encountered in the art and obvious to those skilled in the art are within the spirit and scope of the disclosure.

[0105]

[0127] While certain aspects of the disclosure have been described above, it will be understood that these aspects may be practiced otherwise than as described. This description is not intended to limit the embodiments of the disclosure.

[0106]

[0128] It is understood that the Detailed Description section, and not the Background, Overview, and Abstract sections, are intended to be used to interpret the claims. The Overview and Abstract sections may describe one or more, but not all, example embodiments contemplated by the inventors, and thus are not intended to limit the scope of the present embodiments and the appended claims in any way.

[0107]

[0129] Some aspects of the present disclosure have been described above using functional building blocks illustrating the implementation of specific functions and relationships thereof. In this specification, the boundaries of these functional building blocks are arbitrarily defined for the convenience of description. Alternative boundaries may be defined as long as the specific functions and relationships thereof are appropriately implemented.

[0108]

[0130] The foregoing description of specific embodiments of the present disclosure fully discloses the general nature of the embodiments, such that those skilled in the art can, without undue experimentation, readily modify and / or adapt such specific embodiments to various applications without departing from the general concept of the present disclosure. Such adaptations and modifications are therefore intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance presented herein.

[0109]

[0131] Embodiments of the present disclosure may be further described using the following clauses. 1. A collector flow ring housing for mitigating fuel debris accumulation in an extreme ultraviolet (EUV) radiation system, comprising: a plurality of showerhead channel outlets that output a plurality of first gas fluid streams to a plurality of portions of the plasma-facing surface of the collector flow ring housing; a groove purge passage outlet for outputting a second gaseous fluid flow to the fuel debris receiving surface of the collector flow ring housing; a shroud mounting structure supporting the shroud assembly; a cooling passage for transporting a fluid to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system; and A collector flow ring housing having a plurality of optical measurement ports for receiving a plurality of optical measurement tubes. 2. A plurality of showerhead channel outlets are fluidly coupled to a gas fluid chamber; a groove purge channel fluidly coupled to the gas fluid chamber; 2. The collector flow ring housing of clause 1, wherein the gas fluid chamber provides an aggregate gas fluid flow non-uniformity of less than about 5 percent between the plurality of first gas fluid streams and the second gas fluid stream. 3. The collector flow ring housing of clause 1, wherein the plurality of showerhead channel outlets, groove purge channel outlets, and plurality of optical measurement ports are disposed in a unitary piece of material forming a body of the collector flow ring housing. 4. The collector flow ring is formed in the body of the housing; Reduce the total mass of the collector flow ring housing, 4. The collector flow ring housing of clause 3, further comprising a weight reduction cavity that alters the center of gravity of the collector flow ring housing. 5. The collector flow ring housing of clause 1, further comprising a plurality of thermal measurement channels supporting a plurality of thermal measurement devices. 6. The collector flow ring housing of clause 1, further comprising a plurality of collector guide rail mounting structures coupled to the plurality of collector guide rails. 7. The collector flow ring housing of clause 1, wherein the collector flow ring housing comprises aluminum (Al). 8. The collector flow ring housing of clause 1, further comprising a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni). 9. A laser source generating light pulses that irradiate the fuel material at an irradiation location to generate a plasma that emits EUV radiation; a fuel source for delivering fuel material to an irradiation site; a collector flow ring housing; The collector flow ring housing is a plurality of showerhead channel outlets that output a plurality of first gas fluid streams to a plurality of portions of the plasma-facing surface of the collector flow ring housing; a groove purge passage outlet for outputting a second gaseous fluid flow to the fuel debris receiving surface of the collector flow ring housing; A shroud mounting structure supporting the shroud assembly; and An extreme ultraviolet (EUV) radiation source comprising: a cooling passage for transporting a liquid fluid to remove heat from at least a portion of a collector flow ring housing during EUV radiation generating operation of the EUV radiation system. 10. A plurality of optical measurement ports for receiving a plurality of optical measurement tubes; and generating a first control signal instructing the laser source to generate a light pulse; generating a second control signal directing the fuel source to deliver the fuel material; generating third control signals directing the gas fluid source to control output of the plurality of first gas fluid flows from the plurality of showerhead channel outlets, the third control signal further directing the gas fluid source to control output of the second gas fluid flow from the groove purge channel outlet; 10. The EUV radiation source of clause 9, comprising a controller generating a fourth control signal instructing the liquid fluid source to control transport of the liquid fluid in the cooling channel. 11. A plurality of showerhead channel outlets are fluidly coupled to a gas fluid chamber that is fluidly coupled to a gas fluid source; a groove purge channel fluidly coupled to the gas fluid chamber; a third control signal directs the gas fluid source to control a third gas fluid flow through the gas fluid chamber; 11. The EUV radiation source of clause 10, wherein the third gas fluid flow passing through the gas fluid chamber results in an aggregate gas fluid flow non-uniformity between the plurality of first gas fluid flows and the second gas fluid flow of less than about 5 percent. 12. The EUV radiation source of clause 10, wherein the plurality of showerhead channel outlets, the groove purge channel outlets, and the plurality of optical metrology ports are disposed in a unitary piece of material forming a body of the collector flow ring housing. 13. A collector flow ring housing is formed in the body of the collector flow ring housing; Reduce the total mass of the collector flow ring housing, 13. The EUV radiation source of clause 12, further comprising a weight reduction cavity that alters the center of gravity of the collector flow ring housing. 14. Further comprising a plurality of thermal measurement devices generating a plurality of thermal measurement signals associated with the collector flow ring housing and transmitting the plurality of thermal measurement signals to the controller; the collector flow ring housing further comprising a plurality of thermal measurement channels supporting a plurality of thermal measurement devices; The EUV radiation source of clause 10, wherein the controller further receives a plurality of thermal measurement signals from the plurality of thermal measurement devices and generates a plurality of thermal measurements associated with the collector flow ring housing based on the received plurality of thermal measurement signals. 15. The EUV radiation source of clause 10, wherein the collector flow ring housing further comprises a plurality of collector guide rail mounting structures coupled to the plurality of collector guide rails. 16. A method of manufacturing a collector flow ring housing for mitigating fuel debris accumulation in an extreme ultraviolet (EUV) radiation system, comprising: forming a plurality of showerhead channel outlets in a body of the collector flow ring housing for outputting a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface of the collector flow ring housing; forming a groove purge passage outlet in a body of the collector flow ring housing for outputting a second gaseous fluid flow to a fuel debris receiving surface of the collector flow ring housing; forming a shroud mounting structure supporting the shroud assembly; forming a cooling passage for transporting a fluid to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system; and forming a plurality of optical measurement ports in a body of a collector flow ring housing for receiving a plurality of optical measurement tubes. 17. Providing a first gas fluid chamber fluidly coupled to the plurality of showerhead channel outlets and the groove purge channel outlet; providing a second gas fluid chamber fluidly coupled to the first gas fluid chamber. 17. The method of clause 16, wherein the first gas fluid chamber and the second gas fluid chamber provide an aggregate gas flow non-uniformity of less than about 5 percent between the plurality of first gas fluid streams and the second gas fluid stream. 18. Reduce the total mass of the collector flow ring housing; 17. The method of clause 16, further comprising forming a weight reducing cavity in a body of the collector flow ring housing that alters a center of gravity of the collector flow ring housing. 19. The method of clause 16, further comprising forming a plurality of thermal measurement channels supporting a plurality of thermal measurement devices. 20. The method of clause 16, further comprising forming a plurality of collector guide rail mounting structures coupled to the plurality of collector guide rails, the collector flow ring housing being formed of aluminum (Al).

[0110]

[0132] The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary aspects or embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. 1. A collector flow ring housing configured to mitigate fuel debris accumulation in an extreme ultraviolet (EUV) radiation system, comprising: a plurality of showerhead channel outlets configured to output a plurality of first gas fluid flows across a plurality of portions of a plasma-facing surface of the collector flow ring housing; a groove purge channel outlet configured to output a second gaseous fluid flow across a fuel debris receiving surface of the collector flow ring housing; a shroud mounting structure configured to support a shroud assembly that is a mounting for the shroud; a cooling passage configured to transport a fluid configured to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system; and A collector flow ring housing comprising a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes.

2. the plurality of showerhead channel outlets are configured to be fluidly coupled to a gas fluid chamber; the groove purge channel outlet is configured to be fluidly coupled to the gas fluid chamber; The collector flow ring housing of claim 1 , wherein the gas fluid chamber is configured to provide a collective gas fluid flow non-uniformity of less than about 5 percent between the plurality of first gas fluid streams and the second gas fluid stream.

3. 2. The collector flow ring housing of claim 1, wherein the plurality of showerhead channel outlets, the groove purge channel outlets, and the plurality of optical metrology ports are disposed in a single piece of material forming a body of the collector flow ring housing.

4. formed in the body of the collector flow ring housing; To reduce the total mass of the collector flow ring housing; and The collector flow ring housing of claim 3 , further comprising a weight reduction cavity configured to modify a center of gravity of the collector flow ring housing.

5. The collector flow ring housing of claim 1 , further comprising a plurality of thermal measurement channels configured to support a plurality of thermal measurement devices.

6. The collector flow ring housing of claim 1 , further comprising a plurality of collector guide rail mounting structures configured to couple to a plurality of collector guide rails.

7. The collector flow ring housing of claim 1 , wherein said collector flow ring housing comprises aluminum (Al).

8. 10. The collector flow ring housing of claim 1 further comprising a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni).

9. An extreme ultraviolet (EUV) radiation source, comprising: a laser source configured to generate light pulses configured to irradiate a fuel material at an irradiation location configured to generate a plasma from the fuel material emitting EUV radiation; a fuel source configured to deliver the fuel material to the irradiation location; and a collector flow ring housing; The collector flow ring housing comprises: a plurality of showerhead channel outlets configured to output a plurality of first gas fluid flows across a plurality of portions of a plasma-facing surface of the collector flow ring housing; a groove purge channel outlet configured to output a second gaseous fluid flow across a fuel debris receiving surface of the collector flow ring housing; a shroud mounting structure configured to support a shroud assembly that is a mounting for the shroud; and 1. An extreme ultraviolet (EUV) radiation source comprising: a cooling channel configured to transport a liquid fluid configured to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of an EUV radiation system.

10. a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes; and generating a first control signal configured to instruct the laser source to generate the light pulse; generating a second control signal configured to direct the fuel source to deliver the fuel material; generating a third control signal configured to instruct a gas fluid source to control the output of the plurality of first gas fluid flows from the plurality of showerhead channel outlets, the third control signal further configured to instruct the gas fluid source to control the output of the second gas fluid flow from the groove purge channel outlet; 10. The EUV radiation source of claim 9, further comprising a controller configured to generate a fourth control signal that instructs a liquid fluid source to control transport of the liquid fluid in the cooling channel.

11. the plurality of showerhead channel outlets are configured to be fluidly coupled to a gas fluid chamber configured to be fluidly coupled to the gas fluid source; the groove purge channel outlet is configured to be fluidly coupled to the gas fluid chamber; the third control signal is configured to instruct the gas fluid source to control a third gas fluid flow through the gas fluid chamber; 11. The EUV radiation source of claim 10, wherein the third gas fluid flow passing through the gas fluid chamber is configured to provide a collective gas fluid flow non-uniformity between the plurality of first gas fluid flows and the second gas fluid flow of less than about 5 percent.

12. 11. The EUV radiation source of claim 10, wherein the showerhead channel outlets, the groove purge channel outlet, and the optical metrology ports are disposed in a single piece of material forming a body of the collector flow ring housing.

13. the collector flow ring housing is formed in the body of the collector flow ring housing; To reduce the total mass of the collector flow ring housing; and The EUV radiation source of claim 12 , further comprising a weight reduction cavity configured to modify a center of gravity of the collector flow ring housing.

14. a plurality of thermal measurement devices configured to generate a plurality of thermal measurement signals associated with the collector flow ring housing and to transmit the plurality of thermal measurement signals to the controller; the collector flow ring housing further comprising a plurality of thermal measurement channels configured to support the plurality of thermal measurement devices; 11. The EUV radiation source of claim 10, wherein the controller is further configured to receive the plurality of thermal measurement signals from the plurality of thermal measurement devices and generate a plurality of thermal measurements associated with the collector flow ring housing based on the received plurality of thermal measurement signals.

15. The EUV radiation source of claim 10 , wherein the collector flow ring housing further comprises a plurality of collector guide rail mounting structures configured to couple to a plurality of collector guide rails.

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