Semiconductor devices and electronic devices

Abstract

To provide a semiconductor element and an electronic device that can be manufactured without being affected by the size of a growth substrate. [Solution] A semiconductor element according to one embodiment of the present disclosure comprises a first substrate having an element region having a first semiconductor layer and a first wiring layer containing a compound semiconductor material, and a peripheral region outside the element region; and a second substrate having a second semiconductor layer and a second wiring layer containing a readout circuit, stacked so that the first wiring layer and the second wiring layer face each other, and electrically connected to the first substrate, wherein the first substrate has a buried layer provided across the element region and peripheral region so as to cover the periphery of the first semiconductor layer.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor element and an electronic device used in, for example, an infrared sensor. [Background technology]

[0002] In recent years, image sensors (infrared sensors) having sensitivity in the infrared region have been commercialized. For example, as described in Patent Document 1, the semiconductor element used in this infrared sensor uses a photoelectric conversion layer including a III-V group semiconductor such as InGaAs (indium gallium arsenide), and in this photoelectric conversion layer, infrared rays are absorbed to generate electric charges (photoelectric conversion is performed).

[0003] In Patent Document 1, InGaAs epitaxially grown on a growth substrate made of InP (indium phosphide) is used as a photoelectric conversion layer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2014-521216 Summary of the Invention

[0005] However, in such a semiconductor device, the size of the growth substrate may affect the manufacturing process, and therefore it is desirable to be able to manufacture the device without being affected by the size of the growth substrate.

[0006] It is therefore desirable to provide semiconductor devices and electronic devices that can be manufactured without being affected by the size of the growth substrate.

[0007] A semiconductor device according to an embodiment of the present disclosure includes a first substrate having an element region having a first semiconductor layer and a first wiring layer containing a compound semiconductor material, and a peripheral region outside the element region; and a second substrate having a second semiconductor layer and a second wiring layer including a readout circuit, the first wiring layer and the second wiring layer being stacked so as to face each other and electrically connected to the first substrate. a third semiconductor layer having a photodiode and laminated on the opposite side of the first substrate from the second substrate; The first substrate includes a buried layer provided across the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, and a buried layer provided on the periphery of the first semiconductor layer on the side opposite to the surface facing the second substrate. The first semiconductor layer is made of a semiconductor material that can be epitaxially grown on the second semiconductor layer. and a cap layer.

[0008] An electronic device according to an embodiment of the present disclosure includes the semiconductor element according to the embodiment of the present disclosure.

[0009] In the semiconductor device and electronic device according to an embodiment of the present disclosure, a buried layer is provided over the element region and the peripheral region so as to cover the periphery of the first semiconductor layer constituting the first substrate, and thus the peripheral region of the first substrate has a bonding surface with the second substrate. That is, the first substrate is bonded to the second substrate with a small or no step between the element region and the peripheral region. For example, the semiconductor device and electronic device according to an embodiment of the present disclosure are manufactured using the manufacturing method of the semiconductor device according to an embodiment of the present disclosure.

[0010] According to the semiconductor device and electronic device of the embodiment of the present disclosure, the buried layer is formed over the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, which makes it possible to suppress the occurrence of defects in the manufacturing process due to the step between the first semiconductor layer and the temporary substrate. Therefore, it becomes possible to manufacture the device without being affected by the size of the growth substrate for forming the semiconductor layer.

[0011] The above content is an example of the present disclosure. The effects of the present disclosure are not limited to those described above, and may be different from those described above, or may further include other effects. [Brief description of the drawings]

[0012] [Figure 1A] 1 is a plan view illustrating a schematic configuration of a light receiving element according to a first embodiment of the present disclosure. [Figure 1B] 1B is a schematic diagram showing a cross-sectional configuration taken along line BB' in FIG. 1A. [Diagram 2] 1C is a schematic cross-sectional view illustrating another example (1) of the configuration of the adhesive layer shown in FIG. 1B. FIG. [Diagram 3] 1C is a schematic cross-sectional view illustrating another example (2) of the configuration of the adhesive layer shown in FIG. 1B. FIG. [Figure 4A] 2 is a schematic cross-sectional view illustrating one step of a method for manufacturing the light-receiving element shown in FIG. [Figure 4B] FIG. 4B is a schematic cross-sectional view showing a step subsequent to FIG. 4A. [Figure 4C] FIG. 4C is a schematic cross-sectional view showing a step subsequent to FIG. 4B. [Diagram 5] FIG. 4D is a schematic plan view illustrating an example of the step of FIG. 4C. [Figure 6] 6 is a schematic plan view illustrating another example (1) of the configuration of the semiconductor layer shown in FIG. 5. [Figure 7A] 6 is a schematic plan view illustrating another example (2) of the configuration of the semiconductor layer shown in FIG. 5. [Figure 7B] 7B is a schematic diagram illustrating a cross-sectional configuration taken along line BB shown in FIG. 7A. [Figure 8A] FIG. 4D is a schematic cross-sectional view showing a step subsequent to FIG. 4C. [Figure 8B] FIG. 8B is a schematic cross-sectional view showing a step subsequent to FIG. 8A. [Figure 9A] 8B is a schematic diagram illustrating an example of a planar configuration of the step illustrated in FIG. 8A. [Figure 9B] 8C is a schematic diagram illustrating an example of a planar configuration of the step illustrated in FIG. 8B. [Figure 10A] FIG. 8B is a schematic diagram showing another example (1) of a planar configuration of the step shown in FIG. 8A. [Figure 10B] FIG. 8C is a schematic diagram illustrating another example (1) of a planar configuration of the step illustrated in FIG. 8B. [Figure 11A] FIG. 8B is a schematic diagram illustrating another example (2) of a planar configuration of the step illustrated in FIG. 8A. [Figure 11B]FIG. 8C is a schematic diagram illustrating another example (2) of a planar configuration of the step illustrated in FIG. 8B. [Figure 12] FIG. 8C is a schematic cross-sectional view illustrating another example (1) of the step shown in FIG. 8B. [Figure 13] FIG. 8C is a schematic cross-sectional view illustrating another example (2) of the step shown in FIG. 8B. [Figure 14A] FIG. 8C is a schematic cross-sectional view showing a step subsequent to FIG. 8B. [Figure 14B] FIG. 14B is a schematic cross-sectional view showing a step subsequent to FIG. 14A. [Figure 14C] FIG. 14C is a schematic cross-sectional view showing a step subsequent to FIG. 14B. [Figure 14D] FIG. 14D is a schematic cross-sectional view showing a step subsequent to FIG. 14C. [Figure 14E] FIG. 14B is a schematic cross-sectional view showing the step following FIG. 14D. [Figure 14F] FIG. 14B is a schematic cross-sectional view showing the step following FIG. 14E. [Figure 14G] FIG. 14B is a schematic cross-sectional view showing the step following FIG. 14F. [Figure 14H] FIG. 14B is a schematic cross-sectional view showing the step following FIG. 14G. [Figure 14I] FIG. 14C is a schematic cross-sectional view showing the step following FIG. 14H. [Figure 14J] FIG. 14I is a schematic cross-sectional view showing a step following FIG. [Figure 15] 1 is a schematic cross-sectional view illustrating a schematic configuration of a light receiving element according to Modification 1. FIG. [Figure 16A] 16 is a schematic cross-sectional view illustrating one step of a method for manufacturing the light-receiving element shown in FIG. 15. [Figure 16B] FIG. 16B is a schematic cross-sectional view showing a step subsequent to FIG. 16A. [Figure 17] FIG. 16C is a schematic cross-sectional view illustrating another example (1) of the step shown in FIG. 16B. [Figure 18] FIG. 16C is a schematic cross-sectional view illustrating another example (2) of the step shown in FIG. 16B. [Figure 19A] FIG. 16C is a schematic cross-sectional view showing a step subsequent to FIG. 16B. [Figure 19B] FIG. 19B is a schematic cross-sectional view showing a step subsequent to FIG. 19A. [Figure 20]11 is a cross-sectional view illustrating a schematic configuration of a light receiving element according to Modification 2. FIG. [Figure 21A] 11 is a schematic cross-sectional view illustrating a step of a method for manufacturing a light-receiving element according to a second embodiment of the present disclosure. FIG. [Figure 21B] FIG. 21B is a schematic cross-sectional view showing a step subsequent to FIG. 21A. [Figure 21C] FIG. 21C is a schematic cross-sectional view showing a step subsequent to FIG. 21B. [Figure 21D] FIG. 21D is a schematic cross-sectional view showing a step following FIG. 21C. [Figure 21E] FIG. 21E is a schematic cross-sectional view showing a step following FIG. 21D. [Figure 22] 21B is a schematic cross-sectional view illustrating the configuration of a main part of a light-receiving element completed through a process subsequent to that in FIG. 21E. [Figure 23A] FIG. 21F is an enlarged schematic cross-sectional view (1) of a portion shown in FIG. 21E. [Figure 23B] FIG. 23 is an enlarged schematic cross-sectional view (1) of a portion shown in FIG. 22. [Figure 23C] 23B is a schematic cross-sectional view illustrating another example of the shape of the opening shown in FIG. 23A. FIG. [Figure 24A] FIG. 21F is an enlarged schematic cross-sectional view (2) of a portion shown in FIG. 21E. [Figure 24B] FIG. 23 is a schematic cross-sectional view (2) showing an enlarged portion shown in FIG. 22. [Figure 24C] 24B is a schematic cross-sectional view illustrating another example of the shape of the opening shown in FIG. 24A. FIG. [Figure 25A] FIG. 21F is an enlarged schematic cross-sectional view (3) of a portion shown in FIG. 21E. [Figure 25B] FIG. 23 is a schematic cross-sectional view (3) showing an enlarged portion shown in FIG. 22. [Figure 25C] 25B is a schematic cross-sectional view illustrating another example of the shape of the opening shown in FIG. 25A. FIG. [Figure 25D] FIG. 21F is an enlarged schematic cross-sectional view (4) of a portion shown in FIG. 21E. [Figure 26] 11 is a cross-sectional view illustrating a schematic configuration of a light-receiving element according to a third embodiment of the present disclosure. FIG. [Figure 27]FIG. 1 is a functional block diagram illustrating an example of an electronic device (camera) using an imaging element. [Figure 28] 1 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system. [Figure 29] 2 is a block diagram showing an example of a functional configuration of a camera head and a CCU. FIG. [Diagram 30] 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; [Diagram 31] 4 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order. 1. First embodiment (example of a light receiving element in which the peripheral region of the element substrate has a bonding surface with a readout circuit substrate) 2. Modification 1 (Example having a first buried layer and a second buried layer) 3. Modification 2 (Example with Color Filter and On-Chip Lens) 4. Second embodiment (example of a light receiving element manufactured using a cap layer) 5. Third embodiment (example of a light receiving element in which a semiconductor layer containing silicon is laminated on an element substrate) 6. Application example 1 (Example of imaging element) 7. Application example 2 (electronic devices) 8. Application example 1 (Application to endoscopic surgery system) 9. Application example 2 (Application to moving objects)

[0014] <First embodiment> [composition] 1A and 1B show a schematic configuration of a semiconductor element (light receiving element 1) according to a first embodiment of the present disclosure. FIG. 1A shows a planar configuration of the light receiving element 1, and FIG. 1B shows a cross-sectional configuration along the line B-B' in FIG. 1A. The light receiving element 1 is applied to an infrared sensor using a compound semiconductor material such as a III-V group semiconductor, and has a photoelectric conversion function for light having a wavelength in the visible region (e.g., 380 nm or more and less than 780 nm) to the short infrared region (e.g., 780 nm or more and less than 2400 nm). The light receiving element 1 is provided with a plurality of light receiving unit regions P (pixels P) arranged, for example, two-dimensionally (FIG. 1B).

[0015] The light receiving element 1 has a central element region R1 and a peripheral region R2 that is provided outside the element region R1 and surrounds the element region R1 (FIG. 1A). The light receiving element 1 has a conductive film 15B that is provided from the element region R1 to the peripheral region R2. The conductive film 15B has an opening in a region that faces the center of the element region R1.

[0016] The light receiving element 1 has a laminated structure of an element substrate 10 and a readout circuit substrate 20 (FIG. 1B). One surface of the element substrate 10 is a light incident surface (light incident surface S1), and the surface opposite to the light incident surface S1 (the other surface) is a bonding surface (bonding surface S2) with the readout circuit substrate 20.

[0017] The element substrate 10 has, from the position closest to the readout circuit substrate 20, a wiring layer 10W, a first electrode 11, a semiconductor layer 10S (first semiconductor layer), a second electrode 15, and a passivation film 16 in this order. A surface of the semiconductor layer 10S facing the wiring layer 10W and an end face (side face) are covered with an insulating film 17. The readout circuit substrate 20 is a so-called ROIC (Readout Integrated Circuit), and has a wiring layer 20W and a multilayer wiring layer 22C in contact with the bonding surface S2 of the element substrate 10, and a semiconductor substrate 21 facing the element substrate 10 with the wiring layer 20W and the multilayer wiring layer 22C in between.

[0018] The element substrate 10 has a semiconductor layer 10S in the element region R1. In other words, the region in which the semiconductor layer 10S is provided is the element region R1 of the light receiving element 1. In the element region R1, a region exposed from the conductive film 15B (a region facing the opening of the conductive film 15B) is the light receiving region. In the element region R1, a region covered with the conductive film 15B is an OPB (Optical Black) region R1B. The OPB region R1B is provided so as to surround the light receiving region. The OPB region R1B is used to obtain a black level pixel signal. The element substrate 10 has an insulating film 17 and a buried layer 18 in the peripheral region R2. The peripheral region R2 is provided with holes H1 and H2 that penetrate the element substrate 10 and reach the readout circuit board 20. In the light receiving element 1, light is incident on the semiconductor layer 10S from the light incident surface S1 of the element substrate 10 through the passivation film 16, the second electrode 15, and the second contact layer 14. The signal charge photoelectrically converted in the semiconductor layer 10S moves through the first electrode 11 and the wiring layer 10W, and is read out by the readout circuit board 20. The configuration of each part will be described below.

[0019] The wiring layer 10W is provided across the element region R1 and the peripheral region R2, and has a bonding surface S2 with the readout circuit board 20. In the light receiving element 1, the bonding surface S2 of the element substrate 10 is provided in the element region R1 and the peripheral region R2, and for example, the bonding surface S2 of the element region R1 and the bonding surface S2 of the peripheral region R2 form the same plane. As will be described later, in the light receiving element 1, the bonding surface S2 of the peripheral region R2 is formed by providing an embedding layer 18.

[0020] The wiring layer 10W has a contact electrode 19E and a dummy electrode 19ED in, for example, the interlayer insulating films 19A and 19B. For example, the interlayer insulating film 19B is disposed on the readout circuit board 20 side, and the interlayer insulating film 19A is disposed on the first contact layer 12 side, and these interlayer insulating films 19A and 19B are laminated. The interlayer insulating films 19A and 19B are made of, for example, an inorganic insulating material. Examples of the inorganic insulating material include silicon nitride (SiN), aluminum oxide (Al2O3), silicon oxide (SiO2), and hafnium oxide (HfO2). The interlayer insulating films 19A and 19B may be made of the same inorganic insulating material.

[0021] The contact electrode 19E is provided in, for example, the element region R1. The contact electrode 19E is for electrically connecting the first electrode 11 and the readout circuit board 20, and is provided for each pixel P in the element region R1. The adjacent contact electrodes 19E are electrically separated by the buried layer 18 and the interlayer insulating films 19A and 19B. The contact electrode 19E is formed of, for example, a copper (Cu) pad, and is exposed to the bonding surface S2. The dummy electrode 19ED is provided in, for example, the peripheral region R2. The dummy electrode 19ED is connected to a dummy electrode 22ED of the wiring layer 20W described later. By providing the dummy electrode 19ED and the dummy electrode 22ED, it is possible to improve the strength of the peripheral region R2. The dummy electrode 19ED is formed in, for example, the same process as the contact electrode 19E. The dummy electrode 19ED is formed of, for example, a copper (Cu) pad, and is exposed to the bonding surface S2.

[0022] The first electrode 11 provided between the contact electrode 19E and the semiconductor layer 10S is an electrode (anode) to which a voltage is supplied for reading out signal charges (holes or electrons, hereinafter, for convenience, the signal charges are described as holes) generated in the photoelectric conversion layer 13, and is provided for each pixel P in the element region R1. The first electrode 11 is provided so as to fill the opening of the insulating film 17, and is in contact with the semiconductor layer 10S (more specifically, the diffusion region 12A described later). For example, the first electrode 11 is larger than the opening of the insulating film 17, and a part of the first electrode 11 is provided in the buried layer 18. That is, the upper surface of the first electrode 11 (the surface on the semiconductor layer 10S side) is in contact with the diffusion region 12A, and the lower surface and part of the side surface of the first electrode 11 are in contact with the buried layer 18. Adjacent first electrodes 11 are electrically separated by the insulating film 17 and the buried layer 18.

[0023] The first electrode 11 is made of, for example, any one of titanium (Ti), tungsten (W), titanium nitride (TiN), platinum (Pt), gold (Au), germanium (Ge), palladium (Pd), zinc (Zn), nickel (Ni) and aluminum (Al), or an alloy containing at least one of them. The first electrode 11 may be a single film of such a constituent material, or may be a laminated film combining two or more kinds. For example, the first electrode 11 is made of a laminated film of titanium and tungsten. The thickness of the first electrode 11 is, for example, several tens of nm to several hundreds of nm.

[0024] The semiconductor layer 10S includes, for example, from a position close to the wiring layer 10W, a first contact layer 12, a photoelectric conversion layer 13, and a second contact layer 14. The first contact layer 12, the photoelectric conversion layer 13, and the second contact layer 14 have the same planar shape, and the end faces of each are disposed at the same position in a planar view.

[0025] The first contact layer 12 is provided, for example, in common to all pixels P, and is disposed between the insulating film 17 and the photoelectric conversion layer 13. The first contact layer 12 serves to electrically separate adjacent pixels P, and the first contact layer 12 is provided with, for example, a plurality of diffusion regions 12A. By using, for the first contact layer 12, a compound semiconductor material having a band gap larger than the band gap of the compound semiconductor material constituting the photoelectric conversion layer 13, it is also possible to suppress dark current. For example, n-type InP (indium phosphide) can be used for the first contact layer 12.

[0026] The diffusion regions 12A provided in the first contact layer 12 are arranged to be spaced apart from each other. The diffusion region 12A is arranged for each pixel P, and the first electrode 11 is connected to each diffusion region 12A. The diffusion region 12A is also provided in the OPB region R1B. The diffusion region 12A is for reading out the signal charge generated in the photoelectric conversion layer 13 for each pixel P, and contains, for example, a p-type impurity. An example of the p-type impurity is Zn (zinc). In this way, a pn junction interface is formed between the diffusion region 12A and the first contact layer 12 other than the diffusion region 12A, so that adjacent pixels P are electrically isolated. The diffusion region 12A is provided, for example, in the thickness direction of the first contact layer 12, and is also provided in a part of the thickness direction of the photoelectric conversion layer 13.

[0027] The photoelectric conversion layer 13 between the first electrode 11 and the second electrode 15, more specifically, between the first contact layer 12 and the second contact layer 14, is provided, for example, in common to all pixels P. This photoelectric conversion layer 13 absorbs light of a predetermined wavelength and generates a signal charge, and is made of a compound semiconductor material such as an i-type III-V group semiconductor. Examples of the compound semiconductor material constituting the photoelectric conversion layer 13 include InGaAs (indium gallium arsenide), InAsSb (indium arsenide antimony), InAs (indium arsenide), InSb (indium antimony), and HgCdTe (mercury cadmium telluride). The photoelectric conversion layer 13 may be made of Ge (germanium). In the photoelectric conversion layer 13, for example, photoelectric conversion of light having a wavelength in the visible range to the short infrared range is performed.

[0028] The second contact layer 14 is provided, for example, in common to all pixels P. This second contact layer 14 is provided between the photoelectric conversion layer 13 and the second electrode 15 and is in contact with them. The second contact layer 14 is a region where charges discharged from the second electrode 15 move, and is made of, for example, a compound semiconductor containing n-type impurities. The second contact layer 14 can be made of, for example, n-type InP (indium phosphide).

[0029] The second electrode 15 is provided on the second contact layer 14 (light incident side) as an electrode common to each pixel P, for example, so as to be in contact with the second contact layer 14. The second electrode 15 is for discharging charges (cathode) that are not used as signal charges among the charges generated in the photoelectric conversion layer 13. For example, when holes are read out from the first electrode 11 as signal charges, for example, electrons can be discharged through the second electrode 15. The second electrode 15 is formed of a conductive film that can transmit incident light such as infrared rays. For example, ITO (Indium Tin Oxide) or ITiO (In2O3-TiO2) can be used for the second electrode 15. For example, the second electrode 15 may be provided in a lattice shape so as to separate adjacent pixels P. For this second electrode 15, a conductive material with low light transmittance can be used.

[0030] The passivation film 16 covers the second electrode 15 from the light incident surface S1 side. The passivation film 16 may have an anti-reflection function. For example, silicon nitride (SiN), aluminum oxide (Al2O3), silicon oxide (SiO2), tantalum oxide (Ta2O3), etc. may be used for the passivation film 16. The passivation film 16 has an opening 16H in the OPB region R1B. The opening 16H is provided, for example, in the shape of a frame surrounding the light receiving region (FIG. 1A). The opening 16H may be, for example, a square or circular hole in a plan view. The opening 16H in the passivation film 16 electrically connects the conductive film 15B to the second electrode 15.

[0031] The insulating film 17 is provided between the first contact layer 12 and the buried layer 18, covers an end face of the first contact layer 12, an end face of the photoelectric conversion layer 13, an end face of the second contact layer 14, and an end face of the second electrode 15, and is in contact with the passivation film 16 in the peripheral region R2. The insulating film 17 is made of, for example, silicon oxide (SiO X) or an oxide such as aluminum oxide (Al2O3). The insulating film 17 may be configured with a laminated structure made up of a plurality of films. The insulating film 17 may be configured with a silicon (Si)-based insulating material such as silicon oxynitride (SiON), carbon-containing silicon oxide (SiOC), silicon nitride (SiN), and silicon carbide (SiC). The insulating film 17 has a thickness of, for example, several tens of nm to several hundreds of nm.

[0032] The conductive film 15B is provided from the OPB region R1B to the hole H1 in the peripheral region R2. The conductive film 15B contacts the second electrode 15 at the opening 16H of the passivation film 16 provided in the OPB region R1B, and contacts the wiring (later-described wiring 22CB) of the readout circuit board 20 through the hole H1. This allows a voltage to be supplied from the readout circuit board 20 to the second electrode 15 through the conductive film 15B. The conductive film 15B functions as a voltage supply path to the second electrode 15 and also functions as a light-shielding film, forming the OPB region R1B. The conductive film 15B is made of a metal material including, for example, tungsten (W), aluminum (Al), titanium (Ti), molybdenum (Mo), tantalum (Ta), or copper (Cu). A passivation film may be provided on the conductive film 15B.

[0033] An adhesive layer B may be provided between the end of the second contact layer 14 and the second electrode 15. As described later, this adhesive layer B is used when forming the light receiving element 1, and serves to bond the semiconductor layer 10S to a temporary substrate (temporary substrate 33 in FIG. 4C described later). The adhesive layer B is made of, for example, tetraethoxysilane (TEOS) or silicon oxide (SiO2). The adhesive layer B is provided, for example, wider than the end face of the semiconductor layer 10S, and is covered by the buried layer 18 together with the semiconductor layer 10S. An insulating film 17 is provided between the adhesive layer B and the buried layer 18.

[0034] 2 and 3 show other examples of the configuration of the adhesive layer B. The adhesive layer B may be provided over a wide area of ​​the peripheral region R2, and may extend, for example, from the vicinity of the edge of the semiconductor layer 10S (element region R1) to between the holes H1 and H2 (FIG. 2). Alternatively, the adhesive layer B may extend from the vicinity of the edge of the semiconductor layer 10S (element region R1) to the chip end (chip end E).

[0035] The embedded layer 18 is intended to fill in the step between a temporary substrate (temporary substrate 33 in FIG. 4C described later) and the semiconductor layer 10S in the manufacturing process of the light receiving element 1. As will be described in detail later, in the present embodiment, the embedded layer 18 is formed, so that the occurrence of defects in the manufacturing process due to the step between the semiconductor layer 10S and the temporary substrate 33 can be suppressed.

[0036] The embedded layer 18 in the peripheral region R2 is provided between the wiring layer 10W and the insulating film 17 and between the wiring layer 10W and the passivation film 16, and has a thickness equal to or greater than the thickness of the semiconductor layer 10S. Here, the embedded layer 18 is provided to surround the semiconductor layer 10S, so that a region (peripheral region R2) around the semiconductor layer 10S is formed. This allows the bonding surface S2 with the readout circuit board 20 to be provided in the peripheral region R2. If the bonding surface S2 is formed in the peripheral region R2, the thickness of the embedded layer 18 may be reduced, but it is preferable that the embedded layer 18 covers the semiconductor layer 10S in the thickness direction, and the entire end surface of the semiconductor layer 10S is covered by the embedded layer 18. By having the embedded layer 18 cover the entire end surface of the semiconductor layer 10S via the insulating film 17, it is possible to effectively suppress the intrusion of moisture into the semiconductor layer 10S. The buried layer 18 in the element region R1 is provided between the semiconductor layer 10S and the wiring layer 10W so as to cover the first electrode 11.

[0037] The surface of the buried layer 18 on the bonding surface S2 side is flattened, and in the peripheral region R2, the wiring layer 10W is provided on the flattened surface of the buried layer 18. The buried layer 18 is made of, for example, silicon oxide (SiO X), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide containing carbon (SiOC), and silicon carbide (SiC) can be used.

[0038] As described later, in the process of manufacturing the light receiving element 1, after forming the buried layer 18, the wiring layer 10W including the interlayer insulating films 19A and 19B and the contact electrode 19E is formed above the buried layer 18 (FIG. 14D described later). The readout circuit board 20 including the wiring layer 20W is bonded to the element board 10 including the wiring layer 10W (FIG. 14E described later) to form the light receiving element 1. At this time, the contact electrode 19E of the wiring layer 10W is connected to the contact electrode 22E of the wiring layer 20W. The contact electrodes 19E and 22E have, for example, Cu pads, and the contact electrodes 19E and 22E are connected by direct bonding of the Cu pads. When the contact electrode 19E is formed by using a chemical mechanical polishing (CMP) method, the buried layer 18 arranged below the copper film to be polished is required to have a hardness that can withstand the stress during polishing. In addition, in order to directly bond the Cu pads of the contact electrodes 19E and 22E to each other, it is necessary to form the element substrate 10 and the readout circuit substrate 20 extremely flat. For this reason, it is preferable that the buried layer 18 disposed below the copper film has a hardness that can withstand the stress during polishing. Specifically, it is preferable that the material constituting the buried layer 18 is a material having a higher hardness than the sealant or organic material disposed around the die in a general semiconductor package. Examples of materials having such high hardness include inorganic insulating materials. The buried layer 18 can be formed by forming a film of this inorganic insulating material by, for example, a CVD (Chemical Vapor Deposition) method, a sputtering method, or a coating method.

[0039] The buried layer 18 is provided with holes H1 and H2 penetrating the buried layer 18. The holes H1 and H2 penetrate the wiring layer 10W together with the buried layer 18 and reach the readout circuit board 20. The holes H1 and H2 have, for example, a rectangular planar shape, and a plurality of holes H1 and H2 are provided so as to surround the element region R1 (FIG. 1A). The hole H1 is provided at a position closer to the element region R1 than the hole H2, and the sidewall and bottom surface of the hole H1 are covered with the conductive film 15B. The hole H1 is for connecting the second electrode 15 (conductive film 15B) and the wiring (later-described wiring 22CB) of the readout circuit board 20, and is provided penetrating the passivation film 16, the buried layer 18, and the wiring layer 10W.

[0040] The hole H2 is provided, for example, at a position closer to the chip end E than the hole H1. The hole H2 penetrates the passivation film 16, the embedded layer 18, and the wiring layer 10W, and reaches a pad electrode (a pad electrode 22P described later) of the readout circuit board 20. An electrical connection between the outside and the light receiving element 1 is made through the hole H2. The holes H1 and H2 do not have to reach the readout circuit board 20. For example, the holes H1 and H2 may reach a wiring of the wiring layer 10W, and the wiring may be connected to the wiring 22CB and the pad electrode 22P of the readout circuit board 20. The holes H1 and H2 may penetrate the adhesive layer B (FIGS. 2 and 3).

[0041] The holes and electrons generated in the photoelectric conversion layer 13 are read out from the first electrode 11 and the second electrode 15. In order to perform this readout operation at high speed, it is preferable to set the distance between the first electrode 11 and the second electrode 15 to a distance sufficient for photoelectric conversion but not too far apart. That is, it is preferable to reduce the thickness of the element substrate 10. For example, the distance between the first electrode 11 and the second electrode 15 or the thickness of the element substrate 10 is 10 μm or less, further 7 μm or less, and further 5 μm or less.

[0042] The semiconductor substrate 21 of the readout circuit board 20 faces the element substrate 10 with the wiring layer 20W and the multi-layer wiring layer 22C therebetween. The semiconductor substrate 21 is made of, for example, silicon (Si). A plurality of transistors are provided near the surface (surface on the wiring layer 20W side) of the semiconductor substrate 21. For example, a readout circuit (Read Out Circuit) is configured for each pixel P using the plurality of transistors. For example, the wiring layer 20W has an interlayer insulating film 22A and an interlayer insulating film 22B in this order from the element substrate 10 side, and these interlayer insulating films 22A and 22B are provided in a laminated state. For example, a contact electrode 22E and a dummy electrode 22ED are provided in the interlayer insulating film 22A. The multi-layer wiring layer 22C is provided facing the element substrate 10 with the wiring layer 20W therebetween. For example, a pad electrode 22P and a plurality of wirings 22CB are provided in the multi-layer wiring layer 22C. The interlayer insulating films 22A and 22B are made of, for example, an inorganic insulating material such as silicon nitride (SiN), aluminum oxide (Al2O3), silicon oxide (SiO2), and hafnium oxide (HfO2).

[0043] The contact electrode 22E serves to electrically connect the first electrode 11 and the wiring 22CB, and is provided in the element region R1 for each pixel P. This contact electrode 22E contacts the contact electrode 19E at the bonding surface S2 of the element substrate 10. Adjacent contact electrodes 22E are electrically isolated by an interlayer insulating film 22A.

[0044] The dummy electrode 22ED provided in the peripheral region R2 contacts the dummy electrode 19ED on the bonding surface S2 of the element substrate 10. The dummy electrode 22ED is formed, for example, in the same process as the contact electrode 22E. The contact electrode 22E and the dummy electrode 22ED are formed, for example, of a copper (Cu) pad, and are exposed on the surface of the readout circuit substrate 20 facing the element substrate 10. That is, for example, CuCu bonding is performed between the contact electrode 19E and the contact electrode 22E, and between the dummy electrode 19ED and the dummy electrode 22ED. This allows the pixel P to be miniaturized, as will be described in detail later.

[0045] The wiring 22CB connected to the contact electrode 19E is connected to a transistor provided near the surface of the semiconductor substrate 21, and the first electrode 11 and the readout circuit are connected for each pixel P. The wiring 22CB connected to the conductive film 15B via the hole H1 is connected to, for example, a predetermined potential. In this way, one of the charges (e.g., a hole) generated in the photoelectric conversion layer 13 is read out from the first electrode 11 to the readout circuit via the contact electrodes 19E and 22E, and the other of the charges (e.g., an electron) generated in the photoelectric conversion layer 13 is discharged from the second electrode 15 to a predetermined potential via the conductive film 15B.

[0046] The pad electrode 22P provided in the peripheral region R2 is for electrical connection to the outside. A hole H2 is provided near the chip end E of the light receiving element 1, penetrating the element substrate 10 and reaching the pad electrode 22P, and electrical connection to the outside is made through this hole H2. The connection is made by a method such as wire bonding or bumping. For example, a predetermined potential may be supplied from an external terminal arranged in the hole H2 to the second electrode 15 through the wiring 22CB and the conductive film 15B of the hole H2 readout circuit board 20. As a result of photoelectric conversion in the photoelectric conversion layer 13, a signal voltage read out from the first electrode 11 may be read out to a readout circuit of the semiconductor substrate 21 through the contact electrodes 19E, 22E, and output to an external terminal arranged in the hole H2 via this readout circuit. The signal voltage may be output to an external terminal via the readout circuit, for example, via another circuit included in the readout circuit board 20, together with the readout circuit. The other circuits include, for example, a signal processing circuit and an output circuit.

[0047] The thickness of the readout circuit board 20 is preferably greater than that of the element substrate 10. For example, the thickness of the readout circuit board 20 is preferably at least twice, more preferably at least five times, or even more preferably at least ten times, greater than that of the element substrate 10. Alternatively, the thickness of the readout circuit board 20 is, for example, at least 100 μm, or at least 150 μm, or at least 200 μm. The readout circuit board 20 having such a large thickness ensures the mechanical strength of the light receiving element 1. Note that the readout circuit board 20 may include only one layer of the semiconductor substrate 21 that forms the circuit, or may further include a substrate such as a support substrate in addition to the semiconductor substrate 21 that forms the circuit.

[0048] [Method of manufacturing the light receiving element 1] The light receiving element 1 can be manufactured, for example, as follows: Figures 4A to 14J show the manufacturing process of the light receiving element 1 in order of steps.

[0049] First, as shown in FIG. 4A, the semiconductor layer 10S is epitaxially grown on a growth substrate 31 made of, for example, InP. The thickness of the growth substrate 31 is, for example, several hundred μm, and the thickness of the semiconductor layer 10S is, for example, several μm. Thereafter, as shown in FIG. 4B, an adhesive layer B is formed on the semiconductor layer 10S. The diameter of the growth substrate 31 is, for example, 6 inches or less. The semiconductor layer 10S is formed, for example, by epitaxially growing n-type InP constituting the first contact layer 12, i-type InGaAs constituting the photoelectric conversion layer 13, and n-type InP constituting the second contact layer 14 in this order. The semiconductor layer 10S may be formed after, for example, a buffer layer and a stopper layer are formed on the growth substrate 31.

[0050] Next, as shown in FIG. 4C, the growth substrate 31 on which the semiconductor layer 10S is formed is bonded to the temporary substrate 33 with the adhesive layer B therebetween. The temporary substrate 33 has, for example, an insulating layer (insulating layer 33IA) and a substrate 33S. The insulating layer 33IA is disposed, for example, between the adhesive layer B and the substrate 33S. The temporary substrate 33 has a larger diameter than the growth substrate 31, and the substrate 33S is, for example, a silicon (Si) substrate. The diameter of the temporary substrate 33 is, for example, 8 inches to 12 inches. By bonding the small-diameter growth substrate 31 to the large-diameter temporary substrate 33, it becomes possible to use various devices for large-diameter substrates when forming the element substrate 10. Thereby, for example, the bonding between the readout circuit substrate 20 and the element substrate 10 can be performed by CuCu bonding, and the pixel P can be miniaturized. The bonding of the growth substrate 31 to the temporary substrate 33 may be performed by plasma activation bonding, room temperature bonding, bonding using an adhesive (adhesive bonding), or the like. In this manner, for example, the semiconductor layer 10S in a wafer form is bonded to the temporary substrate 33. The thickness of the temporary substrate 33 is, for example, several hundred μm.

[0051] 5 and 6 show an example of a planar configuration of the temporary substrate 33 and the semiconductor layer 10S (growth substrate 31). A semiconductor layer 10S in a wafer state smaller than the temporary substrate 33 may be bonded to the temporary substrate 33 in a wafer state (FIG. 5), or a plurality of semiconductor layers 10S in chip state may be bonded to the temporary substrate 33 in a wafer state while being spaced apart from each other (FIG. 6).

[0052] 7A and 7B, a semiconductor layer 10S in a wafer state having the same size as the temporary substrate 33 may be bonded to the temporary substrate 33 in a wafer state. Fig. 7A shows a planar configuration of the temporary substrate 33 and the semiconductor layer 10S (growth substrate 31), and Fig. 7B shows a cross-sectional configuration taken along line BB in Fig. 7A.

[0053] After the growth substrate 31 on which the semiconductor layer 10S is formed is bonded to the temporary substrate 33, the growth substrate 31 is removed as shown in Fig. 8A. The growth substrate 31 can be removed by mechanical grinding, CMP (Chemical Mechanical Polishing), wet etching, dry etching, or the like. At this time, the growth substrate 31 may be partially left. Also, the semiconductor layer 10S may be partially etched.

[0054] 8B, the semiconductor layer 10S is etched to a predetermined size, for example, in accordance with the marks on the temporary substrate 33. This forms a plurality of semiconductor layers 10S in a chip state. From FIG. 8B onward, two of the semiconductor layers 10S in a chip state are illustrated.

[0055] Fig. 9A shows an example of the planar configuration of the semiconductor layer 10S before molding, and Fig. 9B shows an example of the planar configuration of the semiconductor layer 10S after molding subsequent to Fig. 9A. Fig. 10A shows another example of the planar configuration of the semiconductor layer 10S before molding, and Fig. 10B shows another example of the planar configuration of the semiconductor layer 10S after molding subsequent to Fig. 10A. In this manner, the semiconductor layer 10S in a wafer state smaller than the temporary substrate 33 (Fig. 9A) or the same size as the temporary substrate 33 (Fig. 10A) is molded into a plurality of semiconductor layers 10S in a chip state.

[0056] Alternatively, as shown in FIGS. 11A and 11B, a plurality of semiconductor layers 10S in a chip state may be formed into a plurality of semiconductor layers 10S in a smaller chip state.

[0057] When the semiconductor layer 10S is etched, the adhesive layer B is etched together with the semiconductor layer 10S. The adhesive layer B may remain wider than the semiconductor layer 10S and may extend around the semiconductor layer 10S (FIG. 8B).

[0058] 12, the adhesive layer B may be narrower than the semiconductor layer 10S, so that a gap is generated between the semiconductor layer 10S and the temporary substrate 33. The adhesive layer B may be etched to the same size as the semiconductor layer 10S.

[0059] As shown in FIG. 13, the adhesive layer B does not need to be etched when the semiconductor layer 10S is etched.

[0060] After forming the semiconductor layer 10S, as shown in FIG. 14A, the diffusion region 12A is formed for each pixel P in the semiconductor layer 10S. This separates the elements. For example, the insulating film 17 is used as a hard mask to form the diffusion region 12A. Specifically, the insulating film 17 is formed to cover the upper surface (the surface opposite to the surface bonded to the temporary substrate 33) and the side surface of the semiconductor layer 10S, and then an opening is formed by etching in the insulating film 17 covering the upper surface of the semiconductor layer 10S. Then, the p-type impurity is diffused in vapor phase using the insulating film 17 as a hard mask. This forms the diffusion region 12A in a selective region. The diffusion depth is, for example, several hundred nm, and the diffusion is approximately isotropic. The diffusion region 12A may be formed by ion implantation using a resist mask. Here, the diffusion region 12A is formed in the semiconductor layer 10S provided on the large-diameter temporary substrate 33, so that the pixel P can be miniaturized.

[0061] After providing the diffusion region 12A in the semiconductor layer 10S, the first electrode 11 is formed on the semiconductor layer 10S as shown in Fig. 14B. For example, the first electrode 11 is formed by forming a laminated film of titanium (Ti) / tungsten (W) in an opening provided in the insulating film 17 by a chemical vapor deposition (CVD) method, a physical vapor deposition (PVD) method, an atomic layer deposition (ALD) method, a deposition method, or the like, and then patterning the laminated film by photolithography and etching.

[0062] After forming the first electrode 11, as shown in FIG. 14C, the embedded layer 18 is formed on the entire surface of the temporary substrate 33. The embedded layer 18 is formed, for example, by forming a film of an insulating material on the entire surface of the temporary substrate 33 so as to embed the semiconductor layer 10S, and then planarizing the film by CMP (Chemical Mechanical Polishing). This forms the embedded layer 18 that covers the periphery (peripheral region R2) of the semiconductor layer 10S and the upper surface (the surface farthest from the temporary substrate 33) of the semiconductor layer 10S. Although details will be described later, in this embodiment, the embedded layer 18 that fills the steps between the semiconductor layer 10S and the temporary substrate 33 is formed in this way, so that the occurrence of defects in the manufacturing process due to these steps is suppressed.

[0063] After forming the buried layer 18, as shown in FIG. 14D, a wiring layer 10W is formed facing the semiconductor layer 10S with the buried layer 18 therebetween. For example, an interlayer insulating film 19A and an interlayer insulating film 19B are formed in this order on the buried layer 18, and then openings are formed in the regions of the interlayer insulating films 19A and 19B facing the first electrode 11. A copper (Cu) film is formed in the openings of the interlayer insulating films 19A and 19B by a deposition method, a PVD method, a plating method, or the like, and then the surface of the copper film is polished by, for example, a CMP method to form a contact electrode 19E. For example, a dummy electrode 19ED (FIG. 1B) is formed in the peripheral region R2 in the same process as the formation of the contact electrode 19E. Here, since the wiring layer 10W is formed on a large-diameter temporary substrate 33, it is possible to use various devices for large-diameter substrates.

[0064] After forming the wiring layer 10W, as shown in FIG. 14E, the readout circuit board 20 is bonded to the temporary substrate 33 with the wiring layer 10W therebetween. At this time, the wiring layer 20W is formed in advance on the readout circuit board 20. The wiring layer 20W of the readout circuit board 20 has a contact electrode 22E and a dummy electrode 22ED, and when the readout circuit board 20 is bonded to the temporary substrate 33, for example, the contact electrode 22E and the dummy electrode 22ED of the wiring layer 20W are CuCu bonded to the contact electrode 19E and the dummy electrode 19ED of the wiring layer 10W. More specifically, in the element region R1, a bonding surface S2 where the contact electrode 19E and the contact electrode 22E are bonded is formed, and in the peripheral region R2, a bonding surface S2 where the dummy electrode 19ED and the dummy electrode 22ED are bonded is formed. Here, the peripheral region R2 of the element substrate 10 is also bonded to the readout circuit board 20.

[0065] After the readout circuit board 20 is attached to the temporary substrate 33, the temporary substrate 33 is removed as shown in Fig. 14F. The temporary substrate 33 can be removed by using, for example, mechanical grinding, wet etching, dry etching, or the like.

[0066] After removing the temporary substrate 33, as shown in FIG. 14G, the adhesive layer B and the like are also removed to expose the surface of the semiconductor layer 10S. At this time, unnecessary layers of the semiconductor layer 10S may be removed. Also, the insulating layer 33IA or the insulating film 17 may be partially left other than the opening of the semiconductor layer 10S, or the buried layer 18 may be partially excavated.

[0067] 14H, the second electrode 15 and the passivation film 16 are formed in this order on the surface of the semiconductor layer 10S exposed by removing the temporary substrate 33 (the surface opposite to the surface on which the wiring layer 10W is provided). Then, as shown in FIG. 14I, a hole H1 and a conductive film 15B are formed. This electrically connects the second electrode 15 and the readout circuit board 20.

[0068] 14J, holes H2 are formed that penetrate the element substrate 10 and reach the pad electrodes 22P of the readout circuit substrate 20. This completes the light-receiving element 1 shown in FIG.

[0069] [Photodetector 1 operation] In the light receiving element 1, when light (e.g., light having wavelengths in the visible and infrared regions) is incident on the photoelectric conversion layer 13 through the passivation film 16, the second electrode 15, and the second contact layer 14, the light is absorbed in the photoelectric conversion layer 13. As a result, pairs of holes and electrons are generated (photoelectrically converted) in the photoelectric conversion layer 13. At this time, for example, when a predetermined voltage is applied to the first electrode 11, a potential gradient is generated in the photoelectric conversion layer 13, and one of the generated charges (e.g., a hole) moves to the diffusion region 12A as a signal charge and is collected from the diffusion region 12A to the first electrode 11. The signal charge moves to the semiconductor substrate 21 through the contact electrodes 19E and 22E and is read out for each pixel P.

[0070] [Functions and Effects of Photodetector 1] The light receiving element 1 of this embodiment has an embedding layer 18 in the peripheral region R2 of the element substrate 10, and the peripheral region R2 is also provided with a bonding surface S2 with the readout circuit substrate 20. This embedding layer 18 is for filling in the step between the semiconductor layer 10S and the temporary substrate 33 when forming the light receiving element 1, and by forming this embedding layer 18, it is possible to suppress the occurrence of defects in the manufacturing process caused by the step between the semiconductor layer 10S and the temporary substrate 33. This will be described below.

[0071] The types of growth substrates 31 for epitaxially growing the semiconductor layer 10S are limited. For example, there are no large-diameter growth substrates 31 for growing the photoelectric conversion layer 13 made of InGaAs. When forming the diffusion region 12A for each pixel P or forming the wiring layer 10W using this small-diameter growth substrate 31, it is difficult to miniaturize the pixels P due to device restrictions and the like. For this reason, a method of manufacturing a light-receiving element using a large-diameter temporary substrate 33 is conceivable.

[0072] However, if a light receiving element is manufactured without forming an embedded layer (embedded layer 18 in FIG. 14C), the wiring layer 10W is formed on the semiconductor layer 10S with a large step between the temporary substrate 33 and the semiconductor layer 10S. This may cause defocusing during photolithography when forming the wiring layer 10W. In addition, when the contact electrode 19E is formed by CMP of the copper film, copper may remain in the step portion. Furthermore, due to the step, there is a risk of poor bonding when the readout circuit substrate 20 is bonded to the temporary substrate 33.

[0073] In contrast, in the photodetector 1, the buried layer 18 is formed to reduce or eliminate the step between the semiconductor layer 10S and the temporary substrate 33, and then the wiring layer 10W is formed, so that the occurrence of defects caused by the step during the manufacture of the photodetector described above can be suppressed. Therefore, the photodetector can be manufactured using various devices for large-diameter substrates without being affected by the size of the growth substrate 31, and the pixels can be miniaturized.

[0074] Furthermore, in the light receiving element 1, it is possible to form a hole H1 for connecting the second electrode 15 and the readout circuit board 20 in the embedded layer 18 in the peripheral region R2. Therefore, the second electrode 15 and the readout circuit board 20 can be electrically connected without providing a hole H1 in the semiconductor layer 10S. Furthermore, the hole H1 can be easily formed in the embedded layer 18 made of an insulating material using existing technology.

[0075] Furthermore, the end faces of the semiconductor layer 10S can be covered with a sufficient thickness by the buried layer 18, which prevents moisture from penetrating into the semiconductor layer 10S, thereby making it possible to prevent deterioration of the semiconductor layer 10S.

[0076] As described above, in the light receiving element 1 of the present embodiment, the embedded layer 18 is formed, so that it is possible to suppress the occurrence of defects in the manufacturing process due to the step between the semiconductor layer 10S and the temporary substrate 33. Therefore, it is possible to manufacture the light receiving element 1 without being influenced by the size of the growth substrate 31 for forming the semiconductor layer 10S, and to miniaturize the pixels P, for example. In this light receiving element 1, by providing the embedded layer 18, a bonding surface S2 with the readout circuit substrate 20 is also formed in the peripheral region R2 of the element substrate 10.

[0077] Furthermore, by forming the semiconductor layer 10S into a chip shape of a predetermined size on the temporary substrate 33 before forming the embedded layer 18, it is possible to easily form a light receiving element 1 of the desired structure while suppressing the occurrence of misalignment in subsequent processes.

[0078] Furthermore, by connecting the element substrate 10 and the readout circuit substrate 20 by CuCu bonding of the contact electrodes 19E and 22E, it is possible to miniaturize the pixels P. This will be described below.

[0079] A method has been proposed for connecting an element substrate including a compound semiconductor with a readout circuit substrate including a readout circuit using solder bumps or indium beads. When using these connection means, the diameter of the bumps or beads formed in the assembly process of the semiconductor device and the length of one side of the electrode pad that contacts them are, for example, several tens of μm or 100 μm or more. On the other hand, when CuCu bonding is used, the length of one side of the Cu pad formed in the wafer process of the semiconductor device is several μm. Therefore, in the light receiving element 1, the size of the contact electrodes 19E, 22E provided for each pixel P is reduced to about 1 / 10 of the size of a solder bump or the like. This makes it possible to reduce the size of the pixel P.

[0080] Modifications of the above embodiment and other embodiments will be described below. In the following description, the same components as those in the above embodiment will be given the same reference numerals and the description thereof will be omitted as appropriate.

[0081] <Variation 1> 15 shows a cross-sectional configuration of a main part of a light receiving element (light receiving element 1A) according to Modification 1 of the first embodiment. In this light receiving element 1A, an embedding layer 18 includes a first embedding layer 18A and a second embedding layer 18B that are stacked one on the other. Except for this, the light receiving element 1A has the same configuration and effects as the light receiving element 1.

[0082] The first embedded layer 18A is disposed in the peripheral region R2, and is provided closer to the light incident surface S1 than the second embedded layer 18B. Specifically, the first embedded layer 18A is disposed between the second embedded layer 18B and the passivation film 16, and covers an end face of the semiconductor layer 10S.

[0083] The second embedded layer 18B is provided across the element region R1 and the peripheral region R2. The second embedded layer 18B in the element region R1 is disposed between the wiring layer 10W and the semiconductor layer 10S, and covers the lower surface and side surfaces of the first electrode 11 as well as the lower surface (the surface facing the readout circuit board 20) of the semiconductor layer 10S. The second embedded layer 18B in the peripheral region R2 is disposed between the wiring layer 10W and the first embedded layer 18A. The constituent material of the first embedded layer 18A and the constituent material of the second embedded layer 18B may be the same or different. The thickness of the first embedded layer 18A and the thickness of the second embedded layer 18B may be the same or different.

[0084] The insulating film 17 is provided on approximately the same plane across the element region R1 and the peripheral region R2. The insulating film 17 is disposed between the semiconductor layer 10S and the second embedded layer 18B in the element region R1, and between the first embedded layer 18A and the second embedded layer 18B in the peripheral region R2.

[0085] Such a light receiving element 1A can be manufactured, for example, as follows: Figures 16A to 19B show the manufacturing process of the light receiving element 1A in order of steps.

[0086] First, in the same manner as described in the first embodiment, the semiconductor layer 10S on the temporary substrate 33 is formed into a plurality of chip shapes (FIG. 8B).

[0087] 16A, the first embedded layer 18A is formed on the entire surface of the temporary substrate 33. The first embedded layer 18A is formed, for example, by forming a film of an insulating material on the entire surface of the temporary substrate 33 so as to embed the semiconductor layer 10S, and then planarizing the film by CMP. This forms the first embedded layer 18A that covers the periphery of the semiconductor layer 10S. At this time, the upper surface of the semiconductor layer 10S may be exposed from the first embedded layer 18A.

[0088] 16B, after the first embedded layer 18A is formed, a diffusion region 12A is formed in the semiconductor layer 10S using a mask formed of, for example, an insulating film 17. The insulating film 17 is formed on the first embedded layer 18A.

[0089] The mask for forming the diffusion region 12A may be formed of the first embedded layer 18A as shown in FIG. 17, or may be formed of the first embedded layer 18A and the insulating film 17 as shown in FIG. 18.

[0090] After the diffusion region 12A is formed in the semiconductor layer 10S, the first electrode 11 is formed in the opening of the insulating film 17 as shown in FIG. 19A.

[0091] After the first electrode 11 is formed, as shown in Fig. 19B, the second embedded layer 18B is formed on the first embedded layer 18A so as to cover the first electrode 11. The second embedded layer 18B is formed by depositing an insulating material on the entire surface of the temporary substrate 33 and then planarizing the film by CMP. The subsequent steps are the same as those described in the first embodiment above (Figs. 14D to 14J), and the light receiving element 1A is completed.

[0092] As in this modification, the embedded layer 18 may be configured to have a laminated structure of a first embedded layer 18 A and a second embedded layer 18 B. In this case as well, the same effects as those of the first embodiment can be obtained.

[0093] <Variation 2> 20 shows a cross-sectional configuration of a main part of a light receiving element (light receiving element 1B) according to Modification 2 of the first embodiment. This light receiving element 1B has a color filter layer 41 and an on-chip lens (light collecting lens) 42 on a light incident surface S1 (the surface opposite to the surface facing the readout circuit board 20) of an element substrate 10. Except for this, the light receiving element 1B has the same configuration and effect as the light receiving element 1.

[0094] For example, in the light receiving element 1B, a color filter layer 41 and an on-chip lens 42 are provided in this order on the passivation film 16 of the element substrate 10 with a planarization film 16A in between. The color filter layer 41 may include an IR (Infrared) filter. By providing the color filter layer 41, light receiving data of a wavelength corresponding to each pixel P can be obtained.

[0095] The on-chip lens 42 is for collecting light incident on the light receiving element 1 to the photoelectric conversion layer 13. The on-chip lens 42 is made of, for example, an organic material or silicon oxide (SiO2). In the light receiving element 1B, the embedded layer 18 is provided in the peripheral region R2, so that the step between the element region R1 and the peripheral region R2 of the element substrate 10 is reduced or eliminated, and a flat light incident surface S1 is formed. This makes it possible to form the on-chip lens 42 with high accuracy, for example, by using a photolithography process. For example, the color filter layer 41 and the on-chip lens 42 are terminated in the element region R1. The planarization film 16A disposed between the passivation film 16 and the color filter layer 41 is provided, for example, from the element region R1 to the peripheral region R2, and is terminated in the peripheral region R2. The color filter layer 41, the on-chip lens 42, and the planarization film 16A may each be terminated at any position in the element region R1 or in the peripheral region R2.

[0096] As in this modification, a color filter layer 41 and on-chip lenses 42 may be provided on the light incident surface S1 of the element substrate 10. In this case, the same effects as those of the first embodiment can be obtained. Moreover, the on-chip lenses 42 can be easily formed with high accuracy on the light incident surface S1 that is flattened by the embedding layer 18.

[0097] <Second embodiment> 21A to 21E show the manufacturing process of a light receiving element (light receiving element 2 in FIG. 22) according to the second embodiment in the order of steps. This light receiving element 2 is manufactured by forming a cap layer (cap layer 35 in FIG. 21A) for protecting the semiconductor layer 10S, and then bonding the semiconductor layer 10S to a temporary substrate 33 with the cap layer therebetween. Except for this, the light receiving element 2 has the same configuration as the light receiving element 1, and also has the same action and effect.

[0098] The light receiving element 2 can be manufactured using the cap layer 35, for example, as follows.

[0099] 21A, for example, a semiconductor layer 10S and a cap layer 35 made of i-type InGaAs are formed in this order by epitaxial growth on a growth substrate 31. As the semiconductor layer 10S, for example, a first contact layer 12 made of n-type InP, a photoelectric conversion layer 13 made of i-type or n-type InGaAs, and a second contact layer 14 made of n-type InP are formed in this order.

[0100] The cap layer 35 is for preventing the semiconductor layer 10S from directly contacting the adhesive layer B for bonding the semiconductor layer 10S to the temporary substrate 33. If the process is carried out while the adhesive layer B is in contact with the semiconductor layer 10S, the characteristics of the semiconductor layer 10S may be deteriorated. Alternatively, the semiconductor layer 10S may be peeled off from the temporary substrate 33. The semiconductor layer 10S may be peeled off from the adhesive layer B. By forming the cap layer 35 between the semiconductor layer 10S and the adhesive layer B, the occurrence of such deterioration in characteristics and film peeling can be suppressed. The cap layer 35 may be made of any semiconductor material that can be epitaxially grown on the semiconductor layer 10S (more specifically, the second contact layer 14), and may be, for example, InGaAs or InAsSb.

[0101] After the cap layer 35 is formed on the semiconductor layer 10S, an adhesive layer B containing, for example, silicon oxide (SiO 2 ) is formed on the cap layer 35.

[0102] 21B, the growth substrate 31 is bonded to a large-diameter temporary substrate 33 with the adhesive layer B therebetween. At this time, a cap layer 35 is interposed between the adhesive layer B and the second contact layer 14. For the adhesive layer B, for example, tetraethoxysilane (TEOS) and silicon oxide (SiO2) can be used.

[0103] Next, in the same manner as described in the first embodiment, the growth substrate 31 is removed, the semiconductor layer 10S is formed, the diffusion region 12A is formed by pure material diffusion, the first electrode 11 is formed, and the buried layer 18 is formed in this order (see Figs. 8A to 14C). After that, as shown in Fig. 21C, the wiring layer 10W is formed on the buried layer 18. In this embodiment, as in the light-receiving element 1, the buried layer 18 is formed to fill the step between the semiconductor layer 10S and the temporary substrate 33, so that the occurrence of defects in the manufacturing process due to these steps is suppressed. In addition, in the steps of removing the growth substrate 31, forming the diffusion region 12A, and forming the wiring layer 10W, the cap layer 35 is interposed between the adhesive layer B and the second contact layer 14, so that the occurrence of deterioration in the characteristics of the semiconductor layer 10S and film peeling can be suppressed.

[0104] After the wiring layer 10W is formed, the temporary substrate 33 is attached to the readout circuit substrate 20 with the wiring layer 10W therebetween in the same manner as described in the first embodiment (FIG. 21D).

[0105] Next, as shown in FIG. 21E, the temporary substrate 33, the adhesive layer B, and the cap layer 35 are removed in this order to expose the second contact layer 14. The temporary substrate 33 is removed in the same manner as described in the first embodiment. The adhesive layer B and the cap layer 35 can be removed by, for example, wet etching. For example, HF (Hydrogen Fluoride) or BHF (Buffered Hydrogen Fluoride) can be used for wet etching the adhesive layer B. For example, a mixture of an acid and an oxidizing agent can be used for wet etching the cap layer 35. For example, HF, hydrochloric acid (HCl), or phosphoric acid (H3PO4) can be used as the acid, and for example, hydrogen peroxide water or ozone water can be used as the oxidizing agent. Although the adhesive layer B and the cap layer 35 can be removed by dry etching, it is preferable to remove them by wet etching (described later).

[0106] 23A is an example showing an enlarged view of portion R shown in FIG. 21E. The area from which the adhesive layer B and the cap layer 35 are removed is made smaller than the area of ​​the semiconductor layer 10S in a plan view, for example. This leaves the cap layer 35 and the adhesive layer B on the periphery of the light incident surface S1 side of the semiconductor layer 10S (the surface opposite to the surface facing the readout circuit board 20), more specifically, on the end of the second contact layer 14. The cap layer 35 may be recessed with respect to the adhesive layer B, or may protrude.

[0107] The process steps after removing the cap layer 35 are the same as those described in the first embodiment above (see FIGS. 14H to 14J), and the light-receiving element 2 is completed.

[0108] FIG. 22 shows an example of a cross-sectional configuration of a main part of the light receiving element 2 thus manufactured.

[0109] Fig. 23B is an example showing an enlarged view of the portion R shown in Fig. 22. In this manner, the second electrode 15 and the passivation film 16 may be formed while the cap layer 35 and the adhesive layer B remain. At this time, the second electrode 15 is in contact with the second contact layer 14, and is also in contact with the cap layer 35 and the adhesive layer B. The embedded layer 18 protrudes toward the light incident surface S1 (opposite the readout circuit board 20) side beyond the semiconductor layer 10S by the thickness of the cap layer 35 and the adhesive layer B.

[0110] The opening formed by removing the adhesive layer B and the cap layer 35, i.e., the opening exposing the second contact layer 14, preferably has a tapered shape as shown in FIG. 23C. By forming the second electrode 15 in such a tapered opening, the coverage of the second electrode 15 is improved. For example, the adhesive layer B and the cap layer 35 are removed by wet etching to form the tapered opening. For this reason, the adhesive layer B and the cap layer 35 are preferably removed by wet etching.

[0111] FIG. 24A is another example showing the portion R shown in FIG. 21E and FIG. 24B is another example showing the portion R shown in FIG. 22 in an enlarged manner. In this way, the area from which the adhesive layer B and the cap layer 35 are removed may be the same as the area of ​​the semiconductor layer 10S in a plan view. This removes the cap layer 35 on the end of the second contact layer 14. In the light receiving element 2 thus formed, the upper surface of the second contact layer 14 (the surface on the light incident surface S1 side) and the lower surface of the adhesive layer B (the surface on the readout circuit board 20 side) are misaligned, and a step is formed between them due to the cap layer 35. In addition, the second electrode 15 contacts the second contact layer 14 and the adhesive layer B.

[0112] The opening formed by removing the adhesive layer B and the cap layer 35, ie, the opening exposing the second contact layer 14, preferably has a tapered shape as shown in FIG. 24C.

[0113] FIG. 25A is an enlarged view of the portion R shown in FIG. 21E, and FIG. 25B is an enlarged view of the portion R shown in FIG. 22. In this manner, the area from which the adhesive layer B and the cap layer 35 are removed may be larger than the area of ​​the semiconductor layer 10S in a plan view. This removes the cap layer 35 on the end of the second contact layer 14. In the light receiving element 2 thus formed, a recess 18R caused by etching is formed between the end face of the semiconductor layer 10S and the buried layer 18. In addition, the second electrode 15 contacts the second contact layer 14, fills the recess 18R, and contacts the adhesive layer B.

[0114] The opening formed by removing the adhesive layer B and the cap layer 35, ie, the opening exposing the second contact layer 14, preferably has a tapered shape as shown in FIG. 25C.

[0115] As shown in FIG. 25D, the area from which the adhesive layer B and the cap layer 35 are removed may be made larger so that the adhesive layer B is removed together with the cap layer 35.

[0116] Similarly to the light receiving element 1 described above, the light receiving element 2 formed by this method also has the embedded layer 18 formed, which can suppress the occurrence of defects in the manufacturing process caused by the step between the semiconductor layer 10S and the temporary substrate 33. In addition, the cap layer 35 is formed, which can prevent contact between the semiconductor layer 10S (second contact layer 14) and the adhesive layer B.

[0117] In the light receiving element 2, the cap layer 35 may remain on the end of the second contact layer 14 (FIGS. 23A to 23C), or the cap layer 35 may be completely removed. In the light receiving element 2 from which the cap layer 35 has been completely removed, for example, a step between the upper surface of the second contact layer 14 and the lower surface of the adhesive layer B (FIGS. 24A to 24C) or a recess 18R between the end surface of the semiconductor layer 10S and the buried layer 18 (FIGS. 25A to 25D) is provided. In the light receiving element 2, the buried layer 18 protrudes toward the light incident surface S1 side from the semiconductor layer 10S by the thickness of the cap layer 35 and the adhesive layer B.

[0118] <Third embodiment> 26 is a schematic diagram showing a cross-sectional structure of a light receiving element (light receiving element 3) according to the third embodiment. The light receiving element 3 has a laminated structure of an element substrate 10 containing a compound semiconductor material and a semiconductor layer (semiconductor layer 51S, second semiconductor layer) containing silicon (Si). Except for this, the light receiving element 3 has the same structure as the light receiving element 1, and also has the same action and effect.

[0119] The light receiving element 3 has, on the light incident surface S1 of the element substrate 10, a wiring layer 51W electrically connected to the semiconductor layer 51S, the semiconductor layer 51S, a color filter layer 41, and an on-chip lens, in this order.

[0120] The semiconductor layer 51S is provided with a photodiode PD having a pn junction for each pixel P. The wiring layer 51W includes a plurality of wirings, and for example, a signal charge generated in the photodiode PD is moved to the readout circuit board 20 for each pixel P by this wiring layer 51W.

[0121] In the light receiving element 3, for example, photoelectric conversion is performed on light having wavelengths in the visible and infrared regions. For example, light having a wavelength in the visible region is incident on the semiconductor layer 51S via the on-chip lens 42 and the color filter layer 41, and is photoelectrically converted by the photodiode PD. On the other hand, light having a wavelength in the infrared region is transmitted through the semiconductor layer 51S and is photoelectrically converted by the photoelectric conversion layer 13 of the element substrate 10. The signal charges generated in the photodiode PD and the signal charges generated in the photoelectric conversion layer 13 are read out by the readout circuit board 20.

[0122] The light receiving element 3 of this embodiment also has an embedded layer 18 formed therein, as described for the light receiving elements 1 and 2, so that it is possible to suppress defects in the manufacturing process caused by a step between the semiconductor layer 10S and the temporary substrate 33. In addition, since the semiconductor layer 51S is laminated on the element substrate 10, light with wavelengths in the visible and infrared regions can be photoelectrically converted in one pixel P. This makes it possible to increase the amount of information that can be obtained from one pixel P.

[0123] <Application example 1> The light receiving element 1 (or light receiving elements 1A, 1B, 2, and 3, hereinafter collectively referred to as the light receiving element 1) described in the above embodiment is applied to, for example, an imaging element. This imaging element is, for example, an infrared image sensor.

[0124] <Application example 2> The above-mentioned imaging element can be applied to various types of electronic devices, such as a camera capable of capturing images in the infrared region. Fig. 27 shows a schematic configuration of an electronic device 5 (camera) as an example. The electronic device 5 is, for example, a camera capable of capturing still images or moving images, and includes an imaging element 4 made of a light receiving element 1, an optical system (optical lens) 310, a shutter device 311, a drive unit 313 for driving the imaging element 4 and the shutter device 311, and a signal processing unit 312.

[0125] The optical system 310 guides image light (incident light) from a subject to the image sensor 4. This optical system 310 may be composed of a plurality of optical lenses. The shutter device 311 controls the light irradiation period and the light blocking period to the image sensor 4. The drive unit 313 controls the transfer operation of the image sensor 4 and the shutter operation of the shutter device 311. The signal processing unit 312 performs various signal processing on the signal output from the image sensor 4. The video signal Dout after the signal processing is stored in a storage medium such as a memory, or is output to a monitor or the like.

[0126] Furthermore, the light receiving element 1 described in the present embodiment and the like can also be applied to the following electronic devices (capsule endoscopes and mobile objects such as vehicles).

[0127] <Application Example 1 (Endoscopic Surgery System)> The technology according to the present disclosure may be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0128] FIG. 28 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0129] 28 shows a state in which an operator (doctor) 11131 is performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0130] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the illustrated example, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may be configured as a so-called flexible scope having a flexible lens barrel.

[0131] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an observation target in the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0132] An optical system and an image sensor are provided inside the camera head 11102, and reflected light (observation light) from an observation target is collected on the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to an observation image. The image signal is transmitted to a camera control unit (CCU) 11201 as RAW data.

[0133] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and performs overall control of the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102, and performs various types of image processing on the image signal, such as development processing (demosaic processing), for displaying an image based on the image signal.

[0134] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0135] The light source device 11203 is composed of a light source such as an LED (light emitting diode), and supplies the endoscope 11100 with irradiation light when photographing an operation site or the like.

[0136] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiated light, magnification, focal length, etc.) of the endoscope 11100.

[0137] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 sends gas into the body cavity of the patient 11132 via the insufflation tube 11111 to inflate the body cavity for the purpose of securing the field of view of the endoscope 11100 and securing the working space of the surgeon. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, image, or graph.

[0138] The light source device 11203 that supplies irradiation light to the endoscope 11100 when photographing the surgical site can be composed of a white light source composed of, for example, an LED, a laser light source, or a combination of these. When the white light source is composed of a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so that the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to capture images corresponding to each of the RGB colors in a time-division manner by irradiating the observation object with laser light from each of the RGB laser light sources in a time-division manner and controlling the driving of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter to the image sensor.

[0139] The light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. The driving of the image sensor of the camera head 11102 may be controlled in synchronization with the timing of the change in the light intensity to obtain images in a time-division manner, and the images may be synthesized to generate an image with a high dynamic range that is free of so-called blackout and whiteout.

[0140] The light source device 11203 may be configured to supply light of a predetermined wavelength band corresponding to the special light observation. In the special light observation, for example, by utilizing the wavelength dependency of light absorption in body tissue, a narrow band light is irradiated compared to the irradiated light (i.e., white light) during normal observation, and a predetermined tissue such as blood vessels on the mucous membrane surface is photographed with high contrast, so-called narrow band imaging is performed. Alternatively, in the special light observation, a fluorescent observation may be performed in which an image is obtained by fluorescence generated by irradiating an excitation light. In the fluorescent observation, it is possible to irradiate an excitation light to a body tissue and observe the fluorescence from the body tissue (autofluorescence observation), or to locally inject a reagent such as indocyanine green (ICG) into the body tissue and irradiate the body tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0141] FIG. 29 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0142] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other by a transmission cable 11400 so as to be able to communicate with each other.

[0143] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

[0144] The imaging unit 11402 may include one imaging element (so-called single-plate type) or multiple imaging elements (so-called multiple-plate type). When the imaging unit 11402 is configured as a multiple-plate type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining the image signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to a 3D (dimensional) display. By performing a 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical site. Note that when the imaging unit 11402 is configured as a multiple-plate type, the lens unit 11401 may also be provided in multiple systems corresponding to each imaging element.

[0145] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately behind the objective lens.

[0146] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be appropriately adjusted.

[0147] The communication unit 11404 is configured by a communication device for transmitting and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0148] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201, and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of capturing the image, and / or information specifying the magnification and focus of the captured image.

[0149] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by a user, or may be automatically set by the control unit 11413 of the CCU 11201 based on an acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0150] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404.

[0151] The communication unit 11411 is configured with a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0152] Furthermore, the communication unit 11411 transmits, to the camera head 11102, a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0153] The image processing unit 11412 performs various types of image processing on the image signal, which is RAW data sent from the camera head 11102 .

[0154] The control unit 11413 performs various controls related to imaging of the surgical site etc. by the endoscope 11100 and display of the captured image obtained by imaging the surgical site etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0155] Further, the control unit 11413 causes the display device 11202 to display the captured image showing the surgical site, etc., based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 can recognize surgical tools such as forceps, specific living body parts, bleeding, mist when the energy treatment tool 11112 is used, etc., by detecting the shape and color of the edge of an object included in the captured image. When the control unit 11413 causes the display device 11202 to display the captured image, it may use the recognition result to superimpose various types of surgery support information on the image of the surgical site. By superimposing and presenting the surgery support information to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0156] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for communication of electrical signals, an optical fiber for optical communication, or a composite cable of these.

[0157] Here, in the illustrated example, communication is performed wired using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0158] An example of an endoscopic surgery system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 11402 among the configurations described above. By applying the technology according to the present disclosure to the imaging unit 11402, a clearer image of the surgical site can be obtained, allowing the surgeon to reliably check the surgical site.

[0159] Although an endoscopic surgery system has been described here as an example, the technology disclosed herein may also be applied to other systems, such as a microsurgery system.

[0160] <Application Example 2 (Mobile)> The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving object, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, or a robot.

[0161] FIG. 30 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a moving object control system to which the technology according to the present disclosure can be applied.

[0162] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 30, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also, as functional configurations of the integrated control unit 12050, a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053 are illustrated.

[0163] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0164] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as head lamps, back lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves or signals of various switches transmitted from a portable device that replaces a key may be input to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, and the like of the vehicle.

[0165] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for a person, a car, an obstacle, a sign, or characters on a road surface, based on the received image.

[0166] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0167] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing.

[0168] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0169] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on the driver's operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle acquired by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0170] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside-vehicle information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0171] The audio / image output unit 12052 transmits at least one output signal of audio and image to an output device capable of visually or audibly notifying information to passengers in the vehicle or the outside of the vehicle. In the example of Fig. 30, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as the output device. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

[0172] FIG. 31 is a diagram showing an example of the installation position of the imaging unit 12031.

[0173] In FIG. 31, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0174] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided at positions such as the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield in the vehicle interior of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the windshield in the vehicle interior mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the upper part of the windshield in the vehicle interior is mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

[0175] 31 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, an overhead image of the vehicle 12100 viewed from above is obtained by superimposing the image data captured by the imaging units 12101 to 12104.

[0176] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of a plurality of imaging elements, or may be an imaging element having pixels for detecting a phase difference.

[0177] For example, the microcomputer 12051 can extract, as a preceding vehicle, a three-dimensional object that is the closest three-dimensional object on the travel path of the vehicle 12100 and travels at a predetermined speed (for example, 0 km / h or more) in approximately the same direction as the vehicle 12100, by calculating the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the change over time of this distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104. Furthermore, the microcomputer 12051 can set a vehicle distance to be secured in advance in front of the preceding vehicle, and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control). In this way, cooperative control can be performed for the purpose of automatic driving that travels autonomously without relying on the driver's operation.

[0178] For example, the microcomputer 12051 classifies and extracts three-dimensional object data on three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0179] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured images of the imaging units 12101 to 12104. The recognition of such a pedestrian is performed, for example, by a procedure of extracting feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras, and a procedure of performing pattern matching processing on a series of feature points that indicate the contour of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

[0180] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 among the above-described configurations. By applying the technology according to the present disclosure to the imaging unit 12031, it is possible to obtain a captured image that is easier to see, thereby reducing the fatigue of the driver.

[0181] Furthermore, the light receiving element 1 described in the present embodiment and the like can also be applied to electronic devices such as surveillance cameras, biometric authentication systems, and thermography. The surveillance camera is, for example, a night vision system. By applying the light receiving element 1 to a surveillance camera, it becomes possible to recognize pedestrians and animals at night from a distance. Furthermore, by applying the light receiving element 1 to an in-vehicle camera, it is difficult to be affected by headlights and weather. For example, a captured image can be obtained without being affected by smoke and fog. Furthermore, it becomes possible to recognize the shape of an object. Furthermore, non-contact temperature measurement is possible in thermography. Temperature distribution and heat can also be detected in thermography. In addition, the light receiving element 1 can also be applied to electronic devices that detect flames, moisture, gas, and the like.

[0182] Although the embodiments and application examples have been described above, the present disclosure is not limited to the above embodiments, and various modifications are possible. For example, the layer configuration of the light receiving element described in the above embodiments is one example, and other layers may be further provided. In addition, the material and thickness of each layer are also one example, and are not limited to those described above. For example, in the above embodiments, the semiconductor layer 10S is configured by the first contact layer 12, the photoelectric conversion layer 13, and the second contact layer 14, but the semiconductor layer 10S may include the photoelectric conversion layer 13. For example, the first contact layer 12 and the second contact layer 14 may not be provided, or other layers may be included.

[0183] Furthermore, in the above-mentioned embodiments, for convenience, the signal charges are holes, but the signal charges may be electrons. For example, the diffusion region may contain n-type impurities.

[0184] In addition, in the above embodiment and the like, a light receiving element has been described as a specific example of the semiconductor element of the present technology, but the semiconductor element of the present technology may be something other than a light receiving element. For example, the semiconductor element of the present technology may be a light emitting element.

[0185] Furthermore, the effects described in the above embodiment and the like are merely examples, and other effects may be achieved, or further other effects may be included.

[0186] The present disclosure may be configured as follows. (1) a first substrate having an element region including a first semiconductor layer and a first wiring layer containing a compound semiconductor material, and a peripheral region outside the element region; a second substrate including a second semiconductor layer and a second wiring layer, the second substrate being laminated such that the first wiring layer and the second wiring layer face each other and electrically connected to the first substrate; 、 a third semiconductor layer having a photodiode and stacked on the first substrate on the opposite side to the second substrate; Equipped with The first substrate includes a buried layer provided across the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, and a buried layer provided on the periphery of the surface of the first semiconductor layer opposite to the surface facing the second substrate. A semiconductor material capable of being epitaxially grown on the first semiconductor layer. and a cap layer. Semiconductor element. (2) The element region of the first substrate is bonded to the second substrate on the same plane as a bonding surface of the peripheral region with the second substrate. The semiconductor element according to (1) above. (3) a first electrode provided in the first wiring layer and electrically connected to the first semiconductor layer; a second electrode facing the first electrode with the first semiconductor layer therebetween; The semiconductor element according to (1) or (2). (4) The first substrate further has a through hole in the buried layer for electrically connecting the second electrode and the second substrate. The semiconductor element according to (3) above. (5) The buried layer protrudes beyond the first semiconductor layer to a side opposite to the second substrate. A semiconductor element according to any one of (1) to (4). (6 ) before The buried layer is provided across the thickness of the first semiconductor layer. Any one of (1) to (5) above The semiconductor element according to claim 1. (7) The first wiring layer is also provided in the peripheral region. Any one of (1) to (6) above The semiconductor element according to claim 1. (8) The compound semiconductor material absorbs light having wavelengths in the infrared region. Any one of (1) to (7) above The semiconductor element according to claim 1. (9) The compound semiconductor material is any one of InGaAs, InAsSb, InAs, InSb, and HgCdTe. Any one of (1) to (8) above The semiconductor element according to claim 1. (10) Further, the first semiconductor layer has an on-chip lens on the side opposite to the surface facing the second substrate. Any one of (1) to (9) above The semiconductor element according to claim 1. (11) The semiconductor material constituting the cap layer is InGaAs or InAsSb. A semiconductor element according to any one of (1) to (10). (12) the first substrate further includes an adhesive layer that is provided on a surface of the first semiconductor layer opposite to a surface facing the second substrate and that is wider than an end surface of the first semiconductor layer and is covered with the embedded layer; The cap layer is disposed between the first semiconductor layer and the adhesion layer. A semiconductor element according to any one of (1) to (11). (13) a first substrate having an element region including a first semiconductor layer and a first wiring layer containing a compound semiconductor material, and a peripheral region outside the element region; a second substrate including a second semiconductor layer and a second wiring layer, the second substrate being laminated such that the first wiring layer and the second wiring layer face each other and electrically connected to the first substrate; 、 a third semiconductor layer having a photodiode and stacked on the first substrate on the opposite side to the second substrate; Equipped with The first substrate includes a buried layer provided across the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, and a buried layer provided on the periphery of the surface of the first semiconductor layer opposite to the surface facing the second substrate. A semiconductor material capable of being epitaxially grown on the first semiconductor layer. and a cap layer. Semiconductor element Prepared electronic equipment. [Explanation of symbols]

[0187] 1, 1A, 1B, 2, 3...light receiving element, 10...element substrate, 10S...semiconductor layer, 10W, 22W, 51W...wiring layer, 11...first electrode, 12...first contact layer, 12A...diffusion region, 13...photoelectric conversion layer, 14...second contact layer, 15...second electrode, 16...passivation film, 17...insulating film, 18...buried layer, 18V, 22V...through electrode, 19A, 19B, 22A...interlayer insulating film, 19EA, 19EB, 22EA, 22EB... Contact electrode, 20...readout circuit board, 21...semiconductor substrate, 22CA...pixel circuit, 22CB...wiring, 22P...pad electrode, 31...growth substrate, 32...insulating layer, 33...temporary substrate, 34B...buffer layer, 34S...stopper layer, 35...cap layer, 41...color filter layer, 42...on-chip lens, 51S...silicon layer, B...adhesive layer, H...hole, P...pixel, R1...element region, R2...peripheral region, S1...light incident surface, S2...bonding surface.

Claims

1. a first substrate having an element region including a first semiconductor layer and a first wiring layer, the first semiconductor layer including a compound semiconductor material, and a peripheral region outside the element region; a second substrate including a second semiconductor layer and a second wiring layer including a read circuit, the second substrate being laminated such that the first wiring layer and the second wiring layer face each other, and electrically connected to the first substrate; a third semiconductor layer having a photodiode and stacked on the first substrate on the opposite side to the second substrate; The first substrate has a buried layer provided across the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, and a cap layer made of a semiconductor material capable of epitaxial growth on the first semiconductor layer, provided on the periphery of the surface of the first semiconductor layer opposite to the surface facing the second substrate. Semiconductor element.

2. The element region of the first substrate is bonded to the second substrate on the same plane as a bonding surface of the peripheral region with the second substrate. The semiconductor device according to claim 1 .

3. a first electrode provided in the first wiring layer and electrically connected to the first semiconductor layer; a second electrode facing the first electrode with the first semiconductor layer therebetween; The semiconductor device according to claim 1 .

4. The first substrate further has a through hole in the buried layer for electrically connecting the second electrode and the second substrate. The semiconductor device according to claim 3 .

5. The buried layer protrudes beyond the first semiconductor layer to a side opposite to the second substrate. The semiconductor device according to claim 1 .

6. The buried layer is provided across the thickness of the first semiconductor layer. The semiconductor device according to claim 1 .

7. The first wiring layer is also provided in the peripheral region. The semiconductor device according to claim 1 .

8. The compound semiconductor material absorbs light having wavelengths in the infrared region. The semiconductor device according to claim 1 .

9. The compound semiconductor material is any one of InGaAs, InAsSb, InAs, InSb, and HgCdTe. The semiconductor device according to claim 1 .

10. Furthermore, the first semiconductor layer has an on-chip lens on the side opposite to the surface facing the second substrate. The semiconductor device according to claim 1 .

11. The semiconductor material constituting the cap layer is InGaAs or InAsSb. The semiconductor device according to claim 1 .

12. The first substrate further has an adhesive layer that is wider than an end face of the first semiconductor layer on a surface of the first semiconductor layer opposite to a surface of the first semiconductor layer facing the second substrate and is covered with the embedded layer; The cap layer is provided between the first semiconductor layer and the adhesion layer. The semiconductor device according to claim 1 .

13. a first substrate having an element region including a first semiconductor layer and a first wiring layer, the first semiconductor layer including a compound semiconductor material, and a peripheral region outside the element region; a second substrate including a second semiconductor layer and a second wiring layer including a read circuit, the second substrate being laminated such that the first wiring layer and the second wiring layer face each other, and electrically connected to the first substrate; a third semiconductor layer having a photodiode and stacked on the first substrate on the opposite side to the second substrate; The first substrate has a buried layer provided across the element region and the peripheral region so as to cover the periphery of the first semiconductor layer, and a cap layer made of a semiconductor material capable of epitaxial growth on the first semiconductor layer, provided on the periphery of the surface of the first semiconductor layer opposite to the surface facing the second substrate. Electronic equipment equipped with semiconductor elements.

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