Substrate liquid processing apparatus and substrate liquid processing method

Abstract

To provide a substrate liquid processing apparatus and a substrate liquid processing method that are advantageous in preventing particles from being mixed into a processing liquid to be applied to a substrate.SOLUTION: A liquid supply circuit 30 that supplies a processing liquid to a discharge nozzle of a processing unit includes: a supply tank 37 to which the processing liquid is supplied via a guide line L2; a pressurizing device 38 that pressurizes the inside of the supply tank; a discharge nozzle 19 that discharges the supplied processing liquid onto the substrate W; a supply line L4 connected to the supply tank and the discharge nozzle and not provided with an adjustment mechanism that variably restricts the flow path connecting the supply tank and the discharge nozzle; a first drainage line L5 connected to a first branch portion b1 between the supply tank and the discharge nozzle of the supply line; a liquid flow adjustment mechanism 40 provided on the first drainage line and restricting the passage of processing liquid having a pressure lower than a set pressure; and a control unit that adjusts the set pressure.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a substrate liquid processing apparatus and a substrate liquid processing method. [Background technology]

[0002] There is known a substrate liquid processing apparatus that prevents particles from being mixed into the processing liquid. In the apparatus of Patent Document 1, since there is no need to interpose a control valve for adjusting the flow rate in the branch line, particles that may be generated from such a control valve do not flow in the liquid processing unit. In the apparatus of Patent Document 2, dust generation inside the constant pressure valve can be suppressed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-41751 A [Patent Document 2] JP 2017-204069 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that is advantageous in preventing particles from being mixed into a processing liquid applied to a substrate. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a substrate liquid processing apparatus comprising: a supply tank having a processing liquid supplied to its inside via a guide line; a pressurizing device for pressurizing the inside of the supply tank; a discharge nozzle for discharging the supplied processing liquid; a supply line connected to the supply tank and the discharge nozzle and not provided with an adjustment mechanism for variably restricting a flow path connecting the supply tank and the discharge nozzle; a first drainage line connected to a first branch portion of the supply line between the supply tank and the discharge nozzle; a liquid flow adjustment mechanism provided in the first drainage line for restricting the passage of processing liquid at a pressure lower than a set pressure; and a control unit for adjusting the set pressure. Effect of the Invention

[0006] The present disclosure is advantageous in preventing particles from being mixed into the processing liquid applied to the substrate. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of an example of a processing system. [Diagram 2] FIG. 2 is a schematic diagram of an example of a processing unit. [Diagram 3] FIG. 3 is a diagram showing a schematic configuration of an example of a liquid supply circuit for supplying the treatment liquid to the discharge nozzles. [Figure 4] FIG. 4 is a diagram illustrating an example of a storage unit. [Diagram 5] FIG. 5 is a diagram illustrating an example of a storage unit. [Figure 6] FIG. 6 is a diagram illustrating an example of a storage unit. [Figure 7] FIG. 7 is a diagram illustrating an example of a storage unit. [Figure 8] FIG. 8 is a diagram showing an outline of a first embodiment of a processing liquid supply system. [Figure 9] FIG. 9 is a diagram showing an outline of a first embodiment of a processing liquid supply system. [Figure 10] FIG. 10 is a schematic diagram showing a first embodiment of a processing liquid supply system. [Figure 11]FIG. 11 is a schematic diagram showing a first embodiment of a processing liquid supply system. [Figure 12] FIG. 12 is a schematic diagram showing a second embodiment of the processing liquid supply system. [Figure 13] FIG. 13 is a schematic diagram showing a second embodiment of the processing liquid supply system. [Figure 14] FIG. 14 is a partial cross-sectional view for explaining an example of a heating method in the first heating zone of the guide line. [Figure 15] FIG. 15 is a partial cross-sectional view for explaining an example of a heating method in the first heating zone of the guide line. [Figure 16] FIG. 16 is a partial cross-sectional view for explaining an example of a heating method in the first heating zone of the guide line. [Figure 17] FIG. 17 is a partial cross-sectional view for explaining an example of a heating method in the first heating zone of the guide line. [Figure 18] FIG. 18 is a schematic diagram for explaining an example of a heating method in the first heating zone of the guide line. [Figure 19] FIG. 19 is a schematic diagram for explaining an example of a heating method in the first heating zone of the guide line. [Figure 20] FIG. 20 is a schematic diagram for explaining an example of a heating method in the first heating zone of the guide line. [Figure 21] FIG. 21 is a schematic diagram showing a first embodiment of a treatment liquid temperature adjustment system. [Figure 22] FIG. 22 is a schematic diagram showing a second embodiment of the treatment liquid temperature adjustment system. [Figure 23] FIG. 23 is a diagram illustrating an example of a stirrer installed inside a supply pipe that constitutes a supply line. [Figure 24] FIG. 24 is a diagram showing an example of stirring the processing liquid in the supply tank. [Diagram 25] FIG. 25 is a diagram showing an example of the structure of a supply tank that can suppress temperature unevenness of the treatment liquid. [Figure 26] FIG. 26 is a diagram showing an example of the structure of a supply tank capable of suppressing a decrease in the temperature of the processing liquid. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Fig. 1 is a diagram showing an outline of an example of a processing system 80. The processing system 80 shown in Fig. 1 has a loading / unloading station 91 and a processing station 92. The loading / unloading station 91 includes a placement section 81 equipped with a plurality of carriers C, and a transport section 82 in which a first transport mechanism 83 and an exchange section 84 are provided. Each carrier C accommodates a plurality of substrates W in a horizontal state. The processing station 92 is provided with a plurality of processing units 10 installed on both sides of a transport path 86, and a second transport mechanism 85 that reciprocates along the transport path 86.

[0009] The substrate W is taken out of the carrier C by the first transport mechanism 83 and placed on the delivery section 84, and is taken out of the delivery section 84 by the second transport mechanism 85. The substrate W is then carried into the corresponding processing unit 10 by the second transport mechanism 85, and is subjected to a predetermined liquid treatment (e.g., chemical liquid treatment) in the corresponding processing unit 10. Thereafter, the substrate W is taken out of the corresponding processing unit 10 by the second transport mechanism 85 and placed on the delivery section 84, and is then returned to the carrier C of the placement section 81 by the first transport mechanism 83.

[0010] The processing system 80 includes a control unit 93. The control unit 93 is configured, for example, by a computer, and includes an arithmetic processing unit and a storage unit. The storage unit of the control unit 93 stores programs and data for various processes performed in the processing system 80. The arithmetic processing unit of the control unit 93 appropriately reads out and executes the programs stored in the storage unit, thereby controlling various mechanisms of the processing system 80 and performing various processes.

[0011] The programs and data stored in the storage unit of the control unit 93 may be those recorded in a computer-readable storage medium and installed into the storage unit from the storage medium. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0012] FIG. 2 is a schematic diagram of an example of the processing unit 10. As shown in FIG.

[0013] The processing unit 10, together with a control unit 93 (see FIG. 1), constitutes a substrate liquid processing apparatus, and includes a substrate holding unit 11, a rotation drive unit 12, a liquid supply unit 15, a cup structure 21, an inert gas supply unit 22, and a processing chamber 23. The substrate holding unit 11, the rotation drive unit 12, the liquid supply unit 15, and the cup structure 21 are installed inside the processing chamber 23. The inert gas supply unit 22 supplies an inert gas (e.g., nitrogen) into the processing chamber 23.

[0014] The substrate holder 11 holds the substrate W supplied via the second transport mechanism 85 (see FIG. 1). The illustrated substrate holder 11 employs a vacuum system for suction-holding the back surface of the substrate W, but the substrate holder 11 may hold the substrate W by other systems (e.g., mechanical chuck system). The rotation drive unit 12 applies rotational power to the substrate holder 11 to rotate the substrate W held by the substrate holder 11 together with the substrate holder 11. The illustrated rotation drive unit 12 includes a rotation drive shaft that extends on the rotation axis A1 and has the substrate holder 11 fixedly attached to its tip, and a rotation drive main body that rotates the rotation drive shaft about the rotation axis A1. In this manner, in the illustrated example, the substrate holder 11 and the rotation drive unit 12 constitute at least a part of the rotation mechanism 13 that rotates the substrate W about the rotation axis A1.

[0015] The liquid supply unit 15 includes a nozzle drive unit 16, a drive arm 17, and a discharge nozzle 19. The nozzle drive unit 16 includes a revolving drive shaft that extends on the revolving axis A2 and has a drive arm 17 fixedly attached to its tip, and a revolving drive main body that rotates the revolving drive shaft around the revolving axis A2. The revolving drive shaft of the nozzle drive unit 16 is attached to one end of the drive arm 17, and a discharge nozzle 19 is attached to a discharge head 18 that constitutes the other end of the drive arm 17. The discharge nozzle 19 moves around the revolving axis A2 together with the drive arm 17 (including the discharge head 18). In this manner, in the illustrated example, at least a part of a nozzle moving mechanism that moves the discharge nozzle 19 is configured by the nozzle drive unit 16 and the drive arm 17.

[0016] The discharge nozzle 19 discharges a processing liquid supplied via a supply line (see reference symbol "L4" in FIG. 3 etc.) described below. The processing liquid discharged from the discharge nozzle 19 is applied to the substrate W held by the substrate holder 11 and used for liquid processing of the substrate W. The supply line is connected to the discharge nozzle 19 through the nozzle driver 16 and the drive arm 17 inside the processing chamber 23. Note that in addition to the discharge nozzle 19, a supply ejector (liquid flow switching mechanism) (see reference symbol "69" in FIG. 12 etc.) described below and the like can be attached to the drive arm 17 which is movably provided.

[0017] The specific composition and use of the processing liquid supplied to the discharge nozzle 19 are not limited. For example, a chemical liquid for changing the characteristics of the substrate W, a rinsing liquid for washing the surface of the substrate W, and a cleaning liquid for cleaning the substrate W may be used as the processing liquid. The number of discharge nozzles 19 that the liquid supply unit 15 has is not limited. Although only one discharge nozzle 19 is illustrated in FIG. 2, the liquid supply unit 15 may be equipped with two or more discharge nozzles 19. For example, the discharge head 18 may be provided with a discharge nozzle 19 that discharges a chemical liquid, a discharge nozzle 19 that discharges a rinsing liquid such as deionized water (DIW), and a discharge nozzle 19 that discharges a cleaning liquid (e.g., IPA) used for cleaning the substrate.

[0018] Cup structure 21 has a ring-like planar shape, and is provided so as to surround substrate W held by substrate holding part 11. Cup structure 21 receives liquid scattered from substrate W and guides it to a drain duct (not shown), and adjusts the flow of gas to prevent the gas around substrate W from diffusing. The specific configuration of cup structure 21 is not limited. For example, cup structure 21 may have, as separate bodies, a cup for mainly guiding liquid and a cup for mainly adjusting the flow of gas.

[0019] The processing unit 10 may further include other mechanisms not described above. For example, an exhaust adjustment mechanism for discharging gas from the processing chamber 23 and a drainage adjustment mechanism for discharging liquid that has dropped (scattered) from the substrate W from the processing chamber 23 may be provided. Also, a heating device for heating the liquid on the substrate W to promote liquid processing of the substrate W may be provided.

[0020] [Liquid supply circuit] 3 is a diagram showing a schematic configuration of an example of a liquid supply circuit 30 for supplying the processing liquid P to the discharge nozzle 19. The liquid supply circuit 30 is realized by various components of the processing unit 10 described above and other components of the processing system 80.

[0021] The liquid supply circuit 30 shown in Figure 3 includes a storage unit 32 connected to a processing liquid supply source 31 via a storage line L1, a supply tank 37 connected to the storage unit 32 via a guide line L2, and an ejection nozzle 19 connected to the supply tank 37 via a supply line L4.

[0022] The storage unit 32 stores the processing liquid P supplied from the processing liquid supply source 31 via the storage line L1. The specific configuration of the storage unit 32 is not limited. For example, the storage unit 32 may have only one storage tank capable of storing the processing liquid P, or may have multiple storage tanks (see Figs. 4 to 7 described later). The storage line L1 is provided with a storage opening / closing valve 45. The storage opening / closing valve 45 opens and closes the flow path of the storage line L1 under the control of the controller 93, thereby controlling the supply of the processing liquid P to the storage unit 32.

[0023] The guide line L2 is provided with a guide on-off valve 33 and a guide filter 34 located downstream of the guide on-off valve 33. The guide on-off valve 33 opens and closes the flow path of the guide line L2 under the control of the control unit 93. The guide filter 34 removes foreign matter from the processing liquid P while allowing the processing liquid P to pass through. The processing liquid P is sent from the storage unit 32 to the supply tank 37 through the guide line L2 whose flow path is opened by the guide on-off valve 33.

[0024] The method of sending the processing liquid P from the storage unit 32 to the supply tank 37 is not limited. For example, it is possible to send the processing liquid P from the storage unit 32 to the guide line L2 by blowing a pressurizing gas (for example, an inert gas such as nitrogen) into the storage tank of the storage unit 32 (see FIG. 7 described later). In addition, it is possible to send the processing liquid P from the storage unit 32 to the supply tank 37 by utilizing gravity by installing the storage unit 32 and the guide line L2 above the supply tank 37. When using a sending device such as a pump (not shown) that directly sends out the processing liquid P in the guide line L2, it is preferable that such a sending device is provided upstream of the guide filter 34. In this case, even if particles are released into the processing liquid P from the sending device, such particles can be removed from the processing liquid P by the guide filter 34.

[0025] A heating zone in which the treatment liquid is heated by the heating unit is set on at least one of the guide line L2 and the supply tank 37. In the example shown in Fig. 3, heating zones are set on both the guide line L2 and the supply tank 37. That is, a first heating unit 35 is provided near the first heating zone Z1 of the guide line L2, and the treatment liquid P in the first heating zone Z1 is heated by the first heating unit 35. In addition, a second heating unit 36 ​​is provided near the second heating zone Z2 of the supply tank 37, and the treatment liquid P in the second heating zone Z2 is heated by the second heating unit 36.

[0026] The heating zones Z1 and Z2 are set downstream of the guide filter 34. The guide filter 34 removes foreign matter from the processing liquid P flowing through the portion of the flow path of the processing liquid P that is upstream of the heating zones Z1 and Z2. The higher the temperature of the processing liquid P passing through the guide filter 34, the more likely it is that foreign matter will be released from the guide filter 34 into the processing liquid P. In the liquid supply circuit 30 shown in FIG. 3, the processing liquid P before heating passes through the guide filter 34, so that the release of foreign matter from the guide filter 34 into the processing liquid P can be suppressed. In addition, in the liquid supply circuit 30 shown in FIG. 3, the flow path of the processing liquid P from the guide line L2 to the discharge nozzle 19 is not provided with a filter for removing foreign matter from the processing liquid P in the heating zones Z1 and Z2 and in the flow path downstream of the heating zones Z1 and Z2. In this way, by preventing the high-temperature processing liquid P heated in the heating zones Z1 and Z2 from passing through the filter, contamination of the processing liquid P can be prevented.

[0027] The treatment liquid P is supplied to the inside of the supply tank 37 through the guide line L2. A pressurizing device 38 is attached to the supply tank 37. The pressurizing device 38 pressurizes the inside of the supply tank 37 and sends the treatment liquid P from the supply tank 37 to the supply line L4. The pressurizing device 38 shown in the figure is connected to the supply tank 37 through the gas line L3, and can supply a pressurizing gas (e.g., an inert gas such as nitrogen) into the supply tank 37 through the gas line L3 to increase the pressure in the supply tank 37. A pressurizing filter 39 is provided in a portion of the gas line L3 downstream of the pressurizing device 38. The pressurizing filter 39 removes foreign matter from the pressurizing gas while passing the pressurizing gas from the pressurizing device 38. Therefore, the pressurizing gas sent from the pressurizing device 38 to the gas line L3 flows into the supply tank 37 in a clean state after the pressurizing filter 39 removes foreign matter from the pressurizing gas.

[0028] The supply line L4 is connected to the supply tank 37 and the discharge nozzle 19. The supply line L4 is not provided with an adjustment mechanism for variably restricting the flow path connecting the supply tank 37 and the discharge nozzle 19. The "adjustment mechanism for variably restricting the flow path" referred to here can be configured with any adjustment mechanism. Typically, an adjustment mechanism such as a valve or a pump that can change the cross-sectional area of ​​the flow path of the processing liquid can be the "adjustment mechanism for variably restricting the flow path". Examples of valves that can be the "adjustment mechanism for variably restricting the flow path" include a dispense valve that works as an opening / closing valve for opening and closing the flow path, and a suck-back valve for pulling the liquid level at the nozzle tip back to the upstream side. The "adjustment mechanism for variably restricting the flow path" may cause particles such as dust to be mixed into the liquid in the flow path. In the liquid supply circuit 30 shown in FIG. 3, the "adjustment mechanism for variably restricting the flow path" is not installed downstream of the guide filter 34, so that it is possible to prevent particles from being mixed into the processing liquid P in the flow path between the guide filter 34 and the discharge nozzle 19.

[0029] A first drainage line L5 is connected to a first branched portion b1 of the supply line L4 between the supply tank 37 and the discharge nozzle 19. A liquid flow adjustment mechanism 40 is provided in the first drainage line L5. The liquid flow adjustment mechanism 40 adjusts the flow of the treatment liquid P in the supply line L4 and the first drainage line L5, and can control the discharge of the treatment liquid P from the discharge nozzle 19. The liquid flow adjustment mechanism 40 can be realized by various configurations, and specific examples of the liquid flow adjustment mechanism 40 will be described later (see FIGS. 8 to 13). The treatment liquid P that has passed through the liquid flow adjustment mechanism 40 is sent downstream via the first drainage line L5 and is returned to the storage unit 32 or discharged to the drain tank 41.

[0030] In the liquid supply circuit 30 (substrate liquid processing apparatus) having the above-mentioned configuration, the inside of the supply tank 37 is pressurized by the pressurizing device 38, whereby the processing liquid P is supplied from the supply tank 37 to the discharge nozzle 19 via the supply line L4. A substrate liquid processing method for applying the processing liquid P to the substrate W and performing liquid processing on the substrate W is carried out by discharging the processing liquid P thus supplied to the discharge nozzle 19 from the discharge nozzle 19 toward the substrate W.

[0031] Next, specific examples of the components of the liquid supply circuit 30 will be described.

[0032] [Storage unit] 4 to 7 are diagrams illustrating an example of the storage unit 32. FIG.

[0033] 4 to 7 includes a plurality of storage tanks (i.e., a first storage tank 47a and a second storage tank 47b). The first storage tank 47a and the second storage tank 47b are connected to each other via a plurality of circulation lines (i.e., a first circulation line L7a and a second circulation line L7b).

[0034] The first circulation line L7a is a line that guides the processing liquid P from the first storage tank 47a to the second storage tank 47b. The first circulation line L7a is provided with a first circulation on-off valve 49a and a first circulation filter 50a. The first circulation on-off valve 49a is provided upstream of the first circulation filter 50a (i.e., on the first storage tank 47a side) and opens and closes the first circulation line L7a under the control of the control unit 93. The first circulation filter 50a is provided downstream of the first circulation on-off valve 49a (i.e., on the second storage tank 47b side) and removes foreign matter from the processing liquid P while passing the processing liquid P through the first circulation line L7a.

[0035] The second circulation line L7b is a line that guides the processing liquid P from the second storage tank 47b to the first storage tank 47a. A second circulation on-off valve 49b and a second circulation filter 50b are provided in the second circulation line L7b. The second circulation on-off valve 49b is provided upstream of the second circulation filter 50b (i.e., on the second storage tank 47b side) and opens and closes the second circulation line L7b under the control of the control unit 93. The second circulation filter 50b is provided downstream of the second circulation on-off valve 49b (i.e., on the first storage tank 47a side) and removes foreign matter from the processing liquid P while passing the processing liquid P through the second circulation line L7b.

[0036] A first storage pressurizing unit 48a is attached to the first storage tank 47a, and a second storage pressurizing unit 48b is attached to the second storage tank 47b. Under the control of the control unit 93, the first storage pressurizing unit 48a pressurizes the inside of the first storage tank 47a, and the second storage pressurizing unit 48b pressurizes the inside of the second storage tank 47b. The specific configurations of the first storage pressurizing unit 48a and the second storage pressurizing unit 48b are not limited. For example, the first storage pressurizing unit 48a and the second storage pressurizing unit 48b may each include a compressor that sends a pressurizing gas to the inside of the first storage tank 47a and the second storage tank 47b.

[0037] The storage line L1 is connected to the first storage tank 47a. A storage on-off valve 45 and a storage filter 46 are provided in the storage line L1. The storage on-off valve 45 is provided upstream of the storage filter 46 (i.e., on the treatment liquid supply source 31 side), and opens and closes the storage line L1 under the control of the control unit 93. The storage filter 46 is provided downstream of the storage on-off valve 45 (i.e., on the first storage tank 47a side), and removes foreign matter from the treatment liquid P while allowing the treatment liquid P in the storage line L1 to pass therethrough.

[0038] The guide line L2 is connected to a first storage tank 47a, and the first storage tank 47a is connected to the supply tank 37 via the guide line L2.

[0039] Furthermore, the storage unit 32 is provided with other mechanisms (not shown) as necessary. For example, each of the first storage tank 47a and the second storage tank 47b is provided with a liquid amount measuring mechanism (not shown) such as a level sensor that measures the height and / or amount of the processing liquid P stored therein. For example, by providing a plurality of sensors that detect the presence or absence of the processing liquid P at different heights in each of the storage tanks 47a, 47b, it is possible to measure the height of the processing liquid P in each of the storage tanks 47a, 47b. The measurement results of the liquid amount measuring mechanism are sent to the control unit 93.

[0040] A first drainage line L5 (see FIG. 3) may be connected to at least one of the storage tanks 47a, 47b. In this case, the treatment liquid that has passed through the liquid flow adjustment mechanism 40 flows into at least one of the storage tanks 47a, 47b via the first drainage line L5. The first drainage line L5 may be directly connected to at least one of the storage tanks 47a, 47b, or may be connected via the storage line L1. By connecting the first drainage line L5 to a portion of the storage line L1 upstream of the storage filter 46, the treatment liquid P that has flowed from the first drainage line L5 into the storage line L1 flows into the first storage tank 47a after foreign matter has been removed by the storage filter 46.

[0041] When the processing liquid P is supplied to the storage unit 32 having the above-mentioned configuration, the storage unit 32 is placed in the state shown in Fig. 4. That is, under the control of the control unit 93, the storage line L1 is opened by the storage on-off valve 45, and the first circulation line L7a, the second circulation line L7b, and the guide line L2 are closed by the first circulation on-off valve 49a, the second circulation on-off valve 49b, and the guide on-off valve 33. As a result, the processing liquid P is supplied from the processing liquid supply source 31 to the first storage tank 47a via the storage line L1, and the processing liquid P is stored in the first storage tank 47a.

[0042] The control unit 93 monitors the height and / or amount of the processing liquid P in the first storage tank 47a based on the measurement result of the liquid amount measuring mechanism. When the processing liquid P in the first storage tank 47a reaches a predetermined height and / or amount (for example, about 300 cc to 500 cc), the control unit 93 controls the storage opening / closing valve 45 to close the storage line L1 and stop the supply of the processing liquid P to the first storage tank 47a.

[0043] Thereafter, the processing liquid P is circulated between the storage tanks 47a, 47b, and foreign matter is removed by the circulation filters 50a, 50b. For example, as shown in FIG. 5, under the control of the control unit 93, the first circulation line L7a is opened by the first circulation on-off valve 49a, and the second circulation line L7b and the guide line L2 are closed by the second circulation on-off valve 49b and the guide on-off valve 33. In this state, the first storage pressurizing unit 48a pressurizes the inside of the first storage tank 47a, so that the processing liquid P can be sent from the first storage tank 47a to the second storage tank 47b through the first circulation line L7a. Also, as shown in FIG. 6, under the control of the control unit 93, the second circulation line L7b is opened by the second circulation on-off valve 49b, and the first circulation line L7a and the guide line L2 are closed by the first circulation on-off valve 49a and the guide on-off valve 33. In this state, the second storage pressurization unit 48b pressurizes the inside of the second storage tank 47b, thereby allowing the processing liquid P to be sent from the second storage tank 47b to the first storage tank 47a.

[0044] In this manner, after the foreign matter is removed from the processing liquid P by the circulation filters 50a, 50b, the processing liquid P is sent from the storage unit 32 to the supply tank 37. Specifically, as shown in Fig. 7, under the control of the control unit 93, the guide line L2 is opened by the guide on-off valve 33, and the first circulation line L7a and the second circulation line L7b are closed by the first circulation on-off valve 49a and the second circulation on-off valve 49b. In this state, the inside of the first storage tank 47a is pressurized by the first storage pressurization unit 48a, so that the processing liquid P can be sent from the first storage tank 47a to the guide line L2.

[0045] 4 to 7, the first circulation filter 50a and the second circulation filter 50b constitute "a filter that removes foreign matter from the processing liquid flowing through at least one of the multiple circulation lines." Also, the combination of the first storage and pressurization unit 48a, the second storage and pressurization unit 48b, the first circulation on-off valve 49a, the second circulation on-off valve 49b, and the guide on-off valve 33 constitutes "a circulation adjustment mechanism that circulates the processing liquid between the multiple storage tanks via the multiple circulation lines."

[0046] In a conventional substrate liquid processing apparatus, foreign matter may be removed from the processing liquid by filtering the processing liquid while circulating the processing liquid using, for example, a bellows pump. On the other hand, according to the storage unit 32 shown in Figs. 4 to 7 described above, foreign matter can be removed from the processing liquid P by circulating the processing liquid P between the multiple storage tanks 47a, 47b using, for example, a pressurizing gas. Therefore, foreign matter can be appropriately removed from the processing liquid P by the storage unit 32 having a simple configuration without using a mechanism with a complicated structure such as a bellows pump.

[0047] Next, a description will be given of a specific example of a supply system for the processing liquid P from the supply tank 37 to the discharge nozzle 19. Two structural examples of such a processing liquid supply system (i.e., a "first aspect of the processing liquid supply system" and a "second aspect of the processing liquid supply system") will be described below.

[0048] [First embodiment of processing liquid supply system] Figures 8 to 11 are diagrams showing an outline of a first embodiment of a treatment liquid supply system. Some of the components are omitted from the illustration in Figures 8 to 11. For example, in this embodiment, a heating section for heating the treatment liquid P (i.e., the first heating section 35 and the second heating section 36 in Figure 3) is provided, but the heating section is omitted from the illustration in Figures 8 to 11. Also, detailed explanation of the configuration and function of each element already explained will be omitted.

[0049] In addition to the above-mentioned guide line L2, gas line L3, and supply line L4, an atmosphere release line L9 is connected to the supply tank 37 of this embodiment. The atmosphere release line L9 connects the inside of the supply tank 37 to the environment (e.g., atmosphere) around the supply tank 37, and is provided to make the pressure inside the supply tank 37 the same as the environmental pressure (e.g., atmospheric pressure). An atmosphere release valve 63 is provided in the atmosphere release line L9. The atmosphere release valve 63 opens and closes the flow path of the atmosphere release line L9 under the control of the control unit 93. When the atmosphere release valve 63 opens the atmosphere release line L9, the inside of the supply tank 37 is opened to the surroundings, and gas can freely move between the inside of the supply tank 37 and the surroundings via the atmosphere release line L9. On the other hand, when the atmosphere release valve 63 closes the atmosphere release line L9, the inside of the supply tank 37 is blocked from the surroundings, and gas does not flow between the inside of the supply tank 37 and the surroundings. For example, when the processing liquid P is supplied to the discharge nozzle 19 (see FIG. 9 described later), the control unit 93 controls the atmosphere release valve 63 to close the atmosphere release line L9, thereby placing the inside of the supply tank 37 in a state where the pressure can be efficiently increased. On the other hand, when the processing liquid P is not supplied to the discharge nozzle 19 (see FIG. 10 and FIG. 11 described later), the control unit 93 controls the atmosphere release valve 63 to open L9.

[0050] The pressurizing device 38 has a gas supply unit 65 that supplies pressurizing gas to the gas line L3 connected to the inside of the supply tank 37, an air pressure adjustment unit 66 that adjusts the pressure of the pressurizing gas flowing through the gas line L3, and a gas on-off valve 67 that opens and closes the flow path of the gas line L3. The gas supply unit 65 may be driven under the control of the control unit 93 and may include, for example, a compressor. The air pressure adjustment unit 66 may be driven under the control of the control unit 93 and may include, for example, an electropneumatic regulator. The gas supply unit 65 and the air pressure adjustment unit 66 may be stopped from being driven under the control of the control unit 93, for example, when the liquid supply circuit 30 is placed in a standby state. The gas on-off valve 67 is driven under the control of the control unit 93 and may be, for example, a solenoid valve.

[0051] The supply tank 37 is provided with a liquid volume measuring mechanism (not shown) such as a level sensor that measures the height and / or amount of the processing liquid P stored inside. The measurement result of the liquid volume measuring mechanism is sent to the control unit 93.

[0052] The discharge nozzle 19 is located above the supply tank 37 and the liquid flow adjustment mechanism 40 (specifically, the back pressure valve 42). The supply tank 37 and the liquid flow adjustment mechanism 40 (the back pressure valve 42) are provided at a position lower than the highest part of the supply line L4.

[0053] A liquid detection sensor 61 is provided near the supply line L4. The liquid detection sensor 61 detects the presence or absence of the treatment liquid P at a first measurement point M1 located downstream (i.e., on the discharge nozzle 19 side) of the first branch portion b1 of the supply line L4. The detection method of the liquid detection sensor 61 is not limited. For example, when the supply line L4 is made of a material that is capable of transmitting light, the liquid detection sensor 61 may use an optical sensor. Furthermore, the liquid detection sensor 61 may use a sensor that measures the electrostatic capacitance or magnetic field at the first measurement point M1. The liquid detection sensor 61 transmits the detection result to the control unit 93.

[0054] The first branched portion b1 is located between the supply tank 37 and the highest portion of the supply line L4 extending from the supply tank 37 to the discharge nozzle 19. The first measurement point M1 is located between the first branched portion b1 and the highest portion of the supply line L4 extending from the supply tank 37 to the discharge nozzle 19, and is set at a position lower than the highest portion of the supply line L4.

[0055] A flow meter 62 is provided on the supply line L4. The flow meter 62 measures the flow rate of the treatment liquid P at a second measurement point M2 located downstream of the first branched portion b1 of the supply line L4 (i.e., on the discharge nozzle 19 side). The flow meter 62 transmits the measurement result to the control unit 93. The control unit 93 adjusts the set pressure of a back pressure valve 42, which will be described later, based on the measurement result of the flow meter 62.

[0056] The first drainage line L5 is provided with a back pressure valve 42 and a drainage on-off valve 43 located downstream of the back pressure valve 42. The drainage on-off valve 43 opens and closes the flow path of the first drainage line L5 under the control of the control unit 93. The back pressure valve 42 functions as the above-mentioned liquid flow adjustment mechanism 40, and restricts the passage of the processing liquid P with a pressure lower than the set pressure. The back pressure valve 42 in this example allows the processing liquid P with a pressure equal to or higher than the set pressure to pass, but does not allow the processing liquid P with a pressure lower than the set pressure to pass. Therefore, the back pressure valve 42 adjusts the pressure of the processing liquid P in the first drainage line L5 (particularly the flow path upstream of the back pressure valve 42) and the supply line L4 to a pressure lower than the set pressure.

[0057] The set pressure of the back pressure valve 42 is adjusted by the control unit 93, and the flow state of the treatment liquid P can be changed by changing the set pressure. For example, when the treatment liquid P is supplied to the discharge nozzle 19, the control unit 93 adjusts the set pressure of the back pressure valve 42 so that it is equal to or higher than the peak head pressure, which is the pressure head at the height position of the highest part of the supply line L4 extending from the supply tank 37 to the discharge nozzle 19. On the other hand, when the treatment liquid P is not supplied to the discharge nozzle 19, the control unit 93 adjusts the set pressure of the back pressure valve 42 so that it is lower than the peak head pressure.

[0058] A second drainage line L6 is connected to a second branch portion b2 of the supply line L4 between the supply tank 37 and the discharge nozzle 19. In the example shown in Fig. 8 to Fig. 11, the second branch portion b2 is set at the same position as the first branch portion b1, but the second branch portion b2 may be provided upstream or downstream of the first branch portion b1. The second drainage line L6 may be connected to the supply line L4 via the first drainage line L5.

[0059] The second drainage line L6 is provided with a suction mechanism 53. The driving mode of the suction mechanism 53 can be switched between a suction mode in which the flow path of the supply line L4 is suctioned via the second drainage line L6, and a non-suction mode in which the flow path of the supply line L4 is not suctioned via the second drainage line L6. For example, when the treatment liquid P is not supplied to the discharge nozzle 19, the control unit 93 adjusts the suction mechanism 53 to the suction mode at least temporarily. This makes it possible to quickly move the treatment liquid P in the supply line L4 away from the discharge nozzle 19, and prevents unintended problems such as the treatment liquid P dripping from the discharge nozzle 19.

[0060] The suction mechanism 53 of this example has a mode switching valve 54, a negative pressure tank 55, and a negative pressure regulator 56. The mode switching valve 54 is provided in the second drainage line L6, and opens and closes the second drainage line L6 under the control of the control unit 93. One end of the second drainage line L6 is connected to the supply line L4 (particularly the second branch portion b2), and the other end of the second drainage line L6 is connected to the negative pressure tank 55. The negative pressure regulator 56 adjusts the negative pressure tank 55 to a negative pressure state.

[0061] The illustrated negative pressure regulator 56 includes a negative pressure compressor 57, a negative pressure on-off valve 58, and a negative pressure ejector 59. The negative pressure compressor 57 sends out gas (e.g., an inert gas such as nitrogen) to the negative pressure line L8 under the control of the control unit 93. The negative pressure on-off valve 58 is provided between the negative pressure compressor 57 and the negative pressure ejector 59, and opens and closes the negative pressure line L8 under the control of the control unit 93. The negative pressure ejector 59 can be configured by an aspirator that connects the negative pressure tank 55 and the negative pressure line L8, and can create a reduced pressure state inside the negative pressure tank 55 by the Venturi effect using the gas flowing through the negative pressure line L8. The aspirator typically has a T-shaped flow path consisting of a combination of a horizontal flow path and a vertical flow path. The horizontal flow path is locally narrowed at the junction of the vertical flow path. By flowing a fluid (in this example, gas from the negative pressure compressor 57) through the horizontal flow path, the flow rate of the fluid increases and the pressure decreases at the confluence, resulting in the fluid in the vertical flow path being drawn toward the horizontal flow path.

[0062] When adjusting the suction mechanism 53 to the non-suction mode, the control unit 93 controls the mode switching valve 54 to close the flow path of the second drainage line L6. On the other hand, when adjusting the suction mechanism 53 to the suction mode, the control unit 93 controls the mode switching valve 54 to open the flow path of the second drainage line L6.

[0063] For example, when adjusting the temperature of the treatment liquid P, the liquid supply circuit 30 is placed in the state shown in Fig. 8 under the control of the control unit 93. That is, the guide line L2 is opened by the guide on-off valve 33, the atmosphere release line L9 is closed by the atmosphere release valve 63, and the gas line L3 is opened by the gas on-off valve 67. In addition, the first drainage line L5 is opened by the drainage on-off valve 43, and the second drainage line L6 is closed by the mode switching valve 54. The control unit 93 also sets the set pressure of the back pressure valve 42 to be lower than the above-mentioned peak head pressure.

[0064] In this state, the pressurizing gas supplied from the gas supply unit 65 to the gas line L3 is adjusted in pressure by the air pressure adjustment unit 66, and then supplied through the pressure filter 39 into the supply tank 37. This pressurizes the inside of the supply tank 37, and the treatment liquid P is sent from the supply tank 37 to the supply line L4. Meanwhile, the treatment liquid P is supplied to the supply tank 37 from the storage unit 32 (for example, the first storage tank 47a shown in FIGS. 4 to 7) via the guide line L2. The control unit 93 controls the guide opening / closing valve 33 to open and close the guide line L2 based on the measurement result of a liquid amount measuring mechanism (not shown) provided in the supply tank 37, and an appropriate amount of the treatment liquid P is stored in the supply tank 37.

[0065] A part of the processing liquid P that flows from the supply tank 37 into the supply line L4 flows into the first drainage line L5 via the first branch portion b1 and reaches the back pressure valve 42. Since the set pressure of the back pressure valve 42 is adjusted to be lower than the peak head pressure, the back pressure valve 42 adjusts the pressure of the processing liquid P in the supply line L4 to be lower than the peak head pressure while allowing the processing liquid P to pass through. As a result, the processing liquid P in the supply line L4 can only reach a height position lower than the highest part of the supply line L4, and the processing liquid P is not supplied to the discharge nozzle 19.

[0066] The processing liquid P that has passed through the back pressure valve 42 is sent through the first drainage line L5 to the storage unit 32 (for example, the first storage tank 47a shown in FIGS. 4 to 7). The processing liquid P may be sent directly from the first drainage line L5 to the storage unit 32, or may be sent from the first drainage line L5 to the storage unit 32 via a tank or line (not shown). The processing liquid P sent from the first drainage line L5 to the storage unit 32 is returned to the supply tank 37 via the guide line L2.

[0067] 8, the processing liquid P sent from the supply tank 37 to the supply line L4 is returned to the supply tank 37 through the first drainage line L5, the storage unit 32 and the guide line L2 without being discharged from the discharge nozzle 19. The processing liquid P is heated in the heating zones (not shown in FIG. 8; see the first heating zone Z1 and the second heating zone Z2 in FIG. 3) while circulating through the liquid supply circuit 30 in this way, and the temperature of the processing liquid P is gradually increased overall and adjusted to a desired temperature.

[0068] After the processing liquid P is adjusted to the desired temperature, when the processing liquid P is supplied to the discharge nozzle 19 and discharged from the discharge nozzle 19, the liquid supply circuit 30 is placed in the state shown in Figure 9 under the control of the control unit 93.

[0069] That is, the control unit 93 sets the set pressure of the back pressure valve 42 to the above-mentioned peak head pressure or higher (preferably higher than the peak head pressure). The guide line L2 is closed by the guide on-off valve 33, but the open / closed states of the atmosphere release line L9, the gas line L3, the first drainage line L5 and the second drainage line L6 are set to the same state as that shown in Fig. 8. The pressurizing device 38 (particularly the air pressure adjusting unit 66) pressurizes the inside of the supply tank 37 so that the treatment liquid P sent from the supply tank 37 to the supply line L4 has a pressure of the peak head pressure or higher (preferably a pressure higher than the peak head pressure).

[0070] Thereby, the pressure of the treatment liquid P in the supply line L4 is adjusted to the same pressure as the “set pressure equal to or higher than the peak head pressure” by the back pressure valve 42. As a result, the treatment liquid P reaches the highest part of the supply line L4 and is then supplied to the discharge nozzle 19.

[0071] The control unit 93 may adjust the set pressure of the back pressure valve 42 based on the measurement result of the flow meter 62. For example, when the control unit 93 determines from the measurement result of the flow meter 62 that the amount of processing liquid P supplied to the discharge nozzle 19 is insufficient, the control unit 93 may increase the set pressure of the back pressure valve 42 to supply a larger amount of processing liquid P to the discharge nozzle 19. When the control unit 93 determines from the measurement result of the flow meter 62 that the amount of processing liquid P supplied to the discharge nozzle 19 is too large, the control unit 93 may decrease the set pressure of the back pressure valve 42 to reduce the amount of processing liquid P supplied to the discharge nozzle 19.

[0072] In the example shown in FIG. 9, while the treatment liquid P is being supplied to the discharge nozzle 19, the negative pressure on-off valve 58 opens the negative pressure line L8 under the control of the control unit 93, and the negative pressure tank 55 is adjusted to a negative pressure state.

[0073] Then, when the supply of processing liquid P to the discharge nozzle 19 is stopped from a state in which the processing liquid P is being supplied to the discharge nozzle 19, and the discharge of processing liquid P from the discharge nozzle 19 is stopped, the liquid supply circuit 30 is placed in the state shown in Figure 10 under the control of the control unit 93.

[0074] That is, the control unit 93 sets the set pressure of the back pressure valve 42 to be lower than the peak head pressure. This causes the back pressure valve 42 to adjust the pressure of the treatment liquid P in the supply line L4 to be lower than the peak head pressure. As a result, the treatment liquid P cannot reach the highest part of the supply line L4, and the treatment liquid P is not supplied to the discharge nozzle 19.

[0075] Further, the second drainage line L6 is opened by the mode switching valve 54 under the control of the control unit 93, and the suction mechanism 53 is adjusted to the suction mode. As a result, the negative pressure tank 55 is connected to the supply line L4 via the second drainage line L6, and the treatment liquid P in the supply line L4 is sucked into the negative pressure tank 55 via the second drainage line L6. As a result, the head position of the treatment liquid P in the supply line L4 can be quickly moved away from the discharge nozzle 19, and it is also possible to instantaneously stop the discharge of the treatment liquid P from the discharge nozzle 19. The treatment liquid P that has flowed into the negative pressure tank 55 is sent to the storage unit 32 via the negative pressure ejector 59 and the negative pressure line L8.

[0076] The control unit 93 switches the suction mechanism 53 (described later) from a suction mode to a non-suction mode according to the detection result of the liquid detection sensor 61. While the detection result of the liquid detection sensor 61 indicates that the treatment liquid P is present at the first measurement point M1, the control unit 93 controls the suction mechanism 53 (particularly the mode switching valve 54) so ​​that the suction mode is maintained. On the other hand, when the detection result of the liquid detection sensor 61 indicates that the treatment liquid P is not present at the first measurement point M1, the control unit 93 controls the suction mechanism 53 (particularly the mode switching valve 54) so ​​that the mode is switched from the suction mode to the non-suction mode. This makes it possible to reliably move the head position of the treatment liquid P in the supply line L4 away from the discharge nozzle 19.

[0077] Furthermore, the atmosphere release line L9 is opened by the atmosphere release valve 63, and the gas line L3 is closed by the gas on-off valve 67. This adjusts the pressure inside the supply tank 37 to the same as the pressure around the supply tank 37, and the pressure of the processing liquid P from the supply tank 37 to the supply line L4 can be weakened.

[0078] The open / closed states of the guide line L2 and the first drainage line L5 are the same as those shown in FIG.

[0079] When the liquid supply circuit 30 is placed in the standby state, the liquid supply circuit 30 is placed in the state shown in FIG.

[0080] That is, the control unit 93 sets the set pressure of the back pressure valve 42 lower than the peak head pressure. The first drainage line L5 is closed by the drainage on-off valve 43, the atmosphere release line L9 is opened by the atmosphere release valve 63, and the gas line L3 is closed by the gas on-off valve 67. The second drainage line L6 is closed by the mode switching valve 54, and the negative pressure line L8 is closed by the negative pressure on-off valve 58.

[0081] As a result, the processing liquid P in the supply tank 37 and the supply line L4 is neither supplied to the discharge nozzle 19 nor circulated. The inside of the supply tank 37 is not pressurized, and the processing liquid P in the supply line L4 is not discharged through the first drainage line L5 and the second drainage line L6. Therefore, the liquid level of the processing liquid P in the supply line L4 is the same as the liquid level of the processing liquid P in the supply tank 37.

[0082] Meanwhile, the guide line L2 is opened by the guide on-off valve 33, and the processing liquid P is supplied from the storage unit 32 to the supply tank 37 via the guide line L2. The control unit 93 monitors the amount of processing liquid P stored in the supply tank 37 based on the measurement results of a liquid volume measuring mechanism (not shown) provided in the supply tank 37. Then, when the processing liquid P in the supply tank 37 reaches an appropriate amount, the control unit 93 closes the guide line L2 by the guide on-off valve 33, and stops the supply of the processing liquid P to the supply tank 37.

[0083] In a conventional substrate liquid processing apparatus, the discharge of the processing liquid from the discharge nozzle can be switched on and off by controlling the opening and closing of an on-off valve provided in the supply line while applying pressure to the processing liquid also in the vicinity of the discharge nozzle. On the other hand, according to the liquid supply circuit 30 shown in Figures 8 to 11, the discharge of the processing liquid P from the discharge nozzle 19 can be switched on and off by changing the set pressure of the back pressure valve 42. Therefore, according to the liquid supply circuit 30 of this embodiment, it is not necessary to install a device for applying pressure to the processing liquid P in the vicinity of the discharge nozzle 19 or to install an on-off valve in the supply line L4.

[0084] In the conventional substrate liquid processing apparatus, a constant pressure valve is provided in the supply line to adjust the flow rate of the processing liquid in the supply line and control the amount of processing liquid supplied to the discharge nozzle. On the other hand, according to the liquid supply circuit 30 shown in Figures 8 to 11, the amount of processing liquid P supplied to the discharge nozzle 19 can be changed by using the pressurizing gas sent from the pressurizer 38 to the supply tank 37. Therefore, according to the liquid supply circuit 30 of this embodiment, it is not necessary to install a constant pressure valve in the supply line L4.

[0085] [Second embodiment of processing liquid supply system] Figures 12 and 13 are diagrams showing an outline of a second embodiment of the processing liquid supply system. Some of the components are omitted from Figures 12 and 13. For example, in this embodiment, a heating section for heating the processing liquid P (i.e., the first heating section 35 and the second heating section 36 in Figure 3) is provided, but is not shown in Figures 12 and 13. Furthermore, detailed explanations of the configurations and functions of the elements already explained will be omitted.

[0086] The liquid supply circuit 30 of this embodiment also includes a supply tank 37, a pressurizing device 38, a discharge nozzle 19, and a supply line L4 similar to the liquid supply circuit 30 of the first embodiment described above. That is, the processing liquid P is supplied to the inside of the supply tank 37 via a guide line L2, the pressurizing device 38 pressurizes the inside of the supply tank 37, and the discharge nozzle 19 discharges the supplied processing liquid P. The supply line L4 is connected to the supply tank 37 and the discharge nozzle 19, and is not provided with an adjustment mechanism for variably restricting the flow path connecting the supply tank 37 and the discharge nozzle 19.

[0087] The liquid supply circuit 30 of this embodiment further includes a supply ejector 69. The supply ejector 69 is provided in the first branch portion b1, and functions as a liquid flow switching mechanism that switches whether or not the processing liquid P flows in the portion of the supply line L4 that connects the first branch portion b1 and the discharge nozzle 19, depending on the flow of the processing liquid P in the first drainage line L5. Specifically, the supply ejector 69 can be configured as an aspirator that connects the discharge nozzle 19, the supply line L4, and the first drainage line L5. The supply ejector 69 can create a reduced pressure state in the discharge nozzle 19 by the Venturi effect that utilizes the processing liquid P flowing from the supply line L4 to the first drainage line L5.

[0088] The first drainage line L5 connected to the first branch portion b1 in this manner is connected to the supply line L4 at the supply ejector 69. The first drainage line L5 branches into a first branch drainage line L5a provided with a back pressure valve 42 and a second branch drainage line L5b provided with a drainage on-off valve 43. The first branch drainage line L5a and the second branch drainage line L5b are connected to a storage unit 32 (for example, the first storage tank 47a shown in FIGS. 4 to 7).

[0089] The highest part of the first drainage line L5 is provided at the same height as the highest part of the supply line L4 or at a lower position than the highest part of the supply line L4. In particular, the first branch drainage line L5a and the second branch drainage line L5b are provided at a lower position than the highest part of the supply line L4.

[0090] The back pressure valve 42 restricts the passage of the processing liquid P having a pressure lower than the set pressure, and allows the processing liquid P having a pressure equal to or higher than the set pressure to pass, while not allowing the processing liquid P having a pressure lower than the set pressure to pass. The drainage opening / closing valve 43 opens and closes the second branch drainage line L5b under the control of the control unit 93.

[0091] The back pressure valve 42 and the drainage on-off valve 43 function as a liquid flow adjustment mechanism 40 that adjusts the flow of the treatment liquid P in the first drainage line L5 under the control of the control unit 93. For example, when the second branch drainage line L5b is opened by the drainage on-off valve 43 (see FIG. 12), the treatment liquid P in the first drainage line L5 is sent to the storage unit 32 via the second branch drainage line L5b. Therefore, the treatment liquid P in the first drainage line L5 is sent smoothly downstream basically without pressure adjustment. On the other hand, when the second branch drainage line L5b is closed by the drainage on-off valve 43 (see FIG. 13), the back pressure valve 42 inhibits the flow of the treatment liquid P in the first drainage line L5 so as to adjust the pressure of the treatment liquid P in the first drainage line L5 to a pressure lower than the set pressure.

[0092] The other configuration is the same as that of the liquid supply circuit 30 of the first embodiment described above (see Figs. 8 to 11). For example, the discharge nozzle 19 is located above the supply tank 37 and the liquid flow adjustment mechanism 40 (specifically, the back pressure valve 42 and the drainage opening / closing valve 43).

[0093] For example, when adjusting the temperature of the processing liquid P, the liquid supply circuit 30 is placed in the state shown in Fig. 12 under the control of the control unit 93. That is, the guide line L2 is opened by the guide on-off valve 33, the atmosphere release line L9 is closed by the atmosphere release valve 63, the gas line L3 is opened by the gas on-off valve 67, and the second branch drainage line L5b is opened by the drainage on-off valve 43.

[0094] In this state, the pressurizing gas supplied from the gas supply unit 65 to the gas line L3 has its pressure adjusted by the air pressure adjustment unit 66, and is then supplied through the pressure filter 39 into the supply tank 37. This pressurizes the inside of the supply tank 37, and the treatment liquid P is sent from the supply tank 37 to the supply line L4. At this time, the pressurizing device 38 (particularly the air pressure adjustment unit 66) pressurizes the inside of the supply tank 37 so that the treatment liquid P sent from the supply tank 37 to the supply line L4 has a pressure higher than the above-mentioned peak head pressure.

[0095] Meanwhile, the treatment liquid P is supplied to the supply tank 37 from the storage unit 32 (for example, the first storage tank 47a shown in FIGS. 4 to 7) via the guide line L2. The control unit 93 controls the guide on-off valve 33 to open and close the guide line L2 based on the measurement result of a liquid volume measuring mechanism (not shown) provided in the supply tank 37, and stores an appropriate amount of the treatment liquid P in the supply tank 37.

[0096] The treatment liquid P flowing from the supply tank 37 into the supply line L4 flows into the first drainage line L5 at the first branch portion b1, and is sent to the storage unit 32 via the second branch drainage line L5b. That is, the flow rate of the treatment liquid P in the supply line L4 increases in the supply ejector 69 and flows into the first drainage line L5. Meanwhile, the pressure in the supply line L4 between the first branch portion b1 and the discharge nozzle 19 is reduced. As a result, the treatment liquid P in the supply line L4 basically flows into the first drainage line L5 and is not supplied to the discharge nozzle 19. Specifically, the gas around the discharge nozzle 19 flows into the supply line L4 via the discharge nozzle 19, and an airflow is generated from the discharge nozzle 19 toward the first branch portion b1.

[0097] The processing liquid P sent from the second branch drainage line L5b to the storage unit 32 is returned to the supply tank 37 via the guide line L2. When the liquid supply circuit 30 is in the state shown in Fig. 12 in this way, the processing liquid P sent from the supply tank 37 to the supply line L4 is returned to the supply tank 37 through the first drainage line L5, the storage unit 32 and the guide line L2 without being discharged from the discharge nozzle 19. The processing liquid P is heated in the heating zone (not shown in Fig. 12; see the first heating zone Z1 and the second heating zone Z2 in Fig. 3) while circulating through the liquid supply circuit 30 in this way, and the temperature of the processing liquid P is gradually increased overall and adjusted to a desired temperature.

[0098] After the processing liquid P is adjusted to the desired temperature, when the processing liquid P is supplied to the discharge nozzle 19 and discharged from the discharge nozzle 19, the liquid supply circuit 30 is placed in the state shown in Figure 13 under the control of the control unit 93.

[0099] That is, the second branch drainage line L5b is closed by the drainage on-off valve 43, and the guide line L2 is closed by the guide on-off valve 33. The open / closed states of the atmosphere release line L9 and the gas line L3 are set to the same state as that shown in Fig. 12. Then, the pressurizing device 38 (particularly the air pressure adjusting unit 66) pressurizes the inside of the supply tank 37 so that the treatment liquid P sent from the supply tank 37 to the supply line L4 has a pressure higher than the peak head pressure.

[0100] As a result, the flow of the treatment liquid P in the supply line L4 is obstructed by the back pressure valve 42, and the pressure is adjusted to the same as the "set pressure equal to or higher than the peak head pressure" by the back pressure valve 42. As a result, the treatment liquid P also flows into the portion of the supply line L4 between the first branch portion b1 and the discharge nozzle 19 in the supply ejector 69, and is supplied to the discharge nozzle 19.

[0101] The treatment liquid P that flows into the first drainage line L5 and passes through the back pressure valve 42 is sent to the storage unit 32 via the first branch drainage line L5a.

[0102] When the supply of the processing liquid P to the discharge nozzle 19 is stopped to stop the discharge of the processing liquid P from the discharge nozzle 19, the gas line L3 is closed by the gas on-off valve 67, and the atmosphere release line L9 is opened by the atmosphere release valve 63. This causes the pressure of the processing liquid P in the supply line L4 to be adjusted to a pressure lower than the peak head pressure. As a result, the processing liquid P cannot reach the highest part of the supply line L4, and the processing liquid P is no longer supplied to the discharge nozzle 19.

[0103] When the liquid supply circuit 30 is placed in a standby state, the gas line L3 is closed by the gas on-off valve 67, the air release line L9 is opened by the air release valve 63, and the guide line L2 is opened by the guide on-off valve 33. As a result, the processing liquid P in the supply tank 37 and the supply line L4 is not supplied to the discharge nozzle 19 and is not circulated, but the processing liquid P is supplied from the storage unit 32 to the supply tank 37 via the guide line L2. The control unit 93 monitors the amount of the processing liquid P stored in the supply tank 37 based on the measurement result of a liquid amount measuring mechanism (not shown) provided in the supply tank 37. Then, when the processing liquid P in the supply tank 37 reaches an appropriate amount, the control unit 93 closes the guide line L2 by the guide on-off valve 33, and stops the supply of the processing liquid P to the supply tank 37.

[0104] [Heating zone and heating section] Next, a specific embodiment of heating the treatment liquid P in the heating zone (particularly the first heating zone Z1) will be illustrated.

[0105] 14 to 17 are partial cross-sectional views for explaining examples of heating methods in the first heating zone Z1 of the guide line L2. The first heating unit 35 can heat the treatment liquid P in the first heating zone Z1 by using a temperature regulating liquid Q that is hotter than the treatment liquid P in the first heating zone Z1.

[0106] If the guide pipe 71 constituting the guide line L2 is made of a material (e.g., PFA (polytetrafluoroethylene)) that is permeable to the temperature adjusting liquid Q used in the first heating section 35, there is a concern that the temperature adjusting liquid Q may be mixed into the treatment liquid P in the guide line L2. In order to avoid this concern, for example, as shown in FIG. 14, a liquid having the same composition as the treatment liquid P flowing through the guide line L2 may be used as the temperature adjusting liquid Q in the first heating section 35. In this case, even if the temperature adjusting liquid Q permeates the guide pipe 71 and enters the guide line L2, the composition of the treatment liquid P flowing through the guide line L2 does not change, and a treatment liquid P having an appropriate composition can be supplied to the discharge nozzle 19.

[0107] Furthermore, as shown in FIG. 15, even when the guide pipe 71 is made of a material (e.g., a metal) that is not permeable to the temperature adjusting liquid Q (preferably both the processing liquid P and the temperature adjusting liquid Q), a processing liquid P having an appropriate composition can be supplied to the discharge nozzle 19.

[0108] 16, the guide pipe 71 constituting the guide line L2 may have an inner pipe 71a and an outer coat 71b provided on the outside of the inner pipe 71a. In this case, at least one of the inner pipe 71a and the outer coat 71b is preferably made of a material that is impermeable to the processing liquid P. At least one of the inner pipe 71a and the outer coat 71b is preferably made of a material that is impermeable to the temperature adjusting liquid Q. For example, when the inner pipe 71a is made of a material that is permeable to the temperature adjusting liquid Q, the outer coat 71b is preferably made of a material that is impermeable to the temperature adjusting liquid Q (preferably both the processing liquid P and the temperature adjusting liquid Q).

[0109] Furthermore, by using a liquid having a higher density than the processing liquid P as the temperature adjusting liquid Q, the temperature adjusting liquid Q can be prevented from permeating the guide pipe 71, as shown in FIG.

[0110] 18 to 20 are schematic diagrams for explaining examples of heating methods in the first heating zone Z1 of the guide line L2. In Fig. 18 and Fig. 19, the temperature adjustment tank 75 is seen through, and the guide pipe 71 located inside the temperature adjustment tank 75 is illustrated.

[0111] The first heating zone Z1 may include a portion of the guide pipe 71 constituting the guide line L2 that has a spiral shape. In this case, the first heating unit 35 that heats the processing liquid P in the first heating zone Z1 can be made compact, and the processing liquid P can be efficiently heated in a limited space.

[0112] The processing liquid P flowing through the guide line L2 may bump due to heating in the first heating zone Z1. When the processing liquid P bumps, the pressure in the guide pipe 71 constituting the guide line L2 increases suddenly, which may lead to damage to the guide pipe 71.

[0113] In order to prevent damage to the guide pipe 71 due to such bumping of the processing liquid P, the first heating section 35 may heat the processing liquid P in the first heating zone Z1 using a high-temperature temperature control liquid Q stored in a temperature control tank 75 as shown in FIG. 18, for example.

[0114] The first heating section 35 shown in FIG. 18 has a temperature adjustment tank 75, a flow path switching section 74 connected to the temperature adjustment tank 75 via an adjustment liquid supply line 76, and a gas-liquid discharge line 77 connected to the temperature adjustment tank 75. The guide pipe 71 constituting the guide line L2 penetrates the temperature adjustment tank 75, and the first heating zone Z1 including the spiral-shaped portion of the guide pipe 71 is located inside the temperature adjustment tank 75. The adjustment liquid supply line 76 connected to the temperature adjustment tank 75 is equipped with a flow path switching section 74, and a temperature adjustment liquid supply section 72 and a purge gas supply section 73 are connected to the flow path switching section 74. Under the control of the control section 93, the flow path switching section 74 can selectively introduce the temperature adjustment liquid Q supplied from the temperature adjustment liquid supply section 72 and the purge gas (for example, an inert gas such as nitrogen) supplied from the purge gas supply section 73 into the inside of the temperature adjustment tank 75. In this manner, each of the temperature adjusting liquid supply unit 72 and the purge gas supply unit 73 can be connected to the adjusting liquid supply line 76 via the flow path switching unit 74. In addition, the temperature adjusting tank 75 is connected to the temperature adjusting liquid supply unit 72 via a gas / liquid discharge line 77.

[0115] For example, when the processing liquid P is heated in the first heating zone Z1, the flow path switching unit 74, under the control of the control unit 93, sends the high-temperature temperature adjusting liquid Q supplied from the temperature adjusting liquid supply unit 72 to the temperature adjusting tank 75 via the adjusting liquid supply line 76. As a result, the processing liquid P is heated by the temperature adjusting liquid Q in the temperature adjusting tank 75 in the portion of the guide line L2 located inside the temperature adjusting tank 75.

[0116] On the other hand, when heating of the processing liquid P in the first heating zone Z1 is stopped, the flow path switching unit 74, under the control of the control unit 93, sends the purge gas supplied from the purge gas supply unit 73 to the temperature adjustment tank 75 via the adjustment liquid supply line 76. As a result, the temperature adjustment liquid Q in the temperature adjustment tank 75 is pushed out by the purge gas to the gas-liquid discharge line 77. The temperature adjustment liquid Q discharged from the temperature adjustment tank 75 to the gas-liquid discharge line 77 is sent to the temperature adjustment liquid supply unit 72 via the gas-liquid discharge line 77.

[0117] In this state where the temperature adjusting liquid Q is stored in the temperature adjusting tank 75, the flow path switching unit 74 introduces a purge gas into the temperature adjusting tank 75, whereby the temperature adjusting liquid Q is quickly discharged from the temperature adjusting tank 75 to the gas / liquid discharge line 77. By quickly discharging the temperature adjusting liquid Q from the temperature adjusting tank 75 using the purge gas, the heating of the treatment liquid P in the first heating zone Z1 can be quickly stopped. This makes it possible to effectively prevent bumping of the treatment liquid P in the guide line L2 (particularly in the first heating zone Z1 and in the vicinity of the first heating zone Z1).

[0118] 19, a relief line L10 provided with a relief valve 87 may be connected to the guide line L2. While the pressure of the processing liquid P in the guide line L2 is lower than the set relief pressure of the relief valve 87, the relief valve 87 closes the relief line L10. On the other hand, when the pressure of the processing liquid P in the guide line L2 becomes equal to or higher than the set relief pressure of the relief valve 87, the relief line L10 is opened by the relief valve 87, and the processing liquid P is released from the guide line L2 to the relief line L10. This prevents the pressure in the guide line L2 from becoming excessive, and prevents damage to the guide piping 71, even if bumping of the processing liquid P occurs in the guide line L2.

[0119] The first heating unit 35 may use an electric heater 88 as shown in FIG. 20 to heat the treatment liquid P in the first heating zone Z1, instead of the temperature adjustment liquid Q stored in the temperature adjustment tank 75. In the example shown in FIG. 20, the electric heater 88 is disposed so as to penetrate the spiral portion of the guide pipe 71. The control unit 93 switches the power supply to the electric heater 88 on and off, thereby switching between heating and non-heating the treatment liquid P in the first heating zone Z1. From the viewpoint of preventing bumping of the treatment liquid P, it is preferable that the temperature of the electric heater 88 is reduced in a short time when the electric heater 88 is switched from a heated state to a non-heated state. For this reason, it is preferable that the electric heater 88 is a heater with a small heat capacity, and for example, a halogen heater can be used as the electric heater 88.

[0120] [Temperature adjustment of processing liquid] When a large amount of processing liquid P is stored in the supply tank 37, it is difficult to keep the temperature of the processing liquid P supplied from the supply tank 37 to the supply line L4 at a desired temperature. In particular, the greater the amount of processing liquid P stored in the supply tank 37, the more likely the temperature of the processing liquid P is to become higher or lower than the desired temperature. On the other hand, in order to stably perform liquid processing of the substrate W, it is preferable that the processing liquid P in the supply line L4 is stably adjusted to the desired temperature.

[0121] In order to adjust the temperature of the processing liquid P in the supply line L4 to a desired temperature, the processing liquid P stored in the supply tank 37 may be adjusted to a temperature higher than the desired temperature, and the processing liquid P in the supply line L4 may be adjusted to the desired temperature by adding low-temperature processing liquid P. For example, a cooling liquid supply unit that supplies low-temperature processing liquid P may be provided in at least one of the supply tank 37 and the supply line L4.

[0122] FIG. 21 is a schematic diagram showing a first embodiment of a treatment liquid temperature adjustment system.

[0123] In this embodiment, the processing liquid P having a temperature lower than a desired temperature is supplied from the cooling liquid supply unit 101 to the supply tank 37, thereby adjusting the temperature of the processing liquid P. That is, the cooling liquid supply unit 101 for supplying the low-temperature processing liquid P is provided for the supply tank 37. The cooling liquid supply unit 101 shown in FIG. 21 includes a cooling processing liquid supply part 102, a cooling liquid on-off valve 103, a cooling flow meter 108, and a cooling liquid filter 104.

[0124] The cooling treatment liquid supply unit 102 delivers the treatment liquid P at a temperature lower than a desired temperature to the cooling liquid line L11 connected to the inside of the supply tank 37. The treatment liquid P delivered by the cooling treatment liquid supply unit 102 to the cooling liquid line L11 may have a temperature lower than the environmental temperature or may have the same temperature as the environmental temperature.

[0125] The coolant on-off valve 103 opens and closes the coolant line L11 under the control of the control unit 93. When the coolant on-off valve 103 closes the coolant line L11, the low-temperature processing liquid P sent from the cooling processing liquid supply unit 102 to the coolant line L11 is not sent to the supply tank 37. On the other hand, when the coolant on-off valve 103 opens the coolant line L11, the low-temperature processing liquid P sent from the cooling processing liquid supply unit 102 to the coolant line L11 is sent to the supply tank 37.

[0126] The cooling flow meter 108 measures the flow rate of the low-temperature processing liquid P flowing through the cooling liquid line L11. The measurement result of the cooling flow meter 108 is sent to the control unit 93. The cooling liquid filter 104 removes foreign matter from the processing liquid P while allowing the processing liquid P to pass through the cooling liquid line L11.

[0127] The supply tank 37 is provided with a liquid temperature measuring sensor 105 and a level sensor 106. The liquid temperature measuring sensor 105 measures the temperature of the processing liquid P stored in the supply tank 37. The level sensor 106 measures the liquid level of the processing liquid P stored in the supply tank 37. The measurement results of the liquid temperature measuring sensor 105 and the level sensor 106 are sent to the control unit 93.

[0128] In addition to the above-mentioned guide line L2, atmospheric release line L9, gas line L3, coolant line L11, and supply line L4, a third drainage line L12 is connected to the supply tank 37. A temperature adjustment on-off valve 107 and a drainage flow meter 109 are provided in the third drainage line L12. The temperature adjustment on-off valve 107 opens and closes the third drainage line L12 under the control of the control unit 93. The drainage flow meter 109 measures the flow rate of the treatment liquid P flowing through the third drainage line L12. The measurement result of the drainage flow meter 109 is sent to the control unit 93.

[0129] In this embodiment, the control unit 93 controls the second heating unit 36 ​​to heat the processing liquid P stored in the supply tank 37 (i.e., the second heating zone Z2) so that the temperature of the processing liquid P stored in the supply tank 37 (i.e., the second heating zone Z2) becomes higher than the desired temperature.

[0130] When the control unit 93 determines from the measurement result of the liquid temperature measurement sensor 105 that the processing liquid P in the supply tank 37 has a temperature higher than the desired temperature, a predetermined amount of processing liquid P is discharged from the supply tank 37 via the third drainage line L12. That is, the control unit 93 controls the temperature adjustment on-off valve 107 to open the third drainage line L12, and discharges the high-temperature processing liquid P from the supply tank 37 to the third drainage line L12. When the control unit 93 determines from the measurement result of the drainage flow meter 109 that the amount of high-temperature processing liquid P discharged from the supply tank 37 has reached a predetermined amount, it controls the temperature adjustment on-off valve 107 to close the third drainage line L12.

[0131] Meanwhile, the low-temperature processing liquid P is supplied from the coolant supply unit 101 to the supply tank 37 via the coolant line L11. That is, the control unit 93 controls the coolant on-off valve 103 to open the coolant line L11 and supplies the low-temperature processing liquid P from the coolant supply unit 101 to the supply tank 37. For example, when the second heating unit 36 ​​heats the processing liquid P in the second heating zone Z2 to a first temperature, the coolant supply unit 101 supplies the processing liquid P at a second temperature lower than the first temperature to the supply tank 37. When the control unit 93 determines from the measurement result of the cooling flow meter 108 that the amount of the low-temperature processing liquid P supplied to the supply tank 37 has reached a predetermined amount, it controls the coolant on-off valve 103 to close the coolant line L11.

[0132] By thus discharging high-temperature processing liquid P from the supply tank 37 while supplying low-temperature processing liquid P to the supply tank 37, the temperature of the processing liquid P sent from the supply tank 37 to the supply line L4 can be stably adjusted to the desired temperature.

[0133] The amount of the processing liquid P discharged from the supply tank 37 via the third drainage line L12 may be the same as or different from the amount of the processing liquid P supplied to the supply tank 37 via the coolant line L11. The amount of the processing liquid P discharged from the supply tank 37 via the third drainage line L12 may be a predetermined fixed amount, or may be an amount determined according to the measurement result of the liquid temperature measurement sensor 105. The amount of the processing liquid P supplied to the supply tank 37 via the coolant line L11 may be a fixed amount, or may be an amount determined according to the amount of the processing liquid P discharged from the supply tank 37, or may be an amount determined according to the measurement result of the liquid temperature measurement sensor 105.

[0134] FIG. 22 is a schematic diagram showing a second embodiment of the treatment liquid temperature adjustment system.

[0135] In this embodiment, the temperature of the processing liquid P is adjusted by supplying the processing liquid P at a temperature lower than a desired temperature from the coolant supply unit 101 to the supply line L4. That is, the coolant line L11 is connected to the supply line L4 instead of the supply tank 37, and the coolant supply unit 101 supplies the low-temperature processing liquid P to the supply line L4 via the coolant line L11.

[0136] The other configuration is similar to that of the above-mentioned first embodiment (see FIG. 21).

[0137] In this embodiment, the high-temperature processing liquid P flowing into the supply line L4 from the supply tank 37 is mixed with the low-temperature processing liquid P flowing into the supply line L4 via the coolant line L11, and the processing liquid P is adjusted to the desired temperature in the supply line L4.

[0138] The amount of the low-temperature processing liquid P supplied from the cooling liquid supply unit 101 to the supply line L4 is determined based on the temperature and amount of the processing liquid P flowing from the supply tank 37 into the supply line L4. The control unit 93 obtains the "temperature of the processing liquid P flowing from the supply tank 37 into the supply line L4" from the measurement result of the liquid temperature measurement sensor 105, and obtains the "temperature of the processing liquid P flowing from the supply tank 37 into the supply line L4" from the measurement result of the flow meter 62. The control unit 93 determines the "amount of the low-temperature processing liquid P to be supplied from the cooling liquid supply unit 101 to the supply line L4" based on the measurement result of the liquid temperature measurement sensor 105 and the measurement result of the flow meter 62. Then, while monitoring the "amount of the low-temperature processing liquid P supplied from the cooling liquid supply unit 101 to the supply line L4" based on the measurement result of the cooling flow meter 108, the control unit 93 controls the cooling liquid on-off valve 103 so that the determined amount of the low-temperature processing liquid P flows into the supply line L4.

[0139] In order to suppress unevenness in the temperature of the treatment liquid P in the supply line L4, it is preferable to stir the treatment liquid P.

[0140] Specifically, by stirring the processing liquid P in the supply line L4, it is possible to suppress temperature unevenness of the processing liquid P in the supply line L4. For example, as shown in Fig. 23, by installing an agitator 116 (agitation unit) inside the supply pipe 115 that constitutes the supply line L4, the processing liquid P is agitated by the agitator 116 while flowing through the supply line L4. The specific shape of the agitator 116 is not limited, and the agitator 116 can be formed by, for example, a static mixer.

[0141] Furthermore, by stirring the processing liquid P in the supply tank 37, it is possible to suppress temperature unevenness of the processing liquid P in the supply tank 37 and the supply line L4. For example, as shown in Fig. 24, the processing liquid P in the supply tank 37 can be stirred by the pressurizing gas N supplied from the pressurizing device 38 via the gas line L3. In the example shown in Fig. 24, with one end (stirring part) of the gas line L3 positioned in the processing liquid P in the supply tank 37, the pressurizing gas N is ejected from the one end.

[0142] Furthermore, the temperature unevenness of the processing liquid P in the supply line L4 can also be suppressed by reducing the height (i.e., vertical size) or width (i.e., horizontal size) of the supply tank 37. For example, as shown in Fig. 25, the height of the supply tank 37 may be reduced and the width increased while the second heating unit 36 ​​is provided so as to surround the supply tank 37 from above, below, and horizontally. In this case, the portion of the processing liquid P stored in the supply tank 37 that is far from the second heating unit 36 ​​is reduced, and uneven heating of the processing liquid P can be prevented.

[0143] Furthermore, if the temperature of the processing liquid P in the supply tank 37 is easily affected by the environmental temperature and is subject to change, it becomes difficult to stably maintain the temperature of the processing liquid P sent from the supply tank 37 to the supply line L4 at a desired temperature. Therefore, it is preferable that the supply tank 37 has a structure that makes it difficult for the temperature of the processing liquid P in the supply tank 37 to be affected by the environmental temperature.

[0144] For example, as shown in FIG. 26, the supply tank 37 may have a heat insulating part 37c, and the heat transfer between the processing liquid P in the supply tank 37 and the surroundings of the supply tank 37 may be reduced by the heat insulating part 37c. The supply tank 37 shown in FIG. 26 has an inner structure 37a in which the processing liquid P is stored, an outer structure 37b provided on the outside of the inner structure 37a, and a heat insulating part 37c provided between the inner structure 37a and the outer structure 37b. The heat insulating part 37c shows values ​​that make it difficult to transfer heat, for example, in at least one of thermal conductivity, thermal diffusivity, thermal diffusion coefficient, and heat transfer coefficient, compared to the inner structure 37a. The heat insulating part 37c can be made of any gas, liquid, and / or solid, and may be made of the same gas as the gas (e.g., air) surrounding the supply tank 37. The supply tank 37 shown in FIG. 26 is integrally formed with the second heating part 36, and the second heating part 36 is attached to the inner structure 37a.

[0145] It should be noted that the embodiments disclosed in this specification are merely illustrative in all respects and are not to be construed as limiting. The above-mentioned embodiments and modifications can be omitted, substituted, and modified in various forms without departing from the scope and spirit of the appended claims. For example, the above-mentioned embodiments and modifications may be combined, and an embodiment other than the above-mentioned may be combined with the above-mentioned embodiment or modifications.

[0146] Furthermore, the technical category in which the above-mentioned technical idea is embodied is not limited. For example, the above-mentioned substrate liquid processing apparatus may be applied to other apparatuses. Furthermore, the above-mentioned technical idea may be embodied by a computer program for causing a computer to execute one or more procedures (steps) included in the above-mentioned substrate liquid processing method. Furthermore, the above-mentioned technical idea may be embodied by a computer-readable non-transitory recording medium on which such a computer program is recorded.

Claims

1. An apparatus for supplying a processing liquid supplied from a processing liquid source to a nozzle, comprising: a storage line provided with a storage opening / closing valve; a storage unit to which the processing liquid is supplied from the processing liquid supply source via the storage line and which supplies the processing liquid to the nozzle via a guide line; The storage unit comprises: A plurality of storage tanks; A storage pressurizing unit that pressurizes the inside of the plurality of storage tanks; a circulation line connecting the plurality of storage tanks to each other; An on-off valve provided in the circulation line, The guide line is provided with a guide valve, a circulation adjustment mechanism for circulating the treatment liquid among the plurality of storage tanks via the circulation line, the circulation adjustment mechanism including the storage pressurization unit, the on-off valve, and the guide on-off valve.

2. The apparatus described in claim 1, wherein the circulation line is provided with a circulation filter that removes foreign matter from the treatment liquid.

3. The plurality of storage tanks includes a first storage tank and a second storage tank, the circulation line includes a first circulation line and a second circulation line connected to the first storage tank and the second storage tank, The processing liquid sent from the processing liquid supply source through the storage line is supplied to the first storage tank, 3. The apparatus of claim 1, wherein the first circulation line guides the processing liquid from the first storage tank to the second storage tank, and the second circulation line guides the processing liquid from the second storage tank to the first storage tank.

4. The apparatus described in claim 3, wherein the guide line is connected to the first storage tank.

5. A method for supplying a processing liquid provided from a processing liquid source to a nozzle, comprising the steps of: supplying the processing liquid from the processing liquid supply source to a storage unit through a storage line provided with a storage opening / closing valve; supplying the treatment liquid from the storage unit to the nozzle through a guide line; The storage unit comprises: A plurality of storage tanks; A storage pressurizing unit that pressurizes the inside of the plurality of storage tanks; a circulation line connecting the plurality of storage tanks to each other; An on-off valve provided in the circulation line, The guide line is provided with a guide valve, a circulation adjustment mechanism that circulates the treatment liquid among the plurality of storage tanks via the circulation line, the circulation adjustment mechanism including the storage pressurization unit, the on-off valve, and the guide on-off valve.

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