Irregular shaped dies

Abstract

The present invention pertains to an irregular-shape diamond die that is used to produce an irregular shape wire, and that is provided with a processing hole in which a reduction part and a bearing part are provided sequentially from the upstream side in a wire drawing direction. In a cross-section of the bearing part perpendicular to the wire drawing direction, a curve line-shape corner part and a non-corner part disposed at a position different from that of the corner part are provided. The surface roughness of the corner part is greater than that of the non-corner part. The surface roughness Sa of the corner part is at most 0.30 μm, and the surface roughness Sa of the non-corner part is at most 0.20 μm.

Description

[Technical field]

[0001] The present disclosure relates to a shaped die. This application claims priority to Japanese Patent Application No. 2021-187105, filed on November 17, 2021. The entire contents of the Japanese patent application are incorporated herein by reference. [Background technology]

[0002] Conventionally, a special shaped die has been disclosed, for example, in International Publication No. WO 2018 / 123513 (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 123513 Summary of the Invention

[0004] The deformed die of the present disclosure is a deformed die for producing a deformed wire, and is provided with a processing hole having a reduction section and a bearing section in that order from the upstream side in the wiredrawing direction, and in a cross section of the bearing section perpendicular to the wiredrawing direction, a curved corner section and a non-corner section at a position different from the corner section are provided, and the surface roughness of the corner section is rougher than that of the non-corner section. The surface roughness Sa of the corner section is 0.30 μm or less, and the surface roughness Sa of the non-corner section is 0.20 μm or less. [Brief description of the drawings]

[0005] [Figure 1] FIG. 1 is a cross-sectional view of a deformed diamond die 10 according to an embodiment, a diamond 1 constituting the deformed diamond die 10, a case 2 for housing the diamond 1, and a sintered alloy 3 interposed between them. [Diagram 2] FIG. 2 is a front view of the diamond 1 in FIG. [Diagram 3]FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is an enlarged cross-sectional view of the bearing portion 6d taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a cross section corresponding to FIG. 4, showing a corner portion 7a1 and a non-corner portion 7b1 in the reduction portion 6c. [Figure 6] FIG. 6 is a cross-sectional view of the processed hole 7 in the wire drawing direction, shown for explaining the opening angle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] [Problem that this disclosure aims to solve] There was a problem that the precision of the profiled wire produced using the conventional profiled dies was low. [Effects of this disclosure] According to the present disclosure, the processing accuracy of the irregular shaped wire can be improved.

[0007] [Details of the embodiment] (Overall composition) The outline of the diamond die for drawing a deformed wire will be explained with reference to the drawings. FIG. 1 is a cross-sectional view of a deformed diamond die 10 according to an embodiment, a diamond 1 constituting the deformed diamond die 10, a case 2 for storing the diamond 1, and a sintered alloy 3 interposed therebetween. FIG. 1 is a cross-sectional view of a state in which the deformed diamond die can be used after being stored in a die case. The diamond 1 is stored in the case 2. The diamond 1 is attached to the case 2 by using the sintered alloy 3. In the deformed diamond die 10 as a deformed die, the portion for processing the wire is composed of the diamond 1, for example.

[0008] FIG. 2 is a front view of the diamond 1 in FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3, showing an enlarged view of the bearing portion 6d. As shown in FIGS. 2 to 4, the diamond 1 has a polycrystalline diamond 5 surrounded by a support ring 4 made of cemented carbide. The center portion is composed of a hole inner surface 6 through which the wire to be drawn passes while being in contact with the hole 7 and a processing hole 7. The hole inner surface 6 is further divided, and the details are shown in FIG. 3. The hole inner surface 6 is divided into a bell portion 6a, an approach portion 6b, a reduction portion 6c, a bearing portion 6d, a back relief portion 6e, and an exit portion 6f, and as shown in FIG. 2, the shape seen from the front is similar to a rectangle. The bearing portion 6d is the area including the portion with the smallest diameter in the processing hole 7.

[0009] At least the surface from the bell portion 6a to the bearing portion 6d of the inner surface 6 formed by the processed hole 7 is formed with a smooth curved surface in the thickness direction of the diamond. That is, unlike a case where the bell portion 6a, the approach portion 6b, the reduction portion 6c, and the bearing portion 6d are each formed linearly and the boundaries between them are rounded, each portion is formed with a smooth curved surface as a whole. This curved surface is formed with a single R curved surface or a compound R curved surface, and the boundaries between them are not clearly distinguishable.

[0010] The wire diameter of the wire after drawing with the irregular diamond die 10 is as large as about 10 mm. When drawing such a thick wire, if the surface from the bell portion 6a to the bearing portion 6d is formed as a smooth curved surface, there is no significant change in the wire drawing resistance, the wire surface after drawing is less likely to be scratched, and the surface roughness and waviness are reduced. In terms of supplying lubricant, a smooth curved surface also provides good lubrication conditions.

[0011] The polycrystalline diamond 5 around the machining hole 7 is a single polycrystalline diamond that is continuous in the circumferential direction of the machining hole 7. Since the polycrystalline diamond 5 around the machining hole 7 is a single polycrystalline diamond that is continuous in the circumferential direction of the machining hole, it has higher strength than divided diamond. As a result, the precision of the machining hole is high, and the surface roughness of the wire after drawing can be reduced.

[0012] (Length of reduction portion 6c and bearing portion 6d) If the front shape of the bearing portion 6d is a rectangle and the distance between opposing faces of the rectangle is D, then the range of length 1.0D in the wiredrawing direction is the bearing portion 6d. The part with the smallest inner diameter is the center of the bearing portion 6d, and the areas above and below this part in the wiredrawing direction by 0.5D each are the bearing portion 6d. The reduction portion 6c is located upstream of the bearing portion 6d so as to be adjacent to the bearing portion 6d and is within a range of length 0.5D in the wiredrawing direction. In general, the longer the length of the bearing portion 6d, the better from the standpoint of improving the life of the irregular diamond die 10, i.e., preventing wear and deformation of the polycrystalline diamond 5.

[0013] However, when drawing ultra-fine wires, the problem of wire breakage is a major issue, so the bearing portion 6d cannot be made longer. To prevent wire breakage, two measures are required: reducing the contact area between the polycrystalline diamond 5 and the wire and reducing the frictional force per unit area. Therefore, it is preferable to shorten the bearing portion 6d in order to reduce the contact area with the wire. This reduces the frictional force.

[0014] Also, by making the surface smooth, the contact area is reduced, the supply of lubricant is prevented from running out, and the wire drawing resistance can be stabilized, resulting in an extremely effective prevention of wire breakage. Furthermore, when grinding the bearing portion 6d, it is difficult to make a smooth surface with small surface roughness if the bearing portion 6d is long, but since it is short, it is possible to grind it with high precision, which also has the effect of stabilizing the wire drawing resistance.

[0015] (Surface roughness Sa of bearing part 6d) Comparing the surface roughness Sa of the corner portion 7a and the linear non-corner portion 7b in the bearing portion 6d, the surface roughness Sa of the corner portion 7a is rougher. The surface roughness Sa of the corner portion is 0.30 μm or less, and the surface roughness Sa of the non-corner portion is 0.20 μm or less. Preferably, the surface roughness Sa of the corner portion 7a is 0.15 μm or less, and the surface roughness Sa of the non-corner portion 7b is 0.10 μm or less. More preferably, the surface roughness Sa of the corner portion 7a is 0.10 μm or less, and the surface roughness Sa of the non-corner portion 7b is 0.07 μm or less.

[0016] The surface roughness Sa is defined by ISO 25178. The measurement range is a range with 20 or more peaks and valleys in the measurement range. Measurement is performed under the conditions of measurement pretreatment, tilt correction, and no Gaussian filter. The bearing portion 6d is the part with the smallest diameter in the machining hole 7, and the surface roughness of the bearing portion 6d is deeply related to the surface roughness of the wire. The surface roughness Sa of the non-corner portion of the bearing portion 6d is preferably 0.05 μm or less. To obtain a die with high accuracy and long life, the surface roughness Sa of the bearing portion 6d is more preferably 0.03 μm or less, and most preferably 0.01 μm or less. The smaller the surface roughness Sa of the bearing portion 6d, the more preferable. However, in terms of industrial production, considering the cost-effectiveness, the surface roughness Sa of the bearing portion 6d is preferably 0.002 μm or more.

[0017] In order to measure the surface roughness Sa of the bearing part 6d, a transfer material (for example, RepliSet, manufactured by Marumoto Struers Co., Ltd.) is filled into the machining hole 7 of the irregular die to create a replica with the surface of the machining hole 7 transferred thereto. The corner parts 7a and non-corner parts 7b of this replica are observed with a laser microscope (for example, a shape analysis laser microscope, VK-X series, manufactured by Keyence Corporation) to measure the surface roughness Sa at any three points. The average value of the surface roughness Sa at the three points in the corner parts 7a and non-corner parts 7b is taken as the surface roughness Sa at the corner parts 7a and non-corner parts 7b of the bearing part 6d. The surface roughness Sa of the wire after drawing is also measured at any three points by observing the surface with the laser microscope. The average value of the surface roughness Sa at the three points is taken as the surface roughness Sa of the wire.

[0018] (Surface roughness of reduction part 6c) Fig. 5 is a cross section corresponding to Fig. 4, showing a corner portion 7a1 and a non-corner portion 7b1 in the reduction portion 6c. Preferably, the surface roughness Sa of the corner portion 7a1 of the reduction portion 6c is 0.10 µm or less, the surface roughness Sa of the non-corner portion 7b1 of the reduction portion 6c is 0.07 µm or less, and the difference in surface roughness Sa between the non-corner portions 7b, 7b1 of the reduction portion 6c and the bearing portion 6d is 0.05 µm or less.

[0019] In this case, since the reduction portion 6c upstream of the bearing portion 6d has a small surface roughness, the surface roughness of the wire after drawing can be made small.

[0020] To obtain a die with high accuracy and long life, the surface roughness Sa of the corner portion 7a1 and the non-corner portion 7b1 of the reduction portion 6c is preferably 0.05 μm or less, and most preferably 0.03 μm or less. The smaller the surface roughness Sa of the reduction portion 6c, the better. However, in terms of industrial production, taking into account the cost-effectiveness, the surface roughness Sa of the reduction portion 6c is preferably 0.01 μm or more.

[0021] The surface roughness of the reduction portion 6c is measured in the same manner as the surface roughness of the bearing portion 6d.

[0022] (Side length and corner radius) The drawn wire is used for motor windings and the like. For such applications, it is necessary to wind the wire at a high density, so the smaller the R of the corners of the wire, the better. For this reason, the R of the rectangular corners 7a of the bearing part is set to 20 μm or less. The smaller the R of the corners 7a, the better. However, in terms of industrial production, taking into account the cost-effectiveness, it is preferable that the R of the corners 7a is 1 μm or more.

[0023] In this embodiment, the processed hole 7 is shown to have a rectangular shape, but the processed hole 7 is not limited to a rectangular shape and may have other polygonal shapes such as a triangle or a hexagon. It is preferable that the multiple cross sections perpendicular to the longitudinal direction of the wire include straight line portions. Furthermore, when the lengths of the sides are different, it is preferable that the length of the longest side is 1000 μm or less. There is no lower limit to the length of the longest side. However, if the longest side is too short, the manufacturing costs will be high in industrial production. Therefore, in consideration of cost-effectiveness, it is preferable that the length of the longest side is 5 μm or more.

[0024] In this embodiment, the shape of the processed hole 7 is a rectangle, but is not limited to this and may be a track shape in which straight lines and semicircles are connected.

[0025] (Opening angle at reduction portion 6c) 6 is a cross-sectional view of the processed hole 7 in the wiredrawing direction to explain the opening angle. In the present disclosure, the cross-sectional shape (reduction cross section) of the reduction portion 6c is substantially similar to the cross-sectional shape of the bearing portion 6d. In the reduction portion 6c, the angle θ between the tangent 6c1 of the wall surface and the center line 7d is the opening angle in the reduction portion 6c (hereinafter referred to as the reduction angle). In the reduction portion 6c, the tangent 6c1 and the reduction portion 6c come into contact at the center position in the wiredrawing direction.

[0026] The reduction angle of the corner portion 7a1 may be different from the reduction angle of the non-corner portion 7b1.

[0027] In addition, the reduction angle of the corner portion 7a1 may be set to be larger than the reduction angle of the non-corner portion 7b1.

[0028] In this way, by making the reduction angle of the corner portion 7a1 larger than that of the non-corner portion 7b1, the area reduction rate of the corner portion 7a1 can be set to be larger than that of the non-corner portion 7b1. As a result, the wire being drawn is drawn more rapidly at the corner portion 7a1 than at the non-corner portion 7b1. In this way, even if the wire is a thick diameter wire that is the target of the deformed die of the present disclosure, the wire can be easily drawn to every corner of the corner portion 7a1. This improves the shape accuracy of the drawn wire. In addition, if the area reduction rate is increased, the resistance during drawing increases, but by providing the surface roughness as described above, the increase in resistance during drawing is suppressed, and the problem of the wire breaking is less likely to occur.

[0029] Furthermore, the reduction angle of the corner portion 7a1 increases as it gets farther away from the non-corner portion 7b1. Specifically, the reduction angle may increase as it gets closer to the tip 7a2 of the corner portion 7a1. The tip 7a2 of the corner portion 7a1 refers to the location of the corner portion 7a1 that is farthest from the center line 7d.

[0030] By forming the corner portion 7a1 in this shape, the tip 7a2 of the corner portion 7a1 has the largest area reduction rate, and the wire can be easily processed up to the tip 7a2 of the corner portion 7a1. Furthermore, in the process of manufacturing the irregular shaped die, the corner portion 7a1 can be easily processed and the precision of the corner portion 7a1 can be easily improved.

[0031] (diamond grain size) In order to reduce the R of the corner portion 7a1 and further reduce the surface roughness Sa of the bearing portion 6d, the grain size of the diamond constituting the polycrystalline diamond 5 must be small. It is preferable to use polycrystalline diamond (sintered diamond) 5 with an average grain size of 500 nm or less.

[0032] To obtain a die with high accuracy and long life, it is more preferable that the average grain size of diamond is 300 nm or less, and most preferably 100 nm or less. The smaller the average grain size of diamond, the better. However, because ultrafine diamond grains are expensive in industrial production, it is preferable that the average grain size of diamond is 5 nm or more.

[0033] To measure the average grain size of diamond grains, a scanning electron microscope is used to photograph three arbitrary locations of the polycrystalline diamond 5 within an area of ​​5 μm x 5 μm. From the photographed image, individual diamond grains are extracted, and the extracted diamond grains are binarized to calculate the area of ​​each diamond grain. Then, a circle having the same area as each diamond grain is assumed, and the diameter of this circle is taken as the grain size of the diamond grain. The arithmetic mean value of the diameters of each diamond grain (diameter of the circle) is taken as the average grain size.

[0034] (Binder) The polycrystalline diamond 5 may contain a binder. The proportion of the binder in the polycrystalline diamond is preferably 5% by volume or less. To obtain a highly accurate and long-life die, the proportion of the binder is more preferably 3% by volume or less, and most preferably no binder is contained.

[0035] To measure the binder ratio, as described in the "Diamond grain size" paragraph above, three arbitrary locations within an area of ​​5 μm x 5 μm are photographed with a scanning electron microscope on the polycrystalline diamond 5. The photographed image is read into Adobe Photoshop or similar software, and a threshold value that matches the original image is calculated by tracing the outline, and the image is bi-toned using that threshold value. This bi-tonalization makes it possible to calculate the area of ​​the binder that appears white. Note that diamond particles appear gray, and grain boundaries appear black. The area ratio of the binder is taken as the volume ratio of the binder.

[0036] (material) In the above example, a wire is processed by using the diamond 1. However, the bearing portion 6d may be made of a hard material other than the diamond 1 in the irregular shaped die.

[0037] The material of the bearing portion 6d may be, for example, cubic boron nitride (CBN) or a hard alloy, and the material of the bearing portion 6d may be determined depending on the material of the wire to be processed.

[0038] (Method of manufacturing irregular diamond die 10) Sintered diamond with an average grain size of 5 μm or less is prepared as the material for the irregular diamond die 10. After processing this sintered diamond into a cylindrical shape, holes are drilled using a laser processing method. Next, rough processing is performed using an electric discharge processing method. Next, the holes are polished. Then, ultrasonic polishing is performed using diamond powder and a polishing needle for finishing.

[0039] (First polishing) Ultrasonic polishing is performed using diamond powder with a particle size of 0-2 μm. (Second polishing) Ultrasonic polishing is performed using diamond powder with a particle size of 0-1 μm.

[0040] (Third polishing) Ultrasonic polishing is performed using diamond powder with a particle size of 0-1 / 4 μm. (Fourth polishing) Wire polishing is performed using diamond powder with a particle size of 0-1 / 10 μm.

[0041] The non-corner portions 7b are polished more intensively than the corner portions 7a. As a result, the surface roughness Sa of the non-corner portions 7b in the bearing portion 6d is 0.026 μm, and the surface roughness Sa of the corner portions 7a is 0.042 μm. The surface roughness Sa of the non-corner portions 7b1 in the reduction portion 6c is 0.029 μm, and the surface roughness Sa of the corner portions 7a1 is 0.058 μm.

[0042] Diamond polishing is generally done by gradually grinding the powder for processing. It can be polished cleanly if time is spent, but there is no standard for how clean it should be. In this disclosure, compared to conventional polishing methods, the corner and non-corner parts are polished to within the specified high precision values ​​considered necessary for wire processing, making the stress inside the wire uniform and improving wire habits such as twisting.

[0043] The reason for making the surface roughness of the non-corner portions 7b smaller than that of the corner portions 7a is that the non-corner portions 7b are machined more extensively and the corner portions 7a are machined less extensively compared to the non-corner portions 7b in the irregular diamond die 10. By making the surface roughness Sa smaller in the non-corner portions 7b where the wire is machined more extensively, problems such as twisting are suppressed.

[0044] To reduce the surface roughness of the corner portions 7a, the corner portions 7a need to be polished with high precision, but because the corner portions 7a are curved with a small radius R, polishing them with high precision may distort their shape, in which case the shape of the wire cannot be maintained. Furthermore, because the corner portions 7a contribute less to processing than the non-corner portions 7b, problems such as twisting of the wire do not occur even if the surface roughness is higher than that of the non-corner portions 7b.

[0045] The irregular die of the present disclosure is an irregular die for producing irregular wire, and is provided with a processing hole 7 having a reduction portion 6c and a bearing portion 6d, in that order from the upstream side in the wiredrawing direction, and in a cross section of the bearing portion 6d perpendicular to the wiredrawing direction, a curved corner portion 7a and a non-corner portion 7b at a position different from the corner portion 7a are provided, and the surface roughness of the corner portion 7a is coarser than the surface roughness of the non-corner portion 7b.

[0046] Preferably, the surface roughness Sa of the corner portions 7a is 0.10 μm or less, and the surface roughness Sa of the non-corner portions 7b is 0.07 μm or less.

[0047] Preferably, in a cross section of the reduction portion 6c perpendicular to the wiredrawing direction, a curved corner portion 7a1 and a non-corner portion 7b1 at a position different from the corner portion 7a1 are provided, the surface roughness Sa of the corner portion 7a1 of the reduction portion 6c is 0.10 μm or less, the surface roughness Sa of the non-corner portion 7b1 of the reduction portion 6c is 0.07 μm or less, and the difference in surface roughness Sa of the non-corner portions 7b, 7b1 of the reduction portion 6c and the bearing portion 6d is 0.05 μm or less.

[0048] The wire to be drawn can be of various metals such as copper, silver, iron, gold, aluminum, etc. (Example) (Sample No. 1 to 8)

[0049] [Table 1]

[0050] Irregular shaped diamond dies with sample numbers 1 to 8 shown in Table 1 were prepared with the shapes shown in Figures 1 to 5 and various numerical values ​​set.

[0051] The irregular diamond die of sample number 1 was made by the following method. First, pilot holes were drilled in polycrystalline diamonds of various average grain sizes by laser processing, and then rough processing was performed by electric discharge processing. Next, finishing processing was performed by lapping. In the lapping processing method, a stainless steel wire was first produced by rolling processing, with each corner of a rectangle with a cross-sectional shape of 95 μm × 50 μm being rounded to R20 μm. The 95 μm side of this stainless steel wire was brought into contact with one side of the die hole, and finishing processing was performed by reciprocating while supplying diamond slurry (containing diamonds with a grain size of 0.2 μm). The remaining three sides were also finished in the same manner.

[0052] A copper square wire with a side length of 105 μm was drawn in a lubricant (drawing speed: 10 m / min) for one hour to obtain a square wire with a length of 600 m. The surface roughness Sa of the wire in the direction perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on a 600 m long section. The results are shown in Table 1.

[0053] When the surface roughness Sa of the drawn rectangular wire of sample number 1 is taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were graded A, samples with a relative value of surface roughness Sa of more than 1 and not more than 1.1 were graded B, samples with a relative value of surface roughness Sa of more than 1.1 and not more than 1.3 were graded C, samples with a relative value of surface roughness Sa of more than 1.3 and not more than 1.4 were graded D, and samples with a relative value of surface roughness Sa of more than 1.4 were graded E. Samples rated A to D are suitable for practical use.

[0054] From Table 1, it can be seen that in all samples, the surface roughness of the corner portions 7a is higher than the surface roughness of the non-corner portions 7b.

[0055] It is preferable that the surface roughness Sa of the corner portions 7a is 0.15 μm or less, and the surface roughness Sa of the non-corner portions 7b is 0.10 μm or less.

[0056] It is more preferable that the surface roughness Sa of the corner portions 7a is 0.10 μm or less, and the surface roughness Sa of the non-corner portions 7b is 0.07 μm or less.

[0057] More preferably, the surface roughness Sa of the corner portions of the reduction portion 6c is 0.15 μm or less, the surface roughness Sa of the non-corner portions of the reduction portion is 0.10 μm or less, and the difference in surface roughness Sa between the reduction portion and the bearing portion is 0.05 μm or less.

[0058] (Sample Nos. 11 to 13)

[0059] [Table 2]

[0060] Irregular shaped diamond dies were prepared as shown in Figures 1 to 5, with various numerical values ​​set as shown in Table 2, specimen numbers 11 to 13.

[0061] The wire drawing conditions were stricter than those of sample numbers 1 to 8. A copper square wire with a side length of 105 μm was drawn in a lubricant (drawing speed: 13 m / min) for one hour to obtain a square wire with a length of 780 m. The surface roughness Sa of the wire in the direction perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on the 780 m long portion. The results are shown in Table 2.

[0062] When the surface roughness Sa of the drawn square wire in sample number 11 was taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were given an evaluation of A, and samples with a relative value of surface roughness Sa of more than 1 but not exceeding 1.1 were given an evaluation of B.

[0063] (Sample Nos. 21 to 28)

[0064] [Table 3]

[0065] Irregular shaped diamond dies were prepared as shown in Figures 1 to 5, with various numerical values ​​set as shown in Table 3, sample numbers 21 to 28.

[0066] A copper square wire with one side of 2100μm and the other side of 4200μm was drawn in a lubricant (drawing speed 13m / min) for one hour to obtain a square wire with a length of 780m. The surface roughness Sa of the wire in the direction perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on the 780m long portion. The results are shown in Table 3.

[0067] When the surface roughness Sa of the drawn rectangular wire in sample number 21 is taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were graded A, samples with a relative value of surface roughness Sa of more than 1 and not more than 1.1 were graded B, samples with a relative value of surface roughness Sa of more than 1.1 and not more than 1.3 were graded C, samples with a relative value of surface roughness Sa of more than 1.3 and not more than 1.4 were graded D, and samples with a relative value of surface roughness Sa of more than 1.4 were graded E. Samples rated A to D are suitable for practical use.

[0068] (Sample Nos. 31 to 38)

[0069] [Table 4]

[0070] Irregular shaped diamond dies with sample numbers 31 to 38 shown in Table 4 were prepared with the shapes shown in Figures 1 to 5 and various numerical values ​​set.

[0071] A copper square wire with one side of 5250μm and the other side of 7350μm was drawn in a lubricant (drawing speed 13m / min) for one hour to obtain a square wire with a length of 780m. The surface roughness Sa of the wire in the direction perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on the 780m long portion. The results are shown in Table 4.

[0072] When the surface roughness Sa of the drawn rectangular wire of sample number 31 is taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were graded A, samples with a relative value of surface roughness Sa of more than 1 and not more than 1.1 were graded B, samples with a relative value of surface roughness Sa of more than 1.1 and not more than 1.3 were graded C, samples with a relative value of surface roughness Sa of more than 1.3 and not more than 1.4 were graded D, and samples with a relative value of surface roughness Sa of more than 1.4 were graded E. Samples graded A to D are suitable for practical use.

[0073] (Sample Nos. 41 to 48)

[0074] [Table 5]

[0075] Irregular shaped diamond dies with sample numbers 41 to 48 shown in Table 5 were prepared with the shapes shown in Figures 1 to 5 and various numerical values ​​set.

[0076] A copper square wire with one side of 7350μm and the other side of 9450μm was drawn in a lubricant (drawing speed 13m / min) for one hour to obtain a square wire with a length of 780m. The surface roughness Sa of the wire in the direction perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on the 780m long portion. The results are shown in Table 5.

[0077] When the surface roughness Sa of the drawn rectangular wire of sample number 41 is taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were graded A, samples with a relative value of surface roughness Sa of more than 1 and not more than 1.1 were graded B, samples with a relative value of surface roughness Sa of more than 1.1 and not more than 1.3 were graded C, samples with a relative value of surface roughness Sa of more than 1.3 and not more than 1.4 were graded D, and samples with a relative value of surface roughness Sa of more than 1.4 were graded E. Samples rated A to D are suitable for practical use.

[0078] (Sample numbers 51 to 58)

[0079] [Table 6]

[0080] Irregular shaped diamond dies with sample numbers 51 to 58 shown in Table 6 were prepared with the shapes shown in Figures 1 to 5 and various numerical values ​​set.

[0081] A copper square wire with one side 9450μm and the other 11550μm was drawn in a lubricant (drawing speed 13m / min) for one hour to obtain a square wire with a length of 780m. The surface roughness Sa of the wire perpendicular to the drawing direction after one hour of drawing was evaluated according to ISO25178. The surface roughness was measured on the 780m long portion. The results are shown in Table 6.

[0082] When the surface roughness Sa of the drawn rectangular wire of sample number 51 is taken as 1, samples with a relative value of surface roughness Sa of 0.8 to 1 were graded A, samples with a relative value of surface roughness Sa of more than 1 and not more than 1.1 were graded B, samples with a relative value of surface roughness Sa of more than 1.1 and not more than 1.3 were graded C, samples with a relative value of surface roughness Sa of more than 1.3 and not more than 1.4 were graded D, and samples with a relative value of surface roughness Sa of more than 1.4 were graded E. Samples graded A to D are suitable for practical use.

[0083] It is further preferable that the surface roughness Sa of the corner portion 7a1 of the reduction portion 6c is 0.15 μm or less, the surface roughness Sa of the non-corner portion 7b1 of the reduction portion 6c is 0.10 μm or less, and the difference in surface roughness Sa of the non-corner portions 7b, 7b1 of the reduction portion 6c and the bearing portion 6d is 0.05 μm or less.

[0084] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0085] 1 diamond, 2 case, 3 sintered alloy, 4 alloy support ring, 5 polycrystalline diamond, 6 hole inner surface, 6a bell portion, 6b approach portion, 6c reduction portion, 6d bearing portion, 6e back relief portion, 6f exit portion, 7 machining hole, 7a, 7a1 corner portion, 7b, 7b1 non-corner portion, 10 irregularly shaped diamond die.

Claims

1. A profile die for producing profiled wires, A processing hole having a reduction portion and a bearing portion is provided in this order from the upstream side in the wire drawing direction, In a cross section of the bearing portion perpendicular to a wire drawing direction, a curved corner portion and a non-corner portion at a position different from the corner portion are provided, The irregular-shaped die has a surface roughness Sa of the corner portions that is rougher than a surface roughness of the non-corner portions, the surface roughness Sa of the corner portions being 0.30 μm or less, and the surface roughness Sa of the non-corner portions being 0.20 μm or less.

2. The surface roughness Sa of the corner portion is 0.15 μm or less, 2. The irregular shaped die according to claim 1, wherein the surface roughness Sa of the non-corner portion is 0.10 μm or less.

3. The surface roughness Sa of the corner portion is 0.10 μm or less, 3. The irregular shaped die according to claim 2, wherein the surface roughness Sa of the non-corner portion is 0.07 μm or less.

4. In a cross section of the reduction portion perpendicular to the wire drawing direction, a curved corner portion and a non-corner portion at a position different from the corner portion are provided, The surface roughness Sa of the corner portion of the reduction portion is 0.15 μm or less, The surface roughness Sa of the non-corner portion of the reduction portion is 0.10 μm or less, 4. The irregular shaped die according to claim 1, wherein a difference in surface roughness Sa between the reduction portion and the non-corner portion of the bearing portion is 0.05 μm or less.

5. The irregular shaped die according to claim 1 , wherein an opening angle of the reduction in the corner portion is different from an opening angle of the reduction in the non-corner portion.

6. The irregular shaped die according to claim 5 , wherein an opening angle of the reduction in the corner portion is larger than an opening angle of the reduction in the non-corner portion.

7. The irregular shaped die according to claim 6 , wherein an opening angle of the reduction in the corner portion increases as the opening angle increases away from the non-corner portion.

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