Method for manufacturing electronic device, and supported electronic device

Abstract

To easily peel a support from an electronic device with supports.SOLUTION: A method of manufacturing an electronic device includes: a preparing step S1 of preparing an electronic device 15 with supports which is equipped with a first support 2, a second glass film 1, an electronic device element 14, a second glass film 4 and a second support 5 in this order; a first peeling step S41 of peeling the first support 2 from the electronic device 15 with supports; and a second peeling step S42 of peeling the second support 5 from the electronic device 15 with supports. The first support 2 has a protruding portion 17 protruding from the second support 5. In the first peeling step S41, external force is applied to the protruding portion 17, thereby forming a peeling starting point S between the first support 2 and the first glass film 1.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a method for producing an electronic device, and a support-attached electronic device used in the production method. [Background technology]

[0002] In recent years, panel displays such as liquid crystal displays and organic electroluminescence displays have become widespread due to their advantages such as thinness, light weight, low power consumption, etc. For example, a liquid crystal display is an electronic device having electronic device elements such as a liquid crystal layer between a pair of glass films, and an organic electroluminescence display is an electronic device having electronic device elements such as an organic electroluminescence element between a pair of glass films.

[0003] In the manufacturing process of such electronic devices, a laminate in which a glass film is laminated on a support is sometimes used in order to improve the handleability of the glass film (see, for example, paragraph 0073 of Patent Document 1).

[0004] In detail, in the manufacturing process of the electronic device, first, a first laminate in which a first glass film (one of a pair of glass films) is laminated on a first support, and a second laminate in which a second glass film (the other of the pair of glass films) is laminated on a second support are respectively manufactured. Next, various processes (e.g., an array process, a color filter process, etc.) for forming electronic device elements are performed on the first glass film of the first laminate and the second glass film of the second laminate. Thereafter, the first glass film of the first laminate and the second glass film of the second laminate are bonded together, and the electronic device elements are disposed between the first glass film and the second glass film. In this state, the electronic device is provided with a support in which supports are disposed on both the front and back sides of the electronic device, and then the first support and the second support are peeled off from the electronic device with the support. In this way, an electronic device including the first glass film, the electronic device elements, and the second glass film in this order is manufactured.

[0005] Patent Document 1 discloses a method for peeling a support from an electronic device with a support, in which an external force is applied to an edge of the support protruding from the electronic device by an external force application part (locking part) so as to bend the support, thereby forming a peeling starting point part (gap) between the glass film and the support. After the peeling starting point part is formed in this way, the glass film and the support can be easily separated by progressing the peeling from the peeling starting point part. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-3147 A Summary of the Invention [Problem to be solved by the invention]

[0007] 18, in the case of a conventional electronic device 101 with a support, an upper surface 104a of an edge portion of a first support 104 protruding from an electronic device 102 (strictly speaking, a first glass film 103) and a lower surface 106a of an edge portion of a second support 106 protruding from an electronic device 102 (strictly speaking, a second glass film 105) face each other in the stacking direction (vertical direction) via a gap 107. However, the dimension of this gap 107 in the stacking direction is generally very small as the electronic device 102 becomes thinner.

[0008] On the other hand, in the peeling method disclosed in Patent Document 1, for example, when an external force is applied by pressing an external force application part (locking part) against the upper surface 104a of the edge part of the lower first support 104, a problem may occur in that the edge part of the upper second support 106 gets in the way. That is, since the edge part of the upper second support 106 protrudes so as to cover the edge part of the lower first support 104, it is very difficult to press the external force application part against the upper surface 104a of the edge part of the first support 104. As described above, this problem becomes particularly noticeable as the gap 107 between the edge part of the first support 104 and the edge part of the second support 106 becomes smaller. As a result, a peeling start point cannot be formed between the first glass film 103 and the first support 104, and a problem may occur in that the first support 104 cannot be easily peeled off from the first glass film 103.

[0009] An object of the present invention is to easily peel off a support from an electronic device with a support. [Means for solving the problem]

[0010] (1) The present invention, which has been invented to solve the above-mentioned problems, is a method for manufacturing an electronic device, the method including a preparation step of preparing an electronic device with a support comprising, in this order, a first support, a first glass film, an electronic device element, a second glass film, and a second support, a first peeling step of peeling the first support from the electronic device with the support, and a second peeling step of peeling the second support from the electronic device with the support, wherein in the electronic device with the support prepared in the preparation step, the first support has a protruding portion protruding from the second support, and in the first peeling step, an external force is applied to the protruding portion to form a peel starting portion between the first support and the first glass film.

[0011] In this way, even in the case of an electronic device with supports in which supports are arranged on both the front and back sides of the electronic device, an external force for forming a peel starting point on the first support can be easily and reliably applied by utilizing the protruding portion of the first support protruding from the second support. In other words, when applying an external force to the first support, the edge portion of the second support does not get in the way. As a result, a peel starting point can be easily formed between the first support and the first glass film. Therefore, it becomes possible to easily peel the first support from the first glass film using this peel starting point as a starting point.

[0012] (2) In the above configuration (1), the second support may have a notch at an edge thereof, and the protruding portion may be formed by the first support protruding from the notch.

[0013] In this way, an external force can be easily applied to the protruding portion of the first support through the cutout portion of the second support. In addition, since the first support and the second support can be of approximately the same size, there is an advantage that the production and management of the supports is simplified.

[0014] (3) In the above configuration (2), it is preferable that the first support and the second support are each rectangular, the cutout portion is formed in at least one corner portion of the first support, and the protruding portion is formed by a corresponding corner portion of the second support protruding from the cutout portion.

[0015] In this way, a protruding portion is formed at the corner portion of the first support. Therefore, by applying an external force to the protruding portion of the first support using the cutout portion of the second support, a peel starting point portion can be formed at the corner portion of the first support. Furthermore, if it is the corner portion of the first support, peeling can easily progress from the peel starting point portion. Therefore, it is easy to peel the first support from the first glass film.

[0016] (4) In the above configuration (3), the cutout portion is preferably linear.

[0017] This makes it easier to process the cutout portion. Also, since the area of ​​the protruding portion at the corner portion of the first support can be increased, it becomes easier to apply an external force to the corner portion of the first support.

[0018] (5) In the above configuration (1), the first support and the second support may each be rectangular, and the protruding portion may be formed by at least one side of the first support protruding from a corresponding side of the second support.

[0019] In this way, the corner portion of the first support is included in the protruding portion. Therefore, for the same reason as described above, it is easy to peel the first support from the first glass film. In addition, for example, the protruding portion can be easily formed by simply making the size of the first support larger than the size of the second support.

[0020] (6) In the above configuration (5), the protruding portion is preferably formed by at least two intersecting sides of the first support protruding beyond the corresponding sides of the second support.

[0021] In this way, the area of ​​the protruding portion at the corner portion of the first support can be increased, making it easier to apply an external force to the corner portion of the first support.

[0022] (7) In the above configurations (1) to (6), the first support and the second support are preferably made of glass.

[0023] This improves the adhesion between the first support and the first glass film, and also improves the adhesion between the second support and the second glass film, making the manufacturing method of the present invention more useful.

[0024] (8) The present invention, which has been invented to solve the above problems, is an electronic device with a support comprising a first support, an electronic device, and a second support, in this order, wherein the electronic device comprises a first glass film, an electronic device element, and a second glass film, in this order, the first support is arranged on the first glass film side of the electronic device, the second support is arranged on the second glass film side of the electronic device, and the first support has a protruding portion protruding from the second support.

[0025] In this way, the same effects as those of the corresponding configurations already described can be obtained. Effect of the Invention

[0026] According to the present invention, the support can be easily peeled off from the support-attached electronic device. [Brief description of the drawings]

[0027] [Figure 1] 3 is a flowchart showing a method for manufacturing an electronic device according to the first embodiment. [Diagram 2] 5(a) and 5(b) are plan views illustrating a stack formation step in the method for manufacturing an electronic device according to the first embodiment. [Diagram 3] 2(a) is a cross-sectional view taken along line AA in FIG. 2(a), and FIG. 2(b) is a cross-sectional view taken along line BB in FIG. 2(b). [Figure 4] 1(a) and 1(b) are plan views illustrating processing steps of a method for manufacturing an electronic device according to a first embodiment. [Diagram 5] FIG. 4 is a plan view showing a support-attached electronic device forming step in the method for manufacturing an electronic device according to the first embodiment. [Figure 6] 5C is a cross-sectional view taken along line CC of FIG. [Figure 7] FIG. [Figure 8] 13 is a perspective view of a locking portion that constitutes the external force application portion. FIG. [Figure 9]4 is a cross-sectional view of a main part illustrating a first peeling step (first peeling start point forming step) of the method for manufacturing the electronic device according to the first embodiment. FIG. [Figure 10] 4 is a cross-sectional view of a main part illustrating a first peeling step (first peeling start point forming step) of the method for manufacturing the electronic device according to the first embodiment. FIG. [Figure 11] 4 is a perspective view of a main part illustrating a first peeling step (first peeling start point forming step) of the method for manufacturing the electronic device according to the first embodiment. FIG. [Figure 12] 4 is a cross-sectional view of a main part illustrating a first peeling step (first peeling advance step) of the method for manufacturing the electronic device according to the first embodiment. FIG. [Figure 13] 4 is a cross-sectional view of a main part illustrating a second peeling step (a second peeling start point forming step) of the method for manufacturing the electronic device according to the first embodiment. FIG. [Figure 14] 5(a) and 5(b) are plan views showing a laminate according to a second embodiment of the present invention. [Figure 15] FIG. 4 is a plan view showing a support-attached electronic device according to a second embodiment. [Figure 16] FIG. 11 is a plan view showing a support-attached electronic device according to a third embodiment. [Figure 17] FIG. 13 is a plan view showing a support-attached electronic device according to a fourth embodiment. [Figure 18] FIG. 1 is a cross-sectional view showing a conventional electronic device with a support. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, a method for manufacturing an electronic device according to an embodiment of the present invention will be described with reference to the drawings. In each embodiment, the same reference numerals are used to designate corresponding components, and duplicated descriptions may be omitted. When only a portion of a configuration is described in each embodiment, the configuration of another embodiment described above may be applied to the other portion of the configuration. In addition to the combination of configurations explicitly stated in the description of each embodiment, configurations of multiple embodiments may be partially combined together even if not explicitly stated, as long as there is no particular problem with the combination.

[0029] First Embodiment A method for producing an electronic device according to a first embodiment of the present invention will be described with reference to Fig. 1 to Fig. 13. In this embodiment, a liquid crystal panel included in a liquid crystal display or the like is exemplified as an example of an electronic device. In addition, in the description of the production method, an electronic device with a support will also be described.

[0030] 1, the present manufacturing method includes a laminate formation step S1, a treatment step S2, a support-attached electronic device formation step S3, and a peeling step S4, in this order. In the present embodiment, the laminate formation step S1, the treatment step S2, and the support-attached electronic device formation step S3 are included in a preparation step for preparing an electronic device with a support. However, the configuration of the preparation step is not particularly limited as long as an electronic device with a support can be prepared.

[0031] (1) Laminate formation process S1 As shown in Figures 2(a) and (b) and Figures 3(a) and (b), the laminate formation process S1 includes a first lamination process S11 in which a first glass film 1 and a first support 2 are laminated to obtain a first laminate 3, and a second lamination process S12 in which a second glass film 4 and a second support 5 are laminated to obtain a second laminate 6.

[0032] In the following description, the first support 2 side of the first glass film 1 is referred to as the first main surface (lower surface in FIG. 3(a)) 1a, and the side opposite to the first support 2 is referred to as the second main surface (upper surface in FIG. 3(a)) 1b. In addition, the first support 2 is referred to as the first main surface (upper surface in FIG. 3(a)) 2a, and the side opposite to the first glass film 1 is referred to as the second main surface (lower surface in FIG. 3(a)) 2b. Similarly, in the following description, the second support 5 side of the second glass film 4 is referred to as the first main surface (lower surface in FIG. 3(b)) 4a, and the side opposite to the second support 5 is referred to as the second main surface (upper surface in FIG. 3(b)) 4b. In addition, the second support 5 is referred to as the first main surface (upper surface in FIG. 3(b)) 5a, and the side opposite to the second glass film 4 is referred to as the second main surface (lower surface in FIG. 3(b)) 5b.

[0033] The first and second glass films 1, 4 and the first and second supports 2, 5 are rectangular plate-like bodies. In this embodiment, the first and second glass films 1, 4 have the same size (length and width dimensions), and the first and second supports 2, 5 have the same size (length and width dimensions). The size of the first and second supports 2, 5 is larger than the size of the first and second glass films 1, 4.

[0034] The first and second glass films 1 and 4 each have a thickness of preferably 300 μm or less, more preferably 200 μm or less, and further preferably 100 μm or less. In consideration of handleability, the first and second glass films 1 and 4 each have a thickness of preferably 1 μm or more, and more preferably 5 μm or more.

[0035] The first and second glass films 1, 4 are formed of, for example, silicate glass, silica glass, etc., preferably borosilicate glass, and more preferably non-alkali glass.

[0036] The alkali-free glass refers to glass that does not substantially contain an alkali component (alkali metal oxide), and specifically refers to glass that contains 3000 ppm or less of an alkali component. The alkali component content is preferably 1000 ppm or less, more preferably 500 ppm or less, and further preferably 300 ppm or less.

[0037] The thickness of the first and second supports 2, 5 is preferably 400 μm or more, more preferably 500 μm or more. Considering bending of the first and second supports 2, 5, the thickness of the first and second supports 2, 5 is preferably 1000 μm or less, more preferably 700 μm or less.

[0038] The first and second supports 2, 5 are plate-like glass in this embodiment and are formed of known glass such as silicate glass, silica glass, borosilicate glass, non-alkali glass, etc., similarly to the first and second glass films 1, 4. From the viewpoint of suppressing the difference in expansion during heating in the treatment step S2 or the like, the first and second glass films 1, 4 and the first and second supports 2, 5 are preferably formed of the same type of glass (particularly, non-alkali glass).

[0039] In this embodiment, the first and second glass films 1, 4 and the first and second supports 2, 5 are formed by an overflow downdraw method. Note that other downdraw methods such as a slot downdraw method, or a float method may also be used as the forming method. However, from the viewpoint of obtaining a smooth surface, it is preferable to use the overflow downdraw method as the forming method.

[0040] In the first laminate 3, the first support 2 and the first glass film 1 are directly adhered to each other without any other member such as an adhesive being interposed therebetween. Similarly, in the second laminate 6, the second support 5 and the second glass film 4 are directly adhered to each other without any other member such as an adhesive being interposed therebetween.

[0041] The surface roughness Ra of the first main surface 1a of the first glass film 1 and the first main surface 2a of the first support 2 is preferably 2.0 nm or less, more preferably 1.0 nm or less, and even more preferably 0.2 nm or less. In this way, the first glass film 1 and the first support 2 can be adhered to each other to such an extent that no misalignment occurs without using an adhesive. For the same reason, the surface roughness Ra of each of the first main surface 4a of the second glass film 4 and the first main surface 5a of the second support 5 is preferably 2.0 nm or less, more preferably 1.0 nm or less, and even more preferably 0.2 nm or less. Here, the surface roughness Ra is the arithmetic average roughness in accordance with JIS R 1683:2014, and is measured by an atomic force microscope (hereinafter the same).

[0042] On the other hand, the surface roughness Ra of the second main surface 1b of the first glass film 1 and the second main surface 4b of the second glass film 4 is not particularly limited. However, since these main surfaces 1b and 4b are surfaces to be subjected to treatment such as film formation in the treatment step S2, the surface roughness Ra is preferably 2.0 nm or less, more preferably 1.0 nm or less, and further preferably 0.2 nm or less.

[0043] In this embodiment, as shown in FIG. 2(a), at the entire periphery (all four sides) of the first laminate 3, the edge portion 8 of the first support 2 protrudes from the first glass film 1. As a result, a frame-shaped region including a corner portion 7 of the first support 2 protrudes from the first glass film 1. Similarly, as shown in FIG. 2(b), at the entire periphery of the second laminate 6, the edge portion 10 of the second support 5 protrudes from the second glass film 4. As a result, a frame-shaped region including a corner portion 9 of the second support 5 protrudes from the second glass film 4. Note that, at all four sides of the first laminate 3, the side of the first glass film 1 and the side of the first support 2 protruding from that side are substantially parallel. Similarly, at all four sides of the second laminate 6, the side of the second glass film 4 and the side of the second support 5 protruding from that side are substantially parallel.

[0044] The amount by which edge portion 8 of first support 2 protrudes from first glass film 1 and the amount by which edge portion 10 of second support 5 protrudes from second glass film 4 are, for example, 0.5 mm or more and 10 mm or less, and preferably 0.5 mm or more and 1.0 mm or less.

[0045] As shown in Fig. 2(b) and Fig. 3(b), the second support 5 has a cutout portion 11 at its edge portion 10. In this embodiment, the cutout portion 11 is formed at one corner portion 9 of the second support 5 protruding from the second glass film 4. On the other hand, as shown in Fig. 2(a) and Fig. 3(a), the first support 2 has glass remaining without being cut out at a position (corner portion 7) corresponding to the cutout portion 11 of the second support 5. In other words, the edge portion 8 of the first support 2 has a larger remaining glass area than the second support 5 at the position corresponding to the cutout portion 11 of the second support 5.

[0046] In this embodiment, the cutout portion 11 of the second support 5 is linear and inclined with respect to the two sides of the second support 5 that intersect (orthogonal) at the corner portion 9. In other words, the cutout portion 11 is in a state where a triangular corner of the second support 5 is cut away. This cutout portion 11 can also be used as an orientation flat portion for determining the type, length and width direction, front and back, etc. The shape of the cutout portion 11 is not limited to a linear shape, and may be a curved shape, a concave shape (notch shape), etc.

[0047] (2) Processing step S2 As shown in Fig. 4(a) and (b), the process S2 includes a first process S21 of forming a first element 12 on the second main surface 1b of the first glass film 1 of the first laminate 3, and a second process S22 of forming a second element 13 on the second main surface 4b of the second glass film 4 of the second laminate 6. The first element 12 includes, for example, a color filter, and the second element 13 includes, for example, a TFT array. At least one of the first element 12 and the second element 13 includes a liquid crystal layer or a partitioned space (a space for sealing liquid crystal) for forming a liquid crystal layer. In the drawings, the first element 12 and the second element 13 are simplified to a sheet shape, but the shape and the formation range of the first element 12 and the second element 13 are not particularly limited.

[0048] In this embodiment, the first processing step S21 and the second processing step S22 involve heating. Due to this heating, new bonds are formed between the first glass film 1 and the first support 2, and the adhesion between the first glass film 1 and the first support 2 is increased compared to before the first processing step S21. For the same reason, the adhesion between the second glass film 4 and the second support 5 is also increased compared to before the second processing step S22.

[0049] (3) Support-attached electronic device formation process S3 5 and 6 , in the support-attached electronic device forming step S3, the first laminate 3 and the second laminate 6 are laminated so that the first element 12 and the second element 13 face each other. In this state, the first glass film 1 of the first laminate 3 and the second glass film 4 of the second laminate 6 are joined together, and an electronic device element 14 including the first element 12 and the second element 13 is disposed between the first glass film 1 and the second glass film 4.

[0050] A bonding portion (not shown) between the first glass film 1 and the second glass film 4 is formed so as to surround an area in which the electronic device element 14 is formed in order to ensure airtightness of the electronic device element 14. The method for bonding the first glass film 1 and the second glass film 4 is not particularly limited, and examples of the bonding method that can be used include a method of directly bonding the first glass film 1 and the second glass film 4 by laser bonding, and a method of bonding the first glass film 1 and the second glass film 4 via another member such as a glass frit or a spacer.

[0051] By such a support-attached electronic device forming step S3, a support-attached electronic device 15 is obtained which includes the first support 2, the first glass film 1, the electronic device element 14, the second glass film 4, and the second support 5 in this order. Among these, the first glass film 1, the electronic device element 14, and the second glass film 4 correspond to an electronic device 16.

[0052] In the support-attached electronic device 15, the edge portion 8 of the first support 2 has a protruding portion 17 that protrudes from the edge portion 10 of the second support 5. In this embodiment, the protruding portion 17 is formed by a corner portion 7 of the first support 2 protruding from a cutout portion 11 of the second support 5. It is to be noted that a corner portion 18 of the electronic device 16 (strictly speaking, a corner portion of the first glass film 1 and the second glass film 4) does not protrude from the cutout portion 11 of the second support 5.

[0053] The amount of protrusion 17 protruding from cutout 11 is, for example, 0.5 mm to 10 mm, and preferably 0.5 mm to 1.0 mm. Here, the amount of protrusion means the length of protruding portion 17 along the side direction.

[0054] The gap between the first support 2 and the second support 5, in other words the thickness of the electronic device 16, is, for example, from 40 μm to 2000 μm, and preferably from 300 μm to 1000 μm.

[0055] (4) Peeling process S4 7 to 13, the peeling step S4 includes a first peeling step S41 (see FIGS. 7 to 12) of peeling the first support 2 from the support-attached electronic device 15, and a second peeling step S42 (see FIG. 13) of peeling the second support 5 from the support-attached electronic device 15. In this embodiment, the second peeling step S42 is performed after the first peeling step S41. Note that in FIG. 11, the electronic device element 14, the second glass film 4, and the second support 5 of the support-attached electronic device 15 are not shown.

[0056] The first peeling step S41 includes a peeling starting point forming step (see FIGS. 7 to 11) of forming a peeling starting point S between the first support 2 and the first glass film 1, and a peeling progressing step (see FIG. 12) of progressing peeling between the first support 2 and the first glass film 1 starting from the peeling starting point S. In the present embodiment, a case where the first peeling step S41 is performed using a peeling device 21 is illustrated.

[0057] As shown in FIG. 7, the peeling apparatus 21 includes a holder 22 for holding the support-attached electronic device 15, and an external force application section 23 for applying an external force to the protruding section 17 of the first support 2 included in the support-attached electronic device 15.

[0058] The holder 22 is capable of holding the support-attached electronic device 15 in a flat state. In this embodiment, the holder 22 has a mounting surface 24 on which the second main surface 2b of the first support 2 is placed. The mounting surface 24 may be provided with a suction mechanism (e.g., a plurality of suction holes) for suctioning the second main surface 2b of the first support 2.

[0059] The external force application portion is provided at one corner portion 25 of the holder 22. In this embodiment, the external force application portion has a lifting portion and a locking portion 27 provided on an upper surface a of the lifting portion .

[0060] The lifting / lowering unit 26 constitutes the corner portion 25 of the support table 22, and is capable of moving up and down along the normal direction (up and down direction) of the mounting surface 24. In the initial state before being lowered, the upper surface 26a of the lifting / lowering unit 26 is disposed flush with the mounting surface 24.

[0061] The locking portion 27 is capable of locking with the protruding portion 17 of the first support 2 placed on the placement surface 24 as the lifting portion 26 descends.

[0062] The locking portion 27 is configured to come into contact with two sides constituting the corner portion 7 of the first support 2 at equal distances. In this embodiment, as shown in Fig. 8, the locking portion 27 has an inclined surface 27a. This inclined surface 27a is for adjusting the curvature (radius) of the protruding portion 17 when the first support 2 is bent (see Fig. 10). In other words, by adjusting the inclination angle of the inclined surface 27a and the lowering amount of the lifting / lowering portion 26, the magnitude of the curvature (radius) of the protruding portion 17 of the first support 2 can be controlled.

[0063] 9, the peeling device 21 further includes a plurality of suction members 28 capable of suctioning the second main surface 5b of the second support 5. Each of the suction members 28 has a bellows-shaped suction portion 29 provided at the tip.

[0064] Next, the first peeling step S41 using the peeling device 21 configured as above will be described.

[0065] 7, in the peel start point forming step of the first peeling step S41, first, the support-attached electronic device 15 is placed on the placement surface 24 of the peeling apparatus 21. At this time, the protruding portion 17 (corner portion 7) of the first support 2 is placed so as to match with the corner portion 25 of the holder 22 where the external force application portion 23 is provided. In this state, as shown in FIG. 9, the protruding portion 17 of the first support 2 abuts against the side surface of the locking portion 27. As a result, the support-attached electronic device 15 is placed at a predetermined position.

[0066] After the support-attached electronic device 15 is placed, the lifting section 26 is lowered to press the locking section 27 against the first main surface 2a of the protruding section 17 of the first support 2. At this time, the protruding section 17 of the first support 2 protrudes from the second support 5 due to the cutout section 11 of the second support 5. In other words, the second support 5 is retracted inward to a position where it does not come into contact with the locking section 27. Therefore, the locking section 27 can be pressed against the protruding section 17 of the first support 2 easily and reliably.

[0067] 10 and 11 , by continuing to lower the lifting unit 26 after pressing the locking unit 27 against the first support 2, a downward external force F is applied to the first support 2 at the contact point with the locking unit 27. This causes the first support 2 to bend in a direction away from the first glass film 1. As a result, a peel starting point (gap) S is formed between the first main surface 1a of the first glass film 1 and the first main surface 2a of the first support 2.

[0068] 9 and 10 , in the peel starting point forming step, the second main surface 5b of the second support 5 may be adsorbed by the adsorption member 28. In this way, when an external force F is applied to the protruding portion 17, it is possible to suppress the first glass film 1 from bending downward together with the first support 2, which makes it easier to form the peel starting point S. In the case where the second main surface 5b of the second support 5 is not adsorbed by the adsorption member 28 in the peel starting point forming step, the adsorption portion 29 of the adsorption member 28 may be separated from the second main surface 5b of the second support 5.

[0069] As shown in FIG. 12, in the peeling development step of the first peeling step S41, the second support 5 is lifted while the second main surface 5b of the second support 5 is suctioned by a plurality of suction members 28. The lifting of the second support 5 is performed by contracting the suction portion 29 of the suction member 28 or lifting the suction member 28 itself. At this time, since the peeling start portion S has already been formed between the first main surface 2a of the first support 2 and the first main surface 1a of the first glass film 1, the adhesion between the first main surface 5a of the second support 5 and the first main surface 4a of the second glass film 4 is stronger than the adhesion between the first main surface 2a of the first support 2 and the first main surface 1a of the first glass film 1. Therefore, when the second support 5 is lifted by the suction members 28, the second glass film 4 is bent so as to follow the second support 5. And, since the first glass film 1 and the second glass film 4 included in the electronic device 16 are bonded to each other, the first glass film 1 is also bent so as to follow the second support 5. As a result, a peeling force G is applied in a direction in which the first main surface 1a of the first glass film 1 moves away from the first main surface 2a of the first support 2. This peeling force G causes peeling between the first main surface 2a of the first support 2 and the first main surface 1a of the first glass film 1 to progress in a planar direction (for example, the X direction in the figure) starting from the peel initiation point S. Then, by expanding the peeled region to the entire area, the first support 2 and the first glass film 1 can be completely separated.

[0070] It is preferable that, even when the peeling force G is applied by the adsorption member 28, the external force application unit 23 continues to apply the external force F to the protruding portion 17 in order to suppress re-adhesion of the peel starting point S (see FIG. 12). However, before the adsorption member 28 applies the peeling force G, the external force application unit 23 may stop applying the external force F to the protruding portion 17. After the adsorption member 28 expands the peeled region to a certain area (for example, an area along one side of the first glass film 1), the peeled region may be further expanded using another means (for example, another adsorption member).

[0071] After the first support 2 is peeled off through the first peeling step S41 as described above, the second peeling step S42 is performed. The second peeling step S42 includes a peeling origin forming step of forming a peeling origin between the second support 5 and the second glass film 4, and a peeling advancement step of advancing peeling between the second support 5 and the second glass film 4 starting from the peeling origin. Note that in the present embodiment, a case where the peeling device 21 is used also in the second peeling step S42 is illustrated as an example.

[0072] 13, in the peeling start point forming step of the second peeling step S42, the support-attached electronic device from which the first support 2 has been peeled is turned upside down and placed on the placement surface 24 of the peeling apparatus 21. That is, the second main surface 5b of the second support 5 is placed on the placement surface 24. Then, in this state, the same operation as in the first peeling step S41 is repeated to completely separate the second support 5 and the second glass film 4. In this way, an electronic device 16 from which the first support 2 and second support 5 have been removed can be obtained.

[0073] 13, the present embodiment illustrates a case in which the suction portion 29 of the suction member 28 comes into contact with the first main surface 1a of the first glass film 1 in the peel starting point forming step and / or the peel extension step of the second peeling step S42. In this case, there is a risk that a suction mark of the suction portion 29 will remain on the first main surface 1a of the first glass film 1. For this reason, it is preferable to perform a cleaning step of cleaning the electronic device 16 after completion of the second peeling step S42. Furthermore, in the present embodiment, the peel starting point is formed in the corner portion 9 having the cutout portion 11 in the second peeling step S42, but the peel starting point may be formed in the corner portion 9 not having the cutout portion 11.

[0074] Second Embodiment In the second embodiment of the present invention, a modified example of the support-attached electronic device 15 will be illustrated. In this embodiment, the differences between the first laminate 3 and the second laminate 6 will be described, and then the differences in the support-attached electronic device 15 will be described.

[0075] As shown in Fig. 14(a), in the first laminate 3 according to this embodiment, the first support 2 has a corner cut portion 31 (chamfered portion) at each of the four corner portions 7. On the other hand, as shown in Fig. 14(b), in the second laminate 6 according to this embodiment, the second support 5 has an orientation flat portion (cutout portion) 11 at one corner portion 9, and a corner cut portion 32 at each of the remaining three corner portions 9. The corner cut portions 31, 32 and the orientation flat portion 11 are formed by removing corner portions by grinding or the like. The removed area of ​​the orientation flat portion 11 is larger than that of the other corner portions.

[0076] 15, the support-attached electronic device 15 according to this embodiment is obtained by laminating the above-mentioned first laminate 3 and second laminate 6. That is, in the support-attached electronic device 15, a corner portion 7 including one corner-cut portion 31 of the first support 2 protrudes from the orientation flat portion 11 of the second support 5, thereby forming a protruding portion 17. Therefore, by applying an external force to the protruding portion 17, a peel starting point S can be easily formed.

[0077] <Third embodiment> In the third embodiment of the present invention, a modified example of the support-attached electronic device 15 is illustrated.

[0078] 16, in the support-attached electronic device 15 according to this embodiment, the entire area of ​​one side of the first support 2 protrudes from the corresponding side of the second support 5, thereby forming a protruding portion 17. In other words, the protruding portion 17 is a rectangular area along one side of the second support 5. In this case as well, the protruding portion 17 includes the corner portion 7 of the first support 2. Therefore, by applying an external force to the corner portion 7 of the first support 2 included in the protruding portion 17, a peel starting point S can be easily formed.

[0079] <Fourth embodiment> In the fourth embodiment of the present invention, a modified example of the support-attached electronic device 15 is illustrated.

[0080] As shown in FIG. 17, in the support-attached electronic device 15 according to this embodiment, the entire areas of at least two intersecting sides of the first support 2 protrude from the corresponding sides of the second support 5, forming a protruding portion 17. In the illustrated example, the protruding portion 17 is formed by all four sides of the first support 2 protruding from the second support 5. That is, the protruding portion 17 is a frame-shaped region along each side of the second support 5. In this case as well, the protruding portion 17 includes the corner portion 7 of the first support 2. Moreover, it is easy to increase the area (exposed area) of the protruding portion 17 at the corner portion 7 of the first support 2. Therefore, it is easy to apply an external force to the corner portion 7 of the first support 2, and the peeling starting point S can be formed more easily.

[0081] The above describes a method for manufacturing a glass article according to an embodiment of the present invention. However, the embodiment of the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

[0082] In the above embodiment, the peeling-progressing step is performed using an adsorption member, but the present invention is not limited to this configuration. For example, in the peeling-progressing step, peeling may be advanced by inserting a sheet-like member into the gap at the peeling start point or by blowing a fluid such as air into the gap at the peeling start point.

[0083] In the above embodiment, the peeling start point is formed at the corner of the support, but the present invention is not limited to this configuration. For example, the peeling start point may be formed at the middle of the side of the first support. In this case, the protruding portion for applying an external force to the first support is also formed at the middle of the side of the first support. That is, for example, when the protruding portion of the first support is formed using the cutout portion of the second support, the cutout portion is also formed at the middle of the side of the second support. In other words, in the present invention, the position of the protruding portion is not limited to the corner of the first support, and the position of the cutout portion of the second support is not limited to the corner of the second support.

[0084] In the above embodiment, the support protrudes from the glass film at all the periphery (all four sides) of the electronic device with the support, but the present invention is not limited to this configuration. For example, the support may protrude from the glass film at three sides or one side of the electronic device with the support. In this case, it is preferable that the end face of the glass film and the end face of the support coincide with each other at the side that does not protrude.

[0085] In the above embodiment, the glass surface of the glass film and the glass surface of the support (plate glass) are directly adhered to each other, but the present invention is not limited to this configuration. For example, a substrate on which a non-glass material layer is formed may be used as the support, and the glass surface of the glass film and the non-glass material layer of the substrate may be adhered to each other. In this case, the substrate is formed of, for example, plate glass, and the non-glass material layer is formed of, for example, an acrylic adhesive layer, a silicone thin film layer, an inorganic thin film layer (ITO, oxide, metal, carbon), etc.

[0086] In the above embodiment, the glass film and the support are both rectangular, but the present invention is not limited to this configuration. The glass film and / or the support may be circular, elliptical, triangular, or polygonal having pentagons or more.

[0087] In the above embodiment, the peeling step is exemplified as a case where the first peeling step of peeling the first support is followed by the second peeling step of peeling the second support, but the present invention is not limited to this configuration. For example, the first peeling step and the second peeling step may be performed simultaneously in a state where the electronic device with the support is held in a vertical position (preferably a vertical position). In this case, for example, it is preferable to form the protruding portion of the first support protruding from the second support and the protruding portion of the second support protruding from the first support at different positions that do not overlap each other. In this way, it is easy to simultaneously apply an external force for forming a peel start portion to the first support and the second support.

[0088] In the above embodiment, the electronic device is exemplified as a liquid crystal panel (liquid crystal display), but the present invention is not limited to this configuration. For example, the present invention can be applied to an organic EL display, a lighting device consisting of a liquid crystal element or an organic EL element, an in-vehicle laser scanning device, a mirror monitor device, a semiconductor package device, and various other electronic devices. That is, the electronic device element in the present invention is not limited to a liquid crystal layer, etc., but may be a printed layer of an organic paste, a polarizing material, a semiconductor element, or other liquid or solid matter. [Explanation of symbols]

[0089] 1 First Glass Film 2 First support 4 Second glass film 5 Second support 11 Cutout (orientation flat) 14 Electronic Device Elements 15 Supported electronic device 16 Electronic Devices 17 Protruding part 21 Peeling device 22 Holding stand 23 External force application section 24 Placement surface 26 Lifting section 27 Locking part 28 Adsorption member 29 Adsorption part F external force G Peeling force S Peeling start point

Claims

1. A preparation step of preparing a support-attached electronic device including a first support, a first glass film, an electronic device element, a second glass film, and a second support in this order; a first peeling step of peeling the first support from the support-attached electronic device; a second peeling step of peeling the second support from the support-attached electronic device, In the support-attached electronic device prepared in the preparing step, the first support has a protruding portion protruding from the second support, The method for manufacturing an electronic device, wherein in the first peeling step, an external force is applied to the protruding portion to form a peel starting point between the first support and the first glass film.

2. the second support has a notch at an edge portion thereof, The method for manufacturing an electronic device according to claim 1 , wherein the protruding portion is formed by the first support protruding from the cutout portion.

3. Each of the first support and the second support has a rectangular shape, The cutout portion is formed in at least one corner portion of the first support, The method for manufacturing an electronic device according to claim 2 , wherein the protruding portion is formed by a corresponding corner portion of the second support protruding from the notch portion.

4. The method for manufacturing an electronic device according to claim 3 , wherein the cutout portion has a linear shape.

5. Each of the first support and the second support has a rectangular shape, The method for manufacturing an electronic device according to claim 1 , wherein the protruding portion is formed by at least one side of the first support protruding beyond a corresponding side of the second support.

6. The method for manufacturing an electronic device according to claim 5 , wherein the protruding portion is formed by at least two intersecting sides of the first support protruding beyond the corresponding sides of the second support.

7. 7. The method for producing an electronic device according to claim 1, wherein the first support and the second support are made of glass.

8. A support-attached electronic device including a first support, an electronic device, and a second support in this order, the electronic device comprises, in this order, a first glass film, an electronic device element, and a second glass film; the first support is disposed on the first glass film side of the electronic device; the second support is disposed on the second glass film side of the electronic device; the first support has a first edge extending beyond the electronic device; the second support has a second edge extending beyond the electronic device; The first edge portion has a protruding portion protruding from the second support.

Images