Machining system, machining method, robot system, connection device, and end effector device

Abstract

To provide a processing system capable of making proper a relative position relation between an irradiation device which irradiates an object with processing light and the object.MEANS: A processing system comprises: a movable member which can change a relative position relation with a part of an object; an irradiation device which irradiates the object with processing light; and a connection device which connects the movable member and the irradiation device so that the relative position relation between the movable member and the irradiation device can be changed. The connection device comprises: a drive member which moves at least one of the movable member and irradiation device; and an elastic member which couples the movable member and the irradiation device.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to the technical field of a processing system and processing method capable of processing an object with processing light, a robot system, an end effector device, and a connection device that connects a robot and an end effector. [Background technology]

[0002] As a processing system capable of processing an object, Patent Document 1 describes a processing system that forms a structure by irradiating a processing light onto the surface of an object. In this type of processing system, it is required to appropriately set the relative positional relationship between the object and an irradiation device that irradiates the object with the processing light. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 4,994,639 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system for processing an object with processing light, comprising: a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device which irradiates the processing light toward the object; and a connection device which connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device is changeable, wherein the connection device comprises a driving member which moves at least one of the movable member and the irradiation device, and an elastic member which connects the movable member and the irradiation device.

[0005] According to a second aspect, there is provided a processing system for processing an object with processing light, the processing system comprising: a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device which irradiates the processing light toward the object; a connection device which connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device is changeable; and a vibration reduction device which reduces vibration from the movable member to the irradiation device.

[0006] According to a third aspect, there is provided a processing system for processing an object with processing light, comprising: a movable member whose relative positional relationship with a part of the object can be changed; an irradiation device that irradiates the processing light toward the object; a connection device that connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed; and a position measurement device that measures the position of the irradiation device relative to the object or a reference position, wherein the connection device comprises a position changing member that changes the position of the irradiation device relative to the movable member based on a position measurement result by the position measurement device.

[0007] According to a fourth aspect, there is provided a processing method for processing an object with processing light, the processing method including changing a positional relationship between a position of a movable member and a position of a part of the object, irradiating the processing light toward the object using an irradiation device, changing a relative positional relationship between the movable member and the irradiation device, and connecting the movable member and the irradiation device by a connecting part having a driving member that moves at least one of the movable member and the irradiation device, and an elastic member that connects the movable member and the irradiation device.

[0008] According to a fifth aspect, there is provided a processing method for processing an object with processing light, the processing method including changing a positional relationship between a position of a movable member and a position of a part of the object, irradiating the processing light toward the object using an irradiation device, changing a relative positional relationship between the movable member and the irradiation device, and reducing vibration from the movable member to the irradiation device.

[0009] According to a sixth aspect, there is provided a processing method for processing an object with processing light, the processing method including changing a positional relationship between a position of a movable member and a position of a part of the object, irradiating the processing light toward the object using an irradiation device, measuring a position of the irradiation device relative to the object or a reference position, and changing a relative positional relationship between the movable member and the irradiation device based on the measured position of the irradiation device.

[0010] According to a seventh aspect, there is provided a robot system comprising: an end effector that acts on an object; a movable member whose relative relationship with a part of the object can be changed; and a connection device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed, the connection device comprising a drive member that moves at least one of the movable member and the end effector, and an elastic member that connects the movable member and the end effector.

[0011] According to an eighth aspect, there is provided a robot system comprising: an end effector that acts on an object; a movable member whose relative relationship with a part of the object can be changed; a connection device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed; and a vibration reduction device that reduces vibrations from the movable member to the end effector.

[0012] According to a ninth aspect, there is provided a robot system comprising: an end effector acting on an object; a movable member whose relative relationship with a part of the object can be changed; a connection device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed; and a position measuring device that measures the position of the end effector relative to the object or a reference position, wherein the connection device comprises a position changing member that changes the position of the end effector relative to the movable member based on the position measurement result by the position measuring device.

[0013] According to a tenth aspect, there is provided a connection device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed, the connection device comprising: a drive member that moves at least one of the movable member and the end effector; and an elastic member that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed.

[0014] According to an eleventh aspect, there is provided a connection device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed, the connection device including a vibration reduction device that reduces vibrations from the movable member to the end effector, and connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed.

[0015] According to a twelfth aspect, there is provided a connection device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed, the connection device including a position change member that changes the position of the end effector relative to the movable member based on a position measurement result by a position measurement device that measures the position of the connection device and / or the end effector relative to the object or a reference position.

[0016] According to a 13th aspect, there is provided an end effector device comprising an end effector acting on an object, and a connection device connecting a movable member whose relative relationship with a part of the object can be changed and the end effector so that the relative positional relationship between the movable member and the end effector can be changed, the connection device comprising a drive member which moves at least one of the movable member and the end effector, and an elastic member which connects the movable member and the end effector.

[0017] According to a 14th aspect, there is provided an end effector device comprising: an end effector that acts on an object; a connection device that connects a movable member and the end effector so that a relative positional relationship between the movable member and a part of the object can be changed; and a vibration reduction device that reduces vibration from the movable member to the end effector.

[0018] According to a 15th aspect, there is provided an end effector device comprising: an end effector that acts on an object; a connection device that connects a movable member and the end effector so that the relative positional relationship between the end effector and a movable member whose relative relationship with a part of the object can be changed; and a position measurement device that measures the position of the end effector relative to the object or a reference position, wherein the connection device comprises a position change member that changes the position of the end effector relative to the movable member based on the position measurement result by the position measurement device. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to a first embodiment. [Diagram 2] 2(a) and 2(b) are cross-sectional views each showing a schematic state of processing of a coating film formed on the surface of an object to be processed. [Diagram 3] Figure 3(a) is a cross-sectional view showing a schematic diagram of a light irradiation device provided in the processing system of the first embodiment, and Figures 3(b) and 3(c) are each a cross-sectional view showing the configuration of a light source system provided in the light irradiation device. [Figure 4] FIG. 4 is a cross-sectional view that illustrates a schematic configuration of a light irradiation device that does not include a light source system. [Diagram 5] FIG. 5 is a cross-sectional view showing the structure of the first drive system. [Figure 6] FIG. 6 is a cross-sectional view showing the structure of the second drive system. [Figure 7]FIG. 7(a) is a cross-sectional view showing a cross section of the riblet structure formed by the processing apparatus of the first embodiment, and FIG. 7(b) is a perspective view showing the riblet structure formed by the processing apparatus of the first embodiment. [Figure 8] Figures 8(a) and 8(b) are each a front view showing an aircraft, which is an example of a workpiece on which a riblet structure is formed, and Figure 8(c) is a side view showing an aircraft, which is an example of a workpiece on which a riblet structure is formed. [Figure 9] FIG. 9 is a plan view showing a plurality of processing shot areas set on the surface of a coating film. [Figure 10] FIG. 10 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 11] Figure 11(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 11(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 11(a). [Figure 12] FIG. 12 is a plan view showing the scanning trajectory of the processing light (that is, the movement trajectory of the target irradiation area) during the period in which the scanning operation and the stepping operation are repeated. [Figure 13] FIG. 13 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 14] Figure 14(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 14(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 14(a). [Figure 15] FIG. 15 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 16] FIG. 16 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 17] FIG. 17 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 18]FIG. 18 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 19] FIG. 19 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 20] FIG. 20 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 21] FIG. 21 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to the second embodiment. [Figure 22] FIG. 22 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to the third embodiment. [Figure 23] Each of FIGS. 23(a) and 23(b) is a plan view showing a test structure formed when the drive system is controlled based on the measurement results of the position measurement device. [Figure 24] Each of Figures 24(a) and 24(b) is a plan view showing a characteristic change pattern formed on a sensitive member when processing light is irradiated while controlling the drive system based on the measurement results of the position measurement device, in a manner similar to the case of forming a test structure. [Diagram 25] FIG. 25 is a cross-sectional view illustrating a schematic structure of a processing system according to the fourth embodiment. [Figure 26] FIG. 26 is a perspective view illustrating a schematic structure of a processing system according to the fifth embodiment. [Figure 27] FIG. 27 is a front view illustrating a schematic structure of the processing system according to the fifth embodiment. [Figure 28] FIG. 28 is a side view diagrammatically illustrating the structure of the processing system according to the fifth embodiment. [Figure 29] FIG. 29 is an enlarged front view showing a part of the structure of the processing system according to the fifth embodiment. [Diagram 30] FIG. 30 is a cross-sectional view showing the structure of a drive system according to the sixth embodiment. [Diagram 31] FIG. 31 is a cross-sectional view showing the structure of a drive system according to the sixth embodiment. [Diagram 32]FIG. 32 is a front view showing the light irradiation device whose attitude has been changed so that the processing light is irradiated from diagonally below to diagonally above the aircraft, which is the processing object. [Diagram 33] FIG. 33 is a cross-sectional view showing a plurality of second driving systems that connect the light irradiation device and the first driving system shown in FIG. [Diagram 34] FIG. 34 is a cross-sectional view illustrating a schematic structure of a processing system according to the seventh embodiment. [Diagram 35] FIG. 35 shows an example of an end effector. [Diagram 36] Each of Figures 36(a) to 36(e) shows an example of an end effector. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, embodiments of a processing system, a processing method, a robot system, a connection device, and an end effector device will be described with reference to the drawings. Hereinafter, embodiments of a processing system, a processing method, a robot system, a connection device, and an end effector device will be described using a processing system SYS that processes a coating film SF formed on a surface of a processing target S using processing light EL. However, the present invention is not limited to the embodiments described below.

[0021] In the following description, the positional relationship of various components constituting the machining system SYS will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may be the horizontal direction.

[0022] (1) Machining system SYSa according to the first embodiment First, a machining system SYS of a first embodiment (hereinafter, the machining system SYS of the first embodiment will be referred to as a "machining system SYSa") will be described.

[0023] (1-1) Structure of the processing system SYSa First, the structure of the processing system SYSa of the first embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view that typically shows the structure of the processing system SYSa of the first embodiment.

[0024] As shown in FIG. 1, the processing system SYS processes a coating film SF formed (e.g., applied) on the surface of a processing object S. The processing object S may be, for example, a metal, an alloy (e.g., duralumin, etc.), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), etc.), glass, or an object made of any other material. The coating film SF is a film of paint that covers the surface of the processing object S. For this reason, the coating film SF may be called a paint layer. The processing object S serves as a substrate for the coating film SF. The thickness of the coating film SF is, for example, several tens of micrometers to several hundreds of micrometers, but may be any other size. The paint constituting the coating film SF may include, for example, a resin-based paint, or may include other types of paint. The resin paint may include at least one of, for example, an acrylic paint (e.g., a paint containing an acrylic polyol), a polyurethane paint (e.g., a paint containing a polyurethane polyol), a polyester paint (e.g., a paint containing a polyester polyol), a vinyl paint, a fluorine-based paint (e.g., a paint containing a fluorine-based polyol), a silicone-based paint, and an epoxy-based paint.

[0025] FIG. 1 shows an example in which the processing system SYSa (particularly, a processing device 1 provided in the processing system SYSa, which will be described later) is disposed on a workpiece S having a surface along a horizontal plane (i.e., an XY plane). However, the processing system SYSa is not necessarily disposed on the workpiece S having a surface along a horizontal plane. For example, as will be described in detail later with reference to FIG. 8 etc., the processing system SYSa may be disposed on the workpiece S having a surface intersecting with the horizontal plane. The processing system SYSa may be disposed so as to be suspended from the workpiece S. In this case, the X-axis direction and the Y-axis direction may be defined as directions along (typically parallel directions) the surface of the workpiece S for convenience, and the Z-axis direction may be defined as a direction intersecting (typically perpendicular direction) the surface of the workpiece S for convenience.

[0026] The processing system SYSa irradiates the coating film SF with processing light EL in order to process the coating film SF. The processing light EL may be any type of light as long as it can process the coating film SF by irradiating the coating film SF. As an example, the processing light EL may be laser light. Furthermore, the processing light EL may be light of any wavelength as long as it can process the coating film SF by irradiating the coating film SF. In the first embodiment, the processing light EL is described using an example in which the processing light EL is invisible light (e.g., at least one of infrared light and ultraviolet light). That is, in the first embodiment, the processing light EL is described using an example in which the processing light EL is at least one of light having a wavelength included in a wavelength band shorter than the wavelength band of visible light and light having a wavelength included in a wavelength band longer than the wavelength band of visible light. However, the processing light EL may be visible light.

[0027] Here, the processing of the coating film SF using the processing light EL will be described with reference to Fig. 2(a) and Fig. 2(b). Fig. 2(a) and Fig. 2(b) are cross-sectional views each showing a schematic diagram of the processing of the coating film SF formed on the surface of the processing object S.

[0028] As shown in FIG. 2(a), the processing system SYSa irradiates the processing light EL to the target irradiation area EA set on the surface of the coating film SF. The target irradiation area EA is an area where the processing system SYSa is scheduled to irradiate the processing light EL. As shown in FIG. 2(a), when the processing light EL is irradiated to the target irradiation area EA, a part of the coating film SF overlapping the target irradiation area EA (i.e., the coating film located on the -Z side of the target irradiation area EA) is evaporated by the processing light EL. At this time, in the thickness direction of the coating film SF, not all of the coating film SF overlapping the target irradiation area EA is evaporated. That is, in the thickness direction of the coating film SF, a part of the coating film SF overlapping the target irradiation area EA (specifically, a part of the coating film SF relatively close to the target irradiation area EA) is evaporated, while the other part of the coating film SF overlapping the target irradiation area EA (specifically, a part of the coating film SF relatively far from the target irradiation area EA) is not evaporated. In other words, the coating film SF is evaporated only to the extent that the processing object S is not exposed from the coating film SF. For this reason, the characteristics of the processing light EL may be set to desired characteristics that evaporate the coating film SF only to the extent that the workpiece S is not exposed from the coating film SF. The characteristics of the processing light EL may be set to desired characteristics that do not affect the workpiece S when irradiated with the processing light EL. The characteristics of the processing light EL may be set to desired characteristics that affect only the coating film SF when irradiated with the processing light EL. The characteristics of the processing light EL may include at least one of the wavelength of the processing light EL, the amount of energy per unit time and / or per unit area transmitted from the processing light EL to the surface of the coating film SF, the intensity distribution of the processing light EL on the surface of the coating film SF, the irradiation time of the processing light EL to the surface of the coating film SF, and the size of the processing light EL on the surface of the coating film SF (for example, the spot diameter or area).

[0029] At this time, the energy (i.e., intensity) of the processing light EL irradiated onto the coating film SF is determined so that the irradiation of the processing light EL does not affect the work-piece S. The energy of the processing light EL is determined so that the processing light EL does not penetrate the coating film SF and reach the work-piece S. In other words, the energy of the processing light EL is determined so that the irradiation of the processing light EL affects only the coating film SF.

[0030] As a result, the coating film SF is removed in the portion where the coating film SF has evaporated. On the other hand, the coating film SF remains as it is in the portion where the coating film SF has not evaporated. That is, as shown in FIG. 2(b), the coating film SF is partially removed in the portion where the processing light EL has been irradiated. As a result, as shown in FIG. 2(b), the thickness of the coating film SF is thinner in the portion where the processing light EL has been irradiated than in the portion where the processing light EL has not been irradiated. In other words, as shown in FIG. 2(b), on the surface of the processing object S, there exists a coating film SF that remains relatively thick because the processing light EL has not been irradiated, and a coating film SF that has become relatively thin because the processing light EL has been irradiated. That is, the thickness of the coating film SF is at least partially adjusted by the irradiation of the processing light EL. A part of the coating film SF is removed in the thickness direction (the Z-axis direction in the example shown in FIG. 2(b)) by the irradiation of the processing light EL. As a result, a recess (in other words, a groove portion) C corresponding to the portion where the coating film SF is relatively thin is formed on the surface of the coating film SF. Therefore, the "operation of processing the coating film SF" in the first embodiment includes at least one of an operation of adjusting the thickness of the coating film SF, an operation of removing a portion of the coating film SF, and an operation of forming a recess C in the coating film SF.

[0031] The coating film SF evaporates by absorbing the processing light EL. That is, the coating film SF is removed, for example, by photochemically decomposing the coating film SF when the energy of the processing light EL is transmitted to the coating film SF. When the processing light EL is a laser beam, the phenomenon in which the coating film SF is photochemically decomposed and removed when the energy of the processing light EL is transmitted to the coating film SF is sometimes called laser ablation. For this reason, the coating film SF contains a material capable of absorbing the processing light EL. Specifically, for example, the coating film SF may contain a material whose absorptance for the processing light EL (for example, when the processing light EL is invisible light, whose absorptance for light in a wavelength band including a wavelength different from the wavelength band of visible light) is equal to or greater than a predetermined first absorption threshold. In other words, light in a wavelength band whose absorptance by the coating film SF is equal to or greater than a predetermined first absorption threshold may be used as the processing light EL.

[0032] The material constituting the coating film SF may contain a colorant (specifically, for example, at least one of a pigment and a dye). When the coating film SF contains a colorant, the colorant may be a colorant that exhibits a desired color when irradiated with visible light. As a result, the coating film SF containing such a colorant exhibits the desired color. In this case, the colorant may have a property that the absorptance of light in a first wavelength band including a wavelength that is reflected by the coating film SF among the wavelength bands of visible light and is recognized by humans as light of the desired color is different from the absorptance of light in a second wavelength band of visible light that is different from the first wavelength band, so that the coating film SF exhibits the desired color. For example, the colorant may have a property that the absorptance of light in the first wavelength band is smaller than the absorptance of light in the second wavelength band. For example, the dye may have a characteristic that the absorptance of light in the first wavelength band is equal to or lower than a predetermined second absorption threshold (wherein the second absorption threshold is smaller than the first absorption threshold) and equal to or higher than a predetermined third absorption threshold (wherein the third absorption threshold is larger than the second absorption threshold). An example of a dye that can adequately absorb the invisible processed light EL and exhibit a desired color is, for example, a near-infrared absorbing dye (e.g., tetrafluoroboronated 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohex-1-en-1-yl}vinyl)-2,6-diphenylthiopyrylium) manufactured by Spectrum Info, located in Kiev, Ukraine. In addition, when the coating film SF is transparent, the coating film SF does not need to contain a dye.

[0033] When the coating film SF contains a pigment, the pigment may be a pigment that is transparent to visible light. As a result, the coating film SF containing such a pigment becomes a transparent film (so-called clear coat). Note that the "transparent film" here may mean a film through which light of at least a part of the wavelength band of visible light can pass. In this case, the pigment may have a property of not absorbing much visible light (i.e., reflecting it accordingly) so that the coating film SF becomes transparent. For example, the pigment may have a property that the absorptance of visible light is smaller than a predetermined fourth absorption threshold. An example of a dye that can adequately absorb invisible processed light EL while being transparent to visible light is, for example, a near-infrared absorbing dye manufactured by Spectrum Info (one example is tetrafluoroboronated 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indol-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium).

[0034] 1 again, in order to process the coating film SF, the processing system SYSa includes a processing device 1 and a control device 2. Furthermore, the processing device 1 includes a light irradiation device 11, a drive system 12, a storage device 13, a support device 14, a drive system 15, an exhaust device 16, a gas supply device 17, and a position measurement device 18.

[0035] The light irradiation device 11 can irradiate the coating film SF with processing light EL under the control of the control device 2. In order to irradiate the coating film SF with processing light EL, the light irradiation device 11 includes a light source system 111 capable of emitting the processing light EL and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the coating film SF, as shown in Fig. 3(a), which is a cross-sectional view that typically shows the structure of the light irradiation device 11.

[0036] The light source system 111, for example, simultaneously emits a plurality of processing lights EL. However, the light source system 111 may emit a single processing light EL. In this case, the light irradiation device 11 may emit a single processing light EL. In order to emit a plurality of processing lights EL, the light source system 111 includes a plurality of light sources 1111 as shown in FIG. 3(b), which is a cross-sectional view showing a schematic example of the structure of the light source system 111. The plurality of light sources 1111 are arranged in a line at equal intervals. Each light source 1111 emits pulsed light as the processing light EL. When the emission time width of the pulsed light (hereinafter referred to as the "pulse width") is shortened, the processing accuracy (for example, the formation accuracy of the riblet structure described later) is improved. Therefore, each light source 1111 may emit pulsed light with a relatively short pulse width as the processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width of 1000 nanoseconds or less as the processing light EL. For example, each light source 1111 may emit a pulsed light having a pulse width on the order of picoseconds as the processing light EL, or may emit a pulsed light having a pulse width on the order of femtoseconds as the processing light EL. Alternatively, as shown in FIG. 3(c), which is a cross-sectional view showing a schematic diagram of another example of the structure of the light source system 111, the light source system 111 may include a single light source 1111 and a splitter 1112 that splits the light from the single light source 1111 into multiple processing lights EL. The multiple exits from which the multiple processing lights EL branched by the splitter 1112 are respectively output are arranged in a row at equal intervals. Examples of the splitter 1112 include at least one of an optical fiber coupler, a waveguide splitter, a lens array, a diffractive optical element, and a spatial light modulator.

[0037] The optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. The multiple processing lights EL are irradiated onto the coating film SF via the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0038] The focus lens 1121 is an optical element that is composed of one or more lenses and adjusts the positions of at least some of the lenses along the optical axis direction to adjust the convergence position BF of the multiple processing lights EL (in other words, the light collecting position or the irradiation position in the optical axis direction, that is, the focal position of the optical system 112). The galvanometer mirror 1122 deflects the multiple processing lights EL so that the multiple processing lights EL scan the surface of the coating film SF (that is, the multiple target irradiation areas EA onto which the multiple processing lights EL are respectively irradiated move on the surface of the coating film SF). In other words, the galvanometer mirror 1122 can function as an irradiation position changing device that changes the irradiation positions of the multiple processing lights EL on the coating film SF with respect to the light irradiation device 11. The galvanometer mirror 1122 may cause the multiple processing lights ELk emitted by the optical system 112 to sweep the surface of the coating film SF. The galvanometer mirror 1122 includes an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scanning mirror 1122X reflects the multiple processing lights EL toward the Y-scanning mirror 1122Y. The X-scanning mirror 1122X can swing or rotate in the θY direction (i.e., the rotation direction around the Y axis). By the swing or rotation of the X-scanning mirror 1122X, the multiple processing lights EL scan the surface of the coating film SF along the X-axis direction. By the swing or rotation of the X-scanning mirror 1122X, the multiple target irradiation areas EA move along the X-axis direction on the coating film SF. The X-scanning mirror 1122X changes the relative positional relationship between the multiple target irradiation areas EA and the coating film SF along the X-axis direction. The Y-scanning mirror 1122Y reflects the multiple processing lights EL toward the fθ lens 1123. The Y-scanning mirror 1122Y can swing or rotate in the θX direction (i.e., the rotation direction around the X axis). By the swing or rotation of the Y-scanning mirror 1122Y, the multiple processing lights EL scan the surface of the coating film SF along the Y-axis direction. By swinging or rotating the Y-scanning mirror 1122Y, the multiple target irradiation areas EA move along the Y-axis direction on the coating film SF. The Y-scanning mirror 1122Y changes the relative positional relationship along the Y-axis direction between the multiple target irradiation areas EA and the coating film SF. The fθ lens 1123 is an optical element for focusing the multiple processing light beams EL from the galvanometer mirror 1122 on the coating film SF.

[0039] The fθ lens 1123 is a terminal optical element located on the light emission side of the optical system 112 (in other words, closest to the coating film SF or located at the end of the optical paths of the multiple processing lights EL) among the optical elements included in the optical system 112. However, the optical system 112 may include an optical element (e.g., a cover lens, etc.) provided on the light emission side of the fθ lens 1123. The fθ lens 1123 may be configured to be detachable from the optical system 112. As a result, after removing the old fθ lens 1123 from the optical system 112, it is possible to attach another fθ lens 1123 to the optical system 112. However, when the optical system 112 includes an optical element (e.g., a cover lens, etc.) provided on the emission side of the fθ lens 1123, the optical element becomes the terminal optical element, and the optical element may be configured to be detachable from the optical system 112.

[0040] The directions of travel of the multiple processing lights EL from the optical system 112 are, for example, parallel to each other. As a result, in the first embodiment, the coating film SF is simultaneously irradiated with multiple processing lights EL traveling in parallel to each other. In other words, multiple target irradiation areas EA are set simultaneously on the coating film SF. Therefore, the throughput for processing the coating film SF is improved compared to when a single processing light EL is irradiated to the coating film SF. Note that the directions of travel of the multiple processing lights EL from the optical system 112 do not have to be parallel to each other.

[0041] The light irradiation device 11 may not include the light source system 111. In this case, the light irradiation device 11 may irradiate the coating film SF with a plurality of processing lights EL emitted from the light source system 111 arranged outside the light irradiation device 11 using the optical system 112. Specifically, for example, as shown in FIG. 4, which is a cross-sectional view showing a schematic structure of the light irradiation device 11 not including the light source system 111, the light irradiation device 11 may receive a plurality of processing lights EL from the light source system 111 arranged outside the light irradiation device 11 via an optical transmission member 113 such as an optical fiber. The light irradiation device 11 may irradiate the coating film SF with a plurality of processing lights EL that have entered the light irradiation device 11 through the transmission member 113 using the optical system 112. Although FIG. 4 shows an example in which the optical system 112 is housed in the housing 114, the optical system 112 may not be housed in the housing 114. In other words, the light irradiation device 11 may or may not include the housing 114. Furthermore, even if the light irradiation device 11 includes the light source system 111, the optical system 112 may be housed in the housing 114, or the optical system 112 may not be housed in the housing 114. The light source system 111 may be housed in the housing 114, or the light source system 111 may not be housed in the housing 111. Here, as the light transmission member 113, a light pipe, a relay optical system including one or more lenses or mirrors, or the like may be used.

[0042] 1 again, the drive system 12 moves the light irradiation device 11 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed) under the control of the control device 2. That is, the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the multiple target irradiation areas EA onto which the multiple processing lights EL are respectively irradiated and the coating film SF is also changed. For this reason, it can be said that the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the multiple target irradiation areas EA and the coating film SF.

[0043] The driving system 12 may move the light irradiation device 11 along the surface of the coating film SF. In the example shown in FIG. 1, the surface of the coating film SF is a plane parallel to at least one of the X-axis and the Y-axis, so the driving system 12 may move the light irradiation device 11 along at least one of the X-axis and the Y-axis. As a result, the target irradiation area EA on the coating film SF moves along at least one of the X-axis and the Y-axis. That is, the range in which the light irradiation device 11 can irradiate the processing light EL is changed. The driving system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (i.e., the direction intersecting the surface of the coating film SF). In the example shown in FIG. 1, the thickness direction of the coating film SF is a direction along the Z-axis, so the driving system 12 may move the light irradiation device 11 along the Z-axis direction. The driving system 12 may move the light irradiation device 11 along at least one of the rotation directions of the θX direction, the θY direction, and the θZ direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis.

[0044] The drive system 12 supports the light irradiation device 11 and moves the supported light irradiation device 11. In this case, the drive system 12 may include, for example, a first support member that supports the light irradiation device 11 and a first moving mechanism that moves the first support member.

[0045] In the first embodiment, the drive system 12 includes a first drive system 121 and a second drive system 122. The first drive system 121 is attached to the second drive system 121. The first drive system 121 supports the second drive system 122. The light irradiation device 11 is attached to the second drive system 122 via a mounting member 19. The second drive system 122 supports the light irradiation device 11 via the mounting member 19. Therefore, the second drive system 122 may substantially function as a connection device that connects the first drive system 121 and the light irradiation device 11. The second drive system 122 may support the light irradiation device 11 without the mounting member 19. For example, the second drive system 122 may support the light irradiation device 11 by supporting the housing 114 shown in FIG. 4.

[0046] The first drive system 121 moves the second drive system 122 relative to the coating film SF under the control of the control device 2. That is, the first drive system 121 functions as a moving device that moves the second drive system 122 relative to the coating film SF. Since the light irradiation device 11 is attached to the second drive system 122, it can be said that the first drive system 121 moves the second drive system 122 to move the light irradiation device 11 relative to the coating film SF. That is, the first drive system 121 moves the light irradiation device 11 together with the second drive system 122. The second drive system 122 moves the second drive system 122 relative to the coating film SF under the control of the control device 2. That is, the second drive system 122 functions as a moving device that moves the light irradiation device 11 relative to the coating film SF.

[0047] Incidentally, the specific structures of the first drive system 121 and the second drive system 122 will be described in detail later (see FIGS. 5 and 6), and therefore detailed description thereof will be omitted here.

[0048] The storage device 13 includes a ceiling member 131 and a partition member 132. The ceiling member 131 is disposed on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-shaped member along the XY plane. The ceiling member 131 supports the drive system 12. Specifically, the first drive system 121 is attached to the ceiling member 131. That is, the ceiling member 131 supports the first drive system 121. Also, as described above, since the second drive system 122 is attached to the first drive system 121, the second drive system 122 is attached to the ceiling member 131 via the first drive system 121. That is, the ceiling member 131 supports the second drive system 122 via the first drive system 121. Also, as described above, since the light irradiation device 11 is attached to the second drive system 122, the light irradiation device 11 is attached to the ceiling member 131 via the first drive system 121 and the second drive system 122. The ceiling member 131 supports the light irradiation device 11 via the first drive system 121 and the second drive system 122. A partition member 132 is disposed on the outer edge (or in the vicinity thereof) of the surface on the -Z side of the ceiling member 131. The partition member 132 is a tubular (for example, cylindrical or rectangular tubular) member extending from the ceiling member 131 toward the -Z side. The space surrounded by the ceiling member 131 and the partition member 132 becomes a storage space SP for storing the light irradiation device 11 and the drive system 12. Therefore, the drive system 12 described above moves the light irradiation device 11 within the storage space SP. Furthermore, the storage space SP includes a space between the light irradiation device 11 and the coating film SF (particularly, a space including the optical path of the processing light EL). More specifically, the storage space SP includes a space between the terminal optical element (for example, the fθ lens 1123) of the light irradiation device 11 and the coating film SF (particularly, a space including the optical path of the processing light EL).

[0049] Each of the ceiling member 131 and the partition member 132 is a member capable of blocking the processing light EL. That is, each of the ceiling member 131 and the partition member 132 is opaque to the wavelength of the processing light EL. As a result, the processing light EL propagating in the storage space SP does not leak out to the outside of the storage space SP (that is, the outside of the storage device 13). Note that each of the ceiling member 131 and the partition member 132 may be a member capable of attenuating the processing light EL. That is, each of the ceiling member 131 and the partition member 132 may be semi-transparent to the wavelength of the processing light EL. Furthermore, each of the ceiling member 131 and the partition member 132 is a member that does not transmit (that is, can block) unnecessary substances generated by irradiation of the processing light EL. An example of the unnecessary substances is the vapor of the coating film SF. As a result, the unnecessary substances generated in the storage space SP do not leak out to the outside of the storage space SP (that is, the outside of the storage device 13).

[0050] An end 134 of the partition member 132 (specifically, an end on the coating film SF side, in the example shown in FIG. 1, an end on the -Z side) can come into contact with the surface of the coating film SF. When the end 134 comes into contact with the coating film SF, the accommodation device 13 (i.e., the ceiling member 131 and the partition member 132) cooperates with the coating film SF to maintain the airtightness of the accommodation space SP. When the end 134 comes into contact with the coating film SF, it is possible to change its shape (particularly, the shape of the contact surface of the end 134 that comes into contact with the coating film SF (in the example shown in FIG. 1, the surface on the -Z side), the same below) according to the shape of the surface of the coating film SF. For example, when the end 134 comes into contact with the coating film SF whose surface is flat, the shape of the end 134 becomes flat like the coating film SF. For example, when the end 134 comes into contact with the coating film SF whose surface is curved, the shape of the end 134 becomes curved like the coating film SF. As a result, the sealing performance of the accommodation space SP is improved compared to a case where the end 134 cannot change its shape according to the surface shape of the coating film SF. An example of the end 134 whose shape can be changed is an end 134 made of an elastic material such as rubber (in other words, a flexible material). Note that, for example, a bellows-shaped end having an elastic structure may be used as the end 134 whose shape can be changed.

[0051] The end 134 may be capable of adhering to the coating film SF while in contact with the coating film SF. For example, the end 134 may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. When the end 134 adheres to the coating film SF, the airtightness of the storage space SP is further improved compared to when the end 134 is not attached to the coating film SF. However, the end 134 does not have to be capable of adhering to the coating film SF. Even in this case, as long as the end 134 contacts the coating film SF, the airtightness of the storage space SP is still appropriately maintained.

[0052] The partition member 132 is a member that can expand and contract along the Z-axis direction by a driving system (for example, an actuator) (not shown) that operates under the control of the control device 2. For example, the partition member 132 may be a bellows-shaped member (so-called bellows). In this case, the partition member 132 can expand and contract by the expansion and contraction of the bellows portion. Alternatively, for example, the partition member 132 may include a telescopic pipe in which a plurality of hollow cylindrical members having different diameters are combined. In this case, the partition member 132 can expand and contract by the relative movement of the plurality of cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the partition member 132 extends along the Z-axis direction to have a relatively long length, and a first contracted state in which the partition member 132 contracts along the Z-axis direction to have a relatively short length.

[0053] When the partition member 132 is in the first extended state, the end 134 is in a first contact state in which it can come into contact with the coating film SF. On the other hand, when the partition member 132 is in the first contracted state, the end 134 is in a first non-contact state in which it does not come into contact with the coating film SF. In other words, when the partition member 132 is in the first contracted state, the end 134 is in a first non-contact state in which it is separated from the coating film SF on the +Z side. Note that the configuration for switching the state of the end 134 between the first contact state and the first non-contact state is not limited to the configuration for expanding and contracting the partition member 132. For example, the state of the end 134 may be switched between the first contact state and the first non-contact state by configuring the storage device 13 itself to be movable along the ±Z direction.

[0054] The accommodation device 13 further includes a detection device 135. The detection device 135 detects unnecessary substances in the accommodation space SP (i.e., substances generated by irradiation with the processing light EL). As will be described in detail later, the detection result of the detection device 135 is referred to by the control device 2 when changing the state of the partition member 132 from the first extended state to the first contracted state.

[0055] The support device 14 supports the storage device 13. Since the storage device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 essentially supports the drive system 12 and the light irradiation device 11 via the storage device 13. In order to support the storage device 13, the support device 14 includes a beam member 141 and a plurality of leg members 142. The beam member 141 is disposed on the +Z side of the storage device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the storage device 13 via a support member 143. A plurality of leg members 142 are disposed on the beam member 141. The leg member 142 is a rod-shaped member extending from the beam member 141 toward the -Z side.

[0056] An end 144 of the leg member 142 (specifically, an end on the coating film SF side, in the example shown in FIG. 1, an end on the -Z side) can come into contact with the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (i.e., by the workpiece S). That is, the support device 14 supports the storage device 13 with the end 144 in contact with the coating film SF (in other words, with the support device 14 supported by the coating film S). When the end 144 comes into contact with the coating film SF, similar to the end 134 of the storage device 13, the shape of the end 144 (particularly, the shape of the contact surface of the end 144 that comes into contact with the coating film SF (in the example shown in FIG. 1, the surface on the -Z side), the same applies below) may be changed according to the shape of the surface of the coating film SF. The end 144 may be attached to the coating film SF in a state of contact with the coating film SF. For example, the end 144 may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. When the end 144 is attached to the coating film SF, the stability of the support device 14 is improved compared to a case in which the end 144 is not attached to the coating film SF. However, the end 144 does not have to be able to be attached to the coating film SF.

[0057] The beam member 141 is a member that can be extended and retracted along at least one of the X-axis and Y-axis (or along any direction along the XY plane) by the drive system 15 that operates under the control of the control device 2. For example, the beam member 141 may include a telescopic pipe in which multiple tubular members having different diameters are combined. In this case, the beam member 141 can be extended and retracted by the relative movement of the multiple tubular members.

[0058] The leg member 142 is a member that can be extended and retracted along the Z-axis direction by the drive system 15 that operates under the control of the control device 2. For example, the leg member 142 may include a telescopic pipe in which a plurality of tubular members having different diameters are combined. In this case, the leg member 142 can be extended and retracted by the relative movement of the plurality of tubular members. The state of the leg member 142 can be set to at least a second extended state in which the leg member 142 extends along the Z-axis direction and thus has a relatively long length, and a second contracted state in which the leg member 142 contracts along the Z-axis direction and thus has a relatively short length. When the leg member 142 is in the second extended state, the end portion 144 is in a second contact state in which it can come into contact with the coating film SF. On the other hand, when the leg member 142 is in the second contracted state, the end portion 144 is in a second non-contact state in which it does not come into contact with the coating film SF. In other words, when the leg member 142 is in the second contracted state, the end portion 144 is in a second non-contact state in which it is separated from the coating film SF on the +Z side.

[0059] The driving system 15 moves the supporting device 14 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed) under the control of the control device 2. That is, the driving system 15 moves the supporting device 14 relative to the coating film SF so as to change the relative positional relationship between the supporting device 14 and the coating film SF. Since the supporting device 14 supports the storage device 13, the driving system 15 essentially moves the supporting device 14 to move the storage device 13 relative to the coating film SF. That is, the driving system 15 essentially moves the supporting device 14 relative to the coating film SF so as to change the relative positional relationship between the storage device 13 and the coating film SF. Furthermore, the storage device 13 supports the light irradiation device 11 via the driving system 12. Therefore, the driving system 15 essentially moves the supporting device 14 to move the light irradiation device 11 relative to the coating film SF. That is, the drive system 15 can move the support device 14 with respect to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. In other words, the drive system 15 can move the support device 14 with respect to the coating film SF so as to change the relative positional relationship between the multiple target irradiation areas EA and the coating film SF.

[0060] The driving system 15 expands and contracts the beam members 141 under the control of the control device 2 in order to move the support device 14. Furthermore, the driving system 15 expands and contracts the multiple leg members 142 under the control of the control device 2 in order to move the support device 14. The manner in which the support device 14 is moved by the driving system 15 will be described in detail later with reference to Figures 9 to 20.

[0061] The exhaust device 16 is connected to the accommodation space SP via an exhaust pipe 161. The exhaust device 16 can exhaust the gas in the accommodation space SP. In particular, the exhaust device 16 can suck the unnecessary substances generated by the irradiation of the processing light EL from the accommodation space SP to the outside of the accommodation space SP by exhausting the gas in the accommodation space SP. In particular, if the unnecessary substances are present on the optical path of the processing light EL, they may affect the irradiation of the processing light EL to the coating film SF. For this reason, the exhaust device 16 particularly sucks the unnecessary substances together with the gas in the space from the space including the optical path of the processing light EL between the terminal optical element of the optical system 112 and the coating film SF. The unnecessary substances sucked from the accommodation space SP by the exhaust device 16 are discharged to the outside of the processing device 1 through the filter 162. The filter 162 adsorbs the unnecessary substances. The filter 162 may be detachable or replaceable.

[0062] The gas supply device 17 is connected to the accommodation space SP via an intake pipe 171. The gas supply device 17 can supply gas to the accommodation space SP. The gas to be supplied to the accommodation space SP can be at least one of the atmosphere, CDA (clean dry air), and an inert gas. An example of the inert gas is nitrogen gas. In the first embodiment, the gas supply device 17 supplies CDA. Therefore, the accommodation space SP becomes a space purged by CDA. At least a part of the CDA supplied to the accommodation space SP is sucked in by the exhaust device 16. The CDA sucked in by the exhaust device 16 from the accommodation space SP passes through a filter 162 and is discharged to the outside of the processing system SYSa.

[0063] The gas supply device 17 particularly supplies a gas such as CDA to the optical surface 1124 on the side of the accommodation space SP of the fθ lens 1123 shown in FIG. 3 (i.e., the optical surface on the side of the accommodation space SP of the terminal optical element of the optical system 112). Since the optical surface 1124 faces the accommodation space SP, it may be exposed to unnecessary substances generated by irradiation with the processing light EL. As a result, the unnecessary substances may adhere to the optical surface 1124. Furthermore, since the processing light EL passes through the optical surface 1124, the unnecessary substances adhered to the optical surface 1124 may be burned (i.e., fixed) by the processing light EL passing through the optical surface 1124. The unnecessary substances attached (and further fixed) to the optical surface 1124 may become stains on the optical surface 1124 and may affect the characteristics of the processing light EL. However, when a gas such as CDA is supplied to the optical surface 1124, contact between the optical surface 1124 and the unnecessary substances is prevented. This prevents dirt from adhering to the optical surface 1124. Therefore, the gas supply device 17 also functions as an adhesion prevention device that prevents dirt from adhering to the optical surface 1124. Furthermore, even if dirt has adhered (or even become stuck) to the optical surface 1124, the dirt may be removed (e.g., blown away) by the CDA supplied to the optical surface 1124. Therefore, the gas supply device 17 may also function as an adhesion prevention device that removes dirt adhering to the optical surface 1124.

[0064] The position measuring device 18 measures the relative positional relationship between the coating film SF and the light irradiation device 11. That is, the position measuring device 18 measures the relative positional relationship between the workpiece S and the light irradiation device 11. In the first embodiment, the position measuring device 18 measures the position of the coating film SF relative to the light irradiation device 11. That is, the position measuring device 18 measures the position of the workpiece S relative to the light irradiation device 11.

[0065] In order to measure the position of the coating film SF (i.e., the position of the workpiece S, the same applies below) relative to the light irradiation device 11, the position measuring device 18 may measure the coating film SF. That is, the position measuring device 18 may measure the workpiece SF. In this case, the position measuring device 18 may be called an object measuring device because it measures an object including at least one of the coating film SF and the workpiece S.

[0066] The position measurement device 18 may be disposed at a fixed position with respect to the light irradiation device 11 (particularly, the optical system 112). The position measurement device 18 may be disposed at a position where the relative position with respect to the light irradiation device 11 is fixed. The position measurement device 18 may be disposed at a position where the relative position between the light irradiation device 11 and the position measurement device 18 does not change even if the drive system 12 moves the light irradiation device 11. For example, FIG. 1 shows an example where the position measurement device 18 is attached to a mounting member 19 to which the light irradiation device 11 is attached. However, the position measurement device 18 may be attached to a member different from the mounting member 19. For example, the position measurement device 18 may be attached to the light irradiation device 11. For example, the position measurement device 18 may be attached to the above-mentioned housing 114 (see FIG. 4).

[0067] When the position measuring device 18 is disposed at a fixed position relative to the light irradiation device 11, the output from the position measuring device 18 (i.e., the measurement result of the position measuring device 18) includes information on the position of the coating film SF relative to the light irradiation device 11. Specifically, the measurement result of the position measuring device 18 includes information on the position of the coating film SF relative to the position measuring device 18. In other words, the measurement result of the position measuring device 18 includes information on the position of the coating film SF in the measurement coordinate system of the position measuring device 18. Here, when the position measuring device 18 is disposed at a fixed position relative to the light irradiation device 11, the information on the position of the coating film SF relative to the position measuring device 18 substantially includes information on the position of the coating film SF relative to the light irradiation device 11 that is disposed at a fixed position relative to the position measuring device 18. Therefore, the control device 2 can appropriately identify the position of the coating film SF relative to the light irradiation device 11.

[0068] The position measuring device 18 may be any type of measuring device as long as it can measure the coating film SF. For example, the position measuring device 18 may include an imaging device (i.e., a camera) capable of imaging an object such as the coating film SF. The position measuring device 18 may include an irradiation device that irradiates the coating film SF with measurement light that draws a predetermined pattern on the coating film SF, and an imaging device that images the pattern drawn on the coating film SF by the measurement light. In this way, the position measuring device 18 may be a measuring device that measures the coating film SF by a non-contact method (for example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method). Note that a plurality of position measuring devices 18 may be provided. In this case, the measurement axes of the position measuring devices 18 (typically optical axes in an optical measurement method such as an imaging method) may be mutually intersecting (or twisted) or may be parallel (or coaxial).

[0069] The control device 2 controls the overall operation of the processing system SYSa. In particular, the control device 2 controls the light irradiation device 11, the drive system 12, the accommodation device 13, and the drive system 15 so that a recess C having a desired shape is formed at a desired position, as will be described later in detail.

[0070] The control device 2 may include, for example, a central processing unit (CPU) (or a graphics processing unit (GPU) in addition to or instead of the CPU) and a memory. The control device 2 functions as a device that controls the operation of the machining system SYSa by the CPU executing a computer program. This computer program is a computer program for making the control device 2 (e.g., the CPU) perform (i.e., execute) the operation to be performed by the control device 2, which will be described later. In other words, this computer program is a computer program for making the control device 2 function so as to make the machining system SYSa perform the operation to be described later. The computer program executed by the CPU may be recorded in a memory (i.e., a recording medium) provided in the control device 2, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 2 or externally attachable to the control device 2. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 2 via a network interface.

[0071] The control device 2 may not be provided inside the processing system SYSa, and may be provided as a server or the like outside the processing system SYSa. In this case, the control device 2 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB, may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be mentioned. As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control device 2 and the processing system SYSa may be configured to be able to transmit and receive various information via the network. The control device 2 may be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 2 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 2 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 2 may be provided outside the processing system SYSa.

[0072] As a recording medium for recording the computer program executed by the CPU, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), and other optical disks, magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 2 by the control device 2 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 2, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0073] (1-2) Structure of drive system 12 Next, a description will be given of the structure of the drive system 12. As described above, the drive system 12 includes the first drive system 121 and the second drive system 122, and therefore, hereinafter, the structures of the first drive system 121 and the second drive system 122 will be described in that order.

[0074] (1-2-1) Structure of drive system 121 First, the structure of the first drive system 121 will be described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing the structure of the first drive system 121.

[0075] As shown in FIG. 5, the first drive system 121 includes a base 1211 and an arm drive system 1212 .

[0076] The base 1211 is attached to the ceiling member 131 of the storage device 13. The arm drive system 1212 is attached to the base 1211. The base 1211 supports the arm drive system 1212. The base 1211 is used as a base member for supporting the arm drive system 1212.

[0077] The arm drive system 1212 includes a plurality of arm members 12121. The plurality of arm members 12121 are connected to each other so as to be able to swing freely via at least one joint member 12122. Therefore, the arm drive system 1212 is a robot having a so-called vertical multi-joint structure. The arm drive system 1212 may include a single joint (i.e., a drive shaft defined by the joint member 12122). Alternatively, the arm drive system 1212 may include a plurality of joints. FIG. 5 shows an example in which the arm drive system 1212 includes three joints. The two arm members 12121 connected to each other via the respective joints swing by the actuators 12123 corresponding to the respective joints. FIG. 5 shows an example in which the arm drive system 1212 includes three actuators 12123 corresponding to the three joints. As a result, at least one arm member 12121 moves. Therefore, at least one arm member 12121 can move relative to the coating film SF. In other words, the at least one arm member 12121 is movable so that the relative positional relationship between the at least one arm member 12121 and the coating film SF can be changed.

[0078] A second drive system 122 is attached to the arm drive system 1212. Specifically, the second drive system 122 is attached to one of the arm members 12121 that is located at a position farthest from the base 1211. For ease of explanation, the one arm member 12121 to which the second drive system 122 is attached will be referred to as the distal arm member 12124 below. The second drive system 122 may be directly attached to the distal arm member 12124, or may be indirectly attached to the distal arm member 12124 via another member (for example, an attachment member 1213 to be described with reference to FIG. 30 in a sixth embodiment to be described later).

[0079] When the distal arm member 12124 is moved by the actuator 12123 described above, the second driving system 122 attached to the distal arm member 12124 also moves. Therefore, the arm driving system 1212 (i.e., the first driving system 121) can move the second driving system 122. Specifically, the arm driving system 1212 can move the second driving system 122 relative to the coating film SF. The arm driving system 1212 can move the second driving system 122 so that the relative positional relationship between the second driving system 122 and the coating film SF is changed. In addition, when the second driving system 122 moves, the light irradiation device 11 attached to the second driving system 122 also moves. Therefore, the arm driving system 1212 (i.e., the first driving system 121) can move the light irradiation device 11.

[0080] The control device 2 may control the arm driving system 1212 based on the measurement result of the position measurement device 18. Specifically, the control device 2 may obtain information on the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement result of the position measurement device 18, and control the arm driving system 1212 based on the information on the relative positional relationship between the coating film SF and the light irradiation device 11. If the position measurement device 18 is equipped with an imaging device, the control device 2 may control the arm driving system 1212 using visual servo based on the measurement result of the position measurement device 18 (i.e., an image captured by the imaging device). The visual servo may be called vision servo. The light irradiation device 11 may also be equipped with an acceleration sensor as a motion measurement sensor for measuring its vibration. In this case, the control device 2 may control the arm driving system 1212 based on the measurement result of the acceleration sensor.

[0081] As an example, the control device 2 may control the arm drive system 1212 so that the light irradiation device 11 moves relative to the coating film SF. That is, the control device 2 may control the arm drive system 1212 so as to change the relative position between the light irradiation device 11 and the coating film SF. In this case, the control device 2 may control the arm drive system 1212 so as to align the coating film SF with the light irradiation device 11. The control device 2 may control the arm drive system 1212 so as to align the coating film SF with the target irradiation area EA onto which the processing light EL is irradiated from the light irradiation device 11. As an example, the control device 2 may control the arm drive system 1212 so that the target irradiation area EA is set at a desired position on the coating film SF (i.e., the processing light EL is irradiated). The control device 2 may control the arm drive system 1212 so that the target irradiation area EA moves along a desired path on the coating film SF. The control device 2 may control the arm drive system 1212 using an output from an encoder that is provided at a joint portion of the arm drive system 1212 and detects angles between a plurality of arm members 12121.

[0082] In addition, in the first embodiment, "the relative position between the light irradiation device 11 and the coating film SF" means the relative position between the light irradiation device 11 and the coating film SF in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, around the X-axis (i.e., the rotation direction corresponding to the θX direction), around the Y-axis (i.e., the rotation direction corresponding to the θY direction), and around the Z-axis (i.e., the rotation direction corresponding to the θZ direction). In other words, "the relative position between the light irradiation device 11 and the coating film SF" in the first embodiment may also include the relative attitude between the light irradiation device 11 and the coating film SF.

[0083] Since the relative position between the target irradiation area EA and the coating film SF is changed when the relative position between the light irradiation device 11 and the coating film SF is changed, the position measurement device 18 may measure the relative position between the coating film SF and the irradiation position of the processing light EL (e.g., the irradiation position of the processing light EL on the coating film SF) in addition to or instead of measuring the relative positional relationship between the light irradiation device 11 and the coating film SF. For example, the position measurement device 18 may measure the irradiation position of the processing light EL on the coating film SF during at least a part of the period during which the light irradiation device 11 irradiates the coating film SF with the processing light EL. For example, the position measurement device 18 may measure the irradiation position of the processing light EL on the coating film SF (i.e., the position where the processing light EL is actually irradiated, e.g., the position of the part processed by the processing light EL) after the light irradiation device 11 finishes irradiating the coating film SF with the processing light EL. For example, after the light irradiation device 11 finishes irradiating the processing light EL on a sensitive member (specifically, a member whose characteristics change when irradiated with the processing light EL, for example, a sensitive member PE described in a third embodiment described later) formed on the coating film SF, the position measurement device 18 may measure the irradiation position of the processing light EL on the sensitive member (i.e., the position of a portion of the sensitive member whose characteristics have changed when irradiated with the processing light EL). Even in this case, the control device 2 may control the arm drive system 1212 to align the coating film SF with the light irradiation device 11 (i.e., align the coating film SF with the target irradiation area EA) based on the measurement result of the position measurement device 18. Note that the position measurement device 18 may measure the irradiation position of the processing light EL itself. In this case, the position measurement device 18 may measure the light of the wavelength of the processing light EL.

[0084] The first drive system 121 is not limited to an articulated robot, and may have any structure as long as it is possible to move the second drive system 122 relative to the coating film SF. For example, the first drive system 121 may be an orthogonal multi-axis moving body in which a plurality of linear guides are combined. For example, the first drive system 121 may be an orthogonal two-axis moving body in which a first linear guide is provided along a first direction in a predetermined plane, and a second linear guide is provided on the moving body (first moving block) of the first linear guide along a second direction intersecting (typically perpendicular) with the first direction. In this case, the second drive system may be attached to the moving body (second moving block) of the second linear guide. Also, a third linear guide may be provided on the moving body (second moving block) of the second linear guide in the above-mentioned orthogonal two-axis moving body along a third direction intersecting with the above-mentioned predetermined plane. In such an orthogonal three-axis moving body, the second drive system 122 may be attached to the moving body (third moving block) of the third linear guide.

[0085] (1-2-2) Structure of the second drive system 122 Next, the structure of the second drive system 122 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing the structure of the second drive system 122.

[0086] As shown in FIG. 6, the second driving system 122 includes a support member 1221 , a support member 1222 , an air spring 1223 , a damper member 1224 , and a driving member 1225 .

[0087] The support member 1221 is attached to the first driving system 121. Specifically, the support member 1221 is attached to the distal arm member 12124 of the first driving system 121. The support member 1221 is fixed to the distal arm member 12124 so that the attached surface 1221a of the support member 1221 and the attachment surface 12124a formed at the tip of the distal arm member 12124 come into contact with each other. Here, the attachment surface 12124a can be regarded as a part that moves with respect to the coating film SF as an object. The support member 1222 is attached to the light irradiation device 11 via the attachment member 19. The support member 1222 is fixed to the attachment member 19 so that the attached surface 1222a of the support member 1222 and the first attachment surface 19a of the attachment member 19 come into contact with each other. The light irradiation device 11 is fixed to the mounting member 19 so that a second mounting surface 19b of the mounting member 19 and a mounted surface 11a formed on a part of the outer surface of the light irradiation device 11 come into contact with each other.

[0088] The support member 1221 and the support member 1222 are coupled (in other words, linked or connected) via the air spring 1223, the damper member 1224, and the drive member 1225. Specifically, the air spring 1223, the damper member 1224, and the drive member 1225 are disposed between a second surface (a surface on the -Z side in the example shown in FIG. 6) opposite to a first surface (a surface on the +Z side in the example shown in FIG. 6) on which the first drive system 121 is attached of the support member 1221, and a fourth surface (a surface on the +Z side in the example shown in FIG. 6) opposite to a third surface (a surface on the -Z side in the example shown in FIG. 6) on which the mounting member 19 is attached of the support member 1222, so as to couple the support member 1221 and the support member 1222. In other words, the air spring 1223, the damper member 1224, and the driving member 1225 are attached to the supporting members 1221 and 1222, respectively, so as to couple the supporting members 1221 and 1222. Since the first driving system 121 is attached to the supporting member 1221 and the light irradiation device 11 is attached to the supporting member 1222, it can be said that the air spring 1223, the damper member 1224, and the driving member 1225 are essentially attached to the supporting members 1221 and 1222, respectively, so as to couple the first driving system 121 and the light irradiation device 11.

[0089] The air spring 1223 applies an elastic force caused by the pressure of a gas (air, for example) to at least one of the support members 1221 and 1222 under the control of the control device 2. The air spring 1223 applies an elastic force caused by the pressure of the gas to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222 under the control of the control device 2. In particular, the air spring 1223 may apply an elastic force caused by the pressure of the gas to at least one of the support members 1221 and 1222 along a direction in which the support members 1221 and 1222 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 6). That is, the air spring 1223 may apply an elastic force caused by gas pressure to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly the distal arm member 12124) and the light irradiation device 11 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 6). The air spring 1223 may be referred to as an elastic member.

[0090] In order to impart an elastic force caused by the gas pressure, gas is supplied to the air spring 1223 from a gas supply device 12261 via a pipe 12262 and a valve 12263. The control device 2 controls at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of a pressure gauge 1226 that measures the pressure of the aircraft body in the air spring 1223. It is noted that the gas supply device 12261, the pipe 12262, and the valve 12263 may be omitted. In this case, the air spring 1223 may impart an elastic force caused by the internal gas pressure to at least one of the support members 1221 and 1222, regardless of the control of the control device 2.

[0091] The air spring 1223 may support the weight of the support member 1222 by using an elastic force under the control of the control device 2. Specifically, the air spring 1223 may support the weight of the support member 1222 by using an elastic force along the direction in which the support members 1221 and 1222 are aligned. Since the light irradiation device 11 is attached to the support member 1222, the air spring 1223 may support the weight of the light irradiation device 11 attached to the support member 1222 by using an elastic force. Specifically, the air spring 1223 may support the weight of the light irradiation device 11 by using an elastic force along the direction in which the first drive system 121 (particularly, the distal arm member 12124) and the light irradiation device 11 are aligned. In this case, the air spring 1223 may function as a weight canceller that cancels the weight of the light irradiation device 11. The air spring 1223 may support the weight of the support member 1222 by using an elastic force, regardless of the control of the control device 2.

[0092] The air spring 1223 may use elastic force to reduce vibrations transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 under the control of the control device 2. That is, the air spring 1223 may use elastic force to damp vibrations transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122. Specifically, the air spring 1223 may use elastic force to reduce (dampen) vibrations traveling (i.e., transmitted) from the first drive system 121 to the light irradiation device 11 via the second drive system 122. That is, the air spring 1223 may use elastic force to reduce (dampen) vibrations traveling from a portion of the first drive system 121 to which the second drive system 122 is attached (i.e., the distal arm portion 12124) to a portion of the light irradiation device 11 to which the second drive system 122 is attached. In this case, the control device 2 may control at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of the pressure gauge 1226 so that the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 is reduced (i.e., damped). The air spring 1223 (or the second drive system 122 including the air spring 1223) may be referred to as a vibration reduction device or a vibration damping device. The air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by utilizing an elastic force, regardless of the control of the control device 2.

[0093] Reducing the vibration from the first drive system 121 to the light irradiation device 11 may include reducing (i.e., making smaller) the vibration amount of the light irradiation device 11 than the vibration amount (i.e., the amplitude of vibration) of the first drive system 121. Reducing the vibration from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the part of the light irradiation device 11 to which the second drive system 122 is attached than the vibration amount of the part of the first drive system 121 to which the second drive system 122 is attached (i.e., the distal arm part 12124). Reducing the vibration from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the support member 1222 to which the light irradiation device 11 is attached than the vibration amount of the support member 1221 to which the first drive system 121 is attached. In addition, when the air spring 1223 does not reduce the vibration from the first drive system 121 to the light irradiation device 11, the vibration amount of the first drive system 121 and the vibration amount of the light irradiation device 11 become substantially the same. In other words, the vibration amount of the support member 1121 and the vibration amount of the support member 1122 become substantially the same. For this reason, reducing the vibration from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the light irradiation device 11 compared to the case where the vibration from the first drive system 121 to the light irradiation device 11 is not reduced. Reducing the vibration from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the support member 1122 compared to the case where the vibration from the first drive system 121 to the light irradiation device 11 is not reduced. In addition, the vibration amount referred to here may mean the vibration amount for some object. For example, the vibration amount of the first drive system 121, the vibration amount of the light irradiation device 11, the vibration amount of the support member 1221 and the vibration amount of the support member 1222 may respectively mean the vibration amount of the first drive system 121 relative to the coating film SF (or the workpiece SF, same below), the vibration amount of the light irradiation device 11 relative to the coating film SF, the vibration amount of the support member 1221 relative to the coating film SF and the vibration amount of the support member 1222 relative to the coating film SF.

[0094] The damper member 1224 imparts an elastic force caused by a factor other than air pressure to at least one of the support members 1221 and 1222. The damper member 1224 imparts an elastic force caused by a factor other than air pressure to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222. In particular, the damper member 1224 may impart an elastic force to at least one of the support members 1221 and 1222 along a direction in which the support members 1221 and 1222 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 6). That is, the damper member 1224 may apply an elastic force to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly the distal arm member 12124) and the light irradiation device 11 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 6). The damper member 1224 may be referred to as an elastic member.

[0095] The damper member 1224 may be any member capable of applying elastic force. For example, the damper member 1224 may include a compression spring coil. For example, the damper member 1224 may include a leaf spring.

[0096] The damper member 1224 may support the weight of the support member 1222 by using an elastic force. Specifically, the damper member 1224 may support the weight of the support member 1222 by using an elastic force along the direction in which the support member 1221 and the support member 1222 are aligned. Since the light irradiation device 11 is attached to the support member 1222, the damper member 1224 may support the weight of the light irradiation device 11 attached to the support member 1222 by using an elastic force. Specifically, the damper member 1224 may support the weight of the light irradiation device 11 by using an elastic force along the direction in which the first drive system 121 (particularly, the distal arm member 12124) and the light irradiation device 11 are aligned. In this case, the damper member 1224 may function as a weight canceller that cancels the weight of the light irradiation device 11.

[0097] The damper member 1224 may use elastic force to reduce vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122. That is, the damper member 1224 may use elastic force to attenuate vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122. Specifically, the damper member 1224 may use elastic force to reduce (attenuate) vibration traveling (that is, transmitted) from the first drive system 121 to the light irradiation device 11 via the second drive system 122. For this reason, the damper member 1224 (or the second drive system 122 including the damper member 1224) may be referred to as a vibration reduction device or a vibration damping device.

[0098] The damper member 1224 may convert the vibration of the air spring 1223 into a damped vibration by using an elastic force. In other words, the damper member 1224 may convert the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 into a damped vibration by using an elastic force.

[0099] The driving member 1225 can generate a driving force under the control of the control device 2. The driving member 1225 can impart the generated driving force to at least one of the support members 1221 and 1222. The driving member 1225 can impart the generated driving force to at least one of the first driving system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222. The driving member 1225 may have any structure as long as it can generate a driving force. For example, the driving member 1225 may have a structure capable of electrically generating a driving force. For example, the driving member 1225 may have a structure capable of magnetically generating a driving force. As an example, FIG. 6 shows an example in which the driving member 1225 is a voice coil motor (VCM) capable of electrically generating a driving force. Note that while a voice coil motor is a type of linear motor, the driving member 1225 may be a linear motor different from the voice coil motor. The drive member 1225 may generate a driving force along a linear axis.

[0100] The driving member 1225 may have a structure in which a member of the driving member 1225 attached to the support member 1221 does not come into physical contact with a member of the driving member 1225 attached to the support member 1222. For example, when the driving member 1225 is a voice coil motor, a member of the driving member 1225 attached to the support member 1221 (e.g., a member including either a coil or a magnetic pole) does not come into physical contact with a member of the driving member 1225 attached to the support member 1222 (e.g., a member including the other of a coil or a magnetic pole).

[0101] The driving member 1225 may move at least one of the support members 1221 and 1222 using a driving force under the control of the control device 2. The driving member 1225 may move at least one of the support members 1221 and 1222 using a driving force under the control of the control device 2, thereby moving at least one of the first driving system 121 and the light irradiation device 11. In this case, the driving member 1225 may change the relative position between the first driving system 121 and the light irradiation device 11 by moving at least one of the first driving system 121 and the light irradiation device 11 using a driving force. Note that the "relative position between the first driving system 121 and the light irradiation device 11" in the first embodiment means the relative position between the first driving system 121 and the light irradiation device 11 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis. That is, the "relative position between the first drive system 121 and the light irradiation device 11" in the first embodiment may also include the relative posture between the first drive system 121 and the light irradiation device 11. In this case, it can be said that the second drive system 122 including the drive member 1225 connects the first drive system 121 and the light irradiation device 11 so that the relative position between the first drive system 121 and the light irradiation device 11 can be changed. That is, it can be said that the above-mentioned air spring 1223 and the damper member 1224 (and further, the drive member 1225) connect the first drive system 121 and the light irradiation device 11 so that the relative position between the first drive system 121 and the light irradiation device 11 can be changed by the drive member 1225. Incidentally, the drive member 1225 may be referred to as a position changing device.

[0102] The driving member 1225 may change the relative position between the first driving system 121 and the light irradiation device 11 under the control of the control device 2 based on the measurement result of the position measurement device 1227 included in the second driving system 122. The position measurement device 1226 measures the relative position between the first driving system 121 and the light irradiation device 11. For example, the position measurement device 1226 may be an encoder including a detection unit 12261 attached to the support member 1221 and a scale unit 12262 attached to the support member 1222. The measurement result of the position measurement device 1226 includes information regarding the relative position between the support member 1221 and the support member 1222. Since the first driving system 121 is attached to the support member 1221 and the light irradiation device 11 is attached to the support member 1222, the information regarding the relative position between the support member 1221 and the support member 1222 includes information regarding the relative position between the first driving system 121 and the light irradiation device 11. Therefore, the control device 2 can appropriately identify the relative position between the first drive system 121 and the light irradiation device 11. As a result, the control device 2 can appropriately change the relative position between the first drive system 121 and the light irradiation device 11 based on the measurement result of the position measurement device 1227.

[0103] The driving member 1225 may change the relative position between the first driving system 121 and the light irradiation device 11 (typically, move the light irradiation device 11 with respect to the first driving system 121) under the control of the control device 2, thereby moving the light irradiation device 11 with respect to the coating film SF. The driving member 1225 may move the light irradiation device 11 so that the relative positional relationship between the light irradiation device 11 and the coating film SF is changed. In this case, the control device 2 may control the driving member 1225 based on the measurement result of the position measurement device 18 in addition to the measurement result of the position measurement device 1227. Specifically, the control device 2 may obtain information regarding the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement result of the position measurement device 18, and control the driving member 1225 based on the information regarding the relative positional relationship between the coating film SF and the light irradiation device 11. For example, the control device 2 may control the driving member 1225 so that the light irradiation device 11 moves with respect to the coating film SF. That is, the control device 2 may control the driving member 1225 to change the relative position between the light irradiation device 11 and the coating film SF. At this time, the control device 2 may control the driving member 1225 to align the coating film SF with the light irradiation device 11. The control device 2 may control the driving member 1225 to align the coating film SF with the target irradiation area EA to which the processing light EL is irradiated from the light irradiation device 11. As an example, the control device 2 may control the driving member 1225 to set the target irradiation area EA at a desired position on the coating film SF (i.e., the processing light EL is irradiated). The control device 2 may control the driving member 1225 to move the target irradiation area EA along a desired path on the coating film SF.

[0104] Here, as described above, the first drive system 121 can also move the light irradiation device 11 relative to the coating film SF, similarly to the second drive system 122. That is, the processing apparatus 1 can move the light irradiation device 11 using both or either one of the first drive system 121 and the second drive system 122. In this case, the movement mode of the light irradiation device 11 by the first drive system 121 may be different from the movement mode of the light irradiation device 11 by the second drive system 122. For example, the positioning accuracy of the light irradiation device 11 by the first drive system 121 may be lower than the positioning accuracy of the light irradiation device 11 by the second drive system 122. That is, the positioning accuracy of the light irradiation device 11 by the second drive system 122 may be higher than the positioning accuracy of the light irradiation device 11 by the first drive system 121. For example, the accuracy of movement of the light irradiation device 11 by the first drive system 121 (i.e., the accuracy of changing the relative position between the coating film SF and the light irradiation device 11) may be lower than the accuracy of movement of the light irradiation device 11 by the second drive system 122. That is, the accuracy of movement of the light irradiation device 11 by the second drive system 122 may be higher than the accuracy of movement of the light irradiation device 11 by the first drive system 121. For example, the range of movement of the light irradiation device 11 by the first drive system 121 may be larger than the range of movement of the light irradiation device 11 by the second drive system 122. That is, the range of movement of the light irradiation device 11 by the second drive system 122 may be smaller than the range of movement of the light irradiation device 11 by the first drive system 121. For example, the amount of movement of the light irradiation device 11 by the first drive system 121 (i.e., the amount of change in the relative position between the coating film SF and the light irradiation device 11) may be greater than the amount of movement of the light irradiation device 11 by the second drive system 122. That is, the amount of movement of the light irradiation device 11 by the second drive system 122 may be less than the amount of movement of the light irradiation device 11 by the first drive system 121. In this case, the control device 2 may control the first drive system 121 to align the light irradiation device 11 with respect to the coating film SF with a first accuracy, and control the second drive system 122 to align the light irradiation device 11 with respect to the coating film SF with a second accuracy higher than the first accuracy. That is, the control device 2 may control the first drive system 121 to roughly align the light irradiation device 11 with respect to the coating film SF, and control the second drive system 122 to align the light irradiation device 11 with high accuracy with respect to the coating film SF.The positioning accuracy of the light irradiation device 11 by the first drive system 121 can be considered to be substantially equivalent to the positioning accuracy of the tip arm member 12124 by the first drive system 121. The movement accuracy of the light irradiation device 11 by the first drive system 121 can be considered to be substantially equivalent to the movement accuracy of the tip arm member 12124 by the first drive system 121. The movement range of the light irradiation device 11 by the first drive system 121 can be considered to be substantially equivalent to the movement range of the tip arm member 12124 by the first drive system 121. The movement amount of the light irradiation device 11 by the first drive system 121 can be considered to be substantially equivalent to the movement amount of the tip arm member 12124 by the first drive system 121.

[0105] The driving member 1225 may reduce vibration transmitted between the first driving system 121 and the light irradiation device 11 via the second driving system 122 by changing the relative position between the first driving system 121 and the light irradiation device 11 using the driving force under the control of the control device 2. That is, the driving member 1225 may damp vibration transmitted between the first driving system 121 and the light irradiation device 11 via the second driving system 122 using the driving force. Specifically, the driving member 1225 may reduce (dampen) vibration traveling (i.e., transmitted) from the first driving system 121 to the light irradiation device 11 via the second driving system 122 using the driving force. For this reason, the driving member 1225 (or the second driving system 122 including the driving member 1225) may be referred to as a vibration reduction device or a vibration damping device.

[0106] The driving member 1225 may convert the vibration of the air spring 1223 into damped vibration by changing the relative position between the first driving system 121 and the light irradiation device 11 using the driving force. That is, the driving member 1225 may convert the vibration transmitted between the first driving system 121 and the light irradiation device 11 via the second driving system 122 into damped vibration using the driving force. In this case, it can be said that the driving member 1225 reduces the relative displacement amount between the first driving system 121 and the light irradiation device 11 caused by the vibration from the first driving system 121 toward the light irradiation device 11 using the driving force. Specifically, it can be said that the driving member 1225 reduces the relative displacement amount between a part of the first driving system 121 to which the second driving system 122 is connected (i.e., the distal arm part 12124) and a part of the light irradiation device 11 to which the second driving system 122 is connected, caused by the vibration from the first driving system 121 toward the light irradiation device 11, using the driving force. If the driving member 1225 can convert the vibration of the air spring 1223 into damped vibration, the second driving system 122 does not need to include the damper member 1224. However, even if the driving member 1225 cannot convert the vibration of the air spring 1223 into damped vibration, the second driving system 122 does not need to include the damper member 1224. Furthermore, the number of air springs 1223, the number of damper members 1224, and the number of driving members 1225 do not need to be equal to one another.

[0107] Here, considering that the processing apparatus 1 can move the light irradiation device 11 using both or either of the first drive system 121 and the second drive system 122 as described above, it can also be said that the processing apparatus 1 can reduce vibrations directed from the first drive system 121 to the light irradiation device 11 using both or either of the first drive system 121 and the second drive system 122. In this case, when the movement mode of the light irradiation device 11 by the first drive system 121 is different from the movement mode of the light irradiation device 11 by the second drive system 122 as described above, the control device 2 may determine whether or not the vibrations should be reduced using the first drive system 121 and / or whether or not the vibrations should be reduced using the second drive system 122 based on the characteristics of the vibrations to be reduced. For example, the control device 2 may determine whether or not the vibrations should be reduced using the first drive system 121 and / or whether or not the vibrations should be reduced using the second drive system 122 based on the frequency of the vibrations to be reduced. Specifically, the control device 2 may determine that the vibration should be reduced using the first drive system 121 when the vibration to be reduced includes a vibration in a first frequency range. The first frequency range is typically set to a frequency range that includes the vibration that can be reduced by the first drive system 121. In this case, the control device 2 may control the first drive system 121 to reduce at least a part of the vibration traveling from the first drive system 121 to the light irradiation device 11. In addition, the control device 2 may determine that the vibration should be reduced using the second drive system 122 when the vibration to be reduced includes a vibration in a second frequency range different from the first frequency range. The second frequency range is typically set to a frequency range that includes the vibration that can be reduced by the second drive system 122. In this case, the control device 2 may control the second drive system 122 to reduce at least a part of the vibration traveling from the drive system 121 to the light irradiation device 11. Furthermore, as described above, when the positioning accuracy of the light irradiation device 11 by the first drive system 121 is lower than the positioning accuracy of the light irradiation device 11 by the second drive system 122, the second frequency range typically includes frequencies higher than the first frequency range.

[0108] The driving member 1225 may apply a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force. In the example shown in FIG. 6, since the air spring 1223 and / or the damper member 1224 apply an elastic force along the Z-axis direction, the driving member 1225 may apply a driving force acting along a direction including a component in the Z-axis direction. When the driving member 1225 generates a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force, the driving member 1225 can convert the vibration of the air spring 1223 into a damped vibration by using this driving force. When converting the vibration of the air spring 1223 into a damped vibration, the driving member 1225 may change the resonance frequency of the air spring 1223 by using the driving force. Typically, the driving member 1225 may increase the resonance frequency of the air spring 1223 by using the driving force.

[0109] The driving member 1225 may apply a driving force acting along a direction intersecting the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force. In the example shown in FIG. 6, since the air spring 1223 and / or the damper member 1224 apply an elastic force along the Z-axis direction, the driving member 1225 may apply a driving force acting along a direction intersecting the Z-axis direction (for example, at least one of the X-axis direction and the Y-axis direction). When the driving member 1225 generates a driving force acting along a direction intersecting the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force, the driving member 1225 does not need to use this driving force to damp the vibration of the air spring 1223. This relatively reduces the load on the driving member 1225.

[0110] A device that actively reduces vibrations using an elastic member such as the air spring 1223 and the driving member 1225 may be called an active vibration isolation device. Therefore, the second drive system 122 may be called an active vibration isolation device. The active vibration isolation device may be called an active vibration isolation system (AVIS).

[0111] (1-3) Specific examples of machining operations by the machining system SYSa (1-3-1) Examples of structures formed by machining operations As described with reference to FIG. 2, in the first embodiment, the processing system SYSa forms a recess C in the coating film SF. The recess C is formed in a portion of the coating film SF that is actually irradiated with the processing light EL. Therefore, by appropriately setting the position on the coating film SF where the processing light EL is actually irradiated (i.e., the position where the target irradiation area EA where the processing light EL is scheduled to be irradiated is set), the recess C can be formed at a desired position on the coating film SF. In other words, a structure made of the coating film SF can be formed on the workpiece S.

[0112] Specifically, as described above, the processing system SYSa uses at least one of the galvanometer mirror 1122 and the drive system 12 to move the surface of the coating film SF to the target irradiation area EA. During the period in which the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa irradiates the processing light EL at a timing when the target irradiation area EA overlaps with an area on the surface of the coating film SF that should actually be irradiated with the processing light EL (i.e., an area to be processed). On the other hand, during the period in which the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at a timing when the target irradiation area EA does not overlap with an area on the surface of the coating film SF that should actually be irradiated with the processing light EL. In other words, during the period in which the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at a timing when the target irradiation area EA overlaps with an area on the surface of the coating film SF that should not actually be irradiated with the processing light EL (i.e., an area not to be processed). As a result, a structure is formed on the workpiece S by the coating film SF according to the pattern (or distribution) of the area of ​​the coating film SF that is actually irradiated with the processing light EL.

[0113] In the first embodiment, the processing system SYSa forms a riblet structure, which is an example of a structure formed by such a coating film SF, on the workpiece S under the control of the control device 2. The riblet structure is a structure that can reduce the resistance of the surface of the coating film SF to a fluid (particularly, frictional resistance and turbulent frictional resistance). The resistance of the surface of the workpiece S on which the riblet structure is formed to a fluid is smaller than the resistance of the surface of the workpiece S on which the riblet structure is not formed to a fluid. For this reason, it can also be said that the riblet structure is a structure that can reduce the resistance of the surface of the workpiece S to a fluid. Note that the fluid referred to here may be any medium (gas, liquid) that flows relative to the surface of the coating film SF. For example, a medium flowing relative to the stationary workpiece SF and a stationary medium distributed around the moving workpiece SF are each an example of a fluid.

[0114] An example of the riblet structure is shown in Figures 7(a) and 7(b). As shown in Figures 7(a) and 7(b), the riblet structure is a structure in which a plurality of concave structures CP1 (i.e., concave structures CP1 formed linearly so as to extend along the first direction) formed by continuously forming recesses C along a first direction (Y-axis direction in the example shown in Figures 7(a) and 7(b)) are arranged along a second direction (X-axis direction in the example shown in Figures 7(a) and 7(b)) intersecting the first direction. In other words, the riblet structure is a structure in which a plurality of concave structures CP1 extending along the first direction have a periodic direction in the second direction intersecting the first direction. Between two adjacent concave structures CP1, a convex structure CP2 protruding from the surroundings is substantially present. Therefore, the riblet structure can also be said to be a structure in which, for example, a plurality of convex structures CP2 extending linearly along a first direction (for example, the Y-axis direction) are arranged along a second direction (for example, the X-axis direction) intersecting the first direction. In other words, the riblet structure can also be said to be a structure in which, for example, a plurality of convex structures CP2 extending along a first direction have a periodic direction in a second direction intersecting the first direction. The riblet structures shown in Figures 7(a) and 7(b) are periodic structures. Note that the riblet structure may also be a non-periodic structure.

[0115] The interval between two adjacent concave structures CP1 (i.e., the arrangement pitch P1 of the concave structures CP1) is, for example, several microns to several hundreds of microns, but may be other sizes. Furthermore, the depth D of each concave structure CP1 (i.e., the depth in the Z-axis direction) is, for example, several microns to several hundreds of microns, but may be other sizes. The depth D of each concave structure CP1 may be equal to or smaller than the arrangement pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be equal to or smaller than half the arrangement pitch P1 of the concave structures CP1. The shape of a cross section including the Z axis of each concave structure CP1 (specifically, a cross section along the XZ plane) is a bowl-shaped curved shape, but may be a triangle, a rectangle, or a polygon with pentagons or more.

[0116] The interval between two adjacent convex structures CP2 (i.e., the arrangement pitch P2 of the convex structures CP2) is, for example, several microns to several hundreds of microns, but may be other sizes. Furthermore, the height H of each convex structure CP2 (i.e., the height in the Z-axis direction) is, for example, several microns to several hundreds of microns, but may be other sizes. The height H of each convex structure CP2 may be equal to or less than the arrangement pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be equal to or less than half the arrangement pitch P2 of the convex structures CP2. The shape of a cross section including the Z axis of each convex structure CP2 (specifically, a cross section along the XZ plane) is a mountain shape with a curved slope, but may be a triangle, a rectangle, or a polygon with pentagons or more.

[0117] Furthermore, the riblet structure formed by the processing system SYSa may itself be an existing riblet structure, such as that described in Chapter 5 of the "Mechanical Engineering Handbook: Basics, α4 Fluid Engineering" edited by the Japan Society of Mechanical Engineers, and therefore a detailed explanation of the riblet structure itself will be omitted.

[0118] As described above, such a riblet structure can reduce the resistance to a fluid on the surface of the workpiece S on which the riblet structure is formed. For this reason, the workpiece S may be an object (e.g., a structure) for which it is desired to reduce the resistance to a fluid. For example, the workpiece S may include an object (i.e., a moving object) that can move so that at least a part of it moves through a fluid (e.g., at least one of a gas and a liquid). Specifically, for example, the workpiece S may include the body of an aircraft PL (e.g., at least one of a fuselage PL1, a main wing PL2, a vertical tail PL3, and a horizontal tail PL4) as shown in Fig. 8(a) to Fig. 8(c). In this case, as shown in Fig. 8(a) and Fig. 8(c), the processing device 1 (or the processing system SYSa, the same applies hereinafter in this paragraph) may be self-supported on the body of the aircraft PL by a support device 14. Alternatively, since the end 144 of the leg member 142 of the support device 14 can be attached to the paint film SF, the processing device 1 may be attached to the body of the aircraft PL so as to be suspended (i.e., hanging) from the body of the aircraft PL by the support device 14, as shown in FIG. 8(b). Furthermore, since the end 144 of the leg member 142 of the support device 14 can be attached to the paint film SF and the end 134 of the partition member 132 of the storage device 13 can be attached to the paint film SF, the processing device 1 can stand on its own on the paint film SF even if the surface of the paint film SF is facing upward and inclined with respect to the horizontal plane. Furthermore, the processing device 1 can be attached to the paint film SF so as to be suspended from the paint film SF even if the surface of the paint film SF is facing downward and inclined with respect to the horizontal plane. In either case, the light irradiation device 11 can be moved along the surface of the aircraft by the drive system 12 and / or by the movement of the support device 14. Therefore, the processing system SYSa is capable of forming a riblet structure using a paint film SF even on a workpiece S such as an aircraft fuselage (i.e., a workpiece S having a curved surface, a surface that is inclined relative to the horizontal plane, or a surface that faces downward).

[0119] In addition, for example, the processing object S may include a car body or an aerodynamic part. For example, the processing object S may include a ship's hull. For example, the processing object S may include a rocket's fuselage. For example, the processing object S may include a turbine (for example, at least one of a water turbine and a wind turbine, and in particular, a turbine blade). For example, the processing object S may include a part constituting an object that is movable so that at least a part of it moves through a fluid. For example, the processing object S may include an object that is at least a part of which is fixed in a flowing fluid. Specifically, for example, the processing object S may include a bridge girder installed in a river or the sea. For example, the processing object S may include a pipe through which a fluid flows. In this case, the inner wall of the pipe can be the surface of the processing object S described above.

[0120] Incidentally, one example of the workpiece S given here is a relatively large object (e.g., an object having a size on the order of several meters to several hundred meters). In this case, as shown in Figs. 8(a) to 8(c), the size of the light irradiation device 11 is smaller than the size of the workpiece S. However, the workpiece S may be an object of any size. For example, the workpiece S may be an object having a size on the order of kilometers, centimeters, millimeters, or micrometers.

[0121] The characteristics of the riblet structure described above may be set to appropriate characteristics so that the friction reduction effect can be appropriately obtained depending on the type of object S to be processed. In other words, the characteristics of the riblet structure described above may be optimized so that the friction reduction effect can be appropriately obtained depending on the type of object S to be processed. More specifically, the characteristics of the riblet structure may be set to appropriate characteristics so that the friction reduction effect can be appropriately obtained depending on at least one of the type of fluid distributed around the object S to be processed during use (i.e., during operation), the relative speed of the object S to the fluid, and the shape of the object S to be processed. Furthermore, the characteristics of the riblet structure described above may be set to appropriate characteristics so that the friction reduction effect can be appropriately obtained depending on the type of object S to be processed and on which part of the object the riblet structure is formed. For example, when the object S to be processed is the body of an aircraft PL, the characteristics of the riblet structure formed on the fuselage PL1 and the characteristics of the riblet structure formed on the main wing PL2 may be different.

[0122] The characteristics of the riblet structure may include the size of the riblet structure. The size of the riblet structure may include at least one of the arrangement pitch P1 of the concave structures CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structures CP2, the height H of each convex structure CP2, etc. The characteristics of the riblet structure may include the shape of the riblet structure (for example, the shape of a cross section including the Z axis (specifically, a cross section along the XZ plane)). The characteristics of the riblet structure may include the extension direction of the riblet structure (i.e., the extension direction of the concave structures CP1). The characteristics of the riblet structure may include the formation position of the riblet structure.

[0123] As an example, if the workpiece S is the fuselage of an aircraft flying at an altitude of 10 km and a speed of 1000 km / h during cruising, the arrangement pitch P1 of the concave structure CP1 (i.e., the arrangement pitch P2 of the convex structure CP2) may be set to, for example, approximately 78 micrometers.

[0124] (1-3-2) Processing flow Next, the flow of processing operations for forming a riblet structure will be described with reference to FIGS.

[0125] First, as described above, the multiple processing beams EL are deflected by the galvanometer mirror 1122. In order to form a riblet structure, the galvanometer mirror 1122 deflects the multiple processing beams EL so as to alternately repeat a scanning operation in which the multiple target irradiation areas EA are moved along the Y-axis direction on the surface of the coating film SF and each of the multiple processing beams EL is irradiated onto the corresponding target irradiation areas EA at a desired timing, and a stepping operation in which the multiple target irradiation areas EA are moved at least a predetermined amount along the X-axis direction on the surface of the coating film SF. In this case, the Y-axis may be referred to as the scan axis, and the X-axis may be referred to as the step axis.

[0126] Here, there is a limit to the size of the area on the surface of the coating film SF that can be scanned with multiple processing lights EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. Therefore, in the first embodiment, as shown in FIG. 9, the control device 2 sets multiple processing shot areas SA on the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). Each processing shot area SA corresponds to an area on the coating film SF that can be scanned with multiple processing lights EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. The shape of each processing shot area SA is rectangular, but the shape is arbitrary.

[0127] The control device 2 controls the light irradiation device 11 to irradiate a part of one processing shot area SA (for example, SA1) with a plurality of processing lights EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the one processing shot area SA (SA1). After that, the control device 2 controls at least one of the drive systems 12 and 15 to move the light irradiation device 11 relative to the coating film SF, thereby disposing the light irradiation device 11 at a position where the light irradiation device 11 can irradiate another processing shot area SA (for example, SA2) with a plurality of processing lights EL. After that, the control device 2 controls the light irradiation device 11 to irradiate the other processing shot area SA (SA2) with a plurality of processing lights EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the other processing shot area SA. The control device 2 repeats the following operations for all processing shot areas SA1 to SA16 to form a riblet structure.

[0128] Hereinafter, the operation of forming a riblet structure in the processing shot areas SA1 to SA4 shown in FIG. 9 will be described as an example. In the following, an example will be described in which two processing shot areas SA adjacent along the X-axis direction are located in the accommodation space SP. However, the same operation is performed even when any number of processing shot areas SA are located in the accommodation space SP. In addition, the operation of forming the riblet structure shown below is merely an example, and the processing system SYS may form a riblet structure by performing an operation different from the operation shown below. In short, the processing system SYS may perform any operation as long as it can irradiate the processing object S with multiple processing lights EL to form a riblet structure on the processing object S.

[0129] As shown in FIG. 10, first, the control device 2 controls the drive system 15 to move the support device 14 relative to the coating film SF so that the accommodation device 13 is disposed at the first accommodation position where the processing shot areas SA1 and SA2 are located in the accommodation space SP. That is, the control device 2 moves the accommodation device 13 supported by the support device 14 so that the processing shot areas SA1 and SA2 are covered by the accommodation device 13. Furthermore, the control device 2 controls the drive system 12 (that is, the first drive system 121 and / or the second drive system 122) to move the light irradiation device 11 relative to the coating film SF so that the light irradiation device 11 is disposed at the first irradiation position where the processing shot area SA1 can be irradiated with a plurality of processing lights EL. After the accommodation device 13 is disposed at the first accommodation position and the light irradiation device 11 is disposed at the first irradiation position, the partition member 132 is in a first extension state. Therefore, the end 134 of the partition member 132 contacts and adheres to the coating film SF. Similarly, the leg members 142 are in the second extended state, so that the ends 144 of the leg members 142 contact and adhere to the paint film SF.

[0130] Thereafter, as shown in FIG. 11(a) and FIG. 11(b), the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the processing shot area SA1 is scanned with a plurality of processing lights EL. Specifically, the control device 2 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that a certain area in the processing shot area SA1 is scanned with a plurality of processing lights EL along the Y-axis direction in order to perform the above-mentioned scanning operation. During the scanning operation, the light source system 111 emits a plurality of processing lights EL. Thereafter, the control device 2 rotates at least the X-scanning mirror 1122X of the galvanometer mirror 1122 by a unit step amount in order to perform the above-mentioned stepping operation. During the stepping operation, the light source system 111 does not emit a plurality of processing lights EL. Thereafter, the control device 2 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that a certain area in the processing shot area SA1 is scanned with a plurality of processing lights EL along the Y-axis direction in order to perform the above-mentioned scanning operation. In this way, the control device 2 controls the galvanometer mirror 1122 so that the entire processing shot area SA1 (or a part of the processing shot area SA1 where the riblet structure is to be formed) is scanned with a plurality of processing lights EL by alternately repeating the scanning operation and the stepping operation. Note that a plurality of processing lights EL may be emitted while the stepping operation is being performed.

[0131] That is, in the first embodiment, as shown in FIG. 12, which is a plan view showing the scanning trajectory of the processing light EL during the period in which the scanning operation and the stepping operation are repeated (i.e., the moving trajectory of the target irradiation area EA), the processing device 1 sequentially performs the scanning operation on the multiple scanning areas SCA set in the processing shot area SA. FIG. 12 shows an example in which six scanning areas SCA#1 to SCA#6 are set in the processing shot area SA. Each scanning area SCA is an area scanned by multiple processing lights EL irradiated in one scanning operation (i.e., a series of scanning operations without a stepping operation). Each scanning area SCA is an area in which multiple target irradiation areas EA move in one scanning operation. In this case, in one scanning operation, the target irradiation area EA moves from the scanning start position SC_start of each scanning area SCA toward the scanning end position SC_end. Such a scanning area SCA is typically an area extending along the Y-axis direction (i.e., the scanning direction of the multiple processing lights EL). The multiple scanning areas SCA are arranged along the X-axis direction (i.e., the direction intersecting the scanning direction of the multiple processing lights EL).

[0132] In this case, the processing system SYSa starts a scan operation from, for example, one of the multiple scan areas SCA set in a certain processing shot area SA, which is located on the most +X side or the most -X side. For example, FIG. 12 shows an example in which the processing system SYSa starts a scan operation from the shot area SCA#1 located on the most -X side. In this case, the control device 2 controls the galvanometer mirror 1122 so that the processing light EL can be irradiated to the scan start position SC_start#1 of the scan area SCA#1 (for example, the end of the -Y side in the scan area SCA#1 or its vicinity). That is, the control device 2 controls the galvanometer mirror 1122 so that the target irradiation area EA is set to the scan start position SC_start#1 of the scan area SCA#1. After that, the processing system SYSa performs a scan operation on the scan area SCA#1. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the multiple target irradiation areas EA move from the scan start position SC_start#1 of the scan area SCA#1 to the scan end position SC_end#1 of the scan area SCA#1 (for example, the end on the +Y side in the scan area SCA#1 or its vicinity). Furthermore, the control device 2 controls the light irradiation device 11 so that each of the multiple processing lights EL is irradiated to the corresponding target irradiation area EA at a desired timing. As a result, the scan area SCA#1 is scanned by the multiple processing lights EL. Note that in FIG. 12, the movement trajectory of one target irradiation area EA in each scan area SCA is shown for the sake of simplicity of the drawing, but in reality, multiple target irradiation areas EA move in each scan area SCA. That is, in FIG. 12, the scanning trajectory of one processing light EL in each scan area SCA is shown for the sake of simplicity of the drawing, but in reality, each scan area SCA is scanned by multiple processing lights EL.

[0133] After completing the scan operation for the scan area SCA#1, the processing system SYSa performs a step operation to perform a scan operation for another scan area SCA different from the scan area SCA#1. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the processing light EL can be irradiated to the scan start position SC_start#2 (for example, the end of the -Y side in the scan area SCA#2 or its vicinity) of the scan area SCA#2 adjacent to the scan area SCA#1 along the X-axis direction. That is, the control device 2 controls the galvanometer mirror 1122 so that the target irradiation area EA is set at the scan start position SC_start#2 of the scan area SCA#2. As a result, as shown in FIG. 12, the target irradiation position EA moves along each of the X-axis direction and the Y-axis direction. At this time, the movement amount of the target irradiation position EA in the X-axis direction may be the same as the size of the scan area SCA in the X-axis direction. The movement amount of the target irradiation position EA in the Y-axis direction may be the same as the size of the scan area SCA in the Y-axis direction.

[0134] Thereafter, the processing system SYSa performs a scan operation on the scan area SCA#2. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the multiple target irradiation areas EA move from the scan start position SC_start#2 of the scan area SCA#2 to the scan end position SC_end#2 of the scan area SCA#2 (for example, the end on the +Y side in the scan area SCA#2 or its vicinity). Furthermore, the control device 2 controls the light irradiation device 11 so that the multiple processing lights EL are each irradiated to the corresponding target irradiation area EA at a desired timing. As a result, the scan area SCA#2 is scanned by the multiple processing lights EL.

[0135] Thereafter, the same operation is repeated until the scanning operation for the scan areas SCA#3 to SCA#6 is completed.

[0136] In the example shown in FIG. 12, the scanning direction of the processing light EL by the scanning operation is fixed to the +Y axis direction. The moving direction of the target irradiation area EA by the scanning operation is fixed to the +Y axis direction. That is, in the example shown in FIG. 12, the scanning directions of the processing light EL by the scanning operation performed multiple times in the processing shot area SA (that is, the moving direction of the target irradiation area EA, the same below) are the same as each other. The scanning directions of the multiple processing lights EL that scan the multiple scan areas SCA respectively are the same as each other. The moving directions of the target irradiation area EA in the multiple scan areas SCA are the same as each other. Specifically, the scanning direction of the processing light EL by the scanning operation performed on the scan area SCA#1, the scanning direction of the processing light EL by the scanning operation performed on the scan area SCA#2, ..., the scanning direction of the processing light EL by the scanning operation performed on the scan area SCA#6 are the same as each other.

[0137] By repeating such scanning and stepping operations, a riblet structure is formed in the processing shot area SA1. As shown in Fig. 11(a) and Fig. 11(b), the width of the area scanned by the processing light EL (i.e., the width of the processing shot area SA, particularly the width in the X-axis direction) is larger than the width of the light irradiation device 11 (particularly the width in the X-axis direction).

[0138] In the process of repeating such scanning and stepping operations, the position of the target irradiation area EA may be shifted due to the operation of the galvanometer mirror 1122. For example, if the galvanometer mirror 1122 continues to operate, the temperature of the galvanometer mirror 1122 may change (typically, increase). If the temperature of the galvanometer mirror 1122 changes, the characteristics of the galvanometer mirror 1122 may change compared to before the temperature of the galvanometer mirror 1122 changed. As a result, the position of the target irradiation area EA relative to the galvanometer mirror 1122 may change (i.e., the position of the target irradiation area EA may be shifted). Such a position shift of the target irradiation area EA may hinder proper processing of the coating film SF. Therefore, the control device 2 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF so as to reduce the position shift of the target irradiation area EA (i.e., to move the target irradiation area EA closer to its original position). For example, the control device 2 may control the first drive system 121 to move the light irradiation device 11 relative to the coating film SF so as to reduce the positional deviation of the target irradiation area EA (e.g., to reduce the amount of positional deviation). For example, the control device 2 may control the second drive system 122 (particularly, the drive member 1225) to move the light irradiation device 11 relative to the coating film SF so as to reduce the positional deviation of the target irradiation area EA.

[0139] The control device 2 controls the drive system 15 so that the leg members 142 are maintained in the second extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the ends 144 of the leg members 142 continue to adhere to the coating film SF. As a result, the stability of the support device 14 is improved, and the possibility that the target irradiation area EA of the processing light EL will be unintentionally shifted on the coating film SF due to instability of the support device 14 is reduced. However, as long as the support device 14 is capable of standing on the coating film SF (or is capable of being attached to the coating film SF so as to be suspended from the coating film SF) during at least a portion of the period during which the light irradiation device 11 is irradiating the light EL, some of the leg members 142 may be in the second contracted state.

[0140] The control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the end 134 of the partition member 132 continues to adhere to the coating film SF. As a result, the hermeticity of the storage space SP is maintained, so that the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., outside the storage device 13). Furthermore, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., outside the storage device 13).

[0141] Incidentally, there is a possibility that at least a part of the end 134 that should be attached to the coating film SF may become detached from the coating film SF due to some factor. In this case, if the light irradiation device 11 continues to irradiate the processing light EL, at least one of the processing light EL and the unnecessary material may leak out of the storage device 13. Therefore, the control device 2 may control the light irradiation device 11 to stop irradiating the processing light EL when it detects that at least a part of the end 134 has become detached from the coating film SF during the period when the light irradiation device 11 is irradiating the processing light EL.

[0142] 13, the control device 2 controls the drive system 12 so that the light irradiation device 11 moves from the first irradiation position to a second irradiation position where the light irradiation device 11 can irradiate the processing shot area SA2 with a plurality of processing light beams EL. During the period in which the light irradiation device 11 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0143] Thereafter, as shown in FIG. 14(a) and FIG. 14(b), the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple processing lights EL scan the processing shot area SA2. Specifically, the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple processing lights EL scan the entire processing shot area SA2 (or a part of the processing shot area SA2 where the riblet structure is to be formed) by alternately repeating the above-mentioned scanning operation and the above-mentioned step operation. As a result, the riblet structure is formed in the processing shot area SA2. Note that the multiple recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as to be continuously connected to each of the multiple recesses CP1 constituting the riblet structure in the processing shot area SA2 (or other processing shot areas SA) adjacent to the processing shot area SA1. Alternatively, the multiple recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the multiple recesses CP1 constituting the riblet structure in the processing shot area SA2. For example, the continuous length of one recess CP1 formed as a result of scanning the processing light EL in the processing shot area SA depends on the size of the processing shot area SA (particularly, the size in the Y-axis direction, which is the scanning direction of the processing light EL). Therefore, when the size of the processing shot area SA is large enough to realize a continuous length that allows the riblet structure to perform the above-mentioned function, the multiple recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the multiple recesses CP1 constituting the riblet structure in the processing shot area SA2. As an example, when the processing target S is an aircraft, the continuous length that allows the riblet structure to perform the above-mentioned function is approximately several mm according to a calculation based on the airspeed and the frequency of the turbulence phenomenon when the aircraft is in use (typically, during cruising).Therefore, when a processed shot area SA whose size in the Y-axis direction is larger than approximately a few mm can be set on the surface of the coating film SF, the multiple recesses CP1 that constitute the riblet structure in the processed shot area SA1 may be formed so as not to be connected to each of the multiple recesses CP1 that constitute the riblet structure in the processed shot area SA2.

[0144] When the riblet structure is formed in the processing shot area SA2, there are no processing shot areas SA in which the riblet structure has not yet been formed remaining in the storage space SP. Therefore, the light irradiation device 11 cannot form a riblet structure by irradiating a plurality of processing lights EL to the processing shot areas SA in which the riblet structure has not yet been formed simply by moving the light irradiation device 11 in the storage space SP using the drive system 12. Therefore, when there are no processing shot areas SA in which the riblet structure has not yet been formed remaining in the storage space SP, the control device 2 controls the drive system 15 by moving the support device 14 (i.e., by moving the storage device 13) so that the processing shot areas SA in which the riblet structure has not yet been formed are newly positioned in the storage space SP.

[0145] 15, the control device 2 first controls a drive system (not shown) that expands and contracts the partition member 132 so that the state of the partition member 132 switches from a first extended state to a first contracted state. As a result, the end 134 of the partition member 132 separates from the coating film SF. Note that while the support device 14 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL. Therefore, even if the end 134 separates from the coating film SF, there is no possibility that at least one of the processing light EL and the unnecessary material will leak out to the outside of the storage device 13.

[0146] However, although the unnecessary substances present in the storage space SP are sucked out of the storage space SP by the exhaust device 16 described above, there is a possibility that due to some factor, all of the unnecessary substances present in the storage space SP are not sucked out by the exhaust device 16 (i.e., the unnecessary substances remain in the storage space SP). In this case, when the end portion 134 is separated from the coating film SF, the unnecessary substances may leak out to the outside of the storage device 13. For this reason, the control device 2 may determine whether or not to switch the partition member 132 from the first extended state to the first contracted state based on the detection result of the detection device 135 that detects the unnecessary substances in the storage space SP. If the unnecessary substances remain in the storage space SP, the control device 2 may not switch the partition member 132 from the first extended state to the first contracted state. In this case, the unnecessary substances remaining in the storage space SP are continuously sucked in by the exhaust device 16. On the other hand, if the unnecessary substances do not remain in the storage space SP, the control device 2 may switch the partition member 132 from the first extended state to the first contracted state.

[0147] Furthermore, the control device 2 controls the drive system 15 so that at least some of the leg members 142 that move relative to the coating film SF in association with the movement of the support device 14 (particularly, as described later, the extension of the beam member 141 that had been contracted) among the multiple leg members 142 are switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the coating film SF in association with the extension of the beam member 141 that had been contracted is typically the leg member 142 that is located on the front side of the movement direction of the support device 14 (i.e., the movement direction of the storage device 13) among the multiple leg members 142. In the example shown in FIG. 15, the support device 14 moves toward the +X side, and the leg member 142 located on the front side of the movement direction of the support device 14 is the leg member 142 located on the +X side. Hereinafter, the leg member 142 located on the front side of the movement direction of the support device 14 is referred to as the "front leg member 142". As a result, the end 144 of the front leg member 142 moves away from the coating film SF.

[0148] Thereafter, as shown in FIG. 16, the control device 2 controls the drive system 15 so that the storage device 13 moves from the first storage position to the second storage position where the processing shot areas SA3 and SA4 are located in the storage space SP. Specifically, the control device 2 controls the drive system 15 so that the beam member 141 extends along the moving direction of the support device 14. As a result, the beam member 141 extends while supporting the storage device 13 (and further while supporting the light irradiation device 11 supported by the storage device 13). Furthermore, in parallel with the movement of the support device 14, the control device 2 controls the drive system 12 so that the light irradiation device 11 moves from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the processing shot area SA3 with a plurality of processing lights EL. Thus, in the first embodiment, the support device 14 is self-propelled while being supported by the processing object S. For this reason, the support device 14 may be referred to as a self-propelled device.

[0149] During the period when the supporting device 14 is moving (i.e., the beam member 141, which had been contracted, is expanding), the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first contracted state. As a result, the movement of the supporting device 14 (i.e., the movement of the containing device 13) is not hindered by contact between the end 134 of the partition member 132 and the coating film SF. Furthermore, the coating film SF is not damaged by contact between the end 134 and the coating film SF during the movement of the supporting device 14. However, if the movement of the supporting device 14 is not hindered by contact between the end 134 and the coating film SF, at least a part of the end 134 may be in contact with the coating film SF during at least a part of the period when the supporting device 14 is moving. If the coating film SF is not damaged by contact between the end portion 134 and the coating film SF during movement of the support device 14, at least a portion of the end portion 134 may be in contact with the coating film SF during at least a portion of the period during which the support device 14 is moving.

[0150] Furthermore, during the period when the support device 14 is moving, the control device 2 controls the drive system 15 so that the front leg member 142 is maintained in the second contracted state. As a result, the movement of the support device 14 (i.e., the movement of the storage device 13) is not hindered by contact between the end 144 of the front leg member 142 and the coating film SF. Furthermore, the coating film SF is not damaged by contact between the end 144 and the coating film SF during the movement of the support device 14. However, if the movement of the support device 14 is not hindered by contact between the end 144 and the coating film SF, at least a part of the end 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving. If the coating film SF is not damaged by contact between the end 144 and the coating film SF during the movement of the support device 14, at least a part of the end 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving.

[0151] Furthermore, while the support device 14 is moving, the control device 2 controls the drive system 15 so that the leg members 142 other than the front leg member 142 among the multiple leg members 142 are maintained in the first extended state. As a result, even if the end 144 of the front leg member 142 is separated from the paint film SF, the end 144 of the leg members 142 other than the front leg member 142 is in contact with the paint film SF. Therefore, the support device 14 remains capable of standing on the paint film SF (or is capable of being attached to the paint film SF so as to hang down from the paint film SF) in the same way as when all the end portions 144 of the multiple leg members 142 are in contact with the paint film SF.

[0152] Furthermore, during the period in which the supporting device 14 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0153] After the storage device 13 is placed in the second storage position, as shown in FIG. 17, the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 switches from the first contracted state to the first extended state. As a result, the end 134 of the partition member 132 contacts and adheres to the paint film SF. Furthermore, the control device 2 controls the drive system 15 so that the front leg member 142 switches from the second contracted state to the second extended state. As a result, the end 144 of the front leg member 142 contacts and adheres to the paint film SF. Here, the extension operation of the partition member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time lag.

[0154] Thereafter, as shown in FIG. 18, the control device 2 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the coating film SF as the support device 14 moves (particularly, as described later, the extended beam member 141 contracts) among the multiple leg members 142 is switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the coating film SF as the extended beam member 141 contracts is typically the leg member 142 located on the rear side of the movement direction of the support device 14 among the multiple leg members 142. In the example shown in FIG. 18, the leg member 142 located on the rear side of the movement direction of the support device 14 is the leg member 142 located on the -X side. Hereinafter, the leg member 142 located on the rear side of the movement direction of the support device 14 is referred to as the "rear leg member 142". As a result, the end portion 144 of the rear leg member 142 moves away from the coating film SF.

[0155] Thereafter, as shown in FIG. 19, the control device 2 controls the drive system 15 so that the beam members 141, which have been extended along the movement direction of the support device 14, contract.

[0156] After the beam member 141 has been contracted, the control device 2 controls the drive system 15 so that the rear leg member 142 switches from the second contracted state to the second extended state, as shown in Fig. 20. As a result, the end 144 of the rear leg member 142 comes into contact with and adheres to the paint film SF.

[0157] Thereafter, the control device 2 controls the light irradiation device 11 so that the multiple processing lights EL scan the processing shot areas SA3 and SA4 in the same manner as when the multiple processing lights EL scan the processing shot areas SA1 and SA2. Thereafter, the same operation is repeated, and the multiple processing lights EL are irradiated onto the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). As a result, the riblet structure is formed by the coating film SF on the processing object S.

[0158] (1-4) Technical effects of processing system SYSa As described above, the processing system SYSa of the first embodiment can form a riblet structure by the coating film SF on the surface of the workpiece S by irradiating the processing light EL onto the workpiece S (particularly, the coating film SF formed on the surface of the workpiece S). Therefore, the processing system SYSa can form the riblet structure relatively easily and in a relatively short time, compared to a processing device that forms a riblet structure by scraping away the surface of the workpiece S with a cutting tool such as an end mill.

[0159] Furthermore, the processing system SYSa can simultaneously irradiate a plurality of processing light beams EL to form a plurality of concave structures CP1 at the same time, which improves the throughput in forming the riblet structure compared to a processing device that can irradiate a single processing light beam EL to form only a single concave structure CP1 at a time.

[0160] Furthermore, the processing system SYSa can scan the coating film SF at a relatively high speed by deflecting a plurality of processing light beams EL with the galvanometer mirror 1122. This improves the throughput in forming the riblet structure.

[0161] Furthermore, instead of directly processing the workpiece S, the processing system SYSa can form a riblet structure on the surface of the workpiece S by processing the coating film SF formed on the surface of the workpiece S. Therefore, it is possible to avoid an increase in the weight of the workpiece S due to the formation of the riblet structure, compared to a processing system that forms a riblet structure by newly adding (e.g., attaching) a special material for forming the riblet structure to the surface of the workpiece S (i.e., the surface of the coating film SF).

[0162] Furthermore, because the processing system SYSa does not directly process the workpiece S, it can relatively easily re-form the riblet structure. Specifically, when re-forming the riblet structure, the riblet structure formed by the coating film SF is first peeled off, and then a new coating film SF is applied. The processing system SYSa can then process the newly applied coating film SF to form a new riblet structure. Therefore, deterioration of the riblet structure (e.g., damage, etc.) can be dealt with relatively easily by re-forming the riblet structure.

[0163] Furthermore, because the processing system SYSa does not directly process the workpiece S, it can form a riblet structure on the surface of the workpiece S that is difficult to process directly or on which a riblet structure is not originally formed. In other words, if the processing system SYSa processes the coating film SF after the coating film SF is applied to the surface of the workpiece S, it is possible to form a riblet structure relatively easily.

[0164] In addition, when the coating film SF is applied to the workpiece S and then processed, the operation of processing the workpiece S may include an operation of applying (i.e., forming) the coating film SF to the workpiece S and an operation of processing the coating film SF (e.g., partially removing the coating film SF). The operation of applying the coating film SF to the workpiece S may be performed by the processing system SYSa. In this case, the processing system SYSa may be equipped with a coating device for applying the coating film SF to the workpiece S. Alternatively, the operation of applying the coating film SF to the workpiece S may be performed outside the processing system SYSa. For example, the operation of applying the coating film SF to the workpiece S may be performed by a coating device outside the processing system SYSa.

[0165] Furthermore, the processing system SYSa can form a riblet structure using a coating film SF. The coating film SF usually has a relatively high durability against the external environment (for example, at least one of heat, light, and wind). Therefore, the processing system SYSa can relatively easily form a riblet structure having a relatively high durability.

[0166] Furthermore, in the first embodiment, the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF is included in the accommodation space SP. Therefore, compared to a processing system in which the optical path of the processing light EL is not included in the accommodation space SP (i.e., it is open to an open space), it is possible to appropriately prevent the processing light EL irradiated to the coating film SF (or the scattered light or reflected light of the processing light EL from the coating film SF, etc.) from propagating to the surroundings of the processing system SYSa (in other words, scattering). Furthermore, it is possible to appropriately prevent unnecessary substances generated by irradiation of the processing light EL from propagating to the surroundings of the processing system SYSa (in other words, scattering).

[0167] Furthermore, in the first embodiment, the light irradiation device 11 is supported by a support device 14 that is movable over the coating film SF. Therefore, the processing system SYSa can relatively easily process a coating film SF that spreads over a relatively wide area. In other words, the processing system SYSa can form a riblet structure by the coating film SF over a relatively wide area on the surface of the workpiece S. Furthermore, since the processing system SYSa does not need to move the workpiece S, it can relatively easily form a riblet structure even on the surface of a relatively large or heavy workpiece S.

[0168] Furthermore, the processing system SYSa can use the exhaust device 16 to suck unnecessary substances generated by the irradiation of the processing light EL to the outside of the accommodation space SP. Therefore, the irradiation of the processing light EL to the coating film SF is hardly hindered by unnecessary substances. Therefore, the irradiation accuracy of the processing light EL is improved compared to a processing system that does not have the exhaust device 16 (i.e., the irradiation of the processing light EL to the coating film SF may be hindered by unnecessary substances). As a result, the formation accuracy of the riblet structure is improved.

[0169] Furthermore, the processing apparatus 1 can use the gas supply device 17 to prevent dirt from adhering to the optical surface 1124 (i.e., the optical surface on the side of the storage space SP of the terminal optical element of the optical system 112). Therefore, compared to a processing apparatus not equipped with the gas supply device 17, there is a smaller possibility that the irradiation of the processing light EL to the coating film SF will be hindered by dirt that has adhered to the optical surface 1124. This improves the irradiation accuracy of the processing light EL. As a result, the formation accuracy of the riblet structure is improved.

[0170] In the first embodiment, the processing apparatus 1 can move the light irradiation device 11 relative to the coating film SF using the drive system 12 including the first drive system 121 and the second drive system 122. Therefore, the processing apparatus 1 can appropriately move the light irradiation device 11 relative to the coating film SF. Specifically, if the light irradiation device 11 is moved using only the first drive system 121 (i.e., without using the second drive system 122), it is difficult to appropriately increase the positioning accuracy of the light irradiation device 11. This is because the positioning accuracy of the light irradiation device 11 by the first drive system 121 is an accuracy obtained by accumulating the movement accuracy (i.e., the swing accuracy or the rotation accuracy) of a plurality of joints of the first drive system 121. However, in the first embodiment, even if the positioning accuracy of the light irradiation device 11 by the first drive system 121 cannot be appropriately increased, the positioning accuracy of the light irradiation device 11 is increased by the second drive system 122 having a higher positioning accuracy than the first drive system 121. In other words, by using the second drive system 122, the positioning accuracy of the light irradiation device 11 of the entire drive system 12 including the first drive system 121 and the second drive system 122 can be made higher than the positioning accuracy of the light irradiation device 11 by the first drive system 121. Therefore, the processing apparatus 1 can move the light irradiation device 11 appropriately (for example, with high accuracy) relative to the coating film SF compared to a case where the second drive system 122 is not provided.

[0171] In addition, since the drive system 12 is equipped with the first drive system 121, in addition to the second drive system 122, which can increase the range of movement of the light irradiation device 11 compared to the second drive system 122, there is also the advantage that the range of movement of the light irradiation device 11 is increased compared to a comparative example drive device which does not have the first drive system 121 but has the second drive system 122.

[0172] That is, in the first embodiment, the processing system SYSa can appropriately increase the movement range of the light irradiation device 11 by mainly using the first drive system 121, while appropriately increasing the movement accuracy of the light irradiation device 11 by mainly using the second drive system 122. That is, the processing system SYSa can achieve both an increase in the movement range of the light irradiation device 11 and an improvement in the movement accuracy of the light irradiation device 11.

[0173] In addition, in the first embodiment, there is less need to appropriately increase the positioning accuracy of the light irradiation device 11 by the first drive system 121. Therefore, it is not necessary to increase the rigidity of the first drive system 121 (for example, the rigidity of the arm member 12121) in order to appropriately increase the positioning accuracy of the light irradiation device 11 by the first drive system 121. As a result, it is possible to reduce the weight of the first drive system 121. Furthermore, as the weight of the first drive system 121 is reduced, it is also possible to reduce the size of the actuator 12123 for moving the arm member 12121.

[0174] Furthermore, in the first embodiment, it is possible to reduce the possibility that vibrations accompanying the movement of the first drive system 121 are transmitted to the light irradiation device 11, or to make the vibration amount of the light irradiation device 11 smaller than the vibration amount accompanying the movement of the first drive system 121. As a result, it is possible to shorten the settling time of the light irradiation device 11, and to improve the total throughput. Alternatively, it is possible to reduce the deterioration of positioning accuracy caused by the vibration of the light irradiation device 11, and thus to improve the formation accuracy of the riblet structure.

[0175] In the first embodiment, since the arm drive system 1212 is controlled based on the measurement result of the position measurement device 18, the positioning accuracy of the light irradiation device 11 can be improved.

[0176] (2) Machining system SYSb according to the second embodiment Next, a processing system SYS of a second embodiment (hereinafter, the processing system SYS of the second embodiment will be referred to as a "processing system SYSb") will be described with reference to Fig. 21. Fig. 21 is a cross-sectional view that illustrates a schematic overall structure of the processing system SYSb of the second embodiment.

[0177] As shown in FIG. 21 , the processing system SYSb of the second embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1b instead of the processing device 1. Other features of the processing system SYSb may be the same as other features of the processing system SYSa. The processing device 1b differs from the processing device 1 in that it includes a position measuring device 18b instead of the position measuring device 18. Other features of the processing device 1b may be the same as other features of the processing device 1.

[0178] The position measuring device 18b measures the relative positional relationship between the coating film SF and the light irradiation device 11, similarly to the position measuring device 18. The position measuring device 18b measures the position of the light irradiation device 11 relative to a predetermined reference position, in comparison with the above-mentioned position measuring device 18. Specifically, the position measuring device 18b measures the position of the light irradiation device 11 in a reference coordinate system in which a reference position is defined. The reference position may be, for example, the origin of the reference coordinate system. For example, a measurement coordinate system used by the position measuring device 18b to measure the relative positional relationship between the coating film SF and the light irradiation device 11 is used as the reference coordinate system. However, other coordinate systems may be used as the reference coordinate system. Note that if the position of the coating film SF in the reference coordinate system is known, the relative positional relationship between the coating film SF and the light irradiation device 11 can be obtained by measuring the relative positional relationship between the reference position in the reference coordinate system and the light irradiation device 11 by the position measuring device 18b. In other words, the position measuring device 18b indirectly measures the relative positional relationship between the coating film SF and the light irradiation device 11.

[0179] In order to measure the position of the light irradiation device 11 relative to a reference position, the position measurement device 18b includes an index member 181b and an index measurement device 182b.

[0180] The index member 181b is a member that serves as an index when measuring the position of the light irradiation device 11 relative to a reference position. The index member 181b is disposed at a fixed position relative to the light irradiation device 11 (particularly, the optical system 112). The index member 181b is disposed at a position where the relative position of the light irradiation device 11 and the index member 181b does not change even if the drive system 12 moves the light irradiation device 11. For example, FIG. 21 shows an example where the index member 181b is disposed on the mounting member 19 to which the light irradiation device 11 is attached. However, the index member 181b may be attached to a member different from the mounting member 19. For example, the index member 181b may be attached to the light irradiation device 11. For example, the index member 181b may be attached to the above-mentioned housing 114 (see FIG. 4).

[0181] The index measuring device 182b measures the position of the index member 181b. The index measuring device 182b may be any measuring device as long as it can measure the position of the index measuring member 181b. The index measuring device 182b may be disposed in any position as long as it can measure the position of the index measuring member 181b.

[0182] The output from the index measuring device 182b (i.e., the measurement result of the index measuring device 182b) includes information on the position of the light irradiation device 11 relative to the reference position. Specifically, the measurement result of the index measuring device 182b includes information on the position of the index member 181b relative to the reference position. That is, the measurement result of the index measuring device 182b includes information on the position of the index member 181b in the reference coordinate system. Here, since the index member 181b is disposed at a fixed position relative to the light irradiation device 11, the information on the position of the index member 181b in the reference coordinate system substantially includes information on the position of the light irradiation device 11 in the reference coordinate system. Therefore, the control device 2 can appropriately identify the position of the light irradiation device 11 relative to the reference position.

[0183] An example of the index member 181b is a marker. The marker may include a marker that can be identified by a physical shape (e.g., an engraved mark, a convex portion, or a concave portion). The marker may include a marker that can be identified by a visual feature (e.g., a color, etc.). The marker may include a marker that can be identified by light emitted by the marker itself (e.g., an LED (Light Emitting Diode)). In this case, the index measurement device 182b may include an imaging device (e.g., a camera) that can image the marker. Alternatively, the index measurement device 182b may include an irradiation device that irradiates the marker with measurement light (or any measurement beam) and a light receiving device that receives the measurement light from the marker.

[0184] An example of the index member 181b is a transmitter capable of transmitting a signal. An example of the signal is at least one of a radio signal and an optical signal. In this case, the index measurement device 182b may include a receiver capable of receiving the signal.

[0185] The position measurement device 18b may include a single index member 181b. In this case, the control device 2 can specify the position of the light irradiation device 11 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction based on the measurement result of the index measurement device 182b (i.e., information on the position of the single index member 181b). The position measurement device 18b may include two index members 181b. In this case, the control device 2 can specify the position of the light irradiation device 11 in the rotation direction corresponding to the θZ direction (i.e., the amount of rotation of the light irradiation device 11 around the Z axis) in addition to the position of the light irradiation device 11 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction based on the measurement result of the index measurement device 182b (i.e., information on the position of the two index members 181b). The position measurement device 18b may include three or more index members 181b. In this case, the control device 2 can determine the position of the light irradiation device 11 in each of the rotational directions of the θX direction, the θY direction, and the θZ direction (i.e., the amount of rotation of the light irradiation device 11 around the X axis, the Y axis, and the Z axis) in addition to the position of the light irradiation device 11 in each of the X axis, the Y axis, and the Z axis based on the measurement results of the index measuring device 182b (i.e., information regarding the positions of three or more index members 181b).

[0186] In addition to or in place of the index member 181b, a reflecting member that reflects the measurement light from the (index) measuring device 182b may be provided. In this case, the reflecting member may be a corner cube reflector or a cat's eye reflector.

[0187] The position measuring device 18b may measure the position of a portion on the coating film SF (on the workpiece S) that is a feature point in the reference coordinate system. Here, by using 3D data of the workpiece S (coating film SF), the coordinates of the feature point in the coordinate system of the 3D data are known. By matching the coordinates of the feature point in the reference coordinate system with the coordinates of the feature point in the coordinate system of the 3D data, the position measuring device 18b can obtain the positional relationship between an arbitrary position of the workpiece S (coating film SF) and the index member 181b. Note that the feature point of a certain workpiece S may include a point at a characteristic position in the three-dimensional shape of an object represented by point cloud data, which is a collection of points indicating positions on the surface (coating film SF) of the workpiece S. Examples of the feature point may include at least one of a vertex, a corner, a boundary, a point located on the most +Z side, a point located on the most -Z side, a point located on the most +X side, a point located on the most -X side, a point located on the most +Y side, and a point located on the most -Y side of the workpiece S.

[0188] A plurality of position measuring devices 18b may be provided. In this case, the measurement axes of the position measuring devices 18b may intersect with each other.

[0189] Furthermore, the position measuring device 18b may measure the position of the light irradiation device 11 by a non-contact method (for example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method).

[0190] The machining system SYSb of the second embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above.

[0191] (3) Machining system SYSc according to the third embodiment Next, a processing system SYS of a third embodiment (hereinafter, the processing system SYS of the third embodiment will be referred to as a "processing system SYSc") will be described with reference to Fig. 22. Fig. 22 is a cross-sectional view that illustrates a schematic overall structure of the processing system SYSc of the third embodiment.

[0192] As shown in FIG. 22, the processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1c instead of the processing device 1. Other features of the processing system SYSc may be the same as other features of the processing system SYSa. The processing device 1c differs from the processing device 1 in that it further includes the position measuring device 18b described in the second embodiment in addition to the position measuring device 18. Other features of the processing device 1c may be the same as other features of the processing device 1.

[0193] The control device 2 may control the drive system 12 (i.e., the first drive system 121 and the second drive system 122) based on the measurement result of at least one of the position measurement devices 18 and 18b. As a result, the machining system SYSb of the third embodiment can enjoy the same effects as those that can be enjoyed by the machining system SYSa of the first embodiment and the machining system SYSb of the second embodiment described above.

[0194] However, when the machining system SYSc includes the position measuring devices 18 and 18b (i.e., a plurality of position measuring devices), the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b may change during the machining operation. Specifically, the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b may deviate from the original ideal relative position. As a result, the structure formed on the coating film SF when the driving system 12 is controlled based on the measurement result of the position measuring device 18 to form a certain structure may not match the structure formed on the coating film SF when the driving system 12 is controlled based on the measurement result of the position measuring device 18b to form the same structure. Therefore, in the third embodiment, the control device 2 may control the driving system 12 based on information on the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b in addition to the measurement result of at least one of the position measuring devices 18 and 18b.

[0195] Specifically, the control device 2 first obtains information on the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b. In order to obtain information on the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b, the control device 2 may control the processing device 1c to perform test processing (specifically, to form a test structure (hereinafter referred to as a "test structure") ST). Specifically, the control device 2 may control the processing device 1c to form the test structure ST by controlling the drive system 12 based on the measurement result of the position measuring device 18, and to form the same test structure ST by controlling the drive system 12 based on the measurement result of the position measuring device 18b. At this time, the control device 2 may control the processing device 1c to form the test structure ST on the actual coating film SF. Alternatively, the control device 2 may control the processing device 1c to form the test structure ST on the applied coating for test processing after a coating device (not shown) applies a coating for test processing to the coating film SF. Alternatively, the control device 2 may control the processing device 1c to form a test structure ST on a test object (that is, an object different from the work-piece SF) for forming the test structure ST.

[0196] As a result, as shown in FIG. 23(a) and FIG. 23(b), a test structure ST (hereinafter referred to as "test structure ST1") formed when the driving system 12 is controlled based on the measurement result of the position measurement device 18, and a test structure ST (hereinafter referred to as "test structure ST2") formed when the driving system 12 is controlled based on the measurement result of the position measurement device 18b are formed on the coating film SF (or the test coating or the test object). FIG. 23(a) is a plan view showing the test structure ST1 formed when the driving system 12 is controlled based on the measurement result of the position measurement device 18. FIG. 23(b) is a plan view showing the test structure ST2 formed when the driving system 12 is controlled based on the measurement result of the position measurement device 18b. The test structures ST1 and ST2 shown in FIG. 23(a) and FIG. 23(b) are line-and-space structures extending in a one-dimensional direction, but the test structures are not limited to this. For example, it may be a structure extending in two dimensions (for example, one or more cross shapes or box shapes).

[0197] Thereafter, the control device 2 measures the two formed test structures ST1 and ST2 using at least one of the position measurement devices 18 and 18b (e.g., an imaging device) or an imaging device not shown. Thereafter, the control device 2 acquires information on the formation positions of the test structures ST1 and ST2 based on the measurement results of at least one of the position measurement devices 18 and 18b. Here, if the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b has not changed (i.e., if the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b has not shifted from the original ideal relative position), the relative formation position of the test structure ST1 in the region where the test structure ST1 is formed and the relative formation position of the test structure ST2 in the region where the test structure ST2 is formed should match. On the other hand, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has changed (i.e., if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has shifted from the original ideal relative position), there is a high possibility that the relative formation position of the test structure ST1 in the region where the test structure ST1 is formed and the relative formation position of the test structure ST2 in the region where the test structure ST2 is formed do not match. Note that Figures 23(a) and 23(b) show an example in which the relative formation position of the test structure ST1 and the relative formation position of the test structure ST2 in the region where the test structure ST2 is formed do not match. For this reason, the information on the formation positions of the test structures ST1 and ST2 substantially includes information on the relative positions between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b.

[0198] As a result, the control device 2 can control the drive system 12 based on information on the formation positions of the test structures ST1 and ST2 so as to reduce the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b. For example, the control device 2 may correct the measurement result of at least one of the position measurement devices 18 and 18b so as to reduce the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b, and control the drive system 12 based on the corrected measurement result. For example, when controlling the drive system 12 based on the measurement result of at least one of the position measurement devices 18 and 18b, the control device 2 may control the movement mode (for example, at least one of the movement direction and the movement amount) of the light irradiation device 11 by the drive system 12 so as to reduce the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b. For example, the control device 2 may control the irradiation position of one or more processing lights EL on the coating film SF (workpiece S) based on the measurement result of at least one of the position measuring devices 18 and 18b to reduce the influence caused by the change in the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b. In this case, the irradiation position of the processing light EL may be at least one of a position within the surface of the coating film SF (workpiece S) and a position in a direction intersecting the surface. In this case, the processing data used by the light irradiation device 11 (data including the movement path of the irradiation position of the processing light EL, the intensity of the processing light EL, etc.) may be corrected using the measurement result of at least one of the position measuring devices 18 and 18b.

[0199] Alternatively, considering that the test structure ST is formed due to a change in the characteristics of the coating film SF (or a test coating or a test object) caused by irradiation with the processing light EL, the control device 2 may control the processing device 1c to irradiate the processing light EL for forming the test structure ST to the sensitive member PE whose characteristics are changed by irradiation with the processing light EL, instead of actually forming the test structure ST. Specifically, the control device 2 may control the processing device 1c to irradiate the processing light EL to the sensitive member PE while controlling the drive system 12 in the same manner as when forming the test structure ST, based on the measurement result of the position measurement device 18, and to irradiate the processing light EL to the sensitive member PE while controlling the drive system 12 in the same manner as when forming the same test structure ST, based on the measurement result of the position measurement device 18b. Alternatively, the control device 2 may control the processing device 1c to irradiate the processing light EL to the affixed sensitive member PE after the sensitive member PE (for example, a sheet-shaped sensitive member PE) is affixed to the coating film SF by an attachment device not shown in the figure. In addition, the sensitive member PE does not need to be attached to the coating film SF if the positional relationship between the sensitive member PE and the coating film SF does not change between the time of irradiation with the processing light EL and the time of measurement of the test structure ST. For example, the sensitive member PE may be placed on the coating film SF.

[0200] As a result, as shown in Figures 24(a) and 24(b), a characteristic change pattern PV is formed on the sensitive member PE, whose characteristics have changed due to irradiation with the processing light EL. Note that Figure 24(a) is a plan view showing a characteristic change pattern PV (hereinafter referred to as "characteristic change pattern PV1") formed when the processing light EL is irradiated while controlling the drive system 12 in the same manner as when the test structure ST is formed, based on the measurement results of the position measurement device 18. Figure 24(b) is a plan view showing a characteristic change pattern PV (hereinafter referred to as "characteristic change pattern PV2") formed when the processing light EL is irradiated while controlling the drive system 12 in the same manner as when the test structure ST is formed, based on the measurement results of the position measurement device 18b.

[0201] Thereafter, the control device 2 measures the two formed characteristic change patterns PV1 and PV2 using at least one of the position measuring devices 18 and 18b (for example, an imaging device) or an imaging device not shown. Thereafter, the control device 2 acquires information on the formation positions of the characteristic change patterns PV1 and PV2 based on the measurement results of at least one of the position measuring devices 18 and 18b. Here, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has not changed, the relative formation position of the characteristic change pattern PV1 in the area where the characteristic change pattern PV1 is formed and the relative formation position of the characteristic change pattern PV2 in the area where the characteristic change pattern PV2 is formed should match. On the other hand, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has changed, there is a high possibility that the relative formation position of the characteristic change pattern PV1 in the area where the characteristic change pattern PV1 is formed and the relative formation position of the characteristic change pattern PV2 in the area where the characteristic change pattern PV2 is formed will not match. 24(a) and 24(b) show an example in which the relative formation position of the characteristic change pattern PV1 coincides with the relative formation position of the test structure ST2 within the region in which the characteristic change pattern PV2 is formed. Therefore, the information on the formation positions of the characteristic change patterns PV1 and PV2 substantially includes information on the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b.

[0202] As a result, the control device 2 can control the drive system 12 based on information regarding the formation positions of the characteristic change patterns PV1 and PV2 so as to reduce the effects caused by changes in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b.

[0203] Furthermore, by measuring the line widths of the characteristic change patterns PV1 and PV2, it is possible to obtain information about the irradiation position of the processing light EL in a direction intersecting the surface of the coating film SF (workpiece S).

[0204] Furthermore, a plurality of position measuring devices 18 and a plurality of position measuring devices 18b may be provided. In this case, the measurement axes of the respective position measuring devices 18 may be in a mutually intersecting (or twisted) relationship, or may be in parallel (or coaxial) relationship with each other. Furthermore, the measurement axes of the respective position measuring devices 18b may be in a mutually intersecting relationship.

[0205] (4) Machining system SYSd according to the fourth embodiment Next, a processing system SYS of a fourth embodiment (hereinafter, the processing system SYS of the fourth embodiment will be referred to as a "processing system SYSd") will be described with reference to Fig. 25. Fig. 25 is a perspective view showing a schematic structure of the processing system SYSd of the fourth embodiment.

[0206] As shown in FIG. 25, the processing system SYSd of the fourth embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1d instead of the processing device 1. The other features of the processing system SYSd may be the same as the other features of the processing system SYSa. The processing device 1d differs from the processing device 1 in that it includes a support device 14d instead of the support device 14. The other features of the processing device 1d may be the same as the other features of the processing device 1. In FIG. 25, in order to emphasize ease of viewing the drawing, some of the components of the processing system SYSd (e.g., the storage device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) are omitted.

[0207] The support device 14d supports the storage device 13, similar to the support device 14. That is, the support device 14d supports the drive system 12 and the light irradiation device 11 via the storage device 13, similar to the support device 14. The support device 14d is different from the support device 14 that can self-propel while supported by the workpiece SF in that it is self-propelled without being supported by the workpiece SF. The support device 14d is different from the support device 14 that can self-propel while in contact with the workpiece SF in that it is self-propelled without contacting (i.e., without interfering with) the workpiece SF. Other features of the support device 14d may be the same as other features of the support device 14.

[0208] In order to move independently without interfering with the workpiece S, the support device 14d includes a gantry member 141d and a moving block 142d instead of the beam member 141 and leg member 142 of the support device 14.

[0209] The gantry member 141d is a gate-shaped member in which a beam member 1412d having a linear shape is disposed on top of a plurality of leg members 1411d having a linear shape. In the example shown in FIG. 25, the plurality of leg members 1411d are linear members extending in the Z-axis direction, and the beam member 1412d is a linear member extending in the X-axis direction. The gantry member 141d has a large size that can at least partially surround the workpiece SF without contacting the workpiece S. Specifically, the gantry member 141d may have a large size that can sandwich the workpiece S between the plurality of leg members 1411d. The gantry member 141d may have a large size that can position the beam member 1412d above the workpiece S. For example, in the example shown in FIG. 25, the gantry member 141d has a large size that can straddle the fuselage of an aircraft, which is a specific example of the workpiece S.

[0210] The gantry member 141d is capable of self-moving along a rail (not shown) formed on a support surface (or other surface) on which the workpiece S is placed. In the example shown in Fig. 25, the gantry member 141d is capable of self-moving along a rail (not shown) extending in the Y-axis direction, for example. That is, in the example shown in Fig. 25, the gantry member 141d is capable of self-moving along the Y-axis direction.

[0211] The moving block 142d is attached to the beam member 1412d of the gantry member 141d. The moving block 142d is attached to the beam member 1412d so as to be movable along the beam member 1412d. For example, the moving block 142d may be attached to a rail (not shown) formed on the beam member 1412d so as to be movable along the rail. In the example shown in FIG. 25, since the beam member 1412d is a member extending in the X-axis direction, the moving block 142d is movable along the X-axis direction. The moving block 142d is further movable along a direction intersecting the direction in which the gantry member 141d moves and the direction in which the beam member 1412d extends. In the example shown in FIG. 25, the moving block 142d is movable along a Z-axis direction intersecting the Y-axis direction in which the gantry member 141d moves and the X-axis direction in which the beam member 1412d extends.

[0212] The driving system 12 and the light irradiation device 11 are attached to the moving block 142d via a storage device 13 (not shown). That is, the moving block 142d supports the driving system 12 and the light irradiation device 11 via a storage device 13 (not shown). Therefore, the light irradiation device 11 also moves due to the movement of the gantry member 141d and the moving block 142d. Specifically, the light irradiation device 11 moves along the Y-axis direction due to the movement of the gantry member 141d along the Y-axis direction. The light irradiation device 11 moves along the X-axis direction and the Z-axis direction due to the movement of the moving block 142d along each of the X-axis direction and the Z-axis direction.

[0213] In order to reduce misalignment of the light irradiation device 11 when the workpiece S is processed, the gantry member 141d may include a fixing member for fixing the gantry member 141d to a supporting surface.

[0214] The machining system SYSd of the fourth embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above.

[0215] The gantry member 141d may be self-moving along each of a plurality of different directions. The moving block 142d may be attached to at least one leg member 1411d in addition to or instead of the beam member 1412d. The moving block 142d may be attached to at least one leg member 1411d so as to be movable along the at least one leg member 1411d. The moving block 142d may move along the at least one leg member 1411d in addition to or instead of moving along the beam member 1412d. The moving block 142d may be movable along a single direction. The moving block 142d does not have to be movable.

[0216] The machining system SYSd of the fourth embodiment may further include components specific to at least one of the machining systems SYSb of the second embodiment to SYSd of the third embodiment described above. The components specific to the machining system SYSb of the second embodiment include components related to the position measurement device 18b. The components specific to the machining system SYSc of the third embodiment include components related to the position measurement devices 18 and 18b.

[0217] (5) Machining system SYSe according to the fifth embodiment Next, a processing system SYS of a fifth embodiment (hereinafter, the processing system SYS of the fifth embodiment will be referred to as "processing system SYSe") will be described with reference to Figs. 26 to 29. Fig. 26 is a perspective view showing a schematic structure of the processing system SYSe of the fifth embodiment. Fig. 27 is a front view showing a schematic structure of the processing system SYSe of the fifth embodiment. Fig. 28 is a side view showing a schematic structure of the processing system SYSe of the fifth embodiment. Fig. 29 is a front view showing an enlarged portion of the structure of the processing system SYSe of the fifth embodiment.

[0218] As shown in Figures 26 to 29, the processing system SYSe of the fifth embodiment differs from the processing system SYSd of the fourth embodiment in that it includes a processing device 1e instead of the processing device 1. The other features of the processing system SYSe may be the same as the other features of the processing system SYSd. The processing device 1e differs from the processing device 1d in that it includes a support device 14e instead of the support device 14d. The other features of the processing device 1e may be the same as the other features of the processing device 1d. Note that in Figures 26 to 29, in order to emphasize ease of viewing the drawings, some of the components of the processing system SYSe (e.g., the storage device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) are omitted.

[0219] The support device 14e supports the storage device 13, similar to the support device 14d. That is, the support device 14e supports the drive system 12 and the light irradiation device 11 via the storage device 13, similar to the support device 14d. The support device 14e is self-propelled without being supported by the workpiece SF, similar to the support device 14d. The support device 14e differs from the support device 14d in that it includes an arch member 141e and a moving block 142e instead of the gantry member 141d and the moving block 142d. Other features of the support device 14e may be the same as other features of the support device 14d.

[0220] The arch member 141e is an arch-shaped member in which a beam member 1412e having a curved shape (for example, having an arch shape) is disposed on the upper part of a plurality of leg members 1411e having a linear shape. In the example shown in FIG. 26 to FIG. 29, the plurality of leg members 1411e are linear members extending in the Z-axis direction, and the beam member 14e is a curved member extending along the X-axis direction and whose position in the Z-axis direction (i.e., height) changes depending on the position in the X-axis direction. The arch member 141e has a large size that can at least partially surround the workpiece SF without contacting the workpiece S. Specifically, the arch member 141e may have a large size that can sandwich the workpiece S between the plurality of leg members 1411e. The arch member 141e may have a large size that can position the beam member 1412e above the workpiece S. For example, in the example shown in FIGS. 26 to 29, the arch member 141e has a large size that allows it to straddle the fuselage of an aircraft, which is a specific example of the object S.

[0221] The arch member 141e, like the gantry member 141d of the fourth embodiment, is capable of self-moving along a rail (not shown) formed on a support surface (or other surface) on which the workpiece S is placed. In the example shown in FIG. 26, the arch member 141e is capable of self-moving, for example, along a rail (not shown) extending in the Y-axis direction. That is, in the example shown in FIG. 26, the arch member 141e is capable of self-moving along the Y-axis direction. However, the arch member 141e may be capable of self-moving along each of a plurality of different directions.

[0222] The moving block 142e is attached to the arch member 141e. For example, the moving block 142e may be attached to a beam member 1412e of the arch member 141e. For example, the moving block 142e may be attached to at least one leg member 1411e of the arch member 141e. The moving block 142e is attached to the arch member 141e so as to be movable along the arch member 141e. For example, the moving block 142e may be attached to a rail 143e (see FIG. 29) formed on the arch member 141e so as to be movable along the rail 143e. The rail 143e is formed on the beam member 1412e of the arch member 141e. The rail 143e may be formed on at least one leg member 1411e of the arch member 141e. In the example shown in Figures 26 to 29, the beam member 1412d is a curved member that extends along the X-axis direction and whose position in the Z-axis direction (i.e., height) changes depending on the position in the X-axis direction, and therefore the movable block 142e is movable along the X-axis direction and the Z-axis direction.

[0223] The driving system 12 and the light irradiation device 11 are attached to the moving block 142e via the unillustrated accommodation device 13. That is, the moving block 142e supports the driving system 12 and the light irradiation device 11 via the unillustrated accommodation device 13. Therefore, the light irradiation device 11 also moves due to the movement of the arch member 141e and the moving block 14e. Specifically, the light irradiation device 11 moves along the Y-axis direction due to the movement of the arch member 141e along the Y-axis direction. The light irradiation device 11 moves along the X-axis direction and the Z-axis direction due to the movement of the moving block 142e along each of the X-axis direction and the Z-axis direction. In the example shown in FIG. 26 to FIG. 29, the driving system 12 does not include the first driving system 121, but the driving system 12 may include the first driving system 121.

[0224] The machining system SYSe of the fifth embodiment can provide the same effects as those provided by the machining system SYSd of the fourth embodiment described above.

[0225] The processing system SYSe of the fifth embodiment, like the processing system SYSd of the fourth embodiment, may further include components specific to at least one of the processing systems SYSb of the second embodiment to SYSc of the third embodiment described above.

[0226] (6) Machining system SYSf according to the sixth embodiment Next, a processing system SYS of a sixth embodiment (hereinafter, the processing system SYS of the sixth embodiment will be referred to as "processing system SYSf") will be described. The processing system SYSf of the sixth embodiment is different from the processing system SYSa of the first embodiment in that it includes a processing device 1f instead of the processing device 1. Other features of the processing system SYSf may be the same as other features of the processing system SYSa. The processing device 1f is different from the processing device 1 in that it includes a drive system 12f instead of the drive system 12. Other features of the processing device 1f may be the same as other features of the processing device 1. For this reason, hereinafter, the drive system 12f of the sixth embodiment will be described with reference to Figs. 30 and 31. Figs. 30 and 31 are cross-sectional views showing the structure of the drive system 12f of the sixth embodiment.

[0227] As shown in Figs. 30 and 31, the drive system 12f is different from the drive system 12 in that it includes a plurality of second drive systems 122. Fig. 30 shows an example in which the drive system 12f includes two second drive systems 122, but the drive system 12f may include three or more second drive systems 122. Other features of the drive system 12f may be the same as other features of the drive system 12. Note that Fig. 30 shows an example in which the second drive system 122 is attached to the distal arm member 12124 of the first drive system 121 via the attachment member 1213. However, as described above, the second drive system 122 may be directly attached to the distal arm member 12124.

[0228] The second drive systems 122 may be arranged such that the direction of the elastic force applied by the air spring 1223 of one of the second drive systems 122 is different from the direction of the elastic force applied by the air spring 1223 of the other second drive systems 122 of the second drive systems 122. For example, in the example shown in Figs. 30 and 31, the air spring 1223#1 of the second drive system 122#1 is arranged to apply an elastic force along the X-axis direction, and the air spring 1223#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction. In this case, at least one air spring 1223 of the second drive systems 122 may be arranged to apply an elastic force along a direction including a gravity direction component. In the example shown in Figs. 30 and 31, the air spring 1223#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction, which is a direction including a gravity direction component.

[0229] However, as shown in Fig. 32 and Fig. 33, depending on the movement mode of the light irradiation device 11 by the drive system 12, the attitude of the light irradiation device 11 may change in a coordinate system formed by the X-axis, the Y-axis, and the Z-axis (that is, at least one of the amount of rotation around the X-axis, the amount of rotation around the Y-axis, and the amount of rotation around the Z-axis). Note that Fig. 32 is a front view showing the light irradiation device 11 whose attitude has changed so as to irradiate the processing light EL from diagonally below to diagonally above the aircraft, which is the processing object S, and Fig. 33 is a cross-sectional view showing a plurality of second drive systems 122 that connect the light irradiation device 11 shown in Fig. 32 and the first drive system 121. As a result, as shown in Fig. 32 and Fig. 33, the direction of the elastic force applied by the air spring 1223 may change in a coordinate system formed by the X-axis, the Y-axis, and the Z-axis. In the sixth embodiment, the second drive systems 122 may be arranged such that the direction of the elastic force applied by the air spring 1223 of one of the second drive systems 122 is different from the direction of the elastic force applied by the air spring 1223 of the other of the second drive systems 122 even when the posture of the light irradiation device 11 changes. For example, the second drive systems 122 may be arranged such that the direction in which the one of the second drive systems 122 connects the light irradiation device 11 and the first drive system 121 is different from the direction in which the other of the second drive systems 122 connects the light irradiation device 11 and the first drive system 121. Furthermore, the air spring 1223 of each of the second drive systems 122 may apply an elastic force along the direction in which the second drive system 122 connects the light irradiation device 11 and the first drive system 121. In this case, even when the posture of the light irradiation device 11 changes, the direction of the elastic force applied by the air spring 1223 of one second drive system 122 is different from the direction of the elastic force applied by the air spring 1223 of the other second drive system 122. For example, in the example shown in Fig. 32 and Fig. 33, the air spring 1223#1 of the second drive system 122#1 applies an elastic force along a direction in which the second drive system 122#1 connects the light irradiation device 11 (particularly, the housing 114) and the first drive system 121 (particularly, the mounting member 1213) (for example, a direction A1 from the lower left to the upper right in Fig. 33), and the air spring 1223#2 of the second drive system 122#2 applies an elastic force along a direction in which the second drive system 122#2 connects the light irradiation device 11 and the first drive system 121 (for example, a direction A2 from the upper left to the lower right in Fig. 33).

[0230] The multiple second driving systems 122 may be arranged such that the direction of the elastic force applied by the damper member 1224 of one of the multiple second driving systems 122 is different from the direction of the elastic force applied by the damper member 1224 of the other second driving systems 122 of the multiple second driving systems 122. For example, in the example shown in FIG. 30 and FIG. 31, the damper member 1224#1 of the second driving system 122#1 is arranged to apply an elastic force along the X-axis direction, and the damper member 1224#2 of the second driving system 122#2 is arranged to apply an elastic force along the Z-axis direction. In this case, at least one damper member 1224 of the multiple second driving systems 122 may be arranged to apply an elastic force along a direction including a gravity direction component. In the example shown in FIG. 30 and FIG. 31, the damper member 1224#2 of the second driving system 122#2 is arranged to apply an elastic force along the Z-axis direction, which is a direction including a gravity direction component.

[0231] However, as shown in Fig. 32 and Fig. 33, for the same reason as when the direction of the elastic force applied by the air spring 1223 changes, the direction of the elastic force applied by the damper member 1224 may change in a coordinate system formed by the X-axis, the Y-axis, and the Z-axis. In the sixth embodiment, the multiple second drive systems 122 may be arranged such that the direction of the elastic force applied by the damper member 1224 of one second drive system 122 is different from the direction of the elastic force applied by the damper member 1224 of the other second drive systems 122 even when the posture of the light irradiation device 11 changes. For example, the direction in which one second drive system 122 connects the light irradiation device 11 and the first drive system 121 may be different from the direction in which the other second drive system 122 connects the light irradiation device 11 and the first drive system 121. Furthermore, the damper member 1224 of each second drive system 122 may apply an elastic force along a direction in which each second drive system 122 connects the light irradiation device 11 and the first drive system 121. In this case, even if the attitude of the light irradiation device 11 changes, the direction of the elastic force applied by the damper member 1224 of one second drive system 122 will be different from the direction of the elastic force applied by the damper member 1224 of the other second drive system 122. For example, in the example shown in Figures 32 and 33, the damper member 1224#1 of the second drive system 122#1 applies an elastic force along the direction in which the second drive system 122#1 connects the light irradiation device 11 and the first drive system 121 (for example, direction A1 from the lower left to the upper right in Figure 33), and the damper member 1224#2 of the second drive system 122#2 applies an elastic force along the direction in which the second drive system 122#2 connects the light irradiation device 11 and the first drive system 121 (for example, direction A2 from the upper left to the lower right in Figure 33).

[0232] The second drive systems 122 may be arranged such that the direction of the drive force applied by the drive member 1225 of one of the second drive systems 122 is different from the direction of the drive force applied by the drive member 1225 of the other second drive systems 122 of the second drive systems 122. For example, in the example shown in FIG. 30 and FIG. 31, the drive member 1225#1 of the second drive system 122#1 is arranged to apply a drive force along a direction intersecting the X-axis (e.g., at least one of the Y-axis direction and the Z-axis direction), and the drive member 1225#2 of the second drive system 122#2 is arranged to apply a drive force along a direction intersecting the Z-axis (e.g., at least one of the X-axis direction and the Y-axis direction). In this case, at least one drive member 1225 of the second drive systems 122 may be arranged to apply a drive force along a direction including a directional component intersecting the gravity direction. In the example shown in Figures 30 and 31, the driving member 1225#2 of the second driving system 122#2 is arranged so as to apply an elastic force along at least one of the X-axis direction and the Y-axis direction, which are directions that include a directional component that intersects the direction of gravity.

[0233] However, as shown in Fig. 32 and Fig. 33, for the same reason as when the direction of the elastic force applied by the air spring 1223 changes, the direction of the driving force applied by the driving member 1225 may change in a coordinate system formed by the X-axis, the Y-axis, and the Z-axis. In the sixth embodiment, the multiple second driving systems 122 may be arranged such that the direction of the driving force applied by the driving member 1225 of one second driving system 122 is different from the direction of the driving force applied by the driving member 1225 of the other second driving systems 122, even when the attitude of the light irradiation device 11 changes. For example, the direction in which one second driving system 122 connects the light irradiation device 11 and the first driving system 121 may be different from the direction in which the other second driving system 122 connects the light irradiation device 11 and the first driving system 121. Furthermore, the driving member 1225 of each second driving system 122 may apply a driving force along a direction intersecting the direction in which each second driving system 122 connects the light irradiation device 11 and the first driving system 121. In this case, even if the attitude of the light irradiation device 11 changes, the direction of the driving force applied by the driving member 1225 of one second driving system 122 will be different from the direction of the driving force applied by the driving member 1225 of the other second driving system 122. For example, in the example shown in Figures 32 and 33, the driving member 1225#1 of the second driving system 122#1 applies a driving force along a direction intersecting the direction in which the second driving system 122#1 connects the light irradiation device 11 and the first driving system 121 (for example, direction A2 from the upper left to the lower right in Figure 33), and the driving member 1225#2 of the second driving system 122#2 applies a driving force along a direction intersecting the direction in which the second driving system 122#2 connects the light irradiation device 11 and the first driving system 121 (for example, direction A1 from the lower left to the upper right in Figure 33).

[0234] 30 and 31, the number of air springs 1223, the number of damper members 1224, and the number of driving members 1225 do not have to be equal to one another. For example, the number of air springs 1223 may be less than the number of driving members 1225.

[0235] The processing system SYSf of the sixth embodiment can achieve the same effects as those achieved by the processing system SYSa of the first embodiment. In addition, since the processing system SYSf includes a plurality of second drive systems 122, the degree of freedom of the posture of the light irradiation device 11 is improved compared to the processing system SYSa including a single second drive system 122. For example, in the processing system SYSf, the light irradiation device 11 can move to have not only a first posture in which the processing light EL is irradiated from above the workpiece S downward, but also a second posture in which the processing light EL is irradiated from obliquely above the workpiece S obliquely downward, a third posture in which the processing light EL is irradiated from side to side of the workpiece S, a fourth posture in which the processing light EL is irradiated from obliquely below the workpiece S obliquely upward, and a fifth posture in which the processing light EL is irradiated from below the workpiece S upward. Therefore, the processing system SYSf can appropriately form a structure on the coating film SF of the workpiece S having a complex shape.

[0236] In the sixth embodiment, the connection point between the first driving system 121 and the light irradiation device 11 by the second driving system 122 may be located between the first surface of the light irradiation device 11 and the second surface facing the opposite side to the first surface of the light irradiation device 11. For example, as shown in Fig. 30, when the light irradiation device 11 has a housing 114, the connection point CP between the first driving system 121 and the light irradiation device 11 by the second driving system 122 may be located between the first surface of the housing 114 (for example, a surface 1141 of the housing 114 facing the opposite side to the workpiece S) and the second surface of the housing 114 (for example, a surface 1142 of the housing 114 facing the workpiece S). In this way, when the connection point CP is disposed between the first surface and the second surface of the light irradiation device 11 (for example, between the surface 1141 and the surface 1142 of the housing 114), the positioning accuracy of the light irradiation device 11 is improved compared to when the connection point CP is not disposed between the first surface and the second surface of the light irradiation device 11 (for example, between the surface 1141 and the surface 1142 of the housing 114). In this case, the connection point CP between the first drive system 121 and the light irradiation device 11 by the second drive system 122 may be located at the center of gravity GP (see FIG. 30) of the light irradiation device 11. When the connection point CP is located at the center of gravity GP, the positioning accuracy of the light irradiation device 11 is improved compared to when the connection point CP is not located at the center of gravity GP. Incidentally, not only in the sixth embodiment but also in at least one of the first to fifth embodiments, the connection point CP may be disposed between the first and second surfaces of the light irradiation device 11 (for example, between the surfaces 1141 and 1142 of the housing 114). In at least one of the first to fifth embodiments, the connection point CP may be disposed at the center of gravity position GP.

[0237] The machining system SYSf of the sixth embodiment may further include components specific to at least one of the machining systems SYSb of the second embodiment to SYSe of the fifth embodiment. The components specific to the machining system SYSd of the fourth embodiment include components related to the support device 14d. The components specific to the machining system SYSe of the fifth embodiment include components related to the support device 14e.

[0238] (7) Machining system SYSg according to the seventh embodiment Next, a processing system SYS of a seventh embodiment (hereinafter, the processing system SYS of the seventh embodiment will be referred to as a "processing system SYSg") will be described with reference to Fig. 34. Fig. 34 is a cross-sectional view that illustrates a structure of the processing system SYSg of the seventh embodiment.

[0239] As shown in FIG. 34, the processing system SYSg of the seventh embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1g instead of the processing device 1. The other features of the processing system SYSg may be the same as the other features of the processing system SYSa. The processing device 1g differs from the processing device 1 in that it includes a support device 14g instead of the support device 14. The other features of the processing device 1g may be the same as the other features of the processing device 1. In FIG. 34, in order to emphasize ease of viewing the drawing, some of the components of the processing system SYSg (e.g., the storage device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) are omitted.

[0240] The support device 14g supports the storage device 13, similar to the support device 14. That is, the support device 14g supports the drive system 12 and the light irradiation device 11 via the storage device 13, similar to the support device 14. The support device 14g is different from the support device 14, which does not need to be able to fly, in that the support device 14g is capable of flying at a position away from the work-piece SF. An example of the support device 14g that is capable of flying is an aircraft or other flying object. The aircraft may be remotely controlled, may be controlled by a pilot on board the aircraft, or may be capable of autonomous flight. An example of the aircraft is at least one of an aircraft, a drone (see FIG. 34), a helicopter, a balloon, and an airship.

[0241] The machining system SYSg of the seventh embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above.

[0242] The machining system SYSg of the seventh embodiment may further include components specific to at least one of the machining system SYSb of the second embodiment to the machining system SYSf of the sixth embodiment. The components specific to the machining system SYSf of the sixth embodiment include components related to the drive system 12f.

[0243] (8) Other modifications In the above description, the drive system 12 includes the first drive system 121 and the second drive system 122. However, the drive system 12 does not necessarily have to include the first drive system 121. In this case, the second drive system 122 may be attached to the storage device 13 without the first drive system 121. The second drive system 122 may be attached to the support device 14 (or the support device 14d, 14e, or 14g) without the first drive system 121.

[0244] In the above description, the processing system SYS deflects the processing light EL with the galvanometer mirror 1122 in order to cause the multiple processing light beams EL to scan the surface of the coating film SF. However, in addition to or instead of deflecting the processing light EL with the galvanometer mirror 1122, the processing apparatus 1 may move the light irradiation device 11 relative to the coating film SF to cause the multiple processing light beams EL to scan the surface of the coating film SF. That is, the control device 2 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF so that the processing light EL scans the surface of the coating film SF.

[0245] One of the purposes of the drive system 12 moving the light irradiation device 11 relative to the coating film SF is to cause the processing light EL to scan the surface of the coating film SF, as described above. Therefore, if the processing light EL can be scanned over the coating film SF without moving the light irradiation device 11, the light irradiation device 11 does not need to move. In other words, the processing system SYS does not need to be equipped with the drive system 12.

[0246] One of the purposes of the drive system 12 moving the light irradiation device 11 relative to the coating film SF is to scan the multiple processing shot areas SA in sequence with the processing light EL without moving the accommodation device 13 and the support device 14 when multiple processing shot areas SA are accommodated in the accommodation space SP of the accommodation device 13. For this reason, when a single processing shot area SA is accommodated in the accommodation space SP, the light irradiation device 11 does not need to move. In other words, the processing device 1 does not need to be equipped with the drive system 12.

[0247] In the above description, the processing apparatus 1 includes the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17. However, the processing apparatus 1 does not need to include at least one of the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17, as long as the processing apparatus 1 can process the workpiece S. The processing apparatus 1 does not need to include at least a part of the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17, as long as the processing apparatus 1 can process the workpiece S. When the processing apparatus 1 does not include the storage device 13, the drive system 12 may be attached to the support device 14. Furthermore, the structures of the above-mentioned storage device 13, support device 14, drive system 15, exhaust device 16 and gas supply device 17 are merely examples, and the processing apparatus 1 may be equipped with at least one of the storage device 13, support device 14, drive system 15, exhaust device 16 and gas supply device 17 having a structure different from the structures described above.

[0248] In the above description, the processing system SYS forms a riblet structure by the coating film SF on the surface of the processing object S. However, the processing system SYS may form an arbitrary structure by the coating film SF having an arbitrary shape on the surface of the processing object S. Even in this case, if the control device 2 controls the light irradiation device 11, etc. so that the processing light EL scans the surface of the coating film SF along a scanning trajectory according to the structure to be formed, an arbitrary structure having an arbitrary shape can be formed. An example of an arbitrary structure is a fine texture structure (typically an uneven structure) of the order of micrometers or nanometers formed regularly or irregularly. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure having a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure having at least one of a liquid repellency function and a self-cleaning function (for example, having a lotus effect). The fine texture structure may include at least one of a fine protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, and a honeycomb structure having a droplet collecting function.

[0249] In the above description, the processing system SYS evaporates the coating film SF by irradiating the processing light EL, thereby removing the coating film SF. However, in addition to or instead of evaporating the coating film SF by irradiating the processing light EL, the processing system SYS may remove the coating film SF by changing the properties of the coating film SF by irradiating the processing light EL. For example, the processing system SYS may melt the coating film SF by irradiating the processing light EL, and remove the melted coating film SF, thereby removing the coating film SF. For example, the processing system SYS may make the coating film SF brittle by irradiating the processing light EL, and remove the coating film SF by peeling off the brittle coating film SF. In the above description, the processing system SYS ablates the coating film SF formed on the surface of the processing object S. However, the processing system SYS may remove a part of the coating film SF formed on the surface of the processing object S by thermal processing.

[0250] In the above description, the processing system SYS forms the recess C (or the recessed structure CP1, or any structure such as a riblet structure due to the recessed structure CP1) by removing the coating film SF. That is, the processing system SYS processes the coating film SF so as to partially thin the coating film SF. However, in addition to or instead of partially thinning the coating film SF, the processing system SYS may process the coating film SF so as to partially thicken the coating film SF. That is, in addition to or instead of forming the recess C by removing the coating film SF, the processing system SYS may form a convex portion (or a convex structure CP2, or any structure due to the convex structure CP2) by adding the coating film SF. For example, the processing system SYS may irradiate the processing light EL to a first portion of the coating film SF to remove the coating film SF in the first portion, and then fix the removed coating film SF to a second portion of the coating film SF to make the coating film SF in the second portion relatively thick (that is, a convex portion may be formed in the second portion).

[0251] In the above description, the processing system SYS processes the coating film SF formed on the surface of the workpiece S. However, the processing system SYS may process any coating other than the coating film SF formed on the surface of the workpiece S. Alternatively, the processing system SYS may process a structure in which multiple layers are stacked. Specifically, the processing system SYS may process at least one layer (typically at least one layer including the most superficial layer) among the multiple layers constituting the structure. The processing system SYS may process at least one layer among the multiple layers constituting the structure to form a structure by the layers. In this case, the at least one layer to be processed corresponds to the above-mentioned coating film SF, and the other layers other than the at least one layer correspond to the workpiece S. Alternatively, the processing system SYS may process the workpiece S itself. In other words, the processing system SYS may process the workpiece S on whose surface the coating film SF or any coating is not formed.

[0252] In the above description, the processing system SYS forms a riblet structure on the workpiece S to reduce the resistance of the surface of the workpiece S to the fluid. However, the processing system SYS may form another structure on the workpiece S different from the riblet structure for reducing the resistance of the surface to the fluid. For example, the processing system SYS may form on the workpiece S a riblet structure for reducing noise generated when the fluid and the surface of the workpiece S move relatively to each other. For example, the processing system SYS may form on the workpiece S a structure that generates vortices in response to the flow of the fluid on the surface of the workpiece S. For example, the processing system SYS may form on the workpiece S a structure for imparting hydrophobicity to the surface of the workpiece S.

[0253] In the above description, the processing system SYS that processes an object with the processing light EL is described. That is, in the above description, an example in which the second drive system 122 connects the irradiation device 11 and the first drive system 121 is described. However, in addition to or instead of the light irradiation device 11 in the processing system SYS, an end effector that acts on the object may be used. For example, the second drive system 122 may connect the end effector and the first drive system 121. Here, the end effector may be a part that has a function of directly acting on the work target (e.g., the object). Also, the end effector may be a part that obtains the properties of the work target (e.g., the object). Here, the properties of the object (e.g., the work target) may include at least one of the shape of the object, the position of the object, the position of the feature point of the object, the attitude of the object, the surface property of the object (e.g., at least one of reflectance, spectral reflectance, surface roughness, color, etc.), and the hardness of the object. Note that the light irradiation device 11 and the position measurement device 18 in the above description can be considered as a type of end effector.

[0254] An example of such an apparatus having an end effector is a first apparatus having a first drive system 121 as a movable member capable of changing the relative positional relationship between the end effector and a part of an object, and a second drive system 122 as a connection device connecting the first drive system 121 and the end effector so that the relative positional relationship between the first drive system 121 and the end effector can be changed. The first apparatus may be called a robot system. Also, an example of an apparatus having an end effector may be a second apparatus having an end effector and the second drive system 122. The second apparatus may be called an end effector apparatus. The apparatus may be configured with the second drive system 122 as a connection device connecting the first drive system 121 and the end effector.

[0255] An end effector Efa, which is an example of an end effector, is shown in Fig. 35. As shown in Fig. 35, the end effector Efa includes an attachment part Ef1 that is attached to a connection device (for example, the second drive system 122), and a plurality of finger modules attached to a plurality of attachment surfaces (three attachment surfaces in the example shown in Fig. 35) inclined with respect to the axis of the attachment part Ef1 (typically, the axis connecting the attachment part Ef1 and the connection device). Each finger module includes a first link module Ef21 rotatable around a first joint axis of the attachment part Ef1, a first drive module Ef31 provided on the first link module Ef21 and driving the first link module Ef21 to rotate around the first joint axis, a second link module Ef22 provided on the first link module Ef21 and rotatable around a second joint axis perpendicular to the first joint axis, a second drive module Ef32 driving the second link module Ef22 to rotate around the second joint axis, a third link module Ef23 provided on the second link module Ef22 to be rotatable around a third joint axis, and a third drive unit Ef33 driving the third link module Ef23 to rotate around the third joint axis. Here, the end effector Efa may be referred to as a hand. Also, a part of the third link module Ef23 (typically a tip portion) may be regarded as a gripping portion for gripping an object, and may be referred to as a fingertip of the hand.

[0256] A position measuring device 18 may be attached to the attachment part Ef1. In this case, the measurement axis of the position measuring device may be a direction along the axis of the attachment part Ef1, a direction parallel to the axis of the attachment part Ef1, or a direction inclined with respect to the axis of the attachment part Ef1. The position measuring device 18 may measure at least one of at least a part of the object and a part of the end effector Efa (typically, a gripping part or a fingertip). Also, a part of the position measuring device 18b (typically, an index member 181b) may be attached to the attachment part Ef1.

[0257] The end effector is not limited to the end effector Efa as a hand capable of gripping an object shown in Fig. 35 or the position measuring device. For example, the end effector may include at least one of an adsorption holding device Efb for adsorbing and holding an object as shown in Fig. 36(a), a spray-type painting device Efc shown in Fig. 36(b), a roller-type painting device Efd shown in Fig. 36(c), a machining head device Efe equipped with a cutting tool such as a drill shown in Fig. 36(d), and a welding gun device Eff shown in Fig. 36(e). For example, the end effector may include at least one of an injector for injecting molten metal, molten resin, or particles for blasting, a manipulator, and an air blower.

[0258] When the end effector requires power, the connection device may supply power to the end effector in a non-contact manner. Also, the output from the end effector may be output to the outside (typically, the control device 2) in a non-contact manner such as wireless or optical transmission.

[0259] (9) Additional Notes The following supplementary notes are further disclosed regarding the above-described embodiment. [Appendix 1] An active vibration isolation device; an irradiation device attached to the active vibration isolation device and configured to irradiate an object with processing light for processing the object; a control device that controls the active vibration isolation device to change a relative position between the object and the irradiation device; A processing system comprising: [Appendix 2] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so as to align the object with the irradiation area of ​​the processing light. 2. The processing system of claim 1. [Appendix 3] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the processing light is irradiated onto a desired position of the object. 3. The processing system according to claim 1 or 2. [Appendix 4] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the amount of vibration of the irradiation device with respect to the object is smaller than when the active vibration isolation device is not controlled. 4. The processing system of any one of claims 1 to 3. [Appendix 5] the irradiation device is attached to another member via the active vibration isolation device; The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the vibration amount of the irradiation device relative to the object is smaller than the vibration amount of the other member relative to the object. 5. The processing system of any one of claims 1 to 4. [Appendix 6] The active vibration isolation device further includes a moving device for moving the active vibration isolation device. 6. The processing system of any one of claims 1 to 5. [Appendix 7] The moving device moves the irradiation device together with the active vibration isolation device. 7. The processing system of claim 6. [Appendix 8] The active vibration isolation device is attached to the moving device. 8. The processing system according to claim 6 or 7. [Appendix 9] The irradiation device is attached to the moving device via the active vibration isolation device. 9. The processing system of any one of claims 6 to 8. [Appendix 10] The moving device includes a plurality of arm members and a joint member that swingably connects the plurality of arm members. 10. The processing system of any one of claims 6 to 9. [Appendix 11] The moving device includes a self-propelled device capable of self-propelling without interfering with the object. 11. The processing system of any one of claims 6 to 10. [Appendix 12] The moving device includes a self-propelled device that is capable of self-propelling while being supported by the object. 12. The processing system of any one of claims 6 to 11. [Appendix 13] The moving device includes a flying device capable of flying at a position away from an object. 13. The processing system of any one of claims 6 to 12. [Appendix 14] The control device controls the moving device to change the relative position between the object and the irradiation device. 14. The processing system of any one of claims 6 to 13. [Appendix 15] The control device controls the moving device to change the relative position between the object and the irradiation device so as to align the object with the irradiation area of ​​the processing light. 15. The processing system of claim 14. [Appendix 16] The control device controls the moving device to change the relative position between the object and the irradiation device so that the processing light is irradiated onto a desired position of the object. 16. The processing system according to claim 14 or 15. [Appendix 17] The amount of change in the relative position between the object and the irradiation device caused by the active vibration isolation device is smaller than the amount of change in the relative position between the object and the irradiation device caused by the moving device. 17. The processing system of any one of claims 14 to 16. [Appendix 18] The accuracy of changing the relative position between the object and the irradiation device by the active vibration isolation device is higher than the accuracy of changing the relative position between the object and the irradiation device by the moving device. 18. The processing system of any one of claims 14 to 17. [Appendix 19] The control device controls at least one of the active vibration isolation device and the moving device to change the relative position between the object and the irradiation device so that the amount of vibration of the irradiation device with respect to the object is smaller than when the active vibration isolation device and the moving device are not controlled. 19. The processing system of any one of claims 14 to 18. [Appendix 20] The control device controls at least one of the active vibration isolation device and the moving device based on a frequency of vibration of the irradiation device relative to the object so that a vibration amount of the irradiation device relative to the object is reduced. 20. The processing system of claim 19. [Appendix 21] the control device controls the moving device so that a vibration amount of the irradiation device with respect to the object is reduced when the frequency is included in a first frequency range; The control device controls the active vibration isolation device so that a vibration amount of the irradiation device with respect to the object is reduced when the frequency is included in a second frequency range higher than the first frequency range. 21. The processing system of claim 20. [Appendix 22] the irradiation device is attached to another member via the active vibration isolation device; The active vibration isolation device includes a position change device that changes a relative position between the other member and the irradiation device, and a vibration damping device that damps vibrations transmitted between the other member and the irradiation device. 22. The processing system of any one of claims 1 to 21. [Appendix 23] The control device changes the relative position between the object and the irradiation device by changing the relative position between the other member and the irradiation device using the position change device. 23. The processing system of claim 22. [Appendix 24] the position changing device changes a relative position between the other member and the irradiation device by an electrical force; The vibration damping device damps vibration transmitted between the other member and the irradiation device by air pressure. 24. The processing system according to claim 22 or 23. [Appendix 25] The present invention further includes a position measuring device that measures a relative position between the object and the irradiation device. 25. The processing system of any one of claims 1 to 24. [Appendix 26] The control device controls the active vibration isolation device based on the measurement result of the position measurement device. 26. The processing system of claim 25. [Appendix 27] A plurality of the position measuring devices are provided, The control device controls the active vibration isolation device based on information regarding a relative position between a measurement reference position of a first position measurement device among the plurality of position measurement devices and a measurement reference position of a second position measurement device among the plurality of position measurement devices, and based on measurement results of the first and second position measurement devices. 27. The processing system according to claim 25 or 26. [Appendix 28] The position measurement device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measurement device that measures the position of the index member. 28. The processing system of any one of claims 25 to 27. [Appendix 29] The indicator member includes a marker, The index measurement device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker. 29. The processing system of claim 28. [Appendix 30] The index member includes a transmitter capable of transmitting a signal, The index measurement device includes a receiving device capable of receiving the signal. 30. The processing system of claim 28 or 29. [Appendix 31] The position measurement device includes an object measurement device that measures the object. 31. The processing system of any one of claims 25 to 30. [Appendix 32] Irradiating an object with processing light for processing the object from an irradiation device attached to the active vibration isolation device; Using the active vibration isolation device to change the relative position between the object and the illumination device; A processing method comprising the steps of: [Appendix 33] An active vibration isolation device; an end effector attached to the active vibration isolation device and adapted to act on an object; a control device that controls the active vibration isolation device to change the relative position between the object and the end effector; A robot system comprising: [Appendix A1] In a processing system that processes an object using processing light, a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device that irradiates the processing light toward the object; a connection device that connects the movable member and the irradiation device so that a relative positional relationship between the movable member and the irradiation device can be changed; Equipped with The connection device includes a drive member that moves at least one of the movable member and the irradiation device, and an elastic member that connects the movable member and the irradiation device. Processing system. [Appendix A2] The driving member applies a driving force along a first direction to at least one of the movable member and the irradiation device, The elastic member applies an elastic force to at least one of the movable member and the irradiation device along a second direction intersecting the first direction. 1. A processing system as described in Appendix A1. [Appendix A3] The elastic member supports the weight of the irradiation device. 1. A processing system as described in Appendix A2. [Appendix A4] The elastic member supports the weight in the second direction. 1. A processing system as described in Appendix A3. [Appendix A5] The driving member applies a driving force along a first direction to at least one of the movable member and the irradiation device, The elastic member exerts an elastic force on at least one of the movable member and the irradiation device along a second direction having a component along the first direction. 13. The processing system according to any one of appendices A1 to A4. [Appendix A6] The driving member provides the driving force to change the resonant frequency of the elastic member. 13. A processing system as described in Appendix A5. [Appendix A7] The elastic member connects the movable member and the irradiation device such that at least one of a position and a posture of the irradiation device can be changed with respect to the movable member. 13. The processing system according to any one of appendices A1 to A4. [Appendix A8] The connection device includes a first elastic member that imparts an elastic force to at least one of the movable member and the irradiation device along a first direction, and a second elastic member that imparts an elastic force to at least one of the movable member and the irradiation device along a second direction different from the first direction. 13. The processing system according to any one of claims A1 to A7. [Appendix A9] The connection member includes a first elastic member that imparts an elastic force to at least one of the movable member and the irradiation device along a first direction including a gravity direction component, and a second elastic member that imparts an elastic force to at least one of the movable member and the irradiation device along a second direction different from the first direction. 13. The processing system according to any one of claims A1 to A7. [Appendix A10] The connection device includes a first drive member that applies a drive force along a third direction to at least one of the movable member and the irradiation device, and a second drive member that applies a drive force along a fourth direction different from the third direction to at least one of the movable member and the irradiation device. 13. A processing system according to claim 8 or A9. [Appendix A11] The connection device connects a first portion of the movable member, the first portion being capable of changing a relative positional relationship with a part of the object, to a second portion that is a part of the irradiation device. 13. The processing system of any one of claims A1 to A10. [Appendix A12] a control device that controls the driving member so that a vibration amount of the irradiation device is smaller than a vibration amount of the first portion. 2. A processing system as described in Appendix A11. [Appendix A13] a moving device for moving the position of the first portion of the movable member relative to the part of the object. 13. A processing system according to claim A11 or A12. [Appendix A14] The positioning accuracy of the second portion by the driving member is higher than the positioning accuracy of the first portion by the moving device. 2. A processing system as described in Appendix A13. [Appendix A15] A range of movement of the first part by the moving device is greater than a range of movement of the second part by the drive member. 13. A processing system according to claim A13 or A14. [Appendix A16] a position measuring device that measures a relative positional relationship between the object and the irradiation device; The drive member is controlled using an output from the position measurement device. 5. The processing system of claim 1, further comprising: [Appendix A17] a position measuring device that measures a relative positional relationship between the object and the irradiation device; The output from the position measurement device is used to control the moving device. 5. The processing system of claim 1, further comprising: [Appendix A18] The position measurement device measures the position of the object relative to the projection device. 13. A processing system according to claim A16 or A17. [Appendix A19] The position measuring device measures the position of the irradiation device relative to a reference position. 19. The processing system of any one of appendix A16 to A18. [Appendix A20] The range in which the processing light can be irradiated by the irradiation device is changed by moving the irradiation device. 13. The processing system of any one of claims A1 to A19. [Appendix A21] the connection device connects a first portion of the movable member, the first portion being capable of changing a relative positional relationship with a part of the object, to a second portion that is a part of the irradiation device; The elastic member reduces vibration from the first portion to the second portion, The driving member reduces the relative displacement between the first portion and the second portion due to the vibration from the first portion toward the second portion. 13. The processing system of any one of claims A1 to A20. [Appendix A22] The irradiation device includes an irradiation position changing device that changes an irradiation position of the processing light on the object relative to the irradiation device. 13. The processing system of any one of claims A1 to A21. [Appendix A23] The driving member reduces a positional deviation of the irradiation position caused by an operation of the irradiation position changing device. 2. The processing system described in Appendix A22. [Appendix A24] A plurality of position measuring devices; a control device that controls the driving member based on information on a relative position between a measurement reference position of a first position measuring device among the plurality of position measuring devices and a measurement reference position of a second position measuring device among the plurality of position measuring devices, and on measurement results of the first and second position measuring devices; 23. The processing system of claim 1, further comprising: [Appendix A25] The position measurement device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measurement device that measures the position of the index member. 13. The processing system according to any one of appendix A16 to A19 and A24. [Appendix A26] The indicator member includes a marker, The index measurement device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker. 2. A processing system as described in Appendix A25. [Appendix A27] The index member includes a transmitter capable of transmitting a signal, The index measurement device includes a receiving device capable of receiving the signal. 13. A processing system according to claim A25 or A26. [Appendix A28] The position measurement device includes an object measurement device that measures the object. 13. The processing system according to any one of appendices A16 to A19 and A24 to A27. [Appendix A29] In a processing system that processes an object using processing light, a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device that irradiates the processing light toward the object; a connection device that connects the movable member and the irradiation device so that a relative positional relationship between the movable member and the irradiation device can be changed; a vibration reduction device that reduces vibration directed from the movable member to the irradiation device; A processing system comprising: [Appendix A30] The vibration reduction device includes a drive member that moves at least one of the movable member and the irradiation device, and an elastic member that connects the movable member and the irradiation device. 2. The processing system described in Appendix A29. [Appendix A31] The vibration reduction device includes a control device that controls the driving member so that the vibration amount of the irradiation device is smaller than the vibration amount of the movable member. 2. A processing system as described in Appendix A30. [Appendix A32] Further comprising a position measuring device that measures a relative positional relationship between the object and the irradiation device, The control device controls the driving member using an output from the position measurement device. 2. A processing system as described in Appendix A31. [Appendix A33] The position measuring device measures the position of the projection device relative to the object. 2. A processing system as described in Appendix A32. [Appendix A34] The position measuring device measures the position of the irradiation device relative to a reference position. 13. A processing system according to claim 32 or A33. [Appendix A35] The irradiation device includes an irradiation position changing device that changes an irradiation position of the processing light on the object relative to the irradiation device. 13. The processing system of any one of claims A29 to A34. [Appendix A36] The vibration reduction device reduces a position shift of the irradiation device caused by an operation of the irradiation position changing device. 2. A processing system as described in Appendix A35. [Appendix A37] The present invention further includes a position measuring device for measuring a relative positional relationship between the object and the irradiation position. 13. A processing system according to claim 12, A23, A35 or A36. [Appendix A38] The position measuring device measures the irradiation position with respect to the object. 2. A processing system as described in Appendix A37. [Appendix A39] The processing light is irradiated from the irradiation device onto a sensitive member whose characteristics change due to the irradiation of the processing light, and a portion of the sensitive member whose characteristics have changed is measured by the position measurement device. 2. A processing system as described in Appendix A38. [Appendix A40] A plurality of position measuring devices; a control device that controls the vibration reduction device based on information on a relative position between a measurement reference position of a first position measurement device among the plurality of position measurement devices and a measurement reference position of a second position measurement device among the plurality of position measurement devices, and on measurement results of the first and second position measurement devices; 30. The processing system of any one of claims A29 to A39, comprising: [Appendix A41] The position measurement device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measurement device that measures the position of the index member. 13. The processing system of any one of claims A32 to A34 and A40. [Appendix A42] The indicator member includes a marker, The index measurement device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker. 2. A processing system as described in Appendix A41. [Appendix A43] The index member includes a transmitter capable of transmitting a signal, The index measurement device includes a receiving device capable of receiving the signal. 10. A processing system according to claim A41 or A42. [Appendix A44] The position measurement device includes an object measurement device that measures the object. 13. The processing system according to any one of appendices A32 to A34 and A40 to A43. [Appendix A45] In a processing system that processes an object using processing light, a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device that irradiates the processing light toward the object; a connection device that connects the movable member and the irradiation device so that a relative positional relationship between the movable member and the irradiation device can be changed; a position measuring device that measures the position of the irradiation device relative to the object or a reference position; Equipped with The connection device includes a position change member that changes the position of the irradiation device relative to the movable member based on a position measurement result by the position measurement device. Processing system. [Appendix A46] The connecting device includes an elastic member that connects the movable member and the illumination device. 2. A processing system as described in Appendix A45. [Appendix A47] The movable member includes a plurality of arm members and a joint member that swingably connects the plurality of arm members. 13. The processing system of any one of appendices A1 to A46. [Appendix A48] The movable member includes a self-propelled device capable of self-propelling without interfering with the object. 13. The processing system of any one of appendices A1 to A47. [Appendix A49] The movable member includes a self-propelled device that is capable of self-propelling while being supported by the object. 13. The processing system of any one of appendices A1 to A48. [Appendix A50] The movable member includes a flying device capable of flying at a position away from the object. 13. The processing system of any one of appendices A1 to A49. [Appendix A51] The moving device includes a self-propelled device capable of self-propelling without interfering with the object. 13. The processing system according to any one of claims A13 to A15 and A17. [Appendix A52] The moving device includes a self-propelled device that is capable of self-propelling while being supported by the object. 13. The processing system according to any one of appendix A13 to A15, A17 and A51. [Appendix A53] The moving device includes a flying device capable of flying at a position away from an object. 13. The processing system according to any one of appendix A13 to A15, A17 and A51 to A52. [Appendix A54] The illumination device includes a housing having a first surface facing a first side and a second surface facing a second side opposite the first side; A connection portion between the movable member and the irradiation device by the connection member is located between the first surface and the second surface. 13. The processing system of any one of appendices A1 to A53. [Appendix A55] The connection point is located at the center of gravity of the irradiation device. 2. A processing system as described in Appendix A54. [Appendix A56] In a processing method for processing an object with processing light, Changing a positional relationship between a position of a movable member and a position of a portion of the object; Irradiating the object with the processing light using an irradiation device; Changing a relative positional relationship between the movable member and the irradiation device; connecting the movable member and the irradiation device by a connecting portion including a driving member for moving at least one of the movable member and the irradiation device, and an elastic member for connecting the movable member and the irradiation device; A processing method comprising the steps of: [Appendix A57] In a processing method for processing an object with processing light, Changing a positional relationship between a position of a movable member and a position of a portion of the object; Irradiating the object with the processing light using an irradiation device; Changing a relative positional relationship between the movable member and the irradiation device; Reducing vibration from the movable member to the irradiation device; A processing method comprising the steps of: [Appendix A58] In a processing method for processing an object with processing light, Changing a positional relationship between a position of a movable member and a position of a portion of the object; Irradiating the object with the processing light using an irradiation device; measuring a position of the illumination device relative to the object or a reference position; changing a relative positional relationship between the movable member and the irradiation device based on the measured position of the irradiation device; A processing method comprising the steps of: [Appendix A59] an end effector that acts on an object; A movable member whose relative relationship with a portion of the object is changeable; a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed; Equipped with The connecting device includes a driving member that moves at least one of the movable member and the end effector, and an elastic member that connects the movable member and the end effector. Robot system. [Appendix A60] an end effector that acts on an object; A movable member whose relative relationship with a portion of the object is changeable; a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed; a vibration reduction device that reduces vibration from the movable member toward the end effector; A robot system comprising: [Appendix A61] an end effector that acts on an object; A movable member whose relative relationship with a portion of the object is changeable; a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed; a position measuring device that measures a position of the end effector relative to the object or a reference position; Equipped with The connection device includes a position change member that changes the position of the end effector relative to the movable member based on a position measurement result by the position measurement device. Robot system. [Appendix A62] The movable member includes a plurality of arm members and a joint member that swingably connects the plurality of arm members. 13. The robot system of any one of appendices A59 to A61. [Appendix A63] The movable member includes a self-propelled device capable of self-propelling without interfering with the object. 13. The robot system of any one of appendices A59 to A62. [Appendix A64] The movable member includes a self-propelled device that is self-propelled while being supported by the object. 13. The robot system of any one of appendices A59 to A63. [Appendix A65] The movable member includes a flying device capable of flying at a position away from the object. 13. The robot system of any one of appendices A59 to A64. [Appendix A66] A connection device for connecting an end effector that acts on an object to a movable member whose relative relationship with a part of the object can be changed, comprising: a drive member that moves at least one of the movable member and the end effector, and an elastic member that connects the movable member and the end effector, The movable member and the end effector are connected so that a relative positional relationship between the movable member and the end effector can be changed. Connection device. [Appendix A67] A connection device for connecting an end effector that acts on an object to a movable member whose relative relationship with a part of the object can be changed, comprising: a vibration reduction device that reduces vibration from the movable member to the end effector, The movable member and the end effector are connected so that a relative positional relationship between the movable member and the end effector can be changed. Connection device. [Appendix A68] A connection device for connecting an end effector that acts on an object to a movable member whose relative relationship with a part of the object can be changed, comprising: a position change member that changes the position of the end effector relative to the movable member based on a position measurement result by a position measurement device that measures the position of the connection device and / or the end effector relative to the object or a reference position; Connection device. [Appendix A69] an end effector that acts on an object; a connecting device that connects a movable member whose relative relationship with a part of the object is changeable to the end effector so that a relative positional relationship between the movable member and the end effector is changeable; Equipped with The connecting device includes a driving member that moves at least one of the movable member and the end effector, and an elastic member that connects the movable member and the end effector. End effector device. [Appendix A70] an end effector that acts on an object; a connecting device that connects a movable member whose relative relationship with a part of the object is changeable to the end effector so that a relative positional relationship between the movable member and the end effector is changeable; a vibration reduction device that reduces vibration from the movable member toward the end effector; An end effector device comprising: [Appendix A71] an end effector that acts on an object; a connecting device that connects a movable member whose relative relationship with a part of the object is changeable to the end effector so that a relative positional relationship between the movable member and the end effector is changeable; a position measuring device that measures a position of the end effector relative to the object or a reference position; Equipped with The connection device includes a position change member that changes the position of the end effector relative to the movable member based on a position measurement result by the position measurement device. End effector device.

[0260] The requirements of each of the above-described embodiments may be combined as appropriate. Some of the requirements of each of the above-described embodiments may not be used. The requirements of each of the above-described embodiments may be replaced with the requirements of other embodiments as appropriate. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in each of the above-described embodiments are incorporated by reference into the present description.

[0261] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or concept of the invention that can be read from the claims and the entire specification, and the machining system, machining method, robot system, connecting device, and end effector device that involve such modifications are also included in the technical concept of the present invention. [Explanation of symbols]

[0262] 1 Processing equipment 11 Light irradiation device 111 Light source system 1111 Light source 112 Optical system 114 Case 1122 Galvano Mirror 12 Drive system 121 First Drive System 1212 Arm drive system 12121 Arm parts 12122 Joint material 12123 Actuator 12124 End arm component 122 Second Drive System 1223 Air Spring 1224 Damper parts 1225 Driving member 14, 14d, 14e, 14g support device 18, 18b Position measuring device 181b Indicator member 182b Index measuring device 19 Mounting material 2. Control device C recess CP1 concave structure CP2 Convex structure EA target irradiation area EL processing light S Processing object SF Paint Film PE Sensitive Material SYS Machining System SA Processing shot area Efa~Eff End effector

Claims

1. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; The relative positional relationship between the position measurement device and the processing device does not change even if the connection device changes the position of the processing device. Processing system.

2. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; The connection device is disposed between the position measurement device and the movable member. Processing system.

3. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; a measurement target of the position measuring device includes an index portion, The indicator is measurable from a direction intersecting a direction from the processing device toward the object. Processing system.

4. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; the position measuring device includes a first position measuring device and a second position measuring device, the first position measurement device is capable of measuring a position of the object relative to the processing device; The second position measurement device is capable of measuring the position of the processing device. Processing system.

5. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; The connecting device includes an elastic member that connects the movable member and the processing device. Processing system.

6. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; The movable member includes a self-propelled device that is capable of self-propelling while being supported by the object. Processing system.

7. A processing system for performing processing on an object, A processing device for processing the object; a movable member capable of changing a relative positional relationship between the processing device and a part of the object; a connection device that connects the movable member and the processing device so that a relative positional relationship between the movable member and the processing device can be changed; a position measuring device that measures the position of the processing device; Equipped with the connection device changes a position of the processing device relative to the movable member based on a position measurement result by the position measurement device; the processing device includes a housing having a second surface facing a first side and a second surface facing a second side opposite the first side; The connection portion between the movable member and the processing device by the connection device is located between the first surface and the second surface. Processing system.

8. The processing device includes at least one of an irradiation device that irradiates processing light toward the object, a gripping device that grips the object, a holding device that holds the object, a position measuring device that measures the position of the object, a processing device that machines the object, a welding device, an injector, a manipulator, and an air blower. A processing system according to any one of claims 1 to 7.

9. The position measuring device measures the position of the processing device relative to the object or a reference position. A processing system according to any one of claims 1 to 8.

10. The connection device includes a position change member that changes the position of the processing device relative to the movable member based on a position measurement result by the position measurement device. A processing system according to any one of claims 1 to 9.

11. The amount of movement of the processing device caused by the connection device is smaller than the amount of movement of the processing device caused by the movable member. A processing system according to any one of claims 1 to 10.

12. The relative positional relationship between the position measurement device and the processing device does not change even if the connection device changes the position of the processing device. A processing system according to any one of claims 2 to 11.

13. The connection device is disposed between the position measurement device and the movable member.

13. A processing system according to any one of claims 1 and 3 to 12.

14. The connection device is disposed between the processing device and the movable member. A processing system according to any one of claims 1 to 13.

15. The measurement target of the position measuring device includes an index portion. A processing system according to any one of claims 1 to 2 and 4 to 14.

16. The indicator is disposed on a side surface of the processing device.

16. The processing system according to claim 3 or 15.

17. The indicator is measurable from a direction intersecting a direction from the processing device toward the object.

17. A processing system according to claim 15 or 16.

18. The indicator portion is disposed at a position where the relative positional relationship between the processing device and the indicator portion does not change even if the position of the processing device is changed by the connecting device.

18. A processing system according to any one of claims 3 and 15 to 17.

19. The measurement target of the position measurement device includes at least one of a physical marker, a reflective member, and a self-luminous marker.

19. A processing system according to any one of claims 1 to 18.

20. The position measuring device is capable of irradiating a measuring light toward the measurement target.

20. The processing system of claim 19.

21. The position measurement result includes at least one of information regarding a position in a first axis direction, a second axis direction intersecting with the first axis direction, and a third axis direction intersecting with the first axis direction and the second axis direction.

21. A processing system according to any one of claims 1 to 20.

22. The position measurement result includes at least one of information regarding a position around the first axis, the second axis, and the third axis.

22. The processing system of claim 21.

23. the position measuring device includes a first position measuring device and a second position measuring device, the first position measurement device is capable of measuring a position of the object relative to the processing device; The second position measurement device is capable of measuring the position of the processing device.

23. A processing system according to any one of claims 1 to 3 and 5 to 22.

24. The first position measurement device is disposed at a fixed position relative to the processing device.

24. A processing system according to claim 4 or 23.

25. The first position measurement device is capable of measuring the position of the processing device relative to a reference coordinate system.

25. A processing system according to claim 4, 23 or 24.

26. The connecting device includes an elastic member that connects the movable member and the processing device.

26. A processing system according to any one of claims 1 to 4 and 6 to 25.

27. The movable member includes a plurality of arm members and a joint member that swingably connects the plurality of arm members.

27. A processing system according to any one of claims 1 to 26.

28. The movable member includes a self-propelled device capable of self-propelling without interfering with the object.

28. A processing system according to any one of claims 1 to 27.

29. The movable member includes a self-propelled device that is capable of self-propelling while being supported by the object.

29. A processing system according to any one of claims 1 to 5 and 7 to 28.

30. The movable member includes a flying device capable of flying at a position away from the object.

30. A processing system according to any one of claims 1 to 29.

31. the processing device includes a housing having a second surface facing a first side and a second surface facing a second side opposite the first side; The connection portion between the movable member and the processing device by the connection device is located between the first surface and the second surface.

31. A processing system according to any one of claims 1 to 30.

32. The connection point is located at the center of gravity of the processing device.

32. A processing system according to claim 7 or 31.

33. A processing method for performing processing on an object, comprising: Changing a relative positional relationship between a movable member and a portion of the object; treating the object with a treatment device; Measuring the position of the processing device using a position measurement device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device by using a connection device that connects the movable member and the processing device; Including, A processing method in which the relative positional relationship between the position measurement device and the processing device does not change even if the position of the processing device is changed using the connection device.

34. A processing method for performing processing on an object, comprising: Changing a relative positional relationship between a movable member and a portion of the object; treating the object with a treatment device; Measuring the position of the processing device using a position measurement device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device by using a connection device that connects the movable member and the processing device; Including, The connection device is disposed between the position measurement device and the movable member. Processing method.

35. A processing method for performing processing on an object, comprising: Changing a relative positional relationship between a movable member and a portion of the object; treating the object with a treatment device; Measuring the position of the processing device using a position measurement device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device; Including, a measurement target of the position measuring device includes an index portion, The indicator is measurable from a direction intersecting a direction from the processing device toward the object. Processing method.

36. A processing method for performing processing on an object, comprising: Changing a relative positional relationship between a movable member and a portion of the object; treating the object with a treatment device; Measuring the position of the processing device using a position measurement device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device; Including, the position measuring device includes a first position measuring device and a second position measuring device, the first position measurement device is capable of measuring a position of the object relative to the processing device; The second position measurement device is capable of measuring the position of the processing device. Processing method.

37. A processing method for performing processing on an object, comprising: Changing a relative position between a movable member and a portion of the object; treating the object with a treatment device; measuring the position of the processing device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device by using a connection device that connects the movable member and the processing device; Including, The connecting device includes an elastic member that connects the movable member and the processing device. Processing method.

38. A processing method for performing processing on an object, comprising: treating the object with a treatment device; Using a movable member to change a relative position between the processing device and a portion of the object; changing a relative positional relationship between the movable member and the processing device using a connection device that connects the movable member and the processing device; Measuring the position of the processing device; Including, changing the relative positional relationship between the movable member and the processing device using the connection device includes changing a position of the processing device with respect to the movable member based on the measured position of the processing device; The movable member includes a self-propelled device that is capable of self-propelling while being supported by the object. Processing method.

39. A processing method for performing processing on an object, comprising: Changing a relative position between a movable member and a portion of the object; treating the object with a treatment device; measuring the position of the processing device; changing a relative positional relationship between the movable member and the processing device based on the measured position of the processing device by using a connection device that connects the movable member and the processing device; Including, the processing device includes a housing having a second surface facing a first side and a second surface facing a second side opposite the first side; The connection portion between the movable member and the processing device by the connection device is located between the first surface and the second surface. Processing method.

Images