Method for manufacturing laminated structure, laminated structure, and inkjet composition set

Abstract

Provided is a laminate structure which can improve material leakage prevention.　The laminate structure according to the present invention comprises a first base material, a first layer disposed on the surface of the first base material, and a second layer disposed on the surface of the side opposite the first layer on the first base material side. The first layer is a photocurable layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second layer is a photocurable layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition and second composition are different compositions.

Description

[Technical field]

[0001] The present invention relates to a method for producing a laminated structure using an inkjet device. The present invention also relates to a laminated structure. The present invention also relates to an inkjet composition set that is applied and used using an inkjet device. [Background technology]

[0002] A method of applying a composition using an inkjet device is known. For example, in the manufacture of electronic components, a method is used in which an inkjet composition is applied onto a surface of a substrate using an inkjet device and the composition is cured by light, heat, or the like.

[0003] Patent Document 1 listed below discloses a curable composition for inkjet printing, which contains (A) a hyperbranched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] WO2019 / 189186A1 Summary of the Invention [Problem to be solved by the invention]

[0005] In electronic components such as semiconductor devices and printed wiring boards, a cured layer formed by curing a composition for inkjet may be disposed. The cured layer is often used as an adhesive layer for bonding two components together.

[0006] Furthermore, attempts have been made to use inkjet compositions for applications other than adhesive applications.

[0007] For example, if it were possible to form an area surrounded by a cured layer and then form a metal layer inside the area, or if it were possible to form a partition using the cured layer to prevent the underfill material from spreading, this would lead to smaller electronic components and lower costs.

[0008] In the above applications, it is necessary that materials (eg, materials for forming metal layers, underfill materials, etc.) do not leak out to unintended locations.

[0009] An object of the present invention is to provide a method for producing a laminated structure, a laminated structure, and an inkjet composition set that can enhance the leakage prevention property of materials. Another object of the present invention is to provide an apparatus used for producing the laminated structure. [Means for solving the problem]

[0010] According to a broad aspect of the present invention, there is provided a method for producing a laminated structure, comprising: a first photocuring step of irradiating light to a first composition applied onto a surface of a first substrate by an inkjet method to form a first photocured layer in which the first composition is photocured; and a second photocuring step of irradiating light to a second composition applied by an inkjet method to a surface side of the first photocured layer opposite to the first substrate side to form a second photocured layer in which the second composition is photocured, wherein the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent; the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent; and the first composition and the second composition are different compositions.

[0011] In a specific aspect of the method for producing a laminated structure according to the present invention, the method for producing a laminated structure includes a second coating step of coating a second composition by an inkjet method onto a surface side of the first photocured layer opposite the first substrate side, and in the second photocuring step, the second composition applied in the second coating step is irradiated with light.

[0012] In a specific aspect of the method for producing a laminate structure according to the present invention, the second applying step and the second photocuring step are each performed a plurality of times in a thickness direction of the first photocured material layer.

[0013] In a specific aspect of the manufacturing method of the laminate structure of the present invention, the manufacturing method of the laminate structure includes a heating step for the first and second photocured material layers, in which the first photocured material layer and the second photocured material layer are heated to form a first photo- and thermocured material layer formed by thermally curing the first photocured material layer, and a second photo- and thermocured material layer formed by thermally curing the second photocured material layer.

[0014] In a specific aspect of the method for producing a laminate structure according to the present invention, the method for producing a laminate structure may or may not include a heating step for a first and second photocured material layer, in which the first photocured material layer and the second photocured material layer are heated to form a first photo- and thermo-cured material layer formed by thermally curing the first photocured material layer, and a second photo- and thermo-cured material layer formed by thermally curing the second photocured material layer. When the heating step for the first and second photocured material layers is included, the method may further include irradiating light to a third composition applied by an inkjet method to a surface side of the second photo- and thermo-cured material layer opposite to the first substrate side. and a third photocuring step of forming a third photocured layer by photocuring the third composition. When the heating steps for the first and second photocured layers are not provided, the method further comprises a third photocuring step of irradiating light to the third composition applied by an inkjet method to a surface side of the second photocured layer opposite the first substrate side to form a third photocured layer by photocuring the third composition, the third composition comprising a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the second composition and the third composition are different compositions.

[0015] In a specific aspect of the method for producing a laminated structure according to the present invention, the first composition and the third composition are the same composition.

[0016] In a specific aspect of the manufacturing method of the laminated structure of the present invention, when the heating steps for the first and second photocured material layers are included, the manufacturing method of the laminated structure includes a planarization treatment step of planarizing a surface of the second photo- and thermocured material layer opposite the first substrate side after the heating steps for the first and second photocured material layers, and when the heating steps for the first and second photocured material layers are not included, the manufacturing method of the laminated structure includes a planarization treatment step of planarizing a surface of the second photocured material layer opposite the first substrate side after the second photocuring step, the planarization treatment being a polishing treatment.

[0017] In a particular aspect of the method for manufacturing a laminated structure according to the present invention, the method for manufacturing the laminated structure includes a step of placing a second substrate on a surface of the third photocured layer opposite the first substrate side.

[0018] In a specific aspect of the manufacturing method of the laminate structure according to the present invention, when the heating steps for the first and second photocured material layers are provided, the manufacturing method of the laminate structure includes a heating step for a third photocured material layer, in which the third photocured material layer is heated to form a third photo- and thermo-cured material layer in which the third photocured material layer is thermally cured, and when the heating steps for the first and second photocured material layers are not provided, the manufacturing method of the laminate structure includes a heating step for a first, second and third photocured material layer, in which the first photocured material layer, the second photocured material layer and the third photocured material layer are heated to form a first photo- and thermo-cured material layer in which the first photocured material layer is thermally cured, a second photo- and thermo-cured material layer in which the second photocured material layer is thermally cured, and a third photo- and thermo-cured material layer in which the third photocured material layer is thermally cured.

[0019] According to a broad aspect of the present invention, the method includes a second photocuring step of irradiating light to a second composition applied on a surface of a first substrate by an inkjet method to form a second photocured layer in which the second composition is photocured, and a second photocured layer heating step of heating the second photocured layer to form a second photo- and thermo-cured layer in which the second photocured layer is thermo-cured, or not, and when the second photocured layer heating step is included, a first photocuring step of irradiating light to a first composition applied on a surface side opposite to the first substrate side of the second photo- and thermo-cured layer to form a first photocured layer in which the first composition is photocured. and when a heating step for the second photocured material layer is not provided, a first photocuring step is provided in which a first composition applied by an inkjet method to a surface side of the second photocured material layer opposite to the first substrate side is irradiated with light to form a first photocured material layer in which the first composition is photocured, wherein the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the first composition and the second composition are different compositions.

[0020] In a specific aspect of the method for producing a laminate structure according to the present invention, the method for producing a laminate structure includes a second photocured layer heating step of heating the second photocured layer to form a second photo- and thermo-cured layer in which the second photocured layer is thermally cured, and in the first photocuring step, a first composition applied by an inkjet method to a surface side of the second photo- and thermo-cured layer opposite the first substrate side is irradiated with light to form a first photocured layer in which the first composition is photocured.

[0021] In a specific aspect of the manufacturing method of the laminated structure of the present invention, when a heating step for the second photocured material layer is provided, a planarization treatment step is provided after the heating step for the second photocured material layer to planarize a surface of the second photo- and thermocured material layer opposite the first substrate side, and when the heating step for the second photocured material layer is not provided, a planarization treatment step is provided after the second photocuring step to planarize a surface of the second photocured material layer opposite the first substrate side, the planarization treatment being a polishing treatment.

[0022] In a specific aspect of the manufacturing method of the laminate structure of the present invention, when the heating step for the second photocured material layer is provided, the manufacturing method of the laminate structure includes a heating step for the first photocured material layer of heating the first photocured material layer to form a first photo- and thermo-cured material layer in which the first photocured material layer is thermally cured, and when the heating step for the second photocured material layer is not provided, the manufacturing method of the laminate structure includes a heating step for the first and second photocured material layers of heating the first photocured material layer and the second photocured material layer to form a first photo- and thermo-cured material layer in which the first photocured material layer is thermally cured, and a second photo- and thermo-cured material layer in which the second photocured material layer is thermally cured.

[0023] In a particular aspect of the method for producing a laminated structure according to the present invention, the method for producing a laminated structure includes a step of placing a second substrate on a surface of the first photocured material layer opposite the first substrate.

[0024] In a specific aspect of the method for producing a laminate structure according to the present invention, the second substrate has a smaller surface roughness than the first substrate.

[0025] According to a broad aspect of the present invention, there is provided a method for producing a photoresist film comprising: a first substrate; a first layer disposed on a surface of the first substrate; and a second layer disposed on a surface of the first layer opposite to the first substrate side, the method comprising: a combination of the first layer and the second layer, the first layer being a photocured layer or a photo- and heat-cured layer of a first composition including a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; and a combination of the first layer and the second layer being a photocured layer or a photo- and heat-cured layer of a first composition including a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent. or a combination in which the first layer is a photocured layer or a photo- and heat-cured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the second layer is a photocured layer or a photo- and heat-cured layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the first composition and the second composition are different compositions.

[0026] In a specific aspect of the laminate structure according to the present invention, the first layer is a photocured layer or a photo- and thermocured layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocured layer or a photo- and thermocured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent.

[0027] In a specific aspect of the laminated structure according to the present invention, the second layer has a polished surface.

[0028] In a specific aspect of the laminated structure according to the present invention, the laminated structure includes a second substrate disposed on a surface of the second layer opposite to the first layer side.

[0029] In a specific aspect of the laminated structure of the present invention, the first layer is a photo- and thermally cured layer of the first composition, and the second layer is a photo- and thermally cured layer of the second composition.

[0030] In a specific aspect of the laminated structure according to the present invention, the second layer has a thickness greater than a thickness of the first layer.

[0031] In a specific aspect of the laminate structure according to the present invention, the first layer has a thickness of 0.1 μm or more and 10 μm or less, and the second layer has a thickness of 1 μm or more and 1000 μm or less.

[0032] In a specific aspect of the laminate structure according to the present invention, the laminate structure includes a third layer disposed on a surface of the second layer opposite to the first layer side, the third layer being a photocured layer or a photo- and thermocured layer of a third composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, and the second composition and the third composition are different compositions.

[0033] In a specific aspect of the laminate structure according to the present invention, the first composition and the third composition are the same composition.

[0034] In a specific aspect of the laminated structure according to the present invention, the laminated structure includes a second substrate disposed on a surface of the third layer opposite to the second layer side.

[0035] In a specific aspect of the laminate structure according to the present invention, the first substrate has a smaller surface roughness than the second substrate.

[0036] In a specific aspect of the laminate structure according to the present invention, the third layer is a photo- and thermally cured layer of the third composition.

[0037] In a specific aspect of the laminated structure according to the present invention, the second layer has a thickness greater than a thickness of the third layer.

[0038] In a specific aspect of the laminate structure according to the present invention, the third layer has a thickness of 0.1 μm or more and 10 μm or less.

[0039] In a specific aspect of the laminate structure according to the present invention, the first layer is a photocured layer or a photo- and thermocured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocured layer or a photo- and thermocured layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent.

[0040] According to a broad aspect of the present invention, there is provided a composition set for inkjet printing having a first composition and a second composition, the first composition including a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, the second composition including a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, and the first composition and the second composition being different compositions.

[0041] In a specific aspect of the composition set for inkjet according to the present invention, the composition set for inkjet has a first container and a second container, the first container contains the first composition, and the second container contains the second composition. Effect of the Invention

[0042] Since the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention have the above-mentioned configurations, it is possible to enhance the prevention of leakage of the material. [Brief description of the drawings]

[0043] [Figure 1] 1(a) to (c) are cross-sectional views illustrating each step of a method for manufacturing a laminated structure according to a first embodiment of the present invention. [Diagram 2] 2(d) to (f) are cross-sectional views illustrating each step of the method for manufacturing the laminated structure according to the first embodiment of the present invention. [Diagram 3]3(g) and (h) are cross-sectional views illustrating the steps of the method for manufacturing the laminated structure according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a flowchart illustrating each step of the method for manufacturing the laminated structure according to the first embodiment of the present invention. [Diagram 5] FIG. 5 is a flowchart illustrating each step of the method for manufacturing the laminated structure according to the second embodiment of the present invention. [Figure 6] FIG. 6 is a flowchart illustrating each step of the method for manufacturing the laminated structure according to the second embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view of a laminated structure manufactured by the method for manufacturing a laminated structure according to the second embodiment. [Figure 8] FIG. 8 is a flowchart illustrating each step of the method for manufacturing the laminated structure according to the third embodiment of the present invention. [Figure 9] FIG. 9 is a flowchart illustrating each step of the method for manufacturing the laminated structure according to the third embodiment of the present invention. [Figure 10] FIG. 10 is a cross-sectional view of a laminated structure manufactured by the method for manufacturing a laminated structure according to the third embodiment. [Figure 11] FIG. 11 is a schematic diagram showing an example of a part of an apparatus used in the method for producing the laminated structure shown in FIGS. [Figure 12] FIG. 12 is a schematic diagram showing another example of the apparatus used in the method for producing the laminated structure shown in FIGS. [Figure 13] FIG. 13 is a cross-sectional view that illustrates a composition set for inkjet according to the first embodiment of the present invention. [Figure 14] FIG. 14 is a cross-sectional view showing an electronic component obtained by using the multilayer structure according to the first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0044] The present invention will be described in detail below.

[0045] The method (1) for producing a laminated structure according to the present invention includes a first photocuring step (photocuring step for a first composition) of irradiating a first composition applied by an inkjet method onto a surface of a first substrate with light to form a first photocured product layer in which the first composition is photocured. The method (1) for producing a laminated structure according to the present invention includes a second photocuring step (photocuring step for a second composition) of irradiating a second composition applied by an inkjet method onto a surface side of the first photocured product layer opposite to the first substrate with light to form a second photocured product layer in which the second composition is photocured.

[0046] The method for producing a laminated structure (2) according to the present invention includes a second photocuring step (photocuring step for the second composition) of irradiating light to a second composition applied on a surface of a first substrate by an inkjet method to form a second photocured layer in which the second composition is photocured. The method for producing a laminated structure (2) according to the present invention may or may not include a second photocured layer heating step of heating the second photocured layer to form a second photo- and thermo-cured layer in which the second photocured layer is thermocured. When the method for producing a laminated structure (2) according to the present invention includes the second photocured layer heating step, it includes a first photocuring step (photocuring step for the first composition) of irradiating light to a first composition applied on a surface side of the second photo- and thermo-cured layer opposite to the first substrate side to form a first photocured layer in which the first composition is photocured. The method for manufacturing a laminate structure (2) according to the present invention, when the heating step for the second photocured material layer is not provided, includes a first photocuring step (photocuring step for the first composition) of irradiating light to a first composition applied by an inkjet method to the surface side of the second photocured material layer opposite the first substrate side, thereby forming a first photocured material layer in which the first composition is photocured.

[0047] In the manufacturing methods (1) and (2) of the laminated structure according to the present invention, the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent. In the manufacturing methods (1) and (2) of the laminated structure according to the present invention, the first composition and the second composition are different compositions.

[0048] The manufacturing methods (1) and (2) of the laminated structure according to the present invention have the above-mentioned features, and therefore can improve the prevention of leakage of the material.

[0049] The manufacturing method (1) of the laminate structure preferably includes a first coating step (a coating step for a first composition) of coating a first composition on a surface of a first substrate by an inkjet method. The manufacturing method (1) of the laminate structure preferably includes a second coating step (a coating step for a second composition) of coating a second composition on a surface side of the first photocured material layer opposite to the first substrate side by an inkjet method between the first photocured material layer and the second photocured material layer. In the second coating step, the second composition is preferably coated on a surface of the first photocured material layer opposite to the first substrate side by an inkjet method. The second photocured material layer is preferably in contact with the first photocured material layer.

[0050] The laminate structure manufacturing method (2) preferably includes a second coating step (a coating step for a second composition) of coating the surface of the first substrate by an inkjet method. The laminate structure manufacturing method (2) preferably includes a first coating step (a coating step for a first composition) of coating the surface of the second photocured material layer opposite the first substrate by an inkjet method between the second photocuring step and the first photocuring step. In the first coating step, the first composition is preferably coated by an inkjet method on the surface of the second photocured material layer opposite the first substrate. The first photocured material layer is preferably in contact with the second photocured material layer.

[0051] In this specification, the first coating step and the first photocuring step are collectively referred to as a first photocured layer forming step (a photocured layer forming step for a first composition). Also, in this specification, the second coating step and the second photocuring step are collectively referred to as a second photocured layer forming step (a photocured layer forming step for a second composition).

[0052] Therefore, the manufacturing method (1) of the laminate structure preferably includes a first photocured layer forming step of applying a first composition onto the surface of a first substrate by an inkjet method and irradiating the applied first composition with light to form a first photocured layer formed by photocuring the first composition. The manufacturing method (1) of the laminate structure preferably includes a second photocured layer forming step of applying a second composition onto the surface side of the first photocured layer opposite to the first substrate side by an inkjet method and irradiating the applied second composition with light to form a second photocured layer formed by photocuring the second composition.

[0053] The laminate structure manufacturing method (2) preferably includes a second photocured layer forming step of applying a second composition onto the surface of a first substrate by inkjet printing and irradiating the applied second composition with light to form a second photocured layer formed by photocuring the second composition. The laminate structure manufacturing method (2) preferably includes a first photocured layer forming step of applying a first composition onto the surface side of the second photocured layer opposite to the first substrate side by inkjet printing and irradiating the applied first composition with light to form a first photocured layer formed by photocuring the first composition.

[0054] The laminated structure according to the present invention comprises a first substrate, a first layer disposed on a surface of the first substrate, and a second layer disposed on a surface of the first layer opposite to the substrate. In the laminated structure according to the present invention, the combination of the first layer and the second layer is the following first combination A or the following combination B. Combination A: The first layer is a photocured layer or a photo- and thermocured layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second layer is a photocured layer or a photo- and thermocured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. Combination B: The first layer is a photocured layer or a photo- and thermosetting layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second layer is a photocured layer or a photo- and thermosetting layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. In the laminate structure according to the present invention, the first composition and the second composition are different compositions.

[0055] Since the laminated structure according to the present invention has the above-mentioned configuration, it is possible to improve the ability to prevent the material from leaking out.

[0056] The inkjet composition set according to the present invention is a composition set for inkjet having a first composition and a second composition. In the inkjet composition set according to the present invention, the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent, and the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent. In the inkjet composition set according to the present invention, the first composition and the second composition are different compositions.

[0057] Since the ink jet composition set according to the present invention has the above-mentioned configuration, it is possible to enhance the prevention of leakage of the material.

[0058] The present inventors have found that the conventional inkjet composition may have poor shape retention of the cured layer, leading to leakage of the material to the periphery of the cured layer. The present inventors have found that, particularly when the inkjet composition is a photocurable composition, the photopolymerization reaction is likely to be inhibited on the surface of the composition applied by the inkjet device due to the influence of oxygen in the air. In addition, when powder such as dust adheres to the surface of the inkjet composition, the part where the powder adheres may not be sufficiently irradiated with light, and the photopolymerization reaction may not proceed sufficiently. The present inventors have found that in such a case, the inkjet composition is not sufficiently cured, leading to a problem that the shape retention of the cured layer is likely to decrease.

[0059] Furthermore, the present inventors have found that when a composition containing a highly photoreactive compound is simply used, the curing shrinkage becomes large, which tends to reduce the adhesive strength between the substrate and the cured layer, and the material tends to leak out from between the substrate and the cured layer.

[0060] Furthermore, the present inventors have found that with conventional compositions for inkjet, when cured material layers having different compositions are laminated, it is difficult to sufficiently increase the interlayer adhesive strength, and the material is likely to leak out from areas where the interlayer adhesive strength is low.

[0061] Conventionally, as a method for increasing the adhesive strength between the substrate and the cured layer, a method for forming unevenness on the substrate surface by treating the substrate surface with a chemical solution or physically damaging the substrate surface, and a method for performing a primer treatment are known. However, in these methods, the properties of the substrate surface change even in the part where the inkjet composition is not applied, so that, for example, when a part is connected, problems such as a decrease in electrical conductivity may occur. In addition, the adhesive strength between the primer and the cured layer may decrease.

[0062] In order to reduce the effect of oxygen in the air, the development of an apparatus capable of applying the composition while replacing the air with nitrogen or the like is being considered. However, this increases the size and cost of the apparatus.

[0063] With regard to the new problem that the present inventors have found, it is difficult to improve the leakage prevention properties of the material using conventional methods.

[0064] In contrast, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, it is possible to improve the shape retention of the cured layer formed by curing the first composition and the second composition, and also to increase the adhesive strength to the substrate and the interlayer adhesive strength, without performing surface treatment of the substrate or using an apparatus capable of nitrogen substitution.

[0065] In the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, a specific first composition and a specific second composition are used, so that the shape retention of the cured layer formed by curing the first composition and the second composition can be improved. In addition, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, a specific first composition and a specific second composition are used, so that the adhesive strength between the substrate and the cured layer of the first composition can be increased, and the interlayer adhesive strength between the cured layer of the first composition and the cured layer of the second composition can be increased.

[0066] Therefore, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, materials (e.g., materials for forming a metal layer and underfill materials) are unlikely to leak out from between the substrate and the cured layer. For example, when a material is placed inside an area surrounded by the cured layer, the material is unlikely to leak out from the inside of the area to the outside. Also, for example, when a material is placed outside an area surrounded by the cured layer, the material is unlikely to leak out from the outside of the area to the inside.

[0067] The method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention can improve the shape retention of the photocured layers of the first composition and the second composition, as well as the photo- and thermo-cured layers.

[0068] Furthermore, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, the strength of the cured material layer can be improved, so that damage to the cured material layer can be effectively suppressed, and adhesion of powder such as dust to the cured material layer can be effectively suppressed.

[0069] (Method of manufacturing laminated structure) Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. Note that in the following drawings, the size, thickness, shape, etc. may differ from the actual size, thickness, shape, etc. for convenience of illustration.

[0070] 1(a)-(c), 2(d)-(f), and 3(g) and (h) are cross-sectional views for explaining each step of the method for manufacturing a laminated structure according to a first embodiment of the present invention. Fig. 4 is a flow chart for explaining each step of the method for manufacturing a laminated structure according to a first embodiment of the present invention. The method for manufacturing a laminated structure according to the first embodiment in Figs. 1-4 is the method for manufacturing a laminated structure (1) described above.

[0071] In Figs. 1 to 3, an apparatus 10 including a stage 11, a first discharge section 12, a first light irradiation section 13, a second discharge section 14, and a second light irradiation section 15 is used to manufacture a laminated structure. The first discharge section 12 is a member for discharging a first composition, and is an inkjet head. The second discharge section 14 is a member for discharging a second composition, and is an inkjet head. Therefore, the apparatus 10 is an inkjet device. The first light irradiation section 13 is disposed between the first discharge section 12 and the second discharge section 14. The second light irradiation section 15 is disposed on the opposite side of the second discharge section 14 to the first light irradiation section 13 side. The first light irradiation section 13 and the second light irradiation section 15 are capable of irradiating ultraviolet light.

[0072] <First Photocured Material Layer Forming Step (S1 and S2 in FIG. 4)> First, as shown in FIG. 1(a), a first substrate 3 is placed on the surface of a stage 11. The first substrate 3 is fixed on the surface of the stage 11. The first substrate 3 is adsorbed to the stage 11. Next, a first composition 1 is applied onto the surface of the first substrate 3 by an inkjet method (first application step). The first composition 1 is applied from a first discharge portion 12. The first composition 1 is applied to a predetermined position of the first substrate 3. The first composition 1 is partially applied onto the surface of the first substrate 3.

[0073] 1(b), the stage 11 is moved until the applied first composition 1 is positioned below the first light irradiation section 13. An inkjet device may be moved instead of the stage 11. The first composition 1 is irradiated with light (ultraviolet light) from the first light irradiation section 13 to form a first photocured layer 1A in which the first composition is photocured (first photocuring step).

[0074] After the first photocuring step, it is determined whether or not to repeat the first photocured layer forming step (S3 in FIG. 4). When the first photocured layer forming step is repeated, the first composition is applied to the surface side of the formed first photocured layer opposite to the first substrate side.

[0075] <Second Photocured Material Layer Forming Step (S4 and S5 in FIG. 4)> Next, as shown in FIG. 1(c), the stage 11 is moved until the first photocured material layer 1A is positioned below the second discharge unit 14. An inkjet device may be moved instead of the stage 11. The second composition 2 is applied to the surface side of the first photocured material layer 1A opposite to the first substrate 3 side by the inkjet method (second application step). The second composition 2 is applied from the second discharge unit 14.

[0076] Next, as shown in Fig. 2(d), the stage 11 is moved until the applied second composition 2 is positioned below the second light irradiation section 15. An inkjet device may be moved instead of the stage 11. The second composition 2 is irradiated with light (ultraviolet light) from the second light irradiation section 15 to form a second photocured layer 2A in which the second composition is photocured (second photocuring step).

[0077] After the second photocuring step, it is determined whether or not to repeat the second photocured layer forming step (S6 in FIG. 4). If the second photocured layer forming step is repeated, a second composition is applied to the surface side of the formed second photocured layer opposite to the first substrate side.

[0078] 2(e) and (f) are diagrams showing the second photocured material layer forming step. As shown in FIG. 2(e), the stage 11 is moved until the second photocured material layer 2A is positioned below the second discharge unit 14. Instead of the stage 11, an inkjet device may be moved. The second composition 2 is applied to the surface of the second photocured material layer 2A opposite to the first substrate 3 side by the inkjet method. That is, the second composition 2 is applied to the surface of the first photocured material layer 1A opposite to the first substrate 3 side (second application step). The second composition 2 is applied from the second discharge unit 14.

[0079] Next, as shown in Fig. 2(f), the stage 11 is moved until the applied second composition 2 is positioned below the second light irradiation section 15. An inkjet device may be moved instead of the stage 11. The second composition 2 is irradiated with light (ultraviolet light) from the second light irradiation section 15 to form a second photocured layer 2A in which the second composition is photocured (second photocuring step).

[0080] The second photocured layer forming step is performed twice in the thickness direction of the first photocured layer, as shown in Fig. 1(c) and Fig. 2(d) and as shown in Fig. 2(e) and Fig. 2(f). The second photocured layer forming step is performed multiple times in the thickness direction of the first photocured layer, so that the thickness of the second photocured layer can be increased. The second photocured layer forming step may be performed two or more times, or may be performed three or more times.

[0081] By performing the above-mentioned second photocured material layer formation process multiple times in the thickness direction of the first photocured material layer, it is possible to obtain a laminated structure 4A, as shown in Figure 3(g), which comprises a first substrate 3, a first photocured material layer 1A, and a second photocured material layer 2A, in which the thickness of the second photocured material layer 2A is greater than the thickness of the first photocured material layer 1A.

[0082] <Heating Step for First and Second Photocured Layers (S7 in FIG. 4)> Next, the first photocured material layer 1A and the second photocured material layer 2A are heated to form a first photo- and thermo-cured material layer 1B in which the first photocured material layer 1A is thermally cured, and a second photo- and thermo-cured material layer 2B in which the second photocured material layer 2A is thermally cured (heating process for the first and second photocured material layers).

[0083] In this manner, a laminated structure 4B including the first base material 3, the first photo- and thermo-cured material layer 1B, and the second photo- and thermo-cured material layer 2B can be obtained.

[0084] 5 and 6 are flow charts for explaining each step of a method for manufacturing a laminated structure according to a second embodiment of the present invention. The method for manufacturing a laminated structure according to the second embodiment is a method for manufacturing a laminated structure (1). Fig. 7 is a cross-sectional view of a laminated structure manufactured by the method for manufacturing a laminated structure according to the second embodiment.

[0085] <First Photocured Material Layer Forming Step (S1 and S2 in FIG. 5)> In the method for producing a laminate structure according to the second embodiment, a first photocured material layer forming step is carried out in the same manner as the first photocured material layer forming step (FIGS. 1(a) and (b)) in the method for producing a laminate structure according to the first embodiment.

[0086] After the first photocuring step, it is determined whether or not to repeat the first photocured layer forming step (S3 in FIG. 5). When the first photocured layer forming step is repeated, a first composition is applied to the surface side of the formed first photocured layer opposite to the first substrate side.

[0087] <Second Photocured Material Layer Forming Step (S4 and S5 in FIG. 5)> In the method for producing a laminate structure according to the second embodiment, a second photocured material layer forming step is carried out in the same manner as the second photocured material layer forming step (FIGS. 1(c) and (d)) in the method for producing a laminate structure according to the first embodiment described above.

[0088] After the second photocuring step, it is determined whether or not to repeat the second photocured layer forming step (S6 in FIG. 5). When the second photocured layer forming step is repeated, a second composition is applied to the surface side of the formed second photocured layer opposite to the first substrate side.

[0089] <Heating Step for First and Second Photocured Layers (S8 in FIG. 6)> After the second photocuring step, it is determined whether or not to perform a heating step for the first and second photocured layers (S7 in FIG. 6). If the heating step for the first and second photocured layers is performed, the first photocured layer and the second photocured layer are heated to form a first photo- and thermo-cured layer formed by thermally curing the first photocured layer, and a second photo- and thermo-cured layer formed by thermally curing the second photocured layer (heating step for the first and second photocured layers).

[0090] By carrying out the heating step for the first and second photocured material layers, a laminated structure including a first base material, a first photo- and thermo-cured material layer, and a second photo- and thermo-cured material layer can be obtained.

[0091] <Planarization process (S10 in FIG. 6)> When the heating steps for the first and second photocured material layers are performed, it is determined whether or not a planarization process is performed after the heating steps for the first and second photocured material layers (S9 in FIG. 6). When the heating steps for the first and second photocured material layers are not performed, it is determined whether or not a planarization process is performed after the second photocuring step (S9 in FIG. 6). In this embodiment, it is determined whether or not a polishing process is performed as the planarization process.

[0092] When the heating step for the first and second photocured material layers is performed and the planarization step is performed, the surface of the second photo- and thermo-cured material layer opposite to the first substrate side is planarized after the heating step for the first and second photocured material layers (planarization step).When the heating step for the first and second photocured material layers is not performed and the planarization step is performed, the surface of the second photocured material layer opposite to the first substrate side is planarized (planarization step).

[0093] <Third Photocured Material Layer Forming Step (S11 and S12 in FIG. 6)> A third photocured material layer forming step is carried out using the third composition in the same manner as in the first photocured material layer forming step or the second photocured material layer forming step.

[0094] When the heating step for the first and second photocured material layers is performed, the third composition is applied by an inkjet method on the surface of the second photocured material layer opposite to the first substrate side (third application step (application step for the third composition)). When the heating step for the first and second photocured material layers is not performed, the third composition is applied by an inkjet method on the surface of the second photocured material layer opposite to the first substrate side (third application step (application step for the third composition)). The third composition is applied from a predetermined discharge portion provided in the inkjet device. Note that when the first composition and the third composition are the same composition, in the third application step, the first composition is essentially applied by an inkjet method on the surface of the second photocured material layer or the second photocured material layer opposite to the first substrate side.

[0095] Next, the third composition is irradiated with light (ultraviolet rays) from a predetermined light irradiation unit of the inkjet device, and the third composition is photocured to form a third photocured layer (third photocuring step (photocuring step for third composition)). When the first composition and the third composition are the same composition, in the third photocuring step, light (ultraviolet rays) is irradiated from a predetermined light irradiation unit of the inkjet device, and the first composition is photocured to form a third photocured layer.

[0096] After the third photocuring step, it is determined whether or not to repeat the third photocured layer forming step (S13 in FIG. 6). When the third photocured layer forming step is repeated, a third composition is applied to the surface side of the formed third photocured layer opposite to the first substrate side.

[0097] In the present specification, the third coating step and the third photocuring step are collectively referred to as a third photocured material layer forming step (third composition photocured material layer forming step).

[0098] <Placement step (S14 in FIG. 6)> After the third photocured material layer forming step, a second substrate is disposed on the surface of the third photocured material layer opposite to the first substrate side (disposing step).

[0099] <Heating Step for Third Photocured Material Layer, or Heating Step for First, Second and Third Photocured Material Layers (S15 in FIG. 6)> When the heating step for the first and second photocured material layers is performed, the third photocured material layer is heated after the disposing step to form a third photo- and heat-cured material layer (heating step for the third photocured material layer). When the heating step for the first and second photocured material layers is not performed, the first photocured material layer, the second photocured material layer, and the third photocured material layer are heated after the disposing step to form a first photo- and heat-cured material layer, a second photo- and heat-cured material layer, and a third photo- and heat-cured material layer (heating steps for the first, second, and third photocured material layers). The first photo- and heat-cured material layer is a layer obtained by thermally curing the first photocured material layer. The second photo- and heat-cured material layer is a layer obtained by thermally curing the second photocured material layer. The third photo- and heat-cured material layer is a layer obtained by thermally curing the third photocured material layer.

[0100] In this manner, as shown in FIG. 7, a laminated structure 4D can be obtained which comprises, in this order, a first substrate 3, a first photo- and thermo-cured layer 1D, a second photo- and thermo-cured layer 2D, a third photo- and thermo-cured layer 6D, and a second substrate 7.

[0101] 8 and 9 are flow charts for explaining each step of a method for manufacturing a laminated structure according to a third embodiment of the present invention. The method for manufacturing a laminated structure according to the third embodiment is a method for manufacturing a laminated structure (2). Fig. 10 is a cross-sectional view of a laminated structure manufactured by the method for manufacturing a laminated structure according to the third embodiment.

[0102] <Second Photocured Material Layer Forming Step (S1 and S2 in FIG. 8)> In the method for producing a laminate structure according to the third embodiment, the second photocured material layer formation step is carried out in the same manner as the second photocured material layer formation step (FIGS. 1(c) and (d)) in the method for producing a laminate structure according to the first embodiment, except that a second composition is applied onto the surface of a first substrate.

[0103] Specifically, the second composition is applied onto the surface of the first substrate by an inkjet method (second application step). The second composition is applied to a predetermined position of the first substrate. The second composition is partially applied onto the surface of the first substrate.

[0104] Next, the applied second composition is irradiated with light (ultraviolet light) to form a second photocured layer in which the second composition is photocured (second photocuring step).

[0105] After the second photocuring step, it is determined whether or not to repeat the second photocured layer forming step (S3 in FIG. 8). When the second photocured layer forming step is repeated, a second composition is applied to the surface side of the formed second photocured layer opposite to the first substrate side.

[0106] <Heating step for second photocured material layer (S5 in FIG. 8)> After the second photocuring step, it is determined whether or not to perform a heating step for the second photocured layer (S4 in FIG. 8). If the heating step for the second photocured layer is performed, the second photocured layer is heated to form a second photo- and thermo-cured layer in which the second photocured layer is thermally cured (heating step for the second photocured layer).

[0107] <Planarization process (S7 in FIG. 9)> When the second photocured material layer heating step is performed, it is determined whether or not to perform a flattening process after the second photocured material layer heating step (S6 in FIG. 9).When the second photocured material layer heating step is not performed, it is determined whether or not to perform a flattening process after the second photocuring step (S6 in FIG. 9).

[0108] When the heating step for the second photocured layer is performed and the planarization step is also performed, after the heating step for the second photocured layer, the surface of the second photo- and heat-cured layer opposite the first substrate is planarized (planarization step (planarization step for the second photo- and heat-cured layer)). When the heating step for the second photocured layer is not performed and the planarization step is performed, the surface of the second photocured layer opposite the first substrate is planarized (planarization step (planarization step for the second photocured layer)).

[0109] <First Photocured Material Layer Forming Step (S8 and S9 in FIG. 9)> When the heating step for the second photocured material layer is performed, the first composition is applied to the surface side of the second photo- and thermo-cured material layer opposite the first substrate side by an inkjet system (first application step).When the heating step for the second photocured material layer is not performed, the first composition is applied to the surface side of the second photocured material layer opposite the first substrate side by an inkjet system (first application step).

[0110] Next, when the heating step for the second photocured material layer is performed, the first composition applied by the inkjet method to the surface side of the second photo- and thermo-cured material layer opposite to the first substrate side is irradiated with light to form a first photocured material layer in which the first composition is photocured (first photocuring step).When the heating step for the second photocured material layer is not performed, the first composition applied by the inkjet method to the surface side of the second photocured material layer opposite to the first substrate side is irradiated with light to form a first photocured material layer in which the first composition is photocured (first photocuring step).

[0111] After the first photocuring step, it is determined whether or not to repeat the first photocured layer forming step (S10 in FIG. 9). When the first photocured layer forming step is repeated, a first composition is applied to the surface side of the formed first photocured layer opposite to the first substrate side.

[0112] <Placement step (S11 in FIG. 9)> After the first photocured material layer forming step, a second substrate is disposed on the surface of the first photocured material layer opposite to the first substrate side (disposing step).

[0113] <Heating step for first photocured material layer, or heating step for first and second photocured material layers (S12 in FIG. 9)> When the heating step for the second photocured material layer is performed, the first photocured material layer is heated after the disposing step to form a first photo- and heat-cured material layer (heating step for the first photocured material layer). When the heating step for the second photocured material layer is not performed, the first photocured material layer and the second photocured material layer are heated after the disposing step to form a first photo- and heat-cured material layer and a second photo- and heat-cured material layer (heating step for the first and second photocured material layers). The first photo- and heat-cured material layer is a layer obtained by thermally curing the first photocured material layer. The second photo- and heat-cured material layer is a layer obtained by thermally curing the second photocured material layer.

[0114] In this manner, a laminated structure 4E can be obtained which comprises, in this order, a first substrate 3, a second photo- and thermo-cured layer 2E, a first photo- and thermo-cured layer 1E, and a second substrate 7, as shown in FIG. 10.

[0115] <Other details of the method for manufacturing the laminated structure> Further details of the first, second and third photocurable layer forming steps: The laminate structure manufacturing method (1) may or may not include the first coating step. The laminate structure manufacturing method (2) may or may not include the second coating step. The laminate structure (1) preferably includes the first coating step, the first photocuring step, the second coating step, and the second photocuring step in this order. The laminate structure (2) preferably includes the second coating step, the second photocuring step, the first coating step, and the first photocuring step in this order. The laminate structure manufacturing method (1) may or may not include the third coating step. The laminate structure manufacturing method (1) may or may not include the third photocuring step. The laminate structure manufacturing method (1) may or may not include the third photocuring step. The laminate structure manufacturing method (1) may or may not include the third photocured product layer forming step.

[0116] In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the first composition may be applied to a specific region, and then the entire applied first composition may be irradiated with light to form a first photocured layer. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the first photocured layer may be formed by irradiating the applied first composition with light every time a plurality of drops of the first composition are applied. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the first photocured layer may be formed by irradiating the applied first composition with light every time a drop of the first composition is applied.

[0117] In the above-mentioned laminate structure manufacturing methods (1) and (2), the first photocured material layer forming step may be performed only once in the thickness direction of the first substrate, as shown in FIG. 1. In the above-mentioned laminate structure manufacturing methods (1) and (2), the first photocured material layer forming step may be performed multiple times in the thickness direction of the first substrate. That is, in the above-mentioned laminate structure manufacturing methods (1) and (2), the first coating step and the first photocuring step may each be performed only once or multiple times in the thickness direction of the first substrate. By performing the first photocured material layer forming step multiple times in the thickness direction of the first substrate, the thickness of the first photocured material layer can be increased.

[0118] In the method (1) for producing a laminate structure, the first photocured layer forming step is performed before the second photocured layer forming step. In the method (2) for producing a laminate structure, the second photocured layer forming step is performed before the first photocured layer forming step. In the method (1) for producing a laminate structure, the first photocured layer forming step and the second photocured layer forming step are performed before the third photocured layer forming step.

[0119] In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the second composition may be applied to a specific region, and then the entire applied second composition may be irradiated with light to form a second photocured layer. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the applied second composition may be irradiated with light every time a plurality of drops of the second composition are applied, to form a second photocured layer. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the applied second composition may be irradiated with light every time a drop of the second composition is applied, to form a second photocured layer.

[0120] In the method (1) for producing a laminate structure, the second photocured material layer forming step may be performed only once in the thickness direction of the first photocured material layer. In the method (1) for producing a laminate structure, the second photocured material layer forming step may be performed multiple times in the thickness direction of the first photocured material layer, as shown in Figs. 1 and 2. That is, in the method (1) for producing a laminate structure, the second coating step and the second photocuring step may each be performed only once or multiple times in the thickness direction of the first photocured material layer. In the method (2) for producing a laminate structure, the second photocured material layer forming step may be performed only once in the thickness direction of the first base material. In the method (2) for producing a laminate structure, the second photocured material layer forming step may be performed multiple times in the thickness direction of the first base material. In the method (2) for producing a laminate structure, the second coating step and the second photocuring step may each be performed only once or multiple times in the thickness direction of the first base material. The second photocured layer forming step is performed multiple times in the thickness direction of the first photocured layer or the thickness direction of the first base material, thereby making it possible to increase the thickness of the second photocured layer. The second photocured layer forming step is preferably performed multiple times in the thickness direction of the first photocured layer or the thickness direction of the first base material. The number of times the second photocured layer forming step is repeated is appropriately changed depending on the desired thickness of the second photocured layer.

[0121] In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the third composition may be applied to a specific region, and then the entire applied third composition may be irradiated with light to form a third photocured layer. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the applied third composition may be irradiated with light every time a plurality of drops of the third composition are applied, to form a third photocured layer. In the above-mentioned manufacturing methods (1) and (2) of a laminate structure, the applied third composition may be irradiated with light every time a drop of the third composition is applied, to form a third photocured layer.

[0122] In the above-mentioned laminate structure manufacturing methods (1) and (2), the third photocured material layer forming step may be performed only once in the thickness direction of the second photocured material layer. In the above-mentioned laminate structure manufacturing methods (1) and (2), the third photocured material layer forming step may be performed multiple times in the thickness direction of the second photocured material layer. That is, in the above-mentioned laminate structure manufacturing methods (1) and (2), the third coating step and the third photocuring step may each be performed only once or multiple times in the thickness direction of the second photocured material layer. By performing the third photocured material layer forming step multiple times in the thickness direction of the second photocured material layer, the thickness of the third photocured material layer can be increased.

[0123] In the above-mentioned methods (1) and (2) for producing a laminated structure, the light irradiation in the first photocuring step, the second photocuring step and the third photocuring step is preferably ultraviolet light irradiation.

[0124] The illuminance and irradiation time of the ultraviolet light in the first photocuring step, the second photocuring step, and the third photocuring step can be appropriately changed depending on the composition of the first composition, the second composition, and the third composition, and the coating thickness of the composition. The illuminance of the ultraviolet light in the first photocuring step, the second photocuring step, and the third photocuring step is, for example, 1000 mW / cm 2 or more, 5000 mW / cm 2 or more, 10,000 mW / cm 2 may be less than 8000 mW / cm 2The irradiation time of ultraviolet light in the first photo-curing step, the second photo-curing step, and the third photo-curing step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0125] Other details of the heating process: The method for producing a laminate structure (1) may or may not include a heating step for the first and second photocured layers. The method for producing a laminate structure (1) may or may not include a heating step for the third photocured layer. The method for producing a laminate structure (1) may or may not include a heating step for the first, second, and third photocured layers. The method for producing a laminate structure (2) may or may not include a heating step for the second photocured layer. The method for producing a laminate structure (2) may or may not include a heating step for the first photocured layer. The method for producing a laminate structure (2) may or may not include a heating step for the first and second photocured layers. From the viewpoint of increasing the strength of the cured layers of the first and second compositions, it is preferable that the method for producing a laminate structure (1) includes a heating step for the first and second photocured layers. From the viewpoint of increasing the strength of the cured product layer of the third composition, the manufacturing method (1) of the laminate structure preferably includes a heating step for the third photocured product layer. From the viewpoint of increasing the strength of the cured product layers of the first, second and third compositions, the manufacturing method (1) of the laminate structure preferably includes a heating step for the first, second and third photocured product layers. From the viewpoint of increasing the strength of the cured product layer of the second composition, the manufacturing method (2) of the laminate structure preferably includes a heating step for the second photocured product layer. From the viewpoint of increasing the strength of the cured product layer of the first composition, the manufacturing method (2) of the laminate structure preferably includes a heating step for the first photocured product layer. From the viewpoint of increasing the strength of the cured product layers of the first and second compositions, the manufacturing method (2) of the laminate structure preferably includes a heating step for the first and second photocured product layers.

[0126] In the method (1) for producing a laminate structure, the heating steps for the first and second photocured material layers are performed after the second photocured material layer forming step. In the method (1) for producing a laminate structure, the heating steps for the first and second photocured material layers are preferably performed before the third photocured material layer forming step, and are preferably performed before the third photocured material layer heating step. In the method (1) for producing a laminate structure, the heating steps for the first and second photocured material layers may be performed after the third photocured material layer forming step. In the method (1) for producing a laminate structure, the heating step for the third photocured material layer may be performed before the arrangement step, or may be performed after the arrangement step. In the method (2) for producing a laminate structure, the heating step for the second photocured material layer is performed after the second photocured material layer forming step. In the second laminate structure manufacturing method (2), the second photocured material layer heating step is preferably performed before the first photocured material layer forming step, and is preferably performed before the first photocured material layer heating step. In the laminate structure manufacturing method (2), the first photocured material layer heating step may be performed before the arrangement step, or may be performed after the arrangement step.

[0127] In the heating step, it is preferable to heat the respective photocured material layers simultaneously.

[0128] The heating temperature and heating time in each of the heating steps can be appropriately changed depending on the composition of the first composition, the second composition, and the third composition, and the coating thickness of the composition. The heating temperature in the heating step may be, for example, 100° C. or higher, 120° C. or higher, 250° C. or lower, or 200° C. or lower. The heating time in the heating step may be, for example, 5 minutes or more, 30 minutes or more, 600 minutes or lower, or 300 minutes or lower.

[0129] Other details of the flattening process: The laminate structure manufacturing method (1) may or may not include the planarization step. The laminate structure manufacturing method (2) may or may not include the planarization step. When manufacturing a laminate structure including a first substrate and a second substrate, the laminate structure manufacturing methods (1) and (2) preferably include the planarization step. By carrying out the planarization treatment, even if the thickness of the cured material layer disposed between the second photocured material layer (or the second photo- and thermocured material layer) and the second substrate is small, the adhesive strength between the cured material layer and the second substrate can be increased.

[0130] In the method (1) for producing a laminate structure, the planarization step may be performed before or after the heating step for the first and second photocured layers. In the method (1) for producing a laminate structure, it is preferable to planarize the surface of the second photo- and thermo-cured layer opposite to the first substrate after the heating step for the first and second photocured layers. In the method (2) for producing a laminate structure, the planarization step may be performed before or after the heating step for the second photocured layer. In the method (2) for producing a laminate structure, it is preferable to planarize the surface of the second photo- and thermo-cured layer opposite to the first substrate after the heating step for the second photocured layer. In these cases, the adhesive strength between the substrate and the cured layer can be increased, and the strength of the cured layer can be increased, so that the cured layer can be prevented from peeling off from the first substrate or from being destroyed during the planarization step.

[0131] The flattening treatment may be a polishing treatment, etc. Examples of the polishing treatment include cutting and polishing treatment using a diamond bit, and chemical mechanical polishing treatment.

[0132] Since the planarization is easy, the planarization is preferably a polishing treatment. Since the planarization is particularly easy, the polishing is preferably a cutting and polishing treatment by a diamond bit, and more preferably a combination of a cutting and polishing treatment by a diamond bit and a chemical mechanical polishing treatment.

[0133] Apparatuses that can be used for the above-mentioned planarization treatment (polishing treatment) include the "Planarization Apparatus" manufactured by Keylink Corporation and the "DFS8910" manufactured by DISCO Corporation.

[0134] The absolute value of the difference between the maximum height and the minimum height of the surface of the second photo- and thermo-cured material layer (or the second photo-cured material layer) after the planarization treatment is preferably 5 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less. When the absolute value of the difference is equal to or less than the upper limit, poor adhesion can be more effectively suppressed, and the inclination of the component to be bonded to the surface after the planarization treatment can be more effectively suppressed. The absolute value of the difference may be 0.5 μm or more.

[0135] Other details of the placement process: The laminate structure manufacturing method (1) and (2) may or may not include the disposing step. The laminate structure manufacturing method (1) preferably includes a disposing step of disposing a second substrate on the surface of the third photocured material layer opposite to the first substrate side. In the laminate structure manufacturing method (1), if the heating step for the third photocured material layer is performed before the disposing step, the second substrate is disposed on the surface of the third photo- and thermosetting material layer opposite to the first substrate side in the disposing step. The laminate structure manufacturing method (2) preferably includes a disposing step of disposing a second substrate on the surface of the first photocured material layer opposite to the first substrate side. In the laminate structure manufacturing method (2), if the heating step for the first photocured material layer is performed before the disposing step, the second substrate is disposed on the surface of the first photo- and thermosetting material layer opposite to the first substrate side in the disposing step.

[0136] The method for disposing the second base material is not particularly limited.

[0137] The first substrate and the second substrate may be the same substrate or may be different substrates.

[0138] The substrate in contact with the cured layer of the second composition is preferably a substrate having an uneven surface or a substrate having a primer-treated surface. In this case, the adhesion between the cured layer of the second composition and the substrate can be further improved, and the effect of the present invention can be more effectively achieved. In addition, the long-term reliability can be improved. Methods for forming unevenness on the surface of the substrate include a method using a brush and a method using a blasting process.

[0139] The surface roughness of the substrate in contact with the cured layer of the first composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. In the method (2) for producing a laminated structure, the substrate in contact with the cured layer of the first composition is the second substrate, and the substrate in contact with the cured layer of the second composition is the first substrate. Therefore, in the method (2) for producing a laminated structure, the surface roughness of the second substrate is preferably smaller than the surface roughness of the first substrate.

[0140] The surface roughness means the surface roughness in the region in contact with the cured layer of the first composition, the second composition, or the third composition, and means the arithmetic mean roughness Ra measured in accordance with JIS B0601:1994.

[0141] The surface roughness of the substrate in contact with the cured layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, and preferably 1000 nm or less, more preferably 500 nm or less.

[0142] The absolute value of the difference between the surface roughness of a substrate in contact with the cured layer of the first composition and the surface roughness of a substrate in contact with the cured layer of the second composition is preferably 50 nm or more, more preferably 100 nm or more, and preferably 900 nm or less, more preferably 800 nm or less.

[0143] In the method (1) for producing a laminated structure, the first substrate is preferably a ceramic substrate or a silicon substrate, more preferably a silicon substrate, and the second substrate is preferably a glass substrate.

[0144] In the method (2) for producing a laminated structure, the first substrate is preferably a ceramic substrate or a silicon substrate, more preferably a ceramic substrate. In the method (2) for producing a laminated structure, the second substrate is preferably a glass substrate.

[0145] (Device) This specification also discloses an apparatus used for manufacturing the laminated structure. The apparatus includes a stage, a first discharge unit for discharging the first composition, a second discharge unit for discharging the second composition, and a first light irradiation unit disposed between the first discharge unit and the second discharge unit. When the first composition and the third composition are different compositions, the apparatus preferably includes a third discharge unit for discharging the third composition.

[0146] The first ejection section is preferably an inkjet head, the second ejection section is preferably an inkjet head, the third ejection section is preferably an inkjet head, and the device is preferably an inkjet device.

[0147] Hereinafter, an apparatus not including a third discharge section will be described in detail, but the third discharge section can have the same configuration as the first discharge section or the second discharge section.

[0148] The device may have only one or more of the first discharge parts for discharging the first composition. The device may have only one or more of the second discharge parts for discharging the second composition. When the device has a plurality of the first discharge parts and the second discharge parts, the manufacturing efficiency of the laminated structure can be improved.

[0149] From the viewpoint of improving the manufacturing efficiency of the laminated structure, the device preferably includes a second light irradiation unit arranged on the opposite side of the first discharge unit to the first light irradiation unit, or on the opposite side of the second discharge unit to the first light irradiation unit. In this case, the second light irradiation unit may be arranged on the opposite side of the first discharge unit to the first light irradiation unit, or on the opposite side of the second discharge unit to the first light irradiation unit, or may be arranged on both the opposite side of the first discharge unit to the first light irradiation unit and the opposite side of the second discharge unit to the first light irradiation unit.

[0150] However, the device does not necessarily have to include the second light irradiation unit. When the device does not include the second light irradiation unit, the first light curing step and the second light curing step are performed using the first light irradiation unit.

[0151] The first light irradiation unit and the second light irradiation unit are preferably capable of irradiating ultraviolet light. The first light irradiation unit is preferably a first ultraviolet light irradiation unit, and the second light irradiation unit is preferably a second ultraviolet light irradiation unit.

[0152] The first ultraviolet ray irradiation section and the second ultraviolet ray irradiation section include a light emitting diode (UV-LED) that generates ultraviolet rays.

[0153] The above-mentioned device may include a first ink tank 16 in which the first composition is stored and a first circulation flow section 17 as shown in FIG. 11(a), and may include a second ink tank 18 in which the second composition is stored and a second circulation flow section 19 as shown in FIG. 11(b). The first circulation flow section 17 connects the first ink tank 16 and the first ejection section 12. The first composition flows inside the first circulation flow section 17. The second circulation flow section 19 connects the second ink tank 18 and the second ejection section 14. The second composition flows inside the second circulation flow section 19.

[0154] The first circulation flow path section 17 has a buffer tank 17A and a pump 17B therein. However, as shown in FIG. 12(a), the first circulation flow path section 17X does not have to have a buffer tank and a pump therein. The first circulation flow path section preferably has the buffer tank and preferably has the pump therein. The first circulation flow path section may have a flow meter, a thermometer, a filter, a liquid level sensor, and the like, in addition to the buffer tank and the pump, in the first circulation flow path section.

[0155] The second circulation flow path section 19 has a buffer tank 19A and a pump 19B therein. However, as shown in FIG. 12(b), the second circulation flow path section 19X does not have to have a buffer tank and a pump therein. The second circulation flow path section preferably has the buffer tank and preferably has the pump therein. The second circulation flow path section may have a flow meter, a thermometer, a filter, a liquid level sensor, and the like, in addition to the buffer tank and the pump, in the second circulation flow path section.

[0156] When the buffer tanks 17A, 19A or the pumps 17B, 19B are provided, the buffer tanks 17A, 19A and the pumps 17B, 19B are preferably disposed between the ejection parts 12, 14 and the ink tanks 16, 18, respectively. The buffer tanks 17A, 19A are disposed closer to the ejection parts 12, 14 than the pumps 17B, 19B. The pumps 17B, 19B are disposed closer to the ink tanks 16, 18 than the buffer tanks 17A, 19A. The first composition is temporarily stored in the buffer tank 17A. The second composition is temporarily stored in the buffer tank 19A.

[0157] Regarding the method of circulating the first composition and the second composition, the compositions can be circulated by utilizing their own weight or by applying pressure or pressure reduction using a pump or the like. A combination of these may be used. Examples of the pump include a cylinder-type non-pulsating pump, a propeller pump, a gear pump, and a diaphragm pump. From the viewpoint of increasing the circulation efficiency and further increasing the formation accuracy of the cured material layer, it is preferable that the first and second circulation flow passage sections include pumps that transport the first and second compositions into the first and second circulation flow passage sections.

[0158] From the viewpoint of further improving the accuracy of formation of the cured material layer, it is preferable that the first and second circulation flow path sections include buffer tanks in which the first and second compositions are temporarily stored.

[0159] When circulating the first and second compositions while heating them, it is possible to adjust the temperatures of the first and second compositions by introducing heaters into the first and second ink tanks or by using heaters in the first and second circulation flow paths.

[0160] The first circulation flow path section is preferably a circulation flow path section for circulating the first composition at 30° C. or higher, more preferably a circulation flow path section for circulating the first composition at 40° C. or higher, preferably a circulation flow path section for circulating the first composition at 100° C. or lower, and preferably a circulation flow path section for circulating the first composition at 90° C. or lower. In this case, the viscosity of the first composition can be optimized, and the ejection properties of the first composition can be improved.

[0161] The second circulation flow path section is preferably a circulation flow path section for circulating the second composition at 30° C. or higher, more preferably a circulation flow path section for circulating the second composition at 40° C. or higher, preferably a circulation flow path section for circulating the second composition at 100° C. or lower, and preferably a circulation flow path section for circulating the second composition at 90° C. or lower. In this case, the viscosity of the second composition can be optimized, and the ejection properties of the second composition can be improved.

[0162] In the discharge nozzle of the discharge part, it is preferable to maintain an appropriate pressure and to minimize pressure fluctuations (pulsation) within that range. When a pump or the like is used, it is preferable to provide a damper between the pump and the discharge part in order to suppress pump pulsation. Examples of such a damper include a buffer tank in which the first and second compositions are temporarily stored and a membrane-type damper.

[0163] In the first and second coating steps, after the first and second compositions are moved from the first and second ink tanks to the first and second ejection parts in the device, the first and second compositions not ejected from the first and second ejection parts are caused to flow through the first and second circulation flow passage parts and moved to the first and second ink tanks. This allows the first and second compositions to be applied while being circulated in the first and second coating steps.

[0164] (Laminated structure) The laminated structure according to the present invention comprises a first substrate, a first layer (layer X) disposed on a surface of the first substrate, and a second layer (layer Y) disposed on a surface of the first layer opposite to the first substrate. In the laminated structure according to the present invention, the combination of the first layer and the second layer is the following combination A or the following combination B. Combination A: The first layer is a photocured layer or a photo- and thermocured layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second layer is a photocured layer or a photo- and thermocured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. Combination B: The first layer is a photocured layer or a photo- and thermosetting layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second layer is a photocured layer or a photo- and thermosetting layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. In the laminated structure according to the present invention, the first composition and the second composition are different compositions. The laminated structure according to the present invention may satisfy either the combination A or the combination B.

[0165] The first composition is cured to form a first layer, which is a cured layer of the first composition. The second composition is cured to form a second layer, which is a cured layer of the second composition. More specifically, the first composition is irradiated with light such as ultraviolet light to be photocured, to form a first layer, which is a photocured layer of the first composition. The second composition is irradiated with light such as ultraviolet light to be photocured, to form a second layer, which is a photocured layer of the second composition.

[0166] When the laminated structure according to the present invention satisfies the above combination A, it is preferable that the laminated structure according to the present invention further satisfies the following configuration. From the viewpoint of more effectively exerting the effects of the present invention, the first layer is preferably a photo- and heat-cured layer of the first composition, and the second layer is preferably a photo- and heat-cured layer of the second composition. The photo-cured layer (first photo-cured layer) of the first composition is heated to form the first layer (first photo- and heat-cured layer) which is a photo- and heat-cured layer. The photo-cured layer (second photo-cured layer) of the second composition is heated to form the second layer (second photo- and heat-cured layer) which is a photo- and heat-cured layer.

[0167] When the laminated structure according to the present invention satisfies the above combination B, it is preferable that the laminated structure according to the present invention further satisfies the following configuration. From the viewpoint of more effectively exerting the effects of the present invention, the first layer is preferably a photo- and heat-cured layer of the second composition, and the second layer is preferably a photo- and heat-cured layer of the first composition. The photo-cured layer (second photo-cured layer) of the second composition is heated to form the first layer (second photo- and heat-cured layer) which is a photo- and heat-cured layer. The photo-cured layer (first photo-cured layer) of the first composition is heated to form the second layer (first photo- and heat-cured layer) which is a photo- and heat-cured layer.

[0168] The second layer preferably has a polished surface.

[0169] The laminated structure may include a third layer (layer Z) disposed on the surface of the second layer opposite to the first layer. The third layer is a photocured layer of a third composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent. In the laminated structure, the second composition and the third composition are different compositions. When the laminated structure according to the present invention satisfies the combination A, the laminated structure according to the present invention preferably includes the third layer.

[0170] The laminated structure preferably includes a second substrate disposed on a surface of the second layer opposite to the first layer side. When the laminated structure includes the third layer, the laminated structure preferably includes a second substrate disposed on a surface of the third layer opposite to the second layer side.

[0171] In the laminate structure, the surface roughness of the substrate in contact with the cured layer of the first composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. In the laminate structure, the surface roughness of the substrate in contact with the cured layer of the third composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. Therefore, in the case of the combination A, in the laminate structure, the surface roughness of the first substrate is preferably smaller than the surface roughness of the second substrate. In the case of the combination B, in the laminate structure, the surface roughness of the second substrate is preferably smaller than the surface roughness of the first substrate.

[0172] The surface roughness means the surface roughness in the region in contact with the cured layer of the first composition, the second composition, or the third composition, and means the arithmetic mean roughness Ra measured in accordance with JIS B0601:1994.

[0173] In the laminate structure, the surface roughness of the substrate in contact with the cured layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, and preferably 1000 nm or less, more preferably 500 nm or less.

[0174] In the laminated structure, the absolute value of the difference between the surface roughness of the substrate in contact with the cured layer of the first composition and the surface roughness of the substrate in contact with the cured layer of the second composition is preferably 50 nm or more, more preferably 100 nm or more, and preferably 900 nm or less, more preferably 800 nm or less.

[0175] From the viewpoint of exerting the effects of the present invention more effectively, the thickness of the second layer is preferably thicker than the thickness of the first layer, more preferably at least 40 μm thicker than the thickness of the first layer, and even more preferably at least 50 μm thicker than the thickness of the first layer.

[0176] From the viewpoint of exerting the effects of the present invention more effectively, the thickness of the second layer is preferably thicker than the thickness of the third layer, more preferably at least 40 μm thicker than the thickness of the third layer, and even more preferably at least 50 μm thicker than the thickness of the third layer.

[0177] In order to more effectively exert the effects of the present invention, the thickness of the first layer is preferably 0.1 μm or more, more preferably 0.3 μm or more, and is preferably 10 μm or less, more preferably 5 μm or less.

[0178] In order to more effectively exert the effects of the present invention, the thickness of the second layer is preferably 40 μm or more, more preferably 50 μm or more, and is preferably 1000 μm or less, more preferably 800 μm or less.

[0179] To more effectively exert the effects of the present invention, the thickness of the third layer is preferably 0.1 μm or more, more preferably 0.3 μm or more, and is preferably 10 μm or less, more preferably 5 μm or less.

[0180] In the laminate of the first layer and the second layer, the ratio of thickness to width (thickness / width) is preferably 0.01 or more, more preferably 0.1 or more, and preferably 200 or less, more preferably 150 or less. When the ratio (thickness / width) is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0181] In the laminate of the first layer, the second layer, and the third layer, the ratio of thickness to width (thickness / width) is preferably 0.01 or more, more preferably 0.1 or more, and preferably 200 or less, more preferably 150 or less. When the ratio (thickness / width) is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0182] In the second layer, the ratio of thickness to width (thickness / width) is preferably at least 0.01, more preferably at least 0.1, and preferably at most 200, more preferably at most 150. When the ratio (thickness / width) is at least the above lower limit and at most the above upper limit, the effects of the present invention can be more effectively exhibited.

[0183] (Inkjet composition set) The inkjet composition set includes the first composition and the second composition. In the inkjet composition set, the first composition and the second composition are not mixed. The first composition is preferably contained in a first container, and the second composition is preferably contained in a second container. The inkjet composition set is a set product of the first composition and the second composition. In the inkjet composition set, the first composition is preferably applied and then the second composition is applied. In the inkjet composition set, the first composition is preferably applied and then the second composition is applied and then the second composition is applied and then the first composition is cured. The inkjet composition set is preferably used to manufacture the above-mentioned laminated structure.

[0184] The inkjet composition set may have a third composition. In this case, the first composition, the second composition, and the third composition are not mixed. The third composition is preferably contained in a third container. The inkjet composition set having the third composition is a set of the first composition, the second composition, and the third composition. In addition, when the first photocured layer (or the first photo- and heat-cured layer) and the third photocured layer (or the third photo- and heat-cured layer) are formed from the same composition, the first composition in the set of the first composition and the second composition can be used to form the third photocured layer (or the third photo- and heat-cured layer).

[0185] FIG. 13 is a cross-sectional view that illustrates a composition set for inkjet according to the first embodiment of the present invention.

[0186] The inkjet composition set 5 has a first container 101, a first composition 1, a second container 102, and a second composition 2. The first composition 1 is accommodated in the first container 101. The second composition 2 is accommodated in the second container 102.

[0187] In the method for producing the laminated structure, the second composition is consumed in a larger amount than the first composition. Therefore, in the composition set for inkjet, the amount (volume) of the first composition contained in the first container is preferably larger than the amount (volume) of the first composition of the second composition contained in the second container.

[0188] (First composition, second composition and third composition) Hereinafter, the components contained in the first composition, the second composition, and the third composition will be described in detail. In this specification, "(meth)acrylate" means either or both of "acrylate" and "methacrylate".

[0189] The first composition and the second composition are different compositions, and the third composition and the second composition are different compositions. That is, the first composition and the second composition are different in composition, and the third composition and the second composition are different in composition. The first composition and the third composition may be different compositions, or may be the same composition. From the viewpoint of increasing the production efficiency of the laminated structure, it is preferable that the first composition and the third composition are the same composition. That is, it is preferable that the first composition and the third composition are the same composition.

[0190] The first composition and the third composition each contain a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent. The second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent.

[0191] The first composition and the third composition may or may not contain a polyfunctional (meth)acrylate compound. The second composition may or may not contain a monofunctional (meth)acrylate compound. When both the first composition and the second composition contain a polyfunctional (meth)acrylate compound, the polyfunctional (meth)acrylate compound contained in the first composition and the polyfunctional (meth)acrylate compound contained in the second composition may be the same or different. When both the third composition and the second composition contain a polyfunctional (meth)acrylate compound, the polyfunctional (meth)acrylate compound contained in the third composition and the polyfunctional (meth)acrylate compound contained in the second composition may be the same or different. When both the first composition and the second composition contain a monofunctional (meth)acrylate compound, the monofunctional (meth)acrylate compound contained in the first composition and the monofunctional (meth)acrylate compound contained in the second composition may be the same or different. When both the third composition and the second composition contain a monofunctional (meth)acrylate compound, the monofunctional (meth)acrylate compound contained in the third composition and the monofunctional (meth)acrylate compound contained in the second composition may be the same or different.

[0192] <(Meth)acrylate compounds> The first composition includes a monofunctional (meth)acrylate compound. The second composition includes a polyfunctional (meth)acrylate compound. The third composition includes a monofunctional (meth)acrylate compound. In this specification, a (meth)acrylate compound having an epoxy group is considered to be a (meth)acrylate compound, not an epoxy compound. The monofunctional (meth)acrylate compound and the polyfunctional (meth)acrylate compound may each be used alone or in combination of two or more kinds.

[0193] Examples of the monofunctional (meth)acrylate compound include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, and methoxydiethylene glycol. chol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.

[0194] The polyfunctional (meth)acrylate compound may be a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, or a tetrafunctional or higher functional (meth)acrylate compound.

[0195] Examples of the bifunctional (meth)acrylate compound include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0196] Examples of the trifunctional (meth)acrylate compound include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.

[0197] Examples of the tetrafunctional (meth)acrylate compound include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.

[0198] Examples of the pentafunctional (meth)acrylate compound include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0199] Examples of the hexafunctional (meth)acrylate compound include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0200] Examples of the (meth)acrylate compound having an epoxy group include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0201] From the viewpoint of exerting the effects of the present invention more effectively, the glass transition temperature of the homopolymer of the monofunctional (meth)acrylate compound contained in the first composition and the third composition is preferably −100° C. or higher, more preferably −90° C. or higher, preferably less than 0° C., more preferably −10° C. or lower, respectively.

[0202] From the viewpoint of exerting the effects of the present invention more effectively, the glass transition temperature of the homopolymer of the polyfunctional (meth)acrylate compound contained in the second composition is preferably 50°C or higher, more preferably 80°C or higher, and preferably 200°C or lower, more preferably 180°C or lower.

[0203] In the polymerization to obtain the homopolymer, the polymerization method is not particularly limited. The above-mentioned monofunctional (meth)acrylate compound or the above-mentioned polyfunctional (meth)acrylate compound can be homopolymerized by a known method to obtain the homopolymer. In the above-mentioned polymerization method, all the above-mentioned monofunctional (meth)acrylate compounds or all the above-mentioned polyfunctional (meth)acrylate compounds can be polymerized at once, or the above-mentioned monofunctional (meth)acrylate compounds or the above-mentioned polyfunctional (meth)acrylate compounds can be sequentially added and polymerized.

[0204] The glass transition temperature can be measured using a differential scanning calorimeter at a temperature rise rate of 10° C. / min in accordance with JIS-K7121. Examples of the differential scanning calorimeter include "DSC7020" manufactured by Hitachi High-Tech Science Corporation.

[0205] From the viewpoint of more effectively exerting the effects of the present invention, the monofunctional (meth)acrylate compounds contained in the first composition and the third composition are preferably compounds in which a group having 4 or more carbon atoms is bonded to an oxygen atom constituting an ester structure of an acrylic acid structure portion. The group having 4 or more carbon atoms may be a group having a branched structure or a group not having a branched structure (a group having a linear structure). The monofunctional (meth)acrylate compounds contained in the first composition and the third composition are preferably isodecyl acrylate, isononyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, or dodecyl acrylate. These monofunctional (meth)acrylate compounds are compounds in which a group having 4 or more carbon atoms is bonded to an oxygen atom constituting an ester structure of an acrylic acid structure portion.

[0206] In order to more effectively exert the effects of the present invention, the polyfunctional (meth)acrylate compound contained in the second composition is preferably a difunctional or trifunctional (meth)acrylate compound.

[0207] From the viewpoint of exerting the effects of the present invention even more effectively, the polyfunctional (meth)acrylate compound contained in the second composition is preferably trimethylolpropane triacrylate, 1,6-hexanediol diacrylate, or dicyclopentenyl dimethanol diacrylate.

[0208] In 100% by weight of the first composition or 100% by weight of the third composition, the content of the monofunctional (meth)acrylate compound is preferably 5% by weight or more, more preferably 10% by weight or more, and preferably 95% by weight or less, more preferably 90% by weight or less. When the content of the monofunctional (meth)acrylate compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0209] When the first composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the first composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. When the third composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the third composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. When the content of the polyfunctional (meth)acrylate compound is the above lower limit or more and the above upper limit or less, the effect of the present invention can be more effectively exhibited.

[0210] In 100% by weight of the second composition, the content of the polyfunctional (meth)acrylate compound is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 99% by weight or less, more preferably 90% by weight or less. When the content of the polyfunctional (meth)acrylate compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0211] When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. When the content of the monofunctional (meth)acrylate compound is the lower limit or more and the upper limit or less, the effects of the present invention can be more effectively exhibited.

[0212] When the first composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the first composition is preferably less than the content of the polyfunctional (meth)acrylate compound in 100% by weight of the second composition. When the third composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the third composition is preferably less than the content of the polyfunctional (meth)acrylate compound in 100% by weight of the second composition. In this case, the effect of the present invention can be more effectively exhibited.

[0213] When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably less than the content of the monofunctional (meth)acrylate compound in 100% by weight of the first composition. When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably less than the content of the monofunctional (meth)acrylate compound in 100% by weight of the third composition. In this case, the effect of the present invention can be more effectively exhibited.

[0214] <Epoxy compounds> The first composition includes an epoxy compound. The second composition includes an epoxy compound. The third composition includes an epoxy compound. The epoxy compound contained in the first composition, the epoxy compound contained in the second composition, and the epoxy compound contained in the third composition may be the same or different. Each of the epoxy compounds may be used alone or in combination of two or more.

[0215] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.

[0216] In order to more effectively exert the effects of the present invention, it is preferable that the epoxy compounds contained in the first composition and the third composition are each a bisphenol A type epoxy compound or a dicyclopentadiene type epoxy compound.

[0217] In order to more effectively exert the effects of the present invention, the epoxy compound contained in the second composition is preferably a bisphenol A type epoxy compound or a dicyclopentadiene type epoxy compound.

[0218] In 100% by weight of the first composition or 100% by weight of the third composition, the content of the epoxy compound is preferably 0.1% by weight or more, more preferably 1% by weight or more, and preferably 90% by weight or less, more preferably 70% by weight or less. When the content of the epoxy compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0219] In 100% by weight of the second composition, the content of the epoxy compound is preferably 0.1% by weight or more, more preferably 1% by weight or more, and preferably 90% by weight or less, more preferably 70% by weight or less. When the content of the epoxy compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0220] <Photopolymerization initiator> The first composition includes a photopolymerization initiator. The second composition includes a photopolymerization initiator. The third composition includes a photopolymerization initiator. The photopolymerization initiator included in the first composition, the photopolymerization initiator included in the second composition, and the photopolymerization initiator included in the third composition may be the same or different. Only one type of the photopolymerization initiator may be used, or two or more types may be used in combination.

[0221] The photopolymerization initiator may be a photoradical polymerization initiator or a photocationic polymerization initiator. The photopolymerization initiator is preferably a photoradical polymerization initiator. The photopolymerization initiator may be used alone or in combination of two or more kinds.

[0222] The photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.Examples of the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone and other aminoacetophenone compounds; 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone and other anthraquinone compounds; 2,4-dimethyl Thioxanthone compounds such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzil dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanol oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime); titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium.The above-mentioned photoradical polymerization initiators may be used alone or in combination of two or more kinds.

[0223] A photopolymerization initiator assistant may be used together with the above-mentioned photoradical polymerization initiator. Examples of the photopolymerization initiator assistant include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiator assistants may be used. The above-mentioned photopolymerization initiator assistants may be used alone or in combination of two or more.

[0224] Furthermore, titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals) that have absorption in the visible light region may be used to promote the photoreaction.

[0225] Examples of the photocationic polymerization initiator include sulfonium salts, iodonium salts, metallocene compounds, benzoin tosylate, etc. The photocationic polymerization initiator may be used alone or in combination of two or more kinds.

[0226] In 100% by weight of the first composition, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 30% by weight or less, more preferably 20% by weight or less.

[0227] In 100% by weight of the second composition, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 30% by weight or less, more preferably 20% by weight or less.

[0228] In 100% by weight of the third composition, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 30% by weight or less, more preferably 20% by weight or less.

[0229] <Thermal hardener> The first composition includes a heat curing agent. The second composition includes a heat curing agent. The third composition includes a heat curing agent. The heat curing agent included in the first composition, the heat curing agent included in the second composition, and the heat curing agent included in the third composition may be the same or different. Only one type of the heat curing agent may be used, or two or more types may be used in combination.

[0230] Examples of the heat curing agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts may also be used as the heat curing agent. Other heat curing agents may also be used.

[0231] The amine compound means a compound having one or more primary to tertiary amino groups. Examples of the amine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives. In addition, the amine compound may be an adduct such as an epoxy compound-added polyamine (a reaction product of an epoxy compound and a polyamine), a Michael addition polyamine (a reaction product of an α,β-unsaturated ketone and a polyamine), a Mannich addition polyamine (a condensate of a polyamine, formalin, and a phenol), a thiourea-added polyamine (a reaction product of a thiourea and a polyamine), or a ketone-blocked polyamine (a reaction product of a ketone compound and a polyamine [ketimine]).

[0232] Examples of the aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0233] Examples of the alicyclic polyamine include benzenediamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0234] Examples of the aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0235] Examples of the hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.

[0236] Examples of the guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, α-2,5-dimethylguanide, α,ω-diphenyldiguanide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0237] The phenol compound may be a polyhydric phenol compound, etc. Examples of the polyhydric phenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, xylylene skeleton-containing phenol novolac resin, dicyclopentadiene skeleton-containing phenol novolac resin, and fluorene skeleton-containing phenol novolac resin.

[0238] Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0239] In 100% by weight of the first composition, the content of the heat curing agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, and preferably 50% by weight or less, more preferably 40% by weight or less.

[0240] In 100% by weight of the second composition, the content of the heat curing agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, and preferably 50% by weight or less, more preferably 40% by weight or less.

[0241] In 100% by weight of the third composition, the content of the heat curing agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, and preferably 50% by weight or less, more preferably 40% by weight or less.

[0242] <Curing accelerator> The first composition may or may not contain a curing accelerator. The second composition may or may not contain a curing accelerator. The third composition may or may not contain a curing accelerator. The curing accelerator contained in the first composition, the curing accelerator contained in the second composition, and the curing accelerator contained in the third composition may be the same or different. Only one type of the curing accelerator may be used, or two or more types may be used in combination.

[0243] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organic metal salts, phosphorus compounds, and urea compounds.

[0244] When the first composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the first composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 10% by weight or less, more preferably 8% by weight or less.

[0245] When the second composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the second composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 10% by weight or less, more preferably 8% by weight or less.

[0246] When the third composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the third composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 10% by weight or less, more preferably 8% by weight or less.

[0247] (solvent) The first composition may or may not contain a solvent. The second composition may or may not contain a solvent. The third composition may or may not contain a solvent. The solvent contained in the first composition, the solvent contained in the second composition, and the solvent contained in the third composition may be the same or different. Only one type of the solvent may be used, or two or more types may be used in combination.

[0248] From the viewpoint of further improving the thickness accuracy of the cured layer of the first composition (photocured layer or photo- and heat-cured layer) and further making it less likely that voids will form in the cured layer of the first composition, the smaller the solvent content in the first composition, the better.

[0249] From the viewpoint of further improving the thickness accuracy of the cured layer of the second composition (photocured layer or photo- and heat-cured layer) and further making it less likely that voids will form in the cured layer of the second composition, the smaller the solvent content in the second composition, the better.

[0250] From the viewpoint of further improving the thickness accuracy of the cured layer of the third composition (photocured layer or photo- and heat-cured layer) and further making it less likely that voids will form in the cured layer of the third composition, the smaller the solvent content in the third composition, the better.

[0251] The solvent includes water and organic solvents.

[0252] From the viewpoint of further enhancing the removability of the residue, the solvent is preferably an organic solvent.

[0253] Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0254] When the first composition contains the solvent, the content of the solvent in 100% by weight of the first composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. Most preferably, the first composition does not contain the solvent.

[0255] When the second composition contains the solvent, the content of the solvent in 100% by weight of the second composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. Most preferably, the second composition does not contain the solvent.

[0256] When the third composition contains the solvent, the content of the solvent in 100% by weight of the third composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. Most preferably, the third composition does not contain the solvent.

[0257] (Filler) The first composition may or may not contain a filler. The second composition may or may not contain a filler. The third composition may or may not contain a filler. The filler contained in the first composition, the filler contained in the second composition, and the filler contained in the third composition may be the same or different. Only one type of the filler may be used, or two or more types may be used in combination.

[0258] From the viewpoint of further increasing the thickness precision of the cured layer (photocured layer or photo- and thermo-cured layer) of the first composition and further preventing voids from being generated in the cured layer of the first composition, the smaller the filler content in the first composition, the better. Also, the smaller the filler content in the first composition, the more the occurrence of ejection defects by an inkjet device is suppressed.

[0259] From the viewpoint of further increasing the thickness precision of the cured layer (photocured layer or photo- and thermo-cured layer) of the second composition and further preventing voids from being generated in the cured layer of the second composition, the smaller the filler content in the second composition, the better. Also, the smaller the filler content in the second composition, the more the occurrence of ejection defects by an inkjet device is suppressed.

[0260] From the viewpoint of further increasing the thickness precision of the cured layer (photocured layer or photo- and thermo-cured layer) of the third composition and further preventing voids from being generated in the cured layer of the third composition, the lower the filler content in the third composition, the better. Also, the lower the filler content in the third composition, the more the occurrence of ejection defects by an inkjet device is suppressed.

[0261] Examples of the filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

[0262] When the first composition contains the filler, the content of the filler in 100% by weight of the first composition is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less. Most preferably, the first composition does not contain the filler.

[0263] When the second composition contains the filler, the content of the filler in 100% by weight of the second composition is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less. Most preferably, the second composition does not contain the filler.

[0264] When the third composition contains the filler, the content of the filler in 100% by weight of the third composition is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less. Most preferably, the third composition does not contain the filler.

[0265] (Other ingredients) The first composition, the second composition, and the third composition may each contain other components, which are not particularly limited and include adhesion aids such as coupling agents, pigments, dyes, leveling agents, defoamers, and polymerization inhibitors.

[0266] (Other details and electronics) The method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention can enhance the prevention of leakage of materials, and therefore can be suitably used for forming a partition material and a dam material in electronic components. However, the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention can also be used for purposes other than this. For example, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, the first layer and the second layer may be used for forming a coating agent.

[0267] Fig. 14 is a cross-sectional view showing an electronic component obtained using the laminated structure according to the first embodiment of the present invention, Fig. 14(a) is a plan view of the electronic component, and Fig. 14(b) is a cross-sectional view taken along line II in Fig. 14(a).

[0268] The electronic component 80 includes a laminated structure 4C. The laminated structure 4C includes a first base material 3, a first photo- and thermo-cured layer (first layer) 1B, a second photo- and thermo-cured layer (second layer) 2B, an underfill material 60, solder balls 65, and a semiconductor chip 70. The first photo- and thermo-cured layer 1B is formed by photo-curing and thermally curing the first composition. The second photo- and thermo-cured layer 2B is formed by photo-curing and thermally curing the second composition.

[0269] The first photo- and thermo-cured material layer 1B and the second photo- and thermo-cured material layer 2B are arranged in a frame shape on the surface of the base material 3. Inside the frame-shaped region, an underfill material 60, solder balls 65, and a semiconductor chip 70 are arranged.

[0270] By pouring the underfill material 60 into the inside of the frame-shaped region, it is possible to obtain the electronic component 80. In the present invention, since a specific first composition and a specific second composition are used, the underfill material 60 is unlikely to leak out to the outside of the frame-shaped region when and after the underfill material 60 is poured into the inside of the frame-shaped region.

[0271] The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to the following examples.

[0272] The following materials were prepared:

[0273] (Monofunctional (meth)acrylate compound) Isodecyl acrylate ("IDAA" manufactured by Osaka Organic Chemical Industry Co., Ltd., glass transition temperature of homopolymer is -68℃) Isononyl acrylate ("INAA" manufactured by Osaka Organic Chemical Industry Co., Ltd., glass transition temperature of homopolymer: -60°C)

[0274] (Polyfunctional (meth)acrylate compound) Trimethylolpropane triacrylate (Daicel-Allnex "TMPTA", glass transition temperature of homopolymer 58°C) 1,6-Hexanediol diacrylate ("HDDA" manufactured by Daicel Allnex Corporation, glass transition temperature of homopolymer is 98℃)

[0275] (Epoxy compounds) Dicyclopentadiene type epoxy compound (DIC "HP7200L") Bisphenol A epoxy compound (DIC "EXA-850CRP")

[0276] (Photopolymerization initiator) 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (IGM Resins, "Omnirad379EG")

[0277] (Thermal hardener) Aromatic amine compound (ADEKA "EH-105L")

[0278] (base material) Silicon wafer (surface roughness Ra in the area in contact with the composition: 0.5 nm) Glass substrate (surface roughness Ra in the area in contact with the composition: 1 nm) Ceramic substrate (surface roughness Ra in the area in contact with the composition: 380 nm)

[0279] Inkjet Equipment: An inkjet device was prepared, which had a stage with a vacuum suction function, a first discharge section, a second discharge section, and a first ultraviolet irradiation section (LED) arranged between the first discharge section and the second discharge section.

[0280] (Examples 1 to 8 and Comparative Examples 1 to 3) Preparation of the first composition: The components shown in Tables 1 to 3 were mixed in the amounts shown in Tables 1 to 3 to obtain a first composition.

[0281] Preparation of the second composition: The components shown in Tables 1 to 3 were mixed in the amounts shown in Tables 1 to 3 to obtain a second composition.

[0282] Comparative Example 4 Preparation of the first composition: A first composition was obtained by mixing the components shown in Table 3 in the amounts shown in Table 3. Note that a second composition was not used.

[0283] Comparative Example 5 Preparation of the second composition: A second composition was obtained by mixing the components shown in Table 3 in the amounts shown in Table 3. The first composition was not used.

[0284] (evaluation) (1) Shape retention of the photocured layer (1-1) In Examples 1 to 4 and Comparative Examples 1 to 3, a laminate structure (X) having a photocured layer was produced as follows.

[0285] Preparation of a laminate structure (X) having a photocured layer: The silicon wafer was fixed to the stage by adsorption. The first composition was discharged from the first discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The first composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a first layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 3 μm was formed.

[0286] Next, the second composition was discharged from the second discharge unit onto the surface of the first layer (photocured layer). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 100 μm was formed on the surface of the first layer (photocured layer).

[0287] In this manner, a laminated structure (X) was obtained which had, in this order, the substrate (silicon wafer), the first layer (photocured layer), and the second layer (photocured layer).

[0288] (1-2) In Examples 5 to 8, a laminate structure (X) having a photocured layer was produced in the same manner as in Example 1, except for the following changes.

[0289] In Example 5, a first layer (photocured layer) having a linear shape with a width of 300 μm, a length of 10 mm and a thickness of 3 μm was formed, and a second layer (photocured layer) having a linear shape with a width of 300 μm, a length of 10 mm and a thickness of 100 μm was formed.

[0290] In Example 6, a first layer (photocured material layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 3 μm was formed, and a second layer (photocured material layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 200 μm was formed.

[0291] In Example 7, a first layer (photocured material layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 5 μm was formed, and a second layer (photocured material layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 100 μm was formed.

[0292] In Example 8, a first layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 5 μm was formed, and a second layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm and a thickness of 200 μm was formed.

[0293] (1-3) In Comparative Example 4, a laminate structure (X) including a photocured layer was produced as follows.

[0294] Preparation of a laminate structure (X) having a photocured layer: The silicon wafer was fixed to the stage by adsorption. The first composition was discharged from the first discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The first composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a first layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm, and a thickness of 103 μm was formed. This was used as a laminated structure (X) having a photocured layer.

[0295] (1-4) In Comparative Example 5, a laminate structure (X) including a photocured layer was produced as follows.

[0296] Preparation of a laminate structure (X) having a photocured layer: The silicon wafer was fixed to the stage by adsorption. The second composition was discharged from the second discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured layer) having a linear shape with a width of 150 μm, a length of 10 mm, and a thickness of 103 μm was formed. This was used as a laminated structure (X) having a photocured layer.

[0297] (1-5) The width and thickness of the first layer (photocured layer) and the second layer (photocured layer) in the laminate structure (X) were measured using a laser microscope (OLS4100 manufactured by Olympus Corporation). In Examples 1 to 8, the shape of the photocured layer was maintained.

[0298] (2) Shape retention of photo- and heat-cured layers Preparation of a laminate structure (X) comprising photo- and thermosetting layers: The first and second layers (photocured layers) in the obtained laminated structure (X) having a photocured layer were thermally cured by heating at 170°C for 1 hour to obtain the first and second layers which are photo- and thermo-cured layers. In this way, a laminated structure (X) having a substrate (silicon wafer), a first layer (photo- and thermo-cured layer), and a second layer (photo- and thermo-cured layer) was obtained.

[0299] The first layer (photo- and thermosetting layer) and the second layer (photo- and thermosetting layer) in the obtained laminate structure (X) were cut using a cross-section polishing device (Struers' "Tegramin 25"). The cross-sections of the first layer (photo- and thermosetting layer) and the second layer (photo- and thermosetting layer) obtained by cutting were observed using an optical microscope (Keyence's "Digital Microscope VH-Z100") to measure the thicknesses of the first layer and the second layer.

[0300] [Criteria for determining shape retention of light- and heat-cured layers] ○: There is no change in thickness of each cured layer before and after heating (change rate is less than 5%) △: There is a slight change in thickness of each cured layer before and after heating (change rate is 5% or more but less than 10%) ×: The thickness of each cured layer changes before and after heating (change rate 10% or more)

[0301] (3) Powder adhesion The silicon wafer was fixed to the stage by adsorption. The second composition was discharged from the second discharge part (in Comparative Example 4, the first composition was discharged from the first discharge part). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation part. 2 The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured layer) having a shape of 10 mm in width, 10 mm in length and 20 μm in thickness was formed.

[0302] Next, 100 mg of silica powder ("Seahorster KE-P250" manufactured by Nippon Shokubai Co., Ltd.) was placed on the surface of the photocured layer, and nitrogen was sprayed onto the surface of the photocured layer at 400 L / min for 10 seconds. The amount of silica powder remaining on the surface of the photocured layer was measured.

[0303] <Criteria for determining powder adhesion> ○: The amount of remaining silica powder is less than 10% ×: The amount of remaining silica powder is 10% or more.

[0304] (4) Adhesion to substrate and interlayer adhesion (heat cycle test) The laminated structure (X) having the photo- and thermosetting layers obtained in "(2) Shape retention of the photo- and thermosetting layers" was placed in a temperature cycle tester ("TA530A" manufactured by Kusumoto Chemical Industries, Ltd.) and subjected to a total of 100 cycles of cold-heat cycle testing, with "-40°C for 30 minutes and 125°C for 30 minutes" being one cycle. Nitrogen was sprayed onto the laminated structure (X) after the cold-heat cycle testing at 400 L / min for 10 seconds. It was confirmed whether peeling occurred between the substrate and the first layer (between the substrate and the second layer in Comparative Example 4) or between the first layer and the second layer.

[0305] <Evaluation criteria for adhesion to substrate and interlayer adhesion (heat cycle test)> ○: No peeling occurs between the substrate and the material ×: Peeling occurs between the substrate and the substrate ○: No peeling occurs between layers ×: Peeling occurs between layers

[0306] (5) Leakage prevention of materials The silicon wafer was fixed to the stage by adsorption. The first composition was discharged from the first discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The first composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the coating and irradiation with UV light, a first layer (photocured layer) having a square frame shape with a width of 150 μm, a side length of 10 mm, and a thickness of 3 μm was formed.

[0307] Next, the second composition was discharged from the second discharge unit onto the surface of the first layer (photocured layer). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured layer) having a square frame shape with a width of 150 μm, a side length of 10 mm, and a thickness of 100 μm was formed on the surface of the first layer (photocured layer).

[0308] Next, the first and second layers (photocured layers) were thermally cured by heating at 170°C for 1 hour to obtain the first and second layers which were photo- and thermo-cured layers. In this way, a laminated structure including the substrate (silicon wafer), the first layer (photo- and thermo-cured layer), and the second layer (photo- and thermo-cured layer) was obtained.

[0309] Preparation of material X: The following ingredients were mixed in a planetary mixer, and the resulting mixture was dispersed in a three-roll mill to obtain material X.

[0310] Bisphenol F type epoxy resin (DIC "EPICLON830") 70 parts by weight Reactive diluent (ADEKA "ED-529") 30 parts by weight Heat curing agent (ADEKA "EH105L") 30 parts by weight Fused silica (Admatechs "SO-C5") 300 parts by weight Coupling agent (JNC "S510") 3 parts by weight Carbon black ("MA-600" manufactured by Mitsubishi Chemical Corporation) 0.5 parts by weight

[0311] The obtained material X was filled to a thickness of 50 μm inside a photocured and thermoset layer (a laminate of a first layer and a second layer) having a square frame shape, and material X was thermally cured by heating at 150° C. for 1 hour.

[0312] An optical microscope (Keyence Corporation, Digital Microscope VH-Z100) was used to check whether or not material X had leaked outside the photo- and thermosetting layer.

[0313] In Comparative Example 4, a first layer (photocured material layer) having a square frame shape with a width of 150 μm, a side length of 10 mm, and a thickness of 103 μm was formed on a silicon wafer, and the first layer (photocured material layer) was then thermally cured by heating at 170° C. for 1 hour to obtain a first layer that was a photo- and thermo-cured material layer, except that the evaluation was performed in the same manner as above.

[0314] In addition, in Comparative Example 5, a second layer (photocured material layer) having a square frame shape with a width of 150 μm, a side length of 10 mm, and a thickness of 103 μm was formed on a silicon wafer, and the second layer (photocured material layer) was then thermally cured by heating at 170°C for 1 hour to obtain a second layer that was a photo- and thermo-cured material layer, except that the evaluation was performed in the same manner as above.

[0315] <Criteria for determining material leakage prevention> ○: No leakage was observed ×: Leakage confirmed

[0316] In Comparative Example 4, the shape of the photo- and thermosetting layer (a laminate of the first and second layers) changed during thermal curing, and the thickness of the photo- and thermosetting layer decreased to about 30 μm, causing material X to leak out to the outside of the photo- and thermosetting layer. Also, in Comparative Examples 1 to 3 and 5, the adhesive strength between the base material (silicon wafer) and the first layer, or the adhesive strength between the first layer and the second layer, was low, so the thermal expansion of material X could not be withstood, causing material X to leak out to the outside of the photo- and thermosetting layer.

[0317] (Examples 9 to 14) Preparation of the first and third compositions: The components shown in Tables 4 and 5 were mixed in the amounts shown in Tables 4 and 5 to obtain a first composition and a third composition.

[0318] Preparation of the second composition: The components shown in Tables 4 and 5 were mixed in the amounts shown in Tables 4 and 5 to obtain a second composition.

[0319] (evaluation) (1) Shape retention of the photocured layer (1-1) In Example 9, a laminated structure (X) was produced as follows.

[0320] Fabrication of laminated structure (X): The silicon wafer was fixed to the stage by adsorption. The first composition was discharged from the first discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The first composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the coating and irradiation with UV light, a first layer (photocured layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm was formed.

[0321] Next, the second composition was discharged from the second discharge unit onto the surface of the first layer (photocured layer). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured product layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 1000 μm was formed on the surface of the first layer (photocured product layer).

[0322] Next, the third composition (first composition) was discharged from the first discharge unit onto the surface of the second layer (photocured layer). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The third composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a third layer (photocured layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 10 μm was formed.

[0323] Next, a glass substrate was bonded onto the surface of the third layer using a bonder (FTD-7000P manufactured by Shibaura Mechatronics Corporation) and heated at 170°C for 1 hour to thermally cure the first layer (photocured layer), the second layer (photocured layer) and the third layer (photocured layer).

[0324] In this way, a laminated structure (X) was obtained which had, in this order, a first base material (silicon wafer), a first layer (photo- and thermo-cured layer), a second layer (photo- and thermo-cured layer), a third layer (photo- and thermo-cured layer), and a second base material (glass substrate).

[0325] (1-2) In Examples 10 and 11, a laminate structure (X) was produced in the same manner as in Example 9, except that the following operations were additionally performed and a third layer (photocured layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm was formed.

[0326] After the formation of the second layer (photocured layer) and before the ejection of the third composition, the laminate of the substrate (silicon wafer), the first layer (photocured layer), and the second layer (photocured layer) was heated at 170°C for 1 hour to thermally cure the first layer (photocured layer) and the second layer (photocured layer). Next, a planarization process was performed by cutting and polishing the surface of the second layer (photo- and thermosetting layer) by 100 μm using a planarization device (manufactured by Keylink Co., Ltd.). In Examples 10 and 11, the absolute value of the difference between the maximum height and the minimum height of the surface of the second layer after the planarization process was 3 μm or less.

[0327] In this way, a laminated structure (X) was obtained having, in this order, a base material (silicon wafer), a first layer (photo- and thermo-cured layer), a second layer (photo- and thermo-cured layer), a third layer (photo- and thermo-cured layer), and a second base material (glass substrate).

[0328] (1-3) In Example 12, a laminated structure (X) was produced as follows.

[0329] Fabrication of laminated structure (X): The ceramic substrate was fixed by adsorption to the stage. The second composition was discharged from the second discharge unit. 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The second composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a second layer (photocured layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 1000 μm was formed on the surface of the substrate.

[0330] Next, the first composition was discharged from the first discharge unit onto the surface of the second layer (photocured layer). 0.1 seconds after the discharge, ultraviolet light having a wavelength of 365 nm and an illuminance of 2000 mW / cm was emitted from the first ultraviolet irradiation unit. 2 The first composition was photocured by irradiating with UV light for 0.2 seconds. By repeating the application and irradiation with UV light, a first layer (photocured product layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 10 μm was formed on the surface of the second layer (photocured product layer).

[0331] Next, a glass substrate was bonded onto the surface of the first layer using a bonder ("FTD-7000P" manufactured by Shibaura Mechatronics Corporation), and the first layer (photocured layer) and the second layer (photocured layer) were thermally cured by heating at 170°C for 1 hour.

[0332] In this manner, a laminated structure (X) was obtained which had, in this order, the base material (ceramic substrate), the second layer (photocured layer), the first layer (photocured layer), and the base material (glass substrate).

[0333] (1-4) In Examples 13 and 14, a laminate structure (X) was prepared in the same manner as in Example 12, except that the following operations were additionally performed and a first layer (photocured layer) having a square frame shape with a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm was formed.

[0334] After the second layer (photocured layer) was formed and before the first composition was discharged, the laminate of the base material (ceramic substrate) and the second layer (photocured layer) was heated at 170°C for 1 hour to thermally cure the second layer (photocured layer). Next, a flattening treatment was performed by cutting and polishing the surface of the second layer (photo- and thermosetting layer) by 100 μm using a flattening device (manufactured by Keylink Co., Ltd.). In Examples 13 and 14, the absolute value of the difference between the maximum height and the minimum height of the second layer after the flattening treatment was 3 μm or less.

[0335] In this manner, a laminated structure (X) was obtained which had, in this order, the base material (ceramic substrate), the second layer (photocured layer), the first layer (photocured layer), and the base material (glass substrate).

[0336] (1-5) The width and thickness of the first layer (photocured layer), the second layer (photocured layer) and the third layer (photocured layer) in the laminate structure (X) were measured using a laser microscope (Olympus Corporation, "OLS4100"). In Examples 9 to 14, the shape of the photocured layer was maintained.

[0337] (2) Shape retention of photo- and heat-cured layers The shape retention of the photo- and thermosetting layers was evaluated in the same manner as in “(2) Shape retention of the photo- and thermosetting layers” in the evaluations of Examples 1 to 8 and Comparative Examples 1 to 6. Note that this evaluation was not performed in Examples 10, 11, 13, and 14 in which a flattening treatment was performed.

[0338] [Criteria for determining shape retention of light- and heat-cured layers] ○: There is no change in thickness of each cured layer before and after heating (change rate is less than 5%) △: There is a slight change in thickness of each cured layer before and after heating (change rate is 5% or more but less than 10%) ×: The thickness of each cured layer changes before and after heating (change rate 10% or more)

[0339] (3) Powder adhesion The adhesion of the powder to the second layer (photocured layer) was evaluated in the same manner as in "(3) Adhesion of powder" performed in the evaluation of Examples 1 to 8 and Comparative Examples 1 to 6.

[0340] <Criteria for determining powder adhesion> ○: The amount of remaining silica powder is less than 10% ×: The amount of remaining silica powder is 10% or more.

[0341] (4) Adhesion to substrate and interlayer adhesion (heat cycle test) Except for using the obtained laminated structure (X), the adhesion to the substrate and the interlayer adhesion were evaluated in the same manner as in "(4) Adhesion to the substrate and interlayer adhesion (cooling and heating cycle test)" performed in the evaluation of Examples 1 to 8 and Comparative Examples 1 to 6. It was confirmed whether peeling occurred between the substrate and the first layer, between the first layer and the second layer, between the second layer and the third layer, or between the third layer and the substrate.

[0342] <Evaluation criteria for adhesion to substrate and interlayer adhesion (heat cycle test)> ○: No peeling occurs between the substrate and the material ×: Peeling occurs between the substrate and the substrate ○: No peeling occurs between layers ×: Peeling occurs between layers

[0343] (5) Leak prevention of material (interface with second substrate) The center of the base material (glass substrate) in the obtained laminated structure (X) was cut with a laser to provide an injection port for material X. Next, material X was filled from the injection port into the inside of the photo- and thermosetting layer having a square frame shape, and the material X was thermally cured by heating at 150°C for 1 hour. In Examples 9 to 11, it was confirmed using an optical microscope (Keyence Corporation's "Digital Microscope VH-Z100") whether material X had leaked out from between the second base material (glass substrate) and the third layer, and in Examples 12 to 14, between the second base material (glass substrate) and the first layer.

[0344] <Criteria for determining material leakage prevention> ○: No leakage was observed ×: Leakage confirmed

[0345] The configuration and results are shown in Tables 1 to 5 below.

[0346] [Table 1]

[0347] [Table 2]

[0348] [Table 3]

[0349] [Table 4]

[0350] [Table 5] [Explanation of symbols]

[0351] 1...First composition 1A…First photocured layer 1B, 1D, 1E...First photo- and thermosetting layer 2...Second composition 2A: Second photocured layer 2B, 2D, 2E...Second photo- and thermosetting layer 3...First substrate 4A,4B,4C,4D,4E…Laminated structure 5... Inkjet composition set 6D…Third photo- and thermosetting layer 7...Second substrate 10...device 11. Stage 12...First discharge section 13...First light irradiation unit 14...Second discharge section 15...Second light irradiation unit 16…First ink tank 17, 17X…First circulation flow path section 17A, 19A...Buffer tank 17B, ​​19B…Pump 18…Second ink tank 19, 19X: Second circulation flow path 60...Underfill material 65...Solder ball 70…Semiconductor chip 80...Electronic components 101…First container 102...Second container

Claims

1. a first photocuring step of irradiating light onto a first composition applied onto a surface of a first substrate by an inkjet method to form a first photocured layer in which the first composition is photocured; a second photocuring step of irradiating with light a second composition applied by an inkjet method to a surface side of the first photocured material layer opposite to the first substrate side, to form a second photocured material layer in which the second composition is photocured; the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; The method for producing a laminated structure, wherein the first composition and the second composition are different compositions.

2. a second coating step of coating a second composition on a surface side of the first photocured material layer opposite to the first substrate side by an inkjet method; The method for producing a laminate structure according to claim 1 , wherein in the second photocuring step, the second composition applied in the second application step is irradiated with light.

3. The method for producing a laminate structure according to claim 2 , wherein the second applying step and the second photocuring step are each performed a plurality of times in a thickness direction of the first photocured material layer.

4. 4. The method for producing a laminate structure according to claim 1, further comprising a heating step for heating the first and second photocured layers to form a first photo- and thermo-cured layer formed by thermally curing the first photocured layer, and a second photo- and thermo-cured layer formed by thermally curing the second photocured layer.

5. a heating step for the first and second photocured layers, in which the first photocured layer and the second photocured layer are heated to form a first photo- and heat-cured layer formed by thermally curing the first photocured layer, and a second photo- and heat-cured layer formed by thermally curing the second photocured layer, When the heating step for the first and second photocured layers is included, a third photocuring step is included in which a third composition is applied to a surface side of the second photo- and thermo-cured material layer opposite to the first substrate side by an inkjet method, and the third composition is photocured to form a third photocured material layer, When the heating steps for the first and second photocured material layers are not provided, a third photocuring step is provided in which a third composition is applied to a surface side of the second photocured material layer opposite to the first substrate side by an inkjet method, and light is applied to the third composition to form a third photocured material layer in which the third composition is photocured; the third composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat curing agent; The method for producing a laminate structure according to any one of claims 1 to 3, wherein the second composition and the third composition are different compositions.

6. The method for producing a laminated structure according to claim 5 , wherein the first composition and the third composition are the same composition.

7. When the heating step for the first and second photocured material layers is included, a planarization step is included in which a surface of the second photo- and thermo-cured material layer opposite to the first base material side is planarized after the heating step for the first and second photocured material layers, When the heating step for the first and second photocured material layers is not provided, a planarization step is provided for planarizing a surface of the second photocured material layer opposite to the first base material side after the second photocuring step, The method for producing a laminated structure according to claim 5 or 6, wherein the planarization treatment is a polishing treatment.

8. The method for manufacturing a laminate structure according to any one of claims 5 to 7, further comprising a step of placing a second substrate on a surface of the third photocured material layer opposite to the first substrate side.

9. When the heating steps for the first and second photocured material layers are provided, a heating step for a third photocured material layer is provided in which the third photocured material layer is heated to form a third photo- and thermo-cured material layer in which the third photocured material layer is thermally cured, 9. The method for producing a laminate structure according to any one of claims 5 to 8, further comprising, when the heating step for the first and second photocured material layers is not provided, a heating step for the first, second and third photocured material layers, of heating the first photocured material layer, the second photocured material layer and the third photocured material layer to form a first photo- and thermo-cured material layer formed by thermally curing the first photocured material layer, a second photo- and thermo-cured material layer formed by thermally curing the second photocured material layer, and a third photo- and thermo-cured material layer formed by thermally curing the third photocured material layer.

10. a second photocuring step of irradiating light onto the second composition applied onto the surface of the first base material by the inkjet method to form a second photocured layer in which the second composition is photocured; a heating step for a second photocured material layer, in which the second photocured material layer is heated to form a second photo- and thermo-cured material layer in which the second photocured material layer is thermally cured, or not; When the heating step for the second photocured material layer is included, a first photocuring step is included in which a first composition is applied to a surface side of the second photo- and thermo-cured material layer opposite to the first substrate side by an inkjet method, and a first photocured material layer is formed by photocuring the first composition, When the heating step for the second photocured material layer is not provided, a first photocuring step is provided in which a first composition is applied by an inkjet method to a surface side of the second photocured material layer opposite to the first substrate side, and light is applied to the first composition to form a first photocured material layer in which the first composition is photocured; the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; The method for producing a laminated structure, wherein the first composition and the second composition are different compositions.

11. a second photocured material layer heating step of heating the second photocured material layer to form a second photo- and thermo-cured material layer in which the second photocured material layer is thermally cured, 11. The method for producing a laminate structure according to claim 10, wherein in the first photocuring step, a first composition applied by an inkjet method to a surface side of the second photo- and thermosetting material layer opposite to the first substrate side is irradiated with light to form a first photocured material layer in which the first composition is photocured.

12. When the heating step for the second photocured material layer is included, a planarization step is included in which a surface of the second photo- and thermo-cured material layer opposite to the first base material side is planarized after the heating step for the second photocured material layer, When the heating step for the second photocured material layer is not provided, a planarization step is provided for planarizing a surface of the second photocured material layer opposite to the first base material side after the second photocuring step, The method for producing a laminated structure according to claim 10 , wherein the planarization treatment is a polishing treatment.

13. When the heating step for the second photocured material layer is provided, a heating step for the first photocured material layer is provided in which the first photocured material layer is heated to form a first photo- and thermo-cured material layer in which the first photocured material layer is thermally cured, 13. The method for producing a laminate structure according to claim 12, further comprising, when the heating step for the second photocured material layer is not provided, a heating step for the first and second photocured material layers, of heating the first photocured material layer and the second photocured material layer to form a first photo- and thermo-cured material layer formed by thermally curing the first photocured material layer, and a second photo- and thermo-cured material layer formed by thermally curing the second photocured material layer.

14. The method for producing a laminate structure according to any one of claims 10 to 13, further comprising a step of placing a second substrate on a surface of the first photocured material layer opposite to the first substrate.

15. The method for manufacturing a laminated structure according to claim 14 , wherein the second substrate has a surface roughness smaller than the surface roughness of the first substrate.

16. A first substrate; a first layer disposed on a surface of the first substrate; and a second layer disposed on a surface of the first layer opposite to the first substrate side, wherein a combination of the first layer and the second layer is a combination in which the first layer is a photocured product layer or a photo- and thermocured product layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, and the second layer is a photocured product layer or a photo- and thermocured product layer of a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, or a combination in which the first layer is a photocured product layer or a photo- and thermocured product layer of a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, and the second layer is a photocured product layer or a photo- and thermocured product layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent, A laminate structure, wherein the first composition and the second composition are different compositions.

17. the first layer is a photocured product layer or a photo- and thermocured product layer of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent; The laminated structure according to claim 16, wherein the second layer is a photocured layer or a photo- and thermally cured layer of a second composition comprising a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent.

18. 20. The laminate structure of claim 17, wherein the second layer has a polished surface.

19. 19. The laminated structure according to claim 17 or 18, further comprising a second substrate disposed on a surface of the second layer opposite to the first layer side.

20. the first layer is a photo- and thermally cured layer of the first composition; The laminated structure according to any one of claims 17 to 19, wherein the second layer is a photo- and thermally cured layer of the second composition.

21. The laminated structure according to any one of claims 17 to 20, wherein the second layer has a thickness greater than the thickness of the first layer.

22. The thickness of the first layer is 0.1 μm or more and 10 μm or less, The laminate structure according to any one of claims 17 to 21, wherein the second layer has a thickness of 1 µm or more and 1000 µm or less.

23. a third layer disposed on a surface of the second layer opposite to the first layer side; the third layer is a photocured layer or a photo- and thermocured layer of a third composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent; The laminate structure according to any one of claims 17 to 22, wherein the second composition and the third composition are different compositions.

24. 24. The laminate structure of claim 23, wherein the first composition and the third composition are the same composition.

25. 25. The laminated structure according to claim 23 or 24, further comprising a second substrate disposed on a surface of the third layer opposite to the second layer side.

26. 26. The laminate structure of claim 25, wherein the surface roughness of the first substrate is less than the surface roughness of the second substrate.

27. The laminated structure according to any one of claims 23 to 26, wherein the third layer is a photo- and thermally cured layer of the third composition.

28. The laminated structure according to any one of claims 23 to 27, wherein the second layer has a thickness greater than the thickness of the third layer.

29. The laminate structure according to any one of claims 23 to 28, wherein the third layer has a thickness of 0.1 µm or more and 10 µm or less.

30. the first layer is a photocured layer or a photo- and thermocured layer of a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent; The laminate structure according to claim 16, wherein the second layer is a photocured layer or a photo- and thermally cured layer of a first composition comprising a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent.

31. an inkjet composition set having a first composition and a second composition, the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the first composition and the second composition are different compositions, The inkjet composition set, wherein the first composition and the second composition are used without being mixed.

32. an inkjet composition set having a first composition and a second composition, the first composition contains a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the second composition contains a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermal curing agent; the first composition and the second composition are different compositions, A composition set for inkjet, wherein the first composition is used to form a first photocured material layer or a first photo- and heat-cured material layer, and the second composition is used to form a second photocured material layer or a second photo- and heat-cured material layer, and the first composition and the second composition are used to form different cured material layers.

33. A first container and a second container, The first composition is contained in the first container, The ink jet composition set according to claim 31 or 32, wherein the second composition is contained in the second container.

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