Tape splicing device and method

The tape bonding device and method simplify the joining of dicing tape ends by using peeling and joining mechanisms within the device, eliminating the need for auxiliary materials and complex operations.

JP7650680B2Active Publication Date: 2025-03-25TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
JP2021027973
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-02-24
Publication Date
2025-03-25
Estimated Expiration
2041-02-24

AI Technical Summary

Technical Problem

Existing tape bonding devices require complex operations and auxiliary materials to join the ends of dicing tapes, making the process inefficient and material-intensive.

Method used

A tape bonding device and method that includes first and second peeling means to remove the tape main body from the separator at the ends of the dicing tapes, and a joining means to bond the separators together, allowing the ends of the dicing tapes to be joined without secondary materials.

Benefits of technology

Enables easy and efficient joining of dicing tape ends without auxiliary materials, simplifying the process and reducing material waste by omitting the need for winding tapes around rollers.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a tape joining device and method which can easily join end parts of two dicing tapes without using a subsidiary material.SOLUTION: A joining section 4 for joining end parts of dicing tapes DT includes: an upstream side peeling roller 45 for peeling a tape body B from a separator S in an end part of a following dicing tape DT; a downstream side peeling roller 46 for peeling a tape body B from a separator S in an end part of a preceding dicing tape DT; and a joining unit 48 for joining end parts of the separator S of the preceding dicing tape DT2 and the separator S of the following dicing tape DT1, and for joining end parts of the tape body B of the preceding dicing tape DT2 and the tape body B of the following dicing tape DT1.SELECTED DRAWING: Figure 3
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Description

[Technical field]

[0001] The present invention relates to a tape splicing device and method for splicing ends of first and second dicing tapes. [Background technology]

[0002] In the field of semiconductor manufacturing, there is a process in which semiconductor substrates such as silicon wafers (hereinafter referred to as the "work") are cut into chips. In this process, a dicing tape attached to the work restricts the position of each chip, allowing the chips to be cut efficiently.

[0003] Patent Document 1 describes a tape application device that allows the use of a roll tape 2B attached to one shaft 11 even after the roll tape 2A attached to the other shaft 11 has been used up. Patent Document 2 describes an adhesive tape splicing device that splices an adhesive tape T and a separator S via a splicing tape CT. The reference numerals are those of the respective patent documents. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-8104 A [Patent Document 2] JP 2014-133616 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the device described in Patent Document 1, when replacing the tape, it was necessary to remove the used roll tape that was wound around various rollers and set to follow a predetermined trajectory, and then to reset the new roll tape so that it follows the predetermined trajectory.

[0006] Furthermore, in the device described in Patent Document 2, it is necessary to prepare a joining tape, which is an auxiliary material, for joining the leading adhesive tape and the trailing adhesive tape.

[0007] Therefore, a technical problem arises that needs to be solved in order to easily join the ends of two dicing tapes together without using auxiliary materials, and the present invention aims to solve this problem. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, the tape splicing device of the present invention is a tape splicing device that joins ends of first and second dicing tapes together, and is equipped with a first peeling means that peels the tape body from the separator at the end of the first dicing tape, a second peeling means that peels the tape body from the separator at the end of the second dicing tape, and a joining means that joins the separators of the first and second dicing tapes together and joins the tape bodies of the first and second dicing tapes together.

[0009] According to this configuration, the ends of the first and second dicing tapes can be joined together without using auxiliary materials. Furthermore, by joining the end of one of the first and second dicing tapes to the end of the other of the trailing first and second dicing tapes, the ends of the first and second dicing tapes can be easily joined together without the need for a complicated setting operation of winding the trailing dicing tape around various rollers.

[0010] In addition, in order to achieve the above-mentioned object, the tape joining method of the present invention is a tape joining method for joining ends of a first and a second dicing tape together, and includes a step of peeling the tape body from the separator at an end of the first dicing tape, a step of peeling the tape body from the separator at an end of the second dicing tape, joining the separators of the first and second dicing tapes together, and joining the tape bodies of the first and second dicing tapes together.

[0011] According to this configuration, the ends of the first and second dicing tapes can be joined together without using auxiliary materials. Furthermore, by joining the end of one of the first and second dicing tapes to the end of the other of the trailing first and second dicing tapes, the ends of the first and second dicing tapes can be easily joined together without the need for a complicated setting operation of winding the trailing dicing tape around various rollers. Effect of the Invention

[0012] The present invention makes it possible to easily join the ends of the first and second dicing tapes together without using any auxiliary materials. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view showing a tape application device to which a tape splicing device according to an embodiment of the present invention is applied; [Diagram 2] FIG. 4 is a schematic diagram showing a process of cutting a used dicing tape. [Diagram 3] FIG. 13 is a schematic diagram showing a process of connecting a trailing dicing tape to a leading dicing tape. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] An embodiment of the present invention will be described with reference to the drawings. In the following, when the number, numerical value, amount, range, etc. of components are mentioned, the number is not limited to the specific number, and may be more or less than the specific number, unless otherwise specified or when it is clearly limited to a specific number in principle.

[0015] In addition, when referring to the shape or positional relationship of components, etc., this includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or considered to be clearly different in principle.

[0016] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional ratios of the components may not be the same as in reality.

[0017] 1 is a perspective view of a tape application device 1. The tape application device 1 applies a tape body B of a dicing tape DT to a workpiece W and a dicing frame DF. The workpiece W is, for example, a semiconductor substrate such as a silicon wafer, but is not limited to this. The dicing tape DT is, for example, an ultraviolet curing tape.

[0018] The tape application device 1 includes a transport section 2, an application section 3, and a joining section 4 serving as a tape joining section.

[0019] The transfer section 2 includes an inner circumference side table 21 that holds the workpiece W, and an outer circumference side table 22 on which the dicing frame DF is placed.

[0020] An adsorbent (not shown) made of a porous material having numerous pores is embedded in the surface of the inner circumferential table 21. The roughness of the pores in the adsorbent is, for example, #400 or #800.

[0021] The inner circumference side table 21 is switchably connected to a vacuum source and a compressed air source, not shown. When the vacuum source is activated, negative pressure is supplied between the workpiece W placed on the inner circumference side table 21 and the upper surface (adsorption surface) of the adsorption body, and the workpiece W is adsorbed and held on the adsorption surface. When the compressed air source is activated, compressed air (release air) is supplied between the workpiece W and the adsorption surface, and the adsorption between the workpiece W and the adsorption surface is released.

[0022] The inner circumference side table 21 and the outer circumference side table 22 are placed on a slider 23 and configured to be slidable in a predetermined conveying direction.

[0023] The joining section 3 includes feed rollers 31a, 31b that support the dicing tape DT so that it can be paid out, a take-up roller 32 that takes up the separator S peeled off from the dicing tape DT and imparts a pay-out force to the dicing tape DT, first to sixth guide rollers 33a to 33f that apply tension to the dicing tape DT and regulate the trajectory of the dicing tape DT, a pressure roller 34 that moves up and down to join the tape body B to the workpiece W, and a knife plate 35 that regulates the trajectory of the separator S. Note that there may be three or more feed rollers.

[0024] The joint section 4 is equipped with a lift plate 41 having feed rollers 31a and 31b standing upright from the side surface. The lift plate 41 is provided so as to be able to move up and down freely, and can switch the feed rollers 31a and 31b between a pay-out position where the dicing tape DT can be fed out or a standby position where an unused dicing tape DT is stored.

[0025] The joining section 4 includes upstream holding portions 42a, 42b and a downstream holding portion 43, each capable of suction-holding the dicing tape DT.

[0026] The upstream holding portions 42a and 42b stand upright from the side surfaces of the lift plate 41. The upstream holding portion 42a is capable of holding the dicing tape DT paid out from the feed roller 31a, and the upstream holding portion 42b is capable of holding the dicing tape DT paid out from the feed roller 31b. The upstream holding portions 42a and 42b are configured to be slidable along the payout direction D of the dicing tape DT.

[0027] The downstream holding portion 43 is disposed downstream in the payout direction D with respect to the feed rollers 31a, 31b located at the payout position, and is capable of holding the dicing tape DT. The downstream holding portion 43 is configured to be slidable along the payout direction D.

[0028] The joint section 4 includes a cutter 44. The cutter 44 is configured to be slidable in the up and down direction, and the cutting edge of the cutter 44 is pressed against the dicing tape DT, whereby the cutter 44 cuts the dicing tape DT.

[0029] The joint unit 4 includes an upstream peeling roller 45 as a first peeling means and a downstream peeling roller 46 as a second peeling means. The upstream peeling roller 45 and the downstream peeling roller 46 are made of, for example, resin. The upstream peeling roller 45 and the downstream peeling roller 46 are configured to be slidable along the payout direction D.

[0030] The upstream peeling roller 45 is configured to be rotatable around a rotation axis A1. A needle-shaped member 45a is provided upright on the outer circumferential surface of the upstream peeling roller 45. As will be described later, the needle-shaped member 45a is provided inclined toward the upstream side in the payout direction D with respect to the radial direction of the upstream peeling roller 45.

[0031] The downstream peeling roller 46 is configured to be rotatable around a rotation axis A2. A needle-shaped member 46a is provided upright on the outer circumferential surface of the downstream peeling roller 46. As will be described later, the needle-shaped member 46a is provided inclined toward the downstream side in the payout direction D with respect to the radial direction of the downstream peeling roller 46.

[0032] The joining section 4 includes a joining unit 47 capable of joining a leading first dicing tape DT (hereinafter referred to as a "leading dicing tape DT1") and a trailing second dicing tape DT (hereinafter referred to as a "trailing dicing tape DT2") together. Note that the joining mode performed by the joining unit 47 may be any mode, such as thermocompression bonding or vibration.

[0033] The operation of the tape application device 1 is controlled via a controller (not shown). The controller controls each of the components that make up the tape application device 1. The controller is, for example, a computer, and is composed of a CPU, memory, etc. The functions of the controller may be realized by control using software, or may be realized by something that operates using hardware.

[0034] Next, the operation of the tape application device 1 will be described with reference to the drawings.

[0035] <Work transport> First, the dicing frame DF is transferred onto the outer circumferential table 22 by a transfer hand or the like (not shown).

[0036] Next, the workpiece W is transferred onto the inner circumference side table 21 by a transport hand (not shown) or the like. Thereafter, when negative pressure is supplied between the workpiece W and the suction surface from a compressed air source, the workpiece W is suctioned onto the inner circumference side table 21. The upper surface of the workpiece W and the upper surface of the dicing frame DF are set to be approximately flush with each other.

[0037] <Tape application> Next, the slider 23 is driven to move the inner circumference side table 21 and the outer circumference side table 22 so that one end of the tape body B (the joining start position) is located below the pressure roller .

[0038] Next, the take-up roller 32 rotates to pay out the dicing tape DT, and the pressure roller 34 presses the tape body B against the dicing frame DF to adhere the tape body B with a predetermined pressure.

[0039] Thereafter, when the inner circumference side table 21 and the outer circumference side table 22 move along a predetermined transport direction, the tape body B is gradually adhered to the dicing frame DF and the workpiece W.

[0040] Then, when the tape body B reaches the other end (attachment end position) of the dicing frame DF, the workpiece W and the dicing frame DF are attached together via the tape body B.

[0041] <Tape joining> When the leading dicing tape DT1 is used up to the extent that replacement is necessary, the following dicing tape DT2 is connected. In the following, an example will be described in which the dicing tape DT supported by the feed roller 31a is used up, but the same applies when the dicing tape DT supported by the feed roller 31b is used up.

[0042] First, when it is detected that the remaining amount of the preceding dicing tape DT1 is low, the upstream holding unit 42a and the downstream holding unit 43 adsorb and hold the preceding dicing tape DT1, as shown in Fig. 2(a). Note that the remaining amount of the dicing tape DT1 is detected, for example, by using a rotation speed sensor that calculates the remaining amount of the dicing tape DT from the rotation speed of the feed roller 31a, or by a metal detection sensor that detects the feed roller 31a when the dicing tape DT1 is low.

[0043] 2(b), the cutter 44 descends to cut the dicing tape DT1. After that, the lift plate 41 ascends to move the feed roller 31a to the standby position and the feed roller 31b to the payout position. The trailing dicing tape DT2 supported by the feed roller 31b has its end sucked and held by the upstream holding part 42b.

[0044] 3(a), the upstream peeling roller 45 moves to the vicinity of the trailing dicing tape DT2 and causes the tip of the needle-like member 45a to bite into the tape body B of the trailing dicing tape DT2. Similarly, the downstream peeling roller 46 moves to the vicinity of the leading dicing tape DT1 and causes the tip of the needle-like member 46a to bite into the tape body B of the leading dicing tape DT1.

[0045] Next, as shown in FIG. 3(b), the upstream peeling roller 45 is rotated and slid to the upstream side in the payout direction D, whereby the tape body B is peeled off from the separator S at the end of the trailing dicing tape DT2 in a winding manner. Similarly, the downstream peeling roller 46 is rotated and slid to the downstream side in the payout direction D, whereby the tape body B is peeled off from the separator S at the end of the leading dicing tape DT1 in a winding manner. Here, the thickness dimension of the tape body B is, for example, about 150 μm, and the thickness of the separator S is, for example, about 40 μm. The peeling amounts of the leading dicing tape DT1 and the trailing dicing tape DT2 are set to, for example, about 70 to 80 mm, respectively.

[0046] Next, as shown in Fig. 3(c), the upstream holding part 42b and the downstream holding part 43 are slid so that the leading dicing tape DT1 and the trailing dicing tape DT2 approach each other, so that parts of the separators S of the leading dicing tape DT1 and the trailing dicing tape DT2 overlap each other. Thereafter, the joining unit 47 joins the separators S to each other, as shown in Fig. 3(d).

[0047] Next, the downstream peeling roller 46 is slid to the upstream side in the payout direction D while rotating, so that the tape body B of the leading dicing tape DT1 is overlapped with the separator S of the trailing dicing tape DT2. Thereafter, the upstream peeling roller 45 is slid to the downstream side in the payout direction D while rotating, so that the tape body B of the trailing dicing tape DT2 is overlapped with the tape body B of the leading dicing tape DT1. That is, the ends of the dicing tapes DT are stacked together such that the separator S of the trailing dicing tape DT2 is interposed between the tape body B and separator S of the leading dicing tape DT1. The width by which the separators S overlap is set to, for example, 30 mm.

[0048] Then, as shown in FIG. 3(e), the joining unit 47 joins the leading dicing tape DT1 and the trailing dicing tape DT2 together at the ends of the dicing tapes DT that overlap each other.

[0049] In this way, the tape application apparatus 1 of this embodiment is configured so that the joining section 4 includes an upstream peeling roller 45 that peels the tape body B from the separator S at the end of the trailing dicing tape DT2, a downstream peeling roller 46 that peels the tape body B from the separator S at the end of the leading dicing tape DT1, and a joining unit 47 that joins the ends of the separator S of the leading dicing tape DT2 and the separator S of the trailing dicing tape DT1, and joins the ends of the tape body B of the leading dicing tape DT2 and the tape body B of the trailing dicing tape DT1.

[0050] According to this configuration, the ends of the dicing tapes DT can be joined together without using auxiliary materials. Furthermore, by joining the end of the trailing dicing tape DT2 to the end of the leading dicing tape DT1, the troublesome setting work of winding the trailing dicing tape DT2 around the first to sixth guide rollers 33a to 33f is omitted, and the ends of the dicing tapes DT can be easily joined together.

[0051] In addition, the tape application device 1 is configured such that the upstream peeling roller 45 and the downstream peeling roller 46 have a plurality of needle-shaped members 45a, 46a erected on their outer circumferential surfaces that can be inserted into the tape main body B, and peel the tape main body B from the separator S by rotation.

[0052] According to this configuration, the tape body B can be peeled off from the separator S simply by piercing the tape body B with the needle-like members 45a, 46a and rotating the upstream peeling roller 45 and the downstream peeling roller 46.

[0053] Further, the tape application device 1 is configured such that the needle-shaped member 45a is provided so as to be inclined with respect to the radial direction of the upstream peeling roller 45, and the needle-shaped member 46a is provided so as to be inclined with respect to the radial direction of the downstream peeling roller 46.

[0054] With this configuration, the needle-like member 46a easily peels the tape body B of the leading dicing tape DT1 from the separator S, and the needle-like member 45a easily peels the tape body B of the following dicing tape DT2 from the separator S.

[0055] Furthermore, the tape joining method using the tape application apparatus 1 of this embodiment is a tape joining method for joining ends of dicing tapes DT, and includes a step of peeling the tape body B from the separator S at an end of the trailing dicing tape DT, a step of peeling the tape body B from the separator S at an end of the leading dicing tape DT, a step of joining the ends of the separator S of the leading dicing tape DT2 and the separator S of the trailing dicing tape DT1, and a step of joining the ends of the tape body B of the leading dicing tape DT2 and the tape body B of the trailing dicing tape DT1.

[0056] According to this configuration, the ends of the dicing tapes DT can be joined together without using auxiliary materials. Furthermore, by joining the end of the trailing dicing tape DT2 to the end of the leading dicing tape DT1, the troublesome setting work of winding the trailing dicing tape DT2 around the first to sixth guide rollers 33a to 33f is omitted, and the ends of the dicing tapes DT can be easily joined together.

[0057] Furthermore, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention, and it goes without saying that the present invention extends to such modifications.

[0058] For example, the joint 4 is not limited to being formed by peeling the tape body B from the separator S in the preceding dicing tape DT1 and the following dicing tape DT2, respectively, and then joining the tape bodies B together in a state in which the separators S have been previously joined together; for example, the tape bodies B and the separators S may be stacked alternately, and the joining of the separators S together and the joining of the tape bodies B together may be performed simultaneously.

[0059] Furthermore, the structures of the upstream peeling roller 45 and the downstream peeling roller 46 are not limited to those described above, and any structure capable of peeling the tape body B from the separator S may be used.

[0060] Furthermore, the upstream holding portions 42a, 42b and the downstream holding portion 43 are not limited to those that suction-hold the dicing tape DT, and may, for example, grip the dicing tape DT from the front and back. [Explanation of symbols]

[0061] 1: Tape application device 2: Transport section 21: Inner circumference table 22: Outer table 23: Slider 3: Attachment part 31a: Feed roller 31b: Feed roller 32: Winding roller 33a to 33f: 1st to 6th guide rollers 34: Pressure roller 35: Knife plate 4: Joint section (tape joint device) 41: Lifting plate 42a, 42b: Upstream side holding part 43: Downstream holding part 44: Cutter 45: upstream peeling roller (first peeling means) 45a: Needle-shaped member 46: downstream peeling roller (second peeling means) 46a: Needle-shaped member 47: Joint unit

Claims

1. A tape splicing device that splices ends of a first dicing tape and a second dicing tape together, a first peeling means for peeling the tape body from the separator at an end portion of the first dicing tape; a second peeling means for peeling the tape body from the separator at an end portion of the second dicing tape; a joining means for joining the separators of the first and second dicing tapes to each other so that the separator of the other of the first and second dicing tapes is interposed between a tape body and a separator of one of the first and second dicing tapes and the tape body of the other of the first and second dicing tapes is overlapped on one of the tape bodies of the first and second dicing tapes; and A tape splicing device comprising:

2. The tape splicing device according to claim 1, characterized in that the first peeling means and the second peeling means are rollers having a plurality of needle-shaped members on their outer peripheral surface that can be inserted into the tape body and that peel the tape body from the separator by rotating.

3. 3. The tape splicing device according to claim 2, wherein the needle-shaped member is provided at an angle with respect to a radial direction of the roller.

4. A tape joining method for joining ends of a first dicing tape and a second dicing tape, comprising the steps of: peeling the tape body from the separator at an end of the first dicing tape; peeling the tape body from the separator at an end of the second dicing tape; a step of joining the separators of the first and second dicing tapes together, and joining the tape bodies of the first and second dicing tapes together such that the separator of the other of the first and second dicing tapes is interposed between the tape body and the separator of one of the first and second dicing tapes and the tape body of the other of the first and second dicing tapes overlaps on the tape body of one of the first and second dicing tapes; A tape splicing method comprising the steps of:

Citation Information

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