Processing equipment

Abstract

To provide a processor that can easily perform a work of attaching a dicing tape to a back surface of a wafer where a ring-shaped reinforcement unit is formed in a projecting shape on the back surface corresponding to an outer circumference excessive region and integrating the tape with a frame, and a work of cutting the reinforcement unit and removing the reinforcement unit from the wafer.SOLUTION: In the processor, reinforcement unit removal means 194 includes: laser beam irradiation means 244 for applying a laser beam to a root part of a ring-shaped reinforcement unit formed in an outer circumference of a wafer and forming a cut groove; a first lifting table for holding and lifting a frame unit temporarily placed on a temporary placement table 204 and positioning the frame unit in the laser beam irradiation means 244; and a separation unit 248 for separating the ring-shaped reinforcement unit from the cut groove. The separation unit 248 includes: an ultraviolet ray irradiation unit 270 for applying an ultraviolet ray to a tape corresponding to the cut groove and reducing the adhesive force of the tape; a second lifting table 272; a separation unit 274; and a waste unit.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a processing apparatus for removing a convex ring-shaped reinforcing portion from a wafer having the convex ring-shaped reinforcing portion formed on the back surface corresponding to a peripheral excess region. [Background technology]

[0002] A wafer having a device area on its front surface, where a plurality of devices such as ICs and LSIs are partitioned by planned division lines, and a peripheral excess area surrounding the device area, is ground on its back surface to form the wafer into the desired thickness. The wafer is then divided into individual device chips using a dicing machine and a laser processing machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] The applicant has proposed a technology in which a ring-shaped reinforcing portion is left on the back surface of the wafer corresponding to the peripheral excess area in order to facilitate the transportation of the ground wafer, and then the wafer is subjected to a specified processing, and a dicing tape is attached to the back surface of the wafer while the wafer is supported by a frame, and the ring-shaped reinforcing portion is removed from the wafer (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-62375 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, there is a problem that it is difficult to attach a dicing tape to the back surface of a wafer that has a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area and integrate it with a frame, and it is also difficult to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in poor productivity.

[0006] The object of the present invention, made in consideration of the above facts, is to provide a processing apparatus which makes it easy to attach a dicing tape to the back surface of a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area, thereby integrating the wafer with a frame, and which also makes it easy to cut the ring-shaped reinforcing portion and remove it from the wafer. [Means for solving the problem]

[0007] According to the present invention, there is provided the following processing device that solves the above-mentioned problems: That is, a processing device that removes a convex ring-shaped reinforcement portion from a wafer having a convex ring-shaped reinforcement portion formed on the back surface corresponding to the peripheral excess area, the processing device comprising a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, wafer carrying means for carrying out wafers from the wafer cassette placed on the wafer cassette table, a wafer table for supporting the front side of the wafer carried out by the wafer carrying means, frame housing means for housing a plurality of ring-shaped frames each having an opening formed therein for housing a wafer, and the frame housing means. a frame carrying means for carrying out the frame from the frame storage means, a frame table for supporting the frame carried out by the frame carrying means, a tape applying means disposed above the frame table for applying tape to the frame, a tape-attached frame transport means for transporting the frame with the tape attached to the wafer table and positioning an opening of the frame on the back surface of the wafer supported on the wafer table to place the tape-attached frame on the wafer table, and a tape applying means for applying pressure to the tape of the tape-attached frame on the back surface of the wafer. a frame unit carrying means for carrying out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressing means from the wafer table and temporarily placing it on a temporary placement table; a reinforcement part removing means for cutting and removing a ring-shaped reinforcement part from the wafer of the frame unit placed on the temporary placement table; a ring-free unit carrying means for carrying out a ring-free unit from the reinforcement part removing means, the ring-free unit from which the ring-shaped reinforcement part has been removed; and a frame unit carrying means for accommodating the ring-free unit carried out by the ring-free unit carrying means. and a frame cassette table on which a frame cassette is placed, the reinforcing portion removing means comprising: a laser beam application means for applying a laser beam toward a base of a ring-shaped reinforcing portion formed on the outer periphery of the wafer to form a cut groove; a first lifting table for holding and raising the frame unit temporarily placed on the temporary placement table and positioning it on the laser beam application means; and a separation section for separating the ring-shaped reinforcing portion from the cut groove, the separation section comprising: an ultraviolet ray application section for applying ultraviolet rays to a tape corresponding to the cut groove to reduce the adhesive strength of the tape;The processing device includes a second lift table that exposes the ring-shaped reinforcing portion to the outer periphery and holds the inner side of the wafer by suction, a separator that separates the ring-shaped reinforcing portion by applying a wedge-equipped piece to the outer periphery of the ring-shaped reinforcing portion, and a disposal unit that discards the separated ring-shaped reinforcing portion.

[0008] Preferably, the second lift table includes two or more types of table heads having an outer diameter corresponding to the inner diameter of the reinforcing portion of the wafer, the table heads being detachably attached to the lift means, and the separation unit includes a detection means for detecting whether the type of the table head input to the control means matches the type of the table head actually attached, and the detection means detects whether the outer diameter of the table head obtained by contacting the separator piece with the outer periphery of the table head matches the outer diameter of the table head input to the control means. It is preferable that the separation unit includes a frame support part for supporting a frame adjacent to the piece. It is convenient that the frame support part has a rotatable sphere. It is preferable that an ionizer is disposed adjacent to the piece of the separation unit to remove static electricity from the frame unit. Effect of the Invention

[0009] The processing apparatus of the present invention is a processing apparatus for removing a convex reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to an outer peripheral excess area, and includes a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, a wafer carrying means for carrying out wafers from the wafer cassette placed on the wafer cassette table, a wafer table for supporting the front surface side of the wafer carried out by the wafer carrying means, a frame accommodating means for accommodating a plurality of ring-shaped frames each having an opening for accommodating a wafer, and a frame accommodating means for carrying out the wafers. a frame carrying means for carrying out a frame from a stage, a frame table for supporting the frame carried out by the frame carrying means, a tape applying means disposed above the frame table for applying tape to the frame, a tape-attached frame transport means for transporting the frame with the tape attached to the wafer table and placing the tape-attached frame on the wafer table by positioning an opening of the frame on the backside of the wafer supported on the wafer table, a tape pressing means for pressing the tape of the tape-attached frame to the backside of the wafer, and a tape-attached frame by the tape pressing means. a frame unit carrying-out means for carrying out a frame unit having a frame tape and a back surface of a wafer pressure-bonded from the wafer table and temporarily placing the frame unit on a temporary placement table, a reinforcing portion removing means for cutting and removing a ring-shaped reinforcing portion from the wafer of the frame unit placed on the temporary placement table, a ring-free unit carrying-out means for carrying out a ring-free unit from the reinforcing portion removing means, and a frame cassette table on which a frame cassette containing the ring-free unit carried out by the ring-free unit carrying-out means is placed, The reinforcing portion removing means includes a laser beam application means for applying a laser beam toward the base of a ring-shaped reinforcing portion formed on the outer periphery of the wafer to form a cut groove, a first lift table for holding and raising a frame unit temporarily placed on the temporary placement table and positioning it on the laser beam application means, and a separation section for separating the ring-shaped reinforcing portion from the cut groove, the separation section including an ultraviolet ray application section for applying ultraviolet rays to a tape corresponding to the cut groove to reduce the adhesive strength of the tape, and a second lift table for exposing the ring-shaped reinforcing portion to the outer periphery and holding the inside of the wafer by suction.Since the apparatus includes a separator that applies a wedge-equipped piece to the outer periphery of the ring-shaped reinforcing portion to separate the ring-shaped reinforcing portion, and a disposal section in which the separated ring-shaped reinforcing portion is disposed, the operation of attaching a dicing tape to the back surface of the wafer on which the ring-shaped reinforcing portion is formed in a convex shape on the back surface corresponding to the outer periphery excess region and integrating it with the frame is easy, and the ring-shaped reinforcing portion can be easily cut and removed from the wafer, resulting in good productivity. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view of a processing device constructed in accordance with the present invention; [Diagram 2] 2 is a perspective view of a wafer to be processed by the processing apparatus shown in FIG. 1; [Diagram 3] FIG. 2 is a perspective view of a wafer cassette table and the like shown in FIG. [Figure 4] FIG. 2 is a perspective view of the hand shown in FIG. [Diagram 5] FIG. 2 is a perspective view of a frame receiving means and the like shown in FIG. [Figure 6] 2A is a perspective view of the tape application means etc. when the frame table shown in FIG. 1 is in a lowered position, and FIG. 2B is a perspective view of the tape application means etc. when the frame table shown in FIG. 1 is in an raised position. [Figure 7] FIG. 2 is an exploded perspective view of the tape pressing means shown in FIG. [Figure 8] 11 is a cross-sectional view showing a state in which the pressure roller starts to press the tape in the tape pressing process. FIG. [Figure 9] 13 is a cross-sectional view showing a state in which pressing of the tape by the pressing roller has been completed in the tape pressing process. FIG. [Figure 10] FIG. 2 is a perspective view of the reinforcing portion removing means shown in FIG. 1 . [Figure 11] FIG. 13 is a schematic diagram showing a state in which a laser beam is irradiated onto the base of the wafer in the reinforcing portion removal process. [Figure 12] 2 is a perspective view of a first lifting table of the reinforcement-part removing means shown in FIG. 1; FIG. [Figure 13]2A is a perspective view of a separation portion of the reinforcing portion removing means shown in FIG. 1, and FIG. 2B is an enlarged perspective view of the supporting substrate shown in FIG. [Figure 14] 2 is a perspective view of a discard portion of the reinforcing portion removing means shown in FIG. 1; FIG. [Figure 15] FIG. 2 is a schematic diagram showing a state in which the outer diameter of the table head shown in FIG. 1 is detected by bringing a piece into contact with the table head. [Figure 16] 13 is a schematic diagram showing a state in which the wafer is suction-held by the second lift table in the reinforcing portion removing step. FIG. [Figure 17] 13 is a schematic diagram showing a state in which a piece of the reinforcing portion removing means is applied to the outer periphery of the ring-shaped reinforcing portion in the reinforcing portion removing step. FIG. [Figure 18] 13 is a schematic diagram showing a state in which the reinforcing portion is separated from the wafer in the reinforcing portion removing step. FIG. [Figure 19] 2 is a perspective view of an inverting mechanism of the ring-free unit carrying-out means shown in FIG. 1; [Figure 20] 2 is a perspective view of a ring-free unit supporting portion and a pushing portion of the ring-free unit carrying-out means shown in FIG. 1; [Figure 21] FIG. 13 is a perspective view showing a state in which a ring-less unit accommodation step is being performed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a processing apparatus constructed according to the present invention will be described with reference to the drawings.

[0012] Referring to FIG. 1, the processing apparatus generally designated by the reference symbol 2 comprises a wafer cassette table 8 on which a wafer cassette 6 containing a plurality of wafers is placed, a wafer unloading means 10 for unloading wafers from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 for supporting the front side of the wafer unloaded by the wafer unloading means 10.

[0013] FIG. 2 shows a wafer 4 to be processed by the processing device 2. On the front surface 4a of the wafer 4, a device region 18 in which a plurality of devices 14 such as ICs and LSIs are partitioned by lattice-shaped division lines 16, and a peripheral surplus region 20 surrounding the device region 18 are formed. In FIG. 2, a boundary 22 between the device region 18 and the peripheral surplus region 20 is shown by a two-dot chain line for convenience, but in reality, there is no line indicating the boundary 22. On the back surface 4b side of the wafer 4, a ring-shaped reinforcing part 24 is formed in a convex shape in the peripheral surplus region 20, and the thickness of the peripheral surplus region 20 is larger than the thickness of the device region 18. In addition, a notch 26 indicating a crystal orientation is formed on the periphery of the wafer 4.

[0014] 3, a wafer cassette 6 accommodates a plurality of wafers 4 spaced apart in the vertical direction with the surfaces 4a facing upward. The wafer cassette table 8 in the illustrated embodiment has a top plate 28 on which the wafer cassette 6 is placed, and a support plate 30 that supports the top plate 28. The top plate 28 is freely movable up and down, and a lifting means may be provided for lifting and lowering the top plate 28 to position it at any height.

[0015] Continuing the explanation with reference to FIG. 3, the wafer unloading means 10 includes a Y-axis movable member 32 movable in the Y-axis direction indicated by the arrow Y in FIG. 3, and a Y-axis feed means 34 for moving the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed means 34 includes a ball screw 36 connected to the lower end of the Y-axis movable member 32 and extending in the Y-axis direction, and a motor 38 for rotating the ball screw 36. The Y-axis feed means 34 converts the rotational motion of the motor 38 into linear motion by the ball screw 36 and transmits it to the Y-axis movable member 32, and moves the Y-axis movable member 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction. The X-axis direction indicated by the arrow X in FIG. 3 is a direction perpendicular to the Y-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 3 is a vertical direction perpendicular to the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0016] 3, the wafer carrying-out means 10 in the illustrated embodiment includes a transport arm 42 and a hand 44 disposed at the tip of the transport arm 42, which supports the back surface 4b of the wafer 4 housed in the wafer cassette 6 and turns the wafer 4 over. The transport arm 42 is provided on the upper surface of the Y-axis movable member 32 and is driven by an appropriate drive source (not shown) such as an air drive source or an electric drive source. This drive source drives the transport arm 42 to position the hand 44 at any position in each of the X-axis, Y-axis, and Z-axis directions and to turn the hand 44 upside down.

[0017] Explaining with reference to Fig. 4, the hand 44 is preferably a Bernoulli pad that generates negative pressure by jetting air and supports the wafer 4 without contact. The hand 44 in the illustrated embodiment is generally C-shaped, and one side of the hand 44 is formed with a plurality of air jets 46 connected to a compressed air supply source (not shown). A plurality of guide pins 48 are attached to the outer periphery of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable in the radial direction of the hand 44.

[0018] 3 and 4, the wafer unloading means 10 positions the hand 44 on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, and then ejects compressed air from the air ejection port 46 of the hand 44 to generate negative pressure on one side of the hand 44 by the Bernoulli effect, and the hand 44 suction-supports the wafer 4 from the back surface 4b side without contact. The horizontal movement of the wafer 4 suction-supported by the hand 44 is regulated by each guide pin 48. The wafer unloading means 10 then moves the Y-axis movable member 32 and the transport arm 42 to unload the wafer 4 suction-supported by the hand 44 from the wafer cassette 6.

[0019] 4, the wafer carrying-out means 10 in the illustrated embodiment is equipped with a notch detection means 50 for detecting the position of the notch 26 of the wafer 4. The notch detection means 50 may include, for example, a light-emitting element 52 and a light-receiving element 54 arranged at an interval from each other in the vertical direction, and a drive source (not shown) for rotating at least one of the guide pins 48 of the hand 44.

[0020] The light emitting element 52 and the light receiving element 54 can be attached to the Y-axis movable member 32 or the transport path via an appropriate bracket (not shown). When the guide pin 48 is rotated by the drive source, the wafer 4 supported by suction in the hand 44 rotates due to the rotation of the guide pin 48. To reliably transmit the rotation from the guide pin 48 to the wafer 4, it is preferable that the outer circumferential surface of the guide pin 48 rotated by the drive source is made of an appropriate synthetic rubber.

[0021] The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 via the guide pin 48 by a drive source in a state in which the wafer 4 is supported by suction with the hand 44 and the outer periphery of the wafer 4 is positioned between the light emitting element 52 and the light receiving element 54. This makes it possible to adjust the orientation of the wafer 4 to any orientation.

[0022] As shown in Fig. 3, the wafer table 12 is disposed adjacent to the wafer unloading means 10. The wafer table 12 in the illustrated embodiment includes an annular support portion 56 that supports the peripheral surplus region 20 of the wafer 4 and keeps the portion inside the peripheral surplus region 20 out of contact, and a frame support portion 58 that is disposed on the outer periphery of the annular support portion 56 and supports a frame 64 (see Fig. 5) described below. A plurality of suction holes 60 are formed in the upper surface of the annular support portion 56 and spaced apart in the circumferential direction, and each suction hole 60 is connected to a suction means (not shown). A portion of the wafer table 12 radially inward of the annular support portion 56 is a circular recess 62 recessed downward.

[0023] When the hand 44 is turned 180° to invert the wafer 4 and place the wafer 4 on the wafer table 12 with the front surface 4a of the wafer 4 facing downward, the peripheral surplus region 20 of the wafer 4 is supported by the annular support portion 56 and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even if the wafer 4 is placed on the wafer table 12 with the front surface 4a on which the devices 14 are formed facing downward, the devices 14 do not come into contact with the wafer table 12, so that damage to the devices 14 is prevented. In addition, after supporting the peripheral surplus region 20 with the annular support portion 56, the wafer table 12 operates the suction means to generate suction force in each suction hole 60 to suction and hold the peripheral surplus region 20, thereby preventing the wafer 4 from shifting in position.

[0024] Referring to Figure 5, the processing apparatus 2 further includes a frame accommodating means 66 for accommodating a plurality of ring-shaped frames 64 each having an opening 64a for accommodating a wafer 4, a frame ejecting means 68 for ejecting the frame 64 from the frame accommodating means 66, and a frame table 70 for supporting the frame 64 ejected by the frame ejecting means 68.

[0025] As shown in FIG. 5, the frame accommodating means 66 of the illustrated embodiment includes a housing 72, a lift plate 74 arranged in the housing 72 so as to be movable up and down, and a lifting means (not shown) for lifting and lowering the lift plate 74. In FIG. 5, a Z-axis guide member 78 extending in the Z-axis direction is arranged on a side surface of the housing 72 on the rear side in the X-axis direction. The lift plate 74 is supported by the Z-axis guide member 78 so as to be movable up and down, and the lifting means for lifting and lowering the lift plate 74 is arranged inside the Z-axis guide member 78. The lifting means may have, for example, a ball screw connected to the lift plate 74 and extending in the Z-axis direction, and a motor for rotating the ball screw. In FIG. 5, a door 76 with a handle 76a attached thereto is provided on a side surface of the housing 72 on the front side in the X-axis direction, and in the frame accommodating means 66, the handle 76a is gripped to open the door 76, so that the frame 64 can be accommodated inside the housing 72. Additionally, an opening 80 is provided at the upper end of the housing 72 .

[0026] 5, frames 64 are stored in a stacked manner on the upper surface of a lift plate 74 inside housing 72. The uppermost frame 64 of the multiple stacked frames 64 is carried out by frame carry-out means 68 from an opening 80 of housing 72. Furthermore, when a frame 64 is carried out from the opening 80, frame storage means 66 appropriately raises lift plate 74 by the lifting means, and positions the uppermost frame 64 at a position where it can be carried out by frame carry-out means 68.

[0027] 5, the frame ejection means 68 includes an X-axis guide member 82 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 84 supported by the X-axis guide member 82 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 84 in the X-axis direction, a Z-axis movable member 86 supported by the X-axis movable member 84 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 86 in the Z-axis direction. The X-axis feed means of the frame ejection means 68 may have a ball screw connected to the X-axis movable member 84 and extending in the X-axis direction, and a motor for rotating the ball screw, and the Z-axis feed means may have a ball screw connected to the Z-axis movable member 86 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0028] The Z-axis movable member 86 of the frame ejection means 68 has a holding portion 88 that holds the frame 64. The holding portion 88 in the illustrated embodiment has a rectangular base plate 90 and a plurality of suction pads 92 provided on the lower surface of the base plate 90, and each suction pad 92 is connected to a suction means (not shown).

[0029] The frame ejection means 68 holds the top frame 64 housed in the frame accommodating means 66 by suction using the suction pad 92 of the holding portion 88, and then moves the X-axis movable member 84 and the Z-axis movable member 86 to eject the top frame 64 held by suction from the frame accommodating means 66.

[0030] 5, the frame table 70 is supported by a Z-axis guide member 94 so as to be movable up and down between a lowered position indicated by a solid line and an elevated position indicated by a two-dot chain line. A suitable drive source (e.g., an air drive source or an electric drive source) for raising and lowering the frame table 70 between the lowered position and the elevated position is attached to the Z-axis guide member 94. The frame table 70 is adapted to receive the frame 64 discharged by the frame discharge means 68 at the lowered position.

[0031] As shown in Figures 1 and 5, the processing apparatus 2 includes a tape application means 98 (see Figure 1) that is arranged above the frame table 70 and applies a tape 96 to the frame 64, a tape-attached frame transport means 100 (see Figure 5) that transports the frame 64 with the tape 96 attached (hereinafter sometimes referred to as the "taped frame 64'") to the wafer table 12 and positions the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported by the wafer table 12, thereby placing the tape-attached frame 64' on the wafer table 12, and a tape pressing means 102 (see Figure 1) that presses the tape 96 of the tape-attached frame 64' onto the back surface 4b of the wafer 4.

[0032] Explaining with reference to FIG. 6, the tape application means 98 of the illustrated embodiment comprises a roll tape support section 104 that supports a roll tape 96R on which unused tape 96 is wound, a tape winding section 106 that winds up the used tape 96, a tape pulling section 108 that pulls out the tape 96 from the roll tape 96R, a pressing section 110 that presses the pulled-out tape 96 onto the frame 64, and a cutting section 112 that cuts the tape 96 that protrudes beyond the outer periphery of the frame 64 along the frame 64.

[0033] 6, the roll tape support unit 104 includes a support roller 114 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction. The support roller 114 supports a roll tape 96R that is wound into a cylindrical shape and has a release paper 116 for protecting the adhesive surface of the tape 96 attached to the adhesive surface of the tape 96.

[0034] The tape winding unit 106 includes a winding roller 118 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction, and a motor (not shown) that rotates the winding roller 118. As shown in Fig. 6, the tape winding unit 106 rotates the winding roller 118 by the motor, thereby winding up the used tape 96, which has a circular opening 120 formed therein that corresponds to the portion attached to the frame 64.

[0035] Continuing the explanation with reference to Figure 6, the tape pull-out unit 108 includes a pull-out roller 122 arranged below the support roller 114 of the roll tape support unit 104, a motor (not shown) that rotates the pull-out roller 122, and a driven roller 124 that rotates with the rotation of the pull-out roller 122. The tape pull-out unit 108 rotates the driven roller 124 together with the pull-out roller 122 by the motor, thereby pulling out the tape 96 sandwiched between the pull-out roller 122 and the driven roller 124 from the roll tape 96R.

[0036] The release paper 116 is peeled off from the tape 96 that has passed between the pull-out roller 122 and the driven roller 124, and the peeled release paper 116 is taken up by a release paper take-up section 126. The release paper take-up section 126 in the illustrated embodiment has a release paper take-up roller 128 arranged above the driven roller 124, and a motor (not shown) that rotates the release paper take-up roller 128. In addition, the tape 96 from which the release paper 116 has been peeled off is guided to the take-up roller 118 via a guide roller 130 that is arranged at an interval from the pull-out roller 122 in the Y-axis direction.

[0037] The pressure bonding unit 110 includes a pressure roller 132 arranged to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving the pressure roller 132 in the Y-axis direction. The Y-axis feed means of the pressure bonding unit 110 can be composed of an appropriate drive source (for example, an air drive source or an electric drive source).

[0038] 6, the cutting unit 112 includes a Z-axis guide member 134 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 136 supported by the Z-axis guide member 134 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 136 in the Z-axis direction. The Z-axis feed means of the cutting unit 112 may include a ball screw connected to the Z-axis movable member 136 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0039] Cutting section 112 also includes a motor 138 fixed to the underside of the tip of Z-axis movable member 136, and an arm piece 140 rotated by motor 138 about an axis extending in the Z-axis direction. First and second hanging pieces 142a, 142b are attached to the underside of arm piece 140 at a distance from each other. A circular cutter 144 is supported on first hanging piece 142a and rotatable about an axis perpendicular to the Z-axis direction, and a presser roller 146 is supported on second hanging piece 142b and rotatable about an axis perpendicular to the Z-axis direction.

[0040] Before the frame table 70, which has received the frame 64 from the frame discharge means 68, is moved from the lowered position (the position shown in FIG. 6(a)) to the raised position (the position shown in FIG. 6(b)), the tape application means 98 draws out the unused tape 96 using the draw-out roller 122 and the driven roller 124. Then, the frame table 70 is positioned at the raised position so that the pressure roller 132 of the pressure-bonding unit 110 can press the tape 96 against the frame 64, and the pressure roller 132 is brought into contact with the frame 64 via the tape 96. Then, the pressure roller 132 rolls in the Y-axis direction while pressing the adhesive surface of the tape 96 against the frame 64 with the pressure roller 132. This allows the tape 96 drawn out from the roll tape 96R by the tape draw-out unit 108 to be pressure-bonded to the frame 64.

[0041] After the tape 96 is pressed against the frame 64, the tape application means 98 lowers the Z-axis movable member 136 of the cutting section 112 by the Z-axis feed means, presses the cutter 144 against the tape 96 on the frame 64, and presses the frame 64 from above the tape 96 with the pressure roller 146. Next, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the pressure roller 146 are moved in a circular motion along the frame 64. This allows the tape 96 that protrudes beyond the outer periphery of the frame 64 to be cut along the frame 64. In addition, since the pressure roller 146 presses the frame 64 from above the tape 96, the frame 64 and the tape 96 are prevented from shifting in position when the tape 96 is being cut. Then, after the frame table 70 is lowered, the used tape 96, in which the circular opening 120 corresponding to the portion pasted on the frame 64 has been formed, is taken up by the tape take-up section 106.

[0042] 5, the tape-attached frame transport means 100 includes a Y-axis guide member 148 fixed to an appropriate bracket (not shown) and extending in the Y-axis direction, a Y-axis movable member 150 supported by the Y-axis guide member 148 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) for moving the Y-axis movable member 150 in the Y-axis direction, a Z-axis movable member 152 supported by the Y-axis movable member 150 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 152 in the Z-axis direction. The Y-axis feed means of the tape-attached frame transport means 100 may have a ball screw connected to the Y-axis movable member 150 and extending in the Y-axis direction, and a motor for rotating the ball screw, and the Z-axis feed means may have a ball screw connected to the Z-axis movable member 152 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0043] The Z-axis movable member 152 of the tape-attached frame transport means 100 has a holding portion 154 that holds the tape-attached frame 64'. The holding portion 154 in the illustrated embodiment has a rectangular base plate 156 and a plurality of suction pads 158 provided on the lower surface of the base plate 156, and each suction pad 158 is connected to a suction means (not shown).

[0044] The taped frame transport means 100 holds by suction the upper surface of the taped frame 64' supported on the frame table 70 with the adhesive side of the tape 96 facing downwards using each suction pad 158 of the holding portion 154, and by moving the Y-axis movable member 150 and the Z-axis movable member 152, transports the taped frame 64' held by suction by the holding portion 154 from the frame table 70 to the wafer table 12, and places the taped frame 64' on the wafer table 12 by positioning the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported on the wafer table 12.

[0045] The tape pressing means 102 will be described with reference to Figures 7 to 9. As shown in Figure 7, the tape pressing means 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 accommodating the wafer table 12, a lifting mechanism 164 that raises and lowers the upper chamber 160 to generate a closed state in which the upper chamber 160 is in contact with the lower chamber 162 and an open state in which the upper chamber 160 is separated from the lower chamber 162, a vacuum section 166 that evacuates the upper chamber 160 and the lower chamber 162 in the closed state, and an atmosphere opening section 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0046] 7, the upper chamber 160 in the illustrated embodiment includes a circular top plate 170 and a cylindrical side wall 172 that hangs down from the periphery of the top plate 170. A lifting mechanism 164 that may be composed of an appropriate actuator such as an air cylinder is attached to the upper surface of the top plate 170. In the storage space defined by the lower surface of the top plate 170 and the inner peripheral surface of the side wall 172, there are disposed a pressure roller 174 for pressing the tape 96 of the tape-attached frame 64' against the back surface 4b of the wafer 4 supported by the wafer table 12, a support piece 176 for rotatably supporting the pressure roller 174, and a Y-axis feed means 178 for moving the support piece 176 in the Y-axis direction.

[0047] The Y-axis feed means 178 has a ball screw 180 that is connected to the support piece 176 and extends in the Y-axis direction, and a motor 182 that rotates the ball screw 180. The Y-axis feed means 178 converts the rotational motion of the motor 182 into linear motion by the ball screw 180 and transmits it to the support piece 176, moving the support piece 176 along a pair of guide rails 184 that extend in the Y-axis direction.

[0048] 7, the lower chamber 162 has a cylindrical sidewall 186, the upper part of which is open and the lower part of which is closed. A connection opening 188 is formed in the sidewall 186. A vacuum section 166, which may be constituted by an appropriate vacuum pump, is connected to the connection opening 188 via a flow path 190. The flow path 190 is provided with an atmosphere opening section 168, which may be constituted by an appropriate valve that can open the flow path 190 to the atmosphere.

[0049] With the tape 96 of the tape-attached frame 64' positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, the tape pressing means 102 lowers the upper chamber 160 using the lifting mechanism 164, bringing the lower end of the side wall 172 of the upper chamber 160 into contact with the upper end of the side wall 186 of the lower chamber 162, thereby closing the upper chamber 160 and the lower chamber 162 and bringing the pressure roller 174 into contact with the tape-attached frame 64'.

[0050] Next, the tape pressing means 102 operates the vacuum pump that constitutes the vacuum section 166 with the valve that constitutes the atmospheric opening section 168 closed to create a vacuum inside the upper chamber 160 and the lower chamber 162, and then, as shown in Figures 8 and 9, rolls the pressure roller 174 in the Y-axis direction using the Y-axis feed means 178 to press the tape 96 onto the back surface 4b of the wafer 4 to generate a frame unit U.

[0051] When the tape 96 is pressed onto the back surface 4b of the wafer 4 by the pressure roller 174, a small gap is formed between the wafer 4 and the tape 96 at the base of the ring-shaped reinforcing portion 24, but since the wafer 4 and the tape 96 are pressed onto each other with the insides of the upper chamber 160 and the lower chamber 162 kept in a vacuum, the pressure in the small gap between the wafer 4 and the tape 96 is lower than atmospheric pressure, and when the air release portion 168 is opened after the tape 96 is pressed onto the wafer 4, the atmospheric pressure presses the tape 96 against the wafer 4. This eliminates the gap between the wafer 4 and the tape 96 at the base of the reinforcing portion 24, and the tape 96 comes into close contact with the back surface 4b of the wafer 4 along the base of the reinforcing portion 24.

[0052] As shown in Figures 1 and 10, the processing apparatus 2 further includes a frame unit carrying out means 192 which carries out the frame unit U, in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressed by the tape pressing means 102, from the wafer table 12 and temporarily places it on a temporary placement table 204, a reinforcement portion removing means 194 which cuts and removes the ring-shaped reinforcing portion 24 from the wafer 4 of the frame unit U placed on the temporary placement table 204, a ring-less unit carrying out means 196 (see Figure 1) which carries out the ring-less unit from the reinforcement portion removing means 194 from the ring-shaped reinforcing portion 24 has been removed, and a frame cassette table 200 (see Figure 1) on which a frame cassette 198 containing the ring-less unit carried out by the ring-less unit carrying out means 196 is placed.

[0053] As shown in FIG. 10, the frame unit carrying means 192 in the illustrated embodiment includes a frame unit holding portion 202 including a wafer holding portion 202a for holding a wafer 4 and a frame holding portion 202b for holding a frame 64, and a transport portion 206 for transporting the frame unit holding portion 202 to a temporary placement table 204.

[0054] The wafer holding part 202a of the frame unit holding part 202 includes a circular substrate 208 and a circular suction piece 210 attached to the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed in the lower surface of the suction piece 210, and each suction hole is connected to a suction means (not shown). The frame holding part 202b includes a plurality of protruding pieces 212 (four in the illustrated embodiment) protruding radially outwardly at intervals from the periphery of the substrate 208 of the wafer holding part 202a, and a suction pad 214 attached to the lower surface of the protruding piece 212, and each suction pad 214 is connected to a suction means (not shown).

[0055] The transport unit 206 includes an X-axis guide member 216 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 218 supported by the X-axis guide member 216 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 218 in the X-axis direction, a Z-axis movable member 220 supported by the X-axis movable member 218 so as to be movable in the Z-axis direction, a Z-axis feed means (not shown) for moving the Z-axis movable member 220 in the Z-axis direction, a Y-axis movable member 222 supported by the Z-axis movable member 220 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving the Y-axis movable member 222 in the Y-axis direction. The substrate 208 of the wafer holder 202a is connected to the tip of the Y-axis movable member 222. Each of the X-axis, Y-axis, and Z-axis feed means of the transport unit 206 may have a ball screw and a motor for rotating the ball screw.

[0056] The frame unit carrying-out means 192 preferably includes a two-dimensional movement mechanism that moves the frame unit holding part 202 two-dimensionally in the horizontal direction, and an imaging part 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202, and in the illustrated embodiment, the frame unit holding part 202 is moved two-dimensionally in the horizontal direction on the XY plane by the X-axis feed means and the Y-axis feed means of the transport part 206, and the two-dimensional movement mechanism is configured by the transport part 206. Also, the imaging part 224 in the illustrated embodiment is disposed between the wafer table 12 and the temporary placement table 204, and images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 from below the wafer 4.

[0057] The frame unit removal means 192 suction-holds the wafer 4 from the back surface 4b side (tape 96 side) with the suction piece 210 of the wafer holding portion 202a, and suction-holds the frame 64 with the suction pad 214 of the frame holding portion 202b, and by operating the transport portion 206, removes the frame unit U held by the frame unit holding portion 202 from the wafer table 12.

[0058] Moreover, the frame unit carry-out means 192 of the illustrated embodiment operates the transport section 206 constituting the two-dimensional movement mechanism, measures the coordinates of at least three points on the outer periphery of the wafer 4 by capturing images of at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding section 202 with the imaging section 224, and determines the central coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit carry-out means 192 aligns the center of the wafer 4 with the center of the temporary placement table 204, and temporarily places the frame unit U on the temporary placement table 204.

[0059] 10, the temporary placement table 204 is disposed at a distance in the X-axis direction from the wafer table 12. The temporary placement table 204 in the illustrated embodiment includes an annular support portion 226 that supports the outer peripheral surplus region 20 of the wafer 4 of the frame unit U and keeps a portion inside the outer peripheral surplus region 20 out of contact, and a frame support portion 228 that is disposed on the outer periphery of the annular support portion 226 and supports the frame 64.

[0060] The radially inner portion of the annular support portion 226 forms a downwardly recessed circular depression 230. The frame support portion 228 of the temporary placement table 204 is preferably equipped with a heater (not shown), and the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 is heated by the heater to soften the tape 96, so that the tape 96 is more firmly attached to the base of the ring-shaped reinforcing portion 24 by atmospheric pressure.

[0061] The processing apparatus 2 of the illustrated embodiment includes a temporary placement table transport unit 232 that transports the temporary placement table 204 in the Y-axis direction. The temporary placement table transport unit 232 includes a Y-axis guide member 234 extending in the Y-axis direction, a Y-axis movable member 236 supported by the Y-axis guide member 234 so as to be movable in the Y-axis direction, and a Y-axis feed means 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary placement table 204 is fixed to the upper part of the Y-axis movable member 236. The Y-axis feed means 238 includes a ball screw 240 that is connected to the Y-axis movable member 236 and extends in the Y-axis direction, and a motor 242 that rotates the ball screw 240. The temporary placement table transport unit 232 converts the rotational motion of the motor 242 into linear motion by the ball screw 240 and transmits it to the Y-axis movable member 236, and transports the temporary placement table 204 in the Y-axis direction together with the Y-axis movable member 236.

[0062] As shown in Figures 1 and 10, the reinforcing portion removal means 194 includes a laser beam application means 244 that applies a laser beam toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 to form a cutting groove, a first lifting table 246 (see Figure 1) that holds and lifts the frame unit U temporarily placed on the temporary placement table 204 and moves it in the X-axis direction to position it on the laser beam application means 244, and a separation unit 248 that separates the ring-shaped reinforcing portion 24 from the cutting groove.

[0063] As shown in FIG. 10, the laser beam application means 244 includes a housing 250 arranged adjacent to the temporary placement table 204 in the X-axis direction, an oscillator (not shown) contained in the housing 250 for emitting a laser beam, a collector 252 for collecting the laser beam generated by the oscillator and applying the laser beam to the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4, a suction nozzle 254 for sucking up debris generated when the wafer 4 is irradiated with the laser beam, and a suction means (not shown) connected to the suction nozzle 254.

[0064] The collector 252 extends upward from the top surface of the housing 250 at an incline toward the suction nozzle 254 side, thereby preventing debris generated during irradiation of the laser beam from falling onto the collector 252. In addition, the suction nozzle 254 extends upward from the top surface of the housing 250 at an incline toward the collector 252 side.

[0065] 11, the laser beam application means 244 irradiates a laser beam LB toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 while rotating the frame unit U held by the first lift table 246, thereby forming a ring-shaped cut groove 256 along the base of the reinforcing portion 24 by ablation processing. In addition, the laser beam application means 244 sucks up debris generated by the ablation processing by the suction nozzle 254.

[0066] As shown in Fig. 1, the first lift table 246 is disposed above the temporary placement table 204 so as to be movable in the X-axis direction and the Z-axis direction. Explaining with reference to Fig. 12, the first lift table 246 includes an X-axis guide member 258 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 260 supported by the X-axis guide member 258 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 260 in the X-axis direction, a Z-axis movable member 262 supported by the X-axis movable member 260 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 262 in the Z-axis direction. Each of the X-axis and Z-axis feed means of the first lift table 246 may be configured to include a ball screw and a motor for rotating the ball screw.

[0067] A support shaft 264 extending downward is rotatably supported on the lower surface of the tip of Z-axis movable member 262, and a motor 266 for rotating support shaft 264 about an axis extending in the Z-axis direction is attached to the upper surface of the tip of Z-axis movable member 262. A circular suction piece 268 is fixed to the lower end of support shaft 264. A plurality of suction holes (not shown) are formed on the lower surface of suction piece 268 at intervals in the circumferential direction on a circumference corresponding to the size of frame 64, and each suction hole is connected to suction means.

[0068] The first lifting table 246, after the tape 96 is heated by the heater of the frame support portion 228 of the temporary placement table 204 and the frame 64 portion of the frame unit U where the tape 96 is in close contact with the base of the ring-shaped reinforcing portion 24 is sucked and held by the suction piece 268, moves the Z-axis movable member 262 and the X-axis movable member 260 to raise the frame unit U sucked and held by the suction piece 268 and moves it in the X-axis direction to position it at the laser beam application means 244. Note that if the frame 64 is made of a magnetic material, an electromagnet (not shown) may be attached to the underside of the suction piece 268 so that the suction piece 268 attracts the frame 64 by magnetic force.

[0069] Furthermore, when the laser beam LB is irradiated onto the wafer 4 by the laser beam application means 244, the first lifting table 246 operates the motor 266 to rotate the frame unit U sucked and held by the suction piece 268. Furthermore, the first lifting table 246 moves the frame unit U, in which the cutting groove 256 is formed at the base of the reinforcing portion 24, in the X-axis direction and the Z-axis direction, and temporarily places it on the temporary placement table 204.

[0070] 1, the separation unit 248 is disposed at a distance from the first lift table 246 in the Y-axis direction within the movable range of the temporary placement table 204 in the Y-axis direction. Explaining with reference to FIGS. 13 and 14, the separation unit 248 includes an ultraviolet ray irradiation unit 270 (see FIG. 13) that irradiates ultraviolet rays onto the tape 96 corresponding to the cut groove 256 to reduce the adhesive strength of the tape 96, a second lift table 272 (see FIG. 13) that exposes the ring-shaped reinforcing portion 24 to its outer periphery and suction-holds the inner side of the wafer 4, a separator 274 (see FIG. 13) that separates the ring-shaped reinforcing portion 24 by applying a wedge-having piece 402 to the outer periphery of the ring-shaped reinforcing portion 24, and a disposal unit 276 (see FIG. 14) that discards the separated ring-shaped reinforcing portion 24.

[0071] 13, separation unit 248 in the illustrated embodiment includes a Z-axis guide member 278 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 280 supported by Z-axis guide member 278 so as to be movable in the Z-axis direction, and an elevating means (not shown) for moving Z-axis movable member 280 in the Z-axis direction. The elevating means may have a configuration including a ball screw connected to Z-axis movable member 280 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0072] A support piece 282 is supported on the lower surface of the tip of Z-axis movable member 280, and second lift table 272 is rotatably supported thereon. A motor 284 for rotating second lift table 272 is attached to the upper surface of the tip of Z-axis movable member 280. A pair of the ultraviolet ray irradiation units 270 are attached to support piece 282 in the illustrated embodiment at an interval in the Y-axis direction.

[0073] The second lift table 272 has a support shaft 286 extending downward from the underside of the tip of the Z-axis movable member 280, and a circular table head 287 detachably attached to the lower end of the support shaft 286. A plurality of suction holes (not shown) are formed in the underside of the table head 287, and each suction hole is connected to a suction means.

[0074] The table head 287 has an outer diameter corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4. Specifically, the diameter of the table head 287 is slightly smaller than the diameter of the device region 18 of the wafer 4. The table head 287 is detachably attached to the support shaft 286 and is replaceable according to the diameter of the wafer 4. The support shaft 286 to which the table head 287 is attached is connected to the lifting means of the separation section 248 via the Z-axis movable member 280. In this way, the second lifting table 272 includes two or more types of table heads 287 having outer diameters corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4, and the table heads 287 are detachably attached to the lifting means of the separation section 248.

[0075] Further, the separator 274 is attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 arranged on the lower surface of the support piece 282 at a distance from each other in the longitudinal direction of the support piece 282, a pair of feed means 290 for moving the pair of movable pieces 288, a pair of support substrates 400 supported on each of the movable pieces 288 in a manner that allows them to be raised and lowered, and a pair of Z-axis feed means 294 for raising and lowering the pair of support substrates 400 in the Z-axis direction. Each of the pair of feed means 290 and the Z-axis feed means 294 may be constituted by an appropriate actuator such as an air cylinder or an electric cylinder.

[0076] Continuing the explanation with reference to FIG. 13, the upper surface of each support substrate 400 is equipped with a wedge-equipped block 402, a frame support portion 404 that supports the frame 64, and an ionizer 406 that removes static electricity from the frame unit U.

[0077] The top 402 has an inverted truncated cone shape with a diameter gradually decreasing from top to bottom, and a wedge is formed by an upper surface 402a of the top 402 and a side surface 402b of the top 402. A pair of the tops 402 are arranged at an interval from each other on the upper surface of each supporting substrate 400, and are supported by the supporting substrate 400 so as to be rotatable about an axis extending in the Z-axis direction.

[0078] A pair of frame support parts 404 are disposed on the upper surface of the support substrate 400 adjacent to the tops 402. The frame support parts 404 each have a housing 404a fixed to the support substrate 400 and a sphere 404b rotatably supported by the housing 404a. In the frame support parts 404, each sphere 404b supports the frame 64.

[0079] The ionizer 406 is disposed adjacent to the frame 402. The ionizer 406 blows ionized air toward the frame unit U to remove static electricity from the frame unit U.

[0080] The separation unit 248 in the illustrated embodiment is equipped with a detection means (not shown) for detecting whether the type of table head 287 inputted to a control means (not shown) that controls the operation of the processing device 2 matches the type of table head 287 actually attached to the processing device 2.

[0081] The control means is composed of a computer having a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., and a readable / writable random access memory (RAM) that stores calculation results, etc. Processing conditions such as the diameter of the wafer 4, the width of the reinforcing portion 24, and the outer diameter of the table head 287 are input to the control means by an operator.

[0082] The detection means in the illustrated embodiment includes a top 402 of the separator 274, and a feed means 290 that moves the top 402 toward and away from the table head 287 by operating the movable piece 288. The detection means operates the movable piece 288 by the feed means 290 before starting processing of the wafer 4, and detects whether or not the outer diameter of the table head 287 obtained by bringing the top 402 of the separator 274 into contact with the outer periphery of the table head 287 matches the outer diameter of the table head 287 input to the control means, as shown in Fig. 15. If the detection means detects that the two do not match, an error is reported (for example, a display indicating that they do not match is displayed on a control panel (not shown)).

[0083] Even if the diameter of the wafer 4 is the same, for example, 200 mm, the width of the ring-shaped reinforcing part 24 may differ, such as 3 mm or 5 mm. For this reason, the processing device 2 needs to be equipped with a table head 287 that corresponds to the device region 18 of the wafer 4. If the type of table head 287 input to the control means does not match the type of table head 287 that is actually equipped, it will be impossible to properly remove the ring-shaped reinforcing part 24 from the wafer 4.

[0084] In this regard, the processing apparatus 2 in the illustrated embodiment is equipped with a detection means for detecting whether or not the type of table head 287 inputted to the control means matches the type of table head 287 actually attached to the processing apparatus 2, so that before starting processing of the wafer 4, it can be confirmed whether or not the appropriate table head 287 corresponding to the wafer 4 is attached, and the ring-shaped reinforcement portion 24 can be properly removed from the wafer 4 when processing the wafer 4.

[0085] Explaining with reference to Fig. 14, the disposal section 276 includes a belt conveyor 300 that transports the separated ring-shaped reinforcing parts 24, and a dust box 302 that stores the ring-shaped reinforcing parts 24 transported by the belt conveyor 300. The belt conveyor 300 is positioned by an appropriate actuator (not shown) at a collection position (position shown by a solid line in Fig. 14) that extends substantially horizontally, and a standby position (position shown by a two-dot chain line in Fig. 14) that extends substantially vertically.

[0086] 14, a door 304 with a handle 304a is provided on the side surface of the dust box 302 on the front side in the X-axis direction. A crusher (not shown) for crushing the collected ring-shaped reinforcing parts 24 is attached inside the dust box 302. In the dust box 302, the crushed pieces of the ring-shaped reinforcing parts 24 stored in the dust box 302 can be taken out by holding the handle 304a and opening the door 304.

[0087] When the temporary placement table 204 on which the frame unit U with the cutting groove 256 formed at the base of the reinforcing part 24 is temporarily placed is positioned below the separation part 248 by the temporary placement table transport part 232, the separation part 248 exposes the ring-shaped reinforcing part 24 to the outer periphery and sucks and holds the inside of the wafer 4 by the second lift table 272, as shown in FIG. 16. Next, the movable piece 288 is moved by the feed means 290, and the support substrate 400 is moved by the Z-axis feed means 294, so that the top 402 having a wedge acts on the outer periphery of the ring-shaped reinforcing part 24, as shown in FIG. 17. Specifically, the wedge of the top 402 is positioned between the tape 96 and the reinforcing part 24. Also, the lower surface of the frame 64 is brought into contact with the sphere 404b of the frame support part 404, and the frame 64 is supported by the sphere 404b.

[0088] Next, ultraviolet rays are irradiated from the pair of ultraviolet irradiation units 270 to reduce the adhesive strength of the tape 96 attached to the ring-shaped reinforcement portion 24, and the frame unit U is rotated by the motor 284 together with the second lift table 272 relative to the separator 274. As a result, the tape 96, the adhesive strength of which has been reduced, and the reinforcement portion 24 are pulled apart by the wedges of the pieces 402, and the ring-shaped reinforcement portion 24 can be separated from the frame unit U, as shown in FIG. 18. The separated reinforcement portion 24 is transported to a dust box 302 by the belt conveyor 300 and collected. Note that the separator 274 may be rotated relative to the frame unit U when separating the reinforcement portion 24.

[0089] Furthermore, when separating the reinforcing portion 24, ionized air is blown from the ionizer 406 toward the frame unit U. As a result, even if static electricity is generated due to the contact of the link 402 with the tape 96 and the reinforcing portion 24, the static electricity is removed by the ionized air blown from the ionizer 406. Therefore, the tape 96 and the reinforcing portion 24 are not attracted to each other by static electricity, and the reinforcing portion 24 is reliably separated from the frame unit U.

[0090] In addition, when separating the reinforcing portion 24, the top 402 acting on the frame unit U rotates in conjunction with the relative rotation between the frame unit U and the separator 274, and the sphere 404b in contact with the lower surface of the frame 64 also rotates, so that the relative rotation between the frame unit U and the separator 274 is performed smoothly.

[0091] 1, the ring-free unit carrying-out means 196 is disposed adjacent to the reinforcing portion removing means 194. Explaining with reference to FIGS. 19 and 20, the ring-free unit carrying-out means 196 in the illustrated embodiment includes a frame holding portion 306 that faces the ring-free unit supported by the second lift table 272 and holds the frame 64, an inversion mechanism 308 (see FIG. 19) that moves toward the frame cassette table 200 and inverts the frame holding portion 306, a ring-free unit supporting portion 310 (see FIG. 20) that supports the ring-free unit inverted by the inversion mechanism 308 so that the front surface 4a of the wafer 4 faces upward, and a push-in portion 312 (see FIG. 20) that inserts the ring-free unit supported by the ring-free unit supporting portion 310 into the frame cassette 198 placed on the frame cassette table 200 and accommodates it therein.

[0092] 19, the reversing mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 supported by the Y-axis guide member 314 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) for moving the Y-axis movable member 316 in the Y-axis direction, an arm 318 supported by the Y-axis movable member 316 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the arm 318 in the Z-axis direction. Each of the Y-axis and Z-axis feed means of the reversing mechanism 308 may be configured to have a ball screw and a motor for rotating the ball screw.

[0093] The frame holding unit 306 is supported on the arm 318 so as to be capable of being turned upside down, and a motor 320 is attached to turn the frame holding unit 306 upside down. The frame holding unit 306 in the illustrated embodiment includes a substrate 324 rotatably supported on the arm 318 via a pair of rotating shafts 322, and a plurality of suction pads 326 attached to one side of the substrate 324, and each suction pad 326 is connected to a suction means (not shown). One of the rotating shafts 322 is connected to the motor 320.

[0094] With the suction pad 326 facing upward, the inversion mechanism 308 suction-holds the lower surface of the frame 64 of the ring-less unit U' supported by the second lift table 272 with the suction pad 326, and receives the ring-less unit U' from the second lift table 272. The inversion mechanism 308 also inverts the frame holding part 306 by the motor 320 so that the front surface 4a of the wafer 4 faces upward, and then moves the Y-axis movable member 316 to move the ring-less unit U' held by the frame holding part 306 toward the frame cassette table 200.

[0095] 20, the ring-less unit support section 310 of the illustrated embodiment includes a pair of support plates 328 supported movably in the X-axis direction via suitable brackets (not shown), and a gap adjustment means (not shown) for adjusting the gap in the X-axis direction between the pair of support plates 328. The gap adjustment means may be constituted by a suitable actuator such as an air cylinder or an electric cylinder.

[0096] A heater (not shown) is attached to the pair of support plates 328 that support the ring-less unit U'. When the gap between the pair of support plates 328 is narrowed, the pair of support plates 328 heats the tape 96 of the ring-less unit U' with the heater, thereby smoothing out sagging and wrinkles in the tape 96 that have occurred due to the removal of the reinforcing portion 24.

[0097] 20, the pushing unit 312 in the illustrated embodiment includes a Y-axis guide member 330 extending in the Y-axis direction, a Y-axis movable member 332 supported by the Y-axis guide member 330 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 has a base 334 supported by the Y-axis guide member 330, a support column 336 extending upward from the upper surface of the base 334, and a pressing piece 338 attached to the upper end of the support column 336. The Y-axis feed means of the pushing unit 312 may include a ball screw connected to the Y-axis movable member 332 and extending in the Y-axis direction, and a motor for rotating the ball screw.

[0098] 21 , before receiving the ring-free unit U', the ring-free unit supporting part 310 widens the gap between the pair of support plates 328 by using a gap adjustment means, and then receives the ring-free unit U' held by the suction pad 326. Then, when the ring-free unit supporting part 310 receives the ring-free unit U', the pushing part 312 moves the Y-axis movable member 332 by using the Y-axis feed means, thereby causing the ring-free unit U' supported by the ring-free unit supporting part 310 to enter into the frame cassette 198 placed on the frame cassette table 200 by the pressing piece 338 and accommodate it therein.

[0099] 1 and 21 accommodates a plurality of ring-less units U' spaced apart in the vertical direction with the surfaces 4a of the wafers 4 facing upward. As shown in Fig. 20 and 21, the frame cassette table 200 includes a placement section 340 on which the frame cassette 198 is placed, and an elevation section 342 that raises and lowers the placement section 340 to position it at an arbitrary height. The elevation section 342 may include a ball screw that is connected to the placement section 340 and extends in the Z-axis direction, and a motor that rotates the ball screw.

[0100] Next, a processing method will be described in which, using the processing apparatus 2 as described above, a dicing tape 96 is attached to the back surface 4b of the wafer 4, which has a convex ring-shaped reinforcing portion 24 formed on the back surface 4b corresponding to the peripheral excess region 20, to integrate it with the frame 64, and the ring-shaped reinforcing portion 24 is cut and removed from the wafer 4.

[0101] 1 and 3, a wafer cassette loading step is first performed in which a wafer cassette 6 containing a plurality of wafers 4 is loaded onto a wafer cassette table 8. The wafer cassette 6 contains a plurality of wafers 4 spaced apart in the vertical direction with their surfaces 4a facing upward.

[0102] 1 and 5, a frame accommodating step is performed in which a plurality of ring-shaped frames 64, each having an opening 64a for accommodating a wafer 4, are accommodated in a frame accommodating means 66. The frame accommodating step may be performed before or after the wafer cassette loading step.

[0103] In the frame accommodating process, the lift plate 74 of the frame accommodating means 66 is lowered to a desired position, and then the door 76 is opened by grasping the handle 76a, and multiple frames 64 are stacked and accommodated on the upper surface of the lift plate 74. In addition, the height of the lift plate 74 is appropriately adjusted, and the uppermost frame 64 is positioned at a position where it can be carried out by the frame carrying-out means 68.

[0104] After the wafer cassette placing step and the frame accommodating step are performed, a wafer unloading step is performed in which the wafers 4 are unloaded from the wafer cassette 6 placed on the wafer cassette table 8 .

[0105] 3, in the wafer unloading step, first, the Y-axis feed means 34 of the wafer unloading means 10 is operated to position the Y-axis movable member 32 near the wafer cassette table 8. Next, the transport arm 42 is driven to position the hand 44 with the air outlet 46 facing upward on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned on the back surface 4b side of the wafer 4, a gap is provided between the back surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outward.

[0106] Next, compressed air is ejected from the air ejection port 46 of the hand 44 to generate negative pressure on one side of the hand 44 by the Bernoulli effect, and the wafer 4 is suction-supported from the back surface 4b side by the hand 44 without contact. Next, each guide pin 48 is moved radially inward, and the horizontal movement of the wafer 4 suction-supported by the hand 44 is regulated by each guide pin 48. Then, the Y-axis movable member 32 and the transfer arm 42 of the wafer unloading means 10 are moved, and the wafer 4 suction-supported by the hand 44 is unloaded from the wafer cassette 6.

[0107] After the wafer carrying-out step is performed, it is preferable to perform a notch detection step of detecting the position of the notch 26 of the wafer 4. In the notch detection step, as shown in Fig. 4, the outer periphery of the wafer 4 supported by suction with the hand 44 is positioned between the light emitting element 52 and the light receiving element 54 of the notch detection means 50. Next, the wafer 4 is rotated by the drive source via the guide pin 48, thereby detecting the position of the notch 26 of the wafer 4. This makes it possible to adjust the orientation of the wafer 4 to any orientation.

[0108] After the notch detection step is performed, a wafer supporting step is performed in which the front surface 4a side of the wafer 4 carried out by the wafer carrying-out means 10 is supported by the wafer table 12.

[0109] 3, in the wafer supporting step, first, the hand 44 of the wafer carrying-out means 10 is turned upside down so that the front surface 4a of the wafer 4 faces downward. Next, the Y-axis movable member 32 and the transport arm 42 of the wafer carrying-out means 10 are moved so that the peripheral excess area 20 of the front surface 4a of the wafer 4, which is suction-supported by the hand 44, comes into contact with the annular support portion 56 of the wafer table 12. At this time, since the device area 18 of the front surface 4a of the wafer 4 is located in the recess 62 of the wafer table 12, the device 14 does not come into contact with the wafer table 12, and damage to the device 14 is prevented.

[0110] Next, the suction means of the wafer table 12 is operated to generate suction force in each suction hole 60, thereby suction-holding the peripheral excess region 20 of the front surface 4a of the wafer 4. Next, suction support of the wafer 4 by the hand 44 is released, and the hand 44 is moved away from the wafer table 12. In this manner, the wafer 4 is transferred from the wafer unloading means 10 to the wafer table 12. Since the wafer 4 transferred to the wafer table 12 is held by suction by each suction hole 60, the position of the wafer 4 does not shift.

[0111] After the wafer cassette loading step and the frame accommodating step are performed, a frame unloading step of unloading the frame 64 from the frame accommodating means 66 is performed in parallel with the wafer unloading step and the wafer supporting step.

[0112] 5, in the frame ejection step, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame ejection means 68 are moved so that the suction pad 92 of the holding part 88 comes into contact with the upper surface of the topmost frame 64 housed in the frame housing means 66. Next, the suction means of the frame ejection means 68 is operated to generate a suction force in the suction pad 92, thereby sucking and holding the topmost frame 64 with the suction pad 92. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame ejection means 68 are moved so that the topmost frame 64 sucked and held by the suction pad 92 of the holding part 88 is ejected from the frame housing means 66.

[0113] After the frame unloading step is performed, a frame supporting step is performed in which the frame 64 unloaded by the frame unloading means 68 is supported by the frame table 70.

[0114] Continuing the explanation with reference to Figure 5, in the frame supporting step, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame carry-out means 68 are moved so that the frame 64, which is suction-held by the suction pad 92, comes into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned in the lowered position (the position shown by the solid line in Figure 5). Next, the suction force of the suction pad 92 of the frame carry-out means 68 is released, and the frame 64 is placed on the frame table 70. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame carry-out means 68 are moved so that the holder 88 is separated from above the frame table 70.

[0115] After the frame supporting step is performed, a tape applying step is performed in which tape 96 is applied to frame 64.

[0116] Explaining with reference to Fig. 6, in the tape application process, first, before frame table 70 is moved from a lowered position (position shown in Fig. 6(a)) to an elevated position (position shown in Fig. 6(b)) where tape 96 can be applied to frame 64, tape 96 is pulled out from roll tape 96R and tape 96 from which release paper 116 has been peeled off is positioned above frame table 70. Note that the adhesive surface of tape 96 positioned above frame table 70 faces downward.

[0117] Next, the frame table 70 is raised to an extent that the pressure roller 132 of the pressure bonding unit 110 of the tape application means 98 can press the tape 96 from above against the frame 64. The pressure roller 132 is then rolled in the Y-axis direction while pressing the adhesive surface of the tape 96 against the frame 64. This allows the tape 96 pulled out from the roll tape 96R by the tape pull-out unit 108 to be pressure-bonded to the frame 64.

[0118] Next, the cutter 144 and the pressure roller 146 of the cutting section 112 of the tape application means 98 are lowered, and the cutter 144 is pressed against the tape 96 on the frame 64, while the pressure roller 146 presses the frame 64 from above the tape 96. Next, the motor 138 rotates the arm piece 140, and the cutter 144 and the pressure roller 146 move in a circular motion along the frame 64. This allows the tape 96 that protrudes beyond the outer periphery of the frame 64 to be cut along the frame 64. In addition, since the pressure roller 146 presses the frame 64 from above the tape 96, the frame 64 and the tape 96 are prevented from shifting in position when the tape 96 is being cut. The used tape 96 with the circular opening 120 formed therein is taken up by the tape take-up section 106.

[0119] After the tape application process is performed, the frame 64 with the tape 96 applied thereto is transported to the wafer table 12, and the tape-attached frame transport process is performed in which the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported on the wafer table 12, and the tape-attached frame 64' is placed on the wafer table 12.

[0120] In the tape-attached frame transport step, first, the frame table 70 is moved from the raised position to the lowered position. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame transport means 100 (see FIG. 5) are moved, and each suction pad 158 of the holding part 154 of the tape-attached frame transport means 100 is brought into contact with the upper surface of the tape-attached frame 64' (see FIG. 7) supported by the frame table 70 with the adhesive surface of the tape 96 facing downward.

[0121] Next, the suction means of the tape-attached frame transport means 100 is operated to generate suction force in the suction pads 158, thereby suction-holding the upper surface of the tape-attached frame 64' with the suction pads 158. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame transport means 100 are moved, and the tape-attached frame 64' held by suction with the suction pads 158 is carried out from the frame table 70.

[0122] Next, the taped frame 64' held by suction with the suction pad 158 of the taped frame transport means 100 is transported to the wafer table 12, and as shown in Fig. 7, the opening 64a of the frame 64 is positioned over the back surface 4b of the wafer 4 supported by the wafer table 12, and the taped frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the taped frame 64' faces downward, and the back surface 4b of the wafer 4 faces upward and faces the adhesive surface of the tape 96.

[0123] Next, the suction force of the suction pad 158 of the tape-attached frame transport means 100 is released, and the tape-attached frame 64' is placed on the frame support portion 58 of the wafer table 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame transport means 100 are moved to move the holding portion 154 away from above the wafer table 12.

[0124] After the tape-attached frame transport step is performed, a tape pressing step is performed in which the tape 96 of the tape-attached frame 64' is pressed onto the rear surface 4b of the wafer 4.

[0125] 7 to 9, in the tape pressing step, first, the upper chamber 160 is lowered by the lifting mechanism 164 of the tape pressing means 102, and the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. As a result, the upper chamber 160 and the lower chamber 162 are closed, and the pressing roller 174 is brought into contact with the tape-attached frame 64'. Then, as shown in FIG. 8, the upper end of the ring-shaped reinforcing part 24 of the wafer 4 is stuck to the adhesive surface of the tape 96 of the tape-attached frame 64'.

[0126] Next, the vacuum unit 166 is operated with the atmosphere opening portion 168 of the tape pressing means 102 closed, and the inside of the upper chamber 160 and the lower chamber 162 is evacuated. Next, as shown in FIG. 8 and FIG. 9, the pressing roller 174 of the tape pressing means 102 is rolled in the Y-axis direction to press the tape 96 onto the back surface 4b of the wafer 4. This makes it possible to generate a frame unit U in which the back surface 4b of the wafer 4 and the tape 96 are pressed together. Next, the atmosphere opening portion 168 is opened, and the tape 96 is brought into close contact with the back surface 4b of the wafer 4 along the base of the ring-shaped reinforcing portion 24 by atmospheric pressure. Then, the upper chamber 160 is raised by the lifting mechanism 164.

[0127] By creating a vacuum inside the upper chamber 160 and the lower chamber 162, the suction force of the wafer 4 by the wafer table 12 is lost. However, when the upper chamber 160 and the lower chamber 162 are closed, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the taped frame 64', so that the position of the wafer 4 does not shift during the tape pressing process.

[0128] After the tape pressing step is performed, a frame unit unloading step is performed in which the frame unit U in which the tape 96 of the taped frame 64' and the back surface 4b of the wafer 4 are pressed against each other is unloaded from the wafer table 12.

[0129] Explaining with reference to Figure 5, in the frame unit unloading process, first, the transport section 206 of the frame unit unloading means 192 is operated to bring the underside of the suction piece 210 of the wafer holding section 202a of the frame unit holding section 202 into contact with the tape 96 on the back surface 4b side of the wafer 4, and also bring the suction pad 214 of the frame holding section 202b into contact with the frame 64.

[0130] Next, suction force is generated in the suction piece 210 of the wafer holding part 202a and the suction pad 214 of the frame holding part 202b, so that the suction piece 210 of the wafer holding part 202a suction-holds the wafer 4 from the back surface 4b side (tape 96 side) and the suction pad 214 of the frame holding part 202b suction-holds the frame 64. Next, the suction-holding of the wafer 4 by the wafer table 12 is released. Then, the transport part 206 is operated to carry out the frame unit U held by the frame unit holding part 202 from the wafer table 12.

[0131] After the frame unit carrying-out step is performed, the center of the wafer 4 is aligned with the center of the temporary placement table 204, and the frame unit U is temporarily placed on the temporary placement table 204 in a temporary placement step.

[0132] Explaining with reference to Fig. 10, in the temporary placement step, first, the frame unit U held by the frame unit holding part 202 is positioned above the imaging part 224. Next, the transport part 206 constituting the two-dimensional movement mechanism of the frame unit carry-out means 192 is operated, and at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 are imaged by the imaging part 224. This measures the coordinates of at least three points on the outer periphery of the wafer 4. Next, the central coordinates of the wafer 4 are obtained based on the measured coordinates of the three points.

[0133] Next, the transport unit 206 is operated to position the center of the wafer 4 at the center of the annular support portion 226 of the temporary placement table 204, and the peripheral excess area 20 of the front surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support portion 226 of the temporary placement table 204, while the lower surface of the frame 64 is brought into contact with the upper surface of the frame support portion 228 of the temporary placement table 204. At this time, although the front surface 4a of the wafer 4 faces downward, the device area 18 is located in the recess 230 of the temporary placement table 204, so that the device 14 does not come into contact with the temporary placement table 204, and damage to the device 14 is prevented.

[0134] Next, the suction hold of the wafer 4 by the wafer holding part 202a is released, and the suction hold of the frame 64 by the frame holding part 202b is released, and the frame unit U is transferred from the frame unit carry-out means 192 to the temporary placement table 204. Next, the heater of the frame support part 228 is operated, and the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 is heated by the heater. This softens the tape 96 and makes it adhere to the base of the ring-shaped reinforcing part 24 of the wafer 4.

[0135] After the temporary placement step is performed, a reinforcing portion removing step is performed in which the ring-shaped reinforcing portion 24 is cut and removed from the wafer 4 of the frame unit U carried out by the frame unit carrying-out means 192.

[0136] 1, 10 and 12, in the reinforcing portion removal step, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting / lowering table 246 of the reinforcing portion removal means 194 are moved to bring the lower surface of the suction piece 268 into contact with the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204. Next, suction force is generated in each suction hole of the suction piece 268 of the first lifting / lowering table 246 to suction-hold the frame 64 portion of the frame unit U.

[0137] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first lift table 246 are operated to position the frame unit U sucked and held by the suction piece 268 above the laser beam application means 244, as shown in Fig. 11. Next, the focal point of the laser beam LB is positioned at the base of the ring-shaped reinforcing part 24 of the wafer 4 of the frame unit U.

[0138] Next, while the suction piece 268 and the frame unit U are rotated by the motor 266 of the first lift table 246, the base of the ring-shaped reinforcing part 24 of the wafer 4 is irradiated with the laser beam LB. This allows the base of the ring-shaped reinforcing part 24 of the wafer 4 to be ablated to form a ring-shaped cut groove 256. When the laser beam LB is irradiated to the wafer 4, the suction means of the laser beam application means 244 is operated to generate a suction force in the suction nozzle 254, and the debris generated by the ablation is sucked by the suction nozzle 254.

[0139] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 are moved so that the outer circumferential excess region 20 of the front surface 4a of the wafer 4 of the frame unit U, which is suction-held by the suction piece 268, comes into contact with the upper surface of the annular support portion 226 of the temporary placement table 204, and the lower surface of the frame 64 comes into contact with the upper surface of the frame support portion 228 of the temporary placement table 204. Next, the suction force of the suction piece 268 of the first lifting table 246 is released, and the frame unit U is transferred from the first lifting table 246 to the temporary placement table 204.

[0140] Next, the temporary placement table 204 that has received the frame unit U is positioned below the separation section 248 of the reinforcement removing means 194 by the temporary placement table transport section 232 (see FIG. 10). At this time, the belt conveyor 300 of the disposal section 276 is positioned at the standby position. Next, the second lift table 272 of the separation section 248 is lowered, and the lower surface of the second lift table 272 is brought into contact with the tape 96 on the back surface 4b of the wafer 4. Next, a suction force is generated on the lower surface of the second lift table 272, and the inner side of the wafer 4 of the frame unit U is suction-held by the table head 287 of the second lift table 272 with the ring-shaped reinforcement section 24 exposed on the outer periphery, as shown in FIG.

[0141] Next, the second lift table 272 holding the wafer 4 of the frame unit U by suction is raised, the frame unit U is separated from the temporary placement table 204, and the temporary placement table 204 is moved below the first lift table 246. Next, the movable piece 288 is moved by the feed means 290, and the support substrate 400 is moved by the Z-axis feed means 294, so that the wedge-equipped piece 402 acts on the outer periphery of the ring-shaped reinforcing part 24, as shown in Fig. 17, and the wedge of the piece 402 is positioned between the tape 96 and the reinforcing part 24, and the spheres 404b of the frame support part 404 support the frame 64. Also, the belt conveyor 300 of the disposal part 276 is moved from the standby position to the collection position.

[0142] Next, ultraviolet rays are irradiated from the pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcement unit 24, and the frame unit U is rotated by the motor 284 together with the second lift table 272 relative to the separator 274. In addition, ionized air is blown toward the frame unit U from the ionizer 406. As a result, as shown in FIG. 18, the ring-shaped reinforcement unit 24 can be separated from the frame unit U, and static electricity generated when separating the reinforcement unit 24 does not remain in the frame unit U. The reinforcement unit 24 that has fallen from the frame unit U is transported to the dust box 302 by the belt conveyor 300 and collected. Note that the separator 274 may be rotated relative to the frame unit U when separating the reinforcement unit 24.

[0143] After the reinforcing portion removing step is performed, a ring-free unit carrying-out step is performed in which the ring-free unit U′ from which the ring-shaped reinforcing portion 24 has been removed is carried out from the reinforcing portion removing means 194 .

[0144] In the ring-free unit discharge step, first, the belt conveyor 300 of the disposal section 276 of the reinforcing part removing means 194 is moved from the recovery position to the standby position. Next, the frame holding section 306 of the reversing mechanism 308 (see FIG. 19 ) of the ring-free unit discharge means 196 is positioned below the ring-free unit U' that is held by suction on the second lift table 272.

[0145] Next, with the suction pad 326 of the frame holding portion 306 facing upward, the arm 318 is raised and the suction pad 326 of the frame holding portion 306 is brought into contact with the underside of the frame 64 of the ring-less unit U' which is supported by the second lift table 272 and has the surface 4a of the wafer 4 facing downward.

[0146] Next, suction force is generated in the suction pad 326 of the frame holding part 306, and the frame 64 of the ring-free unit U' is suction-held by the suction pad 326. Next, the suction-holding of the ring-free unit U' by the second lift table 272 is released. As a result, the ring-free unit U' is transferred from the second lift table 272 of the reinforcing part removing means 194 to the frame holding part 306 of the ring-free unit carrying-out means 196.

[0147] After the ring-free unit unloading step is performed, a ring-free unit storing step is performed in which the ring-free unit U' unloaded by the ring-free unit unloading means 196 is stored.

[0148] In the ring-free unit storage step, first, the inversion mechanism 308 of the ring-free unit carrying-out means 196 is turned upside down, and the ring-free unit U' held by suction in the frame holding part 306 is turned upside down. As a result, the ring-free unit U' is positioned below the frame holding part 306, and the front surface 4a of the wafer 4 faces upward.

[0149] Next, the Y-axis movable member 316 and the arm 318 of the inversion mechanism 308 are moved to bring the ring-free unit U' into contact with the upper surfaces of the pair of support plates 328 of the ring-free unit support section 310. At this time, the gap between the pair of support plates 328 is narrowed by the gap adjustment means, and the pair of support plates 328 are in close contact with each other. Next, the suction-holding of the ring-free unit U' by the frame holding section 306 is released, and the ring-free unit U' is placed on the pair of support plates 328. Next, the heaters attached to each support plate 328 are operated to heat the tape 96 of the ring-free unit U', thereby smoothing out any sagging or wrinkles in the tape 96 caused by the removal of the reinforcing section 24. Then, the ring-free unit U' is again suction-held by the frame holding section 306 and raised.

[0150] Next, after the gap between the pair of support plates 328 is widened by the gap adjustment means, the ring-less unit U' is placed on the upper surface of the support plate 328. Then, as shown in Fig. 21, the ring-less unit U' supported by the ring-less unit support portion 310 is pushed by the pressing piece 338 of the pushing portion 312, and the ring-less unit U' is inserted into and accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0151] As described above, in the processing apparatus 2 of the illustrated embodiment, it is easy to attach a dicing tape 96 to the back surface 4b of the wafer 4, which has a convex ring-shaped reinforcing portion 24 formed on the back surface 4b corresponding to the peripheral excess region 20, and to integrate it with the frame 64, and it is also easy to cut and remove the ring-shaped reinforcing portion 24 from the wafer 4, resulting in good productivity. [Explanation of symbols]

[0152] 2: Processing equipment 4: Wafer 4a: Surface of wafer 4b: Back side of wafer 6: Wafer cassette 8: Wafer cassette table 10: Wafer carrying means 12: Wafer table 20: Surplus outer area 24: Reinforcement 64: Frame 64':Taped frame 66: Frame receiving means 68: Frame ejection means 70: Frame table 98: Tape attachment means 100: Tape-attached frame transport means 102: Tape pressing means 192: Frame unit ejection means 194:Reinforcement part removal means 196: Ring-free unit ejection means 198: Frame cassette 200: Frame cassette table 204: Temporary table 244: Laser beam irradiation means 246: First Lift Table 248: Separation part 256: Cutting groove 270: UV irradiation unit 272: Second lift table 274: Separator 276: Disposal Department 287: Table Head 400: Support substrate 402: Frame 404: Frame support 404b: Sphere 406: Ionizer

Claims

1. A processing apparatus for removing a convex reinforcing portion from a wafer having a ring-shaped reinforcing portion formed in a convex shape on a back surface corresponding to an outer peripheral excess region, comprising: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer carrying-out means for carrying out a wafer from the wafer cassette placed on the wafer cassette table; a wafer table that supports the front surface side of the wafer carried out by the wafer carrying-out means; a frame receiving means for receiving a plurality of ring-shaped frames each having an opening for receiving a wafer; a frame ejection means for ejecting the frame from the frame storage means; a frame table for supporting the frame discharged by the frame discharge means; a tape application means disposed above the frame table for applying tape to the frame; a tape-attached frame transport means for transporting the frame with the tape affixed thereto to the wafer table and placing the tape-attached frame on the wafer table by positioning an opening of the frame over the back surface of the wafer supported on the wafer table; a tape pressing means for pressing the tape of the tape-attached frame onto the back surface of the wafer; a frame unit carrying-out means for carrying out, from the wafer table, a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape-bonding means, and temporarily placing the frame unit on a temporary placement table; a reinforcing portion removing means for cutting and removing a ring-shaped reinforcing portion from the wafer of the frame unit placed on the temporary placement table; a ring-free unit carrying-out means for carrying out the ring-free unit from the reinforcing part removing means; a frame cassette table on which a frame cassette accommodating the ring-free unit discharged by the ring-free unit discharge means is placed; Including, the reinforcing portion removing means includes a laser beam application means for applying a laser beam toward a base of a ring-shaped reinforcing portion formed on the outer periphery of the wafer to form a cutting groove, a first lift table for holding and lifting a frame unit temporarily placed on the temporary placement table and positioning it on the laser beam application means, and a separation unit for separating the ring-shaped reinforcing portion from the cutting groove, The separation section is a processing apparatus including an ultraviolet irradiation section which irradiates ultraviolet light onto the tape corresponding to the cutting groove to reduce the adhesive strength of the tape, a second lifting table which exposes the ring-shaped reinforcing portion to its outer periphery and holds the inside of the wafer by suction, a separator which acts on the outer periphery of the ring-shaped reinforcing portion with a wedge-equipped piece to separate the ring-shaped reinforcing portion, and a disposal section in which the separated ring-shaped reinforcing portion is disposed of.

2. the second lifting table includes two or more types of table heads having an outer diameter corresponding to an inner diameter of the reinforcing portion of the wafer, the table heads being detachably attached to the lifting means; The separation unit includes a detection means for detecting whether the type of the table head input to the control means matches the type of the table head actually attached, 2. The processing apparatus according to claim 1, wherein the detection means detects whether or not the outer diameter of the table head obtained by bringing the separator piece into contact with the outer periphery of the table head coincides with the outer diameter of the table head input to the control means.

3. 2. The processing apparatus according to claim 1, further comprising a frame support portion for supporting a frame adjacent to the piece of said separating portion.

4. 4. The processing apparatus of claim 3, wherein said frame support comprises a rotatable sphere.

5. 2. The processing apparatus according to claim 1, further comprising an ionizer disposed adjacent to the piece of said separating section for removing static electricity from said frame unit.

Images