File management device for surface mount machines, surface mount machines

Abstract

A file management device 55 comprises: a data processing unit 56 that combines a plurality of image files captured by a surface-mounted machine 11 and generates a packed file PF; and a storage unit 57 that stores the packed file PF.

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a file management device for a surface mounter, and to a surface mounter. [Background technology]

[0002] In the surface mounter, many images are taken during the process of mounting components on a board. These images are used for post-mortem analysis when a defective board occurs during production. Patent Document 1 discloses a technology for compressing the amount of image data by taking the second and subsequent frames of multiple images of components mounted on a board and converting them into differential images from the first frame. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-085559 A Summary of the Invention [Problem to be solved by the invention]

[0004] The number of images and the amount of data are on the rise due to faster operation of surface mounters and an increase in the number of cameras. The increase in the number of images and the amount of data has led to problems such as the complexity of image file operations (saving, copying, deleting image files) and the time it takes to transfer data to storage media.

[0005] An object of the present invention is to realize a file management device for a surface mounter that is capable of improving the efficiency of file operations and of transferring a large amount of files at high speed. [Means for solving the problem]

[0006] The file management device for a surface mounter includes a data processing unit that combines a plurality of image files captured by the surface mounter to generate a combined file, and a storage unit that stores the combined file. Effect of the Invention

[0007] According to the present disclosure, it is possible to provide a file management device for a surface mounter that can improve the efficiency of file operations and transfer large amounts of files at high speed. [Brief description of the drawings]

[0008] [Figure 1] Surface mounting system configuration diagram [Diagram 2] Plan view of surface mounter [Diagram 3] Head unit side view [Figure 4] Perspective view of component supply tape [Diagram 5] Surface mounter block diagram [Figure 6] Flowchart showing the component mounting process [Figure 7] Flowchart showing the process of generating a combined file [Figure 8] Schematic diagram showing the structure of a combined file [Figure 9] Verification results of data transfer time DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <Outline of this embodiment> (1) A file management device for a surface mounter includes a data processing unit that combines a plurality of image files captured by the surface mounter to generate a combined file, and a storage unit that stores the combined file.

[0010] By combining multiple image files to generate a combined file, the number of files can be reduced. By reducing the number of files, file operations (saving, copying, deleting, etc. of image files) can be made more efficient. In addition, the time required for file transfer can be reduced.

[0011] (2) The data processing unit may combine a plurality of the image files that are related to each other to generate the combined file.

[0012] According to this configuration, since the combined file contains multiple related image files, it is not necessary to search for related image files from the many image files captured by the surface mounter, which makes it possible to efficiently analyze the image files.

[0013] (3) The multiple related image files may be image files of the same component captured during the process of mounting the component on the board.

[0014] With this configuration, the assembly process of a single component can be checked from multiple image files contained in the combined file.

[0015] (4) The combined file may include header information, which may include at least one of information related to the component, information related to imaging conditions, and information related to image processing.

[0016] In this configuration, it becomes possible to carry out a composite analysis by using information contained in the header information in addition to the image file.

[0017] (5) A surface mounter according to one embodiment of the present technology includes a mounting head that adsorbs components and mounts them on a board, a component supplying device that supplies the components to the mounting head, an imaging unit that images the components, the mounting head, and the board, and any of the file management devices described above that combines multiple image files captured by the imaging unit to generate a combined file.

[0018] (6) A file management device included in the surface mounter may transfer the combined file stored in the storage unit to an external storage device connected to the surface mounter.

[0019] By transferring the combined file stored in the storage unit to an external storage device, the free space in the storage unit can be increased, and an area for saving the newly generated combined file can be secured. In addition, the shortened transfer time makes it possible to efficiently transfer a large amount of files. This reduces the waiting time for file transfer, suppresses delays in mounting work, and is effective in improving the tact time of the surface mounter.

[0020] The invention disclosed in this specification can be realized in various forms, such as an apparatus, a method, a computer program for implementing the functions of these apparatus or methods, and a recording medium on which the computer program is recorded.

[0021] <Embodiment> 1. Surface Mount System Configuration 1 is a system configuration diagram of a surface mounting system S including a surface mounter 11. The surface mounting system S is composed of a production line 1 that produces circuit boards PU, a data server (an example of an "external storage device") 20, an operation terminal 22, and a production management device 23. The circuit board PU is a board in which electronic components (an example of a "component") EC are mounted on a printed circuit board (an example of a "board") P.

[0022] The production line 1 includes a printing machine 10, a surface mounter 11, a surface mounter 12, and an inspection device 13. These working devices 10 to 13 are connected in series via a transfer conveyor 32 (see FIG. 2). The transfer conveyor transfers the printed circuit board P to be worked on along the line.

[0023] The printer 10 is a work device that performs a printing process on the printed circuit board P. The printing process is a process of printing solder paste on the printed circuit board P. The surface mounter 11 and the surface mounter 12 are work devices that perform a mounting process of electronic components EC on the printed circuit board P after the printing process. The inspection device 13 is a work device that inspects the printed circuit board P after the components are mounted.

[0024] If no abnormality is detected by the inspection device 13, the printed circuit board P is subjected to a reflow process by a reflow device installed outside the line. Also, if an abnormality is detected by the inspection device 13, the production line 1 is stopped and the cause of the abnormality is analyzed.

[0025] The printing machine 10, the surface mounter 11, the surface mounter 12, and the inspection device 13 are connected to a production management device 23 via a LAN 15. The production management device 23 is a device that manages the production line 1, and stores information on the production plan, etc. The information on the production plan includes the type of printed circuit board P and the type of electronic components EC used in the production. In addition, a data server 20 and an operation terminal 22 are connected to the LAN 15.

[0026] 2 is a plan view of the surface mounter 11. In the following description, directional relationships will be described using XYZ orthogonal coordinate axes. The X-axis and Y-axis are orthogonal to each other on a horizontal plane, and the Z-axis is an axis that extends in the vertical direction and is orthogonal to both the X-axis and the Y-axis.

[0027] The surface mounter 11 includes a base 31, a transport conveyor 32, a head unit 33, a drive unit 34, a feeder 35, and a control device 50. The transport conveyor 32 transports the printed circuit board P to be processed on the base 31 in the X-axis direction.

[0028] The driving unit 34 is a device that moves the head unit 33 in horizontal directions (X-axis and Y-axis directions) on the base 31. An example of the driving unit 34 is a two-axis or three-axis ball screw mechanism using a motor as a drive source.

[0029] Feeder 35 is a device that supplies electronic components EC held by component supply tape 70 to mounting head 36. As shown in FIG. 4, component supply tape 70 is configured by bonding together carrier tape 71 having recesses 72 and top tape 75 that covers the openings of recesses 72, and electronic components EC are stored in the recesses 72. Feeder 35 peels off top tape 75 from component supply tape 70 with the openings of recesses 72 facing upward, and exposes electronic components EC at the suction position. Mounting head 36 suctions and holds the exposed electronic components EC from above. Feeder 35 is an example of a "component supply device".

[0030] 3, the head unit 33 is equipped with a plurality of mounting heads 36. The mounting heads 36 are supported in a state in which they can be raised and lowered relative to the head unit 33. The mounting heads 36 have suction nozzles 37 at their tips and can suck and hold electronic components EC by applying negative pressure, and can release the hold of the electronic components EC by switching the negative pressure to a weak positive pressure.

[0031] The head unit 33 can be moved to any position on the base 31 by a drive unit 34. In addition, the mounting head 36 can be raised and lowered at any position. The head unit 33 performs the function of mounting electronic components EC supplied from a feeder 35 onto a printed circuit board P at a work position WP in the center of the base 31.

[0032] When the mounting process is completed, the surface mounter 11 conveys the completed printed circuit board P to a surface mounter 12 located downstream.

[0033] 2 and 3, the surface mounter 11 has a first camera 41, a second camera 42, and a third camera 43. Each of the cameras 41 to 43 is an example of an "imaging unit", and transmits an image file of a captured image (hereinafter also simply referred to as an "image") to a file management device 55 described later.

[0034] The first camera 41 is attached to a support member 38 that supports the head unit 33. The first camera 41 is a side-view camera, and captures an image of the electronic component EC held by the suction nozzle 37 from the side.

[0035] The second camera 42 is fixed with its imaging surface facing upward on the base 31 near the feeder 35. The second camera 42 is a bottom-view camera that captures an image of the electronic component EC held by the suction nozzle 37 from below before the electronic component EC is mounted on the printed circuit board P.

[0036] The images captured by the first camera 41 and the second camera 42 make it possible to know the suction state of the electronic component EC relative to the suction nozzle 37. Because the first camera 41 is a side-view camera, it is possible to detect the inclination of the electronic component EC suction-held by the suction nozzle 37 with respect to the horizontal plane and whether or not the suction was successful, based on the image from the first camera 41. In addition, the amount of deviation (horizontal position deviation and rotation angle deviation) of the suction position of the electronic component EC relative to the suction nozzle 37 can be detected from the image from the second camera 42.

[0037] If the inclination of the electronic component EC is within the allowable range, the position and angle of the electronic component EC relative to the printed circuit board P can be corrected based on the recognition results of the image captured by the second camera 42, thereby improving the mounting accuracy of the electronic component EC.

[0038] Moreover, if the inclination of the electronic component EC is outside the allowable range, it is determined that a suction error has occurred, and the component is removed from the line, and the suction nozzle 37 picks up the next electronic component EC again for mounting.

[0039] The third camera 43 is a camera attached to the head unit 33. Specifically, as shown in Fig. 2, the third camera 43 is attached to the side of the head unit 33 at a central position of the arrangement of the mounting heads 36 aligned in the X-axis direction. This allows the third camera 43 to move together with the head unit 33 on the base 31 in the horizontal direction (X-axis direction and Y-axis direction).

[0040] Prior to mounting the electronic components EC on the printed circuit board P, the third camera 43 captures an image of a position recognition mark attached to the printed circuit board P. The position recognition mark is a mark for recognizing the position of the printed circuit board P. The image capturing result of the position recognition mark is transmitted from the third camera 43 to the control device 50.

[0041] Furthermore, before the mounting head 36 picks up the electronic component EC housed in the recess 72 of the carrier tape 71, the third camera 43 captures an image of the electronic component EC at the pickup position and its surrounding area (see FIG. 4).

[0042] Furthermore, after the mounting head 36 mounts the electronic components EC at predetermined positions on the printed circuit board P, the third camera 43 captures an image of the electronic components EC on the printed circuit board P and the surrounding area thereof.

[0043] The pressure sensor 44 is disposed between a vacuum pump (not shown) and the mounting head 36, and detects the pressure inside the suction nozzle 37. The detection result of the pressure sensor 44 is transmitted to a data processing unit 56, which will be described later. Each mounting head 36 of the head unit 33 is provided with one pressure sensor 44.

[0044] Based on the imaging results of the position recognition marks, the control device 50 recognizes the accurate position and orientation of the printed circuit board P positioned on the transport conveyor 32. Furthermore, based on the recognition results of the position and orientation of the printed circuit board P, the control device 50 corrects the coordinate position (XY coordinate position) at the time of mounting.

[0045] The surface mounter 11 monitors the mounting process by a first camera 41, a second camera 42, and a third camera 43. The surface mounter 12 monitors the mounting process in a similar manner.

[0046] 2. Control device Next, a control system of the surface mounter 11 will be described with reference to Fig. 5. Fig. 5 is a block diagram of the surface mounter 11. A control device 50 is a controller that controls the surface mounter 11 in an overall manner.

[0047] The control device 50 has a main control unit 51 , an image processing unit 52 , a camera control unit 53 , a sensor control unit 54 , a file management device 55 , a main memory device 58 , and an input / output unit 59 .

[0048] The main control unit 51 performs overall control of the surface mounter 11. The main control unit 51 controls the drive unit 34, the head unit 33, and the feeder 35 to supply the electronic components EC and mount them on the printed circuit board P.

[0049] The camera control unit 53 controls the first camera 41 to the third camera 43. Specifically, it instructs the cameras 41 to 43 on camera settings, including the camera to be used for imaging (one of the cameras 41 to 43), the illuminance of the lighting (not shown) of each camera, the imaging timing, the camera angle, etc. The camera control unit 53 also transmits the camera settings at the time of imaging to the main control unit 51. It also transmits the captured image to the file management device 55.

[0050] The sensor control unit 54 controls the pressure sensor 44. The sensor control unit 54 acquires the pressure value of the suction nozzle 37 at the moment of imaging from the pressure sensor 44 in accordance with the timing of imaging by the cameras 41 to 43. For example, when the suction nozzle 37 is suctioning an electronic component EC, the pressure sensor 44 detects negative pressure, and when nothing is being suctioned, the pressure sensor 44 detects atmospheric pressure. The sensor control unit 54 transmits the pressure value detected by the pressure sensor 44 to the main control unit 51.

[0051] The main storage device 58 is a so-called main memory, and is made up of non-volatile memory such as ROM and RAM. The main storage device 58 stores data of the production program, settings of the surface mounter 11 according to the production program, a library that records the types and shapes of the electronic components EC, and the like. The main storage device 58 transmits setting information of the surface mounter 11 to the main control unit 51.

[0052] The image processing unit 52 performs image correction processing on the images captured by the cameras 41 to 43 to clarify the contours of the electronic components EC shown in the images and to recognize the shape and posture of the electronic components EC, as well as to recognize position recognition marks on the printed circuit board P.

[0053] The input / output unit 59 is connected to the LAN 15. Data is exchanged between the surface mounter 11 and the data server 20 via the input / output unit 59.

[0054] The file management device 55 has a data processing unit 56 and an auxiliary storage device (an example of a "storage unit") 57. The auxiliary storage device 57 is made up of a non-volatile memory such as a ROM or a RAM. A plurality of images captured by the cameras 41 to 43 and image-specific information (described later) specific to each image are collected in the auxiliary storage device 57.

[0055] The data processing unit 56 combines these collected images and information to generate a combined file PF (described later) and stores it in the auxiliary storage device 57 .

[0056] The image specific information includes, in text format, information on the electronic components EC to be mounted, information on the imaging conditions, and information on image processing. Specific examples of each are shown below.

[0057] The information relating to the electronic component EC includes, for example, the type name of the electronic component EC, the mounting number in the production program, the block number, the mounting coordinates, the component shape data (library index), and the like.

[0058] The information relating to the imaging conditions is mainly setting information of the surface mounter 11 at the time of imaging, and includes, for example, information about the mounting head 36 (type of suction nozzle 37, movement speed of the mounting head 36, etc.), nozzle pressure detected by the pressure sensor 44, the imaging status of the image (before suction, after suction, before mounting, after mounting, etc.), the date and time the image was captured, the camera setting conditions (camera illuminance, camera resolution, camera angle, etc.), the image file name, etc.

[0059] The information on image processing is the result of image processing by the image processing unit 52, such as the recognition result coordinates, the shape, attitude, and angle of the recognized electronic component EC, etc. If an error occurs during image recognition, the error number is also included.

[0060] By acquiring image-specific information along with the captured image and linking the two, when a mounting defect is discovered after components are mounted and a previously captured image is analyzed, the detailed situation at the time the image was captured can be known.In addition, by specifying the conditions at the time of image capture (for example, the type of component to be mounted or the date and time of capture, etc.), it is possible to selectively view only images that match the conditions.

[0061] The image unique information is continuously acquired by the main control unit 51 while the production program is being executed, and is updated whenever the suction nozzle 37 is replaced or the pressure value fluctuates. The main control unit 51 transmits the image unique information to the file management device 55 in accordance with the timing of capturing images by the cameras 41 to 43. In other words, every time the cameras 41 to 43 capture an image, the file management device 55 acquires the image and the image unique information at the time the image was captured.

[0062] 3. Explanation of the mounting process Next, a mounting process for mounting electronic components EC on the printed circuit board P will be described with reference to the flowchart of FIG.

[0063] In addition, the surface mounter 11 has a plurality of mounting heads 36 which mount electronic components EC in parallel, but in the following explanation, for simplicity, the operation of one mounting head 36 will be described.

[0064] First, the production management device 23 issues a production start instruction to the main control unit 51 via the LAN 15. Upon receiving the production start instruction, the main control unit 51 reads a production program from the main storage device 58 (S10).

[0065] Next, the main control section 51 moves the head unit 33 to above the suction position of the feeder 35 based on the production program (S20). The suction position is the position where the electronic component EC is shown in FIG.

[0066] Then, the third camera 43 captures an image of the suction position and its surroundings. As a result, the camera control unit 53 acquires an image A (S20). As shown in Fig. 8, the image A is an image of the electronic component EC stored in the recess 72 of the carrier tape 71. The camera control unit 53 transmits the image A to the file management device 55. At the same time as capturing the image A, the main control unit 51 also transmits image unique information A1 at the time of capturing the image A to the file management device 55 (S20). The image A is used to confirm whether or not the electronic component EC is present in the recess 72.

[0067] Next, the main control unit 51 causes the mounting head 36 to pick up the electronic component EC (S30), and moves the mounting head 36 to the front (within the field of view) of the first camera 41. The first camera 41 captures an image of the suction nozzle and the electronic component EC from the side, and transmits image B to the file management device 55 (S40). As shown in FIG. 8, image B is a side view of the electronic component EC picked up by the suction nozzle 37. In addition, the main control unit 51 transmits image unique information B1 at the time image B was picked up to the file management device 55 (S40). Image B is used to confirm the attitude of the electronic component EC picked up by the suction nozzle 37.

[0068] Next, the main control unit 51 moves the head unit 33 to above the second camera 42. The second camera 42 captures an image of the electronic component EC from below, and transmits the image C to the file management device 55 (S50). As shown in FIG. 8, the image C is a bottom view of the electronic component EC picked up by the suction nozzle 37. The main control unit 51 also transmits image unique information C1 at the time of capturing the image C to the file management device 55 (S50). The image C is used to correct the position and the rotation angle when mounting the electronic component EC at a predetermined position on the printed circuit board P.

[0069] Next, the main control unit 51 moves the head unit 33 above the mounting position of the printed circuit board P based on the production program. The mounting position is a position on the printed circuit board P where the electronic component EC is mounted. The first camera 41 captures an image of the suction nozzle 37 and the electronic component EC at the mounting position from the side, and transmits the image D to the file management device 55 (S60). The main control unit 51 also transmits image unique information D1 at the time of capturing the image D to the file management device 55 (S60). The image D (see FIG. 8) is used to confirm the attitude of the electronic component EC immediately before mounting.

[0070] Next, the main control unit 51 lowers the mounting head 36 to mount the electronic component EC on the printed circuit board P (S70). After mounting the electronic component EC, the mounting head 36 rises to its original height. The third camera 43 captures an image of the mounting position on the printed circuit board P from above, and transmits the image E to the file management device 55 (S80). The main control unit 51 also transmits image unique information E1 at the time of capturing the image E to the file management device 55 (S80). The image E (see FIG. 8) is used to check the mounting state of the electronic component EC on the printed circuit board P.

[0071] Next, the first camera 41 captures an image of the suction nozzle 37 from the side after the electronic component EC has been mounted on the printed circuit board P, and transmits the image F to the file management device 55 (S90). The main control unit 51 also transmits image-specific information F1 at the time of capturing the image F to the file management device 55 (S90). The image F (see FIG. 8) is used to check whether any of the electronic components EC held by the suction nozzle 37 remain on the suction nozzle 37.

[0072] Next, the file management device 55 generates a combined file PF based on the images A to F and the image unique information A1 to F1 acquired thus far (S100). The generated combined file PF is stored in the auxiliary storage device 57. The generation of the combined file PF will be described in detail later.

[0073] Next, the main control unit 51 refers to the production program and determines whether there are other electronic components EC to be mounted. If there are other electronic components EC to be mounted (S110: YES), the process proceeds to S20 and the mounting process continues. If there are no other electronic components EC to be mounted (S110: NO), the mounting process ends.

[0074] 4. Generating the combined file PF The generation of the combined file PF in the file management device 55 will be described with reference to Figures 7 and 8. Figure 7 details the process of S100 in the flowchart of Figure 6, and shows the procedure when the file management device 55 generates the combined file PF. Figure 8 is a schematic diagram showing the relationship between a plurality of images A to F and a plurality of image unique information A1 to F1 and the combined file PF.

[0075] As described above, the file management device 55 acquires the images A to F and the image unique information A1 to F1 (S210).

[0076] Next, as shown in Fig. 8, the file management device 55 performs a process of combining the image files of images A to F in the data processing unit 56 to generate one binary file BF (S220). A binary file is a file made up of binary data. Also, binary data is data handled by a computer other than text data, and is represented by an arbitrary bit string. For example, an image file is a binary file made up of binary data.

[0077] In the process of combining the image files of images A to F, the binary data of each file is simply combined. The file size of the generated binary file BF is approximately equal to the combined size of each of the images A to F. The binary file BF contains the binary data of the original image files A to F, but does not contain the image-specific information A1 to F1.

[0078] Next, the data processing unit 56 combines the image unique information A1 to F1 to generate header information H (S230), as shown in Fig. 8. The image unique information A1 to F1 and the header information H are text data. When generating the header information H, the text of the image unique information A1 to F1 may simply be concatenated, or may be reconstructed by item.

[0079] Furthermore, the data processing unit 56 may add new information when generating the header information H. For example, the following information may be added to the header information H: - Number of image files included in combined file PF Creation date and time of combined file PF

[0080] Next, the data processing unit 56 adds header information H to the binary file BF to generate a combined file PF (S240). As a result, the image information of images A to F (binary file BF) and the image specific information A1 to F1 of each image (header information H) are integrated into one combined file PF.

[0081] Next, the data processing unit 56 stores the combined file PF in the auxiliary storage device 57 (S250).

[0082] Through the above processing, one combined file PF is generated based on the multiple images A to F and the multiple pieces of image unique information A1 to F1.

[0083] 5. Verify the time required for data transfer In order to verify the relationship between the number of files and the file size to be transferred and the time required for transfer, in the surface mount system S, a large number of files were transferred from the auxiliary storage device 57 of the surface mounter 11 to the data server 20, and the time required for transfer was measured. The results are shown in Figure 9.

[0084] In this measurement, we compared (a) the transfer of 412 image files with an average data size of approximately 39.5 KB with (b) the transfer of 103 combined files with an average data size of approximately 166 KB. The combined file was a binary file (approximately 158 KB) made by combining four image files with an average data size of 39.5 KB, with header information (approximately 8 KB) added.

[0085] As a result of the verification, the total transfer time was 3.37 [seconds] for (A) and 1.09 [seconds] for (B). The transfer rate was 4830 [KB / sec] for (A) and 15715 [KB / sec] for (B).

[0086] Comparing the results of (A) and (B), the total data size of (B) is larger due to the added header information, but the transfer rate of (B) is about three times that of (A), and the total transfer time is about one-third. From these results, we can see that the transfer rate is higher when the number of files is smaller, and when the total file size is about the same, the fewer the number of files, the shorter the transfer time.

[0087] 6.Effects In the mounting process, images captured by the surface mounter 11 are temporarily stored in a storage medium (auxiliary storage device 57) of the surface mounter 11. If a large amount of data is stored in the auxiliary storage device 57 and the free space becomes insufficient, it becomes impossible to capture and store new image files. In order to continue capturing images, it is necessary to transfer the files in the auxiliary storage device 57 to a large-capacity external storage device (data server 20) and ensure free space in the auxiliary storage device 57.

[0088] If the data transfer speed between the auxiliary storage device 57 and the data server 20 is slow, it may take a long time to secure free space, which may cause a delay in the operation of the surface mounter 11.

[0089] In the configuration of this embodiment, the number of files can be reduced because the file management device 55 generates one combined file PF from the images A to F captured by the surface mounter 11. In this embodiment, six image files are combined, so the number of files can be reduced to 1 / 6.

[0090] Reducing the number of files enables high-speed transfer when transferring a large number of files from the auxiliary storage device 57 to the data server 20, and shortens the time required for data transfer. If the data transfer can be completed in a short time, delays in the operation of the surface mounter 11 can be reduced, and the work efficiency of the surface mounter 11 can be improved.

[0091] In addition, by reducing the number of files, file operations (saving, copying, deleting, etc. of image files) can be made more efficient, making it easier to analyze defective boards.

[0092] In general, images captured by the surface mounter 11 are often used to analyze the cause of defective boards and to improve traceability. When using image files for these purposes, it is possible to analyze a specific electronic component EC by referring to multiple images captured during the series of processes from when it is supplied to the feeder 35 until it is mounted on the printed circuit board P.

[0093] In the configuration of this embodiment, the data processing unit 56 combines multiple related image files, i.e., six image files A to F relating to the same electronic component EC captured during the mounting process on the printed circuit board P, to generate a combined file PF.

[0094] In this way, when referring to a series of images taken during the process of mounting a specific electronic component EC among multiple electronic components EC after mounting, all the necessary image files can be referenced by expanding one combined file PF corresponding to that electronic component EC. This improves the traceability of the specific electronic component EC and allows easy access to the desired image for efficient defect analysis.

[0095] In the above-described embodiment, the combined file PF has header information H. The header information H includes image unique information A1 to F1 corresponding to the image files A to F included in the combined file PF, respectively. The image unique information A1 to F1 is text data describing information related to parts, information related to imaging conditions, and information related to image processing.

[0096] The combined file PF contains the image unique information A1 to F1 as header information H. Therefore, without having to extract the binary file BF contained in the combined file PF and check the image files A to F directly, the contents of the image files A to F can be known by first reading the header information H.

[0097] In addition, various information at the time of capturing the image is included in the header information H. By combining this information with the image, analysis that utilizes the information in a composite manner becomes possible.

[0098] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed in this specification.

[0099] (1) In the above-described embodiment, "image files relating to the same electronic component EC" is given as an example of "multiple related image files." The "multiple related image files" may be other than this, for example, "multiple image files captured in a specific time period" or "multiple image files captured of the same printed circuit board," and are not limited to the contents of the embodiment.

[0100] (2) In the above-described embodiment, the data processing unit 56 generates one combined file PF by combining six images (images A to F) captured of one electronic component EC. Two or more combined files PF may be generated from a plurality of images captured of one electronic component EC. For example, when images A to F are captured, two combined files PF may be generated from images A to C and images D to F. Also, one combined file PF may be generated from images captured of two or more electronic components EC.

[0101] (3) In the above embodiment, the header information H is included in the combined file PF, but the header information H may be omitted.

[0102] (4) In the above-described embodiment, the header information H includes all of the information related to the part, the information related to the imaging conditions, and the information related to the image processing. The header information H may include at least one of these three pieces of information. For example, the header information H may include only the information related to the part, or may include both the information related to the imaging conditions and the information related to the image processing.

[0103] (5) In the above embodiment, the file management device 55 generates the binary file BF by simply combining the binaries of the image files A to F. When generating the binary file BF, the image files may be compressed. [Explanation of symbols]

[0104] 11, 12: Surface mounter 20: Data server (an example of an "external storage device") 35: Feeder (an example of a "parts supply device") 36: Mounting head 37: Suction nozzle 41: First camera (an example of an "imaging unit") 42: Second camera (an example of an "imaging unit") 43: Third camera (an example of an "imaging unit") 55: File management device 56: Data processing section 57: Auxiliary storage device (an example of a "storage unit") EC: Electronic components (an example of "components") BF: Binary file H: Header information P: Printed circuit board (an example of a "circuit board") PF: Combined file

Claims

1. A file management device for a surface mount machine, comprising: a data processing unit that combines a plurality of image files captured by the surface mounter to generate a combined file; a storage unit that stores the combined file, The data processing unit combines a plurality of the image files that are related to each other to generate the combined file, A file management device, wherein the multiple related image files are image files of the same component taken during the mounting process on the board, and are a series of image files taken between the time the component is supplied to a surface mount machine and the time it is mounted on the board.

2. A file management device for a surface mount machine, comprising: a data processing unit that combines a plurality of image files captured by the surface mounter to generate a combined file; a storage unit that stores the combined file, The data processing unit combines a plurality of the image files that are related to each other to generate the combined file, The related image files are image files of the same component taken during the mounting process on the board, and include image files of the component taken from the side and from below immediately after it is picked up by the suction nozzle of the surface mounter, as well as A file management device that includes at least one of an image file of a component supplied to a surface mounting machine and before it is picked up by a suction nozzle, an image file of a component picked up by the suction nozzle and just before it is mounted on a board, and an image file of the suction nozzle after the component is mounted.

3. A file management device for a surface mount machine, comprising: a data processing unit that combines a plurality of image files captured by the surface mounter to generate a combined file; a storage unit that stores the combined file, A file management device, wherein the combined file includes header information consisting of text data combining image-specific information unique to each of the multiple image files, and a binary file combining the binary data of the multiple image files.

Images