Component Placement System

Abstract

To provide a parts mounting system that can share instruction information on parts mounting work with multiple parts mounting lines to automatically perform proper mounting work.SOLUTION: A parts mounting system has a shared memory unit that stores instruction information representing instructions about performing mounting work of mounting parts on a substrate, the instruction information set for each individual substrate, and a plurality of parts mounting lines that share the instruction information stored in the shared memory unit and share the mounting work in accordance with the instruction information.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present specification relates to a component mounting system that performs a mounting operation of mounting components on a board. [Background technology]

[0002] A technology for mass-producing board products by performing substrate-related operations on boards on which circuit patterns are formed has become widespread. Furthermore, it has become common to configure a component mounting line by arranging other types of substrate-related operation machines before and after a component mounting machine that performs component mounting operations. In a component mounting line, typically, unique information is set for each type of board or each individual board, and the component mounting machine and other substrate-related operation machines share the unique information and perform operations based on this information. An example of a technology for sharing information in a component mounting line is disclosed in Patent Document 1.

[0003] The board production line disclosed in Patent Document 1 includes a plurality of board production machines (machines for performing operations on boards) and a shared folder, and a board type information file including information on the board type identified by the most upstream board production machine is created in the shared folder, and the board type information file is recognized by the board production machines other than the most upstream. It is further disclosed that the board type information file includes individual identification information of the board, a terminate flag indicating the end of production of the board, and skip information indicating that a small board piece that is a part of a multi-panel board cannot be used. According to this, since the board type information file is recognized by the downstream board production machine in response to the transport of the board, each board production machine can easily grasp information such as the board type using the shared folder even if it does not have a communication function between them. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 109948 Summary of the Invention [Problem to be solved by the invention]

[0005] In Patent Document 1, the multiple board production machines that make up a board production line are able to commonly recognize information such as board type by recognizing the board type information file in the shared holder. However, when the component mounting work is shared among multiple component mounting lines (board production lines), the shared holder is provided on a line-by-line basis, so information cannot be shared across lines, which may result in the following problems.

[0006] For example, assume that a first component mounting line performs mounting work on the top surface of a double-sided mounting type board, and a second component mounting line performs mounting work on the bottom surface of the board. In this case, even if a defect occurs in the mounting work on the top surface and skip information is set for a specific board indicating that it cannot be used, the second component mounting line cannot recognize this skip information. As a result, there is a risk that the second component mounting line will perform unnecessary mounting work on the bottom surface of the board for which skip information is set. In order to eliminate this risk, the worker's judgment and action are required.

[0007] Therefore, an object of this specification is to provide a component mounting system that can share instruction information regarding component mounting work among multiple component mounting lines and automatically perform appropriate mounting work. [Means for solving the problem]

[0008] This specification discloses a component mounting system including a shared memory unit that stores instruction information representing instructions relating to the performance of a mounting operation of mounting components onto a board, the instruction information being set for each individual board, and a plurality of component mounting lines that share the instruction information stored in the shared memory unit and share the mounting operation in accordance with the instruction information. Effect of the Invention

[0009] In the disclosed component mounting system, the multiple component mounting lines share the instruction information stored in the shared memory unit, and can also commonly recognize when the instruction information has been changed. Therefore, the multiple component mounting lines can automatically perform appropriate mounting operations according to the latest instruction information set for each individual board. [Brief description of the drawings]

[0010] [Figure 1] 1 is a plan view of a multiple board on which components are mounted by a component mounting system according to a first embodiment. [Diagram 2] 10A and 10B are diagrams conceptually illustrating an example of unique information for identifying an individual substrate. [Diagram 3] 4 is a diagram conceptually illustrating an example of mounting operation data used by the component mounting system. FIG. [Figure 4] 1 is a block diagram illustrating a schematic configuration of a component mounting system according to a first embodiment. [Diagram 5] FIG. 4 is an operational flow diagram illustrating the operation of the component mounting system according to the first embodiment. [Figure 6] FIG. 13 is a diagram conceptually illustrating an example of first reference data to which a first component mounting line refers; [Figure 7] FIG. 1 is a block diagram showing a schematic configuration of a component mounting system according to a conventional technique. [Figure 8] FIG. 11 is a block diagram illustrating a schematic configuration of a component mounting system according to a second embodiment. [Figure 9] FIG. 11 is a block diagram illustrating a schematic configuration of a component mounting system according to a third embodiment. [Figure 10] FIG. 13 is a block diagram illustrating a schematic configuration of a component mounting system according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] 1. Multi-panel board K, unique information ID, mounting operation data DP First, with reference to Fig. 1 to Fig. 3, a description will be given of a board on which components are mounted by the component mounting system 1 of the first embodiment, the board's unique information ID, and mounting operation data DP used by the component mounting system 1. An example of the target board is the multiple board K shown in Fig. 1.

[0012] The multi-panel board K is made up of six small board pieces (KS1, KS2, KS3, KS4, KS5, KS6) arranged in a 2 x 3 pattern, and a surrounding frame KW. As shown by the dashed lines in Fig. 1, each of the small board pieces (KS1 to KS6) is removed from the frame KW after components are mounted, and is then separated from one another and used as separate board products. The multi-panel board K is a double-sided mounting type, and mounting work is performed once on the top surface (front surface) and once on the bottom surface (back surface).

[0013] Position reference marks M are provided near two opposing corners of the frame portion KW. Unique information ID is provided near a third corner of the frame portion KW. The position reference marks M and the unique information ID are provided on both the top surface and the bottom surface. Furthermore, the position reference marks M and the unique information ID may be additionally provided on each of the small substrate pieces (KS1 to KS6).

[0014] The unique information ID identifies each individual piece of the multiple substrate K. The unique information ID is expressed, for example, using a character string or a barcode. The unique information ID is also provided by attaching a label or stamping (impressing a seal). The format of the unique information ID illustrated in FIG. 2 consists of a manufacturer column MF, a substrate type column SR, an individual number column NO, and a surface information column FI.

[0015] The manufacturer field MF is written, for example, using two English letters, and indicates the manufacturer of the multi-panel substrate K. The substrate type field SR is written, for example, using four alphanumeric characters, and indicates the type of multi-panel substrate K. The individual number field NO is written, for example, using a six-digit serial number, and indicates an individual piece of multi-panel substrate K. The surface information field FI is written, for example, with an alternative between "T" indicating the top surface and "B" indicating the bottom surface. The format of the unique information ID is not limited to the above, and there are various variations.

[0016] The mounting work data DP used by the component mounting system 1 has, for example, a format as shown in Fig. 3. The data name DN of the mounting work data DP is named by concatenating the contents of the manufacturer column MF and the board type column SR. In the mounting work data DP, the serial number in the individual number column NO (one multi-panel board K) is associated with a plurality of pieces of information, and each association is written on a single line. The plurality of pieces of information include top surface finish information TZ, top surface order information TN, bottom surface finish information BZ, bottom surface order information BN, and six pieces of instruction information (C1 to C6). This information is changeable.

[0017] The top surface completion information TZ and bottom surface completion information BZ are alternatively indicated as "0" indicating that the mounting work on the relevant surface has not been completed, or "1" indicating that the mounting work has been completed. The top surface order information TN and bottom surface order information BN indicate the execution order of the mounting work on the relevant surface. The substrate-related processing machine can search for the top surface order information TN and bottom surface order information BN corresponding to the carry-in order of the multi-panel substrate K, and refer to the information on the substrate without making a mistake. This prevents confusion even if the multi-panel substrate K is carried in in an order different from the serial numbers in the individual number column NO, and even if multiple mounting operations are attempted on one surface of one multi-panel substrate K.

[0018] Each of the six pieces of instruction information (C1 to C6) corresponds to each of the six small board pieces (KS1 to KS6). The six pieces of instruction information (C1 to C6) are alternatively represented as execution information "0", which indicates that mounting work is to be performed on the small board pieces (KS1 to KS6), and skip information "1", which indicates that mounting work is not to be performed. In the initial state mounting work data DP before mounting work on the multiple board piece K is started, the top surface finish information TZ, top surface order information TN, bottom surface finish information BZ, bottom surface order information BN, and the six pieces of instruction information (C1 to C6) in all individual number columns NO are all represented as "0" (see FIG. 3).

[0019] 2. Configuration of component mounting system 1 according to the first embodiment Next, the configuration of the component mounting system 1 of the first embodiment will be described with reference to FIG. 4. The component mounting system 1 is composed of a shared memory unit 2, a first component mounting line 3, a first line-specific memory unit 4, a second component mounting line 5, and a second line-specific memory unit 6. The first component mounting line 3 and the second component mounting line 5 have the same line configuration. The first component mounting line 3 and the second component mounting line 5 share instruction information (C1 to C6) stored in the shared memory unit 2, and perform mounting work in a shared manner in accordance with the instruction information (C1 to C6). The first component mounting line 3 and the second component mounting line 5 can also perform different mounting work for different types of boards.

[0020] The first component mounting line 3 is configured with six board-related operation machines lined up. That is, a solder printer 31, a solder inspection machine 32, a component mounting machine 33, a first board visual inspection machine 34, a second board visual inspection machine 35, and a reflow machine 36 are lined up in the order shown. Each of the six board-related operation machines carries in a board from the upstream side, performs a predetermined board-related operation on the board, and carries out the board downstream after the board-related operation has been completed. The board-related operation includes the component mounting operation and includes related operations before and after the mounting operation.

[0021] The solder printer 31 prints solder paste at predetermined locations on the board. The solder inspection machine 32 inspects the printing state of the solder paste. The component mounting machine 33 mounts components onto the solder paste. The first board visual inspection machine 34 and the second board visual inspection machine 35 share the task of inspecting the mounting state of multiple components. The reflow machine 36 heats and melts the solder paste, then cools and solidifies it, stabilizing the soldered state of the components (reflow operation). The six board-related work machines are not equipped with communication devices for communicating with each other. Therefore, the six board-related work machines cannot transmit information between each other using communication.

[0022] The second solder inspection machine 32 from the upstream side has a unique information acquisition unit 37 that acquires a unique information ID that identifies an individual piece of multiple board K. Examples of the unique information acquisition unit 37 include a camera or a barcode reader disposed above an entrance through which the multiple board K is carried in. The camera captures an image of the unique information ID provided on the multiple board K and acquires it, and the barcode reader reads and acquires the unique information ID.

[0023] The second component mounting line 5 is configured with a solder printer 51, a solder inspection machine 52, a component mounting machine 53, a first board visual inspection machine 54, a second board visual inspection machine 55, and a reflow machine 56 arranged in the order listed. The solder inspection machine 52 has a unique information acquisition unit 57. The first component mounting line 3 and the second component mounting line 5 may have a line configuration different from that described above. The first component mounting line 3 and the second component mounting line 5 may have a line configuration different from each other.

[0024] The shared memory unit 2 stores the above-mentioned mounting work data DP. That is, the shared memory unit 2 stores a unique information ID that identifies an individual piece of the multiple board K in association with the instruction information (C1 to C6). The shared memory unit 2 may be a simple storage device, or may be part of a computer system equipped with a CPU. The mounting work data DP can be accessed (obtained by reading, set or changed by writing) by a specific board-related operation machine. In the first embodiment, the mounting work data DP can be read and obtained by the solder inspection machine (32, 52), and written and set by the second board appearance inspection machine (35, 55).

[0025] The shared storage unit 2 receives information corresponding to the minimum and maximum values ​​of the manufacturer column MF, board type column SR, and individual number column NO of the unique information ID of the multiple board K from the higher-level device 21. The value obtained by subtracting the minimum value from the maximum value of the individual number column NO and adding 1 indicates the production number of multiple boards K. In this way, the initial state mounting work data DP is created. The higher-level device 21 corresponds to a production management system that manages production plans for multiple types of boards.

[0026] The first line-specific memory unit 4 stores first reference data DQ1. The first reference data DQ1 has the same data structure as the mounting operation data DP. The first reference data DQ1 is written by the solder inspection machine 32 and read by the second board visual inspection machine 35. The first reference data DQ1 is also referenced by the component mounting machine 33, the first board visual inspection machine 34, and the second board visual inspection machine 35. The first reference data DQ1 is also changed by the solder inspection machine 32, the first board visual inspection machine 34, and the second board visual inspection machine 35 as necessary.

[0027] The second line-specific memory unit 6 has the same storage capacity as the first line-specific memory unit 4 and has the same functions. That is, the second line-specific memory unit 6 stores second reference data DQ2. The second reference data DQ2 has the same data structure as the mounting operation data DP. The second reference data DQ2 is written by the solder inspection machine 52 and read by the second board appearance inspection machine 55. The second reference data DQ2 is also referred to by the component mounting machine 53, the first board appearance inspection machine 54, and the second board appearance inspection machine 55. Furthermore, the second reference data DQ2 is changed as necessary by the solder inspection machine 52, the first board appearance inspection machine 54, and the second board appearance inspection machine 55.

[0028] 3. Operation of the component mounting system 1 according to the first embodiment Next, the operation of the component mounting system 1 of the first embodiment will be described with reference to Fig. 5 and Fig. 6. In the following, it is assumed that the first component mounting line 3 first performs substrate-related work on the top surface of the multiple board K, and then the second component mounting line 5 performs substrate-related work on the bottom surface of the multiple board K. Both the first component mounting line 3 and the second component mounting line 5 operate according to the operation flow shown in Fig. 5. This operation flow is performed for each individual piece of the multiple board K. Before the operation starts, the initial state mounting operation data DP has already been created.

[0029] When the top surface of the multi-panel board K is carried in, the first component mounting line 3 performs substrate-related operations including mounting operations. Here, the order of carrying in the multi-panel board K is assumed to be "000002," "000001," and "000003" in the individual number column. In step S1 of FIG. 5, the solder printer 31 prints solder paste on the top surface of the carried-in multi-panel board K without recognizing the information corresponding to the individual number column. At this time, the solder printer 31 uses a screen that covers six small board pieces (KS1 to KS6) and a squeegee that moves on the screen. The printed multi-panel board K is carried out and transported to the solder inspection machine 32.

[0030] In the next step S2, the solder inspection machine 32 uses the unique information acquisition unit 37 to acquire the unique information ID of the first multiple board K. In the next step S3, the solder inspection machine 32 reads and acquires information of the corresponding row of the mounting operation data DP from the shared memory unit 2 based on the individual number field NO (=000002) included in the unique information ID, and writes this information to the first reference data DQ1 in the first line-specific memory unit 4 (acquisition process). Furthermore, the solder inspection machine 32 sets the top surface order information TN of the corresponding row of the first reference data DQ1 to "1", which is equal to the carry-in order.

[0031] In the next step S4, the solder inspection machine 32 inspects the printing state of the paste solder. If the printing state is good and the inspection result is a pass, the operation flow proceeds to step S6, and if the inspection result includes a fail, the operation flow proceeds to step S6 via step S5. It is assumed that the inspection result of the first multiple board K is a pass.

[0032] In step S6, the component mounting machine 33 performs the mounting operation of components on the paste solder. Prior to the mounting operation, the component mounting machine 33 judges whether or not to perform the mounting operation according to the instruction information (C1 to C6). More specifically, the component mounting machine 33 refers to the instruction information (C1 to C6) of the corresponding row in the individual number column NO (=000002) of the first reference data DQ1 in which the top surface order information TN corresponding to the first in the carry-in order is "1". If the instruction information (C1 to C6) includes the skip information "1", the component mounting machine 33 skips the mounting operation on the small board (KS1 to KS6) corresponding to the skip information "1". The substrate-related operation machine can refer to the corresponding row of the first reference data DQ1 without making a mistake, based on the top surface order information TN corresponding to the carry-in order of the multiple board K.

[0033] In the next step S7, the first board visual inspection machine 34 and the second board visual inspection machine 35 share the task of inspecting the mounting state of the multiple components. At this time, the first board visual inspection machine 34 and the second board visual inspection machine 35 refer to the instruction information (C1 to C6) in the same way as the component mounting machine 33, and skip the inspection of the small board pieces (KS1 to KS6) corresponding to the skip information "1". If the mounting state is good and the inspection result is pass, the operation flow proceeds to step S9, and if the inspection result includes fail, the operation flow proceeds to step S9 via step S8. It is assumed that the inspection result of the first multiple board K is pass.

[0034] In step S9, the second board visual inspection machine 35 sets "1" to the top surface end information TZ of the corresponding row in the individual number column NO (=000002) of the first reference data DQ1, indicating that the mounting work has been completed. Furthermore, the second board visual inspection machine 35 reads out the information of the corresponding row, transfers this information to the shared storage unit 2, and writes it in the mounting work data DP (transfer process). In the next step S10, the reflow machine 36 performs the reflow work on the multiple board K.

[0035] While the substrate-to-substrate operation is being performed on the top surface of the first multiple substrate K, the top surface of the second multiple substrate K is carried into the solder printer 31, and paste solder is printed on it in step S1. In the next step S2, the solder inspection machine 32 acquires the unique information ID using the unique information acquisition unit 37. In the next step S3, the solder inspection machine 32 reads and acquires information on the corresponding row of the mounting work data DP based on the individual number field NO (=000001) included in the unique information ID, and writes this information into the first reference data DQ1 (acquisition process). Furthermore, the solder inspection machine 32 sets the top surface order information TN of the corresponding row of the first reference data DQ1 to "2", which is equal to the carry-in order.

[0036] In the next step S4, the solder inspection machine 32 inspects the printing state of the paste solder. In the second multiple board K, it is assumed that the third small board KS3 has failed and the other small boards (KS1, KS2, KS4 to KS6) have passed. In other words, the third small board KS3 cannot be used as a board product. Therefore, in step S5, the solder inspection machine 32 changes the implementation information "0" of the third instruction information C3 in the corresponding row of the individual number column NO (=000001) of the mounting work data DP to skip information "1". In step S6, the component mounting machine 33 refers to the instruction information (C1 to C6), skips the mounting work on the third small board KS3, and performs the mounting work on the other small boards (KS1, KS2, KS4 to KS6).

[0037] In the next step S7, the first board visual inspection machine 34 and the second board visual inspection machine 35 omit the inspection of the third small board KS3 and inspect the other small boards (KS1, KS2, KS4 to KS6). The inspection results of the five small boards (KS1, KS2, KS4 to KS6) of the second multiple board K are assumed to be passed. In step S9, the second board visual inspection machine 35 sets "1" to the top surface end information TZ of the corresponding row in the individual number column NO (=000001) of the first reference data DQ1, indicating that the mounting work has been completed. Furthermore, the second board visual inspection machine 35 reads out the information of the corresponding row and writes this information into the mounting work data DP (transfer process). In the next step S10, the reflow machine 36 performs the reflow work on the multiple board K.

[0038] Furthermore, the top surface of the third multiple board K is carried into the solder printer 31, and paste solder is printed in step S1. In the next step S2, the solder inspection machine 32 acquires the unique information ID using the unique information acquisition unit 37. In the next step S3, the solder inspection machine 32 reads and acquires information on the corresponding row of the mounting operation data DP based on the individual number field NO (=000003) included in the unique information ID, and writes this information into the first reference data DQ1 (acquisition process). Furthermore, the solder inspection machine 32 sets the top surface order information TN of the corresponding row of the first reference data DQ1 to "3", which is equal to the carry-in order.

[0039] In the next step S4, the solder inspection machine 32 inspects the printing state of the solder paste. It is assumed that the inspection result is pass for the third multiple board K. In step S6, the component mounting machine 33 refers to the instruction information (C1 to C6) and performs mounting work on all of the small boards (KS1 to KS6).

[0040] In the next step S7, the first board visual inspection machine 34 and the second board visual inspection machine 35 inspect all the small boards (KS1 to KS6). In the third multiple board K, it is assumed that the fifth small board KS5 has failed, and the other small boards (KS1 to KS4, KS6) have passed. In other words, the fifth small board KS5 cannot be used as a board product. Therefore, in step S8, the first board visual inspection machine 34 or the second board visual inspection machine 35 sets skip information "1" to the fifth instruction information C5 of the corresponding row in the individual number column NO (=000003) of the first reference data DQ1.

[0041] In the next step S9, the second board visual inspection machine 35 sets "1" to the top surface end information TZ of the corresponding row in the individual number column NO (=000003) of the first reference data DQ1, indicating that the mounting work has been completed. Furthermore, the second board visual inspection machine 35 reads out the information of the corresponding row and writes this information into the mounting work data DP (transfer process). In the next step S10, the reflow machine 36 performs the reflow work on the multiple board K.

[0042] At this point, the first reference data DQ1 stored in the first line-specific storage unit 4 is in the state shown in Fig. 6. As shown in the figure, for the first to third multiple boards carried in, the top surface finish information TZ is set to "1" and the top surface sequence information TN is set to 1 to 3. Furthermore, skip information "1" is set in the third instruction information C3 in the row with the individual number column NO of 000001 and in the fifth instruction information C5 in the row with the individual number column NO of 000003. Furthermore, due to the transfer process of the second board appearance inspection machine 35, the mounting operation data DP stored in the shared storage unit 2 is in the same state as the first reference data DQ1.

[0043] Next, the bottom surfaces of the first to third multiple boards K are carried into the second component mounting line 5, and the substrate-related work is performed. At this time, the order in which the multiple multiple boards K are carried into the second component mounting line 5 may be different from the order in which they are carried into the first component mounting line 3. The same substrate-related work is performed in the second component mounting line 5 as in the first component mounting line 3. As the substrate-related work progresses, information in each row of the mounting work data DP (information shown in FIG. 6) is read out and written to the second reference data DQ2 in the second line-specific storage unit 6 (acquisition process).

[0044] The solder inspection machine 52, the component mounting machine 53, the first board visual inspection machine 54, and the second board visual inspection machine 55 of the second component mounting line 5 refer to the second reference data DQ2 and omit the work on the small boards (KS1 to KS6) for which the skip information "1" is set. In other words, these board-related work machines omit the work on the small boards (KS1 to KS6) that cannot be used as board products. Specifically, the work on the third small board KS3 of the multiple board K whose individual number column number is 000001 and the fifth small board KS5 of the multiple board K whose individual number column number is 000003 are omitted. However, since the solder printing machine 51 uses a screen, it is not possible to selectively omit printing on some of the small boards (KS1 to KS6).

[0045] The second reference data DQ2 is changed in response to the execution of the board-related work in the second component mounting line 5. Specifically, bottom side sequence information BN and bottom side finish information BZ are set. Furthermore, the skip information is changed and set to "1" in response to the failure of the inspection results of the solder inspection machine 52, the first board visual inspection machine 54, and the second board visual inspection machine 55.

[0046] Furthermore, the mounting operation data DP stored in the shared memory unit 2 becomes the same as the second reference data DQ2 through the transfer process of the second board appearance inspection machine 55. When the board-related operations on the top and bottom surfaces of all the multiple boards K are completed, the first reference data DQ1 and the second reference data DQ2 are erased. On the other hand, the mounting operation data DP is stored to improve the traceability of the board products.

[0047] 4. Functions and Effects of the Component Mounting System 1 of the First Embodiment Next, the operation and effect of the component mounting system 1 of the first embodiment will be described in comparison with a conventional component mounting system 1X. As shown in FIG. 7, the conventional component mounting system 1X does not include a shared memory unit 2, and is composed of a single component mounting line 3X and a memory unit 4X. In the conventional component mounting system 1X, the component mounting line 3X first performs a substrate-to-substrate operation on the top surface of the multiple board K, and appropriately sets skip information "1" to the mounting operation data DP in the memory unit 4X. Next, the component mounting line 3X performs a substrate-to-substrate operation on the bottom surface of the multiple board K while referring to the mounting operation data DP.

[0048] Therefore, the conventional component mounting system 1X performs the board-related operations on the top and bottom surfaces in series, which lengthens the time required for the operations. Also, even if another component mounting system is used to perform the board-related operations on the bottom surface, the other component mounting system cannot recognize the mounting operation data DP, which is changed successively. Therefore, if the board-related operations on the top and bottom surfaces are forcibly performed in parallel, unnecessary mounting operations will be performed on small board pieces (KS1 to KS6) that have failed the inspection. As a result, components are wasted and losses are incurred, and the time required for the operations is lengthened by the amount of unnecessary board-related operations.

[0049] In contrast, in the component mounting system 1 of the first embodiment, the multiple board K for which the substrate-related operation has been completed on the first component mounting line 3 can be carried into the second component mounting line 5. At this time, information about the multiple board K is transferred from the first reference data DQ1 to the second reference data DQ2 via the mounting operation data DP. Therefore, the second component mounting line 5 can correctly determine whether or not to perform the substrate-related operation by referring to the latest state of whether or not the skip information "1" is set in the instruction information (C1 to C6).

[0050] It is also possible to perform substrate-related work on the top surfaces of half of the multiple substrates K on the first component mounting line 3, while performing substrate-related work on the bottom surfaces of the remaining half of the multiple substrates K on the second component mounting line 5, and then replace the multiple substrates K for which work has been completed with another substrate-related work to perform the remaining substrate-related work. In any case, according to the first embodiment, substrate-related work on the top and bottom surfaces can be performed in parallel, thereby shortening the time required for work.

[0051] In addition, since the first component mounting line 3 and the second component mounting line 5 share the instruction information (C1 to C6) stored in the shared memory unit 2, they can also commonly recognize that the instruction information (C1 to C6) has been changed. Therefore, the first component mounting line 3 and the second component mounting line 5 can automatically perform appropriate mounting work in accordance with the latest instruction information (C1 to C6) set for each individual multiple board K.

[0052] This method is economical because it skips the mounting work on small boards (KS1 to KS6) that cannot be used as board products, and does not waste parts. In addition to skipping the mounting work, it also omits meaningless board-related work such as inspection, which reduces the time required for the work.

[0053] 5. Component mounting system 1A according to the second embodiment Next, a component mounting system 1A of a second embodiment will be described with reference to FIG. 8, focusing mainly on the differences from the first embodiment. In the component mounting system 1A of the second embodiment, an operator attempts to make effective use of a multiple board K on which the printing state of the paste solder is not good. To achieve this, a rework control unit 38 is additionally provided on the first component mounting line 3. The rework control unit 38 may be provided on the second component mounting line 5, or on both lines.

[0054] In the second embodiment, if the solder inspection machine 32 judges that the printing condition of any one of the six small board pieces (KS1 to KS6) of the multiple board K is not good and the board has failed, it sets the skip information "1" to the corresponding instruction information (C1 to C6). At the same time, the solder inspection machine 32 notifies the operator of the failure and requests a reinspection. The operator reinspects the multiple board K in the solder inspection machine 32 by visual inspection or the like. If the reinspection is successful, the operator inputs a message to the solder inspection machine 32 indicating that the board has passed. This causes the solder inspection machine 32 to cancel the skip information "1" and it is deemed that there was no failure.

[0055] On the other hand, if the reinspection also fails, the operator removes the corresponding multiple board K from the solder inspection machine 32. The operator then operates the rework control unit 38. The rework control unit 38 resets and erases the top surface order information TN for the corresponding row of the first reference data DQ1 and the skip information "1" present in the instruction information (C1 to C6). This makes the corresponding multiple board K ready to be carried in again at any time. The operator further removes the solder paste from the corresponding multiple board K and carries it back into the solder printer 31. Therefore, the multiple board K that was once determined to include a failing board is now considered to be passing and can be used effectively.

[0056] 6. Third embodiment of component mounting system 1B Next, a component mounting system 1B of a third embodiment will be described with reference to Fig. 9, focusing mainly on the differences from the first and second embodiments. In the component mounting system 1B of the third embodiment, a repair station 39 is additionally provided on the first component mounting line 3. The repair station 39 may be provided on the second component mounting line 5, or on both lines.

[0057] The repair station 39 is disposed between the second board visual inspection machine 35 and the reflow machine 36. The repair station 39 is configured to be able to access the first reference data DQ1. The repair station 39 is a place where an operator works on multiple boards K that have been determined to include failures by the first board visual inspection machine 34 and the second board visual inspection machine 35. Multiple boards K that have been determined to pass by the first board visual inspection machine 34 and the second board visual inspection machine 35 pass through the repair station 39. On the other hand, multiple boards K that have been determined to include failures are temporarily stopped at the repair station 39. Furthermore, the occurrence of failures is notified to the operator.

[0058] The tasks performed by the operator at the repair station 39 include re-inspection, repair, and mounting. In the re-inspection, the operator re-inspects the mounted state of the components by visual inspection or by using an image magnifier. In the repair, a repair soldering iron or the like is used to improve the mounted state of the components. In the mounting, the operator manually mounts the components that the component mounter 33 failed to mount.

[0059] If the judgment result can be corrected to pass by the work, the operator inputs that it is pass to the repair station 39. As a result, the repair station 39 cancels the skip information "1" set by the first board appearance inspection machine 34 and the second board appearance inspection machine 35, and it is treated as if there were no failures. Alternatively, the repair station 39 may transport the multiple board K for which the work has been completed back to the second board appearance inspection machine 35 for reinspection. In this way, the multiple board K that was once judged to include failures is changed to pass and is effectively used.

[0060] 7. Component mounting system 1C according to the fourth embodiment Next, a component mounting system 1C of a fourth embodiment will be described with reference to FIG. 10, focusing mainly on the differences from the first to third embodiments. In the component mounting system 1C of the fourth embodiment, the configuration of the second component mounting line 7 is modified. The second component mounting line 7 is configured with six substrate-related operating machines lined up. That is, an adhesive applicator 71, an adhesive inspector 72, a component mounting machine 73, a first substrate visual inspector 74, a second substrate visual inspector 75, and a dryer 76 are lined up in the order listed.

[0061] The adhesive applicator 71 applies a paste-like conductive adhesive to a predetermined location on the board. The adhesive inspector 72 inspects the applied state of the conductive adhesive. The component mounting machine 73 mounts components onto the conductive adhesive. The first board appearance inspector 74 and the second board appearance inspector 75 share the task of inspecting the mounting state of multiple components. The dryer 76 blows out hot air to dry and solidify the conductive adhesive. The adhesive inspector 72 has a unique information acquisition unit 77.

[0062] In the fourth embodiment, the target is a single-sided mounting type board, and first, the components are mounted by soldering on the first component mounting line 3, and then the components are mounted with a conductive adhesive on the second component mounting line 7. The second component mounting line 7 has a different component mounting method from the first component mounting line 3. Nevertheless, the second reference data DQ2 is used in the same way as the first reference data DQ1 is used on the first component mounting line 3. In the fourth embodiment, by using skip information "1", the same actions and effects as the first embodiment are achieved.

[0063] 8. Applications and Modifications of the Embodiments The mounting operation is not limited to the multiple board K, but may be a general board that does not require separation. In this case, one amount of instruction information is used for one board. Also, the first line-specific storage unit 4 and the second line-specific storage unit 6 may be omitted, and each of the substrate-related operation machines on the first component mounting line 3 and the second component mounting line (5, 7) may access the mounting operation data DP in the shared storage unit 2. Furthermore, management without using the top surface order information TN and the bottom surface order information BN is also possible. For example, as disclosed in Patent Document 1, the first line-specific storage unit 4 and the second line-specific storage unit 6 may be used to transfer instruction information (C1 to C6) between adjacent substrate-related operation machines.

[0064] In the fourth embodiment, a component insertion machine may be provided instead of the adhesive applicator 71, adhesive inspector 72, and component mounter 73 of the second component mounting line 7. The component insertion machine inserts and attaches components to connectors mounted on single-sided mounting type boards on the first component mounting line 3 without using solder paste or conductive adhesive. This configuration also produces the same effects and advantages as the first embodiment. The second, third, and fourth embodiments can be implemented in a composite combination. Various other applications and modifications of each embodiment are possible. [Explanation of symbols]

[0065] 1, 1A, 1B, 1C: Component mounting system 2: Shared memory unit 3: First component mounting line 31: Solder printer 32: Solder inspection machine 33: Component mounting machine 34: First board visual inspection machine 35: Second board visual inspection machine 36: Reflow machine 37: Unique information acquisition unit 38: Rework control unit 39: Repair station 4: First line specific memory unit 5: Second component mounting line 51: Solder printer 52: Solder inspection machine 53: Component mounting machine 54: First board visual inspection machine 55: Second board visual inspection machine 56: Reflow machine 57: Unique information acquisition unit 6: Second line specific memory unit 7: Second component mounting line 71: Adhesive applicator 72: Adhesive inspection machine 73: Component mounting machine 74: First board visual inspection machine 75: Second board visual inspection machine 76: Dryer 77: Unique information acquisition unit K: Multiple board KS1~KS6: PCB strip ID: Unique information DP: Mounting data C1~C6: Instruction information DQ1: First reference data DQ2: Second reference data

Claims

1. a shared storage unit that stores instruction information representing instruction contents related to the implementation of a mounting operation for mounting components on a board, the instruction information being set for each individual board; a plurality of component mounting lines in which a plurality of substrate-related operation machines for performing substrate-related operations including the mounting operation are arranged in line from an upstream side to a downstream side, the plurality of component mounting lines share the instruction information stored in the shared memory unit, and perform the mounting operations in a shared manner in accordance with the instruction information; a line-specific storage unit provided in each of the plurality of component mounting lines, the first substrate-related-operation performing machine reads out the instruction information stored in the shared memory unit and writes the instruction information in the line-specific memory unit; At least one of the substrate-related-operation performing machines arranged from the first substrate-related-operation performing machine to the downstream second substrate-related-operation performing machine changes the instruction information stored in the line-specific memory unit as necessary, the second substrate-related-operation performing machine reads out the instruction information stored in the line-specific memory unit and writes the instruction information in the shared memory unit; Parts mounting system.

2. the plurality of component mounting lines include a first component mounting line that shares the mounting operation on a top surface of the board, and a second component mounting line that shares the mounting operation on a bottom surface of the board; The instruction information includes skip information indicating that the mounting work is not to be performed. The component mounting system according to claim 1 .

3. The substrate is a multiple substrate including a plurality of small substrates, the instruction information includes skip information individually indicating that the mounting operation is not to be performed for each of the plurality of small substrate pieces; 3. The component mounting system according to claim 1 or 2.

4. 4. The component mounting system according to claim 1, wherein the instruction information is changed and set based on an inspection result of an inspection carried out within the component mounting line.

5. the shared storage unit stores unique information for identifying an individual substrate and the instruction information in association with each other; each of the plurality of component mounting lines includes a unique information acquisition unit that acquires the unique information, and acquires the instruction information by referencing the acquired unique information with the shared storage unit; The component mounting system according to any one of claims 1 to 4.

6. at least one of the component mounting lines includes a solder printer that prints solder paste on the board, a solder inspection machine that inspects the printed state of the solder paste, a component mounting machine that performs the mounting operation of the components on the solder paste, and a board appearance inspection machine that inspects the mounting state of the components, and performs the board-related operation; at least one of the solder inspection machine and the board visual inspection machine changes and sets the instruction information to include skip information indicating that the subsequent mounting work is not to be performed when the inspection result is determined to be a failure; The component mounting machine determines whether or not to perform the mounting operation according to the instruction information. The component mounting system according to any one of claims 1 to 5.

7. the solder inspection machine determines the inspection result as "fail" when the printing state of the paste solder is not good, and changes and sets the instruction information including the skip information; The component mounting line in which the substrate-related work is performed includes: a rework control unit that erases the skip information when the substrate-related operation is to be performed again on the substrate from which the paste solder having an unsatisfactory printing state has been removed, 7. The component mounting system according to claim 6.

8. 8. The component mounting system of claim 7, wherein the solder inspection machine requests a reinspection by an operator if the printing state of the paste solder is not good, and judges the printing state to be unsatisfactory even after the reinspection.

9. the board visual inspection machine determines the inspection result as failing when the mounting state of the component is not good or when any of the components has not been mounted, and changes and sets the instruction information including the skip information; The component mounting line in which the substrate-related work is performed includes: a repair station that is disposed downstream of the board visual inspection machine and erases the skip information when the inspection result of the board visual inspection machine is corrected from fail to pass by an operation performed by an operator; The component mounting system according to any one of claims 6 to 8.

10. 10. The component mounting system of claim 9, wherein the tasks performed by the operator at the repair station include one or more of a re-inspection task of re-inspecting the mounting state of the component, a repair task of improving the mounting state of the component, and a mounting task of an unmounted component.

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