Electronic Components

Abstract

To provide an electronic component for suppressing peeling of a conductive resin layer.SOLUTION: An element body 3 has a main surface 3a and an end face 3e that are adjacent to each other. An external electrode 5 is arranged in the main surface 3a and the end face 3e. The external electrode 5 has a second electrode layer E2 where a plurality of air gaps 13 exist, and plating layers PL (third electrode layer E3 and fourth electrode layer E4) arranged on the second electrode layer E2. Between an end edge PL1e of the plating layers PL, and the element body 3, gaps 17 communicating with the plurality of air gaps 13 exist. The second electrode layer E2 has a part E21 positioned on the main surface 3a, and a part E23 positioned on the end face 3e. A maximum thickness T1 in the part E21 is larger than a maximum thickness T3 in the part E23.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] There is known an electronic component that includes an element body having side and end faces adjacent to each other, and external electrodes disposed on the side and end faces (see, for example, Patent Document 1). The external electrodes include a conductive resin layer and a plating layer disposed on the conductive resin layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-144665 Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer is generally formed on a base and contains a resin and conductive metal particles. The base includes, for example, a sintered metal layer or an element body. The resin tends to absorb moisture. When an electronic component is soldered to an electronic device, the moisture absorbed in the resin may gasify and expand in volume. The electronic device includes, for example, a circuit board or an electronic component. In this case, stress acts on the conductive resin layer, and the conductive resin layer may peel off from the base.

[0005] An object of one aspect of the present invention is to provide an electronic component that suppresses peeling of a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one embodiment includes an element body having a side surface and an end surface adjacent to each other, and an external electrode disposed on the side surface and the end surface. The external electrode includes a conductive resin layer having a plurality of voids therein, and a plating layer disposed on the conductive resin layer. A gap communicating with the plurality of voids exists between an edge of the plating layer and the element body. The conductive resin layer has a first portion located on the side surface and a second portion located on the end surface. The proportion of voids in the first portion is greater than the proportion of voids in the second portion.

[0007] In the above-mentioned aspect, even if moisture absorbed in the resin is gasified when the electronic component is solder-mounted, the gas generated from the moisture reaches the gap between the edge of the plating layer and the element body through the multiple voids. The gas that reaches the gap between the edge of the plating layer and the element body moves outside the external electrode, making it difficult for stress to act on the conductive resin layer. As a result, the above-mentioned aspect suppresses peeling of the conductive resin layer. When the proportion of voids in the first portion is greater than the proportion of voids in the second portion, gas generated from moisture in the conductive resin layer is likely to move outside the external electrode through the gap between the element body and the portion of the plating layer located on the first portion. Gas generated in the second portion is likely to reach the first portion through a passage formed by the multiple voids. The gas that reaches the first portion moves outside the external electrode through the gap between the edge of the plating layer and the element body, as described above. Therefore, one of the above aspects controls the position from which the gas is released. When electronic components are soldered to be mounted, there is a risk of solder explosion because there is more molten solder at the positions corresponding to the end faces than at the positions corresponding to the side faces. Solder explosion is a phenomenon in which molten solder is blown away by gas emitted from the external electrode when electronic components are soldered to be mounted to an electronic device. In the above-mentioned one aspect, since the gas generated in the second portion easily reaches the first portion as described above, the gas moves from the first portion through the gap to the outside of the external electrode, and therefore the above-mentioned one aspect suppresses the occurrence of solder explosion.

[0008] The maximum thickness of the first portion may be greater than the maximum thickness of the second portion. In this case, the number of gas movement paths in the first portion increases, making it easier for the gas to move through the first portion. Therefore, the gas is more likely to move out of the external electrode through the gap between the part of the plating layer located on the first portion and the element body. As a result, in this configuration, stress is less likely to act on the conductive resin layer, and this configuration further suppresses peeling of the conductive resin layer. This configuration further suppresses the occurrence of solder explosion.

[0009] In a cross section along the thickness direction of the first portion, the total area of ​​the voids in the first portion may be within a range of 5 to 35% of the area of ​​the first portion. In a cross section along the thickness direction of the first portion, if the total area of ​​the voids in the first portion is less than 5% of the area of ​​the first portion, the gas generated from moisture may have difficulty moving through the voids. In a cross section along the thickness direction of the first portion, if the total area of ​​the voids in the first portion is more than 35% of the area of ​​the first portion, moisture may easily penetrate into the conductive resin layer, and the amount of gas generated may increase. Therefore, this configuration suppresses the increase in the amount of gas generated while suppressing the obstruction of gas movement in the first portion.

[0010] The side surface may constitute a mounting surface. When an electronic component is solder-mounted to an electronic device, an external force acting on the electronic component from the electronic device may act as stress on the element body. The external force acts on the element body through the solder fillet formed during solder mounting and the external electrode. In this case, cracks may occur in the element body. The external force tends to act on the surface of the element body that constitutes the mounting surface, for example. In this configuration, since the first portion is located on the side that constitutes the mounting surface, external forces acting on the electronic component from the electronic device are less likely to act on the element body. If the proportion of voids in the first portion is greater than the proportion of voids in the second portion, the first portion is more likely to absorb external forces acting on the element body than the second portion. Therefore, this configuration reliably prevents cracks from occurring in the element body.

[0011] The conductive resin layer may be formed so as to continuously cover a part of the side surface and a part of the end surface, and the plating layer may be formed so as to cover the entire end surface. For example, external forces tend to act on the element body in an area defined by a part of the side surface and a part of the end surface. In this configuration, the conductive resin layer continuously covers a part of the side surface and a part of the end surface, so that the external force acting on the electronic component from the electronic device is unlikely to act on the element body. Therefore, this configuration suppresses the occurrence of cracks in the element body. Since the plating layer is formed so as to cover the entire end face, it is difficult for a gap to exist between the plating layer and the end face. Therefore, the gas generated in the second portion moves to the first portion and moves to the outside of the external electrode through the gap between the portion located on the first portion and the element body. As a result, this configuration reliably controls the position from which the gas is released and reliably suppresses the occurrence of solder explosions.

[0012] In a cross section along the thickness direction of the conductive resin layer, the maximum length of each of the plurality of voids may be within a range of 1 to 20 μm. If the maximum length of each of the multiple voids in the cross section along the thickness direction of the conductive resin layer is less than 1 μm, the gas generated from moisture may have difficulty moving through the voids. If the maximum length of each of the multiple voids in the cross section along the thickness direction of the conductive resin layer is greater than 20 μm, moisture may easily remain in the conductive resin layer, and the amount of gas generated may increase. Therefore, this configuration suppresses the increase in the amount of gas generated while suppressing the obstruction of gas movement in the conductive resin layer. Effect of the Invention

[0013] According to one aspect of the present invention, there is provided an electronic component that suppresses peeling of a conductive resin layer. [Brief description of the drawings]

[0014] [Figure 1] 1 is a perspective view of a multilayer capacitor in accordance with an embodiment; [Diagram 2] 1 is a side view of the multilayer capacitor in accordance with an embodiment of the present invention; [Diagram 3] 1 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to an embodiment of the present invention; [Figure 4] 1 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to an embodiment of the present invention; [Diagram 5] 1 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to an embodiment of the present invention; [Figure 6] FIG. 4 is a diagram showing a cross-sectional configuration of an external electrode. [Figure 7] FIG. 4 is a diagram showing a cross-sectional configuration of an external electrode. [Figure 8] 2 is a plan view showing the element body, a first electrode layer, and a second electrode layer. FIG. [Figure 9] 2 is a side view showing the element body, the first electrode layer, and the second electrode layer. FIG. [Figure 10] 2 is an end view showing the element body, a first electrode layer, and a second electrode layer. FIG. [Figure 11] FIG. 11 is a perspective view of a multilayer capacitor according to a modified example of the present embodiment. [Figure 12] FIG. 13 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the present embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the present embodiment. [Figure 14] FIG. 4 is a diagram showing a cross-sectional configuration of an external electrode. [Figure 15] FIG. 4 is a diagram showing a cross-sectional configuration of an external electrode. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0016] The configuration of the multilayer capacitor C1 in accordance with this embodiment will be described with reference to Figs. 1 to 10. Fig. 1 is a perspective view of the multilayer capacitor in accordance with this embodiment. Fig. 2 is a side view of the multilayer capacitor in accordance with this embodiment. Figs. 3, 4, and 5 are views showing cross-sectional configurations of the multilayer capacitor in accordance with this embodiment. Figs. 6 and 7 are views showing cross-sectional configurations of external electrodes. Fig. 8 is a plan view showing the element body, the first electrode layer, and the second electrode layer. Fig. 9 is a side view showing the element body, the first electrode layer, and the second electrode layer. Fig. 10 is an end view showing the element body, the first electrode layer, and the second electrode layer. In this embodiment, the electronic component is, for example, a multilayer capacitor C1.

[0017] 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. In this embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0018] The element body 3 has a pair of main surfaces 3a, 3b facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of main surfaces 3a, 3b, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular. The direction in which the pair of main surfaces 3a, 3b face each other is a first direction D1. The direction in which the pair of side surfaces 3c face each other is a second direction D2. The direction in which the pair of end surfaces 3e face each other is a third direction D3. The multilayer capacitor C1 is solder mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the main surface 3a faces the electronic device. The main surface 3a is arranged to form a mounting surface. The main surface 3a is the mounting surface. The main surface 3a is also one of the side surfaces of the element body 3 having a rectangular parallelepiped shape.

[0019] The first direction D1 is a direction perpendicular to each of the main faces 3a, 3b and perpendicular to the second direction D2. The third direction D3 is a direction parallel to each of the main faces 3a, 3b and each of the side faces 3c and perpendicular to the first direction D1 and the second direction D2. The second direction D2 is a direction perpendicular to each of the side faces 3c, and the third direction D3 is a direction perpendicular to each of the end faces 3e. In this embodiment, the length of the element body 3 in the second direction D2 is greater than the length of the element body 3 in the first direction D1. The length of the element body 3 in the third direction D3 is greater than the length of the element body 3 in the first direction D1 and is greater than the length of the element body 3 in the second direction D2. The third direction D3 is the longitudinal direction of the element body 3.

[0020] The pair of side surfaces 3c extend in the first direction D1 to connect the pair of main surfaces 3a, 3b. The pair of side surfaces 3c also extend in the third direction D3. The pair of end surfaces 3e extend in the first direction D1 to connect the pair of main surfaces 3a, 3b. The pair of end surfaces 3e also extend in the second direction D2.

[0021] The element body 3 has a pair of ridges 3g, a pair of ridges 3h, four ridges 3i, a pair of ridges 3j, and a pair of ridges 3k. The ridges 3g are located between the end face 3e and the main face 3a. The ridges 3h are located between the end face 3e and the main face 3b. The ridges 3i are located between the end face 3e and the side face 3c. The ridges 3j are located between the main face 3a and the side face 3c. The ridges 3k are located between the main face 3b and the side face 3c. In this embodiment, the ridges 3g, 3h, 3i, 3j, and 3k are rounded so as to be curved. The element body 3 is subjected to a so-called R chamfering process.

[0022] The end face 3e and the main face 3a are indirectly adjacent to each other via a ridge line 3g. The end face 3e and the main face 3b are indirectly adjacent to each other via a ridge line 3h. The end face 3e and the side face 3c are indirectly adjacent to each other via a ridge line 3i. The main face 3a and the side face 3c are indirectly adjacent to each other via a ridge line 3j. The main face 3b and the side face 3c are indirectly adjacent to each other via a ridge line 3k.

[0023] The element body 3 is configured by stacking a plurality of dielectric layers in the second direction D2. The element body 3 has a plurality of stacked dielectric layers. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible. In the element body 3, the stacking direction of the plurality of dielectric layers may coincide with the first direction D1.

[0024] As shown in Figs. 3 to 5, the multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed within the element body 3. Each of the internal electrodes 7, 9 is made of a conductive material that is typically used as an internal electrode for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

[0025] The internal electrodes 7 and 9 are arranged at different positions (layers) in the second direction D2. The internal electrodes 7 and 9 are arranged alternately in the element body 3 so as to face each other at an interval in the second direction D2. The internal electrodes 7 and 9 have mutually different polarities. When the stacking direction of the multiple dielectric layers is the first direction D1, the internal electrodes 7 and 9 are arranged at different positions (layers) in the first direction D1. One end of the internal electrodes 7, 9 is exposed at the corresponding end face 3e. The internal electrodes 7, 9 have one end exposed at the corresponding end face 3e.

[0026] The multiple internal electrodes 7 and the multiple internal electrodes 9 are alternately arranged in the second direction D2. Each of the internal electrodes 7, 9 is located in a plane substantially parallel to the side surface 3c. The internal electrodes 7 and the internal electrodes 9 face each other in the second direction D2. The direction in which the internal electrodes 7 and the internal electrodes 9 face each other (the second direction D2) is perpendicular to the directions parallel to the side surface 3c (the first direction D1 and the third direction D3). When the lamination direction of the multiple dielectric layers is the first direction D1, the multiple internal electrodes 7 and the multiple internal electrodes 9 are alternately arranged in the first direction D1. In this case, each of the internal electrodes 7, 9 is located in a plane substantially parallel to each of the main surfaces 3a, 3b. The internal electrodes 7 and the internal electrodes 9 face each other in the first direction D1.

[0027] As shown in FIG. 1, the external electrodes 5 are disposed on both ends of the element body 3 in the third direction D3. Each external electrode 5 is disposed on the corresponding end face 3e side of the element body 3. The external electrodes 5 are disposed at least on the main face 3a and the end face 3e adjacent to each other. As shown in FIGS. 2 to 5, the external electrode 5 has a plurality of electrode portions 5a, 5b, 5c, 5e. The electrode portion 5a is disposed on the main face 3a and the ridge portion 3g. The electrode portion 5b is disposed on the ridge portion 3h. Each electrode portion 5c is disposed on the side face 3c and the ridge portion 3i. The electrode portion 5e is disposed on the end face 3e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3j. The external electrode 5 is disposed at least on the end face 3e.

[0028] The external electrode 5 is formed on four surfaces, namely, one main surface 3a, one end surface 3e, and a pair of side surfaces 3c, as well as on the ridges 3g, 3h, 3i, and 3j. The electrode portions 5a, 5b, 5c, and 5e adjacent to each other are connected and electrically connected. The electrode portion 5e covers one end of the corresponding internal electrode 7, 9 in its entirety. The electrode portion 5e is directly connected to the corresponding internal electrode 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrode 7, 9. As shown in FIGS. 3 to 5, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5c, and 5e has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 5b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4.

[0029] The first electrode layer E1 of the electrode portion 5a is disposed on the ridge portion 3g, but is not disposed on the main surface 3a. The first electrode layer E1 of the electrode portion 5a is formed so as to cover the entire ridge portion 3g. The first electrode layer E1 is not formed on the main surface 3a. The first electrode layer E1 of the electrode portion 5a is in contact with the entire ridge portion 3g. The main surface 3a is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5a may be disposed on the main surface 3a. In this case, the first electrode layer E1 of the electrode portion 5a is formed so as to cover a part of the main surface 3a and the entire ridge portion 3g. That is, the first electrode layer E1 of the electrode portion 5a is also in contact with a part of the main surface 3a. The part of the main surface 3a is, for example, a part of the main surface 3a near the end surface 3e.

[0030] The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and the main surface 3a. In the electrode portion 5a, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5a, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 is in contact with a part of the main surface 3a. The part of the main surface 3a is, for example, a part of the main surface 3a near the end surface 3e. The second electrode layer E2 of the electrode portion 5a has a part E21 located on the main surface 3a. The electrode portion 5a has a four-layer structure on the ridge portion 3g and a three-layer structure on the main surface 3a. The second electrode layer E2 of the electrode portion 5a is formed so as to cover the entire ridge portion 3g and a part of the main surface 3a. As described above, the part of the main surface 3a is, for example, a part of the main surface 3a near the end surface 3e. The second electrode layer E2 of the electrode portion 5a indirectly covers the entire ridge portion 3g and a part of the main surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5a directly covers a part of the main surface 3a. The second electrode layer E2 of the electrode portion 5a directly covers the entire first electrode layer E1 formed on the ridge portion 3g. When the first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a, the electrode portion 5a has a four-layer structure on the main surface 3a and the ridge portion 3g. When the first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a, the portion E21 of the second electrode layer E2 includes a portion in contact with the main surface 3a and a portion in contact with the first electrode layer E1.

[0031] The first electrode layer E1 of the electrode portion 5b is disposed on the ridge portion 3h, but is not disposed on the main surface 3b. The first electrode layer E1 of the electrode portion 5b is formed so as to cover the entire ridge portion 3h. The first electrode layer E1 is not formed on the main surface 3b. The first electrode layer E1 of the electrode portion 5b is in contact with the entire ridge portion 3h. The main surface 3b is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5b may be disposed on the main surface 3b. In this case, the first electrode layer E1 of the electrode portion 5b is formed so as to cover a part of the main surface 3b and the entire ridge portion 3h. That is, the first electrode layer E1 of the electrode portion 5b is also in contact with a part of the main surface 3b. The part of the main surface 3b is, for example, a part of the main surface 3b near the end surface 3e. The electrode portion 5b does not have a second electrode layer E2. The principal surface 3b is not covered with the second electrode layer E2 and is exposed from the second electrode layer E2. The second electrode layer E2 is not formed on the principal surface 3b. The electrode portion 5b has a three-layer structure.

[0032] The first electrode layer E1 of the electrode portion 5c is disposed on the ridge portion 3i, but not on the side surface 3c. The first electrode layer E1 of the electrode portion 5c is formed so as to cover the entire ridge portion 3i. The first electrode layer E1 is not formed on the side surface 3c. The first electrode layer E1 of the electrode portion 5c is in contact with the entire ridge portion 3i. The side surface 3c is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5c may be disposed on the side surface 3c. In this case, the first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3g. That is, the first electrode layer E1 of the electrode portion 5c is also in contact with a part of the side surface 3c. The part of the side surface 3c is, for example, a part of the side surface 3c near the end face 3e.

[0033] The second electrode layer E2 of the electrode unit 5c is disposed on the first electrode layer E1 and the side surface 3c. A portion of the first electrode layer E1 is covered with the second electrode layer E2. In the electrode unit 5c, the second electrode layer E2 is in contact with a portion of the side surface 3c and a portion of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5c has a portion E22 located on the side surface 3c. The second electrode layer E2 of the electrode unit 5c is formed so as to cover a portion of the ridge line portion 3i and a portion of the side surface 3c. The portion of the ridge line portion 3i is, for example, a portion of the region of the ridge line portion 3i closer to the main surface 3a. The portion of the side surface 3c is, for example, a corner region of the side surface 3c closer to the main surface 3a and the end surface 3e. The second electrode layer E2 of the electrode unit 5c indirectly covers a portion of the ridge line portion 3i so that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5c directly covers a part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c directly covers a part of the portion of the first electrode layer E1 that is formed on the ridge portion 3i. When the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c, the portion E22 of the second electrode layer E2 includes a portion in contact with the side surface 3c and a portion in contact with the first electrode layer E1.

[0034] The electrode portion 5c has a plurality of regions 5c1 and 5c2. In this embodiment, the electrode portion 5c has only two regions 5c1 and 5c2. The region 5c2 is located closer to the main surface 3a than the region 5c1. The region 5c1 has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The region 5c1 does not have a second electrode layer E2. The region 5c1 has a three-layer structure. The region 5c2 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The region 5c2 has a four-layer structure on the ridge portion 3i and a three-layer structure on the side surface 3c. The region 5c1 is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5c2 is a region where the first electrode layer E1 is covered with the second electrode layer E2. The region 5c2 has a portion E22.

[0035] The first electrode layer E1 of the electrode unit 5e is disposed on the end surface 3e. The entire end surface 3e is covered by the first electrode layer E1. The first electrode layer E1 of the electrode unit 5e is in contact with the entire end surface 3e. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. A part of the first electrode layer E1 is covered by the second electrode layer E2. In the electrode unit 5e, the second electrode layer E2 is in contact with a part of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5e has a part E23 located on the end surface 3e. The second electrode layer E2 of the electrode unit 5e is formed so as to cover a part of the end surface 3e. The part of the end surface 3e is, for example, a part of the area of ​​the end surface 3e near the main surface 3a. The second electrode layer E2 of the electrode unit 5e indirectly covers a part of the end surface 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5e directly covers a part of the portion of the first electrode layer E1 formed on the end surface 3e. In the electrode portion 5e, the first electrode layer E1 is formed on the end surface 3e so as to be connected to one end of the corresponding internal electrode 7, 9.

[0036] The electrode portion 5e has a plurality of regions 5e1 and 5e2. In this embodiment, the electrode portion 5e has only two regions 5e1 and 5e2. The region 5e2 is located closer to the main surface 3a than the region 5e1. The region 5e1 has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The region 5e1 does not have a second electrode layer E2. The region 5e1 has a three-layer structure. The region 5e2 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. In the electrode portion 5e, the third electrode layer E3 and the fourth electrode layer E4 are formed so as to cover the entire end surface 3e when viewed from the third direction D3. In this embodiment, the third electrode layer E3 and the fourth electrode layer E4 indirectly cover the entire end surface 3e. The region 5e2 has a four-layer structure. The region 5e1 is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5e2 is a region where the first electrode layer E1 is covered with the second electrode layer E2. The region 5e2 has a portion E23.

[0037] As shown in Fig. 6, the maximum thickness T1 of the portion E21 of the second electrode layer E2 is larger than the maximum thickness T2 of the portion E22 of the second electrode layer E2. The area of ​​the portion E21 of the second electrode layer E2 is larger than the area of ​​the portion E22 of the second electrode layer E2. As shown in Fig. 7, the maximum thickness T1 of the second electrode layer E2 is larger than the maximum thickness T3 of the portion E23 of the second electrode layer E2. For example, when the portion E21 of the second electrode layer E2 constitutes the first portion, the portion E23 of the second electrode layer E2 constitutes the second portion. In Figs. 6 and 7, the internal electrodes 7 and 9 are omitted from illustration.

[0038] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the end face 3e and the ridges 3g, 3h, and 3i. The first electrode layer E1 is formed by sintering a metal component (metal powder) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. The first electrode layer E1 is not intentionally formed on the pair of main surfaces 3a and 3b and the pair of side surfaces 3c. For example, due to a manufacturing error, the first electrode layer E1 may be unintentionally formed on the main surfaces 3a and 3b and the side surfaces 3c. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, a powder made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 of each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.

[0039] The second electrode layer E2 is formed by curing a conductive resin applied onto the first electrode layer E1, the main surface 3a, and the pair of side surfaces 3c. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, a metal powder. The metal powder is, for example, an Ag powder or a Cu powder. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin.

[0040] In this embodiment, the second electrode layer E2 covers a part of the first electrode layer E1. The part of the first electrode layer E1 is, for example, a region in the first electrode layer E1 that corresponds to the electrode portion 5a, the region 5c2 of the electrode portion 5c, and the region 5e2 of the electrode portion 5e. The second electrode layer E2 directly covers a part of the ridge portion 3j. The part of the ridge portion 3j is, for example, a part of the ridge portion 3j closer to the end face 3e. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 of each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.

[0041] The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. In this embodiment, the third electrode layer E3 is formed on the second electrode layer E2 by Ni plating. The third electrode layer E3 is a Ni plating layer. The third electrode layer E3 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. The third electrode layer E3 contains Ni, Sn, Cu, or Au. The Ni plating layer has better solder leach resistance than the metal contained in the second electrode layer E2.

[0042] The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 is a solder plating layer. In this embodiment, the fourth electrode layer E4 is formed on the third electrode layer E3 by Sn plating. The fourth electrode layer E4 is a Sn plating layer. The fourth electrode layer E4 may be a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The fourth electrode layer E4 contains Sn, a Sn-Ag alloy, a Sn-Bi alloy, or a Sn-Cu alloy.

[0043] The third electrode layer E3 and the fourth electrode layer E4 constitute a plating layer PL formed on the second electrode layer E2. In this embodiment, the plating layer PL formed on the second electrode layer E2 has a two-layer structure. The third electrode layer E3 is an intermediate plating layer located between the fourth electrode layer E4 constituting the outermost layer and the second electrode layer E2. The third electrode layer E3 of each electrode portion 5a, 5b, 5c, 5e is integrally formed. The fourth electrode layer E4 of each electrode portion 5a, 5b, 5c, 5e is integrally formed.

[0044] The first electrode layer E1 (the first electrode layer E1 of the electrode portion 5e) is formed on the end surface 3e so as to be connected to the corresponding internal electrodes 7 and 9. The first electrode layer E1 covers the entire end surface 3e, the entire ridge portion 3g, the entire ridge portion 3h, and the entire ridge portion 3i. The second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, and 5e) continuously covers a part of the main surface 3a, a part of the end surface 3e, and each part of the pair of side surfaces 3c. The second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, and 5e) covers the entire ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3j. The second electrode layer E2 has a plurality of parts corresponding to a part of the main surface 3a, a part of the end surface 3e, each part of the pair of side surfaces 3c, the entire ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3j, respectively. The first electrode layer E1 (the first electrode layer E1 of the electrode portion 5e) is directly connected to the corresponding internal electrodes 7, 9.

[0045] The first electrode layer E1 (the first electrode layer E1 of the electrode portions 5a, 5b, 5c, 5e) has a region covered with the second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5e) and a region not covered with the second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5e). The region not covered with the second electrode layer E2 is a region exposed from the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 cover the region of the first electrode layer E1 not covered with the second electrode layer E2 and the second electrode layer E2.

[0046] 8, when viewed from the first direction D1, the first electrode layer E1 (the first electrode layer E1 of the electrode portion 5a) is entirely covered with the second electrode layer E2. When viewed from the first direction D1, the first electrode layer E1 (the first electrode layer E1 of the electrode portion 5a) is not exposed from the second electrode layer E2.

[0047] As shown in FIG. 9, when viewed from the second direction D2, an end region of the first electrode layer E1 close to the principal surface 3a is covered with the second electrode layer E2. The end region of the first electrode layer E1 close to the principal surface 3a includes the first electrode layer E1 of the region 5c2. When viewed from the second direction D2, an edge E2e of the second electrode layer E2 intersects with an edge E1e of the first electrode layer E1. When viewed from the second direction D2, an end region of the first electrode layer E1 close to the principal surface 3b is exposed from the second electrode layer E2. The end region of the first electrode layer E1 close to the principal surface 3b includes the first electrode layer E1 of the region 5c1.

[0048] As shown in FIG. 10, when viewed from the third direction D3, an end region of the first electrode layer E1 close to the principal surface 3a is covered with the second electrode layer E2. The end region of the first electrode layer E1 close to the principal surface 3a includes the first electrode layer E1 of the region 5e2. When viewed from the third direction D3, an edge E2e of the second electrode layer E2 is located on the first electrode layer E1. When viewed from the third direction D3, an end region of the first electrode layer E1 close to the principal surface 3b is exposed from the second electrode layer E2. The end region of the first electrode layer E1 close to the principal surface 3b includes the first electrode layer E1 of the region 5e1.

[0049] In this embodiment, the second electrode layer E2 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c. The second electrode layer E2 covers the entire ridge line portion 3g, only a portion of the ridge line portion 3i, and only a portion of the ridge line portion 3j. A portion of the portion of the first electrode layer E1 covering the ridge line portion 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 in the region 5c1 is exposed from the second electrode layer E2.

[0050] As shown in Figs. 3 to 7, the second electrode layer E2 has a plurality of voids 13. The plurality of voids 13 are dispersed in the second electrode layer E2. Some of the plurality of voids 13 communicate with each other. The voids 13 that communicate with each other form at least one passage. The passage formed by the voids 13 that communicate with each other opens to the surface of the second electrode layer E2. In a cross section along the thickness direction of the second electrode layer E2, the maximum length of the voids 13 is within a range of 1 to 20 µm. In this embodiment, the maximum length of the voids 13 is 20 µm.

[0051] As described above, the plating layer PL includes the third electrode layer E3 and the fourth electrode layer E4. The plating layer PL has a portion PL1 located on the portion E21, a portion PL2 located on the portion E22, and a portion PL3 located on the portion E23. The portion PL1 has an edge PL1e. The portion PL2 has an edge PL2e. In this embodiment, the entire end face 3e is covered with the external electrode 5, so the portion PL3 does not have an edge. The plating layer PL (the third electrode layer E3 and the fourth electrode layer E4) is separated from the element body 3. As shown in FIG. 7, a gap 17 exists between the edge PL1e and the element body 3 (main surface 3a). As shown in FIG. 6, a gap 19 exists between the edge PL2e and the element body 3 (side surface 3c). The width of the gaps 17 and 19 is, for example, greater than 0 and equal to or less than 3 μm. The width of the gap 17 and the width of the gap 19 may be the same. The width of gap 17 and the width of gap 19 may be different.

[0052] As described above, the second electrode layer E2 has the portion E21, the portion E22, and the portion E23. The proportion of the voids 13 in the portion E21 of the second electrode layer E2 is greater than the proportion of the voids 13 in the portion E22 of the second electrode layer E2. The proportion of the voids 13 in the portion E21 of the second electrode layer E2 is greater than the proportion of the voids 13 in the portion E23 of the second electrode layer E2. The proportion of the voids 13 is the proportion of the total area of ​​the voids 13 to the area of ​​the second electrode layer E2 in a cross section along the thickness direction of the second electrode layer E2. In this embodiment, the thickness direction of the second electrode layer E2 coincides with the direction perpendicular to the main surface 3a in the portion E21, coincides with the direction perpendicular to the side surface 3c in the portion E22, and coincides with the direction perpendicular to the end surface 3e in the portion E23. That is, the thickness direction of the second electrode layer E2 coincides with the first direction D1 in the portion E21, coincides with the second direction D2 in the portion E22, and coincides with the third direction D3 in the portion E23.

[0053] The proportion of voids 13 in portion E21 of the second electrode layer E2 is, for example, a value expressed as a percentage obtained by dividing the total area of ​​voids 13 present in portion E21 by the area of ​​portion E21 in a cross section along the thickness direction of the second electrode layer E2 (portion E21). The proportion of voids 13 present in portion E21 is within a range of 5 to 35%. In this embodiment, the total area of ​​voids 13 present in portion E21 is 1250 to 21000 μm 2 The area of ​​the portion E21 is 0.025 to 0.060 mm 2 For example, the total area of ​​the voids 13 in the portion E21 is 9000 μm 2 and the area of ​​the portion E21 is 0.045 mm 2 In this case, the proportion of voids 13 in portion E21 is 20%. The area of ​​portion E21 is the area of ​​a region in portion E21 that is defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2. The area of ​​portion E21 includes the total area of ​​voids 13 present in portion E21.

[0054] The proportion of voids 13 in portion E22 of the second electrode layer E2 is, for example, a value expressed as a percentage obtained by dividing the total area of ​​voids 13 present in portion E22 by the area of ​​portion E22 in a cross section along the thickness direction of the second electrode layer E2 (portion E22). The proportion of voids 13 present in portion E22 is within a range of 5 to 35%. In this embodiment, the total area of ​​voids 13 present in portion E22 is 1000 to 16800 μm 2 The area of ​​the portion E22 is 0.02 to 0.048 mm 2 For example, the total area of ​​the voids 13 in the portion E22 is 2800 μm 2 and the area of ​​the part E22 is 0.028 mm 2 In this case, the proportion of voids 13 in portion E22 is 10%. The area of ​​portion E22 is the area of ​​a region in portion E22 that is defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2. The area of ​​portion E22 includes the total area of ​​voids 13 present in portion E22.

[0055] The proportion of voids 13 in portion E23 of the second electrode layer E2 is, for example, a value expressed as a percentage obtained by dividing the total area of ​​voids 13 present in portion E23 by the area of ​​portion E23 in a cross section along the thickness direction of the second electrode layer E2 (portion E23). The proportion of voids 13 present in portion E23 is within a range of 5 to 35%. In this embodiment, the total area of ​​voids 13 present in portion E23 is 1000 to 16800 μm 2 The area of ​​the portion E23 is 0.02 to 0.048 mm 2 For example, the total area of ​​the voids 13 in the portion E23 is 2800 μm 2 and the area of ​​the portion E23 is 0.028 mm 2 In this case, the proportion of voids 13 in portion E23 is 10%. The area of ​​portion E23 is the area of ​​a region in portion E23 that is defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2. The area of ​​portion E23 includes the total area of ​​voids 13 present in portion E23.

[0056] The maximum length of the gap 13 can be determined, for example, as follows.

[0057] A cross-sectional photograph of the external electrode 5 is obtained. The cross-sectional photograph is, for example, a photograph of a cross section of the electrode portion 5a cut along a plane perpendicular to the main surface 3a. The cross-sectional photograph is, for example, a photograph of a cross section of the electrode portion 5a cut along a plane that is parallel to a pair of opposing surfaces (for example, a pair of side surfaces 3c) and is equidistant from the pair of surfaces. The obtained cross-sectional photograph is subjected to image processing using software to determine the boundaries of the gaps 13 and to determine the maximum length of the gaps 13. The maximum lengths of a plurality of gaps 13 may be obtained, and the average value of the maximum lengths of the plurality of gaps 13 may be calculated. In this case, the average value is regarded as the maximum length of the gap 13.

[0058] The total area of ​​the gaps 13 in each of the portions E21, E22, and E23 can be determined, for example, as follows. A cross-sectional photograph of the external electrode 5 (electrode portion 5a and electrode portion 5e) is obtained. The cross-sectional photograph is, for example, a photograph taken of a cross section of the external electrode 5 cut along a plane perpendicular to the main surface 3a and the end surface 3e. The cross-sectional photograph is, for example, a photograph taken of a cross section of the external electrode 5 cut along a plane parallel to the pair of side surfaces 3c and equidistant from the pair of side surfaces 3c. The obtained cross-sectional photograph is subjected to image processing using software to determine the boundaries of the voids 13 and to determine the total area of ​​the voids 13 present in portion E21 and the total area of ​​the voids 13 present in portion E23. A cross-sectional photograph of the external electrode 5 (electrode portion 5c) is obtained. The cross-sectional photograph is, for example, a photograph taken of a cross section of the external electrode 5 cut along a plane perpendicular to the side surface 3c. The cross-sectional photograph is, for example, a photograph taken of a cross section of the external electrode 5 cut along a plane parallel to the pair of principal surfaces 3a, 3b and equidistant from the pair of principal surfaces 3a, 3b. The obtained cross-sectional photograph is subjected to image processing using software to determine the boundaries of the voids 13 and to determine the total area of ​​the voids 13 present in portion E22.

[0059] The area of ​​the second electrode layer E2 in each of the portions E21, E22, and E23 can be determined, for example, as follows. A cross-sectional photograph of the external electrode 5 (electrode portion 5a and electrode portion 5e) is obtained. As described above, the cross-sectional photograph is a photograph taken of a cross section when the external electrode 5 is cut along a plane perpendicular to the main surface 3a and the end surface 3e. The obtained cross-sectional photograph is subjected to image processing using software to distinguish the surface of the first electrode layer E1 (the boundary between the first electrode layer E1 and the second electrode layer E2) and the surface of the second electrode layer E2 (the boundary between the second electrode layer E2 and the third electrode layer E3), and the area of ​​the second electrode layer E2 at the portion E21 and the area of ​​the second electrode layer E2 at the portion E23 are obtained. A cross-sectional photograph of the external electrode 5 (electrode portion 5c) is obtained. As described above, the cross-sectional photograph is a photograph taken of a cross section when the external electrode 5 is cut along a plane perpendicular to the side surface 3c. The obtained cross-sectional photograph is subjected to image processing using software to distinguish between the surface of the first electrode layer E1 (the boundary between the first electrode layer E1 and the second electrode layer E2) and the surface of the second electrode layer E2 (the boundary between the second electrode layer E2 and the third electrode layer E3), and the area of ​​the second electrode layer E2 at the portion E22 is calculated.

[0060] As described above, in this embodiment, even if moisture absorbed in the resin contained in the second electrode layer E2 is gasified when the multilayer capacitor C1 is solder-mounted, the gas generated from the moisture reaches the gaps 17 and 19 from the multiple voids 13. The gas that reaches the gaps 17 and 19 moves to the outside of the external electrode 5, making it difficult for stress to act on the second electrode layer E2. As a result, the multilayer capacitor C1 suppresses peeling of the second electrode layer E2. In the multilayer capacitor C1, the proportion of voids 13 in the portion E21 of the second electrode layer E2 is greater than the proportion of voids 13 in the portion E23 of the second electrode layer E2. Therefore, gas generated from moisture in the second electrode layer E2 easily moves to the outside of the external electrode 5 through the gap 17 between the edge PL1e and the element body 3. Gas generated in the portion E23 easily reaches the portion E21 through a passage formed by the multiple voids 13. The gas that reaches the portion E21 moves to the outside of the external electrode 5 through the gap 17 between the edge PL1e and the element body 3, as described above. Therefore, the multilayer capacitor C1 controls the position from which the gas comes out. In the multilayer capacitor C1, the proportion of voids 13 in portion E22 of the second electrode layer E2 is smaller than the proportion of voids 13 in portion E21 of the second electrode layer E2. Therefore, gas generated from moisture in the second electrode layer E2 is unlikely to move from the gap 19 between the edge PL2e and the element body 3. Therefore, the multilayer capacitor C1 reliably controls the position from which the gas escapes.

[0061] When the multilayer capacitor C1 is solder-mounted, there is a risk of solder explosion because there is more molten solder at the position corresponding to the end face 3e than at the position corresponding to the main face 3a. Solder explosion is a phenomenon in which molten solder is blown away by gas emitted from the external electrode 5 when the multilayer capacitor C1 is solder-mounted on an electronic device. In the multilayer capacitor C1, the gas generated in the portion E23 easily reaches the portion E21 as described above. Therefore, the gas generated in the portion E23 moves from the portion E21 through the gap 17 to the outside of the external electrode 5. As a result, the multilayer capacitor C1 suppresses the occurrence of solder explosion. The gas generated in the second electrode layer E2 of the electrode member 5c easily reaches the second electrode layer E2 of the electrode member 5a through the passage formed by the plurality of gaps 13. The gas that reaches the second electrode layer E2 of the electrode member 5a moves to the outside of the external electrode 5 through the gaps 17, as described above.

[0062] In the multilayer capacitor C1, the maximum thickness T1 of the portion E21 is greater than the maximum thickness T3 of the portion E23. Therefore, the number of gas movement paths in the portion E21 increases, making it easier for the gas to move through the portion E21. The gas is more likely to move through the gap 17 to the outside of the external electrode 5. As a result, in the multilayer capacitor C1, stress is less likely to act on the second electrode layer E2, and the multilayer capacitor C1 is more likely to suppress peeling of the second electrode layer E2. In the multilayer capacitor C1, the maximum thickness T1 of the portion E21 is greater than the maximum thickness T2 of the portion E22. Therefore, the number of gas movement paths in the portion E21 increases, making it easier for the gas to move through the portion E21. The gas is more likely to move through the gap 17 to the outside of the external electrode 5. As a result, in the multilayer capacitor C1, stress is less likely to act on the second electrode layer E2, and the multilayer capacitor C1 is more likely to prevent peeling of the second electrode layer E2.

[0063] In the multilayer capacitor C1, in a cross section along the thickness direction of the portion E21 of the second electrode layer E2, the total area of ​​the voids 13 in the portion E21 is within a range of 5 to 35% of the area of ​​the portion E21. If the total area of ​​the voids 13 in the portion E21 in a cross section along the thickness direction of the portion E21 is smaller than 5% of the area of ​​the portion E21, gas generated from moisture may have difficulty moving within the voids 13. If the total area of ​​the voids 13 in the portion E21 in a cross section along the thickness direction of the portion E21 is larger than 35% of the area of ​​the portion E21, moisture may easily penetrate into the second electrode layer E2, and the amount of gas generated may increase. Therefore, the multilayer capacitor C1 suppresses the increase in the amount of gas generated while suppressing the obstruction of gas movement in the portion E21.

[0064] In the multilayer capacitor C1, the main surface 3a forms a mounting surface. When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act as stress on the element body 3. The external force acts on the element body 3 through the solder fillets formed during solder mounting and the external electrodes 5. In this case, cracks may occur in the element body 3. The external force tends to act on the main surface 3a, for example. In the multilayer capacitor C1, since the portion E21 is located on the main surface 3a, the external force acting on the multilayer capacitor C1 from an electronic device is less likely to act on the element body 3. If the proportion of voids present in the portion E21 is greater than the proportion of voids present in the portion E23, the portion E21 is more likely to mitigate the external force acting on the element body 3 than the portion E23. Therefore, the multilayer capacitor C1 reliably suppresses the occurrence of cracks in the element body 3.

[0065] In the multilayer capacitor C1, the second electrode layer E2 is formed so as to continuously cover a part of the main surface 3a, a part of each side surface 3c, and a part of the end surface 3e. The plating layer PL (the third electrode layer E3 and the fourth electrode layer E4) is formed so as to cover the entire end surface 3e. For example, the external force tends to act on a region of the element body 3 defined by a part of the main surface 3a, a part of each side surface 3c, and a part of the end surface 3e. In the multilayer capacitor C1, the second electrode layer E2 continuously covers a part of the main surface 3a, a part of each side surface 3c, and a part of the end surface 3e, so that the external force acting on the multilayer capacitor C1 from the electronic device is unlikely to act on the element body 3. Therefore, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3. Since the plating layer PL is formed so as to cover the entire end face 3e, it is difficult for a gap to exist between the plating layer PL and the end face 3e. Therefore, the gas generated in the portion E23 of the second electrode layer E2 moves to the portion E21, and moves to the outside of the external electrode 5 through the gap 17. As a result, the multilayer capacitor C1 more reliably controls the position from which the gas is released, and reliably suppresses the occurrence of solder explosions.

[0066] In the multilayer capacitor C1, the maximum length of each of the plurality of voids 13 is within a range of 1 to 20 μm in a cross section along the thickness direction of the second electrode layer E2. If the maximum length of each of the plurality of voids 13 is smaller than 1 μm in a cross section along the thickness direction of the second electrode layer E2, the gas generated from moisture may have difficulty moving within the voids 13. If the maximum length of each of the plurality of voids 13 is larger than 20 μm in a cross section along the thickness direction of the second electrode layer E2, moisture may easily remain in the second electrode layer E2, and the amount of gas generated may increase. Therefore, the multilayer capacitor C1 reliably suppresses the increase in the amount of gas generated while reliably suppressing the obstruction of gas movement in the second electrode layer E2.

[0067] Next, the structure of a multilayer capacitor C2 according to a modified example of this embodiment will be described with reference to Figs. 11 to 15. Fig. 11 is a perspective view of the multilayer capacitor according to this modified example. Figs. 12 and 13 are views showing a cross-sectional structure of the multilayer capacitor according to this modified example. Figs. 14 and 15 are views showing a cross-sectional structure of an external electrode. The multilayer capacitor C2 is generally similar to or the same as the above-mentioned multilayer capacitor C1, but this modified example differs from the above-mentioned embodiment in terms of the structure of the external electrode 5. The following mainly describes the differences between the above-mentioned embodiment and this modified example.

[0068] As shown in Figs. 11 to 13, the multilayer capacitor C2 includes an element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9, similar to the multilayer capacitor C1. In the multilayer capacitor C2, one of the pair of main surfaces 3a, 3b and the pair of side surfaces 3c faces an electronic device. For example, in the multilayer capacitor C2, the side surface 3c is disposed so as to form a mounting surface. In this case, the side surface 3c is the mounting surface. The main surfaces 3a and 3b are also side surfaces of the element body 3 having a rectangular parallelepiped shape. The external electrodes 5 are formed on five surfaces, the pair of main surfaces 3a, 3b, one end surface 3e, and the pair of side surfaces 3c, as well as on the ridge portions 3g, 3h, 3i, and 3j. Each of the electrode portions 5a, 5b, 5c, and 5e includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4.

[0069] The first electrode layer E1 of the electrode portion 5a is disposed on the ridge portion 3g, and is not disposed on the main surface 3a. The first electrode layer E1 of the electrode portion 5a is formed so as to cover the entire ridge portion 3g. The first electrode layer E1 is not formed on the main surface 3a. The first electrode layer E1 of the electrode portion 5a is in contact with the entire ridge portion 3g. The main surface 3a is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. In this modified example, the first electrode layer E1 of the electrode portion 5a may also be disposed on the main surface 3a.

[0070] The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and the main surface 3a. In the electrode portion 5a, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5a, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 is in contact with a part of the main surface 3a. The part of the main surface 3a is, for example, a part of the main surface 3a near the end surface 3e. The electrode portion 5a has a four-layer structure on the ridge portion 3g and a three-layer structure on the main surface 3a. The second electrode layer E2 of the electrode portion 5a is formed so as to cover the entire ridge portion 3g and a part of the main surface 3a. As described above, the part of the main surface 3a is, for example, a part of the main surface 3a near the end surface 3e. The second electrode layer E2 of the electrode portion 5a indirectly covers the entire ridge portion 3g and a part of the main surface 3a such that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5a directly covers a part of the main surface 3a. The second electrode layer E2 of the electrode portion 5a directly covers the entire first electrode layer E1 formed on the ridge portion 3g. When the first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a, as described above, the electrode portion 5a has a four-layer structure on the main surface 3a and the ridge portion 3g. The second electrode layer E2 of the electrode portion 5a indirectly covers the part E2 located on the main surface 3a. 1a In this modification, when the first electrode layer E1 of the electrode unit 5a is disposed on the main surface 3a, the portion E2 of the second electrode layer E2 1a includes a portion in contact with the main surface 3a and a portion in contact with the first electrode layer E1.

[0071] The first electrode layer E1 of the electrode portion 5b is disposed on the ridge portion 3h, and is not disposed on the main surface 3b. The first electrode layer E1 of the electrode portion 5b is formed so as to cover the entire ridge portion 3h. The first electrode layer E1 is not formed on the main surface 3b. The first electrode layer E1 of the electrode portion 5b is in contact with the entire ridge portion 3h. The main surface 3b is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. In this modified example, the first electrode layer E1 of the electrode portion 5b may also be disposed on the main surface 3b.

[0072] The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and the main surface 3b. In the electrode portion 5b, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5b, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 is in contact with a part of the main surface 3b. The part of the main surface 3b is, for example, a part of the main surface 3b near the end surface 3e. The electrode portion 5b has a four-layer structure on the ridge portion 3h and a three-layer structure on the main surface 3b. The second electrode layer E2 of the electrode portion 5b is formed so as to cover the entire ridge portion 3h and a part of the main surface 3b. As described above, the part of the main surface 3b is, for example, a part of the main surface 3b near the end surface 3e. The second electrode layer E2 of the electrode portion 5b indirectly covers the entire ridge portion 3h and a part of the main surface 3b such that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5b directly covers a part of the main surface 3b. The second electrode layer E2 of the electrode portion 5b directly covers the entire first electrode layer E1 formed on the ridge portion 3h. When the first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a, the electrode portion 5a has a four-layer structure on the main surface 3a and the ridge portion 3h. The second electrode layer E2 of the electrode portion 5b indirectly covers the part E2 located on the main surface 3b. 1b In this modification, when the first electrode layer E1 of the electrode unit 5b is disposed on the main surface 3b, the portion E2 of the second electrode layer E2 1b includes a portion in contact with the main surface 3b and a portion in contact with the first electrode layer E1.

[0073] The first electrode layer E1 of the electrode portion 5c is disposed on the ridge portion 3i, but not on the side surface 3c. The first electrode layer E1 of the electrode portion 5c is formed so as to cover the entire ridge portion 3i. The first electrode layer E1 is not formed on the side surface 3c. The first electrode layer E1 of the electrode portion 5c is in contact with the entire ridge portion 3i. The side surface 3c is not covered by the first electrode layer E1, and is exposed from the first electrode layer E1. In this modified example, the first electrode layer E1 of the electrode portion 5c may also be disposed on the side surface 3c.

[0074] The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode portion 5c, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5c, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 is in contact with a part of the side surface 3c. The part of the side surface 3c is, for example, a part of the side surface 3c near the end surface 3e. The electrode portion 5c has a four-layer structure on the ridge portion 3i and a three-layer structure on the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the entire ridge portion 3i and a part of the side surface 3c. As described above, the part of the side surface 3c is, for example, a part of the side surface 3c near the end surface 3e. The second electrode layer E2 of the electrode portion 5c indirectly covers the entire ridge portion 3i and a part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. The second electrode layer E2 of the electrode portion 5c directly covers a part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c directly covers the entire first electrode layer E1 formed on the ridge portion 3i. When the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c, the electrode portion 5c has a four-layer structure on the side surface 3c and on the ridge portion 3i. The second electrode layer E2 of the electrode portion 5c has a portion E22 located on the side surface 3c. In this modification, when the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c, the portion E22 of the second electrode layer E2 includes a portion in contact with the side surface 3c and a portion in contact with the first electrode layer E1.

[0075] The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The entire end surface 3e is covered by the first electrode layer E1. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. The second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed so as to cover the entire end surface 3e. The second electrode layer E2 of the electrode portion 5e indirectly covers the entire end surface 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode portion 5e directly covers the entire first electrode layer E1. In the electrode portion 5e, the first electrode layer E1 is formed on the end surface 3e so as to be connected to one end of the corresponding internal electrodes 7, 9. The second electrode layer E2 of the electrode portion 5e has a portion E23 located on the end surface 3e.

[0076] In this modification, as shown in FIGS. 14 and 15, each portion E2 of the second electrode layer E2 1a ,E2 1b The maximum thickness T1 of the second electrode layer E2 is greater than the maximum thickness T2 of the portion E22 of the second electrode layer E2. As shown in FIG. 14, the maximum thickness T1 of the second electrode layer E2 is greater than the maximum thickness T3 of the portion E23 of the second electrode layer E2. For example, 1a ,E2 1b constitutes the first portion, the portion E23 of the second electrode layer E2 constitutes the second portion.

[0077] 12 to 15, the second electrode layer E2 has a plurality of voids 13. In a cross section along the thickness direction of the second electrode layer E2, the maximum length of the voids 13 is within a range of 1 to 20 μm. In this modification, the maximum length of the voids 13 is 20 μm.

[0078] The plating layer PL is part E2 1a The upper portion PL1a and the portion E2 1b14, there is a gap 17 between the edge PL1ea and the element body 3 (main surface 3a). There is a gap 18 between the edge PL1eb and the element body 3 (main surface 3b). There is a gap 19 between the edge PL2e and the element body 3 (side surface 3c) as shown in FIG. 15. The width of the gaps 17, 18, 19 is, for example, greater than 0 and equal to or less than 3 μm. The widths of the gaps 17, 18, 19 may be the same. The widths of the gaps 17, 18, 19 may be different.

[0079] As described above, the second electrode layer E2 is a portion E2 1a and part E2 1b Each portion E2 of the second electrode layer E2 includes a portion E1, a portion E22, and a portion E23. 1a ,E2 1b The proportion of voids 13 in each portion E2 of the second electrode layer E2 is greater than the proportion of voids 13 in each portion E22 of the second electrode layer E2. 1a ,E2 1b The proportion of voids 13 in the portion E23 of the second electrode layer E2 is greater than the proportion of voids 13 in the portion E23 of the second electrode layer E2. 1a ,E2 1b In the portion E21, the thickness direction of the second electrode layer E2 coincides with the direction perpendicular to the main surface 3a, in the portion E22, the thickness direction of the second electrode layer E2 coincides with the direction perpendicular to the side surface 3c, and in the portion E23, the thickness direction of the second electrode layer E2 coincides with the direction perpendicular to the end surface 3e. 1a ,E2 1b At portion E21, it coincides with the first direction D1, at portion E22, it coincides with the second direction D2, and at portion E23, it coincides with the third direction D3.

[0080] Each part E2 of the second electrode layer E2 1a ,E2 1bThe proportion of the voids 13 in the second electrode layer E2 (each portion E2 1a ,E2 1b ) in the cross section along the thickness direction of each part E2 1a ,E2 1b The total area of ​​the voids 13 present in each part E2 1a ,E2 1b The value is expressed as a percentage by dividing the area of ​​each part E2 1a ,E2 1b The ratio of the voids 13 in each portion E2 is within a range of 5 to 35%. 1a ,E2 1b The total area of ​​the voids 13 present in 2 Each part E2 1a ,E2 1b The area is 0.010~0.060mm 2 For example, each part E2 1a ,E2 1b The total area of ​​the voids 13 present in 2 and each part E2 1a ,E2 1b The area of ​​is 0.035 mm 2 In this case, each part E2 1a ,E2 1b The proportion of voids 13 in each portion E2 is 20%. 1a ,E2 1b The area of ​​each part E2 1a ,E2 1b Each portion E2 is an area defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2. 1a ,E2 1b The area of ​​each part E2 1a ,E2 1b The total area of ​​the voids 13 present in the

[0081] The proportion of voids 13 in portion E22 of the second electrode layer E2 is, for example, a value expressed as a percentage obtained by dividing the total area of ​​voids 13 present in portion E22 by the area of ​​portion E22 in a cross section along the thickness direction of the second electrode layer E2 (portion E22). The proportion of voids 13 present in portion E22 is within a range of 5 to 35%. In this modification, the total area of ​​voids 13 present in portion E22 is 300 to 12,600 μm 2 The area of ​​the portion E22 is 0.006 to 0.036 mm 2 For example, the total area of ​​the voids 13 in the portion E22 is 2100 μm 2 and the area of ​​the part E22 is 0.021 mm 2 In this case, the ratio of the voids 13 in the portion E22 is 10%. 1a ,E2 1b The proportion of voids 13 in portion E22 may be, for example, 20%. In this case, the total area of ​​voids 13 present in portion E22 may be, for example, 500 to 21000 μm 2 and the area of ​​the portion E22 is, for example, 0.010 to 0.060 mm 2 More specifically, the total area of ​​the voids 13 present in the portion E22 is, for example, 7000 μm 2 and the area of ​​the portion E22 is, for example, 0.035 mm 2 The area of ​​the portion E22 is the area of ​​the region defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2 in the portion E22. The area of ​​the portion E22 includes the total area of ​​the gaps 13 present in the portion E22.

[0082] The proportion of voids 13 in portion E23 of the second electrode layer E2 is, for example, a value expressed as a percentage obtained by dividing the total area of ​​voids 13 present in portion E23 by the area of ​​portion E23 in a cross section along the thickness direction of the second electrode layer E2 (portion E23). The proportion of voids 13 present in portion E23 is within a range of 5 to 35%. In this modification, the total area of ​​voids 13 present in portion E23 is 1000 to 70000 μm 2 The area of ​​the portion E23 is 0.02 to 0.20 mm2 For example, the total area of ​​the voids 13 present in the portion E23 is 10000 μm 2 and the area of ​​the portion E23 is 0.10 mm 2 In this case, the proportion of voids 13 in portion E23 is 10%. The area of ​​portion E23 is the area of ​​a region in portion E23 that is defined by the surface of the first electrode layer E1 and the surface of the second electrode layer E2. The area of ​​portion E23 includes the total area of ​​voids 13 present in portion E23.

[0083] The maximum length of the gap 13 can be obtained in the same manner as in the above-described embodiment. 1a ,E2 1b The total area of ​​the gap 13 in each of the portions E2, E23, and E4 can be calculated in the same manner as in the above-described embodiment. 1a ,E2 1b , E22, and E23, the area of ​​the second electrode layer E2 can be obtained in the same manner as in the above-described embodiment.

[0084] As described above, even in this modified example, when the multilayer capacitor C2 is solder-mounted, if moisture absorbed in the resin contained in the second electrode layer E2 is gasified, the gas generated from the moisture reaches the gaps 17, 18, and 19 from the multiple voids 13. The gas that reaches the gaps 17, 18, and 19 moves to the outside of the external electrode 5, and stress is unlikely to act on the second electrode layer E2. As a result, the multilayer capacitor C2 suppresses peeling of the second electrode layer E2. In the multilayer capacitor C2, each portion E2 of the second electrode layer E2 1a ,E2 1b The proportion of voids 13 in portion E23 of the second electrode layer E2 is greater than the proportion of voids 13 in portion E23 of the second electrode layer E2. Therefore, gas generated from moisture in the second electrode layer E2 is likely to move to the outside of the external electrode 5 through gap 17 between edge PL1ea and the element body 3. Gas generated from moisture in the second electrode layer E2 is likely to move to the outside of the external electrode 5 through gap 18 between edge PL1eb and the element body 3. Gas generated in portion E23 is likely to move to the outside of portion E23 through a passage formed by the multiple voids 13. 1a or part E2 1b Part E21a The gas that reaches the portion E2 moves to the outside of the outer electrode 5 through the gap 17 as described above. 1b As described above, the gas that has reached this position moves through the gap 18 to the outside of the external electrode 5. As a result, the multilayer capacitor C2 controls the position from which the gas exits, similar to the multilayer capacitor C1. In the multilayer capacitor C2, the proportion of the voids 13 in the portion E22 of the second electrode layer E2 is 1a ,E2 1b The proportion of voids 13 present in the second electrode layer E2 is smaller than the proportion of voids 13 present in the first electrode layer E2. Therefore, gas generated from moisture in the second electrode layer E2 is unlikely to move from the gap 19 between the edge PL2e and the element body 3. Therefore, the multilayer capacitor C2 reliably controls the position from which the gas escapes.

[0085] In the multilayer capacitor C2, the gas generated in the portion E23 is, as described above, 1a or part E2 1b Therefore, the gas generated in the part E23 is easily absorbed into the part E2 1a ,E2 1b 2 and moves to the outside of the external electrode 5 through the gaps 17 and 18. As a result, the multilayer capacitor C2 suppresses the occurrence of solder explosion, similar to the multilayer capacitor C1. The gas generated in the second electrode layer E2 of the electrode member 5c easily reaches the second electrode layer E2 of the electrode member 5a through the passage formed by the plurality of gaps 13. The gas that reaches the second electrode layer E2 of the electrode member 5a moves to the outside of the external electrode 5 through the gap 17 or the gap 18, as described above.

[0086] In the multilayer capacitor C2, each part E2 1a ,E2 1b The maximum thickness T1 of portion E23 is greater than the maximum thickness T3 of portion E23. Therefore, in multilayer capacitor C2 as well, stress is less likely to act on second electrode layer E2, and peeling of second electrode layer E2 is also more effectively suppressed in multilayer capacitor C2. In the multilayer capacitor C2, each part E2 1a ,E2 1bThe maximum thickness T1 of portion E21 is greater than the maximum thickness T2 of portion E22. Therefore, in the multilayer capacitor C2, similar to the multilayer capacitor C1, stress is less likely to act on the second electrode layer E2, and the multilayer capacitor C2 further suppresses peeling of the second electrode layer E2.

[0087] In the multilayer capacitor C2, the portion E2 of the second electrode layer E2 1a In the cross section along the thickness direction of the part E2 1a The total area of ​​the void 13 in the part E2 1a The area of ​​the second electrode layer E2 is within a range of 5 to 35%. 1b In the cross section along the thickness direction of the part E2 1b The total area of ​​the void 13 in the part E2 1b Therefore, similar to the multilayer capacitor C1, the multilayer capacitor C2 suppresses an increase in the amount of gas generated, and each portion E2 1a ,E2 1b This suppresses the obstruction of gas movement in the

[0088] In the multilayer capacitor C2, the principal surface 3a or the principal surface 3b constitutes the mounting surface. The multilayer capacitor C2 also has a part E2 1a is located on the main surface 3a, and the portion E2 1b Since each portion E2 is located on the main surface 3b, an external force acting on the multilayer capacitor C1 from an electronic device is unlikely to act on the element body 3. 1a ,E2 1b If the proportion of voids in part E23 is greater than the proportion of voids in part E23, 1a ,E2 1b Compared to portion E23, portion E23 is more likely to reduce the external force acting on element body 3. Therefore, multilayer capacitor C2 reliably prevents cracks from occurring in element body 3.

[0089] In the multilayer capacitor C2, the maximum length of each of the plurality of gaps 13 in a cross section along the thickness direction of the second electrode layer E2 is within a range of 1 to 20 μm. Therefore, like the multilayer capacitor C1, the multilayer capacitor C2 reliably prevents an increase in the amount of gas generated and reliably prevents the movement of gas in the second electrode layer E2 from being hindered.

[0090] The multilayer capacitors C1 and C2 each include an element body 3 and an external electrode 5 disposed on the element body 3. The external electrode 5 includes a second electrode layer E2 in which a plurality of voids 13 exist, and a plating layer PL disposed on the second electrode layer E2. In the multilayer capacitor C1, gaps 17 and 19 communicating with the plurality of voids 13 exist between the element body 3 and edges PL1e and PL2e of the plating layer PL. In the multilayer capacitor C2, gaps 17, 18, and 19 communicating with the plurality of voids 13 exist between the element body 3 and edges PL1ea, PL1eb, and PL2e of the plating layer PL. Even if moisture absorbed in the resin contained in the second electrode layer E2 is gasified when the multilayer capacitor C1 is solder-mounted, the gas generated from the moisture reaches the gaps 17 and 19 from the multiple voids 13. The gas that reaches the gaps 17 and 19 moves to the outside of the external electrode 5, making it difficult for stress to act on the second electrode layer E2. As a result, the multilayer capacitor C1 suppresses peeling of the second electrode layer E2. Even if moisture absorbed in the resin contained in the second electrode layer E2 is gasified when the multilayer capacitor C2 is solder-mounted, the gas generated from the moisture reaches the gaps 17, 18, and 19 from the multiple voids 13. The gas that reaches the gaps 17, 18, and 19 moves to the outside of the external electrode 5, making it difficult for stress to act on the second electrode layer E2. As a result, the multilayer capacitor C2 suppresses peeling of the second electrode layer E2.

[0091] In this specification, when an element is described as being disposed on another element, the element may be directly disposed on the other element or indirectly disposed on the other element. When an element is indirectly disposed on another element, an intervening element is present between the element and the other element. When an element is directly disposed on the other element, an intervening element is not present between the element and the other element. In this specification, when an element is described as being located on another element, the element may be directly located on the other element or indirectly located on the other element. When an element is indirectly located on another element, an intervening element is present between the element and the other element. When an element is directly located on the other element, an intervening element is not present between the element and the other element. In this specification, when an element is described as covering another element, the element may directly cover the other element or may indirectly cover the other element. When an element indirectly covers another element, an intervening element is present between the element and the other element. When an element directly covers another element, an intervening element is not present between the element and the other element.

[0092] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.

[0093] The proportion of voids 13 in the portion E22 of the second electrode layer E2 is 1a ,E2 1b The proportion of voids 13 in portion E22 may be equal to or greater than the proportion of voids 13 in portions E21 and E22. 1a ,E2 1b When the proportion of voids 13 present is smaller than the above ratio, multilayer capacitors C1 and C2 reliably control the positions from which gas is released, as described above. Part E21,E2 1a ,E2 1b The maximum thickness T1 of the portion E21 may be equal to or smaller than the maximum thickness T2 of the portion E23.1a ,E2 1b When the maximum thickness T1 of portion E21 is greater than the maximum thickness T2 of portion E23, as described above, in the multilayer capacitors C1 and C2, stress is less likely to act on the second electrode layer E2, and the multilayer capacitors C1 and C2 are more likely to suppress peeling of the second electrode layer E2. Part E21,E2 1a ,E2 1b The maximum thickness T1 of the portion E21 may be equal to or smaller than the maximum thickness T3 of the portion E22. 1a ,E2 1b When the maximum thickness T1 of portion E21 is greater than the maximum thickness T3 of portion E22, as described above, in the multilayer capacitors C1 and C2, stress is less likely to act on the second electrode layer E2, and the multilayer capacitors C1 and C2 more reliably suppress peeling of the second electrode layer E2. Part E2 1a The maximum thickness T1 of the part E2 1b The maximum thickness T1 of the portion E2 may be the same as that of the portion E1. 1a The maximum thickness T1 of the part E2 1b The maximum thickness T1 may be different from the maximum thickness T2. Parts E21 and E2 of the second electrode layer E2 1a ,E2 1b In the cross section along the thickness direction of the 1a ,E2 1b The total area of ​​the gap 13 in the 1a ,E2 1b Parts E21 and E2 may be outside the range of 5 to 35% of the area of 1a ,E2 1b In the cross section along the thickness direction of the 1a ,E2 1b The total area of ​​the gap 13 in the area is 1a ,E2 1b In the case where the area of ​​the multilayer capacitors C1 and C2 is within a range of 5 to 35% of the area of ​​the portions E21 and E22, as described above, the multilayer capacitors C1 and C2 can suppress an increase in the amount of gas generated. 1a ,E2 1b This suppresses the obstruction of gas movement in the In a cross section taken along the thickness direction of the second electrode layer E2, the maximum length of each of the plurality of voids 13 may be outside the range of 1 to 20 μm. When the maximum length of each of the plurality of voids 13 in a cross section taken along the thickness direction of the second electrode layer E2 is within the range of 1 to 20 μm, as described above, the multilayer capacitors C1, C2 reliably suppress an increase in the amount of gas generated while reliably suppressing the obstruction of gas movement in the second electrode layer E2.

[0094] In the multilayer capacitor C2, the side surface 3c may form the mounting surface. If gas generated from moisture in the second electrode layer E2 moves to the outside of the external electrode 5 through the gaps 17 and 18, the attitude of the multilayer capacitor C2 may change during solder mounting due to the gas being ejected from the external electrode 5. If the attitude of the multilayer capacitor C2 changes, there is a risk of defective mounting of the multilayer capacitor C2. Each part E2 1a ,E2 1b When the proportion of voids 13 in portion E21 is greater than the proportion of voids 13 in portion E22, the gas moves to the outside of the external electrode 5 mainly through gaps 17 and 18, as described above. The gas is less likely to move to the outside of the external electrode 5 through gap 19. Therefore, the multilayer capacitor C2 suppresses the occurrence of mounting defects of the multilayer capacitor C2. Since the electrode portion 5c has the second electrode layer E2, an external force acting on the multilayer capacitor C2 from the electronic device is less likely to act on the element body 3. Therefore, the multilayer capacitor C2 suppresses the occurrence of cracks in the element body 3.

[0095] In this embodiment, the multilayer capacitors C1 and C2 are used as examples of electronic components, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer composite components, or electronic components other than multilayer electronic components. [Explanation of symbols]

[0096] 3...Element body, 3a, 3b...Main surface, 3e...End surface, 5...External electrode, 13...Gap, 17,18,19...Gap, C1, C2...Multilayer capacitor, E1...First electrode layer, E2...Second electrode layer, E21, E2 1a ,E2 1b ...portion located on the main surface, E23...portion located on the end surface, E3...third electrode layer, E4...fourth electrode layer, PL...plating layer, PL1e, PL1ea, PL1eb...edges of the plating layer.

Claims

1. an element body having a side surface and an end surface adjacent to each other, and external electrodes disposed on the side surface and the end surface; The external electrode includes a conductive resin layer having a plurality of voids, a sintered metal layer disposed on the side surface and the end surface so as to be located between the side surface and the conductive resin layer, and a plating layer disposed on the conductive resin layer, a gap communicating with the plurality of voids is present between an edge of the plating layer and the element body, the conductive resin layer has a first portion located on the side surface and a second portion located on the end surface, The electronic component, wherein the maximum thickness of the first portion is greater than the maximum thickness of the second portion.

2. The electronic component according to claim 1 , wherein the side surface constitutes a mounting surface.

3. the conductive resin layer is formed so as to continuously cover a part of the side surface and a part of the end surface, The electronic component according to claim 1 , wherein the plating layer is formed so as to cover the entire end surface.

4. the element body further has a pair of other side surfaces opposed to each other and adjacent to the side surface and the end surface, the side surface constitutes a mounting surface, the conductive resin layer is formed so as to continuously cover a part of the side surface, a part of the end surface, and a part of each of the pair of other side surfaces, The electronic component according to claim 1 , wherein the plating layer is formed so as to cover the entire end surface.

5. The electronic component according to claim 4 , wherein the gap exists between the side surface and the pair of other side surfaces and the edge of the plating layer.

6. the element body further has a pair of other side surfaces that are opposed to each other and adjacent to the side surface and the end surface, and a further other side surface that is opposed to the side surfaces, The electronic component according to claim 1 or 2, wherein the conductive resin layer is formed so as to continuously cover a portion of the side surface, a portion of each of the pair of other side surfaces, a portion of the further other side surface, and the entire end surface.

7. The electronic component according to claim 6 , wherein the gaps are present between the side surface, the pair of other side surfaces, and the further other side surface and the edge of the plating layer.

8. the conductive resin layer further has a portion located on each of the pair of other side surfaces, The electronic component according to any one of claims 4 to 7, wherein a maximum thickness of the first portion is greater than a maximum thickness of the portions located on each of the pair of other side surfaces.

9. The electronic component according to any one of claims 1 to 8, wherein the width of the gap is greater than 0 and equal to or less than 3 µm.

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