Electric motor drive control device
Patent Information
- Application Number
- JP2024514808
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-04-13
- Filing Date
- 2023-01-26
- Publication Date
- 2025-03-27
- Estimated Expiration
- 2043-01-26
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a drive control device for an electric motor, and more particularly to a technique for suppressing dripping of flux applied in a pre-soldering process when mounting a printed circuit board on the rear surface of a connector block. [Background technology]
[0002] Patent Document 1 describes a spray-type flux applicator for spraying and applying flux to the surface of a printed circuit board when soldering electronic components to the board. In this patent document 1, a spray control member is provided for controlling the range in which the flux liquid sprayed from the spray nozzle spreads in order to appropriately control the area in which the flux is sprayed. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2003-347719 A Summary of the Invention [Problem to be solved by the invention]
[0004] By the way, while flux improves the wettability of solder, it is known that residues of flux can cause migration and inhibit the hardening of liquid gaskets (FIPG: Formed In Place Gaskets). When flux liquid is sprayed and applied as in Patent Document 1, the flux liquid may flow out onto the side of the connector block through the through holes in the printed circuit board due to variations in the spraying.
[0005] Excess flux that has flowed out onto the side of the connector block increases the risk of adhering to the sealing portion of the exterior material or adhering to the worker's gloves and being unintentionally transferred (transferred) to the sealing portion. For this reason, it is necessary to visually check for residual flux that has dripped onto the side of the connector block or to wipe it off manually, which increases the complexity of the mounting work and increases manufacturing costs.
[0006] The present invention has been made in consideration of the above-mentioned circumstances, and its object is to provide a drive control device for an electric motor that can reduce manufacturing costs by suppressing dripping of flux applied in a pre-soldering process when mounting a printed circuit board to a connector block. [Means for solving the problem]
[0007] According to one aspect of the present invention, in a drive control device for an electric motor, the drive control device has a connector block having a connection opening where a part of a terminal member is exposed and the exposed terminal member is connected to a terminal member of a mating connector, and an exterior member that is coupled to the connector block and houses and seals a printed circuit board used for driving and controlling an electric motor. The connector block has a soldered terminal portion where the terminal member protrudes from a rear surface on the housing space side of the printed circuit board, and a sealing member that seals the rear surface. a recessed portion that is lower than the outer edge of the back surface on the outer edge side of the solder terminal portion, and a padding portion provided at the base of the solder terminal portion; There is provided a drive control device for an electric motor comprising: Effect of the Invention
[0008] According to the present invention, since a storage section for excess flux is provided, when mounting a printed circuit board on a connector block, the excess flux applied in the pre-soldering process can be stored in the storage section and prevented from dripping onto the side of the connector block. This makes it possible to stably supply high-quality products by suppressing adhesion to the seal section of the exterior member and transfer from gloves. In addition, the manufacturing cost can be reduced by reducing the visual confirmation work of flux residue and the manual wiping work. [Brief description of the drawings]
[0009] [Figure 1] 4 is a plan view of the rear surface of the connector block in the electric motor drive control device according to the embodiment of the present invention. FIG. [Diagram 2] FIG. 2 is a perspective view of the connector block shown in FIG. 1. [Diagram 3] 3 is a perspective view for explaining a process of mounting a printed circuit board on the rear surface of the connector block of FIG. 2. FIG. [Figure 4] 1 is an external perspective view of an electric motor drive control device according to an embodiment of the present invention; [Diagram 5] FIG. 5 is an exploded perspective view of the drive control device for the electric motor shown in FIG. [Figure 6] FIG. 11 is a front view for explaining a flux application step. [Figure 7] FIG. 11 is a front view for explaining another example of the flux coating step. [Figure 8] 7 is an enlarged cross-sectional view for explaining the flow of flux liquid in a solder terminal portion in the flux application step shown in FIG. 6. FIG. [Figure 9A] FIG. 11 is a cross-sectional view for explaining a first modified example of a storage portion for excess flux. [Figure 9B] FIG. 11 is a cross-sectional view for explaining a second modified example of the storage portion for excess flux. [Figure 9C] FIG. 13 is a cross-sectional view for explaining a third modified example of the storage portion for excess flux. [Figure 9D] FIG. 13 is a cross-sectional view for explaining a fourth modified example of the storage portion for excess flux. [Figure 9E] FIG. 13 is a cross-sectional view for explaining a fifth modified example of a storage portion for excess flux. [Figure 9F] FIG. 13 is a cross-sectional view for explaining a sixth modified example of the storage portion for excess flux. [Figure 9G] FIG. 13 is a cross-sectional view for explaining a seventh modified example of the storage portion for excess flux. [Figure 9H]FIG. 13 is a cross-sectional view for explaining an eighth modified example of the storage portion for excess flux. [Figure 9I] FIG. 13 is a cross-sectional view for explaining a ninth modified example of the storage portion for excess flux. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 to Fig. 5 each show a drive control device for an electric motor according to an embodiment of the present invention. Fig. 1 is a plan view of the rear surface of a connector block, Fig. 2 is a perspective view of the connector block as seen from the rear surface side, and Fig. 3 is a perspective view for explaining a process of mounting a printed circuit board on the rear surface of the connector block. Fig. 4 is an external perspective view of the drive control device for an electric motor, and Fig. 5 is an exploded perspective view of the drive control device shown in Fig. 4. This electric motor drive control device is applied to, for example, an electric steering device of a vehicle, and is used for controlling the drive of an electric motor that generates or assists steering force.
[0011] As shown in Figures 4 and 5, an electric motor drive control device 10 has a motor main body 2 housed in an exterior member (cover) 1, mounted components 3 that control the drive of the motor main body 2, a printed circuit board (PCB) 4 equipped with various electronic components, a connector block 5, etc., attached to the motor main body 2, and is covered with an exterior member (cover) 6. The exterior member 1 and the exterior member 6 form a pair and are joined via a sealing material (not shown). The motor shaft and the gear 2a attached to the motor shaft protrude from one surface of the exterior member 1, and an opening 6a is formed on the opposing surface of the exterior member 6, and a connection opening 5c provided on the front surface 5a of the connector block 5 protrudes.
[0012] The connector block 5 shown in Figures 1 and 2 is a molded body in which a portion of the terminal members is sealed. A front surface 5a of the connector block 5 is provided with a connection opening 5c through which the terminal members are connected to the terminal members of a mating connector. The four corners of the connector block 5 are formed with thick collars 5-1 to 5-4 to enhance durability. By inserting screws 7-1 to 7-4 through the collars 5-1 to 5-4 and screwing them into the screw receiving portions 8-1 to 8-4 of the cover 1, the mounted components 3, the printed circuit board 4, and the connector block 5 are fixed (see Figure 5).
[0013] Sensor input terminals 12-1, 12-2 and CAN communication terminals 13-1, 13-2 are provided as terminal members on the rear surface 5b of the connector block 5. The power supply terminals 11-1 to 11-4 are connected by Tig welding to terminals on the printed circuit board 4. In addition, the sensor input terminals 12-1, 12-2 and the CAN communication terminals 13-1, 13-2 are inserted into through holes of the printed circuit board 4 as shown in FIG. 3, and serve as soldered terminal portions that are soldered to the wiring of the printed circuit board 4.
[0014] In addition, a recess 14-1 with a rectangular opening is provided on the back surface 5b of the connector block 5. A row of sensor input terminals 12-1 is arranged in this recess 14-1, adjacent to the long side away from the periphery of the back surface 5b. Recess 14-1 serves as a reservoir for storing excess flux that is applied to sensor input terminals 12-1 and flows out.
[0015] Furthermore, a barrier portion 15-1 is provided on the periphery of the rear surface 5b of the connector block 5 corresponding to the row of the sensor input terminals 12-2. A recessed portion 14-2 is provided between the barrier portion 15-1 and the sensor input terminals 12-2, adjacent to the row of the sensor input terminals 12-2. The barrier portion 15-1 and the recessed portion 14-2 form a storage portion for storing excess flux that is applied to the sensor input terminals 12-2 and flows out.
[0016] Similarly, barrier portions 15-2 and 15-3 are provided on the periphery of connector block rear surface 5b of CAN communication terminals 13-1 and 13-2. Recesses 14-3 and 14-4 are provided between CAN communication terminals 13-1 and 13-2 and barrier portions 15-2 and 15-3, respectively. The barrier portion 15-2 and the recessed portion 14-3, and the barrier portion 15-3 and the recessed portion 14-4 respectively form a reservoir for storing excess flux that is applied to the CAN communication terminals 13-1 and 13-2 and flows out.
[0017] In this way, sensor input terminal 12-1, which is far from the periphery, stores excess flux in recess 14-1. In contrast, sensor input terminal 12-2, which is closer to the periphery, stores excess flux in barrier 15-1 and recess 14-2. Also, CAN communication terminal 13-1, which is closer to the periphery, stores excess flux in barrier 15-2 and recess 14-3, and CAN communication terminal 13-2, which is closer to the periphery, stores excess flux in barrier 15-3 and recess 14-4.
[0018] As shown in FIG. 5, the printed circuit board 4 is configured such that the first and second mounting parts 4a and 4b corresponding to the planar shape of the rear surface 5b of the connector block 5 are connected by the flexible part 4c. Semiconductor devices such as FETs and various electronic components are mounted on the first and second mounting parts 4a and 4b. Then, as shown in FIG. 3, the first mounting part 4a is first installed on the rear surface 5b of the connector block 5, and the sensor input terminals 12-1 and 12-2 and the CAN communication terminals 13-1 and 13-2 are inserted into the through holes of the first mounting part 4a. The surfaces of the first mounting part 4a around these terminals are the areas 16-1, 16-2, 16-3, and 16-4 to which the flux agent is sprayed. After the flux agent is sprayed, soldering is performed. Next, the second mounting part 4b is placed on the first mounting part 4a, and the printed circuit board 4 is mounted on the rear surface 5b of the connector block 5.
[0019] FIG. 6 shows the flux application process, in which after the printed circuit board 4 is attached to the rear surface 5b of the connector block 5 as shown in FIG. 3, flux agent 22 is sprayed and applied from a spray nozzle 17 to each of the solder terminal portions 21 (areas 16-1, 16-2, 16-3, and 16-4 surrounded by dashed lines around the sensor input terminals 12-1 and 12-2 and the CAN communication terminals 13-1 and 13-2 in FIG. 3). In the above-mentioned coating step, as shown in Fig. 7, a girt wall 18 may be provided along the outer periphery of the back surface 5b of the connector block 5. By providing the girt wall 18 and spraying the flux agent 22 from the spray nozzle 17, scattering of the flux agent 22 can be reduced.
[0020] When the fluxing agent 22 is sprayed, excess flux flowing out from the sensor input terminal 12-1 portion (region 16-1) is stored in a storage portion consisting of the recessed portion 14-1, and excess flux flowing out from the sensor input terminal 12-2 portion (region 16-2) is stored in a storage portion consisting of the recessed portion 14-2 and the barrier portion 15-1. Similarly, excess flux flowing out from the portion of CAN communication terminal 13-1 (region 16-3) is stored in a reservoir consisting of recess 14-3 and barrier 15-2, and excess flux flowing out from the portion of CAN communication terminal 13-2 (region 16-4) is stored in a reservoir consisting of recess 14-3 and barrier 15-3.
[0021] 8 shows an enlarged view of solder terminal portion 21 (sensor input terminals 12-1, 12-2, CAN communication terminals 13-1, 13-2). A padding portion 19 is formed at the base of solder terminal portion 21. This padding portion 19 is formed in a convex shape extending upward from rear surface 5b of connector block 5, with upper surface 19a narrower than bottom surface 19b. By narrowing upper surface 19a in this manner, excess flux is more easily guided along inclined surface 19c to the recessed portion, and the amount of accumulated flux can be reduced.
[0022] In addition, the build-up portion 19 prevents the flux from accumulating at the base of the solder terminal portion 21 and increasing the number of droplets, thereby preventing the flux from flowing in droplet form toward the periphery. Furthermore, the risk of migration caused by flux residue entering the interface between the resin of the connector block 5 and the solder terminal portion 21 can also be reduced. Incidentally, by forming an inclined surface or a rounded surface on the upper surface 19a of the buildup portion 19, the amount of flux remaining can be further suppressed.
[0023] 9A to 9I are cross-sectional views for explaining various modified examples of the storage portion for excess flux. Here, the cross section of the piled-up portion 19 is shown to be quadrangular (the bottom and top faces have the same width), but it is preferable to make the top face narrower than the bottom face as described above, and further to form an incline or roundness on the top face of the piled-up portion 19.
[0024] 9A shows an example in which the mound 19 is disposed in the recess 14. In this example, the upper surface 19a of the mound 19 is lower than the rear surface 5b of the connector block 5, and the upper portion 5d of the outer edge of the connector block 5 is lower than the upper surface 19a of the mound 19. Excess flux is stored in the recess 14 up to the upper portion 5d of the outer edge of the connector block 5.
[0025] 9B shows an example in which the mound 19 and the recess 14 are disposed apart from each other. In this example, the upper surface 19a of the mound 19 is lower than the back surface 5b of the connector block 5, and a separation portion 5e having the same height as the upper portion 5d of the outer edge of the connector block 5 is formed between the mound 19 and the recess 14. This separation portion 5e and the upper portion 5d of the outer edge are lower than the upper surface 19a of the mound 19. Excess flux then passes over the separation portion 5e and is stored in the recess 14 up to the upper portion 5d of the outer edge of the connector block 5.
[0026] 9C shows an example in which the mound 19 is disposed in the recess 14, and a barrier portion 15 is formed on the outer edge of the connector block 5. In this example, the upper surface 19a of the mound 19 is lower than the back surface 5b of the connector block 5, and the barrier portion 15 is higher than the upper surface 19a of the mound 19. Excess flux is then stored in the recess 14 up to the back surface 5b of the connector block 5.
[0027] Fig. 9D shows an example in which the padding portion 19 is disposed within the recessed portion 14, and the barrier portion 15 is formed inside the outer edge of the connector block 5. The only difference is the position of the barrier portion 15, and the other configuration is the same as the example in Fig. 9C, so the same parts are denoted by the same reference numerals and detailed description thereof will be omitted.
[0028] Figures 9E, 9F, and 9G each show an example in which a groove 20 is further formed in the recess 14 shown in Figure 9C. In Figure 9E, one end of the groove 20 is formed in contact with the base of the padding 19, and in Figure 9F, it is formed between the padding 19 and the barrier 15. Also, in Figure 9G, one end of the groove 20 is formed in contact with the base of the barrier 15. As such, the only difference is the position of the groove 20, and the other configurations are similar, so the same parts are denoted by the same reference numerals and detailed description thereof will be omitted.
[0029] Figures 9H and 9I each show an example in which the position of the barrier portion 15 is shifted in the configuration shown in Figure 9E. In Figure 9H, the barrier portion 15 is formed between the groove 20 and the outer edge of the connector block 5, while in Figure 9I, the barrier portion 15 is formed in contact with one end of the groove 20. As such, the only difference is the position of the barrier portion 15, and the other configurations are the same, so the same parts are denoted by the same reference numerals and detailed description thereof will be omitted. As mentioned above, various modifications of the reservoir are possible to store the excess flux.
[0030] As described above, according to the present invention, a storage section for excess flux is provided, so that when a printed circuit board is mounted on the rear surface of the connector block, the excess flux agent applied in the pre-soldering process can be stored in the storage section and prevented from dripping onto the side of the connector block. This makes it possible to steadily supply high-quality products by suppressing the occurrence of migration caused by flux residue and the inhibition of hardening of the seal area. It also reduces manufacturing costs by reducing the need for visual inspection of flux residue and manual wiping work.
[0031] The configurations and control methods described in the above embodiments are merely schematic illustrations to enable the present invention to be understood and practiced. Therefore, the present invention is not limited to the described embodiments, and may be modified in various forms without departing from the scope of the technical ideas set forth in the claims. [Explanation of symbols]
[0032] 1...Exterior member (cover), 2...Motor body, 3...Mounting parts, 4...Printed circuit board, 5...Connector block, 5-1 to 5-4...Collar, 5a...Front, 5b...Rear, 5c...Connection opening, 6...Exterior member (cover), 6a...Opening, 7-1 to 7-4...Screws, 8-1 to 8-4...Screw receiving part, 10...Drive control device for electric motor, 11-1 to 11-4...Power terminal, 12-1 , 12-2... sensor input terminal (soldered terminal portion), 13-1, 13-2... CAN communication terminal (soldered terminal portion), 14-1 to 14-4, 14... recessed portion (storage portion), 15-1 to 15-3, 15... barrier portion (storage portion), 16-1 to 16-4... area, 17... spray nozzle, 18... girder wall, 19... build-up portion, 20... groove, 21... soldered terminal portion, 22... flux agent
Claims
1. a connector block having a connection opening where a portion of a terminal member is exposed and where the exposed terminal member is connected to a terminal member of a mating connector; an exterior member that is connected to the connector block and that houses and seals a printed circuit board used for driving and controlling the electric motor, The connector block includes a solder terminal portion where the terminal member protrudes from a rear surface of the printed circuit board on the side of the housing space, and a recessed portion that is lower than an outer edge of the rear surface on an outer edge side of the solder terminal portion of the rear surface; and a padding portion provided at a base of the solder terminal portion.
2. 2. The drive control device for an electric motor according to claim 1, wherein the inclined portion of the padding is connected to the recess.
3. 2. The drive control device for an electric motor according to claim 1, wherein the solder terminal portion is provided within the recessed portion.
4. 2. The drive control device for an electric motor according to claim 1, wherein the recessed portion is disposed toward an outer edge portion of the connector block that is closest to the solder terminal portion.
5. 2. The drive control device for an electric motor according to claim 1, wherein the recessed portion is separated from the soldering terminal portion and is disposed between the soldering terminal portion and an outer edge portion of the connector block.
6. 2. The drive control device for an electric motor according to claim 1, wherein the recessed portion extends between a mounting and fixing position of the connector block and the soldering terminal portion.
Citation Information
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