Phase change (PCM) devices and manufacturing methods

Abstract

To provide a phase-change memory.SOLUTION: A phase-change memory (PCM) includes a dielectric layer 206, a bottom electrode 204 disposed in the dielectric layer 206, a liner material 203 disposed on the bottom electrode 204, a phase-change material 202 / 205 disposed on the liner material 203, and a top electrode disposed above the phase-change material 202 / 205 and the dielectric layer 206. The invention provides a phase-change memory (PCM) device production method and a PCM device.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to memory devices, and more particularly to improved phase change memory devices (PCM). [Background technology]

[0002] Neuromorphic engineering, also known as neuromorphic computing, is a concept that describes very large scale integrated (VLSI) systems that contain electrical analog circuits that mimic the neurophysiological architecture present in the nervous system.

[0003] The application of these neurophysiological architectures to machine learning can be accelerated by using analog chips that contain phase change memory (PCM). PCM is based on chalcogenide glass materials whose phase changes from crystalline to amorphous and back again when an appropriate current is applied. The maximum and minimum resistance levels in PCM devices are the basis for the binary values ​​one or zero.

[0004] PCM devices are non-volatile and have DRAM-level access latencies, making them an example of memory in the storage hierarchy. Intel Micron 3DXPoint technology is a binary memory based on PCM. PCM can be programmed to change resistance states between maximum and minimum resistance states depending on the proportion of amorphous and crystalline phases present, providing analog states for neuromorphic computation. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a phase change memory in which resistance fluctuation is suppressed. [Means for solving the problem]

[0006] According to one embodiment of the present invention, a phase change memory (PCM) device includes a dielectric layer, a bottom electrode disposed within the dielectric layer, a liner material disposed over the bottom electrode, a phase change material disposed over the liner material, and a top electrode disposed over the phase change material and within the dielectric layer.

[0007] According to some embodiments, a method for manufacturing a phase change memory (PCM) device includes providing a substrate; forming a first structure including a first dielectric layer and a bottom electrode, the bottom electrode being disposed within a first dielectric layer, the bottom electrode and the first dielectric layer being disposed over the substrate; forming a liner material over the bottom electrode and within a second dielectric layer; forming a phase change material over the liner material and within a third dielectric layer; and forming a top electrode over the phase change material and within a fourth dielectric layer.

[0008] According to some embodiments, a phase change memory (PCM) device includes a dielectric layer, a first electrode disposed on a first side of the dielectric layer, a second electrode disposed on a second side of the dielectric layer opposite the first electrode, a phase change material disposed on the dielectric layer, the first electrode, and the second electrode, and a liner material disposed on top of the phase change material.

[0009] As used herein, "facilitating" an action includes performing an action, facilitating an action, assisting in the performance of an action, or causing an action to be performed. Thus, by way of example and not by way of limitation, instructions executing on one processor may facilitate an action performed by instructions executing on a remote processor by sending appropriate data or commands to cause or assist the action. For the avoidance of doubt, where an actor facilitates an action without performing the action, however the action is performed by some entity or combination of entities.

[0010] One or more of the embodiments of the present invention or elements thereof may be implemented in the form of a computer readable recording medium or computer program having computer usable program code for performing the method steps as directed. Furthermore, one or more of the embodiments of the present invention or elements thereof may be implemented in the form of a system (apparatus) including a memory and at least one processor coupled to the memory for performing the exemplary method steps. Still further, in another aspect, one or more of the embodiments of the present invention or elements thereof may be implemented in the form of a means for performing one or more of the method steps described herein, which means may be (i) a hardware module(s), (ii) a software module(s) stored in a computer readable recording medium (or a number of such media) and implemented on a hardware processor, or (iii) a combination of (i) and (ii); including any combination of (i)-(iii) implementing the specific techniques referred to herein.

[0011] The techniques of the present invention can provide substantial useful technical advantages. For example, one or more embodiments may:

[0012] Suppression of resistance fluctuations in PCM devices, and

[0013] A suppression of the programming current of the device can be provided.

[0014] These and other features and advantages of this invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is an exemplary PCM crosspoint memory and neuromorphic computing crossbar array in accordance with some embodiments of the present invention. [Diagram 2]FIG. 2 is a PCM cell including a liner formed from a conductive oxide according to some embodiments of the present invention. [Diagram 3] FIG. 3 is a PCM cell including a liner formed from a metal and a conductive oxide according to some embodiments of the present invention. [Figure 4] FIG. 4 is a PCM cell including a liner formed from metal according to some embodiments of the present invention. [Diagram 5] FIG. 5 is a graph of resistance over time for different liners according to some embodiments of the present invention. [Figure 6] FIG. 6 is a flow diagram of a method for manufacturing a PCM device according to some embodiments of the present invention. [Figure 7] FIG. 7 is a PCM cell configured as a bridge cell according to some embodiments of the present invention. [Figure 8] FIG. 8 is a PCM cell configured as an embedded cell according to some embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention will now be described in more detail with reference to the following description and drawings accompanying this application, which are provided for illustrative purposes only and as such are not drawn to scale, and like and corresponding elements are referred to by like reference numerals.

[0017] In the following description, numerous specific details, such as specific structures, components, materials, dimensions, processing steps and techniques, are referenced to provide an understanding of various embodiments of the present invention. However, it will be understood by those skilled in the art that various embodiments of the present application can be practiced without these specific details. In other examples, well-known structures or processing steps have not been described in detail to avoid obscuring the present application.

[0018] Phase change memory (PCM) crosspoint memory and neuromorphic computing crossbar arrays (see FIG. 1), which are back-end-of-line (BEOL) compatible non-volatile memories, can accelerate the training of fully connected neural networks by performing calculations at the data locations. For using phase change memory (PCM) as analog memory in neuromorphic computing devices, resistance variation is an issue. An embodiment of the present invention relates to an improved PCM structure.

[0019] 1, device 100 includes bit lines 101, PCM 102, liner 103, and word lines 104. According to at least one embodiment, PCM 102 is in turn a top electrode and a GST (germanium antimony terbium or Ge 2 Sb 2 Te 5 The substrate includes a layer of a phase change material, such as ZnO, a liner material, and a bottom electrode. According to some embodiments of the present invention, the liner material includes a thin film of a conductive oxide, such as aluminum (Al) doped zinc oxide (ZnO), hereafter referred to as AZO. The liner material can be formed, for example, by doping ZnO with Al (AZO), indium oxide with tin (ITO), or other metal oxides doped to be conductive oxides, or by depositing conductive oxides.

[0020] According to some embodiments of the present invention, the liner acts as an inert cap. According to some embodiments of the present invention, the liner acts as a thermal barrier to reduce heat loss to the underlying bottom electrode during electrical programming (amorphization or crystallization). According to one or more embodiments of the present invention, ZnO is a semiconductor material whose resistance can be precisely controlled by Al doping.

[0021] Referring to FIG. 2 , according to some embodiments, the PCM 102 includes a top electrode 201 (e.g., a metal or metal nitride (XN, where X is any transition metal that forms a suitable nitride, such as tantalum (Ta), titanium (Ti), or tungsten (W)), a phase change material 202 / 205 (e.g., GST), a conductive oxide liner material 203, and a bottom electrode 204 (e.g., a metal or metal nitride (XN, where X is any transition metal that forms a stable nitride, such as Ta, Ti, or W).

[0022] Phase change material 202 / 205 may include first portion 202 and second portion 205, or both. It should be appreciated that GST is useful as a storage or memory medium due to its ability to undergo a reversible phase change between an amorphous state and a crystalline state when heated or cooled rapidly or heated slowly. According to one or more embodiments, a first portion of GST 202 is GST in an amorphous state and a second portion of GST 205 is GST in a crystalline state. Portion 202 can be electrically programmed to GST in a crystalline state. It should be appreciated that portions 202 and 205 are the same material and the presence of portion 202 depends on the state of the device, i.e., when GST becomes amorphous it is reset (high resistance) and then portion 202 is present.

[0023] According to some embodiments, the PCM 102 is disposed on a dielectric layer 206. According to some embodiments, the dielectric layer 206 is made of silicon dioxide (SiO 2 ), silicon nitride (SiN x ), aluminum oxide (Al 2 O 3 ) etc.

[0024] According to some embodiments, the PCM 102 has a thickness (A-A') between about 20 nanometers (nm) and 100 nm, and a lateral size (B-B') between about 40 nm and 500 nm, and a bottom contact size between about 10 nm and 50 nm.

[0025] According to some embodiments, the conductive oxide liner material 203 does not oxidize significantly in air and therefore acts as an inert cap. Moreover, the conductive oxide liner material 203 maintains its resistance even when exposed (e.g., to the environment). According to some embodiments, the liner acts as a thermal barrier between the PCM and the bottom electrode. Within the conductive oxide liner material 203, the layer containing the metal oxide (e.g., InOx, ZnOx) is semiconducting and its resistance can be precisely controlled by metal doping (e.g., tin (Sn), Al). The conductive oxide liner material 203 can be deposited by atomic layer deposition (ALD) or physical vapor deposition (PVD). According to some embodiments, the conductive oxide liner material 203 has a thickness of about 1-15 nanometers (nm). According to some embodiments, the thickness of the conductive oxide liner is adjusted in proportion to the thickness of the PCM layer to achieve good reversible phase change properties. For example, for the devices of Figures 4 and 8, the PCM layer can have a resistance of about 0.1 to 10 times the resistance of the PCM crystals depending on the thickness of the conductive oxide liner.

[0026] 3, according to some embodiments, the PCM 102 includes a top electrode 201, a GST layer 202 / 205, an Al layer 301 on top of a conductive oxide liner material 203, and a bottom electrode 203. The PCM 102 is disposed within layer 206.

[0027] 4, according to some embodiments, the PCM 102 includes a top electrode 102, a GST layer 202 / 205, an Al layer 401, and a bottom electrode 204. The PCM 102 is disposed within layer 206.

[0028] According to some embodiments, the metal liner material 401 contains Al and has a thickness of about 10 nanometers (nm). The metal liner material 401 can be deposited by sputtering, evaporation, chemical vapor deposition (CVD), etc. According to some embodiments, after deposition, the metal liner material 401 can be annealed, such as by forming gas (FG) annealing. Table 1 lists the process for conventional control structures. Table 1 further lists exemplary liners and structures according to embodiments of the present invention and their associated average resistance change upon reset (i.e., of PCM). In Table 1, the liners are shown with the temperature at which they were deposited (As-dep).

[0029] 5 is a graph of resistance over time for different liners according to some embodiments of the present invention. The resistance of a conventional device with only GST 501 is higher than either GST with a conductive oxide liner 502 or GST with a conductive oxide / Al liner 503.

[0030] [Table 1]

[0031] Referring to FIG. 6, according to some embodiments, a method for manufacturing a PCM device includes providing an intermediate front-end off-line (FEOL) or BEOL wafer including word lines and liners (see FIG. 1) in block 601, forming a dielectric layer 206 in block 602, forming a bottom electrode 204 in block 603, forming a liner material 203 in block 604, forming a phase change material 202 / 205 in block 605, forming a top electrode 201 in block 606, and integrating the PCM device into a computing device in block 607 (e.g., including forming bit lines 101).

[0032] As described below, the dielectric layer 206 may be formed from one or more layers, and forming components such as the liner material in block 604 may further include depositing and patterning layers of dielectric.

[0033] According to one or more embodiments, the bottom electrode 204 is embedded within the dielectric layer 206. Although a single bottom electrode 204 has been described and illustrated, multiple bottom electrodes may be formed within the dielectric layer 206.

[0034] According to some embodiments, the dielectric layer 206 may be, for example, SiO 2 , Si 3 N 4 , silicon oxynitride (N 2 OSi 2 ), silsesquioxanes, or carbon-doped oxides (i.e., organosilicates) containing Si, C, and H atoms. In some embodiments, the dielectric layer 206 is not porous. In other embodiments, the dielectric layer 206 is porous. In some embodiments, a single dielectric material may be used as the dielectric layer 206. In other embodiments, multiple dielectric materials may be used as the dielectric layer 206.

[0035] According to some embodiments, the dielectric layer 206 is formed over a base substrate (not shown). The base substrate may include semiconducting materials, insulating materials, and conductive materials (e.g., word lines), or combinations thereof. The dielectric layer 206 may be formed using, for example, CVD, plasma enhanced chemical vapor deposition (PECVD), spin-on coating, evaporation, chemical solution deposition, and the like.

[0036] In some embodiments, a first opening is formed in the dielectric layer 206, and then the bottom electrode 204 is formed in the first opening 603. The first opening can be formed using lithography and etching. Lithography involves providing a photoresist material (not shown) on the top surface of the dielectric layer 206, exposing the photoresist material to a desired pattern of radiation, and then developing the exposed photoresist using a conventional resist developer. Etching is then used to transfer the pattern from the patterned photoresist material to the underlying dielectric layer 206. Etching can include dry etching processes (e.g., reactive ion etching (RIE), ion beam etching, plasma etching, and laser ablation, or a combination thereof), and wet chemical etching processes, or a combination thereof. In one embodiment, RIE is used to provide an opening in the dielectric layer 206. In some embodiments, an anisotropic etch is used to provide an opening with vertical sidewalls. In other embodiments, an isotropic etch is used to provide openings with non-vertical (i.e., sloping) sidewalls.Following the pattern transfer, the photoresist material can be removed using a resist stripping process, such as ashing.

[0037] After forming the openings in the dielectric layer 206, the bottom electrode 204 is formed in block 603 by depositing a conductive material in the openings. According to some embodiments, the conductive metal material for providing the bottom electrode 204 is, for example, titanium nitride (TiN), tungsten (W), silver (Ag), gold (Au), aluminum (Al), or a stack of multiple layers thereof. The conductive metal material can be formed by a deposition process, for example, CVD, PECVD, physical vapor deposition (PVD), sputtering, atomic layer deposition (ALD), or plating. If the dielectric layer 206 is deposited as multiple layers, a planarization process or an etch-back process follows the deposition of the conductive metal material for providing the bottom electrode 204.

[0038] According to some embodiments, the bottom electrode 204 is formed by depositing a conductive metal material on the surface of a base substrate (not shown) and subsequently patterning the deposited conductive metal material by lithography and etching. The dielectric layer 206 can then be formed by deposition of a dielectric material followed by a planarization or etch-back process.

[0039] According to one or more embodiments of the invention, at block 604, a second opening is formed in the dielectric layer 206 (e.g., in a second portion of the dielectric layer 206 formed over the bottom electrode 204) and a liner material 203 is formed in the second opening. According to some embodiments, the liner material 203 may be deposited by atomic layer deposition (ALD) or sputtering. According to at least one embodiment, the liner material 203 is planarized after deposition using process steps similar to those described with respect to the bottom electrode 204.

[0040] According to one or more embodiments of the invention, at block 605, a third opening is formed in dielectric layer 206 (e.g., a third portion of dielectric layer 206 formed over liner material 203), and phase change material 202 / 205 is formed in the third opening. Phase change material 202 / 205 may include the first and second portions of GST, or both. According to at least one embodiment, phase change material 202 / 205 is planarized after deposition in a manner similar to that described with respect to bottom electrode 204.

[0041] According to one or more embodiments of the invention, at block 606, a fourth opening is formed in dielectric layer 206 (e.g., a third portion of dielectric layer 206 formed over phase change material 202 / 205) and top electrode 201 is formed in the fourth opening. This embodiment includes process steps to planarize top electrode 201, similar to those described with respect to bottom electrode 204.

[0042] According to one embodiment of the present invention, a phase change memory (PCM) device includes a dielectric layer 206, a bottom electrode 204 deposited in the dielectric layer, a liner material 203 disposed on the bottom electrode 204 and within the dielectric layer, a phase change material 202 / 205 disposed on the liner material and within the dielectric layer, and a top electrode 201 disposed on the phase change material and within the dielectric layer.

[0043] According to some embodiments, a method for manufacturing a phase change memory (PCM) device includes providing a substrate 601, forming a first structure 602 / 603 having a first dielectric layer and a bottom electrode, where the bottom electrode is disposed in a first dielectric layer, and the bottom electrode and first dielectric layer are disposed on the substrate, forming a liner material 604 on the bottom electrode and disposed in a second dielectric layer, forming a phase change material 605 on the liner material and in a third dielectric layer, and forming a top electrode 606 on the phase change material and in a fourth dielectric layer.

[0044] According to one or more embodiments, the PCM device can have a variety of other configurations (see, e.g., FIGS. 7 and 8). For example, a PCM device according to some embodiments is configured as a bridge cell 700 (see FIG. 7) that includes a conductive oxide liner material 705 disposed on top of a thin PCM 704. The PCM 704 is formed on first and second metal electrodes 701 and 702 separated by an interlayer dielectric (ILD) 703.

[0045] According to some embodiments, the PCM device is configured as a buried cell device 800 (see FIG. 8 ) having a conductive oxide 805 formed in an intermediate layer 807 and lining a via 806 surrounding a PCM 804. The buried cell device includes a top electrode 801 and a bottom electrode 802, each disposed, for example, in a dielectric 803. The top electrode 801 is disposed above the via and contacts the conductive oxide 805 and a surface of the PCM 804. The bottom electrode 802 is disposed below the via and contacts the underside of the conductive oxide 805.

[0046] According to some embodiments, the sidewalls of the vias 806 can have different configurations, such as vertical sidewalls. According to some embodiments, the liner 805 can be disposed only on the sidewalls of the vias 806, and the PCM 804 directly contacts the top electrode 801 and the bottom electrode 802. According to one or more embodiments, the PCM 804 is separated from one or more of the electrodes 801-802 by the liner 805.

[0047] As illustrated in Figures 7 and 8 and described herein, the presence of the amorphous PCM (a-PCM) portion 202 of the PCM depends on the state of the device.

[0048] According to one embodiment of the present invention, a phase change memory (PCM) device 102 includes a dielectric layer 206, a bottom electrode 204 disposed in the dielectric layer, a liner material 203 disposed on the bottom electrode, a phase change material 205 disposed on the liner material, and a top electrode 201 disposed on the phase change material and in the dielectric layer.

[0049] According to some embodiments, a method for manufacturing a phase change memory (PCM) device includes providing a substrate 601, forming a first structure including a first dielectric layer 602 and a bottom electrode 603, with a bottom electrode disposed in a first dielectric layer, the bottom electrode and the first dielectric layer disposed on the substrate, forming a liner material 604 disposed on the bottom electrode and in the second dielectric layer, forming a phase change material 605 on the liner material and in a third dielectric layer, and forming a top electrode 606 disposed on the phase change material and in a fourth dielectric layer.

[0050] According to some embodiments, a phase change memory (PCM) device includes a dielectric layer 703, a first electrode 701 disposed on a first side of the dielectric layer, a second electrode 702 disposed on a second side of the dielectric layer opposite the first electrode, a phase change material 704 disposed on the dielectric layer, the first and second electrodes, and a liner material 705 disposed on the phase change material.

[0051] Although the invention has been described in terms of given example architectures, it will be appreciated that other architectures, structures, substrate materials, and process features and steps may be modified within the scope of the invention.

[0052] Additionally, when an element, such as a layer, region, or substrate, is referred to as "on" or "over" another element, it will be understood that it can be directly on the other element, or intervening elements may be present. In contrast, when an element is referred to as "directly on" or "directly on" another, there are no intervening elements present. Also, when an element is referred to as being "connected" or "coupled" to another element, it can be directly coupled or connected to the other element or to intervening elements that may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0053] This embodiment may include an integrated circuit chip design that may be generated in a graphical computer programming language and recorded on a computer storage medium (either a disk, tape, physical hard drive, or a virtual hard drive such as a storage access network). If the designer does not manufacture the chip or the photolithographic mask used to manufacture the chip, the designer may directly or indirectly communicate the resulting design to such an entity by physical means (e.g., by providing a copy of the storage medium on which the design is recorded) or electronically (e.g., over the Internet). The recorded design is then converted into an appropriate format (e.g., GDSII) for the manufacture of a photolithographic mask, which typically contains multiple copies of the chip design in question to be formed on a wafer. The photolithographic mask is used to define the areas of the wafer (and layers thereon, or both) to be etched or otherwise processed.

[0054] The methods described herein can be used in the manufacture of integrated circuits. The resulting integrated circuit chips can be distributed by the manufacturer in raw wafer form (i.e., a single wafer having many unpackaged chips), as bare die, or in packaged form. In the latter case, the chips can be mounted in a single chip package (such as a plastic carrier, with leads for attachment to a motherboard or other higher-level carrier), or in a multi-chip carrier (such as a ceramic carrier with either surface interconnects or embedded interconnects, or both). In any case, the chips are subsequently integrated with other chips, discrete circuit elements, and other signal processing devices, or combinations thereof, as part of either (a) an intermediate product, such as a motherboard, or (b) a final product. The final product can be any product that contains an integrated circuit, from toys and other low-end applications to more advanced computer products with displays, keyboards, or other input devices, and a central processing unit.

[0055] Material compositions should be understood as being described in terms of the listed elements, e.g., SiGe. These compositions may include different percentages of elements within the composition, e.g., SiGe may include SiGe1-x, where x is 1 or less. In addition, other elements may be included in the composition and still function in accordance with the principles of the present invention. Compositions having additional elements are referred to herein as alloys.

[0056] References in the specification to "one embodiment" or "one embodiment" of the present principles mean that the particular features, structures, characteristics, and embodiments so recited are included in at least one embodiment of the present principles, in addition to other variations. Thus, the meanings of the terms "in one embodiment" or "in one embodiment" do not necessarily all refer to the same embodiment, as well as any other variations that may appear in various places throughout the specification.

[0057] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this respect, each block in the flowcharts or block diagrams may represent a module, segment, or portion of an instruction, which includes one or more executable instructions for implementing a particular logical function(s) (or functions). In some alternative implementations, the functions described in the blocks may be executed in an order other than that shown. For example, two blocks shown in succession may be executed substantially simultaneously, or the blocks may be executed in reverse order, depending on the functionality involved. It is also noted that each block in the block diagrams and / or flowchart illustrations and combinations of blocks in the block diagrams and flowchart illustrations or combinations thereof may be implemented by a system based on special purpose hardware that performs a particular function or operation or executes specific purpose hardware and computer instructions.

[0058] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting of the present invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "comprises" and "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and components, or combinations thereof, but do not exclude one or more other features, integers, steps, operations, elements, components, and groups thereof, or combinations thereof.

[0059] All equivalents of the corresponding structures, materials, acts, and means or steps in the claims that add functional elements are intended to include any structures, materials, or acts that function in combination with elements recited in other claims as specifically recited in the claims. The description of various embodiments of the present invention is presented for illustrative purposes, but is not intended to be exclusive or to limit the disclosed embodiments. Many modifications and variations will be obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The terms used in this specification are selected to best explain the principles of the embodiments, practical applications or technical improvements beyond the technology found in the market, or to allow those outside the ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. 1. A phase change memory (PCM) device comprising: A dielectric layer; a bottom electrode disposed within the dielectric layer; a liner material disposed over the bottom electrode and including a metal layer formed of Al disposed over a thin film of conductive oxide; a phase change material disposed on the liner material; a top electrode disposed over the phase change material and within the dielectric layer; A phase change memory (PCM) device comprising:

2. the bottom electrode is formed from one of a first metal and a first metal nitride, and the top electrode is formed from one of a second metal and a second metal nitride, the bottom electrode and the top electrode being formed from one of the same material and different materials.

2. The PCM of claim 1.

3. The PCM of claim 1 or 2, wherein the liner material and the phase change material are disposed within the dielectric layer.

4. the dielectric layer includes a first dielectric layer and a second dielectric layer, the bottom electrode is formed within the first dielectric layer and the top electrode is formed within the second dielectric layer; the liner material and the phase change material are disposed within a via formed in an intermediate layer between the first dielectric layer and the second dielectric layer; Further, the liner material contacts the top electrode and the bottom electrode. A PCM according to any one of claims 1 to 3.

5. 5. The PCM of claim 1, wherein the thin conductive oxide film is one of Al-doped ZnO (AZO), doped indium oxide (ITO), and a doped metal oxide.

6. The PCM of any preceding claim, wherein the dielectric layer comprises a plurality of dielectric layers.

7. 1. A method for manufacturing a phase change memory (PCM) device, comprising: Providing a substrate; forming a first structure including a first dielectric layer and a bottom electrode, the first dielectric layer being disposed within the first dielectric layer, the bottom electrode and the first dielectric layer being disposed over the substrate; a liner material disposed over the bottom electrode and within the second dielectric layer; forming a thin film of a conductive oxide on the bottom electrode; and forming a metal layer on said thin conductive oxide film; forming the forming a phase change material over the liner material and within the third dielectric layer; and forming a top electrode disposed over the phase change material and within the fourth dielectric layer; A method for manufacturing a phase change memory (PCM) comprising:

8. the bottom electrode is formed from a first metal or metal nitride and the top electrode is formed from a second metal or metal nitride, the first metal nitride and the second metal nitride being one of the same metal nitride and different nitrides. The method of claim 7.

9. 9. The method of claim 7, wherein the thin conductive oxide film is one of Al-doped ZnO (AZO), doped indium oxide (ITO), and doped metal oxides.

10. The method of any one of claims 7 to 9, further comprising sequentially depositing and patterning said first, second, third and fourth dielectric layers.

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