SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a technique capable of suppressing retention of a flow of a substrate and improving a throughput.SOLUTION: A substrate processing system includes a carrying-in part, a batch processing part, a sheet processing part, an export part, an interface part, and a second interface part. The carrying-in part and the export part are separately provided. The second interface part, the batch processing part, the interface part, and the sheet processing part are arranged in this order along a conveyance direction of the substrate between the carrying-in part and the export part. The interface part includes a first transition device, a conveyance region, and a second transition device in this order along a conveyance direction of the substrate. Each of the first transition device and the second transition device temporally stores the substrate, and the conveyance device is provided in the conveyance region. The conveyance device conveys the substrate from the first transition device to the second transition device.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing system and a substrate processing method. [Background technology]

[0002] The drying apparatus described in Patent Document 1 includes a buffer tank, a transfer unit, and a rotary dryer. The buffer tank holds the semiconductor wafers that have been washed in water. The semiconductor wafers are washed with a plurality of wafers placed on a single holder, and are held in the water of the buffer tank while still placed on the holder. The transfer unit picks up the semiconductor wafers one by one from the buffer tank and transfers them. The rotary dryer supports one semiconductor wafer transferred by the transfer unit so that its main surface is horizontal, rotates it at high speed, and removes water. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 9-162157 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique that can prevent stagnation of the flow of substrates and improve throughput. [Means for solving the problem]

[0005] A substrate processing system according to an embodiment of the present disclosure includes an input section into which a cassette containing a plurality of substrates is input, a batch processing section for processing a lot including a plurality of substrates in a batch, a single wafer processing section for processing the substrates of the lot one by one, an unloading section into which the cassette containing the plurality of substrates is output, an interface section for transferring the substrates between the batch processing section and the single wafer processing section, and a second interface section for transferring the substrates between the input section and the batch processing section. The input section and the unloading section are provided separately, and the second interface section, the batch processing section, the interface section, and the single wafer processing section are arranged in this order between the input section and the unloading section along a transport direction of the substrate. The interface section includes a first transition device, a transport area, and a second transition device, in this order, along the transport direction of the substrate. The first transition apparatus and the second transition apparatus each temporarily store the substrate, and a transfer apparatus is provided in the transfer region, and the transfer apparatus transfers the substrate from the first transition apparatus to the second transition apparatus. Effect of the Invention

[0006] According to one aspect of the present disclosure, stagnation of the flow of substrates can be suppressed, thereby improving throughput. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing system according to an embodiment. [Diagram 2] FIG. 2 is a flowchart showing a substrate processing method according to an embodiment. [Diagram 3] FIG. 3 is a plan view showing an example of the lot formation section of FIG. [Figure 4A] FIG. 4A is a side view showing an example of the operation of the lot formation unit of FIG. [Figure 4B] FIG. 4B is a side view showing an example of the operation of the lot formation unit, following FIG. 4A. [Figure 4C]FIG. 4C is a side view showing an example of the operation of the lot formation unit, following FIG. 4B. [Diagram 5] FIG. 5 is a plan view showing an example of the lot release unit of FIG. [Figure 6A] FIG. 6A is a cross-sectional view showing an example of the operation of the lot release unit of FIG. [Figure 6B] FIG. 6B is a cross-sectional view showing an example of the operation of the lot release unit, following FIG. 6A. [Figure 6C] FIG. 6C is a cross-sectional view showing an example of the operation of the lot release unit, following FIG. 6B. [Figure 7] FIG. 7 is a side view showing an example of the transport section of the interface section of FIG. [Figure 8] FIG. 8 is a side view showing another example of the conveying section. [Figure 9] FIG. 9 is a perspective view illustrating an example of the drying device of FIG. [Figure 10] FIG. 10 is a plan view showing a substrate processing system according to a first modified example. [Figure 11] FIG. 11 is a plan view showing a substrate processing system according to a second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and the description thereof may be omitted.

[0009] As shown in FIG. 1, the substrate processing system 1 includes a loading / unloading section 2, a single wafer processing section 3, an interface section 5, a batch processing section 6, and a control section 9. The loading / unloading section 2 includes a mounting table 21 on which a cassette C is mounted. The cassette C accommodates a plurality of substrates W (e.g., 25 substrates) and is loaded into and unloaded from the loading / unloading section 2. Inside the cassette C, the substrates W are held horizontally and held vertically at a second pitch P2 (P2=N×P1) that is N times the first pitch P1. N is a natural number of 2 or more, which is 2 in this embodiment, but may be 3 or more. The single wafer processing section 3 processes the substrates W one by one. The interface section 5 transfers the substrates W between the single wafer processing section 3 and the batch processing section 6. The batch processing section 6 processes a lot L including a plurality of substrates W (e.g., 50 substrates) at the first pitch P1 in a batch. One lot L is composed of substrates W in, for example, N cassettes C.

[0010] The load / unload section 2, single wafer processing section 3, interface section 5, and batch processing section 6 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction. The substrate W is transported from the load / unload section 2 in the order of arrows A1, A2, A3, A4, and A5 shown in Fig. 1, and returns to the load / unload section 2. Since the load / unload section 2 serves as both the load section and the unload section, the substrate processing system 1 can be made compact.

[0011] The loading / unloading section 2 has a mounting table 21, which has a plurality of mounting plates 22. A plurality of cassettes C are mounted on the plurality of mounting plates 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0012] The loading / unloading section 2 has a first transport area 23, which is adjacent to the mounting table 21 and disposed on the positive side of the mounting table 21 in the X-axis direction. A first transport device 24 is provided in the first transport area 23. The first transport device 24 has a first transport arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The first transport arm transports the substrate W between the cassette C and a transfer section 25 described below. The number of first transport arms may be one or more, and in the latter case, the first transport device 24 transports multiple substrates W (e.g., five substrates) at a time.

[0013] The loading / unloading section 2 has a transfer section 25, which is adjacent to the first transfer region 23 and is disposed on the positive side of the first transfer region 23 in the X-axis direction. The transfer section 25 has a first transition device 26 that temporarily stores the substrate W. There may be more than one first transition device 26, and more than one first transition device 26 may be stacked vertically. The first transition device 26 receives the substrate W from the first transfer device 24 and temporarily stores it until it is handed over to the second transfer device 32 described below. The first transition device 26 also receives the substrate W from the second transfer device 32 and temporarily stores it until it is handed over to the first transfer device 24.

[0014] The single wafer processing unit 3 has a second transfer area 31, which is adjacent to the delivery unit 25 and is disposed on the positive side of the delivery unit 25 in the X-axis direction. A second transfer device 32 is provided in the second transfer area 31. The second transfer device 32 has a second transfer arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The second transfer arm transfers substrates between devices adjacent to the second transfer area 31. The number of second transfer arms may be one or more, and in the latter case, the second transfer device 32 transfers multiple substrates W (e.g., five substrates) at a time.

[0015] The single wafer processing section 3 includes, for example, a second transition device 33, a liquid processing device 34, and a drying device 35, adjacent to the second transfer region 31. The second transition device 33 is adjacent to the second transfer region 31 and is disposed on the X-axis direction positive side of the second transfer region 31. The second transition device 33 receives the substrate W from the second transfer device 32 and temporarily stores the substrate W until it is delivered to the interface section 5. The liquid processing device 34 is of a single wafer type and processes the substrate W one by one with a processing liquid. There may be a plurality of processing liquids, for example, pure water such as DIW and a drying liquid having a surface tension lower than that of pure water. The drying liquid may be, for example, alcohol such as IPA (isopropyl alcohol). The drying device 35 is of a single wafer type and dries the substrate W one by one with a supercritical fluid. Note that both the liquid processing device 34 and the drying device 35 do not have to be of a single wafer type, and the liquid processing device 34 may be of a single wafer type and the drying device 35 may be of a batch type. The drying apparatus 35 may collectively dry a plurality of substrates W with the supercritical fluid. The number of substrates W collectively processed in the drying apparatus 35 may be equal to or greater than the number of substrates W collectively processed in the batch processing unit 6, but may be less than the number of substrates W collectively processed in the batch processing unit 6.

[0016] The arrangement and number of liquid processing apparatus 34 and drying apparatus 35 are not limited to those shown in FIG. 1. For example, liquid processing apparatus 34 may be arranged on both sides of second transport region 31 in the Y-axis direction. Also, liquid processing apparatus 34 may be stacked in the Z-axis direction. The arrangement of drying apparatus 35 is similar to that of liquid processing apparatus 34. Also, apparatuses other than liquid processing apparatus 34 and drying apparatus 35 may be arranged next to second transport region 31.

[0017] The interface section 5 has, for example, a lot forming section 51 and a transport section 52. The lot forming section 51 holds a plurality of substrates W at a first pitch P1 to form a lot L. The transport section 52 transports substrates W from the single wafer processing section 3 to the lot forming section 51, and also transports substrates W from the batch processing section 6 to the single wafer processing section 3.

[0018] 7, the transfer section 52 includes a first transfer robot 53 and a second transfer robot 54. The first transfer robot 53 transfers the substrate W from the single wafer processing section 3 to the lot formation section 51. The second transfer robot 54 transfers the substrate W from the batch processing section 6 to the single wafer processing section 3. Note that the transfer section 52 may include one transfer robot 41 that serves as both the first transfer robot 53 and the second transfer robot 54 as shown in FIG.

[0019] Since the first transport robot 53 and the second transport robot 54 are provided separately, it is possible to separately control the flow A1 of substrates W from the single wafer processing unit 3 to the batch processing unit 6 and the flow A3 of substrates W from the batch processing unit 6 to the single wafer processing unit 3. This makes it possible to prevent the flow of substrates W from stagnating in the interface unit 5, thereby improving throughput.

[0020] The batch processing unit 6 has a third transfer region 61, which is adjacent to the interface unit 5 and is disposed on the positive side of the interface unit 5 in the X-axis direction. A third transfer device 62 is provided in the third transfer region 61. The third transfer device 62 has a third transfer arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates about a vertical axis. It is noted that the third transfer arm does not have to rotate about the vertical axis. The third transfer arm transports substrates W between devices adjacent to the third transfer region 61. The third transfer arm transports lots L in a batch.

[0021] The third transfer area 61 is rectangular in plan view, and its longitudinal direction is the X-axis direction. The lot formation unit 51 is disposed adjacent to the short side of the third transfer area 61, a processing bath (e.g., a third rinsing liquid bath 68) is disposed adjacent to the long side of the third transfer area 61, and the transfer unit 52 is disposed adjacent to both the lot formation unit 51 and the processing bath. Since the transfer unit 52 has easy access to both the lot formation unit 51 and the processing bath, the first transfer robot 53 and the second transfer robot 54 can be robots with a narrow range of movement of their hands.

[0022] Incidentally, since the lot formation section 51 is disposed next to the short side of the third transfer region 61 and the processing tank is disposed next to the long side of the third transfer region 61, the arrangement direction of the substrates W differs between the lot formation section 51 and the processing tank. Therefore, the third transfer device 62 rotates around a vertical axis. By rotating the third transfer device 62, the arrangement direction of the substrates W can be changed between the X-axis direction and the Y-axis direction. Note that if it is not necessary to change the arrangement direction of the substrates, the third transfer device 62 does not need to rotate around the vertical axis.

[0023] The batch processing unit 6 has, for example, a first chemical liquid tank 63, a first rinsing liquid tank 64, a second chemical liquid tank 65, a second rinsing liquid tank 66, a third chemical liquid tank 67, and a third rinsing liquid tank 68 adjacent to the third transfer region 61. These processing tanks are arranged along the long side of the third transfer region 61. Specifically, the first chemical liquid tank 63, the first rinsing liquid tank 64, the second chemical liquid tank 65, the second rinsing liquid tank 66, the third chemical liquid tank 67, and the third rinsing liquid tank 68 are arranged in this order from the positive side in the X-axis direction to the negative side in the X-axis direction.

[0024] The number of processing tanks arranged adjacent to the third transfer region 61 is not limited to that shown in Fig. 1. For example, the second chemical liquid tank 65 and the second rinsing liquid tank 66 are one set in Fig. 1, but may be multiple sets.

[0025] The first chemical liquid tank 63 stores a first chemical liquid in which the lot L is immersed. The first chemical liquid is not particularly limited, but is, for example, DHF (dilute hydrofluoric acid). DHF removes native oxide films. BHF (a mixture of hydrofluoric acid and ammonium fluoride) may be used instead of DHF. The first rinsing liquid tank 64 stores a first rinsing liquid in which the lot L is immersed. The first rinsing liquid is pure water that removes the first chemical liquid from the substrate W, and is, for example, DIW (deionized water).

[0026] The batch processing unit 6 has a first processing tool 71 that receives and holds the lot L from the third transfer device 62. The first processing tool 71 holds the multiple substrates W at a first pitch P1 in the Y-axis direction, and holds each of the multiple substrates W vertically. The batch processing unit 6 also has a first driving device 72 that moves the first processing tool 71 in the X-axis direction and the Z-axis direction. The first processing tool 71 holds the lot L in a first chemical liquid, then holds the lot L in a first rinse liquid, and then transfers the lot L to the third transfer device 62.

[0027] In this embodiment, the number of units including the first processing tool 71 and the first driving device 72 is one, but it may be more than one. In the latter case, one unit immerses the lot L in the first chemical liquid, and another unit immerses the lot L in the first rinsing liquid. In this case, the first driving device 72 only needs to move the first processing tool 71 in the Z-axis direction, and does not need to move the first processing tool 71 in the X-axis direction.

[0028] The second chemical liquid tank 65 stores a second chemical liquid in which the lot L is immersed. The second chemical liquid is not particularly limited, but is, for example, an aqueous phosphoric acid solution. The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film out of the silicon oxide film and the silicon nitride film. The second rinsing liquid tank 66 stores a second rinsing liquid in which the lot L is immersed. The second rinsing liquid is pure water that removes the second chemical liquid from the substrate W, and is, for example, DIW (deionized water).

[0029] The batch processing unit 6 has a second processing tool 73 that receives and holds the lot L from the third transfer device 62. Similar to the first processing tool 71, the second processing tool 73 holds the multiple substrates W in the Y-axis direction at a first pitch P1 and holds each of the multiple substrates W vertically. The batch processing unit 6 also has a second driving device 74 that moves the second processing tool 73 in the Z-axis direction. The second processing tool 73 holds the lot L in the second chemical liquid and then passes the lot L to the third transfer device 62.

[0030] Similarly, the batch processing unit 6 has a third processing tool 75 that receives and holds the lot L from the third transfer device 62. Like the first processing tool 71, the third processing tool 75 holds multiple substrates W at a first pitch P1 in the Y-axis direction and holds each of the multiple substrates W vertically. In addition, the batch processing unit 6 has a third driving device 76 that moves the third processing tool 75 in the Z-axis direction. The third processing tool 75 holds the lot L in the second rinsing liquid and then passes the lot L to the third transfer device 62.

[0031] The third chemical liquid tank 67 stores a third chemical liquid in which the lot L is immersed. The third chemical liquid is not particularly limited, but is, for example, SC1 (a mixture of ammonia, hydrogen peroxide, and water). SC1 removes organic matter and particles. The third rinsing liquid tank 68 stores a third rinsing liquid in which the lot L is immersed. The third rinsing liquid is pure water that removes the third chemical liquid from the substrate W, and is, for example, DIW (deionized water).

[0032] The batch processing unit 6 has a first holder 811 that receives and holds the lot L from the third transfer device 62. The first holder 811 holds the multiple substrates W at a first pitch P1 in the Y-axis direction, and holds each of the multiple substrates W vertically. The batch processing unit 6 also has a drive device 818 that moves the first holder 811 in the X-axis direction and the Z-axis direction. The first holder 811 holds the lot L in the third chemical liquid, and then holds the lot L in the third rinse liquid.

[0033] In this embodiment, the number of units including first holder 811 and driving device 818 is one, but may be more than one. In the latter case, one unit immerses lot L in the third chemical liquid, and another unit immerses lot L in the third rinsing liquid. In this case, driving device 818 only needs to move first holder 811 in the Z-axis direction, and does not need to move first holder 811 in the X-axis direction.

[0034] Furthermore, the batch processing unit 6 has a second holder 814 that receives the multiple substrates W arranged at a second pitch P2 (P2=N×P1) from the first holder 811 in the third processing liquid. The first holder 811, the second holder 814, and the driving device 818 form a lot release unit 81.

[0035] The types of chemicals used in the batch processing unit 6 are not limited to dilute hydrofluoric acid, BFH, phosphoric acid aqueous solution, and SC1, but may be, for example, dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), a plating solution, etc. The chemicals may be for stripping or plating. The number of chemicals is not particularly limited, and may be one.

[0036] The control unit 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the substrate processing system 1. The control unit 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. The control unit 9 also includes an input interface 93 and an output interface 94. The control unit 9 receives signals from the outside via the input interface 93, and transmits signals to the outside via the output interface 94.

[0037] The above program is stored in, for example, a computer-readable storage medium, and is installed from the storage medium into the storage medium 92 of the control unit 9. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card. The program may be downloaded from a server via the Internet and installed into the storage medium 92 of the control unit 9.

[0038] Next, the operation of the substrate processing system 1, that is, the substrate processing method, will be described with reference to Fig. 2. The process shown in Fig. 2 is performed under the control of a control unit 9.

[0039] First, the cassette C containing a plurality of substrates W is carried into the carry-in / out section 2 and placed on the mounting plate 22. Inside the cassette C, the substrates W are held horizontally and held in the vertical direction at a second pitch P2 (P2=N×P1). N is a natural number of 2 or more, which is 2 in this embodiment, but may be 3 or more.

[0040] Next, the first transfer device 24 takes out the substrate W in the cassette C (S101 in FIG. 2) and transfers it to the first transition device 26. Then, the second transfer device 32 receives the substrate W from the first transition device 26 and transfers it to the second transition device 33. Thereafter, the first transfer robot 53 receives the substrate W from the second transition device 33 and transfers it to the lot formation section 51.

[0041] Next, the lot formation unit 51 holds multiple substrates W at a first pitch P1 (P1=P2 / N) to form a lot L (S102 in FIG. 2). One lot L is composed of substrates W in, for example, N cassettes C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W to be processed at once can be increased.

[0042] Next, the third transfer device 62 receives the lot L from the lot formation unit 51 and transfers it to the first processing tool 71. During the transfer, the third transfer device 62 rotates about a vertical axis to change the arrangement direction of the multiple substrates W from the X-axis direction to the Y-axis direction.

[0043] Next, the first processing tool 71 descends from above the first chemical liquid tank 63, immerses the lot L in the first chemical liquid, and performs the first chemical liquid processing (S103 in FIG. 2). After that, the first processing tool 71 ascends to pull the lot L out of the first chemical liquid, and then moves in the X-axis direction toward above the first rinsing liquid tank 64.

[0044] Next, the first processing tool 71 descends from above the first rinsing liquid tank 64, immerses the lot L in the first rinsing liquid, and performs the first rinsing liquid processing (S104 in FIG. 2). After that, the first processing tool 71 ascends to lift the lot L from the first rinsing liquid. Next, the third transfer device 62 receives the lot L from the first processing tool 71 and transfers it to the second processing tool 73.

[0045] Next, the second processing tool 73 descends from above the second chemical liquid tank 65, immerses the lot L in the second chemical liquid, and performs the second chemical liquid processing (S105 in FIG. 2). Thereafter, the second processing tool 73 ascends to lift the lot L from the second chemical liquid. Next, the third transfer device 62 receives the lot L from the second processing tool 73 and transfers it to the third processing tool 75.

[0046] Next, the third processing tool 75 descends from above the second rinse liquid tank 66, immerses the lot L in the second rinse liquid, and performs the second rinse liquid processing (S106 in FIG. 2). Thereafter, the third processing tool 75 ascends to lift the lot L from the second rinse liquid. Next, the third transfer device 62 receives the lot L from the third processing tool 75 and transfers it to the first holder 811.

[0047] Next, the first holder 811 descends from above the third chemical liquid tank 67, immerses the lot L in the third chemical liquid, and performs the third chemical liquid treatment (S107 in FIG. 2). After that, the first holder 811 ascends to lift the lot L from the third chemical liquid, and then moves in the X-axis direction toward above the third rinsing liquid tank 68.

[0048] Next, the first holder 811 descends from above the third rinsing liquid bath 68 to immerse the lot L in the third rinsing liquid, and a third rinsing liquid process is performed (S108 in FIG. 2).

[0049] Furthermore, during its descent, the first holder 811 passes a portion of the lot L to the second holder 814, widening the pitch of the substrates W from the first pitch P1 to a second pitch P2 (S109 in FIG. 2). The second holder 814 holds multiple substrates W at the second pitch P2, and the first holder 811 also holds multiple substrates W at the second pitch P2. The first holder 811 alternately holds substrates W to be passed to the second holder 814 and substrates W that it continues to hold without being passed to the second holder 814. In other words, the substrates W that are part of the lot L and the substrates W that are the remainder of the lot L are lined up alternately and repeatedly to form the lot L.

[0050] Next, the second transport robot 54 transports the substrates W, which are held by the first holder 811 and the second holder 814 in the third rinsing liquid, to the single wafer processing unit 3. Since the pitch of the substrates W is wide, interference between the substrates W and the second transport robot 54 can be prevented. In addition, the pitch of the substrates W when forming a lot L can be narrowed, allowing the number of substrates W to be processed at once to be increased. The second transport robot 54 transports the substrates W one by one to the liquid processing unit 34 of the single wafer processing unit 3.

[0051] Next, the liquid processing device 34 processes the substrates W one by one with liquid (S110 in FIG. 2). There may be multiple liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, alcohol such as IPA (isopropyl alcohol). The liquid processing device 34 supplies the pure water and the drying liquid in this order onto the upper surface of the substrate W to form a liquid film of the drying liquid.

[0052] Next, the second transfer device 32 receives the substrate W from the liquid processing device 34, and holds the substrate W horizontally with the film of the drying liquid facing upward. The second transfer device 32 transfers the substrate W from the liquid processing device 34 to the drying device 35.

[0053] Next, the drying device 35 dries the substrates W one by one with a supercritical fluid (S111 in FIG. 2). The drying liquid can be replaced with the supercritical fluid, and collapse of the uneven pattern of the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, single-wafer processing is performed instead of batch processing in order to reduce the size of the pressure-resistant container.

[0054] As shown in FIG. 9, the drying device 35 includes a pressure-resistant container 351, a movable tray 353, and a supply port 356. The pressure-resistant container 351 has an inlet / outlet 352 for loading / unloading the substrate W. The movable tray 353 has a lid 354 for opening / closing the inlet / outlet 352, and a holder 355 for holding the substrate W horizontally. With the lid 354 closing the inlet / outlet 352, the holder 355 holds the substrate W horizontally inside the pressure-resistant container 351. A concave-convex pattern is formed in advance on the upper surface of the substrate W, and a liquid film of the drying liquid covers the concave-convex pattern. The supply port 356 supplies a supercritical fluid such as carbon dioxide into the pressure-resistant container 351. The number and position of the supply ports 356 are not limited to those shown in FIG. 9. The single-wafer drying device 35 dries the substrates W on which the liquid film has been formed, one by one, with the supercritical fluid.

[0055] In this embodiment, the drying apparatus 35 is of a single wafer type, but as described above, it may be of a batch type. The batch type drying apparatus 35 dries a plurality of substrates W on which a liquid film is formed all at once with a supercritical fluid. The single wafer type drying apparatus 35 has one holding unit 355, whereas the batch type drying apparatus 35 has a plurality of holding units 355.

[0056] The drying device 35 of this embodiment dries the substrate W with a supercritical fluid, but the drying method is not particularly limited. The drying method may be any method that can prevent the concave-convex pattern of the substrate W from collapsing, and may be, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the substrate W is rotated and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W to the outer periphery of the substrate W, and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, N 2The supply position of a drying gas, such as a gas, may be moved from the center of the substrate W toward the outer periphery of the substrate W so as to follow the supply position of the drying liquid.

[0057] Thereafter, the second transfer device 32 receives the substrate W from the drying device 35 and transfers it to the first transition device 26.

[0058] Next, the first transport device 24 receives the substrate W from the first transition device 26, and stores it in the cassette C (S112 in FIG. 2). The cassette C is carried out from the carry-in / out section 2 with the plurality of substrates W stored therein.

[0059] Next, the lot formation section 51 will be described with reference to Figures 3, 4A, 4B, and 4C. Due to space limitations in the drawings, the number of substrates W is shown to be less than the actual number. The same is true for the number of first holding grooves 513, the number of second holding grooves 516, and the number of passing grooves 517.

[0060] The lot formation section 51 has a first holder 511, which holds a plurality of substrates W (e.g., 50 substrates, only 12 of the 50 substrates are shown in FIG. 4C) at a first pitch P1 in the X-axis direction to form a lot L. The first holder 511 has a plurality of first arms 512 as shown in FIG. 3. The number of first arms 512 is not limited to that shown in the figure.

[0061] Each of the multiple first arms 512 extends in the X-axis direction and has first holding grooves 513 arranged at a first pitch P1 in the X-axis direction. The outer periphery of the substrate W is inserted into the first holding grooves 513, which hold the outer periphery of the substrate W. The multiple first arms 512 hold the outer peripheries of each of the multiple substrates W at intervals along the circumferential direction.

[0062] Furthermore, the lot formation unit 51 has a second holder 514, which holds a plurality of substrates W (e.g., 25 substrates, only 6 of the 25 substrates are shown in FIG. 4B) at a second pitch P2 in the X-axis direction. The second holder 514 has a plurality of second arms 515 as shown in FIG. 3. The number of second arms 515 is not limited to that shown in the figure.

[0063] The multiple second arms 515 each extend in the X-axis direction and have second holding grooves 516 arranged at a second pitch P2 in the X-axis direction. The outer periphery of the substrate W is inserted into the second holding grooves 516, which hold the outer periphery of the substrate W. The multiple second arms 515 hold the outer peripheries of each of the multiple substrates W at intervals along the circumferential direction.

[0064] In addition, the multiple second arms 515 further have passing grooves 517 arranged at a second pitch P2 in the X-axis direction. The outer periphery of the substrate W is also inserted into the passing groove 517, but the passing groove 517 allows the substrate W to pass without holding the outer periphery of the substrate W. The passing groove 517 and the second holding groove 516 are arranged alternately in the X-axis direction. The passing groove 517 and the second holding groove 516 are arranged at the same position in the X-axis direction as any of the multiple first holding grooves 513.

[0065] Furthermore, lot formation section 51 has a driving device 518, which raises and lowers first holder 511 relative to second holder 514. First holder 511 is raised and lowered between a retracted position below second holder 514 (see FIG. 4B) and a lot formation position above second holder 514 (see FIG. 4C).

[0066] Next, the operation of the lot formation unit 51 will be described with reference to FIGS. 4A, 4B, and 4C again.

[0067] First, as shown in FIG. 4A, the first holder 511 stops at a receiving position lower than the second holder 514. However, the receiving position may be set above the second holder 514 as long as it is set between the retreat position and the lot formation position. The first transport robot 53 inserts a plurality of substrates W (e.g., five substrates, only two of the five substrates are shown in FIG. 4A) into the passage groove 517 of the second holder 514 and delivers them to the first holder 511. This operation is repeated a plurality of times, and the first holder 511 holds a plurality of substrates W (e.g., 25 substrates, only six of the 25 substrates are shown in FIG. 4A) at the second pitch P2. The first transport robot 53 may insert the substrates W one by one into the passage groove 517 of the second holder 514 and deliver them to the first holder 511.

[0068] Next, as shown in Fig. 4B, the first holder 511 descends from the receiving position to the retreat position to prevent interference between the substrate W and the first transfer arm 531 of the first transfer robot 53. Then, the first transfer robot 53 inserts a plurality of substrates W (e.g., five substrates, only two of the five substrates are shown in Fig. 4B) into the second holding groove 516 of the second holder 514 and delivers them to the second holder 514. This operation is repeated a plurality of times, and the second holder 514 holds a plurality of substrates W (e.g., 25 substrates, only six of the 25 substrates are shown in Fig. 4A) at the second pitch P2. The first transfer robot 53 may insert the substrates W one by one into the second holding groove 516 of the second holder 514 and deliver them to the second holder 514.

[0069] 4C, the first holder 511 rises from the retreat position to the lot formation position. On the way thereto, the first holder 511 receives the substrate W from the second holder 514 in the vacant first holding groove 513, and combines it with the substrate W originally held to form a lot L.

[0070] One lot L is composed of, for example, substrates W in N cassettes C. However, one lot L may be composed of substrates W in one cassette C, or may be composed of substrates W in three or more cassettes C. One lot L may include multiple substrates W at the first pitch P1.

[0071] Lot formation section 51 may further include a third holder (not shown). Similar to second holder 514, the third holder holds multiple substrates W at the second pitch P2 and passes the held substrates W to first holder 511. Since first holder 511 receives substrates W not only from second holder 514 but also from the third holder, the ratio N of the first pitch P1 to the second pitch P2 can be increased, and the number of substrates W to be processed at one time can be increased.

[0072] Next, the lot release section 81 will be described with reference to Figures 5, 6A, 6B, and 6C. Due to space limitations in the drawings, the number of substrates W is shown to be less than the actual number. The same is true for the number of first holding grooves 813, the number of second holding grooves 816, and the number of passing grooves 817.

[0073] The lot release section 81 has a first holder 811, which holds a plurality of substrates W (e.g., 50 substrates, only 12 of the 50 substrates are shown in FIG. 6A) at a first pitch P1 in the Y-axis direction as shown in FIG. 5. The first holder 811 has a plurality of first arms 812 as shown in FIG. 5. The number of first arms 812 is not limited to that shown in the figure.

[0074] Each of the multiple first arms 812 extends in the Y-axis direction and has first holding grooves 813 arranged at a first pitch P1 in the Y-axis direction. The outer periphery of the substrate W is inserted into the first holding grooves 813, which hold the outer periphery of the substrate W. The multiple first arms 812 hold the outer peripheries of each of the multiple substrates W at intervals along the circumferential direction.

[0075] Furthermore, the lot release section 81 has a second holder 814, which holds a plurality of substrates W (e.g., 25 substrates, only 6 of the 25 substrates are shown in FIG. 6B) at a second pitch P2 in the Y-axis direction as shown in FIG. 5. The second holder 814 has a plurality of second arms 815 as shown in FIG. 5. The number of second arms 815 is not limited to that shown in the figure.

[0076] The multiple second arms 815 each extend in the Y-axis direction and have second holding grooves 816 arranged at a second pitch P2 in the Y-axis direction. The outer periphery of the substrate W is inserted into the second holding grooves 816, which hold the outer periphery of the substrate W. The multiple second arms 815 hold the outer peripheries of each of the multiple substrates W at intervals along the circumferential direction.

[0077] In addition, the multiple second arms 815 further have passing grooves 817 arranged at a second pitch P2 in the Y axis direction. The outer periphery of the substrate W is also inserted into the passing groove 817, but the passing groove 817 allows the substrate W to pass without holding the outer periphery of the substrate W. The passing groove 817 and the second holding groove 816 are arranged alternately in the Y axis direction. The passing groove 817 and the second holding groove 816 are arranged at the same position in the Y axis direction as any of the multiple first holding grooves 813.

[0078] Furthermore, the lot release section 81 has a drive device 818, which raises and lowers the first holder 811 relative to the second holder 814. The first holder 811 is raised and lowered between a descent start position (see FIG. 6A) above the second holder 814 and a descent end position (see FIG. 6B) below the second holder 814.

[0079] Next, the operation of the lot release unit 81 will be described with reference to FIGS. 6A, 6B, and 6C again.

[0080] 6A, the first holder 811 holds multiple substrates W in the Y-axis direction at a first pitch P1 at a descent start position. The first holder 811 vertically holds each of the multiple substrates W. The descent start position is set above the third rinsing liquid bath 68.

[0081] 6B, the first holder 811 descends to transfer a part of the lot L to the second holder 814. The second holder 814 receives the multiple substrates W arranged at the second pitch P2 from the first holder 811 in the third rinsing liquid. At the end of its descent, the first holder 811 holds the multiple substrates W that have passed through the passage grooves 817 of the second holder 814 at the second pitch P2.

[0082] As a result, the multiple substrates W are held in the third rinsing liquid separately by the first holder 811 and the second holder 814. The second holder 814 is higher than the first holder 811 and holds the multiple substrates W at the second pitch P2. Similarly, the first holder 811 holds the multiple substrates W at the second pitch P2. Each of the multiple substrates W is held vertically.

[0083] 6B, the second transport robot 54 receives the substrates W from the second holder 814, lifts the substrates W one by one from the third rinsing liquid, and transports them to the single wafer processing unit 3. Since the substrates W are held at the second pitch P2, interference between the substrates W and the second transport arm 541 of the second transport robot 54 can be prevented. The second transport robot 54 may lift the substrates W multiple by one from the third rinsing liquid. This lifting is repeated until all the substrates W are removed from the second holder 814.

[0084] 6C, the first holder 811 rises to transfer the substrate W to the second transport robot 54. The first holder 811 stops at a position slightly lower than the second holder 814, but may stop at a position higher than the second holder 814. It is sufficient that the substrate W continues to be immersed in the third rinsing liquid.

[0085] 6C, the second transport robot 54 receives the substrates W from the first holder 811, lifts the substrates W one by one from the third rinsing liquid, and transports them to the single wafer processing unit 3. Since the substrates W are held at the second pitch P2, interference between the substrates W and the second transport arm 541 of the second transport robot 54 can be prevented. The second transport robot 54 may lift the substrates W multiple by one from the third rinsing liquid. This lifting is repeated until all the substrates W are removed from the first holder 811.

[0086] As described above, the substrate W is held in the third rinsing liquid until it is lifted up from the third rinsing liquid by the second transport robot 54. Since the substrate W is below the liquid level of the third rinsing liquid, the surface tension of the third rinsing liquid does not act on the substrate W, and therefore the concave-convex pattern of the substrate W can be prevented from collapsing.

[0087] Lot release section 81 may further include a third holder (not shown). Similar to second holder 814, the third holder receives multiple substrates W arranged at the second pitch P2 from first holder 811 in the third rinsing liquid. Since first holder 811 passes substrates W not only to second holder 814 but also to the third holder, the ratio N of the first pitch P1 to the second pitch P2 can be increased.

[0088] The lot release unit 81 is installed in the third rinsing liquid tank 68 in order to reduce the size of the batch processing unit 6, but may be installed in a dedicated processing tank. The processing tank may store pure water, similar to the third rinsing liquid tank 68. The use of pure water can suppress deterioration of the second transfer arm 541 of the second transfer robot 54. The lot release unit 81 may be installed in a chemical liquid tank as long as deterioration of the second transfer arm 541 can be suppressed.

[0089] Next, the first transport robot 53 and the second transport robot 54 will be described with reference to Fig. 7. Due to space limitations in the drawing, the number of first transport arms 531 of the first transport robot 53 is shown as being smaller than the actual number.

[0090] The first transport robot 53 transports the substrate W from the single wafer processing unit 3 to the lot formation unit 51 of the interface unit 5. The substrate W is made into a lot L by the lot formation unit 51, and then transported from the lot formation unit 51 to the batch processing unit 6.

[0091] The first transport robot 53 is, for example, a six-axis robot, and has six rotation axes R1, R2, R3, R4, R5, and R6. The first transport robot 53 may be a seven-axis robot. The first transport robot 53 does not have to be an articulated robot, and may be an orthogonal robot, etc. The orthogonal robot may have a rotation axis.

[0092] The first transport robot 53 has a first transport arm 531 at its tip. The first transport arm 531 holds a substrate W. The thickness of the first transport arm 531 is set so that the first transport arm 531 can be inserted between the substrates W arranged at the second pitch P2. A plurality of first transport arms 531 may be provided so as to be able to transport a plurality of substrates W (for example, five substrates, only two of the five substrates are shown in FIG. 7) at a time.

[0093] The second transport robot 54 transports the substrate W from the batch processing unit 6 to the single wafer processing unit 3. For example, the second transport robot 54 transports the substrate W from the third rinsing liquid tank 68 to the liquid processing unit 34. The second transport robot 54 is used to transport the substrate W from the third rinsing liquid tank 68 to the liquid processing unit 34, and the second transport unit 32 is not used. This makes it possible to prevent the second transport unit 32 from becoming wet with the third rinsing liquid. The transport origin is appropriately selected depending on the configuration of the batch processing unit 6. Similarly, the transport destination is appropriately selected depending on the configuration of the single wafer processing unit 3.

[0094] The second transport robot 54 is configured similarly to the first transport robot 53, and has a second transport arm 541 at its tip. The second transport arm 541 holds a substrate W. The thickness of the second transport arm 541 is set so that the second transport arm 541 can be inserted between the substrates W arranged at the second pitch P2. Only one second transport arm 541 is provided to transport the substrates W one by one, but a plurality of second transport arms 541 may be provided so as to transport a plurality of substrates W at a time.

[0095] The second transport arm 541 lifts the substrate W out of the third rinsing liquid, and is therefore wet with the third rinsing liquid. In order to prevent the third rinsing liquid from dripping from the second transport arm 541 onto the wrist of the second transport arm 541, the second transport robot 54 is suspended from the ceiling 55 of the interface unit 5. On the other hand, the first transport robot 53 is installed on the floor 56 of the interface unit 5.

[0096] The second transport robot 54 and the first transport robot 53 may be arranged in reverse, with the first transport robot 53 hung from the ceiling 55 and the second transport robot 54 installed on the floor 56. In this case, it is possible to prevent the third rinsing liquid on the second transport arm 541 from dripping onto the first transport robot 53. The first transport robot 53 can transport the substrate W in a constantly dry state.

[0097] It should be noted that the first transport robot 53 and the second transport robot 54 may both be suspended from the ceiling 55, or both may be installed on the floor 56. Furthermore, one or more of the first transport robot 53 and the second transport robot 54 may be installed on a side wall. The side wall is disposed between the ceiling 55 and the floor 56, and is disposed vertically, unlike the ceiling 55 and the floor 56. The ceiling 55 and the floor 56 are disposed horizontally.

[0098] Note that, during transport of the substrate W by the second transport arm 541, a high humidity gas may be supplied to the substrate W in order to prevent the substrate W from drying. The second transport robot 54 may be provided with a gas nozzle for blowing off droplets on the second transport arm 541. The second transport robot 54 may also be provided with a drain pan for collecting droplets dripping from the second transport arm 541 toward its wrist. The droplets are the third rinsing liquid or condensed high humidity gas.

[0099] Next, a substrate processing system 1 according to a first modified example will be described with reference to Fig. 10. Below, differences between this modified example and the above embodiment will be mainly described.

[0100] 10, the substrate processing system 1 of this modified example is provided with a separate load section 2A and unload section 2B. The cassette C is loaded into the load section 2A with a plurality of substrates W accommodated therein at a second pitch P2. The cassette C is unloaded from the unload section 2B with a plurality of substrates W accommodated therein at the second pitch P2.

[0101] Furthermore, the substrate processing system 1 of this modified example has a second interface unit 5A in addition to the interface unit 5. The second interface unit 5A transfers substrates W between the carry-in unit 2A and the batch processing unit 6. The second interface unit 5A has a lot formation unit 51 and a transport robot 57.

[0102] 7, and transports substrates W from the loading section 2A to the lot formation section 51. The transport robot 57 may transport all of the substrates W contained in one cassette C at once, for example, 25 substrates W at once.

[0103] The interface unit 5 of this modified example has a transport robot 58 corresponding to the second transport robot 54 shown in Fig. 7. The transport robot 58 transports substrates W from the batch processing unit 6 to the single wafer processing unit 3. The interface unit 5 does not have the function of the first transport robot 53 shown in Fig. 7. In the interface unit 5, the substrates W flow in a one-way direction.

[0104] Between the load section 2A and the unload section 2B, a second interface section 5A, a batch processing section 6, an interface section 5, and a single-wafer processing section 3 are arranged in this order along the transport direction of the substrate W. The substrate W is transported from the load section 2A in the order of arrows A1, A2, A3, and A4 shown in FIG. 10, and then transported to the unload section 2B.

[0105] According to this modification, the substrates W flow in one direction through the interface section 5 and the second interface section 5A, so that stagnation of the flow of the substrates W can be prevented, and throughput can be improved.

[0106] The lot formation unit 51 of this modified example is disposed next to the long side of the third transfer area 61 of the batch processing unit 6, similar to the processing tanks such as the third rinsing liquid tank 68. Specifically, the lot formation unit 51, the first chemical liquid tank 63, the first rinsing liquid tank 64, the second chemical liquid tank 65, the second rinsing liquid tank 66, the third chemical liquid tank 67, and the third rinsing liquid tank 68 are arranged in a row in this order.

[0107] As described above, the lot formation unit 51 is disposed next to the long side of the third transfer area 61 of the batch processing unit 6, similar to the processing tanks such as the third rinsing liquid tank 68. Therefore, the arrangement direction of the substrates W is the same in the lot formation unit 51 and the processing tanks. This eliminates the need for the third transfer device 62 to rotate around a vertical axis, and thus the need for a rotation shaft, thereby simplifying the structure of the third transfer device 62.

[0108] Next, a substrate processing system 1 according to a second modified example will be described with reference to Fig. 11. The following mainly describes the differences between this modified example and the first modified example. In the first modified example, the loading section 2A, the second interface section 5A, the batch processing section 6, the interface section 5, the single wafer processing section 3, and the unloading section 2B are arranged in a line in this order.

[0109] In this modification, the loading unit 2A, the second interface unit 5A, the batch processing unit 6, the interface unit 5, the single wafer processing unit 3, and the unloading unit 2B are arranged in this order in a U-shape. Specifically, the loading unit 2A, the second interface unit 5A, and the batch processing unit 6 are arranged in a line in the X-axis direction, the unloading unit 2B and the single wafer processing unit 3 are arranged in a line in the X-axis direction, and the interface unit 5 extends in the Y-axis direction from the batch processing unit 6 to the single wafer processing unit 3.

[0110] 7, a transition device 591, a transfer area 592, and a transition device 593. The transfer robot 58, the transition device 591, the transfer area 592, and the transition device 593 are arranged in a line in the Y-axis direction in this order.

[0111] A transfer device 594 is provided in the transfer region 592. The transfer device 594 has a transfer arm that moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The transfer arm transfers the substrate W from the transition device 591 to another transition device 593. The number of transfer arms may be one or more, and in the latter case, the transfer device 594 transfers multiple substrates W (e.g., five substrates) at a time.

[0112] Next, the operation of the interface unit 5 of this modified example will be described. First, the transfer robot 58 lifts the substrate W from the third rinsing liquid and transfers it to the transition device 591. Next, the transfer device 594 transfers the substrate W from the transition device 591 to another transition device 593. Thereafter, the second transfer device 32 of the single wafer processing device 3 receives the substrate W from the transition device 593 and transfers it to the liquid processing device 34.

[0113] The substrate W is transported from the entrance 2A in the order of arrows A1, A2, A3, A4, A5 and A6 shown in FIG. 11, and then transported to the exit 2B.

[0114] Although the embodiments of the substrate processing system and the substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above-mentioned embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0115] For example, in the above embodiment and modified example, the cassette C accommodates the substrates W therein at the second pitch P2, but the substrates may be accommodated at a pitch other than the second pitch P2, at a pitch narrower than the second pitch P2 (for example, the first pitch P1), or at a pitch wider than the second pitch P2. If the lot release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the transport robots 54, 58 can be suppressed.

[0116] In the above embodiment and modified example, the lot formation section 51 narrows the pitch of the substrates W when forming a lot L, but this need not be the case. For example, when a number of substrates W fewer than the maximum number that the cassette C can accommodate is stored in the cassette C, the lot formation section 51 does not need to narrow the pitch of the substrates W. In any case, if the lot release section 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the transport robots 54, 58 can be suppressed.

[0117] In the above embodiment and modified example, the lot release section 81 expands the pitch of the substrates W from the first pitch P1 to the second pitch P2 in a lump of processing liquid larger than the substrates W, but the pitch of the substrates W may be expanded from the first pitch P1 to the second pitch P2 in a mist of processing liquid. Even if the processing liquid is in a mist, it is possible to prevent the substrates W from drying, and therefore to suppress the collapse of the uneven pattern of the substrates W.

[0118] In the above embodiment and modified example, the transfer section 52 includes the first transfer robot 53 and the second transfer robot 54 as shown in Fig. 7, but may include one transfer robot 41 as shown in Fig. 8. The transfer robot 41 serves as both the first transfer robot 53 and the second transfer robot 54.

[0119] The transport robot 41 has a first transport arm 531 of the first transport robot 53 and a second transport arm 541 of the second transport robot 54. The first transport arm 531 and the second transport arm 541 are each attached to the tip of the transport robot 41. The transport robot 41 transports a substrate W from the single wafer processing unit 3 to the lot formation unit 51 with the first transport arm 531, and transports a substrate W from the batch processing unit 6 to the single wafer processing unit 3 with the second transport arm 541.

[0120] 8, the transfer robot 41 further includes a moving mechanism 411 that moves the second transfer arm 541 relatively to the first transfer arm 531 so as to operate the first transfer arm 531 and the second transfer arm 541 independently. The moving mechanism 411 is provided, for example, at the end of the transfer robot 41. Although the moving mechanism 411 moves the second transfer arm 541 relative to the end of the transfer robot 41 in FIG. 8, it may also move the first transfer arm 531 relative to the end of the transfer robot 41.

[0121] The transfer robot 41 may be hung from a ceiling 55 as shown in FIG. 8, may be installed on a floor 56, or may be installed on a side wall. [Explanation of symbols]

[0122] 1. Substrate Processing System 3 Single-wafer processing section 5 Interface section 52 Conveyor 6 Batch Processing Section 68 3rd rinse tank (processing tank) 811 1st holder 814 2nd holder W substrate

Claims

1. a loading section into which a cassette containing a plurality of substrates is loaded; a batch processing unit for processing a lot including a plurality of substrates at once; a single-wafer processing section for processing the substrates of the lot one by one; a conveying section for conveying a cassette containing a plurality of the substrates; an interface unit for transferring the substrate between the batch processing unit and the single wafer processing unit; a second interface unit that transfers the substrate between the loading unit and the batch processing unit; having the loading section and the unloading section are provided separately, and the second interface section, the batch processing section, the interface section, and the single wafer processing section are arranged in this order between the loading section and the unloading section along a transport direction of the substrate; the interface unit includes a first transition device, a transfer area, and a second transition device in this order along a transfer direction of the substrate; A substrate processing system, wherein the first transition apparatus and the second transition apparatus each temporarily store the substrate, and a transport apparatus is provided in the transport area, and the transport apparatus transports the substrate from the first transition apparatus to the second transition apparatus.

2. The substrate processing system of claim 1 , wherein the second interface unit includes a lot forming unit that forms the lot.

3. The substrate processing system according to claim 1 , wherein the interface unit includes a transfer robot that transfers the substrate from the batch processing unit to the first transition device.

4. the batch processing unit has a processing tank for storing a processing liquid or a mist of a processing liquid in which the lot is immersed, The substrate processing system according to claim 3 , wherein the transfer robot transfers the substrate held in the processing liquid from the processing bath of the batch processing unit to the first transition device.

5. The substrate processing system according to claim 4 , wherein the processing tank stores pure water in which the lot is immersed.

6. 6. The substrate processing system according to claim 1, wherein the single wafer processing section includes a liquid processing section that processes the substrates one by one with a liquid.

7. 7. The substrate processing system according to claim 1, wherein the single wafer processing section includes a drying device that dries the substrates one by one with a supercritical fluid.

8. A substrate processing method using the substrate processing system according to any one of claims 1 to 7, transporting the substrate to the second interface section, the batch processing section, the interface section, and the single wafer processing section in this order between the loading section and the unloading section.

Images