Holding table mechanism and cutting device equipped with same

Abstract

To provide a new technique capable of reducing time and labor for removing a sub-table when a holding table is replaced in accordance with a workpiece shape.SOLUTION: A holding table mechanism 2 comprises: a first holding table 21 having a first holding surface 21a on which a circular workpiece is held; a second holding table having a second holding surface on which a rectangular workpiece is held; a table base which is disposed on a base 4, to which one of the first holding table or the second holding table is selectively fixed, and on which the fixed one of the first holding table or the second holding table is rotated about a rotational axis passing through the center of the first or second holding surface; and a first sub-table 31 added to the base and disposed so as to be exposed outside the first holding surface when the first holding table is fixed to the table base. The second holding table has a second sub-table, and the first sub-table is disposed at a position where the first sub-table and the second holding table do not come into contact with each other when the second holding table is rotated about the rotational axis.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a holding table mechanism that replaceably fixes a holding table, and to a cutting device equipped with the same. [Background technology]

[0002] Conventionally, as in the cutting devices disclosed in Patent Documents 1 and 2, for example, configurations are known that include a sub-table for the purpose of holding a dress board for dressing the cutting blade, for the purpose of holding a test piece (such as a dress board or a silicon piece) for checking and adjusting the cutting position of the cutting blade, and for the purpose of holding a test piece for checking the shape of the cutting blade, etc. This sub-table is, for example, disposed on a cover that covers a moving mechanism that moves the holding table.

[0003] Also, a configuration having a circular holding surface for fixing a circular workpiece such as a wafer is widely known, for example, as in the holding table disclosed in Patent Document 1. In the configuration of Patent Document 1, the sub-table can selectively hold a dress board or an end face correction tool by suction.

[0004] On the other hand, for example, a configuration having a rectangular holding surface for fixing a rectangular workpiece such as a package substrate is also known, such as the holding table disclosed in Patent Document 2. In the configuration of Patent Document 2, a dressing board support part for holding a dress board and a detection plate support part for holding a detection plate are provided.

[0005] As described above, a holding table is used according to the shape of the workpiece, such as circular or rectangular, and when processing workpieces of different shapes using the same processing equipment, it is known to replace the holding table with one that corresponds to the size of the workpiece. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-255458 A [Patent Document 2] JP 2010-87122 A Summary of the Invention [Problem to be solved by the invention]

[0007] On the other hand, for example, there are holding tables for rectangular workpieces, such as the one described in Patent Document 2, in which the dressing board support portion and the detection plate support portion are arranged within the rotation trajectory of the holding table.

[0008] When using this holding table for rectangular workpieces, the dressing board support portion and the detection plate support portion sometimes interfere with the sub-table, making it necessary to remove the sub-table before attaching the holding table for rectangular workpieces.

[0009] As described above, in the conventional configuration, it is necessary to remove the sub-table when replacing the holding table, and an improvement is required.

[0010] In view of the above problems, the present invention proposes a new technique that can reduce the effort required to remove the sub-table when replacing the holding table in accordance with the shape of the workpiece. [Means for solving the problem]

[0011] The problem to be solved by the present invention has been described above, and the means for solving this problem will now be described.

[0012] According to one aspect of the present invention, a holding table mechanism includes a first holding table having a first holding surface for holding a circular workpiece, a second holding table having a second holding surface for holding a rectangular workpiece, a table base arranged on a base to which one of the first holding table or the second holding table is selectively fixed and which rotates the fixed first holding table or the second holding table about a rotation axis passing through the center of the first holding surface or the second holding surface, and a first sub-table attached to the base and including a first sub-holding surface arranged so as to be exposed outside the first holding surface when the first holding table is fixed to the table base, wherein the second holding table has a second sub-table including a second sub-holding surface, and the first sub-table is arranged at a position where the first sub-table and the second holding table do not come into contact when the second holding table is rotated about the rotation axis.

[0013] According to one aspect of the present invention, the radius of rotation of the first holding table is set to be smaller than the radius of rotation of the second holding table.

[0014] According to one aspect of the present invention, the height of the first sub-holding surface is set to a different height from that of the second holding surface.

[0015] According to one aspect of the present invention, there is provided a cutting apparatus comprising a holding table mechanism and a cutting unit equipped with a cutting blade for cutting a workpiece held by the holding table mechanism, wherein a dressing board for dressing the cutting blade is held on the first sub-table. Effect of the Invention

[0016] The present invention provides the following advantages. That is, according to one aspect of the present invention, a first holding table for circular workpieces and a second holding table for rectangular workpieces can be selectively used, and a holding table mechanism having a first sub-table can be configured so that whichever holding table is selected does not come into contact with the first sub-table. This makes it unnecessary to remove the first sub-table when replacing the holding table, thereby shortening the work time and reducing the effort. [Brief description of the drawings]

[0017] [Figure 1] 1 is a diagram showing an example of the configuration of a cutting device including a holding table mechanism according to the present invention; [Diagram 2] FIG. 4 is a diagram showing the configuration of a first holding table. [Diagram 3] 1A is a diagram for explaining the configuration of a first holding table and a table base, and FIG. 1B is a diagram for explaining a state in which the first holding table is fixed to the table base. [Figure 4] FIG. 4 is a diagram illustrating a state in which a workpiece is held by a first holding table. [Diagram 5] FIG. 4 is a diagram showing the configuration of a second holding table. [Figure 6] 1A is a diagram for explaining the configuration of a second holding table and a table base, and FIG. 1B is a diagram for explaining a state in which the second holding table is fixed to the table base. [Figure 7] FIG. 13 is a diagram illustrating a state in which a workpiece is held by a second holding table. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of the configuration of a cutting device 1 equipped with a holding table mechanism 2 according to the present invention.

[0019] The cutting device 1 includes a cutting unit 10 having a cutting blade 11. The cutting blade 11 is detachably attached to the tip of a spindle (not shown) driven by a motor 12, and cuts a workpiece such as a semiconductor wafer to form a cut groove. During cutting, a machining fluid is continuously supplied to the workpiece and the cutting blade 11.

[0020] The cutting unit 10 is provided so as to be movable in the Z-axis direction by a Z-axis moving mechanism 13Z, and is provided so as to be movable in the Y-axis direction by a Y-axis moving mechanism 13Y. This makes it possible to set the cutting height (Z-axis direction) of the cutting blade 11 and to index feed (Y-axis direction) of the cutting blade 11.

[0021] The cutting unit 10 has an imaging unit 14 for capturing an image of the surface of the workpiece, and is capable of detecting streets (planned division lines) on the surface of the workpiece based on the image captured by the imaging unit 14, and performing alignment.

[0022] A holding table mechanism 2 is disposed below the cutting unit 10 so as to be movable in the X-axis direction. The holding table mechanism 2 is provided on a base 4, and the base 4 is configured so as to be movable in the X-axis direction by an X-axis movement mechanism (not shown). This enables the holding table mechanism 2 to be fed for processing (in the X-axis direction).

[0023] The base 4 is provided inside the frame 5a of the device main body 5, and bellows 5b are connected to both sides of the base 4 in the X-axis movement direction. An X-axis movement mechanism (not shown) for moving the base 4 is disposed below the bellows 5b.

[0024] 1, a first holding table 21 and a first sub-table 31 are shown on a base 4. The first holding table 21 holds a circular workpiece (wafer W), and the first sub-table 31 holds a dress board 34.

[0025] FIG. 2, and FIGS. 3(A) and (B) are diagrams showing the holding table mechanism 2, and show the case where a first holding table 21 having a first holding surface 21a for holding a circular workpiece is attached.

[0026] As shown in FIG. 2, the rotation radius R1 of the first holding table 21 is set to be smaller than the rotation radius R2 (FIG. 5) of the second holding table 22 described later.

[0027] 3(A), the first holding table 21 has a porous plate 21b with a circular first holding surface 21a on the upper surface, and a circular base portion 21c that holds the porous plate 21b. A suction passage 21d that communicates with the lower surface side of the porous plate 21b is formed in the base portion 21c, and a connection hole portion 21e that communicates with the suction passage 21d is formed in the lower surface 21u of the base portion 21c.

[0028] 2 and 4, a frame holding portion 21f is formed on the upper surface of the base portion 21c so as to surround the periphery of the first holding surface 21a, and an annular frame F of the wafer unit U is placed on the frame holding portion 21f. The wafer unit U is formed by integrating a wafer W and annular frame F via a tape T. It is to be noted that the wafer W may be held directly on the first holding surface 21a.

[0029] As shown in FIGS. 2 and 4, magnets 21m for fixing the annular frame F of the wafer unit U are arranged at four positions on the frame holding portion 21f of the first holding table 21 at intervals in the circumferential direction.

[0030] As shown in Figures 2 and 4, positioning pins 21p, 21p protrude from the frame holding portion 21f of the first holding table 21, and are abutted against the cutout portions Fp, Fp formed in the annular frame F of the wafer unit U, so that the wafer unit U can be positioned at a specified position relative to the first holding table 21.

[0031] 3(A) and (B), the first holding table 21 is detachably fixed to a table base 40. The table base 40 is disposed on a base 4 (FIG. 1) and configured to move in the X-axis direction and rotate around the Z-axis (vertical axis) by a motor (not shown).

[0032] A mounting surface 41 on which the first holding table 21 is placed is formed on the upper surface of the table base 40. A connection hole 41e is formed in the mounting surface 41 at a position corresponding to the connection hole 21e of the first holding table 21, and the first holding table 21 is positioned relative to the table base 40 by inserting a positioning ring 51 into both the connection holes 21e, 41e.

[0033] The connection hole 41e of the table base 40 is connected to a suction source (not shown) via a suction path 42, and with the first holding table 21 fixed, the suction path 42 and the suction path 21d are connected via the connection holes 21e, 41e, generating a negative pressure on the first holding surface 21a of the porous plate 21b. This negative pressure causes the wafer W, which is the workpiece, to be sucked and held on the first holding surface 21a via the tape T.

[0034] A suction groove 41u for sucking the lower surface 21u of the first holding table 21 is formed in the circumferential direction on the mounting surface 41 of the table base 40. The suction groove 41u is connected to a suction source (not shown), and the first holding table 21 is held by suction to the table base 40.

[0035] The table base 40 is surrounded by a cover 43 at a position lower than the placement surface 41, and the cover 43 closes the gap between the table base 40 and a cylindrical frame 44 fixed to the base 4 (FIG. 1).

[0036] A substantially L-shaped support frame 45 is horizontally protruded from the cylindrical frame 44, and a first sub-table 31 is provided on the upper end of the support frame 45. A first sub-holding surface 31a having a suction groove is formed on the upper surface of the first sub-table 31, and a dress board 34 is suction-held on the first sub-holding surface 31a. The first sub-table 31 may be provided in multiple locations. For example, in a dual dicer in which cutting blades 11 (FIG. 1) are arranged opposite each other, first sub-tables for holding dress boards for dressing each cutting blade may be provided in two locations.

[0037] The dressing board 34 is used to adjust the condition of the cutting blade 11 (FIG. 1) by cutting into the tip of the worn cutting blade 11 (dressing). Specifically, by cutting the cutting blade 11 into the dressing board 34, the tip of the cutting blade is corrected to be flat (flat dressing), and sharpened or rounded. The first sub-holding surface 31a of the first sub-table 31 is configured so that the upper surface 34a of the dressing board 34 is at approximately the same height as the first holding surface 21a of the first holding table 21.

[0038] 2, the first sub-table 31 is disposed at a position farther from the center of the rotation radius R1 of the first holding table 21. This allows the first holding table 21 to rotate without interfering with the first sub-table 31.

[0039] With the above configuration, as shown in Fig. 1, when processing a circular workpiece (wafer W), the first holding table 21 is fixed to the table base 40 (Fig. 3(A)), and cutting is performed with the cutting blade 11. On the other hand, when cutting a rectangular workpiece, the second holding table 22 is used instead of the first holding table 21, as shown in Figs. 5, 6(A) and 6(B).

[0040] As shown in Figures 5, 6(A) and (B), the second holding table 22 has a rectangular second holding surface 22a, and the second holding surface 22a holds a rectangular workpiece, such as a package substrate P as shown in Figure 7.

[0041] The second holding table 22 has a porous plate 22b with a rectangular second holding surface 22a on the upper surface, and a base portion 22c that holds the porous plate 22b. A suction passage 22d that communicates with the lower surface of the porous plate 22b is formed in the base portion 22c, and a connection hole portion 22e that communicates with the suction passage 22d is formed in the lower surface 22u of the base portion 22c.

[0042] 5 and 7, frame holding portions 22f are formed at four locations on the outer periphery of the base portion 22c at positions outside the second holding surface 22a, and the annular frame Fa of the wafer unit Ua is placed on the frame holding portions 22f. The wafer unit Ua is formed by integrating the package substrate P and the annular frame Fa via the tape Ta. The package substrate P may be held directly on the second holding surface 22a.

[0043] As shown in FIGS. 5 and 7, each frame holding portion 22f of the second holding table 22 is provided with a magnet 22n for fixing the annular frame Fa of the wafer unit Ua.

[0044] As shown in Figures 5 and 7, some of the frame holding portions 22f have protruding positioning pins 22q, 22q that abut against cutout portions Fq, Fq formed in the annular frame Fa of the wafer unit Ua, allowing the wafer unit Ua to be positioned at a specified position relative to the second holding table 22.

[0045] 6(A) and (B), the second holding table 22 is detachably fixed to the mounting surface 41 of the table base 40. As with the first holding table 21 described above, the second holding table 22 is positioned relative to the table base 40 by inserting the positioning ring 51 into both connection holes 22e, 41e.

[0046] 6(A) and (B), suction paths 46a, 46b leading to a suction source (not shown) are formed in the table base 40 and are connected to suction paths 26a, 26b formed in the second holding table 22. The suction paths 26a, 26b are connected to a pair of second sub-tables 32, 33 provided on the second holding table 22.

[0047] Second sub-holding surfaces 32a, 33a having suction grooves are formed on the upper surfaces of the second sub-tables 32, 33, respectively, and negative pressure is generated on the second sub-holding surfaces 32a, 33a by suction through suction paths 26a, 26b. Note that, as shown in FIG. 3B, when the first holding table 21 is used, the suction paths 46a, 46b are closed by the first holding table 21.

[0048] 6(A) and (B), the second sub-tables 32 and 33 are provided so as to protrude laterally from the rectangular base portion 22c. A dress board 35 and a blade detection plate 36 are respectively sucked and held on the second sub-holding surfaces 32a and 33a of the second sub-tables 32 and 33. It is to be noted that only one second sub-table may be provided.

[0049] The dressing board 35 is used to adjust the condition of the cutting blade 11 (FIG. 1) by cutting the tip of the worn cutting blade 11 (FIG. 1) into the dressing board 35 (dressing). Specifically, the cutting blade 11 is cut into the dressing board 35 to correct the tip of the cutting blade to be flat (flat dressing), sharpen the blade, make it round, etc. The blade detection plate 36 is used to detect the origin position in the vertical direction by contacting the lower end of the cutting blade 11 (FIG. 1). When cutting the cutting blade 11 (FIG. 1) into the dressing board 35 or the blade detection plate 36, the second holding table 22 is rotated 90 degrees from the state shown in FIG. 5 to position the dressing board 35 or the blade detection plate 36 below the cutting blade 11 (FIG. 1).

[0050] 5, the first sub-table 31 is disposed at a position farther from the center of the rotation radius than the maximum value R2 of the rotation radius of the second holding table 22. This allows the second holding table 22 to rotate without interfering with the first sub-table 31.

[0051] Furthermore, the second sub-tables 32, 33 are disposed inside the maximum value R2 of the rotation radius of the second holding table 22. This prevents the second sub-tables 32, 33 from interfering with the first sub-table 31 when the second holding table 22 rotates.

[0052] 6(B), in this embodiment, the height position H1 of the first sub-holding surface 31a of the first sub-table 31 is set to a different height from the second holding surface 22a of the second holding table 22.

[0053] Specifically, in the second holding table 22, the height position Ha of the second holding surface 22a and each part such as the second sub-tables 32, 33, and the frame holding portion 22f (Figure 5) are positioned at a higher position than the height position H1 of the first sub-table 31.

[0054] This prevents each portion of the second holding table 22 from interfering with the first sub-table 31. Fig. 6(B) shows how the height position H2 of the lowest point of the second sub-table 32 is set higher than the highest position H1 of the first sub-table 31.

[0055] According to the above configuration, even if the first sub-table 31 is configured to be positioned inside the maximum value R2 of the rotation radius of the second holding table 22 in the plan view of Fig. 5, it is possible to realize a configuration in which the first sub-table 31 and the second holding table 22 do not interfere with each other by setting the first sub-table 31 to be positioned lower than the second holding table 22. Note that the height positional relationship between the first sub-table 31 and the second holding table 22 may be reversed from that in Fig. 6(B) to prevent the two from interfering with each other.

[0056] As described above, in a holding table mechanism configured to selectively use the first holding table for circular workpieces and the second holding table for rectangular workpieces and equipped with the first sub-table 31, a configuration can be realized in which, regardless of which holding table is selected, there is no contact with the first sub-table 31, as shown in Figures 2, 3(B), 5, and 6(B). This makes it unnecessary to remove the first sub-table 31 when replacing the holding table, thereby shortening the work time and reducing the effort.

[0057] For example, when the second holding table is used, it is preferable to prevent the adhesion of dirt to the holding surface by covering the first sub-table, and vice versa. [Explanation of symbols]

[0058] 2. Holding table mechanism 4 Foundation 5. Device body 5a frame 5b Bellows 10 Cutting unit 11 Cutting blade 12 Motor 13Y-axis movement mechanism 13Z axis movement mechanism 14 Imaging unit 21 Holding table 21a Holding surface 21b Porous plate 21c Base 21d Suction channel 21e Connection hole 21e Connection hole 21f Frame holder 21m Magnet 21p Pin 21q Pin 21u bottom 22 Holding table 22a Holding surface 22b Porous plate 22c Base 22d Suction channel 22e Connection hole 22f Frame holder 22n Magnet 26a Suction channel 26b Suction path 31 First Subtable 31a First sub-holding surface 32 Second Subtable 33 Second Subtable 32a Second sub-holding surface 33a Second sub-holding surface 34 Dress Board 31a Top surface 35 Dress Board 36 Blade Detection Plate 40 Table Base 41e Connection hole 41u suction groove 42 Suction path 43 Cover 44 Tubular Frame 45 Support Frame 46a Suction channel 46b Suction path 51 Positioning ring F Annular frame Fa Annular Frame H1 Height position H2 Height position Ha Height position P package substrate R1 Maximum R2 Maximum T-Tape U Wafer Unit Ua Wafer unit W wafer

Claims

1. a first holding table having a first holding surface for holding a circular workpiece; a second holding table having a second holding surface for holding a rectangular workpiece; a table base disposed on a base, to which one of the first holding table or the second holding table is selectively fixed, and which rotates the fixed first holding table or the fixed second holding table about a rotation axis passing through a center of the first holding surface or the second holding surface; a first sub-table including a first sub-holding surface attached to the base and arranged so as to be exposed outside the first holding surface when the first holding table is fixed to the table base; A holding table mechanism comprising: the second holding table has a second sub-table including a second sub-holding surface; a holding table mechanism in which the first sub-table is disposed at a position where the first sub-table and the second holding table do not come into contact with each other when the second holding table is rotated about the rotation shaft.

2. The rotation radius of the first holding table is set to be smaller than the rotation radius of the second holding table.

2. The holding table mechanism according to claim 1.

3. The height of the first sub-support surface is set to a different height from the second support surface.

3. The holding table mechanism according to claim 1 or 2.

4. The holding table mechanism according to any one of claims 1 to 3, a cutting unit having a cutting blade for cutting a workpiece held by the holding table mechanism, A cutting apparatus, wherein a dressing board for dressing the cutting blade is held on the first sub-table.

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