Cleaning Equipment

Abstract

To shorten a water storage time in cleaning and to reduce power consumption.SOLUTION: An annular wall 56 is arranged so as to surround a wafer 100; cleaning water is supplied to the inner side of the annular wall 56 to submerge the wafer 100; and ultrasonic vibration is propagated to the cleaning water used for the submersion to clean the wafer 100. Therefore, the wafer 100 can be ultrasonically cleaned with a small amount of cleaning water as compared with a configuration using a water tank for submerging the wafer 100 in water. Therefore, a cleaning water storage time can be shortened. Furthermore, since the output of ultrasonic vibration can be reduced, the power consumption required for cleaning can also be reduced.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a cleaning device. [Background technology]

[0002] As disclosed in Patent Document 1, an ultrasonic cleaning unit is used to clean the cut grooves in a wafer cut by a cutting blade. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-245247 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the ultrasonic cleaning unit, the table holding the wafers is submerged in cleaning water stored in a water tank, and ultrasonic waves are transmitted to the submerged wafers to clean them. Therefore, it takes time to fill the water for cleaning.

[0005] In addition, since the ultrasonic vibration is transmitted to the wafer by propagating it through the water stored in the water tank, it is necessary to ultrasonically vibrate the ultrasonic oscillator with a large output, which results in a large amount of power consumption.

[0006] SUMMARY OF THE PRESENT EMBODIMENT It is therefore an object of the present invention to reduce water retention time during washing and to reduce power consumption. [Means for solving the problem]

[0007] The cleaning device of the present invention (the present cleaning device) is a cleaning device for cleaning a workpiece held on a holding surface of a holding table, the holding surface having an area extending outward from a lower surface of the workpiece, the holding surface including an annular wall capable of surrounding the workpiece held on the holding surface such that an upper end of the annular wall is higher than an upper surface of the workpiece;a through hole passing through the annular wall from inside to outside; a lifting mechanism for lifting and lowering the annular wall in a direction perpendicular to the holding surface, a cleaning water supplying unit for supplying cleaning water to the inside of the annular wall arranged to surround the workpiece held on the holding surface, thereby submerging the workpiece, and a vibration generating unit for propagating ultrasonic vibrations to the cleaning water in which the workpiece is submerged, While discharging the cleaning water in which the workpiece is submerged from the through hole, Ultrasonic vibration is transmitted to the workpiece submerged in water. Then, the workpiece is Wash.

[0008] The holding surface of the holding table may be configured to hold a tape of a work set in which a ring frame having an opening capable of accommodating a workpiece and a workpiece positioned in the opening are integrated with tape, and the annular wall may be positioned on top of the tape.

[0009] Another cleaning device of the present invention is a cleaning device for cleaning a workpiece held on a holding surface of a holding table, the holding surface having an area that extends outward beyond the lower surface of the workpiece and comprising an annular wall capable of surrounding the workpiece held on the holding surface so that its upper end is higher than the upper surface of the workpiece, a lifting mechanism for raising and lowering the annular wall in a direction perpendicular to the holding surface, a cleaning water supply unit for supplying cleaning water to the inside of the annular wall arranged to surround the workpiece held on the holding surface, thereby submerging the workpiece, and a vibration oscillator for propagating ultrasonic vibrations to the cleaning water in which the workpiece is submerged, the lifting mechanism being configured to form a gap between the holding surface and the lower end of the annular wall, and the cleaning water in which the workpiece is submerged is discharged from the gap while ultrasonic vibrations are propagated to the submerged workpiece to clean the workpiece.

[0010] Another cleaning device of the present invention is a cleaning device for cleaning a workpiece held on a holding surface of a holding table, the holding surface having an area extending outward beyond the bottom surface of the workpiece, the cleaning device including an annular wall capable of surrounding the workpiece held on the holding surface so that its upper end is higher than the top surface of the workpiece, a lifting mechanism for raising and lowering the annular wall in a direction perpendicular to the holding surface, a cleaning water supply unit for supplying cleaning water to the inside of the annular wall arranged to surround the workpiece held on the holding surface, thereby submerging the workpiece, and a vibration oscillator for propagating ultrasonic vibrations to the cleaning water in which the workpiece is submerged. a holding section, the holding surface of the holding table being configured to hold a tape of a work set in which a ring frame having an opening capable of accommodating a workpiece and a workpiece positioned in the opening are integrated with the tape, the annular wall being disposed on the tape, and the lifting mechanism being configured to form a gap between an upper surface of the tape of the work set held on the holding surface and a lower end of the annular wall, and the cleaning water in which the workpiece is submerged is discharged from the gap while ultrasonic vibrations are propagated to the submerged workpiece to clean the workpiece.

[0011] In the cleaning device of the present invention, the vibration oscillator may be disposed on the annular wall. Effect of the Invention

[0013] In this cleaning device, an annular wall is disposed so as to surround the workpiece held on the holding surface, cleaning water is supplied to the inside of the annular wall to submerge the workpiece, and ultrasonic vibrations are propagated to the cleaning water used for submersion, thereby ultrasonically cleaning the workpiece. This allows the workpiece to be ultrasonically cleaned with less cleaning water than a configuration that uses a water tank to submerge the workpiece. This therefore shortens the storage time of the cleaning water. Furthermore, since there is less cleaning water to propagate the ultrasonic vibrations, the output of the ultrasonic vibrations can also be reduced. This also reduces the amount of power consumed for cleaning.

[0014] In addition, in the present cleaning device, the dirty cleaning water that is supplied to the inside of the annular wall and used to clean the workpiece is discharged to the outside of the annular wall through the upper end of the annular wall, the through-holes in the annular wall, or the gap under the annular wall, thereby preventing dirt from re-adhering to the workpiece. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a perspective view showing a configuration of a processing device. [Diagram 2] FIG. 2 is a perspective view showing a configuration of a cleaning device. [Diagram 3] FIG. 2 is an explanatory diagram showing an annular wall surrounding a wafer. [Figure 4] FIG. 2 is an explanatory diagram showing an annular wall having a through hole. [Diagram 5] FIG. 11 is an explanatory diagram showing another embodiment of the ultrasonic cleaning unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] As shown in FIG. 1, a processing apparatus 1 according to this embodiment cuts a wafer 100 which is a workpiece.

[0017] The wafer 100 has a roughly rectangular shape, and has a grid-like dividing lines (not shown) formed on its surface. Various devices (not shown) are formed in each of the areas defined by the dividing lines.

[0018] In this embodiment, the wafer 100 is contained in a cassette (not shown) in the form of a work set 107, and is carried into the processing apparatus 1, where it is processed and cleaned. The work set 107 is formed by integrating a ring frame 105 having an opening capable of containing the wafer 100 with the wafer 100 positioned in the opening of the ring frame 105, using a dicing tape 103.

[0019] The configuration of the processing device 1 will be described below.

[0020] The processing device 1 includes a support table 10, a rectangular parallelepiped housing 12 erected on the support table 10, and a control unit 7 built into the housing 12 and controlling each member of the processing device 1.

[0021] A cassette stage 16 is provided on the -Y direction side of the support base 10, on which a cassette (not shown) holding a plurality of work sets 107 is placed. A stage moving member 13 is provided inside the support base 10 below the cassette stage 16, for moving the cassette stage 16 in the vertical direction.

[0022] A push-pull mechanism 17 for transporting a work set 107 is provided between the cassette stage 16 and the chuck table 20 at the center of the support base 10. The push-pull mechanism 17 includes a push-pull arm 171 for moving the work set 107 in and out of the cassette, and a push-pull arm moving mechanism 172 for moving the push-pull arm 171 back and forth in the Y-axis direction.

[0023] In addition, a temporary placement member 18 for temporarily placing a work set 107 is provided on the housing 12 side of the chuck table 20. The push-pull mechanism 17 transports and places the work set 107 including the wafer 100 before cutting from a cassette on the cassette stage 16 onto the temporary placement member 18. The temporary placement member 18 performs positioning of the work set 107 in the X-axis direction.

[0024] A first transport mechanism 30 is provided on the front surface of the housing 12 above the chuck table 20. The first transport mechanism 30 includes a first frame holding unit 31 that holds the ring frame 105 of the work set 107, a first moving mechanism 33 that moves the first frame holding unit 31 in the Y-axis direction, and a first lifting mechanism 35 that raises and lowers the first frame holding unit 31 in the Z-axis direction.

[0025] The first transport mechanism 30 transports and places the work set 107 on the temporary placement member 18 onto the chuck table 20. The first transport mechanism 30 also transports and places the work set 107 on the chuck table 20 onto the cleaning device 50 provided on the +Y direction side of the support base 10.

[0026] The chuck table 20 is fixed on a movable plate 21. The movable plate 21, together with a bellows-shaped waterproof cover 23, covers an opening in the center of the upper surface of the support base 10. Below the movable plate 21 and the waterproof cover 23, a cutting feed mechanism (not shown), for example of a ball screw type, that moves the movable plate 21 and the chuck table 20 in the X-axis direction is provided.

[0027] The chuck table 20 has a processing holding surface 210 made of a porous material. This processing holding surface 210 is connected to a suction source (not shown) to suction-hold the wafer 100 of the work set 107 via the dicing tape 103. Four clamps 22 are provided around the periphery of the chuck table 20. The ring frame 105 of the work set 107 is clamped and fixed from all four sides by each clamp 22. In this manner, the chuck table 20 holds the work set 107.

[0028] The chuck table 20, while holding the work set 107, is carried together with the moving plate 21 from above the support base 10 into the housing 12 by the cutting feed mechanism. A processing unit 14 is provided inside the housing 12. The processing unit 14 cuts the wafer 100 of the work set 107 along the planned division lines. As a result, a cutting groove is formed in the wafer 100.

[0029] After the cutting process, the chuck table 20 and the movable plate 21 are returned to above the support base 10 by the cutting feed mechanism. Then, the work set 107 is sent by the first transport mechanism 30 from the chuck table 20 to the cleaning device 50 on the rear side of the chuck table 20.

[0030] The cleaning apparatus 50 has a holding table 51 that holds a work set 107, and an ultrasonic cleaning unit 55. In the cleaning apparatus 50, the wafer 100 of the work set 107 held by the holding table 51 is cleaned by the ultrasonic cleaning unit 55. The detailed configuration of the cleaning device 50 will be described later.

[0031] A second transport mechanism 60 is provided on the front surface of the housing 12 above the cleaning device 50. The second transport mechanism 60 includes a second frame holding unit 61 that holds the ring frame 105 of the work set 107, a second moving mechanism 63 that moves the second frame holding unit 61 in the Y-axis direction, and a second lifting mechanism 65 that raises and lowers the second frame holding unit 61 in the Z-axis direction.

[0032] The second transfer mechanism 60 carries the work set 107 including the cleaned wafers 100 out of the cleaning device 50 and stores it in a cassette (not shown) on the cassette stage 16 . After the wafer 100 has been cut, the second transfer mechanism 60 may replace the first transfer mechanism 30 in transferring the work set 107 including the wafer 100 from the chuck table 20 to the cleaning device 50.

[0033] A touch panel 40 is also provided on the side of the housing 12. The touch panel 40 is capable of displaying and inputting processing conditions for cutting the wafer 100. That is, the touch panel 40 displays various information such as processing conditions related to the cutting of the wafer 100. The touch panel 40 is also used to set various information such as processing conditions. In this way, the touch panel 40 functions as an input member for inputting information and also functions as a display member for displaying information.

[0034] The control unit 7 executes various processes and performs overall control of each component of the processing device 1. For example, detection results from various detectors (not shown) are input to the control unit 7. The control unit 7 also controls the processing unit 14 to perform cutting processing on the wafer 100. Furthermore, the control unit 7 controls the cleaning device 50 to clean the wafer 100.

[0035] Here, the configuration of the cleaning device 50 will be described in detail. As shown in FIG. 2, the cleaning apparatus 50 has a holding table 51 that holds a work set 107, and an ultrasonic cleaning unit 55 that cleans the wafer 100 on the work set 107, and cleans the wafer 100 held on the cleaning holding surface 52 of the holding table 51.

[0036] The cleaning holding surface 52 of the holding table 51 is formed larger than the wafer 100, and has an area that protrudes beyond the lower surface of the wafer 100. The cleaning holding surface 52 is made of a porous material, and is connected to a suction source (not shown) to suction-hold the wafer 100 of the work set 107 via the dicing tape 103.

[0037] Four clamps 53 are provided around the holding table 51. The ring frame 105 of the work set 107 is clamped and fixed from all four sides by each clamp 53. In this manner, the holding table 51 holds the work set 107. The holding table 51 is capable of rotating about a rotation axis extending perpendicularly to the cleaning holding surface 52 while holding the work set 107 .

[0038] The ultrasonic cleaning unit (annular wall unit) 55 has a rectangular frame-shaped annular wall 56, a cleaning water supply nozzle 57 as a cleaning water supply part that supplies cleaning water, and a first vibration oscillator 58 that oscillates ultrasonic vibrations.

[0039] The annular wall 56 can surround the wafer 100 held on the cleaning holding surface 52 such that the upper end is higher than the upper surface of the wafer 100. For example, in this embodiment, the annular wall 56 has a thickness (height) greater than the thickness of the wafer 100. Furthermore, the frame-shaped interior (opening) of the annular wall 56 is formed to be large enough to accommodate the wafer 100.

[0040] The cleaning water supply nozzle 57 is disposed above the annular wall 56. The cleaning water supply nozzle 57 is connected to a cleaning water supply source (not shown) to supply cleaning water to the inside of the annular wall 56 disposed so as to surround the wafer 100 held by the cleaning holding surface 52, thereby submerging the wafer 100.

[0041] The first vibration oscillator 58 is disposed on the annular wall 56 and oscillates ultrasonic vibrations to the portion surrounded by the annular wall 56. Therefore, the first vibration oscillator 58 can propagate ultrasonic vibrations to the cleaning water that is supplied to the inside of the annular wall 56 as described above and in which the wafers 100 are submerged.

[0042] In addition, the ultrasonic cleaning unit 55 has a position adjustment part 59 that adjusts the positions of the annular wall 56 and the cleaning water supply nozzle 57 .

[0043] The position adjustment unit 59 has a lifting mechanism 70 arranged inside the support base 10, a lifting block 72 attached to the lifting mechanism 70, a lifting rod 73 rotatably attached to the lifting block 72, a swivel motor 74 that rotates the lifting rod 73, and a swivel arm 75 arranged at the upper end of the lifting rod 73.

[0044] The lifting mechanism 70 is configured to move a lifting block 72 up and down along a groove 71 formed in the lifting mechanism 70 and extending in the Z-axis direction. The lifting rod 73 is attached to the lifting block 72 so as to penetrate the lifting block 72. The lifting rod 73 can move up and down together with the lifting block 72 in the Z-axis direction, that is, in a direction perpendicular to the cleaning support surface 52, as indicated by an arrow 301.

[0045] The rotating arm 75 is attached to the upper end of the lifting rod 73 so as to extend substantially horizontally. The rotating arm 75 has an annular wall 56 and a cleaning water supply nozzle 57 attached to its tip.

[0046] Therefore, in this embodiment, the lifting mechanism 70 is capable of raising and lowering the annular wall 56 and the cleaning water supply nozzle 57 in the Z-axis direction perpendicular to the cleaning support surface 52 via the lifting block 72, the lifting rod 73 and the swivel arm 75.

[0047] The lift rod 73 can be rotated by a rotating motor 74 attached to the lower end thereof as shown by an arrow 302. When the lift rod 73 is rotated, the rotating arm 75 attached to the upper end of the lift rod 73, and the annular wall 56 and the cleaning water supply nozzle 57 attached to the rotating arm 75 rotate in the horizontal direction.

[0048] In this way, the position adjustment unit 59 can position the annular wall 56 at any position on the cleaning support surface 52 by raising and lowering and rotating the annular wall 56 using the driving force of the lifting mechanism 70 and the rotating motor 74. In addition, an annular wall 56 may be disposed on the processing holding surface 210 to clean the wafer 100 .

[0049] Here, the cleaning operation of the wafer 100 in the cleaning device 50 under the control of the control unit 7 will be described.

[0050] The control unit 7 sends the work set 107 including the cut wafer 100 to the cleaning device 50 by the first transport mechanism 30 (see FIG. 1), and the cleaning holding surface 52 of the holding table 51 suction-holds the wafer 100 via the dicing tape 103. Furthermore, the control unit 7 clamps and fixes the ring frame 105 of the work set 107 from all four sides by the four clamps 53.

[0051] Next, the control unit 7 uses the position adjustment unit 59 of the cleaning device 50 to place the annular wall 56 of the ultrasonic cleaning unit 55 at a position surrounding the wafer 100, as shown in Fig. 3. In this embodiment, since the wafer 100 is incorporated in the work set 107, the annular wall 56 is placed on the dicing tape 103 of the work set 107 placed on the cleaning holding surface 52 so as to surround the wafer 100. Note that the holding table 51 and the position adjustment unit 59 are omitted from Fig. 3 and Figs. 4 and 5 described later.

[0052] Then, the control unit 7 connects the cleaning water supply nozzle 57 to a cleaning water supply source, thereby supplying cleaning water to the inside of the annular wall 56 surrounding the wafer 100, and submerging the wafer 100 held by the cleaning holding surface 52.

[0053] Furthermore, the control unit 7 uses the first vibration oscillator 58 to propagate ultrasonic vibrations to the cleaning water that is supplied to the inside of the annular wall 56 and submerges the wafer 100. As a result, the ultrasonic vibrations are propagated to the wafer 100 submerged inside the annular wall 56, and the wafer 100, particularly the cutting grooves formed in the wafer 100 by the cutting process, are ultrasonically cleaned satisfactorily. After the inside of the annular wall 56 is filled with the cleaning water supplied to the inside of the annular wall 56 , the cleaning water passes over the upper end of the annular wall 56 and is discharged to the outside of the annular wall 56 . In addition, an annular wall 56 may be placed on the upper surface of the dicing tape 103 of the work set 107 held by the first conveying mechanism 30, cleaning water may be supplied, and the wafer 100 may be submerged within the annular wall 56 to clean the wafer 100.

[0054] After the cleaning of the wafer 100 is completed, the control unit 7 stops the communication of the cleaning water supply source to the cleaning water supply nozzle 57 and the ultrasonic oscillation by the first vibration oscillator 58, and uses the position adjustment unit 59 to move the annular wall 56 away from the cleaning holding surface 52. Thereafter, the control unit 7 rotates the holding table 51 to dry the cleaned wafer 100.

[0055] Then, the control unit 7 uses the second transport mechanism 60 to carry the work set 107 including the cleaned and dried wafers 100 out of the cleaning device 50 and store it in a cassette (not shown) on the cassette stage 16.

[0056] As described above, in the cleaning apparatus 50 of this embodiment, the annular wall 56 is disposed so as to surround the wafer 100, cleaning water is supplied to the inside of the annular wall 56 to submerge the wafer 100, and ultrasonic vibration is propagated to the cleaning water used for the submersion, thereby ultrasonically cleaning the wafer 100. This allows the wafer 100 to be ultrasonically cleaned with less cleaning water than in a configuration in which a water tank is used to submerge the wafer 100. This makes it possible to shorten the storage time of the cleaning water. Furthermore, since there is less cleaning water to propagate the ultrasonic vibration, the output of the ultrasonic vibration can be reduced. This also makes it possible to reduce the power consumption required for cleaning.

[0057] In addition, in this embodiment, the dirty cleaning water that is supplied to the inside of the annular wall 56 and used to clean the wafers 100 flows over the upper end of the annular wall 56 and is discharged to the outside of the annular wall 56. Therefore, it is possible to prevent dirt from re-adhering to the wafers 100.

[0058] In addition, when placing the annular wall 56 on the dicing tape 103 so as to surround the wafer 100, the control unit 7 may use the lifting mechanism 70 to bring the annular wall 56 into close contact with the dicing tape 103, or may form a gap between the dicing tape 103 and the annular wall 56.

[0059] That is, the lifting mechanism 70 may be configured to form a gap between the upper surface of the dicing tape 103 of the work set 107 held on the cleaning holding surface 52 and the lower end of the annular wall 56 .

[0060] In this case, by propagating ultrasonic vibrations to the cleaning water by the first vibration oscillator 58, the wafer 100 can be ultrasonically cleaned while the cleaning water in which the wafer 100 is submerged is discharged from the gap below the annular wall 56. Therefore, in this configuration, the wafer 100 can be cleaned while the dirty cleaning water is discharged from the gap, so that redeposition of dirt on the wafer 100 can be suppressed.

[0061] In addition, when a gap is formed under the annular wall 56 surrounding the wafer 100, the thickness (height) of the annular wall 56 may be less than or equal to the thickness of the wafer 100, as long as the upper end of the annular wall 56 is higher than the upper surface of the wafer 100. In addition, the width of the gap (the distance between the upper surface of the dicing tape 103 and the lower surface of the annular wall 56) is set so that the amount of water discharged from the gap is smaller than the amount of water supplied. This allows water to pool inside the annular wall 56, and the wafer 100 surrounded by the annular wall 56 to be submerged in water.

[0062] 4, the annular wall 56 may have through holes 561 penetrating the inside and outside of the annular wall 56. In this case, even when the annular wall 56 is in close contact with the dicing tape 103 of the work set 107 so as to surround the wafer 100, the cleaning water in the annular wall 56 can flow out of the annular wall 56 via the through holes 561.

[0063] Therefore, even in this case, by propagating ultrasonic vibrations to the cleaning water by the first vibration oscillator 58, the wafer 100 can be ultrasonically cleaned while the cleaning water in which the wafer 100 is submerged is discharged from the through-hole 561. Therefore, the wafer 100 can be cleaned while the dirty cleaning water is discharged from the through-hole 561, so that redeposition of dirt on the wafer 100 can be suppressed. The diameter and number of the through holes 561 are set so that the amount of water discharged from the through holes 561 is smaller than the amount of water supplied. This allows water to be stored inside the annular wall 56, and the wafers 100 surrounded by the annular wall 56 to be submerged in water.

[0064] In this embodiment, the wafer 100 is cleaned in the cleaning device 50 of the processing apparatus 1 while in the state of the work set 107. However, this is not limited thereto, and the wafer 100 may be cleaned directly in the cleaning device 50.

[0065] In this case, the control unit 7 sends the wafer 100 after cutting to the cleaning device 50 by the first transport mechanism 30, and the cleaning holding surface 52 of the holding table 51 directly holds the wafer 100 by suction.

[0066] Then, the control unit 7 uses the position adjustment unit 59 of the cleaning device 50 to position the annular wall 56 of the ultrasonic cleaning unit 55 on the cleaning holding surface 52 so as to surround the wafer 100. Then, the control unit 7 uses the cleaning water supply nozzle 57 to supply cleaning water to the inside of the annular wall 56 to submerge the wafer 100, and uses the first vibration generating unit 58 to propagate ultrasonic vibrations to the cleaning water in which the wafer 100 is submerged. In this way, the wafer 100 is ultrasonically cleaned.

[0067] Even in this case, the annular wall 56 may have a through hole 561 (see FIG. 4), and the lifting mechanism 70 may be configured to form a gap between the cleaning holding surface 52 and the lower end of the annular wall 56. This allows the wafer 100 to be cleaned while the cleaning water in which the wafer 100 is submerged is discharged from the through hole 561 or the gap below the annular wall 56.

[0068] In this embodiment, the ultrasonic vibration generated from the first vibration generator 58 of the cleaning device 50 is preferably a transverse ultrasonic vibration. When a transverse ultrasonic vibration is used, the range in which the ultrasonic waves spread in the cleaning water becomes relatively wide. Therefore, by using the transverse ultrasonic vibration, it is possible to clean the entire wafer 100 well.

[0069] Moreover, the cleaning device 50 may have an ultrasonic cleaning unit 80 as shown in Fig. 5, instead of the ultrasonic cleaning unit 55 shown in Fig. 2 to Fig. 4. This ultrasonic cleaning unit 80 has the annular wall 56, the cleaning water supply nozzle 57, and the position adjustment unit 59 (see Fig. 2) like the ultrasonic cleaning unit 55, but has a second vibration oscillator 81 instead of the first vibration oscillator 58. Note that in Fig. 5, the holding table 51, the cleaning water supply nozzle 57, and the position adjustment unit 59 are omitted from illustration.

[0070] The second vibration oscillator 81 has an ultrasonic oscillator 82 that oscillates ultrasonic vibrations, and a horizontal movement mechanism 83 for moving the ultrasonic oscillator 82 in the horizontal direction (Y-axis direction) as shown by arrow 303. The second vibration oscillator 81 is installed, for example, on the front surface of the housing 12 (see FIG. 1).

[0071] In this configuration, the control unit 7 uses the horizontal movement mechanism 83 to move the ultrasonic oscillator 82 in the Y-axis direction along the cut groove formed in the wafer 100 while propagating ultrasonic vibrations generated by the ultrasonic oscillator 82 to the cleaning water that is supplied to the inside of the annular wall 56 and submerges the wafer 100. This allows the cut groove in the wafer 100 to be ultrasonically cleaned satisfactorily.

[0072] In the configuration shown in Fig. 5, the second vibration oscillator 81 may be configured to oscillate ultrasonic vibration of a longitudinal wave. In ultrasonic vibration of a longitudinal wave, the range in which ultrasonic waves spread in the cleaning water is relatively narrow. However, in the configuration shown in Fig. 5, the second vibration oscillator 81 is moved in the Y-axis direction along the cut groove by the horizontal movement mechanism 83. Therefore, the cut groove of the wafer 100 can be cleaned well. The processing device may be a grinding device. In other words, ultrasonic vibrations may be propagated to the surface to be ground that has been ground by the grinding device, and the surface may be cleaned by submerging the surface to be cleaned in water and propagating ultrasonic vibrations thereto. In the configuration shown in FIG. 5, the horizontal movement mechanism 83 may be configured to move the second vibration oscillator 81 in the Y-axis direction and the X-axis direction along the cut groove. It is also possible to provide a plurality of ultrasonic oscillators 82. That is, an ultrasonic vibration unit having a plurality of plate-shaped ultrasonic vibrators arranged on a flat plate may be landed on the water surface to clean the surface to be cleaned. The flat plate may also be a punched plate having a plurality of holes. Furthermore, the intervals between the multiple ultrasonic oscillators 82 may be adjustable.

[0073] In this embodiment, the annular wall 56 has a rectangular frame shape. In this regard, the shape of the annular wall 56 may be set according to the shape of the workpiece. For example, when cleaning a circular wafer, the annular wall 56 may have a circular frame shape. [Explanation of symbols]

[0074] 1: Processing device, 7: Control unit, 10: Support stand, 12: Housing, 14: Processing unit, 13: stage moving member; 16: cassette stage; 17: Push-pull mechanism, 171: push-pull arm, 172: push-pull arm movement mechanism, 18: Temporary placement material, 20: chuck table, 210: processing holding surface, 21: moving plate, 22: clamp, 23: Waterproof cover, 30: first transport mechanism, 31: first frame holding unit, 33: first moving mechanism, 35: first lifting mechanism, 60: second transport mechanism, 61: second frame holding unit, 63: second moving mechanism, 65: second lifting mechanism, 40: Touch panel, 50: cleaning device, 51: holding table, 52: cleaning support surface, 53: clamp, 55: ultrasonic cleaning unit, 56: annular wall; 561: through hole; 57: cleaning water supply nozzle, 58: first vibration oscillator, 59: Position adjustment section, 70: lifting mechanism, 71: groove, 72: lifting block, 73: lifting rod, 74: rotating motor, 75: rotating arm, 80: ultrasonic cleaning unit, 81: second vibration oscillator, 82: ultrasonic oscillator, 83: horizontal movement mechanism, 100: wafer, 103: dicing tape, 105: Ring frame, 107: Work set

Claims

1. A cleaning device for cleaning a workpiece held on a holding surface of a holding table, comprising: The holding surface has an area that protrudes outward from the lower surface of the workpiece, an annular wall capable of surrounding the workpiece held on the holding surface such that an upper end of the annular wall is higher than an upper surface of the workpiece; a through hole passing through the annular wall from inside to outside; a lifting mechanism for lifting the annular wall in a direction perpendicular to the holding surface; a cleaning water supply unit that supplies cleaning water to the inside of the annular wall that is disposed so as to surround the workpiece held on the holding surface, thereby submerging the workpiece; a vibration generator that propagates ultrasonic vibrations to the cleaning water in which the workpiece is submerged; The cleaning device cleans the workpiece by transmitting ultrasonic vibrations to the submerged workpiece while discharging the cleaning water in which the workpiece is submerged through the through hole.

2. The holding surface of the holding table is configured to hold a tape of a work set in which a ring frame having an opening capable of accommodating a workpiece and the workpiece positioned in the opening are integrated with the tape, The annular wall is disposed over the tape.

2. The cleaning device according to claim 1.

3. A cleaning device for cleaning a workpiece held on a holding surface of a holding table, comprising: The holding surface has an area that protrudes outward from the lower surface of the workpiece, an annular wall capable of surrounding the workpiece held on the holding surface such that an upper end of the annular wall is higher than an upper surface of the workpiece; a lifting mechanism for lifting the annular wall in a direction perpendicular to the holding surface; a cleaning water supply unit that supplies cleaning water to the inside of the annular wall that is disposed so as to surround the workpiece held on the holding surface, thereby submerging the workpiece; a vibration generator that propagates ultrasonic vibrations to the cleaning water in which the workpiece is submerged; The lifting mechanism is configured to form a gap between the holding surface and a lower end of the annular wall; The cleaning device cleans the workpiece by transmitting ultrasonic vibrations to the submerged workpiece while discharging the cleaning water in which the workpiece is submerged from the gap.

4. A cleaning device for cleaning a workpiece held on a holding surface of a holding table, comprising: The holding surface has an area that protrudes outward from the lower surface of the workpiece, an annular wall capable of surrounding the workpiece held on the holding surface such that an upper end of the annular wall is higher than an upper surface of the workpiece; a lifting mechanism for lifting the annular wall in a direction perpendicular to the holding surface; a cleaning water supply unit that supplies cleaning water to the inside of the annular wall that is disposed so as to surround the workpiece held on the holding surface, thereby submerging the workpiece; a vibration generator that propagates ultrasonic vibrations to the cleaning water in which the workpiece is submerged; The holding surface of the holding table is configured to hold a tape of a work set in which a ring frame having an opening capable of accommodating a workpiece and the workpiece positioned in the opening are integrated with the tape, the annular wall is disposed over the tape; the lifting mechanism is configured to form a gap between an upper surface of the tape of the work set held on the holding surface and a lower end of the annular wall; The cleaning device cleans the workpiece by transmitting ultrasonic vibrations to the submerged workpiece while discharging the cleaning water in which the workpiece is submerged from the gap.

5. The vibration oscillator is disposed on the annular wall. The cleaning device according to any one of claims 1 to 4.

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