Machining method and cutting device

Abstract

To suppress deterioration in reliability of a chip and a connection failure.SOLUTION: A processing method comprises: a half-cut step 1002 of forming a cut remaining part at a lower side of a first cutting groove while forming the first cutting groove by cutting a first blade into a package substrate to cut the package substrate with the first blade along a cutting division schedule line; a full-cutting step 1003 of cutting the cutting remaining part along the first cutting groove with a second blade which is thinner than the first blade after the implementation of the half-cutting step 1002; and a tip end formation confirmation step 1005 of confirming a shape of a tip end of the first blade. In the half-cutting step 1002, the first blade is cut into the package substrate to a cutting depth so that a depth of a cutting part becomes a predetermined depth on the basis of the shape of the tip end of the first blade confirmed in the tip end shape confirmation step 1005 and a thickness of the second blade.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a processing method and cutting device for step-cutting a package substrate with two types of blades of different thicknesses to form a chip (package) with a stepped notch formed on the side surface. [Background technology]

[0002] In recent years, the miniaturization of electrical devices has led to a reduction in package size, resulting in a decrease in the electrode area of ​​the package substrate. Therefore, in order to strengthen the bond with the mounting substrate and to improve the visibility of the bond, packages called wettable flanks are widely adopted.

[0003] A wettable flank package is formed by half-cutting the package substrate along the planned dividing line with a blade to expose the electrodes partway through their thickness on the cut surface, plating the electrodes, and then fully cutting them with a blade that is narrower than the half-cut groove (see, for example, Patent Document 1).

[0004] Wettable flank packages improve the wettability of the solder by cutting a notch into the side of the electrode and plating it.Furthermore, by forming a stepped notch on the side, the solder supplied to the notch during mounting forms a bulge called a fillet, resembling the foot of Mt. Fuji, which allows the solder joint to be visually confirmed from the top and sides, making it possible to perform visual inspections using a camera. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-161615 A Summary of the Invention [Problem to be solved by the invention]

[0006] On the other hand, as the cutting blade wears, an R-shape forms at the tip, so if cutting is continued without changing the cutting depth when an R-shape has formed at the tip of the half-cut blade, the depth of the notch formed in the side of the chip (package) will change.

[0007] If the depth of the cutout changes, the fillet, which is the solder connection exposed on the side of the package during mounting, may not be formed at a sufficient height from the mounting board, which could reduce the reliability of inspection or lead to poor connections.

[0008] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a processing method and cutting device capable of suppressing deterioration of chip reliability and connection failure. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems and achieve the object, the processing method of the present invention is a processing method for forming a chip having a stepped notch formed on a side by half-cutting a package substrate, on which a plurality of intersecting planned division lines are set, with a first blade and then full-cutting with a second blade having a blade thickness thinner than the first blade, the processing method including: a half-cut step of cutting the package substrate with the first blade along the planned division lines to form a first cut groove and form an uncut portion below the first cut groove; a full-cut step of cutting the uncut portion along the first cut groove with the second blade, which is thinner than the first blade, after performing the half-cut step; and a tip shape confirmation step of confirming a tip shape of the first blade, wherein in the half-cut step, the first blade is cut into the package substrate to a cutting depth such that the depth of the notch becomes a predetermined depth based on the tip shape of the first blade confirmed in the tip shape confirmation step and the blade thickness of the second blade.

[0010] In the processing method, the tip shape checking step may include forming a cutting mark by the first blade on the upper surface of the package substrate, and checking the tip shape of the first blade based on the cutting mark.

[0011] The processing method may further include a flattening step of correcting and flattening the tip of the first blade at a predetermined timing.

[0012] The cutting device of the present invention is a cutting device that forms a chip with a stepped notch on a side by half-cutting a package substrate on which a plurality of intersecting planned division lines are set with a first blade and then fully cutting it with a second blade having a blade thickness thinner than the first blade, and is characterized in that the cutting device comprises a table that holds the package substrate, a first cutting unit having a first blade that cuts the package substrate along the planned division lines to form a first cut groove and forms an uncut portion below the first cut groove, a second cutting unit having a second blade that is thinner than the first blade and cuts the uncut portion along the first cut groove, an imaging unit that images cutting marks formed by cutting the first blade into an object to be cut, and a control unit that controls each component, and the control unit comprises an estimation unit that estimates a tip shape of the first blade based on an image captured by the imaging unit, and a calculation unit that calculates a cutting depth of the first blade such that the depth of the notch is a predetermined depth based on the tip shape of the first blade and the blade thickness of the second blade estimated by the estimation unit. Effect of the Invention

[0013] The present invention has an effect of suppressing deterioration in chip reliability and connection failure. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a cutting device according to the first embodiment. [Diagram 2] FIG. 2 is a plan view of a package substrate to be processed by the processing method and cutting device according to the first embodiment. [Diagram 3]FIG. 3 is a side view of the package substrate shown in FIG. [Figure 4] FIG. 4 is a plan view of the back surface side of the package substrate shown in FIG. [Diagram 5] FIG. 5 is a perspective view of a packaged chip obtained by dividing the package substrate shown in FIG. [Figure 6] 6 is a front view showing the first cutting unit and the second cutting unit of the cutting device shown in FIG. [Figure 7] FIG. 7 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional view that illustrates a half-cut step of the processing method illustrated in FIG. [Figure 9] FIG. 9 is a cross-sectional view that illustrates a full-cut step of the processing method illustrated in FIG. [Figure 10] FIG. 10 is a cross-sectional view that typically shows a state before the first blade of the cutting device shown in FIG. 1 is worn. [Figure 11] FIG. 11 is a cross-sectional view that typically shows a state in which the first blade shown in FIG. 10 is worn. [Figure 12] FIG. 12 is a cross-sectional view that typically shows a state in which the first blade shown in FIG. 11 has been further worn. [Figure 13] 13 is a side view, partially in cross section, showing a schematic state in which the cutting edge of the first blade is cut into the peripheral excess region of the base substrate of the package substrate in the tip shape confirmation step of the processing method shown in FIG. [Figure 14] FIG. 14 is a plan view of the peripheral excess area of ​​the base substrate of the package substrate on which cutting marks are formed in the tip shape confirmation step of the processing method shown in FIG. [Figure 15] FIG. 15 is a diagram showing an image obtained by imaging the cutting trace by the imaging unit in the tip shape confirmation step of the processing method shown in FIG. [Figure 16]FIG. 16 is a diagram showing an image of the tip of the cutting edge of the first blade generated by reducing the length of the image shown in FIG. 15 in the tip shape confirmation step of the processing method shown in FIG. [Figure 17] FIG. 17 is a cross-sectional view of the tip of the cutting edge of the first blade on which the cutting mark shown in FIG. 14 is formed. [Figure 18] FIG. 18 is a vertical cross-sectional view parallel to the longitudinal direction of the cutting mark shown in FIG. [Figure 19] FIG. 19 is a cross-sectional view that typically shows the cutting depth and the like calculated in the tip shape confirmation step of the processing method shown in FIG. [Figure 20] FIG. 20 is a side view, partially in cross section, illustrating a state in which the cutting edge of the first blade is cut into the peripheral excess region of the base substrate of the package substrate in a tip shape confirmation step of a processing method according to a modified example of the first embodiment. [Figure 21] FIG. 21 is a plan view of a peripheral excess area of ​​a base substrate of a package substrate on which cutting marks are formed in a tip shape confirmation step of a processing method according to a modified example of the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment 1. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0016] [Embodiment 1] A processing method and cutting device 1 according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the cutting device according to the first embodiment. FIG. 2 is a plan view of a package substrate to be processed by the processing method and cutting device according to the first embodiment. FIG. 3 is a side view of the package substrate shown in FIG. 2. FIG. 4 is a plan view of the back surface side of the package substrate shown in FIG. 2. FIG. 5 is a perspective view of a package chip obtained by dividing the package substrate shown in FIG. 2. FIG. 6 is a front view showing a first cutting unit and a second cutting unit of the cutting device shown in FIG. 1.

[0017] The cutting device shown in FIG. 1 relating to embodiment 1 is a processing device that performs cutting processing on a package substrate 200, which is a substrate shown in FIGS. 2, 3, and 4, to divide the package substrate 200 into individual package chips 201 (corresponding to chips) shown in FIG. 5, and form the package chips 201.

[0018] (Package substrate) The package substrate 200 to be processed by the cutting device 1 according to the first embodiment is formed in a rectangular plate-like shape in plan view, as shown in Fig. 2. The package substrate 200 includes a rectangular plate-like base substrate 202, and has a device region 204 and a peripheral excess region 205 surrounding the device region 204 on a surface 203 of the base substrate 202. The surface 203 of the base substrate 202 corresponds to the upper surface of the package substrate 200. The base substrate 202 is made of a metal such as a metal containing copper (i.e., a copper alloy).

[0019] In the device region 204, a plurality of dividing lines 206 are set, which intersect with each other. One of the plurality of dividing lines 206 which intersect with each other extends in a direction parallel to the longitudinal direction of the base substrate 202, and the other of the dividing lines 206 extends in a direction perpendicular to the longitudinal direction of the base substrate 202 and parallel to the width direction of the base substrate 202. A device chip 208 is disposed in a region 207 defined by the plurality of dividing lines 206 which intersect with each other. The dividing lines 206 are configured to penetrate the base substrate 202. The region 207 is configured by a part of the base substrate 202, and the device chip 208 is disposed on the back surface 210 (shown in FIG. 4, etc.) side behind the front surface 203. An electrode 209 for connecting the package chip 201 to a wiring substrate or the like is provided on each dividing line 206.

[0020] The electrodes 209 are formed of a part of the base substrate 202, and in the first embodiment, are provided at the center of the width direction of the planned division lines 206, and are formed linearly in a direction perpendicular to the planned division lines 206. The electrodes 209 are connected to the device chip 208 by wires or the like (not shown).

[0021] In the first embodiment, a plurality of device regions 204 (three in the first embodiment) are arranged at intervals in the longitudinal direction of the base substrate 202. The peripheral surplus region 205 is a region in which no device chip 208 is arranged, and is formed by the base substrate 202, surrounding the entire periphery of each device region 204 and connecting adjacent device regions 204 to each other.

[0022] 3 and 4, the package substrate 200 includes a sealing resin 211 that seals (coats) the back surface 210 side of each device region 204. The sealing resin 211 is made of a thermoplastic resin, seals (coats) the device chips 208 and wires arranged on the back surface 210 of the region 207 of the base substrate 202, and is filled in the division lines 206. The sealing resin 211 seals (coats) the entire device regions 204 on the back surface 210 side of the base substrate 202. The sealing resin 211 seals (coats) the inside of the division lines 206 on the front surface 203 side of the base substrate 202, while exposing the region 207 where the device chips 208 are arranged and the electrodes 209.

[0023] The package substrate 200 is cut at the center of the width direction of each division line 206 of each device region 204, and the electrodes 209 are divided into two, and the package substrate 200 is divided into individual package chips 201 shown in FIG. 5. Thus, the package substrate 200 to be processed by the processing method and cutting device 1 according to the first embodiment is a QFN substrate in which the electrodes 209 made of metal are arranged on the division lines 206 cut by the cutting blade 21. In the first embodiment, the package substrate 200 is a QFN (Quad Flat Non-leaded Package) substrate in which the electrodes 209 are arranged on the division lines 206, but is not limited thereto, and may be a CSP (Chip Scale Packaging) substrate. In the first embodiment, the package chip 201 divided from the package substrate 200 is a small chip in which the length of each side is about 1 mm×1 mm, that is, the chip size is small.

[0024] 2, in the package substrate 200, alignment marks 212 indicating cutting positions of the division lines 206 during cutting are provided on both ends of the division lines 206 on the surface 203 of the base substrate 202. In the embodiment 1, the alignment marks 212 are arranged at positions aligned with the centers of the division lines 206 in the width direction.

[0025] 5, a package chip 201 manufactured by dividing the package substrate 200 includes an area 207 of a base substrate 202, a device chip 208 disposed on a back surface 210 of the area 207, electrodes 209, and a sealing resin 211. The sealing resin 211 seals the device chip 208 and the like with the front surface 203 of the area 207 and the electrodes 209 exposed.

[0026] In the first embodiment, the package chip 201 has a stepped notch 214 formed in each side surface 213. The notch 214 is parallel to the side surface 213 and flat in a direction perpendicular to both the front surface 203 and the back surface 210, and includes a second side surface 213-1 on the front surface 203 side and a flat surface 213-2 continuing to the second side surface 213-1 and the side surface 213. The flat surface 213-3 is formed flat along both the front surface 203 and the back surface 210. In the region where the electrode 209 is formed, the notch 214 is formed only in the electrode 209 and is not formed in the sealing resin 211. The depth 215 of the notch 214 is set to a predetermined depth 219 smaller than the thickness of the electrode 209 and set in advance at the design stage or the like.

[0027] The package chip 201 also has a metal plating layer (not shown) on the surface of the electrode 209. The plating layer improves the wettability of the solder that fixes the package chip 201 to the mounting substrate to the electrode 209. The package chip 201 is mounted on the mounting substrate by fixing the electrode 209 to a metal portion (not shown) of the mounting substrate by the solder.

[0028] (cutting equipment) The cutting device 1 according to the first embodiment is a processing device that holds the package substrate 200 on a table 10 and cuts it along a plurality of planned division lines 206. In the first embodiment, the cutting device 1 is a processing device (a so-called jig dicer) that holds the package substrate 200, to which no dicing tape is attached, directly on the table 10 and performs a so-called full cut on the package substrate 200 to divide it into package chips 201.

[0029] 1, the cutting device 1 includes a table 10 that suction-holds a package substrate 200 on a holding surface 11, a sub-chuck table 15, a cutting unit 20 that cuts the package substrate 200 held on the table 10, an imaging unit 30 that photographs the package substrate 200 held on the table 10, and a control unit 100. As shown in FIGS. 1 and 6, the cutting device 1 includes two cutting units 20, that is, it is a two-spindle dicer, a so-called facing dual type cutting device.

[0030] 1, the cutting device 1 includes a moving unit 40 that relatively moves the table 10 and the cutting unit 20. The moving unit 40 includes an X-axis moving unit 41, a Y-axis moving unit 42, a Z-axis moving unit 43, and a rotational moving unit 44.

[0031] The X-axis moving unit 41 moves the table 10 and the rotational moving unit 44 in the X-axis direction parallel to the horizontal direction, which is the processing feed direction, thereby moving the cutting unit 20 and the table 10 relatively along the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction parallel to the horizontal direction, which is the indexing feed direction, and perpendicular to the X-axis direction, thereby moving the cutting unit 20 and the table 10 relatively along the Y-axis direction.

[0032] The Z-axis moving unit 43 moves the cutting unit 20 in the Z-axis direction perpendicular to both the X-axis direction and the Y-axis direction, which are the cutting feed directions, thereby moving the cutting unit 20 and the table 10 relatively along the Z-axis direction. The rotational movement unit 44 is supported by the X-axis moving unit 41, supports the table 10, and is disposed so as to be movable in the X-axis direction together with the table 10. The rotational movement unit 44 rotates the table 10 around an axis parallel to the Z-axis direction.

[0033] The X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43 each include a well-known ball screw rotatably provided around its axis, a well-known motor for rotating the ball screw around its axis, and a well-known guide rail for supporting the table 10 or the cutting unit 20 movably in the X-axis, Y-axis or Z-axis direction. The rotation moving unit 44 includes a motor for rotating the table 10 around its axis.

[0034] The table 10 suction-holds the package substrate 200 on its upper surface, which is a holding surface 11. The table 10 is rotated about an axis parallel to the Z-axis direction by the rotational movement unit 44. The table 10 is moved in the X-axis direction by the X-axis movement unit 41 together with the rotational movement unit 44.

[0035] The holding surface 11 of the table 10 is divided into a plurality of regions by clearance grooves 12 into which the cutting blade 21 enters during cutting, and suction holes 13 for sucking the package substrate 200 and the package chip 201 are opened in each of the regions divided by the clearance grooves 12 of the holding surface 11. The clearance grooves 12 are provided at positions corresponding to the planned division lines 206 (positions overlapping the planned division lines 206 of the package substrate 200 held on the holding surface 11) and are formed recessed from the holding surface 11.

[0036] The suction holes 13 are provided at positions corresponding to the package chip 201 (i.e., positions overlapping the package chip 201 of the package substrate 200 held on the holding surface 11) and open in each region of the holding surface 11. In the first embodiment, the suction holes 13 correspond one-to-one to the package chips 201. The suction holes 13 are connected to a suction source via a suction path (not shown).

[0037] The sealing resin 211 side of the package substrate 200 is placed on the holding surface 11 of the table 10. The table 10 suction-holds the package substrate 200 and the package chip 201 on the holding surface 11 by suction through suction holes 13 by a suction source. In the first embodiment, the table 10 is a so-called jig table that suction-holds the package substrate 200, to which no dicing tape is attached, directly on the holding surface 11, but is not limited to a jig table in the present invention.

[0038] The sub-chuck table 15 is provided at a position adjacent to the table 10, and suction-holds the dress board 250 on the holding surface 16. The dress board 250 is used for flat dressing, in which the tip of the cutting blade of the cutting blade 21 is worn down by cutting with the cutting blade 21, and the tip of the cutting blade is flattened along the axial direction of the cutting unit 20.

[0039] The sub-chuck table 15, together with the table 10 and the rotary movement unit 44, is moved in the X-axis direction by the X-axis movement unit 41. The sub-chuck table 15, together with the table 10, is rotated about its axis by the rotary movement unit 44.

[0040] The cutting unit 20 is a processing unit in which a cutting blade 21 is attached to a spindle 23 and cuts a package substrate 200 held on the table 10. The cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 42 and movable in the Z-axis direction by a Z-axis moving unit 43 with respect to the package substrate 200 held on the table 10. As shown in FIG. 1, the cutting unit 20 is provided on a support frame 3 erected from the device main body 2 via the Y-axis moving unit 42 and the Z-axis moving unit 43. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0041] The cutting unit 20 includes a cutting blade 21, a spindle housing 22 that is freely movable in the Y-axis and Z-axis directions by a Y-axis moving unit 42 and a Z-axis moving unit 43, a spindle 23 that is rotatably mounted on the spindle housing 22 about its axis and has the cutting blade 21 attached to its tip, a spindle motor (not shown) that rotates the spindle 23 about its axis, and a cutting water nozzle 24 that supplies cutting water to the cutting blade 21.

[0042] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 21 is fixed to the tip of the spindle 23. In the first embodiment, the cutting blade 21 is a so-called hub blade having an annular circular base and an annular cutting blade disposed on the outer periphery of the circular base for cutting the package substrate 200. The cutting blade is made of abrasive grains such as SiC, alumina, diamond, or CBN (Cubic Boron Nitride), and a bond (binding material) for fixing the abrasive grains such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade composed of only the cutting blade.

[0043] In the following, one of the two cutting units 20 is referred to as the first cutting unit 20 (indicated by reference symbol 20-1), and the other is referred to as the second cutting unit 20 (indicated by reference symbol 20-2). In addition, as shown in FIG. 6, the cutting blade 21 of the first cutting unit 20-1 is referred to as the first blade 21 (indicated by reference symbol 21-1), and the cutting blade 21 of the second cutting unit 20-2 is referred to as the second blade 21 (indicated by reference symbol 21-2). In addition, the cutting blade thickness 25-2 of the second blade 21-2 of the second cutting unit 20-2 is thinner than the cutting blade thickness 25-1 of the first blade 21-1 of the first cutting unit 20-1. In addition, in the first embodiment, when the blades 21-1 and 21-2 repeatedly cut the package substrate 200, the cutting blade gradually wears from the tip side, and the corners are removed to form a curved surface (R shape).

[0044] The imaging unit 30 is fixed to the first cutting unit 20-1 so as to move integrally with the first cutting unit 20-1. The imaging unit 30 includes an imaging element that captures an image of a region to be divided of the package substrate 200 before cutting held on the table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the package substrate 200 held on the table 10 to obtain an image for performing alignment between the package substrate 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0045] The cutting device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the positions of the cutting units 20-1 and 20-2 in the Y-axis direction, and a Z-axis position detection unit for detecting the positions of the cutting units 20-1 and 20-2 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the positions of the cutting units 20-1 and 20-2 in the Z-axis direction by a motor pulse. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the X-axis direction of the table 10 and the Y-axis or Z-axis position of the lower ends of the cutting blades of the cutting units 20-1 and 20-2 to the control unit 100.

[0046] In the first embodiment, the positions in the X-axis direction, the Y-axis direction, and the Z-axis direction of the table 10 and the cutting units 20-1 and 20-2 of the cutting device 1 are determined based on predetermined reference positions (not shown).

[0047] The control unit 100 also controls each of the components of the cutting device 1, including the first cutting unit 20-1, the second cutting unit 20-2, and the imaging unit 30, and causes the cutting device 1 to perform a processing operation on the package substrate 200. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a central processing unit (CPU), a storage device having a memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to each of the components of the cutting device 1 via the input / output interface device.

[0048] The control unit 100 is connected to a display unit configured with a liquid crystal display device or the like that displays the status and images of the machining operation, and an input unit that an operator uses to register machining content information, etc. The input unit is configured with a touch panel provided on the display unit.

[0049] 1, the control unit 100 includes an estimation unit 101, a calculation unit 102, and a processing control unit 103 that controls the processing operation of each component of the cutting device 1. The functions of the estimation unit 101, the calculation unit 102, and the processing control unit 103 are realized by the arithmetic processing device performing arithmetic processing in accordance with a computer program stored in the storage device.

[0050] The processing method according to the first embodiment is a processing method in which the cutting device 1 half-cuts the package substrate 200 with a first blade 21-1, and then full-cuts the package substrate 200 with a second blade 21-2 having a blade thickness 25-2 thinner than that of the first blade 21-1, thereby forming a package chip 201 having a stepped cutout 214 formed in a side surface 213. That is, the processing method according to the first embodiment is also a processing operation of the cutting device 1. FIG. 7 is a flowchart showing the flow of the processing method according to the first embodiment. As shown in FIG. 7, the processing method according to the first embodiment includes a half-cut step 1002, a full-cut step 1003, a tip shape confirmation step 1005, a flattening step 1007, and the like.

[0051] In the cutting device 1, the sealing resin 211 of the package substrate 200 is placed on the holding surface 11 of the table 10, and the dress board 250 is placed on the holding surface 11 of the sub-chuck table 15. In the cutting device 1, when the control unit 100 receives processing conditions input from an input unit or the like and the control unit 100 receives a processing start instruction from an operator or the like, the cutting device 1 performs a processing operation, i.e., a processing method. The processing conditions include the blade thicknesses 25-1 and 25-2 of the blades 21-1 and 21-2, the cutting depth 26 (shown in FIG. 8) of the first blade 21-1, a predetermined depth 219 of the depth 215 of the cutout portion 214 set in advance at a design stage or the like, the thickness of the electrode 209, the type of the first blade 21-1, the type of the package substrate 200, and the like. The cutting depth 26 of the processing conditions is smaller than the thickness of the electrode 209 and is the same as the predetermined depth 219 of the depth 215 of the cutout portion 214 set in advance at a design stage or the like.

[0052] When the machining operation is started, the cutting device 1 rotates the spindles 23 of the cutting units 20-1 and 20-2, i.e., the cutting blades 21-1 and 21-1, about their axes, and sucks and holds the package substrate 200 on the holding surface 11 of the table 10, and sucks and holds the dress board 250 on the holding surface 11 of the sub-chuck table 15. When the machining operation is started, the cutting device 1 determines whether or not it is time for the machining control unit 103 of the control unit 100 to check the shape of the tip of the cutting blade of the first blade 21-1 (step 1001). The timing for checking the shape of the tip of the cutting blade of the first blade 21-1 is determined by the type of the package substrate 200 and the first blade 21-1, etc. When the cutting device 1 determines that it is not time for the machining control unit 103 of the control unit 100 to check the shape of the tip of the cutting blade of the first blade 21-1 (step 1001: No), it proceeds to the half-cut step 1002.

[0053] (Half cut step) Fig. 8 is a cross-sectional view that typically shows a half-cut step of the processing method shown in Fig. 7. The half-cut step 1002 is a step in which the first blade 21-1 is caused to cut into the package substrate 200 and cuts the package substrate 200 along the planned division line 206 with the first blade 21-1 to form a first cut groove 216 and to form an uncut portion 217 below the first cut groove 216. That is, in the half-cut step 1002, the first blade 21-1 cuts the package substrate 200 along the planned division line 206 to form the first cut groove 216 and to form an uncut portion 217 below the first cut groove 216.

[0054] In the half-cut step 1002, the cutting device 1 has the processing control section 103 of the control unit 100 control the moving unit 40 to move the table 10 to below the imaging unit 30, capture an image of the mark 212 on the package substrate 200 with the imaging unit 30, and perform alignment to align the blades 21-1, 21-2 with the planned division lines 206. In the half-cut step 1002, the cutting device 1 has the processing control section 103 of the control unit 100 control each component to relatively move the table 10 and the first blade 21-1 of the cutting unit 20-1 along the X-axis direction, the Y-axis direction, etc., while causing the cutting edge of the first blade 21-1 to cut into the center of one planned division line 206 in the width direction by a cutting depth of 26 determined by the processing conditions. In the half-cut step 1002, the cutting device 1 cuts the planned division line 206 of the package substrate 200 with a first blade 21-1, as shown in FIG. 8, to form a first cutting groove 216 in the planned division line 206 and also form an uncut portion 217 below the first cutting groove 216.

[0055] In the first embodiment, in the half-cut step 1002, the cutting device 1 cuts the tip of the cutting blade of the first blade 21-1 into the center of each electrode 209 in the thickness direction by a cutting depth of 26 to form a first cutting groove 216 in the electrode 209 also on the division line 206. Note that the first cutting groove 216 is formed by cutting the tip of the cutting blade of the first blade 21-1 into the center of the electrode 209 in the thickness direction, and is therefore a groove that does not divide the electrode 209 and the package substrate 200, i.e., a half-cut groove.

[0056] In the first embodiment, in the half-cut step 1002, the cutting device 1 forms a first cutting groove 216 on one of the planned dividing lines 206 of the package substrate 200 held by suction on the table 10, but in the present invention, the first cutting groove 216 may be formed in order on a number of the planned dividing lines 206 determined by processing conditions, etc. In the first embodiment, in the half-cut step 1002, the cutting device 1 forms the first cutting groove 216 on one of the planned dividing lines 206 of the package substrate 200 held by suction on the table 10, and then proceeds to the full-cut step 1003.

[0057] (Full cut step) Fig. 9 is a cross-sectional view showing a schematic diagram of a full-cut step of the processing method shown in Fig. 7. The full-cut step 1003 is a step of cutting the uncut portion 217 along the first cutting groove 216 with the second blade 21-2 having a blade thickness 25-2 thinner than that of the first blade 21-1 after the half-cut step 1002 is performed. That is, in the full-cut step 1003, the second blade 21-2 is a cutting blade having a blade thickness 25-2 thinner than that of the first blade 21-1, which cuts the uncut portion 217 along the first cutting groove 216.

[0058] In the full cut step 1003, the cutting device 1 causes the processing control section 103 of the control unit 100 to control each component, and relatively moves the table 10 and the second blade 21-2 of the cutting unit 20-2 along the X-axis direction, the Y-axis direction, etc., while cutting the cutting edge of the second blade 21-2 into the uncut portion 217 below the first cut groove 216 formed in the center of the width direction of one of the division lines 206 until it reaches the clearance groove 12. In the full cut step 1003, as shown in FIG. 9, the cutting device 1 cuts the center of the width direction of the uncut portion 217 below the first cut groove 216 formed in the division line 206 of the package substrate 200 with the second blade 21-2 to form a second cut groove 218 that cuts, i.e., cuts, the uncut portion 217. In the full-cut step 1003 , the cutting device 1 forms second cutting grooves 218 that cut, ie, cut, the uncut portions 217 , and divides the package substrate 200 into package chips 201 .

[0059] At this time, in the package substrate 200, i.e., the package chip 201, a notch 214 is formed by the first cut groove 216, and a side surface 213 is formed by the second cut groove 218. The inner surface of the first cut groove 216 becomes the second side surface 213-1, the bottom surface of the first cut groove 216 becomes the flat surface 213-2, the inner surface of the second cut groove 218 becomes the side surface 213, and the depth 215 of the notch 214 is determined by the cutting depth 26 of the first blade 21-1.

[0060] In the first embodiment, in the full-cut step 1003, the cutting device 1 cuts the remaining portion 217 below the first cut groove 216 formed on one of the planned division lines 206 of the package substrate 200 held by suction on the table 10. However, in the present invention, the first cut groove 216 may be formed in order on the number of planned division lines 206 determined by the processing conditions, etc. In this case, in the full-cut step 1003, it is preferable to cut the remaining portion 217 below the first cut groove 216 formed in the immediately preceding half-cut step 1002. In the first embodiment, in the full-cut step 1003, the cutting device 1 cuts the remaining portion 217 below the first cut groove 216 formed on one of the planned division lines 206 of the package substrate 200 held by suction on the table 10, and then proceeds to step 1004.

[0061] The cutting device 1 judges whether the processing control unit 103 of the control unit 100 has formed the first cutting grooves 216 on all of the planned division lines 206 of the package substrate 200 in the half-cut step 1002, cut the remaining cut portions 217 below the first cutting grooves 216 in the full-cut step 1003, and divided the package substrate 200 into individual package chips 201 (step 1004). When the cutting device 1 judges that the processing control unit 103 of the control unit 100 has formed the first cutting grooves 216 on all of the planned division lines 206 of the package substrate 200 in the half-cut step 1002, cut the remaining cut portions 217 below the first cutting grooves 216 in the full-cut step 1003, and divided the package substrate 200 into individual package chips 201 (step 1004: No), the process returns to step 1001.

[0062] When the machining control unit 103 of the control unit 100 determines that it is time to check the shape of the tip of the cutting edge of the first blade 21-1 (step 1001: Yes), the cutting device 1 proceeds to tip shape checking step 1005. Here, the tip of the cutting edge of the first blade 21-1 of the cutting unit 20-1 of the cutting device 1 is formed flat along the axis of the spindle 23 before it is worn down, for example, as shown in Figs. 8 and 10, and the curved surface 28 (also called R shape) of the corner of the tip is small. Note that Fig. 10 is a cross-sectional view that shows a schematic state of the first blade of the cutting device shown in Fig. 1 before it is worn down. Fig. 11 is a cross-sectional view that shows a schematic state of the first blade shown in Fig. 10 after it is worn down. Fig. 12 is a cross-sectional view that shows a schematic state of the first blade shown in Fig. 11 after it is further worn down.

[0063] When the first blade 21-1 cuts the division line 206 repeatedly, it wears down, and for example, as shown in FIG. 11, the curved surface 28 at the corner of the tip of the cutting blade gradually becomes larger, and the boundary 27 between the curved surface 28 and the flat surface along the axis of the spindle 23 gradually moves toward the center in the thickness direction of the cutting blade. When the boundary 27 of the first blade 21-1 is located outside the second cutting groove 218 formed by the second blade 21-2, the cutting depth 26 and the depth 215 of the notch 214 become equal, and the notch 214 of the predetermined depth 219 can be formed. When the boundary 27 of the first blade 21-1 is located inside the second cutting groove 218 formed by the second blade 21-2, the depth 215 of the notch 214 becomes smaller than the cutting depth 26, and the notch 214 of the depth 215 smaller than the predetermined depth 219 is formed.

[0064] Furthermore, when the first blade 21-1 is further worn, for example, as shown in Fig. 12, the tip of the cutting edge may lose the flat surface along the axis and become curved, convexly curved in the outer circumferential direction. Then, the depth 215 of the notch 214 becomes smaller than the cutting depth 26, and the notch 214 having the depth 215 smaller than the predetermined depth 219 is formed.

[0065] In the first embodiment, the timing for checking the shape of the tip of the cutting edge of the first blade 21-1 in step 1001 is the timing before the first blade 21-1 wears down as shown in Fig. 12, for example, and the depth 215 of the notch 214 becomes smaller than the cutting depth 26, and is the timing before (just before) the above-mentioned boundary 27 penetrates into the inside of the second cutting groove 218. In the first embodiment, the timing for checking the shape of the tip of the cutting edge of the first blade 21-1 in step 1001 is determined for each type of package substrate 200 and first blade 21-1, and is the timing after starting the processing direction or after cutting a predetermined number of planned division lines 206 after the previous tip shape checking step 1005 is performed, etc.

[0066] (Tip shape confirmation step) FIG. 13 is a side view, partially in section, showing a state in which the cutting blade of the first blade is cut into the peripheral excess area of ​​the base substrate of the package substrate in the tip shape confirmation step of the processing method shown in FIG. 7. FIG. 14 is a plan view of the peripheral excess area of ​​the base substrate of the package substrate on which a cutting mark is formed in the tip shape confirmation step of the processing method shown in FIG. 7. FIG. 15 is a diagram showing an image obtained by imaging the cutting mark by the imaging unit in the tip shape confirmation step of the processing method shown in FIG. 7. FIG. 16 is a diagram showing an image of the tip of the cutting blade of the first blade generated by reducing the length of the image shown in FIG. 15 in the tip shape confirmation step of the processing method shown in FIG. 7. FIG. 17 is a cross-sectional view of the tip of the cutting blade of the first blade on which the cutting mark is formed as shown in FIG. 14. FIG. 18 is a vertical cross-sectional view parallel to the longitudinal direction of the cutting mark as shown in FIG. 14. FIG. 19 is a cross-sectional view showing the calculated cutting depth and the like in the tip shape confirmation step of the processing method shown in FIG. 7.

[0067] The tip shape confirmation step 1005 is a step for confirming the shape of the tip of the cutting blade of the first blade 21-1. In the first embodiment, in the tip shape confirmation step 1005, the estimation unit 101 of the control unit 100 of the cutting device 1 controls the moving unit 40 and the like to position the first blade 21-1 above the base substrate 202 in the outer peripheral excess region 205, which is the cutting target of the package substrate 200, as shown in Fig. 13, and lowers the rotating first blade 21-1 along the Z-axis direction to cut in with the tip of the cutting blade of the first blade 21-1, and then raises the first blade 21-1 along the Z-axis direction.

[0068] Then, the cutting marks 220 shown in FIG. 14 are formed on the surface 203 of the base substrate 202 in the peripheral excess region 205 of the package substrate 200. Thus, in the first embodiment, in the tip shape confirmation step 1005, the cutting device 1 cuts the first blade 21-1 into the surface 203 of the base substrate 202 in the peripheral excess region 205, which is the cutting target of the package substrate 200, and forms the cutting marks 220 on the surface 203 with the first blade 21-1. Also, in the first embodiment, in the tip shape confirmation step 1005, the cutting marks 220 are formed by so-called chopper cutting, in which the first blade 21-1 is raised and lowered relative to the surface 203 of the base substrate 202 in the peripheral excess region 205 of the package substrate 200. The cutting marks 220 are grooves recessed from the surface 203 extending along the X-axis direction, and the shapes of both ends 221 are curved according to the shapes of the tips of the cutting blades of the first blade 21-1.

[0069] In addition, since the cutting mark 220 is formed by raising and lowering the first blade 21-1 along the Z-axis direction, both ends 221 of the cutting mark 220 are formed as dead ends so as to gradually approach the surface 203 as they approach both ends 221. Both ends 221 of the cutting mark 220 have the same shape as the tip of the cutting edge of the first blade 21-1.

[0070] In the tip shape confirmation step 1005, the estimating section 101 of the control unit 100 of the cutting device 1 controls the moving unit 40 and the like to position the cutting mark 220 below the imaging unit 30. In the tip shape confirmation step 1005, the estimating section 101 of the control unit 100 of the cutting device 1 causes the imaging unit 30 to image the cutting mark 220 to obtain an image 300, an example of which is shown in Fig. 15. In this manner, the imaging unit 30 images the cutting mark 220 formed by cutting the first blade 21-1 into the base substrate 202 in the peripheral excess region 205 of the package substrate 200.

[0071] In tip shape confirmation step 1005, the estimating unit 101 of the control unit 100 of the cutting device 1 reduces the length of at least a part of the image 300 including one end 221 of the cutting mark 220 so that the length of at least a part of the image is the length as seen from the tangent direction 29 (shown in FIG. 18) of the tip of the cutting edge of the blade 21-1, and forms an image 400 that approximates the tip of the cutting edge of the first blade 21-1. Specifically, the estimating unit 101 of the control unit 100 divides the image 300 in the longitudinal direction of the cutting mark 220 as shown in FIG.

[0072] In the first embodiment, the estimation unit 101 of the control unit 100 divides the image 300 into a plurality of divided images 301, 302, 303, 304, ... for each length L that can be calculated from one end 221 of the cutting mark 220 by the following formula 1. The control unit 100 stores the following formula 1 in advance. The control unit 100 calculates the length L1 (indicated by L in formula 1) of the divided image 302 including one end 221 of the cutting mark 220 that can be calculated by formula 1 corresponding to the value α1 (indicated by α in formula 1). Here, the value α1 is, for example, 1 μm, R is the radius of the first blade 21-1, and d is the cutting depth of the cutting mark 220. The divided image 302 is an image of a part of the cutting mark 220 including one end 221 of the cutting mark 220.

[0073]

number

[0074] The estimation unit 101 of the control unit 100 removes some of the pixels constituting the divided image 302 so that the length L (L1) of the divided image 302 becomes the value α1. At this time, the control unit 100 removes pixels at equal intervals according to the difference between the length L (L1) and the value α1.

[0075] Next, the control unit 100 obtains the length L (L2) of the divided image 303 adjacent to the divided image 302 corresponding to the value α2 (indicated by α in the formula 1) by using the formula 1, where the value α2 is, for example, 1 μm, d is the cutting depth of the cutting mark 220, and R is R-α1. The estimation unit 101 of the control unit 100 removes a part of the pixels constituting the divided image 303 so that the length L (L2) of the divided image 303 becomes the value α2. Furthermore, the control unit 100 obtains the length L (L3) of the divided image 304 adjacent to the divided image 303 corresponding to the value α3 (indicated by α in the formula 1) by using the formula 1, where the value α3 is, for example, 1 μm, d is the cutting depth of the cutting mark 220, and R is R-(α1+α2). The control unit 100 removes a part of the pixels constituting the divided image 303 so that the length L (L3) of the divided image 304 becomes the value α3.

[0076] In this way, the estimation unit 101 of the control unit 100 divides the image 300 into divided images 301, 302, 303,...,300N, and calculates lengths L1, L2, L3,...,LN of the divided images 302, 303, 304,...30N corresponding to each value α1, α2, α3,...,αN. The estimation unit 101 of the control unit 100 removes some of the pixels of all the divided images 302, 303, 304,...,30N to reduce the lengths to values ​​α1, α2, α3,...,αN. Then, the estimation unit 101 of the control unit 100 combines the reduced divided images 301, 302, 303, 304, ..., 30N to reduce the length of the image 300 and generate an image 400 that approximates the shape of the tip of the cutting blade of the first blade 21-1, as shown in Fig. 16. Note that the shape of the cutting mark 220 in the image 400 shown in Fig. 16 is substantially equal to the cross-sectional shape of the tip of the cutting blade of the first blade 21-1 that formed the cutting mark 220 shown in Fig. 17.

[0077] Thus, in the first embodiment, in the tip shape confirmation step 1005, the estimation section 101 of the control unit 100 confirms the shape of the tip of the cutting edge of the first blade 21-1 based on the image 300 of the cutting mark 220 captured by the imaging unit 30.

[0078] Next, the above-mentioned formula 1 will be described. As shown in Fig. 10, the imaging unit 30 images one end 221 of the cutting mark 220 from above perpendicular to the surface 203 of the base substrate 202 in the peripheral excess region 205 of the package substrate 200. In Fig. 18, if the center of the first blade 21-1 when the one end 221 of the cutting mark 220 is formed is A, the point extending from the center A in the Z-axis direction and intersecting with the surface 203 of the package substrate 200 is B, and the one end 221 of the cutting mark 220 is C0, the length of side BC0 of triangle ABC0 can be expressed by the following formula 2.

[0079]

number

[0080] In Figure 18, if the end away from one end 221 of the cutting mark 220 of the divided image 302 is C1 and the radial depth of the cutting mark 220 of the first blade 21-1 at the end C1 away from one end 221 of the cutting mark 220 of the divided image 302 is α1 (indicated as α in equation 3), the length of side BC1 of triangle ABC1 can be expressed by the following equation 3.

[0081]

number

[0082] 18, the estimation unit 101 of the control unit 100 can obtain Equation 1 from Equation 2 and Equation 3 when the longitudinal length of the cutting mark 220 in the divided image 302 is L1 (indicated as L in Equation 1). Since the estimation unit 101 of the control unit 100 sets the value α1, which is the depth of the cutting mark 220, to 1 μm and the radius R of the first blade 21-1 and the cutting depth d of the cutting mark 220 are predetermined, the estimation unit 101 of the control unit 100 can obtain the longitudinal length L1 of the cutting mark 220 in the divided image 302.

[0083] The estimation unit 101 of the control unit 100 can obtain the longitudinal length L2 of the cutting mark 220 of the divided image 303 by setting the value α2 to 1 μm and R to R-α1 in Equation 1, and can obtain the longitudinal length L3 of the cutting mark 220 of the divided image 304 by setting the value α3 to 1 μm and R to R-(α1+α2). The estimation unit 101 of the control unit 100 can similarly obtain the lengths L1, L2, L3,..., LN of all divided images 302, 303, 304,..., 30N. By reducing lengths L1, L2, L3, ···, LN of divided images 302, 303, 304, ···, 30N of image 300 to values ​​α1, α2, α3, ···, αN, the length of each divided image 302, 303, 304, ···, 30N is reduced so that the length of the cutting mark 220 of each divided image 302, 303, 304, ···, 30N becomes the length when viewed from the tangent direction 29 of the tip of the cutting edge of the first blade 21-1.

[0084] The estimation section 101 of the control unit 100 reduces the length of the image 300 by combining the reduced divided images 302, 303, 304, ..., 30N so that the length of the cutting mark 220 in the image 300 becomes the length as viewed from the tangent direction 29 of the tip of the cutting edge of the cutting blade 21 at one end 221 of the cutting mark 220. Therefore, the image 400 approximating the outer peripheral shape of the cutting blade 21 will approximate an image obtained by imaging the one end 221 of the cutting mark 220 from the imaging unit 30 (indicated by a dotted line in FIG. 18) arranged on the tangent direction 29 of the cutting blade 21 at one end 221 of the cutting mark 220.

[0085] In tip shape confirmation step 1005, the calculation unit 102 of the control unit 100 calculates the cutting depth 26-1 at which the depth 215 of the notch 214 becomes the aforementioned specified depth 219, based on the tip shape of the cutting edge of the first blade 21-1 estimated by the estimation unit 101 and the blade thickness 25-2 of the second blade 21-2. Specifically, since the shape of the inner surface of the first cutting groove 216 is equivalent to the shape of the tip of the cutting blade of the first blade 21-1, and the shape of the inner surface of the second cutting groove 218 is equivalent to the shape of the tip of the cutting blade of the second blade 21-2, for example, the calculation unit 102 of the control unit 100 determines the intersection 222 between the first cutting groove 216 and the second cutting groove 218 based on the tip shape of the cutting blade of the first blade 21-1 and the blade thickness 25-2 of the second blade 21-2 estimated by the estimation unit 101, and calculates the cutting depth 26-1 of the first blade 21-1 when this intersection 222 is located at a predetermined depth 219.

[0086] In tip shape confirmation step 1005, calculation section 102 of control unit 100 stores calculated cutting depth 26-1 in the storage device as a new machining condition. In tip shape confirmation step 1005, cutting depth 26-1 calculated by calculation section 102 of control unit 100 is greater than predetermined depth 219 of depth 215 of notch 214. In tip shape confirmation step 1005, calculation section 102 of control unit 100 stores calculated cutting depth 26-1 in the storage device as a new machining condition, and then proceeds to step 1006.

[0087] The machining control section 103 of the control unit 100 determines whether it is a predetermined timing to perform flat dressing on the tip of the cutting edge of the first blade 21-1 (step 1006). The machining control section 103 of the control unit 100 determines whether the cutting depth 26-1 calculated by the calculation section 102 in the tip shape confirmation step 1005 is equal to or greater than a value corresponding to the thickness of the electrode 209. The value corresponding to the thickness of the electrode 209 is a value at which the metal constituting the electrode 209 remains in the uncut portion 217 below the first cutting groove 216 formed by cutting the electrode 209, and may be, for example, the thickness of the electrode 209 or a value slightly smaller than the thickness of the electrode 209.

[0088] When the processing control section 103 of the control unit 100 determines in the tip shape confirmation step 1005 that the cutting depth 26-1 calculated by the calculation section 102 is less than a value corresponding to the thickness of the electrode 209, it determines that it is not the predetermined timing to perform flat dressing on the tip of the cutting edge of the first blade 21-1 (step 1006: No) and returns to the half-cut step 1002. When the processing control section 103 of the control unit 100 determines in the tip shape confirmation step 1005 that the cutting depth 26-1 calculated by the calculation section 102 is equal to or greater than a value corresponding to the thickness of the electrode 209, it determines that it is the predetermined timing to perform flat dressing on the tip of the cutting edge of the first blade 21-1 (step 1006: Yes) and proceeds to the flattening step 1007.

[0089] (flattening step) The flattening step 1007 is a step for correcting the shape of the tip of the cutting edge of the first blade 21-1 at a predetermined timing and flattening it. In the first embodiment, in the flattening step 1007, the machining control section 103 of the control unit 100 of the cutting device 1 controls the moving unit 40 and the like to position the tip of the cutting edge of the rotating first blade 21-1 at a position aligned in the Y-axis direction with the dress board 250 held on the sub-chuck table 15 and below the upper surface of the dress board 250.

[0090] In the first embodiment, in the flattening step 1007, the machining control unit 103 of the control unit 100 of the cutting device 1 controls the moving unit 40, etc. to move the first cutting unit 20-1 along the Y-axis direction in a direction approaching the dress board 250, and causes the tip of the cutting blade of the rotating first blade 21-1 to cut into the upper surface of the dress board 250. In the first embodiment, in the flattening step 1007, the machining control unit 103 of the control unit 100 of the cutting device 1 controls the moving unit 40, etc. to move the first cutting unit 20-1 along the Y-axis direction while causing the tip of the cutting blade of the rotating first blade 21-1 to cut into the upper surface of the dress board 250, thereby performing flat dressing to flatten the tip of the cutting blade of the first blade 21-1 along the axial direction. In embodiment 1, in the flattening step 1007, the cutting device 1 performs flat dressing on the first blade 21-1 by controlling the processing control unit 103 of the control unit 100 to control the moving unit 40, etc. to move the first cutting unit 20-1 along the Y-axis direction a predetermined number of times.

[0091] In the first embodiment, in the flattening step 1007, the cutting device 1 performs flat dressing on the first blade 21-1 and then returns to the tip shape confirmation step 1005. Note that in the first embodiment, the cutting device 1 returns to the tip shape confirmation step 1005 after the flattening step 1007, but in the present invention, the cutting device 1 may return to the half-cut step 1002 after the flattening step 1007.

[0092] In the half-cut step 1002 after returning from step 1004 or step 1006, the cutting device 1 controls each component with the process control section 103 of the control unit 100 to relatively move the table 10 and the first blade 21-1 of the cutting unit 20-1 along the X-axis direction, the Y-axis direction, etc., while cutting the cutting edge of the first blade 21-1 into the center of one of the planned division lines 206 in the width direction by the cutting depth 26-1 calculated by the calculation section 102 in the tip shape confirmation step 1005. In the half-cut step 1002, the cutting device 1 cuts the planned division lines 206 of the package substrate 200 with the first blade 21-1 to form a first cut groove 216 in the planned division line 206 and also form an uncut portion 217 below the first cut groove 216. In this way, in the half-cut step 1002 after returning from step 1004 or step 1006, the cutting device 1 cuts the first blade 21-1 into the package substrate 200 at a cutting depth 26-1 such that the depth 215 of the notch 214 is a predetermined depth 219, calculated based on the shape of the tip of the cutting edge of the first blade 21-1 confirmed in tip shape confirmation step 1005 and the blade thickness 25-2 of the second blade 21-2.

[0093] When the processing control unit 103 of the control unit 100 determines that the package substrate 200 has been divided into individual package chips 201 by forming first cutting grooves 216 on all of the planned division lines 206 of the package substrate 200 in the half-cut step 1002 and cutting the remaining cut portions 217 below the first cutting grooves 216 in the full-cut step 1003 (step 1004: Yes), the cutting device 1 ends the processing operation, i.e., the processing method.

[0094] As described above, the processing method and cutting device 1 according to the first embodiment confirm the shape of the tip of the cutting blade of the first blade 21-1 in the tip shape confirmation step 1005, and set the cutting depth 26-1 of the first blade 21-1 so that the depth 215 of the notch 214 formed by the shape of the tip of the cutting blade of the first blade 21-1 and the blade thickness 25-2 of the second blade 21-2 becomes the predetermined depth 219. For this reason, the processing method and cutting device 1 according to the first embodiment can suppress an error from the predetermined depth 219 of the depth 215 of the notch 214 of the packaged chip 201. As a result, the processing method and cutting device 1 according to the first embodiment have an effect of suppressing a decrease in the reliability of the inspection of the packaged chip 201 and a connection failure.

[0095] As a result, the processing method and cutting device 1 according to the first embodiment perform flat dressing on the first blade 21-1 at a predetermined timing in the flattening step 1007 to correct the shape of the tip of the cutting blade of the first blade 21-1 to be flat, so that the notch 214 of the predetermined depth 219 can be stably formed. In general, flat dressing for correcting the shape of the tip of the cutting blade of the cutting blade takes time (it is not important that the side of the notch is vertical) and reduces productivity. However, the processing method and cutting device 1 according to the first embodiment change the cutting depth 26-1 based on the shape of the tip of the cutting blade of the first blade 21-1 to form the notch 214 of the predetermined depth 219, so that the implementation of flat dressing can be suppressed and a decrease in productivity can be suppressed.

[0096] [Modifications] A processing method and cutting device 1 according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. Fig. 20 is a side view, partially in cross section, showing a state in which the cutting edge of the first blade is cut into the peripheral excess area of ​​the base substrate of the package substrate in the tip shape confirmation step of the processing method according to the modified example of the first embodiment. Fig. 21 is a plan view of the peripheral excess area of ​​the base substrate of the package substrate on which cutting marks are formed in the tip shape confirmation step of the processing method according to the modified example of the first embodiment. In Figs. 20 and 21, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0097] The processing method and cutting device 1 according to the modified example of the first embodiment are the same as those of the first embodiment, except that the method of forming the cutting mark 220-1 in the tip shape confirmation step 1005 is different. In the tip confirmation step of the processing method according to the modified example, the cutting device 1 cuts the first blade 21-1 into the division planned line 206 of the package substrate 200 in the same manner as in the half cut step 1002, and raises the first blade 21-1 in the outer circumferential excess area 205, as shown in FIG. 20, to form the cutting mark 220-1 shown in FIG. 21 by a so-called chopper cut traverse. The cutting mark 220-1 formed in the modified example is formed extending along the X-axis direction from the outer edge of the base substrate 202 in the outer circumferential excess area 205 of the package substrate 200, and the tip 221 is formed in the same shape as in the first embodiment. In the tip confirmation step of the processing method according to the modified example, the cutting device 1 images the area including the tip 221 of the cutting mark 220-1 with the imaging unit 30, confirms the shape in the same manner as in the first embodiment, and calculates the cutting depth 26-1.

[0098] The processing method and cutting apparatus 1 of the modified example check the shape of the tip of the cutting edge of the first blade 21-1 and set the cutting depth 26-1 of the first blade 21-1 so that the depth 215 of the cutout portion 214 becomes a predetermined depth 219, thereby achieving the effect of suppressing a decrease in the reliability of inspection of the packaged chip 201 and poor connections, similar to embodiment 1.

[0099] The present invention is not limited to the above-mentioned embodiment 1. That is, various modifications can be made without departing from the gist of the present invention. In the present invention, the processing method and cutting device 1 may hold the silicon piece or dress board 250, which is the cutting object, on the sub-chuck table 15, and cut the first blade 21-1 into the silicon piece or dress board 250 in the tip shape confirmation step 1005 to form the cutting marks 220, 220-1. In addition, in the present invention, not only the cutting depth 26-1 is corrected during continuous processing, but also the tip shape confirmation step 1005 may be performed before the half-cut step 1002 is performed after the first blade 21-1 is replaced and dressed. In this case, the cutting depth 26-1 in the half-cut step 1002 may be adjusted based on the confirmed shape of the tip of the cutting blade of the first blade 21-1. [Explanation of symbols]

[0100] 1 Cutting equipment 10 Tables 20-1 First cutting unit 20-2 Second cutting unit 21-1 First Blade 21-2 2nd Blade 25-2 Blade thickness 26,26-1 Cutting depth 30 Imaging unit 100 Control Unit 101 Estimation part 102 Calculation section 200 Package Substrate 201 Package Chip (Chip) 203 Surface (Top surface) 205 Surplus area around the periphery (object to be cut) 206 Division Line 213 Side 214 Notch 215 Depth 216 1st cutting groove 217 Remaining part 219 Prescribed depth 220,220-1 Cutting marks 1002 Half Cut Step 1003 Full Cut Step 1005 Tip shape confirmation step 1007 Flattening Step

Claims

1. A processing method for forming a chip having a stepped cutout on a side surface by half-cutting a package substrate having a plurality of intersecting division lines with a first blade and then fully cutting the package substrate with a second blade having a thinner blade thickness than the first blade, comprising: a half-cutting step of cutting the package substrate with the first blade along the division line to form a first cut groove and to form an uncut portion below the first cut groove; a full-cut step of cutting the remaining portion along the first cutting groove with the second blade, the second blade being thinner than the first blade, after the half-cut step is performed; and a tip shape confirmation step of confirming a tip shape of the first blade, In the half-cut step, the first blade is cut into the package substrate to a cutting depth that results in a predetermined depth of the notch based on the tip shape of the first blade and the blade thickness of the second blade confirmed in the tip shape confirmation step.

2. 2. The processing method according to claim 1, wherein the tip shape confirmation step comprises forming a cutting mark on the upper surface of the package substrate by the first blade, and confirming the tip shape of the first blade based on the cutting mark.

3. 3. The processing method according to claim 1, further comprising a flattening step of correcting and flattening the tip of the first blade at a predetermined timing.

4. A cutting device for forming a chip having a stepped cutout on a side surface by half-cutting a package substrate having a plurality of intersecting division lines with a first blade and then fully cutting the package substrate with a second blade having a thinner blade thickness than the first blade, a table for holding the package substrate; a first cutting unit having a first blade that cuts the package substrate along the intended division lines to form first cutting grooves and to form an uncut portion below the first cutting grooves; a second cutting unit having a second blade thinner than the first blade for cutting the uncut portion along the first cutting groove; an imaging unit that images a cutting mark formed by cutting the first blade into an object to be cut; A control unit for controlling each of the components, The control unit includes an estimation unit that estimates a tip shape of the first blade based on an image captured by the imaging unit; a calculation unit that calculates a cutting depth of the first blade based on the tip shape of the first blade and the blade thickness of the second blade estimated by the estimation unit, such that the depth of the notch portion becomes a predetermined depth; A cutting device comprising:

Images