Holder, holding method, and processing method

Abstract

To suppress damage of a plate-like workpiece after processing while suppressing deterioration in processing quality of the plate-like workpiece.SOLUTION: A holder 1 that is a holder for holding plate-like workpiece 200 has a hard plate 2 having a size larger than the held plate-like workpiece 200, a sheet 3 which has a size equal to or smaller than the hard plate 2 and larger than the plate-like workpiece 200 and is brought into close contact with the hard plate 2, a sheet adhesive member 5 bonding an outer peripheral edge 31 of the sheet 3 to the hard plate 2, and a curable resin 4 which is arranged on the sheet 3 and is cured by external stimulation temporarily bonding the plate-like workpiece 200 onto the sheet 3.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a holder for holding a plate-shaped workpiece, a holding method, and a method for machining a plate-shaped workpiece held by the holder. [Background technology]

[0002] When grinding or polishing the back surface of a wafer, which is a plate-like workpiece, a protective member is provided on the wafer surface in advance to protect the wafer surface. Surface protective tapes consisting of a base material and an adhesive layer formed on the base material, and hard plates (see, for example, Patent Document 1) are widely used as protective members.

[0003] Surface protection tapes generally have a soft adhesive layer, and when the back surface of the wafer is pressed with a tool during grinding or polishing, the wafer sinks slightly into the tape, which can degrade processing quality.

[0004] Therefore, as shown in Patent Document 1, a wafer may be fixed to a hard plate with an adhesive or the like for processing. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2004-207606 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the hard plate disclosed in Patent Document 1 has a high risk of damaging the processed wafer during peeling, because the wafer is fixed to the hard plate with an adhesive. The hard plate disclosed in Patent Document 1 increases the risk of damaging the processed wafer during peeling, particularly when fixing a large-diameter wafer having an outer diameter of 200 mm or 300 mm.

[0007] The present invention has been made in consideration of such problems, and its object is to provide a holder, a holding method, and a processing method that can suppress a decrease in the processing quality of a plate-shaped workpiece while suppressing damage to the plate-shaped workpiece after processing. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the holder of the present invention is a holder for holding a plate-shaped workpiece whose back surface is to be processed, and comprises: a hard plate having a size larger than the plate-shaped workpiece to be held; a sheet having a size smaller than the hard plate and larger than the plate-shaped workpiece and made of only a non-adhesive base layer that is in close contact with the hard plate; a sheet adhesive member that adheres only the outer peripheral edge of the sheet to the hard plate; and a sheet adhesive member that is disposed on the sheet and adheres the entire surface of the plate-shaped workpiece to the sheet. It is a resin that is liquid before curing and is cured by irradiation with ultraviolet light or heating. and a cured resin.

[0009] The holding method of the present invention is a holding method for holding a plate-shaped workpiece with the holding tool, the plate-shaped workpiece being held on the sheet via the cured resin. The entire surface of Glue Rus Step and A plate-shaped workpiece that bonds the entire surface and a sheet adhering step of, after carrying out the above step, bringing the sheet with the plate-shaped workpiece adhered thereto into close contact with the hard plate and adhering the outer peripheral edge of the sheet to the hard plate.

[0010] The holding method of the present invention is a holding method for holding a plate-shaped workpiece with the holding tool, comprising a sheet contacting step of contacting the sheet with the hard plate, and a step of contacting the plate-shaped workpiece with the sheet via the cured resin after the sheet contacting step is performed. The entire surface of Glue Rus and after performing the sheet contact step, A plate-shaped workpiece that bonds the entire surface and a sheet bonding step of bonding the outer peripheral edge of the sheet to the hard plate before or after carrying out the sheet bonding step.

[0011] In the above-described holding method, in the sheet contacting step, the sheet may be contacted onto the hard plate via a liquid, and the liquid may be removed from between the sheet and the hard plate.

[0012] The processing method of the present invention is a method for processing a plate-shaped workpiece using the above-mentioned holder, and the plate-shaped workpiece is placed on the sheet via the cured resin. Connect a holder mounting step of attaching the sheet to the hard plate and bringing the sheet into close contact with the hard plate so that the outer periphery of the sheet is adhered to the hard plate; a holding step of holding the hard plate with a holding table and exposing the plate-shaped workpiece after the holder mounting step is performed; a processing step of processing the plate-shaped workpiece after the holding step is performed; and a processing step of performing the processing after the processing step is performed. Cutting between the surface of the hard plate and the sheet adhesive member, or cutting the outer periphery of the sheet and the sheet adhesive member, Plate-shaped workpiece Connected a hard plate removing step of removing the hard plate from the attached sheet, and after performing the hard plate removing step, After bending one end of the sheet, the one end is moved along the surface of the plate-shaped workpiece toward the other end of the sheet, and the sheet and the cured resin are peeled off in order from the one end of the sheet toward the other end of the sheet; and a plate-shaped workpiece removing step for removing the plate-shaped workpiece from the sheet. Effect of the Invention

[0013] The present invention has an effect of suppressing a decrease in the processing quality of a plate-shaped workpiece, while suppressing damage to the plate-shaped workpiece after processing. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a holder according to the first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the holder shown in FIG. [Diagram 3] FIG. 3 is a perspective view showing a plate-shaped workpiece held by the holder shown in FIG. [Figure 4] FIG. 4 is an exaggerated cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6]FIG. 6 is a cross-sectional view of a modification of the holder shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view of another variation of the holder shown in FIG. [Figure 8] FIG. 8 is a flowchart showing the flow of the holding method according to the first embodiment. [Figure 9] FIG. 9 is a cross-sectional view of a state in which a plate-shaped workpiece is opposed to the cured resin disposed on a sheet in the temporary bonding step of the holding method shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view of the state in which the cured resin shown in FIG. 9 has adhered the plate-shaped workpiece to the sheet. [Figure 11] FIG. 11 is a perspective view of a state in which a sheet having a plate-like workpiece adhered to its surface is placed opposite a hard plate in the sheet adhering step of the holding method shown in FIG. [Figure 12] FIG. 12 is a perspective view of a state in which a sheet is placed on the surface of the hard plate shown in FIG. 11 and a sheet adhesive material is applied to the outer peripheral edge of the sheet and the surface of the hard plate. [Figure 13] FIG. 13 is a cross-sectional view of the state in which a sheet is bonded to the hard plate shown in FIG. 12 and a plate-shaped workpiece is held by a holder. [Figure 14] FIG. 14 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 15] FIG. 15 is a cross-sectional view showing a holding step of the processing method shown in FIG. [Figure 16] 16A to 16C are cross-sectional views showing processing steps of the processing method shown in FIG. [Figure 17] FIG. 17 is a cross-sectional view of a state in which a cutter is inserted between the surface of the hard plate and the sheet adhesive member in the hard-plate removing step of the processing method shown in FIG. [Figure 18] FIG. 18 is a cross-sectional view of the seat shown in FIG. 17 with the hard plate removed. [Figure 19] FIG. 19 is a cross-sectional view of a variation of the hard plate removal step of the processing method shown in FIG. [Figure 20] FIG. 20 is a cross-sectional view showing a plate-shaped workpiece removing step in the processing method shown in FIG. [Figure 21] FIG. 21 is a flowchart showing the flow of the holding method according to the second embodiment. [Figure 22] FIG. 22 is a cross-sectional view of a state in which liquid has been supplied onto the surface of the hard plate in the sheet contacting step of the holding method shown in FIG. [Diagram 23] FIG. 23 is a cross-sectional view of the hard plate shown in FIG. 22 with a sheet attached to the surface thereof. [Figure 24] FIG. 24 is a cross-sectional view showing the sheet bonding step of the retention method shown in FIG. [Diagram 25] FIG. 25 is a cross-sectional view of a state in which a plate-shaped workpiece is opposed to the cured resin disposed on a sheet in the temporary bonding step of the holding method shown in FIG. [Figure 26] FIG. 26 is a cross-sectional view of the state in which the hardened resin shown in FIG. 25 has adhered a plate-shaped workpiece to the sheet. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0016] [Embodiment 1] A holder according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the holder according to the first embodiment. FIG. 2 is an exploded perspective view of the holder shown in FIG. 1. FIG. 3 is a perspective view showing a plate-shaped workpiece held by the holder shown in FIG. 1. FIG. 4 is an exaggerated cross-sectional view taken along line IV-IV in FIG. 2. FIG. 5 is a cross-sectional view taken along line VV in FIG. 1. FIG. 6 is a cross-sectional view of a modified version of the holder shown in FIG. 5. FIG. 7 is a cross-sectional view of another modified version of the holder shown in FIG. 5.

[0017] (Plate-shaped workpiece) The holder 1 shown in FIG. 1 and FIG. 2 according to the first embodiment holds the plate-shaped workpiece 200 shown in FIG. 3. The plate-shaped workpiece 200 held by the holder 1 according to the first embodiment is a so-called GaN wafer made of gallium nitride and having a disk-shaped substrate. In the first embodiment, the plate-shaped workpiece 200 is a GaN wafer, but in the present invention, it is not limited to a GaN wafer, and is preferably a disk-shaped semiconductor wafer whose substrate is made of a hard material, such as a wafer whose substrate is made of sapphire, a SiC wafer whose substrate is made of SiC (silicon carbide), or an InP wafer whose substrate is made of InP (indium phosphide), an optical device wafer, or the like. In the present invention, the plate-shaped workpiece 200 may also be a wafer whose substrate is made of silicon, a compound semiconductor, LT (lithium tantalate), or LN (lithium niobate).

[0018] In addition, in embodiment 1, the plate-shaped workpiece 200 does not have any devices formed on the substrate surface 201, such as integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integration), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), or MEMS (Micro Electro Mechanical Systems), but in the present invention, devices may be formed on the substrate surface 201.

[0019] (Holding tool) 1 and 2, the holder 1 includes a hard plate 2, a sheet 3, a cured resin 4 (shown in FIG. 2), and a sheet adhesive member 5. The hard plate 2 is larger in size than the plate-shaped workpiece to be held.

[0020] In the first embodiment, the hard plate 2 is formed in a disk shape with an outer diameter larger than the outer diameter of the plate-shaped workpiece 200 and a thickness larger than the thickness of the plate-shaped workpiece 200. In the first embodiment, the hard plate 2 is made of glass, which is a hard material having translucency, but in the present invention, it is not limited to glass and may be made of ceramics or metal.

[0021] In the first embodiment, the surface 21 of the hard plate 2 is formed as a curved surface in which the thickness is thinnest at the center and gradually thickens toward the outer edge, and no ridge line is formed, as shown in FIG. 4. That is, the surface 21 of the hard plate 2 is formed as a concave curved surface from the surface 21. When the outer diameter of the hard plate 2 is 4 inches (about 100 mm), the difference between the thickness of the center of the hard plate 2 and the thickness of the outer edge of the hard plate 2 is 2 μm or more and 3 μm or less. The curved surface of the surface 21 of the hard plate 2 is a gentle curved surface that is difficult to confirm with the naked eye. FIG. 4 shows the curvature of the curved surface of the surface 21 of the hard plate 2 in an exaggerated manner, and the curved surface of the surface 21 of the hard plate 2 is omitted in other figures. In the first embodiment, the surface 21 of the hard plate 2 is formed as a concave curved surface as described above, but in the present invention, the surface 21 of the hard plate 2 may be formed flat and the thickness of the hard plate 2 may be constant.

[0022] The curved surface of the surface 21 of the hard plate 2 is formed by holding the rear surface 22 behind the surface 21 of the hard plate 2 on the chuck table of a polishing device, and polishing the surface 21 of the hard plate 2 rotated together with the chuck table about its axis with a polishing pad that is also rotated about its axis. Specifically, the polishing pad abuts on approximately half of the surface 21 of the hard plate 2 when viewed from the side, the axis of the chuck table and the axis of the polishing pad are disposed with a gap between them, and the inclination of the axis of the chuck table relative to the vertical direction is adjusted, thereby forming the curved surface of the surface 21 of the hard plate 2.

[0023] The sheet 3 has a size equal to or smaller than the hard plate 2 and larger than the plate-shaped workpiece 200, and is in close contact with the surface 21 of the hard plate 2. The sheet 3 is formed in a disk shape having an outer diameter equal to or smaller than the outer diameter of the hard plate 2 and larger than the outer diameter of the plate-shaped workpiece 200, and a thickness smaller than that of the hard plate 2, and the thickness is constant. The sheet 3 does not include an adhesive layer and is composed only of a non-adhesive base layer. In the first embodiment, the base layer of the sheet 3 is composed of a flexible resin such as PET (polyethylene terephthalate) or PO (polyolefin). In the present invention, the base layer of the sheet 3 may be composed of the same material as the cured resin 4, and may be composed of a deformable material.

[0024] The curable resin 4 is disposed on the sheet 3 and temporarily adheres the plate-shaped workpiece 200 to the sheet 3. The curable resin 4 is a liquid resin that is hardened by an external stimulus. The curable resin 4 is disposed between the sheet 3 and the plate-shaped workpiece 200 in a liquid state, hardens when an external stimulus is applied, and adheres and fixes the plate-shaped workpiece 200 to the sheet 3. In the first embodiment, the curable resin 4 is hardened by irradiation with ultraviolet light 108 (shown in FIG. 10) as an external stimulus, but in the present invention, the hardening resin 4 may be hardened by application of another external stimulus, such as heating, without being limited to irradiation with ultraviolet light 108.

[0025] As shown in FIG. 5, the sheet adhesive member 5 adheres the outer peripheral edge 31 of the sheet 3 to the surface 21 of the hard plate 2. The outer peripheral edge 31 refers to the portion of the sheet 3 that is closer to the outer peripheral edge of the plate-shaped workpiece 200 when the plate-shaped workpiece 200 is adhered and fixed to the sheet 3 by the cured resin 4. The sheet adhesive member 5 is an adhesive that is applied in a liquid state over the entire circumference of the sheet 3, including the outer peripheral edge 31 of the sheet 3 and the surface 21 of the hard plate 2, and is cured to adhere and fix the outer peripheral edge 31 of the sheet 3 to the surface 21 of the hard plate 2. The sheet adhesive member 5 may be made of the same material as the cured resin 4. In this case, the sheet adhesive member 5 is applied over the entire circumference of the sheet 3, including the outer peripheral edge 31 of the sheet 3 and the surface 21 of the hard plate 2, and is then applied and cured by applying an external stimulus.

[0026] In the present invention, the sheet adhesive member 5 is not limited to the adhesive described above, and may be, for example, an adhesive tape 5-1 shown in Fig. 6 or a double-sided tape 5-2 shown in Fig. 7. The adhesive tape 5-1 shown in Fig. 6 includes a base layer made of a non-adhesive resin and an adhesive layer made of an adhesive resin laminated on one surface of the base layer, and the adhesive layer is attached across the outer periphery 31 of the sheet 3 and the surface 21 of the hard plate 2 to adhere and fix the outer periphery 31 of the sheet 3 to the surface 21 of the hard plate 2.

[0027] The double-sided tape 5-2 shown in Figure 7 comprises a base layer made of a non-adhesive resin and adhesive layers made of an adhesive resin laminated on both surfaces of the base layer, and is inserted between the outer peripheral edge 31 of the sheet 3 and the surface 21 of the hard plate 2, with one adhesive layer adhering to the outer peripheral edge 31 of the sheet 3 and the other adhesive layer adhering to the surface 21 of the hard plate 2, thereby adhering and fixing the outer peripheral edge 31 of the sheet 3 to the surface 21 of the hard plate 2.

[0028] The holder 1 having the above-described configuration adheres the plate-shaped workpiece 200 onto the sheet 3 with the hardened resin 4, and holds the plate-shaped workpiece 200.

[0029] (Holding method) Next, a holding method according to the first embodiment will be described with reference to the drawings. Fig. 8 is a flow chart showing the flow of the holding method according to the first embodiment. The holding method according to the first embodiment is a method for holding a plate-shaped workpiece 200 with the holder 1 having the above-mentioned configuration. As shown in Fig. 8, the holding method according to the first embodiment includes a temporary bonding step 1001 and a sheet bonding step 1002.

[0030] (Temporary adhesion step) Fig. 9 is a cross-sectional view of a state in which a plate-shaped workpiece is opposed to the cured resin arranged on a sheet in the temporary adhesion step of the holding method shown in Fig. 8. Fig. 10 is a cross-sectional view of a state in which the cured resin shown in Fig. 9 has adhered the plate-shaped workpiece to the sheet. The temporary adhesion step 1001 is a step in which the plate-shaped workpiece 200 is temporarily adhered onto the sheet 3 via the cured resin 4.

[0031] 9, in the temporary bonding step 1001, a sheet 3 is placed on a flat support surface 102 parallel to the horizontal direction of a support stand 101 made of a light-transmitting material such as glass of a temporary bonding device 100, and a cured resin 4 before curing is supplied onto the sheet 3. In the first embodiment, the cured resin 4 is supplied onto the center of the sheet 3. In the temporary bonding step 1001, the temporary bonding device 100 opens an on-off valve 103, and sucks and holds a back surface 202 behind a front surface 201 of a plate-shaped workpiece 200 on a flat holding surface 106 parallel to the horizontal direction of a holding member 105 by a suction source 104, so that the front surface 201 of the plate-shaped workpiece 200 faces the cured resin 4 on the sheet 3.

[0032] 10, in the temporary bonding step 1001, the temporary bonding device 100 brings the plate-shaped workpiece 200, which is suction-held on the holding surface 106 of the holding member 105, close to the sheet 3, and presses the plate-shaped workpiece 200 against the cured resin 4 on the sheet. Then, the plate-shaped workpiece 200, which is suction-held on the holding member 105, comes into contact with the cured resin 4 on the sheet 3, and as the plate-shaped workpiece 200 moves, the cured resin 4 on the sheet 3 is pushed out toward the outer periphery of the sheet 3. Then, in the temporary bonding step 1001, when the cured resin 4 is brought close to the sheet 3 to a position where the thickness of the cured resin 4 becomes a predetermined thickness, the cured resin 4 covers the entire surface 201 of the plate-shaped workpiece 200.

[0033] In the first embodiment, in the temporary bonding step 1001, the temporary bonding device 100 turns on the ultraviolet lamp 107 and irradiates the curable resin 4 with ultraviolet light 108 through the support stand 101 to harden the curable resin 4, thereby bonding and fixing the front surface 201 side of the plate-shaped workpiece 200 to the sheet 3. In the first embodiment, the plate-shaped workpiece 200 is placed in a position coaxial with the sheet 3.

[0034] (Sheet adhesion step) Fig. 11 is a perspective view of a state in which a sheet having a plate-shaped workpiece adhered to its surface is placed facing a hard plate in the sheet adhering step of the holding method shown in Fig. 8. Fig. 12 is a perspective view of a state in which a sheet is placed on the surface of the hard plate shown in Fig. 11 and a sheet adhesive material is applied to the outer periphery of the sheet and the surface of the hard plate. Fig. 13 is a cross-sectional view of a state in which a sheet is adhered to the hard plate shown in Fig. 12 and a plate-shaped workpiece is held by a holder.

[0035] In the sheet bonding step 1002, after the temporary bonding step 1001 is performed, the sheet 3 to which the plate-shaped workpiece 200 is temporarily bonded is brought into close contact with the hard plate 2, and the outer periphery 31 of the sheet 3 is bonded to the hard plate 2. In the sheet bonding step 1002, as shown in FIG. 11, the sheet 3 to which the plate-shaped workpiece 200 is bonded and fixed is placed facing the surface 21 of the hard plate 2, and then the sheet 3 is placed on the surface 21 of the hard plate 2. In the sheet bonding step 1002, the plate-shaped workpiece 200 is pressed against the hard plate 2 to push out the air from between the sheet 3 and the hard plate 2, and the sheet 3 to which the plate-shaped workpiece 200 is temporarily bonded is brought into close contact with the hard plate 2. In the first embodiment, since the surface 21 of the hard plate 2 is formed into the concave curved surface described above, after the air between the sheet 3 and the hard plate 2 is pushed out and the sheet 3 adheres to the hard plate 2, the sheet 3 tries to return to a flat state, so that the air pressure between the sheet 3 and the surface 21 of the hard plate 2 becomes very low, and the sheet 3 adheres to the surface 21 of the hard plate 2 due to the difference with the surrounding air pressure, and the plate-shaped workpiece 200 is pressed against the hard plate 2 via the sheet 3. In the first embodiment, the sheet 3 and the plate-shaped workpiece 200 are arranged in a position coaxial with the hard plate 2.

[0036] In the sheet bonding step 1002, as shown in Fig. 12, a sheet adhesive material 5 is applied from a nozzle 109 to the outer peripheral edge 31 of the sheet 3 and the surface 21 of the hard plate 2. In the sheet bonding step 1002, after the sheet adhesive material 5 is applied to the outer peripheral edge 31 of the sheet 3 and the surface 21 of the hard plate 2 over the entire circumference, the sheet adhesive material 5 is cured to bond the outer peripheral edge 31 of the sheet 3 to the surface 21 of the hard plate 2. In this way, in the holding method according to the first embodiment, the interface between the sheet 3 and the hard plate 2 is sealed over the entire circumference, and the plate-shaped workpiece 200 is held by the holder 1, as shown in Fig. 13.

[0037] (Processing method) Next, the processing method according to the first embodiment will be described with reference to the drawings. Fig. 14 is a flow chart showing the flow of the processing method according to the first embodiment. The processing method according to the first embodiment is a method for processing a plate-shaped workpiece 200 using the holder 1 having the above-mentioned configuration. As shown in Fig. 14, the processing method according to the first embodiment includes a holder mounting step 2001, a holding step 2002, a processing step 2003, a hard plate removing step 2004, and a plate-shaped workpiece removing step 2005.

[0038] (Holder attachment step) The holder mounting step 2001 is a step of temporarily bonding the plate-shaped workpiece 200 onto the sheet 3 via the cured resin 4 and also of closely contacting the sheet 3 with the hard plate 2, so that the outer peripheral edge 31 of the sheet 3 is bonded to the hard plate 2. In the first embodiment, the holder mounting step 2001 is the above-mentioned holding method.

[0039] (holding step) Fig. 15 is a cross-sectional view showing the holding step of the processing method shown in Fig. 14. In the holding step 2002, after the holder attachment step 2001 is performed, the hard plate 2 is held by the holding table 111 of the processing device 110, and the plate-shaped workpiece 200 is exposed. In the holding step 2002, as shown in Fig. 15, the back surface 22 side of the hard plate 2 is placed on the holding surface 112 of the holding table 111 of the processing device 110, and the opening / closing valve 113 is opened to suck and hold the hard plate 2 on the holding surface 112 by the suction source 114.

[0040] In the first embodiment, the processing device 110 is a grinding device that performs grinding processing, which is processing, on the plate-shaped workpiece 200. In the present invention, the processing device 110 is not limited to a grinding device, and may be a polishing device that performs polishing processing such as chemical mechanical polishing or dry polishing processing, which is processing, on the plate-shaped workpiece 200, a plasma etching device that performs plasma etching processing, or a laser processing device that performs laser processing.

[0041] (Processing steps) Fig. 16 is a cross-sectional view showing the processing steps of the processing method shown in Fig. 14. Processing step 2003 is a step of processing the plate-shaped workpiece 200 after the holding step 2002 is performed. In the first embodiment, in processing step 2003, the plate-shaped workpiece 200 is subjected to a grinding process, which is a processing method, but the present invention is not limited to the grinding process, and the plate-shaped workpiece 200 may be subjected to a polishing process such as a chemical mechanical polishing process or a dry polishing process, a plasma etching process, or a laser process.

[0042] In the first embodiment, in the processing step 2003, as shown in Fig. 16, the processing device 110 rotates the holding table 111 about its axis while rotating the grinding wheel 116 of the grinding unit 115 about its axis, and brings the grinding stone 117 of the grinding wheel 116 into contact with the back surface 202 of the plate-shaped workpiece 200 to grind the back surface 202. In the processing step 2003, the processing device 110 grinds and thins the plate-shaped workpiece 200 until it has a predetermined thickness. Note that in the first embodiment, in the processing step 2003, the processing device 110 supplies grinding water from a nozzle (not shown) to a processing region where the grinding stone 117 and the plate-shaped workpiece 200 come into contact with each other during grinding. In the holder 1 of embodiment 1, the outer peripheral edge 31 of the sheet 3 is adhered to the hard plate 2 with a sheet adhesive member 5, and the interface between the sheet 3 and the hard plate 2 is sealed around the entire circumference, thereby preventing liquid (grinding water) from penetrating the interface between the sheet 3 and the hard plate 2 during processing and causing the sheet 3 to peel off.

[0043] (Hard plate removal steps) Fig. 17 is a cross-sectional view of a state where a cutter 120 is inserted between the surface of the hard plate and the sheet adhesive member in the hard plate removing step of the processing method shown in Fig. 14. Fig. 18 is a cross-sectional view of a state where the hard plate has been removed from the sheet shown in Fig. 17. Fig. 19 is a cross-sectional view of a modified example of the hard plate removing step of the processing method shown in Fig. 14.

[0044] In the hard plate removing step 2004, after the processing step 2003 is performed, the hard plate 2 is removed from the sheet 3 to which the plate-shaped workpiece 200 is temporarily attached. In the hard plate removing step 2004 in the first embodiment, as shown in FIG. 17, the cutter 120 is inserted from the outer periphery of the sheet 3 between the surface 21 of the hard plate 2 and the sheet adhesive member 5 and the sheet 3. In the hard plate removing step 2004 in the first embodiment, the cutter 120 and the sheet 3 are moved relatively in the circumferential direction of the sheet 3 at least once to cut between the surface 21 of the hard plate 2 and the sheet adhesive member 5 over the entire circumference. In the hard plate removing step 2004, as shown in FIG. 18, the sheet 3 to which the plate-shaped workpiece 200 is attached and fixed is removed from the surface 21 of the hard plate 2. In the first embodiment, the sheet adhesive member 5 remains over the entire circumference of the outer periphery 31 of the sheet 3.

[0045] In the present invention, in the hard plate removal step 2004, as shown in FIG. 19, the cutter 120 may be caused to cut into the sheet adhesive member 5 and the outer peripheral edge of the sheet 3 from the plate-shaped workpiece 200 side until it reaches the hard plate 2, and the cutter 120 and the sheet 3 may be moved relatively in the circumferential direction of the sheet 3 at least one revolution to cut the outer peripheral edge 31 of the sheet and the sheet adhesive member 5, and remove the sheet 3 from the surface 21 of the hard plate 2.

[0046] (Plate-shaped workpiece removal step) Fig. 20 is a cross-sectional view showing the plate-shaped workpiece removing step of the processing method shown in Fig. 14. The plate-shaped workpiece removing step 2005 is a step of removing the plate-shaped workpiece 200 from the sheet 3 after the hard plate removing step 2004 is performed.

[0047] In the plate-shaped workpiece removing step 2005, the peeling device 130 places the back surface 202 of the plate-shaped workpiece 200 on the holding surface 132 of the holding table 131, opens the on-off valve 133, and sucks the holding surface 132 with the suction source 134 to suck and hold the plate-shaped workpiece 200 on the holding surface 132 of the holding table 131. In the plate-shaped workpiece removing step 2005, as shown in Fig. 20, the peeling device 130 clamps one end of the sheet 3 with the clamping portion 135, moves the clamping portion 135 so as to curve the one end of the sheet 3, and then moves the clamping portion 135 along the front surface 201 of the plate-shaped workpiece 200 toward the other end of the sheet 3, thereby peeling off the sheet 3 and the cured resin 4 in order from one end of the sheet 3 toward the other end.

[0048] In the holder 1 according to the first embodiment described above, the sheet 3, to which the plate-shaped workpiece 200 is adhered by the cured resin 4 cured by irradiation with ultraviolet light 108, is brought into close contact with the hard plate 2, and only the outer periphery 31 of the sheet 3 is fixed to the hard plate 2. For this reason, the holder 1 holds the plate-shaped workpiece 200 by the hard plate 2, the cured cured resin 4, and the sheet 3, which is composed only of a non-adhesive base layer without an adhesive layer, and deformation of the holder 1 itself when the plate-shaped workpiece 200 is processed can be suppressed more than with a surface protection tape having an adhesive layer, etc.

[0049] Furthermore, the holder 1 can detach the outer peripheral edge 31 of the sheet 3 from the hard plate 2 and bend the sheet 3 to remove it from the plate-shaped workpiece 200, thereby reducing the risk of damage to the plate-shaped workpiece 200.

[0050] As a result, the holder 1 has the effect of suppressing a decrease in the processing quality of the plate-shaped workpiece 200 while suppressing damage to the plate-shaped workpiece 200 after processing.

[0051] Moreover, since the surface 21 of the hard plate 2 of the holder 1 is formed into the curved surface described above, the sheet 3 can be brought into close contact with the surface 21 of the hard plate 2 .

[0052] In addition, the holding method and processing method of embodiment 1 hold the plate-shaped workpiece 200 in the above-mentioned holding tool 1, which has the effect of suppressing deterioration in the processing quality of the plate-shaped workpiece 200 while suppressing damage to the plate-shaped workpiece 200 after processing.

[0053] [Embodiment 2] A holding method according to the second embodiment will be described with reference to the drawings. FIG. 21 is a flow chart showing the flow of the holding method according to the second embodiment. In the description of the second embodiment, the same parts as those of the first embodiment in FIG. 22, FIG. 23, FIG. 24, FIG. 25, and FIG. 26 are denoted by the same reference numerals. The holding method according to the second embodiment is a method for holding a plate-shaped workpiece 200 with a holder 1 having the above-mentioned configuration, as in the first embodiment. As shown in FIG. 21, the holding method according to the second embodiment includes a sheet contacting step 1003, a sheet bonding step 1002-2, and a temporary bonding step 1001-2.

[0054] (Sheet adhesion step) Fig. 22 is a cross-sectional view of a state where liquid has been supplied onto the surface of the hard plate in the sheet contacting step of the holding method shown in Fig. 21. Fig. 23 is a cross-sectional view of a state where a sheet is contacted with the surface of the hard plate shown in Fig. 22. The sheet contacting step 1003 is a step of contacting the sheet 3 onto the surface 21 of the hard plate 2.

[0055] 22, in the sheet contact step 1003, a volatile liquid 6 is supplied to the center of the surface 21 of the hard plate 2 in an amount such that the liquid 6 does not drip from the outer edge of the hard plate 2. In the second embodiment, pure water is supplied as the liquid 6. In the sheet contact step 1003, the contact device 140 opens the on-off valve 141 to suck and hold the sheet 3 on a flat holding surface 144 that is parallel to the horizontal direction of the holding member 143 by the suction source 142, and brings the sheet 3 into contact with the liquid 6 on the surface 21 of the hard plate 2.

[0056] In the sheet contact step 1003, the sheet 3 sucked and held on the holding surface 144 of the holding member 143 is brought close to the hard plate 2, and the sheet 3 is pressed against the liquid 6 on the hard plate 2. Then, the sheet 3 sucked and held on the holding member 143 comes into contact with the liquid 6 on the hard plate 2, and as the sheet 3 moves, the liquid 6 on the hard plate 2 is spread toward the outer periphery of the hard plate 2, and as the sheet 3 approaches the surface 21 of the hard plate 2, the liquid 6 is discharged from between the sheet 3 and the surface 21 of the hard plate 2. Furthermore, a small amount of liquid 6 remaining between the sheet 3 and the hard plate 2 evaporates through the sheet 3 after a predetermined time (e.g., 24 hours) has passed since the sheet 3 was brought into contact with the hard plate 2.

[0057] Then, in the sheet contact step 1003, the sheet 3 is contacted with the surface 21 of the hard plate 2 as shown in FIG. 23. In the sheet contact step 1003, the liquid 6 is supplied to the surface 21 of the hard plate 2 before contacting the sheet 3. Therefore, by contacting the sheet 3 with the surface 21 of the hard plate 2, it is possible to prevent air from remaining between the sheet 3 and the hard plate 2. Thus, in the sheet contact step 1003 in the second embodiment, the sheet 3 is contacted with the surface 21 of the hard plate 2 via the liquid 6, and the liquid 6 is removed from between the sheet 3 and the surface 21 of the hard plate 2. In the second embodiment, the sheet 3 is disposed in a position coaxial with the hard plate 2.

[0058] (Sheet adhesion step) Fig. 24 is a cross-sectional view showing a sheet bonding step of the holding method shown in Fig. 21. The sheet bonding step 1002-2 is a step of bonding the outer peripheral edge 31 of the sheet 3 to the hard plate 2 after the sheet adhesion step 1003 is performed and before the temporary bonding step 1001-2 is performed.

[0059] In the sheet bonding step 1002-2, similar to the sheet bonding step 1002 in the holding method according to the embodiment 1, the outer peripheral edge 31 of the sheet 3 is bonded to the hard plate 2 by the sheet bonding member 5. Note that in the embodiment 2, the sheet bonding step 1002-2 is performed after the sheet adhesion step 1003 and before the temporary adhesion step 1001-2, but the present invention is not limited to this, and the sheet bonding step 1002-2 may be performed after the sheet adhesion step 1003 and the temporary adhesion step 1001-2.

[0060] (Temporary adhesion step) Fig. 25 is a cross-sectional view of a state in which a plate-shaped workpiece is opposed to the cured resin arranged on the sheet in the temporary adhesion step of the holding method shown in Fig. 21. Fig. 26 is a cross-sectional view of a state in which the cured resin shown in Fig. 25 has adhered the plate-shaped workpiece to the sheet. The temporary adhesion step 1001 is a step in which the plate-shaped workpiece 200 is temporarily adhered to the sheet 3 via the cured resin 4 after the sheet adhesion step 1003 is performed.

[0061] 25, in the temporary bonding step 1001-2, the hard plate 2 is placed on the support surface 102 of the support stand 101 made of a light-transmitting material such as glass in the temporary bonding device 100, and the cured resin 4 before curing is supplied onto the sheet 3 on the surface 21 of the hard plate 2. In the second embodiment, the cured resin 4 is supplied onto the center of the sheet 3. In the temporary bonding step 1001, the temporary bonding device 100 opens the on-off valve 103 to suck and hold the back surface 202 of the plate-shaped workpiece 200 on the holding surface 106 of the holding member 105 by the suction source 104, and the front surface 201 of the plate-shaped workpiece 200 faces the cured resin 4 on the sheet 3.

[0062] 26, in the temporary bonding step 1001, the temporary bonding device 100 brings the plate-shaped workpiece 200, which is suction-held on the holding surface 106 of the holding member 105, close to the sheet 3, and presses the plate-shaped workpiece 200 against the cured resin 4 on the sheet. Then, the plate-shaped workpiece 200, which is suction-held on the holding member 105, comes into contact with the cured resin 4 on the sheet 3, and as the plate-shaped workpiece 200 moves, the cured resin 4 on the sheet 3 is pushed out toward the outer periphery of the sheet 3. Then, in the temporary bonding step 1001, when the cured resin 4 is brought close to the sheet 3 to a position where the thickness of the cured resin 4 becomes a predetermined thickness, the cured resin 4 covers the entire surface 201 of the plate-shaped workpiece 200.

[0063] 26 , in the temporary bonding step 1001, the temporary bonding device 100 turns on the ultraviolet lamp 107 to irradiate the curable resin 4 with ultraviolet light 108 through the support base 101 and the hard plate 2 to harden the curable resin 4, thereby bonding and fixing the front surface 201 side of the plate-shaped workpiece 200 to the sheet 3. In addition, in the embodiment 2, the plate-shaped workpiece 200 is placed in a position coaxial with the sheet 3. In this way, the holding method according to the embodiment 2 holds the plate-shaped workpiece 200 on the holder 1.

[0064] The holding method of embodiment 2, like embodiment 1, holds the plate-shaped workpiece 200 in a holder 1 of the configuration described above, and thus has the effect of suppressing damage to the plate-shaped workpiece 200 after processing while suppressing deterioration in the processing quality of the plate-shaped workpiece 200.

[0065] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0066] 1 Holder 2 Hard Plate 3 Sheets 4 Cured resin 5 Sheet adhesive material 6 liquid 31 Outer rim 111 Holding table 200 Plate-shaped workpiece 1001,1001-2 Temporary adhesion step 1002,1002-2 Sheet adhesion step 1003 Sheet adhesion step 2001 Holder installation step 2002 Retention Step 2003 Processing Step 2004 Hard plate removal step 2005 Plate-shaped workpiece removal step

Claims

1. A holder for holding a plate-shaped workpiece whose back surface is to be processed, A hard plate having a size larger than the plate-shaped workpiece to be held; a sheet having a size smaller than the hard plate and larger than the plate-like workpiece, the sheet being made of only a non-adhesive base layer that is in close contact with the hard plate; a sheet adhesive member that adheres only the outer peripheral edge of the sheet to the hard plate; a holder comprising a resin that is placed on the sheet and bonds the entire surface of the plate-shaped workpiece to the sheet, the resin being liquid before hardening and hardened by exposure to ultraviolet light or heat; and a hardened resin.

2. A method for holding a plate-shaped workpiece with the holder according to claim 1, comprising the steps of: a step of adhering the entire surface of a plate-shaped workpiece onto the sheet via the cured resin; This holding method includes a sheet bonding step in which, after performing a step of bonding the entire surface of the plate-shaped workpiece, the sheet to which the plate-shaped workpiece is bonded is tightly attached to the hard plate and the outer peripheral edge of the sheet is bonded to the hard plate.

3. A method for holding a plate-shaped workpiece with the holder according to claim 1, comprising the steps of: a sheet contact step of contacting the sheet onto the hard plate; After carrying out the sheet contact step, a step of adhering the entire surface of the plate-shaped workpiece to the sheet via the cured resin; A holding method comprising a sheet bonding step of bonding the outer peripheral edge of the sheet to the hard plate after performing the sheet contact step and before or after performing a step of bonding the entire surface of the plate-shaped workpiece.

4. The holding method according to claim 3 , wherein in the sheet contacting step, the sheet is contacted onto the hard plate via a liquid, and the liquid is removed from between the sheet and the hard plate.

5. A method for processing a plate-shaped workpiece using the holder according to claim 1, comprising the steps of: a holder attachment step of adhering a plate-shaped workpiece onto the sheet via the cured resin and bringing the sheet into close contact with the hard plate so that the outer periphery of the sheet is adhered to the hard plate; a holding step of holding the hard plate on a holding table and exposing a plate-shaped workpiece after the holding tool mounting step is performed; After carrying out the holding step, a processing step of processing the plate-shaped workpiece; After carrying out the processing step, a hard plate removing step is performed in which the hard plate is removed from the sheet to which the plate-shaped workpiece is adhered by cutting between the surface of the hard plate and the sheet adhesive member, or by cutting the outer periphery of the sheet and the sheet adhesive member; and a plate-shaped workpiece removing step, in which, after carrying out the hard plate removing step, one end of the sheet is bent and then the one end is moved along the surface of the plate-shaped workpiece toward the other end of the sheet, thereby peeling the sheet and the cured resin in sequence from one end of the sheet toward the other end, thereby removing the plate-shaped workpiece from the sheet.

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