Electronic Components

The electronic component design with U-shaped external terminals addresses the issue of peeling by reducing stress concentration, thereby ensuring the component's functionality and element characteristics are maintained.

JP7657106B2Active Publication Date: 2025-04-04TDK CORP
View PDF 8 Cites 0 Cited by

Patent Information

Application Number
JP2021104171
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-06-23
Publication Date
2025-04-04
Estimated Expiration
2041-06-23

AI Technical Summary

Technical Problem

In electronic components with external terminals on a mounting surface, peeling of these terminals can lead to deterioration in element characteristics and failure to function.

Method used

The electronic component design features a U-shaped outer shape for the external terminals, which reduces stress concentration at the inner ends, thereby suppressing peeling even under impact.

Benefits of technology

This design effectively prevents peeling of external terminals from the mounting surface, ensuring the electronic component maintains its functionality and element characteristics.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007657106000001
    Figure 0007657106000001
  • Figure 0007657106000002
    Figure 0007657106000002
  • Figure 0007657106000003
    Figure 0007657106000003
Patent Text Reader

Abstract

To provide an electronic component in which peeling of an external terminal is suppressed.SOLUTION: In a coil component 1, each of external terminal electrodes 60A, 60B, 60C, and 60D on the upper surface 10c has a U-shaped outer shape, and therefore, stress concentration is less likely to occur at an inner end portion 60a compared to the external terminal electrode having a corner on the inner end portion. Therefore, even when the coil component 1 is subjected to an impact, for example, external terminal electrodes 60A, 60B, 60C, and 60D are effectively prevented from being separated from the upper surface 10c due to stress concentration.SELECTED DRAWING: Figure 9
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] Conventionally, electronic components having external terminals provided on a mounting surface facing a mounting board are known. Patent Document 1 listed below discloses a four-terminal electronic component having external terminals provided at each of the four corners of the mounting surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-111349 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the case of electronic components as described above, if the external terminals are peeled off from the mounting surface, problems such as deterioration of element characteristics or failure of the element to function may occur.

[0005] The inventors conducted extensive research into the peeling of external terminals and discovered a new technique that can effectively prevent the external terminals from peeling off from the mounting surface.

[0006] An object of the present invention is to provide an electronic component in which peeling of external terminals is suppressed. [Means for solving the problem]

[0007] An electronic component according to one aspect of the present invention comprises a base body having a pair of parallel end faces and a mounting surface connecting the pair of end faces, and a first external terminal covering at least the mounting surface of the surface of the base body and electrically connected to an internal conductor provided within the base body, wherein when viewed from the mounting surface side, the first external terminal extends inward from an edge corresponding to the end faces and has a U-shaped outer shape with a curved inner end.

[0008] In the above electronic component, since the external terminals on the mounting surface have a U-shaped outer shape, stress concentration is unlikely to occur at the inner ends of the external terminals, and therefore, even if the electronic component is subjected to an impact, the external terminals are effectively prevented from peeling off from the mounting surface due to stress concentration.

[0009] In an electronic component according to another aspect of the present invention, the first external terminal continuously covers the mounting surface and the end surface of the element body.

[0010] An electronic component according to another aspect of the present invention comprises a pair of first external terminals extending inward from an edge corresponding to an end face, each of the inner ends of the pair of first external terminals having a first curved portion on a closer side and a second curved portion on a farther side, the curvature of the first curved portion being smaller than the curvature of the second curved portion.

[0011] In another aspect of the electronic component of the present invention, in the outer shape of a pair of first external terminals, the length of a straight line extending from the edge corresponding to the end face to the first curved portion is shorter than the length of a straight line extending from the edge corresponding to the end face to the second curved portion.

[0012] An electronic component according to another aspect of the present invention comprises a pair of first external terminals extending inward from one of a pair of end faces and a pair of second external terminals extending inward from the other, each of the inner ends of the pair of second external terminals having a first curved portion on a closer side and a second curved portion on a farther side, the curvature of the first curved portion being smaller than the curvature of the second curved portion.

[0013] In an electronic component according to another aspect of the present invention, the mounting surface of the element body is rectangular, and a pair of first external terminals and a pair of second external terminals are located at the four corners of the mounting surface.

[0014] Another aspect of the present invention provides an electronic component, the body of which includes metal powder and resin.

[0015] In another aspect of the present invention, an electronic component has a base body having a pair of side surfaces perpendicular to a pair of end faces, and an exposed area is formed between an outer edge of the mounting surface and the first external terminal in the facing direction of the pair of side surfaces on the mounting surface, where the mounting surface is exposed from the first external terminal. Effect of the Invention

[0016] According to the present invention, there is provided an electronic component in which peeling of an external terminal is suppressed. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic perspective view of a coil component according to an embodiment. [Diagram 2] FIG. 2 is a diagram showing the inside of the coil component of FIG. [Diagram 3] FIG. 3 is an exploded view of the coil shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the coil device shown in FIG. 2 taken along line IV-IV. [Diagram 5] FIG. 5 is a cross-sectional view of the coil device shown in FIG. 2 taken along line VV. [Figure 6] FIG. 6 is a plan view of the coil shown in FIG. [Figure 7] FIG. 7 is a diagram showing one end surface of the element body of the coil device shown in FIG. [Figure 8] FIG. 8 is a view showing the other end face of the element body of the coil device shown in FIG. [Figure 9] FIG. 9 is a diagram showing the shape of the external terminals on the upper surface of the element body. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be designated by the same reference numerals, and duplicated descriptions will be omitted.

[0019] The electronic component according to the embodiment described below is a type of electronic component, and is a coil component having a coil portion as an internal conductor. The coil component 1 according to the embodiment is a balun coil. The balun coil is used, for example, when a near field wireless communication circuit (NFC circuit) is mounted on a cellular terminal. The balun coil converts between an unbalanced signal of an antenna and a balanced signal of an NFC circuit, thereby realizing a connection between an unbalanced circuit and a balanced circuit.

[0020] As shown in FIG. 1, the coil component 1 is composed of an element body 10, a coil structure 20 embedded in the element body 10, and two pairs of external terminal electrodes 60A, 60B, 60C, 60D provided on the surface of the element body 10.

[0021] The element body 10 has a rectangular parallelepiped outer shape and six faces 10a to 10f. As an example, the element body 10 is designed to have dimensions of a long side of 2.0 mm, a short side of 1.25 mm, and a height of 0.65 mm. Of the faces 10a to 10f of the element body 10, the end face 10a and the end face 10b are parallel to each other, the top face 10c and the bottom face 10d are parallel to each other, and the side face 10e and the side face 10f are parallel to each other. The top face 10c of the element body 10 is the mounting face of the element body 10 that faces the mounting board side on which the coil component 1 is mounted, and connects the pair of end faces 10a, 10b.

[0022] The element 10 is made of a resin 12 containing a magnetic metal powder, which is a type of magnetic material. The resin 12 containing a magnetic metal powder is a binding powder in which a metal powder (more specifically, a magnetic metal powder) is bound by a binder resin. The magnetic metal powder of the resin 12 containing a magnetic metal powder is made of, for example, an iron-nickel alloy (permalloy alloy), carbonyl iron, an amorphous, non-crystalline or crystalline FeSiCr-based alloy, sendust, or the like. The binder resin is, for example, a thermosetting epoxy resin. In this embodiment, the content of the magnetic metal powder in the binding powder is 80 to 92 vol% in volume percent and 95 to 99 wt% in mass percent. From the viewpoint of magnetic properties, the content of the magnetic metal powder in the binding powder may be 85 to 92 vol% in volume percent and 97 to 99 wt% in mass percent. The magnetic metal powder of the resin 12 containing a magnetic metal powder may be a powder having one type of average particle size, or may be a mixed powder having a plurality of types of average particle sizes.

[0023] The metal magnetic powder-containing resin 12 of the element body 10 integrally covers the coil structure 20 described below. Specifically, the metal magnetic powder-containing resin 12 covers the coil structure 20 from above and below, and also covers the outer periphery of the coil structure 20. In addition, the metal magnetic powder-containing resin 12 fills the inner periphery of the coil structure 20.

[0024] The coil structure 20 is configured to include an insulating substrate 30, an upper coil structure 40A provided on the upper side of the insulating substrate 30, and a lower coil structure 40B provided on the lower side of the insulating substrate 30.

[0025] The insulating substrate 30 has a flat plate shape, extends between the end faces 10a, 10b of the element body 10, and is designed to be perpendicular to the end faces 10a, 10b. The insulating substrate 30 also extends parallel to the upper face 10c and the lower face 10d of the element body 10. As shown in Fig. 3, the insulating substrate 30 has an elliptical ring-shaped coil forming portion 31 extending along the long side direction of the element body 10, and a pair of frame portions 34A, 34B extending along the short side direction of the element body 10 and sandwiching the coil forming portion 31 from both sides. An elliptical opening 32 extending along the long side direction of the element body 10 is provided in the center of the coil forming portion 31.

[0026] The insulating substrate 30 is made of a non-magnetic insulating material. The thickness of the insulating substrate 30 can be designed to be in the range of, for example, 10 to 60 μm. In this embodiment, the insulating substrate 30 has a structure in which a glass cloth is impregnated with an epoxy resin. The resin constituting the insulating substrate 30 is not limited to an epoxy resin, and may be BT resin, polyimide, aramid, or the like. The material constituting the insulating substrate 30 may be ceramic or glass. The material constituting the insulating substrate 30 may be a mass-produced printed circuit board material. The material constituting the insulating substrate 30 may be a resin material used for a BT printed circuit board, an FR4 printed circuit board, or an FR5 printed circuit board.

[0027] Upper coil structure 40A is provided on substrate upper surface 30a in coil formation portion 31 of insulating substrate 30. Upper coil structure 40A includes first planar coil 41, second planar coil 42, and upper insulator 50A, as shown in Figures 2 and 3. First planar coil 41 and second planar coil 42 are wound adjacent to each other in parallel on upper surface 30a of insulating substrate 30.

[0028] The first planar coil 41 is a substantially oval spiral air-core coil wound around the opening 32 of the coil forming section 31 in the same layer on the upper surface 30a of the insulating substrate 30. The number of turns of the first planar coil 41 may be one turn or multiple turns. In this embodiment, the number of turns of the first planar coil 41 is 3 to 4. The first planar coil 41 has an outer end 41a and an inner end 41b. The outer end 41a is provided on the frame section 34A and exposed from the end surface 10a of the element body 10. The inner end 41b is provided on the edge of the opening 32. The insulating substrate 30 is provided with a first through conductor 41c extending in the thickness direction of the insulating substrate 30 at a position overlapping with the inner end 41b of the first planar coil 41. The first planar coil 41 is made of, for example, Cu, and can be formed by electrolytic plating.

[0029] The second planar coil 42, like the first planar coil 41, is a substantially oval spiral air-core coil wound around the opening 32 of the coil forming portion 31 in the same layer on the upper surface 30a of the insulating substrate 30. The second planar coil 42 is wound so as to be adjacent to the first planar coil 41 on the inner circumferential side of the first planar coil 41. The number of turns of the second planar coil 42 may be one turn or multiple turns. In this embodiment, the number of turns of the second planar coil 42 is the same as the number of turns of the first planar coil 41. The second planar coil 42 has an outer end 42a and an inner end 42b. The outer end 42a of the second planar coil 42, like the outer end 41a of the first planar coil 41, is provided on the frame portion 34A and exposed from the end surface 10a of the element body 10. An inner end 42b of the second planar coil 42 is provided on the edge of the opening 32 and is adjacent to an inner end 41b of the first planar coil 41. A second through conductor 42c extending in the thickness direction of the insulating substrate 30 is provided in the insulating substrate 30 at a position overlapping with the inner end 42b of the second planar coil 42. The second planar coil 42, like the first planar coil 41, is made of, for example, Cu, and can be formed by electrolytic plating.

[0030] The upper insulator 50A is provided on the upper surface 30a of the insulating substrate 30, and is a thick-film resist patterned by known photolithography. The upper insulator 50A defines the plating growth regions of the first planar coil 41 and the second planar coil 42. In this embodiment, as shown in FIG. 4, the upper insulator 50A integrally covers the first planar coil 41 and the second planar coil 42, and more specifically covers the side and upper surfaces of the first planar coil 41 and the second planar coil 42. As shown in FIGS. 5 and 6, a part of the upper insulator 50A extends from the inside of the element body 10 through between the outer end 41a and the outer end 42a to the end surface 10a of the element body 10, and is exposed at the end surface 10a. Also, as shown in FIGS. 5 and 6, a part of the upper insulator 50A extends from the inside of the element body 10 along the substrate upper surface 30a to the end surface 10b, and is exposed at the end surface 10b. The thickness of upper insulator 50A is greater than the thicknesses of first planar coil 41 and second planar coil 42. Upper insulator 50A is made of, for example, epoxy resin.

[0031] Lower coil structure 40B is provided on substrate lower surface 30b in coil forming portion 31 of insulating substrate 30. Lower coil structure 40B includes first planar coil 41, second planar coil 42, and lower insulator 50B, as shown in Figures 2 and 3. First planar coil 41 and second planar coil 42 are wound adjacent to each other in parallel on lower surface 30b of insulating substrate 30.

[0032] The first planar coil 41 and the second planar coil 42 of the lower coil structure 40B are symmetrical to the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A. More specifically, the first planar coil 41 and the second planar coil 42 of the lower coil structure 40B have a shape obtained by inverting the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A around an axis parallel to the short side of the base body 10.

[0033] The outer end 41a of the first planar coil 41 of the lower coil structure 40B is provided on the frame portion 34B and exposed from the end surface 10b of the element body 10. The inner end 41b of the first planar coil 41 of the lower coil structure 40B overlaps with a first through conductor 41c provided on the insulating substrate 30. Therefore, the inner end 41b of the first planar coil 41 of the lower coil structure 40B is electrically connected to the inner end 41b of the first planar coil 41 of the upper coil structure 40A via the first through conductor 41c. The first planar coil 41 of the lower coil structure 40B is made of, for example, Cu, and can be formed by electrolytic plating.

[0034] The outer end 42a of the second planar coil 42 of the lower coil structure 40B is provided on the frame portion 34B and exposed from the end surface 10b of the element body 10. The inner end 42b of the second planar coil 42 of the lower coil structure 40B overlaps with a second through conductor 42c provided on the insulating substrate 30. Therefore, the inner end 42b of the second planar coil 42 of the lower coil structure 40B is electrically connected to the inner end 42b of the second planar coil 42 of the upper coil structure 40A via the second through conductor 42c. The second planar coil 42 of the lower coil structure 40B is made of, for example, Cu, and can be formed by electrolytic plating.

[0035] The lower insulator 50B is provided on the lower surface 30b of the insulating substrate 30 and is a thick-film resist patterned by known photolithography. The lower insulator 50B defines the plating growth regions of the first planar coil 41 and the second planar coil 42, similar to the upper insulator 50A. In this embodiment, as shown in FIG. 4, the lower insulator 50B integrally covers the first planar coil 41 and the second planar coil 42, and more specifically covers the side and upper surfaces of the first planar coil 41 and the second planar coil 42. A part of the lower insulator 50B extends from the inside of the element body 10 through between the outer end 41a and the outer end 42a to the end surface 10b of the element body 10, similar to the upper insulator 50A, and is exposed at the end surface 10b. A portion of lower insulator 50B extends from inside element body 10 along substrate lower surface 30b to end surface 10a and is exposed at end surface 10a. Lower insulator 50B has a thickness greater than that of first planar coil 41 and second planar coil 42. Lower insulator 50B may have the same thickness as upper insulator 50A. Lower insulator 50B is made of, for example, epoxy resin.

[0036] The element body 10 includes a pair of coil sections C1 and C2 that form a double coil structure. The first coil section C1 is composed of a first planar coil 41 of an upper coil structure 40A provided on the upper surface 30a of the insulating substrate 30, a first planar coil 41 of a lower coil structure 40B provided on the lower surface 30b of the insulating substrate 30, and a first through conductor 41c that connects the first planar coils 41 on both sides. In the first coil section C1, the outer end 41a of the first planar coil 41 of the upper coil structure 40A forms a first end, and the outer end 41a of the first planar coil 41 of the lower coil structure 40B forms a second end. The second coil portion C2 is composed of a second planar coil 42 of an upper coil structure 40A provided on the upper surface 30a of the insulating substrate 30, a second planar coil 42 of a lower coil structure 40B provided on the lower surface 30b of the insulating substrate 30, and a second through conductor 42c connecting the second planar coils 42 on both sides. In the second coil portion C2, the outer end 42a of the second planar coil 42 of the upper coil structure 40A constitutes a first end, and the outer end 42a of the second planar coil 42 of the lower coil structure 40B constitutes a second end.

[0037] Each of the two pairs of external terminal electrodes 60A, 60B, 60C, and 60D is provided so as to cover at least the upper surface 10c of the surface of the element body 10. In this embodiment, each of the external terminal electrodes 60A, 60B, 60C, and 60D is bent in an L-shape, continuously covers the upper surface 10c and the end surfaces 10a and 10b, and is provided in pairs on each of the end surfaces 10a and 10b. The external terminal electrode 60A on the end surface 10a and the external terminal electrode 60C on the end surface 10b are provided at positions corresponding to each other in the long side direction of the element body 10. Similarly, the external terminal electrode 60B on the end surface 10a and the external terminal electrode 60D on the end surface 10b are provided at positions corresponding to each other in the long side direction of the element body 10.

[0038] In this embodiment, the external terminal electrodes 60A, 60B, 60C, and 60D are made of resin electrodes, and are made of, for example, a resin containing Ag powder. The external terminal electrodes 60A, 60B, 60C, and 60D can be formed, for example, by applying an electrode paste. In this case, the electrode paste can be transferred to the element body 10 by using a rib or a roller of a mold. The electrode paste can also be printed on the element body 10 by screen printing.

[0039] Of the pair of external terminal electrodes 60A, 60B (first external terminals) provided on the end face 10a, the external terminal electrode 60A is connected to the outer end 41a of the first planar coil 41 of the upper coil structure 40A, and the external terminal electrode 60B is connected to the outer end 42a of the second planar coil 42 of the upper coil structure 40A. As shown in FIG. 7, when viewed from the end face 10a side, the external terminal electrode 60A is biased toward the side face 10f and covers the end face 10a up to the vicinity of the side face 10f. Moreover, the external terminal electrode 60B is biased toward the side face 10e and covers the end face 10a up to the vicinity of the side face 10e. When viewed from the end face 10a side, the external terminal electrode 60A and the external terminal electrode 60B are spaced apart by a predetermined uniform width.

[0040] Of the pair of external terminal electrodes 60C, 60D (second external terminals) provided on the end face 10b, the external terminal electrode 60C is connected to the outer end 41a of the first planar coil 41 of the lower coil structure 40B, and the external terminal electrode 60D is connected to the outer end 42a of the second planar coil 42 of the lower coil structure 40B. As shown in FIG. 8, when viewed from the end face 10b side, the external terminal electrode 60C is biased toward the side face 10f and covers the end face 10b up to the vicinity of the side face 10f. Moreover, the external terminal electrode 60D is biased toward the side face 10e and covers the end face 10b up to the vicinity of the side face 10e. When viewed from the end face 10b side, the external terminal electrode 60C and the external terminal electrode 60D are spaced apart by a predetermined uniform width.

[0041] As shown in FIG. 7, on the end face 10a of the element body 10, the outer end 41a of the first planar coil 41 and the outer end 42a of the second planar coil 42 are arranged side by side on the upper surface 30a of the insulating substrate 30. An upper insulator 50A is located in the region between the outer end 41a of the first planar coil 41 and the outer end 42a of the second planar coil 42 on the end face 10a of the element body 10. A lower insulator 50B is located on the end face 10a of the element body 10 so as to face the upper insulator 50A across the insulating substrate 30. Similarly, on the end face 10b of the element body 10, as shown in FIG. 8, a lower insulator 50B exposed on the end face 10b is located in the region between the outer end 41a of the first planar coil 41 and the outer end 42a of the second planar coil 42. Moreover, an upper insulator 50A is positioned on end surface 10b of element body 10 so as to face lower insulator 50B with insulating substrate 30 interposed therebetween.

[0042] Next, the shapes of the external terminal electrodes 60A, 60B, 60C, and 60D on the upper surface 10c of the element body 10 will be described with reference to FIG.

[0043] As shown in Fig. 9, the external terminal electrodes 60A, 60B, 60C, and 60D are located at the four corners of the rectangular top surface 10c. When viewed from the top surface 10c, the external terminal electrodes 60A, 60B, 60C, and 60D have a substantially U-shaped outer shape. On the top surface 10c, the external terminal electrodes 60A, 60B, 60C, and 60D extend inward from edges corresponding to the end surfaces 10a and 10b. The external terminal electrodes 60A, 60B, 60C, and 60D extend inward from edges corresponding to the end surfaces 10a and 10b. In this embodiment, each of the external terminal electrodes 60A, 60B, 60C, and 60D is spaced a predetermined width from the outer edge of the upper surface 10c in the facing direction of the pair of side surfaces 10e, 10f of the upper surface 10c, and an exposed region 13 is formed between the outer edge of the upper surface 10c and each of the external terminal electrodes 60A, 60B, 60C, and 60D. In the exposed region 13, the upper surface 10c is exposed from each of the external terminal electrodes 60A, 60B, 60C, and 60D.

[0044] The inner end 60a of each of the external terminal electrodes 60A, 60B, 60C, and 60D on the upper surface 10c of the element body 10 has no corners, and the inner end 60a is configured as a curve. In this embodiment, the inner end 60a of each of the external terminal electrodes 60A, 60B, 60C, and 60D has a first curved portion E1 and a second curved portion E2. In the external terminal electrodes 60A and 60B extending inward from an edge corresponding to the same end surface 10a, the first curved portion E1 is located on the closer side to each other, and the second curved portion E2 is located on the farther side. Similarly, in the external terminal electrodes 60C and 60D extending inward from an edge corresponding to the same end surface 10b, the first curved portion E1 is located on the closer side to each other, and the second curved portion E2 is located on the farther side. In addition, in this embodiment, the first curved portion E1 is designed to be smaller in curvature than the second curved portion E2. Furthermore, in this embodiment, the length D1 of the straight line extending from the edge corresponding to the end faces 10a, 10b to the first curved portion E1 is designed to be shorter than the length of the straight line extending from the edge corresponding to the end faces 10a, 10b to the second curved portion E2.

[0045] As described above, in the coil component 1, the external terminal electrodes 60A, 60B, 60C, and 60D on the top surface 10c have a U-shaped external shape, so stress concentration is less likely to occur at the inner end 60a compared to external terminal electrodes with corners at the inner end. Therefore, even if an impact is applied to the coil component 1, for example, the external terminal electrodes 60A, 60B, 60C, and 60D are effectively prevented from peeling off from the top surface 10c due to stress concentration. In addition, the occurrence of cracks in the external terminal electrodes 60A, 60B, 60C, and 60D or the element body 10 due to stress concentration is also effectively prevented.

[0046] Furthermore, in the coil component 1, the external terminal electrodes 60A, 60B, 60C, and 60D cover only two faces (i.e., the top face and the end faces) and do not cover corners of the element body 10 defined by the top face 10c, the end faces 10a, 10b, and the side faces 10e, 10f. Even if the external terminal electrodes 60A, 60B, 60C, and 60D cover only two faces in this manner, the external terminal electrodes 60A, 60B, 60C, and 60D have a U-shaped outer shape on the top face 10c, making them less likely to peel off from the top face 10c.

[0047] The present invention is not limited to the above-described embodiment, and can be modified in various ways.

[0048] For example, the electronic component is not limited to a coil component, but may be other electronic components (for example, a capacitor, a resistor, a varistor, etc.) Furthermore, the number of external terminal electrodes can be appropriately increased or decreased, and the number of external terminal electrodes provided on one end surface may be one, or three or more. [Explanation of symbols]

[0049] 1...coil component, 10...element body, 12...resin containing metal magnetic powder, 30...insulating substrate, 41...first planar coil, 42...second planar coil, 41a, 42a...outer end portion, 50A...upper insulator, 50B...lower insulator, 60A to 60D...external terminal electrodes, 60a...inner end portion, C1...first coil portion, C2...second coil portion.

Claims

1. an element body having a pair of end faces parallel to each other and a mounting surface connecting the pair of end faces; a first external terminal covering at least a mounting surface among the surfaces of the element body and electrically connected to an internal conductor provided within the element body; Equipped with When viewed from the mounting surface side, the first external terminal extends inward from an edge corresponding to the end face, and has a U-shaped outer shape with an inner end curved, a pair of the first external terminals extending inward from an edge corresponding to the end surface; an electronic component, wherein each inner end of the pair of first external terminals has a first curved portion on a closer side and a second curved portion on a farther side, the curvature of the first curved portion being smaller than the curvature of the second curved portion.

2. 2. The electronic component according to claim 1, wherein the first external terminal continuously covers a mounting surface and an end surface of the element body.

3. 3. The electronic component according to claim 1, wherein in the outer shape of the pair of first external terminals, a length of a straight line extending from the edge corresponding to the end face to the first curved portion is shorter than a length of a straight line extending from the edge corresponding to the end face to the second curved portion.

4. a pair of first external terminals extending inward from one of the pair of end faces and a pair of second external terminals extending inward from the other of the pair of end faces; The electronic component according to any one of claims 1 to 3, wherein each inner end of the pair of second external terminals has a first curved portion on a closer side and a second curved portion on a farther side, and the curvature of the first curved portion is smaller than the curvature of the second curved portion.

5. The mounting surface of the element has a rectangular shape, 5. The electronic component according to claim 4, wherein the pair of first external terminals and the pair of second external terminals are located at four corners of the mounting surface, respectively.

6. The electronic component according to any one of claims 1 to 5, wherein the element contains metal powder and resin.

7. the element body has a pair of side surfaces perpendicular to the pair of end surfaces, The electronic component according to any one of claims 1 to 6, wherein an exposed region in which the mounting surface is exposed from the first external terminal is formed between an outer edge of the mounting surface and the first external terminal in a facing direction of the pair of side surfaces on the mounting surface.

Citation Information

Patent Citations

  • Laminated chip electronic component and its manufacturing method

    JP2003100548A

  • Laminated dielectric filter

    JP2010258743A

  • Coil component and manufacturing method therefor

    JP2012084936A

  • Common mode filter and manufacturing method of the same

    JP2016111349A

  • Electronic component built-in wiring board

    JP2017005232A