Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus.SOLUTION: A substrate processing apparatus is provided, and it comprises a substrate supporter supporting a substrate, a processing solution feeder supplying a processing solution to the substrate, first and second collection receptacles configured to collect the processing solution, a first piping connected to the first collection receptacle and containing an insulating material, a second piping connected to the second collection receptacle and containing an insulating material, a first ionizing device in contact with the first piping, a second ionizing device in contact with the second piping, and a plurality of first conductive lines connected to the first ionizing device and the second ionizing device.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Contaminants such as particles, organic residues, and metal residues remaining on the substrate surface have a significant impact on the characteristics and production yield of semiconductor devices. The process of removing such contaminants from the substrate surface is called a cleaning process. The cleaning process is a key element in the semiconductor manufacturing process and is performed before and after each unit process for manufacturing semiconductor devices.

[0003] The cleaning process includes applying various processing solutions onto the semiconductor substrate, and the processing solutions used in the cleaning process are collected by piping connected to a collection vessel of the cleaning equipment. Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a substrate processing apparatus having improved reliability. [Means for solving the problem]

[0005] A substrate processing apparatus according to a first aspect includes a substrate supporter including a support plate configured to support a substrate and a rotation driver configured to rotate the support plate, a processing solution supply device configured to supply a processing solution to the substrate, a first recovery container configured to surround the substrate supporter and to recover the processing solution splashed from the substrate, a lift driver configured to drive the first recovery container up and down relative to the substrate supporter, and a first pipe connected to the first recovery container and including an insulating material; A conductive material is included, and the bent portion of the first pipe is covered. a first static eliminator in contact with the first pipe; and providing a path for discharging static electricity generated by the first pipe.a first conductive line connecting the first static eliminator to the first conductive line and configured to apply a reference potential to the first ground bar; a second ground bar connected to the rotation actuator and the lift actuator and configured to provide the reference potential; a second conductive line connecting the rotation actuator and the lift actuator to the second ground bar; a third ground bar; a third conductive line connecting the third ground bar to the first ground bar; a fourth conductive line connecting the third ground bar to the second ground bar; and a fifth conductive line connecting the third ground bar to an earth ground, The first ground bar and the second ground bar are spaced apart from each other, and The third conductive line has a resistance per unit length less than that of the first conductive line, the fourth conductive line has a resistance per unit length less than that of each of the second conductive lines, the fifth conductive line has a resistance per unit length less than that of the third conductive line, and the fifth conductive line has a resistance per unit length less than that of the third conductive line.

[0006] A substrate processing apparatus according to a second aspect includes a processing solution supply device including a substrate supporter for supporting a substrate and a nozzle configured to supply a processing solution to the substrate, a first collection container configured to surround the substrate supporter and collect the processing solution scattered from the substrate, a second collection container configured to surround the first collection container and collect the processing solution scattered from the substrate, a first pipe connected to the first collection container and containing an insulating material, a second pipe connected to the second collection container and containing an insulating material, a first static elimination device including a conductive material, surrounding a bent portion of the first pipe, being in contact with the bent portion of the first pipe, and configured to remove static electricity generated by the first pipe, and a second static elimination device connected to the first static elimination device. and providing a path for discharging static electricity generated by the first pipe.a first conductive line connecting the first static eliminator to the first conductive line and configured to apply a reference potential to the first ground bar; a second ground bar connected to a rotation actuator and a lift actuator and configured to provide the reference potential; a second conductive line connecting the rotation actuator and the lift actuator to the second ground bar; a third ground bar; a third conductive line connecting the third ground bar to the first ground bar; a fourth conductive line connecting the third ground bar to the second ground bar; and a fifth conductive line connecting the third ground bar to an earth ground, The first ground bar and the second ground bar are spaced apart from each other, and The third conductive line has a resistance per unit length less than that of the first conductive line, the fourth conductive line has a resistance per unit length less than that of each of the second conductive lines, the fifth conductive line has a resistance per unit length less than that of the third conductive line, and the fifth conductive line has a resistance per unit length less than that of the third conductive line.

[0007] A substrate processing apparatus according to a third aspect includes a substrate supporter including a support plate configured to support a substrate and a rotation driver configured to rotate the support plate, a processing solution supply device configured to supply a processing solution to the substrate, a first collection container configured to surround the substrate supporter and to collect the processing solution splashed from the substrate, a second collection container configured to surround the first collection container and to collect the processing solution splashed from the substrate, a lift driver configured to drive the first collection container and the second collection container up and down relative to the substrate supporter, a first pipe connected to the first collection container and containing an insulating material, and a second pipe connected to the second collection container and containing an insulating material. A conductive material is included, and the bent portion of the first pipe is covered. a first static eliminator in contact with the bent portion of the first pipe, a second static eliminator in contact with the bent portion of the second pipe, and a path for discharging static electricity to the first static eliminator and the second static eliminator; and a path for discharging static electricity generated by the first pipe.a plurality of first conductive lines configured to provide a reference potential for operation of the rotation actuator and the lift actuator; a first ground bar connected to the plurality of first conductive lines; a second ground bar connected to the plurality of second conductive lines and spaced apart from the first ground bar; a third conductive line connected to the first ground bar; a fourth conductive line connected to the second ground bar; a third ground bar connected to the third conductive line and the fourth conductive line; and a fifth conductive line connecting the third ground bar to an earth ground, The first ground bar and the second ground bar are spaced apart from each other, and The resistance value per unit length of the fifth conductive line is smaller than the resistance value per unit length of each of the third conductive line and the fourth conductive line, and the resistance value per unit length of each of the third conductive line and the fourth conductive line is smaller than the resistance value per unit length of each of the first conductive line and the second conductive line. Effect of the Invention

[0008] According to the technical concept of the present invention, it is possible to effectively remove electrostatic charges generated in piping for recovering a processing solution in a substrate processing apparatus, thereby providing a substrate processing apparatus with improved reliability while reducing communication failures and noise caused by the static electricity.

[0009] The effects obtained from the exemplary embodiments of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure belong from the following description. In other words, unintended effects leading to the implementation of the exemplary embodiments of the present disclosure can also be derived from the exemplary embodiments of the present disclosure by those skilled in the art. [Brief description of the drawings]

[0010] [Figure 1]1 is a plan view for explaining a substrate processing system according to an exemplary embodiment; [Diagram 2] FIG. 2 is a cross-sectional view for explaining the first substrate processing apparatus of FIG. [Diagram 3] FIG. 2 is a perspective view showing a first static eliminator and a first pipe. [Figure 4] FIG. 11 is a block diagram for explaining a charge removing action of the first substrate processing apparatus according to the exemplary embodiment. [Diagram 5] FIG. 11 is a cross-sectional view illustrating a first substrate processing apparatus according to another exemplary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same components in the drawings are designated by the same reference numerals, and duplicated explanations thereof will be omitted.

[0012] FIG. 1 is a plan view for explaining a substrate processing system 100 according to an exemplary embodiment.

[0013] Referring to FIG. 1, the substrate processing system 100 also includes an index module 1000 and a process module 2000 .

[0014] The index module 1000 receives a substrate S (FIG. 2) from an external source and transfers the substrate S (FIG. 2) to the process module 2000, which can perform a cleaning process and a drying process using a supercritical fluid.

[0015] The index module 1000 is an equipment front end module (EFEM) and also includes a load port 1100 and a transfer frame 1200 .

[0016] The load port 1100 is also configured to accommodate a container C in which substrates S (FIG. 2) are stored. By way of non-limiting example, the container C may be a front opening unified pod (FOUP). The container C may be externally loaded into and removed from the load port 1100 by an overhead transfer (OHT) system.

[0017] The transfer frame 1200 can transfer a substrate S (FIG. 2) between a container C placed on the load port 1100 and a process module 2000. The transfer frame 1200 also includes an index robot 1210 and an index rail 1220. The index robot 1210 is also configured to move on the index rail 1220. Thus, the index robot 1210 can move to a position adjacent to either the container C from which the substrate S (FIG. 2) is extracted or stored, or the process module 2000.

[0018] The process module 2000 is a module for processing substrates in order to manufacture semiconductor devices, and includes a buffer chamber 2100, a transfer chamber 2200, a plurality of first substrate processing apparatuses 3000, and a plurality of second substrate processing apparatuses 4000.

[0019] The buffer chamber 2100 can temporarily store the substrate S (FIG. 2) transferred from the index module 1000 to the process module 2000 or from the process module 2000 to the index module 1000. The buffer chamber 2100 also includes a buffer slot in which the substrate S (FIG. 2) is placed.

[0020] The transfer chamber 2200 can transfer a substrate S (FIG. 2) to the buffer chamber 2100, the first substrate processing apparatus 3000, and the second substrate processing apparatus 4000, which are arranged adjacent to a transfer rail 2220. The transfer chamber 2200 also includes a transfer robot 2210 and a transfer rail 2220. The transfer robot 2210 can move to a position adjacent to the first substrate processing apparatus 3000 and the second substrate processing apparatus 4000 on the transfer rail 2220 to transfer the substrate S (FIG. 2) to the first substrate processing apparatus 3000 and the second substrate processing apparatus 4000.

[0021] The plurality of first substrate processing apparatuses 3000 and the plurality of second substrate processing apparatuses 4000 may perform a cleaning process. The cleaning process may be sequentially performed by one of the plurality of first substrate processing apparatuses 3000 and one of the plurality of second substrate processing apparatuses 4000. Each of the plurality of first substrate processing apparatuses 3000 is configured to perform a cleaning process including a chemical process, a rinsing process, and an organic solvent process on a substrate S (FIG. 2), and each of the second substrate processing apparatuses 4000 is also configured to perform a drying process using a supercritical fluid on the substrate S (FIG. 2) after the cleaning process.

[0022] The plurality of first substrate processing apparatuses 3000 and the plurality of second substrate processing apparatuses 4000 are also arranged along a side of the transfer chamber 2200. For example, the plurality of first substrate processing apparatuses 3000 and the plurality of second substrate processing apparatuses 4000 may be spaced apart from each other across the transfer chamber 2200.

[0023] The number and arrangement of the first substrate processing apparatus 3000 and the second substrate processing apparatus 4000 are not limited to the above examples, and may be appropriately changed taking into account various factors such as the footprint of the substrate processing system 100 and process efficiency.

[0024] FIG. 2 is a cross-sectional view for explaining the first substrate processing apparatus 3000 of FIG.

[0025] FIG. 3 is a perspective view showing the first static eliminator 3441 and the first pipe 3410. As shown in FIG.

[0026] 2 and 3, the first substrate processing apparatus 3000 may perform a chemical process, a rinsing process, and an organic solvent process, or may selectively perform only one of the chemical process, the rinsing process, and the organic solvent process.

[0027] Here, the chemical process is a process of providing a cleaning agent to the substrate S and removing foreign matter on the substrate S, the rinsing process is a process of providing a rinse agent to the substrate S and removing the cleaning agent remaining on the substrate S, and the organic solvent process is a process of providing an organic solvent to the substrate S and replacing the rinse agent remaining between the circuit patterns of the substrate S with an organic solvent having a surface tension lower than that of the rinse agent.

[0028] The substrate supporter 3100 is capable of supporting and fixing the substrate S, and rotating the substrate S about an axis perpendicular to the upper surface of the substrate S. The substrate supporter 3100 also includes a support plate 3110, support pins 3111, chucking pins 3112, a rotation shaft 3120, and a rotation driver 3130.

[0029] Here, the substrate S may be a semiconductor wafer. The substrate S may include, for example, silicon (Si). The substrate S may include a semiconductor material such as germanium (Ge), or a compound semiconductor such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), and indium phosphide (InP).

[0030] The support pins 3111 and the chucking pins 3112 are also disposed on the upper surface of the support plate 3110. The support pins 3111 can support the substrate S, and the chucking pins 3112 can fix the supported substrate S. According to an exemplary embodiment, the support pins 3111 and the chucking pins 3112 can space the back surface of the substrate S from the upper surface of the support plate 3110 to facilitate pick and place of the substrate S and prevent contamination of the back surface of the substrate.

[0031] The support plate 3110 is also connected to a rotating shaft 3120. The rotating shaft 3120 can transmit torque from a rotation driver 3130 to the support plate 3110 to rotate the support plate 3110. This allows the substrate S placed on the support plate 3110 to rotate. At this time, the chucking pin 3112 can prevent the substrate S from leaving its fixed position.

[0032] The processing solution supply apparatus 3200 is also configured to spray a processing solution onto the substrate S. The processing solution may include a cleaning agent, a rinsing agent, an organic solvent, etc. The processing solution supply apparatus 3200 also includes a nozzle 3210, a nozzle bar 3220, a nozzle shaft 3230, and a nozzle shaft driver 3240.

[0033] By way of non-limiting example, cleaning agents may include hydrogen peroxide (H2O2), ammonia (NH4OH), hydrochloric acid (HCl), sulfuric acid (H2SO4), hydrofluoric acid (HF), etc. By way of non-limiting example, rinse agents may include pure water.

[0034] Non-limiting examples of organic solvents include isopropyl alcohol (IPA), ethylene glycol, 1-propanol, tetrahydrofuran (THF), 4-hydroxyl 4-methyl 2-pentanone, 1-butanol, 2-butanol, methanol, ethanol, n-propyl alcohol, and dimethylether.

[0035] The nozzles 3210 are also located on the lower surface of one end of the nozzle bar 3220. The nozzle bar 3220 is also coupled to a nozzle shaft 3230. The nozzle shaft driver 3240 can raise / lower or rotate the nozzle shaft 3230 to adjust the position of the nozzles 3210.

[0036] Once the processing solution is supplied to the substrate S by the processing solution supplying device 3200, the substrate supporter 3100 can rotate the substrate S. The processing solution can be uniformly distributed over the entire area of ​​the substrate S through spin coating. When the substrate S rotates, some of the processing solution can be scattered from the substrate S. The processing solution can also be collected by the collecting device 3300.

[0037] The collection device 3300 also includes a first collection container 3310 , a second collection container 3320 and a third collection container 3330 , a lift bar 3340 and a lift driver 3350 .

[0038] The first collection container 3310 may have a ring shape surrounding the substrate supporter 3100. The second collection container 3320 may have a ring shape surrounding the first collection container 3310. The third collection container 3330 may have a ring shape surrounding the second collection container 3320. The first collection container 3310, the second collection container 3320, and the third collection container 3330 may be fixed to one another.

[0039] The internal space of the first collection container 3310 is also the first inlet 3311 of the first collection container 3310 through which the processing solution flows, the space between the first collection container 3310 and the second collection container 3320 is also the second inlet 3321 of the second collection container 3320 through which the processing solution flows, and the space between the second collection container 3320 and the third collection container 3330 is also the third inlet 3331 of the third collection container 3330 through which the processing solution flows.

[0040] The third inlet 3331 is disposed above the second inlet 3321 (i.e., closer to the nozzle 3210), and the second inlet 3321 is disposed above the first inlet 3311. This allows the first collection container 3310, the second collection container 3320, and the third collection container 3330 to collect different processing solutions from each other.

[0041] The lift bar 3340 is also connected to the first collection container 3310, the second collection container 3320, and the third collection container 3330. The lift bar 3340 can transmit a driving force from the lift driver 3350 to the first collection container 3310, the second collection container 3320, and the third collection container 3330 so as to move the first collection container 3310, the second collection container 3320, and the third collection container 3330 up and down.

[0042] When the substrate S is placed on or picked up from the substrate supporter 3100, the lift bar 3340 and the lift driver 3350 can lower the first collection container 3310, the second collection container 3320 and the third collection container 3330 so that the substrate supporter 3100 is protruded upward relative to the first collection container 3310, the second collection container 3320 and the third collection container 3330.

[0043] In addition, the lift bar 3340 and the lift driver 3350 can adjust the positions of the first collection container 3310, the second collection container 3320, and the third collection container 3330 so that the processing solution splashed from the substrate S can flow into the first collection container 3310, the second collection container 3320, and the third collection container 3330 while the substrate S is being processed.

[0044] The first pipe 3410 is also connected to the bottom of the first collection container 3310, the second pipe 3420 is also connected to the bottom of the second collection container 3320, and the third pipe 3430 is also connected to the bottom of the third collection container 3330. According to an exemplary embodiment, the first pipe 3410, the second pipe 3420, and the third pipe 3430 can convey the treatment solution collected in the first collection container 3310, the second collection container 3320, and the third collection container 3330 to a chemical regeneration system.

[0045] According to an exemplary embodiment, the first collection container 3310, the second collection container 3320, and the third collection container 3330 can collect different substances of the processing solution, and thus the first line 3410, the second line 3420, and the third line 3430 can deliver different substances of the processing solution. For example, the first line 3410 can deliver a cleaning agent, the second line 3420 can deliver a rinsing agent, and the third line 3430 can deliver an organic solvent. As another example, the first line 3410 and the second line 3420 can deliver different cleaning agents, and the third line 3430 can deliver a combination of the cleaning agent, the rinsing agent, and the organic solvent.

[0046] According to an exemplary embodiment, the first pipe 3410 and the second pipe 3420 may include a different material than the third pipe 3430. For example, the first pipe 3410 and the second pipe 3420 may include an insulating material, and the third pipe 3430 may include a conductive material.

[0047] By way of non-limiting example, the first and second pipes 3410 and 3420 may include a corrosion-resistant material such as polyvinyl chloride (PVC). The third pipe 3430 may include a carbon fiber pipe, etc. The third pipe 3430 may transmit a highly corrosive material such as isopropyl alcohol (IPA).

[0048] According to an exemplary embodiment, the third pipe 3430 is a carbon fiber pipe, so that a substance such as isopropyl alcohol (IPA) can be safely transferred, and the first pipe 3410 and the second pipe 3420 are polyvinyl chloride (PVC) pipes, so that the first pipe 3410 and the second pipe 3420 can be provided at a low cost.

[0049] According to an exemplary embodiment, the first static eliminator 3441 can be in contact with the first pipe 3410. According to an exemplary embodiment, the second static eliminator 3442 can be in contact with the second pipe 3420. According to an exemplary embodiment, the first static eliminator 3441 can surround a portion of the first pipe 3410. According to an exemplary embodiment, the second static eliminator 3442 can surround a portion of the second pipe 3420.

[0050] According to an exemplary embodiment, the first static eliminator 3441 and the second static eliminator 3442 may include a material capable of discharging charges accumulated in the first pipe 3410 and the second pipe 3420. According to an exemplary embodiment, the first static eliminator 3441 and the second static eliminator 3442 may include a conductive material. According to an exemplary embodiment, the first static eliminator 3441 and the second static eliminator 3442 may include carbon, silicon, metal, etc. As a non-limiting example, the first static eliminator 3441 and the second static eliminator 3442 may each include a conductive thread, a conductive film, and a conductive casting (i.e., an element manufactured by a template process).

[0051] According to an exemplary embodiment, the first static eliminator 3441 can be in contact with a portion of the first pipe 3410 where electrostatic charge is likely to accumulate. According to an exemplary embodiment, the second static eliminator 3442 can be in contact with a portion of the second pipe 3420 where electrostatic charge is likely to accumulate. Thereby, the static electricity induced in the first pipe 3410 and the second pipe 3420 can be removed.

[0052] As an example, friction between the processing solution and the bent portions of each of the first pipe 3410 and the second pipe 3420 is greater than friction between the processing solution and the straight portions of each of the first pipe 3410 and the second pipe 3420. For example, friction between the processing solution and the first pipe 3410 and the second pipe 3420 is maximized at the bent portions of each of the first pipe 3410 and the second pipe 3420, and thus static electricity such as triboelectricity may be easily induced at the bent portions of each of the first pipe 3410 and the second pipe 3420.

[0053] According to an exemplary embodiment, the first static eliminator 3441 can surround the bent portion of the first pipe 3410. According to an exemplary embodiment, the second static eliminator 3442 can surround the bent portion of the second pipe 3420. According to an exemplary embodiment, the first static eliminator 3441 can be in contact with the bent portion of the first pipe 3410. According to an exemplary embodiment, the second static eliminator 3442 can be in contact with the bent portion of the second pipe 3420.

[0054] According to an exemplary embodiment, the first conductive line 3541 is also connected to the third pipe 3430, and the first and second static eliminators 3441 and 3442. As described above, the third pipe 3430 includes a conductive material, but the first conductive line 3541 may be directly connected to the third pipe 3430. A ground potential GND may be applied to the first conductive line 3541. The first conductive line 3541 may provide a path for discharging charges accumulated in the third pipe 3430, and the first and second static eliminators 3441 and 3442. As a non-limiting example, the first conductive line 3541 may also include copper (Cu).

[0055] According to an exemplary embodiment, the first substrate processing apparatus 3000 further includes a controller. The controller may be implemented by hardware, firmware, software, or any combination thereof. For example, the controller may include a computing device such as a workstation computer, a desktop computer, a laptop computer, or a tablet computer. The controller may include a simple controller; a complex processor such as a microprocessor, a CPU, or a GPU; a processor configured by software; or a dedicated hardware or firmware. The controller may be implemented by a general-purpose computer or application-specific hardware such as a digital signal processor (DSP), a field programmable gate array (FPGA), and an application specific integrated circuit (ASIC).

[0056] Firmware, software, routines, and instructions may be configured to perform the operations described above for the controller or any of the steps described below. For example, the controller may be embodied by software configured to generate signals to control the operation of the rotation actuator 3130, the nozzle shaft actuator 3240, and the lift actuator 3350. The operations of the controller may also be caused by a computing device, processor, or other device executing firmware, software, routines, and instructions.

[0057] According to an exemplary embodiment, the first substrate processing apparatus 3000 also includes an EtherCAT (Ethernet for Control Automation Technology) network for communicating with an external server.

[0058] According to the exemplary embodiment, the first static eliminator 3441 and the second static eliminator 3442 can effectively remove static electricity generated from the first pipe 3410 and the second pipe 3420. This can prevent noise related to the rotation driver 3130, the nozzle shaft driver 3240, the lift driver 3350, and the controller, and communication failure of the EtherCat network, which are induced by the static electricity.

[0059] FIG. 4 is a block diagram for explaining the charge removal action of the first substrate processing apparatus 3000 according to an exemplary embodiment.

[0060] 2 and 4, the first substrate processing apparatus 3000 further includes a first ground bar 3510, a second ground bar 3520, a third ground bar 3530, a first conductive line 3541, a second conductive line 3542, a third conductive line 3543, a fourth conductive line 3544 and a fifth conductive line 3545.

[0061] According to an exemplary embodiment, the first ground bar 3510 is also configured to discharge charges accumulated in the first static eliminator 3441 and the second static eliminator 3442. A first terminal of each of the first conductive lines 3541 is also coupled to the third piping 3430 and one of the first static eliminator 3441 and the second static eliminator 3442. A second terminal of each of the first conductive lines 3541 is also coupled to the first ground bar 3510. The third piping 3430 and the first static eliminator 3441 and the second static eliminator 3442 are also configured to be electrically coupled to the first ground bar 3510 via the first conductive line 3541.

[0062] According to an exemplary embodiment, the second ground bar 3520 may provide a ground potential GND for the operation of electronic components of the first substrate processing apparatus 3000. For example, the second ground bar 3520 may provide a ground potential GND to electronic components of the first substrate processing apparatus 3000, including the rotation driver 3130, the nozzle shaft driver 3240, the lift driver 3350, the controller, and various sensors.

[0063] According to an exemplary embodiment, the second ground bar 3520 is also configured to be electrically connected to electronic components of the first substrate processing apparatus 3000, including the rotation actuator 3130, the nozzle shaft actuator 3240, the lift actuator 3350, the controller, and various sensors, via the second conductive lines 3542. According to an exemplary embodiment, a first terminal of each of the second conductive lines 3542 is also connected to one of the electronic components of the first substrate processing apparatus 3000, including the rotation actuator 3130, the nozzle shaft actuator 3240, the lift actuator 3350, the controller, and various sensors, and a second terminal of each of the second conductive lines 3542 is also connected to the second ground bar 3520.

[0064] According to an exemplary embodiment, a first terminal of the third conductive line 3543 is also coupled to the first ground bar 3510 and a second terminal of the third conductive line 3543 is also coupled to the third ground bar 3530. According to an exemplary embodiment, the first ground bar 3510 is also configured to be electrically coupled to the third ground bar 3530 via the third conductive line 3543.

[0065] A first terminal of the fourth conductive line 3544 is also coupled to the second ground bar 3520 and a second terminal of the fourth conductive line 3544 is also coupled to the third ground bar 3530. According to an exemplary embodiment, the second ground bar 3520 is also configured to be electrically coupled to the third ground bar 3530 via the fourth conductive line 3544.

[0066] According to an exemplary embodiment, the first ground bar 3510 and the second ground bar 3520 may be spaced apart from each other. According to an exemplary embodiment, the first ground bar 3510 and the second ground bar 3520 are not directly electrically connected to each other. According to an exemplary embodiment, the first ground bar 3510 is also configured to be electrically connected to the second ground bar 3520 via the third conductive line 3543, the third ground bar 3530, and the fourth conductive line 3544.

[0067] The fifth conductive line 3545 is also coupled to the third ground bar 3530. According to an exemplary embodiment, the fifth conductive line 3545 may apply a ground potential GND to the third ground bar 3530. According to an exemplary embodiment, the fifth conductive line 3545 may provide a path for dissipating static electricity removed from the first pipe 3410 and the second pipe 3420 by the first static eliminator 3441 and the second static eliminator 3442.

[0068] According to an exemplary embodiment, the fifth conductive line 3545 is also connected to an earth ground EG. According to an exemplary embodiment, the earth ground EG is also a charge reservoir that stores static electricity transferred from the first charge neutralizer 3441 and the second charge neutralizer 3442. According to an exemplary embodiment, the earth ground EG is a ground on the power system, and the second ground bar 3520 is also a chassis ground that provides a reference potential for the operation of electronic components of the first substrate processing apparatus 3000, including the rotation driver 3130, the nozzle shaft driver 3240, the lift driver 3350, the controller, and various sensors.

[0069] According to an exemplary embodiment, the cross-sectional area of ​​each of the first conductive lines 3541 is also substantially the same as the cross-sectional area of ​​each of the second conductive lines 3542. According to an exemplary embodiment, the resistance per unit length of each of the first conductive lines 3541 is also substantially the same as the resistance per unit length of each of the second conductive lines 3542.

[0070] According to an exemplary embodiment, the respective sizes and resistances of the first ground bar 3510 and the second ground bar 3520 are also substantially identical to each other. According to an exemplary embodiment, the first ground bar 3510 and the second ground bar 3520 are also comprised of the same material. According to an exemplary embodiment, the first ground bar 3510 and the second ground bar 3520 are also comprised of a conductive material, such as a metallic material. According to an exemplary embodiment, the resistance value of the first ground bar 3510 and the resistance value of the second ground bar 3520 are also substantially identical to each other.

[0071] According to an exemplary embodiment, the cross-sectional area of ​​the third conductive line 3543 is also substantially the same as the cross-sectional area of ​​the fourth conductive line 3544. According to an exemplary embodiment, the resistance per unit length of the third conductive line 3543 is also substantially the same as the resistance per unit length of the fourth conductive line 3544.

[0072] According to an exemplary embodiment, the cross-sectional area of ​​each of the third conductive line 3543 and the fourth conductive line 3544 is 1 lead The cross-sectional area of ​​each of the third conductive line 3543 and the fourth conductive line 3544 is greater than the cross-sectional area of ​​each of the second conductive line 3542. According to an exemplary embodiment, the resistance per unit length of each of the third conductive line 3543 and the fourth conductive line 3544 is greater than the cross-sectional area of ​​each of the third conductive line 3543 and the fourth conductive line 3544. 1 lead The resistance per unit length of the first conductive line 3541 and the second conductive line 3542 is smaller than the resistance per unit length of the first conductive line 3542.

[0073] According to an exemplary embodiment, the size of the third ground bar 3530 is greater than the size of each of the first ground bar 3510 and the second ground bar 3520. According to an exemplary embodiment, the resistance value of the third ground bar 3530 is less than the resistance value of the first ground bar 3510 and the second ground bar 3520.

[0074] According to an exemplary embodiment, the cross-sectional area of ​​the fifth conductive line 3545 is greater than the cross-sectional area of ​​each of the third conductive line 3543 and the fourth conductive line 3544. According to an exemplary embodiment, the resistance per unit length of the fifth conductive line 3545 is less than the resistance per unit length of each of the third conductive line 3543 and the fourth conductive line 3544.

[0075] According to an exemplary embodiment, since the first ground bar 3510 is not directly connected to the second ground bar 3520, it is possible to prevent static electricity discharged through the first ground bar 3510 from being transmitted through the second ground bar 3520 to the electronic components of the first substrate processing apparatus 3000, including the rotation driver 3130, the nozzle shaft driver 3240, the lift driver 3350, the controller, and various sensors.

[0076] In addition, since the resistance per unit length of the fifth conductive line 3545 is smaller than the resistance per unit length of each of the third conductive line 3543 and the fourth conductive line 3544, most of the static electricity reaching the third ground bar 3530 via the third conductive line 3543 may flow to the earth ground EG via the fifth conductive line 3545, instead of flowing to the second ground bar 3520 via the fourth conductive line 3544. As a result, most of the static electricity discharged via the first ground bar 3510 may be discharged to the earth ground EG via the first conductive line 3541, the third conductive line 3543, and the fifth conductive line 3545.

[0077] According to an exemplary embodiment, arcs due to accumulation of static electricity generated from the first pipe 3410, the second pipe 3420, and the third pipe 3430 can be prevented, and the reliability of the first substrate processing apparatus 3000 can be improved.

[0078] FIG. 5 is a schematic cross-sectional view for explaining a first substrate processing apparatus 3001 according to another exemplary embodiment.

[0079] Referring to FIG. 5, the first substrate processing apparatus 3001 also includes a substrate supporter 3100, a processing solution supply device 3200, a first collection container 3130, a second collection container 3120 and a third collection container 3330, a first pipe 3410, a second pipe 3420 and a third pipe 3430, as well as a first charge elimination device 3441', a second charge elimination device 3443, a third charge elimination device 3444 and a fourth charge elimination device 3445.

[0080] The substrate supporter 3100, the processing solution supply device 3200, the first collection container 3130, the second collection container 3120, and the third collection container 3330, as well as the first pipe 3410, the second pipe 3420, and the third pipe 3430 are substantially the same as those described with reference to Figures 2 to 4, and therefore repeated explanations related thereto will be omitted.

[0081] According to an exemplary embodiment, the first static eliminator 3441′ further includes a first portion surrounding the bent portion of the first pipe 3410 and a second portion surrounding the straight portion of the first pipe 3410. The second portion of the first static eliminator 3441′ also extends along the first pipe 3410 from the bent portion of the first pipe 3410. The second portion of the first static eliminator 3441′ can contact the straight portion of the first pipe 3410.

[0082] According to an exemplary embodiment, the second static eliminator 3443 can cover a part of the bent portion of the second pipe 3420. According to an exemplary embodiment, the second static eliminator 3443 can cover an outer surface 3422 of the bent portion of the second pipe 3420 and expose an inner surface 3421. Here, the inner surface 3421 of the bent portion of the second pipe 3420 is in the bending direction of the second pipe 3420, and the outer surface 3422 is opposite to the inner surface 3421.

[0083] According to an exemplary embodiment, the second static eliminator 3443 may be in contact with an outer surface 3422 of the bent portion of the second pipe 3420 and may be spaced apart from an inner surface 3421 of the bent portion of the second pipe 3420. According to an exemplary embodiment, by providing the second static eliminator 3443 that covers only the outer surface 3422 of the bent portion of the second pipe 3420, the manufacturing cost of the second static eliminator 3443 may be reduced.

[0084] According to an exemplary embodiment, the third static eliminator 3444 may cover a part of the first pipe 3410. According to an exemplary embodiment, the third static eliminator 3444 may be separated from the bent portion of the first pipe 3410. According to an exemplary embodiment, the third static eliminator 3444 may cover a portion of the straight portion of the first pipe 3410 where static electricity such as frictional electricity is likely to occur. According to an exemplary embodiment, the third static eliminator 3444 may be in contact with a portion of the straight portion of the first pipe 3410 where static electricity such as frictional electricity is likely to occur. According to an exemplary embodiment, the third static eliminator 3444 may be additionally provided in a portion of the first pipe 3410 other than the bent portion where static electricity is likely to occur, thereby making it possible to more effectively remove static electricity generated by the first pipe 3410.

[0085] According to an exemplary embodiment, the fourth static eliminator 3445 can cover a portion of the processing solution supply apparatus 3200. According to an exemplary embodiment, the fourth static eliminator 3445 can be in contact with a portion of the processing solution supply apparatus 3200. According to an exemplary embodiment, the fourth static eliminator 3445 can cover a portion of the processing solution supply apparatus 3200 where static electricity is likely to be generated, such as a junction between the nozzle 3210 and the nozzle bar 3220. According to an exemplary embodiment, the fourth static eliminator 3445 can be in contact with a portion of the processing solution supply apparatus 3200 where static electricity is likely to be generated, such as a junction between the nozzle 3210 and the nozzle bar 3220.

[0086] The first conductive line 3541 is connected to the first charge neutralizer 3441′, and the further first conductive line 3541 is also connected to the second charge neutralizer 3443, the third charge neutralizer 3444, and the fourth charge neutralizer 3445. The further first conductive line 3541 can apply a reference potential GND to the second charge neutralizer 3443, the third charge neutralizer 3444, and the fourth charge neutralizer 3445. The further first conductive line 3541 can provide a path for discharging static electricity to the second charge neutralizer 3443, the third charge neutralizer 3444, and the fourth charge neutralizer 3445. The further first conductive line 3541 is also connected to a ground bar 3510 (FIG. 4).

[0087] As described above, exemplary embodiments have been disclosed in the drawings and the specification. In this specification, specific terms have been used to describe the embodiments, but they are merely used for the purpose of describing the technical ideas of the present disclosure, and are not used to limit the meaning or the scope of the present disclosure described in the claims. Therefore, a person skilled in the art will understand that various modifications and other equivalent embodiments are possible. Therefore, the true technical scope of protection of the present disclosure is defined by the technical ideas of the claims. [Explanation of symbols]

[0088] 100 Substrate processing system 1000 Index Module 1100 Loading port 1200 Transfer Frame 2000 Process Module 2100 Buffer Chamber 2200 Transfer Chamber 3000, 3001 First substrate processing apparatus 3100 PCB Supporter 3110 Support plate 3200 Processing solution supply unit 3210 Nozzle 3220 Nozzle Bar 3230 Nozzle shaft 3240 Nozzle shaft driver 3300 Recovery Device 3310 First collection container 3320 No. 2 Collection Container 3330 Collection Container No. 3 3340 Lifting bar 3350 Lifting Drive 3410 First Pipe 3420 Second Pipe 3430 3rd Pipe 4000 Second substrate processing equipment

Claims

1. a substrate supporter including a support plate configured to support a substrate and a rotational driver configured to rotate the support plate; a processing solution supply configured to supply a processing solution to the substrate; a first recovery container configured to surround the substrate supporter and recover the processing solution splashed from the substrate; an elevation driver configured to drive the first collection container up and down relative to the substrate supporter; a first pipe connected to the first collection container and containing an insulating material; a first static eliminator including a conductive material, covering a bent portion of the first pipe, and in contact with the first pipe; a first conductive line connected to the first static eliminator and providing a path for discharging static electricity generated by the first pipe; a first ground bar to which the first static eliminator is connected via the first conductive line and to which a reference potential is applied; a second ground bar coupled to the rotation driver and the lift driver and configured to provide the reference potential; a second conductive line connecting the rotation actuator and the lift actuator to the second ground bar; A third ground bar; and a third conductive line connecting the third ground bar and the first ground bar; a fourth conductive line connecting the third ground bar and the second ground bar; a fifth conductive line connecting the third ground bar to an earth ground; Including, The first ground bar and the second ground bar are spaced apart from each other, and a resistance value per unit length of the third conductive line is smaller than a resistance value per unit length of the first conductive line. a resistance per unit length of the fourth conductive line is less than a resistance per unit length of each of the second conductive lines; a resistance value per unit length of the fifth conductive line is smaller than a resistance value per unit length of the third conductive line; The resistance per unit length of the fifth conductive line is The substrate processing apparatus according to claim 1, wherein the resistance value is smaller than the resistance value.

2. 2. The substrate processing apparatus of claim 1, wherein the first ground bar is indirectly connected to the second ground bar via the third conductive line, the third ground bar, and the fourth conductive line.

3. A substrate supporter for supporting a substrate; a processing solution supply including a nozzle configured to supply a processing solution to the substrate; a first recovery container configured to surround the substrate supporter and recover the processing solution splashed from the substrate; a second collection container surrounding the first collection container and configured to collect the processing solution splashed from the substrate; a first pipe connected to the first collection container and containing an insulating material; a second pipe connected to the second collection vessel and containing an insulating material; a first static elimination device including a conductive material, surrounding the bent portion of the first pipe, and in contact with the bent portion of the first pipe to eliminate static electricity generated by the first pipe; a first conductive line connected to the first static eliminator and providing a path for discharging static electricity generated by the first pipe; a first ground bar to which the first static eliminator is connected via the first conductive line and to which a reference potential is applied; a second ground bar coupled to the rotation driver and the lift driver and configured to provide the reference potential; a second conductive line connecting the rotation actuator and the lift actuator to the second ground bar; A third ground bar; and a third conductive line connecting the third ground bar and the first ground bar; a fourth conductive line connecting the third ground bar and the second ground bar; a fifth conductive line connecting the third ground bar to an earth ground; Including, The first ground bar and the second ground bar are spaced apart from each other, and a resistance value per unit length of the third conductive line is smaller than a resistance value per unit length of the first conductive line. a resistance per unit length of the fourth conductive line is less than a resistance per unit length of each of the second conductive lines; a resistance value per unit length of the fifth conductive line is smaller than a resistance value per unit length of the third conductive line; 4. The substrate processing apparatus according to claim 3, wherein the fifth conductive line has a resistance per unit length smaller than a resistance per unit length of the third conductive line.

4. The substrate processing apparatus described in Claim 3, characterized in that the first de-ionization device includes a first portion surrounding the bent portion of the first piping, and a second portion surrounding a straight portion of the first piping.

5. The present invention further includes a second static elimination device configured to eliminate static electricity generated by the second piping, The substrate processing apparatus according to claim 3 , wherein the second charge removing device covers a part of a bent portion of the second pipe.

6. The second static elimination device is in contact with an outer surface of the bent portion of the second pipe, The substrate processing apparatus according to claim 5 , wherein the second pipe is spaced from an inner surface of the bent portion of the second pipe.

7. The present invention further includes a third static elimination device configured to eliminate static electricity generated by the first piping, The substrate processing apparatus according to claim 6 , wherein the third charge removing device is spaced apart from the bent portion of the first pipe.

8. Further comprising a fourth static elimination device configured to eliminate static electricity generated by the treatment solution supply device, The substrate processing apparatus according to claim 7 , wherein the fourth charge removing device is in contact with the nozzle.

9. A substrate processing apparatus as described in claim 8, further comprising a plurality of first conductive lines configured to provide a path for discharging static electricity to the first charge removal device to the fourth charge removal device.

10. A substrate supporter comprising: a support plate configured to support a substrate; and a rotational driver configured to rotate the support plate; a processing solution supply configured to supply a processing solution to the substrate; a first recovery container configured to surround the substrate supporter and recover the processing solution splashed from the substrate; a second collection container surrounding the first collection container and configured to collect the processing solution splashed from the substrate; an elevation driver configured to drive the first collection container and the second collection container up and down relative to the substrate supporter; a first pipe connected to the first collection container and containing an insulating material; a second pipe connected to the second collection vessel and containing an insulating material; a first static eliminator including a conductive material, covering the bent portion of the first pipe, and in contact with the bent portion of the first pipe; a second static eliminator in contact with the bent portion of the second pipe; a plurality of first conductive lines providing a path for discharging static electricity to the first static eliminator and the second static eliminator, and a path for discharging static electricity generated by the first piping; a plurality of second conductive lines configured to provide a reference potential for operation of the rotation actuator and the lift actuator; a first ground bar connected to the first conductive lines; a second ground bar connected to the second plurality of conductive lines and spaced apart from the first ground bar; a third conductive line connected to the first ground bar; a fourth conductive line connected to the second ground bar; a third ground bar connected to the third conductive line and the fourth conductive line; a fifth conductive line connecting the third ground bar to an earth ground; The first ground bar and the second ground bar are spaced apart from each other, a resistance value per unit length of the fifth conductive line is smaller than a resistance value per unit length of each of the third conductive line and the fourth conductive line; a resistance value per unit length of each of the third conductive line and the fourth conductive line is smaller than a resistance value per unit length of each of the first conductive line and the second conductive line.

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