Compositions and methods for selectively etching silicon nitride films - Patents.com

Abstract

The present invention relates to compositions and methods for selectively wet etching surfaces of microelectronic devices that contain both silicon nitride (SiN) and polysilicon. The etching compositions described contain phosphoric acid, several polysilicon corrosion inhibitors, and several silanes. It has been found that the combination of the two components significantly improves the selectivity of the silicon nitride etching composition in the presence of polysilicon.

Description

[Technical field]

[0001] The present invention generally relates to compositions and methods for selectively etching silicon nitride films in the presence of silicon oxide and polysilicon. [Background technology]

[0002] In the microelectronics industry, there is a continuing demand for improved device performance and smaller device dimensions and smaller device feature dimensions, which provide the dual benefits of higher density of device features and higher device speeds.

[0003] Shrinking feature and device dimensions necessitate finding new ways to improve the steps of the multi-step process of manufacturing microelectronic devices. In the methods of preparing many types of microelectronic devices, the step of removing silicon nitride is common. Thin layers of silicon nitride (Si3N4) are typically deposited by chemical vapor deposition from silane (SiH4) and ammonia (NH3) and can be useful in microelectronic devices as a barrier against water and sodium. Patterned silicon nitride layers are also used as masks for spatially selective silicon oxide growth. After application, all or part of these silicon nitride materials may need to be removed, which is typically done by etching.

[0004] The removal of silicon nitride from a substrate by etching is advantageously performed in a manner that does not damage or destroy other exposed or covered features of the microelectronic device. Often, the process of removing silicon nitride is performed in a manner that preferentially removes silicon nitride over other materials, such as silicon dioxide, that are also present on the surface of the microelectronic device substrate. According to various commercial methods, silicon nitride is removed from the microelectronic device surface by a wet etching process that includes exposing the substrate surface to concentrated phosphoric acid (H3PO4) at elevated temperatures, for example in a bath having a temperature ranging from 150°C to 180°C. Conventional wet etching techniques for selectively removing silicon nitride over silicon oxide have used aqueous solutions of phosphoric acid (H3PO4), typically about 85 weight percent phosphoric acid and 15 weight percent water. Using fresh hot phosphoric acid, a typical Si3N4:SiO2 selectivity may be about 40:1.

[0005] In further device structures, in addition to silicon oxide, exposed surfaces of polysilicon may also be present, further complicating the desired selective silicon nitride etching process insofar as the aqueous phosphoric acid method tends to cause corrosion of the polysilicon surface. Thus, there is a need for compositions and methods useful for preferentially etching silicon nitride in the presence of polysilicon surfaces. Summary of the Invention

[0006] In summary, the present invention relates to compositions and methods for wet etching the surfaces of microelectronic devices containing silicon nitride (SiN) and polysilicon. Optionally, other materials are present, such as conductive, semiconductive, or insulating materials useful in microelectronic devices, or processing materials useful in the preparation of microelectronic devices. Materials such as metal silicides may also be present, but are often not exposed except where defects such as cracks or lithographic misalignment are present. The etching compositions described herein include phosphoric acid, several polysilicon corrosion inhibitors, and several silanes. In one embodiment, it has been found that the combination of two inhibitors significantly improves the selectivity of silicon nitride etching operations in the presence of polysilicon. In another embodiment, the combination of one inhibitor and several silicon-based additives also improves silicon nitride etching while simultaneously reducing the turbidity of the composition upon application. [Brief description of the drawings]

[0007] [Figure 1] 1A-1C are depictions of an exemplary substrate before and after an etching step when performing a method of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally used in its sense including "and / or" unless the context clearly dictates otherwise.

[0009] The term "about" generally refers to a range of numbers that are considered equivalent to the stated value (e.g., having the same function or result). In many cases, the term "about" may include numbers that are rounded to the nearest significant figure.

[0010] Numeric ranges expressed using endpoints include all numbers subsumed within that range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

[0011] In one aspect, the present invention provides a composition comprising: concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 alkyldiphenyloxide disulfonic acids; and compounds of the formula Si[phenyl-(-CH2-) x ] n (OR) m wherein n is 1, 2, or 3; m is 1, 2, or 3; the sum of n and m is 4; and x is 0, 1, 2, or 3, and wherein each R is independently selected from C1-C4 alkyl.

[0012] In one embodiment, the present invention comprises: concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C-C 16 Alkylbenzene sulfonate and C6-C 12 Compounds selected from alkyldiphenyloxide disulfonic acids; Formula (I): TIFF0007657328000001.tif57170 [wherein each R is independently selected from C1-C4 alkyl] A composition comprising the compound of formula (I) is provided.

[0013] In one embodiment, R is methyl in formula (I); i.e., the compound of formula (I) is phenyltrimethoxysilane.

[0014] In another aspect, the present invention provides a composition comprising: concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; i. N-(3-trimethoxysilylpropyl)diethylenetriamine; ii. N-(2-aminoethyl)-3-aminopropyltriethoxysilane; iii. N-(2-aminoethyl)-3-aminopropyl silanetriol; iv. N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; v. N-(6-aminohexyl)aminopropyltrimethoxysilane; vi. (3-aminopropyl)triethoxy-silane; and vii. A compound selected from: (3-aminopropyl)silanetriol; and A composition is provided that includes a compound selected from tetramethylammonium silicate and tetraethyl orthosilicate.

[0015] In one embodiment, the composition of this aspect further comprises 4-(3-phenylpropyl)pyridine.

[0016] In one embodiment of this aspect, the composition comprises (3-aminopropyl)silanetriol; tetramethylammonium silicate; phosphoric acid; 4-(3-phenylpropyl)pyridine, dodecylbenzenesulfonic acid; and 4-octylbenzenesulfonic acid.

[0017] The compositions of the present invention utilize at least one compound that functions as a polysilicon inhibitor during the selective etching of silicon nitride in the presence of polysilicon. In this regard, we have identified a number of compounds that may serve this purpose of polysilicon corrosion inhibition, some of which may be classified as surfactants. In general, polysilicon corrosion inhibitor compounds include linear and branched surfactants. C8~C 16 Alkylbenzene sulfonate and C6-C 12 Alkyl diphenyl oxide disulfonic acids are selected from the group consisting of: Hexyldiphenyloxide disulfonic acid (CAS No. 147732-59-0), Tetrapropyl-(sulfophenoxy)-benzenesulfonic acid (CAS No. 119345-03-8, also known as sulfonated (a) benzene, 1,1-oxybis-, tetrapropylene derivatives, sulfonated and (b) 1,1'-oxybisbenzene tetrapropylene derivatives, sulfonated), Dodecylbenzenesulfonic acid (CAS No. 121-65-3), and 4-Octylbenzenesulfonic acid (CAS No. 17012-98-5) Includes:

[0018] These polysilicon corrosion inhibitor compounds have the formula Si[phenyl-(-CH2-) x ] n (OR) m or a compound of formula (I), the prevention of corrosion of polysilicon surfaces can be enhanced beyond that possible by utilizing either component alone. Thus, the compositions of the present invention are useful as etching compositions in the selective etching or removal of silicon nitride films on some microelectronic devices.

[0019] As used herein, the term "microelectronic device" (or "microelectronic device substrate", or simply "substrate") is used consistent with the commonly understood meaning of this term in the electronics, microelectronics, and semiconductor manufacturing arts, e.g., It refers to any of a variety of different kinds: semiconductor substrates; integrated circuits; solid state storage devices; hard memory disks; read, write, read-write heads and their mechanical or electronic components; flat panel displays; phase change memory devices; solar panels and other products that contain one or more solar cell devices; photovoltaic cells; and microelectromechanical systems (MEMS) manufactured for use in microelectronics, integrated circuit, energy harvesting, or computer chip applications. It should be understood that the term "microelectronic device" can refer to any in-process microelectronic device or microelectronic device substrate that contains, or is being prepared to contain, functional electronic (current carrying) structures, functional semiconductor structures, and insulating structures for ultimate electronic utilization in a microelectronic device or microelectronic assembly.

[0020] As used herein, the term "silicon nitride" is intended to mean something consistent with the meaning of the term as used in the microelectronics and semiconductor manufacturing industries. Consistent therewith, silicon nitride refers to materials including thin films made of amorphous silicon nitride with industrially useful low levels of other materials or impurities, and potentially variations close to the nominal stoichiometry of Si3N4. Silicon nitride may be present as a functional feature of a device, for example as a barrier or insulating layer, as part of a microelectronic device substrate, or to function as a material that facilitates a multi-step manufacturing process for preparing a microelectronic device.

[0021] As used herein, the term "silicon oxide" refers to a material consistent with the meaning of the term used in the microelectronics and semiconductor manufacturing industries. Consistent therewith, silicon oxide refers to silicon oxide (SiO x ), e.g., SiO2, "thermal oxide" (ThO x) and the like. The silicon oxide can be disposed on the substrate by any method, for example, by chemical vapor deposition from TEOS or another source, or by thermal evaporation. The silicon oxide can advantageously contain low levels of other materials or impurities that are commercially useful. Silicon oxide can be present as a feature of a microelectronic device, for example, as an insulating layer, as part of a microelectronic device substrate.

[0022] As used herein, "polysilicon" or polycrystalline Si or poly-Si is understood by those skilled in the art to be a polycrystalline form of silicon consisting of multiple small silicon crystals. It is typically deposited using low pressure chemical vapor deposition (LPCVD) and is often doped n-type or p-type polysilicon. As will be readily understood by those skilled in the art, the degree of doping can range from lightly doped (e.g., 10 13 cm -3 ~10 18 cm -3 range) to highly doped (e.g., 10 18 cm -3 The doping rate can vary from 0.1 to 1.0 (up to 1.0 n-type doped materials). Examples of p-type doped materials include polysilicon doped with a dopant species from Group IIIA of the periodic table, such as boron, aluminum, gallium and / or indium. An n-type doped material can be, for example, polysilicon doped with a dopant species from Group IV of the periodic table (silicon, germanium, or tin) or a dopant species from Group V of the periodic table (phosphorus, arsenic, antimony, or bismuth).

[0023] Some etching composition embodiments include: aqueous phosphoric acid (e.g., concentrated phosphoric acid and optionally an amount of added water); a polysilicon corrosion inhibitor compound; and a compound of the formula Si(phenyl) in an amount effective to improve the etch rate of silicon nitride or the selectivity of silicon nitride to polysilicon. n (OR) mor a compound of formula (I); and optionally a composition in the form of an aqueous solution comprising, consisting essentially of, or consisting of an effective amount of a fluoride compound and / or optionally dissolved silica to provide the desired etching (including a useful or advantageous etching rate) of silicon nitride. These and other example compositions may comprise, consist of, or consist essentially of the listed ingredients and optional ingredients. As a general convention throughout this description, compositions of matter such as the described etching compositions, or ingredients or components thereof, are said to "consist essentially of" a particular group of ingredients or materials, referring to compositions containing the particular ingredient or material together with minor or insignificant amounts or less of other ingredients or materials, e.g., 5, 2, 1, 0.5, 0.1, or 0.05 parts by weight or less of other ingredients or materials. For example: the described aqueous phosphoric acid; polysilicon corrosion inhibitor compounds; formula Si(phenyl) n (OR) m or a compound of formula (I); and optional ingredients means an etching composition that contains these ingredients and not more than 5, 2, 1, 0.5, 0.1, or 0.05 parts by weight of any other dissolved or insoluble material or materials (singly or as a whole) other than the specified material.

[0024] The etching composition includes an amount of aqueous phosphoric acid (e.g., concentrated phosphoric acid) effective to effect the desired etching of silicon nitride. The term "aqueous phosphoric acid" refers to a source of the etching composition that is mixed or combined with other sources of the etching composition to form the etching composition. The term "phosphoric acid solids" refers to the non-aqueous components of the aqueous phosphoric acid source or the non-aqueous components of the etching composition prepared from the aqueous phosphoric acid source.

[0025] The amount of phosphoric acid solids contained in the etching composition may be an amount that, in combination with other materials of the etching composition, provides the desired etching performance, including the desired silicon nitride etch rate and selectivity, which typically requires a relatively high amount (concentration) of phosphoric acid solids. For example, the etching composition may contain an amount of phosphoric acid solids of at least about 50 weight percent based on the total weight of the etching composition, such as at least 70, or at least about 80 or 85 weight percent based on the total weight of the etching composition.

[0026] To provide the desired amount of phosphoric acid solids, the composition may contain "concentrated" phosphoric acid as a source that is mixed or combined with other sources (optionally water and one source in some form) to provide the etching composition. "Concentrated" phosphoric acid refers to an aqueous phosphoric acid source that contains a large or maximum amount of phosphoric acid solids in the presence of a small or minimum amount of water and is substantially free of other sources (e.g., less than 0.5 or 0.1 weight percent of any non-water or non-phosphoric acid solid material). Concentrated phosphoric acid can be considered to typically contain at least about 80 or 85 weight percent phosphoric acid solids in about 15 or 20 weight percent water. Alternatively, the etching composition may be considered to include a quantity of concentrated phosphoric acid diluted with water or an equivalent formed in any manner, for example, meaning concentrated phosphoric acid diluted with a quantity of water before or after combination with other sources of the etching composition. Alternatively, the source of the etching composition may be concentrated or dilute phosphoric acid, and the etching composition may contain an additional amount of water provided to the etching composition, either as a component of a different source or as a separate water source.

[0027] By way of example, when concentrated phosphoric acid is used to form the composition, the amount of concentrated phosphoric acid (85 weight percent in water) can be at least 60, e.g., at least 80, or at least 90, 93, 95, or at least 98 weight percent of the etching composition, based on the total weight etching composition.

[0028] As used herein, the term "fluoride compound" refers to a number of etchants that are optionally added to increase the etch rate of silicon nitride. Such compounds include, but are not limited to, HF, ammonium fluoride, tetrafluoroboric acid, hexafluorosilicic acid, BF or other compounds containing Si-F bonds, tetrabutylammonium tetrafluoroborate (TBA-BF4), tetraalkylammonium fluorides (NR1R2R3R4F), and combinations thereof. In one embodiment, the fluoride compound is selected from HF, ammonium fluoride, tetrafluoroboric acid, hexafluorosilicic acid, tetrabutylammonium tetrafluoroborate, tetra(C1-C6 alkyl)ammonium fluoride, and combinations thereof.

[0029] The amount of optional fluoride compound contained in the composition of the present invention may be an amount that, in combination with other materials of the etching composition, provides the desired etching performance, including the desired silicon nitride etch rate and selectivity. For example, the etching composition may contain an amount of fluoride source compound in the range of about 5 to 10,000 or even up to 50,000 ppm (i.e., 0.0005 to 1 or even 5 weight percent) based on the total weight of the etching composition, such as about 20 to 2,000 ppm (i.e., 0.002 to 0.2 weight percent) based on the total weight of the etching composition. In some embodiments, the composition is free or substantially free of such fluoride compounds. "Substantially free" is defined herein as less than 2 weight percent, less than 1 weight percent, less than 0.5 weight percent, or less than 0.1 weight percent in some embodiments. "Free" is intended in some embodiments to correspond to less than 0.001 weight percent in consideration of environmental contamination, and in other embodiments to correspond to 0.0 weight percent.

[0030] Optionally, the compositions of the present invention can further include an amount of silica dissolved in phosphoric acid ("added silica"), for example, by dissolving a solid silica material in phosphoric acid or by adding a soluble silicon-containing compound capable of forming dissolved silica by reaction with aqueous phosphoric acid, examples of such compounds include (a) TMAS (tetramethylammonium silicate), (b) tetraacetoxysilane, or (c) tetraalkoxysilanes, such as tetramethoxysilane, tetraethoxysilane, etc. The dissolved silica can be effective to improve the selectivity of the etching composition to silicon nitride. The amount can be any useful amount that does not result in supersaturation of the pretreatment silica at the conditions of the etching process, such as about 5 to 10,000 ppm of dissolved silica or soluble silicon-containing compound based on the total weight of the etching composition, or about 20 to 5,000, 3,000, 1,000, or 500 ppm based on the total weight of the etching composition.

[0031] In some embodiments, the compositions of the present invention may further comprise at least one silane selected from (a) an alkylaminoalkoxysilane and (b) an alkylaminohydroxylsilane, where the silane has at least one moiety selected from alkoxy and hydroxyl. In one embodiment, the alkylaminoalkoxysilane and alkylaminohydroxylsilane compounds are N-(3-trimethoxysilylpropyl)diethylenetriamine (CAS number 35141-30-1); N-(2-aminoethyl)-3-aminopropyltriethoxysilane (CAS No. 5089-72-5); N-(2-aminoethyl)-3-aminopropylsilanetriol (CAS No. 1760-24-3); N 1 -(3-trimethoxysilylpropyl)diethylenetriamine (CAS No. 35141-30-1); N-(6-aminohexyl)aminopropyltrimethoxysilane (CAS No. 51895-58-0); (3-aminopropyl)triethoxy-silane (CAS No. 919-30-2), also known as "APTES"; and (3-Aminopropyl)silanetriol (CAS No. 58160-99-9), also known as "APST" is selected from.

[0032] The etching composition may contain water from one or more sources. For example, water will be present in the aqueous phosphoric acid feedstock. Additionally, water may be used as a carrier for one or more other ingredients of the composition, or water may be added alone as an ingredient in itself. The amount of water should be sufficiently low so that the composition exhibits desired or preferred or advantageous performance characteristics, including a useful (sufficiently high) silicon nitride etch rate. More water present will tend to increase the silicon nitride etch rate, but may also lower the boiling point of the composition, thereby lowering the use temperature of the composition, which is counterproductive. Exemplary amounts of water from all sources in the etching composition may be less than about 50, 40, or 30 weight percent, such as from about 5 weight percent to about 25 weight percent water based on the total weight of the etching composition, or from about 10 to 20 weight percent water based on the total weight of the etching composition.

[0033] In some embodiments, the compositions of the present invention do not require or may exclude other types of ingredients not typically included in etching compositions, such as solid materials such as pH adjusters and abrasives.

[0034] The compositions of the present invention can be prepared by any method useful for producing the described etching compositions. By one method, aqueous or solid ingredients can be combined, optionally with heating, and mixed to homogenize.

[0035] As mentioned above, the composition described can be useful for the method of removing silicon nitride from the surface of a microelectronic device substrate.The substrate can contain other materials useful for microelectronic devices, such as one or more of insulators, barrier layers, conductive materials, semiconducting materials, or materials useful for processing microelectronic devices (e.g., photoresist, mask, among others).The substrate of the example has a surface that includes silicon nitride, thermal oxide (ThOx) and PETEOS (oxide deposited using plasma-enhanced tetraethyl orthosilicate) and polysilicon.

[0036] The compositions of the present invention, when used, can provide useful etching performance based on commercial performance demands and expectations, and can provide improved performance in terms of silicon nitride etch rate and selectivity to polysilicon as compared to comparative etching compositions.

[0037] Thus, in another aspect, the present invention provides a method of etching a silicon nitride surface on a microelectronic device substrate that includes a surface comprising polysilicon, the method comprising: Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 alkyldiphenyloxide disulfonic acids; and compounds of the formula Si[phenyl-(-CH2-) x ] n (OR) m wherein n is 1, 2, or 3, m is 1, 2, or 3, the sum of n and m is 4, and x is 0, 1, 2, or 3, and wherein each R is independently selected from C1-C4 alkyl; and a method is provided comprising providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with the composition under conditions effective to etch the silicon nitride.

[0038] In one embodiment, the present invention provides a method of etching a silicon nitride surface on a microelectronic device substrate that includes a surface comprising polysilicon, comprising: Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 alkyldiphenyloxide disulfonic acids; and compounds of formula (I): providing a composition comprising a compound of formula: TIFF0007657328000002.tif57170, wherein each R is independently selected from C1-C4 alkyl; A method is provided that includes providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with a composition under conditions effective to etch the silicon nitride.

[0039] In another aspect, the invention provides a method of etching a silicon nitride surface on a microelectronic device substrate that includes a surface comprising polysilicon, the method comprising: Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; i. N-(3-trimethoxysilylpropyl)diethylenetriamine; i. N-(2-aminoethyl)-3-aminopropyltriethoxysilane; iii. N-(2-aminoethyl)-3-aminopropyl silanetriol; iv. N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; v. N-(6-aminohexyl)aminopropyltrimethoxysilane; vi. (3-aminopropyl)triethoxy-silane; and vii. A compound selected from (3-aminopropyl)silanetriol; and providing a composition comprising a compound selected from tetramethylammonium silicate and tetraethyl orthosilicate; A method is provided that includes providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with a composition under conditions effective to etch the silicon nitride.

[0040] The silicon nitride etch process is effective to at least partially remove the silicon nitride on the surface of the microelectronic device substrate, the phrase "at least partially remove" corresponding to removal of at least about 85%, at least 90%, at least 95%, or at least about 99% of the silicon nitride present on the device prior to particle removal.

[0041] The method can be carried out in known commercially available equipment. In general, to etch a substrate to selectively remove material on a surface of the substrate, an etching composition is applied to the surface and contacted with the surface structures to selectively remove some structures chemically.

[0042] Because the composition is designed to etch oxides very slowly, there are cases where the silicon nitride film has a thin oxide surface that can inhibit the etching process. In such cases, a very brief treatment with dilute HF may be an advantageous first process step.

[0043] In the etching process, the composition can be applied to the surface by any suitable method, such as by spraying the composition onto the surface; by immersing the substrate in the etching composition (in a static or dynamic volume of the composition); by contacting the surface with another material, such as a pad or fibrous absorbent application element, in which the etching composition has been absorbed; by contacting the substrate with a volume of the etching composition in a circulating pool; or by any other suitable means, method or technique that removes and contacts the etching composition with the surface of silicon-germanium and silicon-containing microelectronic substrates. Application can be made in batch or single-wafer equipment for dynamic or static cleaning.

[0044] Useful etching process conditions (e.g., time and temperature) may be any that have been found to be effective or advantageous. In general, the etching composition is contacted with the surface, for example, by immersion in a bath of the etching composition, for a time sufficient to selectively remove silicon nitride. The exposure time to the etching composition and the temperature of the etching composition may be effective to remove the desired amount of silicon nitride from the surface of the substrate. The time of the etching step should not be too short, since it would mean that the etching rate of silicon nitride may be too high, which would make process control difficult and may result in poor quality of the microelectronic device at the end of the etching step. Of course, it is preferred that the time required for the etching step is not too long to allow good efficiency and throughput of the etching process and the semiconductor manufacturing line. Examples of useful times for the etching step may range from about 5 minutes to about 300 minutes, or from about 10 minutes to about 60 minutes, at temperatures ranging from about 100° C. to about 180° C. Such contact times and temperatures are exemplary, and any other suitable time and temperature conditions effective to achieve the required removal selectivity may be used.

[0045] The etching process herein may be useful for etching silicon nitride material from the surface of any type of substrate. According to certain embodiments, the substrate may include alternating thin film layers of silicon nitride as structural features of the substrate, which may include alternating thin film layers of silicon oxide and dielectrics such as polysilicon, conductive metal silicides, and zirconium oxide or aluminum oxide and silicon nitride layers. The substrate prior to the etching process includes alternating layers of silicon nitride disposed in openings between high aspect ratio silicon oxide structures. In the etching process, the silicon nitride is removed to leave silicon oxide layers with openings or "slits" separating the silicon oxide layers, as shown in the substrate on the right side of FIG. 1. According to the present specification, the substrate shown in FIG. 1 may be etched using an etching process as illustrated in FIG. 1. The example etching processes can significantly increase the SiN etch rate, exhibit good selectivity to silicon oxide of greater than about 150, or 200, or 300, and in some embodiments, at least about 2000, as compared to prior art and comparable etching compositions and etching processes, and avoid significant silica redeposition (as evidenced by closing or nearly closing the slit openings).

[0046] After selective etching of the desired amount of silicon nitride is complete, the etching composition remaining on the surface of the etched microelectronic device may be removed from the surface by any desired useful method, such as rinsing, cleaning, or other removal step using water (or optionally phosphoric acid followed by water). For example, after etching, the microelectronic device substrate may be rinsed with a rinse of deionized water (e.g., at a temperature ranging from about 20 to about 90° C.), followed by drying, such as spin drying, N2, steam drying, etc. After rinsing, the substrate surface may be measured for the presence and amount of particles on the surface.

[0047] The compositions described herein can be easily formulated by simply adding each ingredient and mixing until homogeneous. Additionally, the compositions can be easily formulated as single package formulations or multi-part formulations that are mixed at or before use, with multi-part formulations being preferred. The individual parts of the multi-part formulation may be mixed at the tool or in a mixing area / zone such as an in-line mixer or in a storage tank upstream of the tool. It is contemplated that the various parts of the multi-part formulation that form the desired composition when mixed together may contain any combination of ingredients / components. It will be understood that the concentration of each ingredient may vary widely in certain semi-aqueous compositions, i.e., may be more dilute or more concentrated, and that the semi-aqueous composition may variously and alternatively comprise, consist of, or consist essentially of any combination of component ingredients consistent with the disclosure herein.

[0048] Thus, in a third aspect, the present invention provides a kit comprising one or more components adapted to form a composition as described herein in one or more containers. The container of the kit should be suitable for storing and transporting the semi-aqueous composition components, for example, NOWPak® containers (Advanced Technology Materials, Inc., Danbury, Connecticut, USA). The one or more containers containing the components of the composition preferably include a means for fluid communication for blending and dispensing the components in the one or more containers. For example, with respect to NOWPak® containers, gas pressure can be applied to the outside of a liner in the one or more containers to expel at least a portion of the contents of the liner, thereby allowing fluid communication for blending and dispensing. Alternatively, gas pressure can be applied to the head space of a conventional pressurizable container, or a pump can be used to allow fluid communication. In addition, the system preferably includes a dispense port for dispensing the blended composition to a process tool.

[0049] To manufacture the liner for the one or more containers, a substantially chemically inert, impurity-free, flexible and elastic polymeric film material, such as high density polyethylene, can be used. Desirable liner materials are generally processed without the need for coextrusion or barrier layers and without any pigments, UV inhibitors, or processing agents that may adversely affect the purity requirements of the components disposed in the liner. Desirable liner materials include films including virgin (additive-free) polyethylene, virgin polytetrafluoroethylene (PTFE), polypropylene, polyurethane, polyvinylidene chloride, polyvinyl chloride, polyacetal, polystyrene, polyacrylonitrile, polybutylene, and the like. Preferred thicknesses of such liner materials range from about 5 mils (0.005 inches) to about 30 mils (0.030 inches), for example, 20 mils (0.020 inches) thick.

[0050] With regard to containers for kits, the disclosures of the following patents and patent applications are incorporated herein by reference in their entirety: U.S. Pat. No. 7,188,644, entitled "APPARATUS AND METHOD FOR MINIMIZING THE GENERATION OF PARTICLES IN ULTRAPURE LIQUIDS"; and U.S. Pat. No. 6,698,619, entitled "RETURNABLE AND REUSABLE, BAG-IN-DRUM FLUID STORAGE AND DISPENSING CONTAINER SYSTEM." EXAMPLES

[0051] Formulation by Weight Percentage TIFF0007657328000003.tif109170Description: 3-APST = (3-aminopropyl)trimethoxysilane (CAS No. 58160-99-9) DIW = deionized water TMAS = Tetramethylammonium silicate (CAS No. 53116-81-7) PTMOS = Phenyltrimethoxysilane (CAS No. 2996-92-1) DBA-40 = Tetrapropyl-(sulfophenoxy)-benzenesulfonic acid (CAS No. 119345-03-8), *Highly phosphorus-doped polysilicon etching rate

[0052] Example K composition: 27.5 weight percent (3-aminopropyl) silanetriol 18 weight percent tetramethylammonium silicate 89% phosphoric acid 0.5 weight percent 4-(3-phenylpropyl)pyridine 0.5% dodecylbenzylsulfonic acid in 5 weight percent phosphoric acid 0.15 weight percent 4-octylbenzyl sulfonic acid Etch Rate Results: SiNx 123.1 (Å / min) SiOx 0.23 (Å / min) * Doped polysilicon 0.10 (Å / min)

[0053] Heavily phosphorus-doped polysilicon was first exposed to a 100:1 HF solution for 60 seconds to remove surface oxide. It was then exposed to a selective silicon nitride formulation at 160°C for 30 minutes and rinsed with hot deionized water. Spectroscopic ellipsometry was used to measure the polysilicon thickness before and after processing.

[0054] These formulations required boiling off the water to reach 160° C. Alternatively, the formulations can be made using less water.

[0055] Examples 1 to 9 TIFF0007657328000004.tif91170Description: ◎ : High suppression of poly-Si 0: Good △: Slightly effective DDBSA: Dodecyl benzyl sulfonic acid OBSA: 4-octylbenzylsulfonic acid

[0056] Polysilicon etch rate study conditions: 160°C; SiNx and SiOx 1800 s; poly-Si 7000 s.

[0057] Aspects In a first aspect, the present invention provides a method for producing a method for treating a cancer cell comprising: a. concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; b. Linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; and c. Formula Si[phenyl-(-CH2-) x ] n (OR) m wherein n is 1, 2, or 3; m is 1, 2, or 3; the sum of n and m is 4; and x is 0, 1, 2, or 3; and wherein each R is independently selected from C1-C4 alkyl. A composition comprising:

[0058] In a second aspect, the present invention provides a composition of the first aspect, wherein each R is methyl.

[0059] In a third aspect, the present invention provides a composition of the first aspect, wherein n is 1.

[0060] In a fourth aspect, the present invention provides a method for producing a compound comprising the steps of: Hexyldiphenyloxide disulfonic acid; Tetrapropyl-(sulfophenoxy)-benzenesulfonic acid; Dodecylbenzenesulfonic acid; and 4-Octylbenzenesulfonic acid The composition of the first aspect is provided, wherein the composition is selected from:

[0061] In a fifth aspect, the present invention provides the composition of any one of the first to fourth aspects, further comprising added silica.

[0062] In a sixth aspect, the present invention provides the composition of any one of the first to fourth aspects, further comprising at least one silane selected from (a) an alkylaminoalkoxysilane and (b) an alkylaminohydroxylsilane, the silane having at least one moiety selected from an alkoxy and a hydroxyl.

[0063] In a seventh aspect, the present invention provides a method for producing a composition comprising the steps of: N-(3-trimethoxysilylpropyl)diethylenetriamine; N-(2-aminoethyl)-3-aminopropyltriethoxysilane; N-(2-aminoethyl)-3-aminopropylsilanetriol; N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; N-(6-aminohexyl)aminopropyltrimethoxysilane; (3-aminopropyl)triethoxy-silane; and (3-aminopropyl)silanetriol The composition of any one of the first to fourth aspects is provided, further comprising a compound selected from:

[0064] In an eighth aspect, the present invention provides the composition of any one of the first to fourth aspects, further comprising tetramethylammonium silicate and (3-aminopropyl)silanetriol.

[0065] In a ninth aspect, the present invention provides the composition of any one of the first to fourth aspects, further comprising tetramethylammonium silicate.

[0066] In a tenth aspect, the present invention provides a method for producing a composition comprising: a. concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; b. Linear and branched C8-C16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; and c. Expression TIFF0007657328000005.tif50170, wherein each R is independently selected from C1-C4 alkyl. A composition comprising:

[0067] In an eleventh aspect, the present invention provides the composition of the tenth aspect, wherein each R is methyl.

[0068] In a twelfth aspect, the present invention provides a method for preparing a compound comprising the steps of: Hexyldiphenyloxide disulfonic acid; Tetrapropyl-(sulfophenoxy)-benzenesulfonic acid; Dodecylbenzenesulfonic acid; and 4-Octylbenzenesulfonic acid The composition of the tenth or eleventh aspect is provided, wherein the composition is selected from the group consisting of

[0069] In a thirteenth aspect, the present invention provides a method for producing a composition comprising the steps of: N-(3-trimethoxysilylpropyl)diethylenetriamine; N-(2-aminoethyl)-3-aminopropyltriethoxysilane; N-(2-aminoethyl)-3-aminopropylsilanetriol; N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; N-(6-aminohexyl)aminopropyltrimethoxysilane; (3-aminopropyl)triethoxy-silane; and (3-aminopropyl)silanetriol The composition of any one of the tenth, eleventh or twelfth aspects is provided, further comprising a compound selected from:

[0070] In a fourteenth aspect, the present invention provides a composition of any one of the tenth, eleventh or twelfth aspects, further comprising tetramethylammonium silicate and (3-aminopropyl)silanetriol.

[0071] In a fifteenth aspect, the present invention provides a method of etching a silicon nitride surface on a microelectronic device substrate that includes a surface comprising polysilicon, comprising: a. concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; b. Linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; and c. Formula Si[phenyl-(-CH2-) x ] n (OR) m wherein n is 1, 2, or 3; m is 1, 2, or 3; the sum of n and m is 4; and x is 0, 1, 2, or 3; and wherein each R is independently selected from C1-C4 alkyl: providing a composition comprising: A method is provided that includes providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with a composition under conditions effective to etch the silicon nitride.

[0072] In a sixteenth aspect, the present invention provides the method of the fifteenth aspect, wherein R is methyl.

[0073] In a seventeenth aspect, the present invention provides a method for producing a composition comprising the steps of: Hexyldiphenyloxide disulfonic acid; Dodecyldiphenyloxide disulfonic acid; Dodecylbenzenesulfonic acid; and 4-Octylbenzenesulfonic acid The method of the fifteenth or sixteenth aspect is provided, wherein the fifteenth or sixteenth aspect is selected from the group consisting of

[0074] In an eighteenth aspect, the present invention provides a compound according to the present invention, wherein c. is of the formula TIFF0007657328000006.tif50170, wherein each R is selected from C1-C4 alkyl.

[0075] In a nineteenth aspect, the present invention provides the method of any one of the fifteenth to eighteenth aspects, wherein each R is methyl.

[0076] In a twentieth aspect, the present invention provides a method for producing a composition comprising the steps of: Hexyldiphenyloxide disulfonic acid; Tetrapropyl-(sulfophenoxy)-benzenesulfonic acid; Dodecylbenzenesulfonic acid; and 4-Octylbenzenesulfonic acid The method of any one of the fifteenth to nineteenth aspects is provided, wherein the method is selected from the group consisting of:

[0077] In a twenty-first aspect, the present invention provides the method of any one of the fifteenth to twentieth aspects, further comprising at least one silane selected from (a) an alkylaminoalkoxysilane and (b) an alkylaminohydroxylsilane, the silane having at least one moiety selected from an alkoxy and a hydroxyl.

[0078] In a twenty-second aspect, the present invention provides a method for producing a composition comprising the steps of: N-(3-trimethoxysilylpropyl)diethylenetriamine; N-(2-aminoethyl)-3-aminopropyltriethoxysilane; N-(2-aminoethyl)-3-aminopropylsilanetriol; N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; N-(6-aminohexyl)aminopropyltrimethoxysilane; (3-aminopropyl)triethoxy-silane; and (3-aminopropyl)silanetriol The method of any one of the fifteenth to twentieth aspects is provided, further comprising a compound selected from:

[0079] In a twenty-third aspect, the present invention provides the method of any one of the fifteenth to twentieth aspects, further comprising added silica.

[0080] In a twenty-fourth aspect, the present invention provides the method of the fifteenth aspect, further comprising tetramethylammonium silicate and (3-aminopropyl)silanetriol.

[0081] In a twenty-fifth aspect, the present invention provides the method of the fifteenth aspect, further comprising tetramethylammonium silicate.

[0082] In a twenty-sixth aspect, the present invention provides a method for producing a composition comprising: a. concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; b. Linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; c. i. N-(3-trimethoxysilylpropyl)diethylenetriamine; ii. N-(2-aminoethyl)-3-aminopropyltriethoxysilane; iii. N-(2-aminoethyl)-3-aminopropyl silanetriol; iv. N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; v. N-(6-aminohexyl)aminopropyltrimethoxysilane; vi. (3-aminopropyl)triethoxy-silane; and vii. A compound selected from: (3-aminopropyl)silanetriol; and d. A compound selected from tetramethylammonium silicate and tetraethyl orthosilicate. A composition comprising:

[0083] In a twenty-seventh aspect, the present invention provides a composition of the twenty-sixth aspect, further comprising e. 4-(3-phenylpropyl)pyridine.

[0084] In a twenty-eighth aspect, the present invention provides a composition of the twenty-sixth aspect, comprising (3-aminopropyl)silanetriol; tetramethylammonium silicate, phosphoric acid, 4-(3-phenylpropyl)pyridine, dodecylbenzenlsulfonic acid, and 4-octylbenzenesulfonic acid.

[0085] In a twenty-ninth aspect, the present invention provides a method of etching a silicon nitride surface on a microelectronic device substrate including a surface comprising polysilicon, comprising: a. concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; b. Linear and branched C8-C 16 Alkylbenzene sulfonate and C6-C 12 A compound selected from alkyldiphenyloxide disulfonic acids; c. i. N-(3-trimethoxysilylpropyl)diethylenetriamine; ii. N-(2-aminoethyl)-3-aminopropyltriethoxysilane; iii. N-(2-aminoethyl)-3-aminopropyl silanetriol; iv. N 1 -(3-trimethoxysilylpropyl)diethylenetriamine; v. N-(6-aminohexyl)aminopropyltrimethoxysilane; vi. (3-aminopropyl)triethoxy-silane; and vii. A compound selected from (3-aminopropyl)silanetriol; and d. A compound selected from tetramethylammonium silicate and tetraethyl orthosilicate. The present invention provides a method comprising providing a composition comprising:

[0086] In a thirtieth aspect, the present invention provides the method of the twenty-ninth aspect, wherein the composition further comprises 4-(3-phenylpropyl)pyridine.

[0087] In a thirty-first aspect, the present invention provides a method of etching a silicon nitride surface on a microelectronic device substrate including a surface comprising polysilicon, comprising: (3-aminopropyl)silanetriol; Tetramethylammonium silicate; phosphoric acid; 4-(3-phenylpropyl)pyridine; Dodecylbenzenesulfonic acid; and 4-Octylbenzenesulfonic acid: providing a composition comprising: A method is provided that includes providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with a composition under conditions effective to etch the silicon nitride.

[0088] In a thirty-second aspect, the present invention provides a kit comprising in one or more containers one or more components a., b., c., d., and / or e. as described in any one of the first to fourteenth aspects or the twenty-sixth or twenty-eighth aspects.

[0089] Having thus described several exemplary embodiments of the present disclosure, it will be readily apparent to one skilled in the art that still other embodiments may be made and used within the scope of the appended claims. Many advantages of the present disclosure covered in this document have been set forth in the foregoing description. It should be understood, however, that the present disclosure is, in many respects, only illustrative. The scope of the present disclosure is, of course, defined in the language set forth in the appended claims.

Claims

1. Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C ８ ~C １６ Alkylbenzene sulfonic acid and C ６ ~C １２ alkyldiphenyloxide disulfonic acids; ２ -) ｘ ] ｎ (OR) ｍ wherein n is 1, 2, or 3; m is 1, 2, or 3; the sum of n and m is 4; x is 0, 1, 2, or 3; and wherein each R is independently C １ ~C ４ alkyl]; and a compound selected from N-(3-trimethoxysilylpropyl)diethylenetriamine, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropylsilanetriol, N 1 -(3-trimethoxysilylpropyl)diethylenetriamine, N-(6-aminohexyl)aminopropyltrimethoxysilane, (3-aminopropyl)triethoxy-silane, and (3-aminopropyl)silanetriol.

2. 10. The composition of claim 1, further comprising at least one silane selected from (a) an alkylaminoalkoxysilane and (b) an alkylaminohydroxylsilane, the silane having at least one moiety selected from an alkoxy and a hydroxyl.

3. Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C ８ ~C １６ Alkylbenzene sulfonic acid and C ６ ~C １２ Compounds selected from alkyldiphenyloxide disulfonic acids; wherein each R is independently C １ ~C ４ alkyl]; and a compound selected from N-(3-trimethoxysilylpropyl)diethylenetriamine, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropylsilanetriol, N 1 -(3-trimethoxysilylpropyl)diethylenetriamine, N-(6-aminohexyl)aminopropyltrimethoxysilane, (3-aminopropyl)triethoxy-silane, and (3-aminopropyl)silanetriol.

4. 1. A method of etching a silicon nitride surface on a microelectronic device substrate including a surface comprising polysilicon, comprising: Concentrated phosphoric acid in an amount of at least 60 weight percent based on the total weight of the composition; linear and branched C ８ ~C １６ Alkylbenzene sulfonic acid and C ６ ~C １２ alkyldiphenyloxide disulfonic acids; ２ -) ｘ ] ｎ (OR) ｍ wherein n is 1, 2, or 3; m is 1, 2, or 3; the sum of n and m is 4; x is 0, 1, 2, or 3; and wherein each R is independently C １ ~C ４ alkyl]; and a composition comprising a compound selected from N-(3-trimethoxysilylpropyl)diethylenetriamine, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropylsilanetriol, N 1 -(3-trimethoxysilylpropyl)diethylenetriamine, N-(6-aminohexyl)aminopropyltrimethoxysilane, (3-aminopropyl)triethoxy-silane, and (3-aminopropyl)silanetriol; providing a substrate having a surface comprising silicon nitride and a surface comprising polysilicon, and contacting the substrate with the composition under conditions effective to etch the silicon nitride. A method comprising:

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