Sheet defect position detection method, information processing device, sheet defect position detection system, and electronic component production method

Abstract

To provide a method for detecting a defective position in a sheet, capable of appropriately detecting the defective positions of a carrier film and a ceramic green sheet in a post-process.SOLUTION: A sheet defect position detection method includes a defect information acquisition step (step S13) of acquiring defect information of a green sheet film G, a marking step (step S14) of applying a mark to at least one of a carrier film C and the ceramic green sheet, a drying step (step S22) of applying a thermal history to the green sheet film G, a mark information acquisition step (step S31) of acquiring mark information from the green sheet film G after applying the thermal history, and a defect position determination step (step S32) of determining the defect position of the green sheet film G. The defect position determination step (step S32) determines the defect position of the green sheet film G on the basis of defect position information based on the defect information and read mark distance information based on the mark information.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sheet defect position detection method, an information processing device, a sheet defect position detection system, and a method for producing electronic components. [Background technology]

[0002] Conventionally, there is known a multilayer ceramic electronic component manufacturing apparatus including a printing device that prints electrodes on a green sheet. For example, Patent Document 1 discloses an apparatus that prints target marks on a green sheet and performs image processing of the target marks to determine the electrode printing position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-167544 Summary of the Invention [Problem to be solved by the invention]

[0004] Defects may occur in the ceramic green sheet or the carrier film on which the ceramic green sheet is molded during the manufacturing process. However, the device of Patent Document 1 does not take into consideration the possibility of defects occurring in the carrier film or the ceramic green sheet. Therefore, when a defect occurs in the carrier film or the ceramic green sheet, no consideration is given to how to deal with the defect, taking into consideration the process performed on the carrier film or the ceramic green sheet.

[0005] The present invention aims to provide a sheet defect position detection method that takes into account the processes performed on the carrier film and the ceramic green sheet when a defect occurs in at least one of the carrier film and the ceramic green sheet, and is capable of appropriately detecting the defect position in the carrier film and the ceramic green sheet in a subsequent process. [Means for solving the problem]

[0006] The sheet defect position detection method of the present invention includes a sheet molding process for molding a ceramic green sheet on a carrier film; a defect information acquisition process for acquiring information of defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a marking process for imparting a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet; a thermal history imparting process for imparting a thermal history to the ceramic green sheet and the carrier film; a mark information acquisition process for acquiring information of the plurality of marks imparted by the marking process from the plurality of marks imparted to at least one of the carrier film and the ceramic green sheet after the thermal history is imparted by the thermal history imparting process; and a defect position determination process for determining the position of the defect after the thermal history is imparted by the thermal history imparting process, wherein the defect position determination process determines the position of the defect after the thermal history is imparted by the thermal history imparting process based on defect position information based on the information of the defect acquired in the defect information acquisition process and read mark distance information based on the information of the plurality of marks acquired in the mark information acquisition process.

[0007] The information processing device of the present invention is an information processing device for a production system of electronic components, comprising: a sheet molding unit that molds a ceramic green sheet on a carrier film; a defect information acquisition unit that acquires information of defects that have occurred in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a mark imparting unit that imparts a thermal history to at least one of the carrier film and the ceramic green sheet at predetermined intervals after the ceramic green sheet has been molded; a thermal history imparting unit that imparts a thermal history to the ceramic green sheet and the carrier film; and a mark information acquisition unit that acquires information of the multiple marks imparted by the mark imparting unit from the multiple marks imparted to at least one of the carrier film and the ceramic green sheet after the thermal history has been imparted by the thermal history imparting unit, and comprises a defect position determination unit that determines the position of the defect after the thermal history has been imparted by the thermal history imparting unit, and the defect position determination unit determines the position of the defect after the thermal history has been imparted by the thermal history imparting unit based on defect position information based on the information of the defect acquired by the defect information acquisition unit and read mark distance information based on the information of the multiple marks acquired by the mark information acquisition unit.

[0008] The sheet defect position detection system of the present invention is a sheet defect position detection system used in an electronic component production system, comprising a sheet molding unit that molds a ceramic green sheet on a carrier film, and a thermal history imparting unit that imparts a thermal history to the ceramic green sheet and the carrier film, the system comprising a defect information acquisition unit that acquires information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is imparted by the thermal history imparting unit, and a defect information acquisition unit that, before the thermal history is imparted by the thermal history imparting unit, applies multiple defects at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet. the control unit includes a defect position determination unit that determines the position of the defect after the thermal history is imparted by the thermal history imparting unit, and the defect position determination unit determines the position of the defect after the thermal history is imparted by the thermal history imparting unit based on defect position information based on the information of the defect acquired by the defect information acquisition unit and distance information between read marks based on information of the multiple marks acquired by the mark information acquisition unit.

[0009] The method for producing electronic components of the present invention includes a sheet molding step of molding a ceramic green sheet on a carrier film, and a thermal history imparting step of imparting a thermal history to the ceramic green sheet and the carrier film, and includes a defect information acquisition step of acquiring information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is imparted by the thermal history imparting step, a marking step of imparting a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet before the thermal history is imparted by the thermal history imparting step, and a marking step of applying a plurality of marks to the carrier film and the ceramic green sheet after the thermal history is imparted by the thermal history imparting step. The method includes a mark information acquisition process for acquiring information on the multiple marks imparted by the mark imparting process from the multiple marks imparted to at least one of the rear film and the ceramic green sheet, a defect position determination process for determining the position of the defect after the thermal history is imparted by the thermal history imparting process, and a utilization area determination process for determining the area of ​​the ceramic green sheet to be used for the production of electronic components based on the position of the defect determined by the defect position determination process, wherein the defect position determination process determines the position of the defect after the thermal history is imparted by the thermal history imparting process based on defect position information based on the information of the defect acquired in the defect information acquisition process and read mark distance information based on the information of the multiple marks acquired in the mark information acquisition process. Effect of the Invention

[0010] According to the present invention, when a defect occurs in at least one of a carrier film and a ceramic green sheet, a sheet defect position detection method can be provided that takes into account the processes performed on the carrier film and the ceramic green sheet and can appropriately detect the defect position of the carrier film and the ceramic green sheet in a subsequent process. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing a production system for multilayer ceramic electronic components according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a schematic diagram showing a green sheet molding apparatus according to an embodiment of the present invention. [Diagram 3] FIG. 1 is a schematic diagram showing an internal electrode layer printing device according to an embodiment of the present invention. [Figure 4] FIG. 1 is a schematic diagram showing a stacking device according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic diagram showing a cutting device according to an embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram showing an example of a mark provided on a carrier film. [Figure 7] 2 is a block diagram showing a hardware configuration of a control device according to an embodiment of the present invention; FIG. [Figure 8] 2 is a block diagram showing a functional configuration of a control device according to an embodiment of the present invention; FIG. [Figure 9] 10A and 10B are schematic diagrams for explaining the relationship between the mark and the defect position before the thermal history imparting step. [Figure 10] 11 is a schematic diagram for explaining the relationship between the mark and the defect position after the thermal history imparting step. FIG. [Figure 11] 11A and 11B are schematic diagrams for explaining an example of use of post-processing based on defect position information; [Figure 12] 11A and 11B are schematic diagrams for explaining another example of use of post-processing based on defect position information. [Figure 13] 10 is a flowchart illustrating a flow of a sheet creation process. [Figure 14] 10 is a flowchart illustrating a flow of an internal electrode forming step. [Figure 15] 10 is a flowchart for explaining the flow of a laminated block production process. [Figure 16] 10 is a flowchart for explaining a defect mark linking process executed by a control device in a sheet production process. [Figure 17]10 is a flowchart for explaining a defect position determination process executed by a control device in a laminated block production process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] A production system S for multilayer ceramic electronic components according to an embodiment of the present invention will be described below with reference to Figs. 1 to 9. Fig. 1 is a schematic diagram showing a production system S for multilayer ceramic electronic components according to an embodiment of the present invention. The arrows shown in Fig. 1 indicate the flow direction of green sheet films G within the production system S for multilayer ceramic electronic components. In the following description, carrier films C on which ceramic green sheets have been molded will be collectively referred to as green sheet films G.

[0013] The production system S for multilayer ceramic electronic components manufactures electronic components. Specifically, the production system S for multilayer ceramic electronic components manufactures, for example, multilayer ceramic capacitors. The multilayer ceramic capacitor has a laminate including, for example, ceramic layers as a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, and an effective layer portion as a capacitor effective portion is configured in which the plurality of internal electrode layers face each other in the height direction via a dielectric layer. In the capacitor effective portion, a capacitance is formed and the characteristics of the capacitor are expressed. Note that the electronic component is not limited to a multilayer ceramic capacitor.

[0014] A production system S for multilayer ceramic electronic components includes a green sheet molding device 1 as a first device, an internal electrode layer printing device 2, a lamination device 3 as a second device, a cutting device 4, and a sheet defect position detection system S1.

[0015] <Green sheet molding equipment> The green sheet molding apparatus 1 will be described with reference to FIG. 2. FIG. 2 is a schematic diagram showing the green sheet molding apparatus 1 according to one embodiment of the present invention. The green sheet molding apparatus 1 molds a ceramic green sheet on a carrier film C, for example, as shown in FIG. 2. The green sheet molding apparatus 1 has a carrier film supply section 10, a conveying section 11, a sheet molding section 12, a drying section 13, a defect information acquisition section 14, a marking section 15, and a winding section 16. In other words, the winding section 16 is provided in the green sheet molding apparatus 1 as a first device.

[0016] The carrier film supplying unit 10 unwinds the carrier film C wound in a roll and supplies the carrier film C to the inside of the device. As the carrier film C, for example, a PET (polyethylene terephthalate) film is used.

[0017] The conveying section 11 includes a plurality of rollers 110. The carrier film C unwound from the carrier film supplying section 10 is conveyed to the sheet forming section 12 while being tensioned by the plurality of rollers 110 constituting the conveying section 11. Thereafter, a ceramic green sheet is formed on the carrier film C by the sheet forming section 12 described below. The green sheet film G, which is the carrier film C on which the ceramic green sheet has been formed, is conveyed from the sheet forming section 12 to the winding section 16 via the drying section 13, the defect information acquiring section 14, and the marking section 15 while being tensioned by the plurality of rollers 110 constituting the conveying section 11.

[0018] The conveying section 11 further includes a rotary encoder 111 as a movement amount detection section. The rotary encoder 111 detects the movement amount of the carrier film C and the green sheet film G in conjunction with the conveyance of the carrier film C or the green sheet film G.

[0019] The sheet molding unit 12 applies a slurry containing a ceramic material onto a carrier film C, and molds a ceramic green sheet onto the carrier film C. In this embodiment, the slurry containing a ceramic material is applied onto the carrier film C by, for example, a doctor blade method.

[0020] The drying section 13 dries the green sheet film G. In other words, the drying section 13 dries the ceramic green sheet formed on the carrier film C. The drying section 13 has a heating means. The drying section 13 may be, for example, a drying oven.

[0021] The winding unit 16 winds up and collects the green sheet film G in a roll shape. In other words, the winding unit 16 winds up and collects the ceramic green sheet formed on the carrier film C in a roll shape.

[0022] In this embodiment, as described above, the green sheet molding apparatus 1 is provided with the defect information acquisition unit 14 and the marking unit 15. The defect information acquisition unit 14 and the marking unit 15 will be described later in the sheet defect position detection system S1.

[0023] Although the green sheet molding apparatus 1 of the present embodiment is a molding apparatus using a doctor blade method, the present invention is not limited to this.

[0024] <Internal electrode layer printing device> Next, the internal electrode layer printing device 2 will be described with reference to Fig. 3. Fig. 3 is a schematic diagram showing the internal electrode layer printing device 2 according to one embodiment of the present invention. The internal electrode layer printing device 2 prints a conductive paste for an internal electrode layer on a ceramic green sheet molded by the green sheet molding device 1. The internal electrode layer printing device 2 has an unwinding section 20, a conveying section 21, an internal electrode layer printing section 22 as a layer member forming section, a drying section 23 as a heat history imparting section, and a winding section 24.

[0025] The unwinding section 20 unwinds the green sheet film G wound in a roll and supplies the green sheet film G to the inside of the apparatus.

[0026] The conveying section 21 includes a plurality of rollers 210. The green sheet film G unwound from the unwinding section 20 is conveyed to the winding section 24 via the internal electrode layer printing section 22 and the drying section 23 while being subjected to a predetermined tension by the plurality of rollers 210 constituting the conveying section 21.

[0027] The conveying section 21 further includes a rotary encoder 211 as a movement amount detection section. The rotary encoder 211 detects the amount of movement of the green sheet film G in conjunction with the conveyance of the green sheet film G.

[0028] The internal electrode layer printing unit 22 prints a conductive paste for the internal electrode layers on the ceramic green sheets. That is, the internal electrode layer printing unit 22 forms the internal electrode layers as layer members on the ceramic green sheets. In this embodiment, the conductive paste for the internal electrode layers is printed in a predetermined pattern on the ceramic green sheets by screen printing. The conductive paste for the internal electrode layers is printed while being aligned using marks or the like provided by the mark providing unit 15 described later.

[0029] Here, the process of printing the conductive paste for the internal electrode layers on the ceramic green sheets by the internal electrode layer printing unit 22 corresponds to a layer member forming process of forming the internal electrode layers as layer members on the ceramic green sheets. The internal electrode layer printing unit 22 corresponds to the layer member forming unit.

[0030] The drying section 23 dries the conductive paste for the internal electrode layers printed on the green sheet film G. The drying section 23 has a heating means. The drying section 23 may be, for example, a drying oven. Thus, the drying section 23 imparts a thermal history to the ceramic green sheet.

[0031] Here, the drying step by the drying unit 23 corresponds to a thermal history imparting step of imparting a thermal history to the ceramic green sheet. The drying unit 23 corresponds to a thermal history imparting unit.

[0032] The drying section 23 may be provided in the internal electrode layer printing apparatus 2, or may be provided as a separate apparatus from the internal electrode layer printing apparatus 2.

[0033] The winding section 24 winds up the green sheet film G after the conductive paste for the internal electrode layers has been printed into a roll and collects it.

[0034] Although the internal electrode layer printing device 2 in this embodiment is a printing device using a screen printing method, the present invention is not limited to this and may be a printing device using a gravure printing method, for example.

[0035] <Stacking device> Next, the lamination device 3 will be described with reference to FIG. 4. FIG. 4 is a schematic diagram showing a lamination device according to one embodiment of the present invention. The lamination device 3 cuts out the green sheet film G on which the internal electrode layers are printed to a predetermined size, and laminates the cut-out green sheet film G. The lamination device 3 has an unwinding section 30, a conveying section 31, a mark information acquiring section 32, a sheet cutting and laminating section 33, and a winding section 34. In other words, the unwinding section 30 is provided in the lamination device 3 as a second device.

[0036] The unwinding section 30 unwinds the green sheet film G wound in a roll and supplies the green sheet film G to the inside of the apparatus.

[0037] The conveying section 31 includes a plurality of rollers 310. The green sheet film G unwound from the unwinding section is conveyed to the winding section 34 via the mark information acquiring section 32 and the sheet cutting and stacking section 33 while being subjected to a predetermined tension by the plurality of rollers 310 constituting the conveying section 31.

[0038] The conveying section 31 further includes a rotary encoder 311 as a movement amount detection section. The rotary encoder 311 detects the movement amount of the green sheet film G in conjunction with the conveyance of the green sheet film G.

[0039] The sheet cutting and lamination section 33 cuts out the green sheet film G conveyed by the conveyance section 31 to a predetermined size. The green sheet film G is cut out while aligning the position using marks or the like provided by the mark providing section 15 described later. In the sheet cutting and lamination section 33, a plurality of green sheet films G are cut out, and the cut green sheet films G are laminated in a mold and temporarily pressed. This produces a laminated sheet. The laminated sheet is then pressed by a pressing means such as an isostatic press (not shown) to produce an unfired laminated block B shown in FIG. 5. In FIG. 5, the laminated block B is formed by laminating a plurality of layers, but is not shown for the sake of convenience. In the laminated block B, a portion E that is an effective portion of the laminated ceramic capacitor and a portion GA that is a gap that is a non-effective portion are alternately arranged. The lamination device 3 that performs the temporary pressing and the isostatic press (not shown) are separate structures.

[0040] The winding section 34 winds and collects the green sheet film G after being cut out by the sheet cutting and laminating section 33. The collected green sheet film G has the ladder-shaped ceramic green sheet remaining on the carrier film C.

[0041] In this embodiment, the stacking device 3 is provided with a mark information acquiring unit 32. The mark information acquiring unit 32 will be described later in the description of the sheet defect position detecting system.

[0042] <Cutting device> Next, the cutting device 4 will be described with reference to FIG. 5. FIG. 5 is a schematic diagram showing a cutting device according to one embodiment of the present invention. The cutting device 4 is, for example, a dicer. The cutting device 4 cuts the laminated block B supplied from the stacking device 3 to chip size. The cutting device 4 includes a table 40 and a cutting section 41. The laminated block B produced by the stacking device 3 is placed on the table 40. The cutting section 41 cuts the laminated block B placed on the table to a predetermined chip size.

[0043] The cutting unit 41 includes a cutting blade 410 arranged above a table, a holder 411 for fixing the cutting blade 410, a guide 412 for guiding the cutting blade in the cutting direction, and a driving means (not shown) for moving the holder 411 to move the cutting blade 410 in the thickness direction of the laminated block B. The laminated block is cut by the cutting blade 410 moved by the driving means, and laminated chips are cut out.

[0044] <Subsequent process> The laminated chip is then fired to produce a laminate. Then, external electrodes are formed on the laminate. Through these manufacturing steps, a multilayer ceramic capacitor is manufactured as an electronic component.

[0045] <Sheet defect location detection system> Next, the sheet defect position detection system S1 will be described with reference to Figures 1, 2, 4 and 6. Figure 6 is a schematic diagram showing an example of a mark provided on a carrier film C.

[0046] The sheet defect position detection system S1 includes a defect information acquisition unit 14, a mark providing unit 15, a mark information acquisition unit 32, and a control device 5.

[0047] The defect information acquisition unit 14 of this embodiment is provided in the green sheet molding device 1. The defect information acquisition unit 14 acquires defect information of defects occurring in at least one of the carrier film C and the ceramic green sheet molded on the carrier film C. The defect information includes information on the type of defect, such as pinholes, streaks, scratches, and foreign matter, and position information of the defect in the conveying direction and width direction. Hereinafter, a case where a defect occurs in the ceramic green sheet will be described, but even if a defect occurs only in the carrier film C, or if a defect occurs in the carrier film C and the ceramic green sheet, the action and effect described below can be obtained in the same way. In addition, the defect position information according to this embodiment is position information based on a mark applied to the carrier film C by the mark application unit 15 described below. For this reason, the defect position information is associated with a defect identification information ID described below for identifying the reference mark. The defect information acquisition unit 14 is, for example, a camera. The camera as the defect information acquisition unit 14 continuously captures the green sheet film G being conveyed and acquires an image of the green sheet film G including information on defects such as pinholes, streaks, scratches, and foreign matter. The defect information acquisition unit 14 according to this embodiment includes a camera unit 140 and an illumination unit 141, as shown in FIG.

[0048] The marking unit 15 of this embodiment is provided in the green sheet molding apparatus 1. The marking unit 15 provides multiple marks at a predetermined interval P1 on the carrier film C. As shown in FIG. 6, the marking unit 15 according to this embodiment provides multiple marks at a predetermined interval P1 on one end side of the carrier film C in the width direction. In addition, the marking unit 15 provides multiple marks at the predetermined interval P1 based on movement amount information output from a rotary encoder 111 provided in the conveying unit 11 of the green sheet molding apparatus 1. It is preferable that the multiple marks are provided at equal intervals. The predetermined interval P1 may be, for example, 200 mm or more and 1000 mm or less.

[0049] The marking unit 15 in this embodiment is an inkjet type, but is not limited to the inkjet type. The marking unit 15 may be another marking means such as a laser marker. The mark may have a simple geometric shape such as a circle. The mark may include identification information such as a symbol, a character, a barcode, or a two-dimensional code.

[0050] The mark according to this embodiment is a series of symbols and serves as an ID. Specifically, the mark includes an indication A for pitch measurement, reel number information RN, and defect identification information ID, as shown in FIG.

[0051] The display A for pitch measurement is a display for correcting the pitch between marks and the actual feed amount. The reel number information RN is a display for identifying the roll R of each green sheet film G. The reel number information RN is, for example, a decimal or hexadecimal number. The defect identification information ID is a display for identifying the position of a defect in the roll R of each green sheet film G. The ID is, for example, a decimal or hexadecimal number.

[0052] As shown in Figure 6, the marking unit 15 prints multiple marks at a predetermined interval P1 from the roll R side of the carrier film C toward the end, in that order, as one mark.

[0053] The mark information acquiring unit 32 of this embodiment is provided in the lamination device 3. The mark information acquiring step (step S31) by the mark information acquiring unit 32 is performed after the internal electrode layer printing step (step S21) and the drying step (step S22) by the internal electrode layer printing device 2.

[0054] The mark information acquisition unit 32 acquires information on the multiple marks applied in the mark application process. The mark information acquisition unit 32 is, for example, a camera. The camera as the mark information acquisition unit 32 continuously captures images of the green sheet film G being transported and acquires images of the green sheet film G including the mark information. In addition, the mark information acquisition unit 32 acquires information on the multiple marks applied by the mark application unit 15 from the green sheet film G after the thermal history is applied by the drying unit 23.

[0055] Next, a configuration example of the control device 5 as an information processing device will be described with reference to FIG. 7. FIG. 7 is a block diagram showing a hardware configuration of a control device according to an embodiment of the present invention. The control device 5 is a general-purpose computer capable of executing various functions by installing various programs. For example, various functions of the control unit are realized by executing a program (application) stored in a storage unit. The program (application) may be provided via a network, or may be provided by being recorded on a computer-readable recording medium such as a CD-ROM (Compact Disc Read only memory) or a DVD (Digital Versatile Disc). However, the control device 5 is not limited to a general-purpose computer. That is, each function of the control unit may be realized by cooperation between hardware and software, or may be realized only by hardware (electronic circuitry).

[0056] As shown in FIG. 7, the control device 5 includes a processor 50, a ROM (Read Only Memory) 51, a RAM (Random Access Memory) 52, a bus 53, an input / output interface 54, an input unit 55, an output unit 56, a memory unit 57, a communication unit 58, and a power supply unit 59.

[0057] The processor 50 performs, for example, various types of calculations and control processes required for the operation of the control device 5. The processor 50 is, for example, a central processing unit (CPU), a micro processing unit (MPU), a system on a chip (SoC), a digital signal processor (DSP), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a programmable logic device (PLD), a field-programmable gate array (FPGA), or a combination of these. The processor 50 may also be a combination of these processors with a hardware accelerator or the like.

[0058] The processor 50 controls each unit to realize various functions of the control device 5 based on programs such as firmware, system software, and application software stored in the ROM 51 or the RAM 52. The processor 50 also executes processes based on the programs, which will be described later. Note that a part or all of the programs may be incorporated in the circuitry of the processor 50.

[0059] The processor 50, the ROM 51, and the RAM 52 are connected to one another via a bus 53. An input / output interface 54 is also connected to the bus 53. An input unit 55, an output unit 56, a storage unit 57, a communication unit 58, and a power supply unit 59 are connected to the input / output interface 54.

[0060] The storage unit 57 is configured with a recording medium such as a ROM, a hard disk drive (HDD), a solid state drive (SSD), or a removable memory card. Examples of the recording medium include non-transitory tangible media. The storage unit 57 is configured with a main storage device configured with a non-volatile memory such as a ROM or a volatile memory such as a RAM, and an auxiliary storage device configured with a magnetic disk, an optical disk, a magneto-optical disk, or a semiconductor memory. The storage unit 57 stores information related to marks such as defect information, reel number information RN, and defect identification information ID.

[0061] The input unit 55 and the output unit 56 are user interfaces electrically connected to the input / output interface 54 by wire or wirelessly. The input unit 55 is composed of, for example, a touch panel or keys, and inputs various information in response to instructions from an operator. The output unit 56 is composed of, for example, a display that displays images, a speaker, and the like, and outputs images and sounds.

[0062] The communication unit 58 is a device for communicating with the mark information acquisition unit 32 of the lamination device 3 and the defect information acquisition unit 14 and marking unit 15 of the green sheet molding device 1. The communication unit 58 is communicably connected to the defect information acquisition unit 14 and marking unit 15 of the green sheet molding device 1 and the mark information acquisition unit 32 of the lamination device 3. The communication is performed, for example, via the Internet, a LAN (Local Area Network), or a mobile phone network, or a network that is a combination of these. The communication unit 58 may be a device for performing short-distance communication without using a network.

[0063] The communication unit 58 receives and inputs, for example, image information of the ceramic green sheet including defect information captured by the defect information acquisition unit 14, movement amount information of the green sheet film G output from the rotary encoder 111, image information of the green sheet film G including mark information captured by the mark information acquisition unit 32, and movement amount information of the green sheet film G output from the rotary encoder 311.

[0064] The power supply unit 59 is configured to be able to supply power to each unit of the control device 5 by being connected to a power supply (not shown).

[0065] Next, functions realized by the control unit 500 of the control device 5 will be described with reference to Fig. 5. Fig. 8 is a block diagram showing the functional configuration of the control device 5 according to one embodiment of the present invention. As shown in Fig. 8, the control unit 500 of this embodiment has an input processing unit (input control function) 501, an output processing unit (output processing function) 502, a communication processing unit (communication processing function) 503, a defect position detection unit (defect position detection function) 504, a mark distance detection unit (mark distance detection function) 505, and a defect position correction unit (defect position correction function) 506.

[0066] The input processing unit 501 executes a process of accepting an operation by an operator to the input unit 55. For example, the input processing unit 501 executes a process of accepting a management operation of the sheet defect position detection system S1 to the input unit 55 by an operator.

[0067] The output processing unit 502 executes a process for displaying an image on the screen of the output unit 56. For example, the output processing unit 502 executes a process for displaying a management screen of the sheet defect position detection system S1 on the screen of the output unit 56.

[0068] The communication processing unit 503 executes a process for communicating with an external device via the communication unit 58. For example, the communication processing unit 503 executes a process for transmitting and receiving various information to and from the green sheet molding device 1 and the lamination device 3 via the communication unit 58.

[0069] The defect position detection unit 504 detects the position of a defect on the green sheet film G before the thermal history is imparted by the drying unit 13 serving as a thermal history imparting unit.

[0070] Specifically, the defect position detection unit 504 performs image processing on the image information of the green sheet film G captured by the camera serving as the defect information acquisition unit 14, and detects defects such as pinholes, streaks, scratches, and foreign matter on the green sheet film G. Then, based on information including the imaging timing at which the defect was captured and movement amount information output from the rotary encoder 111 provided in the conveying unit 11 of the green sheet molding apparatus 1, the defect position detection unit 504 detects the position of the defect in the conveying direction of the ceramic green sheet.

[0071] More specifically, the defect position detection unit 504 detects a first distance L1 indicating the distance in the ceramic green sheet conveying direction between the mark position at the time of marking, which indicates the position of the mark applied by the mark application unit 15, and the position of the defect based on the defect information acquired by the defect information acquisition unit 14, based on the movement amount information output from the rotary encoder 111 serving as a movement amount detection unit.

[0072] For example, an example will be described with reference to Fig. 9. Fig. 9 is a schematic diagram for explaining the relationship between marks and defect positions. Fig. 9 shows a ceramic green sheet indicated by a hatched area formed on a green sheet film G, marks M1 to 3 attached to one end in the width direction of a portion of a carrier film C on which a ceramic green sheet is not formed, and defects D1 to 7 irregularly occurring on the ceramic green sheet.

[0073] The position of the defect is determined in the conveying direction from the mark A, which is a mark adjacent to the target defect and is located on the roll R side of the unwinding side of the green sheet film G. The position in the width direction is determined by image processing.

[0074] 9, for defects D1 and D2, the adjacent mark on the roll R side of green sheet film G is mark M1. Therefore, the position of defect D1 is calculated as being at a position L1a from mark A of mark M1 in the transport direction of roll R of green sheet film G, using mark A for pitch measurement of mark M1 as a reference. The position of defect D2 is calculated as being at a position L1b from mark A of mark M1 in the transport direction of roll R of green sheet film G, using mark A for pitch measurement of mark M1 as a reference.

[0075] Similarly, the positions of defects D3-5 are calculated as being at positions L1c, L1d, and L1e in the transport direction of the roll R of green sheet film G, using the pitch measurement mark A of mark M2 as a reference. The positions of defects D6 and D7 are calculated as being at positions L1f and L1g in the transport direction of the roll R of green sheet film G, using the pitch measurement mark A of mark M3 as a reference.

[0076] The mark distance detection unit 505 detects the mark distance P2 on the carrier film C after the thermal history has been imparted by the drying unit 23 serving as a thermal history imparting unit, as shown in FIG.

[0077] FIG. 10 is a schematic diagram for explaining the relationship between the mark and the defect position after the thermal history imparting process. In FIG. 10, mark M1' indicates the pitch measurement mark A of mark M1 after the thermal history imparting process. Mark M2' indicates the pitch measurement mark A of mark M2 after the thermal history imparting process. For convenience of explanation, the reel number information RN and the defect identification information ID of marks M1, M1', M2, and M2' are omitted. Also, in FIG. 10, defect D' indicates defect D after the thermal history imparting process. L2 indicates the distance between mark M1 and defect D' in the conveying direction when the distance between mark M1 and defect D in the conveying direction is extended after the thermal history is imparted by the thermal history imparting. Mark distance P2 indicates the mark distance between mark M1' and mark M2' in the conveying direction when the mark distance between marks M1 and M2 imparted at a predetermined interval P1 is extended by the thermal history imparting.

[0078] Specifically, the mark distance detection unit 505 performs image processing on image information of the green sheet film G with multiple marks attached, captured by the camera as the mark information acquisition unit 32, to detect the multiple marks on the carrier film C. Then, based on information including the image capture timing of the multiple marks and movement amount information output from the rotary encoder 311 provided in the conveying unit 31 of the lamination device 3, the read mark distance P2 indicating the distance between the multiple marks in the conveying direction of the carrier film C is detected. As described above, the mark attachment unit 15 attaches marks so that the mark distance is a predetermined interval P1, but the mark distance changes to P2 due to the expansion and contraction of the green sheet film G by the drying unit 23, etc.

[0079] For example, an example will be described with reference to Fig. 9. The mark distance detection unit 505 performs image processing on image information of the green sheet film G to which multiple marks M1-3 are applied, captured by a camera serving as the mark information acquisition unit 32, and detects the multiple marks M1-3 on the carrier film C. Then, based on information including the image capture timing at which the multiple marks M1-3 are captured and movement amount information output from the rotary encoder 311 provided in the transport unit 31 of the lamination device 3, it detects a read mark distance P2 indicating the distance between the multiple marks in the transport direction of the carrier film C.

[0080] The defect position correction unit 506 corrects the position information of the defect detected by the defect position detection unit 504, thereby determining the position of the defect in the ceramic green sheet after the thermal history is imparted by the drying unit 23. Specifically, the defect position correction unit 506 determines the defect position in the ceramic green sheet after the thermal history is imparted by the drying unit 23 based on the first distance L1 detected by the defect position detection unit 504, the mark-to-mark distance P1 at the time of application indicating the distance in the transport direction of the carrier film C between the multiple marks during the mark application process by the mark application unit 15, and the read mark distance P2 detected by the mark distance detection unit 505.

[0081] More specifically, a second distance L2 indicating the distance between the position of the mark based on the mark information acquired by the mark information acquiring unit 32 in the mark information acquiring step and the position of the defect in the ceramic green sheet after the thermal history is imparted by the drying unit 23 is calculated based on L2=L1×P2 / P1, and the position of the defect in the ceramic green sheet after the thermal history is imparted by the thermal history imparting step is determined based on the calculated second distance L2. That is, the position of the defect in the ceramic green sheet after the thermal history is imparted by the thermal history imparting step is determined by correcting the position of the defect before the thermal history is imparted by the thermal history imparting step based on the above formula.

[0082] Next, the control unit 500 of the control device 5 associates the position information corrected by the defect position correction unit 506 with the ID information of the predetermined mark and stores them in the storage unit 57. Therefore, the defect position information included in the defect information conforms to the actual product after correction, and can be effectively used for quality abnormality management in the post-process. An example of using the defect position information will be described below with reference to Figs. 11 and 12. Fig. 11 is a schematic diagram for explaining one example of using post-processing based on the defect position information. Fig. 12 is a schematic diagram for explaining another example of using post-processing based on the defect position information.

[0083] The control device 5 can utilize the position information of the defects in the ceramic green sheet determined by the defect position determining unit as follows.

[0084] For example, the control device 5 may output information corresponding to the position of the defect in the ceramic green sheet determined by the defect position determining unit on the display of the output unit 56. For example, the control device 5 can display the position of the defect in the layer of the electronic component containing a defect, or the laminated chip as a semi-finished product containing a defect, or the laminated sheet, based on the reel number information RN or the defect identification information ID associated with the defect information.

[0085] The control device 5 may also identify electronic components containing defects, or laminated chips and laminates as semi-finished products containing defects, based on defect position information as information corresponding to the position of defects in the ceramic green sheets. The control device 5 may also output the identified electronic components, etc. on the display of the output unit 56. In this case, a worker, etc. who sees the display may remove the identified electronic components, etc. from the production line. Also, as in the example of FIG. 11, the control device 5 may identify that LA3 of the layers LA1, LA2, and LA3 in the laminate is defective, and the identified layer may be analyzed non-destructively by CT analysis. In this way, this embodiment provides a method for performing the printing and lamination process of the internal electrode layer while maintaining the defect information obtained in the molding process of the ceramic green sheets, and making it possible to recover the defective portion after the printing and lamination process of the internal electrode layer. For this reason, it becomes clear which layer of the laminated chip or laminated sheet the defect of the ceramic green sheet is located at, and the actual product recovered in the lamination device can be analyzed as a semi-finished product or after it is completed.

[0086] 12, the control device 5 may determine, as a utilization area determination step, an area A of the ceramic green sheet that is not to be input into a subsequent manufacturing step, based on defect position information as information corresponding to the position of a defect D in the ceramic green sheet corrected by the defect position correction unit 506. The subsequent manufacturing step may be a cutting step (step S33) in the sheet cutting / laminating unit of the lamination device 3, or a cutting step in the cutting device 4.

[0087] Specifically, the control device 5 transmits information on the region A of the green sheet film G that will not be input to the subsequent manufacturing process to the lamination device 3 via the communication unit 58. When the lamination device 3 receives information on the region A of the green sheet film G that will not be input to the subsequent manufacturing process, the lamination device 3 may not process the region A as shown in Fig. 12. In Fig. 12, the portion S that has been cut out by the lamination device 3 and the region A that has not been cut out are displayed based on the information on the region A of the green sheet film G.

[0088] The above-mentioned defect position detection unit (defect position detection function) 504, mark distance detection unit (mark distance detection function) 505, and defect position correction unit (defect position correction function) 506 function as a defect position determination unit. The defect position determination unit determines the position of a defect in the ceramic green sheet after the thermal history is imparted by the drying unit 23. The defect position determination unit determines the position of a defect in the ceramic green sheet after the thermal history is imparted by the drying unit 23, based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on information on a plurality of marks acquired by the mark information acquisition unit 32.

[0089] From another perspective, considering that defects may also occur in the carrier film C, it can be said that the defect position determination unit determines the position of a defect that occurs in at least one of the carrier film C and the ceramic green sheet after the internal electrode layer is formed. Also, it can be said that the defect position determination unit determines the position of a defect that occurs in at least one of the carrier film C and the ceramic green sheet in the area covered by the internal electrode layer, based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on position information of a plurality of marks acquired by the mark information acquisition unit 32.

[0090] From another perspective, considering that defects may also occur in the carrier film C, it can be said that the defect position determination unit determines the position of a defect that has occurred in at least one of the carrier film C and the ceramic green sheet of the green sheet film G unwound by the unwinding unit 30. It can also be said that the defect position determination unit determines the position of a defect that has occurred in at least one of the carrier film C and the ceramic green sheet of the green sheet film G unwound by the unwinding unit 30, based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on position information of a plurality of marks acquired by the mark information acquisition unit 32.

[0091] <Electronic component production methods> Next, a method for producing electronic components to which a sheet defect location detection method according to one embodiment of the present invention is applied will be described with reference to Figs. 13 to 15. Fig. 13 is a flowchart for explaining the flow of a sheet production process. Fig. 14 is a flowchart for explaining the flow of an internal electrode formation process. Fig. 15 is a flowchart for explaining the flow of a laminated block production process. The method for producing electronic components according to this embodiment includes a sheet production process, an internal electrode formation process, and a laminated block production process.

[0092] <Sheet creation process> The sheet preparation process will be described with reference to Fig. 13. The sheet preparation process includes a supplying process (step S10), a sheet molding process (step S11), a drying process (step S12), a defect information acquisition process (step S13) for performing a defect inspection, a marking process (step S14), and a winding process (step S15). Note that the sheet defect position detection method according to this embodiment includes a winding process (step S15) for winding up the green sheet film G into a roll between the marking process (step S14) and the mark information acquisition process (step S31) described later.

[0093] First, in a supply step (step S10), the carrier film supply unit 10 supplies the carrier film C into the apparatus. The carrier film C supplied by the carrier film supply unit 10 is transported to the sheet forming unit 12 by the rollers 110 of the transport unit 11.

[0094] Next, in the sheet molding process (step S11), the sheet molding unit 12 applies a slurry containing a ceramic material onto the transported carrier film C, and molds a ceramic green sheet on the carrier film C. The ceramic green sheet molded by the sheet molding unit 12 is transported to the drying unit 13 by the rollers 110 of the transport unit 11.

[0095] Next, in a drying step (step S12), the drying unit 13 dries the transported ceramic green sheet. The ceramic green sheet dried by the drying unit 13 is transported to the defect information acquisition unit 14 by the rollers 110 of the transport unit 11.

[0096] Next, in the defect information acquisition step (step S13), the defect information acquisition unit 14 irradiates the conveyed green sheet film G with the illumination unit 141 and captures an image with the camera unit 140, while processing the acquired image, acquiring defect information, and performing defect inspection. In other words, in the defect information acquisition step (step S13), information on defects in the ceramic green sheet formed on the carrier film C is acquired. From another perspective, considering that defects may also occur in the carrier film C, the defect information acquisition step (step S13) can be said to acquire information on defects occurring in at least one of the carrier film C and the ceramic green sheet formed on the carrier film C before the internal electrode layer is formed in the internal electrode layer printing step (step S21) described later. From another perspective, considering that defects may also occur in the carrier film C, the defect information acquisition step (step S13) can be said to acquire information on defects occurring in at least one of the carrier film C and the ceramic green sheet formed on the carrier film C before being wound up in the winding step (step S15). The green sheet film G that has been subjected to defect inspection by the defect information acquisition unit 14 is transported to the marking unit 15 by the rollers 110 of the transport unit 11.

[0097] Next, in the marking step (step S14), the marking unit 15 applies a plurality of marks at predetermined intervals P1 on the transported carrier film C (step S14).

[0098] From another perspective, the marking step (step S14) provides a plurality of marks at a predetermined interval P1 on the carrier film C before the internal electrode layers are formed in the internal electrode layer printing step (step S21) described below. From another perspective, the defect information acquisition step (step S13) provides a plurality of marks at a predetermined interval P1 on the carrier film C before the carrier film C is wound up in the winding step (step S15).

[0099] The control device 5 according to the present embodiment executes a defect mark linking process that links the defect information acquired in step S13 with the reel number information RN and defect identification information ID of the applied mark. The defect mark linking process will be described later. The green sheet film G with the mark applied is transported to the winding section 16 by the roller 110 of the transport section 11.

[0100] Next, in the winding process (step S15), the winding unit 16 winds up the green sheet film G, which has been molded into a ceramic green sheet and transported, into a roll and collects it (step S15). In other words, the winding process (step S15) winds up the green sheet film G into a roll. When the winding process (step S15) is completed, the sheet production process is completed.

[0101] <Internal electrode formation process> The internal electrode forming process will be described with reference to Fig. 14. The internal electrode forming process includes an unwinding process (step S20), an internal electrode layer printing process (step S21) as a layer member forming process, a drying process (step S22) as a thermal history imparting process, and a winding process (step S23). The thermal history imparting process is a heating process. The sheet defect position detection method according to this embodiment also includes an internal electrode layer printing process (step S21) for forming an internal electrode layer as a layer member on a ceramic green sheet between a mark imparting process (step S14) and a mark information acquiring process (step S31) described later.

[0102] First, in the unwinding process (step S20), the unwinding section 20 unwinds the green sheet film G wound into a roll in the sheet production process, and supplies the green sheet film G to the inside of the device (step S20). The green sheet film G supplied by the unwinding section 20 is transported to the internal electrode layer printing section 22 by the rollers 210 of the transport section 21.

[0103] Next, in the internal electrode layer printing process (step S21), the internal electrode layer printing unit 22 prints a conductive paste for the internal electrode layer on the transported green sheet film G (step S21). In addition, in the internal electrode layer printing process (step S21), the internal electrode layer is formed on the ceramic green sheet so that the multiple marks provided in the mark providing process (step S14) are exposed. The green sheet film G on which the conductive paste for the internal electrode layer is printed by the internal electrode layer printing unit 22 is transported to the drying unit 23 by the rollers 210 of the transport unit 21.

[0104] Next, in the drying step (step S22), the drying unit 23 dries the conductive paste for the internal electrode layers printed on the transported green sheet film G (step S22). As a result, in the drying step (step S22), a thermal history is imparted to the ceramic green sheet and the carrier film C. The green sheet film G on which the conductive paste for the internal electrode layers has been dried by the drying unit 23 is transported to the winding unit 24 by the roller 210 of the transport unit 21.

[0105] The winding section 24 winds up the transported green sheet film G, onto which the conductive paste for the internal electrode layers has been printed, into a roll and collects it (step S23), completing the internal electrode formation process.

[0106] <Laminated block production process> The laminated block creation process will be described with reference to Fig. 15. The laminated block creation process includes an unwinding process (step S30), a mark information acquisition process (step S31), a defect position determination process (step S32), a cut-out process (step S33), a lamination process (step S34), and a block removal process (step S35). The sheet defect position detection method according to this embodiment includes an unwinding process of unwinding the rolled green sheet film G between the above-mentioned marking process (step S14) and the mark information acquisition process (step S31).

[0107] First, in the unwinding process (step S30), the unwinding section 30 unwinds the green sheet film G on which the conductive paste for the internal electrode layer is printed and wound into a roll in the internal electrode forming process, and supplies the green sheet film G to the inside of the device. The green sheet film G supplied by the unwinding section 30 is transported to the mark information acquisition section 32 by the rollers 310 of the transport section 31.

[0108] Next, in the mark information acquisition step (step S31), the mark information acquisition unit 32 acquires information on the multiple marks imparted in the mark imparting step to the transported carrier film C. In other words, the mark information acquisition step (step S31), which serves as a mark reading step for reading the positions of marks, acquires information on the multiple marks imparted in the mark imparting step (step S14) from the multiple marks imparted to the carrier film C after the thermal history is imparted in the drying step (step S22) as a thermal history imparting step.

[0109] From another perspective, the mark information acquisition process (step S31) acquires information on the multiple marks provided by the mark providing process (step S14) from the multiple marks provided on the carrier film C after the internal electrode layers are formed. From another perspective, the mark information acquisition process (step S31) acquires information on the multiple marks provided by the mark providing process (step S14) from the multiple marks provided on the carrier film C unwound by the unwinding process (step S30).

[0110] Next, in the defect position determination step (step S32), the control device 5 determines the position of a defect in the ceramic green sheet after the thermal history is imparted by the drying step (step S22). From another perspective, considering that a defect may also occur in the carrier film C, the defect position determination step (step S32) can be said to determine the position of a defect that occurs in at least one of the carrier film C and the ceramic green sheet after the internal electrode layer is formed. From another perspective, considering that a defect may also occur in the carrier film C, the defect position determination step (step S32) can be said to determine the position of a defect that occurs in at least one of the carrier film C and the green sheet film G unwound by the unwinding step (step S30).

[0111] More specifically, the defect position determination process (step S32) determines the position of a defect that has occurred in at least one of the carrier film C and the ceramic green sheet after being given a thermal history by the drying process (step S22) based on defect position information based on defect information acquired in the defect information acquisition process (step S13) and distance information between read marks based on information on the multiple marks acquired in the mark information acquisition process (step S31).

[0112] From another perspective, considering that defects may also occur in the carrier film C, the defect position determination process (step S32) can be said to determine the position of a defect that has occurred in at least one of the carrier film C and the ceramic green sheet within the area covered by the internal electrode layer, based on defect position information based on defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the multiple marks acquired in the mark information acquisition process (step S31).

[0113] From another perspective, considering that defects may also occur in the carrier film C, the defect position determination process (step S32) can be said to determine the position of a defect that has occurred in at least one of the carrier film C and the ceramic green sheet after being unwound by the unwinding process (step S30) based on defect position information based on defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the multiple marks acquired in the mark information acquisition process (step S31).

[0114] In step S32, a defect position determination process is executed based on the information of the multiple marks acquired by the mark information acquisition unit 32. The position of the defect is determined by the defect position determination process. The defect position determination process will be described later. The sheet defect position detection method may include, after the defect position determination process (step S32), a utilization area determination process for determining an area of ​​the green sheet film G to be used for the production of electronic components based on the determined defect position information. The green sheet film G, whose mark information has been acquired by the mark information acquisition unit 32, is transported to the sheet cutting and stacking unit 33 by rollers 310 of the transport unit 31.

[0115] Next, in the cutting step (step S33), the sheet cutting and laminating unit 33 cuts out the ceramic green sheet conveyed by the conveying unit 31 to a predetermined size.

[0116] Next, in the lamination process (step S34), the cut ceramic green sheets are laminated in a die (not shown) of the sheet cutting and lamination unit 33, thereby producing a laminated sheet. The produced laminated sheet is compressed by a compression means such as a hydrostatic press (not shown) to be processed into a laminated block before firing.

[0117] Next, in the block removal process (step S35), the processed laminated block is removed, and the laminated block production process is completed. The laminated block processed in the laminated block production process is cut to chip size by the above-mentioned cutting device 4 to produce laminated chips. The cut laminated chips are then fired, and processed into electronic components through the processes of coating, baking, and plating external electrodes.

[0118] <Defect mark linkage processing> Next, the defect mark linking process executed by the control device 5 according to this embodiment in the sheet production process will be described with reference to Fig. 16. The defect mark linking process is a process for linking the defect information acquired by the defect information acquisition unit 14 with the reel number information RN and defect identification information ID of the mark added by the marking unit 15. Fig. 16 is a flowchart for explaining the defect mark linking process executed by the control device 5 in the sheet production process. The defect mark linking process is executed at the timing of step S14 in the sheet production process.

[0119] First, the control device 5 acquires sheet replacement information from the green sheet molding device 1 via the communication unit 58 (step S100). Next, when the control device 5 acquires sheet conveyance start information from the green sheet molding device 1 via the communication unit 58 (step S101), it reads the reel number information RN and the defect identification information ID based on the sheet replacement information stored in the storage unit 57 (step S102). Next, the control device 5 causes the marking unit 15 of the green sheet molding device 1 via the communication unit 58 to impart a mark including the reel number information RN and the defect identification information ID read in step S102 to the carrier film C (step S103).

[0120] Next, the control device 5 receives the defect information acquired by the defect information acquisition unit 14 from the green sheet molding device 1 via the communication unit 58 (step S104). Next, the control device 5 associates the defect information received from the green sheet molding device 1 in step S104 with the reel number information RN and the defect identification information ID read in step S102, and stores them in the storage unit 57 (step S105), and ends the process.

[0121] <Defect position determination process> Next, the defect position determination process executed by the control device 5 according to this embodiment in the defect position determination step (step S32) of the laminated block creation step will be described with reference to Fig. 17. The defect position determination process is a process for determining the position of a defect occurring in at least one of the carrier film C ceramic green sheets after the thermal history is imparted in the drying step (step S22) by correcting the position of the defect detected by the defect information acquisition unit 14. Fig. 17 is a flowchart for explaining the defect position determination process executed by the control device 5 in the laminated block creation step. The defect position determination process is executed at the timing of step S32 of the laminated block creation step.

[0122] First, the control device 5 acquires sheet replacement information from the stacking device 3 via the communication unit 58 (step S200). Next, the control device 5 acquires fixed amount intermittent conveyance start information from the stacking device 3 via the communication unit 58 (step S201). Next, the control device 5 receives mark information read by the mark information acquisition unit 32 from the stacking device 3 via the communication unit 58 (step S202).

[0123] Next, the control device 5 calculates the distance between two consecutive marks (step S203). Next, the expansion / contraction amount and distortion of the green sheet film G are calculated (step S204). That is, the control device 5 divides the read mark distance P2 read by the mark information acquisition unit 32 by the mark distance P1 at the time of mark application. Next, the control device 5 corrects the defect position for the mark and records it in the memory unit 57 (step S205). The correction of the defect position for the mark is performed by multiplying the first distance L1 detected by the defect information acquisition unit 14 by P2 / P1 calculated in step S205. After correcting the defect position, the control device 5 records it in the memory unit 57 and ends the process.

[0124] According to the sheet defect position detection method according to the present embodiment described above, the following effects can be obtained.

[0125] Conventionally, defect information of the ceramic green sheet and the carrier film on which the ceramic green sheet is molded obtained in the sheet molding process could be utilized for quality abnormality management in the sheet molding process. However, since the carrier film and the ceramic green sheet are wound up and separated into a reel after the sheet molding process, there is a problem that utilization of the defect information is limited to the sheet molding process and there is no connection to the subsequent processes.

[0126] For this reason, if the carrier film and ceramic green sheet are deformed such as expanding or contracting due to thermal history from the time of molding, there is a risk of cumulative errors occurring in defect position information in the transport direction. If cumulative errors occur, it becomes difficult to use the defect information for quality abnormality management. For example, if a PET film expands by about 0.1% during the drying process, if nothing is done, the errors will accumulate, and it may expand by 1m over 1000m.

[0127] Furthermore, in order to match defect position information with the actual product in later processes during quality anomaly management, starting point information is required. However, from a fail-safe perspective, multiple starting points are required, which can complicate quality anomaly management.

[0128] To address these issues, the configuration of this embodiment is adopted. That is, a marking function is added to the green sheet molding device, and marks that serve as scales are engraved at regular intervals, and in a post-process, the mark intervals are measured and error correction is performed at the same time. In addition, by engraving the scales with different IDs each time, it becomes possible to match the defect information regardless of which part is the starting point.

[0129] That is, the present invention provides a method for printing and laminating the internal electrode layers while maintaining the defect information obtained in the molding process of the ceramic green sheets, and for recovering the defective parts after the printing and laminating process of the internal electrode layers. Therefore, it becomes clear where the defects in the carrier film and the ceramic green sheets are located in which layer of the laminated chip or laminated sheet, and the actual parts recovered from the lamination device can be analyzed as semi-finished products or after they are completed. In addition, a failure analysis method can be established from a different perspective than the initial failure test using electrical methods. In addition, by tracing the defects from the source to downstream, it is possible to know what should be managed with emphasis. In addition, recovering the defective parts in advance leads to the prevention of the outflow of defects.

[0130] The sheet defect position detection method configured as described above includes a sheet forming process (step S11) of forming a ceramic green sheet on a carrier film C, a defect information acquisition process (step S13) of acquiring information on defects occurring in the ceramic green sheet formed on the carrier film C, a marking process (step S14) of applying a plurality of marks at a predetermined interval P1 on the carrier film C, a drying process (step S22) of applying a thermal history to the ceramic green sheet and the carrier film C, and a marking process (step S23) of determining a defect position from the plurality of marks applied to the carrier film C after the thermal history is applied by the drying process (step S22). The method includes a mark information acquisition process (step S31) for acquiring information on the multiple marks imparted by the drying process (step S14), and a defect position determination process (step S32) for determining the positions of defects in the ceramic green sheet after the thermal history has been imparted by the drying process (step S22). The defect position determination process (step S32) determines the positions of defects in the ceramic green sheet after the thermal history has been imparted by the drying process (step S22) based on defect position information based on the defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on the information on the multiple marks acquired in the mark information acquisition process (step S31).

[0131] As a result, even if the green sheet film G is thermally deformed by a thermal history imparting process such as a drying process, the defective positions of the green sheet film G can be appropriately detected in a subsequent process.

[0132] In the sheet defect position detection method, the drying step (step S22) is a heating step.

[0133] This makes it possible to appropriately detect the position of defects in the green sheet film G in the process after the green sheet film G is heated.

[0134] In addition, the sheet defect position detection method includes an internal electrode layer printing process (layer member forming process) (step S21) for forming an internal electrode layer (layer member) on a ceramic green sheet between the mark providing process (step S14) and the mark information acquiring process (step S31).

[0135] As a result, even if a defect in the green sheet film G is hidden by a layer member such as an internal electrode layer, the position of the defect in the green sheet film G can be properly detected in a later process.

[0136] In addition, the sheet defect position detection method includes, between the marking process (step S14) and the mark information acquisition process (step S31), a winding process (step S15) of winding up the carrier film C on which the ceramic green sheet has been molded into a roll, and an unwinding process (step S30) of unwinding the roll-shaped carrier film C on which the ceramic green sheet has been molded.

[0137] As a result, even if the green sheet film G is plastically deformed due to winding and unwinding of the ceramic green sheet, the position of a defect in the green sheet film G can be properly detected in a subsequent process.

[0138] The control device 5 (information processing device 5) is a production system for multilayer ceramic electronic components, the system including: a sheet forming unit 12 that forms a ceramic green sheet on a carrier film C; a defect information acquiring unit 14 that acquires information on defects occurring in the ceramic green sheet formed on the carrier film C; a mark providing unit 15 that provides a plurality of marks on the carrier film C at a predetermined interval P1; a drying unit 23 (thermal history providing unit 23) that provides a thermal history to the ceramic green sheet and the carrier film C; and a mark information acquiring unit 32 that acquires information on the plurality of marks provided by the mark providing unit 15 from the plurality of marks provided on the carrier film C after the thermal history has been provided by the drying unit 23 (thermal history providing unit 23). The control device 5 (information processing device 5) of the system S (electronic component production system S) is provided with a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in the ceramic green sheet after the thermal history has been imparted by the drying unit 23 (thermal history imparting unit 23), and the defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the position of a defect in the ceramic green sheet after the thermal history has been imparted by the drying unit 23 (thermal history imparting unit 23) based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on information on a plurality of marks acquired by the mark information acquisition unit 32.

[0139] As a result, even if the green sheet film G is thermally deformed by a thermal history imparting process such as a drying process, the defective positions of the green sheet film G can be appropriately detected in a subsequent process.

[0140] The sheet defect position detection system S1 is a sheet defect position detection system S1 used in a multilayer ceramic electronic component production system S (electronic component production system S) including a sheet forming unit 12 that forms a ceramic green sheet on a carrier film C, and a drying unit 23 (thermal history imparting unit 23) that imparts a thermal history to the ceramic green sheet and the carrier film C, and includes a defect information acquisition unit 14 that acquires information on defects occurring in the ceramic green sheet formed on the carrier film C before the thermal history is imparted by the drying unit 23 (thermal history imparting unit 23), a mark imparting unit 15 that imparts a plurality of marks at predetermined intervals P1 on the carrier film C before the thermal history is imparted by the drying unit 23 (thermal history imparting unit 23), and a mark imparting unit 15 that imparts a plurality of marks at predetermined intervals P1 on the carrier film C before the thermal history is imparted by the drying unit 23 (thermal history imparting unit 23). The control unit 500 is equipped with a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in the ceramic green sheet after a thermal history is imparted by the drying unit 23 (thermal history imparting unit 23), and the defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the position of a defect in the ceramic green sheet after a thermal history is imparted by the drying unit 23 (thermal history imparting unit 23) based on defect position information based on the defect information acquired by the defect information acquisition unit 14 and read mark distance information based on the information of the multiple marks acquired by the mark information acquisition unit 32.

[0141] As a result, even if the green sheet film G is thermally deformed by a thermal history imparting process such as a drying process, the defective positions of the green sheet film G can be appropriately detected in a subsequent process.

[0142] The method for producing electronic components includes a sheet forming process (step S11) for forming a ceramic green sheet on a carrier film C, and a drying process (step S22) for imparting a thermal history to the ceramic green sheet and the carrier film C, and further includes a defect information acquisition process (step S13) for acquiring information on defects occurring in the ceramic green sheet formed on the carrier film C before the thermal history is imparted by the drying process (step S22), a marking process (step S14) for imparting a plurality of marks at a predetermined interval P1 on the carrier film C before the thermal history is imparted by the drying process (step S22), and a marking process (step S14) for determining a defect caused by the drying process (step S22) from the plurality of marks imparted to the carrier film C after the thermal history is imparted by the drying process (step S22). The method includes a mark information acquisition process (step S31) for acquiring information on the multiple marks acquired by the drying process (step S22), a defect position determination process (step S32) for determining the positions of defects in the ceramic green sheet after the thermal history has been imparted by the drying process (step S22), and a utilization area determination process for determining the area of ​​the ceramic green sheet to be used for producing electronic components based on the defect positions of the ceramic green sheet determined by the defect position determination process (step S32). The defect position determination process (step S32) determines the positions of defects in the ceramic green sheet after the thermal history has been imparted by the drying process (step S22) based on defect position information based on the information on the defects acquired in the defect information acquisition process (step S13) and read mark distance information based on the information on the multiple marks acquired in the mark information acquisition process (step S31).

[0143] As a result, even if the ceramic green sheet and the carrier film C are thermally deformed by a thermal history imparting process such as a drying process, the defective positions of the green sheet film G can be appropriately detected in a subsequent process.

[0144] The sheet defect position detection method according to the present embodiment described above can appropriately determine the position of a defect that occurs in the green sheet film G in the area covered by the layer member after the layer member forming process. The sheet defect position detection method in this aspect includes a sheet forming process (step S11) of forming a ceramic green sheet on a carrier film C, a defect information acquisition process (step S13) of acquiring information on defects that occur in the ceramic green sheet formed on the carrier film C, a marking process (step S14) of applying a plurality of marks at a predetermined interval P1 on the carrier film C, an internal electrode layer printing process (layer member forming process) (step S21) of forming an internal electrode layer (layer member) on the ceramic green sheet, and a marking process (step S22) of determining the position of a defect from the plurality of marks applied to the carrier film C after the internal electrode layer (layer member) is formed. The method includes a mark information acquisition process (step S31) for acquiring information on the multiple marks applied by the mark application process (step S14), and a defect position determination process (step S32) for determining the position of a defect in the ceramic green sheet after the internal electrode layer (layer member) is formed, and the defect position determination process (step S32) determines the position of a defect in the ceramic green sheet in the area covered by the internal electrode layer (layer member) based on defect position information based on the defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the multiple marks acquired in the mark information acquisition process (step S31).

[0145] As a result, even if a defect in the ceramic green sheet is hidden by a layer member such as an internal electrode layer, the position of the defect in the green sheet film G can be properly detected in a later process.

[0146] In the sheet defect position detection method according to one embodiment of the present invention, the layer member forming step is an internal electrode layer printing step (step S21).

[0147] As a result, even in the manufacture of multilayer ceramic electronic components that includes an internal electrode layer printing process, the defective positions of the green sheet film G can be appropriately detected in a process subsequent to the internal electrode layer printing process.

[0148] In addition, in a sheet defect location detection method according to one embodiment of the present invention, an internal electrode layer printing process (layer member forming process) (step S21) forms an internal electrode layer (layer member) on a ceramic green sheet so that the multiple marks applied in the mark application process (step S14) are exposed.

[0149] This makes it possible to acquire a mark image by imaging in the mark information acquisition step following the internal electrode layer printing step, and makes it possible to easily and appropriately detect the defective positions of the green sheet film G in a step subsequent to the layer member forming step.

[0150] The control device 5 (information processing device 5) is a multilayer ceramic electrode including a sheet forming unit 12 which forms a ceramic green sheet on a carrier film C, a defect information acquiring unit 14 which acquires information on defects occurring in the ceramic green sheet formed on the carrier film C, a mark applying unit 15 which applies a plurality of marks at a predetermined interval P1 on the carrier film C, an internal electrode layer printing unit 22 (layer member forming unit 22) which forms an internal electrode layer (layer member) on the ceramic green sheet, and a mark information acquiring unit 32 which acquires information on the plurality of marks applied by the mark applying unit 15 from the plurality of marks applied to the carrier film C after the internal electrode layer (layer member) is formed. An information processing device of a child component production system S (electronic component production system S) includes a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in a ceramic green sheet after an internal electrode layer (layer member) is formed, and the defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the defect position of the ceramic green sheet in an area covered by the internal electrode layer (layer member) based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on position information of a plurality of marks acquired by the mark information acquisition unit 32.

[0151] As a result, even if a defect in the ceramic green sheet is hidden by a layer member such as an internal electrode layer, the position of the defect in the green sheet film G can be properly detected in a later process.

[0152] The sheet defect position detection system S1 is used in a multilayer ceramic electronic component production system S (electronic component production system S) including a sheet forming unit 12 that forms a ceramic green sheet on a carrier film C, and an internal electrode layer printing unit 22 (layer member forming unit 22) that forms an internal electrode layer (layer member) on the ceramic green sheet, and includes a defect information acquisition unit 14 that acquires information on defects that have occurred in the ceramic green sheet formed on the carrier film C before the internal electrode layer (layer member) is formed, a mark application unit 15 that applies a plurality of marks at predetermined intervals P1 on the carrier film C before the internal electrode layer (layer member) is formed, and a mark application unit 16 that applies a plurality of marks at predetermined intervals P1 on the carrier film C after the internal electrode layer (layer member) is formed. The control unit 500 includes a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in the ceramic green sheet after the internal electrode layer (layer member) is formed, and the defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the defect position of the ceramic green sheet in the area covered by the internal electrode layer (layer member) based on defect position information based on the defect information acquired by the defect information acquisition unit 14 and read mark distance information based on position information of the multiple marks acquired by the mark information acquisition unit 32.

[0153] As a result, even if a defect in the ceramic green sheet is hidden by a layer member such as an internal electrode layer, the position of the defect in the green sheet film G can be properly detected in a later process.

[0154] The method for producing electronic components includes a sheet forming step (step S11) for forming a ceramic green sheet on a carrier film C, and an internal electrode layer printing step (layer member forming step) (step S21) for forming an internal electrode layer (layer member) on the ceramic green sheet, and further includes a defect information acquisition step (step S13) for acquiring information on defects occurring in the ceramic green sheet formed on the carrier film C before the internal electrode (layer member) is formed, a mark providing step (step S14) for providing a plurality of marks at predetermined intervals P1 on the carrier film C before the internal electrode layer (layer member) is formed, and a mark providing step (step S14) for determining a defect amount provided by the mark providing step (step S14) from the plurality of marks provided on the carrier film C after the internal electrode layer (layer member) is formed. The method includes a mark information acquisition process (step S31) for acquiring information on a plurality of marks, a defect position determination process (step S32) for determining the position of a defect in the ceramic green sheet after the internal electrode layer (layer member) is formed, and a utilization area determination process for determining the area of ​​the ceramic green sheet to be used for producing electronic components based on the defect position of the ceramic green sheet determined by the defect position determination process (step S32). The defect position determination process (step S32) determines the defect position of the ceramic green sheet in the area covered by the internal electrode layer (layer member) based on defect position information based on the defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the plurality of marks acquired in the mark information acquisition process (step S31).

[0155] As a result, even if a defect in the ceramic green sheet is hidden by a layer member such as an internal electrode layer, the position of the defect in the green sheet film G can be properly detected in a later process.

[0156] Moreover, the sheet defect position detection method according to the present embodiment described above can appropriately determine the defect position of the green sheet film G even after the carrier film C winding step (step S15) and unwinding step (step S30) are performed. That is, the sheet defect position detection method according to one embodiment of the present invention includes a sheet molding step (step S11) of molding a ceramic green sheet on the carrier film C, a defect information acquisition step (step S13) of acquiring information on defects occurring in the ceramic green sheet molded on the carrier film C, a marking step (step S14) of applying a plurality of marks at a predetermined interval P1 on the carrier film C, a winding step (step S15) of winding the green sheet film G onto a roll, an unwinding step (step S30) of unwinding the green sheet film G wound onto the roll, and a marking step (step S31) of applying a marking to the carrier film C unwound by the unwinding step (step S30). The method includes a mark information acquisition process (step S31) for acquiring information on the multiple marks applied by the mark application process (step S14) from the multiple marks obtained by the unwinding process, and a defect position determination process (step S32) for determining the position of a defect in the ceramic green sheet unwound by the unwinding process (step S30), in which the defect position determination process (step S32) determines the position of a defect in the ceramic green sheet after it has been unwound by the unwinding process (step S30) based on defect position information based on the defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the multiple marks acquired in the mark information acquisition process (step S31).

[0157] As a result, even if the green sheet film G is plastically deformed due to winding and unwinding of the ceramic green sheet, the position of a defect in the green sheet film G can be properly detected in a subsequent process.

[0158] In addition, in a sheet defect position detection method according to one embodiment of the present invention, the winding section 16 is provided in a first device 1, and the unwinding section 30 is provided in a second device 3 used in a subsequent process of the first device 1.

[0159] As a result, even when the electronic component production system S is composed of multiple devices as in this embodiment, the defective positions of the green sheet film G can be properly detected in a process subsequent to the winding and unwinding processes.

[0160] In addition, in the sheet defect position detection method according to one embodiment of the present invention, the first device is a green sheet molding device 1 and the second device is a lamination device 3.

[0161] As a result, even in a production system for laminated ceramic electronic components in which the green sheet molding device 1 and the lamination device 3 are separate entities, as in this embodiment, the location of defects in the green sheet film G can be properly detected in a process subsequent to the winding and unwinding processes.

[0162] The control device 5 (information processing device 5) is a laminated cell including a sheet forming unit 12 for forming a ceramic green sheet on a carrier film C, a defect information acquiring unit 14 for acquiring information on defects occurring in the ceramic green sheet formed on the carrier film C, a marking unit 15 for applying a plurality of marks at a predetermined interval P1 on the carrier film C, a winding unit 16 for winding the green sheet film G onto a roll, an unwinding unit 30 for unwinding the green sheet film G wound onto the roll, and a mark information acquiring unit 32 for acquiring information on the plurality of marks applied by the marking unit 15 from the plurality of marks applied to the carrier film C unwound by the unwinding unit 30. The control device 5 (information processing device 5) of the ceramic green sheet production system S (electronic component production system S) is equipped with a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in the ceramic green sheet unwound by the unwound unit 30, and the defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the defect position in the ceramic green sheet unwound by the unwound unit 30 based on defect position information based on defect information acquired by the defect information acquisition unit 14 and read mark distance information based on position information of a plurality of marks acquired by the mark information acquisition unit 32.

[0163] As a result, even if the green sheet film G is plastically deformed due to winding and unwinding of the ceramic green sheet, the position of a defect in the green sheet film G can be properly detected in a subsequent process.

[0164] The sheet defect position detection system S1 is a sheet defect position detection system S1 used in a multilayer ceramic electronic component production system S (electronic component production system S) that includes a sheet forming unit 12 that forms a ceramic green sheet on a carrier film C, a winding unit 16 that winds the green sheet film G onto a roll, and an unwinding unit 30 that unwinds the green sheet film G wound onto the roll, and includes a defect information acquisition unit 14 that acquires information on defects that have occurred in the ceramic green sheet formed on the carrier film C before it is wound by the winding unit 16, a mark providing unit 15 that provides a plurality of marks at predetermined intervals P1 on the carrier film C before it is wound by the winding unit 16, and a carrier film unwound by the unwinding unit 30. The apparatus includes a mark information acquisition unit 32 that acquires information on the multiple marks applied by the mark application unit 15 from the multiple marks applied to the ceramic green sheet C, and a control unit 500. The control unit 500 includes a defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) that determines the position of a defect in the ceramic green sheet unwound by the unwound unit 30. The defect position determination unit (defect position detection unit 504, mark distance detection unit 505, defect position correction unit 506) determines the position of a defect in the ceramic green sheet unwound by the unwound unit 30 based on defect position information based on the defect information acquired by the defect information acquisition unit 14 and read mark distance information based on the position information of the multiple marks acquired by the mark information acquisition unit 32.

[0165] As a result, even if the green sheet film G is plastically deformed due to winding and unwinding of the ceramic green sheet, the position of a defect in the green sheet film G can be properly detected in a subsequent process.

[0166] The method for producing electronic components includes a sheet forming process (step S11) for forming a ceramic green sheet on a carrier film C, a winding process (step S15) for winding the green sheet film G onto a roll, and an unwinding process (step S30) for unwinding the green sheet film G wound onto the roll, and includes a defect information acquisition process (step S13) for acquiring information on defects occurring in the ceramic green sheet formed on the carrier film C before the carrier film C is wound up in the winding process (step S15), a marking process (step S14) for providing a plurality of marks at predetermined intervals P1 on the carrier film C before the carrier film C is wound up in the winding process (step S15), and a marking process (step S15) for providing a plurality of marks on the carrier film C wound up in the unwinding process (step S30). The method includes a mark information acquisition process (step S31) for acquiring information on the multiple marks acquired by the unwinding process (step S30), a defect position determination process (step S32) for determining the position of a defect in the ceramic green sheet unwound by the unwinding process (step S30), and a utilization area determination process for determining the area of ​​the ceramic green sheet to be used for producing electronic components based on the defect position of the ceramic green sheet determined by the defect position determination process (step S32). The defect position determination process (step S32) determines the defect position of the ceramic green sheet unwound by the unwinding process (step S30) based on defect position information based on the defect information acquired in the defect information acquisition process (step S13) and read mark distance information based on position information of the multiple marks acquired in the mark information acquisition process (step S31).

[0167] As a result, even if the green sheet film G is plastically deformed due to winding and unwinding of the ceramic green sheet, the position of a defect in the green sheet film G can be properly detected in a subsequent process.

[0168] <Other embodiments> The thermal history imparting step is not limited to the drying step after printing the internal electrode layer. The thermal history imparting step may be a heating step including a drying step. When there is a thermal history imparting step in which the green sheet thermally expands or shrinks, the effect of this embodiment can be appropriately obtained. Furthermore, the layer member forming step is not limited to the internal electrode layer printing step. When a layer member is formed so as to cover the ceramic green sheet, the effect of this embodiment can be appropriately obtained.

[0169] In the above embodiment, the control unit 500 of the control device 5 is configured by multiple functional blocks as described above, but the functional blocks do not necessarily need to be physically separated, and one CPU may realize the functions of multiple functional blocks. Also, the control unit may be located in two or more separate locations. Also, all or a part of the control unit may be provided in a server (not shown).

[0170] In the sheet defect position detection system S1 according to the present embodiment, the mark is applied to the carrier film C portion of the green sheet film G as described above, but is not limited thereto. For example, the mark may be applied to the ceramic green sheet portion, or the mark may be applied to the ceramic green sheet portion and the carrier film C portion. In any aspect, the sheet defect position detection method according to the present embodiment can appropriately detect the defect position of the ceramic green sheet in a later process even if the ceramic green sheet is thermally deformed by a thermal history imparting process such as a drying process, or if the defect of the green sheet film G is hidden by a layer member such as an internal electrode layer, or if the ceramic green sheet is plastically deformed by winding and unwinding the ceramic green sheet.

[0171] In this specification, the steps of describing a program to be recorded on a recording medium include not only processes that are performed chronologically according to the order, but also processes that are not necessarily performed chronologically but are executed in parallel or individually.

[0172] Although several embodiments of the present invention have been described above, these embodiments are merely illustrative and do not limit the technical scope of the present invention. The present invention can take various other embodiments, and various modifications such as omissions and substitutions can be made without departing from the gist of the present invention. These embodiments and their modifications are included in the scope and gist of the invention described in this specification, etc., and are included in the scope of the invention described in the claims and their equivalents.

[0173] <1> a sheet forming step of forming a ceramic green sheet on a carrier film; a defect information acquiring step of acquiring information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a marking step of providing a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet; a thermal history imparting step of imparting a thermal history to the ceramic green sheet and the carrier film; a mark information acquiring step of acquiring information on the plurality of marks provided by the mark providing step from the plurality of marks provided on at least one of the carrier film and the ceramic green sheet after the thermal history is provided by the thermal history providing step; a defect position determining step of determining a position of the defect after the thermal history is applied by the thermal history applying step, A sheet defect position detection method, in which the defect position determination process determines the position of the defect after thermal history is imparted by the thermal history imparting process, based on defect position information based on the information of the defect acquired in the defect information acquisition process and information on the distance between read marks based on information of a plurality of marks acquired in the mark information acquisition process. <2> The thermal history imparting step is a heating step. <1> The sheet defect position detection method according to claim 1, <3> a layer member forming step of forming a layer member on the ceramic green sheet between the mark providing step and the mark information obtaining step; <1> or <2> The sheet defect position detection method according to claim 1, <4> Between the mark providing step and the mark information obtaining step, a winding step of winding up the carrier film on which the ceramic green sheet has been molded into a roll, and an unwinding step of unwinding the roll-shaped carrier film on which the ceramic green sheet has been molded, are included. <1> from <3> 13. The sheet defect position detection method according to claim 12, wherein the sheet defect position detection method is a method for detecting a position of a sheet. <5> an information processing device for an electronic component production system, comprising: a sheet molding unit that molds a ceramic green sheet on a carrier film; a defect information acquisition unit that acquires information of defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a mark applying unit that applies a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet; a thermal history applying unit that applies a thermal history to the ceramic green sheet and the carrier film; and a mark information acquisition unit that acquires information of the plurality of marks applied by the mark applying unit from the plurality of marks applied to at least one of the carrier film and the ceramic green sheet after the thermal history is applied by the thermal history applying unit, a defect position determining unit that determines a position of the defect after the thermal history is applied by the thermal history applying unit, The defect position determination unit determines the position of the defect after the thermal history is imparted by the thermal history imparting unit based on defect position information based on the information of the defect acquired by the defect information acquisition unit and distance information between read marks based on information of a plurality of marks acquired by the mark information acquisition unit. <6> a sheet forming unit that forms a ceramic green sheet on a carrier film; a thermal history imparting unit that imparts a thermal history to the ceramic green sheet and the carrier film, a defect information acquiring unit that acquires information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is applied by the thermal history applying unit; a marking unit that applies a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet before the thermal history is applied by the thermal history applying unit; a mark information acquiring unit that acquires information on the plurality of marks provided by the mark providing unit from the plurality of marks provided on at least one of the carrier film and the ceramic green sheet after the thermal history is provided by the thermal history providing unit; A control unit, the control unit includes a defect position determination unit that determines a position of the defect after the thermal history is applied by the thermal history application unit, A sheet defect position detection system, wherein the defect position determination unit determines the position of the defect after thermal history is imparted by the thermal history imparting unit based on defect position information based on the defect information acquired by the defect information acquisition unit and distance information between read marks based on information of a plurality of marks acquired by the mark information acquisition unit. <7> a sheet forming step of forming a ceramic green sheet on a carrier film; a thermal history imparting step of imparting a thermal history to the ceramic green sheet and the carrier film, a defect information acquiring step of acquiring information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is applied in the thermal history applying step; a marking step of providing a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet before the thermal history is provided by the thermal history providing step; a mark information acquiring step of acquiring information on the plurality of marks provided by the mark providing step from the plurality of marks provided on at least one of the carrier film and the ceramic green sheet after the thermal history is provided by the thermal history providing step; a defect position determining step of determining a position of the defect after the thermal history is applied by the thermal history applying step; a utilization area determination step of determining an area of ​​the ceramic green sheet to be utilized for the production of electronic components based on the position of the defect determined by the defect position determination step, A method for producing electronic components, wherein the defect position determination step determines the position of the defect after the thermal history is imparted by the thermal history imparting step, based on defect position information based on the information of the defect acquired in the defect information acquisition step, and on distance information between read marks based on information of a plurality of marks acquired in the mark information acquisition step. [Explanation of symbols]

[0174] C Carrier Film Step S11: Sheet forming process Step S13: Defect information acquisition process Step S14: Marking process Step S22: Heat history application process Step S31: Mark information acquisition process Step S32: Defect position determination process

Claims

1. a sheet forming step of forming a ceramic green sheet on a carrier film; a defect information acquiring step of acquiring information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a marking step of providing a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet; a thermal history imparting step of imparting a thermal history to the ceramic green sheet and the carrier film; a mark information acquiring step of acquiring information on the plurality of marks provided by the mark providing step from the plurality of marks provided on at least one of the carrier film and the ceramic green sheet after the thermal history is provided by the thermal history providing step; a defect position determining step of determining a position of the defect after the thermal history is applied by the thermal history applying step, A sheet defect position detection method, in which the defect position determination process determines the position of the defect after thermal history is imparted by the thermal history imparting process, based on defect position information based on the information of the defect acquired in the defect information acquisition process and information on the distance between read marks based on information of a plurality of marks acquired in the mark information acquisition process.

2. The sheet defect position detecting method according to claim 1 , wherein the thermal history imparting step is a heating step.

3. 3. The sheet defect position detection method according to claim 1, further comprising a layer member forming step of forming a layer member on the ceramic green sheet between the mark providing step and the mark information obtaining step.

4. 3. The sheet defect position detection method according to claim 1 or 2, further comprising, between the marking process and the mark information acquisition process, a winding process of winding up the carrier film on which the ceramic green sheet is molded into a roll, and an unwinding process of unwinding the roll-shaped carrier film on which the ceramic green sheet is molded.

5. an information processing device for an electronic component production system, comprising: a sheet molding unit that molds a ceramic green sheet on a carrier film; a defect information acquisition unit that acquires information of defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film; a mark applying unit that applies a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet; a thermal history applying unit that applies a thermal history to the ceramic green sheet and the carrier film; and a mark information acquisition unit that acquires information of the plurality of marks applied by the mark applying unit from the plurality of marks applied to at least one of the carrier film and the ceramic green sheet after the thermal history is applied by the thermal history applying unit, a defect position determining unit that determines a position of the defect after the thermal history is applied by the thermal history applying unit, The defect position determination unit determines the position of the defect after the thermal history is imparted by the thermal history imparting unit based on defect position information based on the information of the defect acquired by the defect information acquisition unit and distance information between read marks based on information of a plurality of marks acquired by the mark information acquisition unit.

6. a sheet forming unit that forms a ceramic green sheet on a carrier film; a thermal history imparting unit that imparts a thermal history to the ceramic green sheet and the carrier film, a defect information acquiring unit that acquires information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is applied by the thermal history applying unit; a marking unit that applies a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet before the thermal history is applied by the thermal history applying unit; a mark information acquiring unit that acquires information on the plurality of marks applied by the mark applying unit from the plurality of marks applied to at least one of the carrier film and the ceramic green sheet after the thermal history is applied by the thermal history applying unit; A control unit, the control unit includes a defect position determination unit that determines a position of the defect after the thermal history is applied by the thermal history application unit, A sheet defect position detection system, wherein the defect position determination unit determines the position of the defect after thermal history is imparted by the thermal history imparting unit based on defect position information based on the defect information acquired by the defect information acquisition unit and distance information between read marks based on information of a plurality of marks acquired by the mark information acquisition unit.

7. a sheet forming step of forming a ceramic green sheet on a carrier film; a thermal history imparting step of imparting a thermal history to the ceramic green sheet and the carrier film, a defect information acquiring step of acquiring information on defects occurring in at least one of the carrier film and the ceramic green sheet molded on the carrier film before the thermal history is applied in the thermal history applying step; a marking step of providing a plurality of marks at predetermined intervals on at least one of the carrier film and the ceramic green sheet after molding of the ceramic green sheet before the thermal history is provided by the thermal history providing step; a mark information acquiring step of acquiring information on the plurality of marks provided by the mark providing step from the plurality of marks provided on at least one of the carrier film and the ceramic green sheet after the thermal history is provided by the thermal history providing step; a defect position determining step of determining a position of the defect after the thermal history is applied by the thermal history applying step; a utilization area determination step of determining an area of ​​the ceramic green sheet to be utilized for the production of electronic components based on the position of the defect determined by the defect position determination step, A method for producing electronic components, wherein the defect position determination step determines the position of the defect after the thermal history is imparted by the thermal history imparting step, based on defect position information based on the information of the defect acquired in the defect information acquisition step, and on distance information between read marks based on information of a plurality of marks acquired in the mark information acquisition step.

Images