Electronic Components

Abstract

To provide an electronic component capable of suppressing occurrence of migration even in a case where an external electrode includes a conductive resin layer.SOLUTION: An external electrode 5 has an electrode part 5c. The electrode part 5c is arranged on a lateral face 3c, including a second electrode layer E2. An insulating film 21 arranged on an element body 3 has a film portion 21a. The film portion 21a is arranged on the lateral face 3c along an edge E2ce of the second electrode layer E2 included in the electrode part 5c. The film portion 21a is arranged on the lateral face 3c so as to cover the edge E2ce and a region exposed from the external electrode 5 on the lateral face 3c.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes a rectangular parallelepiped element body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). The element body has a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction, and a pair of second side faces facing each other in a third direction. The multiple external electrodes are respectively arranged on both ends of the element body in the first direction. The multiple internal electrodes are arranged within the element body so as to be aligned in the second direction, and are electrically connected to corresponding external electrodes among the multiple external electrodes. The external electrodes have electrode portions that are arranged on the second side faces and include a conductive resin layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-006501 A Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer generally contains a plurality of metal particles and resin. In this case, migration may occur in the external electrodes. Migration is considered to occur, for example, due to the following phenomena. The electric field generated between the internal electrode and the conductive resin layer to which the internal electrode is not electrically connected acts on the metal particles, ionizing the atoms of the metal particles. The generated metal ions are attracted to the electric field generated between the external electrodes and migrate from the conductive resin layer. The metal ions that migrate from the conductive resin layer react with electrons supplied from the element body, for example, and are precipitated as metal on the surface of the element body.

[0005] An object of each aspect of the present invention is to provide an electronic component that suppresses the occurrence of migration even when an external electrode includes a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a rectangular parallelepiped body, a plurality of external electrodes, a plurality of internal electrodes, and an insulating film disposed on the body. The body has a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction, and a pair of second side faces facing each other in a third direction. The external electrodes are disposed on both ends of the body in the first direction. The internal electrodes are disposed within the body so as to be aligned in the second direction, and are electrically connected to corresponding external electrodes among the external electrodes. Each external electrode has a pair of first electrode portions that are disposed on the pair of second side faces, respectively, and include a conductive resin layer. The insulating film has film portions that are disposed on the second side faces along edges of the conductive resin layer contained in each first electrode portion, and that cover the edges and the areas of the second side faces that are exposed from the external electrodes.

[0007] In the one embodiment, the edge of the conductive resin layer included in the first electrode portion is covered by the film portion of the insulating film. Therefore, even if metal ions are generated in the conductive resin layer of the first electrode portion due to an electric field generated between the internal electrode and the conductive resin layer of the first electrode portion to which the internal electrode is not electrically connected, the metal ions are unlikely to move out of the conductive resin layer of the first electrode portion. In other words, the film portion of the insulating film restricts the movement of the metal ions. As a result, the one embodiment suppresses the occurrence of migration.

[0008] In the above aspect, each external electrode may have a pair of second electrode portions respectively disposed on the pair of first side surfaces and including a conductive resin layer, and the insulating film may have film portions respectively disposed on the first side surfaces along edges of the conductive resin layers included in each second electrode portion and covering the edges and the regions of the first side surfaces exposed from the external electrodes. In a configuration in which the insulating film has the film portion disposed on the first side surface, the edge of the conductive resin layer included in the second electrode portion is covered by the film portion disposed on the first side surface of the insulating film. Therefore, even if metal ions are generated in the conductive resin layer of the second electrode portion due to an electric field generated between the outermost internal electrode located on the outermost side in the second direction among the multiple internal electrodes and the conductive resin layer of the second electrode portion to which the outermost internal electrode is not electrically connected, the metal ions are unlikely to move from the conductive resin layer of the second electrode portion. In other words, the film portion disposed on the first side surface restricts the movement of the metal ions. As a result, the above configuration further suppresses the occurrence of migration.

[0009] In the above aspect, the conductive resin layer may contain a plurality of silver particles.

[0010] An electronic component according to another aspect of the present invention includes a rectangular parallelepiped body, a plurality of external electrodes, and a plurality of internal electrodes. The body has a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction, and a pair of second side faces facing each other in a third direction. The plurality of external electrodes are arranged on both ends of the body in the first direction. The plurality of internal electrodes are arranged in the body so as to be aligned in the second direction, and are electrically connected to corresponding external electrodes among the plurality of external electrodes. Each external electrode has a pair of first electrode portions arranged on the pair of second side faces, respectively, and including a conductive resin layer. In two conductive resin layers located on the same second side face, one conductive resin layer has an edge facing the other conductive resin layer. The conductive resin layer includes a first region including a plurality of metal particles having a first content and a resin, and a second region including a plurality of metal particles having a second content smaller than the first content and a resin. The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

[0011] In another aspect of the above, the second region constitutes an edge of the conductive resin layer included in the first electrode portion. The content (second content) of the plurality of metal particles in the second region is smaller than the content (first content) of the plurality of metal particles in the first region. Even if metal ions are generated in the conductive resin layer of the first electrode portion by an electric field generated between the internal electrode and the conductive resin layer of the first electrode portion to which the internal electrode is not electrically connected, the amount of metal ions generated in the second region is smaller than that in the first region. Therefore, in a configuration in which the conductive resin layer of the first electrode portion has the second region, the amount of metal ions that migrate from the conductive resin layer of the first electrode portion is smaller than that in a configuration in which the conductive resin layer of the first electrode portion is composed of the first region. As a result, the above another aspect suppresses the occurrence of migration.

[0012] In another aspect of the above, each external electrode may have a pair of second electrode parts respectively arranged on a pair of first side surfaces and including a conductive resin layer. In two conductive resin layers located on the same first side surface, one conductive resin layer may have an edge facing the other conductive resin layer. The conductive resin layer included in the second electrode part arranged on the first side surface may include a third region including a plurality of metal particles having a third content and a resin, and a fourth region including a plurality of metal particles having a fourth content smaller than the third content and a resin. The fourth region may be located closer to the edge of the conductive resin layer than the third region, and may include the edge of the conductive resin layer. In a configuration in which the conductive resin layer included in the second electrode portion has the fourth region, the fourth region constitutes an edge of the conductive resin layer included in the second electrode portion. The content (fourth content) of the plurality of metal particles in the fourth region is smaller than the content (third content) of the plurality of metal particles in the third region. Even if metal ions are generated in the conductive resin layer of the second electrode portion by an electric field generated between an outermost internal electrode located on the outermost side in the second direction among the plurality of internal electrodes and a conductive resin layer of the second electrode portion to which the outermost internal electrode is not electrically connected, the amount of metal ions generated in the fourth region is smaller than that in the third region. Therefore, in a configuration in which the conductive resin layer of the second electrode portion has the fourth region, the amount of metal ions that migrate from the conductive resin layer of the second electrode portion is smaller than that in a configuration in which the conductive resin layer of the second electrode portion is composed of the third region. As a result, the above-mentioned another aspect further suppresses the occurrence of migration.

[0013] The metal particles may include silver particles.

[0014] In each of the above aspects, each external electrode may have a pair of second electrode portions that are respectively arranged on a pair of first side surfaces and include a conductive resin layer. In two conductive resin layers located on the same first side surface, one conductive resin layer may have an edge facing the other conductive resin layer. Among the multiple internal electrodes, an outermost internal electrode located on the outermost side in the second direction may be adjacent in the second direction to a second electrode portion to which the outermost internal electrode is electrically connected. With a plane including an end face to which the outermost internal electrode is exposed as a reference plane, a first length of the outermost internal electrode from the reference plane in the first direction may be larger than a second length in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which the second electrode portion includes, and may be smaller than a third length from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which the second electrode portion includes. In a configuration in which the first length is longer than the second length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer included in the second electrode portion adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other. In a configuration in which the first length is shorter than the third length, the outermost internal electrode is unlikely to face, in the second direction, a conductive resin layer included in a second electrode portion to which the outermost internal electrode is not electrically connected, and an electric field is unlikely to be generated between the conductive resin layer and the outermost internal electrode that are not electrically connected to each other. As a result, a configuration in which the first length is greater than the second length and less than the third length further suppresses the occurrence of migration.

[0015] Each of the above aspects may include a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode. The dummy conductor may be electrically connected to an external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected. In a configuration in which the dummy conductor is located in the same layer as the outermost internal electrode, structural defects are unlikely to occur in the element.

[0016] Each of the above aspects may include a pair of dummy conductors each adjacent to a corresponding one of the pair of first side faces in the second direction. Each external electrode may have a pair of second electrode portions each disposed on the pair of first side faces and including a conductive resin layer. Each dummy conductor may be electrically not connected to an internal electrode adjacent to the dummy conductor in the second direction and may face the conductive resin layer included in the second electrode portion in the second direction. In the configuration in which the dummy conductor is provided, the dummy conductor is located between the conductive resin layer included in the second electrode portion and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode portion. The dummy conductor separates the conductive resin layer of the second electrode portion from the internal electrode that is not electrically connected to the conductive resin layer of the second electrode portion. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the second electrode portion and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode portion. Even if an electric field is generated between the conductive resin layer of the second electrode portion and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode portion, the strength of the electric field is small. As a result, the configuration in which the dummy conductor is provided further suppresses the occurrence of migration.

[0017] In each of the above aspects, each external electrode may have an electrode portion that is disposed on an end face and includes a conductive resin layer. A configuration in which an external electrode is arranged on an end face and has an electrode portion including a conductive resin layer reduces the stress acting on the solder fillet formed in the electrode portion, and suppresses the occurrence of solder cracks. Effect of the Invention

[0018] Each aspect of the present invention provides an electronic component that suppresses the occurrence of migration even when the external electrodes include a conductive resin layer. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Figure 4] FIG. 4 is a diagram showing the second electrode layer and the insulating film. [Diagram 5] FIG. 5 is a diagram showing the second electrode layer and the insulating film. [Figure 6] FIG. 6 is a diagram showing a mounting structure of the multilayer capacitor in accordance with the first embodiment. [Figure 7] FIG. 7 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 8] FIG. 8 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 9] FIG. 9 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 10] FIG. 10 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 11] FIG. 11 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 12] FIG. 12 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 14] FIG. 14 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 15] FIG. 15 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 16] FIG. 16 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 17] FIG. 17 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 18]FIG. 18 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 19] FIG. 19 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 20] FIG. 20 is a perspective view of the multilayer capacitor in accordance with the second embodiment. [Figure 21] FIG. 21 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 22] FIG. 22 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 23] FIG. 23 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Figure 24] FIG. 24 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Diagram 25] FIG. 25 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Figure 26] FIG. 26 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Figure 27] FIG. 27 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Figure 28] FIG. 28 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Figure 29] FIG. 29 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Diagram 30] FIG. 30 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. [Diagram 31] FIG. 31 is a cross-sectional view showing a multilayer capacitor according to a modified example of the second embodiment. [Diagram 32] FIG. 32 is a cross-sectional view showing a multilayer capacitor according to a modified example of the second embodiment. [Diagram 33] FIG. 33 is a cross-sectional view showing a multilayer capacitor according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0021] First embodiment The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described with reference to Figures 1 to 3. Figure 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. Figures 2 and 3 are views showing a cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. In this embodiment, the electronic component is, for example, the multilayer capacitor C1.

[0022] 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. In this embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0023] The element body 3 has a pair of side surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of side surfaces 3a, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular. The direction in which the pair of side surfaces 3a face each other is the second direction D2. The direction in which the pair of side surfaces 3c face each other is the third direction D3. The direction in which the pair of end surfaces 3e face each other is the first direction D1. The multilayer capacitor C1 is solder-mounted to an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, one side surface 3a faces the electronic device. The one side surface 3a is arranged to form a mounting surface. The one side surface 3a is the mounting surface. Of the pair of side surfaces 3c, one side surface 3c may be arranged to form a mounting surface. For example, when the side surface 3a forms a first side surface, the side surface 3c forms a second side surface.

[0024] The second direction D2 is a direction perpendicular to each side surface 3a and perpendicular to the third direction D3. The first direction D1 is a direction parallel to each side surface 3a and each side surface 3c and perpendicular to the second direction D2 and the third direction D3. The third direction D3 is a direction perpendicular to each side surface 3c, and the first direction D1 is a direction perpendicular to each end surface 3e. In this embodiment, the length of the element body 3 in the first direction D1 is greater than the length of the element body 3 in the second direction D2 and is greater than the length of the element body 3 in the third direction D3. The first direction D1 is the longitudinal direction of the element body 3. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be different from each other.

[0025] The length of element body 3 in the second direction D2 is the height of element body 3. The length of element body 3 in the third direction D3 is the width of element body 3. The length of element body 3 in the first direction D1 is the length of element body 3. In this embodiment, the height of element body 3 is 0.1 to 2.5 mm, the width of element body 3 is 0.1 to 5.0 mm, and the length of element body 3 is 0.2 to 5.7 mm. For example, the height of element body 3 is 2.5 mm, the width of element body 3 is 2.5 mm, and the length of element body 3 is 3.2 mm.

[0026] The pair of side surfaces 3c extend in the second direction D2 to connect the pair of side surfaces 3a. The pair of side surfaces 3c also extend in the first direction D1. The pair of end surfaces 3e extend in the second direction D2 to connect the pair of side surfaces 3a. The pair of end surfaces 3e also extend in the third direction D3.

[0027] The element body 3 has four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between the end face 3e and the side face 3a. The ridges 3i are located between the end face 3e and the side face 3c. The ridges 3j are located between the side face 3a and the side face 3c. In this embodiment, the ridges 3g, 3i, and 3j are rounded so as to be curved. The element body 3 is subjected to a so-called R chamfering process. The end face 3e and the side face 3a are indirectly adjacent to each other via the ridges 3g. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridges 3i. The side face 3a and the side face 3c are indirectly adjacent to each other via the ridges 3j.

[0028] The element body 3 is configured by stacking a plurality of dielectric layers in the second direction D2. The element body 3 has a plurality of dielectric layers stacked on top of each other. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible.

[0029] As shown in Figs. 2 and 3, the multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed within the element body 3. Each of the internal electrodes 7, 9 is made of a conductive material that is typically used as an internal conductor for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

[0030] The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the second direction D2. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other with a gap in the second direction D2. The internal electrodes 7 and the internal electrodes 9 have mutually different polarities. One end of the internal electrodes 7, 9 is exposed at the corresponding end face 3e. The internal electrodes 7, 9 have one end exposed at the corresponding end face 3e. The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the second direction D2. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the second direction D2. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to the side surface 3a. The internal electrodes 7 and 9 face each other in the second direction D2. The direction in which the internal electrodes 7 and 9 face each other (the second direction D2) is perpendicular to the direction parallel to the side surface 3a (the third direction D3 and the first direction D1).

[0031] In this embodiment, the multiple internal electrodes 7 include one internal electrode 7A that is located outermost in the second direction D2. The internal electrode 7A is the outermost internal electrode. In this embodiment, the multiple internal electrodes 9 include one internal electrode 9A that is located outermost in the second direction D2. The internal electrode 9A is the outermost internal electrode. In FIG. 3, for the sake of explanation, the internal electrodes 7 and 9 (internal electrodes 7A and 9A) are intentionally illustrated shifted from each other in the third direction D3.

[0032] As shown in FIG. 1, the external electrodes 5 are respectively arranged at both ends of the element body 3 in the first direction D1. Each external electrode 5 is arranged on the side of the corresponding end face 3e of the element body 3. In this embodiment, each external electrode 5 is arranged on a pair of side faces 3a, a pair of side faces 3c, and one end face 3e. As shown in FIG. 2 and FIG. 3, the external electrode 5 has a plurality of electrode portions 5a, 5c, 5e. The electrode portion 5a is arranged on the side face 3a and the ridge portion 3g. Each electrode portion 5c is arranged on the side face 3c and the ridge portion 3i. The electrode portion 5e is arranged on the end face 3e. The external electrode 5 also has an electrode portion arranged on the ridge portion 3j.

[0033] The external electrode 5 is formed on five surfaces, namely, the pair of side surfaces 3a, one end surface 3e, and the pair of side surfaces 3c, as well as the ridges 3g, 3i, and 3j. The electrode portions 5a, 5c, and 5e adjacent to each other are connected and electrically connected. The electrode portion 5e covers one end of the corresponding internal electrode 7, 9 in its entirety. The electrode portion 5e is directly connected to the corresponding internal electrode 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrode 7, 9. As shown in FIG. 2 and FIG. 3, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a and 5c has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. Each of the electrode portions 5e has a first electrode layer E1 and a third electrode layer E3.

[0034] The first electrode layer E1 of the electrode unit 5a is disposed on the side surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is formed so as to cover a part of the side surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is in contact with the part of the side surface 3a and the entire ridge portion 3g. That is, in the electrode unit 5a, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3a is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3a is a partial region of the side surface 3a near the end face 3e. The first electrode layer E1 of the electrode unit 5a is located on the side surface 3a. The first electrode layer E1 does not have to be formed on the side surface 3a. That is, the first electrode layer E1 does not have to be disposed on the side surface 3a. The second electrode layer E2 of the electrode unit 5a is disposed on the first electrode layer E1 and the side surface 3a. In the electrode unit 5a, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the side surface 3a. In the electrode unit 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3a. The second electrode layer E2 of the electrode unit 5a is formed so as to cover the first electrode layer E1 of the electrode unit 5a. In the electrode unit 5a, the second electrode layer E2 indirectly covers the side surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode unit 5a is located on the side surface 3a. The third electrode layer E3 of the electrode unit 5a is disposed on the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode unit 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the side surface 3a.

[0035] The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the part of the side surface 3c and the entire ridge portion 3i. That is, in the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3c is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3c is a partial region of the side surface 3c near the end face 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode unit 5c is disposed on the first electrode layer E1 and on the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3c. The second electrode layer E2 of the electrode unit 5c is formed so as to cover the first electrode layer E1 of the electrode unit 5c. In the electrode unit 5c, the second electrode layer E2 indirectly covers the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode unit 5c is located on the side surface 3c. The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c.

[0036] The first electrode layer E1 of the electrode unit 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode unit 5e is formed so as to cover the entire end surface 3e. The first electrode layer E1 of the electrode unit 5e is in contact with the entire end surface 3e. That is, in the electrode unit 5e, the first electrode layer E1 is in direct contact with the end surface 3e. The third electrode layer E3 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e.

[0037] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the part of the side surface 3a, the part of the side surface 3c, one end face 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 of each electrode portion 5a, 5c, and 5e is integrally formed.

[0038] The second electrode layer E2 is formed by curing a conductive resin applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin includes, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles or copper particles. In this embodiment, the second electrode layer E2 includes a plurality of silver particles. That is, the second electrode layer E2 includes a plurality of metal particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 included in each electrode portion 5a, 5c is integrally formed.

[0039] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (a portion exposed from the second electrode layer E2) by plating. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 has, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each electrode portion 5a, 5c, 5e is integrally formed.

[0040] For example, when the electrode portion 5c constitutes a first electrode portion, the electrode portion 5a constitutes a second electrode portion. In this embodiment, the electrode portion 5e does not include the second electrode layer E2.

[0041] As shown in Figs. 2 and 3, the multilayer capacitor C1 includes an insulating film 21. The insulating film 21 is disposed on the element body 3. The insulating film 21 has a film portion 21a disposed on each side surface 3c and a film portion 21b disposed on each side surface 3a. In this embodiment, the film portion 21a and the film portion 21b are integrally formed. The insulating film 21 is made of, for example, a resin having electrical insulation properties. The resin constituting the insulating film 21 is, for example, an acrylic resin, a polyurethane resin, an epoxy resin, or a polyolefin resin. The insulating film 21 does not include a filler having electrical conductivity.

[0042] As shown in FIG. 4, the film portion 21a is disposed at the edge E2c of the second electrode layer E2 included in the electrode portion 5c. e The second electrode layer is disposed on the side surface 3c so as to extend along the insulating film 3. FIG 4 is a diagram showing the second electrode layer and the insulating film. The membrane portion 21a has an edge E2c e The film portion 21a is disposed on the side surface 3c so as to continuously cover the second electrode layer E2 and the area of ​​the side surface 3c exposed from the external electrode 5. In this embodiment, the film portion 21a is in direct contact with the second electrode layer E2 and the side surface 3c. That is, the film portion 21a is disposed on the side surface 3c so as to continuously cover the second electrode layer E2 and the area of ​​the side surface 3c exposed from the external electrode 5. e On the side surface 3c, the membrane portion 21a is disposed so as to directly cover the edge E2c. e In the electrode portion 5c, the edge E2c of the second electrode layer E2 extends along the e A part of the second electrode layer E2, including the first electrode layer E1, is covered with the film portion 21a. The third electrode layer E3 of the electrode unit 5c is formed in a region exposed from the film portion 21a of the second electrode layer E2. 3, the width W1 of the film portion 21a is 5% or more of the width W2 of the external electrode 5. The width W1 is the length of the film portion 21a in the first direction D1. The width W2 of the external electrode 5 is the length of the external electrode 5 in the first direction D1.

[0043] As shown in FIG. 5, the film portion 21b is disposed on the edge E2a of the second electrode layer E2 included in the electrode portion 5a. e The second electrode layer and the insulating film are disposed on the side surface 3a so as to extend along the line . The membrane portion 21b has an edge E2a e The film portion 21b is disposed on the side surface 3a so as to continuously cover the second electrode layer E2 and the area of ​​the side surface 3a exposed from the external electrode 5. In this embodiment, the film portion 21b is in direct contact with the second electrode layer E2 and the side surface 3a. That is, the film portion 21b is disposed on the side surface 3a so as to continuously cover the second electrode layer E2 and the area of ​​the side surface 3a exposed from the external electrode 5. e On the side surface 3a, the membrane portion 21b is disposed so as to directly cover the edge E2a. e In the electrode portion 5a, the edge E2a of the second electrode layer E2 extends along the e A part of the second electrode layer E2, including the first electrode layer E1, is covered with the film portion 21b. The third electrode layer E3 of the electrode unit 5a is formed in a region exposed from the film portion 21b of the second electrode layer E2. The width W3 of the membrane portion 21b is 5% or more of the width W2 as shown in Fig. 2. The width W3 is the length of the membrane portion 21b in the first direction D1. The width W3 may be equal to or different from the width W1.

[0044] When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body 3 through the electrode portion 5c. The external force is transmitted to the electrode portion 5c from a solder fillet formed during solder mounting. The electronic device may include, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the electrode portion 5c has the second electrode layer E2. Therefore, an external force is unlikely to act on the element body 3 from the electrode portion 5c. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3.

[0045] There is also a risk that an external force acting on the multilayer capacitor C1 from the electronic device will act on the element body 3 through the electrode portions 5a. In the multilayer capacitor C1, the electrode portion 5a has the second electrode layer E2. Therefore, external force is unlikely to act from the electrode portion 5a to the element body 3. As a result, the multilayer capacitor C1 further suppresses the occurrence of cracks in the element body 3.

[0046] In the multilayer capacitor C1, the edge E2c of the second electrode layer E2 included in the electrode portion 5ce are covered by the film portion 21a. Therefore, even if metal ions are generated in the second electrode layer E2 of the electrode portion 5c due to an electric field generated between the internal electrodes 7, 9 and the second electrode layer E2 of the electrode portion 5c to which the internal electrodes 7, 9 are not electrically connected, the metal ions are unlikely to move from the second electrode layer E2 of the electrode portion 5c. In other words, the film portion 21a restricts the movement of the metal ions. As a result, the multilayer capacitor C1 suppresses the occurrence of migration.

[0047] In the multilayer capacitor C1, the edge E2a of the second electrode layer E2 included in the electrode portion 5a e is covered by the film portion 21b. Therefore, even if metal ions are generated in the second electrode layer E2 of the electrode portion 5a due to an electric field generated between the internal electrodes 7A, 9A and the second electrode layer E2 of the electrode portion 5a to which the internal electrodes 7A, 9A are not electrically connected, the metal ions are unlikely to move from the second electrode layer E2 of the electrode portion 5a. In other words, the film portion 21b restricts the movement of the metal ions. As a result, the multilayer capacitor C1 further suppresses the occurrence of migration.

[0048] The second electrode layer E2 contains a plurality of silver particles. Silver particles tend to cause migration more easily than, for example, copper particles. The multilayer capacitor C1 reliably suppresses the occurrence of migration even when the second electrode layer E2 contains a plurality of silver particles.

[0049] Next, the mounting structure of the multilayer capacitor C1 will be described with reference to Fig. 6. Fig. 6 is a diagram showing the mounting structure of the multilayer capacitor in accordance with this embodiment.

[0050] As shown in FIG. 6, the electronic component device includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic device. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE. Each pad electrode PE is arranged on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is arranged on the electronic device ED such that the side surface 3a constituting the mounting surface faces the main surface EDa. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to the main surface EDa. When the side surface 3c constitutes the mounting surface, each of the internal electrodes 7, 9 is located in a plane approximately perpendicular to the main surface EDa.

[0051] When the multilayer capacitor C1 is solder-mounted, molten solder wets and rises up the external electrodes 5 (third electrode layers E3). When the wetted solder solidifies, solder fillets SF are formed on the external electrodes 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillets SF.

[0052] Next, the configuration of a multilayer capacitor C11 according to a modified example of the first embodiment will be described with reference to Fig. 7. Fig. 7 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C11 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configuration of the electrode portion 5e. Below, the differences between the first embodiment described above and this modified example will be mainly described.

[0053] Each electrode portion 5e has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed so as to cover the entire first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 indirectly covers the end surface 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode unit 5e is located on the end surface 3e. The third electrode layer E3 of the electrode unit 5e is disposed on the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The second electrode layer E2 of each of the electrode units 5a, 5c, and 5e is integrally formed.

[0054] The configuration in which the electrode portion 5e has the second electrode layer E2 relieves the stress acting on the solder fillet formed on the electrode portion 5e, and therefore the multilayer capacitor C11 suppresses the occurrence of solder cracks.

[0055] Next, the configuration of a multilayer capacitor C12 according to a modified example of the first embodiment will be described with reference to Fig. 8. Fig. 8 is a diagram showing a cross-sectional configuration of the multilayer capacitor according to the modified example of the first embodiment. The multilayer capacitor C12 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configurations of the electrode portions 5a and the insulating film 21. Below, the differences between the first embodiment described above and this modified example will be mainly described.

[0056] As shown in FIG. 8, the electrode portion 5a does not necessarily have to have the second electrode layer E2. The third electrode layer E3 of the electrode unit 5a is disposed on the first electrode layer E1. In the electrode unit 5a, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode unit 5a, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in the electrode unit 5a, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the side surface 3a.

[0057] In a configuration in which the electrode portion 5a does not have the second electrode layer E2, the second electrode layer E2 and the internal electrodes 7, 9, which are not electrically connected to each other, do not face each other in the second direction D2. Therefore, the insulating film 21 does not need to have the film portion 21b. Even in this case, the multilayer capacitor C12 further suppresses the occurrence of migration. In a configuration in which the electrode portion 5a does not have the second electrode layer E2, the insulating film 21 does not need to have the film portion 21b, as shown in Fig. 8. Even in a configuration in which the insulating film 21 does not have the film portion 21b, the insulating film 21 has the film portion 21a, similar to the multilayer capacitor C1 shown in Fig. 3.

[0058] Next, the configuration of a multilayer capacitor C13 according to a modified example of the first embodiment will be described with reference to Figs. 9 to 11. Figs. 9, 10, and 11 are diagrams showing the cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C13 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configurations of the internal electrodes 7A, 9A and the insulating film 21. Below, the differences between the first embodiment described above and this modified example will be mainly described.

[0059] As shown in Figures 9 and 10, the internal electrode 7A has a pair of ends 7Ae1, 7Ae2 facing each other in the first direction D1. The end 7Ae1 is exposed to the end surface 3e. The end 7Ae2 is located within the element body 3. As shown in Figures 9 and 11, the internal electrode 9A has a pair of ends 9Ae1, 9Ae2 facing each other in the first direction D1. The end 9Ae1 is exposed to the end surface 3e. The end 9Ae2 is located within the element body 3. For example, when each of the ends 7Ae1, 9Ae1 constitutes a first end, each of the ends 7Ae2, 9Ae2 constitutes a second end.

[0060] The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a. Each second electrode layer E2 located on the same side surface 3a has an edge E2a e On the same side surface 3a, the edge E2a of one of the second electrode layers E2 e The edge E2a of the other second electrode layer E2 e and is opposed to

[0061] As shown in FIG. 9, the length L11 of the internal electrode 7A in the first direction D1 from the reference plane PL1 is a distance L11 between the edge E2a of the second electrode layer E2 electrically connected to the internal electrode 7A and the reference plane PL1. e Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the second direction D2, the length L21 in the first direction D1 from the end 7A e2 is exposed from the second electrode layer E2 to which the internal electrode 7A is electrically connected. The length L11 is a distance from the reference plane PL1 to the end edge E2a of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. e The length L31 in the first direction D1 from the internal electrode 7A to the second electrode layer E2 to which the internal electrode 7A is not electrically connected is smaller than the length L31 in the first direction D1 from the internal electrode 7A to the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected are viewed from the second direction D2, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected do not overlap each other. The reference plane PL1 includes an end surface 3e where an end 7Ae1 of the internal electrode 7A is exposed. For example, when the length L11 constitutes a first length, the length L21 constitutes a second length, and the length L31 constitutes a third length.

[0062] The length L12 of the internal electrode 9A in the first direction D1 from the reference plane PL2 is a distance L12 between the end edge E2a of the second electrode layer E2 electrically connected to the internal electrode 9A and the reference plane PL2. e Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the second direction D2, the length L22 in the first direction D1 from the end 9A e2 is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected. The length L12 is a distance from the reference plane PL2 to the end edge E2a of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. e The length L32 in the first direction D1 from the internal electrode 9A to the second electrode layer E2 to which the internal electrode 9A is not electrically connected is smaller than the length L32 in the first direction D1 from the internal electrode 9A to the second electrode layer E2 to which the internal electrode 9A is not electrically connected. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the second direction D2, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap each other. The reference plane PL2 includes an end surface 3e where an end 9Ae1 of the internal electrode 9A is exposed. For example, when the length L12 constitutes a first length, the length L22 constitutes a second length, and the length L32 constitutes a third length.

[0063] A length L41 in the first direction D1 from the reference plane PL1 to the other end of the internal electrode 9 is smaller than the length L21. Therefore, when the internal electrode 9 that is not electrically connected to the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed in the second direction D2, the internal electrode 9 and the second electrode layer E2 to which the internal electrode 7A is electrically connected overlap each other. A length L42 in the first direction D1 from the reference plane PL2 to the other end of the internal electrode 7 is smaller than the length L22. Therefore, when the internal electrode 7 that is not electrically connected to the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed in the second direction D2, the internal electrode 7 and the second electrode layer E2 to which the internal electrode 9A is electrically connected overlap each other.

[0064] Length L11 and length L12 may be the same or different. Length L21 and length L22 may be the same or different. Length L31 and length L32 may be the same or different. Length L41 and length L42 may be the same or different.

[0065] The multilayer capacitor C13 includes a plurality of conductors 11 and 13. The multilayer capacitor C13 includes two conductors 11 and 13. In Fig. 10 and Fig. 11, for the sake of explanation, the internal electrodes 7 and 9 (internal electrodes 7A and 9A) and the conductors 11 and 13 are intentionally illustrated shifted from each other in the third direction D3. The conductor 11 is located in the same layer as the internal electrode 7A and is spaced apart from the internal electrode 7A. The conductor 11 has one end exposed at the corresponding end face 3e. One end of the conductor 11 is exposed at the end face 3e where one end of the internal electrode 9 is exposed. One end of the conductor 11 is entirely covered by the corresponding electrode portion 5e. The conductor 11 is directly connected to the corresponding electrode portion 5e. The conductor 11 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor C13, the conductor 11 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. That is, the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected. The conductor 13 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. The conductor 13 has one end exposed at the corresponding end face 3e. One end of the conductor 13 is exposed at the end face 3e where one end of the internal electrode 7 is exposed. One end of the conductor 13 is entirely covered by the corresponding electrode portion 5e. The conductor 13 is directly connected to the corresponding electrode portion 5e. The conductor 13 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor C13, the conductor 13 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. That is, the conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected. The conductors 11 and 13 form dummy conductors that are unlikely to contribute to the formation of capacitance.

[0066] In the multilayer capacitor C13, the lengths L11 and L12 are greater than the lengths L21 and L22. Therefore, the internal electrodes 7 and 9 adjacent to the internal electrodes 7A and 9A in the second direction D2 and the second electrode layer E2 included in the electrode portion 5a adjacent to the internal electrodes 7A and 9A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to each other. The lengths L11 and L12 are shorter than the lengths L31 and L32. Therefore, the internal electrodes 7A and 9A are unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion 5a to which the internal electrodes 7A and 9A are not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7A and 9A that are not electrically connected to each other. As a result, the multilayer capacitor C13 further suppresses the occurrence of migration. Therefore, the insulating film 21 does not need to have the film portion 21b.

[0067] In the multilayer capacitor C13, the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7A is not electrically connected. The conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9A is not electrically connected. In a configuration in which the conductors 11 and 13 are located in the same layer as the internal electrodes 7A and 9A, structural defects are unlikely to occur in the element body 3.

[0068] Next, the configuration of a multilayer capacitor C14 according to a modified example of the first embodiment will be described with reference to Figs. 12 to 14. Figs. 12, 13, and 14 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the modified example of the first embodiment. The multilayer capacitor C14 according to this modified example is generally similar to or the same as the multilayer capacitor C13 shown in Figs. 9 to 11, but this modified example differs from the multilayer capacitor C13 in terms of the configuration of each conductor 11, 13. Below, the differences between the multilayer capacitor C13 and this modified example will be mainly described.

[0069] The multilayer capacitor C14 includes a pair of conductors 11, 13. For ease of explanation, the internal electrodes 7A, 9A and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3 in Figures 13 and 14. In the multilayer capacitor C14 as well, the conductors 11, 13 form dummy conductors that are unlikely to contribute to the formation of capacitance.

[0070] The conductor 11 is adjacent to one side surface 3a in the second direction D2. The conductor 11 is adjacent to the internal electrode 9A in the second direction D2. The conductor 11 is located between one side surface 3a and the internal electrode 9A. The conductor 11 includes a portion 11a and a portion 11b. The portion 11a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is arranged on one side surface 3a. Thus, the conductor 11 faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is not electrically connected. The portion 11b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A is electrically connected and which is disposed on one side surface 3a. For example, if portion 11a constitutes a first portion, portion 11b constitutes a second portion.

[0071] The portion 11a is spaced apart from the portion 11b in the first direction D1 and is not electrically connected to any of the second electrode layers E2. The portion 11a does not have an end exposed on the surface of the element body 3. The portion 11b is electrically connected to the second electrode layer E2 facing the portion 11b in the second direction D2. The portion 11b has an end exposed at the end face 3e where the internal electrode 9A is exposed. The end of the portion 11b exposed at the end face 3e is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9A is electrically connected. The portion 11b is electrically connected to the external electrode 5 to which the internal electrode 9A is electrically connected.

[0072] The conductor 13 is adjacent to the other side surface 3a in the second direction D2. The conductor 13 is adjacent to the internal electrode 7A in the second direction D2. The conductor 13 is located between the other side surface 3a and the internal electrode 7A. The conductor 13 includes a portion 13a and a portion 13b. The portion 13a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is arranged on the other side surface 3a. Thus, the conductor 13 faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected. The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is arranged on the other side surface 3a.

[0073] The portion 13a is spaced apart from the portion 13b in the first direction D1 and is not electrically connected to any of the second electrode layers E2. The portion 13a does not have an end exposed on the surface of the element body 3. The portion 13b is electrically connected to the second electrode layer E2 facing the portion 13b in the second direction D2. The portion 13b has an end exposed at the end face 3e where the internal electrode 7A is exposed. The end of the portion 13b exposed at the end face 3e is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7A is electrically connected. The portion 13b is electrically connected to the external electrode 5 to which the internal electrode 7A is electrically connected. For example, if portion 13a constitutes a first portion, portion 13b constitutes a second portion.

[0074] The end 7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. In the positional relationship between the internal electrode 9A, the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3a, and the conductor 13 (portion 13a), the conductor 13 (portion 13a) is located between the internal electrode 9A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3a do not face each other in the second direction D2.

[0075] The end 9Ae2 overlaps with the conductor 11 (portion 11a) when viewed from the second direction D2. In the positional relationship between the internal electrode 7A, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a, and the conductor 11 (portion 11a), the conductor 11 (portion 11a) is located between the internal electrode 7A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a do not face each other in the second direction D2.

[0076] In the multilayer capacitor C14, the conductor 11 is located between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The conductor 11 separates the second electrode layer E2 from the internal electrode 7A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. The conductor 13 is located between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. The conductor 13 separates the second electrode layer E2 from the internal electrode 9A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. As a result, the multilayer capacitor C14 further suppresses the occurrence of migration. Therefore, the insulating film 21 does not need to have the film portion 21b.

[0077] In the multilayer capacitor C14, the conductor 11 includes a portion 11a and a portion 11b, and the conductor 13 includes a portion 13a and a portion 13b. The portion 11a faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A adjacent to the conductor 11 in the second direction D2 is not electrically connected. The portion 11b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A is electrically connected. The portion 13a faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A adjacent to the conductor 13 in the second direction D2 is not electrically connected. The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected. In the multilayer capacitor C14, the configuration on one end face 3e side from the center in the first direction D1 is unlikely to differ from the configuration on the other end face 3e side from the center in the first direction D1. Therefore, structural defects are unlikely to occur in the element body 3.

[0078] In the multilayer capacitor C14, the end 7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The end 9Ae2 overlaps with the conductor 11 (portion 11a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor C14 further suppresses the occurrence of migration.

[0079] Next, the structure of a multilayer capacitor C15 according to a modified example of the first embodiment will be described with reference to Figs. 15 to 17. Figs. 15, 16, and 17 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C15 according to this modified example is generally similar to or the same as the multilayer capacitor C14 shown in Figs. 12 to 14, but this modified example differs from the multilayer capacitor C14 in terms of the structures of the conductors 11, 13. The following mainly describes the differences between the multilayer capacitor C14 and this modified example.

[0080] In the multilayer capacitor C15, the portion 11a and the portion 11b are integral. The conductor 11 has no end exposed on the surface of the element body 3. The conductor 11 is not connected to any of the external electrodes 5. In other words, the conductor 11 is not electrically connected to the second electrode layer E2 either. Portions 13a and 13b are integral. Conductor 13 has no ends exposed on the surface of element body 3. Conductor 13 is not connected to any of the external electrodes 5. In other words, conductor 13 is not electrically connected to the second electrode layer E2 either.

[0081] The end 7Ae2 faces the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a in the second direction D2. That is, the end 7Ae2 is exposed from the conductor 13 (portion 13a) when viewed from the second direction D2. The end 9Ae2 faces the second electrode layer E2, which is not electrically connected to the internal electrode 9A and is disposed on one side surface 3a, in the second direction D2. That is, the end 9Ae2 is exposed from the conductor 11 (portion 11a) when viewed from the second direction D2. In the multilayer capacitor C15, the length of the internal electrodes 7, 9 in the second direction D2 is large, making it possible to increase the capacitance of the multilayer capacitor.

[0082] Next, the configuration of a multilayer capacitor C16 according to a modified example of the first embodiment will be described with reference to Figs. 18 and 19. Figs. 18 and 19 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the modified example of the first embodiment. The multilayer capacitor C16 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configurations of the electrode portions 5a, 5c and the insulating film 21. Below, the differences between the first embodiment described above and this modified example will be mainly described.

[0083] In the multilayer capacitor C16, the film portion 21a is in direct contact with the third electrode layer E3 and the side surface 3c. e In the electrode portion 5c, the edge E2c of the second electrode layer E2 is disposed so as to indirectly cover the side surface 3c and directly cover the side surface 3c. e A part including the above is indirectly covered by the film portion 21a. The film portion 21b is in direct contact with the third electrode layer E3 and the side surface 3a. e In the electrode portion 5a, the edge E2a of the second electrode layer E2 is disposed so as to indirectly cover the side surface 3a and directly cover the side surface 3a. e A part including the above is indirectly covered by the film portion 21b. In the multilayer capacitor C16, the second electrode layer E2 of the electrode portion 5a is formed so as to cover the entire first electrode layer E1 of the electrode portion 5a. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the entire first electrode layer E1 of the electrode portion 5c.

[0084] In the multilayer capacitor C16, even if metal ions are generated in the second electrode layer E2 of the electrode unit 5c due to an electric field generated between the internal electrodes 7, 9 and the second electrode layer E2 of the electrode unit 5c to which the internal electrodes 7, 9 are not electrically connected, the metal ions are unlikely to move from the second electrode layer E2 of the electrode unit 5c. That is, the film portion 21a restricts the movement of the metal ions. As a result, the multilayer capacitor C16 suppresses the occurrence of migration. Even if metal ions are generated in the second electrode layer E2 of the electrode unit 5a due to an electric field generated between the internal electrodes 7A, 9A and the second electrode layer E2 of the electrode unit 5a to which the internal electrodes 7A, 9A are not electrically connected, the metal ions are unlikely to move from the second electrode layer E2 of the electrode unit 5a. That is, the film portion 21b restricts the movement of the metal ions. As a result, the multilayer capacitor C16 further suppresses the occurrence of migration.

[0085] Second Embodiment The configuration of the multilayer capacitor C2 in accordance with the second embodiment will be described with reference to Figs. 20 to 22. Fig. 20 is a perspective view of the multilayer capacitor in accordance with the second embodiment. Figs. 21 and 22 are views showing a cross-sectional configuration of the multilayer capacitor in accordance with the second embodiment. The multilayer capacitor C2 is generally similar to or the same as the multilayer capacitor C1, but the multilayer capacitor C2 differs from the multilayer capacitor C1 in terms of the configuration of the second electrode layer E2. The multilayer capacitor C2 differs from the multilayer capacitor C1 in that it does not include an insulating film 21. The following mainly describes the differences between the multilayer capacitor C1 and the multilayer capacitor C2. In this embodiment as well, the electronic component is, for example, the multilayer capacitor C2.

[0086] 20 to 22, the multilayer capacitor C2 includes an element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The multilayer capacitor C2 does not include the insulating film 21 that the multilayer capacitor C1 includes. In this embodiment, the multilayer capacitor C2 includes a pair of external electrodes 5. The external electrode 5 has a plurality of electrode portions 5a, 5c, and 5e. Each of the electrode portions 5a and 5c has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. Each of the electrode portions 5e has a first electrode layer E1 and a third electrode layer E3.

[0087] The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each second electrode layer E2 located on the same side surface 3c has an edge E2c e On the same side surface 3c, the edge E2c of one of the second electrode layers E2 e is the edge E2c of the other second electrode layer E2 e and is opposed to In the electrode portion 5c, each second electrode layer E2 includes a region E2c1 and a region E2c2. The region E2c2 is closer to the edge E2c than the region E2c1. e Located near the edge E2c e The metal particle content in region E2c2 is smaller than the metal particle content in region E2c1. The metal particle content in region E2c2 is, for example, less than 30 vol.%. The metal particle content in region E2c1 is, for example, 30 vol.% or more. In this embodiment, the metal particle content in region E2c2 is about 25 vol.%, and the metal particle content in region E2c1 is about 50 vol.%.

[0088] The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a. Each second electrode layer E2 located on the same side surface 3a has an edge E2a e On the same side surface 3a, the edge E2a of one of the second electrode layers E2 e The edge E2a of the other second electrode layer E2 e and is opposed to In the electrode portion 5a, each second electrode layer E2 includes a region E2a1 and a region E2a2. The region E2a2 is closer to the edge E2a than the region E2a1. e Located near the edge E2a eThe metal particle content in region E2a2 is smaller than the metal particle content in region E2a1. The metal particle content in region E2a2 is, for example, less than 30 vol.%. The metal particle content in region E2a1 is, for example, 30 vol.% or more. In this embodiment, the metal particle content in region E2a2 is about 25 vol.%, and the metal particle content in region E2a1 is about 50 vol.%.

[0089] For example, if region E2c1 constitutes a first region, region E2c2 constitutes a second region, region E2a1 constitutes a third region, and region E2a2 constitutes a fourth region. For example, if the content of metal particles in region E2c1 constitutes a first content, the content of metal particles in region E2c2 constitutes a second content, the content of metal particles in region E2a1 constitutes a third content, and the content of metal particles in region E2a2 constitutes a fourth content.

[0090] A width W4 of the region E2c2 is 5% or more of the width W2, as shown in Fig. 21. The width W4 is the length of the region E2c2 in the first direction D1. The width W5 of the region E2a2 is 5% or more of the width W2 as shown in Fig. 22. The width W5 is the length of the region E2a2 in the first direction D1. The width W5 may be equal to or different from the width W4.

[0091] In the multilayer capacitor C2, the electrode portion 5c has the second electrode layer E2. Therefore, the multilayer capacitor C2 suppresses the occurrence of cracks in the element body 3, similar to the multilayer capacitor C1. In the multilayer capacitor C2, the electrode portion 5a has the second electrode layer E2. Therefore, the multilayer capacitor C2 can further suppress the occurrence of cracks in the element body 3, similar to the multilayer capacitor C1.

[0092] In the multilayer capacitor C2, the region E2c2 is the edge E2c of the second electrode layer E2 included in the electrode portion 5c. eThe content of metal particles in the region E2c2 is smaller than the content of metal particles in the region E2c1. Even if metal ions are generated in the second electrode layer E2 of the electrode portion 5c by an electric field generated between the internal electrodes 7, 9 and the second electrode layer E2 of the electrode portion 5c to which the internal electrodes 7, 9 are not electrically connected, the amount of metal ions generated in the region E2c2 is smaller than that in the region E2c1. Therefore, in the multilayer capacitor C2, the amount of metal ions that migrate from the second electrode layer E2 of the electrode portion 5c is smaller than that in the case where the second electrode layer E2 of the electrode portion 5c is configured from the region E2c1. As a result, the multilayer capacitor C2 suppresses the occurrence of migration.

[0093] In the multilayer capacitor C2, the region E2a2 is located at the edge E2a of the second electrode layer E2 included in the electrode portion 5a. e The content of metal particles in the region E2a2 is smaller than that in the region E2a1. Even if metal ions are generated in the second electrode layer E2 of the electrode portion 5a by an electric field generated between the internal electrodes 7A, 9A and the second electrode layer E2 of the electrode portion 5a to which the internal electrodes 7A, 9A are not electrically connected, the amount of metal ions generated in the region E2a2 is smaller than that in the region E2a1. Therefore, in the multilayer capacitor C2, the amount of metal ions that migrate from the second electrode layer E2 of the electrode portion 5a is smaller than that in the multilayer capacitor C2 in a configuration in which the second electrode layer E2 of the electrode portion 5a is composed of the region E2a1. As a result, the multilayer capacitor C2 further suppresses the occurrence of migration.

[0094] The second electrode layer E2 contains a plurality of silver particles. Silver particles tend to cause migration more easily than, for example, copper particles. The multilayer capacitor C2 reliably suppresses the occurrence of migration even when the second electrode layer E2 contains a plurality of silver particles.

[0095] Next, the configuration of a multilayer capacitor C21 according to a modified example of the second embodiment will be described with reference to FIG. 23. FIG. 23 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C21 according to this modified example is generally similar or the same as the above-mentioned multilayer capacitor C2, but this modified example differs from the above-mentioned second embodiment in terms of the configuration of the electrode portion 5e. The following mainly describes the differences between the above-mentioned second embodiment and this modified example. This modified example is similar to the multilayer capacitor C11 shown in FIG. 7 in terms of the configuration of the electrode portion 5e.

[0096] Like the multilayer capacitor C11, each electrode portion 5e has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The configuration in which the electrode portion 5e has the second electrode layer E2 relieves the stress acting on the solder fillet formed on the electrode portion 5e, and therefore the multilayer capacitor C21 suppresses the occurrence of solder cracks.

[0097] Next, the configuration of a multilayer capacitor C22 according to a modified example of the second embodiment will be described with reference to FIG. 24. FIG. 24 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C22 according to this modified example is generally similar or the same as the above-mentioned multilayer capacitor C2, but this modified example differs from the above-mentioned second embodiment in terms of the configuration of the electrode portion 5a. The following mainly describes the differences between the above-mentioned second embodiment and this modified example. This modified example is similar to the multilayer capacitor C12 shown in FIG. 8 in terms of the configuration of the electrode portion 5a.

[0098] The electrode portion 5a may not have the second electrode layer E2, similar to the electrode portion 5a of the multilayer capacitor C12. In the configuration in which the electrode portion 5a does not have the second electrode layer E2, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to each other do not face each other in the second direction D2. Therefore, the occurrence of migration is further suppressed in the multilayer capacitor C22 as well.

[0099] Next, the structure of a multilayer capacitor C23 according to a modified example of the second embodiment will be described with reference to Figs. 25 to 27. Figs. 25, 26, and 27 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C23 according to this modified example is generally similar or the same as the above-mentioned multilayer capacitor C2, but this modified example differs from the above-mentioned second embodiment in terms of the structure of the internal electrodes 7A, 9A. The following mainly describes the differences between the above-mentioned second embodiment and this modified example. This modified example is similar to the multilayer capacitor C13 shown in Figs. 9 to 11 in terms of the structure of the internal electrodes 7A, 9A.

[0100] In the multilayer capacitor C23, similarly to the multilayer capacitor C13, the lengths L11 and L12 are greater than the lengths L21 and L22. In the multilayer capacitor C23, the length L21 is the distance from the reference plane PL1 to the edge E2a of the second electrode layer E2 electrically connected to the internal electrode 7A. e The length L22 is the length in the first direction D1 from the reference plane PL2 to the edge E2a of the second electrode layer E2 that is electrically connected to the internal electrode 9A. e The length in the first direction D1 is from the internal electrode 7A, 9A to the internal electrode 7A. Therefore, the internal electrodes 7, 9 adjacent to the internal electrodes 7A, 9A in the second direction D2 and the second electrode layer E2 included in the electrode portion 5a adjacent to the internal electrodes 7A, 9A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to each other. The lengths L11 and L12 are shorter than the lengths L31 and L32. In the multilayer capacitor C23, the length L31 is the distance from the reference plane PL1 to the end edge E2a of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. e The length L32 is the length in the first direction D1 from the reference plane PL2 to the end edge E2a of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. eThe length in the first direction D1 is from the first electrode layer E2 to the second electrode layer E3. Therefore, the internal electrodes 7A, 9A are unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion 5a to which the internal electrodes 7A, 9A are not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7A, 9A, which are not electrically connected to each other. As a result, the multilayer capacitor C23 further suppresses the occurrence of migration. Therefore, the second electrode layer E2 included in the electrode portion 5a does not need to have the region E2a2. Although not shown in the drawings, the second electrode layer E2 included in the electrode portion 5a may have the region E2a2.

[0101] Next, the structure of a multilayer capacitor C24 according to a modified example of the second embodiment will be described with reference to Figs. 28 to 30. Figs. 28, 29, and 30 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C24 according to this modified example is generally similar or the same as the multilayer capacitor C23 shown in Figs. 25 to 27, but this modified example differs from the multilayer capacitor C23 in terms of the structures of the conductors 11 and 13. The following mainly describes the differences between the multilayer capacitor C23 and this modified example. This modified example is similar to the multilayer capacitor C14 shown in Figs. 12 to 14 in terms of the structures of the conductors 11 and 13.

[0102] The multilayer capacitor C24, like the multilayer capacitor C14, includes a pair of conductors 11, 13. For the sake of explanation, the internal electrodes 7A, 9A and the conductors 11, 13 are intentionally illustrated in the third direction D3 in Figures 29 and 30. In the multilayer capacitor C24, the conductors 11, 13 also form dummy conductors that are unlikely to contribute to the formation of capacitance. In the multilayer capacitor C24, similarly to the multilayer capacitor C14, the conductor 11 is located between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. Therefore, even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. The conductor 13 is located between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. Therefore, even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. As a result, the multilayer capacitor C24 further suppresses the occurrence of migration. Therefore, the second electrode layer E2 included in the electrode portion 5a does not need to have the region E2a2. Although not shown in the drawings, the second electrode layer E2 included in the electrode portion 5a may have the region E2a2.

[0103] Next, the structure of a multilayer capacitor C25 according to a modified example of the second embodiment will be described with reference to Figs. 31 to 33. Figs. 31, 32, and 33 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor according to this modified example is generally similar or the same as the multilayer capacitor C24 shown in Figs. 28 to 30, but this modified example differs from the multilayer capacitor C24 in terms of the structures of the conductors 11 and 13. The following mainly describes the differences between the multilayer capacitor C24 and this modified example. This modified example is similar to the multilayer capacitor C15 in terms of the structures of the conductors 11 and 13.

[0104] In the multilayer capacitor C25, the portion 11a and the portion 11b are integral. The conductor 11 has no end exposed on the surface of the element body 3. The conductor 11 is not connected to any of the external electrodes 5. In other words, the conductor 11 is not electrically connected to the second electrode layer E2 either. Portions 13a and 13b are integral. Conductor 13 has no ends exposed on the surface of element body 3. Conductor 13 is not connected to any of the external electrodes 5. In other words, conductor 13 is not electrically connected to the second electrode layer E2 either. In the multilayer capacitor C25, the second electrode layer E2 included in the electrode portion 5a does not have to have the region E2a2. Although not shown in the drawings, the second electrode layer E2 included in the electrode portion 5a may have the region E2a2.

[0105] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.

[0106] In each of the modified examples shown in FIGS. 8 to 19 and 24 to 33, similarly to each of the modified examples shown in FIGS. 7 and 23, the electrode portion 5e may have a second electrode layer E2.

[0107] In the present embodiment and the modified example, the multilayer capacitors C1, C11 to C16, C2, and C21 to C25 are used as examples of electronic components, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer composite components, or electronic components other than multilayer electronic components. [Explanation of symbols]

[0108] 3...Element body, 3a,3c...Side surface, 3e...End surface, 5...External electrode, 5a,5c,5e...Electrode part, 7,9,7A,9A...Internal electrode, 11,13...Conductor, 21...Insulating film, 21a,21b...Membrane part, C1, C11~C16 ,C2,C21~C25...Multilayer capacitor, D1...First direction, D2...Second direction, D3...Third direction, E1...First electrode layer, E2...Second electrode layer, E2a1,E2a2,E2c1,E2c2...Second electrode layer area, E2a e ,E2c e ...edge of the second electrode layer, E3...third electrode layer, PL1, PL2...reference surfaces.

Claims

1. an element body having a rectangular parallelepiped shape, the element body having a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction, and a pair of second side faces facing each other in a third direction; a plurality of external electrodes disposed on both ends of the element body in the first direction; a plurality of internal electrodes arranged within the element body so as to be aligned in the second direction and electrically connected to corresponding ones of the plurality of external electrodes, Each of the external electrodes has a pair of first electrode portions that are respectively disposed on the pair of second side surfaces and include a conductive resin layer, In the two conductive resin layers located on the same second side surface, one of the conductive resin layers has an edge facing the other of the conductive resin layers, The conductive resin layer is a first region including a plurality of metal particles having a first content and a resin; a second region including a plurality of metal particles having a second content less than the first content and a resin; The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

2. Each of the external electrodes has a pair of second electrode portions that are respectively disposed on the pair of first side surfaces and include a conductive resin layer, In the two conductive resin layers located on the same first side surface, one of the conductive resin layers has an edge facing the other of the conductive resin layers, The conductive resin layer included in the second electrode portion disposed on the first side surface is a third region including a plurality of metal particles having a third content and a resin; a fourth region including a plurality of metal particles having a fourth content less than the third content and a resin; The electronic component according to claim 1 , wherein the fourth region is located closer to the edge of the conductive resin layer than the third region and includes the edge of the conductive resin layer.

3. The electronic component according to claim 1 , wherein the metal particles include silver particles.

4. Each of the external electrodes has a pair of second electrode portions that are respectively disposed on the pair of first side surfaces and include a conductive resin layer, In the two conductive resin layers located on the same first side surface, one of the conductive resin layers has an edge facing the other of the conductive resin layers, Among the plurality of internal electrodes, an outermost internal electrode located outermost in the second direction is adjacent to the second electrode portion to which the outermost internal electrode is electrically connected in the second direction, 2. The electronic component according to claim 1, wherein a surface including the end face to which the outermost internal electrode is exposed is taken as a reference surface, and a first length of the outermost internal electrode from the reference surface in the first direction is greater than a second length in the first direction from the reference surface to the edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which the second electrode portion includes, and is smaller than a third length from the reference surface to the edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which the second electrode portion includes.

5. a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode; 5. The electronic component according to claim 4, wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected.

6. a pair of dummy conductors each adjacent to a corresponding one of the pair of first side surfaces in the second direction; Each of the external electrodes has a pair of second electrode portions that are respectively disposed on the pair of first side surfaces and include a conductive resin layer, The electronic component according to claim 1 , wherein each of the dummy conductors is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and faces the conductive resin layer included in the second electrode portion in the second direction.

7. 7. The electronic component according to claim 1, wherein each of the external electrodes further comprises an electrode portion disposed on the end face and including a conductive resin layer.

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