Semiconductor Device

Abstract

This semiconductor device comprises an electroconductive member, a semiconductor element, and a joining layer. The electroconductive member has a principal surface and a back surface that face toward opposite sides from one another in the thickness direction. The semiconductor element includes: a body layer; and a plurality of electrodes that project toward the principal surface from a side of the body layer that opposes the principal surface in the thickness direction. The joining layer joins the principal surface and the plurality of electrodes. Each of the plurality of electrodes includes: a base part that is in contact with the body layer; and a columnar part that projects from the base part and is in contact with the joining layer. The plurality of electrodes include: a first electrode; and a second electrode that, when viewed along the thickness direction, is located closer to a peripheral edge of the body layer than the first electrode. When viewed along the thickness direction, the area of the columnar part of the second electrode is greater than the area of the columnar part of the first electrode.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device including a semiconductor element. [Background technology]

[0002] 2. Description of the Related Art Conventionally, semiconductor devices in which a semiconductor element is bonded to a conductive member (such as a lead) by flip mounting are widely known. Patent Document 1 discloses an example of such a semiconductor device.

[0003] In this semiconductor device, a plurality of electrodes of a semiconductor element (a semiconductor chip in Patent Document 1) are joined to a conductive member (a lead wire in Patent Document 1) by a bonding layer (a conductive bump in Patent Document 1). The plurality of electrodes of the semiconductor element face the conductive member.

[0004] During the manufacture of the semiconductor device, when a semiconductor element is bonded to a conductive member by flip-chip mounting, first, a plurality of electrodes of the semiconductor element are temporarily attached to the conductive member via a bonding layer. Next, the bonding layer is melted by reflow. At this time, thermal stress of the semiconductor element is generated by the reflow. This may cause the semiconductor element to warp in its thickness direction. When this warping becomes significant, the contact area of ​​the electrode with the bonding layer becomes smaller for each of a plurality of electrodes located relatively close to the periphery of the semiconductor element as viewed along the thickness direction. In this state, there is a concern that the conduction state of the electrode with respect to the conductive member to which the electrode is bonded may deteriorate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-85522 A Summary of the Invention [Problem to be solved by the invention]

[0006] In view of the above circumstances, one object of the present disclosure is to provide a semiconductor device capable of reducing warpage in the thickness direction of a semiconductor element that is flip-chip mounted during device manufacturing. [Means for solving the problem]

[0007] The semiconductor device provided by the present disclosure includes a conductive member having a main surface and a back surface facing opposite each other in a thickness direction; a semiconductor element having a main layer and a plurality of electrodes protruding toward the main surface from a side of the main layer facing the main surface in the thickness direction; and a bonding layer that bonds the main surface and the plurality of electrodes. Each of the plurality of electrodes has a base that contacts the main layer and a columnar portion that protrudes from the base and contacts the bonding layer. The plurality of electrodes includes a first electrode and a second electrode that is located closer to the periphery of the main layer than the first electrode when viewed along the thickness direction. When viewed along the thickness direction, the area of ​​the columnar portion of the second electrode is larger than the area of ​​the columnar portion of the first electrode.

[0008] Preferably, the height of the columnar portion of the second electrode is greater than the height of the columnar portion of the first electrode.

[0009] Preferably, the height of the columnar portion of the second electrode is not less than 110% and not more than 120% of the height of the columnar portion of the first electrode.

[0010] Preferably, the columnar portion of each of the plurality of electrodes has a tip surface facing the main surface and a side surface connected to the tip surface and facing in a direction perpendicular to the thickness direction, and the bonding layer is in contact with the tip surface and the side surface.

[0011] Preferably, the semiconductor element has a surface protective film covering the side of the main layer opposite the main surface in the thickness direction, and the tip surface of each of the multiple electrodes is located between the main surface and the surface protective film in the thickness direction.

[0012] Preferably, in each of the plurality of electrodes, the base portion and the columnar portion are in contact with the surface protection film.

[0013] Preferably, in at least any one of the plurality of electrodes, the columnar portion is located away from the surface protection film.

[0014] Preferably, the columnar portion of the second electrode is located away from the surface protection film.

[0015] Preferably, a recess is formed in the columnar portion of each of the plurality of electrodes, recessed from the tip surface toward the main body layer, and the bonding layer is in contact with the recess.

[0016] Preferably, the tip surface of each of the plurality of electrodes is convex and bulges toward the main surface.

[0017] Preferably, the columnar portion of the second electrode has a curved surface that forms a boundary between the tip surface and the side surface and bulges outwardly of the columnar portion in a convex manner.

[0018] Preferably, the conductive member includes a plurality of first leads and a plurality of second leads, the plurality of first leads extending in a first direction perpendicular to the thickness direction and arranged along a second direction perpendicular to both the thickness direction and the first direction, the plurality of second leads being located away from the plurality of first leads in the second direction, the main body layer having a semiconductor substrate and a semiconductor layer stacked on a side of the semiconductor substrate facing the main surface in the thickness direction, the semiconductor layer comprising a switching circuit and a control circuit conductive to the switching circuit, any one of the plurality of electrodes conductive to the switching circuit and joined to the main surface of any one of the plurality of first leads, and any one of the plurality of electrodes conductive to the control circuit and joined to the main surface of any one of the plurality of second leads.

[0019] Preferably, the semiconductor device further includes a sealing resin covering a portion of each of the multiple first leads and the multiple second leads and the semiconductor element, the sealing resin having a bottom surface facing the same side as the back surface in the thickness direction, and a pair of first side surfaces connected to the bottom surface and spaced apart from each other in the first direction, each of the multiple first leads includes a main portion extending in the first direction and a pair of side portions connected to both ends of the main portion in the first direction, each of the pair of side portions having a first end surface connected to the main surface and the back surface and facing the first direction, the back surface of each of the multiple first leads is exposed from the bottom surface, and the first end surface of one of the pair of side portions is exposed from each of the pair of first side surfaces so as to be flush with the first side surface, and in each of the multiple first leads, the dimension of the first end surface in the second direction is smaller than the dimension of the back surface of the main portion in the second direction.

[0020] Preferably, in at least any one of the multiple first leads, each of the pair of side portions has a narrowed portion formed extending from the main surface to the back surface and recessed inwardly from both sides in the second direction.

[0021] Preferably, in at least any one of the multiple first leads, each of the pair of side portions has a notch formed that extends from the main surface to the back surface, is recessed from the first end face in the first direction, and divides the first end face into two regions.

[0022] Preferably, each of the multiple second leads has a second end face connected to the main surface and the back surface and facing the second direction, the sealing resin has the bottom surface and a pair of second side surfaces connected to the pair of first side surfaces and positioned apart from each other in the second direction, the back surfaces of each of the multiple second leads are exposed from the bottom surface, and the second end face of each of the multiple second leads is exposed from one of the pair of second side surfaces so as to be flush with the second side surface.

[0023] Preferably, among the multiple first leads, the first lead located farthest from the multiple second leads includes multiple protrusions protruding from the main portion on a side away from the multiple second leads in the second direction, each of the multiple protrusions having a minor end surface connected to the main surface and the back surface and facing the second direction, and exposed from one of the pair of second side surfaces so that the minor end surface of each of the multiple protrusions is flush with the second side surface. Effect of the Invention

[0024] According to the semiconductor device according to the present disclosure, it is possible to reduce warpage in the thickness direction of a semiconductor element that is flip-chip mounted during the manufacture of the device.

[0025] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0026] [Figure 1] 1 is a perspective view of a semiconductor device according to a first embodiment of the present disclosure. [Diagram 2] 2 is a plan view of the semiconductor device shown in FIG. 1, seen through a sealing resin. [Diagram 3] 3 is a plan view of the semiconductor device corresponding to FIG. 2, with a portion of the semiconductor element further seen through compared to FIG. [Figure 4] 2 is a bottom view of the semiconductor device shown in FIG. 1. [Diagram 5] FIG. 2 is a front view of the semiconductor device shown in FIG. [Figure 6] 2 is a rear view of the semiconductor device shown in FIG. [Figure 7] 2 is a right side view of the semiconductor device shown in FIG. [Figure 8] FIG. 2 is a left side view of the semiconductor device shown in FIG. [Figure 9] FIG. 4 is a partially enlarged view of FIG. [Figure 10] FIG. 4 is a partially enlarged view of FIG. [Figure 11]FIG. 4 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 4 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 4 is a cross-sectional view taken along line XIII-XIII in FIG. [Figure 14] FIG. 4 is a cross-sectional view taken along line XIV-XIV in FIG. [Figure 15] FIG. 12 is a partially enlarged view of FIG. 11, showing the first electrode and its vicinity. [Figure 16] FIG. 12 is a partially enlarged view of FIG. 11, showing the second electrode and its vicinity. [Figure 17] 10 is a partially enlarged cross-sectional view of a semiconductor device according to a second embodiment of the present disclosure, showing a first electrode and its vicinity. [Figure 18] 18 is a partially enlarged cross-sectional view of the semiconductor device shown in FIG. 17, illustrating a second electrode and its vicinity. [Figure 19] 13 is a partially enlarged cross-sectional view of a semiconductor device according to a third embodiment of the present disclosure, showing a second electrode and its vicinity. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0028] [First embodiment] A semiconductor device A10 according to a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 16. The semiconductor device A10 includes a conductive member 10, a semiconductor element 20, a bonding layer 30, and a sealing resin 40. As shown in FIG. 1, the package format of the semiconductor device A10 is a QFN (Quad For Non-Lead Package). The semiconductor element 20 is a flip-chip type LSI. The semiconductor element 20 includes a switching circuit 212A and a control circuit 212B (each of which will be described later in detail). In the semiconductor device A10, the switching circuit 212A converts DC power (voltage) into AC power (voltage). The semiconductor device A10 is used, for example, as one element constituting a circuit of a DC / DC converter. Here, FIG. 2 shows the sealing resin 40 through the semiconductor element 20 for ease of understanding. FIG. 3 shows the semiconductor element 20 through the semiconductor element 20 (excluding the columnar portions 222 of the electrodes 22 described later) in comparison with FIG. 2 for ease of understanding. In these figures, the semiconductor element 20 and the sealing resin 40 are shown by imaginary lines (two-dot chain lines).

[0029] In the description of the semiconductor device A10, the thickness direction z of the conductive member 10 is referred to as the "thickness direction z". The direction perpendicular to the thickness direction z is referred to as the "first direction x". The direction perpendicular to both the thickness direction z and the first direction x is referred to as the "second direction y". As shown in Figures 1 and 2, the semiconductor device A10 is square-shaped when viewed along the thickness direction z. In addition, in the description of the semiconductor device A10, for convenience, the side in the second direction y where the multiple second leads 12 (described in detail later) are located is referred to as the "one side of the second direction y". The side in the second direction y where the multiple first leads 11 (described in detail later) are located is referred to as the "other side of the second direction y".

[0030] As shown in FIG. 2, the conductive member 10 supports the semiconductor element 20 and serves as a terminal for mounting the semiconductor device A10 on a wiring board. As shown in FIGS. 11 to 14, the conductive member 10 is partially covered with the sealing resin 40. The conductive member 10 has a main surface 101 and a back surface 102 that face opposite each other in the thickness direction z. The main surface 101 faces one side in the thickness direction z and faces the semiconductor element 20. The semiconductor element 20 is supported by the main surface 101. The main surface 101 is covered with the sealing resin 40. The back surface 102 faces the other side in the thickness direction z. The conductive member 10 is composed of a single lead frame. The lead frame is made of a material containing, for example, copper (Cu) or a copper alloy. The conductive member 10 includes a plurality of first leads 11, a plurality of second leads 12, and a pair of third leads 13.

[0031] As shown in FIG. 3 and FIG. 4, the first leads 11 are strip-shaped extending in the second direction y when viewed along the thickness direction z. The first leads 11 are arranged along the second direction y. In the example shown by the semiconductor device A10, the first leads 11 are composed of three terminals, namely, a first input terminal 11A, a second input terminal 11B, and an output terminal 11C. The first leads 11 are arranged in the order of the first input terminal 11A, the output terminal 11C, and the second input terminal 11B from one side to the other side in the second direction y. The first input terminal 11A and the second input terminal 11B receive DC power (voltage) to be converted in the semiconductor device A10. The first input terminal 11A is a positive pole (P terminal). The second input terminal 11B is a negative pole (N terminal). The output terminal 11C outputs AC power (voltage) converted by the switching circuit 212A configured in the semiconductor element 20.

[0032] As shown in FIG. 3, the first input terminal 11A is located between the multiple second leads 12 and the output terminal 11C in the second direction y. The output terminal 11C is located between the first input terminal 11A and the second input terminal 11B in the second direction y. Each of the first input terminal 11A and the output terminal 11C includes a main portion 111 and a pair of side portions 112. As shown in FIGS. 3 and 4, the main portion 111 extends in the first direction x. In the multiple first leads 11, the semiconductor element 20 is supported by the main surface 101 of the main portion 111. The pair of side portions 112 are connected to both ends of the main portion 111 in the first direction x. As shown in FIGS. 3, 4, 12, and 13, each of the pair of side portions 112 has a first end surface 112A. The first end surface 112A is connected to both the main surface 101 and the back surface 102 of the first lead 11, and faces the first direction x. The first end surface 112A is exposed from the sealing resin 40.

[0033] 9, a constricted portion 112B is formed on each of a pair of side portions 112 of the first input terminal 11A and the output terminal 11C. The constricted portion 112B extends from the main surface 101 to the back surface 102 of the first lead 11, and is recessed inwardly of the side portions 112 from both sides in the second direction y. The constricted portion 112B is in contact with the sealing resin 40. Due to the constricted portion 112B, in the first input terminal 11A and the output terminal 11C, the dimension b in the second direction y of each of the pair of first end faces 112A is smaller than the dimension B in the second direction y of the back surface 102 of the main portion 111.

[0034] As shown in FIG. 3, the second input terminal 11B is located on the other side of the second direction y than the output terminal 11C. Therefore, the second input terminal 11B is located on the other side of the multiple first leads 11 in the second direction y. The second input terminal 11B includes a main portion 111, a pair of side portions 112, and multiple protrusions 113. The multiple protrusions 113 protrude from the other side of the main portion 111 in the second direction y. The sealing resin 40 is filled between two adjacent protrusions 113. As shown in FIG. 12, each of the multiple protrusions 113 has a sub-end surface 113A. The sub-end surface 113A is connected to both the main surface 101 and the back surface 102 of the second input terminal 11B and faces the other side of the second direction y. The sub-end surface 113A is exposed from the sealing resin 40. As shown in FIG. 7, the multiple sub-end surfaces 113A are arranged at predetermined intervals along the first direction x.

[0035] As shown in FIG. 10, a cutout 112C is formed in each of the pair of side portions 112 of the second input terminal 11B. The cutout 112C extends from the main surface 101 to the back surface 102 of the second input terminal 11B, and is recessed in the first direction x from the first end surface 112A. This divides the first end surface 112A into two regions spaced apart from each other in the second direction y. The cutout 112C also makes the dimension b in the second direction y of each of the pair of first end surfaces 112A in the second input terminal 11B smaller than the dimension B in the second direction y of the back surface 102 of the main portion 111. The dimension b here is the sum of the dimension b1 in the second direction y of one region of the first end surface 112A and the dimension b2 in the second direction y of the other region of the first end surface 112A (b=b1+b2). Sealing resin 40 is filled in the cutout portion 112C.

[0036] 3 and 4, in each of the multiple first leads 11, the area of ​​the main surface 101 is larger than the area of ​​the back surface 102. In the example shown in semiconductor device A10, the areas of the back surfaces 102 of the first input terminal 11A and the output terminal 11C are equal to each other. The area of ​​the back surface 102 of the second input terminal 11B is larger than the areas of the back surfaces 102 of the first input terminal 11A and the output terminal 11C.

[0037] In each of the first input terminal 11A, the second input terminal 11B, and the output terminal 11C, the main surface 101 of the main portion 111 on which the semiconductor element 20 is supported may be plated with, for example, silver (Ag). Furthermore, in each of the first input terminal 11A, the second input terminal 11B, and the output terminal 11C, the back surface 102 exposed from the sealing resin 40, the pair of first end faces 112A, and the plurality of minor end faces 113A may be plated with, for example, tin (Sn). Note that instead of tin plating, a plurality of metal platings may be employed, for example, in which nickel (Ni), palladium (Pd), and gold (Au) are layered in this order.

[0038] As shown in FIG. 3, the second leads 12 are located on one side of the first leads 11 in the second direction y. One of the second leads 12 is a ground terminal of the control circuit 212B configured in the semiconductor element 20. To each of the other second leads 12, power (voltage) for driving the control circuit 212B or an electric signal for transmitting to the control circuit 212B is input. As shown in FIG. 3, FIG. 4, and FIG. 11, each of the second leads 12 has a second end surface 121. The second end surface 121 is connected to both the main surface 101 and the back surface 102 of the second lead 12 and faces one side of the second direction y. The second end surface 121 is exposed from the sealing resin 40. As shown in FIG. 8, the second end surfaces 121 are arranged at predetermined intervals along the first direction x.

[0039] 3 and 4, in each of the multiple second leads 12, the area of ​​the main surface 101 is larger than the area of ​​the back surface 102. The areas of the back surfaces 102 of the multiple second leads 12 are all equal. The back surfaces 102 of the multiple second leads 12 on which the semiconductor element 20 is supported may be plated with silver, for example. Furthermore, the back surfaces 102 and second end surfaces 121 of the multiple second leads 12 exposed from the sealing resin 40 may be plated with tin, for example. Instead of tin plating, multiple metal platings may be used in which nickel, palladium, and gold are layered in this order.

[0040] As shown in FIG. 3, the pair of third leads 13 are located between the first lead 11 (first input terminal 11A) and the plurality of second leads 12 in the second direction y. The pair of third leads 13 are spaced apart from each other in the first direction x. An electric signal or the like is input to each of the pair of third leads 13 to be transmitted to the control circuit 212B configured in the semiconductor element 20. As shown in FIGS. 3, 4, and 14, each of the pair of third leads 13 has a third end surface 131. The third end surface 131 is connected to both the main surface 101 and the back surface 102, and faces the first direction x. The third end surface 131 is exposed from the sealing resin 40. The third end surface 131 is arranged along the second direction y together with the first end surfaces 112A of the plurality of first leads 11.

[0041] 3 and 4, in each of the pair of third leads 13, the area of ​​the main surface 101 is larger than the area of ​​the back surface 102. The main surface 101 of the pair of third leads 13 on which the semiconductor element 20 is supported may be plated with, for example, silver. Furthermore, the back surface 102 and the third end surface 131 of the pair of third leads 13 exposed from the sealing resin 40 may be plated with, for example, tin. Note that, instead of tin plating, multiple metal platings may be employed in which nickel, palladium, and gold are layered in this order.

[0042] 11 to 14, the semiconductor element 20 is bonded to and supported by a conductive member 10 (a plurality of first leads 11, a plurality of second leads 12, and a pair of third leads 13) by flip-chip bonding. The semiconductor element 20 is covered with a sealing resin 40. As shown in FIGS. 12 to 18, the semiconductor element 20 has a main body layer 21, a plurality of electrodes 22, and a surface protection film 23.

[0043] The main body layer 21 forms a main portion of the semiconductor element 20. As shown in Fig. 15 and Fig. 16, the main body layer 21 has a semiconductor substrate 211, a semiconductor layer 212, and a passivation film 213. The thickness of the main body layer 21 (dimension in the thickness direction z) is not less than 100 µm and not more than 300 µm.

[0044] 15 and 16, the semiconductor substrate 211 supports therebelow a semiconductor layer 212, a passivation film 213, a plurality of electrodes 22, and a surface protection film 23. The semiconductor substrate 211 is made of a material containing, for example, silicon (Si) or silicon carbide (SiC) as a main component.

[0045] As shown in FIGS. 11 to 14, the semiconductor layer 212 is laminated on the side of the semiconductor substrate 211 facing the main surface 101 of the conductive member 10. The semiconductor layer 212 includes a plurality of types of p-type semiconductors and n-type semiconductors based on differences in the amount of elements to be doped. The semiconductor layer 212 includes a switching circuit 212A and a control circuit 212B that is conductive to the switching circuit 212A. The switching circuit 212A is a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor). In the example shown in the semiconductor device A10, the switching circuit 212A is divided into two regions, a high-voltage region (upper arm circuit) and a low-voltage region (lower arm circuit). Each region is configured by one n-channel MOSFET. The control circuit 212B includes a gate driver for driving the switching circuit 212A, a bootstrap circuit corresponding to the high voltage region of the switching circuit 212A, and the like, and performs control for normally driving the switching circuit 212A. A wiring layer (not shown) is formed in the semiconductor layer 212. The switching circuit 212A and the control circuit 212B are mutually conductive through the wiring layer.

[0046] 15 and 16, the passivation film 213 covers the lower surface of the semiconductor layer 212. The passivation film 213 has electrical insulation properties. The passivation film 213 is composed of, for example, a silicon oxide film (SiO2) in contact with the lower surface of the semiconductor layer 212 and a silicon nitride film (Si3N4) laminated on the silicon oxide film. The passivation film 213 is provided with a plurality of openings 213A penetrating in the thickness direction z.

[0047] As shown in FIGS. 11 to 14, the electrodes 22 protrude from the side of the main layer 21 facing the main surface 101 of the conductive member 10 in the thickness direction z toward the main surface 101 of the conductive member 10. The upper ends of the electrodes 22 are in contact with the semiconductor layer 212 of the main layer 21. The electrodes 22 are bonded to the main surface 101 of the conductive member 10. The electrodes 22 include a plurality of first electrodes 22A and a plurality of second electrodes 22B. As shown in FIGS. 2 and 3, as viewed along the thickness direction z, each of the second electrodes 22B is located closer to the periphery of the semiconductor element 20 than any of the first electrodes 22A. Any of the electrodes 22 is electrically connected to the switching circuit 212A of the semiconductor layer 212 and is bonded to any of the main surfaces 101 of the first leads 11. Any of the multiple electrodes 22 is electrically connected to the control circuit 212B of the semiconductor layer 212, and is joined to the main surface 101 of any of the multiple second leads 12. Furthermore, a pair of the multiple second electrodes 22B are electrically connected to the control circuit 212B, and are individually joined to the main surfaces 101 of a pair of third leads 13.

[0048] As shown in FIG. 15 and FIG. 16, each of the electrodes 22 has a base 221 and a columnar portion 222. The base 221 is in contact with the semiconductor layer 212 of the main body layer 21. As a result, the base 221 is electrically connected to either the switching circuit 212A of the semiconductor layer 212 or the control circuit 212B of the semiconductor layer 212. The base 221 contains aluminum (Al) or copper in its composition. As another configuration of the base 221, multiple metal layers of copper, nickel, and palladium may be laminated in this order from the semiconductor layer 212 downward. The base 221 is in contact with the passivation film 213 of the main body layer 21. A part of the base 221 is exposed from the opening 213A of the passivation film 213. The columnar portion 222 protrudes from the part of the base 221 exposed from the opening 213A toward the main surface 101 of the conductive member 10. The columnar portion 222 is, for example, cylindrical. The columnar portion 222 contains copper in its composition. The columnar portion 222 has a tip surface 222A and a side surface 222B. The tip surface 222A faces the main surface 101 of the conductive member 10. The side surface 222B is connected to the tip surface 222A and faces a direction perpendicular to the thickness direction z. In the semiconductor device A10, the columnar portion 222 has a recess 222C recessed from the tip surface 222A toward the main body layer 21. The multiple electrodes 22 are formed by electrolytic plating.

[0049] As shown in FIG. 3, the area of ​​each of the columnar portions 222 of the second electrodes 22B is larger than the area of ​​each of the columnar portions 222 of the first electrodes 22A when viewed along the thickness direction z. As shown in FIG. 15 and FIG. 16, the height h2 of each of the columnar portions 222 of the second electrodes 22B is larger than the height h1 of each of the columnar portions 222 of the first electrodes 22A. Here, in each of the electrodes 22, the heights h1 and h2 are the distances in the thickness direction z from the tip surface 222A to the boundary between the columnar portion 222 and the base portion 221. The height h2 of each of the columnar portions 222 of the second electrodes 22B is 110% to 120% of the height h1 of each of the columnar portions 222 of the first electrodes 22A.

[0050] 16, the columnar portion 222 of each of the second electrodes 22B has a curved surface 222D that forms a boundary between the tip surface 222A and the side surface 222B. The curved surface 222D bulges outward from the columnar portion 222 in a convex shape.

[0051] 15 and 16, the surface protective film 23 covers the side of the main body layer 21 facing the main surface 101 of the conductive member 10, i.e., the passivation film 213 of the main body layer 21. In each of the multiple electrodes 22, the tip surface 222A of the columnar portion 222 is located between the main surface 101 of the conductive member 10 and the surface protective film 23 in the thickness direction z. In the semiconductor device A10, the surface protective film 23 contacts both the base portion 221 and the columnar portion 222 of the multiple electrodes 22. The surface protective film 23 has electrical insulation properties. The surface protective film 23 is made of a material containing, for example, polyimide.

[0052] As shown in FIG. 15 and FIG. 16, the bonding layer 30 is in contact with both the main surface 101 of the conductive member 10 and the plurality of electrodes 22. The bonding layer 30 is conductive. As a result, each of the plurality of electrodes 22 is bonded to the main surface 101 of the conductive member 10 in a state of electrical continuity with the conductive member 10. The bonding layer 30 is, for example, a lead-free solder containing tin and silver in its composition. In each of the plurality of electrodes 22, the bonding layer 30 is in contact with both the tip surface 222A and the side surface 222B of the columnar portion 222. In the semiconductor device A10, the bonding layer 30 is also in contact with the recess 222C of the columnar portion 222.

[0053] 5 to 8, the sealing resin 40 has a top surface 41, a bottom surface 42, a pair of first side surfaces 431, and a pair of second side surfaces 432. The sealing resin 40 is made of a material containing, for example, a black epoxy resin.

[0054] 11 to 14, the top surface 41 faces the same side as the main surface 101 of the conductive member 10 in the thickness direction z. As shown in Figs. 5 to 8, the bottom surface 42 faces the opposite side to the top surface 41. As shown in Fig. 4, rear surfaces 102 of the multiple first leads 11, rear surfaces 102 of the multiple second leads 12, and rear surfaces 102 of the pair of third leads 13 are exposed from the bottom surface 42.

[0055] 7 and 8, the pair of first side surfaces 431 are connected to both the top surface 41 and the bottom surface 42, and face the first direction x. The pair of first side surfaces 431 are spaced apart from each other in the second direction y. As shown in FIGS. 12 to 14, the first end surfaces 112A of the multiple first leads 11 and the third end surface 131 of the third lead 13 are exposed from each of the pair of first side surfaces 431 so as to be flush with the first side surfaces 431.

[0056] As shown in Figs. 5 and 6, the pair of second side surfaces 432 are connected to the top surface 41, the bottom surface 42, and the pair of first side surfaces 431, and face the second direction y. The pair of second side surfaces 432 are spaced apart from each other in the first direction x. As shown in Fig. 11, the second end surfaces 121 of the multiple second leads 12 are exposed from the second side surface 432 located on one side in the second direction y so as to be flush with the second side surface 432. The multiple sub-end surfaces 113A of the second input terminal 11B (first lead 11) are exposed from the second side surface 432 located on the other side in the second direction y so as to be flush with the second side surface 432.

[0057] Next, the effects of the semiconductor device A10 will be described.

[0058] The semiconductor device A10 includes a conductive member 10 having a principal surface 101, a semiconductor element 20 having a plurality of electrodes 22, and a bonding layer 30 bonding the principal surface 101 to the plurality of electrodes 22. Each of the plurality of electrodes 22 has a base 221 in contact with the side of the main body layer 21 facing the principal surface 101, and a columnar portion 222 protruding from the base 221 toward the principal surface 101 and in contact with the bonding layer 30. As a result, the semiconductor element 20 is bonded to the conductive member 10 by flip-chip bonding.

[0059] Further, the electrodes 22 include a first electrode 22A and a second electrode 22B located closer to the periphery of the main body layer 21 of the semiconductor element 20 than the first electrode 22A when viewed along the thickness direction z. When viewed along the thickness direction z, the area of ​​the columnar portion 222 of the second electrode 22B is larger than the area of ​​the columnar portion 222 of the first electrode 22A. This increases the contact area of ​​the columnar portion 222 of the second electrode 22B with the bonding layer 30, thereby increasing the bonding strength of the columnar portion 222 with the bonding layer 30. Therefore, when the semiconductor element 20 is flip-chip mounted on the conductive member 10, if the main body layer 21 tries to warp up in the thickness direction z due to thermal stress acting on the main body layer 21 by reflow, the resistance acting on the second electrode 22B and resisting the warping up becomes larger. Therefore, according to the semiconductor device A10, it is possible to reduce warping in the thickness direction z of the semiconductor element 20 that is flip-chip mounted during the manufacture of the device.

[0060] The height h2 of the columnar portion 222 of the second electrode 22B is greater than the height h1 of the columnar portion 222 of the first electrode 22A. As a result, even if the main body layer 21 warps in the thickness direction z when the semiconductor element 20 is flip-chip mounted on the conductive member 10, the penetration amount of the columnar portion 222 of the second electrode 22B into the bonding layer 30 is ensured to be at least a certain amount. This occurs because the bonding layer 30 melts due to reflow, and the semiconductor element 20 sinks into the bonding layer 30 toward the conductive member 10 due to its own weight. In this case, in order to exert this effect, it is preferable that the height h2 of the columnar portion 222 of the second electrode 22B is 110% or more and 120% or less of the height h1 of the columnar portion 222 of the first electrode 22A. Therefore, even if the semiconductor element 20 warps in the thickness direction z during the manufacture of the semiconductor device A10, the deterioration of the conduction state of the second electrode 22B with respect to the conductive member 10 can be prevented.

[0061] The columnar portion 222 of the second electrode 22B has a curved surface 222D that forms a boundary between the tip surface 222A and the side surface 222B. The curved surface 222D bulges outward from the columnar portion 222 in a convex shape. When the semiconductor element 20 is flip-chip mounted on the conductive member 10, if the main body layer 21 is about to warp in the thickness direction z, stress is transmitted to the interface between the bonding layer 30 and the second electrode 22B. Therefore, by adopting this configuration, it is possible to reduce the concentration of the stress in the columnar portion 222 of the second electrode 22B.

[0062] In the semiconductor device A10, a recess 222C recessed from the tip surface 222A toward the main body layer 21 is formed in each of the columnar portions 222 of the multiple electrodes 22. The recess 222C is in contact with the bonding layer 30. This causes an anchor effect on the bonding layer 30 with respect to the columnar portion 222. This makes it possible to improve the bonding strength between the columnar portion 222 and the bonding layer 30.

[0063] A switching circuit 212A is configured in the semiconductor layer 212 of the main body layer 21 of the semiconductor element 20. At least one of the multiple electrodes 22 is electrically connected to the switching circuit 212A. Meanwhile, the back surfaces 102 of the multiple first leads 11, which are included in the conductive member 10 and to which at least one of the multiple electrodes 22 is joined, are exposed from the bottom surface 42 of the sealing resin 40. This allows the heat generated from the semiconductor element 20 by driving the switching circuit 212A during use of the semiconductor device A10 to be efficiently dissipated to the outside.

[0064] As described above, each of the multiple electrodes 22 has a base 221 and a columnar portion 222. The columnar portion 222 is made of a material containing copper. The columnar portion 222 is shorter in length and has a larger cross-sectional area than a bonding wire. Therefore, the parasitic resistance between the first lead 11 and the switching circuit 212A can be reduced compared to the case where the first lead 11 and the base 221 are connected by a bonding wire. The reduced parasitic resistance has the effect of reducing the on-resistance and noise in the switching circuit 212A.

[0065] Each of the multiple first leads 11 has a main portion 111 extending in a first direction x and a pair of side portions 112 connected to both ends of the main portion 111 in the first direction x. Each of the pair of side portions 112 has a first end surface 112A facing the first direction x and exposed from a first side surface 431 of the sealing resin 40. Each of the pair of first end surfaces 112A is flush with the first side surface 431. In the second direction y, the dimension b of each of the pair of first end surfaces 112A is smaller than the dimension B of the back surface 102 of the main portion 111. This allows the area of ​​each of the pair of first end surfaces 112A to be smaller than the area of ​​the corresponding surface in a conventional QFN semiconductor device. Therefore, when the semiconductor device A10 is manufactured by dividing the semiconductor device A10 into individual pieces by blade dicing, the generation of metal burrs on the pair of first end surfaces 112A is suppressed. When the generation of metal burrs is suppressed, the mountability of the semiconductor device A10 on the wiring board can be improved.

[0066] 9, a constricted portion 112B is formed on each of a pair of side portions 112 of the multiple first leads 11 (first input terminals 11A and output terminals 11C). This allows the dimension b of each of the pair of first end faces 112A in the second direction y to be smaller than the dimension B of the back surface 102 of the main portion 111 of the first lead 11. In addition, the constricted portion 112B is in contact with the sealing resin 40 in the first direction x. This prevents the multiple first leads 11 from slipping out of the pair of first side surfaces 431 of the sealing resin 40.

[0067] As shown in FIG. 10, a cutout 112C is formed in each of a pair of side portions 112 of the first lead 11 (second input terminal 11B). This also makes it possible to make the dimension b of each of the pair of first end faces 112A in the second direction y smaller than the dimension B of the back surface 102 of the main portion 111 of the first lead 11. The cutout 112C is filled with the sealing resin 40. This results in a configuration in which the first lead 11 is in contact with the sealing resin 40 in the first direction x. This makes it possible to prevent the first lead 11 from slipping out of the pair of first side surfaces 431 of the sealing resin 40.

[0068] The second input terminal 11B includes a plurality of protruding portions 113 protruding from the other side in the second direction y of the main portion 111. Each of the plurality of protruding portions 113 has a sub-end surface 113A facing the second direction y. The sub-end surfaces 113A are exposed from a second side surface 432 of the sealing resin 40 located on the other side in the second direction y. This results in a configuration in which the second input terminal 11B contacts the sealing resin 40 on the other side in the second direction y. This makes it possible to prevent the second input terminal 11B from slipping out of the second side surface 432 located on the other side in the second direction y.

[0069] In each of the multiple first leads 11, the area of ​​the main surface 101 is larger than the area of ​​the back surface 102. This results in a configuration in which the multiple first leads 11 contact the sealing resin 40 on the side toward which the back surface 102 in the thickness direction z faces. This makes it possible to prevent the multiple first leads 11 from slipping out of the bottom surface 42 of the sealing resin 40. Furthermore, it is possible to ensure a larger area of ​​the main surface 101 of each of the multiple first leads 11 to which at least one of the multiple electrodes 22 is joined. This makes it possible to further increase the number of the multiple electrodes 22 joined to the multiple first leads 11.

[0070] The conductive member 10 further includes a plurality of second leads 12 to which at least one of the plurality of electrodes 22 is joined. In each of the plurality of second leads 12, the area of ​​the main surface 101 is larger than the area of ​​the back surface 102. Therefore, similar to the relationship between the main surface 101 and the back surface 102 of the first lead 11 described above, the plurality of second leads 12 can be prevented from slipping out of the bottom surface 42 of the sealing resin 40. Furthermore, the area of ​​each of the plurality of second leads 12 to which at least one of the plurality of electrodes 22 is joined can be further secured. This makes it possible to further increase the number of the plurality of electrodes 22 joined to the plurality of second leads 12.

[0071] Second Embodiment A semiconductor device A20 according to a second embodiment of the present disclosure will be described with reference to Figs. 17 and 18. In these figures, the same or similar elements as those of the semiconductor device A10 described above are denoted by the same reference numerals, and duplicated descriptions will be omitted. Here, the cross-sectional position of Fig. 17 is the same as that of Fig. 15. The cross-sectional position of Fig. 18 is the same as that of Fig. 16.

[0072] In the semiconductor device A20, the configuration of the electrodes 22 of the semiconductor element 20 is different from that in the semiconductor device A10 described above.

[0073] As shown in FIGS. 17 and 18, in each of the multiple electrodes 22 (multiple first electrodes 22A and multiple second electrodes 22B), the tip surface 222A of the columnar portion 222 has a convex shape that bulges toward the main surface 101 of the conductive member 10.

[0074] Next, the effects of the semiconductor device A20 will be described.

[0075] The semiconductor device A20 includes a conductive member 10 having a main surface 101, a semiconductor element 20 having a plurality of electrodes 22, and a bonding layer 30 bonding the main surface 101 and the plurality of electrodes 22. Each of the plurality of electrodes 22 has a base 221 in contact with the side of the main layer 21 facing the main surface 101, and a columnar portion 222 protruding from the base 221 toward the main surface 101 and in contact with the bonding layer 30. The plurality of electrodes 22 further includes a first electrode 22A and a second electrode 22B located closer to the periphery of the main layer 21 of the semiconductor element 20 than the first electrode 22A when viewed along the thickness direction z. When viewed along the thickness direction z, the area of ​​the columnar portion 222 of the second electrode 22B is larger than the area of ​​the columnar portion 222 of the first electrode 22A. Therefore, the semiconductor device A20 also makes it possible to reduce warping in the thickness direction z of the semiconductor element 20 that is flip-chip mounted during the manufacture of the device.

[0076] In the semiconductor device A20, in each of the multiple electrodes 22, the tip surface 222A of the columnar portion 222 is convex and bulges toward the main surface 101 of the conductive member 10. As a result, when the semiconductor element 20 is bonded to the conductive member 10 by flip-chip bonding, the bonding layer 30 interposed between the main surface 101 and the columnar portion 222 is spread in a direction perpendicular to the thickness direction z. The spread bonding layer 30 comes into contact with the side surface 222B of the columnar portion 222. As a result, the contact area of ​​the bonding layer 30 with the side surface 222B is further increased, and the bonding strength of the columnar portion 222 with the bonding layer 30 can be further increased.

[0077] Third Embodiment A semiconductor device A30 according to a third embodiment of the present disclosure will be described with reference to Fig. 19. In these figures, the same or similar elements as those of the semiconductor device A10 described above are denoted by the same reference numerals, and duplicated descriptions will be omitted. Here, the cross-sectional position of Fig. 19 is the same as that of Fig. 16.

[0078] The semiconductor device A30 differs from the semiconductor device A10 described above in the configurations of the electrodes 22 and the surface protective film 23 of the semiconductor element 20.

[0079] As shown in FIG. 19, in each of the second electrodes 22B among the electrodes 22, the tip surface 222A of the columnar portion 222 is parallel to the main surface 101 of the conductive member .

[0080] 19, the surface protective film 23 is located away from the columnar portions 222 of the second electrodes 22B. The surface protective film 23 is provided with a plurality of openings 231 penetrating in the thickness direction z. From each of the plurality of openings 231, one of the columnar portions 222 of the second electrodes 22B is exposed. This allows the volume of the columnar portion 222 of each of the second electrodes 22B to be larger than the volume of the columnar portion 222 of each of the second electrodes 22B in each of the semiconductor devices A10 and A20 described above when forming the second electrodes 22B.

[0081] Next, the effects of the semiconductor device A30 will be described.

[0082] The semiconductor device A30 includes a conductive member 10 having a main surface 101, a semiconductor element 20 having a plurality of electrodes 22, and a bonding layer 30 bonding the main surface 101 and the plurality of electrodes 22. Each of the plurality of electrodes 22 has a base 221 in contact with the side of the main layer 21 facing the main surface 101, and a columnar portion 222 protruding from the base 221 toward the main surface 101 and in contact with the bonding layer 30. The plurality of electrodes 22 further includes a first electrode 22A and a second electrode 22B located closer to the periphery of the main layer 21 of the semiconductor element 20 than the first electrode 22A as viewed along the thickness direction z. As viewed along the thickness direction z, the area of ​​the columnar portion 222 of the second electrode 22B is larger than the area of ​​the columnar portion 222 of the first electrode 22A. Therefore, the semiconductor device A30 also makes it possible to reduce warpage in the thickness direction z of the semiconductor element 20 that is flip-chip mounted during the manufacture of the device.

[0083] In the semiconductor device A30, the surface protection film 23 of the semiconductor element 20 is located away from the columnar portion 222 of the second electrode 22B. This allows the volume of the columnar portion 222 of the second electrode 22B to be made larger than the volume of the columnar portion 222 of the second electrode 22B in each of the semiconductor devices A10 and A20 described above when forming the second electrode 22B. This makes it possible to more reliably make the area of ​​the columnar portion 222 of the second electrode 22B larger than the area of ​​the columnar portion 222 of the first electrode 22A when viewed along the thickness direction z.

[0084] In the semiconductor devices A10 to A30, the conductive member 10 refers to multiple leads (multiple first leads 11, multiple second leads 12, and a pair of third leads 13) formed from the same lead frame. The conductive member 10 may alternatively be configured to include an insulating substrate and a conductive layer disposed on the insulating substrate and having multiple regions spaced apart from one another.

[0085] The present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the present disclosure can be freely designed in various ways. [Explanation of symbols]

[0086] A10, A20, A30: Semiconductor device 10: Conductive material 101: Main surface 102: Back side 11: First Lead 11A: First input terminal 11B: 2nd input terminal 11C: Output terminal 111: Main part 112: Side 112A: First end surface 112B: Waist 112C: Notch 113:Protrusion 113A: Minor end face 12: 2nd Lead 121: Second end surface 13: 3rd Lead 131: Third end surface 20: Semiconductor element 21: Main layer 211: Semiconductor substrate 212: Semiconductor layer 212A: Switching circuit 212B: Control circuit 213: Passivation film 213A:Aperture 22: Electrode 22A: 1st electrode 22B: 2nd electrode 221: Base 222: Columnar part 222A: Tip surface 222B: Side 222C: Recess 222D: Curved surface 23: Surface protective film 231:Aperture 30: Bonding layer 40: Sealing resin 41:Top surface 42: Bottom 431:1st side 432:Second side B: Dimensions b, b1, b2: dimensions h1,h2:height z: thickness direction x: 1st direction y: second direction

Claims

1. A conductive member having a main surface and a back surface facing in opposite directions in a thickness direction; a semiconductor element including a main body layer and a plurality of electrodes protruding from a side of the main body layer facing the main surface in the thickness direction toward the main surface; a bonding layer that bonds the main surface and the plurality of electrodes; Each of the plurality of electrodes has a base portion in contact with the main body layer and a columnar portion protruding from the base portion and in contact with the bonding layer, the plurality of electrodes includes a first electrode and a second electrode located closer to a periphery of the main body layer than the first electrode when viewed in the thickness direction; When viewed in the thickness direction, an area of ​​the columnar portion of the second electrode is larger than an area of ​​the columnar portion of the first electrode, The conductive member includes a plurality of first leads and a plurality of second leads, the first leads extend in a first direction perpendicular to the thickness direction and are arranged along a second direction perpendicular to both the thickness direction and the first direction; the second leads are spaced apart from the first leads in the second direction; the main body layer includes a semiconductor substrate and a semiconductor layer stacked on a side of the semiconductor substrate facing the main surface in the thickness direction; A switching circuit and a control circuit that is electrically connected to the switching circuit are configured in the semiconductor layer, any one of the plurality of electrodes is electrically connected to the switching circuit and is joined to the main surface of any one of the plurality of first leads; any one of the plurality of electrodes is electrically connected to the control circuit and is joined to the main surface of any one of the plurality of second leads.

2. The semiconductor device according to claim 1 , wherein the height of said columnar portion of said second electrode is greater than the height of said columnar portion of said first electrode.

3. The semiconductor device according to claim 2 , wherein a height of said columnar portion of said second electrode is not less than 110% and not more than 120% of a height of said columnar portion of said first electrode.

4. the columnar portion of each of the plurality of electrodes has a tip surface facing the main surface and a side surface connected to the tip surface and facing in a direction perpendicular to the thickness direction, 4. The semiconductor device according to claim 1, wherein the bonding layer is in contact with the tip surface and the side surface.

5. the semiconductor element has a surface protection film covering a side of the main body layer opposite to the main surface in the thickness direction, The semiconductor device according to claim 4 , wherein said tip face of each of said plurality of electrodes is located between said main surface and said surface protective film in said thickness direction.

6. The semiconductor device according to claim 5 , wherein in each of said plurality of electrodes, said base portion and said columnar portion are in contact with said surface protective film.

7. The semiconductor device according to claim 5 , wherein the columnar portion of at least any one of the plurality of electrodes is spaced apart from the surface protective film.

8. The semiconductor device according to claim 7 , wherein the columnar portion of the second electrode is spaced apart from the surface protection film.

9. a recess that is recessed from the tip surface toward the main body layer is formed in the columnar portion of each of the plurality of electrodes, 9. The semiconductor device according to claim 4, wherein the bonding layer is in contact with the recess.

10. 9. The semiconductor device according to claim 4, wherein said tip end surface of each of said plurality of electrodes is convex and bulges out toward said main surface.

11. 11. The semiconductor device according to claim 4, wherein the columnar portion of the second electrode has a curved surface that forms a boundary between the tip surface and the side surface and that bulges outwardly from the columnar portion.

12. Further comprising a sealing resin that covers a portion of each of the plurality of first leads and the plurality of second leads and the semiconductor element; the sealing resin has a bottom surface facing the same side as the back surface in the thickness direction, and a pair of first side surfaces connected to the bottom surface and spaced apart from each other in the first direction; Each of the plurality of first leads includes a main portion extending in the first direction and a pair of side portions connected to both ends of the main portion in the first direction, each of the pair of side portions has a first end surface connected to the main surface and the back surface and facing the first direction; the back surface of each of the first leads is exposed from the bottom surface, the first end surface of one of the pair of side portions is exposed from each of the pair of first side surfaces so as to be flush with one of the pair of first side surfaces; 12. The semiconductor device according to claim 1, wherein in each of said first leads, a dimension of said first end face in said second direction is smaller than a dimension of said back surface of said main portion in said second direction.

13. A semiconductor device as described in claim 12, wherein in at least any of the multiple first leads, each of the pair of side portions has a narrowed portion formed extending from the main surface to the back surface and recessed inwardly from both sides in the second direction.

14. A semiconductor device as described in claim 13, wherein in at least any of the multiple first leads, each of the pair of side portions has a notch formed therein extending from the main surface to the back surface and recessed from the first end face in the first direction, and dividing the first end face into two regions.

15. Each of the plurality of second leads has a second end face connected to the main surface and the back surface and facing the second direction; the sealing resin has a pair of second side surfaces connected to the bottom surface and the pair of first side surfaces and spaced apart from each other in the second direction; the back surface of each of the second leads is exposed from the bottom surface, 15. The semiconductor device according to claim 12, wherein the second end surface of each of the second leads is exposed from one of the pair of second side surfaces so as to be flush with one of the pair of second side surfaces.

16. Among the plurality of first leads, a first lead farthest from the plurality of second leads includes a plurality of protrusions protruding from the main portion on a side away from the plurality of second leads in the second direction, each of the plurality of protrusions has a sub-end surface connected to the main surface and the back surface and facing the second direction; The semiconductor device according to claim 15 , wherein the minor end surface of each of the plurality of protrusions is exposed from one of the pair of second side surfaces so as to be flush with one of the pair of second side surfaces.

Images