Method and device for transferring electronic components

Abstract

This method is for transferring, from a first holding member (20A) to a second holding member (20B), an electronic component (1) that has one end and the other end, the method comprising: a first step (D1) for shortening the distance between the first holding member to which the other end of the electronic component has been bonded and the second holding member, and bonding the other end of the electronic component to the second holding member; and a second step (D2 and D3, or D2 and D4) for detaching the electronic component, which is bonded to the second holding member, from the first holding member by using a difference in bonding strength between the first holding member and the second holding member. The second step includes a distance extension movement (D3) for extending the distance between the first holding member and the second holding member, and a position changing movement (D2 or D4) for parallelly moving one of the first holding member and the second holding member relative to the other at least at the time of and / or before starting the distance extension movement.

Description

[Technical field]

[0001] The present invention relates to a transfer method and device for transferring an electronic component held by a first holding member to a second holding member. [Background technology]

[0002] For example, in a manufacturing method for electronic components such as a multilayer capacitor, for example, for forming external electrodes on the electronic component, one end of the electronic component is held on an adhesive plate and the other end is coated with a conductive paste (FIG. 8 of Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-244104 A Summary of the Invention [Problem to be solved by the invention]

[0004] As shown in FIG. 1 of Patent Document 1, in order to form external electrodes at both ends of an electronic component, it is necessary to first form a first external electrode by applying and drying a conductive paste to one end of the electronic component, the other end of which is adhered to an adhesive plate, and then form a second external electrode at the other end of the electronic component with the first external electrode still adhered to the adhesive plate.

[0005] However, after forming the first external electrode and before forming the second external electrode, it was necessary to peel off the end portion that had been adhered to the adhesive plate from the adhesive plate and then re-adhere the first external electrode of the electronic component to the adhesive plate, which was a cumbersome task.

[0006] An object of the present invention is to provide a method and device for transferring an electronic component, which can directly and smoothly transfer an electronic component from a first holding member to a second holding member. [Means for solving the problem]

[0007] (1) One aspect of the present invention is a method for transferring an electronic component having one end and an other end from a first holding member to a second holding member, the method comprising the steps of: a first step of shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second holding member; a second step of peeling off the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing a difference in adhesive force between a first adhesive surface of the first holding member and a second adhesive surface of the second holding member, the second adhesive surface having an adhesive force per unit area greater than that of the first adhesive surface; having The second step relates to a method for transferring and mounting electronic components, the method including a distance expansion movement for expanding the distance between the first holding member and the second holding member, and a position change movement for moving one of the first holding member and the second holding member in parallel relative to the other at least at the start of and / or before the start of the distance expansion movement.

[0008] According to one aspect of the present invention, the electronic component is tilted with respect to the perpendicular line of the first holding member by the position change movement during the second step. As a result, the other end of the electronic component can be locally peeled off from the first adhesive surface of the first holding member. In this way, the adhesive force of the electronic component by the first adhesive surface of the first holding member can be weakened. At this time, one end of the electronic component may also be locally peeled off from the second adhesive surface of the second holding member. However, since the adhesive force per unit area of ​​the second adhesive surface of the second holding member is greater than that of the first adhesive surface of the first holding member, the electronic component adheres more strongly to the second adhesive surface than to the first adhesive surface. On the other hand, the electronic component is completely peeled off from the first adhesive surface of the first holding member by the distance expansion movement performed simultaneously with or after the above-mentioned position change movement, and the electronic component is held only by the second holding member.

[0009] (2) In one aspect (1) of the present invention, the second step can include the position change movement performed before the start of the distance expansion movement, and the distance expansion movement performed thereafter. By performing the position change movement before the start of the distance expansion movement, the other end of the electronic component is locally peeled off from the first adhesive surface of the first holding member at the time of the distance expansion movement, making it possible to easily remove the electronic component from the first holding member. Note that the position change movement performed before the start of the distance expansion movement may be, for example, a linear movement, which is one step, and may be performed multiple times. This is effective for reliably removing the electronic component from the first holding member.

[0010] (3) In the aspect (1) of the present invention, the second step can perform the distance expansion movement and the position change movement simultaneously. In this way, local peeling in different regions is repeated and the electronic component is simultaneously separated from the first holding member, so that the electronic component can be reliably detached from the first holding member.

[0011] (4) In one aspect (3) of the present invention, the position change movement can change the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the movement direction of the two-dimensional position within the plane of the first adhesive surface changes sequentially. In this way, the movement direction of the two-dimensional position of the electronic component within the projection plane changes sequentially, and the inclination of the central axis of the electronic component inclined with respect to the perpendicular line of the first holding member changes sequentially. As a result, the local position where the other end of the electronic component is peeled off from the first adhesive surface of the first holding member also changes sequentially. Therefore, local peeling in different areas is repeated, making it easier to detach the electronic component from the first holding member.

[0012] (5) In one aspect (1) of the present invention, the electronic component may have a first external electrode formed at the one end and a second external electrode not formed at the other end. In this case, the first external electrode is formed in advance at one end of the electronic component held by the first holding member before transfer. Thereafter, the second external electrode can be applied to the other end of the electronic component transferred from the first holding member to the second holding member.

[0013] (6) Another aspect of the present invention is The electronic component includes a first adhesive surface and has one end and another end. Other end a first holding member capable of holding the electronic component by adhering the first adhesive surface to the first holding member; a second adhesive surface having a higher adhesive strength per unit area than the first adhesive surface; one end a second holding member capable of holding the electronic component by adhering the second holding member to the second adhesive surface; a moving mechanism that relatively moves the first holding member and the second holding member; having The moving mechanism includes: The distance between the first holding member and the second holding member to which the other end of the electronic component is adhered is shortened by a distance shortening movement. one end and adhering the second adhesive surface of the second holding member to the second adhesive surface of the second holding member. Then, by a distance expansion movement that expands a distance between the first holding member and the second holding member, the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member, According to another aspect (6) of the present invention, the method according to the aspect (1) of the present invention can be preferably carried out.

[0014] (7) The aspects (2) to (5) of the present invention can also be applied to the aspect (6) of the present invention. [Brief description of the drawings]

[0015] [Figure 1] 1A to 1C are diagrams illustrating an example of an electronic component manufactured by an electronic component manufacturing method and apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view of the electronic component of FIG. 1. [Diagram 3] 1 is a diagram showing an electronic component manufacturing apparatus according to an embodiment of the present invention; [Figure 4] FIG. 4 is a block diagram of the manufacturing apparatus of FIG. 3. [Diagram 5] FIG. 1 is a diagram showing a first step of a transfer method. [Figure 6] 6A to 6C are diagrams illustrating a second step of the transfer method in the first embodiment. [Figure 7] FIG. 13 is a diagram showing a state in which the electronic components have been transferred. [Figure 8] 13 is a diagram showing a state in which the electronic component is locally peeled off from the first holding member by the position change movement in the second step. FIG. [Figure 9] FIG. 11 is a diagram showing a second step of the transfer method in the second embodiment. [Figure 10] FIG. 11 is a diagram showing a position change movement in a second step in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In the following invention, many different embodiments and examples are provided for implementing different features of the presented subject matter. Of course, these are merely examples and are not intended to be limiting. Furthermore, the present invention may repeat reference numbers and / or letters in various examples. Such repetition is for the sake of brevity and clarity, and does not, per se, require a relationship between the various embodiments and / or configurations described. Furthermore, when a first element is described as being "connected" or "coupled" to a second element, such a description includes embodiments in which the first element and the second element are directly connected or coupled to each other, as well as embodiments in which the first element and the second element are indirectly connected or coupled to each other with one or more other elements intervening therebetween. Also, when a first element is described as "moving" relative to a second element, such a description includes embodiments of relative movement in which at least one of the first element and the second element moves relative to the other.

[0017] 1. Electronic Components FIG. 1 shows an electronic component 1 manufactured by a manufacturing method according to an embodiment of the present invention, and FIG. 2 shows a schematic cross section of a paste material formed on the electronic component 1, for example, first and second external electrodes 4A and 4B. Here, there is no particular restriction on the size of the electronic component 1 to which the present invention is applied, but it is suitable for an electronic component 1 that has been made ultra-small in accordance with downsizing. For example, when the maximum length of one side of a rectangular (square or rectangular) cross section shown in FIG. 1 is L1 and the length in the direction perpendicular to the rectangular cross section is L2, the ultra-small electronic component 1 has L1=500 μm or less and L2=1000 μm or less. Preferably, L1=300 μm or less and L2=600 μm or less, more preferably, L1=200 μm or less and L2=400 μm or less, and even more preferably, L1=125 μm or less and L2=250 μm or less. Note that the rectangle here includes a rectangle with a corner where two sides meet at a strictly 90° angle, as well as a substantially rectangular shape with curved or chamfered corners. Needless to say, the present invention can be applied to electronic components 1 having cross sections other than rectangular.

[0018] 2, first and second external electrodes 4A, 4B made of conductive paste layers are formed on both end portions 2, 2 of the electronic component 1. Each end portion 2 of the electronic component 1 includes an end face 2A, a side face 2B, and a corner portion 2C connecting the end face 2A and the side face 2B. In this embodiment, the first external electrode 4A is first applied and dried to one of the end portions 2, and then the second external electrode 4B is applied to the other end portion 2.

[0019] 2. Electronic component manufacturing equipment FIG. 3 shows a manufacturing apparatus 10 used in the implementation of this embodiment, and FIG. 4 shows a control system block diagram. This manufacturing apparatus 10 has a carrier plate (jig) 20 which is a holding member for the electronic component 1, a moving mechanism 50, and a surface plate 100. In FIG. 3, three orthogonal axial directions are designated as X, Y, and Z. The surface plate 100 can be used for a coating process of the first and second external electrodes 4A and 4B, etc. To transfer the electronic component 1 between two carrier plates 20A and 20B (see FIG. 5), the surface plate 100 may be used, but a transfer table 200 shown in FIG. 5 may be used instead of the surface plate 100. In this case, the moving mechanism 50 can be moved above the transfer table 200 by a mechanism not shown.

[0020] Carrier plate 20, which holds multiple electronic components 1 in a hanging manner, has an adhesive surface for holding at least one, for example multiple, electronic components 1. Carrier plate 20 is detachably supported on jig fixing plate 30. A base 40 is fixed above jig fixing plate 30, and a surface plate 100 or a transfer table 200 is disposed below.

[0021] A squeegee unit 110 including a squeegee 112 and a blade 114 is provided on the surface plate 100. The squeegee unit 110 moves over the surface plate 100. The squeegee unit 110 can form a dip layer of the conductive paste 120 having a height H on the surface 101 of the surface plate 100 by moving the blade 114. The squeegee unit 110 can scrape off the dip layer of the conductive paste 120 from the surface 101 of the surface plate 100 by moving the squeegee 112.

[0022] The base 40 is provided with a moving mechanism 50 for moving the jig fixing platen 30. Here, the moving mechanism 50 can include an X-axis drive unit 60, a Y-axis drive unit 70, and a Z-axis drive unit 80. The moving mechanism 50 may move the jig fixing platen 30 and the base plate 100 relatively in the X-, Y-, and Z-axis directions. That is, the moving mechanism 50 may move the base plate 100 (transfer table 200). Alternatively, a moving mechanism 50 for moving the jig fixing platen 30 and a moving mechanism 50 for moving the base plate 100 (transfer table 200) may be provided. Alternatively, some of the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 included in the moving mechanism 50 may move the jig fixing platen 30, and the other parts may move the base plate 100 (transfer table 200).

[0023] The X-axis driving unit 60 can be configured with an X-table that is movable in the X-axis direction relative to the base 40 along the X-axis guide 62. The Y-axis driving unit 70 can be configured with a Y-table that is movable in the Y-axis direction relative to the X-axis driving unit 60 along the Y-axis guide 72. The Z-axis driving unit 80 is fixed to the Y-axis driving unit 70, for example, and is capable of moving a Z-axis 82 in the Z-axis direction. The jig fixing plate 30 is fixed to the Z-axis 82. Note that in FIG. 3, the driving sources of the X, Y, and Z axes, for example, motors and their driving force transmission mechanisms are omitted from the illustration.

[0024] In this way, the jig fixing plate 30, the carrier plate 20 and the multiple electronic components 1 can be moved by the moving mechanism 50 in the Z-axis direction relative to the surface plate 100 (transfer table 200), and can also be moved along the XY plane parallel to the surface of the surface plate 100.

[0025] As shown in FIG. 4, the manufacturing apparatus 10 has a control unit 90 that controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80. The control unit 90 is connected to an operation input unit 92 such as a keyboard. The control unit 90 includes a storage unit 91, which stores operation information input via the operation input unit 92, programs registered in advance, and the like. The control unit 90 controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 according to the data and programs stored in the storage unit 91. The control unit 90 can shorten the distance between the jig fixing platen 30 and the base plate 100 (transfer table 200) by the Z-axis drive unit 80 (distance shortening movement). In addition, the control unit 90 can move the jig fixing platen 30 by the X-axis drive unit 60 and / or the Y-axis drive unit 70 along a movement trajectory in a plane parallel to the base plate 100 (transfer table 200), for example, along a straight line or a circular orbit (position change movement). Furthermore, the control unit 90 can expand the distance between the jig fixing plate 30 and the base plate 100 (transfer table 200) by the Z-axis driving unit 80 (distance expansion movement) simultaneously with the linear or circular movement by the X-axis driving unit 60 and the Y-axis driving unit 70, or after the linear movement.

[0026] 3. Manufacturing methods for electronic components In the manufacturing apparatus 10 of this embodiment, a prepress process, a coating process, and a subsequent blotting process are performed on both ends 2 of the electronic component 1. The prepress process is a process of bringing the end faces 2A of each of the electronic components 1 held on the carrier plate 20 into contact with the surface plate 100 before the coating process. The coating process is a process of bringing the end 2 including the end face 2A of each of the electronic components 1 held on the carrier plate 20 into contact with a dip layer of conductive paste formed on the surface 101 of the surface plate 100 to coat the end 2 of each of the electronic components 1 with the conductive paste. The blotting process is a process of bringing the conductive paste applied to each of the end 2 of each of the electronic components 1 held on the carrier plate 20 into contact with the surface 101 of the surface plate 100 to transfer excess conductive paste to the surface plate 100. The conductive paste is then dried to form the first and second external electrodes 4A and 4B.

[0027] 5, an electronic component 1 having a first external electrode 4A formed on one end is held by a first carrier plate 20A. That is, the electronic component 1 held by the first carrier plate 20A undergoes the above-mentioned prepress step, coating step, blotting step, and drying step to form the first external electrode 4A. In order to form a second external electrode 4B on the other end of the electronic component 1, it is necessary to transfer the electronic component 1 from the first carrier plate 20A to the second carrier plate 20B.

[0028] For this reason, in Fig. 5, the first carrier plate 20A removed from the jig fixing plate 30 is held on the transfer table 200. The first carrier plate 20A is fixed on the transfer table 200 by, for example, vacuum suction or clamping. Next, the jig fixing plate 30 and the second carrier plate 20B in Fig. 3 are moved above the transfer table 200 on which the first carrier plate 20A is placed. However, in Fig. 5, the jig fixing plate 30 is omitted, and only one electronic component 1 is shown on the first carrier plate 20A.

[0029] 5, the first carrier plate 20A includes a first base material 21A and a first adhesive sheet (first adhesive surface in a broad sense) 22A. An electronic component 1 having a first external electrode 4A formed at one end is held upright by having the other end adhered to the adhesive sheet 22A. Similarly, the second carrier plate 20B includes a first base material 21B and a second adhesive sheet 22B (second adhesive surface in a broad sense). The first and second carrier plates 20A and 20B are arranged such that the adhesive sheets 22A and 22B face each other.

[0030] 3.1. Method for transferring electronic components (first embodiment) 3.1.1.First step As shown in Fig. 5, the distance between the first carrier plate 20A and the second carrier plate 20B to which the other end of the electronic component 1 is adhered is shortened. In this embodiment, the second carrier plate 20B is lowered in the direction D1 in Fig. 5 by the Z-axis driving unit 80 shown in Fig. 3. In this way, as shown in Fig. 6, the first external electrode 4A at one end of the electronic component 1 can be adhered to the adhesive sheet 22B of the second carrier plate 20B while the other end of the electronic component 1 remains adhered to the adhesive sheet 22A of the first carrier plate 20A.

[0031] 3.1.2.Second process As shown in Fig. 6 and Fig. 7, the electronic component 1 adhered to the second carrier plate 20B is peeled off from the first carrier plate 20A by utilizing the difference in adhesive strength between the first and second adhesive sheets 22A and 22B. For this purpose, in Fig. 6, the second carrier plate 20B is slid in the D2 direction in Fig. 6 (hereinafter also referred to as D2 movement) by the X-axis driving unit 60 shown in Fig. 3, and then the second carrier plate 20B is raised in the D3 direction in Fig. 6 (hereinafter also referred to as D3 movement) by the Z-axis driving unit 80 shown in Fig. 3. Here, the D2 movement is a position change movement that moves one of the first carrier plate 20A and the second carrier plate 20B in parallel with the other. The D3 movement is a distance expansion movement that expands the distance between the first carrier plate 20A and the second carrier plate 20B. The D2 movement (slide movement) performed before the D3 movement may be performed multiple times in different directions. The D3 movement may be performed simultaneously with the D2 movement.

[0032] Here, by the movement D2 shown in FIG. 6, the central axis P of the electronic component 1 is tilted with respect to the perpendicular line of the first carrier plate 20A as shown in FIG. 8. As a result, as shown in FIG. 8, the end face 2A of the electronic component 1 can be locally peeled off from the adhesive sheet 22A of the first carrier plate 20A. In this way, the adhesive force of the adhesive sheet 22A to the electronic component 1 can be weakened, and the electronic component 1 can be more easily peeled off from the adhesive sheet 22A. At this time, there is a possibility that the first external electrode 4A of the electronic component 1 is also locally peeled off from the adhesive sheet 22B of the second carrier plate 20B. However, since the adhesive sheet 22B has a larger adhesive force per unit area than the adhesive sheet 22A, even in the state of FIG. 8, the electronic component 1 adheres to the adhesive sheet 22B more strongly than the adhesive sheet 22A.

[0033] By the movement D3 after the movement D2 shown in FIG. 6, the electronic component 1 is completely peeled off from the adhesive sheet 22A, and the electronic component 1 is held only by the second carrier plate 20B as shown in FIG. 7. Thereafter, the second external electrode 4B can be formed on the electronic component 1 using the second carrier plate 20B in the same manner as the formation of the first external electrode 4A on the electronic component 1. In particular, by the above-mentioned transfer method, the multiple electronic components 1 can be simultaneously transferred from the first carrier plate 20A to the second carrier plate 20B while maintaining the positional relationship of the multiple electronic components 1 aligned on the first carrier plate 20A. Note that in the first embodiment, the distance expansion movement may be performed simultaneously with the position change movement. In this case, the electronic components 1 that are locally peeled off by the position change movement can be separated from the first carrier plate 20A by the distance expansion movement performed simultaneously.

[0034] 3.2. Method for transferring electronic components (embodiment 2) In the second embodiment, the second step (D2 movement and D3 movement) shown in FIG. 6 of the first embodiment is changed to D3 movement and D4 movement shown in FIG. 9. In FIG. 9, the distance expansion movement (D3) between the first and second carrier plates 20A and 20B is performed simultaneously with the D4 movement shown in FIG. 10. The D4 movement in FIG. 10 is a movement that changes the two-dimensional position 1A on the projection plane (the paper surface of FIG. 10) of the first carrier plate 20A of the electronic component 1 projected onto the adhesive sheet 22A so that the movement direction of the two-dimensional position 1A in the projection plane changes sequentially. This D4 movement is also a position change movement that moves one of the first carrier plate 20A and the second carrier plate 20B in parallel with the other. Specifically, in FIG. 10, the movement direction of the two-dimensional position 1A (the direction of the tangent 211 to the circle 210 shown in FIG. 10) changes sequentially so that the two-dimensional position 1A becomes, for example, a part or the whole (loop) of the circular movement locus 210. That is, the simultaneous movements of D3 and D4 shown in Fig. 9 cause the second carrier plate 20B to move in a spiral manner by the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 in Fig. 3. As a result, the electronic component 1 is locally peeled off from the adhesive sheet 22A of the first carrier plate 20A by the second step of the second embodiment as well, as shown in Fig. 8. The loop trajectory is not limited to a circle and may be an ellipse or the like.

[0035] Moreover, as the direction of movement (the direction of tangent 211 to circle 210 shown in FIG. 10) of electronic component 1 in the projection plane (the paper surface of FIG. 10) of two-dimensional position 1A of electronic component 1 changes sequentially, the inclination of central axis P of electronic component 1 inclined with respect to the perpendicular line of first carrier plate 20A changes sequentially. As a result, the local position where other end 2A of electronic component 1 is peeled off from first adhesive sheet 22A of first carrier plate 20A also changes sequentially. Therefore, local peeling in different regions is repeated, making it easier to detach electronic component 1 from first carrier plate 20A.

[0036] In the second embodiment, the distance expansion movement and the position change movement are performed simultaneously in the second step. In this way, local peeling in different regions is repeated and at the same time the electronic component 1 is pulled away from the first carrier plate 20A, so that the electronic component 1 can be smoothly and reliably detached from the first carrier plate 20A. As a result, the electronic component 1 can be held only by the second carrier plate 20B as in the first embodiment, as shown in FIG. 7.

[0037] The present invention is not limited to the above embodiment, and various modifications are possible within the scope of the present invention. This transfer method can also be used to transfer electronic components before external electrodes are formed on one end and the other end. For example, a plurality of electronic components without external electrodes before being held by the first carrier plate 20A are aligned through a guide having a plurality of guide holes and held on a holding member. This holding member has an adhesive surface with a smaller adhesive force per unit area than the first carrier plate 20A. This transfer method can also be used when transferring electronic components from the holding member to the first carrier plate 20A. [Explanation of symbols]

[0038] Reference Signs List 1...electronic component, 2...end, 2A...end face, 2B...side face, 2C...corner, 4A, 4B...paste material, 10...manufacturing apparatus, 20, 20A, 20B...holding member (carrier plate), 21A, 21B...substrate, 22A...first adhesive surface, 22B...second adhesive surface, 30...jig fixing plate, 40...base, 50...movement mechanism, 60...X-axis drive unit, 70...Y-axis drive unit, 80...Z-axis drive unit, 90...control unit, 91...storage unit, 92...operation input unit, 100...table, 200...transfer table, 210...circular movement trajectory, 211...circular tangent (movement direction that changes sequentially), P...central axis of electronic component

Claims

1. A method for transferring an electronic component having one end and another end from a first holding member to a second holding member, comprising the steps of: a first step of shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second holding member; a second step of peeling off the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing a difference in adhesive strength between a first adhesive surface of the first holding member and a second adhesive surface of the second holding member, the second adhesive surface having an adhesive strength per unit area greater than that of the first adhesive surface; having The second step is a method for transferring electronic components that includes a distance expansion movement that expands the distance between the first holding member and the second holding member, and a position change movement that moves one of the first holding member and the second holding member parallel to the other at least at the start of and / or before the start of the distance expansion movement.

2. In claim 1, The second step comprises: the repositioning movement being performed before the initiation of the distance extension movement; the distance-widening movement being subsequently performed; A method for transferring electronic parts, comprising:

3. In claim 1, The second step is a method for transferring and mounting an electronic component, in which the distance expansion movement and the position change movement are carried out simultaneously.

4. In claim 3, The position change movement is a method for transferring and mounting an electronic component, in which the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member is changed so that the movement direction of the two-dimensional position within the plane of the first adhesive surface is changed sequentially.

5. In claim 1, The electronic component has a first external electrode formed at one end and a second external electrode not yet formed at the other end.

6. a first holding member including a first adhesive surface and capable of holding an electronic component having one end and another end by adhering the other end of the electronic component to the first adhesive surface; a second holding member including a second adhesive surface having a greater adhesive strength per unit area than the first adhesive surface, the second holding member being capable of holding the electronic component by adhering the one end to the second adhesive surface; a moving mechanism that moves the first holding member and the second holding member relatively; having The moving mechanism includes: a distance shortening movement for shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second adhesive surface of the second holding member; Then, by a distance expansion movement that expands a distance between the first holding member and the second holding member, the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member, An electronic component transfer device that locally peels the other end of the electronic component from the first adhesive surface by a position change movement that moves one of the first holding member and the second holding member parallel to the other at least at the start of and / or before the start of the distance expansion movement.

7. In claim 6, The moving mechanism performs the position change movement before starting the distance expansion movement, and then performs the distance expansion movement.

8. In claim 6, The movement mechanism is an electronic component transfer device that simultaneously performs the distance expansion movement and the position change movement.

9. In claim 8, The position change movement of the electronic component transfer device changes the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the movement direction of the two-dimensional position within the plane of the first adhesive surface changes sequentially.

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