Method and apparatus for plasma etching - Patents.com

Abstract

To provide a method of plasma-etching a structure comprising a substrate and a component which forms involatile metal etch products.SOLUTION: The method comprises the steps of: providing a structure comprising a substrate and a component which forms involatile metal etch products; positioning the structure on a support 20 within a chamber 11 having a first gas inlet arrangement 10 comprising one or more gas inlets and a second gas inlet arrangement 12 comprising one or more gas inlets; etching the structure by performing a first plasma etch step using a first etch process gas mixture which is only introduced into the chamber 11 through the first gas inlet arrangement 10; and further etching the structure by performing a second plasma etch step using a second etch process gas mixture which is only introduced into the chamber 11 through the second gas inlet arrangement 12.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method of plasma etching, and in particular to a method of plasma etching a structure comprising a substrate and a component that forms a non-volatile metal etch product, and also to an apparatus for plasma etching. [Background technology]

[0002] Plasma etching is a common technique in the field of semiconductor device manufacturing. An undesirable and unexpected consequence of the etching process is the accumulation of material inside the chamber in which the etching occurs. Once the material reaches a certain thickness, the chamber must be cleaned periodically to prevent the material from spalling off the chamber walls and contaminating the system. This period is known as the mean time between cleanings (MTBC). A longer MTBC is desirable because it increases the productivity of the plasma tool. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2011 / 100954 [Patent Document 2] US Patent Application Publication No. 2013 / 115781 Summary of the Invention [Problem to be solved by the invention]

[0004] Inherent challenges can be encountered when etching unique structures that comprise a substrate and another component that forms non-volatile metal etch products when etched. A unique challenge is encountered when etching PZT (lead zirconate titanate), which typically utilizes a noble metal electrode such as Pt. PZT is a piezoelectric material that is commonly used in actuator applications such as sensors / ultrasonic transducers, AFM actuators, and in microelectronics for the creation of non-volatile memory devices. Dry etching of PZT layers poses unique challenges, especially in large wafer diameters (>150 mm) and highly open areas (>80%). The etch by-products are primarily non-volatile, resulting in coating of the inside of the process chamber with a thin film rich in Pb, Zr, and Ti from the PZT and Pt from the electrodes, along with by-products of the process gases used during etching, such as carbon, fluorine, and oxygen. While the use of O2 batch cleaning and O2 interwafer cleaning may minimize carbon-based by-product deposition, the remaining by-products are non-volatile and therefore difficult to remove by dry etching. Beyond a certain thickness, variations in thin film stress in the deposited material can result in spalling of the deposited material. This is exacerbated by thermal gradients in the chamber, and / or thermal cycling during idle times, and / or the presence of poor adhesion points. The spalling causes an increase in the number of particles and defects on the processed wafer. It is then necessary to open the vacuum chamber to the environment and clean the interior of the chamber using wet / mechanical methods. This results in a shorter MTBC than is desired. In addition, spalling of material on the electrostatic chuck (ESC) can disrupt the integrity of the clamping force applied by the ESC. This affects the heat transfer between the PZT-containing structures and the ESC, resulting in non-uniform wafer cooling and a consequent deterioration in process performance. Ultimately, this results in an incomplete product. As such, tool productivity is reduced and furthermore there are significant economic impacts associated with spalling as unexpected particle generation can adversely affect device yields.However, as the demand for PZT-based devices increases, there is an increasing need to improve the plasma etching process of materials to improve device yields and increase the productivity of etching systems.

[0005] SUMMARY OF THE PRESENT EMBODIMENT The present invention, at least in some of its embodiments, addresses one or more of the above problems and needs. [Means for solving the problem]

[0006] According to one aspect of the invention, there is provided a method for plasma etching a structure comprising a substrate and a component that forms a non-volatile metal etch product, the method comprising: Providing a structure comprising a substrate and a component that forms a non-volatile metal etch product; placing the structure on a support in a chamber having a first gas inlet array with one or more gas inlets and a second gas inlet array with one or more gas inlets; Etching the structure by performing a first plasma etching step with a first etching process gas mixture that is simply supplied to the chamber through a first gas inlet arrangement; further etching the structure by performing a second plasma etch step solely with a second etch process gas mixture supplied to the chamber through the second gas inlet arrangement; Includes.

[0007] In accordance with a further aspect of the invention, there is provided a plasma etching apparatus for plasma etching a structure comprising a substrate and a component forming a non-volatile metal etch product, the apparatus comprising: a chamber having a first gas inlet array with one or more gas inlets and a second gas inlet array with one or more gas inlets; a support located within the chamber, on which the structure may be placed; A plasma generating device; a controller configured to control the first and second gas inlet arrays such that the structure is etched by performing a first plasma etch step with a first etch process gas mixture only supplied to the chamber through the first gas inlet array, and further etched by performing a second plasma etch step with a second etch process gas mixture only supplied to the chamber through the second gas inlet array; Equipped with.

[0008] The present invention utilizes a two-step etching process with gas inlet switching to extend the average time between chamber cleanings. It is believed that a higher concentration of precursor gas around the gas inlet leads to increased deposition around the gas inlet. By utilizing a two-step etching process with switched gas inlets, the present invention provides greater uniformity within the chamber deposition, thereby extending the MTBC.

[0009] The gas inlets of the first gas inlet array may be located radially inward of the gas inlets of the second gas inlet array, or vice versa. The chamber may further comprise a plasma generating device. The plasma generating device may separate the gas inlets of the first gas inlet array from the gas inlets of the second gas inlet array.

[0010] The plasma generating device may comprise an annular housing and a plasma generating element disposed within the annular housing. The gas inlets of the first gas inlet arrangement may be located radially inside the annular housing and the gas inlets of the second gas inlet arrangement may be located radially outside the annular housing, or vice versa. The plasma generating element may be an RF antenna. The annular housing may be formed from a ceramic material.

[0011] The structure may be placed on a support and an RF bias power may be applied to the support during the first and second plasma etching steps. Accordingly, the plasma etching apparatus may comprise a power application arrangement for applying an RF bias power to the support. The RF bias power may be greater in the first plasma etching step than in the second plasma etching step.

[0012] The first and second plasma etching steps may use different etching process gas mixtures. The second etching process gas mixture may include a fluorocarbon. The fluorocarbon may be absent from the first etching process gas mixture. Alternatively, the first and second plasma etching steps may use the same etching process gas mixture.

[0013] The structure may be plasma etched using a single first plasma etch step and a single second plasma etch step. Alternatively, the structure can be etched in a cyclical manner by alternating the first and second plasma etch steps a desired number of times. When a cyclical etch process is used, the order of the first and second gas inlet arrangements can be swapped between etch cycles, i.e., in some etch cycles, the first etch process gas mixture may only be supplied to the chamber through the second gas inlet arrangement, and the second etch process gas mixture may only be supplied to the chamber through the second gas inlet arrangement. Thus, the method further includes the steps of etching the structure even further by performing a first plasma etch step with the first etch process gas mixture that is only supplied to the chamber through the second gas inlet arrangement, and etching the structure even further by performing a second plasma etch step with the second etch process gas mixture that is only supplied to the chamber through the first gas inlet arrangement.

[0014] The components of the structure forming the non-volatile metal etch product may be a piezoelectric layer and / or a metal electrode. The components of the structure forming the non-volatile metal etch product may be a layer of PZT (lead zirconate titanate) and / or a noble metal electrode, such as a Pt electrode. The layer of PZT may be separated from the semiconductor substrate by one or more layers of another material. The layer of PZT may comprise a bottom surface. The bottom surface may be separated from the semiconductor substrate by an electrode layer, such as a Pt layer. Additionally or alternatively, the layer of PZT may be separated from the semiconductor substrate by a barrier layer, such as SiO2. The layer of PZT may comprise a top surface. An electrode layer, such as a Pt layer, may be present on the top surface. The structure may further comprise a photoresist layer or another masking material.

[0015] When etching PZT and / or precious metal electrodes, the first etch process gas mixture may consist essentially of CF4, H2, and optionally one or more inert diluents such as Ar, and the second etch process gas mixture may consist essentially of C4F8, CF4, H2, and optionally one or more inert diluents such as Ar.

[0016] The substrate may be a semiconductor substrate.

[0017] The semiconductor substrate may be a silicon substrate, hi some embodiments, the semiconductor substrate is a silicon substrate and the component that forms the non-volatile metal etch product is a layer of PZT.

[0018] The semiconductor substrate may be a SiC substrate and the component that forms the non-volatile metal etch product may be a metal mask. The plasma etching may include backside etching of the SiC substrate through the metal mask.

[0019] The first and second gas inlet arrays may each comprise any suitable number of gas inlets. In principle the first and / or second gas inlet array may have a single gas inlet, although in practice it is more likely that each gas array will have multiple gas inlets.

[0020] The substrate may be in the form of a wafer. Semiconductor substrates, such as Si, will typically be in the form of a wafer.

[0021] Different types of plasma generating devices suitable for plasma etching will be familiar to the skilled reader, and the present invention may be used in conjunction with a variety of these plasma generating devices.

[0022] Although the present invention has been described above, it extends to any inventive combination of the features set forth above or in the following description. For example, features described in connection with one aspect of the invention are disclosed in connection with another aspect of the invention. Although exemplary embodiments of the present invention are described in detail herein with reference to the accompanying drawings, it should be understood that the present invention is not limited to these exact embodiments. It is further contemplated that specific features described either individually or as part of an embodiment may be combined with other individually described features or parts of other embodiments, even if the other features and embodiments make no reference to the specific features. Thus, the present invention extends to such specific combinations not yet described.

[0023] The invention will now be described, by way of example only, with reference to the accompanying drawings in which: [Brief description of the drawings]

[0024] [Figure 1] 1 is a schematic diagram of a plasma etching apparatus according to the present invention; [Diagram 2] 1 is a schematic diagram of a plasma etching apparatus according to the present invention; [Diagram 3] Deposition at the RF source window is depicted and Figures 4 and 5 show the corresponding areas. [Figure 4] 4 is a SEM micrograph of the well-adhered material shown in FIG. 3. [Diagram 5] 4 is a SEM micrograph of the failed bonded material shown in FIG. 3. [Figure 6] 1 depicts an EDX compositional analysis for a deposited material layer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] The present invention utilizes a two-step etching method and corresponding plasma etching apparatus to extend the average time between chamber cleans.

[0026] A plasma processing apparatus according to the present invention is shown in Figures 1 and 2. The present invention may be implemented in an adapted version of Applicant's Omega® Synapse™ etch process module, which is configured to perform a two-step etch process with gas inlet switching. Well-known features such as an exhaust gas pumping system are not shown in Figures 1 and 2, but will be understood by the skilled reader.

[0027] The apparatus includes a plasma etch chamber 11 having a plurality of internal surfaces. The apparatus includes a first gas inlet array 10, a second gas inlet array 12, a ceramic annular housing 18, an RF antenna 14, a platen RF electrode 16, and a support 20 for supporting a structure 28 to be etched. In the embodiment shown in Figures 1 and 2, the support 20 is an electrostatic chuck and the platen RF electrode 16 is used to control the directionality of the etching ions. This in turn controls the extent of physical etching achieved during processing. Higher platen power increases the substrate etch rate more.

[0028] The plasma etch chamber 11 has an upper wall or lid. An annular housing 18 is submerged within the chamber 11 and depends downwardly from the upper wall. The annular housing 18 defines a circular area within the upper wall.

[0029] In the embodiment shown in Figures 1 and 2, the first gas inlet array 10 is an inner gas plenum and the second gas inlet array 12 is an outer gas plenum. Each gas inlet array includes a plurality of gas inlets, each terminating in an opening through which process gas enters the interior of the chamber 11. The inner gas plenum 10 is located within a circular area defined by an annular housing 18. The gas inlets of the inner gas plenum 10 are located inside the annular housing 18 as a plurality of openings arranged in a circular pattern. The outer gas plenum 12 is located outside the circular area defined by the annular housing 18. The gas inlets of the inner gas plenum 10 are located outside the annular housing 18 as a plurality of openings arranged in a circular pattern. The inner gas plenum may have eight gas inlets, while the outer gas plenum may have approximately ten times as many gas inlets. However, it will be appreciated that the first and second gas inlet arrays may have any suitable number of gas inlets.

[0030] The etching chamber is further shown in FIG. 2, which illustrates the processing of a structure 28 present within the chamber. The chamber includes chamber walls 24 within which the structure 28 rests on a support 20. A plasma 26 is ignited and maintained by RF power coupled into the chamber from an RF power source (not shown) via an RF antenna 14 mounted within an annular housing 18. The annular housing 18 acts as a window allowing the RF power to be coupled into the chamber. Etch process gases enter the chamber through gas inlets in either the inner gas plenum 10 or the outer gas plenum 12. A controller 30 is used to switch the gas inlet point from the first gas plenum to the second gas plenum.

[0031] The present invention may be used to etch structures containing PZT (lead zirconate titanate). A typical wafer structure is a silicon substrate base layer, followed by a SiO2 layer, a platinum layer, a PZT layer, a second platinum layer, and finally a photoresist mask on the top surface of the wafer. The photoresist mask protects the wafer from the plasma etch. The mask is patterned according to the desired etch product. Typically, the platinum electrode layer has a thickness of 50-250 nm and the PZT layer has a thickness of 500-2500 nm.

[0032] The wafer to be etched is electrostatically clamped to a support 20. Helium is used to cool the wafer.

[0033] During the first etching step, a relatively high platen power is used to etch the PZT at a high rate with low selectivity (PZT / Pt) down to the stopping layer. The stopping layer is typically a platinum electrode. The platen power is reduced in the second step and may be switched off completely. The reduction in platen power leads to a reduction in the etch rate for the PZT and increases the PZT / Pt selectivity. This results in the plasma continuing to etch some remaining PZT during the second step, but not etching the stopping layer or removing the Pt at a substantially reduced rate.

[0034] The inner surface of the chamber is textured to improve adhesion of the first layer of deposited material. The metal shielding in the chamber was coated with arc-sprayed Al to achieve a surface roughness of about 20-35 μm, while the annular housing 18 was coated with a yttria coating to achieve a surface roughness of about 6 μm. Testing was performed by etching a highly open area (80% OA) patterned wafer having a photoresist mask (4.5 μm thick) / Pt (100 nm thick) / PZT (2 μm thick) / Pt (100 nm thick) layer formed thereon using the process conditions shown in Table 1 for either the inner or outer gas plenum used to supply the etching process gases.

[0035] Typical process parameters for each step are shown in Table 1. The PZT etch is typically performed at a chamber temperature of 55° C. and a pressure of 5-50 mTorr. [Table 1]

[0036] When the outer gas plenum was used to perform the etching step, deposition was found to be evident on the chamber surfaces around the outer gas plenum. When the inner gas plenum was used to perform the etching step, deposition was visible on the annular housing and around the inner gas plenum. Over 214 microns of PZT was successfully etched using the inner plenum before the material delaminated from the ceramic window in the annular housing.

[0037] 3 depicts the material deposited on the annular housing 18. It can be seen that the material adheres well in some areas while delaminating in other areas.

[0038] The SEM micrograph shown in Figure 4 corresponds to the good adhesion area shown in Figure 3. A thick layer of fluorocarbon polymer is present between each layer of metallic etch products. As wafers are processed in the chamber an increasing number of times, a layer structure of etch products and fluorocarbon polymer builds up inside the chamber.

[0039] In contrast, the SEM micrograph in Figure 5 was taken from the poorly adhered area shown in Figure 3. In this area, the fluorocarbon layers between the etch product layers are thin or absent. The SEM image shows that the areas where a thicker fluorocarbon polymer layer is present between each redeposited etch product layer are better adhered than the areas where the fluorocarbon layer is thin or absent.

[0040] Figure 6 shows an EDX compositional analysis of the redeposited material taken from the good adhesion area. The composition of the material is consistent with the presence of a thick fluorocarbon layer sandwiched between layers of metal etch products as seen in Figure 4.

[0041] Without wishing to be limited by any particular theory or speculation, it is believed that there are two main mechanisms for deposition inside the chamber. The first is direct deposition of process gases on the chamber interior. The second is redeposition of etch products from the wafer during etching. It is believed that material deposition from the etch process gas mixture varies throughout the chamber due to local variations in precursor gas concentration as a function of distance from the gas inlet. This results in higher deposition around the gas inlet. More uniform deposition may be achieved by using a two-step etch method and switching the location of the gas inlet between the two etch steps, thus extending the time between chamber cleans. Deposition from wafer etch products is believed to operate in a straight line distance fashion from the wafer, and is therefore not affected by the gas inlet.

[0042] Although the invention has been found to be particularly effective with respect to etching PZT, the invention may be applied to etching other structures having components that form non-volatile metal etch products, for example, the invention may be applied to the backside etching of SiC using a metal mask. [Explanation of symbols]

[0043] 10 first gas inlet array, 11 plasma etch chamber, 12 second gas inlet array, 14 RF antenna, 16 platen RF electrode, 18 ceramic annular housing, 20 support, 24 chamber wall, 26 plasma, 28 structure, 30 controller.

Claims

1. 1. A method of plasma etching a structure comprising a substrate and a component that forms a non-volatile metal etch product, comprising: Providing a structure comprising a substrate and a component that forms a non-volatile metal etch product; placing the structure on a support in a chamber having a first gas inlet array with one or more gas inlets and a second gas inlet array with one or more gas inlets; Etching the structure by performing a first plasma etching step with a first etching process gas mixture that is simply supplied to the chamber through the first gas inlet arrangement; further etching the structure by performing a second plasma etching step with a second etching process gas mixture that is simply supplied to the chamber through the second gas inlet arrangement; Including, the first plasma etching step and the second plasma etching step are performed using a plasma generating device in the chamber, the plasma generating element being an RF antenna; the gas inlets of the first gas inlet array are located radially inward of the gas inlets of the second gas inlet array, or vice versa; The method of claim 1, wherein the plasma generating device separates the gas inlets of the first gas inlet array from the gas inlets of the second gas inlet array.

2. The method of claim 1 , wherein the plasma generating device comprises an annular housing and a plasma generating element disposed within the annular housing.

3. The method of claim 1 or 2, wherein the structure is mounted on a support and an RF bias power is applied to the support during the first and second plasma etching steps.

4. The method according to any of claims 1 to 3, wherein the first and second plasma etching steps use different etching process gas mixtures.

5. 5. The method of claim 4, wherein the second etch process gas mixture comprises a fluorocarbon, the fluorocarbon being absent from the first etch process gas mixture.

6. The method according to any of the preceding claims, wherein the components of the structure forming a non-volatile metal etch product are layers of PZT (lead zirconate titanate) and / or noble metal electrodes.

7. The method according to any one of claims 1 to 6, wherein the substrate is a semiconductor substrate.

8. The method of claim 7 , wherein the semiconductor substrate is a silicon substrate.

9. 8. The method of claim 7, wherein the semiconductor substrate is a SiC substrate and the component that forms a non-volatile metal etch product is a metal mask.

10. 1. A plasma etching apparatus for plasma etching a structure comprising a substrate and a component that forms a non-volatile metal etch product, comprising: a chamber having a first gas inlet array with one or more gas inlets and a second gas inlet array with one or more gas inlets; a support located within the chamber, on which the structure may be placed; A plasma generating device; a controller configured to control the first and second gas inlet arrangements such that the structure is etched by performing a first plasma etch step with a first etch process gas mixture that is only supplied into the chamber through the first gas inlet arrangement, and further etched by performing a second plasma etch step with a second etch process gas mixture that is only supplied to the chamber through the second gas inlet arrangement; Equipped with the gas inlets of the first gas inlet array are located radially inward of the gas inlets of the second gas inlet array, or vice versa; the chamber further comprising a plasma generating device separating the gas inlets of the first gas inlet array from the gas inlets of the second gas inlet array. Plasma etching equipment.

11. 11. The apparatus of claim 10, wherein the plasma generating device comprises an annular housing and a plasma generating element disposed within the annular housing, and wherein the gas inlets of the first gas inlet arrangement are located radially inside the annular housing and the gas inlets of the second gas inlet arrangement are located radially outside the annular housing, or vice versa.

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