Cooler, semiconductor device, and power conversion device

Abstract

To provide a technique to efficiently cool a semiconductor package while the semiconductor package operates.SOLUTION: A cooler comprises: a plurality of perforated pipes that are provided side by side and separated in a first direction; a first header to which one ends of the plurality of perforated pipes are joined; and a second header that is provided separated from the first header in a second direction intersecting with the first direction and to which the other ends of the plurality of perforated pipes are joined. A first perforated pipe being any one of the plurality of perforated pipes has, at the one end of the first perforated pipe, a first inclined part inclined in the first direction with respect to the second direction, and has, at the other end of the first perforated pipe, a second inclined part inclined in the first direction with respect to the second direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a cooler, a semiconductor device, and a power conversion device. [Background technology]

[0002] In order to suppress the temperature rise of the power semiconductor package due to heat generation, a cooling pipe through which a refrigerant flows is used.

[0003] Patent Document 1 discloses a layered cooler having a supply header and a discharge header, and a plurality of cooling pipes arranged in a layered manner so as to be able to hold an electronic component from both sides. The cooling pipes have a first joint connected to the supply header, a second joint connected to the discharge header, and an expanded pipe portion formed between the first and second joints.

[0004] Patent document 2 discloses a refrigerant-cooled double-sided cooling semiconductor device having a plurality of flat refrigerant pipe sections, an inlet side header section, an outlet side header section, and a clamping section that clamps a semiconductor module (semiconductor package) and the flat refrigerant pipe sections in the stacking direction. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2008-016718 A [Patent Document 2] JP 2004-214623 A Summary of the Invention [Problem to be solved by the invention]

[0006] In electronic devices that use semiconductor packages, there is a demand for efficient cooling of the semiconductor packages while they are in operation.

[0007] The present disclosure provides a technique for efficiently cooling a semiconductor package while the semiconductor package is in operation. [Means for solving the problem]

[0008] According to one aspect of the present disclosure, there is provided a cooler comprising: a plurality of multi-hole pipes arranged in a row and spaced apart in a first direction; a first header to which one ends of each of the plurality of multi-hole pipes are joined; and a second header arranged in a row and spaced apart from the first header in a second direction intersecting the first direction and to which the other ends of each of the plurality of multi-hole pipes are joined, wherein a first multi-hole pipe of any one of the plurality of multi-hole pipes has, at the one end of the first multi-hole pipe, a first inclined portion that is inclined in the first direction with respect to the second direction, and has, at the other end of the first multi-hole pipe, a second inclined portion that is inclined in the first direction with respect to the second direction. Effect of the Invention

[0009] According to the present disclosure, a semiconductor package can be efficiently cooled while the semiconductor package is in operation. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of the semiconductor device of the present embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the semiconductor device of the present embodiment. [Diagram 3] FIG. 3 is a top view of the semiconductor package of the semiconductor device of the present embodiment. [Figure 4] FIG. 4 is a bottom view of the semiconductor package of the semiconductor device of the present embodiment. [Diagram 5] FIG. 5 is a perspective view of the cooler of the semiconductor device of the present embodiment. [Figure 6] FIG. 6 is an exploded perspective view of the cooler of the semiconductor device of the present embodiment. [Figure 7] FIG. 7 is a perspective view of a header of the cooler of the semiconductor device of the present embodiment. [Figure 8] FIG. 8 is a cross-sectional view of a multi-hole pipe of a cooler for a semiconductor device according to this embodiment. [Figure 9] FIG. 9 is a cross-sectional view of the semiconductor device of the present embodiment. [Figure 10] FIG. 10 is a cross-sectional view of the semiconductor device of the present embodiment. [Figure 11] FIG. 11 is a side view showing an outline of the cooler of the semiconductor device of the present embodiment. [Figure 12] FIG. 12 is a side view showing an outline of a modification of the cooler of the semiconductor device of the present embodiment. [Figure 13] FIG. 13 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. [Figure 14] FIG. 14 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. [Figure 15] FIG. 15 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. [Figure 16] FIG. 16 is a perspective view of a power converter using the semiconductor device of this embodiment. [Figure 17] FIG. 17 is a perspective view of a power converter using the semiconductor device of this embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings. Note that, in the description of the specification and drawings relating to each embodiment, components having substantially the same or corresponding functional configurations may be given the same reference numerals to avoid redundant description. In addition, in order to facilitate understanding, the scale of each part in the drawings may differ from the actual scale.

[0012] In the directions of parallel, right angle, orthogonal, horizontal, vertical, up / down, left / right, etc., deviations are permitted to the extent that they do not impair the effects of the embodiment. The shape of the corners is not limited to right angles and may be rounded in an arch shape. Parallel, right angle, orthogonal, horizontal, and vertical may include approximately parallel, approximately right angle, approximately orthogonal, approximately horizontal, and approximately vertical.

[0013] <<Semiconductor device 1>> Fig. 1 is a perspective view of the semiconductor device 1 of this embodiment. Fig. 2 is an exploded perspective view of the semiconductor device 1 of this embodiment. The semiconductor device 1 is, for example, a power converter that converts direct current into alternating current using two semiconductor packages 20 and supplies power to each phase of a three-phase motor. The semiconductor device 1 is used, for example, in a power converter that drives a motor.

[0014] In addition, for convenience of explanation, an XYZ Cartesian coordinate system may be set in the drawings. For the coordinate axis perpendicular to the paper surface of the drawing, a cross mark in a circle on the coordinate axis indicates that the direction toward the back of the paper surface is positive, and a black circle mark in a circle indicates that the direction toward the front of the paper surface is positive. However, this coordinate system is defined for the purpose of explanation and does not limit the attitude of the semiconductor device 1, etc.

[0015] In this disclosure, unless otherwise specified, the X-axis is the extension direction of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30. The Y-axis is the direction in which the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30 are adjacent to each other. The Y-axis direction may be referred to as the up-down direction. The Z-axis is the direction perpendicular to the X-axis and Y-axis.

[0016] The semiconductor device 1 includes a plurality of semiconductor packages 20 and a cooler 30.

[0017] The semiconductor device 1 of this embodiment includes six semiconductor packages 20. Specifically, the semiconductor device 1 includes a semiconductor package 21, a semiconductor package 22, a semiconductor package 23, a semiconductor package 24, a semiconductor package 25, and a semiconductor package 26. In the following description, when there is no need to distinguish between the semiconductor package 21, the semiconductor package 22, the semiconductor package 23, the semiconductor package 24, the semiconductor package 25, and the semiconductor package 26, they may be collectively referred to as the semiconductor package 20.

[0018] The semiconductor packages 20 are arranged and held in three rows and two columns between a first multi-hole pipe 30b1, a second multi-hole pipe 30b2, and a third multi-hole pipe 30b3 of the cooler 30, which will be described later. The semiconductor packages 20 are provided between two adjacent multi-hole pipes. A coolant (heat coolant), for example, cooling water, is introduced into the cooler 30 from a coolant inlet 30ap1. The coolant introduced into the cooler 30 is discharged from a coolant outlet 30ap2. The semiconductor packages 20 are cooled by exchanging heat with the cooling water flowing through the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

[0019] Between the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2, a semiconductor package 21, a semiconductor package 22, and a semiconductor package 23 are arranged in order from the first header 30a side. In addition, between the second multi-hole pipe 30b2 and the third multi-hole pipe 30b3, a semiconductor package 24, a semiconductor package 25, and a semiconductor package 26 are arranged in order from the first header 30a side.

[0020] The semiconductor package 20 and the cooler 30 of the semiconductor device 1 will now be described in detail.

[0021] <Semiconductor Package 20> Fig. 3 is a top view of the semiconductor package 20 of the semiconductor device 1 of this embodiment. Fig. 4 is a bottom view of the semiconductor package 20 of the semiconductor device 1 of this embodiment.

[0022] The semiconductor package 20 is, for example, a so-called 2-in-1 semiconductor package in which two semiconductor elements constituting upper and lower arms for one phase are packaged. The semiconductor package 20 is also a so-called double-sided cooling type semiconductor package. The semiconductor package 20 contains semiconductor elements such as power transistors, for example, IGBTs (Insulated Gate Bipolar Transistors) and FETs (Field-Effect Transistors).

[0023] The built-in semiconductor element may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an FWD (Free Wheeling Diode). The mounted semiconductor element may be a RB-IGBT (Reverse Blocking-Insulated Gate Bipolar Transistor) in which the above-mentioned IGBT or FWD is integrated into a single chip. The mounted semiconductor element may be a RC-IGBT (Reverse Conducting-Insulated Gate Bipolar Transistor) in which the above-mentioned IGBT or FWD is integrated into a single chip.

[0024] The semiconductor package 20 includes a case 20d having a substantially rectangular parallelepiped shape and made of resin, for example, epoxy resin, etc. The case 20d has an upper surface 20dA and a lower surface 20dB on the opposite side to the upper surface 20dA.

[0025] The semiconductor package 20 has current terminals 20a1, 20a2, and 20a3, and control terminals 20b1, 20b2, 20b3, and 20b4 on a side surface of the case 20d. The current terminals 20a1, 20a2, and 20a3, and the control terminals 20b1, 20b2, 20b3, and 20b4 are provided to protrude from the side surface of the case 20d of the semiconductor package 20.

[0026] The current terminal 20a1, the current terminal 20a2, and the current terminal 20a3 are, for example, terminals for passing a current to a load. The current terminal 20a1, the current terminal 20a2, and the current terminal 20a3 are formed of a conductive material. The control terminal 20b1, the control terminal 20b2, the control terminal 20b3, and the control terminal 20b4 are terminals for controlling a current to be passed to a load. The control terminal 20b1, the control terminal 20b2, the control terminal 20b3, and the control terminal 20b4 are formed of a conductive material.

[0027] The semiconductor package 20 also has a heat sink 20c1 and a heat sink 20c2. For example, a power transistor built into the semiconductor package 20 is a heat generating element, and therefore needs to be cooled. The heat sink 20c1 and the heat sink 20c2 are provided to dissipate heat from the heat generating element. The heat sink 20c1 and the heat sink 20c2 are each formed of a material having high thermal conductivity, for example, a metal such as copper. The heat sink 20c1 and the heat sink 20c2 are each thermally connected to the heat generating element. The heat sink 20c1 is provided on an upper surface 20dA of the case 20d. The heat sink 20c2 is provided on a lower surface 20dB of the case 20d.

[0028] <Cooler 30> Fig. 5 is a perspective view of the cooler 30 of the semiconductor device 1 of the present embodiment. Fig. 6 is an exploded perspective view of the cooler 30 of the semiconductor device 1 of the present embodiment.

[0029] The cooler 30 cools the semiconductor package 20. A refrigerant flows through the inside of the cooler 30. The cooler 30 cools the semiconductor package 20 by exchanging heat between the semiconductor package 20 and a refrigerant (e.g., cooling water) flowing through the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The refrigerant is not limited to water, and may be a liquid including an antifreeze.

[0030] The cooler 30 includes a first header 30a, a first multi-hole pipe 30b1, a second multi-hole pipe 30b2, a third multi-hole pipe 30b3, and a second header 30c. The second header 30c is provided spaced apart from the first header 30a in the X-axis direction. The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are provided at predetermined intervals in the Y-axis direction, i.e., a direction intersecting the X-axis direction, specifically, at intervals that can hold the semiconductor package 20.

[0031] The X-axis direction is an example of the second direction.

[0032] The first header 30a is connected to one end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the first header 30a is connected to the -X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The second header 30c is connected to the other end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the second header 30c is connected to the +X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

[0033] [First header 30a] First, the first header 30a will be described. Fig. 7 is a perspective view of the first header 30a of the cooler 30 of the semiconductor device 1 of this embodiment. The first header 30a introduces the refrigerant into the inside of the cooler 30 and discharges it to the outside of the cooler 30. The first header 30a is a hollow rectangular parallelepiped formed by wall portions 30aA, 30aB, 30aC, 30aD, 30aE, and 30aF.

[0034] A part of the wall 30aE, which is the wall on the +X side of the first header 30a, is released. Specifically, the first header 30a has an opening 30ah1, an opening 30ah2, and an opening 30ah3 in the wall 30aE. One ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are inserted into the openings 30ah1, 30ah2, and 30ah3 of the first header 30a, respectively, and fixed thereto. The first header 30a and the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed to each other by brazing, for example, to ensure watertightness.

[0035] The first header 30a has a refrigerant inlet 30ap1 and a refrigerant outlet 30ap2 in the wall portion 30aF. The refrigerant inlet 30ap1 introduces a refrigerant from an external cooling device. The refrigerant outlet 30ap2 discharges the refrigerant to the external cooling device. The first header 30a has a partition wall therein, which will be described later. The partition wall is a wall that separates the refrigerant introduced into the first header 30a from the refrigerant discharged from the first header 30a. The partition wall will be described in detail later.

[0036] [First multi-hole pipe 30b1, second multi-hole pipe 30b2, third multi-hole pipe 30b3] Next, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 will be described. FIG. 8 is a cross-sectional view of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 of the cooler 30 of the semiconductor device 1 of this embodiment. Note that FIG. 8 representatively shows a cross-sectional view cut at the center of the second multi-hole pipe 30b2. The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are pipes whose longitudinal ends are open and through which a refrigerant flows. In addition, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 cool the semiconductor package 20 by exchanging heat with the refrigerant flowing through the inside of the multi-hole pipe.

[0037] The first, second and third multi-hole pipes 30b1, 30b2 and 30b3 have a substantially rectangular cross section in the short direction. The first, second and third multi-hole pipes 30b1, 30b2 and 30b3 are so-called microchannels having a divided flow path 30bc inside. The flow path 30bc in this embodiment may be formed with dimensions on the order of millimeters.

[0038] Each of the flow paths 30bc of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 is a rectangular microchannel that is long in the Y-axis direction (up and down direction). The flow paths 30bc may be divided into two or more stages in the Y-axis direction.

[0039] The Y-axis direction (up-down direction) is an example of the first direction.

[0040] The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 have a cooling surface 30bA and a cooling surface 30bB. When the semiconductor package 20 is cooled by the cooler 30, the semiconductor package 20 to be cooled is provided in contact with the cooling surface 30bA or the cooling surface 30bB. Specifically, the cooling surface 30bA or the cooling surface 30bB is thermally joined to the heat sink 20c1 or the heat sink 20c2 of the semiconductor package 20 by a joining member described later, such as soldering or thermally conductive grease.

[0041] The flow paths 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 have a uniform cross-sectional area in the extending direction of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The extending direction of the flow paths 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 and the flow direction of the refrigerant are the same in the X-axis direction. In this disclosure, the cross-sectional area of ​​the flow path 30bc is the cross-sectional area of ​​a plane perpendicular to the extending direction of the flow paths 30bc, i.e., the flow direction of the refrigerant.

[0042] At least one of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 allows the refrigerant to flow in the direction from the first header 30a to the second header 30c, and the remaining multi-hole pipes allow the refrigerant to flow in the direction from the second header 30c to the first header 30a. In the following description, the multi-hole pipe through which the refrigerant flows in the direction from the first header 30a to the second header 30c may be referred to as the upstream multi-hole pipe, and the multi-hole pipe through which the refrigerant flows in the direction from the second header 30c to the first header 30a may be referred to as the downstream multi-hole pipe.

[0043] Among the first, second and third multi-hole pipes 30b1, 30b2 and 30b3, the first and third multi-hole pipes 30b1 and 30b3 provided at the ends in the Y-axis direction each have an inclined portion inclined outward in the Y-axis direction with respect to the X-axis direction. The inclined portions will be described in detail later.

[0044] [Second Header 30c] The second header 30c guides the refrigerant introduced from at least one of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 to the remaining multi-hole pipes of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. In other words, the second header 30c guides the refrigerant introduced from the upstream multi-hole pipe to the downstream multi-hole pipe.

[0045] The second header 30c is hollow with one side open. Specifically, the second header 30c has an opening 30ch1, an opening 30ch2, and an opening 30ch3 on the -X side surface. The other ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are inserted and fixed to the open side of the second header 30c. Specifically, the other end of the first multi-hole pipe 30b1 is inserted and fixed to the opening 30ch1. The other end of the second multi-hole pipe 30b2 is inserted and fixed to the opening 30ch2. The other end of the third multi-hole pipe 30b3 is inserted and fixed to the opening 30ch3. The second header 30c, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed to each other by brazing, for example, to ensure watertightness.

[0046] <Partition wall of first header 30a> Here, the partition walls provided in the first header 30a will be described.

[0047] The coolant introduced into the cooler 30 from an external cooling device absorbs heat from the semiconductor package 20 and is discharged from the cooler 30. Therefore, the temperature of the coolant flowing through the cooler 30 is lowest immediately after it is introduced, and gradually increases as it absorbs heat. In other words, the temperature of the coolant in the downstream multi-hole pipe is higher than the temperature of the coolant flowing through the upstream multi-hole pipe.

[0048] Next, the position of the partition wall provided in the first header 30a will be described. In the semiconductor device 1 of this embodiment, two multi-hole pipes, the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2, are upstream multi-hole pipes. Also, one multi-hole pipe, the third multi-hole pipe 30b3, is downstream multi-hole pipe.

[0049] 9 and 10 are cross-sectional views of the semiconductor device 1 of this embodiment. Specifically, FIG. 9 is a cross-sectional view of the semiconductor device 1 cut at the first header 30a portion along a plane perpendicular to the X-axis direction. Specifically, FIG. 10 is a cross-sectional view of the semiconductor device 1 cut at the center portion in the Z direction along a plane perpendicular to the Z-axis direction. Note that the semiconductor package 20 is shown as a uniform cross section with internal details omitted. Also, in FIG. 10, the inclined portion of the multi-hole tube is omitted.

[0050] In the semiconductor device 1 of this embodiment, the partition wall 30aw is provided so that the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 are upstream multi-hole pipes and the third multi-hole pipe 30b3 is downstream multi-hole pipe. The partition wall 30aw extends in the X-axis direction from the wall portion 30aF to the wall portion 30aE of the first header 30a.

[0051] The first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 communicate with a space SPin surrounded by a part of the wall 30aA, the wall 30aB, a part of the wall 30aC, the partition wall 30aw, the wall 30aE, and the wall 30aF. A refrigerant is introduced into the space SPin from the refrigerant inlet 30ap1. The refrigerant introduced into the space SPin is discharged from the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 which communicate with the space SPin.

[0052] On the other hand, the third multi-hole pipe 30b3 communicates with a space SPout surrounded by a part of the wall 30aA, the partition wall 30aw, a part of the wall 30aC, the wall 30aD, the wall 30aE, and the wall 30aF. The refrigerant is introduced from the third multi-hole pipe 30b3 communicating with the space SPout. The refrigerant introduced into the space SPout is discharged from the refrigerant outlet 30ap2.

[0053] <Sloped section of multi-hole pipe> A description will be given of the inclined portions provided in the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 of the cooler 30. Fig. 11 is a side view showing an outline of the cooler 30 of the semiconductor device 1 of the present embodiment.

[0054] Of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3, the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3, which are located at the outermost sides in the Y-axis direction, each have an inclined portion on both sides in the X-axis direction that inclines outward in the Y-axis direction with respect to the X-axis direction.

[0055] Specifically, the first multi-hole pipe 30b1 has an inclined portion 30b1a that is inclined toward the -Y side, that is, toward the outside in the Y-axis direction, on the -X side. The first multi-hole pipe 30b1 also has an inclined portion 30b1b that is inclined toward the -Y side, that is, toward the outside in the Y-axis direction, on the +X side. Both ends of the first multi-hole pipe 30b1 are inclined toward the X-axis direction with respect to the inclined portion 30b1a and the inclined portion 30b1b.

[0056] The third multi-hole pipe 30b3 has an inclined portion 30b3a on the -X side that is inclined outward in the Y-axis direction, i.e., toward the +Y side. The third multi-hole pipe 30b3 also has an inclined portion 30b3b on the +X side end that is inclined outward in the Y-axis direction, i.e., toward the +Y side. Both ends of the first multi-hole pipe 30b1 are inclined toward the X-axis direction with respect to the inclined portions 30b1a and 30b1b.

[0057] The first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 each have an inclined portion, so that a step of width H is provided.

[0058] One end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is joined to the first header 30a. The other end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is joined to the second header 30c.

[0059] When the semiconductor device 1 operates, the semiconductor package 20 generates heat. When the semiconductor package 20 generates heat, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are heated by the semiconductor package 20. When the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are heated from a state in which the first header 30a and the second header 30c are fixed at room temperature, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 each thermally expand.

[0060] For example, when both ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are not fixed, they thermally expand in proportion to the length L [m] of the multi-hole pipe, the linear expansion coefficient α [1 / K] of the cooling pipe material, and the temperature difference ΔT [K]. That is, the thermal deformation amount (lengthwise) δ of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is α×L×ΔT. For example, when the multi-hole pipes are made of aluminum material, the linear expansion coefficient of aluminum material is 23.8×10 -6 Since this is [1 / K], if the length of the multi-hole pipe is 0.15 [m], a thermal expansion of 0.2 [mm] will occur.

[0061] The first header 30a and the second header 30c are fixed to a housing to which the semiconductor device 1 is attached. Therefore, even if the semiconductor device 1 operates, the distance between the first header 30a and the second header 30c does not change. On the other hand, when the semiconductor device 1 operates, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 thermally expand.

[0062] Therefore, the wall portion 30aE of the first header 30a to which the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are joined is deformed. Also, the wall portion 30cE of the second header 30c to which the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are joined is deformed.

[0063] The first multi-hole pipe 30b1 has an inclined portion 30b1a and an inclined portion 30b1b. The third multi-hole pipe 30b3 has an inclined portion 30b3a and an inclined portion 30b3b. The inclined portion 30b1a and the inclined portion 30b3a each press the wall portion 30aE in the direction of the arrow A. The inclined portion 30b1b and the inclined portion 30b3b each press the wall portion 30cE in the direction of the arrow A. Therefore, the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 are deformed in the Y-axis direction toward the second multi-hole pipe 30b2 on the inside.

[0064] As the first multi-hole tube 30b1 deforms in the Y-axis direction toward the inner second multi-hole tube 30b2, the semiconductor package 20 disposed between the first multi-hole tube 30b1 and the second multi-hole tube 30b2 is sandwiched more firmly by the first multi-hole tube 30b1 and the second multi-hole tube 30b2. As the third multi-hole tube 30b3 deforms in the Y-axis direction toward the inner second multi-hole tube 30b2, the semiconductor package 20 disposed between the third multi-hole tube 30b3 and the second multi-hole tube 30b2 is sandwiched more firmly by the third multi-hole tube 30b3 and the second multi-hole tube 30b2.

[0065] Therefore, when the semiconductor device 1 operates and the semiconductor package 20 generates heat, the semiconductor package 20 can be stably cooled by the cooler 30.

[0066] For example, the first multi-hole pipe 30b1 is an example of a first outer multi-hole pipe, the inclined portion 30b1a is an example of a first inclined portion, and the inclined portion 30b1b is an example of a second inclined portion. The third multi-hole pipe 30b3 is an example of a second outer multi-hole pipe, the inclined portion 30b3a is an example of a third inclined portion, and the inclined portion 30b3b is an example of a fourth inclined portion. The third multi-hole pipe 30b3 may be an example of a first multi-hole pipe, and the second header 30c may be an example of a first header.

[0067] Although the ends of the first multi-hole tube 30b1 and the third multi-hole tube 30b3 are parallel to the X-axis direction, the shapes of the ends of the first multi-hole tube and the third multi-hole tube are not limited to the shapes of the first multi-hole tube 30b1 and the third multi-hole tube 30b3. Fig. 12 is a side view showing an outline of a cooler 130 which is a modified example of the cooler 30 of the semiconductor device of the present embodiment.

[0068] The first multi-hole pipe 130b1 of the cooler 130 has an inclined portion 130b1a and an inclined portion 130b1b at both ends, respectively. The third multi-hole pipe 130b3 of the cooler 130 has an inclined portion 130b3a and an inclined portion 130b3b at both ends, respectively.

[0069] In the cooler 130, both ends of the first multi-hole pipe 130b1 are inclined portions 130b1a and 130b1b, and the refrigerant flows obliquely to the X-axis direction to the first header 130a and the second header 130c, respectively. In the cooler 130, both ends of the third multi-hole pipe 130b3 are inclined portions 130b3a and 130b3b, and the refrigerant flows obliquely to the X-axis direction to the first header 130a and the second header 130c, respectively.

[0070] <Connection between multi-hole pipe and header> FIG. 13 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment.

[0071] The first header 230a includes a wall portion 230aE that joins the multi-hole pipes. The first multi-hole pipe 230b1 and the third multi-hole pipe 230b3 have inclined portions. In order to connect the inclined portions, the wall portion 230aE of the first header 230a includes a wall portion 230aE1 and a wall portion 230aE3 that are inclined to fit the inclined portions. The wall portion 230aE of the first header 230a also includes a wall portion 230aE2 that connects the wall portion 230aE1 and the wall portion 230aE3 and is provided vertically to fit the second multi-hole pipe 230b2.

[0072] The wall portion 230aE1 has an opening 230ah1 into which the first multi-hole pipe 230b1 is inserted. The wall portion 230aE2 has an opening 230ah2 into which the second multi-hole pipe 230b2 is inserted. The wall portion 230aE3 has an opening 230ah3 into which the third multi-hole pipe 230b3 is inserted.

[0073] Although the first header 230a has been described, the same applies to the second header. For example, the wall portion 230aE1 is an example of a first inclined wall portion. The inclined wall portion provided in the second header is an example of a second inclined wall portion.

[0074] Also, the opening may be provided with an inclination in order to connect the multi-hole pipe and the header. Fig. 14 is a diagram showing the connection between the multi-hole pipe and the header of the cooler of the semiconductor device of this embodiment.

[0075] The first header 330a has an opening 330ah1, an opening 330ah2, and an opening 330ah3 in a wall portion 330aE.

[0076] The opening 330ah1 is for inserting the first multi-hole pipe 330b1. The opening 330ah1 is inclined in the direction in which the inclined portion of the first multi-hole pipe 330b1 extends so as to fit the inclined portion of the first multi-hole pipe 330b1. The opening 330ah2 is for inserting the second multi-hole pipe 330b2. The opening 330ah2 is formed horizontally in order to fit the second multi-hole pipe 330b2. The opening 330ah3 is for inserting the third multi-hole pipe 330b3. The opening 330ah3 is inclined in the direction in which the inclined portion of the third multi-hole pipe 330b3 extends so as to fit the inclined portion of the third multi-hole pipe 330b3.

[0077] Although the first header 330a has been described, the same applies to the second header. For example, the opening 330ah1 is an example of a first inclined opening. Also, the inclined opening provided in the second header is an example of a second inclined opening.

[0078] Furthermore, in order to absorb dimensional changes due to thermal expansion of the multi-hole pipe with respect to the header whose position is fixed, the wall portion to which the multi-hole pipe is joined may be made easily deformable, i.e., the rigidity of the wall portion to which the multi-hole pipe is joined may be reduced.

[0079] 15 is a diagram showing the connection between the multi-hole pipe and the header of the cooler of the semiconductor device of this embodiment. The wall portion 430aE that joins with the multi-hole pipe of the first header 430a has a smaller thickness (wall thickness) than the other wall portions. That is, the wall portion 430aE is formed of a thin plate. The wall portion 430aE has an opening 430ah1, an opening 430ah2, and an opening 430ah3 for attaching the multi-hole pipe.

[0080] The wall portion 430aE is formed thin, and thus has a lower rigidity than the other wall portions. That is, the wall portion 430aE has the lowest rigidity among the wall portions constituting the first header 430a. In this embodiment, the wall portion 430aE is formed thinner than the other wall portions to reduce its rigidity, but this is not limited to forming it thin. For example, the wall portion 430aE may be formed locally thin or bellows-shaped, and other possible means for reducing the rigidity are also included.

[0081] Therefore, even if each of the first multi-hole tube 430b1, the second multi-hole tube 430b2, and the third multi-hole tube 430b3 thermally expands, the amount of deformation due to thermal expansion can be absorbed.

[0082] Although the first header 430a has been described, the same applies to the second header 430a. For example, the wall portion 430aE is an example of a joint wall portion.

[0083] <<Power conversion equipment>> Next, a power conversion device using the semiconductor device according to this embodiment will be described.

[0084] 16 and 17 are perspective views of a power converter 5 using the semiconductor device 1 according to this embodiment. Fig. 17 is a view of the power converter 5 of Fig. 16 with the cover 51 removed.

[0085] The power conversion device 5 converts, for example, DC power into three-phase AC power of a predetermined frequency. The power conversion device 5 is mounted, for example, on an automobile or the like.

[0086] The power conversion device 5 includes a cover 51 and a case 52. The case 52 includes a connector 53 and a connector 54 for connecting an external power source and a load. The combination of the cover 51 and the case 52 may be referred to as a housing 50.

[0087] The power conversion device 5 includes a control board 55, the semiconductor device 1, and a capacitor 56 inside a cover 51 and a case 52. A refrigerant is introduced and discharged through pipes 112 and 113.

[0088] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0089] For example, the number of multi-hole tubes is not limited to 3, and may be 2 or more. Furthermore, the multi-hole tubes having an inclined portion are not limited to the first multi-hole tube and the second multi-hole tube, and any of the multi-hole tubes provided in the cooler may have an inclined portion. [Explanation of symbols]

[0090] 1 Semiconductor device 5 Power conversion device 20, 21, 22, 23, 24, 25, 26 Semiconductor packages 30, 130 cooler 30a, 130a, 230a, 330a, 430a First header 230aE1, 230aE3 Wall section 330ah1, 330ah3 opening 30b1, 130b1, 230b1, 330b1, 430b1 1st multi-hole pipe 30b1a, 30b1b, 130b1a, 130b1b, 230b1a, 330b1a Slope 30b2, 130b2, 230b2, 330b2, 430b2 2nd multi-hole pipe 30b3, 130b3, 230b3, 330b3, 430b3 3rd multi-hole pipe 30b3a, 30b3b, 130b3a, 130b3b, 230b3a, 330b3a Slope 30c, 130c 2nd Header SPin space SPout space

Claims

1. A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction; a first header to which one end of each of the plurality of multi-hole pipes is joined; a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes; Equipped with A first multi-hole tube of any one of the plurality of multi-hole tubes is a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe; a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe; The first multi-hole pipe is a first outer multi-hole pipe that is provided at the outermost position in the first direction among the plurality of multi-hole pipes. cooler.

2. The first inclined portion and the second inclined portion are each inclined toward the outside. The cooler of claim 1 .

3. the plurality of multi-hole pipes include a second outer multi-hole pipe provided on the outermost side opposite to the first multi-hole pipe in the first direction, The second outer multi-hole tube is a third inclined portion inclined in the first direction with respect to the second direction at the one end; a fourth inclined portion inclined in the first direction with respect to the second direction at the other end; A cooler according to claim 1 or 2.

4. the third inclined portion and the fourth inclined portion are inclined toward opposite sides of the first outer multi-hole tube, The cooler according to claim 3.

5. the first header has a first inclined wall portion to which the one end of the first multi-hole pipe is joined, the first inclined wall portion being inclined in the first direction with respect to the second direction; the second header has a second inclined wall portion to which the other end of the first multi-hole pipe is joined, the second header having a second inclined wall portion inclined in the first direction with respect to the second direction; A cooler according to any one of claims 1 to 4.

6. the first header has a first inclined opening portion which is inclined in a direction in which the first inclined portion extends and to which the one end of the first multi-hole pipe is joined, the second header has a second inclined opening portion, to which the other end of the first multi-hole pipe is joined, the second header being inclined in a direction in which the second inclined portion extends and penetrating therethrough; A cooler according to any one of claims 1 to 4.

7. A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction; a first header to which one end of each of the plurality of multi-hole pipes is joined; a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes; Equipped with Each of the first header and the second header includes a plurality of wall portions including a joint wall portion to which the plurality of multi-hole pipes are joined, The joint wall portion has the lowest rigidity among the plurality of wall portions. cooler.

8. A plurality of multi-hole pipes arranged in a line and spaced apart in a first direction; a first header to which one end of each of the plurality of multi-hole pipes is joined; a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes; Equipped with A first multi-hole tube of any one of the plurality of multi-hole tubes is a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe; a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe; the first header has a first inclined wall portion to which the one end of the first multi-hole pipe is joined, the first inclined wall portion being inclined in the first direction with respect to the second direction; the second header has a second inclined wall portion to which the other end of the first multi-hole pipe is joined, the second header having a second inclined wall portion inclined in the first direction with respect to the second direction; cooler.

9. A plurality of multi-hole pipes arranged in a line and spaced apart in a first direction; a first header to which one end of each of the plurality of multi-hole pipes is joined; a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes; Equipped with A first multi-hole tube of any one of the plurality of multi-hole tubes is a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe; a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe; the first header has a first inclined opening portion which is inclined in a direction in which the first inclined portion extends and to which the one end of the first multi-hole pipe is joined, the second header has a second inclined opening portion, to which the other end of the first multi-hole pipe is joined, the second header being inclined in a direction in which the second inclined portion extends and penetrating therethrough; cooler.

10. A plurality of multi-hole pipes arranged in a line and spaced apart in a first direction; a first header to which one end of each of the plurality of multi-hole pipes is joined; a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes; Equipped with A first multi-hole tube of any one of the plurality of multi-hole tubes is a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe; a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe; The first header has a refrigerant inlet and a refrigerant outlet. cooler.

11. A plurality of semiconductor packages; The cooling device according to any one of claims 1 to 10, Each of the plurality of semiconductor packages is provided between two adjacent multi-hole tubes. Semiconductor device.

12. A semiconductor device comprising: Power conversion equipment.

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