Teaching device and teaching method for teaching the operation of a laser processing machine, and device and method for generating an interference check program

Abstract

Conventionally, a technique for effectively verifying interference between a laser beam emitted by a laser machining device and an object (e.g., a tool) present in a work cell has been desired.　A teaching device 50 comprises: a model data acquisition unit 64 that acquires an object model; an input receiving unit 70 that receives input of an interference detection condition for detecting interference between a virtual laser beam and the object model in a virtual laser machining operation in which the virtual laser beam is simulatively irradiated at a machining location; and an interference detection unit 72 that detects interference occurring in the virtual laser machining operation on the basis of the received interference detection condition. The interference detection condition includes a beam size of the virtual laser beam, or an invalid region set in the object model for invalidating the interference detection.

Description

[Technical field]

[0001] The present disclosure relates to a teaching device and a teaching method for teaching the operation of a laser processing machine, and a device and a method for generating an interference check program. [Background technology]

[0002] A teaching device that teaches the operation of a laser processing machine is known (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-35404 A Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, there has been a demand for a technique for effectively verifying interference between a laser beam emitted by a laser processing machine and an object (eg, a jig) present in a work cell. [Means for solving the problem]

[0005] In one aspect of the present disclosure, a teaching device for teaching the operation of a laser processing machine that laser processes an object includes a model data acquisition unit that acquires an object model that models an object, an input receiving unit that receives input of interference detection conditions for detecting interference between a virtual laser light and the object model in a virtual laser processing operation in which the virtual laser light is simulated to be irradiated to a processing location set on the object model, and an interference detection unit that detects interference that occurs in the virtual laser processing operation based on the interference detection conditions received by the input receiving unit, where the interference detection conditions include the beam size of the virtual laser light or an invalid area that is set for the object model to invalidate detection of interference.

[0006] In another aspect of the present disclosure, a method for teaching the operation of a laser processing machine for laser processing an object includes a processor acquiring model data of an object model that models an object, accepting input of interference detection conditions for detecting interference between a virtual laser light and the object model in a virtual laser processing operation in which virtual laser light is simulated to be irradiated to a processing location set on the object model, and detecting interference occurring in the virtual laser processing operation based on the accepted interference detection conditions, wherein the interference detection conditions include a beam size of the virtual laser light or an invalid area set for the object model to invalidate detection of interference.

[0007] In yet another aspect of the present disclosure, an apparatus for generating an interference confirmation program that causes a laser processing machine that performs a laser processing operation to laser process a processing location set on a workpiece to perform an interference confirmation operation to check in advance for interference between laser light and an environmental object includes an input receiving unit that receives input of operating parameters for the interference confirmation operation, an operating speed setting unit that sets the operating speed of the laser processing machine in the interference confirmation operation to a speed slower than that of the laser processing operation based on the operating parameters received by the input receiving unit, and a program generation unit that generates an interference confirmation program that specifies commands to operate the laser processing machine at the operating speed set by the operating speed setting unit in the interference confirmation operation, and irradiate the processing location with laser light having optical characteristics different from those of the laser processing operation.

[0008] In yet another aspect of the present disclosure, a method for generating an interference confirmation program for causing a laser processing machine that performs a laser processing operation to laser process a processing location set on a workpiece to perform an interference confirmation operation to check in advance for interference between laser light and environmental objects, the processor receives input of operating parameters for the interference confirmation operation, and based on the received operating parameters, determines the operating speed of the laser processing machine in the interference confirmation operation to be slower than that of the laser processing operation, and generates an interference confirmation program that specifies commands to operate the laser processing machine at the determined operating speed in the interference confirmation operation and irradiate the processing location with laser light having optical characteristics different from those of the laser processing operation. Effect of the Invention

[0009] According to the present disclosure, it becomes possible to effectively verify possible interference between laser light and an object. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram of a laser processing system according to one embodiment. [Diagram 2] 2 is a block diagram of the laser processing system shown in FIG. 1. [Diagram 3] An example of the laser irradiation device shown in FIG. 1 is shown. [Figure 4] 2 illustrates an example of the moving mechanism shown in FIG. [Diagram 5] 2 shows an example of a virtual space generated by the teaching device shown in FIG. [Figure 6] 1 shows an example of a machining location set on a workpiece model. [Figure 7] An example of a machining path set for the machining location shown in FIG. 6 is shown. [Figure 8] 4 shows an example of input image data for inputting an interference detection condition. [Figure 9] FIG. 2 is a block diagram showing other functions of the laser processing system. [Figure 10] 1 shows the operation of the movement mechanism while laser scanning one processing location in a laser processing operation. [Figure 11] 13 shows an example of input image data for inputting operation parameters of an interference checking operation. [Figure 12] 13 is a flowchart showing an example of a flow of an interference checking operation. [Figure 13] 13 is a flowchart showing an example of the process of step S2 in FIG. 12. [Figure 14] FIG. 13 is a block diagram of a laser processing system according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. In various embodiments described below, similar elements are given the same reference numerals, and duplicated explanations will be omitted. First, a laser processing system 10 according to one embodiment will be described with reference to Figs. 1 to 3. The laser processing system 10 includes a laser processing machine 12, a control device 14, and a teaching device 50.

[0012] The laser processing machine 12, under the command of the control device 14, irradiates a processing location PL set on the workpiece 102 with a laser beam LB, and performs laser processing (laser welding, laser cutting, etc.) on the processing location PL by the laser beam LB. Specifically, the laser processing machine 12 includes a laser oscillator 16, a laser irradiation device 18, and a moving mechanism 20.

[0013] The laser oscillator 16 is a solid-state laser oscillator (e.g., a YAG laser oscillator or a fiber laser oscillator) or a gas laser oscillator (e.g., a carbon dioxide gas laser oscillator), and generates laser light LB therein by optical resonance in response to a command from the control device 14, and supplies the laser light LB to the laser irradiation device 18 through a light guiding member 22. The light guiding member 22 has at least one of, for example, an optical fiber, a light guiding path made of a hollow or light-transmitting material, a reflecting mirror, and an optical lens, and guides the laser light LB to the laser irradiation device 18.

[0014] The laser irradiation device 18 is a laser scanner (galvano scanner) or a laser processing head having a nozzle for emitting laser light and assist gas, and focuses the laser light LB supplied from the laser oscillator 16 and irradiates the workpiece 102. Fig. 3 shows a schematic configuration of the laser irradiation device 18 as a laser scanner. The laser irradiation device 18 shown in Fig. 3 has a housing 24, a light receiving unit 26, mirrors 28 and 30, mirror driving devices 32 and 34, an optical lens 36, a lens driving device 38, and a laser light emitting unit 40.

[0015] The housing 24 is hollow and defines a propagation path of the laser light LB therein. The light receiving unit 26 is provided in the housing 24 and receives the laser light LB propagated through the light guiding member 22. The mirror 28 is provided inside the housing 24 so as to be rotatable about the axis A1. The mirror 28 reflects the laser light LB that has entered the housing 24 through the light receiving unit 26 toward the mirror 30. The mirror driving device 32 is, for example, a servo motor, and rotates the mirror 28 about the axis A1 in response to a command from the control device 14.

[0016] On the other hand, the mirror 30 is provided inside the housing 24 so as to be rotatable about an axis A2. The axis A2 may be substantially perpendicular to the axis A1. The mirror 30 reflects the laser light LB reflected by the mirror 28 toward the optical lens 36. The mirror driving device 34 is, for example, a servo motor, and rotates the mirror 30 about the axis A2 in response to a command from the control device 14. In general, the mirrors 28 and 30 may be referred to as galvanometer mirrors, and the mirror driving devices 32 and 34 may be referred to as galvanometer motors.

[0017] The optical lens 36 has a focus lens or the like, and focuses the laser light LB. In this embodiment, the optical lens 36 is supported inside the housing 24 so as to be movable in the direction of the optical axis O of the incident laser light LB. The lens driving device 38 has a piezoelectric element, an ultrasonic vibrator, an ultrasonic motor, or the like, and displaces the optical lens 36 in the direction of the optical axis O in response to a command from the control device 14, thereby displacing the focus FP of the laser light LB irradiated to the workpiece 102 in the direction of the optical axis O. The laser light emitting unit 40 emits the laser light LB focused by the optical lens 36 to the outside of the housing 24.

[0018] 1 and 2 again, the moving mechanism 20 has, for example, a servo motor, and moves the laser irradiation device 18 relatively to the workpiece 102. For example, the moving mechanism 20 is a multi-joint robot that can move the laser irradiation device 18 to any position in the moving mechanism coordinate system C1. Alternatively, the moving mechanism 20 may have a plurality of ball screw mechanisms that move the laser irradiation device 18 along the xy plane of the moving mechanism coordinate system C1 and in the z-axis direction of the moving mechanism coordinate system C1.

[0019] The moving mechanism coordinate system C1 is a coordinate system for automatically controlling the operation of the moving mechanism 20, and is set for the moving mechanism 20. Meanwhile, a tool coordinate system C2 is set for the laser irradiation device 18. The tool coordinate system C2 is a coordinate system that defines the position of the laser irradiation device 18 in the moving mechanism coordinate system C1. In this document, "position" may refer to both position and posture.

[0020] In this embodiment, the tool coordinate system C2 is set with respect to the laser irradiation device 18 so that its origin is located at the center of the laser light emitting part of the laser irradiation device 18 (in the example shown in FIG. 3, the laser light emitting part 40) and its z axis is parallel to (e.g., coincident with) the optical axis O of the laser light LB emitted from the laser light emitting part.

[0021] FIG. 4 shows a schematic configuration of the moving mechanism 20 as a vertical articulated robot. The moving mechanism 20 shown in FIG. 4 has a robot base 42, a rotating body 44, a lower arm 46, an upper arm 48, and a wrist 49. The robot base 42 is fixed on the floor of the work cell. The rotating body 44 is provided on the robot base 42 so as to be rotatable around a vertical axis. The lower arm 46 is provided on the rotating body 44 so as to be rotatable around a horizontal axis, and the upper arm 48 is provided on the tip of the lower arm 46 so as to be rotatable. The wrist 49 is provided on the tip of the upper arm 48 so as to be rotatable around two axes that are perpendicular to each other.

[0022] Each component of the moving mechanism 20 (robot base 42, rotating body 44, lower arm 46, upper arm 48, and wrist 49) is provided with a servo motor (not shown), and the servo motor rotates each movable component of the moving mechanism 20 (rotating body 44, lower arm 46, upper arm 48, and wrist 49) around a drive axis in response to commands from the control device 14.

[0023] 4, the movement mechanism coordinate system C1 is set so that its origin is located at the center of the robot base 42 and its z-axis coincides with the rotation axis of the rotating body 44. When the laser irradiation device 18 is positioned at an arbitrary target position in the movement mechanism coordinate system C1 by the operation of the movement mechanism 20, the control device 14 first sets a tool coordinate system C2 in the movement mechanism coordinate system C1. Next, the control device 14 operates the movement mechanism 20 so as to position the laser irradiation device 18 at a position represented by the set tool coordinate system C2.

[0024] In this way, the control device 14 can place the laser irradiation device 18 at any target position in the movement mechanism coordinate system C1 by operating the movement mechanism 20. In the following description, for convenience, the positive x-axis direction of the movement mechanism coordinate system C1 may be referred to as the right, the positive y-axis direction as the forward direction, and the positive z-axis direction as the upward direction.

[0025] The control device 14 controls the operation of the laser processing machine 12. Specifically, the control device 14 is a computer having a processor (CPU, GPU, etc.) and memory (ROM, RAM, etc.). The control device 14 controls the laser light generation operation by the laser oscillator 16. The control device 14 also operates mirror drive devices 32 and 34 of the laser irradiation device 18 to change the orientations of the mirrors 28 and 30, respectively, thereby allowing the laser light LB irradiated to the workpiece 102 to move at high speed relative to the workpiece 102.

[0026] The control device 14 also operates the lens driving device 38 of the laser irradiation device 18 to displace the optical lens 36, thereby moving the focus FP of the laser light LB emitted from the laser light emitting unit 40 in the direction of the optical axis O. The control device 14 also operates the moving mechanism 20 to move the laser irradiation device 18 relative to the workpiece 102.

[0027] The teaching device 50 is for teaching the operation of the laser processing machine 12. As shown in Fig. 2, the teaching device 50 is a computer having a processor 52, a memory 54, and an I / O interface 56. Note that the teaching device 50 may be any type of computer, such as a desktop or tablet PC, a teaching operation panel, or a teaching pendant.

[0028] The processor 52 has a CPU or a GPU, and is communicatively connected to the memory 54 and the I / O interface 56 via a bus 58. The processor 52 communicates with the memory 54 and the I / O interface 56 and performs arithmetic processing to realize a teaching function, which will be described later.

[0029] The memory 54 has a RAM or a ROM, etc., and temporarily or permanently stores various data used in the arithmetic processing for the teaching function executed by the processor 52, and various data generated during the arithmetic processing. The I / O interface 56 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (registered trademark) terminal, and communicates data with an external device via wired or wireless communication under instructions from the processor 52.

[0030] The teaching device 50 is provided with an input device 60 and a display device 62. The input device 60 has a keyboard, a mouse, a touch panel, or the like, and receives data input from an operator. The display device 62 has a liquid crystal display, an organic EL display, or the like, and displays various data.

[0031] The input device 60 and the display device 62 are communicatively connected to the I / O interface 56 via a wire or wirelessly. The input device 60 and the display device 62 may be provided separately from the housing of the teaching device 50, or may be incorporated into the housing of the teaching device 50 as an integral part.

[0032] The processor 52 is configured to send commands to each servo motor of the moving mechanism 20 via the control device 14 in response to input data to the input device 60, and to jog the moving mechanism 20 in accordance with the commands. By operating the input device 60, the operator controls the moving mechanism 20 via the control device 14 and teaches the laser processing operation LPO by the laser processing machine 12.

[0033] Here, in the work cell, there are various objects 100 including the above-mentioned workpiece 102 and environmental objects 104 arranged around the workpiece 102. The environmental objects 104 include, for example, a jig for installing the workpiece 102 in the work cell, structures such as pillars arranged in the work cell, and peripheral equipment arranged around the workpiece 102.

[0034] When the control device 14 operates the laser processing machine 12 to perform a laser processing operation LPO for laser processing the processing location PL of the workpiece 102, it is necessary to avoid interference between the laser light LB emitted from the laser irradiation device 18 and the environmental object 104. The teaching device 50 teaches the laser processing operation LPO of the laser processing machine 12 while taking into consideration such interference between the laser light LB and the environmental object S.

[0035] Hereinafter, a method for teaching the laser processing operation LPO using the teaching device 50 will be described. First, the operator prepares drawing data of a laser processing machine model 12M that models the laser processing machine 12, and drawing data of an object model 100M that models the object 100. The drawing data of the laser processing machine model 12M and the object model 100M are, for example, three-dimensional CAD data.

[0036] In the following description, when the name of a component in the real space is "XX", the model of the component is referred to as "XX model". Thus, the laser processing machine model 12M includes a laser oscillator model 16M that models the laser oscillator 16, a laser irradiation device model 18M that models the laser irradiation device 18, and a moving mechanism model 20M that models the moving mechanism 20 (in the example shown in FIG. 3, a robot base model 42M, a rotating body model 44M, a lower arm model 46M, an upper arm model 48M, and a wrist model 49M). In addition, the object model 100M includes a workpiece model 102M that models the workpiece 102, and an environmental object model 104M that models the environmental object 104.

[0037] As an example, the operator may create the laser processing machine model 12M and the object model 100M using a design support device (CAD / CAM device), which is a computer separate from the teaching device 50, and download the drawing data of the laser processing machine model 12M and the object model 100M to the teaching device 50 via the I / O interface 56.

[0038] As another example, the functions of the design support device may be implemented in the teaching device 50, for example as software, and an operator may create the laser processing machine model 12M and the object model 100M in the teaching device 50 by operating the input device 60 while visually checking the display device 62 provided on the teaching device 50.

[0039] The processor 52 acquires the downloaded or created drawing data of the laser processing machine model 12M and the object model 100M, and stores the data in the memory 54 of the teaching device 50. Thus, in this embodiment, the processor 52 functions as a model data acquisition unit 64 (FIG. 2) that acquires the laser processing machine model 12M and the object model 100M.

[0040] When the operator operates the input device 60 to input a teaching start command CMt, the processor 52 reads out the laser processing machine model 12M and the object model 100M from the memory 54, and places them in the virtual space VS. The processor 52 may place only the laser irradiation device model 18M and the moving mechanism model 20M of the laser processing machine model 12M in the virtual space VS.

[0041] Fig. 5 shows an example of a virtual space VS in which a moving mechanism model 20M of the moving mechanism 20 shown in Fig. 4, a laser irradiation device model 18M, and an object model 100M are arranged. In this embodiment, a workpiece model 102M has a plurality of surface models 106M, 108M, and 110M that are connected to each other.

[0042] The processor 52 sets a movement mechanism coordinate system C1 and a tool coordinate system C2 for the movement mechanism model 20M and the laser irradiation device model 18M arranged in the virtual space VS in the positional relationship shown in Fig. 4. The processor 52 generates image data of the constructed virtual space VS and displays it on the display device 62.

[0043] In addition, the processor 52 determines the machining location PL n Position data PD n Figure 6 shows the processing area PL n 6, machining points PL1 and PL2 are set on a surface model 106M of a workpiece model 102M, machining points PL3 and PL4 are set on a surface model 108M, and machining points PL5 and PL6 are set on a surface model 110M.

[0044] These multiple processing points PL nA machining path PT of a predetermined shape is set for each of the positions (n=1 to 6). FIG. 7 shows an example of the machining path PT. In the example shown in FIG. 7, the machining path PT is a rectangle having a start point P1 and an end point P2. In an actual laser machining operation LPO, the laser processing machine 12 moves the laser light LB irradiated from the laser irradiation device 18 in a clockwise direction (or counterclockwise direction) along the machining path PT from the start point P1 to the end point P2, thereby forming a machining area PL n In this paper, moving the laser beam LB only once from the starting point P1 to the end point P2 of the processing path PT is referred to as one "laser scan."

[0045] As an example, the operator operates the input device 60 to input the machining location PL in the moving mechanism coordinate system C1 as data in a format different from the drawing data of the workpiece model 102M (for example, a different format). n (Specifically, the machining path PT) is set, and the machining location PL n Position data PD n Create a.

[0046] Alternatively, the operator creates the workpiece model 102M using a computer-aided design (CAD / CAM) device that is a computer separate from the teaching device 50, and marks the machining location PL on the workpiece model 102M. n This sets the machining location PL as data in the same format as the work model 102M (or in a different format). n Position data PD n The processor 52 may create each of the machining locations PL n (Processing path PT) position data PD n are obtained as coordinates in the movement mechanism coordinate system C1.

[0047] Next, the processor 52 calculates the machining area PL set on the workpiece model 102M in the virtual space VS. nThe input of operation parameters PRv for executing a virtual laser processing operation VLP (that is, a simulation of the laser processing operation LPO) in which a virtual laser beam LBv is radiated to the target object is accepted.

[0048] The operation parameter PRv is, for example, the value of each processing location PL in the virtual laser processing operation VLP. n The number of times N is to scan the processing path PT set in v , the time t for one laser scan of the processing path PT v , scanning frequency f v (i.e., the number of times the laser scans the processing path PT per second), the scanning speed V at which the virtual laser light LBv moves along the processing path PT v , multiple processing points PL n OR v , and the moving speed U at which the moving mechanism model 20M moves the laser irradiation device model 18M. v Includes at least one of the following:

[0049] For example, the processor 52 generates input image data ID1 for inputting the operation parameter PRv, and displays it on the display device 62. While visually checking the input image data ID1 displayed on the display device 62, the operator operates the input device 60 to input the operation parameter PRv (i.e., the number of times N v , time t v , scanning frequency f v , scanning speed V v , order OR v Or movement speed U v )

[0050] The processor 52 then calculates the position data PD of the object model 100M (specifically, the work model 102M and the environmental object model 104M) and the laser processing machine model 12M (for example, the laser irradiation device model 18M and the moving mechanism model 20M) arranged in the virtual space VS. n Based on the operation parameter PRv, the laser processing machine model 12M is operated in the virtual space VS to apply the virtual laser light LBv to the processing point PL nA virtual laser processing operation VLP is generated to irradiate the target object.

[0051] For example, the processor 52 may set each of the machining positions PL n For N times v = 10, scanning speed V v = 100 [mm / sec], and the order of machining locations is PL1 → PL2 → PL3 → PL4 → PL5 → PL6 OR v In this case, the processor 52 generates a virtual laser processing operation VLP such that a series of operations as shown below are performed in a simulated manner within the virtual space VS.

[0052] Specifically, the processor 52 simulates the movement of the moving mechanism model 20M in the virtual space VS, and moves the laser irradiation device model 18M to the right along a predetermined movement path MPv in the moving mechanism coordinate system C1, and also simulates the movement of the laser irradiation device model 18M to irradiate the virtual laser light LBv from the laser irradiation device model 18M to the processing points PL1 →PL2 →PL3 →PL4 →PL5 →PL6 in the order OR v Then, a simulated irradiation is performed.

[0053] At this time, the processor 52 n In the laser irradiation device model 18M, a virtual laser beam LBv is irradiated along the processing path PT at a scanning speed V v = 100 [mm / sec] and each machining point PL n Repeat N times v =Scan the laser only 10 times.

[0054] The processor 52 generates a virtual laser processing operation VLP including such a series of operations based on the object model 100M, the laser processing machine model 12M, the position data PD n , and the motion parameter PRv. More specifically, the processor 52 automatically determines the movement path MPv.

[0055] The moving path MPv is made up of multiple teaching points TP1, TP2, TPm (m is a positive integer), and the processor 52 determines the teaching point TP m The moving path MPv may be determined by automatically determining the moving path MPv (or the teaching point TP m ) are determined as coordinates of the movement mechanism coordinate system C1.

[0056] In addition, the processor 52 calculates the distance between each processing point PL in the virtual laser processing operation VLP. n The irradiation timing RTv (e.g., irradiation start time and irradiation end time) for irradiating the virtual laser light LBv to the workpiece model 102M and the direction in which the virtual laser light LBv is emitted from the laser irradiation device model 18M at the irradiation timing RTv (or the irradiation position on the workpiece model 102M) are automatically determined.

[0057] Thus, in this embodiment, the processor 52 functions as an operation generating unit 66 (FIG. 2) that generates the virtual laser processing operation VLP. The processor 52 may display the generated virtual laser processing operation VLP on the display device 62 as image data of a moving image. In this case, the operator can visually recognize the virtual laser processing operation VLP as a simulation moving image.

[0058] The processor 52 also sets an interference detection condition CD for detecting interference between the virtual laser beam LBv and the object model 100M in the virtual laser processing operation VLP. n The input of the collision detection condition CD is accepted. n For example, the beam size BS of the virtual laser light LBv n , or an invalid area IA set for the object model 100M to disable the detection of interference n Includes.

[0059] The processor 52 determines the interference detection condition CD n The processor 52 generates input image data ID2 for inputting the above-mentioned character, and displays the same on the display device 62. In this manner, in the present embodiment, the processor 52 functions as an image generating unit 68 (FIG. 2) that generates the input image data ID2. FIG. 8 shows an example of the input image data ID2.

[0060] The input image data ID2 is the interference detection condition CD n The GUI has a processing location selection image area 110 and a condition setting image area 112. The processing location selection image area 110 is used by the processor 52 to input position data PD n Processing location PL obtained n (n=1-6) are listed in list form.

[0061] A scroll bar image 114 is displayed in the processing part selection image area 110, and the operator can select the processing part PL to be displayed by operating the input device 60 and sliding the scroll bar image 114 up and down on the image. n The operator can change the number of processing positions PL displayed in the processing position selection image area 110 by operating the input device 60. n The user can select one of the areas by clicking it on the image. In the example shown in Fig. 8, the processing area PL2 is selected.

[0062] The condition setting image area 112 displays the processing part PL selected in the processing part selection image area 110. n About Collision Detection Condition CD n (Specifically, beam size BS n and invalid area IA n Specifically, the condition setting image area 112 is used to set the beam size BS n A numerical input image 116 for setting the invalid area IA n and a numerical input image 118 for setting the value.

[0063] The numerical value input image 116 is a numerical value input image of the processing part PL selected in the processing part selection image area 110. n (In the example shown in FIG. 8, the beam size BS of the virtual laser light LBv irradiated to the processing path PT of the processing location PL2) n This is for inputting the beam size BS nFor example, the diameter (or radius) R of the virtual laser light LBv n (unit: [mm]) or cross-sectional area E n (Unit: mm 2 8, the beam size BS n As diameter R n The example shows how to enter [mm].

[0064] The operator operates the input device 60 to input the beam size BS n For example, when the processing location PL2 is selected as shown in Fig. 8, if a diameter R2 = 0.400 [mm] is input as the beam size BS2 in the numerical input image 116, the processor 52 will simulate the irradiation of a cylindrical virtual laser light LBv having a diameter R2 = 0.400 [mm] to the processing location PL2 when executing the virtual laser processing operation VLP, and will perform laser scanning of the processing path PT.

[0065] On the other hand, the numerical value input image 118 is a numerical value input image of the processing part PL selected in the processing part selection image area 110. n When the virtual laser beam LBv is irradiated to the workpiece model 102M, the virtual laser beam LBv is irradiated to the workpiece model 102M at a predetermined distance d n The range of the invalid area IA n To set the predetermined distance d n (unit: [mm]). The operator operates the input device 60 to input the invalid area IA in the numerical value input image 118. n The distance d that defines n can be entered.

[0066] 8, when the processing location PL2 is selected and the distance d2=1.000 [mm] is input to the numerical input image 118, the processor 52 sets, as an invalid area IA2, a range of a distance d2=1.000 [mm] from the irradiation position on the surface model 106M where the processing location PL2 is set, within the propagation area of ​​the virtual laser light LBv irradiated to the processing location PL2 in the virtual laser processing operation VLP. Note that the processor 52 may set the invalid area IA2 as a hemispherical area (i.e., a hemispherical area with a radius d2 centered on the irradiation position) within a distance d2=1.000 [mm] from the irradiation position on the surface model 106M.

[0067] Here, depending on the format of the drawing data of the object model 100M, the processor 52 may not be able to distinguish between the workpiece model 102M and the environmental object model 104M. In this case, the processor 52 recognizes the workpiece model 102M and the environmental object model 104M as one object model 100M, and when executing the virtual laser processing operation VLP, it is not possible to distinguish whether the virtual laser light LBv interferes with the workpiece model 102M or the environmental object model 104M.

[0068] In such a case, the processing location PL n When the virtual laser light LBv is laser scanned with the workpiece model 102M, the virtual laser light LBv and the workpiece model 102M interfere with each other in the calculation, and the processor 52 detects such interference. n For the workpiece model 102M, the interference between the virtual laser beam LBv and the workpiece model 102M can be made invalid and not detected.

[0069] As described above, the processor 52 detects a plurality of processing locations PL n For each collision detection condition CD n (Specifically, beam size BS n , and invalid area IA n The distance d that defines n) are input. In this embodiment, the processor 52 receives the interference detection condition CD n The input unit 70 (FIG. 2) functions as an input receiving unit 70 that receives the input.

[0070] Thereafter, the operator operates the input device 60 to input a command CM1 for starting the virtual laser processing operation VLP. For example, the processor 52 may generate start button image data (not shown) for starting the virtual laser processing operation VLP and display it on the display device 62. Upon receiving the command CM1 through the input device 60, the processor 52 executes the above-mentioned virtual laser processing operation VLP in the virtual space VS.

[0071] While executing this virtual laser processing operation VLP, the processor 52 receives the interference detection condition CD n Specifically, the processor 52 detects interference between the virtual laser beam LBv and the object model 100M in the virtual laser processing operation VLP. n For the interference detection condition CD n The beam size BS is set as n The propagation region of the virtual laser light LBv when the virtual laser light LBv having the above-mentioned relation is simulated is calculated, and the presence or absence of interference between the virtual laser light LBv and the object model 100M is detected.

[0072] At this time, the collision detection condition CD n Processing location PL n Invalid area IA n is set, the processor 52 does not detect interference between the virtual laser light LBv and the workpiece model 102M, but detects interference between the virtual laser light LBv and the environmental object model 104M. n Based on this, the interference detector 72 (FIG. 2) detects interference between the virtual laser beam LBv and the object model 100M.

[0073] When the processor 52 detects interference between the virtual laser light LBv and the environmental object model 104M in the virtual laser processing operation VLP, it generates a notification signal NS to notify that fact. This notification signal NS includes, for example, information indicating the position where the virtual laser light LBv interferes with the environmental object model 104M (for example, image data for highlighting the interference position on the environmental object model 104M).

[0074] When the operator recognizes from the notification signal NS that interference between the virtual laser light LBv and the environmental object model 104M has occurred, the operator corrects the virtual laser processing motion VLP generated by the motion generating unit 66. Specifically, the operator operates the input device 60 to correct the above-mentioned movement path MPv (or the teaching point TP m ), movement speed U v In response to the command CM2, the processor 52 functions as the motion generating unit 66 and changes the parameters of the set movement path MPv (or the teaching point TP m ), movement speed U v , or by changing parameters such as the irradiation timing RTv, the virtual laser processing operation VLP is modified.

[0075] In this way, the operator tries out the virtual laser processing operation VLP, and when interference between the virtual laser light LBv and the environmental object model 104M occurs in the tried virtual laser processing operation VLP, the operator repeats the task of correcting the virtual laser processing operation VLP. As a result, the processor 52 (operation generating unit 66) can generate a virtual laser processing operation VLP0 in which no interference occurs between the virtual laser light LBv and the environmental object model 104M.

[0076] Next, the operator operates the input device 60 to input a command CM3 for generating a processing program PPG for the laser processing operation LPO to be executed in real space by the laser processing machine 12. At this time, the processor 52 may generate button image data (not shown) for generating the processing program PPG and display it on the display device 62.

[0077] When the processor 52 receives the command CM3 through the input device 60, the processor 52 generates a processing program PPG based on the virtual laser processing operation VLP0 generated as described above. n Position data PD n , the moving path MPv (or the teaching point TP m ), irradiation timing RTv, and operation parameter PRv (number of scans N v , scanning time t v , scanning frequency f v , scanning speed V v , order OR v Or movement speed U v ) is defined as a command CMv (e.g., code), the processor 52 automatically generates the machining program PPG. In this manner, in the present embodiment, the processor 52 functions as a program generator 74 (FIG. 2) that generates the machining program PPG.

[0078] As described above, in this embodiment, the input receiving unit 70 receives the interference detection condition CD n Beam size BS as n and invalid area IA n The interference detection unit 72 receives the input of the interference detection condition CD n Based on this, interference occurring in the virtual laser processing operation VLP is detected.

[0079] Conventionally, the virtual laser beam LBv is defined as a line with a cross-sectional area of ​​zero, and then the virtual laser processing operation VLP is executed to detect the presence or absence of interference between the virtual laser beam LBv and the object model 100M. In this case, there can be no error in detecting the interference between the virtual laser beam LBv and the object model 100M.

[0080] When a laser processing operation is performed according to a processing program created as a result of the virtual laser processing operation VLP based on such interference detection, the irradiation timing of the laser processing machine 12, the processing location PL nIf there is a slight error in the position of the workpiece 102 or in the arrangement of the workpiece 102 and the environmental object 104, there is a possibility that the actual laser light LB will interfere with the environmental object 104.

[0081] In this embodiment, the interference detection condition CD n Beam size BS as n When the input is received, the virtual laser light LBv is generated with a beam size of BS n After defining the virtual laser beam LBv as a region having a cross-sectional area according to the virtual laser beam LBv, the virtual laser processing operation VLP is executed, and interference between the virtual laser beam LBv and the object model 100M is detected.

[0082] According to this configuration, if the irradiation timing of the laser processing machine 12 and the processing location PL n Even if there is a slight error in the position of the workpiece 102 or in the arrangement of the workpiece 102 and the environmental object 104, it is possible to prevent the laser light LB from interfering with the environmental object 104 during the actual laser processing operation LPO.

[0083] In addition, as described above, in the past, there were cases where the workpiece model 102M and the environmental object model 104M could not be distinguished from each other due to the format of the drawing data of the object model 100M. n As the invalid area IA n When the input of is received, it is possible to avoid detecting interference between the virtual laser light LBv and the workpiece model 102M in the virtual laser processing operation VLP. n or invalid area IA n The interference detection condition CD n By accepting the signal as a valid signal, possible interference can be effectively checked.

[0084] In this embodiment, the input receiving unit 70 also detects the invalid area IA n Collision detection conditions for setting CD n As the distance d n According to this configuration, the operator can input the invalid area IA. nIt is possible to easily set the area of ​​a desired size, and the invalid area IA in the virtual space VS n You can also intuitively recognize the range of

[0085] In the present embodiment, the input receiving unit 70 receives a plurality of processing positions PL n For each collision detection condition CD n According to this configuration, the operator inputs the processing location PL n For each collision detection condition CD n For example, in the virtual laser processing operation VLP, when the processing locations PL1 and PL2 are laser scanned, the laser irradiation device model 18M is moved at a relatively fast moving speed U v1 On the other hand, when scanning the processing points PL3 and PL4 with a laser, the laser irradiation device model 18M is moved at a relatively slow moving speed U v2 ( v1 ) to move it.

[0086] Here, the laser irradiation device model 18M is moved at a slower speed U v2 When moving the virtual laser processing operation VLP, it may be desirable to set the clearance for interference detection in the virtual laser processing operation VLP small, since there is little discrepancy between the result of interference detection between the virtual laser light LBv and the object model 100M (specifically, the environmental object model 104M) and the interference state between the laser light LB and the object 100 (specifically, the environmental object 104) in the actual laser processing operation LPO.

[0087] On the other hand, the laser irradiation device model 18M has a faster moving speed U v1 When moving the virtual laser beam LBv with the object model 100M, a discrepancy is likely to occur between the result of interference detection between the virtual laser beam LBv and the object model 100M and the interference state between the laser beam LB and the object 100 during the actual laser processing operation LPO, so it may be necessary to set a large clearance for interference detection during the virtual laser processing operation VLP.

[0088] According to this embodiment, the laser irradiation device model 18M is moved at a high moving speed U v1 ​For the processing points PL1 and PL2 to be scanned by moving the laser at a speed of 1000 s, relatively large beam sizes BS1 and BS2 are set, while the laser irradiation device model 18M is moved at a slow moving speed U v1 For the processing points PL3 and PL4 to be scanned by moving the laser, relatively small beam sizes BS3 and BS4 can be set. n Optimal beam size BS n can be set.

[0089] In addition, the operator determines an invalid area IA to be set for the work model 102M according to the positional relationship between the work model 102M and the environmental object model 104M. n In some cases, it may be necessary to adjust the range of the processing area PL n Each time, the invalid area IA n In this way, the range of the processing area PL n Collision detection conditions CD n By accepting the input of the collision detection condition CD n Processing location PL n can be optimized for each

[0090] In this embodiment, the image generating unit 68 detects the interference detection condition CD n According to this configuration, the operator can visually check the input image data ID2 while determining the interference detection conditions CD n Since it is possible to input the collision detection condition CD n This simplifies the task of setting up the

[0091] In the present embodiment, the motion generating unit 66 generates the object model 100M, the laser processing machine model 12M, and the processing location PL n Position data PD n Based on the above, a virtual laser processing operation VLP is generated. According to this configuration, the virtual laser processing operation VLP can be automatically generated by the processor 52, and the operator can confirm and verify the virtual laser processing operation VLP. This simplifies the work related to teaching the laser processing operation LPO.

[0092] Furthermore, in this embodiment, the program generation unit 74 generates a processing program PPG for the laser processing operation LPO based on the virtual laser processing operation VLP0 generated by the operation generation unit 66. According to this configuration, the virtual laser processing operation VLP0 and the processing program PPG can be automatically generated, so that the work related to teaching the laser processing operation LPO can be further simplified.

[0093] The processor 52 calculates the moving speed U at which the moving mechanism model 20M moves the laser irradiation device model 18M. v Depending on the beam size BS n may be set automatically. In this case, the moving speed U v and beam size BS n A data table in which the moving speed U and the moving speed P are associated with each other is stored in advance in the memory 54, and the processor 52 receives the moving speed U as the motion parameter PRv. v By applying this to the data table, the beam size BS n In this case, the input receiving unit 70 may set the beam size BS n The input is not accepted and the invalid area IA n It is also possible to accept only the input of

[0094] Also, for example, when the workpiece model 102M and the environmental object model 104M can be distinguished from each other by the format of the drawing data of the object model 100M, the interference detection unit 72 can be configured to invalidate the interference between the virtual laser light LBv and the workpiece model 102M and to detect only the interference between the virtual laser light LBv and the environmental object model 104M. In this case, the input reception unit 70 detects the invalid area IA n No input is accepted, beam size BS n It is also possible to accept only the input of

[0095] In addition, the processor 52 detects the processing location PL from the laser irradiation device model 18M in the virtual laser processing operation VLP. nA conical virtual laser beam LBv whose cross-sectional area decreases toward the center of the laser irradiation device model 18M may be emitted from the laser irradiation device model 18M. In this case, the input receiving unit 70 receives the interference detection condition CD n As the beam size BS n In addition, the reduction rate λ n (or taper rate) may further be accepted.

[0096] For example, it is assumed that the input receiving unit 70 receives an input of a beam size BS2=diameter R2=0.400 [mm] and a reduction rate λ as the interference detection condition CD2 for the processing location PL2. In this case, the processor 52 simulates, in the virtual laser processing operation VLP, a conical virtual laser beam LBv having a diameter R2 of 0.400 [mm] at the laser beam emitting part model 40M of the laser irradiation device model 18M and a cross-sectional area that reduces at a reduction rate λ2 from the laser beam emitting part model 40M toward the processing location PL2.

[0097] Alternatively, in the virtual laser processing operation VLP, the processor 52 simulates emitting a cone-shaped virtual laser beam LBv whose cross-sectional area is reduced at a reduction rate λ2 from the laser beam emitting part model 40M toward the position of the processing location PL2 and whose diameter R2 is 0.400 [mm] at the position of the processing location PL2. By generating such a cone-shaped virtual laser beam LBv, the virtual laser processing operation VLP can be executed with the virtual laser beam LBv similar to the laser beam LB in the actual laser processing operation LPO.

[0098] In addition, the input receiving unit 70 n Interference detection condition CD for n As the above distance d n Along with the invalid area IA n For example, when the operator is selecting the machining area PL2 as shown in Fig. 8, the operator operates the input device 60 to specify the surface model 106M in which the machining area PL2 is set.

[0099] In this case, the processor 52 functions as an input receiving unit 70, receives input specifying the surface model 106M as the reference for the invalid area IA2, and sets the area within the range of the input distance d2 (e.g., 1.000 [mm]) from the irradiation position on the surface model 106M as the invalid area IA2.

[0100] At this time, the processor 52 may function as an image generating unit 68 to display an image of the workpiece model 102M in the input image data ID2 so that the operator can visually recognize the image. n is a predetermined set value (e.g., d n = 1.000 [mm]) may be stored in advance in the memory 54. In this case, the processor 52 n The input is not accepted and the invalid area IA n The following will be set:

[0101] In the present embodiment, the case where the motion generating unit 66 automatically generates the virtual laser processing motion VLP has been described. However, this is not limited to this, and the operator may manually generate the virtual laser processing motion VLP by operating the input device 60. In this case, the motion generating unit 66 can be omitted from the teaching device 50.

[0102] In the present embodiment, the program generating unit 74 automatically generates the machining program PPG. However, the present invention is not limited to this, and the operator may manually generate the machining program PPG by operating the input device 60. In this case, the program generating unit 74 can be omitted from the teaching device 50.

[0103] In the present embodiment, when interference occurs between the virtual laser light LBv and the environmental object model 104M during the virtual laser processing operation VLP, the operator may change the moving path MPv (teaching point TP m ), movement speed U v In the above, the case where the command CM2 for changing the irradiation timing RTv is input has been described.

[0104] However, the present invention is not limited to this. The processor 52 may function as the motion generating unit 66 to generate a moving path MPv (taught point TP) so as to avoid the interference based on the position of the interference that has occurred. m ), movement speed U v Alternatively, the irradiation timing RTv may be automatically changed to automatically correct the virtual laser processing operation VLP.

[0105] Furthermore, the above-mentioned processing program PPG may have a first processing program PPG1 for operating the moving mechanism 20 and a second processing program PPG2 for operating the laser irradiation device 18. In this case, the program generating unit 74 may generate the first processing program PPG1 and the second processing program PPG2 as separate data (for example, in different data forms or formats).

[0106] The above-mentioned model data acquisition unit 64, motion generation unit 66, image generation unit 68, input reception unit 70, interference detection unit 72, and program generation unit 74 are functional modules realized by, for example, a computer program executed by the processor 52. At least one function of the model data acquisition unit 64, motion generation unit 66, image generation unit 68, input reception unit 70, interference detection unit 72, and program generation unit 74 may be implemented in the control device 14. In this case, the processor of the control device 14 performs the function of the teaching device 50.

[0107] Next, other functions of the laser processing system 10 will be described with reference to Fig. 9. In a work cell in real space, the control device 14 generates commands for the actual laser processing machine 12 according to the processing program PPG generated by the method of the embodiment shown in Fig. 2 (or other methods), and causes the laser processing machine 12 to execute a laser processing operation LPO.

[0108] In this laser processing operation LPO, the laser processing machine 12 operates the moving mechanism 20 to move the laser irradiation device 18 along a moving path MPv (i.e., teaching points TP1, TP2, . . . TP m) to the right, and the laser irradiation device 18 is operated to emit the laser beam LB to process a plurality of processing points PL n OR v The laser is scanned with.

[0109] In Fig. 10, one processing point PL n 1 shows the operation of the moving mechanism 20 while the laser beam LB is being laser scanned. For example, the processing program PPG includes a number of scans N v If =10 is specified, the moving mechanism 20 moves the laser irradiation device 18 to the teaching point TP m (First teaching point) to teaching point TP m+1 (second teaching point), along the moving path MPv at a moving speed U v While moving the laser beam LB to the right, the laser irradiation device 18 irradiates the processing area PL n The machining path PT is set at a scanning speed V v The laser is scanned 10 times.

[0110] During such an operation, interference between the laser light LB and the environmental object 104 may occur in the real space. v and the scanning speed V of the laser irradiation device 18. v Since the laser beam LB moves at a high speed, it is difficult for an operator to visually check for interference between the laser beam LB and the environmental object 104 during the actual laser processing operation LPO.

[0111] Therefore, in this embodiment, the teaching device 50 generates an interference confirmation program IPG for executing an interference confirmation operation IVO for confirming in advance the interference between the laser beam LB and the environmental object 104. Here, the interference confirmation operation IVO is an operation different from the actual laser processing operation LPO, and for interference confirmation, the laser processing machine 12 is operated at an operation speed ν lower than that of the laser processing operation LPO, and the laser beam LBg having optical characteristics different from those of the laser processing operation LPO is directed to the processing location PL. n This is the action of test-irradiating the

[0112] The operating speed v of the laser processing machine 12 includes a moving speed U at which the moving mechanism 20 moves the laser irradiation device 18, and a scanning speed V at which the laser irradiation device 18 moves the laser light LBg along the processing path PL. The laser light LBg is visible light (so-called guide laser) having a wavelength different from that of the laser light LB emitted in the laser processing operation LPO, and has a lower laser power than that of the laser light LB. In this paper, the laser light LBg emitted in the interference confirmation operation IVO is referred to as the guide laser LBg.

[0113] A method for generating the interference check program IPG will be described below. When the operator operates the input device 60 to input a command CM4 for generating the interference check program IPG, the processor 52 n Position data PD n For example, the location data PD n may be stored in the memory 54 or may be defined in the machining program PPG.

[0114] In addition, the processor 52 reads the teaching point TP from the machining program PPG. m and TP m+1 Position data PD TP In this manner, in the present embodiment, the processor 52 acquires the teaching point TP at which the laser processing machine 12 positions the laser irradiation device 18 in the laser processing operation LPO. m Position data PD TP The position data acquisition unit 80 (FIG. 9) acquires the position data.

[0115] Then, the processor 52 calculates the operation parameters PRi for the interference checking operation IVO. n The input of the operation parameter PRi is accepted. n is, for example, the scanning speed V at which the guide laser LBg is moved along the processing path PL in the interference confirmation operation IVO. i_n , the scanning time t n , and the scanning time t n The allowable time τ nIncludes.

[0116] The processor 52 calculates the operating parameters PRi n The processor 52 generates input image data ID3 for inputting the above-mentioned character, and displays the same on the display device 62. In this manner, in the present embodiment, the processor 52 functions as an image generating unit 82 (FIG. 9) that generates the input image data ID3. FIG. 11 shows an example of the input image data ID3.

[0117] The input image data ID3 is input to the operator as the operation parameter PRi n The GUI has a processing part selection image area 110 including the above-mentioned scroll bar image 114, and a parameter setting image area 120. The parameter setting image area 120 is a GUI for inputting the processing part PL selected in the processing part selection image area 110. n About the operating parameters PRi n This is to set the

[0118] Specifically, the parameter setting image area 120 is a scanning speed V i_n and a numerical input image 122 for setting the scanning time t n and a numerical input image 124 for setting the allowable time τ n The numerical value input images 122, 124, and 126 each include a numerical value input image 126 for setting a processing part PL selected in the processing part selection image area 110. n (In the example shown in FIG. 11, the processing location PL2) is scanned at a scanning speed V i_n , scanning time t n , and the allowable time τ n (In the example shown in FIG. 11, the scanning speed V i_2 , scanning time t2, and allowable time τ2).

[0119] In this way, the operator selects the desired processing location PL n Select the processing area PL n Each time, the operation parameters PRi are input through the numerical input images 122, 124 and 126. n as the scanning speed V i_n, scanning time t n , and the allowable time τ n Therefore, in this embodiment, the processor 52 inputs the operation parameter PRi n The input unit 84 (FIG. 9) functions as an input receiving unit 84 that receives the input.

[0120] The processor 52 then calculates the received operating parameters PRi n Based on this, the operating speed v n For example, when the operator selects a processing location PL2 in the processing location selection image area 110 as shown in FIG. 11, the operator sets a scanning speed V i_2 = 1 [mm / sec], scanning time t2 = 1 [sec], and allowable time τ2 = 5 [sec].

[0121] In this case, the processor 52 first obtains the path length L2 from the start point P1 to the end point P2 of the machining path PT set at the machining location PL2 from the position data PD2 of the machining location PL2. Then, using the path length L2, the processor 52 obtains the scanning speed V corresponding to the scanning time t2 and the allowable time τ2 input as the operation parameter PRi2. t2 and V τ2 We ask for the following respectively.

[0122] For example, assume that the path length L2 is 40 mm. In this case, the processor 52 calculates a scanning speed V t2 , V t2 Similarly, the processor 52 determines the scanning speed V when the path length L2 is laser scanned in the allowable time τ2. τ2 , V τ2 =L2 / τ2=8[mm / sec].

[0123] Then, the processor 52 calculates the scanning speed V i_2and the calculated scanning speed V t2 and scanning speed V τ2 and MAX(MIN(V i_2 ,V t2 ),V τ2 ) for this conditional formula (I). i_2 ,V t2 ) is V i_2 and V t2 In other words, in this embodiment, the smaller of MIN(V i_2 ,V t2 )=V i_2 (=1[mm / sec]), so MAX(MIN(V i_2 ,V t2 ),V τ2 )=MAX(V i_2 ,V τ2 )

[0124] On the other hand, MAX(V i_2 ,V τ2 ) is V i_2 and V τ2 In other words, in this embodiment, the larger of MAX(V i_2 ,V τ2 )=V τ2 (=8 [mm / sec]). In this way, the processor 52 calculates the scanning speed V i_2 From the scanning time t2, the allowable time τ2, and the conditional formula (I), the scanning speed V2 when laser scanning the processing part PL2 in the interference checking operation IVO is V2 = V τ2 = 8 [mm / sec].

[0125] The technical significance of using the conditional formula (I) will be described below. If an operator selects a scanning speed V i_2 is input as a relatively low speed in order to facilitate visual interference checking. In this case, the input scanning speed V i_2 The scanning time t required to scan the path length L2 with the laser V2 is a relatively long scan time t V2 =L2 / Vi_2 It becomes.

[0126] On the other hand, from the viewpoint of reducing the cycle time of the interference check operation IVO, it is assumed that the operator inputs a relatively short scanning time t2 as the operation parameter PRi2. In this case, the scanning speed V corresponding to the input scanning time t2 is t2 In the above conditional formula (I), MIN(V i_2 ,V t2 ) to determine the speed V i_2 and velocity V t2 By selecting the smaller of the two, the speed V t2 are excluded.

[0127] However, MIN(V i_2 ,V t2 ) the selected speed V i_2 Now, as mentioned above, the scanning time t V2 In this case, the cycle time of the interference check operation IVO may increase excessively. Therefore, in the conditional formula (I), MAX(V i_2 ,V τ2 ) to determine the speed V i_2 and the speed V corresponding to the allowable time τ2 τ2 By selecting the larger of the speed V and V, the cycle time may become excessively redundant. i_2 Excluding this, the speed V corresponding to the allowable time τ2 τ2 is defined as the scanning speed V2 when the machining location PL2 is laser scanned in the interference checking operation IVO.

[0128] In this manner, in this embodiment, the permissible time τ2 is input as the operation parameter PRi2 in order to keep the scanning time t2 required for laser scanning the machining path PT of the machining location PL2 in the interference checking operation IVO within a permissible range to the extent that the cycle time of the interference checking operation IVO does not become excessively long. According to the conditional formula (I), i_2 ,V t2 and V τ2Regardless of which of the above is selected, the scanning time t2 will not exceed the allowable time τ2.

[0129] If the operator selects an appropriate scanning speed V i_2 Or enter the scan time t2 (for example, the scan speed V i_2 In the case where the input values ​​are: t2=10 [mm / sec], scanning time t2=5 [sec], and allowable time τ2=10 [sec], the processor 52 calculates the scanning speed V2 when laser scanning the processing location PL2 in the interference checking operation IVO from the conditional formula (I), as the scanning speed V corresponding to the scanning time t2 (=5 [sec]). t2 (=8[mm / sec]). The scanning speed V2 determined to enable visual confirmation of interference is the scanning speed V in the laser processing operation LPO. v (For example, 100 [mm / sec]) will be set to a value lower than this.

[0130] As described above, the processor 52 calculates the operating parameters PRi n Based on this, the machining location PL is checked using the interference check operation IVO. n The operating speed ν n (Specifically, the scanning speed V n ) at a speed lower than the laser processing operation LPO (V n <V v ) in the present embodiment. Therefore, the processor 52 operates at an operating speed v n This functions as an operation speed setting unit 86 (FIG. 9) that sets the operation speed.

[0131] In addition, the operation parameter PRi n The operating speed ν determined based on n is a given threshold value ν th If the threshold value v is greater than or equal to the threshold value v , the processor 52 may generate a warning signal AS in the form of image or sound data, for example, stating that "the operation speed in the interference check operation is high, so visual interference check may be difficult," and output the signal through the display device 62 or a speaker (not shown). th is, for example, the operating speed vv (For example, the scanning speed V v Or movement speed U v ) as a standard, ν th =αν v (α is a positive coefficient).

[0132] Next, the processor 52 generates an interference confirmation program IPG that defines a command CMi for causing the laser processing machine 12 to execute a series of operations as follows as an interference confirmation operation IVO. That is, in the interference confirmation operation IVO, the laser processing machine 12 operates the laser oscillator 16 to generate a guide laser LBg, operates the moving mechanism 20 to move the laser irradiation device 18, and operates the laser irradiation device 18 to project a plurality of processing locations PL n are laser scanned in the order ORv by a guide laser LBg.

[0133] One processing location PL n When performing laser scanning, the laser processing machine 12 first operates the moving mechanism 20 to move the laser irradiation device 18 to the teaching point TP. m (FIG. 10). Next, the laser processing machine 12 positions the laser irradiation device 18 at the teaching point TP m With the laser stationary, apply the guide laser LBg to the processing area PL n and the scanning speed V n And the processing part PL n The processing path PT is repeatedly scanned with the laser.

[0134] Next, when an interference check command CM5 is received from the operator, the laser processing machine 12 stops the irradiation of the guide laser LBg, and then operates the moving mechanism 20 to move the laser irradiation device 18 to the teaching point TP. m+1 Next, the laser processing machine 12 positions the laser irradiation device 18 at the teaching point TP m+1 With the laser stationary, apply the guide laser LBg to the processing area PL n Irradiate again to the processed area PL n The machining path PT is the scanning speed V nIn this way, the laser processing machine 12 moves the laser irradiation device 18 to the teaching point TP m and TP m+1 Each time the laser beam is positioned in sequence, a laser scan is performed.

[0135] Next, when an interference check command CM6 is received from the operator, the laser processing machine 12 stops the irradiation of the guide laser LBg, and then operates the moving mechanism 20 to move the laser irradiation device 18 to the next processing location PL n+1 Teaching point TP set for m Move to the next processing point PL n+1 The above-described series of laser scans are then performed on the target object.

[0136] The above series of laser scans are performed on multiple processing points PL n In the order ORv, the laser processing machine 12 executes the interference checking operation IVO. n Position data PD n and teaching point TP m Position data PD TP and the scanning speed V determined by the operation speed setting unit 86. n Based on this, the processor 52 automatically generates an interference checking program IPG in which commands CMi for causing the laser processing machine 12 to execute a series of interference checking operations IVO as described above are defined. In this manner, in this embodiment, the processor 52 functions as a program generating unit 88 (FIG. 9) that generates the interference checking program IPG.

[0137] Fig. 12 shows a flowchart illustrating an example of the interference confirmation operation IVO. The processor 52 of the teaching device 50 (or the processor of the control device 14) executes the flow shown in Fig. 12 in accordance with the interference confirmation program IPG generated by the program generation unit 88. The flow shown in Fig. 12 starts when the processor 52 receives an operation start command CM7 from an operator, a higher-level controller, or a computer program (for example, the interference confirmation program IPG).

[0138] In step S1, the processor 52 selects the nth processing location PL n In step S2, the processor 52 sets the number "n" that identifies the nth processed portion PL n This step S2 will be described with reference to Fig. 13. After the start of step S2, in step S11, the processor 52 operates the moving mechanism 20 to move the laser irradiation device 18 to the n-th processing location PL n The first teaching point TP set for m Position it at.

[0139] In step S12, the processor 52 starts laser scanning. Specifically, as described above, the processor 52 operates the laser oscillator 16 to generate the guide laser LBg and points the laser irradiation device 18 to the first teaching point TP. m With the guide laser LBg stationary, the nth processing point PL n The nth processing location PL n The processing path PT is scanned by the guide laser LBg at a scanning speed V n The laser scan is repeated.

[0140] In step S12, the operator n While the laser scan of the object 104 is being performed, the operator can visually check whether there is interference between the guide laser LBg and the environmental object 104. When the interference check is completed, the operator operates the input device 60 to input an interference check command CM5.

[0141] In step S13, the processor 52 judges whether or not the interference check command CM5 is received. If the processor 52 judges that the interference check command CM5 is received (i.e., YES), the processor 52 ends the laser scanning started in step S12 (i.e., stops the emission of the guide laser LBg) and proceeds to step S15, whereas if the processor 52 judges that the interference check command CM5 is received (i.e., YES), the processor 52 proceeds to step S14.

[0142] In step S14, the processor 52 generates a confirmation signal RS. For example, the processor 52 generates the confirmation signal RS in the form of image or audio data, saying, "Please check for interference between the guide laser and the environmental object. If there is no interference, proceed to the next step." The processor 52 outputs the generated confirmation signal RS through the display device 62 or a speaker (not shown), and returns to step S13.

[0143] In this way, the processor 52 loops steps S13 and S14 until it determines YES in step S13. In step S15, the processor 52 operates the moving mechanism 20 to move the laser irradiation device 18 to the n-th processing location PL n The second teaching point TP set for m+1 Position it at.

[0144] In step S16, the processor 52 starts laser scanning. Specifically, the processor 52 moves the laser irradiation device 18 to the second teaching point TP as described above. m+1 With the guide laser LBg stationary, the nth processing point PL n The nth processing location PL n The processing path PT is scanned by the guide laser LBg at a scanning speed V n The laser scan is repeated.

[0145] In step S16, the operator n While the laser scan is being performed on the object 104, the operator visually checks again whether there is interference between the guide laser LBg and the environmental object 104. When the interference check is completed, the operator operates the input device 60 to input an interference check command CM6.

[0146] In step S17, the processor 52 determines whether or not an interference confirmation command CM6 has been received. If the processor 52 determines YES, it ends the laser scanning started in step S16 and proceeds to step S3 in FIG. 12, whereas if the processor 52 determines NO, it proceeds to step S18. In step S18, the processor 52 generates a confirmation signal RS in the same manner as in step S14 described above, and returns to step S17. In this way, the processor 52 loops steps S17 and S18 until it determines YES in step S17.

[0147] Referring again to FIG. 12, in step S3, the processor 52 n The number "n" that identifies the number is incremented by "1" (n=n+1). In step S4, processor 52 determines whether or not the number "n" that is set at this point is greater than "6" (i.e., n>6).

[0148] If the processor 52 determines that n>6 (i.e., YES), it ends the flow of the interference checking operation IVO shown in Fig. 12, whereas if it determines that n≦6 (i.e., NO), it returns to step S2. Thus, the processor 52 repeatedly executes the loop of steps S2 to S4 until it determines YES in step S4. The processor 52 executes each of steps S1 to S4 shown in Fig. 12 in accordance with the interference checking program IPG. Therefore, the interference checking program IPG defines commands CMi (e.g., codes) for executing each of steps S1 to S4.

[0149] As described above, in this embodiment, the processor 52 functions as the position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operation speed setting unit 86, and the program generation unit 88 to generate the interference check program IPG. Therefore, the position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operation speed setting unit 86, and the program generation unit 88 constitute a device 90 (FIG. 9) that generates the interference check program IPG. Note that the position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operation speed setting unit 86, and the program generation unit 88 are functional modules realized by, for example, a computer program executed by the processor 52.

[0150] In this device 90, the operation speed setting unit 86 sets the operation parameters PRi n Based on this, the motion speed ν n (Scanning speed V n ) is set to a speed lower than that of the laser processing operation LPO. The program generating unit 88 controls the laser processing machine 12 to operate at an operating speed v n (Scanning speed V n ) and guide the guide laser LBg to the processing point PL n An interference checking program IPG is generated that defines a command CMi for irradiating the target object (steps S12 and S16 in FIG. 13).

[0151] According to this device 90, in the interference checking operation IVO, the operation speed v n By operating the laser processing machine 12 in this manner, the operator can visually check for interference between the laser light LBg and the environmental object 104 before performing the actual laser processing operation LPO. As a result, the presence or absence of such interference can be effectively verified in advance, and if interference does occur, measures can be taken, such as modifying the processing program PPG to avoid the interference.

[0152] In the device 90, the input receiving unit 84 receives the operation parameter PRi n Let V be the scanning speed. i_n, scanning time t n , and the allowable time τ n The operation speed setting unit 86 receives the input of the scanning speed V i_n , the scanning time t n , and the allowable time τ n Based on this, the scanning speed V in the interference confirmation operation IVO is n According to this configuration, the scanning speed V in the interference checking operation IVO is n can be automatically determined as the speed at which the operator can visually confirm interference.

[0153] In the apparatus 90, the position data acquisition unit 80 acquires teaching points TP for positioning the laser irradiation device 18 in the laser processing operation LPO. m , T.P. m+1 Position data PD TP The program generating unit 88 then moves the laser irradiation device 18 to the teaching point TP in the interference checking operation IVO. m , T.P. m+1 An interference checking program IPG is generated that defines a command CMi for positioning the target object to the target object (steps S11 and S15 in FIG. 13).

[0154] According to this configuration, the teaching point TP in the laser processing operation LPO (more specifically, defined in the processing program PPG) m , T.P. m+1 Therefore, interference that may occur in the actual laser processing operation LPO can be verified with high accuracy by the interference checking operation IVO performed in advance.

[0155] In the apparatus 90, the program generating unit 88 causes the laser irradiation device 18 to move to the first teaching point TP in the interference checking operation IVO. m and the second teaching point TP m An interference checking program IPG is generated that defines commands CMi for executing laser scanning (steps S11 and S12, and steps S15 and S16 in FIG. 13) each time the laser beam is positioned in sequence.

[0156] According to this configuration, in the interference checking operation IVO, the processing location PL n The starting point of the movement of the laser irradiation device 18 when scanning the object with the laser (first teaching point TP m ) and end point (second teaching point TP m+1 ), laser scanning is performed by the guide laser LBg. This allows the processing location PL n This makes it possible to more efficiently verify interference that may occur when laser scanning a target object.

[0157] In the device 90, the input receiving unit 84 receives a plurality of processing positions PL n Operation parameters PRi n (Scanning speed V i_2 , scanning time t2, and allowable time τ2), and the operation speed setting unit 86 receives input of the multiple processing locations PL n The operation speed ν n (Scanning speed V n ) is established.

[0158] According to this configuration, the operator can determine the motion speed v n The processing area PL n This makes it easier to visually check for interference during the interference check operation IVO.

[0159] In the device 90, the image generating unit 82 calculates the operation parameter PRi n According to this configuration, the operator can visually check the input image data ID3 and input the operation parameters PRi n Since it is possible to input the operation parameter PRi n This simplifies the task of setting up the

[0160] In this embodiment, the motion speed setting unit 86 sets the motion speed v n Let V be the scanning speed. nHowever, the present invention is not limited to this. The motion speed setting unit 86 may set the motion speed v n Let V be the scanning speed. n (or the scanning speed V n In addition to the above, the moving speed U at which the moving mechanism 20 moves the laser irradiation device 18 n In this case, the input receiving unit 84 may determine a plurality of processing locations PL n For each operation parameter PRi n , the movement speed U n may be accepted.

[0161] In addition, the input receiving unit 84 receives the operation parameters PRi n As the above-mentioned scanning time t n Alternatively (or in addition), the scanning frequency f i_n (=1 / t n In this case, the operation speed setting unit 86 may receive the input scanning frequency f i_n The corresponding scanning speed V fn , V fn =f i_n ×L n (where L n PL is the processing location n The scanning speed V fn , MAX(MIN(V i_n ,V fn ),V τn ) to the condition (I), the scanning speed V n may be determined.

[0162] The above conditional formula (I) is expressed as follows: MAX(MIN(V i_n ,V tn ),V τn The operator may use any logical expression as the conditional expression (I). For example, the conditional expression (I) may be MIN(MAX(V i_n ,V tn ),V τn ) may be used.

[0163] In this embodiment, the input receiving unit 70 receives the operation parameters PRi n Let V be the scanning speed. i_n , scanning time t n , and the allowable time τ n However, the input receiving unit 70 is not limited to this. i_n , scanning time t n , and the allowable time τ n In this case, the motion speed setting unit 86 determines the motion speed v n Determine.

[0164] In this embodiment, the position data acquisition unit 80 acquires the teaching point TP m Position data PD TP The program generating unit 88 performs an interference checking operation IVO to move the laser irradiation device 18 to the teaching point TP m This paper describes the case where an interference check program IPG is generated that specifies a positioning command CMi.

[0165] However, the present invention is not limited to this. The program generating unit 88 generates the position data PD TP An interference confirmation program IPG may be generated that defines a command CMi for positioning the laser irradiation device 18 at an arbitrary position in the interference confirmation operation IVO without using the above. The arbitrary position may be determined by an operator according to the interference confirmation operation IVO to be executed. In other words, in this case, the position data acquisition unit 80 can be omitted from the device 90.

[0166] In this embodiment, the program generating unit 88 controls the laser irradiation device 18 to move to the teaching point TP in steps S12 and S16 in FIG. m and TP m+1 In the above description, the interference check program IPG is generated so that the laser irradiation device 18 is moved to the teaching point TP in a stationary state. m and TP m+1 Without stopping the robot at the teaching point TPm and TP m+1 The interference checking program IPG may be generated to perform a laser scan while passing through.

[0167] Note that steps S13, S14, S17, and S18 may be omitted from the flow of the interference checking operation IVO shown in Fig. 13. For example, in the interference checking operation IVO, after the start of step S12, the processor 52 n Repeated a given number of times N i After repeatedly performing the laser scanning for the desired number of times, the process may proceed to step S15.

[0168] After the start of step S16, the processor 52 also n Repeated a given number of times N i In this case, the input receiving unit 84 may receive the operation parameter PRi n As a result, the processing area PL n Every N times i The input may further be accepted.

[0169] In addition, the functions of device 90 (i.e., position data acquisition unit 80, image generation unit 82, input reception unit 84, motion speed setting unit 86, and program generation unit 88) can also be implemented in control device 14. In this case, the processor of control device 14 functions as device 90.

[0170] 2 and 9, the image generating units 68 and 82 generate the image data ID2 (FIG. 8) and ID3 (FIG. 11), respectively. However, this is not limiting, and the processor 52 may generate the interference detection condition CD by, for example, the operator's voice without generating the image data ID2 or ID3. n Or operation parameter PRi n In this case, the teaching device 50 is further provided with a microphone for receiving voice input from the operator. That is, in this case, the image generating unit 68 or 82 can be omitted from the teaching device 50 or the device 90.

[0171] In the above embodiment, the workpiece 102 and the workpiece model 102M are provided with six machining points PL n However, the present invention is not limited to this, and only one machining location PL1 may be set on the workpiece 102 and the workpiece model 102M, or any number of machining locations PL n Alternatively, the machining path PT is not limited to a rectangle as shown in Fig. 7, and may be set to any shape, such as a triangle, a circle, or a straight line segment.

[0172] The above-mentioned control device 14 may have a first control device 14A that controls the operation of the laser oscillator 16 and the laser irradiation device 18, and a second control device 14B that controls the operation of the moving mechanism 20. Such a configuration is shown in Fig. 14. The first control device 14A and the second control device 14B are computers each having a processor (CPU, GPU, etc.) and memory (ROM, RAM, etc.), and are connected to each other so as to be able to communicate with each other.

[0173] The first control device 14A and the second control device 14B communicate with each other and execute the laser processing operation LPO or the interference confirmation operation IVO while synchronizing the operation of the laser oscillator 16 and the laser irradiation device 18 with the operation of the moving mechanism 20. Although the present disclosure has been described above through the embodiments, the above-mentioned embodiments do not limit the invention according to the claims. [Explanation of symbols]

[0174] 10 Laser processing system 12 Laser processing machine 14 Control device 16 Laser Oscillator 18 Laser irradiation device 20 Moving mechanism 50 Teaching device 52 processors 64 Model Data Acquisition Section 66 Motion generator 68,82 Image Generation Unit 70,84 Input reception section 72 Interference detection section 74,88 Program Generation Section 80 Position data acquisition unit 86 Operation speed setting section 90 equipment

Claims

1. A teaching device for teaching an operation of a laser processing machine that performs laser processing on an object, comprising: a model data acquisition unit that acquires an object model obtained by modeling the object; an input receiving unit that receives an input of an interference detection condition for detecting interference between a virtual laser light and the object model in a virtual laser processing operation in which a virtual laser light is simulatedly irradiated onto a processing location set on the object model; an interference detection unit that detects the interference occurring in the virtual laser processing operation based on the interference detection condition accepted by the input acceptance unit, A teaching device, wherein the interference detection condition includes a beam size of the virtual laser light or an invalid area set for the object model to invalidate detection of the interference.

2. the object comprises a workpiece to be laser machined; The object model has a workpiece model that models the workpiece, The teaching device according to claim 1 , wherein the input receiving unit receives an input of a predetermined distance to set a range of the predetermined distance from the irradiation position of the virtual laser light on the work model as the invalid area as the interference detection condition.

3. The teaching device according to claim 1 , wherein the input receiving unit receives an input of the interference detection condition for each of the plurality of machining locations.

4. 4. The teaching device according to claim 1, further comprising an image generating unit that generates input image data for inputting the interference detection conditions.

5. The model data acquisition unit further acquires a laser processing machine model obtained by modeling the laser processing machine, The teaching device according to any one of claims 1 to 4, further comprising an operation generating unit that generates the virtual laser processing operation in which the laser processing machine model is operated in a simulated manner based on the object model, the laser processing machine model, and position data of the processing location to irradiate the virtual laser light to the processing location.

6. The teaching device according to claim 5 , further comprising: a program generating unit that generates a processing program for the laser processing operation to be executed by the laser processing machine based on the virtual laser processing operation generated by the operation generating unit.

7. 1. A method for teaching operation of a laser machine for laser machining an object, comprising: The processor: acquiring model data of an object model obtained by modeling the object; receiving an input of an interference detection condition for detecting interference between a virtual laser beam and the object model in a virtual laser processing operation for simulating irradiation of a processing location set on the object model with the virtual laser beam; Detecting the interference occurring in the virtual laser processing operation based on the received interference detection condition; A method according to claim 1, wherein the interference detection condition includes a beam size of the virtual laser light or an invalid area set for the object model to disable detection of the interference.

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