Processing System

Abstract

To provide a processing system which allows a user to grasp a correlation between a plurality of pieces of measurement data.SOLUTION: A processing system 1 comprises: a holding table 10; a cutting unit 20 which performs cutting processing on a processing object 200; a moving unit which relatively moves the holding table 10 and the cutting unit 20; a measurement unit which acquires measurement values of a plurality of measurement items; and a control unit 100. The control unit 100 comprises: a measurement data storage part 101 which stores a measurement value and XY coordinates where the measurement value is acquired as measurement data; a color setting storage part 103 which stores a color set in accordance with the measurement data; and an image generation part 104 which generates an image in which a color corresponding to the measurement value is added to the position equivalent to the XY coordinates. The image generation part 104 generates an image added with a color according to the measurement values of at least two or greater measurement items.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a machining system for acquiring metrology data relating to a process. [Background technology]

[0002] Usually, in semiconductor devices, various measurement data related to the processing of the workpiece are acquired. Furthermore, a technology has been proposed that colors the wafer map according to the magnitude of the measurement value, so that the relationship between the measurement value and processing defects can be grasped in a short time (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-092207 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, because the measurement data is so diverse, it has been difficult to understand the correlations between the measurement data.

[0005] Therefore, an object of the present invention is to provide a processing system that makes it possible to grasp the correlation between a plurality of pieces of measurement data. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the processing system of the present invention is a processing system including a holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a moving unit for relatively moving the holding table and the processing unit in an X direction and a Y direction perpendicular to the X direction, a measuring unit for acquiring measured values ​​of a plurality of measurement items related to processing, and a control unit. a display unit for displaying an image;The control unit includes a measurement data storage unit that associates the measurement value with an XY coordinate represented by the X direction and the Y direction in which the measurement value was obtained, and stores the measurement data in association with the XY coordinate. Measurement item It is set according to And the measurement items have different hues a color setting storage unit that stores a color; and an image generating unit that generates an image with the color corresponding to the measurement value for a position corresponding to the XY coordinates. ,of The image generating unit generates the image colored according to the measured values ​​of at least two or more of the measurement items. The images colored according to the measured values ​​of at least two or more of the measurement items thus generated are displayed side by side or overlaid on the display unit, and the colors are transparent, and the positions where the measured values ​​exceed the threshold are displayed darker than the positions where the measured values ​​are below the threshold. It is characterized by:

[0007] In the processing system, the measurement items may be any of the vibration of the holding table, the pressure, temperature, and flow rate of the fluid supplied to the holding table, the load on the holding table, the moving speed of the holding table, the torque of the motor connected to the holding table, the pressure, temperature, and flow rate of the fluid supplied to the processing unit, the current and voltage supplied to the processing unit, the moving speed of the processing unit, the torque of the motor mounted on the processing unit, the current and voltage supplied to the processing feed unit, and the torque of the motor mounted on the processing feed unit.

[0008] The processing system of the present invention includes an inspection table for holding a processed workpiece, an imaging unit for imaging the workpiece held on the inspection table, an inspection unit for acquiring inspection values ​​of inspection items from the captured image, and a control unit. a display unit for displaying an image; The control unit includes an inspection data storage unit that associates the inspection value with an XY coordinate corresponding to the coordinate at which the inspection value was acquired, and stores the inspection data in association with the XY coordinate. The relevant test items It is set according to In addition, the test items are each different in hue. and an image generating unit that generates an image with the color corresponding to the inspection value for a position corresponding to the XY coordinates. The image generating unit includes at least two The test item Generate the image colored according to the test value The images colored according to the test values ​​of at least two or more test items thus generated are displayed side by side or overlapped on the display unit, and the colors are transparent, and a position where a test value exceeding a threshold value is displayed darker than a position where a test value below the threshold value is displayed. It is characterized by:

[0009] In the processing system, the inspection item may be any one of the position of a processing mark formed on the workpiece, the width of the processing mark, chipping formed adjacent to the processing mark, attached foreign matter, cracks, and film peeling.

[0010] In the processing system, the image generating unit The measurement items and the same workpiece from which the measurement value was obtained. After processing Workpiece From the image captured Obtained test values Inspection items Depending on both The measurement items and the inspection items are set to have different hues. A colored image may also be generated. Effect of the Invention

[0011] The present invention has an effect of making it possible to grasp the correlation between a plurality of pieces of measurement data. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a processing system according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece to be processed and inspected by the processing system shown in FIG. [Diagram 3] 3 is a side view, partially in cross section, showing a schematic configuration of a cutting unit and a holding table of a processing device of the processing system shown in FIG. [Figure 4] FIG. 4 is a perspective view of a main part of the cutting unit shown in FIG. [Diagram 5] FIG. 5 is a perspective view showing a configuration example of an inspection device of the processing system shown in FIG. [Figure 6] FIG. 6 is a perspective view showing an inspection table and the like of the inspection apparatus shown in FIG. [Figure 7] FIG. 7 is a perspective view showing an imaging unit of the inspection apparatus shown in FIG. [Figure 8] FIG. 8 is a diagram showing measurement data stored in the measurement data storage unit of the control unit of the machining system shown in FIG. [Figure 9] FIG. 9 is a diagram showing the inspection data stored in the inspection data storage unit of the control unit of the machining system shown in FIG. [Figure 10] FIG. 10 is a diagram showing the relationship between the measurement data and the inspection data and the colors stored in the color setting storage unit of the control unit of the machining system shown in FIG. [Figure 11] FIG. 11 is a diagram showing an example of an image generated by the image generating unit shown in FIG. [Figure 12] FIG. 12 is a diagram showing a state in which the images shown in FIG. 11 are displayed in an overlapping manner. [Figure 13] FIG. 13 is a diagram showing another example of an image generated by the image generating unit shown in FIG. [Figure 14] FIG. 14 is a diagram showing a state in which the images shown in FIG. 13 are displayed in an overlapping manner. [Figure 15] FIG. 15 is a perspective view showing a configuration example of a processing device of a processing system according to the second embodiment. [Figure 16] FIG. 16 is a perspective view showing a configuration example of a processing system according to a modification of the first and second embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0014] [Embodiment 1] A processing system according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing system according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece to be processed and inspected by the processing system shown in FIG. 1. FIG. 3 is a side view showing a schematic partial cross section of the configuration of a cutting unit and a holding table of a processing device of the processing system shown in FIG. 1. FIG. 4 is a perspective view of a main part of the cutting unit shown in FIG. 3. FIG. 5 is a perspective view showing a configuration example of an inspection device of the processing system shown in FIG. 1. FIG. 6 is a perspective view showing an inspection table and the like of the inspection device shown in FIG. 5. FIG. 7 is a perspective view showing an imaging unit of the inspection device shown in FIG. 5.

[0015] (workpiece) The processing system 1 shown in Fig. 1 according to the first embodiment is a system that cuts (corresponding to processing) a workpiece 200 shown in Fig. 2 and inspects the workpiece 200 after cutting. The workpiece 200 to be processed and inspected by the processing system 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with a substrate 201 made of silicon, sapphire, gallium, or the like. As shown in Fig. 2, the workpiece 200 has a plurality of mutually intersecting division lines 203 set on a surface 202, and a device 204 is formed in an area partitioned by the division lines 203. The device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), a charge coupled device (CCD), or an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor).

[0016] In the first embodiment, the workpiece 200 has a functional layer 205 on a substrate 201, as shown in Fig. 1. The functional layer 205 includes a low dielectric constant insulator coating (hereinafter referred to as a low-k film) made of an inorganic film such as SiOF or BSG (SiOB), an organic film such as a polymer film of a polyimide or parylene, or carbon-containing silicon oxide (SiOCH), and a circuit layer made of a conductive metal.

[0017] The low-k film is laminated with a circuit layer to form a device 204. The circuit layer constitutes the circuit of the device 204. For this purpose, the device 204 is formed by the mutually laminated low-k films of the functional layer 205 laminated on the substrate 201 and the circuit layer laminated between the low-k films. The functional layer 205 of the planned division line 203 is formed of a low-k film and does not include a conductive film except for a TEG (Test Element Group). The TEG is an evaluation element for finding design and manufacturing problems that occur in the device 204.

[0018] In the first embodiment, as shown in Fig. 1, the workpiece 200 is supported in an opening of the annular frame 210 by adhering an adhesive tape 209, which is a disk-like shape having a diameter larger than the outer diameter of the workpiece 200 and has an annular frame 210 attached to its outer edge, to a back surface 206 behind the front surface 202. The workpiece 200 is divided into individual chips 208 by forming cutting grooves 207 (shown by dotted lines in Fig. 2) that are processing marks reaching the adhesive tape 209 along the intended division lines 203. The chips 208 include a portion of the substrate 201 and devices 204 formed on the substrate 201.

[0019] (Processing System) The processing system 1 shown in Fig. 1 is an apparatus that divides a workpiece 200 into individual chips 208 and inspects the divided chips 208. As shown in Fig. 1, the processing system 1 includes a processing apparatus 2, a control unit 100, and an inspection apparatus 300. The processing system 1 of the present invention does not necessarily include both the processing apparatus 2 and the inspection apparatus 300. The processing system 1 of the present invention may be configured with only the processing apparatus 2, with the inspection apparatus 300 removed from Fig. 1, or may be configured with only the inspection apparatus 300 installed independently of the processing apparatus, with the processing apparatus 2 removed from Fig. 1.

[0020] (Processing equipment) In the first embodiment, the processing device 2 is a cutting device that holds the workpiece 200 on a holding table 10 and cuts the workpiece 200 along a planned division line 203 with a cutting blade 21 to divide the workpiece 200 into individual chips 208. As shown in Fig. 1, the processing device 2 includes a holding table 10 that suction-holds the workpiece 200 on a holding surface 11, a cutting unit 20 that is a processing unit that cuts the workpiece 200 held on the holding table 10, and an imaging unit that captures an image of the workpiece 200 held on the holding table 10. As shown in Fig. 1, the processing device 2 is a so-called facing dual type cutting device that includes two cutting units 20, i.e., a two-spindle dicer.

[0021] 3, the processing device 2 includes a moving unit 40 that moves the holding table 10 and the cutting unit 20 relatively. The moving unit 40 includes at least a processing feed unit 41 that processes and feeds the holding table 10 in the X direction parallel to the horizontal direction, an indexing feed unit 42 that indexes and feeds the cutting unit 20 in the Y direction parallel to the horizontal direction and perpendicular to the X direction, a cutting feed unit 43 that cuts and feeds the cutting unit 20 in the Z direction parallel to the vertical direction perpendicular to both the X direction and the Y direction, and a rotational moving unit 44 that rotates the holding table 10 around an axis parallel to the Z direction. That is, the moving unit 40 moves the holding table 10 and the cutting unit 20 relatively in the X direction, the Y direction, the Z direction, and around the axis.

[0022] The processing feed unit 41 moves the holding table 10 and the rotational movement unit 44 in the X-direction, which is the processing feed direction, to move the cutting unit 20 and the holding table 10 relatively along the X-direction. The indexing feed unit 42 moves the cutting unit 20 in the Y-direction, which is the indexing feed direction, to move the cutting unit 20 and the holding table 10 relatively along the Y-direction. The cutting feed unit 43 moves the cutting unit 20 in the Z-direction, which is the cutting feed direction, to move the cutting unit 20 and the holding table 10 relatively along the Z-direction. The rotational movement unit 44 is supported by the processing feed unit 41, supports the holding table 10, and is disposed so as to be freely movable in the X-direction together with the holding table 10.

[0023] 3, the processing feed unit 41, the indexing feed unit 42 and the cutting feed unit 43 are provided with a well-known ball screw rotatably provided around an axis, well-known motors 41-1, 42-1, 43-1 for rotating the ball screw around the axis, and well-known guide rails for supporting the holding table 10 or the cutting unit 20 movably in the X, Y or Z directions. The rotation transfer unit 44 is provided with a motor 44-1 for rotating the holding table 10 around the axis.

[0024] These motors 41-1, 42-1, 43-1, and 44-1 have built-in torque measurement mechanisms that measure torque, which is a measurement item of these motors 41-1, 42-1, 43-1, and 44-1. The torque measurement mechanisms of the motors 41-1, 42-1, 43-1, and 44-1 acquire measured torque values ​​and output the acquired torque measurements to the control unit 100. The motor 42-1 of the indexing feed unit 42 and the motor 43-1 of the cutting feed unit 43 are motors mounted on the cutting unit 20, i.e., the motors of the indexing feed unit 42 and the cutting feed unit 43 mounted with the cutting unit 20.

[0025] The holding table 10 is disk-shaped, and the holding surface 11 for holding the workpiece 200 is made of porous ceramics or the like. The holding table 10 is provided so as to be movable in the X direction by the processing feed unit 41 between the processing area below the cutting unit 20 and the carry-in / out area separated from the lower part of the cutting unit 20 and where the workpiece 200 is carried in and out. The holding table 10 is provided so as to be rotatable about an axis parallel to the Z direction by the rotation movement unit 44. The holding table 10 is connected to the suction source 13 shown in FIG. 3, and sucks and holds the workpiece 200 placed on the holding surface 11 by being sucked by the suction source 13. In the first embodiment, the holding table 10 sucks and holds the back surface 206 side of the workpiece 200 via the adhesive tape 209. In addition, a plurality of clamping parts 12 for clamping the annular frame 210 are provided around the holding table 10 as shown in FIG. 1.

[0026] The cutting unit 20 is a processing unit in which the cutting blade 21 is attached to the spindle 23 and cuts the workpiece 200 held on the holding table 10. The cutting unit 20 is provided so as to be movable in the Y direction by the indexing feed unit 42 and movable in the Z direction by the incision feed unit 43 with respect to the workpiece 200 held on the holding table 10. The cutting unit 20 is provided on a support frame (not shown) erected from the device main body 3 via the indexing feed unit 42 and the incision feed unit 43. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the indexing feed unit 42 and the incision feed unit 43.

[0027] As shown in Figure 3, the cutting unit 20 comprises a cutting blade 21, a spindle housing 22 that is freely movable in the Y and Z directions by an indexing feed unit 42 and a cutting feed unit 43, a spindle 23 that is rotatably mounted on the spindle housing 22 about its axis and has the cutting blade 21 attached to its tip, a spindle motor 24 that rotates the spindle 23 about its axis, a blade cover 25 shown in Figure 4 that is attached to the tip surface of the spindle 23, and a nozzle 26 shown in Figure 4 that supplies cutting water, which is a fluid, to the cutting blade 21.

[0028] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 21 is fixed to the tip of the spindle 23. In the first embodiment, the cutting blade 21 is a so-called hub blade having an annular circular base 211 and an annular cutting blade 212 disposed on the outer periphery of the circular base 211 to cut the workpiece 200, as shown in FIG. 3. The cutting blade 212 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bond material such as metal or resin, and is formed to a predetermined thickness. The cutting blade 212 of the cutting blade 21 is worn when cutting the workpiece 200. In the present invention, the cutting blade 21 may be a so-called washer blade composed of only the cutting blade 212.

[0029] The cutting blade 21 is fixed to the tip of the spindle 23, and the spindle 23 is rotated around its axis by the spindle motor 24 to rotate the cutting blade 21. The spindle motor 24 is provided with a rotor 241 that is provided on the spindle 23 and rotates integrally with the spindle 23, and a stator 242 that is disposed on the outer periphery of the rotor 241 and in the spindle housing 22 and rotates the rotor 241 when power is supplied from a power source 243. In the spindle motor 24, the stator 242 rotates the rotor 241, causing the spindle 23 to rotate around its axis.

[0030] The blade cover 25 covers at least the upper part of the cutting blade 21. The blade cover 25 is fixed to the tip surface of the spindle housing 22. The nozzle 26 includes a shower nozzle 261 and a pair of blade nozzles 262. The nozzles 261 and 262 are attached to the blade cover 25, and cutting water is supplied from the fluid supply source 27. The shower nozzle 261 faces the cutting edge of the cutting blade 212 of the cutting blade 21 in the X direction, and supplies cutting water to the cutting edge of the cutting blade 212 of the cutting blade 21 during cutting. The blade nozzles 36 extend parallel to the X direction and are spaced apart from each other in the Y direction. The blade nozzles 262 position the lower end of the cutting blade 212 of the cutting blade 21 between each other, and supply cutting water to the lower end of the cutting blade 212 of the cutting blade 21 during cutting. The nozzle 26 supplies cutting water from the shower nozzle 261 and the blade nozzle 262, so that the cutting water is supplied via the cutting blade 21 to the processing point where the cutting blade 21 cuts the workpiece 200.

[0031] The axes of the cutting blade 21 and the spindle 23 of the cutting unit 20 are set parallel to the Y direction.

[0032] The imaging unit is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The imaging unit includes an imaging element that images an area to be divided of the workpiece 200 held on the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit images the workpiece 200 held on the holding table 10 to obtain an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0033] The processing device 2 also includes an X-direction position detection unit (not shown) for detecting the position of the holding table 10 in the X direction, a Y-direction position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y direction, and a Z-direction position detection unit for detecting the position of the cutting unit 20 in the Z direction. The X-direction position detection unit and the Y-direction position detection unit can be configured with a linear scale parallel to the X direction or the Y direction, and a reading head. The Z-direction position detection unit detects the position of the cutting unit 20 in the Z direction by a motor pulse. The X-direction position detection unit, the Y-direction position detection unit, and the Z-direction position detection unit output the X-direction position of the holding table 10 and the Y-direction or Z-direction position of the lower end of the cutting blade 212 of the cutting unit 20 to the control unit 100.

[0034] In the first embodiment, the positions in the X direction, the Y direction, and the Z direction of the holding table 10 and the cutting unit 20 of the processing device 2 are determined based on a predetermined reference position (not shown). In the first embodiment, the positions in the X direction, the Y direction, and the Z direction are determined by the distances in the X direction, the Y direction, and the Z direction from a reference position. In the first embodiment, the XY coordinates represented by the X direction and the Y direction of the processing device 2 (coordinates indicated by the distance in the X direction from a reference position indicating the position in the X direction and the distance in the Y direction from a reference position indicating the position in the Y direction) may indicate an arbitrary position of the workpiece 200 held on the holding surface 11 of the holding table 10.

[0035] The processing device 2 also includes a cassette elevator 81 on which a cassette 80 containing multiple workpieces 200 before and after cutting is placed and which moves the cassette 80 in the Z direction, a cleaning unit 82 which cleans the workpiece 200 after cutting, and a transport unit 83 which moves the workpiece 200 in and out of the cassette 80 and transports the workpiece 200 between the cassette 80, the holding table 10, the cleaning unit 82, and the inspection table 310 of the inspection device 300.

[0036] The control unit 100 also controls each component of the machining system 1, causing the machining system 1 to perform a machining operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the machining system 1 to each component of the machining system 1 via the input / output interface device.

[0037] The control unit 100 is connected to a display unit 110 configured with a liquid crystal display device or the like that displays the status and images of the machining operation, an input unit 120 that is used when the operator registers machining content information, and a notification unit 130 that notifies the operator. The input unit 120 is configured with a touch panel provided on the display unit 110. The notification unit 130 emits at least one of sound and light to notify the operator.

[0038] The processing device 2 of the processing system 1 also includes a measurement unit 50 for acquiring measurement values ​​of a plurality of measurement items related to cutting processing. The measurement unit 50 includes a film thickness measurement means 51 shown in Fig. 1, a vibration measurement sensor 52 shown in Fig. 3, a suction measurement means 53, a load measurement sensor 54, a rotation speed measurement sensor 55, a torque measurement mechanism for the motor 44-1 of the rotation movement unit 44 described above, a fluid measurement means 56 shown in Fig. 4, a current value measurement sensor 57 for measuring the current value of the power supplied to the stator 242 of the spindle motor 24, a voltage value measurement sensor 58 for measuring the voltage value of the power supplied to the stator 242 of the spindle motor 24, a processing feed speed measurement sensor 59, and The feed speed measuring sensor 60 includes an indexing feed speed measuring sensor 60, an incision feed speed measuring sensor 61, a torque measuring mechanism for the motor 42-1 of the indexing feed unit 42, a torque measuring mechanism for the motor 43-1 of the incision feed unit 43, a feed current value measuring sensor 62 for measuring the current value of the power supplied to the motor 41-1 of the processing feed unit 41, a feed voltage value measuring sensor 63 for measuring the voltage value of the power supplied to the motor 41-1 of the processing feed unit 41, and the torque measuring mechanism for the motor 41-1 of the processing feed unit 41 described above.

[0039] The film thickness measuring means 51 measures the thickness of the functional layer 205 of the workpiece 200 held on the holding table 10. The film thickness measuring means 51 acquires a measurement value of the thickness of the functional layer 205, and outputs the acquired measurement value of the thickness of the functional layer 205 to the control unit 100.

[0040] In the first embodiment, the vibration measuring sensor 52 is an AE (Acoustic Emission) sensor that is attached to the holding table 10 and measures the vibration of the holding table 10. The vibration measuring sensor 52 acquires a measurement value of the vibration of the holding table 10 and outputs the acquired measurement value of the vibration of the holding table 10 to the control unit 100. Note that, although the vibration measuring sensor 52 is an AE sensor in the second embodiment, in the present invention, it may be, for example, an acceleration sensor.

[0041] The suction measurement means 53 measures the pressure, temperature, and flow rate of the gas (corresponding to the fluid supplied to the holding table 10) sucked into the holding surface 11 by the suction source 13. In the first embodiment, the suction measurement means 53 includes a pressure sensor that measures the pressure of the gas sucked into the holding surface 11 by the suction source 13, a temperature sensor that measures the temperature of the gas, and a flow rate sensor that measures the flow rate of the gas.

[0042] The suction measurement means 53 acquires measurement values ​​of the pressure, temperature and flow rate of the gas sucked into the holding surface 11 by the suction source 13, and outputs the acquired measurement values ​​of the pressure, temperature and flow rate of the gas sucked into the holding surface 11 by the suction source 13 to the control unit 100. Note that in the present invention, the suction measurement means 53 is provided with at least one of a pressure sensor, a temperature sensor and a flow rate sensor, and only needs to acquire at least one measurement value of the pressure, temperature and flow rate of the gas sucked into the holding surface 11, which is the fluid supplied to the holding table 10, by the suction source 13.

[0043] The load measuring sensor 54 is attached to the holding table 10 and measures the load applied to the holding table 10. The load measuring sensor 54 acquires a measurement value of the load applied to the holding table 10, and outputs the acquired measurement value of the load applied to the holding table 10 to the control unit 100.

[0044] The rotation speed measuring sensor 55 measures the rotation speed around the axis of the holding table 10, which is the moving speed of the holding table 10. The rotation speed measuring sensor 55 obtains a measurement value of the rotation speed around the axis of the holding table 10, and outputs the obtained measurement value of the rotation speed around the axis of the holding table 10 to the control unit 100.

[0045] The fluid measuring means 56 measures the pressure, temperature and flow rate of the cutting water, which is a fluid supplied to the cutting unit 20. In the first embodiment, the fluid measuring means 56 includes a pressure sensor that measures the pressure of the cutting water supplied to the cutting unit 20, a temperature sensor that measures the temperature of the cutting water, and a flow rate sensor that measures the flow rate of the cutting water.

[0046] The fluid measuring means 56 acquires measured values ​​of the pressure, temperature and flow rate of the cutting water, and outputs the acquired measured values ​​of the pressure, temperature and flow rate of the cutting water to the control unit 100. In the present invention, the fluid measuring means 56 is provided with at least one of a pressure sensor, a temperature sensor and a flow rate sensor that measures the flow rate of the cutting water, and only needs to acquire measured values ​​of at least one of the pressure, temperature and flow rate of the cutting water.

[0047] The current value measuring sensor 57 measures the current value of the power supplied to the stator 242 of the spindle motor 24. The current value is the value of the current flowing through the stator 242 of the spindle motor 24, and tends to increase over time when the cutting resistance increases when cutting the workpiece 200 due to an increase in the processing load caused by blunting of the cutting blade 212 during cutting. The current value measuring sensor 57 obtains a measured value of the current value of the power supplied to the stator 242 of the spindle motor 24, and outputs the obtained measured value of the current value to the control unit 100.

[0048] The voltage value measuring sensor 58 measures the voltage value of the power supplied to the stator 242 of the spindle motor 24. The voltage value measuring sensor 58 obtains a measured value of the voltage value of the power supplied to the stator 242 of the spindle motor 24, and outputs the obtained measured voltage value to the control unit 100. In the present invention, it is sufficient that the measuring unit 50 includes at least one of the current value measuring sensor 57 and the voltage value measuring sensor 58.

[0049] The processing feed speed measuring sensor 59 measures the moving speed in the X direction of the holding table 10. The processing feed speed measuring sensor 59 acquires a measured value of the moving speed in the X direction of the holding table 10, and outputs the acquired measured value of the moving speed in the X direction of the holding table 10 to the control unit 100.

[0050] The indexing feed speed measuring sensor 60 measures the moving speed in the Y direction of the cutting unit 20. The indexing feed speed measuring sensor 60 acquires a measured value of the moving speed in the Y direction of the cutting unit 20, and outputs the acquired measured value of the moving speed in the Y direction of the cutting unit 20 to the control unit 100.

[0051] The cutting feed speed measuring sensor 61 measures the moving speed in the Z direction of the cutting unit 20. The cutting feed speed measuring sensor 61 acquires a measured value of the moving speed in the Z direction of the cutting unit 20, and outputs the acquired measured value of the moving speed in the Z direction of the cutting unit 20 to the control unit 100.

[0052] The feed current value measuring sensor 62 measures the current value of the power supplied to the motor 41-1 of the processing feed unit 41. The feed current value measuring sensor 62 acquires a measured value of the current value of the power supplied to the motor 41-1 of the processing feed unit 41, and outputs the acquired measured value of the current value to the control unit 100.

[0053] The feed voltage value measuring sensor 63 measures the voltage value of the power supplied to the motor 41-1 of the processing feed unit 41. The feed voltage value measuring sensor 63 acquires a measured value of the voltage value of the power supplied to the motor 41-1 of the processing feed unit 41, and outputs the acquired measured value of the voltage value to the control unit 100. In the present invention, it is sufficient that the measuring unit 50 includes at least one of the feed current value measuring sensor 62 and the feed voltage value measuring sensor 63.

[0054] In the first embodiment, the thickness of the functional layer 205, the vibration of the holding table 10, the pressure, temperature and flow rate of the gas sucked by the suction source 13 to the holding surface 11, the load on the holding table 10, the rotation speed of the holding table 10 around the axis, the pressure, temperature and flow rate of the cutting water, the current value of the power supplied to the stator 242 of the spindle motor 24, the voltage value of the power supplied to the stator 242 of the spindle motor 24, the moving speed of the holding table 10 in the X direction, the moving speed of the cutting unit 20 in the Y direction, the moving speed of the cutting unit 20 in the Z direction, the current value of the power supplied to the motor 41-1 of the processing feed unit 41, the voltage value of the power supplied to the motor 41-1 of the processing feed unit 41, and the torque of the motors 41-1, 42-1, 43-1, and 44-1 are measurement items described in the claims. In the present invention, the measurement items may be at least one of the above-mentioned items.

[0055] (Inspection equipment) The inspection apparatus 300 shown in FIG. 5 is an inspection apparatus in which the workpiece 200 after cutting is carried onto an inspection table 310 and the workpiece 200 after cutting is inspected. In the first embodiment, the inspection device 300 inspects the workpiece 200 after cutting by measuring the widthwise position of the division line 203 at the center of the cut groove 207 formed in the workpiece 200, the width of the cut groove 207, the size of the chipping formed on the edge of the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208, the size of the foreign matter attached to each of the front surface 202 and back surface 206 of the chip 208, the length of the crack extending from the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208 toward the chip 208, and the area, length, and width of the functional layer 205 peeled off from the substrate 201 starting from the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208 (hereinafter, referred to as the peeled film area). Note that chipping is formed when a part of the chip 208 is chipped off from the outer edge of the front surface 202 or back surface 206 during cutting.

[0056] As shown in FIG. 5, the inspection device 300 is provided with an inspection table 310 which is installed in a unit body 301 and includes a transparent holding surface 311 for holding the workpiece 200 after cutting, a moving unit 320, and an imaging unit 330.

[0057] The moving unit 320 moves the inspection table 310 and the imaging unit 330 relatively, and includes a holding table moving unit 321 and an imaging unit moving unit 322, as shown in FIGS.

[0058] The holding table moving unit 321 moves the inspection table 310 in the X direction, thereby relatively moving the inspection table 310 and the imaging unit 330 in the X direction. The holding table moving unit 321 moves the inspection table 310 in the X direction across a carry-in / out area where the workpiece 200 is carried in and out of the inspection table 310 by the transport unit 83, and an inspection area where the chips 208 of the workpiece 200 held on the inspection table 310 are inspected.

[0059] The imaging unit moving unit 322 moves the imaging unit 330 in the Y direction, thereby moving the inspection table 310 and the imaging unit 330 relatively in the Y direction.

[0060] The holding table moving unit 321 and the imaging unit moving unit 322 are equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the imaging unit 330 so that it can move freely in the X or Y direction.

[0061] In the first embodiment, the holding table moving unit 321 is disposed on the upper surface of the unit body 301 with the ball screw and the guide rail positioned between them in the Y direction with the opening 302 on the upper surface of the unit body 301. Also, in the first embodiment, the holding table moving unit 321 includes a first support member 323 that moves in the X direction by a ball screw that rotates about an axis and supports one end of the inspection table 310 in the Y direction, and a second support member 324 that is provided movably in the X direction by a guide rail and supports the other end of the inspection table 310 in the Y direction.

[0062] In the first embodiment, the imaging unit moving unit 322 has a ball screw and a guide rail disposed on a gate-shaped support frame 303 on the upper surface of the unit body 301. The support frame 303 is disposed on the upper surface of the unit body 301, straddling the opening 302 and the ball screw and guide rail of the holding table moving unit 321. The imaging unit moving unit 322 also includes a support member 325 which moves in the Y direction by a ball screw rotating about an axis and is provided so as to be freely movable in the Y direction by the guide rail, and which supports the imaging unit 330.

[0063] The inspection table 310 holds the workpiece 200 on a holding surface 311. The inspection table 310 includes a disk-shaped holding portion 312 and an annular frame 313.

[0064] Holding portion 312 is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, magnesium fluoride, or the like, and its upper surface is holding surface 311 that holds workpiece 200. Holding portion 312 has holding surface 311 formed flat along the horizontal direction. In holding portion 312, back surface 206 of workpiece 200 is placed on holding surface 311 via adhesive tape 209. Holding surface 311 holds workpiece 200 via adhesive tape 209 attached to workpiece 200. Holding portion 312 is formed in a disk shape with a constant thickness.

[0065] Frame 313 is made of metal. Frame 313 is formed so that its inner diameter is equal to the outer diameter of holding portion 312, and is attached to the outer edge of holding portion 312. Frame 313 is supported at both ends by first supporting member 323 and second supporting member 324.

[0066] The imaging unit 330 captures images of the front surface 202 and the back surface 206 of the chip 208 of the workpiece 200 held on the inspection table 310. As shown in Fig. 7, the imaging unit 330 includes a unit body 331 formed in a column shape whose longitudinal direction is parallel to the Z direction, attached to a support member 325, and provided so as to be movable in the Y direction by an imaging unit moving unit 322, a first imaging camera 332 provided at the upper end of the unit body 331, and a second imaging camera 333 provided at the lower end of the unit body 331. The first imaging camera 332 and the second imaging camera 333 are provided at the upper and lower ends of the unit body 331 so as to be movable in the Z direction by an elevation unit 334, respectively.

[0067] The lifting unit 334 includes a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the first imaging camera 332 or the second imaging camera 333 so that it can move freely in the Z direction.

[0068] The first imaging camera 332 is provided with a plurality of imaging elements disposed above the holder 312 of the inspection table 310 and capturing an image of the chip 208 of the workpiece 200 held by the holder 312 from above. The imaging elements are, for example, a charge-coupled device (CCD) imaging element or a complementary metal-oxide semiconductor (CMOS) imaging element. The first imaging camera 332 captures an image of the chip 208 of the workpiece 200 held by the holder 312 of the inspection table 310, and outputs the obtained image to the control unit 100. In the first embodiment, the first imaging camera 332 captures an image of the front surface 202 side of the workpiece 200.

[0069] The second imaging camera 333 is provided with a plurality of imaging elements that are disposed below the holding portion 312 of the inspection table 310 and capture images of the chips 208 of the workpiece 200 held by the holding portion 312 through the holding portion 312. The imaging elements are, for example, a charge-coupled device (CCD) imaging element or a complementary metal-oxide semiconductor (CMOS) imaging element. The second imaging camera 333 captures images of the chips 208 of the workpiece 200 held by the holding portion 312 of the inspection table 310 from below the workpiece 200 through the holding portion 312, and outputs the obtained images to the control unit 100. In the first embodiment, the second imaging camera 333 captures images of the back surface 206 side of the workpiece 200 through the holding portion 312. In the first embodiment, the first imaging camera 332 and the second imaging camera 333 capture images of the front surface 202 and the back surface 206 side of the chips 208 at the same position of the workpiece 200.

[0070] The inspection apparatus 300 also includes an inspection X-direction position detection unit (not shown) for detecting the position of the inspection table 310 in the X direction, and an inspection Y-direction position detection unit (not shown) for detecting the position of the inspection table 310 in the Y direction. The inspection X-direction position detection unit and the inspection Y-direction position detection unit can be configured with a linear scale parallel to the X direction or the Y direction, and a read head. The inspection X-direction position detection unit and the inspection Y-direction position detection unit output the position of the inspection table 310 in the X direction or the Y direction to the control unit 100.

[0071] In the first embodiment, the X-direction position and the Y-direction position of the inspection table 310 of the inspection device 300 are determined based on a predetermined reference position (not shown). In the first embodiment, the X-direction position and the Y-direction position are determined by the distance in the X direction and the Y direction from the reference position. In the first embodiment, the XY coordinates (coordinates indicated by the distance in the X direction from a reference position indicating the position in the X direction and the distance in the Y direction from a reference position indicating the position in the Y direction, hereinafter referred to as the inspection XY coordinates) represented by the X direction and the Y direction of the inspection device 300 may indicate an arbitrary position of the workpiece 200 held on the holding surface 11 of the inspection table 310. The XY coordinates of the processing device and the inspection XY coordinates of the inspection device 300 are corresponding coordinates. In the first embodiment, the X-direction position of the XY coordinates of the processing device 2 and the Y-direction position of the inspection XY coordinates of the inspection device 300 indicate the same position of the workpiece 200 held on the holding table 10 or the inspection table 310, and the Y-direction position of the XY coordinates of the processing device 2 and the X-direction position of the inspection XY coordinates of the inspection device 300 indicate the same position of the workpiece 200 held on the holding table 10 or the inspection table 310.

[0072] The inspection device 300 also includes an inspection section 350 (shown in FIG. 1 ) which is an inspection unit that acquires inspection values ​​of inspection items from images captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330. In the first embodiment, the control unit 100 includes the inspection section 350.

[0073] The inspection section 350 obtains, from images captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330, an inspection value for the widthwise position of the planned division line 203 at the center of the cut groove 207 formed in the workpiece 200, an inspection value for the width of the cut groove 207, an inspection value for the size of chipping formed adjacent to the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208 and on the inner edge of the cut groove 207, an inspection value for the size of foreign matter attached to each of the front surface 202 and back surface 206 of the chip 208, an inspection value for the length of cracks formed on the inner edge of the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208, and an inspection value for the area of ​​film peeling, and outputs these inspection values ​​to the control unit 100.

[0074] In the first embodiment, the inspection items described in the claims are the widthwise position of the planned division line 203 at the center of the cut groove 207 formed in the workpiece 200, the width of the cut groove 207, the size of chipping formed at the edge of the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208, the size of foreign matter attached to each of the front surface 202 and back surface 206 of the chip 208, the length of cracks extending from the cut groove 207 on each of the front surface 202 and back surface 206 of the chip 208 toward the inside of the chip 208, and the area, length, and width of the peeled film. In the present invention, the inspection items may be at least one of the above-mentioned items.

[0075] As shown in FIG. 1, the control unit 100 includes a measurement data storage unit 101, an inspection data storage unit 102, a color setting storage unit 103, and an image generation unit 104. FIG. 8 is a diagram showing measurement data stored in the measurement data storage unit of the control unit of the processing system shown in FIG. 1. FIG. 9 is a diagram showing inspection data stored in the inspection data storage unit of the control unit of the processing system shown in FIG. 1. FIG. 10 is a diagram showing the relationship between the measurement data and the inspection data and colors stored in the color setting storage unit of the control unit of the processing system shown in FIG. 1. FIG. 11 is a diagram showing an example of an image generated by the image generation unit shown in FIG. 1. FIG. 12 is a diagram showing a state in which the images shown in FIG. 11 are displayed in an overlapping manner. FIG. 13 is a diagram showing another example of an image generated by the image generation unit shown in FIG. 1. FIG. 14 is a diagram showing a state in which the images shown in FIG. 13 are displayed in an overlapping manner.

[0076] The measurement data storage unit 101 links each measurement value measured by the measuring unit 50 before or during cutting of the workpiece 200 by the processing device 2 with the XY coordinates at which the measuring unit 50 acquired each measurement value, and stores the data as measurement data 400 (shown in FIG. 8). In the first embodiment, the measurement data storage unit 101 stores the measurement data 400 that links the workpiece 200, each measurement value acquired by the measuring unit 50 before or during cutting of the workpiece 200, and the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the measuring unit 50 acquired each measurement value.

[0077] In embodiment 1, before cutting the workpiece 200, the moving unit 40 moves the film thickness measuring means 51 and the holding table 10 relatively so that the film thickness measuring means 51 can measure the thickness of the functional layer 205 of the entire workpiece 200 at predetermined intervals, and stores film thickness measurement data 401 as measurement data 400 shown in Figure 8, which links the measurement value of the thickness of the functional layer 205 acquired by the film thickness measuring means 51 to the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the film thickness measuring means 51 acquired the measurement value of the thickness of the functional layer 205.

[0078] In addition, the measurement data storage unit 101 stores vibration measurement data 402 as measurement data 400 shown in FIG. 8, which links the vibration measurement value of the holding table 10 acquired by the vibration measuring sensor 52 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the vibration measuring sensor 52 acquired the vibration measurement value.

[0079] The measurement data storage unit 101 stores holding surface pressure measurement data 403, holding surface temperature measurement data 404, and holding surface flow rate measurement data 405 as measurement data 400 shown in FIG. 8, which links the measurement values ​​of the pressure, temperature, and flow rate of the gas sucked into the holding surface 11 by the suction source 13 acquired by the suction measurement means 53 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time the suction measurement means 53 acquired the measurement values.

[0080] The measurement data storage unit 101 stores load measurement data 406 as measurement data 400 shown in FIG. 8, which links the measurement value of the load applied to the holding table 10 acquired by the load measurement sensor 54 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the load measurement sensor 54 acquired the load measurement value.

[0081] The measurement data storage unit 101 stores rotational speed measurement data 407 as measurement data 400 shown in FIG. 8 , which links the measurement value of the rotational speed of the holding table 10 acquired by the rotational speed measurement sensor 55 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the rotational speed measurement sensor 55 acquired the measurement value of the rotational speed of the holding table 10.

[0082] The measurement data memory unit 101 stores cutting water pressure measurement data 408, cutting water temperature measurement data 409, and cutting water flow rate measurement data 410 as measurement data 400 shown in Figure 8, which links the measurement values ​​of the cutting water pressure, temperature, and flow rate acquired by the fluid measurement means 56 during cutting processing of the workpiece 200 to the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time the fluid measurement means 56 acquired the measurement values.

[0083] The measurement data storage unit 101 stores spindle current value measurement data 411 as measurement data 400 shown in FIG. 8 , which links the measurement value of the current value of the power supplied to the stator 242 acquired by the current value measurement sensor 57 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the current value measurement sensor 57 acquired the measurement value.

[0084] The measurement data storage unit 101 stores spindle voltage value measurement data 412 as measurement data 400 shown in FIG. 8 , which links the measurement value of the voltage value of the power supplied to the stator 242 acquired by the voltage value measurement sensor 58 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the voltage value measurement sensor 58 acquired the measurement value.

[0085] The measurement data storage unit 101 stores processing feed speed measurement data 413 as measurement data 400 shown in FIG. 8 , which links the measurement value of the X-direction moving speed of the holding table 10 acquired by the processing feed speed measuring sensor 59 during cutting processing of the workpiece 200 with the X-direction position detection unit and the Y-direction position detection unit at the time when the processing feed speed measuring sensor 59 acquired the measurement value.

[0086] The measurement data storage unit 101 stores index feed speed measurement data 414 as measurement data 400 shown in FIG. 8 , which links the measurement value of the Y-direction moving speed of the cutting unit 20 acquired by the index feed speed measurement sensor 60 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the index feed speed measurement sensor 60 acquired the measurement value.

[0087] The measurement data storage unit 101 stores infeed speed measurement data 415 as measurement data 400 shown in FIG. 8, which links the measurement value of the Z-direction movement speed of the cutting unit 20 acquired by the infeed speed measurement sensor 61 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the infeed speed measurement sensor 61 acquired the measurement value.

[0088] The measurement data storage unit 101 stores feed current measurement data 416 as measurement data 400 shown in FIG. 8 , which links the measurement value of the current value of the power supplied to the motor 41-1 of the machining feed unit 41 acquired by the feed current measurement sensor 62 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the feed current measurement sensor 62 acquired the measurement value.

[0089] The measurement data storage unit 101 stores feed voltage value measurement data 417 as measurement data 400 shown in FIG. 8 , which links the measurement value of the voltage value of the power supplied to the motor 41-1 of the machining feed unit 41 acquired by the feed voltage value measurement sensor 63 during cutting processing of the workpiece 200 with the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the feed voltage value measurement sensor 63 acquired the measurement value.

[0090] The measurement data storage unit 101 stores torque measurement data 417, 418, 419, 420 as measurement data 400 shown in FIG. 8 which links the torque measurement values ​​of each motor 41-1, 42-1, 43-1, 44-1 acquired by the torque measurement mechanisms of each motor 41-1, 42-1, 43-1, 44-1 during cutting processing of the workpiece 200 to the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit at the time when the torque measurement mechanisms acquired the torque measurement values.

[0091] The inspection data storage unit 102 associates each inspection value acquired by the inspection unit 350 of the inspection device 300 after cutting the workpiece 200 of the processing device 2 with the XY coordinates corresponding to the inspection XY coordinates at which the inspection unit 350 acquired each inspection value, and stores the result as inspection data 500 (shown in FIG. 9). Note that the inspection XY coordinates and the XY coordinates corresponding to the inspection XY coordinates indicate the same position of the workpiece 200.

[0092] In the first embodiment, the moving unit 320 moves the imaging cameras 332, 333 of the imaging unit and the inspection table 310 relatively so that the imaging cameras 332, 333 can image the entire workpiece 200, and the inspection data storage unit 102 stores the cutting groove position inspection data 501 as the inspection data 500 shown in Fig. 9 in which the inspection values ​​of the positions of the cutting groove 207 at predetermined intervals acquired by the inspection unit 350 from the images of the front surface 202 and the back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 are linked to the XY coordinates of the same positions as the inspection XY coordinates of the inspection values ​​of the positions of the cutting groove 207. Note that the position of the cutting groove 207 is the center position in the width direction of the cutting groove 207.

[0093] Furthermore, in the first embodiment, the inspection data storage unit 102 stores cutting groove width inspection data 502 as inspection data 500 shown in FIG. 9 , which links inspection values ​​of the width of the cutting groove 207 at predetermined intervals acquired by the inspection unit 350 from images of the front surface 202 and back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330 with XY coordinates at the same positions as the inspection XY coordinates of the inspection values ​​of the width of the cutting groove 207.

[0094] In the first embodiment, the inspection data storage unit 102 stores chipping size inspection data 503 as inspection data 500 shown in FIG. 9, which links inspection values ​​of the size of chipping at predetermined intervals acquired by the inspection unit 350 from images of the front surface 202 and back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330, with XY coordinates at the same positions as the inspection XY coordinates of the inspection values ​​of the size of chipping.

[0095] In the first embodiment, the inspection data storage unit 102 stores foreign object size inspection data 504 as inspection data 500 shown in FIG. 9 , which links inspection values ​​of foreign object size at predetermined intervals acquired by the inspection unit 350 from images of the front surface 202 and back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330 with XY coordinates at the same positions as the inspection XY coordinates of the inspection values ​​of the foreign object size.

[0096] In embodiment 1, the inspection data storage unit 102 stores crack inspection data 505 as inspection data 500 shown in Figure 9, which links inspection values ​​of crack lengths at predetermined intervals acquired by the inspection unit 350 from images of the front surface 202 and back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330, and XY coordinates at the same positions as the inspection XY coordinates of the inspection values ​​of the crack lengths.

[0097] In the first embodiment, the inspection data storage unit 102 stores film peeling inspection data 506 as inspection data 500 shown in FIG. 9 , which links inspection values ​​of the film peeling area at predetermined intervals acquired by the inspection unit 350 from images of the front surface 202 and back surface 206 of the workpiece 200 captured by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330, with XY coordinates at the same positions as the inspection XY coordinates of the inspection values ​​of the film peeling area.

[0098] The color setting storage unit 103 stores a color 600 (shown in FIG. 10) having transparency set according to each of the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, and 420. The color setting storage unit 103 also stores a color 600 set according to each of the inspection data 501, 502, 503, 504, 505, and 506.

[0099] In the first embodiment, the color setting storage unit 103 stores a color 600 corresponding to each of the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, and 420 and each of the inspection data 501, 502, 503, 504, 505, and 506. The colors 600 corresponding to each of the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and each of the inspection data 501, 502, 503, 504, 505, 506 stored in the color setting storage unit 103 each have transparency and have different hues.

[0100] In addition, in the first embodiment, as shown in FIG. 10, the color setting memory unit 103 stores a first color 601 corresponding to the film thickness measurement data 401, stores a second color 602 corresponding to the cutting water temperature measurement data 409, stores a third color 603 corresponding to the spindle current value measurement data 411, and stores a fourth color 604 corresponding to the chipping size inspection data 503.

[0101] After cutting and inspection, the image generation unit 104 generates a wafer map 700 (shown in Figures 11, 12, 13 and 14) showing the shape of the workpiece 200 to be processed, and generates images 801, 802, 803, 804 (shown in Figures 11, 12, 13 and 14) in which a transparent color 600 corresponding to the measurement data 400 or inspection data 500 set in the color setting memory unit 103 is applied to the XY coordinates where the measurement values ​​of each measurement item of the wafer map 700 were obtained, and to the XY coordinates corresponding to the inspection XY coordinates where the inspection values ​​of each inspection item were obtained. The image generation unit 104 applies a transparent color 600 corresponding to the measurement data 400 or the inspection data 500 set in the color setting memory unit 103 to the positions indicated by the XY coordinates where the measurement values ​​of each measurement item on the wafer map 700 were obtained, and to the positions indicated by the XY coordinates equivalent to the inspection XY coordinates where the inspection values ​​of each inspection item were obtained, thereby generating images 801, 802, 803, and 804.

[0102] In the first embodiment, the image generating unit 104 generates images 801, 802, 803, and 804 in which the colors 600 set in the color setting storage unit 103 according to at least two or more measurement items or inspection items are applied to the measurement positions or the positions indicated by the XY coordinates where the inspection values ​​were obtained on the wafer map 700. In the first embodiment, the image generating unit 104 displays the colors 600 set in the color setting storage unit 103 at the positions indicated by the XY coordinates where the measurement values ​​and the inspection values ​​exceeding the threshold value are obtained darker than the positions indicated by the XY coordinates where the measurement values ​​and the inspection values ​​below the threshold value determined in advance by the processing conditions, etc. are obtained in the generated images 801, 802, 803, and 804. In addition, in Figs. 11, 12, 13, and 14, the positions indicated by the XY coordinates where the measurement values ​​and the inspection values ​​below the threshold value of the images 801, 802, 803, and 804 were obtained are indicated by sparse parallel diagonal lines, and the positions of the XY coordinates where the measurement values ​​and the inspection values ​​above the threshold value are obtained are indicated by dense parallel diagonal lines.

[0103] The functions of the inspection unit 350 and image generation unit 104 described above are realized by the arithmetic processing unit of the control unit 100 executing a computer program stored in a storage device. The functions of the measurement data storage unit 101, the inspection data storage unit 102, and the color setting storage unit 103 are realized by the storage device of the control unit 100.

[0104] (Machining operation) Next, a processing operation of the processing system 1 according to the embodiment 1 will be described. In the processing system 1 having the above-mentioned configuration, the cassette 80 containing the workpiece 200 is placed in the cassette elevator 81. In the processing system 1, processing conditions are set in the control unit 100. When the control unit 100 receives an instruction to start the processing operation from an operator or the like, the processing system 1 starts the processing operation.

[0105] When the processing operation is started, the control unit 100 of the processing system 1 controls the conveying unit 83 to take out one workpiece 200 from the cassette 80 and place it on the holding surface 11 of the holding table 10 in the carry-in / out area via the adhesive tape 209. In the processing operation, the processing system 1 suction-holds the workpiece 200 on the holding surface 11 via the adhesive tape 209, and clamps the annular frame 210 with the clamp unit 12. Before cutting the workpiece 200, the control unit 100 controls the moving unit 40 to move the holding table 10 from the carry-in / out area toward the processing area, and the moving unit 40 moves the film thickness measuring means 51 and the holding table 10 relatively so that the film thickness measuring means 51 can measure the thickness of the functional layer 205 of the entire workpiece 200 at predetermined intervals, and the film thickness measuring means 51 acquires the measured value of the thickness of the functional layer 205 of the workpiece 200 at predetermined intervals. The processing system 1 stores in the measurement data memory unit 101 film thickness measurement data 401 that links the measured thickness value of the functional layer 205 acquired by the control unit 100 to the XY coordinates detected by the X-direction position detection unit and the Y-direction position detection unit when the film thickness measurement means 51 acquired the measured thickness value of the functional layer 205.

[0106] In the processing system 1, the control unit 100 rotates the spindle 23 about its axis and supplies cutting water from the nozzles 261, 262. In the processing system 1, the control unit 100 controls the moving unit 40 to move the holding table 10 to below the imaging unit, and the imaging unit captures an image of the workpiece 200 sucked and held on the holding table 10, thereby performing alignment.

[0107] In the processing operation, the control unit 100 of the processing system 1 controls the moving unit 40 and the like based on the processing conditions to relatively move the cutting blade 21 and the workpiece 200 along the division lines 203, while cutting the cutting blade 21 into the division lines 203 of the workpiece 200 until it reaches the adhesive tape 209, thereby performing cutting processing. The processing system 1 cuts the division lines 203 of the workpiece 200 in accordance with the processing conditions, forms cutting grooves 207 on the division lines 203, and divides the workpiece 200 into individual chips 208. When all the division lines 203 of the workpiece 200 are cut, the processing system 1 moves the holding table 10 from the processing area toward the carry-in / out area.

[0108] In addition, the control unit 100 of the processing system 1 generates a wafer map 700 in a processing operation, and the measurement unit 50 acquires the measurement value of each measurement item. In the processing operation, the control unit 100 of the processing system 1 generates measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 by linking the measurement value of each measurement item acquired by the measurement unit 50 with the XY coordinates detected by the position detection unit when each measurement value was acquired. In the control unit 100 of the machining system 1, the generated measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 is stored in the measurement data storage unit 101 during the machining operation.

[0109] The processing system 1 stops the movement of the holding table 10 in the carry-in / out area, stops the suction holding of the workpiece 200 on the holding table 10, releases the clamping of the clamping section 12, and transports the workpiece 200 from the holding table 10 to the cleaning unit 82 by the transport unit 83. After cleaning the workpiece 200 in the cleaning unit 82, the processing system 1 transports the workpiece 200 after cutting by the transport unit 83 to the inspection table 310 positioned in the carry-in / out area, and places the workpiece 200 on the holding surface 311 of the inspection table 310.

[0110] The processing system 1 holds the workpiece 200 on the holding surface 311 via an adhesive tape 209, and the control unit 100 controls the holding table moving unit 321 and the imaging unit moving unit 322 to move the inspection table 310 holding the workpiece 200 to an inspection area. In the processing operation, the control unit 100 of the processing system 1 controls the moving unit 320 to relatively move the imaging unit 330 and the inspection table 310 so that the imaging cameras 332, 333 can image the entire workpiece 200, and the front surface 202 and the back surface 206 of the workpiece 200 are imaged by the first imaging camera 332 and the second imaging camera 333 of the imaging unit 330.

[0111] In the control unit 100 of the processing system 1, the inspection section 350 acquires inspection values ​​for each inspection item from images captured by the imaging cameras 332 and 333, and generates inspection data 501, 502, 503, 504, 505, and 506 by linking the inspection value for each inspection item acquired by the inspection section 350 with XY coordinates corresponding to the inspection XY coordinates detected by the inspection position detection unit when each inspection value was acquired. In the control unit 100 of the processing system 1, the inspection data storage section 102 stores the generated inspection data 501, 502, 503, 504, 505, and 506.

[0112] During the processing operation, the processing system 1 captures images of the entire workpiece 200 using the imaging cameras 332, 333, and upon completing inspection of the chips 208 of the workpiece 200 held on the inspection table 310, moves the inspection table 310 to the loading / unloading area and stops the inspection table 310 in the loading / unloading area.

[0113] In the machining operation, the machining system 1 controls the transport unit 83 to carry the workpiece 200 out of the inspection table 310 and carry the workpiece 200 into the cassette 80. The machining system 1 cuts all of the workpieces 200 in the cassette 80 and inspects the chips 208, and then ends the machining operation.

[0114] In addition, in the processing system 1, the control unit 100 may receive from the operator a command from the input unit 120 or the like to specify at least two of the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and the inspection data 501, 502, 503, 504, 505, 506 to be displayed on the display unit 110. When the control unit 100 of the processing system 1 receives the above-mentioned command, the image generation unit 104 refers to the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and the inspection data 501, 502, 503, 504, 505, 506 stored in the measurement data memory unit 101 and the inspection data memory unit 102, and applies the color 600 set in the color setting memory unit 103 to the positions indicated by the XY coordinates where each measurement value and inspection value of the wafer map 700 was obtained, to generate images 801, 802, 803, 804, and display them on the display unit 110 as shown in Figures 11, 12, 13, and 14. In this manner, the display unit 110 displays images 801, 802, 803, and 804.

[0115] Note that image 801 on the left side of FIG. 11 is an image showing film thickness measurement data 401 with a first color 601 added, and image 802 on the right side of FIG. 11 is an image showing chipping size inspection data 503 with a fourth color 604 added, and FIG. 12 shows an image in which image 801 showing film thickness measurement data 401 with a first color 601 added and image 802 showing chipping size inspection data 503 with a fourth color 604 are superimposed.

[0116] In addition, image 803 on the left side of Figure 13 is an image showing cutting water temperature measurement data 409 in the second color 602, image 804 on the right side of Figure 13 is an image showing spindle current value measurement data 411 in the third color 603, and Figure 14 shows an image in which image 803 showing cutting water temperature measurement data 409 in the second color 602 and image 804 showing spindle current value measurement data 411 in the third color 603 are superimposed.

[0117] In this way, the image generator 104 generates images 801, 802, 803, and 804 to which a color 600 corresponding to the measurement values ​​of at least two measurement items and the test values ​​of the test items of each of the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, and 420 and each of the test data 501, 502, 503, 504, 505, and 506 is applied. The image generator 104 displays the generated images 801, 802, 803, and 804 side by side or overlaid on the display unit 110 according to the operation of the operator from the input unit 120. In this way, the image generating unit 104 generates an image with color 600 applied according to both the measurement value and the inspection value acquired on the same workpiece 200 as the workpiece 200 from which the measurement value was acquired. Note that, although Fig. 11, Fig. 12, Fig. 13, and Fig. 14 show an example in which the display unit 110 displays two images 801, 802, 803, and 804, in the present invention, the display unit 110 may display three or more images 801, 802, 803, and 804.

[0118] The processing system 1 of the embodiment 1 described above has the image generation unit 104 generate images 801, 802, 803, 804 with colors 600 corresponding to the measurement values ​​of at least two or more measurement items and the test values ​​of the test items, and displays the generated images 801, 802, 803, 804 on the display unit 110, thereby achieving the effect of making it possible to easily grasp the correlation between multiple measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and test data 501, 502, 503, 504, 505, 506.

[0119] In addition, the processing system 1 can display images 801, 802, 803, 804 with transparent colors 601, 602, 603, 604 generated by the image generation unit 104 on the display unit 110, making the distribution of each color 601, 602, 603, 604 clear and making it easier to understand the periodicity and correlation of multiple measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and inspection data 501, 502, 503, 504, 505, 506.

[0120] In addition, the processing system 1 can display images 801, 802, 803, 804 with transparent colors 601, 602, 603, 604 generated by the image generation unit 104 on the display unit 110. Therefore, when two or more colors 601, 602, 603, 604 overlap, the resulting color is different from the colors 601, 602, 603, 604 before the overlap, making the XY coordinates on the wafer map 700 that are likely to be correlated with the workpiece 200 clear.

[0121] The processing system 1 can display images 801, 802, 803, 804 with transparent colors 601, 602, 603, 604 generated by the image generation unit 104 on the display unit 110, so that the correlation between multiple measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and inspection data 501, 502, 503, 504, 505, 506 can be intuitively understood, which can be useful for improving processing quality and analyzing the causes of processing defects. Furthermore, the image generating unit 104 may apply color 600 onto a wafer map 700 formed by scaling down the outer diameter of the workpiece 200, or may apply color 600 onto a wafer map 700 displaying an actually captured photograph of the workpiece 200. By applying color onto the actually captured photograph of the workpiece 200, it is possible to easily identify the cause of defects and consider quality improvements by comparing the state of the device 204 and laminated films formed on the workpiece 200 with the measured values ​​and inspection values.

[0122] [Embodiment 2] A processing system according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 15 is a perspective view showing a configuration example of a processing device of the processing system according to the second embodiment. In Fig. 15, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0123] In the processing system 1 according to the second embodiment, the processing device 2-2 is a laser processing device shown in Fig. 15. The processing device 2-2 of the processing system 1 according to the second embodiment is a laser processing device that irradiates a laser beam having an absorbent wavelength to the workpiece 200 held on the holding table 10, laser processes the workpiece 200, and forms a laser processed groove, which is a processing mark, in the workpiece 200. Note that in the present invention, the processing device 2-2, which is a laser processing device, may irradiate a laser beam having a wavelength that is transparent to the workpiece 200.

[0124] The processing device 2-2 includes a moving unit 40, which includes a processing feed unit 41 that moves the holding table 10 in the X direction, an indexing feed unit 42 that moves the holding table 10 in the Y direction, and a rotational movement unit 44 that rotates the holding table 10 around an axis parallel to the Z direction. The processing device 2-2 of the processing system 1 according to the second embodiment includes a laser beam irradiation unit 90 that is a processing unit that irradiates a laser beam onto the workpiece 200 held on the holding table 10, laser processes the workpiece 200, and forms a laser processed groove, which is a processing mark, on the workpiece 200. In the case of a laser processing device, the film thickness measuring means 51 may measure the thickness of the water-soluble resin coated on the upper surface of the workpiece 200.

[0125] In addition, the inspection device 300 of the processing system 1 of embodiment 2 acquires, as inspection items of the workpiece 200 after laser processing, the following inspection values: the widthwise position of the planned division line 203 in the center of the laser-processed groove, which is the processing mark formed on the workpiece 200, the width of the laser-processed groove, the size of chipping formed on the edges of the laser-processed groove on each of the front surface 202 and back surface 206 of the chip 208, the size of foreign matter attached to each of the front surface 202 and back surface 206 of the chip 208, the length of cracks extending from the laser-processed groove toward the inside of the chip 208 on each of the front surface 202 and back surface 206 of the chip 208, and the area, width and length of film peeling on the chip 208 on each of the front surface 202 and back surface 206 of the chip 208.

[0126] In the processing system 1 of embodiment 2, the image generation unit 104 generates images 801, 802, 803, and 804 in which a color 600 is applied according to the measurement values ​​of at least two or more measurement items and the test values ​​of the test items, and displays the generated images 801, 802, 803, and 804 on the display unit 110, thereby achieving the effect of making it possible to grasp the correlation between multiple measurement data 400 and test data 500.

[0127] [Modifications] A processing system according to a modified example of the first and second embodiments of the present invention will be described with reference to the drawings. Fig. 16 is a perspective view showing a configuration example of a processing system according to a modified example of the first and second embodiments. In Fig. 16, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0128] The processing system 1-1 of the modified example is the same as embodiments 1, 2 and 3, except that the processing device 2 and the inspection device 300 are installed independently, and the workpiece 200 is transported between the processing device 2 and the inspection device 300 by a conveyor belt transport device 84.

[0129] In the processing system 1-1 according to the modified example, identification information composed of a barcode, a two-dimensional code, or the like is given to the workpiece 200 or the annular frame 210, and the processing device 2 and the inspection device 300 each have a reading unit (not shown) for reading the identification information. In the processing system 1-1 according to the modified example, the control unit 100 stores the workpiece 200, the measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420, and the inspection data 501, 502, 503, 504, 505, 506 in association with each other.

[0130] 16 includes a plurality of cassette elevators 81 on which cassettes 80 are placed, and a transport device 85 using a belt conveyor for loading and unloading the workpieces 200 into and from the cassettes 80. The processing device 2 of the processing system 1-1 shown in FIG.

[0131] In addition, in the present invention, the processing system 1-1 may be equipped with a transport device using an unmanned transport vehicle instead of the transport device 84 to transport the workpiece 200 between the processing device 2 and the inspection device 300, or an operator may transport the workpiece 200 between the processing device 2 and the inspection device 300 manually, etc.

[0132] In the processing system 1-1 relating to the modified example, similarly to the first embodiment, the image generation unit 104 generates images 801, 802, 803, 804 in which a color 600 corresponding to the measurement values ​​of at least two or more measurement items and the test values ​​of the test items is applied, and the generated images 801, 802, 803, 804 are displayed on the display unit 110, thereby achieving the effect of making it possible to grasp the correlation between multiple measurement data 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 411, 412, 413, 414, 415, 416, 417, 418, 419, 420 and the test data 501, 502, 503, 504, 505, 506.

[0133] The present invention is not limited to the above-mentioned embodiment and modified examples. That is, various modifications can be made without departing from the gist of the present invention. In the embodiment, the processing system 1, 1-1 includes the processing device 2, 2-2 and the inspection device 300, and stores both the measurement data 400 obtained by acquiring the measurement value of the measurement item and the inspection data 500 obtained by acquiring the inspection value of the inspection item, and the image generating unit 104 generates an image with a color 600 according to both the measurement value and the inspection value obtained in the same workpiece 200 as the workpiece 200 from which the measurement value was acquired. However, in the present invention, it is sufficient to store either the measurement data 400 or the inspection data 500. That is, in the present invention, the processing system 1, 1-1 may be composed of only the processing device 2, 2-2 out of the processing device 2, 2-2 and the inspection device 300, and may include only the measurement unit 50 out of the measurement unit 50 and the inspection section 350, the control unit 100 may include one of the measurement data storage section 101 and the inspection data storage section 102, and the image generation section 104 may generate an image with the color 600 added according to one of the measurement value and the inspection value acquired in the same workpiece 200 as the workpiece 200 from which the measurement value was acquired. Also, in the present invention, it is sufficient to store the inspection data 500 out of the measurement data 400 and the inspection data 500. That is, in the present invention, the processing system 1, 1-1 may be composed of only the inspection device 300 out of the processing device 2, 2-2 and the inspection device 300, and may have only the inspection section 350 out of the measurement unit 50 and the inspection section 350, and the control unit 100 may have only the inspection data memory section 102 out of the measurement data memory section 101 and the inspection data memory section 102.

[0134] In addition, in the present invention, the processing devices 2, 2-2 may be various processing devices such as a grinding device that grinds the workpiece 200, a polishing device that polishes the workpiece 200, or a bit cutting device that cuts the workpiece 200 with a bit. [Explanation of symbols]

[0135] 1,1-1 Processing system 10 Holding table 20 Cutting unit (processing unit) 40 Mobile Units 41 Processing feed unit 41-1 Motor 42-1 Motor 44-1 Motor 50 measurement units 90 Laser beam irradiation unit (processing unit) 100 Control Unit 101 Measurement data storage unit 102 Inspection data storage unit 103 Color setting memory section 104 Image Generation Unit 110 Display unit 200 Workpiece 207 Cutting groove (machining mark) 310 Inspection Table 330 Imaging unit 350 Inspection Department (Inspection Unit) 400 Measurement Data 600 colors 801,802,803,804 Images

Claims

1. 1. A processing system comprising: The processing system comprises: A holding table for holding the workpiece; a processing unit for processing a workpiece held on the holding table; a moving unit that relatively moves the holding table and the processing unit in an X direction and a Y direction perpendicular to the X direction; a measurement unit for acquiring measurement values ​​of a plurality of measurement items related to processing; A control unit; a display unit for displaying an image; The control unit a measurement data storage unit that associates the measurement value with an XY coordinate represented by the X direction and the Y direction in which the measurement value was acquired, and stores the result as measurement data; a color setting storage unit that stores colors that are set according to the measurement items of the measurement data and have different hues for each of the measurement items; an image generating unit that generates an image with the color corresponding to the measurement value for the position corresponding to the XY coordinates, The image generating unit includes: generating the image colored according to the measurement values ​​of at least two or more of the measurement items, and displaying the generated image colored according to the measurement values ​​of at least two or more of the measurement items side by side or overlapping on the display unit; The color has transparency, and positions where a measurement value exceeding the threshold is displayed darker than positions where a measurement value below the threshold is displayed.

2. The measurement items are: Vibration of the holding table, pressure, temperature, and flow rate of the fluid supplied to the holding table, A load applied to the holding table, a moving speed of the holding table, and a torque of a motor connected to the holding table. The pressure, temperature, and flow rate of the fluid supplied to the processing unit, the current and voltage supplied to the processing unit, The moving speed of the processing unit, the torque of the motor mounted on the processing unit, The current and voltage supplied to the processing feed unit, and the torque of the motor mounted on the processing feed unit, 2. The machining system according to claim 1, wherein the machining system is any one of the above.

3. The processing system is an inspection table for holding the workpiece after processing; an imaging unit for imaging a workpiece held on the inspection table; an inspection unit for acquiring inspection values ​​of inspection items from the captured image; A control unit; a display unit for displaying an image; The control unit an inspection data storage unit that associates the inspection value with an XY coordinate corresponding to the coordinate at which the inspection value was acquired, and stores the result as inspection data; a color setting storage unit that stores colors that are set according to the inspection items of the inspection data and have different hues for each of the inspection items; an image generating unit that generates an image with the color corresponding to the inspection value applied to a position corresponding to the XY coordinates, The image generating unit includes: generating the image colored according to the test values ​​of at least two or more of the test items, and displaying the generated images colored according to the test values ​​of at least two or more of the test items side by side or in an overlapping manner on the display unit; The color has transparency, and positions where inspection values ​​exceeding the threshold are displayed darker than positions where inspection values ​​below the threshold are displayed.

4. The test items are: The location of the machining marks formed on the workpiece, the width of the machining marks, chipping formed adjacent to the machining marks, foreign matter attached, cracks, peeling of the film, 4. The machining system according to claim 3, wherein the machining system is any one of the above.

5. The processing system according to claim 1 or claim 2, characterized in that the image generation unit is set according to both the measurement item of the measurement value and the inspection item of the inspection value obtained from an image of a processed workpiece identical to the workpiece from which the measurement value was obtained, and generates images colored with different hues for each measurement item and inspection item.

Images