Component crimping device and component crimping method

Abstract

To provide a component crimping system capable of properly imaging an alignment mark.SOLUTION: A component crimping system 100 includes a stage 37, an imaging unit 39, a crimping tool 34, a moving mechanism K, and a control unit 2a. The control unit 2a is configured to control a first camera 39L or a second camera 39R of the imaging unit 39 to execute to pick up an image of either one of a pair of alignment marks M at least one of board 3 and component 5 have, and after the imaging, controls the moving mechanism K to change the relative position of the pair of alignment marks and the imaging unit 39, and after changing the relative position, controls the first camera 39L or the second camera 39R to execute imaging one of the pair of alignment marks.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a component crimping device that crimps a component onto a substrate. [Background technology]

[0002] Conventionally, a component bonding device that bonds electronic components (hereinafter simply referred to as "components") to a substrate such as a liquid crystal panel has been provided as, for example, an electronic component mounting device (see Patent Document 1). This component bonding device has a pair of imaging cameras that capture images of a pair of alignment marks provided on the substrate and the component, respectively. Then, based on the imaging results, the component bonding device aligns the substrate and the component, and mounts the component on the substrate in an aligned state. This alignment mark is also called an alignment mark. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-218567 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the component pressure bonding device of Patent Document 1 has a problem in that it may be difficult to capture an image of the alignment mark.

[0005] Therefore, the present disclosure provides a component compression bonding device and the like that can properly capture an image of an alignment mark. [Means for solving the problem]

[0006] A component bonding apparatus according to one aspect of the present disclosure includes a stage that holds a substrate, an imaging unit including a first imaging unit and a second imaging unit, a crimping tool that holds a component and crimps the component onto the substrate, a movement mechanism that moves at least one of the crimping tool, the stage, and the imaging unit, and a control unit that controls the imaging unit, the crimping tool, and the movement mechanism, and the control unit causes the imaging unit to capture an image of a pair of alignment marks on at least one of the substrate and the component according to a predetermined imaging mode, and controls the movement mechanism based on an imaging result by the imaging unit to move the crimping tool. the component held on a bonding tool is aligned with the substrate held on the stage, and the bonding tool is caused to bond the component to the substrate; in the predetermined imaging mode, the first imaging unit or the second imaging unit is caused to image one of the pair of alignment marks; after the imaging of one of the pair of alignment marks, the moving mechanism is controlled to change a relative position between the pair of alignment marks and the imaging unit; and after the change in relative position, the first imaging unit or the second imaging unit is caused to image the other of the pair of alignment marks.

[0007] These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may be a non-transitory recording medium. Effect of the Invention

[0008] The component compression bonding device of the present disclosure can properly capture images of alignment marks.

[0009] Further advantages and benefits of certain aspects of the present disclosure will become apparent from the specification and drawings, in which such advantages and / or benefits are provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of which are provided to obtain one or more identical features. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. [Diagram 2] FIG. 2 is a plan view of a component mounting line according to the embodiment. [Diagram 3] FIG. 3 is a diagram showing a computer and each of the components controlled by the computer, which are provided in the component mounting line in the embodiment. [Figure 4] FIG. 4 is a block diagram showing a configuration of a component crimping device according to an embodiment. [Diagram 5] FIG. 5 is a diagram showing an example of the appearance of a board and a component according to the embodiment. [Figure 6] FIG. 6 is a diagram showing an example of a first camera, a second camera, and an imaging movement mechanism included in the imaging unit according to the embodiment. [Figure 7] FIG. 7 is a diagram showing the first camera, the lower receiving portion, and the pressure bonding tool as viewed from the X-axis direction when an image of a component and a board is captured in the embodiment. [Figure 8] FIG. 8 is a diagram for explaining the imaging modes according to the embodiment. [Figure 9] FIG. 9 is a flowchart showing an example of a processing operation related to imaging by the control unit in the embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of detailed processing operations in the second imaging mode by the control unit in the embodiment. [Figure 11] FIG. 11 is a plan view of a component mounting line according to a modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] (Findings on which this disclosure is based) The present inventors have found that the component crimping device of Patent Document 1 described in the "Background Art" section has the following problems.

[0012] As described above, the component pressure bonding device of Patent Document 1 uses a pair of imaging cameras to capture an image of a pair of alignment marks formed on a component or a board. That is, with the distance between the pair of imaging cameras adjusted to be equal to the distance between the pair of alignment marks, the pair of imaging cameras capture images of the pair of alignment marks located above from below. Specifically, one of the pair of imaging cameras captures an image of one of the pair of alignment marks from below, and the other of the pair of imaging cameras captures an image of the other of the pair of alignment marks from below.

[0013] Here, in recent years, there are cases where components and substrates are mounted on small devices such as smart watches. In such cases, the components and substrates are miniaturized, and the interval between the pair of alignment marks formed on these components and substrates is also shortened. As a result, the interval between the pair of imaging cameras must also be shortened. However, the interval between the pair of imaging cameras cannot be made shorter than a predetermined minimum interval because of mechanical or physical constraints. Therefore, when the interval between the pair of alignment marks is shorter than the minimum interval, the interval between the pair of imaging cameras cannot be adjusted to be equal to the interval between the pair of alignment marks.

[0014] In such a case, it is difficult to properly capture an image of the pair of alignment marks, which may result in a decrease in the accuracy of alignment between the component and the board, and thus in a decrease in the quality of the mounting board on which the components are mounted.

[0015] In order to solve such problems, a component bonding apparatus according to one aspect of the present disclosure includes a stage for holding a substrate, an imaging section including a first imaging section and a second imaging section, a bonding tool for holding a component and bonding the component to the substrate, a movement mechanism for moving at least one of the bonding tool, the stage, and the imaging section, and a control section for controlling the imaging section, the bonding tool, and the movement mechanism, wherein the control section causes the imaging section to capture an image of a pair of alignment marks on at least one of the substrate and the component in accordance with a predetermined imaging mode, and controls the movement mechanism based on an imaging result by the imaging section. By controlling the moving mechanism, the component held on the pressure bonding tool is aligned with the substrate held on the stage, and the pressure bonding tool is caused to perform pressure bonding of the component to the substrate. In the predetermined imaging mode, the first imaging unit or the second imaging unit is caused to image one of the pair of alignment marks, and after the imaging of one of the pair of alignment marks, the relative position between the pair of alignment marks and the imaging unit is changed by controlling the moving mechanism, and after the change in relative position, the first imaging unit or the second imaging unit is caused to image the other of the pair of alignment marks.

[0016] As a result, the pair of alignment marks are imaged at different times while changing the relative positions between the pair of alignment marks and the imaging unit. Therefore, even if the mark pitch between the pair of alignment marks is shorter than the imaging pitch between the first imaging unit and the second imaging unit, the pair of alignment marks can be properly imaged. As a result, the accuracy of alignment between the components and the board can be improved, and the quality of the mounting board, which is the board to which the components are pressure-bonded, can be improved.

[0017] In addition, the control unit may switch the imaging mode of the pair of alignment marks between a first imaging mode and a second imaging mode which is the specified imaging mode, and in the first imaging mode, with an imaging pitch between the first imaging unit and the second imaging unit being adjusted to an inter-mark pitch which is the distance between the pair of alignment marks, the control unit may cause the imaging units to image one of the pair of alignment marks by the first imaging unit and image the other of the pair of alignment marks by the second imaging unit, without changing the relative positions.

[0018] As a result, when the mark pitch and the imaging pitch are equal, the pair of alignment marks can be properly imaged simultaneously by the first imaging unit and the second imaging unit, thereby improving the production throughput of mounting boards.

[0019] The control unit may determine whether the inter-imaging pitch is adjusted to the inter-mark pitch, and switch the imaging mode to the first imaging mode when the inter-mark pitch is the inter-imaging pitch, and switch the imaging mode to the second imaging mode when the inter-mark pitch is not the inter-imaging pitch. Alternatively, the first imaging unit and the second imaging unit may be arranged such that the inter-imaging pitch, which is the interval between the first imaging unit and the second imaging unit, is variably set, and the control unit may determine whether the inter-mark pitch is equal to or greater than an inter-imaging minimum pitch, which is a minimum value of the inter-imaging pitch, and switch the imaging mode to the first imaging mode when the inter-mark pitch is equal to or greater than the inter-imaging minimum pitch, and switch the imaging mode to the second imaging mode when the inter-mark pitch is less than the inter-imaging minimum pitch.

[0020] This makes it possible to automatically switch between the first imaging mode and the second imaging mode in accordance with the pitch between the marks, thereby improving the efficiency of the work of crimping components.

[0021] The second imaging mode has a first pattern in which the first imaging unit and the second imaging unit are used to image the pair of alignment marks, and a second pattern in which only one of the first imaging unit and the second imaging unit is used to image the pair of alignment marks, and the control unit selects one of the first pattern and the second pattern in the second imaging mode, and when the selected pattern is the first pattern, causes one of the first imaging unit and the second imaging unit to image one of the pair of alignment marks and controls the moving mechanism. the relative position is changed by controlling the moving mechanism, and after the change in relative position, the other of the first imaging unit and the second imaging unit is caused to image the other of the pair of alignment marks, and if the selected pattern is a second pattern, one of the first imaging unit and the second imaging unit is caused to image one of the pair of alignment marks, the relative position is changed by controlling the moving mechanism, and after the change in relative position, one of the first imaging unit and the second imaging unit is caused to image the other of the pair of alignment marks.

[0022] This makes it possible to switch between using both the first imaging unit and the second imaging unit or using only one of them to capture an image of a pair of alignment marks, thereby increasing the degree of freedom in imaging.

[0023] Furthermore, the control unit may determine whether the inter-mark pitch is equal to or greater than a difference between the inter-mark pitch and the inter-imaging pitch in selecting the pattern, and select the first pattern when the inter-mark pitch is equal to or greater than the difference, and select the second pattern when the inter-mark pitch is less than the difference. Alternatively, the control unit may determine whether the inter-mark pitch is equal to or greater than a difference between the inter-mark pitch and the inter-imaging minimum pitch in selecting the pattern, and select the first pattern when the inter-mark pitch is equal to or greater than the difference, and select the second pattern when the inter-mark pitch is less than the difference, and the inter-imaging pitch in the first pattern and the second pattern may be adjusted to the inter-imaging minimum pitch.

[0024] This makes it possible to appropriately suppress the amount of change in the relative positions. For example, when the mark pitch is equal to or greater than the above-mentioned difference, the first imaging unit and the second imaging unit can respectively image one and the other of the pair of alignment marks by changing the relative positions by the distance of the difference. That is, the pair of alignment marks can be imaged without changing the relative positions to the distance of the mark pitch. On the other hand, when the mark pitch is less than the above-mentioned difference, the pair of alignment marks can be imaged by only one of the first imaging unit and the second imaging unit by changing the relative positions by the distance of the mark pitch. That is, the pair of alignment marks can be imaged without changing the relative positions to the distance of the difference. Therefore, the pair of alignment marks can be imaged while appropriately suppressing the amount of change in the relative positions according to the mark pitch.

[0025] Hereinafter, the embodiment will be specifically described with reference to the drawings.

[0026] In addition, the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection forms of components, steps, and order of steps shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept are described as optional components. In addition, each figure is a schematic diagram and is not necessarily illustrated precisely. In addition, the same components are given the same reference numerals in each figure. In addition, expressions such as "approximately equal" are used in the following embodiments. For example, "approximately equal" does not only mean completely equal, but also means substantially equal, that is, including an error of, for example, a few percent. In addition, "approximately equal" means equal within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately".

[0027] (Embodiment) [Schematic configuration of component mounting line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line in this embodiment.

[0028] The component mounting line 1 in this embodiment is a system that produces mounted boards by mounting components 5 on a board 3, which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The components 5 are, for example, electronic components such as a drive circuit. Specifically, as shown in FIG. 1, the component mounting line 1 has a board carry-in section 10, a bonding section 20, a temporary pressure bonding section 30, a full pressure bonding section 40, and a board carry-out section 50. The board carry-in section 10, the bonding section 20, the temporary pressure bonding section 30, the full pressure bonding section 40, and the board carry-out section 50 are connected in this order.

[0029] The substrate carry-in section 10 receives a rectangular substrate 3 carried in by a worker or from another device on the upstream side. The substrate 3 is then carried out to the bonding section 20 on the downstream side.

[0030] The adhering section 20 receives the substrate 3 carried out from the substrate carry-in section 10, and adheres an adhesive member to each of the plurality of electrode sections 4 on the periphery of the substrate 3. Then, the substrate 3 to which the adhesive member has been adhered is carried out to the temporary pressure-bonding section 30. Each of the plurality of electrode sections 4 is, for example, composed of a plurality of electrodes.

[0031] The temporary bonding unit 30 receives the substrate 3 carried out from the attaching unit 20, and mounts and presses the component 5 on the portion of the substrate 3 to which the adhesive member is attached. Then, the substrate 3 to which the component 5 is pressed is carried out to the full pressure bonding unit 40. The pressing performed in the temporary pressure bonding unit 30 is also called temporary pressure bonding.

[0032] The final compression bonding section 40 receives the board 3 carried out from the temporary compression bonding section 30, and performs final compression bonding (also called thermocompression bonding) on ​​the components 5 temporarily bonded to the board 3. Then, the board 3 that has been subjected to the final compression bonding is carried out to the board carrying-out section 50.

[0033] The substrate unloading section 50 receives the substrate 3 unloaded from the full-pressure bonding section 40. The substrate 3 received by the substrate unloading section 50 is unloaded to the downstream side.

[0034] In this manner, the component mounting line 1 performs the component mounting work of mounting components 5 to each of the multiple electrode portions 4 provided on the periphery of the brought-in board 3, and then transports the mounted board, which is the board 3 on which the components 5 are mounted, out of the board removal section 50.

[0035] [Detailed configuration of component mounting line] Fig. 2 is a plan view of the component mounting line 1 in this embodiment. Specifically, Fig. 2 shows the configuration of the component mounting line 1 seen from above. In this embodiment, the conveying direction of the board is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, i.e., the depth direction, is referred to as the Y-axis direction. The negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side, respectively, of the conveying direction of the board, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side, respectively, of the vertical direction, and the negative side and the positive side in the Y-axis direction correspond to the near side and the far side, or the front side and the rear side, respectively, of the depth direction.

[0036] The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. The base 1a of the substrate loading section 10 is provided with a stage 11 on which the substrate 3 is placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. In addition, a plurality of suction holes 11a are provided on the upper surface of the stage 11. The stage 11 holds the substrate 3, which has been loaded by an operator or from another upstream device and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

[0037] The adhering unit 20 has a function of performing an adhering operation (in other words, an adhering process) of adhering an ACF (Anisotropic Conductive Film), which is an adhesive member, to the electrode portion 4 of the substrate 3. The ACF is also called an anisotropic conductive adhesive, and is a member for electrically connecting the electrode portion 4 of the substrate 3 and the component 5. The adhering unit 20 includes a substrate moving mechanism 21 and an adhering mechanism 22.

[0038] The substrate moving mechanism 21 is a mechanism that moves the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the stage 23 are stacked on top of each other on the base 1b in this order from the bottom.

[0039] The Y-axis table is provided to extend in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, and raises and lowers the stage 23 provided on the upper portion in the Z-axis direction and rotates it around the Z axis.

[0040] Furthermore, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this manner, the substrate moving mechanism 21 suctions and holds the substrate 3, moves it within a horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z axis.

[0041] The bonding mechanism 22 is provided with, for example, two bonding heads aligned in the X-axis direction above the base 1b. Each bonding head is provided with a supply unit that supplies ACF and a bonding tool for bonding the ACF to the substrate 3. Each of the two bonding heads bonds the ACF to positions on the substrate 3 that correspond to the multiple electrode portions 4. Also, a bonding support stand is provided at a position corresponding to each of the two bonding heads below.

[0042] The pre-bonding unit 30 performs a pre-bonding step of mounting and pre-bonding a component 5 on the area (i.e., the target area) of the substrate 3 to which the ACF is attached. The pre-bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a tray moving unit 33e.

[0043] The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction through the plurality of suction holes 37a. The substrate moving mechanism 31 also has a function of moving the stage 37 that suction-holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 37, the substrate moving mechanism 31 positions the region of the substrate 3, which is held by suction and has the ACF affixed, above the lower support unit 36, which is the backup stage of the component mounting mechanism 32. Although the substrate moving mechanism 31 has the suction holes 37a as described above, the stage 37 may be moved and rotated without having the suction holes 37a.

[0044] The component supply unit 33 is provided protruding from the rear of the base 1b at the rear side of the component mounting mechanism 32 (i.e., on the positive side in the Y-axis direction). For example, two tray sets are arranged along the X-axis direction in the component supply unit 33. The tray set is made up of a plurality of trays 7, and these trays 7 are stacked along the Z-axis direction. Furthermore, a plurality of components 5 are placed on the trays 7, for example, in a matrix form. The component supply unit 33 supplies the plurality of components 5 for each tray 7.

[0045] The tray moving unit 33e moves the tray 7 on which the multiple components 5 are placed, which is supplied from the component supply unit 33, to the negative side in the Y axis direction.

[0046] The component mounting mechanism 32 includes a crimping tool 34, a tool moving mechanism 34a, and a lower support 36. The tool moving mechanism 34a moves the crimping tool 34 in the X-axis and Y-axis directions. The lower support 36 supports from below a crimping target portion, which is a predetermined portion of the substrate 3 held by the stage 37. Note that the crimping target portion is a portion of the edge of the substrate 3 to which the ACF is attached.

[0047] The bonding tool 34 holds the component 5 and bonds the component 5 to the substrate 3 held by the stage 37. Specifically, the bonding tool 34 moves in the X-axis direction and the Y-axis direction by the tool moving mechanism 34a and stops on the component 5 to be bonded that is placed on the tray 7 moved by the tray moving unit 33e. The bonding tool 34 then descends to pick up the component 5 to be bonded from above and rises (i.e., picks up) while holding the component 5. The bonding tool 34 then moves in the X-axis direction and the Y-axis direction by the tool moving mechanism 34a and stops on the lower support unit 36. The bonding tool 34 then descends in the Z-axis direction and bonds the component 5 to the portion to be bonded of the substrate 3 supported by the lower support unit 36. That is, the bonding tool 34 places the adsorbed component 5 on the ACF and presses the substrate 3 together with the component 5 against the lower support unit 36, thereby provisionally bonding the component 5 to the substrate 3. For example, the pressure bonding tool 34 is heated to about 80° C. and presses the component 5 onto the substrate 3. The temporary pressure bonding unit 30 may include a mechanism for rotating the orientation of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0048] The final bonding unit 40 performs a final bonding process (i.e., a thermocompression process) of final bonding (i.e., thermocompression bonding) of the component 5, which has been temporarily bonded to the substrate 3 by the temporary bonding unit 30, to the substrate 3. In this manner, the electrode unit 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. The final bonding unit 40 includes a substrate moving mechanism 41 and a bonding mechanism 42.

[0049] The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the plurality of suction holes 49a. The substrate moving mechanism 41 also has a function of moving the stage 49 that suction-holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 41 positions the region where the component 5 of the substrate 3, which is suction-held and temporarily pressure-bonded, above the lower support portion 46 of the pressure bonding mechanism 42 by moving and rotating the stage 49.

[0050] The crimping mechanism 42 is provided on the base 1b, and includes a crimping tool 43 and a lower support 46.

[0051] The bonding tool 43 is heated and presses the component 5 of the substrate 3 supported by the support 46 towards the support 46. For example, the bonding tool 43 presses the component 5 in a state where it is heated to about 200° C. As a result, the component 5 is fully bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0052] The substrate unloading section 50 has a function of holding the substrate 3 transported from the main pressure bonding section 40 on the stage 51 by vacuum suction. The substrate 3 held in the substrate unloading section 50 is either unloaded to another device on the downstream side or removed from the stage 51 by an operator.

[0053] The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 holds the substrate 3 transferred from the main pressure bonding unit 40 by vacuum suction on the upper surface.

[0054] The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 has a function of transferring (transporting) the substrate 3 that has been loaded into the substrate loading unit 10 to the bonding unit 20, the temporary pressure bonding unit 30, the final pressure bonding unit 40, and the substrate unloading unit 50 in this order. The transport unit 60 is disposed in a front area (i.e., on the negative side in the Y-axis direction) of the bonding unit 20, the temporary pressure bonding unit 30, and the final pressure bonding unit 40. The transport unit 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D that are disposed in this order from the upstream side on a moving base 61 that extends in the X-axis direction across the bases 1a, 1b, and 1c.

[0055] Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In this embodiment, a case is illustrated in which each of the substrate transport mechanisms 62A to 62D includes two arm units 64. The base 63 is provided on a moving base 61, and moves freely in the X-axis direction. The two arm units 64 are provided on the base 63 side by side in the X-axis direction. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0056] Each of the substrate transport mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-sucked from above, and receives or transfers the substrate 3 from the rising and lowering stage 11, 23, 37, 49, 51. For example, the substrate transport mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carry-in section 10 and transfers it to the stage 23 of the bonding section 20. Also, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the bonding section 20 and transfers it to the stage 37 of the temporary pressure bonding section 30. Also, for example, the substrate transport mechanism 62C receives the substrate 3 from the stage 37 of the temporary pressure bonding section 30 and transfers it to the stage 49 of the main pressure bonding section 40. Also, for example, the substrate transport mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding section 40 and transfers it to the stage 51 of the substrate carry-out section 50.

[0057] FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each of the components controlled by the computer.

[0058] The component mounting line 1 includes a computer 2 as shown in Fig. 3. The computer 2 is communicatively connected to, for example, the adhering unit 20, the temporary pressure bonding unit 30, the main pressure bonding unit 40, and the transport unit 60 via, for example, control lines, and controls each of these units. The computer 2 includes a control unit 2a, a storage unit 2b, and a display unit 2c.

[0059] The display unit 2c displays images and characters, and is configured, for example, by a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, etc. However, the display unit 2c is not limited to these displays.

[0060] The storage unit 2b stores various data necessary for component mounting work, such as the size of the board 3, the type of components 5 to be mounted on the board 3, the mounting position, the mounting direction, and the timing of moving the board 3, as well as control programs executed by the control unit 2a, etc. The storage unit 2b is realized by, for example, a ROM (Read Only Memory) or a RAM (Random Access Memory), etc.

[0061] The control unit 2a controls the substrate moving mechanism 21 of the adhering unit 20, the substrate moving mechanism 31 of the temporary pressure bonding unit 30, the substrate moving mechanism 41 of the main pressure bonding unit 40, and the transport unit 60 to perform a substrate transfer operation for transferring the substrate 3 between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed synchronously between each unit.

[0062] The control unit 2a also controls the adhering unit 20. In other words, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 21, changes the spacing between the multiple adhering heads by the head moving motor, and causes the adhering unit 20 to perform an adhering operation of adhering the ACF to the substrate 3 by the adhering mechanism 22.

[0063] The control unit 2a also controls the temporary pressure bonding unit 30. That is, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31, and causes the component mounting mechanism 32 to perform temporary pressure bonding of the components 5 to the substrate 3. At this time, the control unit 2a may correct or change the position of the substrate 3 according to the result of imaging by the imaging unit 39 provided in the temporary pressure bonding unit 30. The imaging unit 39 is moved by the imaging movement mechanism 38. The control unit 2a also controls the component supply unit 33 and the tray movement unit 33e to move the components 5 supplied from the component supply unit 33 to the component mounting mechanism 32 side.

[0064] Furthermore, the control unit 2a controls the final bonding unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41, and causes the component 5 temporarily bonded to the substrate 3 to be final bonded by the bonding mechanism 42.

[0065] Furthermore, the control unit 2a controls the display unit 2c to display images, characters, and the like on the display unit 2c.

[0066] Such a control unit 2a is realized, for example, by a control program stored in a memory unit 2b for controlling each part and each mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0067] [Component crimping device configuration] FIG. 4 is a block diagram showing the configuration of component crimping apparatus 100 according to the present embodiment.

[0068] The component pressure bonding apparatus 100 comprises a pre-pressure bonding section 30 in a component mounting line 1 and a control section 2 a of a computer 2 .

[0069] Specifically, the component crimping apparatus 100 includes a control unit 2a, a component supply unit 33, a tray moving unit 33e, an imaging unit 39, a crimping tool 34, a stage 37, and a moving mechanism K.

[0070] The imaging section 39 includes a first camera 39L and a second camera 39R. The first camera 39L and the second camera 39R are examples of a first imaging section and a second imaging section, respectively.

[0071] The moving mechanism K includes the above-mentioned tool moving mechanism 34a, substrate moving mechanism 31, and imaging moving mechanism 38. That is, the moving mechanism K in this embodiment moves at least one of the pressure bonding tool 34, the stage 37, and the imaging unit 39.

[0072] The control unit 2a controls the component supply unit 33, the tray moving unit 33e, the imaging unit 39, the crimping tool 34, and the moving mechanism K.

[0073] [Appearance of components and board] FIG. 5 is a diagram showing an example of the external appearance of the substrate 3 and the component 5. As shown in FIG.

[0074] 5(a), an electrode portion 4 consisting of electrodes such as leads, and a pair of first alignment marks Mb arranged to sandwich the electrode portion 4 in the X-axis direction are formed on the substrate 3. The substrate mark pitch Ab, which is the distance between the pair of first alignment marks Mb, is determined in advance. An ACF 91 is attached to the substrate 3 so as to cover the electrode portion 4.

[0075] The control unit 2a uses the board imaging data generated by the imaging unit 39 capturing an image of the board 3 to identify the positions of the pair of first alignment marks Mb.

[0076] 5(b), the component 5 is formed with an electrode portion 6 consisting of electrodes such as leads, and a pair of second alignment marks Mc arranged to sandwich the electrode portion 6 in the X-axis direction. The component mark pitch Ac, which is the distance between the pair of second alignment marks Mc, is determined in advance to be equal to the substrate mark pitch Ab. Hereinafter, the substrate mark pitch Ab and the component mark pitch Ac will be collectively referred to as the mark pitch.

[0077] The control unit 2a uses component imaging data generated by the imaging unit 39 capturing an image of the component 5 to identify the positions of the pair of second alignment marks Mc.

[0078] [Details of imaging by the imaging unit] FIG. 6 is a diagram showing an example of each of the first camera 39L and the second camera 39R included in the imaging section 39 and the imaging movement mechanism 38 in this embodiment.

[0079] The first camera 39L and the second camera 39R are disposed below the lower receiving portion 36, and capture images in the upward Z-axis direction. The first camera 39L and the second camera 39R are also arranged in the X-axis direction.

[0080] The imaging movement mechanism 38 moves the imaging ranges of the first camera 39L and the second camera 39R, for example, by moving each of them. The imaging movement mechanism 38 changes the distance between the cameras, i.e., the imaging pitch, by moving each of the first camera 39L and the second camera 39R along the X-axis direction.

[0081] When the component 5 is imaged, the crimping tool 34 suctions and holds the component 5 with the electrode portion 6, which is made up of multiple electrodes formed on the component 5, and a pair of second alignment marks Mc arranged to sandwich the electrode portion 6 facing downward. The pair of second alignment marks Mc are arranged to face the lower receiving portion 36.

[0082] The first camera 39L and the second camera 39R capture images of the pair of second alignment marks Mc of the component 5 from below through the two through-holes h1 of the lower support 36. Each of the two through-holes h1 is a hole having an opening on the upper surface of the lower support 36 arranged along the X-axis direction, for example, and penetrates the lower support 36 along the Z-axis direction. The first camera 39L captures an image of the second alignment mark Mc on the positive side of the X-axis direction of the component 5 through the through-hole h1 on the positive side of the X-axis direction. The second camera 39R captures an image of the second alignment mark Mc on the negative side of the X-axis direction of the component 5 through the through-hole h1 on the negative side of the X-axis direction. The through-hole h1 in this embodiment is a hole, but may be a groove recessed on the positive side of the Y-axis direction, or may be made of a member such as glass having translucency.

[0083] When the substrate 3 is imaged, the edge of the substrate 3 held by the stage 37 is disposed above the lower support 36. Furthermore, an electrode unit 4 consisting of a plurality of electrodes and a pair of first alignment marks Mb disposed so as to sandwich the electrode unit 4 are formed on the upper surface of the edge. Furthermore, an ACF 91 is attached to the upper surface of the edge so as to cover the electrode unit 4.

[0084] The first camera 39L and the second camera 39R capture images of the pair of first alignment marks Mb of the substrate 3 from below through the two through-holes h1 of the lower support 36. The portion of the substrate 3 on which the pair of first alignment marks Mb are formed has translucency. Therefore, the first alignment marks Mb formed on the upper surface of the substrate 3 are captured through the translucent portion. The first camera 39L captures an image of the first alignment mark Mb on the positive side of the X-axis direction of the substrate 3 through the through-hole h1 on the positive side of the X-axis direction. The second camera 39R captures an image of the first alignment mark Mb on the negative side of the X-axis direction of the substrate 3 through the through-hole h1 on the negative side of the X-axis direction.

[0085] Moreover, the pressure bonding tool 34 and the stage 37 are moved in the X-axis direction and the Y-axis direction by the moving mechanism K. Moreover, the imaging unit 39 is moved in the X-axis direction by the moving mechanism K. Therefore, the relative positions of the pair of first alignment marks Mb and the imaging unit 39 are changed by the moving mechanism K, and similarly, the relative positions of the pair of second alignment marks Mc and the imaging unit 39 are changed by the moving mechanism K. Moreover, the first camera 39L and the second camera 39R included in the imaging unit 39 are arranged such that the imaging pitch, which is the interval between the first camera 39L and the second camera 39R, is variable. In this embodiment, the moving mechanism K changes the imaging pitch.

[0086] Here, the imaging pitch has a minimum value. Therefore, the distance between the first camera 39L and the second camera 39R cannot be less than the minimum value. Hereinafter, the minimum value is also referred to as the imaging minimum pitch. As a result, when the mark pitch of the component 5 and the board 3 is shorter than the imaging minimum pitch, it may not be possible to simultaneously image the pair of first alignment marks Mb or the pair of second alignment marks Mc.

[0087] Therefore, the control unit 2a in this embodiment switches the imaging mode of the pair of alignment marks between a first imaging mode and a second imaging mode according to the pitch between the pair of alignment marks. The pair of alignment marks is a pair of first alignment marks Mb or a pair of second alignment marks Mc. The first imaging mode is a mode in which the first camera 39L and the second camera 39R simultaneously capture images of the pair of alignment marks. The second imaging mode is a mode in which the first camera 39L or the second camera 39R captures an image of one of the pair of alignment marks, and after the above-mentioned relative position changes, the first camera 39L or the second camera 39R captures an image of the other of the pair of alignment marks.

[0088] FIG. 7 is a diagram showing the first camera 39L, the lower receiving portion 36, and the crimping tool 34 as viewed from the X-axis direction when the component 5 and the board 3 are imaged.

[0089] In imaging the component 5, as shown in (a) of FIG. 7, the first camera 39L images one of the pair of second alignment marks Mc of the component 5 located above the receiving portion 36 from below the receiving portion 36 through the through-hole h1 of the receiving portion 36. In the first imaging mode, when one of the pair of second alignment marks Mc is imaged as described above, the second camera 39R similarly images the other of the pair of second alignment marks Mc of the component 5 through the through-hole h1 of the receiving portion 36. On the other hand, in the second imaging mode, after one of the pair of second alignment marks Mc is imaged as described above, the first camera 39L or the second camera 39R images the other of the pair of second alignment marks Mc of the component 5 through the through-hole h1 of the receiving portion 36.

[0090] The image of the board 3 is taken after the image of the component 5 is taken. In the image of the board 3, as shown in (b) of FIG. 7, the first camera 39L takes an image of one of the pair of first alignment marks Mb of the board 3 placed on the upper surface of the lower support portion 36 from the lower side of the lower support portion 36 through the through-hole h1 of the lower support portion 36. In the first image-taking mode, when the image of one of the pair of first alignment marks Mb is taken as described above, the second camera 39R similarly takes an image of the other of the pair of first alignment marks Mb of the board 3 through the through-hole h1 of the lower support portion 36. On the other hand, in the second image-taking mode, after the image of one of the pair of first alignment marks Mb is taken as described above, the first camera 39L or the second camera 39R takes an image of the other of the pair of first alignment marks Mb of the board 3 through the through-hole h1 of the lower support portion 36.

[0091] In this manner, the control unit 2a causes the imaging unit 39 to capture images of the pairs of alignment marks that are respectively held on the board 3 and the component 5. Then, based on the imaging result by the imaging unit 39, the control unit 2a controls the moving mechanism K to align the component 5 held on the pressure bonding tool 34 with the board 3 held on the stage 37, and causes the pressure bonding tool 34 to pressure bond the component 5 to the board 3.

[0092] FIG. 8 is a diagram for explaining the imaging mode in the present embodiment. Note that the component 5 or the substrate 3 is hereinafter also referred to as a member P to be pressure-bonded, and the pair of first alignment marks Mb and the pair of second alignment marks Mc are hereinafter also referred to as a pair of alignment marks M.

[0093] The control unit 2a switches the imaging mode for imaging the pair of alignment marks M into a first imaging mode and a second imaging mode. Then, the control unit 2a causes the first camera 39L and the second camera 39R to image the pair of alignment marks M of the member P to be pressure-bonded according to the switched imaging mode.

[0094] First, the control unit 2a specifies a mark pitch A, which is the interval between the pair of alignment marks M of the member P to be pressure-bonded, and an imaging interval minimum pitch Bmin, which is the minimum value of the imaging interval pitch. Then, the control unit 2a determines whether or not the mark pitch A is equal to or greater than the imaging interval minimum pitch Bmin. Here, when the mark pitch A is equal to or greater than the imaging interval minimum pitch Bmin (that is, when A ≧ Bmin), the control unit 2a switches the imaging mode to the first imaging mode. Conversely, when the mark pitch A is less than the imaging interval minimum pitch Bmin (that is, when A < Bmin), the imaging mode is switched to the second imaging mode.

[0095] The first imaging mode is a mode in which the first camera 39L captures an image of the alignment mark M on the positive side of the X-axis direction and the second camera 39R captures an image of the alignment mark M on the negative side of the X-axis direction at the same time. When the imaging mode is switched to the first imaging mode, the control unit 2a controls the moving mechanism K to place the first camera 39L below the alignment mark M on the positive side of the X-axis direction and place the second camera 39R below the alignment mark M on the negative side of the X-axis direction, as shown in FIG. 8(a). This sets the inter-mark pitch A and the inter-imaging pitch B to be approximately equal. Then, the control unit 2a causes the imaging unit 39 to capture one of the pair of alignment marks M by the first camera 39L and the other of the pair of alignment marks M by the second camera 39R without changing the above-mentioned relative positions, with the inter-imaging pitch B adjusted to the inter-mark pitch A, which is the interval between the pair of alignment marks M.

[0096] The second imaging mode has a first pattern and a second pattern as shown in FIG. 8. In the second imaging mode, regardless of the pattern, the imaging of the alignment mark M on the positive side of the X-axis direction and the imaging of the alignment mark M on the negative side of the X-axis direction are performed at different timings. That is, in the second imaging mode, as shown in (b) to (e) of FIG. 8, the control unit 2a first causes the first camera 39L or the second camera 39R to image one of the pair of alignment marks M. After imaging one of the pair of alignment marks M, the control unit 2a controls the moving mechanism K to change the relative position between the pair of alignment marks M and the imaging unit 39. After changing the relative position, the control unit 2a causes the first camera 39L or the second camera 39R to image the other of the pair of alignment marks M. In the examples of (b) to (e) in Figures 8, imaging of the alignment mark M on the positive side of the X-axis direction is performed first, and imaging of the alignment mark M on the negative side of the X-axis direction is performed later, but the order is not limited to this and may be reversed.

[0097] Here, the first pattern of the second imaging mode is a pattern in which the first camera 39L and the second camera 39R are used for imaging a pair of alignment marks M. On the other hand, the second pattern of the second imaging mode is a pattern in which only one of the first camera 39L and the second camera 39R is used for imaging a pair of alignment marks M. In the second imaging mode, the control unit 2a selects a pattern with a smaller amount of change in the relative position described above from among the first pattern and the second pattern. That is, when the imaging mode is switched to the second imaging mode, the control unit 2a selects one pattern from the first pattern and the second pattern of the second imaging mode. At this time, the control unit 2a determines whether or not the pitch A between the marks is equal to or greater than the difference between the pitch A between the marks and the minimum pitch Bmin between the images. Then, when the pitch A between the marks is equal to or greater than the difference (that is, when A ≥ Bmin - A), the control unit 2a selects the first pattern, and when the pitch A between the marks is less than the difference (that is, when A < Bmin - A), the control unit 2a selects the second pattern. In the first pattern and the second pattern, the pitch B between the images is adjusted to the minimum pitch Bmin between the images.

[0098] When the selected pattern is the first pattern, the control unit 2a controls the moving mechanism K so that the alignment mark M on the positive side in the X-axis direction of the pair of alignment marks M is positioned above the first camera 39L, as shown in (b) of FIG. 8. Then, the control unit 2a causes the first camera 39L to capture an image of the alignment mark M on the positive side in the X-axis direction. Thereafter, the control unit 2a controls the moving mechanism K to change the above-mentioned relative position, as shown in (c) of FIG. 8. That is, the control unit 2a controls the moving mechanism K so that the alignment mark M on the negative side in the X-axis direction of the pair of alignment marks M is positioned above the second camera 39R. For example, the moving mechanism K moves the crimping tool 34 or the stage 37 to move the crimping target member P held by the crimping tool 34 or the stage 37 to the negative side in the X-axis direction. Alternatively, the moving mechanism K moves the imaging unit 39 to the positive side in the X-axis direction. Then, the control unit 2a causes the second camera 39R to capture an image of the alignment mark M on the negative side in the X-axis direction.

[0099] Thus, in the case of the first pattern, the control unit 2a causes one of the first camera 39L and the second camera 39R to capture an image of one of the pair of alignment marks M, and changes the above-mentioned relative position by controlling the moving mechanism K. After the change in the relative position, the control unit 2a causes the other of the first camera 39L and the second camera 39R to capture an image of the other of the pair of alignment marks M.

[0100] When the selected pattern is the second pattern, the control unit 2a controls the moving mechanism K so that one of the pair of alignment marks M (the alignment mark M on the positive side in the X-axis direction in FIG. 8(d)) is positioned above the first camera 39L, as shown in FIG. 8(d). Then, the control unit 2a causes the first camera 39L to capture an image of the alignment mark M (the alignment mark M on the positive side in the X-axis direction in FIG. 8(d)). Thereafter, the control unit 2a changes the above-mentioned relative position by controlling the moving mechanism K, as shown in FIG. 8(e). That is, the control unit 2a controls the moving mechanism K so that the other of the pair of alignment marks M (the alignment mark M on the negative side in the X-axis direction in FIG. 8(e)) is positioned above the first camera 39L. For example, the moving mechanism K moves the crimping tool 34 or the stage 37, thereby moving the crimping target material P held by the crimping tool 34 or the stage 37 in the X-axis direction (the positive side in the X-axis direction in FIG. 8(e)). Alternatively, the moving mechanism K moves the imaging unit 39 in the X-axis direction (the negative side in the X-axis direction in FIG. 8(e)). Then, the control unit 2a causes the first camera 39L to capture an image of the other side (the alignment mark M on the negative side in the X-axis direction in FIG. 8(e)).

[0101] Thus, in the case of the second pattern, the control unit 2a causes one of the first camera 39L and the second camera 39R to capture one of the pair of alignment marks M, and controls the moving mechanism K to change the relative position. After the relative position is changed, the control unit 2a causes one of the first camera 39L and the second camera 39R to capture the other of the pair of alignment marks M. Note that, in the examples of (d) and (e) of FIG. 8, one of the first camera 39L and the second camera 39R is the first camera 39L, but it may be the second camera 39R. Also, in the examples of (d) and (e) of FIG. 8, the alignment mark M on the positive side of the X-axis direction of the pair of alignment marks M is captured first, and then the alignment mark M on the negative side of the X-axis direction is captured, but the order of capturing images may be reversed.

[0102] In the first pattern, due to the relative position change by the moving mechanism K, the member P to be crimped moves by the above-described difference (i.e., Bmin - A) along the X-axis direction with respect to the imaging unit 39. On the other hand, in the second pattern, due to the relative position change by the moving mechanism K, the member P to be crimped moves by the pitch A between the marks along the X-axis direction with respect to the imaging unit 39. Therefore, when A ≥ Bmin - A, the first pattern is selected, so that the amount of movement, i.e., the amount of relative position change, can be made smaller than that in the second pattern. Also, when A < Bmin - A, the second pattern is selected, so that the amount of movement, i.e., the amount of relative position change, can be made smaller than that in the first pattern.

[0103] FIG. 9 is a flowchart showing an example of the processing operation related to imaging by the control unit 2a in the present embodiment.

[0104] First, the control unit 2a specifies the pitch A between the marks of the member P to be crimped (step S11). Further, the control unit 2a specifies the minimum pitch Bmin between imaging (step S12).

[0105] Then, the control unit 2a determines whether or not the pitch A between the marks is equal to or greater than the minimum pitch Bmin between imaging (step S13). Here, when the control unit 2a determines that the pitch A between the marks is equal to or greater than the minimum pitch Bmin between imaging (Yes in step S13), it causes the moving mechanism K and the imaging unit 39 to perform imaging in the first imaging mode (step S14). That is, a pair of alignment marks M of the member P to be crimped is imaged in the first imaging mode. On the other hand, when the control unit 2a determines that the pitch A between the marks is less than the minimum pitch Bmin between imaging (No in step S13), it causes the moving mechanism K and the imaging unit 39 to perform imaging in the second imaging mode (step S20). That is, a pair of alignment marks M of the member P to be crimped is imaged in the second imaging mode.

[0106] Fig. 10 is a flowchart showing an example of detailed processing operations in the second imaging mode by the control unit 2a in this embodiment. That is, Fig. 10 is a flowchart showing the processing operations of step S20 in Fig. 9 in detail.

[0107] First, the control unit 2a calculates the difference (Bmin-A) by subtracting the inter-mark pitch A from the inter-imaging minimum pitch Bmin (step S21). Then, the control unit 2a determines whether the inter-mark pitch A is equal to or larger than the difference (Bmin-A) (step S22).

[0108] Here, when the control unit 2a determines that the inter-mark pitch A is equal to or greater than the difference (Bmin-A) (Yes in step S22), it causes the moving mechanism K and the imaging unit 39 to perform imaging using the first pattern (step S23). That is, the pair of alignment marks M of the crimping target material P are imaged using the first pattern in the second imaging mode. On the other hand, when the control unit 2a determines that the inter-mark pitch A is less than the difference (Bmin-A) (No in step S22), it causes the moving mechanism K and the imaging unit 39 to perform imaging using the second pattern (step S24). That is, the pair of alignment marks M of the crimping target material P are imaged using the second pattern in the second imaging mode.

[0109] As described above, in the present embodiment, in the second imaging mode, the control unit 2a causes the first camera 39L or the second camera 39R to capture an image of one of the pair of alignment marks M. Then, after capturing an image of one of the pair of alignment marks M, the control unit 2a controls the moving mechanism K to change the relative position between the pair of alignment marks M and the imaging unit 39. Furthermore, after the relative position is changed, the control unit 2a causes the first camera 39L or the second camera 39R to capture an image of the other of the pair of alignment marks M.

[0110] As a result, the pair of alignment marks M are imaged at different times while changing the relative positions between the pair of alignment marks M and the imaging unit 39. Therefore, even if the mark pitch A between the pair of alignment marks M is shorter than the imaging pitch B between the first camera 39L and the second camera 39R, for example, the pair of alignment marks M can be appropriately imaged. As a result, the accuracy of alignment between the component 5 and the board 3 can be improved, and the quality of the mounting board, which is the board 3 to which the component 5 is pressure-bonded, can be improved.

[0111] In the above embodiment, the inter-imaging pitch B is variable, and the imaging mode is switched to the second imaging mode based on the inter-imaging minimum pitch Bmin and the inter-mark pitch A. However, the inter-imaging pitch B may be fixed. In this case, the control unit 2a switches the imaging mode to the second imaging mode when the inter-mark pitch A is different from the inter-imaging pitch B. That is, the above-mentioned inter-imaging minimum pitch Bmin may be replaced with the fixed inter-imaging pitch B. In this case, in step S13 of the flowchart shown in FIG. 9, the control unit 2a determines whether the inter-mark pitch A is the inter-imaging pitch B (step S13). Then, when the inter-mark pitch A is the inter-imaging pitch B, the control unit 2a switches the imaging mode to the first imaging mode (step S14), and when the inter-mark pitch A is not the inter-imaging pitch B, the control unit 2a switches the imaging mode to the second imaging mode (step S20). That is, whether the inter-mark pitch A is longer or shorter than the inter-imaging pitch B, the imaging mode is switched to the second imaging mode. In the flow chart shown in FIG. 10, the control unit 2a subtracts the inter-mark pitch A from the inter-imaging pitch B to calculate the difference (BA) (step S21). Then, the control unit 2a judges whether the inter-mark pitch A is equal to or greater than the difference (BA) (step S22). Here, when the control unit 2a judges that the inter-mark pitch A is equal to or greater than the difference (BA) (Yes in step S22), it causes the moving mechanism K and the imaging unit 39 to perform imaging using the first pattern (step S23). On the other hand, when the control unit 2a judges that the inter-mark pitch A is less than the difference (BA) (No in step S22), it causes the moving mechanism K and the imaging unit 39 to perform imaging using the second pattern (step S24).

[0112] In step S13, when determining whether the inter-mark pitch A is the inter-imaging pitch B, if the difference between the inter-mark pitch A and the inter-imaging pitch B is within a predetermined range, the process may switch to step S14, and if the difference between the inter-mark pitch A and the inter-imaging pitch B exceeds the predetermined range, the process may switch to step S20. In this case, the predetermined range is a difference range in which one and the other of a pair of alignment marks M can be captured in the respective fields of view of the first camera 39L and the second camera 39R, and is, for example, 1 / 2 the size of the field of view when the fields of view of the first camera 39L and the second camera 39R are the same.

[0113] In the present embodiment, the control unit 2a switches the imaging mode between a first imaging mode and a second imaging mode. In the first imaging mode, the control unit 2a causes the imaging unit 39 to capture an image of one of the pair of alignment marks M by the first camera 39L and an image of the other of the pair of alignment marks M by the second camera 39R without changing the relative positions, in a state in which the imaging pitch B is adjusted to the mark pitch A.

[0114] As a result, when the mark pitch A and the imaging pitch B are equal, the pair of alignment marks M can be simultaneously and appropriately imaged by the first camera 39L and the second camera 39R, thereby improving the production throughput of mounting boards.

[0115] Furthermore, in this embodiment, the control unit 2a switches the imaging mode to the first imaging mode when the pitch A between marks is equal to or greater than the minimum pitch Bmin between images, and switches the imaging mode to the second imaging mode when the pitch A between marks is less than the minimum pitch Bmin between images.

[0116] This makes it possible to automatically switch between the first imaging mode and the second imaging mode in accordance with the mark pitch A, thereby improving the efficiency of the work of crimping the component 5.

[0117] In the present embodiment, the control unit 2a selects one of the first and second patterns in the second imaging mode. In the first pattern, the control unit 2a causes one of the first and second cameras 39L and 39R to capture one of the pair of alignment marks M, and after the relative positions change, causes the other of the first and second cameras 39L and 39R to capture the other of the pair of alignment marks M. In the second pattern, the control unit 2a causes one of the first and second cameras 39L and 39R to capture one of the pair of alignment marks M, and after the relative positions change, causes the first and second cameras 39L and 39R to capture the other of the pair of alignment marks M.

[0118] This makes it possible to switch between using both the first camera 39L and the second camera 39R or using only one of them to capture an image of the pair of alignment marks M, thereby increasing the degree of freedom in capturing images.

[0119] Moreover, in this embodiment, the control unit 2a judges whether the inter-mark pitch A is equal to or greater than the difference between the inter-mark pitch A and the inter-imaging minimum pitch Bmin. If the inter-mark pitch A is equal to or greater than the difference, the control unit 2a selects the first pattern, and if the inter-mark pitch A is less than the difference, the control unit 2a selects the second pattern. Furthermore, in the first and second patterns, the inter-imaging pitch B is adjusted to the inter-imaging minimum pitch Bmin.

[0120] This makes it possible to appropriately suppress the amount of change in the relative positions. For example, when the mark pitch A is equal to or greater than the above-mentioned difference, the first camera 39L and the second camera 39R can capture one and the other of the pair of alignment marks M by changing the relative positions by the distance of the difference. That is, the pair of alignment marks M can be captured without changing the relative positions to the distance of the mark pitch A. On the other hand, when the mark pitch A is less than the above-mentioned difference, the pair of alignment marks M can be captured by only one of the first camera 39L and the second camera 39R by changing the relative positions by the distance of the mark pitch A. That is, the pair of alignment marks M can be captured without changing the relative positions to the distance of the difference. Therefore, the pair of alignment marks M can be captured while appropriately suppressing the amount of change in the relative positions according to the mark pitch A.

[0121] (Modification) In the above embodiment, the component supply unit 33 of the temporary pressure bonding unit 30 supplies the components 5 placed on the tray 7, but the components 5 may be punched out from a strip-shaped component storage body such as TCP and then supplied.

[0122] Fig. 11 is a plan view of the component mounting line 1 according to this modified example. Specifically, Fig. 11 shows the configuration of the component mounting line 1 viewed from above.

[0123] The component mounting line 1 according to this modification includes a board carry-in section 10, a bonding section 20, a main pressure-bonding section 40, a board unloading section 50, and a transport section 60, similar to the above embodiment, and further includes a pre-pressure-bonding section 30A instead of the pre-pressure-bonding section 30. In other words, the component pressure-bonding apparatus 100 according to this modification includes the pre-pressure-bonding section 30A and a control section 2a of a computer 2.

[0124] The temporary pressure bonding unit 30A includes a component supply unit 33H instead of the component supply unit 33 of the above embodiment. The component supply unit 33H includes a supply reel 33a around which a strip-shaped component storage body such as TCP (Tape carrier package) is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. The component supply unit 33H sequentially supplies components 5 from the strip-shaped component storage body by the movements of these components.

[0125] Further, the temporary pressure bonding unit 30A includes a component moving unit 35 instead of the tray moving unit 33e. The component moving unit 35 holds the components 5 supplied from the component supply unit 33H and moves them to the pressure bonding tool 34 included in the component mounting mechanism 32.

[0126] The component mounting mechanism 32 is provided on the base 1b, and includes a crimping tool 34 and a support 36. When the component 5 is placed below the crimping tool 34 by the component moving unit 35, the crimping tool 34 descends and rises while suctioning and holding the component 5. The crimping tool 34 then descends and crimps the component 5 onto the target portion of the substrate 3 supported by the support 36.

[0127] The component pressure bonding device 100 in the component mounting line 1 according to this modified example can also achieve the same effects as those of the above embodiment. In this modified example, the moving mechanism K includes a board moving mechanism 31 and an imaging moving mechanism 38.

[0128] (Other variations) Although the component crimping device according to one or more aspects has been described based on the above embodiment and its modified examples, the present disclosure is not limited to the above embodiment and its modified examples. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by a person skilled in the art to the above embodiment and its modified examples, and forms constructed by combining the components of the above embodiment and its modified examples may also be included within the scope of the present disclosure.

[0129] For example, in the above embodiment and its modified examples, the shape of each of the first alignment mark Mb and the second alignment mark Mc is a cross, but the shape is not limited to this and may be another shape.

[0130] Furthermore, in the above embodiment and its modified examples, the substrate 3 is a display panel, and the component 5 is temporarily and permanently pressure-bonded to the display panel, but the substrate 3 may be a substrate other than a display panel.

[0131] In the above embodiment and its modified example, the image of the first alignment mark Mb is captured after the image of the second alignment mark Mc. However, the image of the second alignment mark Mc may be captured after the image of the first alignment mark Mb.

[0132] In the second imaging mode in the above embodiment and its modified example, the pair of alignment marks M are imaged in the order of the alignment mark M on the positive side in the X-axis direction and the alignment mark M on the negative side in the X-axis direction, but they may be imaged in the reverse order. The order of imaging the pair of first alignment marks Mb and the order of imaging the pair of second alignment marks Mc may be reversed. That is, when the pair of first alignment marks Mb are imaged in the order of the first alignment mark Mb on the positive side in the X-axis direction and the first alignment mark Mb on the negative side in the X-axis direction, the pair of second alignment marks Mc may be imaged in the order of the second alignment mark Mc on the negative side in the X-axis direction and the second alignment mark Mc on the positive side in the X-axis direction. The order of imaging the pair of first alignment marks Mb and the order of imaging the pair of second alignment marks Mc may be the same. In other words, when a pair of first alignment marks Mb are imaged in the order of the first alignment mark Mb on the positive side of the X-axis direction and then the first alignment mark Mb on the negative side of the X-axis direction, a pair of second alignment marks Mc may also be imaged in the order of the second alignment mark Mc on the positive side of the X-axis direction and then the second alignment mark Mc on the negative side of the X-axis direction.

[0133] In addition, in the above embodiment and its modified examples, images of a pair of alignment marks M on each of the component 5 and the board 3 are captured, but it is also possible to capture an image of only a pair of alignment marks M on either one of the component 5 or the board 3.

[0134] In the above embodiment and its modified example, the control unit 2a specifies the mark pitch A and the minimum inter-imaging pitch B in order to switch the imaging mode. At this time, the control unit 2a may specify them by reading out the mark pitch A and the minimum inter-imaging pitch Bmin stored in the storage unit 2b. The storage unit 2b may also store data indicating the dimensions of the board 3 of each type and the positions of the pair of first alignment marks Mb for each type of board 3. The storage unit 2b may also store data indicating the dimensions of the component 5 of each type and the positions of the pair of second alignment marks Mc for each type of component 5. In imaging the pair of alignment marks M, the control unit 2a may align the first camera 39L and the second camera 39R with the pair of alignment marks M in the XY plane based on each data stored in the storage unit 2b.

[0135] Moreover, the change in the relative position in the above embodiment and its modified examples may be realized by moving the crimping target member P by the moving mechanism K, or may be realized by moving the imaging unit 39 by the moving mechanism K. Moreover, the change in the relative position may be realized by moving both the crimping target member P and the imaging unit 39 by the moving mechanism K.

[0136] In the above embodiment and its modified example, all or some of the components of the computer 2 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the temporary compression bonding unit 30 to execute each step included in the flowcharts shown in Figures 9 and 10.

[0137] Also, the components of the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, the IC or LSI is referred to as an IC or LSI, but the name may change depending on the degree of integration, and may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose. [Industrial Applicability]

[0138] The present disclosure can be used, for example, in a component pressure bonding device provided in a component mounting line that mounts components on a display panel. [Explanation of symbols]

[0139] 1. Component mounting line 1a, 1b, 1c base 2. Computer 2a Control section 2b Storage section 2c Display section 3. Substrate 4, 6 Electrode part 5 parts 7 Tray 10. Board loading section Stages 11, 23, 37, 49, 51 11a, 23a, 37a, 49a, 51a Adsorption holes 20 Adhesive part 21, 31, 41 Substrate moving mechanism 22 Adhesion mechanism 30, 30A Temporary crimping part 32 Parts mounting mechanism 33, 33H Parts Supply Department 33a Supply reel 33b Punching section 33c Movable stage 33d Rail 33e Tray moving part 34, 43 Crimping tool 34a Tool movement mechanism 35 Parts moving section 36, 46 Lower support 38 Imaging movement mechanism 39 Imaging section 39L First Camera 39R Second Camera 40 Crimping section 42 Crimping mechanism 50 Substrate removal section 60 Conveyor 61 Mobile Base 62A, 62B, 62C, 62D Substrate transport mechanism 63 Base 64 Arm Unit 91 ACF 100 Component crimping device K moving mechanism M Alignment Mark Mb First alignment mark Mc Second alignment mark P Crimping target material

Claims

1. A stage for holding the substrate; an imaging section including a first imaging section and a second imaging section; a crimping tool for holding a component and crimping the component onto the substrate; A moving mechanism that moves at least one of the crimping tool, the stage, and the imaging unit; A control unit that controls the imaging unit, the crimping tool, and the moving mechanism, The control unit is determining whether an inter-imaging pitch, which is a distance between the first imaging unit and the second imaging unit, is adjusted to an inter-mark pitch, which is a distance between a pair of alignment marks on at least one of the board and the component; switching an imaging mode of the pair of alignment marks to a first imaging mode when the mark pitch is the imaging pitch; if the mark pitch is not the imaging pitch, switching the imaging mode to a second imaging mode; The pair of alignment marks are imaged by the imaging unit; By controlling the moving mechanism based on the imaging result by the imaging unit, the component held by the pressure bonding tool and the substrate held by the stage are aligned, and the pressure bonding tool is caused to perform pressure bonding of the component to the substrate; In the second imaging mode, causing the first imaging unit or the second imaging unit to capture an image of one of the pair of alignment marks; After capturing an image of one of the pair of alignment marks, the moving mechanism is controlled to change a relative position between the pair of alignment marks and the imaging unit; After the change in the relative position, causing the first imaging unit or the second imaging unit to image the other of the pair of alignment marks; In the first imaging mode, while the imaging pitch is adjusted to the inter-mark pitch, imaging one of the pair of alignment marks by the first imaging unit and imaging the other of the pair of alignment marks by the second imaging unit are executed by the imaging units without changing the relative positions. Component crimping device.

2. The second imaging mode is a first pattern in which the first imaging unit and the second imaging unit are used to image the pair of alignment marks; a second pattern in which only one of the first imaging unit and the second imaging unit is used to image the pair of alignment marks; The control unit is In the second imaging mode, one of a first pattern and a second pattern is selected; If the selected pattern is a first pattern, causing one of the first imaging unit and the second imaging unit to capture an image of one of the pair of alignment marks; changing the relative position by controlling the moving mechanism; after the change in the relative positions, causing the other of the first imaging unit and the second imaging unit to image the other of the pair of alignment marks; If the selected pattern is a second pattern, causing one of the first imaging unit and the second imaging unit to capture an image of one of the pair of alignment marks; changing the relative position by controlling the moving mechanism; causing one of the first imaging unit and the second imaging unit to capture an image of the other of the pair of alignment marks after the change in the relative position; The component crimping device according to claim 1 .

3. The control unit is In the selection of the pattern, determining whether the inter-mark pitch is equal to or greater than the difference between the inter-mark pitch and the inter-imaging pitch; selecting the first pattern when the mark pitch is equal to or greater than the difference; selecting the second pattern if the mark pitch is less than the difference; The component crimping device according to claim 2 .

4. A stage for holding a substrate; an imaging section including a first imaging section and a second imaging section; a crimping tool for holding a component and crimping the component onto the substrate; A moving mechanism that moves at least one of the crimping tool, the stage, and the imaging unit; A control unit that controls the imaging unit, the crimping tool, and the moving mechanism, The first imaging unit and the second imaging unit The first imaging unit and the second imaging unit are arranged such that an imaging pitch between them is variable, The control unit is determining whether or not a mark pitch, which is a distance between a pair of alignment marks on at least one of the board and the component, is equal to or greater than a minimum inter-imaging pitch, which is a minimum value of the inter-imaging pitch; switching an imaging mode of the pair of alignment marks to a first imaging mode when the inter-mark pitch is equal to or greater than the inter-imaging minimum pitch; switching the imaging mode to a second imaging mode when the inter-mark pitch is less than the inter-imaging minimum pitch; The pair of alignment marks are imaged by the imaging unit; By controlling the moving mechanism based on the imaging result by the imaging unit, the component held by the pressure bonding tool and the substrate held by the stage are aligned, and the pressure bonding tool is caused to perform pressure bonding of the component to the substrate; In the second imaging mode, causing the first imaging unit or the second imaging unit to capture an image of one of the pair of alignment marks; After capturing an image of one of the pair of alignment marks, the moving mechanism is controlled to change a relative position between the pair of alignment marks and the imaging unit; After the change in the relative position, causing the first imaging unit or the second imaging unit to image the other of the pair of alignment marks; In the first imaging mode, while the imaging pitch is adjusted to the inter-mark pitch, imaging one of the pair of alignment marks by the first imaging unit and imaging the other of the pair of alignment marks by the second imaging unit are executed by the imaging units without changing the relative positions. Component crimping device.

5. The second imaging mode is a first pattern in which the first imaging unit and the second imaging unit are used to image the pair of alignment marks; a second pattern in which only one of the first imaging unit and the second imaging unit is used to image the pair of alignment marks; The control unit is In the second imaging mode, one of a first pattern and a second pattern is selected; If the selected pattern is a first pattern, causing one of the first imaging unit and the second imaging unit to capture an image of one of the pair of alignment marks; changing the relative position by controlling the moving mechanism; after the change in the relative positions, causing the other of the first imaging unit and the second imaging unit to image the other of the pair of alignment marks; If the selected pattern is a second pattern, causing one of the first imaging unit and the second imaging unit to capture an image of one of the pair of alignment marks; changing the relative position by controlling the moving mechanism; causing one of the first imaging unit and the second imaging unit to capture an image of the other of the pair of alignment marks after the change in the relative position; The component crimping device according to claim 4.

6. The control unit is In the selection of the pattern, determining whether the inter-mark pitch is equal to or greater than the difference between the inter-mark pitch and the inter-imaging minimum pitch; selecting the first pattern when the mark pitch is equal to or greater than the difference; selecting the second pattern when the mark pitch is less than the difference; In the first pattern and the second pattern, The inter-imaging pitch is adjusted to the inter-imaging minimum pitch. The component crimping device according to claim 5 .

7. A component crimping method in which a component crimping device crimps a component onto a substrate, comprising: The component crimping device includes: a stage for holding the substrate; an imaging section including a first imaging section and a second imaging section; a crimping tool that holds the component and crimps the component onto the substrate; a moving mechanism that moves at least one of the crimping tool, the stage, and the imaging unit; The component crimping method includes: a determination step of determining whether or not an inter-imaging pitch, which is a distance between the first imaging unit and the second imaging unit, is adjusted to a mark-to-mark pitch, which is a distance between a pair of alignment marks on at least one of the board and the component; a switching step of switching an imaging mode of the pair of alignment marks to a first imaging mode when the inter-mark pitch is the inter-imaging pitch, and switching the imaging mode to a second imaging mode when the inter-mark pitch is not the inter-imaging pitch; an imaging step of imaging the pair of alignment marks by the imaging unit; a pressure bonding process in which the moving mechanism aligns the component held by the pressure bonding tool with the substrate held by the stage based on an imaging result by the imaging unit, and the pressure bonding tool pressure bonds the component to the substrate; The imaging step when the imaging mode is the second imaging mode includes: a first step in which the first imaging unit or the second imaging unit images one of the pair of alignment marks; a second step of changing a relative position between the pair of alignment marks and the imaging unit by the moving mechanism after capturing an image of one of the pair of alignment marks; a third step of imaging the other of the pair of alignment marks by the first imaging unit or the second imaging unit after the change in the relative position; The imaging step when the imaging mode is the first imaging mode includes: a fourth step of imaging one of the pair of alignment marks by the first imaging unit and imaging the other of the pair of alignment marks by the second imaging unit, without the moving mechanism changing the relative positions, while the imaging pitch of the imaging unit is adjusted to the mark pitch; Part crimping method.

8. A component crimping method in which a component crimping device crimps a component onto a substrate, comprising: The component crimping device includes: a stage for holding the substrate; an imaging section including a first imaging section and a second imaging section; a crimping tool that holds the component and crimps the component onto the substrate; a moving mechanism that moves at least one of the crimping tool, the stage, and the imaging unit; The first imaging unit and the second imaging unit The first imaging unit and the second imaging unit are arranged such that an imaging pitch between them is variable, The component crimping method includes: a determination step of determining whether or not a mark pitch, which is a distance between a pair of alignment marks on at least one of the board and the component, is equal to or greater than a minimum inter-imaging pitch, which is a minimum value of the inter-imaging pitch; a switching step of switching an imaging mode of the pair of alignment marks to a first imaging mode when the inter-mark pitch is equal to or greater than the inter-imaging minimum pitch, and switching the imaging mode to a second imaging mode when the inter-mark pitch is less than the inter-imaging minimum pitch; an imaging step of imaging the pair of alignment marks by the imaging unit; a pressure bonding process in which the moving mechanism aligns the component held by the pressure bonding tool with the substrate held by the stage based on an imaging result by the imaging unit, and the pressure bonding tool pressure bonds the component to the substrate; The imaging step when the imaging mode is the second imaging mode includes: a first step in which the first imaging unit or the second imaging unit images one of the pair of alignment marks; a second step of changing a relative position between the pair of alignment marks and the imaging unit by the moving mechanism after capturing an image of one of the pair of alignment marks; a third step of imaging the other of the pair of alignment marks by the first imaging unit or the second imaging unit after the change in the relative position; The imaging step when the imaging mode is the first imaging mode includes: a fourth step in which, in a state in which the imaging pitch is adjusted to the inter-mark pitch, the imaging unit images one of the pair of alignment marks by the first imaging unit and the other of the pair of alignment marks by the second imaging unit, without the moving mechanism changing the relative positions; Part crimping method.

Images