Semiconductor Device

Abstract

To prevent an external connection terminal from falling off from a contact component.SOLUTION: An external connection terminal 50 of a semiconductor device has projections 51c formed on four outer surface portions, and the projections 51c are pressed against the inner peripheral surface 31a of a through hole 31c. Therefore, in addition to the four corners of the external connection terminal 50, the projection 51c contacts the inner peripheral surface 31a of the through hole 31c, and the four corners and the projection 51c receive pressure from the inner peripheral surface 31a and are fixed. As a result, when a printed circuit board is attached to the external connection terminal 50, it is possible to prevent the external connection terminal 50 from being excessively inserted into a contact component 30.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a semiconductor device. [Background technology]

[0002] The semiconductor device includes a power device and is used as a power conversion device. Examples of the power device include an IGBT (Insulated Gate Bipolar Transistor) and a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). In the semiconductor device, a semiconductor chip including the power device and an insulating circuit board are sealed with a sealing member. The insulating circuit board has an insulating plate and a circuit pattern formed on the front surface of the insulating plate. A semiconductor chip is disposed on the circuit pattern, and an external connection terminal is disposed via a contact part (see, for example, Patent Document 1). When a signal is applied to the external connection terminal, the signal is input to the semiconductor chip via the contact part and the circuit pattern.

[0003] A printed circuit board is further attached to the external connection terminals. During attachment, vias of the printed circuit board are pressed against the external connection terminals extending upward from the semiconductor device, and the external connection terminals are attached to the vias. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2009 / 0194884 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to be able to handle large currents, the above-mentioned printed circuit board is, for example, configured as a multi-layer board, and the copper plates included therein are made thick. This increases the rigidity of the printed circuit board. When attaching the printed circuit board to an external connection terminal, if the pressing load of the printed circuit board against the external connection terminal becomes greater than the pressing load of the external connection terminal against the contact part, the external connection terminal may penetrate (fall off) the contact part. If the external connection terminal falls off within the contact part, a force is applied to the front surface of the insulating circuit board to which the contact part is attached, damaging the insulating plate, which may deteriorate the insulation properties.

[0006] The present invention has been made in view of the above-mentioned circumstances, and has an object to provide a semiconductor device capable of preventing the external connection terminals from falling off from the contact components. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a semiconductor device comprising: a conductive plate; a contact component having a main body portion having a cylindrical through hole formed therein and including one opening end and the other opening end, the one opening end being joined to the conductive plate; and an external connection terminal having a rectangular prism shape including four outer surface portions extending in the insertion direction, the external connection terminal being inserted into the contact component with its four corners pressed against the inner surface of the through hole, the external connection terminal having protrusions formed on at least a pair of opposing outer surface portions of the four outer surface portions, the protrusions being pressed against the inner surface of the through hole.

[0008] According to one aspect of the present invention, there is provided a contact component including a conductive plate, a main body portion having a cylindrical through hole formed therein and including one open end and the other open end, and a flange formed on at least the one open end of the main body portion, the one open end being joined to the conductive plate, and an external connection terminal having a rectangular column shape extending in an insertion direction and inserted into the contact component with a corner pressed against an inner peripheral surface of the through hole, the contact component having a rectangular column shape extending in an insertion direction and a corner pressed against an inner peripheral surface of the through hole, the one open end being joined to the conductive plate, the one open end being joined to the conductive plate, and the flange formed on at least the one open end of the main body portion and the one open end being joined to the conductive plate, the one open end being joined to the conductive plate, and the external connection terminal having a rectangular column shape extending in an insertion direction and inserted into the contact component with a corner pressed against an inner peripheral surface of the through hole, and The other open end both In the semiconductor device, a thick reinforcing portion is formed in a circumferential direction and protrudes outward from other regions of the main body. Effect of the Invention

[0009] According to the disclosed technique, the external connection terminals are prevented from falling off from the contact components, which prevents damage to the semiconductor device and suppresses deterioration of the reliability of the semiconductor device. [Brief description of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view of a semiconductor device according to a first embodiment. [Diagram 2] 1 is a plan view of an insulating circuit substrate included in the semiconductor device of the first embodiment. [Diagram 3] 2A to 2C are diagrams for explaining contact components included in the semiconductor device according to the first embodiment. [Figure 4] 2 is a diagram for explaining an external connection terminal included in the semiconductor device according to the first embodiment. FIG. [Diagram 5] 2 is a plan sectional view for explaining an external connection terminal included in the semiconductor device of the first embodiment. FIG. [Figure 6] 2 is a side cross-sectional view of a contact component included in the semiconductor device according to the first embodiment before an external connection terminal is press-fitted into the contact component. FIG. [Figure 7] 4 is a side cross-sectional view of the semiconductor device according to the first embodiment after an external connection terminal is press-fitted into a contact component included in the semiconductor device. FIG. [Figure 8] 1 is a first cross-sectional plan view of the semiconductor device according to the first embodiment after an external connection terminal is press-fitted into a contact component included in the semiconductor device; [Figure 9] 13 is a second cross-sectional plan view of the semiconductor device according to the first embodiment after the external connection terminal is press-fitted into the contact component; FIG. [Figure 10] 13A to 13C are diagrams for explaining contact components included in a semiconductor device according to a second embodiment. [Figure 11]13 is a diagram for explaining an external connection terminal included in a semiconductor device according to a second embodiment. FIG. [Figure 12] 13 is a side cross-sectional view of a contact component included in a semiconductor device according to a second embodiment before an external connection terminal is press-fitted into the contact component. FIG. [Figure 13] 13 is a side cross-sectional view of the semiconductor device according to the second embodiment after an external connection terminal is press-fitted into a contact component included in the semiconductor device; FIG. [Figure 14] 13A to 13C are diagrams for explaining contact components included in a semiconductor device according to a first modified example of the second embodiment. [Figure 15] 13A to 13C are diagrams for explaining contact components included in a semiconductor device according to a second modification of the second embodiment. [Figure 16] 13 is a side cross-sectional view of a contact component included in a semiconductor device according to a third embodiment before an external connection terminal is press-fitted into the contact component. FIG. [Figure 17] 13 is a side cross-sectional view of a contact component included in the semiconductor device according to the third embodiment after an external connection terminal is press-fitted into the contact component. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiment will be described with reference to the drawings. In the following description, the terms "front surface" and "upper surface" refer to the surface facing upward (+Z direction) in the semiconductor device 1 of FIG. 1. Similarly, "up" refers to the upward (+Z direction) direction in the semiconductor device 1 of FIG. 1. The terms "rear surface" and "lower surface" refer to the surface facing downward (-Z direction) in the semiconductor device 1 of FIG. 1. Similarly, "lower" refers to the downward (-Z direction) direction in the semiconductor device 1 of FIG. 1. Similar orientations are used in other drawings as necessary. The terms "front surface", "upper surface", "upper", "rear surface", "lower surface", "lower", and "side surface" are merely convenient expressions for identifying relative positional relationships and do not limit the technical idea of ​​the present invention. For example, "upper" and "lower" do not necessarily mean a vertical direction relative to the ground. In other words, the directions of "upper" and "lower" are not limited to the direction of gravity. In the following description, the term "main component" refers to a component that is contained in an amount of 80 vol% or more of the entire component.

[0012] [First embodiment] A semiconductor device 1 according to a first embodiment will be described with reference to Figs. 1 and 2. Fig. 1 is a cross-sectional view of the semiconductor device according to the first embodiment, and Fig. 2 is a plan view of an insulating circuit board included in the semiconductor device according to the first embodiment. Fig. 2 shows a plan view of the semiconductor device 1 of Fig. 1 with a sealing member 43, a case 40, and a printed circuit board 60 removed. In this embodiment, the multiple circuit patterns 12, the first and second semiconductor chips 20 and 21, the multiple contact components 30, the multiple bonding wires 15, and the multiple external connection terminals 50 will be described with the same reference numerals without distinction between them. Other configurations will also be described with the same reference numerals without distinction between them when there are multiple configurations.

[0013] As shown in FIG. 1 and FIG. 2, the semiconductor device 1 has an insulating circuit board 10, and first and second semiconductor chips 20, 21 and an electronic component 23 bonded to the front surface of the insulating circuit board 10. The semiconductor device 1 has a contact component 30 bonded to the front surface of the insulating circuit board 10. The first and second semiconductor chips 20, 21, the electronic component 23, and the contact component 30 are bonded to the front surface of the insulating circuit board 10 via a bonding member (not shown). The semiconductor device 1 also has a bonding wire 15 that electrically connects the front surface of the insulating circuit board 10 to the main electrodes of the first and second semiconductor chips 20, 21. An external connection terminal 50 is press-fitted into the contact component 30. In the semiconductor device 1, these are covered by a case 40. The case 40 is bonded to the outer periphery of the insulating plate 11 of the insulating circuit board 10 via an adhesive 41a. The tip of the external connection terminal 50 extends upward (in the +Z direction) from the case 40. In addition, the inside of the case 40 of the semiconductor device 1 is sealed with a sealing member 43. Furthermore, the semiconductor device 1 includes a printed circuit board 60. The printed circuit board 60 is attached to an external connection terminal 50 extending upward from the case 40.

[0014] The insulating circuit board 10 includes an insulating plate 11, a plurality of circuit patterns 12 provided on the front surface of the insulating plate 11, and a metal plate 13 provided on the back surface of the insulating plate 11. The insulating plate 11 and the metal plate 13 are rectangular in plan view. The insulating plate 11 and the metal plate 13 may have corners chamfered in an R-shape or a C-shape. The size of the metal plate 13 is smaller than the size of the insulating plate 11 in plan view, and is formed inside the insulating plate 11. The insulating plate 11 is made of a material having insulation properties and excellent thermal conductivity. Such an insulating plate 11 is made of ceramics or insulating resin. The ceramics are aluminum oxide, aluminum nitride, silicon nitride, etc. The insulating resin is a paper phenol board, a paper epoxy board, a glass composite board, a glass epoxy board, etc. The thickness of the insulating plate 11 is 0.2 mm or more and 2.5 mm or less.

[0015] The circuit patterns 12 are made of a metal having excellent electrical conductivity. Such a metal is, for example, copper, aluminum, or an alloy containing at least one of these as a main component. The thickness of the circuit patterns 12 is 0.1 mm or more and 2.0 mm or less. The surfaces of the circuit patterns 12 may be plated to improve corrosion resistance. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy. The circuit patterns 12 for the insulating plate 11 are obtained by forming a metal layer on the front surface of the insulating plate 11 and subjecting the metal layer to a process such as etching. Alternatively, the circuit patterns 12 cut out in advance from the metal layer may be pressure-bonded to the front surface of the insulating plate 11. The circuit patterns 12 shown in FIG. 2 are an example. The number, shape, size, etc. of the circuit patterns 12 may be appropriately selected as necessary.

[0016] The metal plate 13 has an area smaller than that of the insulating plate 11, is larger than the area of ​​the region where the circuit pattern 12 is formed, and is rectangular like the insulating plate 11. The corners may be chamfered in an R shape or a C shape. The metal plate 13 is smaller than the size of the insulating plate 11, and is formed on the entire surface of the insulating plate 11 except for the edge portion. The metal plate 13 is mainly composed of a metal having excellent thermal conductivity. The metal is, for example, copper, aluminum, or an alloy containing at least one of these. The thickness of the metal plate 13 is 0.1 mm or more and 2.5 mm or less. In order to improve the corrosion resistance of the metal plate 13, a plating process may be performed. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy.

[0017] Examples of the insulating circuit board 10 having such a configuration include a DCB (Direct Copper Bonding) board, an AMB (Active Metal Brazed) board, and a resin insulating board. A cooling unit (not shown) may be attached to the metal plate 13 of the insulating circuit board 10 via a thermal interface material. This can improve the heat dissipation of the semiconductor device 1. The thermal interface material is a general term for various materials such as thermally conductive grease, elastomer sheet, RTV (Room Temperature Vulcanization) rubber, gel, and phase change material. is The grease is, for example, silicone mixed with a metal oxide filler. In this case, the cooling unit is made of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these materials, which have excellent thermal conductivity. As the cooling unit, a heat sink made of one or more fins, a water-cooling cooling device, or the like can be used.

[0018] The bonding wires 15 appropriately electrically connect between the first and second semiconductor chips 20, 21 and the circuit pattern 12, or between a plurality of first and second semiconductor chips 20, 21. Such bonding wires 15 are made of a material with excellent conductivity. The material is, for example, gold, silver, copper, aluminum, or an alloy containing at least one of these. The diameter of the control bonding wires 15 is, for example, 110 μm or more and 400 μm or less. Alternatively, the diameter of the main current bonding wires 15 may be, for example, 300 μm or more and 500 μm or less.

[0019] The first semiconductor chip 20 includes a power device element made of silicon or silicon carbide. The power device element is a switching element. The switching element is, for example, an IGBT or a power MOSFET. Such a first semiconductor chip 20 includes, for example, a drain electrode (or a collector electrode) as a main electrode on the back surface, and a gate electrode and a source electrode (or an emitter electrode) as a control electrode and a main electrode on the front surface.

[0020] The second semiconductor chip 21 is a diode element made of silicon or silicon carbide. The diode element is, for example, an FWD (Free Wheeling Diode) such as an SBD (Schottky Barrier Diode) or a PiN (P-intrinsic-N) diode. Such a second semiconductor chip 21 has a cathode electrode as a main electrode on the back surface and an anode electrode as a main electrode on the front surface. The thickness of the first and second semiconductor chips 20 and 21 is, for example, 50 μm or more and 220 μm or less.

[0021] Also, an RC (Reverse-Conducting)-IGBT having both the functions of an IGBT and an FWD may be used instead of the first and second semiconductor chips 20 and 21. Also, instead of the first and second semiconductor chips 20 and 21, for example, a lead frame, external connection terminals (pin terminals, contact components, etc.), and electronic components (thermistors, current sensors) may be arranged as necessary.

[0022] The electronic components 23 include, for example, a capacitor, a resistor, a thermistor, a current sensor, and a control IC (Integrated Circuit). One or more electronic components 23 may be arranged on the circuit pattern 12 to obtain a desired function in the semiconductor device 1. The electronic components 23 may also be used in appropriate combination to achieve the function.

[0023] The first and second semiconductor chips 20 and 21 have their rear surfaces mechanically and electrically bonded to a predetermined circuit pattern 12 via a bonding member (not shown). The bonding member is solder or a metal sintered body. Lead-free solder is used as the solder. Lead-free solder is mainly composed of an alloy containing at least two of tin, silver, copper, zinc, antimony, indium, and bismuth. Furthermore, the solder may contain additives. The additives are, for example, nickel, germanium, cobalt, or silicon. The solder contains additives, which improves wettability, gloss, and bonding strength, thereby improving reliability. The metal used in the metal sintered body is, for example, silver.

[0024] The contact component 30 is often provided via solder to the circuit pattern 12 on the outer edge side of the insulating plate 11 among the multiple circuit patterns 12. On the other hand, the first and second semiconductor chips 20, 21 are often disposed via solder to the circuit pattern 12 on the inner side of the circuit pattern 12 on the outer edge side among the multiple circuit patterns 12. Such a contact component 30 comprises a main body portion having a cylindrical through hole formed therein, Main unitand a flange provided at each of the open ends of the contact component 30. The contact component 30 is made of a metal having excellent electrical conductivity. Such metal is, for example, silver, copper, nickel, or an alloy containing at least one of these. A plating film may be formed on the surface of the contact component 30 by plating to improve corrosion resistance. The plating material used for the plating film is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy. Details of the contact component 30 will be described later.

[0025] The contact component 30 has one open end mechanically and electrically bonded to a predetermined circuit pattern 12 via a bonding member (not shown). The contact component 30 is arranged so that the through hole is perpendicular to the front surface of the circuit pattern 12. The bonding member is solder or a metal sintered body. Lead-free solder is used as the solder. Lead-free solder is mainly composed of an alloy containing at least two of tin, silver, copper, zinc, antimony, indium, and bismuth. The solder may further contain an additive. The additive is, for example, nickel, germanium, cobalt, or silicon. The solder contains an additive, which improves wettability, gloss, and bonding strength, thereby improving reliability. The metal used in the metal sintered body is, for example, silver or a silver alloy.

[0026] The external connection terminal 50 includes a prismatic body and a truncated cone-shaped tip provided at each end of the body. The external connection terminal 50 is press-fitted into the through hole from the other open end side of the contact component 30 opposite to the side joined to the circuit pattern 12. The external connection terminal 50 is arranged parallel to the through hole of the contact component 30. Therefore, the external connection terminal 50 is arranged perpendicular to the front surface of the circuit pattern 12. The external connection terminal 50 is made of a metal having excellent electrical conductivity. Such a metal is, for example, silver, copper, nickel, or an alloy containing at least one of these. A plating film may be formed on the surface of the external connection terminal 50 by plating to improve corrosion resistance. The plating material used for the plating film is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy. The external connection terminal 50 will be described in detail later.

[0027] The case 40 has an outer casing 41 and an upper lid 42. The outer casing 41 surrounds the insulating circuit board 10. The outer casing 41 is a box-shaped member having a substantially rectangular shape in a plan view. Fixing holes (not shown) are formed at the four corners of the outer casing 41 in a plan view. The fixing holes are holes penetrating the outer casing 41 from the front surface to the back surface. The upper lid 42 covers the upper opening of the outer casing 41 and is attached integrally to the outer casing 41. In addition, an insertion hole 42a is formed in the upper lid 42 in correspondence with the external connection terminal 50. Such a case 40 is made of a thermoplastic resin. Such a resin is made mainly of a thermoplastic resin. The thermoplastic resin is, for example, a polyphenylene sulfide resin, a polybutylene terephthalate resin, a polybutylene succinate resin, a polyamide resin, or an acrylonitrile butadiene styrene resin.

[0028] The sealing member 43 seals the inside of the case 40 to a height that can seal at least the first and second semiconductor chips 20, 21, the contact components 30, and the bonding wires 15. The sealing member 43 may be, for example, a silicone gel. The sealing member 43 may be, for example, a thermosetting resin. and fever Contained in hardening resin Filler ( Filler ) The thermosetting resin is, for example, an epoxy resin, a phenolic resin, or a maleimide resin. Filler The sealing member 43 is, for example, silicon oxide, aluminum oxide, boron nitride, or aluminum nitride. Tofu The filler may be, for example, silicon dioxide, aluminum oxide, boron nitride, or aluminum nitride.

[0029] The printed circuit board 60 includes an insulating plate and a plurality of circuit patterns formed on at least one of the front surface and the back surface of the insulating plate. The printed circuit board 60 has vias 61, which are a plurality of through holes penetrating from the front surface to the back surface, formed at positions corresponding to the external connection terminals 50 of the semiconductor device 1. The insulating plate is flat and made of an insulating material. Such a material is used by soaking a base in resin. For example, paper, glass cloth, or glass nonwoven cloth is used for this base. For example, phenol resin, epoxy resin, or polyimide resin is used for the resin. Specific examples of the insulating plate include a paper phenol board, a paper epoxy board, a glass epoxy board, a glass polyimide board, and a glass composite board. Such an insulating plate is also rectangular in plan view. The corners of the insulating plate may be chamfered into an R shape or a C shape. The circuit pattern has a plurality of pattern shapes so as to form a predetermined circuit. The circuit pattern is made of a material with excellent conductivity. Such materials include, for example, silver, copper, nickel, or an alloy containing at least one of these. The surfaces of the upper circuit pattern and the lower circuit pattern may be plated to improve corrosion resistance. Materials used in this plating process include nickel, nickel-phosphorus alloy, nickel-boron alloy, etc. Furthermore, the vias 61 are electrically connected to at least one of the upper circuit pattern and the lower circuit pattern as appropriate. In the semiconductor device 1, the external connection terminals 50 are press-fitted into the vias 61 of the printed circuit board 60. As a result, the printed circuit board 60 and the semiconductor device 1 are electrically connected to each other.

[0030] Next, the contact component 30 included in the semiconductor device 1 will be described with reference to Fig. 3. Fig. 3 is a diagram for explaining the contact component included in the semiconductor device of the first embodiment. Fig. 3(A) is a plan view of the opening end 31c1 side of Fig. 3(B). Fig. 3(B) is a cross-sectional view along the dashed line XX of Fig. 3(A).

[0031] The contact component 30 includes a main body 31 and flanges 32 and 33 provided at the opening ends 31c1 and 31c2 of the main body 31, respectively. The main body 31 has a cylindrical through hole 31c formed therein, and includes an inner peripheral surface 31a and an outer peripheral surface 31b. The inner diameter B1 of the through hole 31c is, for example, 0.2 mm or more and 2.0 mm or less. The thickness T1 of the main body 31 is, for example, 50 μm or more and 0.5 mm or less. The flanges 32 and 33 are formed at the opening ends 31c1 and 31c2 of the through hole 31c of the main body 31, respectively. The outer diameter B2 of the flanges 32 and 33 is longer than the inner diameter B1, and is, for example, 1.0 mm or more and 4.0 mm or less. The width T2 of the flanges 32, 33 from the through hole 31c of the main body 31 is the difference between the outer diameter B2 and the inner diameter B1 of the flanges 32, 33, and is, for example, 0.8 mm or more and 2.0 mm or less. The thickness H2 of the flanges 32, 33 may be the same as the thickness T1 of the main body 31, and is, for example, 50 μm or more and 0.5 mm or less. The height H1 of the contact component 30 is a height that fits within a predetermined insertion range of the external connection terminal 50, and is, for example, 2.0 mm or more and 20 mm or less.

[0032] In such a contact component 30, one opening end 31c2 is joined to the circuit pattern 12, and the external connection terminal 50 is inserted from the other opening end 31c1 opposite to the one opening end 31c2. Therefore, the external connection terminal 50 is inserted into the contact component 30 along the insertion direction I from the opening end 31c1 to the opening end 31c2.

[0033] Next, the external connection terminal 50 included in the semiconductor device 1 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a diagram for explaining the external connection terminal included in the semiconductor device of the first embodiment, and Fig. 5 is a plan sectional view for explaining the external connection terminal included in the semiconductor device of the first embodiment. Fig. 5 is a sectional view taken along dashed line XX in Fig. 4.

[0034] The external connection terminal 50 includes a body portion 51 and tip portions 52 and 53. The insertion direction I of the external connection terminal 50 is a direction from the tip portion 52 to the tip portion 53. The body portion 51 has a prismatic (quadratic) shape. The body portion 51 is surrounded on all four sides by four outer surface portions 51b, and includes four corner portions 51a where the outer surface portions 51b are joined. In addition, the four corner portions 51a are chamfered in an R shape as shown in FIG. 5. In such a body portion 51, the length A1 of the opposing corner portions 51a is larger than the inner diameter B1 of the contact component 30, and may be 120% or less of the inner diameter B1. For example, it is 0.2 mm or more and 2.4 mm or less.

[0035] Protrusions 51c are formed on the four outer surface portions 51b of the body portion 51 along the insertion direction I. The protrusions 51c are formed at the center of the outer surface portions 51b in the width direction (perpendicular to the insertion direction I). That is, the protrusions 51c have an elongated sliding surface 51c1 along the insertion direction I. The length L of the protrusions 51c in the insertion direction I is shorter than the height H1 of the contact component 30. Preferably, the length L of the protrusions 51c is 30% or more and 80% or less of the height H1 of the contact component 30. For example, it is 0.6 mm or more and 16 mm or less. Therefore, when the external connection terminal 50 is inserted into the contact component 30, the end portion on the tip portion 53 side of the protrusions 51c becomes , open The end of the protruding portion 51c on the tip end 52 side is located on the opening end 31c1 side from the mouth end 31c2. , open It is located on the opening end 31c2 side from the mouth end 31c1. That is, the end of the protrusion 51c on the tip 53 side and the end on the tip 52 side are located between the first opening end 31c2 and the second opening end 31c1 in a side view. At this time, the external connection terminal 50 is inserted into the contact component 30 without the tip 53 protruding from the opening end 31c2.

[0036] Moreover, the height of the protruding portion 51c from the outer surface portion 51b decreases at least toward the tip portion 53 in the insertion direction I. In the case of FIG. 4, the height of the protruding portion 51c from the outer surface portion 51b also decreases toward the tip portion 52. That is, the protruding portion 51c has a curved surface shape that describes a gentle arch. The highest position of the sliding surface 51c1 of the protruding portion 51c may be the center of the sliding surface 51c1 in the insertion direction I, or may be shifted from the center toward the tips 52, 53.

[0037] In addition, the corners on both sides in the width direction of the sliding surface 51c1 of the protrusion 51c are chamfered in an R shape as shown in FIG. 5, similarly to the body portion 51. The length A3 of the opposing sliding surface 51c1 of such a protrusion 51c, which is the highest from the outer surface portion 51b, is, for example, 0.2 mm or more and 2.4 mm or less. The length A3 of the protrusion 51c is formed to be approximately equal to the length A1. The length A3 may be the same as the length A1 between the opposing corners 51a, or may be 90% or more and 110% or less of the length A1. Furthermore, the length A3 of the sliding surface 51c1 may be larger than the inner diameter B1 of the contact component 30 and 120% or less of the inner diameter B1. The body portion 51 on which the protrusion 51c is formed is formed, for example, by drawing. A die including a die hole in which a shape corresponding to the protrusion 51c is formed is used. The protrusion 51c formed on the outer surface 51b of the body 51 pulled from the die hole is cut and polished to form the protrusion 51c on the body 51. As shown in Fig. 5, the protrusion 51c has a rectangular shape. The shape of the protrusion 51c is not limited to a rectangular shape, and the sliding surface 51c1 may be arched. The protrusion 51c may also have a triangular shape.

[0038] The tip parts 52 and 53 are provided at both ends of the body part 51. The tip parts 52 and 53 are each formed in a truncated cone shape. That is, the tip parts 52 and 53 have tapered surfaces 52a and 53a that form side surfaces whose diameters decrease in the vertical direction of the external connection terminal 50. Furthermore, the diameter A4 of the tip surface (upper surface) of the tip parts 52 and 53 is shorter than the diameter A2 of the bottom surface opposite the upper surface. Such tip parts 52 and 53 may be joined to both ends of the body part 51 by heat, adhesive, or welding. Alternatively, the tip parts 52 and 53 may be formed by grinding, turning, cutting, or the like at both ends of the body part 51.

[0039] Next, the press-fitting of the external connection terminal 50 into the contact component 30 will be described with reference to Figs. 6 to 9. Fig. 6 is a side cross-sectional view before the external connection terminal is press-fitted into the contact component included in the semiconductor device of the first embodiment, and Fig. 7 is a side cross-sectional view after the external connection terminal is press-fitted into the contact component included in the semiconductor device of the first embodiment. Figs. 8 and 9 are plan cross-sectional views after the external connection terminal is press-fitted into the contact component included in the semiconductor device of the first embodiment. Note that in Figs. 6 and 7, the circuit pattern 12 on which the contact component 30 is provided is omitted. Also, in Figs. 6 and 7, at least the components required for the description are given reference numerals. Figs. 8 and 9 show cross-sectional views taken along the dashed line XX in Fig. 7.

[0040] First, as shown in FIG. 6, the external connection terminal 50 is inserted from the tip 53 into the opening end 31c1 of the through hole 31c of the contact component 30. At this time, the tip 53 can be easily inserted into the opening end 31c1 of the through hole 31c because the tapered surface 53a is formed. Then, the external connection terminal 50 is further inserted toward the opening end 31c2 along the insertion direction I. At this time, the sliding surface 51c1 of the protruding portion 51c is curved. Therefore, the protruding portion 51c of the external connection terminal 50 advances in the insertion direction I while sliding through the through hole 31c. At this time, the corner portion 51a of the external connection terminal 50 also advances in the insertion direction I while sliding through the through hole 31c.

[0041] Then, when the protrusion 51c of the external connection terminal 50 advances in the insertion direction I while sliding on the inner peripheral surface 31a of the through hole 31c, the highest part of the sliding surface 51c1 of the protrusion 51c from the outer surface 51b fits into the inner peripheral surface 31a of the through hole 31c. Then, the advancement of the external connection terminal 50 in the insertion direction I into the through hole 31c stops. That is, at this time, as shown in FIG. 8, the sliding surfaces 51c1 of the four protrusions 51c of the body part 51 are pressed against the inner peripheral surface 31a of the through hole 31c. Also, the four corners 51a of the body part 51 are pressed against the inner peripheral surface 31a of the through hole 31c and crushed. That is, the four corners 51a and the four protrusions 51c of the body part 51 contact the inner peripheral surface 31a of the through hole 31c. This increases the contact area with the inner circumferential surface 31a of the through hole 31c compared to when the protrusions 51c are not present. That is, the body 51 is pressed from the inner circumferential surface 31a of the through hole 31c at the four protrusions 51c in addition to the four corners 51a. Therefore, the external connection terminal 50 is securely fixed to the inner circumferential surface 31a of the through hole 31c of the contact component 30 by press-fitting the protrusions 51c in addition to the corners 51a.

[0042] When the external connection terminal 50 is inserted and fixed in the contact component 30 as described above, the dimensions at the position where the external connection terminal 50 is fitted in the contact component 30 are configured so that length A3 ≈ length A1 > inner diameter B1, as shown in FIG. 8. Since the contact component 30 and the external connection terminal 50 have such dimensions, the four corners 51a and four protrusions 51c of the external connection terminal 50 contact the inner circumferential surface 31a of the through hole 31c, and the four corners 51a and four protrusions 51c are pressed from the inner circumferential surface 31a and fixed. Therefore, when the printed circuit board 60 is attached to the external connection terminal 50, it is possible to prevent the external connection terminal 50 from being inserted too far into the contact component 30. Therefore, a certain pressing load is ensured to insert the external connection terminal 50 into the contact component 30. Therefore, by pressing the external connection terminals 50 against the contact parts 30 with a constant pressing load, the external connection terminals 50 can be reliably pressed into the contact parts 30, and the height of the external connection terminals 50 can be made uniform. circuitThe substrate can be attached reliably and safely, and the occurrence of damage to the semiconductor device 1 can be reduced.

[0043] In the above case, the length A3≈length A1 may be longer than the inner diameter B1, or depending on the material of the external connection terminal 50 and the contact component 30, the regions of the main body 31 of the contact component 30 corresponding to the four corners 51a and the four protrusions 51c of the external connection terminal 50 may be raised outward as shown in Fig. 9. That is, the outer peripheral surface 31b of the main body 31 of the contact component 30 is raised outward more than the other portions in the portions corresponding to the four corners 51a and the protrusions 51c of the external connection terminal 50 inserted into the through hole 31c. Even in this case, as in Fig. 8, the four corners 51a and the four protrusions 51c of the external connection terminal 50 contact the inner peripheral surface 31a of the through hole 31c, and the four corners 51a and the four protrusions 51c are fixed by pressure from the inner peripheral surface 31a. Furthermore, when mounting the printed circuit board 60 to the external connection terminals 50, excessive insertion of the external connection terminals 50 into the contact components 30 can be suppressed.

[0044] The semiconductor device 1 includes a circuit pattern 12, a contact component 30 having a main body 31 with a cylindrical through hole 31c formed therein and including one opening end 31c2 and the other opening end 31c1, the one opening end 31c2 being joined to the circuit pattern 12, and an external connection terminal 50 having a rectangular prism shape including four outer surface portions 51b extending in the insertion direction I and inserted into the contact component 30 with four corner portions 51a pressed against the inner peripheral surface 31a of the through hole 31c. Furthermore, the external connection terminal 50 has protrusions 51c formed on the four outer surface portions 51b, respectively, and the protrusions 51c are pressed against the inner peripheral surface 31a of the through hole 31c. Therefore, the external connection terminal 50 has the protrusions 51c in addition to the four corner portions 51a in contact with the inner peripheral surface 31a of the through hole 31c, and is fixed by pressure applied from the inner peripheral surface 31a to the four corner portions 51a and the protrusions 51c. As a result, when mounting the printed circuit board 60 to the external connection terminals 50 , excessive insertion of the external connection terminals 50 into the contact components 30 can be suppressed.

[0045] The protrusions 51c formed on such an external connection terminal 50 are preferably formed on at least a pair of opposing outer surface portions 51b among the four outer surface portions 51b of the body portion 51 in order to increase the contact area with the inner peripheral surface 31a of the through hole 31c. Therefore, the opposing outer surface portions 51b among the four of the body portion 51 are sandwiched by the inner peripheral surface 31a of the through hole 31c. Moreover, the protrusions 51c are not limited to a shape elongated along the insertion direction I with respect to the outer surface portions 51b. In other cases, the protrusions 51c may be formed one by one in a semi-spherical shape with respect to the outer surface portions 51b of the body portion 51. Moreover, by making the width of the protrusions 51c wider (in the direction perpendicular to the insertion direction I) than in the case of FIG. 8, the contact area with the inner peripheral surface 31a of the through hole 31c is also increased, so that the external connection terminal 50 is more reliably fixed to the through hole 31c.

[0046] [Second embodiment] In the second embodiment, unlike the first embodiment, a new configuration is added to the contact component 30, not to the external connection terminal 50, to obtain the same effect as the first embodiment. The external connection terminal 50 and the contact component 30 of the second embodiment are mainly described in terms of differences from those of the first embodiment. In addition, in the second embodiment, the semiconductor device 1 can be applied to the components other than the contact component and the external connection terminal. FIG. 10 is a diagram for explaining the contact component included in the semiconductor device of the second embodiment. FIG. 11 is a diagram for explaining the external connection terminal included in the semiconductor device of the second embodiment. FIG. 10(A) is a cross-sectional view taken along the dashed line ZZ in FIG. 10(B). FIG. 10(B) is a cross-sectional view taken along the dashed line YY in FIG. 10(A).

[0047] The contact component 30 of the second embodiment shown in FIG. 10 includes a main body 31 and flanges 32 and 33 provided at the opening ends 31c1 and 31c2 of the main body 31, respectively, in the same manner as the first embodiment. The dimensions are also similar to those of the main body 31 and the flanges 32 and 33 of the first embodiment. Furthermore, the contact component 30 of the second embodiment includes reinforcing parts 34 and 35. The reinforcing parts 34 and 35 are formed in at least one of the opening ends 31c1 and 31c2 of the main body 31, protruding outward (XY plane) from other regions of the main body 31, and are formed thick in an annular shape along the circumferential direction. Moreover, the reinforcing parts 34 and 35 are connected to the flanges 32 and 33 along the circumferential direction together with the main body 31 at the opening ends 31c1 and 31c2. In the second embodiment, the reinforcing parts 34 and 35 are formed at both the opening ends 31c1 and 31c2, respectively. The height H3 of the reinforcing parts 34, 35 in the Z direction is 10% or more and 30% or less of the height H1 of the contact component 30. For example, it is 0.2 mm or more and 6.0 mm or less. The thickness T3 of the reinforcing parts 34, 35 in the XY plane is larger than the thickness T1 of the main body part 31 and smaller than the width T2 of the flanges 32, 33. Preferably, the thickness T3 of the reinforcing parts 34, 35 may be 150% or more of the thickness T1 of the main body part 31 and 80% or less of the width T2 of the flanges 32, 33. For example, it is 75 μm or more and 1.6 mm or less.

[0048] Here, the difference between the flanges 32, 33 and the reinforcing parts 34, 35 formed on the contact component 30 will be described. The flanges 32, 33 prevent the contact component 30 from falling over when the contact component 30 is joined to the circuit pattern 12 by a joining member. Furthermore, by providing the flanges 32, 33 on the contact component 30, the joining area of ​​the contact component 30 to the circuit pattern 12 can be increased. Therefore, the joining strength between the contact component 30 and the circuit pattern 12 is improved. In order to perform such a function, the outer diameter B2 of the flanges 32, 33 must be 50% or more of the height H1 of the contact component 30. Furthermore, the width T2 of the flanges 32, 33 must be 2.5 times or more the thickness T1 of the main body part 31 of the contact component 30. Such flanges 32, 33 are formed by pressing the cylindrical main body part 31. Therefore, the height H2 of the flanges 32, 33 is smaller than the thickness T1 of the main body part 31. Therefore, the height H2 of the flanges 32, 33 is less than 0.4 times the width T2.

[0049] On the other hand, the reinforcing parts 34, 35 are formed at the opening ends 31c1, 31c2 of the contact component 30 (main body 31), so that the opening ends 31c1, 31c2 of the main body 31 are less likely to expand. Therefore, when an external connection terminal 50 is inserted into the contact component 30 on which the reinforcing parts 34, 35 are formed, the external connection terminal 50 receives a larger pressure at the positions of the reinforcing parts 34, 35 of the contact component 30 than at other positions. The thickness T3 of the reinforcing parts 34, 35 is required to be 1.1 times or more and less than 2.5 times the thickness T1 of the main body, and more preferably 1.5 times or more and 2.0 times or less. The height H3 of the reinforcing parts 34, 35 is required to be greater than the thickness T1 of the main body 31 and to be 0.5 times or more and less than 4.0 times the thickness T3 of the reinforcing parts 34, 35.

[0050] Therefore, the flanges 32, 33 are required to have a height H2 as small as possible and a width T2 as large as possible. On the other hand, the reinforcing parts 34, 35 may have a thickness T3 smaller than the width T2 of the flanges 32, 33 to some extent, and the height H3 is equal to or larger than the height H of the flanges 32, 33. 2.It is necessary that the thickness be sufficiently larger than the thickness T1.

[0051] An external connection terminal 50 of the second embodiment shown in Fig. 11 includes a prismatic body portion 51 and truncated cone-shaped tip portions 52, 53, similar to the first embodiment. The dimensions are also similar to those of the body portion 51 and tip portions 52, 53 of the first embodiment. However, in the second embodiment, no protrusions 51c are provided on a pair of opposing outer surface portions 51b of the body portion 51. Also in the second embodiment, the length A1 of the external connection terminal 50 is several percent longer than the inner diameter B1 of the through hole 31c.

[0052] Next, the press-fitting of the external connection terminal 50 into such a contact component 30 will be described with reference to Figures 12 and 13. Figure 12 is a side cross-sectional view of the contact component included in the semiconductor device of the second embodiment before the external connection terminal is press-fitted, and Figure 13 is a side cross-sectional view of the contact component included in the semiconductor device of the second embodiment after the external connection terminal is press-fitted. Note that in Figures 12 and 13, reference numerals are given to at least the components required for the description.

[0053] First, similarly to the first embodiment, the external connection terminal 50 is inserted into the opening end 31c1 of the through hole 31c of the contact component 30, starting from the tip 53 (see FIG. 6). At this time, since the tip 53 has the tapered surface 53a, it can be easily inserted into the opening end 31c1 of the through hole 31c. The external connection terminal 50 is further inserted toward the opening end 31c2.

[0054] A reinforcing portion 34 is formed on the opening end 31c1 side of the contact component. The length A1 of the external connection terminal 50 is longer than the inner diameter B1 of the through hole 31c. Therefore, the opening end 31c1 of the through hole 31c is difficult for the external connection terminal 50 to enter and difficult to widen. Therefore, in order to insert the external connection terminal 50 into the through hole 31c in the insertion direction I, it is necessary to push it with a larger pushing load than when the reinforcing portion 34 is not present. The four corners 51a of the external connection terminal 50 inserted into the through hole 31c are inserted while receiving a larger pressure from the areas corresponding to the reinforcing portions 34 of the through hole 31c.

[0055] Further, the external connection terminal 50 is pushed into the through hole 31c along the insertion direction I. The four corners 51a of the external connection terminal 50 are pressed against the inner circumferential surface 31a of the through hole 31c and slide while moving further in the insertion direction I. Then, the tip 53 of the external connection terminal 50 reaches just before the opening end 31c2 of the through hole 31c. Since the reinforcing portion 35 is formed on the opening end 31c2 side of the through hole 31c, the portion of the through hole 31c corresponding to the reinforcing portion 35 is less likely to widen. A large pushing load is required to push the external connection terminal 50 further along the insertion direction I. When the tip 53 of the external connection terminal 50 fits into the region corresponding to the reinforcing portion 35 of the through hole 31c, the tip 53 of the external connection terminal 50 is clamped and restrained by the reinforcing portion 35 as shown in FIG. 13. Then, when the printed circuit board 60 is attached to the external connection terminal 50, the external connection terminal 50 can be prevented from being inserted too far into the contact component 30.

[0056] The semiconductor device includes a circuit pattern 12, a contact component 30 having a body 31 with a cylindrical through hole 31c formed therein and including one opening end 31c2 and the other opening end 31c1, a flange 33 formed on at least one opening end 31c2 of the body 31, and one opening end 31c2 joined to the circuit pattern 12, and an external connection terminal 50 having a rectangular column shape extending in the insertion direction I and inserted into the contact component 30 with a corner 51a pressed against the inner circumferential surface 31a of the through hole 31c. 31c2 At least one of the opening ends 31c1 and 31c2 has thick reinforcement parts 35, 34 formed in a circumferential direction and extending outward from other areas of the main body 31. Therefore, when the external connection terminal 50 is inserted into the through hole 31c with the four corners 51a in contact with the inner circumferential surface 31a of the through hole 31c, the external connection terminal 50 is fixed by pressure from the reinforcement part 35 on the opening end 31c2 side. As a result, when the printed circuit board 60 is attached to the external connection terminal 50, it is possible to prevent the external connection terminal 50 from being inserted too far into the contact component 30. Various modified examples of the reinforcing portions 34 and 35 will be described below.

[0057] [Variation 1] The contact component 30 of the first modification will be described with reference to FIG. 14. FIG. 14 is a diagram for explaining the contact component included in the semiconductor device of the first modification of the second embodiment. FIG. 14 corresponds to FIG. 10(B). Therefore, FIG. 10(A) can be referred to for the cross-sectional view of the contact component 30 of FIG. 14. In the contact component 30 of FIG. 14, the thickness T3 of the reinforcing portion 34 formed in the contact component 30 of FIG. 10 becomes thinner from the opening end 31c1 toward the opening end 31c2, and the thickness T3 of the reinforcing portion 35 becomes thinner from the opening end 31c2 toward the opening end 31c1.

[0058] As described above, the reinforcing portions 34, 35 increase the pressing load of the external connection terminal 50 pressed into the through hole 31c. At this time, the reinforcing portions 34, 35 prevent the through hole 31c from widening, depending on the thickness T3 of the reinforcing portions 34, 35. For example, the reinforcing portions 34, 35 of the contact component 30 in FIG. 10 have a uniform thickness T3. Therefore, when the external connection terminal 50 is inserted into the through hole 31c of the contact component 30 in FIG. 10, the external connection terminal 50 that inserts into the area corresponding to the reinforcing portions 34, 35 receives uniform pressure from the reinforcing portions 34, 35.

[0059] On the other hand, in the contact component 30 of Fig. 14, the thickness T3 of the reinforcing portion 34 decreases from the opening end 31c1 to the opening end 31c2. Accordingly, when the external connection terminal 50 is inserted into the through hole 31c of the contact component 30 of Fig. 14, the pressure that the external connection terminal 50 receives from the reinforcing portion 34 is not uniform. That is, the pressure that the external connection terminal 50 receives from the reinforcing portion 34 at the inner circumferential surface 31a decreases from the opening end 31c1 to the opening end 31c2.

[0060] Furthermore, the thickness T3 of the reinforcing portion 35 increases from the opening end 31c1 to the opening end 31c2. Accordingly, the pressure that the external connection terminal 50 receives from the region of the inner circumferential surface 31a corresponding to the reinforcing portion 35 increases from the opening end 31c1 to the opening end 31c2.

[0061] When the external connection terminal 50 is pressed into the through hole 31c of such a contact component 30 in the insertion direction I, the external connection terminal 50 passes through the reinforcing portion 34 and enters the reinforcing portion 35, and receives a pressure from the region of the inner circumferential surface 31a corresponding to the reinforcing portion 35 that gradually increases as the external connection terminal 50 advances in the insertion direction I. Therefore, when the external connection terminal 50 is pressed into the contact component 30 with a constant pressing load, the external connection terminal 50 can be stably pressed in. In particular, the external connection terminal 50 can stably enter the region of the through hole 31c of the contact component 30 corresponding to the reinforcing portion 35. As a result, when the printed circuit board 60 is attached to the external connection terminal 50, excessive insertion of the external connection terminal 50 into the contact component 30 can be suppressed.

[0062] [Variation 2] The contact component 30 of the second modification will be described with reference to FIG. 15. FIG. 15 is a diagram for explaining a contact component included in a semiconductor device of the second modification of the second embodiment. FIG. 15 corresponds to FIG. 10(B). Therefore, FIG. 10(A) can be referred to for the cross-sectional view of the contact component 30 of FIG. 15. The contact component 30 of FIG. 15 is the contact component 30 of FIG. 10 with the flanges 32 and 33 removed.

[0063] 8, when the external connection terminal 50 is inserted into the through hole 31c with the four corners 51a in contact with the inner peripheral surface 31a of the through hole 31c, the external connection terminal 50 is fixed by pressure from the reinforcing portion 35 on the opening end 31c2 side. As a result, when the printed circuit board 60 is attached to the external connection terminal 50, excessive insertion of the external connection terminal 50 into the contact component 30 can be suppressed.

[0064] [Third embodiment] In the third embodiment, the press-fitting of the external connection terminal 50 (FIGS. 4 and 5) of the first embodiment into the contact component 30 (FIG. 10) of the second embodiment will be described with reference to FIGs. 16 and 17. FIG. 16 is a side cross-sectional view of the external connection terminal before press-fitting into the contact component included in the semiconductor device of the third embodiment, and FIG. 17 is a side cross-sectional view of the external connection terminal after press-fitting into the contact component included in the semiconductor device of the third embodiment.

[0065] First, similarly to the first and second embodiments, the external connection terminal 50 is inserted into the opening end 31c1 of the through hole 31c of the contact component 30, starting from the tip 53. At this time, since the tip 53 has the tapered surface 53a, it can be easily inserted into the opening end 31c1 of the through hole 31c. The external connection terminal 50 is further inserted toward the opening end 31c2.

[0066] A reinforcing portion 34 is formed on the opening end 31c1 side of the contact component. The length A1 of the external connection terminal 50 is longer than the inner diameter B1 of the through hole 31c. Therefore, as shown in FIG. 16, when the external connection terminal 50 enters the opening end 31c1 of the through hole 31c, the external connection terminal 50 is subjected to pressure from the inner peripheral surface 31a of the through hole 31c. The pressure at this time is larger than when the reinforcing portion 34 is not present. A larger pressing load is required to press the external connection terminal 50 in the insertion direction I. When the external connection terminal 50 is inserted in the insertion direction I, the protruding portion 51c abuts against the opening end 31c1.

[0067] Furthermore, when the external connection terminal 50 is pushed in with a large pushing load, the sliding surface 51c1 and the four corners 51a of the protrusion 51c enter the through hole 31c from the opening end 31c1, and the sliding surface 51c1 and the four corners 51a of the protrusion 51c slide on the inner circumferential surface 31a of the through hole 31c while moving in the insertion direction I. At this time, the opening end 31c1 of the contact component 30 is suppressed from expanding because the reinforcing portion 34 is formed. When the tip portion 53 of the external connection terminal 50 is inserted into the through hole 31c beyond the region corresponding to the reinforcing portion 34, the portion between the reinforcing portion 34 and the reinforcing portion 35 of the main body portion 31 is pressed outward by the protrusion 51c and expands outward beyond the opening ends 31c1 and 31c2.

[0068] When the external connection terminal 50 is pushed into the through hole 31c along the insertion direction I, the highest part of the sliding surface 51c1 of the protruding portion 51c from the outer surface portion 51b fits into the inner peripheral surface 31a of the through hole 31c. Furthermore, the tip portion 53 of the external connection terminal 50 reaches just before the opening end 31c2 of the through hole 31c, and the tip portion 53 of the external connection terminal 50 is clamped by the reinforcing portion 35. In this way, the external connection terminal 50 is more reliably prevented from moving in the insertion direction I than in the first and second embodiments (FIG. 17). Then, when the printed circuit board 60 is attached to the external connection terminal 50, the external connection terminal 50 can be prevented from being inserted too far into the contact component 30. In the third embodiment, the protruding portion 51c of the external connection terminal 50 is an example and may be hemispherical. The contact component 30 may also be configured in the same manner as in the second embodiment and the second and third modifications. [Explanation of symbols]

[0069] 1 Semiconductor device 10. Insulated Circuit Board 11 Insulating plate 12 Circuit Pattern 13 Metal plate 15 Bonding Wire 20 First semiconductor chip 21 Second semiconductor chip 23 Electronic Components 30 Contact parts 31 Main body 31a Inner surface 31b Outer surface 31c through hole 31c1,31c2 Open end 32,33 Flange 34,35 Reinforcement 40 cases 41 External enclosure 41a Adhesive 42 Top cover 42a Insertion hole 43 Sealing member 50 External connection terminal 51 Body 51a Corner 51b External part 51c Protrusion 51c1 Sliding surface 52,53 Tip 52a, 53a Tapered surface 60 Printed Circuit Board 61 Via

Claims

1. A conductive plate; a contact component including a body portion having a cylindrical through hole and including one open end and another open end, the one open end being joined to the conductive plate; an external connection terminal having a rectangular prism shape including four outer surface portions extending in an insertion direction, the external connection terminal being inserted into the contact component with the four corners pressed against an inner peripheral surface of the through hole; having The external connection terminal has protrusions formed on at least a pair of opposing outer surface portions of the four outer surface portions, and the protrusions are pressed against an inner circumferential surface of the through hole. Semiconductor device.

2. The external connection terminal is press-fitted into the through hole. The semiconductor device according to claim 1 .

3. The protrusions are formed on all of the outer surface portions of the external connection terminals, 3. The semiconductor device according to claim 1 or 2.

4. The protrusion is formed on the outer surface portion so as to extend along the insertion direction.

4. The semiconductor device according to claim 1.

5. When the external connection terminal is inserted into the through hole, a first end portion of the protruding portion on the side of the one opening end portion is located between the one opening end portion and the other opening end portion in a side view, a second end portion of the protruding portion on the other opening end side is located between the other opening end portion and the one opening end portion in a side view; 5. The semiconductor device according to claim 1.

6. an outer circumferential surface of the body of the contact element is raised outwardly in portions corresponding to the four corners and the protrusion of the external connection terminal inserted into the through hole, relative to other portions; 6. The semiconductor device according to claim 1.

7. a thickness of the protrusion with respect to the outer surface portion becomes thinner toward the one opening end in the insertion direction; 7. The semiconductor device according to claim 1.

8. A conductive plate; a contact component including a body portion having a cylindrical through hole and including one open end and another open end, and a flange formed on at least the one open end of the body portion, the one open end being joined to the conductive plate; an external connection terminal having a rectangular column shape extending in an insertion direction, the external connection terminal being inserted into the contact component with a corner portion pressed against an inner peripheral surface of the through hole; having The contact component has a thick reinforcing portion formed in a circumferential direction at both the one opening end and the other opening end of the outer circumferential surface of the main body portion, the thick reinforcing portion protruding outward from other regions of the main body portion. Semiconductor device.

9. In a planar cross section of the main body, the inner circumferential surface and the outer circumferential surface are formed into a cylindrical shape by forming concentric circles. The semiconductor device according to claim 8.

10. The reinforcing portion is formed at least on the side of the one opening end and to a predetermined height from the one opening end.

10. The semiconductor device according to claim 8.

11. a tip end portion of the external connection terminal on the insertion direction side is inserted from the one opening end portion of the main body portion to the predetermined height; The semiconductor device according to claim 10.

12. The thickness of the reinforcing portion is formed to become thinner with increasing distance from the one opening end with respect to the outer circumferential surface. The semiconductor device according to claim 10 or 11.

13. the external connection terminal has a rectangular prism shape surrounded on all four sides by outer surface portions, at least a pair of opposing outer surface portions of the outer surface portions each having a protrusion, and the protrusions are pressed against the inner circumferential surface of the through hole; 13. The semiconductor device according to claim 8.

14. When the external connection terminal is inserted into the through hole, a first end portion of the protrusion on the side of the one opening end portion is located at the same position as the one opening end portion or located from the one opening end portion toward the other opening end portion in a side view; a second end portion of the protruding portion on the other opening end side is located at the same position as the other opening end or on the one opening end side from the other opening end in a side view; The semiconductor device according to claim 13.

15. A first length between the outer sides of the protrusions formed on the pair of outer surface portions in a cross-sectional view in the insertion direction of the external connection terminal into the contact part is equal to a second length between the opposing corner portions of the main body portion in the cross-sectional view, or is 90% or more and 110% or less of the second length. The semiconductor device according to claim 1 .

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