Inspection method for inspection system and inspection system

Abstract

To provide a technique capable of suppressing a power consumption of an inspection system having a plurality of inspection units.SOLUTION: An inspection system comprises a plurality of inspection units for performing an electric inspection of an inspected body. In an inspection method, at least one of the following determination processing of (a) to (c) is performed on the basis of a total current detected: (a) an unoperation unit compares the total current with a start current threshold value at a timing of a start of an inspection, and the start of the inspection of the unoperation unit is waited when the total current is the start current threshold value or more; (b) the total current is compared with an operating current threshold value during the inspection of an operating unit, and the operating unit is waited when the total current is the operating current threshold value or more; and (c) the unoperation unit compares the total current with a processing speed current threshold value at the timing of the start of the inspection, and a processing content of a low power and a low speed is set when the total current is the processing speed current threshold value or more to start the inspection of the unoperation unit.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to an inspection method for an inspection system and an inspection system. [Background technology]

[0002] Patent Document 1 discloses an inspection system equipped with multiple testers (inspection units) that perform electrical inspections of objects to be inspected. Factories that have this type of inspection system ensure a power supply capacity that assumes that the power consumption of each inspection unit will be maximum at the same time. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-29627 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique capable of reducing power consumption in an inspection system having multiple inspection units. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, Multiple objects transported independently of each other Test subject Multiple Inspection Unit Equipped with The present invention provides an inspection method for an inspection system, which detects a total current, which is the sum of currents, or a total power, which is the sum of powers, supplied to each of the plurality of inspection units, and performs at least one of the following judgment processes (a) to (c) based on the detected total current or total power. (a) Determination process: When an unoperated unit that is not being inspected among the plurality of inspection units starts inspection, the total current is compared with a start current threshold or the total power is compared with a start power threshold, and if the result of the comparison is that the total current is equal to or greater than the start current threshold or the total power is equal to or greater than the start power threshold, the start of inspection of the unoperated unit is awaited, and if the total current is less than the start current threshold or the total power is less than the start power threshold, inspection of the unoperated unit is started. (b) Determination process: during inspection of an active unit being inspected among the plurality of inspection units, the total current is compared with an active current threshold or the total power is compared with an active power threshold, and if the comparison result indicates that the total current is equal to or greater than the active current threshold or the total power is equal to or greater than the active power threshold, at least one of the active units is put on hold, and if the total current is less than the active current threshold or the total power is less than the active power threshold, inspection of the active unit is continued. (c) Determination process: At the timing when the non-operating unit starts inspection, the total current is compared with a processing speed current threshold or the total power is compared with a processing speed power threshold, and if the comparison result shows that the total current is equal to or greater than the processing speed current threshold or the total power is equal to or greater than the processing speed power threshold, low power and low speed processing content is set and inspection of the non-operating unit is started, and if the total current is less than the processing speed current threshold or the total power is less than the processing speed power threshold, high power and high speed processing content is set and inspection of the non-operating unit is started. Effect of the Invention

[0006] According to one aspect, it is possible to reduce power consumption of an inspection system having a plurality of inspection units. [Brief description of the drawings]

[0007] [Figure 1] 1 is a diagram showing an overall configuration of an inspection system according to an embodiment; [Diagram 2] 2 is a schematic cross-sectional view of the inspection device taken along a horizontal direction. FIG. [Diagram 3] 4 is a schematic cross-sectional view of a transport area and an inspection area taken along the vertical direction. FIG. [Figure 4] 1 is a schematic vertical cross-sectional view showing a testing unit having a tester and a probe card. [Diagram 5] FIG. 2 is a block diagram showing electrical and communication connections of the hardware of the inspection device. [Figure 6] FIG. 2 is a block diagram showing functional parts of a controller. [Figure 7] 10 is a diagram illustrating a determination process performed by a first determination processor with respect to a total current. FIG. [Figure 8] 11 is a diagram illustrating the determination process performed by a second determination processor with respect to a total current. FIG. [Figure 9] 13 is a diagram illustrating the determination process performed by a third determination processor with respect to a total current. FIG. [Figure 10] 11 is an explanatory diagram illustrating a start current threshold, a release current threshold, an operating current threshold, a restart current threshold, and a processing speed current threshold. FIG. [Figure 11] 11 is a flowchart showing a testing method at the start of testing a non-operating unit. [Figure 12] 1 is a flow chart showing a method for inspecting an operating unit during operation. [Figure 13] FIG. 13 is a block diagram showing electrical connections and communication connections of hardware of an inspection device according to a modified example. [Figure 14] FIG. 13 is a block diagram showing an inspection system according to another modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0009] 1 is a diagram showing an overall configuration of an inspection system 1 according to an embodiment of the present disclosure, where (a) is a perspective view seen from a carry-in / out area 12, and (b) is a perspective view seen from an inspection area 14. As shown in FIG. 1, the inspection system 1 according to an embodiment includes one or more inspection devices 10 (one in the illustrated example) that inspect a wafer W (object to be inspected), which is an example of a substrate. The inspection device 10 is installed, for example, in a clean room or the like in a factory where the wafer W is manufactured.

[0010] The inspection device 10 has a rectangular parallelepiped housing 11 and contains a plurality of testers 20 that perform electrical inspection of a wafer W. The inspection device 10 also includes, in the housing 11, a controller 30 (control unit) that controls the operation of the inspection device 10, and an operation terminal 40 that is operated by a user of the inspection device 10.

[0011] Fig. 2 is a schematic cross-sectional view taken along the horizontal direction of the inspection device 10. As shown in Fig. 2, the housing 11 includes a load / unload area 12 for loading / unloading a wafer W between the outside and the inside (inspection chamber 11a) of the housing 11, a transfer area 13 for transferring the wafer W from the load / unload area 12, and an inspection area 14 for inspecting the wafer W transferred from the transfer area 13.

[0012] In the loading / unloading area 12, a plurality of loading / unloading sections 12a are provided along the horizontal direction of the housing 11 (see also FIG. 1). Each loading / unloading section 12a is equipped with a load port 15, an aligner 16, etc. The load port 15 receives a FOUP, which is a container that contains a plurality of wafers W. The aligner 16 aligns the wafer W. The loading / unloading area 12 also has a loader 17 for loading and unloading a probe card PR (see FIG. 4) used in each of the plurality of testers 20.

[0013] The transfer area 13 has a plurality of transfer stages 18 that are movable between the load / unload area 12 and the inspection area 14. Each transfer stage 18 is provided for each tester line 14L of the inspection area 14 described below. The transfer stage 18 receives a wafer W from a load port 15 in the load / unload area 12 and transfers it to the inspection area 14, and also transfers a wafer W that has been inspected from the inspection area 14 to the load port 15. When replacing a probe card PR of a tester 20, the transfer stage 18 receives a probe card PR from the inspection area 14 and transfers it to the loader 17, and also transfers a new probe card PR from the loader 17 to the inspection area 14.

[0014] The transfer stage 18 has a chuck device 18a that vacuum-adsorbs the wafer W onto the upper surface thereof and positions and fixes the wafer W. The holding method of the chuck device 18a is not limited to vacuum adsorption, and may be, for example, electromagnetic adsorption or clamping.

[0015] FIG. 3 is a schematic cross-sectional view of the transfer area 13 and the inspection area 14 along the vertical direction. As shown in FIG. 3, the inspection area 14 has a plurality of testers 20 for inspecting the wafer W. Specifically, the plurality of testers 20 are arranged in a matrix in the horizontal and vertical directions (height direction) (see also FIG. 1(b)). Hereinafter, a group of the plurality of testers 20 arranged in the horizontal direction is referred to as a tester line 14L. The tester line 14L has four testers 20 in the horizontal direction, and the inspection device 10 has three stages (multiple stages) of this tester line 14L in the vertical direction. That is, the inspection device 10 has twelve testers 20. It is needless to say that the number of testers 20 constituting the tester line 14L and the number of stages of the tester line 14L are not particularly limited in the inspection device 10.

[0016] The inspection area 14 also has one camera 19 for each of the multiple tester lines 14L. Each camera 19 moves horizontally along the corresponding tester line 14L and captures an image of the position of the wafer W being transported by the transport stage 18 in front of each tester 20 constituting the tester line 14L.

[0017] Fig. 4 is a schematic vertical cross-sectional view showing an inspection unit 21 having a tester 20 and a probe card PR. As shown in Fig. 4, each tester 20 in the inspection area 14 has a pogo frame 22 (test head) on which a probe card PR is attached, and performs an electrical inspection of the wafer W with the probe card PR attached. That is, in the inspection of the wafer W, the inspection device 10 forms the inspection unit 21 by assembling the tester 20 and the probe card PR.

[0018] The main part of each tester 20 is installed, via a base 20a, on the upper part of a pogo frame 22 connected to a frame inside the housing 11. In addition, a probe card PR is attached to the lower part of the pogo frame 22.

[0019] The probe card PR has a disk-shaped main body 23, a number of electrodes 24 arranged on the upper surface of the main body 23, and a number of contact probes 25 (contact terminals) connected to each electrode 24 and protruding downward from the lower surface of the main body 23. Each contact probe 25 makes electrical contact with electrode pads and solder bumps of each semiconductor device formed on the wafer W by abutting against the wafer W. Each contact probe 25 can, for example, contact the entire surface of the wafer W all at once, thereby enabling electrical characteristics of a large number of semiconductor devices to be inspected simultaneously.

[0020] The pogo frame 22 is formed in a substantially flat plate shape and has a number of through holes 26 near the center. A pogo block 27 consisting of a number of pogo pins is inserted into each of the through holes 26. The pogo block 27 is connected to an inspection circuit in the main part of the tester 20 and is capable of contacting a number of electrodes 24 of the probe card PR.

[0021] The pogo frame 22 also has a vacuum mechanism 28 that creates a vacuum between the pogo frame 22 and the transfer stage 18. The vacuum mechanism 28 includes a flange 28a that engages with the pogo frame 22 so as to be movable up and down, a bellows 28b that encloses the space between the pogo frame 22 and the flange 28a, and seal members 28c and 28d that enclose the spaces between the pogo frame 22, the base 20a, and the probe card PR. A contact member 28e that can be in airtight contact with the chuck device 18a is provided on the lower end surface of the flange 28a. The vacuum mechanism 28 attaches the base 20a to the pogo frame 22, and also attaches the chuck device 18a, the probe card PR, and the pogo frame 22 by evacuating the space surrounded by the seal member 28c using a vacuum pump (not shown).

[0022] Each tester 20 has a control board 29 therein for operating each component. The control board 29 is a board with a built-in computer for the tester, which has one or more processors 29a, a memory 29b, an input / output interface and an electronic circuit (not shown), etc. The one or more processors 29a are a combination of one or more of a CPU, an ASIC, an FPGA, a circuit made of a plurality of discrete semiconductors, etc., and executes and processes the programs and recipes stored in the memory 29b. The memory 29b includes a non-volatile memory and a volatile memory, and forms the storage unit of the control board 29.

[0023] The processor 29a of the control board 29 executes an appropriate program or recipe in response to a control command transmitted from the controller 30 to operate each component, thereby performing an electrical inspection of the wafer W. The processor 29a also transmits the inspection result of the wafer W to the controller 30.

[0024] On the other hand, the controller 30 of the inspection device 10 is a control computer for the entire inspection device 10, which has one or more processors 31, a memory 32, an input / output interface 33, and an electronic circuit 34. The one or more processors 31 are one or a combination of a CPU, an ASIC, an FPGA, a circuit made of a plurality of discrete semiconductors, and executes and processes a program stored in the memory 32. The memory 32 includes a non-volatile memory and a volatile memory, and forms a storage unit of the controller 30.

[0025] The controller 30 is communicatively connected via an input / output interface 33 to the load port 15, the aligner 16, the loader 17, the transfer stage 18, the camera 19, the tester 20 (all see FIG. 2), and the like.

[0026] The controller 30 is also connected to an operation terminal 40 provided in the housing 11 of the inspection device 10 via an input / output interface 33 (see FIG. 1). The operation terminal 40 has a touch panel 41 and the like constituting an input / output device of the inspection device 10. The operation terminal 40 is not particularly limited, and a monitor, a speaker, a keyboard, a mouse, and the like may be applied. The controller 30 receives the inspection contents of the inspection device 10 input by the user via the operation terminal 40, outputs a control command to each component of the inspection device 10 based on the inspection contents, and performs an electrical inspection of the wafer W. When the controller 30 receives the inspection results from each tester 20, the controller 30 stores the inspection results in the memory 32 and displays the inspection results via the operation terminal 40 under the user's operation.

[0027] 1 to 4, the inspection device 10, under the control of the controller 30, holds the wafer W in the carry-in / out area 12 by the transfer stage 18 and moves the transfer stage 18. As a result, the inspection device 10 transfers the wafer W to below the probe card PR of the tester 20, and further brings the wafer W close to the probe card PR. When the transfer stage 18 abuts against the flange 28a, a space surrounded by the probe card PR, the transfer stage 18, the pogo frame 22, and the flange 28a is formed below the probe card PR.

[0028] When the control board 29 of the tester 20 receives a control command from the inspection device 10, it operates the vacuum mechanism 28 to evacuate the space sealed by the bellows 28b, thereby holding the chuck device 18a against the pogo frame 22. At this time, the electrode pads and solder bumps of each semiconductor device on the wafer W come into contact with the contact probes 25 of the probe card PR.

[0029] As a result, each inspection unit 21 (tester 20, probe card PR) passes a current through an electronic circuit of each semiconductor device on the wafer W via the pogo pins and each contact probe 25 of the probe card PR under the control of the control board 29. Then, the control board 29 electrically inspects the current returning from the wafer W via each contact probe 25 and pogo pin in the inspection circuit.

[0030] Fig. 5 is a block diagram showing electrical connections and communication connections of the hardware of the inspection device 10. As shown in Fig. 5, the inspection device 10 has electrical wiring 50 that connects the various components of the inspection device 10. The inspection device 10 also includes, as an electrical system configuration connected via the electrical wiring 50, a power supply connection section 51, a breaker 52 connected in series to the power supply connection section 51, an ammeter 53 connected in series to the breaker 52, and a power distribution section 54 connected in series to the ammeter 53. The multiple testers 20 (inspection units 21) and the controller 30 are connected in parallel to the power distribution section 54, and are supplied with power distributed by the power distribution section 54.

[0031] The inspection device 10 also has, as a communication system, appropriate communication means (see dotted lines in FIG. 5) for connecting between each tester 20 and the controller 30 and between the ammeter 53 and the controller 30 so that information can be communicated. The communication means is not particularly limited, and either wired or wireless communication may be used.

[0032] The power supply connector 51 of the inspection device 10 is connected to an AC power supply supplied to a factory. The AC power supply supplies an AC voltage of, for example, 200 V to the inspection device 10. The power supply connector 51 may include an adapter that converts AC power into DC power.

[0033] The breaker 52 cuts off the electric wiring 50 when the current supplied to the inspection device 10 exceeds a predetermined cut-off current value (rated current), thereby restricting the supply of an overcurrent to the inspection device 10. The cut-off current value of the breaker 52 is not particularly limited, but may be set to, for example, 70% or less of the current that can be supplied to the factory (factory breaker).

[0034] Ammeter 53 detects a total current, which is the sum of the currents supplied to each tester 20, and outputs the detection signal (information on the total current) to controller 30. The installation position of ammeter 53 is not particularly limited as long as it is closer to power supply connection unit 51 than power distribution unit 54, and may be between power supply connection unit 51 and breaker 52.

[0035] The power distribution unit 54 supplies power necessary for the operation of the controller 30, and also supplies power to each tester 20 according to the operating state of each inspection unit 21. The power distribution unit 54 also supplies appropriate power to other components of the inspection device 10 (load port 15, aligner 16, loader 17, transfer stage 18, camera 19, etc.: see FIG. 2). Note that, although the inspection device 10 according to this embodiment has the controller 30 connected to the power distribution unit 54 downstream of the ammeter 53, a configuration may also be adopted in which a power distribution unit 55 is provided upstream of the ammeter 53 as shown by the dotted line in FIG. 5, and the controller 30 is connected to the power distribution unit 55.

[0036] The controller 30 is activated based on the power supplied from the power supply system of the inspection apparatus 10, and performs the above-mentioned electrical inspection of the wafer W. At this time, the controller 30 adjusts the progress of the inspection of each inspection unit 21 based on the total current supplied to each tester 20 (inspection unit 21) obtained from the ammeter 53, thereby suppressing the power consumption (current consumption) of the inspection apparatus 10 as a whole.

[0037] Fig. 6 is a block diagram showing the functional parts of the controller 30. The processor 31 executes a program stored in the memory 32 to form a functional block for suppressing power consumption, as shown in Fig. 6. In detail, a current acquisition unit 60, an operation acquisition unit 61, an inspection planning unit 62, an inspection progress adjustment unit 63, and a tester command unit 64 are formed inside the controller 30.

[0038] The current acquisition unit 60 acquires information on the total current detected by the ammeter 53 , temporarily stores it in the memory 32 , and also outputs it to the examination progress adjustment unit 63 .

[0039] The operation acquisition unit 61 continuously acquires information about the operation state from each component (load port 15, transfer stage 18, and multiple testers 20, etc.) of the inspection device 10. For example, the operation state of the inspection unit 21 may include identification information of the inspection unit 21, whether electrical inspection is in progress or not, the inspection items when electrical inspection is in progress, the programs used in electrical inspection, etc.

[0040] Based on the information from the operation acquisition unit 61, the inspection planning unit 62 recognizes the operating unit 21A currently performing an inspection among the multiple inspection units 21 (testers 20) and the non-operating unit 21B not performing an inspection among the multiple inspection units 21. At this time, it is preferable that the inspection planning unit 62 recognizes the progress of the inspection by referring to the inspection items currently being performed by the operating unit 21A. Then, the inspection planning unit 62 plans the inspection of the non-operating unit 21B based on the available transfer stage 18 and the number of wafers W to be inspected. For example, when the wafer W to be inspected is in the load port 15 and there is an unused transfer stage 18, the inspection planning unit 62 determines the operation of the non-operating unit 21B among the inspection units 21 of the tester line 14L in which the transfer stage 18 is located. Then, the inspection planning unit 62 outputs plan information for starting the inspection of the non-operating unit 21B to the inspection progress adjustment unit 63.

[0041] The inspection progress adjustment unit 63 performs a determination process to adjust the inspection of each inspection unit 21 based on the total current information from the current acquisition unit 60, the information on the operating state of each component from the operation acquisition unit 61, and the planning information from the inspection planning unit 62. Specifically, the inspection progress adjustment unit 63 sets the following determinations (a) to (c) and processing contents according to the determinations. (a) When the total current is small, the start of inspection of the non-operating unit 21B is permitted, and when the total current is large, the start of inspection of the non-operating unit 21B is put on hold until the total current becomes small. (b) If the total current is small, the inspection of the active unit 21A continues, and if the total current is large, the inspection of the active unit 21A is put on hold until the total current decreases. (c) When the total current is small, inspection of the non-operating unit 21B is started so as to be inspected at a high throughput, and when the total current is large, inspection of the non-operating unit 21B is started so as to be inspected at a low throughput.

[0042] In order to carry out the above processes (a) to (c), a first judgment processing unit 65, a second judgment processing unit 66, and a third judgment processing unit 67 are formed in the examination progress adjustment unit 63. Furthermore, it is preferable that a threshold setting unit 68 is formed in the examination progress adjustment unit 63, which allows the user to set each current threshold value to be compared with the total current.

[0043] The first determination processing unit 65 performs the determination (a) and sets the processing content based on an instruction to start inspection of the not operating unit 21B in the plan information of the inspection planning unit 62. For this reason, the first determination processing unit 65 has a start current threshold Ta for comparison with the total current. The start current threshold Ta is not particularly limited, but may be set in a range of about 50% to 70% of the interruption current value of the breaker 52. When the total current is equal to or greater than the start current threshold Ta, the first determination processing unit 65 determines to wait for the start of inspection of the not operating unit 21B, and when the total current is less than the start current threshold Ta, determines to start inspection of the not operating unit 21B.

[0044] Furthermore, when waiting for the start of inspection of the non-operating unit 21B, the first determination processing unit 65 measures the timing of transition from the standby state to inspection. For this reason, the first determination processing unit 65 has a release current threshold Tb for comparison with the total current. The release current threshold Tb is a current value equal to or less than the start current threshold Ta, and may be set, for example, in a range of about 40% to 60% of the interruption current value of the breaker 52. When the total current is equal to or more than the release current threshold Tb, the first determination processing unit 65 determines to continue the standby of the non-operating unit 21B, and when the total current reaches less than the release current threshold Tb, determines to start inspection of the non-operating unit 21B.

[0045] Fig. 7 is a diagram for explaining the judgment process of the first judgment processing unit 65 for the total current. Specifically, the first judgment processing unit 65 compares the total current detected by the ammeter 53 with the start current threshold Ta based on receiving an instruction to start the inspection at the timing (time t1) of the first example shown in Fig. 7. Since the total current is less than the start current threshold Ta at time t1, the first judgment processing unit 65 immediately starts the inspection of the non-operating unit 21B at time t1.

[0046] On the other hand, at the timing (time t2) of the second example shown in FIG. 7, the total current is equal to or greater than the start current threshold Ta. When receiving an instruction to start inspection at this timing, the first judgment processing unit 65 waits for the start of inspection of the non-operated unit 21B. When waiting for the start of inspection, the inspection device 10 may operate the transport stage 18 toward the non-operated unit 21B that is waiting, or may stop the operation of the transport stage 18 itself. By operating the transport stage 18, the inspection device 10 can smoothly start the inspection of the non-operated unit 21B after waiting. On the other hand, by stopping the operation of the transport stage 18, the inspection device 10 can more easily reduce the total current.

[0047] When waiting for the start of the inspection, the first determination processing unit 65 further monitors the timing (time t3) at which the total current becomes less than the release current threshold Tb, and determines the start of the inspection of the non-operating unit 21B at time t3.

[0048] In addition, when there is a non-operating unit 21B that has previously been determined to wait for the start of inspection, the first determination processing unit 65 preferably waits for the judgment of the next non-operating unit 21B even if it receives plan information for starting inspection of the next non-operating unit 21B. This allows the inspection device 10 to avoid changing the order of the non-operating units 21B to be inspected.

[0049] Returning to FIG. 6, the second determination processing unit 66 performs the determination and setting of the processing contents (b) during the inspection of the operating unit 21A based on the operation state of the inspection unit 21 of the operation acquisition unit 61. For this reason, the second determination processing unit 66 has an operating current threshold Tc for comparison with the total current. The operating current threshold Tc is also not particularly limited, and may be set, for example, in a range of about 70% to 90% of the interruption current value of the breaker 52. When the total current becomes equal to or greater than the operating current threshold Tc, the second determination processing unit 66 puts at least one of the operating units 21A on standby, and when the total current is less than the operating current threshold Tc, continues the inspection of the operating unit 21A.

[0050] For the operating unit 21A that is on standby, it is preferable that, among the multiple test items scheduled to be performed in the test, the test of the test item that is already being performed continues, and when the test item is finished, the operating unit 21A waits without performing the next test item. This allows the inspection device 10 to avoid repeating the test item that is already being performed.

[0051] Furthermore, when the inspection of the operating unit 21A is put on hold, the second determination processing unit 66 measures the timing to resume the inspection from the standby state. For this reason, the second determination processing unit 66 has a restart current threshold Td for comparison with the total current. The restart current threshold Td is a current value equal to or less than the operating current threshold Tc, and may be set, for example, in a range of about 60% to 80% of the interruption current value of the breaker 52. When the total current is equal to or more than the restart current threshold Td, the second determination processing unit 66 determines to continue the standby of the operating unit 21A, and when the total current reaches less than the restart current threshold Td, determines to resume the inspection of the operating unit 21A.

[0052] Fig. 8 is a diagram for explaining the judgment process of the second judgment processing unit 66 for the total current. Specifically, as shown in Fig. 8, the second judgment processing unit 66 continuously repeats a comparison between the operating current threshold value Tc and the total current during the inspection of the operating unit 21A. Then, at the timing (time t4) when the total current becomes equal to or greater than the operating current threshold value Tc, the second judgment processing unit 66 judges the operating unit 21A to be in standby. At this time, the operating unit 21A continues the inspection item already being performed and then goes into standby, so that the total current may increase even after time t4.

[0053] When the operating unit 21A goes into a standby state, the total current of the inspection device 10 decreases. Even at this time, the second determination processing unit 66 continues to monitor the total current and continuously repeats the comparison of the total current with the restart current threshold Td. The second determination processing unit 66 continues monitoring until the total current becomes less than the restart current threshold Td, and when the total current becomes less than the restart current threshold Td at time t5, the second determination processing unit 66 resumes the inspection of the standby operating unit 21A.

[0054] When the second determination processing section 66 determines that the operating unit 21A should be put on standby during the inspection of the multiple operating units 21A, it is preferable that the multiple operating units 21A be put on standby one by one with a period of time in between. For example, after a predetermined period of time for the first operating unit 21A that has been put on standby, the second determination processing section 66 compares the operating current threshold value Tc with the total current to determine whether the total current has decreased, thereby determining whether to put another operating unit 21A on standby next. This makes it possible to prevent the inspection of the wafer W from being delayed due to the multiple operating units 21A being put on standby successively or simultaneously.

[0055] Furthermore, when the operating unit 21A is put on standby, it is advisable to give priority to putting on standby the operating unit 21A that has already performed fewer inspection items (that was put into operation later) among the multiple operating units 21A. This allows the inspection of the operating unit 21A that has already performed many inspection items (that was put into operation first) to be completed early, and the operation of the waiting operating unit 21A can be resumed. For example, when inspection is being performed by each inspection unit 21 of the same tester line 14L, efficiency including the transportation of the wafer W can be improved by proceeding with the inspection of the operating unit 21A that was put into operation first.

[0056] Conversely, when the operating unit 21A is on standby, the operating unit 21A that has already performed many inspection items among the multiple operating units 21A may be on standby. This allows the inspection of the operating unit 21A that is operated later to proceed, thereby reducing the time lag with the operating unit 21A that is operated earlier. For example, by reducing the time lag when inspections are being performed by the inspection units 21 of different tester lines 14L, it is possible to promote the efficiency of the inspection.

[0057] Returning to FIG. 6, the third determination processing unit 67 performs the determination (c) and sets the processing contents at the timing when the non-operating unit 21B starts the inspection based on the planning information of the inspection planning unit 62. For this reason, the third determination processing unit 67 has a processing speed current threshold Te for comparison with the total current. When the total current is equal to or greater than the processing speed current threshold Te, the third determination processing unit 67 determines to set the processing contents to low power (low current) and low speed (low throughput) and inspect the non-operating unit 21B. Also, when the total current is less than the processing speed current threshold Te, the third determination processing unit 67 determines to set the processing contents to high power (high current) and high speed (high throughput) and inspect the non-operating unit 21B.

[0058] The processing speed current threshold Te may be set to a current value equal to or less than the start current threshold Ta. If the processing speed current threshold Te exceeds the start current threshold Ta, the non-operating unit 21B will operate with the high throughput program when the test after the standby state starts, even though the total current exceeds the start current threshold Ta at the start of the non-operating unit 21B and the unit goes into standby mode. In other words, there will be no opportunity to select the low throughput program. As an example, the processing speed current threshold Te may be set to a range of about 30% to 50% of the interruption current value of the breaker 52.

[0059] For example, the control board 29 of the multiple testers 20 previously stores a low throughput program for low power and low speed inspection and a high throughput program for high power and high speed inspection. The low throughput program is a program for suppressing the current flowing through the wafer W by limiting the contact probes 25 that pass current among the multiple contact probes 25. This slows down the inspection of the inspection unit 21, but allows the inspection to be performed with reduced power consumption. On the other hand, the high throughput program is a program for increasing the amount of current flowing through the wafer W by increasing the number of contact probes 25 that pass current among the multiple contact probes 25. This increases the power consumption of the inspection unit 21, but speeds up the inspection, so the inspection time can be shortened. The control board 29 executes either the low throughput program or the high throughput program to perform the inspection by receiving an operation start command and a program selection command from the controller 30.

[0060] Fig. 9 is a diagram for explaining the judgment process of the third judgment processing unit 67 for the total current. Specifically, based on receiving an instruction to start inspection at the timing (time t6) of the first example shown in Fig. 9, the third judgment processing unit 67 compares the total current detected by the ammeter 53 with the processing speed current threshold Te. Since the total current is less than the processing speed current threshold Te at time t6, the third judgment processing unit 67 judges that the high throughput program is to be executed for the non-operating unit 21B.

[0061] 9 (time t7), the total current is equal to or greater than the processing speed current threshold Te. When an instruction to start inspection is received at this timing, the third determination processing unit 67 determines that the low throughput program is to be executed for the non-operating unit 21B. As a result, even if inspection of the non-operating unit 21B is started, the amount of current of the non-operating unit 21B added to the total current is small.

[0062] When the first determination processing unit 65 and the third determination processing unit 67 make a determination at the start of the inspection of the non-operating unit 21B, it is preferable that the inspection progress adjustment unit 63 holds both the determination results until the inspection of the non-operating unit 21B starts. For example, when the first determination processing unit 65 determines to wait for the start of the inspection of the non-operating unit 21B, the third determination processing unit 67 determines to use the low throughput program. By holding the determination result of the third determination processing unit 67, when the first determination processing unit 65 determines that the total current is less than the release current threshold Tb, the non-operating unit 21B can be inspected with the low throughput program.

[0063] FIG. 10 is an explanatory diagram illustrating the start current threshold Ta, the release current threshold Tb, the operating current threshold Tc, the restart current threshold Td, and the processing speed current threshold Te, where (a) is a first embodiment and (b) is a second embodiment. As shown in FIG. 10(a), the controller 30 sets each current threshold corresponding to the total current in stages. Specifically, the processing speed current threshold Te<the start current threshold Ta<the operating current threshold Tc. This enables the inspection device 10 to reduce the number of inspection units 21 that perform inspection and to give priority to the inspection of the wafer W being inspected. Note that in FIG. 10(a), the release current threshold Tb is set between the processing speed current threshold Te and the start current threshold Ta, but the release current threshold Tb may be lower than the processing speed current threshold Te as long as it is equal to or lower than the start current threshold Ta. In addition, in FIG. 10(a), the restart current threshold Td is set between the start current threshold Ta and the operating current threshold Tc, but the restart current threshold Td may be lower than the operating current threshold Tc, or may be lower than the start current threshold Ta.

[0064] Alternatively, the current thresholds may have an appropriate relationship depending on the inspection contents of the wafer W, the user's request, and the like. For example, as shown in FIG. 10(b), the controller 30 may set each current threshold as follows: processing speed current threshold Te<operating current threshold Tc<start current threshold Ta. This allows the inspection apparatus 10 to simultaneously inspect a plurality of wafers W by increasing the number of inspection units 21 that perform inspection. Even when inspecting a large number of inspection units 21, the power consumption of the inspection apparatus 10 can be suppressed while appropriately adjusting the inspection speed based on the processing speed current threshold Te and the operating current threshold Tc. The operating current threshold Tc may be set to be equal to or lower than the processing speed current threshold Te.

[0065] The requirements for the magnitude of each of the current thresholds mentioned above can be summarized as follows [1] to [3]. [1] The start current threshold Ta and the operating current threshold Tc can be set arbitrarily. [2] Release current threshold Tb ≦ Start current threshold Ta, Restart current threshold Td ≦ Operating current threshold Tc [3] Processing speed current threshold Te ≦ Start current threshold Ta

[0066] Returning to FIG. 6, the threshold setting unit 68 is a functional unit that enables the user to set each current threshold (start current threshold Ta, release current threshold Tb, operating current threshold Tc, restart current threshold Td, and processing speed current threshold Te) for comparison with the total current. For example, the threshold setting unit 68 displays image information for setting each current threshold on the operation terminal 40 (see FIG. 1(a)), and varies each current threshold by user operation. Note that the threshold setting unit 68 may automatically set the release current threshold Tb when the start current threshold Ta is set by the user. Similarly, the threshold setting unit 68 may automatically set the restart current threshold Td when the operating current threshold Tc is set by the user.

[0067] The tester command unit 64 outputs commands to each tester 20 (test unit 21) based on the processing contents set in the test progress adjustment unit 63. For example, when starting the operation of the non-operating unit 21B, the tester command unit 64 transmits a program selection command to the non-operating unit 21B together with an operation start command. Upon receiving this command, the non-operating unit 21B executes either the low throughput program or the high throughput program to start the test. When waiting for the operation of the non-operating unit 21B, the controller 30 does not transmit an operation start command, thereby allowing the non-operating unit 21B to continue waiting.

[0068] Also, for example, when the tester command section 64 puts the operation of the operating unit 21A on hold, it outputs an operation stand-by command to the operating unit 21A. After receiving this command, the operating unit 21A puts the next inspection item on hold and waits after finishing the inspection item that it has already performed. Thereafter, the tester command section 64 outputs an operation restart command to the waiting operating unit 21A, so that the waiting operating unit 21A resumes the inspection from the next inspection item.

[0069] The inspection system 1 (inspection device 10) according to this embodiment is basically configured as described above, and its operation and effects will be described below. Fig. 11 is a flowchart showing an inspection method at the start of inspection of the non-operating unit 21B. Fig. 12 is a flowchart showing an inspection method during the operation of the operating unit 21A.

[0070] 11, the controller 30 of the inspection device 10 continuously acquires the detection signal (information on the total current) of the ammeter 53 through the current acquisition unit 60 during the inspection of the wafer W by the operating unit 21A (step S11). Furthermore, the controller 30 continuously acquires information on the operating state of each component including the tester 20 through the operation acquisition unit 61 (step S12).

[0071] The inspection planning unit 62 generates plan information for starting the inspection of the non-operating unit 21B according to the operating state of the inspection unit 21 (step S13).

[0072] When the inspection progress adjustment unit 63 recognizes the start of inspection of the non-operating unit 21B based on the plan information, the first judgment processing unit 65 and the third judgment processing unit 67 perform judgment processing. Specifically, the third judgment processing unit 67 judges whether the total current is equal to or greater than the processing speed current threshold Te (step S14). If the total current is equal to or greater than the processing speed current threshold Te (step S14: Yes), the tester command unit 64 instructs the selection of a low throughput program (step S15). On the other hand, if the total current is less than the processing speed current threshold Te (step S14: No), the tester command unit 64 instructs the selection of a high throughput program (step S16).

[0073] The first determination processor 65 also determines whether the total current is equal to or greater than the start current threshold Ta (step S17). If the total current is less than the start current threshold Ta (step S17: No), the tester command unit 64 starts inspection of the non-operating unit 21B (step S18). On the other hand, if the total current is equal to or greater than the start current threshold Ta (step S17: Yes), the tester command unit 64 waits for the start of inspection of the non-operating unit 21B (step S19).

[0074] In the standby state of the non-operating unit 21B, the first judgment processing unit 65 judges whether or not the total current has reached less than the release current threshold Tb (step S20). If the total current is equal to or greater than the release current threshold Tb (step S20: No), the process returns to step S19 and the standby state continues. On the other hand, if the total current has reached less than the release current threshold Tb (step S20: Yes), the tester command unit 64 commands the start of inspection of the non-operating unit 21B (step S21). This makes it possible for the inspection device 10 to avoid an increase in the power of the inspection device 10 as a whole at the start of inspection of the non-operating unit 21B.

[0075] Moreover, during the inspection of the operating unit 21A, the inspection progress adjustment unit 63 performs the processing flow shown in Fig. 12 in order to perform the judgment processing by the second judgment processing unit 66. In the processing flow of Fig. 12, steps S31 and S32 perform the same processing flow as steps S11 and S12.

[0076] Then, the second determination processing unit 66 continuously determines whether the total current is equal to or greater than the operating current threshold Tc during the inspection of the operating unit 21A (step S33). If the total current is less than the operating current threshold Tc (step S33: No), the second determination processing unit 66 continues the inspection of the operating unit 21A (step S34).

[0077] On the other hand, if the total current is equal to or greater than the operating current threshold Tc (step S33: Yes), the tester command unit 64 commands the operating unit 21A to wait for the inspection (step S35). The inspection unit 21 that has received the inspection wait command finishes the currently performed inspection item and then suspends the inspection of the wafer W. This causes the total current supplied to each inspection unit 21 to decrease.

[0078] In the standby state of the operating unit 21A, the second judgment processing unit 66 judges whether or not the total current has reached less than the restart current threshold Td (step S36). If the total current is equal to or greater than the restart current threshold Td (step S36: No), the process returns to step S35 and the standby state continues. On the other hand, if the total current has reached less than the restart current threshold Td (step S36: Yes), the tester command unit 64 commands the standby operation inspection unit to resume inspection (step S37). As a result, the operating unit 21A resumes inspection from the inspection item following the inspection item that was being performed before the standby state.

[0079] As described above, the inspection device 10 also determines whether to continue the inspection of the operating unit 21A or to wait, and whether to resume the waiting state, based on the total current of the operating unit 21A. As a result, the inspection device 10 can effectively reduce the power consumption of each inspection unit 21 during inspection.

[0080] The inspection system 1 (inspection device 10) may not perform all of the above-mentioned judgment processes (a) to (c), and may perform at least one or two of (a) to (c). Therefore, the inspection progress adjustment unit 63 may be configured to include one or two of the first judgment processing unit 65, the second judgment processing unit 66, and the third judgment processing unit 67 according to the judgment process to be performed. For example, even by performing only the judgment process (a), the inspection system 1 does not start inspection of the non-operating unit 21B if the total current is large, so that the power consumption of the inspection device 10 as a whole can be reduced. Also, for example, even by performing only the judgment process (b), the inspection system 1 puts the inspection of the operating unit 21A on hold if the total current is large, so that the power consumption of the inspection device 10 as a whole can be reduced. Alternatively, even by performing only the judgment process (c), the inspection system 1 operates the inspection unit 21 at a low current if the total current is large, so that the power consumption of the inspection device 10 as a whole can be reduced.

[0081] In the case of an inspection system 1 that combines the determination processes (a) and (b), the timing at which the non-operating unit 21B consumes power and the adjustment of the power consumption during inspection of the operating unit 21A can be appropriately adjusted. In the case of an inspection system 1 that combines the determination processes (a) and (c), the timing at which the non-operating unit 21B consumes power and the amount of power consumption during inspection of the operating unit 21A can be appropriately adjusted at the start of the non-operating unit 21B. In the case of an inspection system 1 that combines the determination processes (b) and (c), the power consumption during inspection of the operating unit 21A can be further suppressed while the power consumption is appropriately adjusted at the start of the non-operating unit 21B.

[0082] FIG. 13 is a block diagram showing electrical connections and communication connections of hardware of the inspection device 10 according to a modified example. As shown in FIG. 13, the inspection device 10 may use a power meter 56 instead of the ammeter 53 to detect the total power, which is the sum of the powers supplied to each tester 20 (inspection unit 21), and perform the judgment processes (a) to (c) based on the total power. In this case, each current threshold used for comparison with the total current is replaced with a power threshold for comparison with the total power. That is, the controller 30 has a start power threshold Tpa, a release power threshold Tpb, an operating power threshold Tpc, a restart power threshold Tpd, and a processing speed power threshold Tpe, and performs a comparison with the total power supplied to each tester 20.

[0083] Fig. 14 is a block diagram showing an inspection system 1A according to another modified example. As shown in Fig. 14, the inspection system 1A may obtain the total current supplied to each of a plurality of (two in Fig. 14) inspection devices 10, and perform the above-mentioned determination processes (a) to (c) based on the total current of the entire inspection devices 10, in other words, the total current of each inspection device 10 in the factory. In this case, the control unit that manages the progress of the inspection unit 21 may be the controller 30 (see Fig. 5) of a given inspection device 10, or an external computer 70 that is provided separately from each inspection device 10 and connected to each inspection device 10.

[0084] As described above, the inspection method of the inspection system 1 according to the present disclosure monitors the total current or power supplied to the multiple inspection units 21 and appropriately adjusts the inspection of the inspection units 21. As a result, the inspection method can suppress the generation of excess power consumption and reduce the power consumption of the inspection system 1 even in a configuration having multiple inspection units 21. Therefore, the inspection system 1 can reduce the amount of power capacity of the factory that is distributed to the inspection system 1, and can stably allocate the power capacity of the factory to other equipment.

[0085] Moreover, the inspection method performs all of the judgment process (a), the judgment process (b), and the judgment process (c), thereby enabling the inspection method to manage the progress of inspections of the multiple inspection units 21 in greater detail, and to reduce the power consumption of the inspection system 1 while ensuring the inspection speed.

[0086] Moreover, the current threshold to be compared with the total current is set to satisfy the following relationship (1), and the power threshold to be compared with the total power is set to satisfy the following relationship (2). The processing speed current threshold ≦ the start current threshold < the operating current threshold ... (1) The processing speed power threshold≦the starting power threshold<the operating power threshold (2)

[0087] This allows the inspection method to wait for the start of inspection of the non-operating unit 21B in a satisfactory manner based on the total current or total power, and effectively prevents the power consumption of the inspection system 1 from increasing.

[0088] In addition, the current threshold value to be compared with the total current or the power threshold value to be compared with the total power can be set according to a user's operation, so that the inspection method can proceed with the inspection of each inspection unit 21 at a power level according to the user's request.

[0089] Furthermore, in the inspection method, when the total current is equal to or greater than the release current threshold Tb or the total power is equal to or greater than the release power threshold Tpb, during standby for inspection of the non-operating unit 21B by the determination process of (a), the non-operating unit 21B continues to wait, and when the total current falls below the release current threshold Tb or the total power falls below the release power threshold Tpb, inspection of the non-operating unit 21B is started, and the release current threshold Tb is set to equal to or less than the start current threshold Ta, or the release power threshold Tpb is set to equal to or less than the start power threshold Tpa. Thereby, when the inspection of the non-operating unit 21B is on standby, the inspection method can start inspection of the non-operating unit 21B at the timing when the total current or total power drops.

[0090] Furthermore, in the inspection method, when the inspection of the operating unit 21A is on standby by the determination process of (b), if the total current is equal to or greater than the restart current threshold Td or the total power is equal to or greater than the restart power threshold Tpd, the inspection of the operating unit 21A is resumed when the total current falls below the restart current threshold Td or the total power falls below the restart power threshold Tpd, and the restart current threshold Td is set to equal to or less than the operating current threshold Tc, or the restart power threshold Tpd is set to equal to or less than the operating power threshold Tpc. Thereby, when the inspection of the operating unit 21A is on standby, the inspection method can start inspection of the operating unit 21A at the timing when the total current or total power drops.

[0091] Furthermore, in the inspection method, when the inspection of the operating unit 21A is put on hold by the determination process of (b), the inspection continues until the inspection item already being performed in the operating unit 21A is completed, and then the inspection method puts on hold for the next inspection item. This allows the inspection system 1 to avoid having to re-perform the previously performed inspection item after resuming the inspection of the operating unit 21A, and thus makes it possible to prevent a decrease in the inspection speed of the operating unit 21A.

[0092] Furthermore, the multiple inspection units 21 have a low-throughput program for inspection with low power and low-speed processing, and a high-throughput program for inspection with high power and high-speed processing, and the non-operating unit 21B executes either the low-throughput program or the high-throughput program through the determination process of (c). This allows the inspection system 1 to appropriately adjust the inspection speed of the inspection unit 21 according to the total current or total power.

[0093] The inspection unit 21 has a tester 20 and a probe card PR that is attached to the tester 20 and contacts a substrate (wafer W) to be inspected, and inspects electrical characteristics of semiconductor devices formed on the substrate. This enables the inspection system 1 to perform electrical inspection of the substrate while reducing power consumption.

[0094] Moreover, one embodiment of the present disclosure is an inspection system 1 having a plurality of inspection units 21 that perform electrical inspection of an object to be inspected (wafer W), and including at least one of an ammeter 53 that detects a total current which is the sum of currents supplied to each of the plurality of inspection units 21, and a power meter 56 that detects a total power which is the sum of powers, and a control unit (controller 30, external computer 70) that performs at least one of the following judgment processes (a) to (c) based on the detected total current or total power. (a) When an unoperated unit 21B that is not being inspected among the multiple inspection units 21 starts inspection, the total current is compared with a start current threshold Ta or the total power is compared with a start power threshold Tpa, and if the comparison result shows that the total current is equal to or greater than the start current threshold Ta or the total power is equal to or greater than the start power threshold Tpa, the start of inspection of the unoperated unit 21B is awaited, and if the total current is less than the start current threshold Ta or the total power is less than the start power threshold Tpa, inspection of the unoperated unit 21B is started. (b) During inspection of an active unit 21A among the multiple inspection units 21, the total current is compared with an active current threshold Tc or the total power is compared with an active power threshold Tpc, and if the comparison result indicates that the total current is equal to or greater than the active current threshold Tc or the total power is equal to or greater than the active power threshold Tpc, at least one of the active units 21A is put on hold, and if the total current is less than the active current threshold Tc or the total power is less than the active power threshold Tpc, inspection of the active unit 21A is continued. (c) At the timing when the non-operating unit 21B starts inspection, the total current is compared with the processing speed current threshold Te or the total power is compared with the processing speed power threshold Tpe, and as a result of the comparison, if the total current is equal to or greater than the processing speed current threshold Te or the total power is equal to or greater than the processing speed power threshold Tpe, low power and low speed processing content is set and inspection of the non-operating unit 21B is started, and if the total current is less than the processing speed current threshold Te or the total power is less than the processing speed power threshold Tpe, high power and high speed processing content is set and inspection of the non-operating unit 21B is started.

[0095] As a result, even if the inspection system 1 has a configuration including a plurality of inspection units 21, the power consumption of the inspection system 1 can be reduced.

[0096] The inspection method and inspection system 1, 1A according to the presently disclosed embodiments are illustrative and not restrictive in all respects. The embodiments may be modified and improved in various forms without departing from the spirit and scope of the appended claims. The matters described in the above embodiments may have other configurations without any inconsistency, and may be combined without any inconsistency. For example, the object to be inspected by the inspection system 1 is not limited to a substrate (wafer W), but may be various electric and electronic devices that require electrical inspection. [Explanation of symbols]

[0097] 1. 1A Inspection System 10 Inspection equipment 20 Tester 21A Working Unit 21B Non-operating unit 30 Controller 53 Ammeter 56 Power meter 70 External Computer Ta Start current threshold Tb Release current threshold Tc Operating current threshold Td Restart current threshold Te Processing Speed ​​Current Threshold Tpa starting power threshold Tpb Release power threshold Tpc Operating Power Threshold Tpd Resume Power Threshold Tpe processing speed power threshold

Claims

1. An inspection method for an inspection system having a plurality of inspection units each for inspecting a plurality of objects to be inspected that are transported independently of one another, comprising: Detecting a total current or a total power supplied to each of the plurality of inspection units; performing at least one of the following determination processes (a) to (c) based on the detected total current or total power; (a) Determination process: When an unoperated unit that has not been inspected among the plurality of inspection units starts inspection, the total current is compared with a start current threshold or the total power is compared with a start power threshold, and if the comparison result shows that the total current is equal to or greater than the start current threshold or the total power is equal to or greater than the start power threshold, the start of inspection of the unoperated unit is awaited, and if the total current is less than the start current threshold or the total power is less than the start power threshold, inspection of the unoperated unit is started. (b) Determination process: during inspection of an active unit being inspected among the plurality of inspection units, the total current is compared with an active current threshold or the total power is compared with an active power threshold, and if the comparison result shows that the total current is equal to or greater than the active current threshold or the total power is equal to or greater than the active power threshold, at least one of the active units is put on hold, and if the total current is less than the active current threshold or the total power is less than the active power threshold, inspection of the active unit is continued. (c) Determination process: At the timing when the non-operating unit starts inspection, the total current is compared with a processing speed current threshold or the total power is compared with a processing speed power threshold, and if the comparison result shows that the total current is equal to or greater than the processing speed current threshold or the total power is equal to or greater than the processing speed power threshold, low power and low speed processing content is set and inspection of the non-operating unit is started, and if the total current is less than the processing speed current threshold or the total power is less than the processing speed power threshold, high power and high speed processing content is set and inspection of the non-operating unit is started. Inspection method for inspection system.

2. performing all of the determination process (a), the determination process (b), and the determination process (c); 2. A method for inspecting the inspection system of claim 1.

3. A current threshold to be compared with the total current is set to satisfy the following relationship (1), or a power threshold to be compared with the total power is set to satisfy the following relationship (2). The processing speed current threshold ≦ the start current threshold < the operating current threshold (1) The processing speed power threshold≦the starting power threshold<the operating power threshold (2) 3. A method for inspecting the inspection system according to claim 2.

4. The current threshold to be compared with the total current or the power threshold to be compared with the total power can be set according to a user operation. An inspection method for the inspection system according to any one of claims 1 to 3.

5. In waiting for the inspection of the non-operating unit by the determination process of (a), When the total current is equal to or greater than a release current threshold or the total power is equal to or greater than a release power threshold, the standby of the non-operating unit is continued, and when the total current is less than the release current threshold or the total power is less than the release power threshold, an inspection of the non-operating unit is started; The release current threshold is set to be equal to or lower than the start current threshold, or the release power threshold is set to be equal to or lower than the start power threshold.

5. An inspection method for the inspection system according to claim 1.

6. In the waiting for inspection of the operating unit by the determination process of (b), continuing to wait for the active unit when the total current is greater than or equal to a restart current threshold or the total power is greater than or equal to a restart power threshold, and resuming testing of the active unit when the total current falls below the restart current threshold or the total power falls below the restart power threshold; The resume current threshold is set to less than or equal to the operating current threshold, or the resume power threshold is set to less than or equal to the operating power threshold. An inspection method for the inspection system according to any one of claims 1 to 5.

7. In the waiting for the inspection of the operating unit by the judgment process of (b), the inspection is continued until the inspection item already being performed in the operating unit is completed, and the inspection is waited for the execution of the next inspection item.

7. A method for inspecting the inspection system according to claim 1.

8. the plurality of inspection units each having a low-throughput program for inspecting with the low-power and low-speed processing content and a high-throughput program for inspecting with the high-power and high-speed processing content, By the determination process of (c), the non-operating unit executes either the low throughput program or the high throughput program. An inspection method for the inspection system according to any one of claims 1 to 7.

9. The inspection unit has a tester and a probe card that is attached to the tester and contacts the substrate to be inspected, and inspects electrical characteristics of a semiconductor device formed on the substrate.

9. A method for inspecting the inspection system according to claim 1.

10. An inspection system comprising a plurality of inspection units each for inspecting a plurality of objects to be inspected that are transported independently of each other, At least one of an ammeter that detects a total current, which is a sum of currents supplied to each of the plurality of inspection units, and a wattmeter that detects a total power, which is a sum of powers supplied to each of the plurality of inspection units; and a control unit that performs at least one of the following determination processes (a) to (c) based on the detected total current or total power. (a) Determination process: When an unoperated unit that has not been inspected among the plurality of inspection units starts inspection, the total current is compared with a start current threshold or the total power is compared with a start power threshold, and if the comparison result shows that the total current is equal to or greater than the start current threshold or the total power is equal to or greater than the start power threshold, the start of inspection of the unoperated unit is awaited, and if the total current is less than the start current threshold or the total power is less than the start power threshold, inspection of the unoperated unit is started. (b) Determination process: during inspection of an active unit being inspected among the plurality of inspection units, the total current is compared with an active current threshold or the total power is compared with an active power threshold, and if the comparison result shows that the total current is equal to or greater than the active current threshold or the total power is equal to or greater than the active power threshold, at least one of the active units is put on hold, and if the total current is less than the active current threshold or the total power is less than the active power threshold, inspection of the active unit is continued. (c) Determination process: At the timing when the non-operating unit starts inspection, the total current is compared with a processing speed current threshold or the total power is compared with a processing speed power threshold, and if the comparison result shows that the total current is equal to or greater than the processing speed current threshold or the total power is equal to or greater than the processing speed power threshold, low power and low speed processing content is set and inspection of the non-operating unit is started, and if the total current is less than the processing speed current threshold or the total power is less than the processing speed power threshold, high power and high speed processing content is set and inspection of the non-operating unit is started. Inspection system.

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