Gas box assembly for high pressure processing equipment

Abstract

To provide a gas box assembly which can structurally prevent risks of firing arising from gas leakage.SOLUTION: A gas box assembly for a high pressure processing apparatus includes: a housing having an inner space; a supply module disposed in the inner space and configured to supply a process gas to a chamber of the high pressure processing apparatus; an exhaust module configured to exhaust a gas occurring due to processing of an object in the chamber; and a loading module configured to load a protection gas into the inner space at a pressure higher than an external pressure of the housing to block external air from flowing into the inner space.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a gas box assembly used to supply gas to or evacuate gas from a chamber of a high pressure processing apparatus. [Background technology]

[0002] In general, various processes are performed on a semiconductor substrate during the manufacturing process of a semiconductor device, such as oxidation, nitridation, silicide, ion implantation, and chemical vapor deposition (CVD) processes, etc. Hydrogen or deuterium heat treatment processes are also used to improve interface characteristics of semiconductor devices.

[0003] Gases used in processing are supplied to the chamber at high pressure to act on the semiconductor substrate. The gases are supplied to and exhausted from the chamber by a gas box.

[0004] If gas leaks during the gas supply or exhaust process, it can cause problems such as surrounding pollution and fires. As the temperature of the processing process increases, the temperature of the exhaust gas also increases, and the risk of fire in the gas box increases. If the processing temperature is above the spontaneous ignition temperature of the gas, the risk of fire due to leakage increases. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a gas box assembly for a high-pressure processing apparatus which is structurally capable of preventing the risk of fire due to gas leakage from the gas box during processing, even if the processing is performed at high temperatures. [Means for solving the problem]

[0006] To achieve the above object, a gas box assembly for a high-pressure processing apparatus according to one aspect of the present invention may include a housing having an internal space, a supply module disposed in the internal space and configured to supply a process gas to a chamber of the high-pressure processing apparatus, an exhaust module configured to exhaust gas resulting from processing of an object in the chamber, and a filling module configured to fill the internal space with a protective gas at a pressure higher than an external pressure of the housing, thereby preventing external air from flowing into the internal space.

[0007] Here, the pressure of the inner space filled with the protective gas may be biased toward the external pressure more than the pressure of the chamber supplied with the process gas.

[0008] Here, the pressure of the internal space filled with the protective gas may be lower than the pressure of the process gas flowing through the supply module.

[0009] Here, the system may further include a sensing module that senses the environment of the internal space, and a control module configured to control the filling module, and the control module may control the filling module based on the sensing result of the sensing module.

[0010] Here, the sensing module may include a pressure gauge, and the control module may control the filling module to fill the protective gas so that the internal space reaches the set pressure when the pressure of the internal space sensed by the pressure gauge is less than a set pressure.

[0011] Here, the system further includes a sensing module that senses the environment of the internal space, an exhaust module that is configured to exhaust gas from the internal space, and a control module that is configured to control the exhaust module, and the control module may be configured to operate the exhaust module when it determines, based on the sensing result of the sensing module, that gas leakage has occurred from at least one of the supply module and the exhaust module into the internal space.

[0012] Here, the control module may control the filling module to fill the protective gas into the internal space to dilute the gas during a process of discharging the gas from the internal space.

[0013] Here, the filling module adjusts the flow rate of the protective gas into the internal space. filling The gas regulator may include a gas regulator filler configured to

[0014] Here, the filling module may include an emergency opening / closing filling device configured to fill the protective gas into the internal space at a maximum set flow rate during the gas discharge process.

[0015] Here, the sensing module may include at least one of a pressure gauge and a gas detector, and the control module may determine that the gas leak has occurred when the pressure of the internal space sensed by the pressure gauge exceeds a set pressure or when the gas detector senses the process gas.

[0016] Here, the system may further include a sensing module that senses the environment of the internal space, an inflow module configured to inflow the external air into the internal space, and a control module configured to control the inflow module, and the control module may operate the inflow module based on the oxygen concentration in the internal space sensed by the sensing module to control the oxygen concentration in the internal space to reach a set oxygen concentration.

[0017] Here, the object may include a semiconductor substrate, the process gas may include at least one of hydrogen, deuterium, fluorine, ammonia, and chlorine, and the protective gas may include an inert gas.

[0018] According to another aspect of the present invention, a gas box assembly for a high-pressure processing apparatus may include a housing having an internal space, an exhaust module disposed in the internal space and configured to exhaust gas resulting from processing an object in a chamber of the high-pressure processing apparatus at a temperature higher than the ignition point of a processing process gas, and a filling module configured to fill the internal space with a protective gas at a pressure higher than the external pressure of the housing, thereby preventing external air from flowing into the internal space.

[0019] Here, the system further includes a sensing module that senses the environment of the internal space, an exhaust module configured to exhaust gas from the internal space, and a control module configured to control the exhaust module, and the control module may be configured to operate the exhaust module when it is determined that gas leakage has occurred from the exhaust module to the internal space based on the detection result of the sensing module.

[0020] Here, the system may further include a sensing module that senses the environment of the internal space, an inflow module configured to inflow the external air into the internal space, and a control module configured to control the inflow module, and the control module may operate the inflow module based on the oxygen concentration in the internal space sensed by the sensing module, thereby controlling the oxygen concentration in the internal space to reach a set oxygen concentration. Effect of the Invention

[0021] According to the gas box assembly for high pressure processing equipment of the present invention, a supply module for supplying process gas to the processing chamber and an exhaust module for exhausting gas generated by processing from the chamber are installed in the inner space of the housing, and a filling module for filling the inner space with protective gas at a pressure higher than the pressure outside the housing is provided, so that outside air does not flow into the inner space. As a result, even if the process gas leaks into the inner space from the supply module or the exhaust module, the possibility of the leaked process gas coming into contact with outside air (oxygen) and igniting can be structurally eliminated. [Brief description of the drawings]

[0022] [Figure 1] 1 is a conceptual diagram of a gas box assembly for a high-pressure processing apparatus according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a block diagram for explaining the control configuration of the gas box assembly for high-pressure processing apparatus in FIG. [Diagram 3] 13 is a conceptual diagram of a gas box assembly for a high-pressure processing apparatus according to another embodiment of the present invention. [Figure 4] 4 is a flow chart for explaining one control method for the high pressure processing apparatus gas box assembly of FIG. 3. [Diagram 5] 7 is a flowchart for explaining another control method for the gas box assembly for high-pressure processing equipment in FIG. 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, a gas box assembly for a high pressure processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this specification, the same or similar reference numerals are given to the same or similar components in different embodiments, and the description thereof supersedes the first description.

[0024] FIG. 1 is a conceptual diagram of a gas box assembly for a high pressure processing apparatus according to one embodiment of the present invention.

[0025] Referring to the drawing, a high pressure processing apparatus gas box assembly 100 is configured for supplying gas to and exhausting gas therefrom.

[0026] The high-pressure processing apparatus HA will be described first as follows: The high-pressure processing apparatus HA is configured to have an inner chamber IC and an outer chamber EC.

[0027] The inner chamber IC forms a receiving space for receiving an object to be processed. The inner chamber IC may be made of a non-metallic material, for example, quartz, in order to reduce contamination in a high pressure and high temperature working environment. Although simplified in the drawing, a door (not shown) for opening the receiving space is provided at the lower part of the inner chamber IC. The door is lowered to open the receiving space, and the object is loaded into the inner chamber IC while being attached to a holder (not shown). The inner chamber IC is heated to several hundred to several thousand degrees Celsius by the operation of a heater (not shown) disposed outside the inner chamber IC. Depending on the process temperature of the high temperature process, if hydrogen is used as a gas to be loaded into the inner chamber IC, the hydrogen may be heated to 575 degrees Celsius or higher, which is its ignition point. The object may be, for example, a semiconductor substrate. In that case, the holder may be a wafer boat in which the semiconductor substrates can be stacked in a plurality of layers.

[0028] The outer chamber EC is formed to enclose the inner chamber IC. Unlike the inner chamber IC, the outer chamber EC is free from contamination issues, so the outer chamber EC may be made of metal. The outer chamber EC also has a door at the bottom, and when the door of the inner chamber IC is opened, the door of the outer chamber EC also descends and can be opened.

[0029] The following describes the gas box assembly 100. The gas box assembly 100 may include a housing 110, a supply module 120, an exhaust module 130, a fill module 140, an evacuation module 150, and a sensing module 160.

[0030] The housing 110 has an internal space 111. The housing 110 has a generally rectangular body. The housing 110 may have a door (not shown) for an operator to access the internal space 111 to replace / repair a supply module 120 (described later) and the like. The supply module 120, an exhaust module 130, and the like may be installed in the internal space 111.

[0031] The supply module 120 is configured to supply gas to the high pressure processing apparatus HA, specifically, to the chambers (IC and EC). The supply module 120 is connected to a utility line (gas supply line) of a semiconductor factory. The supply module 120 has a first supply line 121 connected to the inner chamber IC and a second supply line 125 connected to the outer chamber EC.

[0032] Gas for processing the target object, such as hydrogen / deuterium, fluorine, ammonia, chlorine, nitrogen, etc., is selectively supplied to the inner chamber IC via the first supply line 121. An inert gas, such as nitrogen or argon, is supplied to the outer chamber EC via the second supply line 125. The gas supplied to the outer chamber EC is specifically supplied to the space between the outer chamber EC and the inner chamber IC. The hydrogen, etc., supplied to the inner chamber IC and the nitrogen, etc., supplied to the outer chamber EC may all be referred to as process gas. This is because a high pressure processing process for the target object is performed by these gases.

[0033] The gas supplied to the inner chamber IC and the outer chamber EC may be supplied at a pressure higher than atmospheric pressure, for example, to form a high pressure of several atmospheres to several tens of atmospheres. When the pressure of the gas supplied to the inner chamber IC is a first pressure and the pressure of the gas supplied to the outer chamber EC is a second pressure, the second pressure is set in relation to the first pressure. For example, the second pressure may be set to be substantially the same as the first pressure or slightly higher than the first pressure. Such a pressure relationship provides the advantage that the gas in the inner chamber IC does not leak and the inner chamber IC is not damaged.

[0034] In order to set and maintain the relationship between the first pressure and the second pressure, a regulator 122 may be installed in the first supply line 121. The regulator 122 may measure and supply the amount of gas input to the inner chamber IC. For example, the regulator 122 may be a mass flow controller (MFC) that measures the flow rate of gas and calculates the input amount. A switch 123 is installed downstream of the regulator 122 to open and close the first supply line 121. A switch 127 may be installed in the second supply line 125. Unlike the regulator 122, the switch 127 does not measure the flow rate and adjusts opening and closing based on the pressure of the outer chamber EC.

[0035] The exhaust module 130 is configured to exhaust gas resulting from the processing of the object from the chambers (IC and EC). The gas resulting from the processing may be a mixed gas containing not only the process gas but also particles derived from the object. The gas resulting from the processing may have a high temperature due to a high-temperature process, for example, a gas having a temperature higher than the ignition point of the process gas. The exhaust module 130 may be connected to a utility line (gas exhaust line) of a semiconductor factory.

[0036] The exhaust module 130 has a first exhaust line 131 for exhausting gas from the inner chamber IC and a second exhaust line 135 for exhausting gas from the outer chamber EC. The first exhaust line 131 is connected to an upper portion of the inner chamber IC and may be extended to the outside of the outer chamber EC. An exhaust valve 133 is installed in the first exhaust line 131. The second exhaust line 135 is connected to the outer chamber EC and may be installed with an exhaust valve 137. The second exhaust line 135 is integrated into the first exhaust line 131. In this case, hydrogen or the like exhausted along the first exhaust line 131 is diluted with nitrogen or the like exhausted along the second exhaust line 135 to reduce its concentration.

[0037] The filling module 140 is configured to fill the internal space 111 with a protective gas. The protective gas may be, for example, an inert gas. The inert gas includes, for example, nitrogen and argon.

[0038] By filling the protective gas, the pressure (third pressure) of the internal space 111 has characteristics different from the first pressure and the second pressure. The third pressure is higher than the external pressure of the housing 110 (usually atmospheric pressure) but lower than the first pressure and the second pressure. Specifically, the third pressure is a value biased toward the external pressure more than the first pressure and the second pressure, and is at a level slightly higher than atmospheric pressure. For example, the third pressure may be a pressure that is tens to hundreds of Pa higher than atmospheric pressure. It is sufficient that the third pressure is set to a level that can block the inflow of external air (oxygen) into the internal space 111.

[0039] The third pressure is also lower than the pressure of the gas (process gas, specifically, the gas for treating the object) flowing through the supply module 120. In this case, even if a crack or the like occurs in the gas lines 121, 125 of the supply module 120 located in the internal space 111, the protective gas will not flow into the internal chamber IC through the crack or the like. As a result, the set composition of the gas for treating the object in the internal chamber IC will not be impaired even if the crack or the like occurs.

[0040] The exhaust module 150 is configured to exhaust the gas in the internal space 111. The gas in the internal space 111 is mainly the protective gas, but may also be mixed with the process gas. The latter corresponds to a case where the process gas leaks from the supply module 120 or the exhaust module 130.

[0041] The exhaust module 150 includes an exhaust duct 151 communicating with the internal space 111. The exhaust duct 151 can communicate with a utility line (gas exhaust line) of a semiconductor factory. A gate valve 155 may be installed in the exhaust duct 151. When it is necessary to exhaust the gas in the internal space 111, the gate valve 155 is opened under the control of the control module 170 (see FIG. 2).

[0042] The sensing module 160 may include a pressure gauge 161 and a gas sensor 165 to sense the environment of the internal space 111. The pressure gauge 161 is for sensing the gas pressure in the internal space 111. The gas sensor 165 is for sensing the process gas (specifically, active gas such as hydrogen) leaked into the internal space 111, and further, gas such as oxygen flowing in from the outside.

[0043] The control configuration of the gas box assembly 100 will be described with reference to Fig. 2. Fig. 2 is a block diagram for explaining the control configuration of the gas box assembly for high pressure processing apparatus of Fig. 1.

[0044] With reference to the drawings (and FIG. 1), the gas box assembly 100 may further include a control module 170 and a containment module 180 in addition to the previously mentioned supply module 120, exhaust module 130, fill module 140, etc.

[0045] The control module 170 is configured to control the supply module 120, the exhaust module 130, the filling module 140, and the discharge module 150. The control module 170 controls the filling module 140 and the discharge module 150 based on the detection result of the detection module 160.

[0046] The storage module 180 is configured to store data, programs, etc. that the control module 170 can refer to for control purposes.

[0047] According to this configuration, the control module 170 fills the internal space 111 with the protective gas based on the detection result of the detection module 160, or exhausts the gas in the internal space 111 due to the leakage of the process gas. For the former, the control module 170 controls the filling module 140, and for the latter, the control module 170 controls the exhaust module 150.

[0048] The control module 170 controls the filling module 140 together with the exhaust module 150, so that the protective gas is introduced into the internal space 111 when the gas in the internal space 111 is exhausted. This allows the concentration of the process gas to be diluted if the process gas leaks into the internal space 111. The introduction of the protective gas may also facilitate the exhaustion of the process gas.

[0049] The control module 170 can exhaust gas from the chamber of the high pressure processing apparatus HA as well as exhaust gas from the internal space 111. This is because processing in the chamber cannot proceed any further if a problem occurs due to leakage from the gas box assembly 100. To exhaust the chamber, the control module 170 can control the exhaust module 130.

[0050] Another embodiment of the above gas box assembly 100 will now be described with reference to FIGS.

[0051] First, FIG. 3 is a conceptual diagram of a gas box assembly for a high pressure processing apparatus according to another embodiment of the present invention.

[0052] Referring to this drawing, the gas box assembly 200 is generally the same as the gas box assembly 100 of the previous embodiment, but differs slightly in that a specific configuration for the filling module 240 is presented and an inlet module 290 is added. The configuration of the high pressure processing apparatus HA (see FIG. 1) is omitted in this drawing.

[0053] The filling module 240 includes a regulation line 241 and a bypass line 245 that are connected to the internal space 211 to supply air to the internal space 211. The regulation line 241 is directly connected to a utility line (gas supply line) of the semiconductor factory, and the bypass line 245 is branched off from the regulation line 241.

[0054] A gas regulating filler 242 may be installed in the regulating line 241. The gas regulating filler 242 is configured to supply the protective gas to the internal space 211 in a normal operation mode. The gas regulating filler 242 is responsible for the function of regulating the supply flow rate of the protective gas to maintain a set pressure for the internal space 211. To this end, the gas regulating filler 242 is controlled based on the pressure sensed by the pressure gauge 261.

[0055] An emergency opening / closing filler 246 may be installed in the bypass line 245. The emergency opening / closing filler 246 does not adjust the supply flow rate of the protective gas to fill it. It is configured to supply the protective gas to the internal space 211 at the maximum set flow rate in an emergency operation mode {a mode for discharging gas from the internal space 211}. It also maintains a closed state in a normal operation mode. By supplying a large amount of the protective gas to the internal space 211, the leaking gas in the internal space 211 can be discharged more quickly while remaining diluted.

[0056] A regulator 243 and a manual valve 244 may also be installed in the control line 241. The regulator 243 adjusts the flow rate of the protective gas flowing in from the utility line so that the maximum set flow rate can be changed. The manual valve 244 is a manual valve for turning on and off the flow of the protective gas itself through the control line 241.

[0057] The inlet module 290 is a component for inflowing external air into the internal space 211. Specifically, the inlet module 290 may be a damper that is opened and closed under the control of the control module 170 (see FIG. 2). When the damper is opened while the exhaust module 150 is operating, the external air can flow into the internal space 211.

[0058] The gas control method for the internal space 211 in the above configuration will be described with reference to FIGS.

[0059] FIG. 4 is a flow chart illustrating one control method for the high pressure processing apparatus gas box assembly of FIG.

[0060] 2 to 3, the pressure of the gas in the internal space 211 is sensed by a pressure gauge 261 in order to fill the internal space 211 with the protective gas or to exhaust the gas from the internal space 211 (S1).

[0061] The control module 170 compares the sensed pressure to a set pressure set for the interior space 211 (S2).

[0062] If the sensed pressure is less than the set pressure (S3), the control module 170 controls the filling module 240 to add the protective gas (S4). Specifically, the control module 170 operates the gas regulating filler 242 so that the pressure in the internal space 211 reaches the set pressure.

[0063] If the sensed pressure is equal to the set pressure (S5), the state may be maintained. In this case, the control module 170 does not operate the filling module 240.

[0064] If the detected pressure exceeds the set pressure (S6), the control module 170 determines that there is a gas leak (S7). This is because the pressure in the internal space 211 increases due to gas leakage from at least one of the supply module 220 and the exhaust module 230 into the internal space 211. In response to the gas leakage, the emergency open / close filler 246 is operated to inject the protective gas into the internal space 211 at the maximum set flow rate. The injection of the protective gas dilutes the concentration of the leaked gas (S8). The diluted leaked gas is exhausted through the exhaust duct 251 by opening the gate valve 255 (S9). When the gas in the internal space 211 is exhausted, the gas in the internal chamber IC and the external chamber EC can also be exhausted through the exhaust lines 231, 235.

[0065] The gas leakage determination (S7), dilution (S8), and exhaust (S9) can also be performed by detecting gas in the internal space 211 (S10). When the gas detector 265 detects the process gas (S11), the control module 170 determines that a gas leakage has occurred (S7). In this case, the dilution (S8) and exhaust (S9) are performed sequentially.

[0066] FIG. 5 is a flow chart for explaining another control method for the gas box assembly for high pressure processing equipment of FIG.

[0067] Referring to this drawing, the gas sensor 265 senses the oxygen concentration in the internal space 211 in order to determine whether or not to allow an operator to approach the gas box assembly 200 for maintenance (S21).

[0068] If it is determined that the detected oxygen concentration is less than the set oxygen concentration (S23), external air is introduced into the internal space 211 (S25). To this end, the control module 170 controls the inflow module 290 to open the damper. Specifically, when the gate valve 255 is opened and the internal space 211 is in a negative pressure state, the damper is opened to allow external air to flow into the internal space 211, which has a pressure lower than the outside.

[0069] When it is determined that the oxygen concentration in the internal space 211 is equal to or higher than the set oxygen concentration (S23), it is possible for the worker to approach the internal space 211. The control module 170 notifies the worker that the worker can approach the internal space 211 (S27). The notification can be given by visual or audio means.

[0070] According to this control, after a gas leak occurs in the internal space 211 and the gas in the chamber of the high pressure processing apparatus HA and the internal space 211 is exhausted / discharged, an operator is permitted to approach the internal space 211 depending on the oxygen concentration in the internal space 211. In this process, an appropriate oxygen concentration is ensured, thereby preventing problems such as suffocation of the operator.

[0071] The gas box assembly for high pressure processing equipment as described above is not limited to the configurations and operation methods of the above-mentioned embodiments. The above-mentioned embodiments may be configured to be variously modified by selectively combining all or part of each embodiment. [Explanation of symbols]

[0072] 100, 200: Gas box assembly 110, 210: Housing 120, 220: Supply module 130, 230: Exhaust module 140, 240: Filling module 150, 250: Emission module 160, 260: Sensing module 170: Control module 180: Storage module

Claims

1. A housing having an interior space; a supply module disposed in the interior space and configured to supply a process gas to a chamber of the high pressure processing apparatus; an exhaust module configured to exhaust gases from processing of objects in the chamber; and A gas box assembly for a high pressure processing apparatus, comprising: a filling module configured to fill the internal space with a protective gas at a pressure set higher than an external pressure of the housing in a normal operating mode, so that the protective gas maintains the set pressure, thereby blocking external air from flowing into the internal space.

2. The pressure in the internal space due to the protective gas filling is 2. The gas box assembly for a high pressure processing apparatus according to claim 1, wherein the pressure in the chamber due to the supply of the process gas is biased toward an external pressure.

3. The pressure in the internal space due to the protective gas filling is 2. The gas box assembly for high pressure processing equipment of claim 1, wherein the pressure is lower than the pressure of the process gas flowing through said supply module.

4. A sensing module for sensing an environment of the interior space; and and a control module configured to control the filling module. The control module includes:

2. The gas box assembly for a high pressure processing apparatus according to claim 1, further comprising: a controller for controlling said filling module based on a sensing result of said sensing module.

5. the sensing module includes a pressure gauge; The control module includes:

5. The gas box assembly for a high pressure processing apparatus according to claim 4, further comprising: a pressure gauge for detecting a pressure in the internal space that is lower than a set pressure; a pressure gauge for detecting a pressure in the internal space that is lower than a set pressure; a pressure gauge for detecting a pressure in the internal space that is lower than a set pressure;

6. a sensing module for sensing an environment of the interior space; an exhaust module configured to exhaust gas from the interior space; and a control module configured to control the ejection module; The control module includes:

2. The gas box assembly for a high pressure processing apparatus as described in claim 1, configured to activate the exhaust module when it is determined that a gas leak has occurred from at least one of the supply module and the exhaust module into the internal space based on the detection result of the sensing module.

7. The control module includes:

7. The gas box assembly for high pressure processing equipment according to claim 6, further comprising: controlling said filling module to fill said inner space with said protective gas to dilute said gas during the process of exhausting said inner space.

8. The filling module comprises:

8. The gas box assembly for high pressure processing equipment of claim 7, further comprising a gas regulating filler configured to regulate the flow rate of the protective gas into the interior space.

9. The filling module comprises:

8. The gas box assembly for high pressure processing equipment according to claim 7, further comprising an emergency opening and closing filler configured to fill the internal space with protective gas at a maximum set flow rate during the gas discharge process.

10. The sensing module includes: at least one of a pressure gauge and a gas sensor; The control module includes:

7. The gas box assembly for a high pressure processing apparatus according to claim 6, wherein the gas leakage is determined to have occurred when the pressure of the internal space sensed by the pressure gauge exceeds a set pressure or when the gas detector senses the process gas.

11. a sensing module for sensing an environment of the interior space; an inlet module configured to inlet the outside air into the interior space; and a control module configured to control the inflow module; The control module includes:

2. The gas box assembly for a high pressure processing apparatus according to claim 1, further comprising: an inlet module that is operated based on the oxygen concentration in the internal space sensed by the sensing module, and is controlled so that the oxygen concentration in the internal space reaches a set oxygen concentration.

12. the object includes a semiconductor substrate; the process gas includes at least one of hydrogen, deuterium, fluorine, ammonia, and chlorine; 2. The gas box assembly for high pressure processing equipment of claim 1, wherein said protective gas comprises an inert gas.

13. A housing having an interior space; an exhaust module disposed in the internal space and configured to exhaust gas resulting from processing of an object at a temperature higher than the ignition point of the processing gas in the chamber of the high-pressure processing device; and A gas box assembly for a high pressure processing apparatus, comprising: a filling module configured to fill the internal space with a protective gas at a pressure set higher than an external pressure of the housing in a normal operating mode, so that the protective gas maintains the set pressure, thereby blocking external air from flowing into the internal space.

14. a sensing module for sensing an environment of the interior space; an exhaust module configured to exhaust gas from the interior space; and a control module configured to control the ejection module; The control module includes:

14. The gas box assembly for a high pressure processing apparatus according to claim 13, configured to activate the exhaust module when it is determined that gas leakage has occurred from the exhaust module to the internal space based on the detection result of the detection module.

15. a sensing module for sensing an environment of the interior space; an inlet module configured to inlet the outside air into the interior space; and a control module configured to control the inflow module; The control module includes:

14. The gas box assembly for a high pressure processing apparatus according to claim 13, wherein the inflow module is operated based on the oxygen concentration in the internal space sensed by the sensing module, and the oxygen concentration in the internal space is controlled to reach a set oxygen concentration.

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