Heat sink and electronic component module

Abstract

To achieve high heat dissipation, effectively dissipate heat, prevent an excessive temperature rise, and improve reliability with a simple configuration.SOLUTION: A heatsink includes a heat conductive plate and a resin coating 31 integrated with the heat conductive plate so as to cover at least a part of the surface of the heat conductive plate, the resin coating 31 includes a ventilating tube 34 through which a ventilating hole 33 passing through the heat conductive plate and the resin coating 31 passes, and at least a portion of the heat conducting plate is housed inside a cylinder wall 34a of the ventilating tube 34.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a heat sink and an electronic component module. [Background technology]

[0002] Conventionally, in electronic component modules mounting heat-generating electronic components such as LSIs and LEDs, a technique has been proposed in which, in addition to an electric circuit electrically connected to the electronic components, a metallic heat sink with high thermal conductivity is provided to dissipate heat generated by the electronic components (see, for example, Patent Document 1).

[0003] FIG. 13 is a cross-sectional view showing a conventional electronic component module on which heat-generating components are mounted.

[0004] In the figure, 891 denotes a light-emitting diode as a heat-generating component mounted in an LED lighting device that is an electronic component module. Also, 811 denotes a substrate on which a plurality of light-emitting diodes 891 are arranged, and the substrate is attached to the bottom plate of a resin case 831 of the LED lighting device via a metal heat dissipation fixing plate 861. Note that a plurality of heat dissipation fins 861a are formed on the lower surface of the heat dissipation fixing plate 861, and the heat dissipation fins 861a are embedded in the bottom plate of the resin case 831. Also, 832 denotes a light-transmitting cover, which is attached to the front surface of the resin case 831.

[0005] Furthermore, a heat dissipation cover 862 is attached to cover the upper surface of the substrate 811 except for the light emitting portion of the light emitting diode 891. The heat dissipation cover 862 is made of metal, and is fixed to the periphery of the substrate 811 so as to be in surface contact with a heat dissipation fixing plate 861.

[0006] As a result, the heat generated by the light emitting diodes 891 is effectively transferred to the heat dissipation fixing plate 861 through two paths, that is, a path via the heat dissipation cover 862 and a path via the substrate 811. The heat thus transferred to the heat dissipation fixing plate 861 is transferred from the heat dissipation fixing plate 861 and the heat dissipation fins 861a to the bottom plate of the resin case 831, and is dissipated from the outer surface of the resin case 831. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2002-299700 A Summary of the Invention [Problem to be solved by the invention]

[0008] However, in the conventional electronic component module, although the heat generated by light emitting diode 891 is designed to be dissipated to the external environment from the outer surface of resin case 831, since the outer surface of resin case 831 is flat, the heat dissipation to the external air is not necessarily sufficient, and the heat generated by light emitting diode 891 tends to accumulate inside. In recent years, with the use of high-brightness light emitting diodes, there is a demand for improved heat dissipation.

[0009] The object of this invention is to provide a heat sink and electronic component module which solves the above-mentioned problems of the conventional art, has a simple configuration, yet has high heat dissipation properties, can dissipate heat effectively, and can prevent excessive temperature rise, and is therefore highly reliable. [Means for solving the problem]

[0010] For this purpose, the heat sink comprises a heat conductive plate and a resin coating integrated with the heat conductive plate so as to cover at least a part of the surface of the heat conductive plate, the resin coating includes a ventilator tube through which vent holes passing through the heat conductive plate and the resin coating pass, and at least a part of the heat conductive plate is accommodated inside the tube wall of the ventilator tube. A heat sink, the ventilator extending upward and downward from the upper and lower surfaces of the resin coating. .

[0011] In another heat sink, the heat conductive plate further includes a cut-out portion, at least a portion of which is accommodated inside the cylindrical wall.

[0012] In still another heat sink, the heat conductive plate further includes a ventilation opening which is a through hole created by cutting and raising the cut-and-raised portion and is adjacent to the cut-and-raised portion, and the ventilation hole passes through the ventilation opening.

[0014] In yet another heat sink, at least a portion of the heat conduction plate is accommodated inside the cylindrical wall of the ventilation duct extending upward from the upper surface of the resin coating, and a slit-shaped wall opening is formed in the cylindrical wall of the ventilation duct extending downward from the lower surface of the resin coating.

[0015] The electronic component module includes a heat conductive plate, a resin coating integrated with the heat conductive plate so as to cover at least a portion of the surface of the heat conductive plate, and an electronic component mounted on a flat mounting portion of the heat conductive plate, the resin coating including a mounting recess formed so that the mounting portion is exposed, and a ventilation tube through which a ventilation hole passing through the heat conductive plate and the resin coating passes, and at least a portion of the heat conductive plate is accommodated inside a tube wall of the ventilation tube. An electronic component module, further comprising a circuit board including a conductive path connected to the electronic component, the resin coating housing the circuit board such that one end of the circuit board is connected to the mounting recess. .

[0017] In still another electronic component module, the ventilators are provided in plurality and are arranged so as to surround at least a portion of the periphery of the mounting recess in plan view.

[0018] In still another electronic component module, the thermally conductive plate further includes a cut-out portion, and the cut-out portion is formed so that a planar surface faces the mounting recess. Effect of the Invention

[0019] According to the present disclosure, the heat sink has a simple configuration yet has high heat dissipation properties, can effectively dissipate heat, can prevent an excessive temperature rise, and can improve reliability. [Brief description of the drawings]

[0020] [Figure 1] 2 is a perspective view of the electronic component module according to the embodiment as viewed from the top side. FIG. [Diagram 2] FIG. 2 is an exploded view of the electronic component module according to the present embodiment. [Diagram 3] FIG. 2 is a top view of the electronic component module according to the present embodiment. [Figure 4] 4 is a side cross-sectional view of the electronic component module according to the present embodiment, taken along the line AA in FIG. 3. [Diagram 5] 4 is a cross-sectional view of the electronic component module according to the present embodiment, taken along the line BB in FIG. 3. [Figure 6] 5 is an enlarged cross-sectional view of a main part of the electronic component module according to the present embodiment, and is an enlarged view of part C in FIG. [Figure 7] 2 is a perspective view of a heat conduction plate of the heat sink according to the embodiment of the present invention as viewed from above. FIG. [Figure 8] 4 is a top view of a thermally conductive plate of the heat sink according to the embodiment of the present invention. FIG. [Figure 9] 2 is a perspective view of the electronic component module according to the embodiment as viewed from the bottom side. FIG. [Figure 10] FIG. 2 is a bottom view of the electronic component module according to the present embodiment. [Figure 11] 11 is a cross-sectional view of the electronic component module according to the present embodiment, taken along the line DD in FIG. 10. [Figure 12] 12 is an enlarged cross-sectional view of a main part of the electronic component module in the present embodiment, and is an enlarged view of a part E in FIG. [Figure 13] FIG. 1 is a cross-sectional view showing a conventional electronic component module on which a heat-generating component is mounted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0022] FIG. 1 is an oblique view of the electronic component module of this embodiment as viewed from the top, FIG. 2 is an exploded view of the electronic component module of this embodiment, FIG. 3 is a top view of the electronic component module of this embodiment, FIG. 4 is a side cross-sectional view of the electronic component module of this embodiment as viewed from the arrow AA in FIG. 3, FIG. 5 is a cross-sectional view of the electronic component module of this embodiment as viewed from the arrow BB in FIG. 3, FIG. 6 is an enlarged cross-sectional view of a key portion of the electronic component module of this embodiment as viewed from the arrow C in FIG. 4, FIG. 7 is an oblique view of the thermal conduction plate of the heat sink of this embodiment as viewed from the top, and FIG. 8 is a top view of the thermal conduction plate of the heat sink of this embodiment.

[0023] In the figure, 1 denotes an electronic component module in this embodiment, which includes a heat generating element 91 mounted thereon, and a heat sink 30 for dissipating heat generated by the heat generating element 91. The heat generating element 91 is, for example, an active electronic component such as an LSI or an LED, but is not limited thereto, and may be any type of component that generates heat during operation. For convenience of explanation, the heat generating element 91 will be described as being an LED. The heat sink 30 includes a metal plate 61 as a thermally conductive plate having a roughly rectangular plate shape, and a resin coating 31 integrated with the metal plate 61 so as to cover at least a part of the surface of the metal plate 61.

[0024] In this embodiment, the expressions indicating directions such as up, down, left, right, front, and back used to explain the configuration and operation of each part such as the electronic component module 1, the heating element 91, the heat sink 30, etc. are not absolute but relative, and are appropriate when each part such as the electronic component module 1, the heating element 91, the heat sink 30, etc. is in the position shown in the figure, but if the position changes, they should be interpreted differently in accordance with the change in position.

[0025] 7 and 8, the metal plate 61 is a member integrally formed by subjecting a metal plate material having high thermal conductivity to processes such as punching, bending, cutting and raising, and is a roughly rectangular flat plate-like member in plan view, with its flat central portion being a mounting portion 61a to which the heating element 91 is attached and mounted. Also, a plurality of plate-like cut-and-raised portions 62, each formed by cutting and raising a portion of the metal plate 61, and ventilation-compatible openings 63, which are through holes created by cutting and raising the cut-and-raised portions 62 and adjacent to the cut-and-raised portions 62, are arranged so as to surround at least a portion of the periphery of the mounting portion 61a.

[0026] In the example shown in the figure, each cut-and-raised portion 62 is formed so that its planar surface 62a faces the mounting portion 61a and its back surface 62b opposite the surface 62a faces the ventilation opening 63. Furthermore, a plurality of resin passage openings 64, which are through holes smaller than the ventilation openings 63, are formed around the mounting portion 61a and at other appropriate locations. Furthermore, mounting member passage openings 66 are formed at the four corners of the roughly rectangular metal plate 61, respectively, through which mounting members such as bolts and rivets pass for mounting the electronic component module 1 to a support plate (not shown) located below it (in the negative direction of the Z axis).

[0027] The metal plate 61 is preferably made of a metal with high thermal conductivity such as a copper alloy, an aluminum alloy, etc., but is not limited to this and may be made of any type of metal. For convenience of explanation, the metal plate 61 will be described as being a copper plate with a thickness of about 0.8 mm.

[0028] Although the metal plate 61 has been given as an example of a heat-conducting plate, the plate is not limited to this, and may be made of ceramic or other material with good electrical conductivity as long as it enables the configuration of this embodiment.

[0029] The resin coating 31 is made of insulating resin such as synthetic resin, and is a member that is molded integrally with the metal plate 61 by insert molding, and is a thin coating with a thickness of about 1.0 [mm] that covers almost the entire upper and lower surfaces of the metal plate 61. Therefore, the outer shape of the resin coating 31 and the heat sink 30 is a roughly rectangular flat plate in a plan view. As shown in Fig. 4, a part of the resin that constitutes the molded resin coating 31 passes through the resin passage opening 64 of the metal plate 61 to connect the resin coating 31 covering the upper surface side (Z-axis positive side) of the metal plate 61 and the resin coating 31 covering the lower surface side (Z-axis negative side), so that the resin coating 31 and the metal plate 61 are firmly integrated and in close contact with each other.

[0030] The upper surface (side surface in the positive direction of the Z-axis) and the lower surface (side surface in the negative direction of the Z-axis) of the resin coating 31 have mounting recesses 32 formed in the portions corresponding to the mounting portion 61a. The mounting recesses 32 are recesses formed so as to recess from the upper and lower surfaces of the resin coating 31, and the mounting portion 61a of the metal plate 61 is exposed at the bottom. The heating element 91 is attached and mounted on the upper surface of the mounting portion 61a exposed in the mounting recess 32 on the upper surface side of the resin coating 31. For example, the lower surface of the heating element 91 is fixed to the upper surface of the mounting portion 61a by a thermally conductive adhesive such as solder or a thermally conductive adhesive applied between the mounting portion 61a and the heating element 91. The mounting recesses 32 on the lower surface of the resin coating 31 may be omitted as appropriate.

[0031] 2, an electric circuit recess 35, which is a strip-shaped recess with one end connected to the mounting recess 32, is formed on the upper surface of the resin coating 31. The other end of the electric circuit recess 35 reaches one end of the resin coating 31 in the longitudinal direction (X-axis direction). A circuit board 11 having a conductive path for supplying current to the heating element 91 is accommodated and attached in the electric circuit recess 35. The circuit board 11 is, for example, a board such as a printed wiring board made of a glass epoxy board with copper foil attached to a plate such as FR-4, or a flexible printed wiring board such as an FPC board, but is not limited to this and may be of any type. For example, it may be a molded interconnect device (MID) in which an electric circuit is plated on a plastic substrate or the like, or in some cases, a pattern may be formed directly on the resin coating 31 by resin plating. Here, for convenience of explanation, the circuit board 11 is described as being a flexible printed wiring board.

[0032] 1 to 3, a plurality of circuit-side connection pads 51 are exposed on the upper surface of the circuit board 11, and a plurality of connection pads (not shown) formed on the upper surface of the heating element 91 are connected to the circuit-side connection pads 51 by bonding wires 92. This electrically connects the heating element 91 to a conductive path (not shown) connected to the circuit-side connection pads 51 on the circuit board 11, and a current is supplied to the heating element 91 via the circuit board 11.

[0033] Further, at the four corners of the generally rectangular resin coating 31, mounting member accommodating openings 36 through which mounting members such as bolts and rivets for attaching the electronic component module 1 to a support plate (not shown) located below the electronic component module 1 are formed. Each mounting member accommodating opening 36 is formed at a position concentric with a mounting member passing opening 66 of the metal plate 61, so that a mounting member (not shown) can pass through the mounting member accommodating openings 36 of the resin coating 31 and the mounting member passing openings 66 of the metal plate 61, which are aligned with each other. As shown in FIG. 3, the diameter of the mounting member accommodating openings 36 is desirably set to be larger than the diameter of the mounting member passing openings 66, so that a head of a mounting member such as a bolt or rivet having a larger diameter than the shaft can be accommodated in the mounting member accommodating openings 36.

[0034] Furthermore, a plurality of blind holes 37 are formed at appropriate positions in the resin coating 31. In the example shown in Figs. 1 to 3, the blind holes 37 include elliptical and circular ones, and the inner diameters thereof include ones with large and small diameters. That is, the shape and size of each blind hole 37 can be set arbitrarily. Note that each blind hole 37 is desirably formed in the same position and with the same shape and size in the resin coating 31 covering the upper side of the metal plate 61 and in the resin coating 31 covering the lower side. Also, the blind holes 37 do not penetrate from the upper surface to the lower surface of the resin coating 31, but are blocked by the metal plate 61 present between the upper and lower surfaces of the resin coating 31. The blind hole 37 is a hole or recess created when the metal plate 61 is clamped from both the top and bottom by a protrusion formed to protrude into the cavity in order to hold the metal plate 61 in a predetermined position in the cavity of the mold into which resin is filled when the resin coating 31 is molded integrally with the metal plate 61 by insert molding, and when the filled resin hardens to form the molded resin coating 31, the protrusion is removed, and the blind hole 37 can be omitted as appropriate.

[0035] Furthermore, the resin coating 31 is formed with a plurality of ventilation holes 33, which are through holes penetrating in the thickness direction. Each ventilation hole 33 is formed at a position that matches the position of a ventilation opening 63 of the metal plate 61 and is configured to penetrate the metal plate 61 and the resin coating 31, but the opening is smaller than the opening of the ventilation opening 63, and it is preferable that each ventilation hole 33 passes through the corresponding ventilation opening 63 as shown in Fig. 5. In other words, it is preferable that the metal plate 61 that defines the periphery of the ventilation opening 63 is not exposed inside the ventilation hole 33.

[0036] A plurality of ventilators 34 are formed on the upper and lower surfaces of the resin coating 31, each of which defines the periphery of each ventilation hole 33 and extends upward and downward. The plurality of ventilators 34 are arranged in a manner surrounding at least a portion of the periphery of the mounting recess 32 in a plan view. Here, the ventilator 34 extending upward from the upper surface of the resin coating 31 is referred to as a first ventilator 34A, and the ventilator 34 extending downward from the lower surface of the resin coating 31 is referred to as a second ventilator 34B. When the first ventilator 34A and the second ventilator 34B are described collectively, they are described as a ventilator 34.

[0037] In the example shown in the figure, the ventilator 34 is a rectangular tube, but is not limited thereto, and may be a cylindrical tube, a hexagonal tube, an octagonal tube, or any other tube of any shape. For convenience of explanation, the ventilator 34 is described as being a rectangular tube. In the example shown in the figure, the ventilator 34 includes a first ventilator 34A and a second ventilator 34B, but either one of them can be omitted as necessary. That is, only either the first ventilator 34A or the second ventilator 34B may be present.

[0038] Each of the first ventilation tubes 34A includes four flat cylindrical walls 34a extending vertically upward from the upper surface of the resin coating 31, and each cylindrical wall 34a defines each of the four sides of the periphery of the ventilation hole 33 having a rectangular cross section. In addition, it is preferable that the upper ends of all the first ventilation tubes 34A are flush with each other and parallel to the upper surface of the resin coating 31. At least a part of the metal plate 61 is accommodated inside at least one cylindrical wall 34a. Specifically, in each of the first ventilation tubes 34A, the cut-and-raised portion 62 of the metal plate 61 is accommodated inside the mounting portion 61a of the metal plate 61, i.e., the cylindrical wall 34a facing the mounting recess 32 of the resin coating 31. In other words, the planar front surface 62a and back surface 62b of the cut-and-raised portion 62 and the edge of the cut-and-raised portion 62 are covered with the resin that constitutes the cylindrical wall 34a.

[0039] It is sufficient that at least a part of the cut-and-raised portion 62 is accommodated inside the tube wall 34a. For example, in the example shown in the figure, the cut-and-raised portion 62 is cut and raised to an angle of about 90 degrees with respect to the upper surface of the metal plate 61, but it may be cut and raised at a smaller angle and inclined with respect to the upper surface of the metal plate 61. In this case, a part of the back surface 62b of the cut-and-raised portion 62 may be exposed or protrude into the ventilation hole 33. Furthermore, in the example shown in the figure, the cut-and-raised portion 62 is cut and raised so that its tip faces upward, but it may be cut and raised so that its tip faces downward. In this case, the cut-and-raised portion 62 may be accommodated inside the tube wall 34a of the second ventilation tube 34B, not the first ventilation tube 34A.

[0040] In the example shown in the figure, the cylindrical wall 34a of the resin coating 31 facing the mounting recess 32 includes a missing portion 34b extending downward from the upper end, and a part of the upper end of the cut-and-raised portion 62 is exposed in the missing portion 34b. The missing portion 34b is a missing portion of the resin caused when the protrusion formed to protrude into the cavity presses the cut-and-raised portion 62 to hold the metal plate 61 at a predetermined position in the cavity of the mold into which the resin is filled when the resin coating 31 formed by the filled resin curing is removed from the mold, and can be omitted as appropriate.

[0041] In this embodiment, all parts of the metal plate 61 except for the parts exposed in the mounting recess 32, the mounting member receiving opening 36, the blind hole 37, and the missing part 34b are covered with the resin coating 31. That is, all parts of the metal plate 61, including the edge part 61e, are covered with the resin coating 31 except for extremely narrow parts that are indispensable for manufacturing or operation, such as a part required for manufacturing the heat sink 30, a part required for mounting the heating element 91 on the heat sink 30, and a part required for mounting the heat sink 30 on the support plate. Also, the edge part 61e of the metal plate 61 embedded inside the resin coating 31 reaches a position close to the edge part 31e of the resin coating 31. That is, the metal plate 61 is embedded in almost all parts of the resin coating 31, including every corner, in a plan view.

[0042] Generally, metals have high thermal conductivity but low emissivity, whereas resins have low thermal conductivity but high emissivity. Therefore, as in the heat sink 30 of this embodiment, when all parts of the metal plate 61 are covered with the thin resin coating 31 except for an extremely narrow part that is indispensable for manufacturing or operation, and the metal plate 61 is present in almost all parts of the resin coating 31, the heat generated by the heating element 91 is rapidly transmitted to all parts of the metal plate 61 through the metal plate 61, which has high thermal conductivity, and then is rapidly transmitted from the metal plate 61 to the surfaces of all parts of the resin coating 31 through the resin coating 31, which has low thermal conductivity but is formed thinly, and is rapidly dissipated to the external environment by radiation (radiation) from the surfaces of all parts of the resin coating 31, which has high emissivity.

[0043] Furthermore, the heat sink 30 in this embodiment has a plurality of ventilator tubes 34 through which vent holes 33 extending in the vertical direction and penetrating the metal plate 61 and the resin coating 31 pass. Therefore, the surrounding air rises quickly inside the vent holes 33 due to the so-called chimney effect, and heat is quickly dissipated from the inner circumferential surface of the vent holes 33 and the surface of the resin coating 31 around the ventilator tubes 34 by air convection. In addition, since a plurality of ventilator tubes 34 are formed, the surface area of ​​the resin coating 31 is increased, and heat is quickly dissipated from the wide surface of the resin coating 31 by radiation and air convection.

[0044] Furthermore, for example, when electronic component module 1 is attached to a support plate (not shown) located below it, the space between the lower surface of resin coating 31 and the support plate has low air flow rate and tends to trap heat, but the air in the space flows into ventilation holes 33 from the lower ends thereof and rises quickly, so that the heat in the space is quickly dissipated by air convection. Furthermore, because cut-and-raised portions 62 of metal plate 61 are housed inside cylindrical wall 34a, the heat generated by heating element 91 is quickly conducted through cut-and-raised portions 62 to cylindrical wall 34a, and is quickly dissipated by the air flowing through ventilation holes 33.

[0045] The cut-and-raised portion 62 is formed by cutting and raising the metal plate 61 so as to connect one side of the ventilation opening 63. However, the configuration protruding from the front surface 62a or the opposite back surface 62b of the metal plate 61 is not limited to this, and may be a cut-and-raised portion raised from an opposing side of the ventilation opening 63, or a configuration raised from the entire periphery of the ventilation opening 63 by pressing or the like. In other words, it is sufficient that the cut-and-raised portion 62 is formed along the periphery of the ventilation opening 63.

[0046] Next, the configuration of the lower surface side of the electronic component module 1 will be described in detail.

[0047] 9 is an oblique view of the electronic component module of this embodiment as viewed from the bottom side, FIG. 10 is a bottom view of the electronic component module of this embodiment, FIG. 11 is a cross-sectional view of the electronic component module of this embodiment, taken along the line DD in FIG. 10, and FIG. 12 is an enlarged cross-sectional view of a main portion of the electronic component module of this embodiment, taken along the line E in FIG. 11.

[0048] In the example shown in the figure, a mounting recess 32 is formed on the lower surface (side surface in the negative direction of the Z axis) of the resin coating 31, but no electric circuit recess 35 is formed. Therefore, the circuit board 11 is not attached to the lower surface of the resin coating 31, and a heating element 91 is not mounted on the lower surface of the mounting portion 61a exposed in the mounting recess 32. However, like the upper surface, the lower surface of the resin coating 31 has an attachment member accommodating opening 36, a blind hole 37, and ventilation holes 33 formed therein. In addition, second ventilation tubes 34B are formed to define the periphery of each ventilation hole 33 and extend downward (in the negative direction of the Z axis).

[0049] Each of the second ventilators 34B includes four flat cylindrical walls 34a extending vertically downward from the lower surface of the resin coating 31, and each cylindrical wall 34a defines one of the four sides of the periphery of the ventilation hole 33 having a rectangular cross section. It is preferable that the lower ends of all the second ventilators 34B are flush with each other and parallel to the lower surface of the resin coating 31. In all the second ventilators 34B, the cut-and-raised portion 62 of the metal plate 61 is not housed inside the cylindrical wall 34a. In some of the second ventilators 34B, the cylindrical wall 34a facing the mounting recess 32 of the resin coating 31 includes a slit-shaped wall opening 34c extending from the lower end to the lower surface of the resin coating 31. The ventilation hole 33 in the second ventilator 34B, including the wall opening 34c, is open on the underside of the resin coating 31, not only at the lower end of the second ventilator 34B but also at the wall opening 34c. Therefore, when the surrounding air rises quickly inside the ventilation hole 33 due to the so-called chimney effect, the air flows into the ventilation hole 33 through the lower end of the second ventilator 34B and the wall opening 34c.

[0050] Therefore, a large amount of air is quickly introduced into ventilation hole 33 from the surroundings and rises inside ventilation hole 33, so that a large amount of heat is quickly dissipated by air convection from the inner peripheral surface of ventilation hole 33 and the surface of resin coating 31 around ventilation tube 34. In addition, for example, when electronic component module 1 is attached to a support plate (not shown) located below it, if the lower end of second ventilation tube 34B is in contact with or close to the support plate, it is impossible or difficult for air to flow into ventilation hole 33 through the lower end of second ventilation tube 34B. However, even in such a case, a sufficient amount of air can flow into ventilation hole 33 from the surroundings through wall opening 34c and rise inside ventilation hole 33.

[0051] Thus, in this embodiment, the heat sink 30 includes the metal plate 61 and the resin coating 31 integrated with the metal plate 61 so as to cover at least a part of the surface of the metal plate 61. The resin coating 31 includes a ventilator 34 through which the ventilation holes 33 penetrating the metal plate 61 and the resin coating 31 pass, and at least a part of the metal plate 61 is accommodated inside the tube wall 34a of the ventilator 34. As a result, the heat sink 30 has a simple configuration, yet has high heat dissipation properties, can effectively dissipate heat, can prevent an excessive temperature rise, and can improve reliability.

[0052] Moreover, the metal plate 61 includes a cut-and-raised portion 62, at least a part of which is contained inside the cylindrical wall 34a. Therefore, heat is rapidly conducted through the cut-and-raised portion 62 to the cylindrical wall 34a, and is rapidly dissipated by the air rising inside the ventilation hole 33 due to the so-called chimney effect.

[0053] Furthermore, the metal plate 61 includes a ventilation opening 63 which is a through hole formed by cutting and raising the cut-and-raised portion 62 and is adjacent to the cut-and-raised portion 62, and the ventilation hole 33 passes through the ventilation opening 63. This allows the cut-and-raised portion 62 to be close to the ventilation hole 33, and heat is quickly transferred from the cut-and-raised portion 62 through the cylindrical wall 34a to the inner surface of the ventilation hole 33, and is quickly dissipated by the air rising inside the ventilation hole 33.

[0054] Furthermore, the ventilator 34 extends upward and downward from the upper and lower surfaces of the resin coating 31. This increases the surface area of ​​the resin coating 31, allowing heat to be dissipated quickly from the surface of the resin coating 31, and also increases the length of the ventilation holes 33, thereby enhancing the chimney effect.

[0055] Furthermore, at least a part of the metal plate 61 is housed inside the tube wall 34a of the ventilation tube 34 extending upward from the upper surface of the resin coating 31, and a slit-shaped wall opening 34c is formed in the tube wall 34a of the ventilation tube 34 extending downward from the lower surface of the resin coating 31. Therefore, even when it is impossible or difficult for air to flow into the ventilation hole 33 through the lower end of the ventilation tube 34 extending downward, a sufficient amount of air can flow into the ventilation hole 33 from the surroundings through the wall opening 34c and rise inside the ventilation hole 33.

[0056] In the present embodiment, the electronic module 1 includes a metal plate 61, a resin coating 31 integrated with the metal plate 61 so as to cover at least a part of the surface of the metal plate 61, and a heating element 91 which is an electronic component mounted on a flat mounting portion 61a of the metal plate 61. The resin coating 31 includes a mounting recess 32 formed so as to expose the mounting portion 61a, and a ventilator 34 through which a vent hole 33 penetrating the metal plate 61 and the resin coating 31 passes, and at least a part of the metal plate 61 is accommodated inside the tubular wall 34a of the ventilator 34. As a result, the electronic module 1 has a simple configuration, but has high heat dissipation properties, can effectively dissipate heat generated by the heating element 91, can prevent excessive temperature rise, and can improve reliability.

[0057] Furthermore, the device further includes a circuit board 11 including a conductive path connected to the heating element 91, and the resin coating 31 has one end connected to the mounting recess 32 and includes an electric circuit recess 35 that accommodates the circuit board 11. Therefore, the electrical connection work of the heating element 91 can be easily performed.

[0058] Further, the ventilation tubes 34 are provided in plurality and are arranged so as to surround at least a portion of the periphery of the mounting recess 32 in a plan view. Therefore, the heat generated by the heating element 91 can be quickly dissipated by the air rising in the surrounding ventilation holes 33.

[0059] Furthermore, the metal plate 61 includes a cut-and-raised portion 62, and the cut-and-raised portion 62 is formed so that a planar surface 62a faces the mounting recess 32. Therefore, the heat generated by the heating element 91 can be quickly transferred to the tube wall 34a of the ventilator 34 via the cut-and-raised portion 62, and dissipated.

[0060] It should be noted that the disclosure of this specification describes the features of the preferred and exemplary embodiments, and that various other embodiments, modifications, and variations within the scope and spirit of the appended claims will occur to those skilled in the art upon review of the disclosure of this specification. [Industrial Applicability]

[0061] The present disclosure can be applied to a heat sink and an electronic component module. [Explanation of symbols]

[0062] 1 Electronic Module 11 Circuit Board 30 Heat sink 31 Resin coating 31e, 61e edge 32 Mounting recess 33 Ventilation hole 34 Ventilation tube 34a Cylinder wall 34A 1st ventilation tube 34b Missing part 34B 2nd ventilation tube 34c wall opening 35 Recess for electrical circuit 36 Mounting material receiving port 37 Blind Hole 51 Circuit side connection pad 61 Metal plate 61a Mounting section 62 Cut-and-origin part 62a surface 62b Back 63 Ventilation opening 64 Resin passage port 66 Mounting material passage hole 91 Heating element 92 Bonding Wire 811 Substrate 831 Resin Case 832 Translucent cover 861 Heat dissipation fixing plate 861a Heat sink fin 862 Heat dissipation cover 891 Light Emitting Diode

Claims

1. (a) a heat conductive plate; and a resin coating integrated with the heat conductive plate so as to cover at least a portion of a surface of the heat conductive plate; (b) the resin coating includes a ventilator tube through which vent holes passing through the heat conduction plate and the resin coating pass, and at least a portion of the heat conduction plate is accommodated inside a tube wall of the ventilator tube; (c) A heat sink characterized in that the ventilator extends upward and downward from the upper and lower surfaces of the resin coating.

2. The heat sink according to claim 1 , wherein the heat conductive plate includes a cut-out portion, at least a portion of the cut-out portion being accommodated inside the cylindrical wall.

3. The heat sink according to claim 2 , wherein the heat conductive plate includes a ventilation opening adjacent to the cut-and-raised portion, the ventilation hole passing through the ventilation opening.

4. A heat sink as described in claim 1, wherein at least a portion of the heat conduction plate is housed inside the cylindrical wall of the ventilation tube extending upward from the upper surface of the resin coating, and a slit-shaped wall opening is formed in the cylindrical wall of the ventilation tube extending downward from the lower surface of the resin coating.

5. (a) a heat conductive plate; a resin coating integrated with the heat conductive plate so as to cover at least a portion of a surface of the heat conductive plate; and an electronic component mounted on a flat mounting portion of the heat conductive plate; (b) an electronic component module, wherein the resin coating includes a mounting recess formed so that the mounting portion is exposed, and a ventilator tube through which vent holes passing through the heat conduction plate and the resin coating pass, and at least a portion of the heat conduction plate is accommodated inside a tube wall of the ventilator tube, (c) further comprising a circuit board including a conductive path connected to the electronic component; (d) An electronic component module, characterized in that the resin coating accommodates the circuit board so that one end of the circuit board is connected to the mounting recess.

6. The electronic component module according to claim 5 , wherein the ventilator is a plurality of ventilators arranged so as to surround at least a portion of the periphery of the mounting recess in a plan view.

7. 7. The electronic component module according to claim 5, wherein the heat conductive plate includes a cut-out portion, and the cut-out portion is formed so that a planar surface of the cut-out portion faces the mounting recess.

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