Detection Equipment

The detection device addresses the issue of heat dissipation gel falling onto the sensor magnet in integrated motors by using strategically placed holes in both the housing and substrate to redirect the gel, ensuring effective prevention and reliable motor operation.

JP7673650B2Active Publication Date: 2025-05-09DENSO CORP
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Patent Information

Application Number
JP2022007239
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-01-20
Publication Date
2025-05-09
Estimated Expiration
2042-01-20

AI Technical Summary

Technical Problem

In mechanical and electrically integrated motors, heat dissipation gel can fall onto the sensor magnet through holes in the housing, and blocking these holes with high permeability material is difficult to implement effectively.

Method used

A detection device is designed with a housing that contains a detection object, a substrate, a sensor, and a heat dissipation gel. The device includes holes in the housing and substrate, which guide the gel away from the sensor magnet, preventing it from falling.

Benefits of technology

The detection device effectively prevents the heat dissipation gel from falling onto the sensor magnet, even if the holes in the housing are not blocked, thereby ensuring reliable operation of the motor.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a detection device capable of suppressing a gel such as a heat dissipation gel from falling on a detection object without necessarily closing a hole in a housing.SOLUTION: A detection device includes a detection target, a housing that accommodates the detection target, a substrate attached to the outside of the housing, a sensor attached to the substrate on the housing side and configured to detect the detection target, a hole in the housing formed at a position overlapping the sensor when viewed from the thickness direction of the substrate, a gel filled between the substrate and the housing, and a hole in the substrate located around the hole in the housing when viewed from the thickness direction.SELECTED DRAWING: Figure 5
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Description

[Technical field]

[0001] The present disclosure relates to a detection device. [Background technology]

[0002] Patent Document 1 discloses an electromechanical integrated motor. The electromechanical integrated motor includes a sensor magnet, a housing, a substrate, and a sensor. The housing accommodates the sensor magnet. The substrate is attached to the outside of the housing. The sensor is attached to the substrate on the side of the housing. The sensor detects magnetic flux from the sensor magnet. A heat dissipation gel is filled between the substrate and the housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-065011 Summary of the Invention [Problem to be solved by the invention]

[0004] In electromechanical integrated motors, a hole is generally formed in the housing to reduce the gap between the sensor and the sensor magnet. The sensor is disposed in the hole in the housing. There is a risk that the heat dissipation gel will get into the hole in the housing and fall onto the sensor magnet. In order to prevent the heat dissipation gel from falling, it is conceivable to block the hole in the housing with a high magnetic permeability material, as disclosed in Patent Document 1.

[0005] However, the process of attaching the high magnetic permeability material to an appropriate position is difficult. In one aspect of the present disclosure, it is preferable to provide a detection device that can prevent gel such as a heat dissipation gel from falling onto a detection target without necessarily blocking the hole in the housing. [Means for solving the problem]

[0006] One aspect of the present disclosure is a detection device comprising a detection target, a housing for accommodating the detection target, a substrate attached to the outside of the housing, a sensor attached to the side of the substrate on the housing and configured to detect the detection target, a hole in the housing formed at a position overlapping with the sensor when viewed from the thickness direction of the substrate, a gel filled between the substrate and the housing, and a hole in the substrate positioned around the hole in the housing when viewed from the thickness direction.

[0007] A detection device according to one aspect of the present disclosure can prevent gel, such as a heat dissipation gel, from falling onto a detection target without necessarily blocking holes in a housing. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view of the mechanically and electrically integrated motor as viewed from the rear side where a circuit board is provided. [Diagram 2] Fig. 2 is a plan view showing a state in which a circuit board is removed from the mechanically and electrically integrated motor shown in Fig. 1. Fig. 2 also shows a second surface of the circuit board and a configuration attached to the second surface. [Diagram 3] FIG. 4 is an explanatory diagram showing the positional relationship between a magnetic sensor and a sensor magnet. [Figure 4] FIG. 2 is an explanatory diagram showing rotation detection signals obtained from three magnetic sensors. [Diagram 5] FIG. 2 is an explanatory diagram illustrating a configuration around a magnetic sensor in the first embodiment. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] 7 is a cross-sectional view showing a cross section VII-VII in FIG. 5. [Figure 8] FIG. 11 is an explanatory diagram illustrating a configuration around a magnetic sensor in a second embodiment. [Figure 9] 9 is a cross-sectional view showing a cross section IX-IX in FIG. 8. [Figure 10] 9 is a cross-sectional view showing the XX section in FIG. 8. [Figure 11]FIG. 11 is an explanatory diagram illustrating a configuration around a magnetic sensor in a third embodiment. [Figure 12] 12 is a cross-sectional view showing the XII-XII cross section in FIG. 11. [Figure 13] 13 is a cross-sectional view showing the XIII-XIII cross section in FIG. 11. [Figure 14] FIG. 13 is an explanatory diagram illustrating a configuration around a magnetic sensor in a fourth embodiment. [Figure 15] 15 is a cross-sectional view showing a cross section along the line XV-XV in FIG. 14. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Exemplary embodiments of the present disclosure will now be described with reference to the drawings. First Embodiment 1. Overall configuration of the mechanically and electrically integrated motor 2 The overall configuration of the mechanically and electrically integrated motor 2 will be described with reference to Fig. 1 to Fig. 7. The mechanically and electrically integrated motor 2 corresponds to a detection device.

[0010] As shown in Fig. 1, the mechanically and electrically integrated motor 2 includes a housing 4 and a circuit board 10. The housing 4 houses the motor and a sensor magnet 30 shown in Fig. 2. The sensor magnet 30 corresponds to an object to be detected.

[0011] The circuit board 10 is attached to the outside of the housing 4. The circuit board 10 is fixed to a base portion which is a part of the housing 4. The base portion rotatably supports the rotating shaft of the motor. The base portion is made of aluminum die-casting. Aluminum die-casting is a non-magnetic material. Circuit components for driving the motor are mounted on the circuit board 10.

[0012] 1, a coil 12, a capacitor 14, etc. are mounted on a first surface 11 of a circuit board 10, the first surface 11 being the side opposite to the housing 4. The coil 12 and the capacitor 14 form part of a drive circuit for the motor.

[0013] 2, six switching elements 22 and three magnetic sensors 24A, 24B, and 24C are mounted on a second surface 13 of the circuit board 10, which is opposite to the first surface 11. The switching elements 22 switch the current path to the motor. The magnetic sensors 24A, 24B, and 24C are used to detect the rotational position of the motor.

[0014] The six switching elements 22 include three pairs. Each pair includes two switching elements 22. One of the two switching elements 22 functions as a high-side switch, and the other functions as a low-side switch. Each pair is assigned to one terminal of the motor. Each pair selectively applies a positive or negative power supply voltage to the terminal of the motor.

[0015] 1, a connector 16 and a terminal block 18 are fixed to the circuit board 10. The connector 16 connects an external DC power supply and a control device to the circuit board 10. The terminal block 18 connects a drive circuit to the motor.

[0016] The mechanically and electrically integrated motor 2 includes a waterproof cover (not shown). The waterproof cover covers the circuit board 10 from the outside. The waterproof cover protects the circuit board 10 and the inside of the housing 4. The waterproof cover is fixed to the housing 4.

[0017] The motor housed inside the housing 4 is a three-phase brushless motor. The terminal block 18 has three connection terminals. Each of the three connection terminals is connected to one of the three terminals of the motor.

[0018] The three magnetic sensors 24A, 24B, and 24C each detect a magnetic flux from the sensor magnet 30. As shown in Figs. 2 and 3, the sensor magnet 30 has a circular ring shape. The sensor magnet 30 is fixed to a rotor. The center of the ring of the sensor magnet 30 coincides with the central axis of rotation of the motor. The thickness direction of the sensor magnet 30 is parallel to the thickness direction of the circuit board 10 (hereinafter referred to as direction X).

[0019] The sensor magnet 30 is made of a permanent magnet. As shown in Fig. 3, when moving in the circumferential direction on the ring of the sensor magnet 30, the polarity of the permanent magnet is reversed every time the rotation angle θ increases by 45 degrees. A rotation angle of 45 degrees corresponds to an electrical angle of 180 degrees.

[0020] As shown in Fig. 3, the position of any point P on the ring in the circumferential direction can be expressed by a rotation angle θ. The line segment connecting point P and center O of the ring is denoted as L. The fixed straight line passing through center O is denoted as L0. The angle between L and L0 is the rotation angle θ, which represents the position of point P in the circumferential direction.

[0021] 2 and 3, when viewed from the direction X, the three magnetic sensors 24A, 24B, and 24C are positioned so as to overlap the sensor magnet 30. The three magnetic sensors 24A, 24B, and 24C are lined up in the circumferential direction of the sensor magnet 30 in the order of the magnetic sensors 24A, 24B, and 24C. The difference Δθ between the rotation angle θ of the magnetic sensor 24A and the rotation angle θ of the magnetic sensor 24B AB is 30 degrees. The difference Δθ between the rotation angle θ of the magnetic sensor 24B and the rotation angle θ of the magnetic sensor 24C is BC is 30 degrees. A rotation angle of 30 degrees corresponds to an electrical angle of 120 degrees.

[0022] When the sensor magnet 30 rotates with the rotation of the motor, the three magnetic sensors 24A, 24B, and 24C each output a sine wave. There is a phase difference of 120 electrical degrees between the sine wave output by the magnetic sensor 24A and the sine wave output by the magnetic sensor 24B. There is a phase difference of 120 electrical degrees between the sine wave output by the magnetic sensor 24B and the sine wave output by the magnetic sensor 24C.

[0023] The detection signal shown in Fig. 4 is obtained by shaping the sine waves output by the three magnetic sensors 24A, 24B, and 24C. The rotation position of the motor can be identified from the detection signal. The change pattern of the detection signal differs depending on whether the motor is rotating forward or reverse. Therefore, the rotation direction of the motor can be identified from the change pattern of the detection signal.

[0024] 2, three holes 25A, 25B, and 25C are formed in the housing 4. The holes 25A, 25B, and 25C penetrate the housing 4. When viewed from the direction X, the hole 25A is positioned to overlap with the magnetic sensor 24A. When viewed from the direction X, the hole 25B is positioned to overlap with the magnetic sensor 24B. When viewed from the direction X, the hole 25C is positioned to overlap with the magnetic sensor 24C.

[0025] The presence of hole 25A prevents interference between magnetic sensor 24A and housing 4. The presence of hole 25B prevents interference between magnetic sensor 24B and housing 4. The presence of hole 25C prevents interference between magnetic sensor 24C and housing 4.

[0026] As shown in Figures 2 and 6, heat dissipation gel 26 is filled between circuit board 10 and housing 4. Heat dissipation gel 26 dissipates heat generated by electronic components such as switching element 22. As shown in Figure 2, when viewed from direction X, heat dissipation gel 26 is on the direction YA side with hole 25A as the reference. When viewed from direction X, heat dissipation gel 26 is on the direction YB side with hole 25B as the reference. When viewed from direction X, heat dissipation gel 26 is on the direction YC side with hole 25C as the reference.

[0027] 2. Peripheral configuration of magnetic sensor 24B The configuration around the magnetic sensor 24B will be described with reference to Figs. 5 to 7. As shown in Figs. 5 and 6, the housing 4 has a protrusion 29. The protrusion 29 is formed in a portion of the housing 4 around the hole 25B of the housing 4 when viewed from the direction X. The protrusion 29 protrudes toward the circuit board 10. In the portion where the protrusion 29 exists, the distance between the circuit board 10 and the housing 4 is smaller than in the portion where the protrusion 29 does not exist.

[0028] As shown in FIG. 5, the circuit board 10 has a plurality of holes 31. The plurality of holes 31 are located around the hole 25B of the housing 4 when viewed from the direction X. The plurality of holes 31 are located on the direction YB side with respect to the hole 25B. As shown in FIG. 6, the plurality of holes 31 each penetrate the circuit board 10 in the direction X. As shown in FIG. 5, the shape of each of the plurality of holes 31 is circular when viewed from the direction X. The plurality of holes 31 are arranged in a honeycomb pattern. That is, when a honeycomb pattern is assumed, the plurality of holes 31 are each located at the position of a constituent unit of the honeycomb.

[0029] 6, when viewed from the direction X, of the hole 31 adjacent to the hole 25B, the portion on the hole 25B side is located in a position overlapping the protrusion 29. The diameter of the hole 31 increases as it progresses toward the housing 4 side along the direction X.

[0030] As shown in Figs. 5 and 7, the housing 4 includes a guide portion 33. The guide portion 33 is a portion that protrudes toward the circuit board 10. In the portion where the guide portion 33 is present, the distance between the circuit board 10 and the housing 4 is smaller than in the portion where the guide portion 33 is not present. As shown in Fig. 5, when viewed from the direction X, the guide portion 33 is formed in a portion that sandwiches the path 35. The path 35 is a path of the heat dissipation gel 26 that runs from the direction YB side through the hole 31 toward the hole 25B. When viewed from the direction X, the guide portion 33 is formed to sandwich the multiple holes 31.

[0031] The periphery of the magnetic sensor 24A and the periphery of the magnetic sensor 24C have the same configuration as the periphery of the magnetic sensor 24B. Around the magnetic sensor 24A, the multiple holes 31 are on the direction YA side with respect to the hole 25A. Around the magnetic sensor 24C, the multiple holes 31 are on the direction YC side with respect to the hole 25C.

[0032] 3. Benefits of the electromechanical integrated motor 2 (1A) The mechanically and electrically integrated motor 2 includes a hole 31. When the heat dissipation gel 26 moves toward the hole 25B along the path 35 shown in Fig. 5, at least a part of the heat dissipation gel 26 is guided to the hole 31 as shown in Fig. 6. Therefore, even if the hole 25B is not necessarily blocked, the heat dissipation gel 26 can be prevented from falling onto the sensor magnet 30. The holes 31 formed around the holes 25A and 25C also have the same effect.

[0033] Furthermore, the mechanically and electrically integrated motor 2 includes protrusions 29 around the holes 25A, 25B, and 25C. The protrusions 29 reduce the distance between the circuit board 10 and the housing 4. Due to the presence of the protrusions 29, the heat dissipation gel 26 is less likely to advance in the direction of the holes 25A, 25B, and 25C, and is more likely to be guided to the hole 31. As a result, the heat dissipation gel 26 can be further prevented from falling onto the sensor magnet 30.

[0034] (1B) Hole 31 has a circular shape. Therefore, even if hole 31 exists, the rigidity and vibration resistance of circuit board 10 are unlikely to decrease. (1C) As shown in Fig. 6, when viewed from direction X, the portion of hole 31 on the side of hole 25B is located in a position overlapping with protrusion 29. Therefore, protrusion 29 acts to lift heat dissipation gel 26 and guide it to hole 31. This makes it easier for heat dissipation gel 26 to be guided to hole 31. As a result, heat dissipation gel 26 can be further prevented from falling onto sensor magnet 30. Protrusions 29 formed around holes 25A and 25C have the same effect.

[0035] 6, the diameter of the hole 31 increases toward the housing 4 along the direction X. Therefore, the diameter of the hole 31 is large on the second surface 13. As a result, the heat dissipation gel 26 is more easily guided to the hole 31.

[0036] Moreover, the diameter of the hole 31 in the first surface 11 is small. Therefore, the rigidity of the circuit board 10 is less likely to decrease. Also, the area of ​​the portion of the first surface 11 where electronic components and wiring can be arranged can be increased.

[0037] (1E) The mechanically and electrically integrated motor 2 includes a guide portion 33. The guide portion 33 guides the heat dissipation gel 26 in the direction of the hole 31. As a result, the heat dissipation gel 26 can be further prevented from falling onto the sensor magnet 30.

[0038] (1F) The multiple holes 31 are arranged in a honeycomb pattern. This allows the diameter of each hole 31 to be small. As a result, the rigidity of the circuit board 10 is less likely to decrease. Furthermore, the area of ​​the first surface 11 where electronic components and wiring can be arranged can be increased. <Second embodiment> The second embodiment has a basic configuration similar to that of the first embodiment, and therefore differences will be described below. Note that the same reference numerals as those in the first embodiment indicate the same configuration, and the preceding description will be referred to.

[0039] In the first embodiment described above, the holes 31 are arranged in a honeycomb pattern when viewed from the direction X. In contrast, the second embodiment differs in that, as shown in FIG. 8, a plurality of holes 31 are arranged in a row along the edge of the hole 25B when viewed from the direction X. In addition, in the second embodiment, the holes 31 include first holes 31S having a first diameter and second holes 31L having a second diameter larger than the first diameter. When viewed from the direction X, the first holes 31S are arranged to sandwich the second holes 31L.

[0040] 9, when viewed from the direction X, the portion of the second hole 31L on the hole 25B side is positioned to overlap the protrusion 29. The diameter of the second hole 31L increases as it progresses toward the housing 4 along the direction X.

[0041] When viewed from the direction X, the portion of the first hole 31S on the hole 25B side is positioned to overlap the protrusion 29. The diameter of the first hole 31S increases as it progresses along the direction X toward the housing 4 side.

[0042] As shown in Figs. 8 and 10, the housing 4 includes a guide portion 33. The guide portion 33 is a portion that protrudes toward the circuit board 10. In the portion where the guide portion 33 is present, the distance between the circuit board 10 and the housing 4 is smaller than in the portion where the guide portion 33 is not present. As shown in Fig. 8, when viewed from the direction X, the guide portion 33 is formed in a portion that sandwiches a path 35. The path 35 is a path of the heat dissipation gel 26 that runs from the direction YB side through the first hole 31S or the second hole 31L toward the hole 25B. The guide portion 33 is formed corresponding to each of the first hole 31S and the second hole 31L.

[0043] According to the second embodiment described above in detail, in addition to the effects (1A) to (1E) of the first embodiment described above, the following effect is also obtained. (2A) The heat dissipating gel 26 mainly flows toward the second hole 31L located in the center when viewed from the direction X. Since the diameter of the second hole 31L is large, it is easy to guide the heat dissipating gel 26 to the second hole 31L.

[0044] Moreover, since the diameter of the first hole 31S is small, it is difficult for the rigidity of the circuit board 10 to decrease. Furthermore, the area of ​​the portion of the first surface 11 in which electronic components and wiring can be arranged can be increased. (2B) The circuit board 10 has a plurality of holes 31. The guide portions 33 are formed to correspond to the first holes 31S and the second holes 31L, respectively. Therefore, the effect of (1E) above is more pronounced. <Third embodiment> The third embodiment has a basic configuration similar to that of the first embodiment, and therefore differences will be described below. Note that the same reference numerals as those in the first embodiment indicate the same configurations, and the preceding description will be referred to.

[0045] In the first embodiment described above, when viewed from the direction X, a plurality of circular holes 31 are formed around the magnetic sensor 24A, the magnetic sensor 24B, and the magnetic sensor 24C in the circuit board 10. In contrast, the third embodiment differs in that, when viewed from the direction X, one hole 31 is present around each of the magnetic sensor 24A, the magnetic sensor 24B, and the magnetic sensor 24C. FIG. 11 shows the hole 31 present around the magnetic sensor 24B. When viewed from the direction X, the shape of the hole 31 is a slit shape that extends in an arc along the edge of the hole 25B.

[0046] 12, when viewed from direction X, the portion of hole 31 on the hole 25B side is positioned to overlap with protrusion 29. As shown in Fig. 12, when viewed in a cross section across slit-shaped hole 31, the diameter of hole 31 increases toward housing 4 along direction X.

[0047] As shown in FIG. 11 and FIG. 13, the housing 4 includes a guide portion 33. The guide portion 33 is a portion that protrudes toward the circuit board 10. In the portion where the guide portion 33 is present, the distance between the circuit board 10 and the housing 4 is smaller than in the portion where the guide portion 33 is not present. As shown in FIG. 11, the guide portion 33 is formed in a portion that sandwiches the path 35 when viewed from the direction X. The path 35 is a path of the heat dissipation gel 26 that runs from the direction YB side through the hole 31 toward the hole 25B. When viewed from the direction X, the guide portion 33 is formed to sandwich the hole 31. The periphery of the magnetic sensor 24A and the periphery of the magnetic sensor 24C also have the same configuration.

[0048] According to the third embodiment described above in detail, in addition to the effects (1A) to (1E) of the first embodiment described above, the following effect is also obtained. (3A) Hole 31 has a slit shape. Therefore, hole 31 widely blocks path 35. As a result, heat dissipation gel 26 is more likely to be guided to hole 31 and is less likely to proceed in the direction of holes 25A, 25B, and 25C. <Fourth embodiment> The fourth embodiment has a basic configuration similar to that of the first embodiment, and therefore differences will be described below. Note that the same reference numerals as those in the first embodiment indicate the same configuration, and the preceding description will be referred to.

[0049] In the first embodiment described above, a plurality of circular holes 31 are formed around the magnetic sensors 24A, 24B, and 24C in the circuit board 10 when viewed from the direction X. In contrast, the fourth embodiment differs from the first embodiment in that, as shown in FIG. 14, a single hole 31 is formed corresponding to all of the magnetic sensors 24A, 24B, and 24C when viewed from the direction X.

[0050] Hole 31 has a shape of a single slit. When viewed from direction X, the portion of hole 31 on the hole 25A side is positioned to overlap with protrusion 29 formed around hole 25A. When viewed from direction X, the portion of hole 31 on the hole 25B side is positioned to overlap with protrusion 29 formed around hole 25B. When viewed from direction X, the portion of hole 31 on the hole 25C side is positioned to overlap with protrusion 29 formed around hole 25C.

[0051] 15, when viewed in a cross section across slit-shaped hole 31, the diameter of hole 31 increases toward housing 4 along direction X. Housing 4 does not include a guide portion 33. According to the fourth embodiment described above in detail, in addition to the effects (1A) to (1D) of the first embodiment described above, the following effect is also obtained.

[0052] (4A) Hole 31 has a slit shape. Therefore, hole 31 widely blocks path 35. As a result, heat dissipation gel 26 is more likely to be guided to hole 31 and is less likely to proceed in the direction of holes 25A, 25B, and 25C.

[0053] (4B) Hole 31 covers the periphery of magnetic sensor 24A, the periphery of magnetic sensor 24B, and the periphery of magnetic sensor 24C. Therefore, the effect of (4A) is more remarkable. <Other embodiments> Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and can be implemented in various modified forms.

[0054] (1) The detection device of the present disclosure may be a device other than the electromechanical integrated motor 2. The detection device of the present disclosure may include a sensor other than the magnetic sensors 24A, 24B, and 24C. The detection device of the present disclosure may include a detection target other than the sensor magnet 30.

[0055] (2) The shape of the holes 31 may be a shape other than a circle or a slit. (3) The detection device of the present disclosure may include a gel other than the heat dissipation gel 26. (4) In the first to fourth embodiments, the diameter of the hole 31 may be constant at any position in the X direction.

[0056] (5) In the first to fourth embodiments, the mechanically and electrically integrated motor 2 does not have to include the protruding portion 29. In addition, in the first to fourth embodiments, when viewed from the direction X, the portion of the hole 31 on the side of the holes 25A, 25B, and 25C may be located in a position that does not overlap with the protruding portion 29.

[0057] (6) In the first to third embodiments, the mechanically and electrically integrated motor 2 does not necessarily have to include the guide portion 33. (7) Multiple functions possessed by one component in the above embodiments may be realized by multiple components, or one function possessed by one component may be realized by multiple components. Also, multiple functions possessed by multiple components may be realized by one component, or one function realized by multiple components may be realized by one component. Also, part of the configuration of the above embodiments may be omitted. Also, at least part of the configuration of the above embodiments may be added to or substituted for the configuration of another of the above embodiments.

[0058] (8) In addition to the detection device described above, the present disclosure can be realized in various forms, such as a system including the detection device as a component, a manufacturing method for the detection device, etc. [Explanation of symbols]

[0059] Reference Signs List 2...Electromechanical integrated motor, 4...Housing, 10...Circuit board, 11...First surface, 12...Coil, 13...Second surface, 14...Capacitor, 16...Connector, 18...Terminal block, 22...Switching element, 24A, 24B, 24C...Magnetic sensor, 25A, 25B, 25C...Hole, 26...Heat dissipation gel, 29...Protrusion, 30...Sensor magnet, 31...Hole, 31L...Second hole, 31S...First hole, 33...Guide portion, 35...Path

Claims

1. A detection target; A housing that houses the detection target; A substrate attached to the outside of the housing; a sensor attached to the substrate on a side of the housing and configured to detect the detection target; a hole formed in the housing at a position overlapping with the sensor when viewed in a thickness direction of the substrate; A gel filled between the substrate and the housing; a hole in the substrate located around the hole in the housing as viewed in the thickness direction; a protrusion formed in a portion of the housing surrounding a hole when viewed in the thickness direction and protruding toward the substrate; Equipped with When viewed from the thickness direction, a portion of the hole of the substrate on a side of the hole of the housing is located at a position overlapping with the protrusion. Detection device.

2. A detection target, A housing that houses the detection target; A substrate attached to the outside of the housing; a sensor attached to the substrate on a side of the housing and configured to detect the detection target; a hole formed in the housing at a position overlapping with the sensor when viewed in a thickness direction of the substrate; A gel filled between the substrate and the housing; a hole in the substrate located around the hole in the housing as viewed in the thickness direction; Equipped with the hole in the substrate is circular in shape; the substrate has a first hole having a first diameter and a second hole having a second diameter larger than the first diameter; When viewed from the thickness direction, the first hole is disposed so as to sandwich the second hole. Detection device.

3. A detection target, A housing that houses the detection target; A substrate attached to the outside of the housing; a sensor attached to the substrate on a side of the housing and configured to detect the detection target; a hole formed in the housing at a position overlapping with the sensor when viewed in a thickness direction of the substrate; A gel filled between the substrate and the housing; a hole in the substrate located around the hole in the housing as viewed in the thickness direction; Equipped with a diameter of the hole in the substrate increases toward the housing along the thickness direction; Detection device.

4. A detection target, A housing that houses the detection target; A substrate attached to the outside of the housing; a sensor attached to the substrate on a side of the housing and configured to detect the detection target; a hole formed in the housing at a position overlapping with the sensor when viewed in a thickness direction of the substrate; A gel filled between the substrate and the housing; a hole in the substrate located around the hole in the housing as viewed in the thickness direction; a guide portion formed in a portion of the housing that sandwiches a path extending from a hole in the substrate to a hole in the housing when viewed in the thickness direction, the guide portion protruding toward the substrate; A detection device comprising:

5. 5. The detection device according to claim 4, A plurality of holes in the substrate; The guide portions are formed corresponding to the respective holes of the plurality of substrates. Detection device.

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