Liquid Cooling System

Abstract

To provide a liquid-cooled heat dissipation system with high heat dissipation efficiency that can be applied to standalone AI computers. [Solution] The liquid-cooled heat dissipation system includes a liquid-cooled vapor chamber, a liquid-cooled heat sink, a first liquid refrigerant pipe and a second liquid refrigerant pipe connecting the two, a liquid refrigerant circulator, a fan, and a liquid refrigerant. The liquid-cooled vapor chamber includes a liquid-cooled cover, a metal upper cover plate, and a metal lower cover plate. The liquid-cooled heat sink includes a heat dissipation base plate and a heat dissipation outer cover. The liquid refrigerant circulator pumps the liquid refrigerant from the first liquid refrigerant pipe to the liquid-cooled cover of the liquid-cooled vapor chamber, absorbs heat, and then flows into the liquid-cooled heat sink via the second liquid refrigerant pipe. The liquid refrigerant is cooled by blowing air onto the outer surface of the base plate of the liquid-cooled heat sink using a fan fixed to the outer surface of the base plate of the liquid-cooled heat sink, and the temperature of the liquid refrigerant is reduced as it flows through the second storage space in the liquid-cooled heat sink, and the liquid refrigerant is returned to the liquid refrigerant circulator for recirculation.

Description

[Technical field]

[0001] The present invention relates to a heat dissipation system, and more particularly to a liquid-cooled heat dissipation system. [Background technology]

[0002] The explosive development of generative artificial intelligence (generative AI) or AI generated content (AIGC) has significantly increased the demand for high-speed computing power and the development of high-end computing chip modules. The huge amount of data and processing speed required for the application of AIGC continues to increase the demand for high-end AI servers. High-end AI servers use a relatively large number of central processing units (CPUs) and graphic processors (GPUs) at the same time, and the number of transistors contained in the high-end chips used has reached 175 billion in response to the high-speed and large-scale computing requirements of generative artificial intelligence (e.g. ChatGPT). The large and high-density heat source associated with the high efficiency and high power consumption of AI server chips has become a major challenge in heat dissipation capacity. For example, the energy consumption of server processors was only about 180 to 280 W in 2018, but it is expected to double to more than 500 W in 2023. For example, the AMD 5nm process Genoa processor and the A100 chip released by leading GPU manufacturer NVIDIA in 2022 have an energy consumption of 400W, which is about 40-50% higher than the previous generation processor. In 2023, the energy consumption of the Bergamo processor will exceed 500W, and the new generation of high-end GPU H100 chip created by NVIDIA specifically for AI servers has a maximum power of 700W. As the number of chips used in a server increases, power consumption increases and the complexity of the modular design of the heat dissipation solution also increases.

[0003] With the upgrade of new generation GPU and CPU, server computing, AI image generation and e-sports applications are the main driving force of growth in the heat dissipation industry. From the perspective of server heat dissipation technology, it can be mainly divided into air cooling, liquid cooling and immersion cooling. Generally, when the thermal power consumption of the chip exceeds 300W, it is difficult to solve the heat problem by air cooling.

[0004] Immersion cooling can be divided into single-phase and two-phase immersion cooling. Immersion cooling has the highest heat dissipation efficiency and can reach more than 1500W. However, since immersion cooling requires immersing the server in a tank with a large amount of cooling liquid, the configuration of the machine room needs to be redesigned according to the application, and the cooling liquid is not only very expensive, but also has problems in terms of environmental protection in application. In addition, more actual application data is needed to further clarify whether other peripheral components such as chips, PCB boards, network interface cards, and power supplies can maintain normal operation when immersed in the cooling liquid.

[0005] Due to the ever-expanding computing power, ChatGPT or high-end AI servers need to have at least 700W of heat dissipation capacity to be sufficient. NVIDIA's A100 or H100 AI servers are usually equipped with 4 to 8 GPUs, each of which generates an additional 300 to 700W of heat energy, and the heat power consumption of the entire AI server is estimated to exceed 3,000W. Since conventional air-cooled heat dissipation cannot provide such efficient heat dissipation, the introduction of "liquid cooling" technology has become a new trend to solve heat consumption through heat dissipation. Liquid cooling heat dissipation introduces a liquid cooling system into the server, and using the property that liquid is more thermally conductive than gas, the high-density heat energy generated by the heat-generating components is quickly transferred to the cooling liquid by the liquid cooling plate, and the cooling liquid after absorbing heat is guided to an outdoor cooling tower or heat dissipation module, and the heat energy is further dissipated into the atmosphere, achieving the effect of rapid temperature reduction and reduced energy consumption. The open-type liquid cooling heat dissipation module, which is currently common in the industry, is an efficient cooling method that combines liquid cooling heat dissipation and air cooling heat dissipation in a server cabinet. This open-type liquid cooling heat dissipation module includes a liquid cooling plate module (Cold Plate), a cooling liquid distribution unit (CDU), and a cooling water manifold, and the cooling liquid passes through a radiator and a back door of a fan or a heat exchanger to lower the temperature. When the open-type liquid cooling heat dissipation module is in operation, the cooling liquid is pumped out by the cooling liquid distribution unit and flows through the cooling water manifold into the liquid cooling plate that is in close contact with the chip or processor. At this time, heat from the chip or processor is transferred by the liquid cooling plate and absorbed by the cooling liquid, and the cooling liquid after absorbing heat flows out from the heat pipe manifold at the other end of the liquid cooling plate. Next, the cooling liquid after absorbing heat is sent to the back door of the cabinet and is cooled by forced heat dissipation flowing through the fan back door. The cooling liquid after cooling returns to the cooling liquid distribution unit and is pumped out to the liquid cooling plate again.

[0006] Due to the miniaturization and high integration of AI computing chips, it is expected that the heat density of the chips will increase significantly, and it is becoming an important trend to move heat dissipation solutions closer to the core heat source such as the chip. Depending on the scale of application, liquid cooling and heat dissipation modules can be divided into machine room level of large data centers, server cabinet level, and chip-level liquid cooling and heat dissipation modules for future AI computers. The liquid cooling and heat dissipation modules required for AI computers are smaller in scale than the machine room level and cabinet level, and the heat dissipation efficiency needs to be fully managed in an environment where external ice machines and air conditioners are not turned on, which can reduce the power usage effectiveness (PUE) of the entire heat dissipation system.

[0007] A liquid cooling plate module, which is commonly seen in liquid cooling modules, covers the heat dissipation structure of a radiator with a liquid cooling cover, and the liquid cooling cover is fixed to a radiator to form a cavity. The liquid cooling cover has a liquid supply port and a liquid drain port, and the cooling liquid enters the cavity formed by fixing the liquid cooling cover and the radiator from the liquid supply port, flows through the heat dissipation structure, flows out from the liquid drain port, and flows through a pipe to an external heat dissipation system (for example, a method of running the pipe to a fin-type heat sink and further adding forced cooling by a fan), and dissipates the heat carried by the cooling liquid. However, when the metal base plate of the heat sink of the liquid cooling plate module contacts a heat-generating component, the lateral heat conduction speed of the metal base plate is limited by the cross-sectional area, and the large amount of heat rapidly generated by the heat-generating component cannot be efficiently conducted to the metal base plate of the entire heat sink, and the large amount of heat is concentrated in a local area where the heat sink and the heat-generating component contact, and even if liquid cooling heat dissipation is added, the heat dissipation capacity that can be improved is significantly limited. In addition, the external heat dissipation system utilizes heat exchange between the duct and the fin-type heat sink, and also uses a fan for air-cooling heat dissipation, so the direct heat dissipation area of ​​the cooling liquid is limited and the heat dissipation efficiency may be insufficient.

[0008] Considering the above problems, the inventor of the present invention has designed a liquid-cooled heat dissipation system including a liquid-cooled vapor chamber, in which the metal base plate of the heat sink of the liquid-cooled heat dissipation module is designed as a vapor chamber, the heat dissipation structure of the heat sink is integrated with the heat dissipation surface of the vapor chamber by integral molding, and the heat dissipation structure is covered in a cavity with a liquid-cooled cover to form the base plate as a vapor chamber. The liquid-cooled cover has a first liquid supply port and a first liquid drain port, and the cooling liquid flows in and out of these heat dissipation structures in the liquid-cooled cover, improving the heat exchange efficiency. The vapor chamber has the characteristics of high thermal conductivity, strong lateral thermal uniformity, and high thermal diffusion coefficient, and its heat diffusion ability is significantly superior to that of ordinary metal base plates (e.g., copper-based base plates, aluminum alloy base plates, etc.). When the heat-generating electronic components attached to the heat-absorbing surface of the vapor chamber generate a large amount of heat, the heat is rapidly transferred to the vapor chamber, and the working fluid in the internal space of the vapor chamber rapidly absorbs the heat and rapidly evaporates to form steam. The heat-dissipating surface of the vapor chamber is connected to the heat sink and the liquid-cooled cover, so that when the steam rises rapidly and contacts the cold metal surface of the heat sink, the steam condenses back into the working fluid, and this cycle of liquid-gas-liquid phase change quickly absorbs and releases a large amount of heat. Compared with the use of a traditional metal base plate, the vapor chamber can quickly diffuse a large amount of concentrated heat source to a larger area of ​​the heat sink, and obtain a larger effective heat dissipation area for faster heat dissipation.

[0009] Vapor chambers utilize the phase change of the working fluid in a sealed working chamber to rapidly dissipate heat, and are currently the most efficient heat dissipation method. They achieve the goal of rapid heat dissipation by utilizing the large amount of latent heat of vaporization that accompanies the rapid evaporation and condensation process of the working fluid in a near-vacuum chamber. The thermal conductivity of vapor chambers is 10,000W / (m 21.5 ℃ or more, which is dozens of times the thermal conductivity efficiency of conventional air convection or liquid convection. When the above-mentioned heat sink is integrated into the heat dissipation surface of the vapor chamber through one-piece molding, it can quickly and effectively transfer and disperse a large amount of heat from inside the vapor chamber to the heat dissipation structure, and greatly improve the heat dissipation efficiency.

[0010] In addition, the liquid-cooled heat dissipation system of the present invention further includes a liquid-cooled heat sink. The liquid-cooled heat sink is a plate-like structure having a hollow cavity, and the inner surface of the hollow cavity is provided with many protruding heat dissipation columns. The frame of the liquid-cooled heat sink is provided with at least one second liquid supply port and at least one second liquid drain port, and the second liquid supply port and the second liquid drain port are respectively connected to the first liquid drain port and the first liquid supply port of the liquid-cooled cover of the liquid-cooled vapor chamber through a liquid cooling pipe, so that the liquid cooling is repeatedly circulated between the liquid-cooled vapor chamber and the liquid-cooled heat sink. After the liquid cooling absorbs heat in the liquid cooling cover of the liquid-cooled vapor chamber, the liquid cooling is transported and enters the cavity of the liquid-cooled heat sink, and flows between the heat dissipation columns in the cavity. Many heat dissipation columns can provide a large heat exchange area, and a fan installed outside the liquid-cooled heat sink can dissipate heat by forcing air onto the external surface, quickly dispersing the cooling liquid after absorbing the heat onto the liquid-cooled heat sink, allowing the heat to be dissipated quickly. Summary of the Invention [Problem to be solved by the invention]

[0011] The present invention provides a liquid-cooling heat dissipation system with high heat dissipation efficiency that can be applied to a standalone AI computer. [Means for solving the problem]

[0012] The present invention provides a liquid cooling system, which includes at least one liquid-cooled vapor chamber, a liquid-cooled heat sink, at least one first liquid refrigerant line and at least one second liquid refrigerant line connected between the above two, a liquid refrigerant circulator, at least one fan and a liquid refrigerant.

[0013] To further explain, the liquid-cooled vapor chamber is a highly efficient liquid-cooled vapor chamber formed by combining a liquid-cooled cover with an integrated vapor chamber. The liquid-cooled vapor chamber of the present invention includes a liquid-cooled cover and an integrated vapor chamber. The liquid-cooled cover includes an upper portion and a side wall connected to the upper portion, the side wall surrounds the upper portion to form a first storage space, the side wall is provided with at least one first liquid supply port and at least one first liquid drain port, and the first liquid supply port and the first liquid drain port are connected to the first storage space. The integrated vapor chamber includes a metal upper cover plate, a metal lower cover plate, a working space, a bleed channel, a capillary structure, and a working fluid. The metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of first heat dissipation columns, an upper frame of an appropriate height is provided around the condensation inner surface to surround the condensation inner surface, an upper flow path groove is provided in the upper frame, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other, and the entire metal top cover plate including the first heat dissipation columns is integrally formed from a metal sheet (or a metal block).

[0014] The metal bottom cover plate includes a heat absorbing outer surface and an evaporation inner surface, the heat absorbing outer surface is used for contacting with heat generating electronic components, a lower frame of suitable height is provided around the evaporative inner surface, a lower flow groove is provided on the lower frame, and the evaporation inner surface has a plurality of parallel arranged lower grooves and a plurality of columnar support structures protruding between the lower grooves, the whole including the columnar support structures is integrally formed by a metal sheet (or a metal block), the lower frame is joined to the upper frame of the metal top cover plate to form a working space, the plurality of columnar support structures protruding and extending from the evaporation inner surface, connected between the upper grooves of the condensation inner surface, and supporting the working space. The intake channel is formed by correspondingly joining the upper flow groove and the lower flow groove, sucking air into the working space, sealing it after sucking air, and maintaining a vacuum state in the working space. The capillary structure is installed in the lower groove, or in the upper and lower grooves. The working fluid is present in the working space and the capillary structure. The above-mentioned liquid-cooled cover is coupled to the heat-dissipating outer surface of the metal top cover plate, and the first heat-dissipating column is disposed in the first accommodating space to form a liquid-cooled vapor chamber.

[0015] Based on the above embodiment, the liquid cooling cover includes a heat dissipation base plate and a heat dissipation outer lid. The heat dissipation base plate has a base plate inner surface and an opposing base plate outer surface. The base plate inner surface is provided with a plurality of second heat dissipation columns that protrude and are arranged in a substantially matrix shape, at least one flow guide plate groove that is long and groove-shaped and protrudes from the base plate inner surface and is installed between the plurality of second heat dissipation columns, and is used to attach at least one long sheet-shaped flow guide plate, and an outer lid joining groove that protrudes and is provided to surround the periphery of the base plate inner surface. The base plate outer surface is provided with a plurality of fan screw holes that protrude from the base plate outer surface, fix at least one of the fans, and perform air cooling for the base plate outer surface. The entire heat dissipation plate is integrally formed by the same metal sheet (metal block), including the plurality of second heat dissipation columns, the flow guide plate groove, the outer lid joining groove, and the fan screw hole.

[0016] The heat-dissipating outer cover has an outer cover side wall connected to the outer cover upper part and the bottom cover upper part. The outer cover side wall surrounds the outer cover upper part to form a second storage space. The outer cover side wall is provided with at least one second liquid supply port and at least one second liquid drain port, and the second liquid supply port and the second liquid drain port communicate with the second storage space. Here, when the heat-dissipating outer cover and the heat-dissipating base plate are fitted together, the outer cover side wall of the heat-dissipating outer cover can be inserted and welded into the outer cover joint groove of the heat-dissipating base plate, and the plurality of second heat-dissipating columns are installed in the second storage space to form the liquid-cooled heat dissipating plate. In this embodiment, one end of the first coolant pipe is connected to the first liquid supply port of the liquid-cooled vapor chamber and the other end is connected to the second liquid drain port of the liquid-cooled heat sink, and one end of the second coolant pipe is connected to the first liquid drain port of the liquid-cooled vapor chamber and the other end is connected to the second liquid supply port of the liquid-cooled heat sink. The coolant circulator is installed between the first coolant pipes or the second coolant pipes, and pumps the coolant to circulate and flow the coolant between the liquid-cooled vapor chamber and the liquid-cooled heat sink to form a liquid-cooled heat sink system.

[0017] In one embodiment of the present invention, the heat absorbing outer surface of the metal bottom cover plate of the liquid-cooled heat sink is a flat surface that contacts the heat-generating electronic components.

[0018] In one embodiment of the present invention, the heat absorbing outer surface of the metal bottom cover plate of the above-mentioned liquid-cooled heat sink further has at least one recessed space for accommodating at least one heat-generating electronic component, and the recessed space is recessed in a direction from the heat absorbing outer surface toward the evaporative inner surface but does not protrude from the corresponding evaporative inner surface.

[0019] In one embodiment of the present invention, the recessed spaces are multiple and accommodate a plurality of the heat-generating electronic components.

[0020] In one embodiment of the present invention, the recessed spaces have the same or different shapes and volumes, and accommodate a plurality of the heat-generating electronic components of the same or different shapes and volumes simultaneously.

[0021] In one embodiment of the present invention, the heat-absorbing outer surface of the metal bottom cover plate of the above-mentioned liquid-cooled heat sink further has at least one screw hole for fixing at least one heat-generating electronic component, and the screw hole is recessed from the heat-absorbing outer surface toward the evaporative inner surface and protrudes from the evaporative inner surface but does not penetrate therethrough to form a screw hole protrusion, and the height of the screw hole protrusion is equal to or less than the height of the column-shaped support structure.

[0022] In one embodiment of the present invention, in the liquid-cooled heat dissipation system, the number of the liquid-cooled vapor chambers is, for example, two, three or four, and the first refrigerant pipe and the second refrigerant pipe are branch pipes having a number of branches corresponding to the number of the liquid-cooled vapor chambers, and the refrigerant circulator is a refrigerant distributor.

[0023] In one embodiment of the present invention, in the liquid-cooling type heat dissipation system, the liquid-cooling cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation base plate and the heat dissipation outer cover are made of copper, aluminum, an aluminum alloy or a magnesium alloy.

[0024] In one embodiment of the present invention, in the liquid-cooled heat dissipation system, the working fluid is water.

[0025] In one embodiment of the present invention, in the liquid-cooled heat sink, a plurality of second liquid supply ports and a plurality of second liquid drain ports are provided on the outer cover side wall.

[0026] In one embodiment of the present invention, in the liquid-cooled heat sink, the number of the second liquid supply ports and the second liquid drain ports provided on the outer cover side wall is two, three or four, respectively.

[0027] In one embodiment of the present invention, the liquid-cooled heat sink has a plate-like structure with a length of 250 to 600 mm, a width of 150 to 450 mm, and a thickness of 10 to 30 mm.

[0028] In one embodiment of the invention, the cooling liquid is water.

[0029] In one embodiment of the present invention, the cooling liquid is water and has a volume of about 1-6 liters. Effect of the Invention

[0030] The liquid-cooled heat dissipation system provided by the present invention is a liquid-cooled heat dissipation system with high heat dissipation efficiency that can be applied to standalone AI computers, and has the following advantages over air-cooled heat dissipation: (1) High heat dissipation efficiency: Liquid coolants can quickly absorb and transport large amounts of heat, and have better cooling performance than traditional air-cooled heat dissipation. (2) Low noise: Compared with air-cooled heat dissipation systems equipped with high-speed cooling fans, liquid-cooled heat dissipation is generally quieter and more efficient at dissipating heat, helping to create a low-noise working environment. (3) Reduce energy consumption: Liquid cooling can reduce the temperature of operating system equipment more effectively than air cooling, allowing the equipment to operate at a lower temperature and improving energy efficiency. [Brief description of the drawings]

[0031] [Figure 1] FIG. 2 is a structural explanatory diagram of an embodiment of a liquid-cooling heat dissipation system of the present invention; [Diagram 2] FIG. 2 is a structural explanatory diagram of a liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. [Diagram 3] FIG. 2 is a structural cross-sectional view of the liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 4] 1 is a structural explanatory diagram of a metal upper cover plate of a liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Diagram 5] 1 is a structural explanatory diagram of a metal bottom cover plate of a liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 6A] 10 is a structural explanatory diagram of a metal bottom cover plate of a liquid-cooled vapor chamber of the second embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 6B] FIG. 11 is a structural cross-sectional view of a metal bottom cover plate of a liquid-cooled vapor chamber of a second embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 7A] FIG. 11 is a structural explanatory diagram of the metal bottom cover plate of the liquid-cooled vapor chamber of the third embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 7B] FIG. 11 is a structural cross-sectional view of a metal bottom cover plate of a liquid-cooled vapor chamber of a third embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 8A] FIG. 11 is a structural explanatory diagram of the metal bottom cover plate of the liquid-cooled vapor chamber of the fourth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 8B] FIG. 11 is a structural cross-sectional view of a metal bottom cover plate of a liquid-cooled vapor chamber of the fourth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 9A] FIG. 13 is a structural explanatory diagram of the metal bottom cover plate of the liquid-cooled vapor chamber of the fifth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 9B] FIG. 13 is a structural cross-sectional view of a metal bottom cover plate of a liquid-cooled vapor chamber of the fifth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 10] 1 is a structural explanatory diagram of a liquid-cooled heat dissipation plate according to one embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 11] 1 is a top view and a side view of the structure of a heat dissipation base plate of a liquid-cooled heat sink according to one embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 12] 1 is a structural explanatory diagram of a heat dissipating outer cover of a liquid-cooled heat sink according to one embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 13] FIG. 4 is a structural diagram illustrating another embodiment of the liquid-cooling heat dissipation system of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, an embodiment of the liquid-cooled heat dissipation system of the present invention will be described with reference to the relevant drawings, but the size and ratio of each component in the drawings may be exaggerated or reduced for clarity and convenience of the description of the drawings. In the following description and / or claims, technical terms used should be interpreted with the conventional meaning commonly used by those skilled in the art, and for ease of understanding, the same components in the following embodiments are shown and described with the same reference numerals. The term "about" as used herein generally means that the actual numerical value is within ±10%, 5%, 1% or 0.5% of a particular value or range. The term "about" herein means that the actual numerical value falls within an acceptable standard error of the mean, as determined by the recognition of a person skilled in the art. Except in the embodiments, or unless otherwise specified, ranges, quantities, values ​​and percentages used herein can be understood to be modified by "about". Thus, unless otherwise specified, numerical values ​​or parameters disclosed in this specification and the appended claims are approximate values ​​and may be changed as necessary.

[0033] 1 is a structural diagram of one embodiment of a liquid-cooled heat dissipation system 10 of the present invention. In this embodiment, the liquid-cooled heat dissipation system 10 includes at least one liquid-cooled vapor chamber 100, a liquid-cooled heat dissipation plate 200, at least one first liquid refrigerant line 300, at least one second liquid refrigerant line 400, a liquid circulator 500, at least one fan 600 and a liquid refrigerant 700.

[0034] Below, six exemplary embodiments are listed, and the difference between the first to fifth embodiments lies in different structural aspects of the liquid-cooled vapor chamber 100, and the sixth embodiment is another embodiment of the liquid-cooled heat dissipation system.

[0035] First embodiment Please refer to FIG. 2 to FIG. 5 at the same time. FIG. 2 is a structural explanatory diagram of the liquid-cooled heat dissipation system 10 of the present invention and the liquid-cooled vapor chamber 100 described in the first embodiment. FIG. 3 is a structural cross-sectional view of the liquid-cooled vapor chamber 100 of FIG. 2. FIG. 4 is a structural explanatory diagram of the metal upper cover plate 120 of the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. FIG. 5 is a structural explanatory diagram of the metal lower cover plate 130 of the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. The liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention includes a liquid-cooled cover 110, a metal upper cover plate 120, a metal lower cover plate 130, an intake channel 140, a capillary structure 150 and a working fluid 160. The liquid cooling cover 110 includes an upper portion 1101 and a side wall 1102 connected to the upper portion 1101, the side wall 1102 surrounding the upper portion 1101 to form a first accommodating space 1103, and the side wall 1102 is provided with at least one first liquid supply port 1104 and at least one first liquid drain port 1105, and the first liquid supply port 1104 and the first liquid drain port 1105 are connected to the first accommodating space 1103. The metal top cover plate 120 includes a heat dissipation outer surface 1201 and a condensation inner surface 1202, the heat dissipation outer surface 1201 has a plurality of first heat dissipation columns 1203, the condensation inner surface 1202 is provided with an upper frame 1204 of an appropriate height surrounding the condensation inner surface 1202, the upper frame 1204 is provided with an upper flow groove 1205, the condensation inner surface 1202 has a plurality of upper grooves 1206 arranged parallel to each other, and the entire metal top cover plate 120 including the first heat dissipation columns 1203 is integrally formed with a metal sheet (or metal block). The metal bottom cover plate 130 includes a heat absorption outer surface 1301 and an evaporation inner surface 1302. The heat-absorbing outer surface 1301 is used for contact with a heat-generating electronic component (not shown), and a lower frame 1303 of appropriate height is provided on the periphery of the evaporative inner surface 1302 which surrounds the evaporative inner surface 1302, and a lower flow path groove 1304 is provided in the lower frame 1303. The evaporative inner surface 1302 has a plurality of lower grooves 1305 arranged parallel to each other and a plurality of column-shaped support structures 1306 protruding between the lower grooves 1305, and here the entire metal bottom cover plate 130 including the column-shaped support structures 1306 is integrally formed from a metal sheet (or metal block).The upper frame 1204 of the metal top cover plate 120 and the lower frame 1303 of the metal bottom cover plate 130 are joined together to form a working space 1307, and the columnar support structure 1306 protrudes and extends from the evaporating inner surface 1302 and abuts between the upper grooves 1206 of the condensing inner surface 1202 to support the working space 1307. The intake channel 140 is formed by correspondingly joining the upper flow groove 1205 and the lower flow groove 1304, and intakes air into the working space 1307 and seals it after intake, so that the working space 1307 maintains a substantially vacuum state. The capillary structure 150 is installed in the lower groove 1305 or in the upper groove 1206 and the lower groove 1305. The working fluid 160 exists in the working space 1307 and the capillary structure 150.

[0036] Please refer to Fig. 10 to Fig. 12. Fig. 10 is a structural explanatory diagram of a liquid-cooled heat sink 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Fig. 11 is a structural top view and a side view of a heat dissipation base plate 210 of the liquid-cooled heat sink 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Fig. 12 is a structural explanatory diagram of a heat dissipation outer cover 220 of the liquid-cooled heat sink 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. The liquid-cooled heat sink 200 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention includes a heat dissipation base plate 210 and a heat dissipation outer cover 220. First, please refer to Fig. 10 and Fig. 11. The heat dissipation base plate 210 has a base plate inner surface 2101 and an opposing base plate outer surface 2102. The base plate inner surface 2101 is provided with a plurality of second heat dissipation columns 2103 protruding and arranged in a matrix, at least one long-groove-shaped flow guide plate groove 2104 protruding from the base plate inner surface 2101 and installed between the plurality of second heat dissipation columns 2103, and used to insert at least one long sheet-shaped flow guide plate 2105, and an outer lid connecting groove 2106 protruding from the periphery along the base plate outer surface 2102 to surround it. The base plate outer surface 2102 is provided with a plurality of fan screw holes 2107 protruding from the base plate outer surface 2102 and for fixing at least one fan 600 that blows on the base plate outer surface 2102 to cool it. Here, the entire heat dissipation base plate 210 including the plurality of second heat dissipation columns 2103, the flow guide plate groove 2104, the outer lid connecting groove 2106, and the fan screw hole 2107 are integrally formed by the same metal sheet (or metal block). In this embodiment, the number of the flow guide plate grooves 2104 can be set according to the needs of actual application, for example, 1, 2, 3, 4, 5, 6, 7, or 8, and a corresponding number of long sheet-shaped flow guide plates 2105 are combined. For example, the number of flow guide plate grooves 2104 shown in Figures 10 and 11 is 5, and five long sheet-shaped flow guide plates 2105 are combined, which are inserted and installed in the five flow guide plate grooves 2104, respectively.

[0037] 10 and 12. In this embodiment, the heat-dissipating outer cover 220 has an outer cover upper portion 2201 and an outer cover side wall 2202 connected to the outer cover upper portion 2201, and the outer cover side wall 2202 surrounds the outer cover upper portion 2201 to form a second receiving space 2203. The outer cover side wall 2202 is provided with at least one second liquid supply port 2204 and at least one second liquid drain port 2205, and the second liquid supply port 2204 and the second liquid drain port 2205 are connected to the second receiving space 2203. Here, when the heat-dissipating outer cover 220 and the heat-dissipating base plate 210 are closed together, the outer cover side wall 2202 of the heat-dissipating outer cover 220 is inserted into the outer cover joint groove 2106 of the heat-dissipating base plate 210 and welded, and the plurality of second heat-dissipating columns 2103 are disposed in the second receiving space 2203 to form the liquid-cooled heat sink 200. In this embodiment, the number of the second liquid supply ports 2204 and the second liquid drain ports 2205 can be set according to the requirements of actual applications, and may be, for example, 1, 2, 3, 4, 5, or 6. In addition, by increasing the number of the second liquid supply ports 2204 and the second liquid drain ports 2205, not only the number of connected liquid-cooled vapor chambers 100 increases, but also the flow of the cooling liquid 700 entering and exiting the liquid-cooled heat sink 200 through the branch pipe increases, thereby improving the heat dissipation efficiency.

[0038] Referring again to FIG. 1, in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, the first liquid refrigerant pipe 300 has one end connected to the first liquid supply port 1104 of the liquid-cooled vapor chamber 100, and the other end connected to the second liquid drain port 2205 of the liquid-cooled heat sink 200. The second liquid refrigerant pipe 400 has one end connected to the first liquid drain port 1105 of the liquid-cooled vapor chamber 100, and the other end connected to the second liquid supply port 2204 of the liquid-cooled heat sink 200. The liquid refrigerant circulator 500 is installed between the first liquid refrigerant pipe 300 or the second liquid refrigerant pipe 400, and pumps the liquid refrigerant 700 to circulate the liquid refrigerant 700 between the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 to form the liquid-cooled heat dissipation system 10 of the present invention.

[0039] In the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, the heat-absorbing outer surface 1301 of the metal bottom cover plate 130 is a flat surface for contacting a heat-generating electronic component.

[0040] Second embodiment Please refer to Figures 6A and 6B. Figures 6A and 6B are a structural explanatory diagram and a structural cross-sectional view of the metal bottom cover plate 131 of the liquid-cooled vapor chamber 100 described in the second embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the difference between the second embodiment and the first embodiment is that the heat-absorbing outer surface 1311 of the metal bottom cover plate 131 further has at least one recessed space 1313 to accommodate at least one heat-generating electronic component, and the recessed space 1313 is recessed from the heat-absorbing outer surface 1311 toward the evaporation inner surface 1312, but does not protrude to the corresponding evaporation inner surface 1312. In this embodiment, the thickness of the liquid-cooled vapor chamber 100 from the heat-dissipating outer surface 1201 (not including the first heat-dissipating column 1203) to the heat-absorbing outer surface 1311 does not exceed 6 mm. In another embodiment, the thickness is 5 mm or less, 4 mm or less, or 3.5 mm or less. In this embodiment, the shape and volume of the recessed space 1313 installed on the heat-absorbing outer surface 1311 of the metal bottom cover plate 131 are determined by the shape and volume of the heat-generating electronic component to be attached. The design of the recessed space 1313 has the following advantages: (1) The heat-generating electronic component can be accommodated in the recessed space 1313 (or partially accommodated in the recessed space), which allows for closer contact between the heat-generating electronic component and the liquid-cooled vapor chamber 100 and a larger contact area (contact area in the lateral direction), thereby improving heat dissipation efficiency. (2) The heat-generating electronic component is accommodated in the recessed space 1313, which reduces the overall thickness during application.

[0041] Third embodiment Please refer to FIG. 7A and FIG. 7B. FIG. 7A and FIG. 7B are a structural explanatory diagram and a structural cross-sectional view of the metal bottom cover plate 132 of the liquid-cooled vapor chamber 100 described in the third embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the difference between the third embodiment and the first embodiment is that the heat-absorbing outer surface 1321 of the metal bottom cover plate 132 further has a plurality of recessed spaces 1323 to accommodate a plurality of heat-generating electronic components, and the recessed spaces 1323 are recessed from the heat-absorbing outer surface 1321 toward the evaporation inner surface 1322, but do not protrude to the corresponding evaporation inner surface 1322. In this embodiment, the thickness of the liquid-cooled vapor chamber 100 from the heat-dissipating outer surface 1201 (not including the first heat-dissipating column 1203) to the heat-absorbing outer surface 1321 does not exceed 6 mm. In another embodiment, the thickness is 5 mm or less, 4 mm or less, or 3.5 mm or less. To explain further, as shown in the figure, in this embodiment, the purpose of providing a plurality of recessed spaces 1323 on the heat absorbing outer surface 1321 of the metal bottom cover plate 132 is to apply to small chip package (chiplet) products that are becoming mainstream in the market. A small chip package integrates several to tens of small chips with the same or different functions, sizes, and volumes into one using packaging technology. However, when several to tens of chips are packaged in the same narrow space, the connection lines between them are very short, the operating frequency is higher, the generated heat and heat density are higher, and the heat dissipation problem is even greater. The plurality of recessed spaces 1323 designed in the metal bottom cover plate of this embodiment can be designed according to the overall size, outer shape, and overall volume of the small chips after packaging, so that the small chips can be more closely attached and accommodated in the plurality of recessed spaces 1323. The rapid lateral heat diffusion and high heat dissipation efficiency of the liquid-cooled vapor chamber 100, combined with the high heat exchange efficiency of the first heat dissipation column 1203 and the cooling liquid 700, can more effectively solve the heat dissipation problem of small chips. Based on the above, in this embodiment, these multiple recessed spaces 1323 can have the same or different shapes and volumes to accommodate multiple heat-generating electronic components of the same or different shapes and volumes at the same time, as shown in FIG. 7A.

[0042] Fourth embodiment Please refer to Figures 8A and 8B. Figures 8A and 8B are a structural explanatory diagram and a structural cross-sectional view of the metal bottom cover plate 133 of the liquid-cooled vapor chamber 100 described in the fourth embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the difference between the fourth embodiment and the first embodiment is that the heat absorbing outer surface 1331 of the metal bottom cover plate 133 further has at least one screw hole 1333 for fixing at least one heat-generating electronic component, and the screw hole 1333 is recessed from the heat absorbing outer surface 1331 toward the evaporation inner surface 1332 and protrudes from the evaporation inner surface 1332 but does not penetrate, forming a screw hole protrusion 1334, and the height of the screw hole protrusion 1334 is equal to or less than the height of the column-shaped support structure 1306. To further explain, in order to bring the chip into closer contact with the metal bottom cover plate 133 of the liquid-cooled vapor chamber 100, in this embodiment, at least one screw hole 1333 is installed in the heat-absorbing outer surface 1331 of the metal bottom cover plate 133, and the chip (heat-generating electronic component) can be fixed to the heat-absorbing outer surface 1331. The chip can be bonded to the heat-absorbing outer surface 1331 without using thermal paste, thereby avoiding a heterogeneous interface with low thermal conductivity and improving heat dissipation efficiency.

[0043] Fifth embodiment Please refer to Figures 9A and 9B. Figure 9 is a structural explanatory diagram and a structural cross-sectional view of the metal bottom cover plate 134 of the liquid-cooled vapor chamber 100 described in the fifth embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figure, the difference between the fifth embodiment and the first embodiment is that the heat-absorbing outer surface 1341 of the metal bottom cover plate 134 further has a plurality of screw holes 1343 for locking a plurality of heat-generating electronic components, where each of the plurality of screw holes 1343 is recessed from the heat-absorbing outer surface 1341 to the evaporation inner surface 1342, protrudes from the evaporation inner surface 1342 but does not penetrate through it, forming a plurality of screw hole protrusions 1344, and the height of each of the plurality of screw hole protrusions 1344 is equal to or less than the height of the column-shaped support structure 1306. The number of the plurality of screw holes 1343 can be set according to the actual application situation, and may be, for example, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12. As shown in FIG. 9A, in this embodiment, the number of the screw holes 1343 is ten, and ten heat-generating electronic components can be fixed.

[0044] Sixth embodiment 13 is a structural diagram of another embodiment of the liquid-cooled heat dissipation system 20 of the present invention. In this embodiment, as shown in FIG. 13, the liquid-cooled heat dissipation system 20 includes four liquid-cooled vapor chambers 100, a liquid-cooled heat dissipation plate 201 consisting of four second liquid supply ports 2214 and four second liquid drain ports 2215, a first liquid coolant duct 301 which is a branch pipe having four branches, a second liquid coolant duct 401 which is a branch pipe having four branches, a liquid coolant circulator 500 (or a liquid coolant distribution unit, CDU), four fans 600, a base plate outer surface 2102 of a heat dissipation base plate 210 fixed to the liquid-cooled heat dissipation plate 201 through a fan screw hole 2107, and a liquid coolant 700. The first liquid supply ports 1104 of the four liquid-cooled vapor chambers 100 are connected to the four second liquid drain ports 2215 of the liquid-cooled heat sink 200 through a first liquid drain pipe 301 of a branch pipe having four branches, and the first liquid drain ports 1105 of the four liquid-cooled vapor chambers 100 are connected to the four second liquid supply ports 2214 of the liquid-cooled heat sink 200 through a second liquid drain pipe 401 of a branch pipe having four branches. In this embodiment, the liquid drain circulator 500 is installed to connect between the second liquid drain port 2215 of the liquid-cooled heat sink 201 and the first liquid supply port 1104 of the liquid-cooled vapor chamber 100, that is, inserted between the first liquid drain pipes 301. The refrigerant 700 is pumped through the refrigerant circulator 500 (or coolant distribution unit, CDU) and flows into the first accommodating space 1103 of each liquid-cooled vapor chamber 100 to exchange heat. The refrigerant 700 that absorbs heat flows out of the first accommodating space 1103 and flows into the second accommodating space 2203 of the liquid-cooled heat sink 201 through the second refrigerant pipe 401. While the refrigerant 700 flows into the liquid-cooled heat sink 200, it is forced to cool by the multiple fans 600, thereby cooling the liquid-cooled heat sink 201 and the refrigerant 700 to lower their temperatures.

[0045] To further explain, the structures or sizes of the liquid-cooled vapor chambers 100 used in the embodiment of FIG. 13 may be the same or different, for example, the liquid-cooled vapor chambers 100 may have any one selected from the metal lower cover plates (130, 131, 132, 133, 134) as in the first to fifth embodiments. Each liquid-cooled vapor chamber 100 may be simultaneously applied to the same or different chipsets or heat-generating electronic components, and the amount of heat absorbed by each liquid-cooled vapor chamber 100 may be different, so the flow rate of the cooling liquid 700 required for cooling may also be different. The cooling liquid circulator 500 (CDU) adjusts the flow rate of the cooling liquid 700 flowing into each liquid-cooled vapor chamber 100 according to the actual temperature situation of each liquid-cooled vapor chamber 100, and can more accurately control the temperature of the chipset or heat-generating electronic components. The number of liquid-cooled vapor chambers 100 used in this embodiment is two, three or four, the first liquid coolant pipe 301 and the second liquid coolant pipe 401 are branch pipes having a branch pipe corresponding to the number of liquid-cooled vapor chambers 100, and the liquid coolant circulator 500 is a liquid coolant distribution unit (CDU).

[0046] In addition, depending on the application of the branch pipe, the number of liquid-cooled vapor chambers 100 and the number of second liquid supply ports 2214 and second liquid drain ports 2215 of the liquid-cooled heat sink 201 may be the same or different.

[0047] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the materials of the liquid-cooled cover 110, the metal upper cover plate 120, the metal lower cover plate (130, 131, 132, 133, 134), the heat dissipation base plate 210, and the heat dissipation outer covers 220, 221 are copper, aluminum, aluminum alloy, or magnesium alloy.

[0048] In one optional embodiment of the present invention, the working fluid 160 is water.

[0049] In one embodiment of the present invention, in the liquid-cooled heat sink 201, the outer cover side wall 2202 is provided with a plurality of second liquid supply ports 2214 and a plurality of second liquid drain ports 2215.

[0050] In the above embodiment, the number of second liquid supply ports 2214 and second liquid drain ports 2215 provided in the outer cover side wall 2202 of the liquid-cooled heat sink 200 is two, three, or four, respectively.

[0051] In one embodiment of the present invention, the liquid-cooled heat sink 200 has a plate-like structure with a length of 250 to 600 mm, a width of 150 to 450 mm, and a thickness of 10 to 30 mm.

[0052] In one embodiment of the present invention, the cooling liquid 700 in the liquid-cooled heat dissipation system 10 (20) is water. In another embodiment, the cooling liquid 700 in the liquid-cooled heat dissipation system 10 (20) is water, especially softened water, to avoid the formation of scale after long-term use. In another embodiment, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid may be added with a cryoprotectant (e.g., ethylene glycol) according to the actual application situation, to prevent the cooling liquid from freezing and becoming unable to function when the environmental temperature is below 0 degrees Celsius.

[0053] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid 700 is water, and the volume is about 1 to 6 liters. In addition, in the liquid-cooled heat dissipation system 10 (20) described in the present invention, the size and volume of the liquid-cooled heat dissipation plate 200, the number and size of the second liquid supply port 2214 and the second liquid drain port 2215, the number of the flow guide plate grooves 2104 and the long sheet-shaped flow guide plate 2105, etc. can be designed according to the actual application situation according to the amount of heat generated by the heat-generating electronic components that need to be cooled, and the required volume of the cooling liquid 700 also varies accordingly. The larger the volume of the cooling liquid 700 used, the more heat can be absorbed.

[0054] It should be noted that the structures of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 disclosed in any of the above embodiments of the liquid-cooled heat sink 10 and 20 of the present invention are merely examples and do not limit the scope of the liquid-cooled heat sink 10 and 20 of the present invention. After considering each embodiment of the present invention, a person skilled in the art can set the number, position, size, shape and structure of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 according to the actual application situation to achieve the expected heat dissipation effect.

[0055] The above embodiments are merely for illustrative purposes, and do not limit the scope of the present invention. Any equivalent modifications or variations based on the liquid-cooled heat dissipation systems 10 and 20 of the above embodiments should fall within the scope of protection of the present invention.

[0056] In addition, 2024 is called the first year of AI computers (AIPC), and most of the industry believes that generative AI will need to run on both commercial and consumer computers, which is also an important turning point for generative AI from the "cloud" to the "edge". The enormous "computing power" of AI chip modules leads to increasing power consumption and generates large amounts of heat, which requires more efficient heat dissipation modules to help cool them down. With the constant upgrade of AI chip modules, the requirements for heat dissipation modules are also increasing.

[0057] AI computers can be regarded as an upgraded version of traditional computers, but most of the CPUs or GPUs of current computers use air-cooled radiators or are configured in the form of AI servers, and the heat dissipation efficiency is enhanced by cabinets with liquid-cooled heat dissipation modules. The liquid-cooled heat dissipation system provided by the present invention is a liquid-cooled heat dissipation system with high heat dissipation efficiency that can be applied to standalone AI computers, and has the following advantages compared with air-cooled heat dissipation: (1) High heat dissipation efficiency: Liquid coolants can quickly absorb and transport large amounts of heat, and have better cooling performance than traditional air-cooled heat dissipation. (2) Low noise: Compared with air-cooled heat dissipation systems equipped with high-speed cooling fans, liquid-cooled heat dissipation is generally quieter and more efficient at dissipating heat, helping to create a low-noise working environment. (3) Reduce energy consumption: Liquid cooling can reduce the temperature of operating system equipment more effectively than air cooling, allowing the equipment to operate at a lower temperature and improving energy efficiency.

[0058] It is found that the present invention breaks through the conventional technology and indeed achieves the desired effect. A person skilled in the art would not easily have realized its inventive step and practicality. It is believed to meet the requirements of the patent claim. In accordance with the law, we have filed this application. In order to promote creativity, we request that your office approve this patent application.

[0059] The above is merely illustrative and not limiting. Any equivalent modifications or variations made without departing from the spirit and scope of the present invention should be included in the scope of the following claims. [Explanation of symbols]

[0060] 10 Liquid cooling system 20 Liquid cooling heat dissipation system 100 Liquid-cooled vapor chamber 110 Liquid cooling cover 1101 Top 1102 Side wall 1103 First Containment Space 1104 1st liquid supply port 1105 First drain 120 Metal top cover plate 1201 Heat dissipation outer surface 1202 Condensation inner surface 1203 First heat dissipation column 1204 Upper frame 1205 Upper flow channel 1206 Upper Groove 130 Metal lower cover plate 131 Metal lower cover plate 132 Metal lower cover plate 133 Metal lower cover plate 134 Metal lower cover plate 1301 Endothermic outer surface 1311 Endothermic outer surface 1321 Endothermic outer surface 1331 Endothermic outer surface 1341 Endothermic outer surface 1302 Evaporation inner surface 1312 Evaporation inner surface 1322 Evaporation inner surface 1332 Evaporation inner surface 1342 Evaporation inner surface 1303 Bottom frame 1304 Lower flow channel 1305 Lower Groove 1306 Column-shaped support structure 1307 Working Space 1313 Recessed Space 1323 Recessed Space 1333 Screw hole 1343 Screw hole 1334 Screw hole protrusion 1344 Screw hole protrusion 140 Intake Channel 150 Capillary structure 160 Working Fluid 200 Liquid-cooled heat sink 201 Liquid-cooled heat sink 210 Heat dissipation base plate 2101 Inner surface of base plate 2102 Outer surface of base plate 2103 Second heat dissipation column 2104 Guide plate groove 2105 Long sheet-shaped flow guide plate 2106 Outer cover joint groove 2107 Fan screw hole 220 Heat dissipating outer cover 221 Heat dissipating outer cover 2201 Upper outer lid 2202 Outer lid side wall 2212 Outer lid side wall 2203 Second Containment Space 2204 2nd liquid supply port 2214 2nd liquid supply port 2205 Second drain 2215 Second Drain Port 300 First Cooling Liquid Pipeline 301 First Cooling Liquid Pipeline 400 Second Cooling Liquid Pipeline 401 Second Cooling Liquid Pipeline 500 Cooling Liquid Circulator 600 Fan 700 Cooling Liquid

Claims

1. at least one liquid-cooled vapor chamber, a liquid-cooled heat sink, at least one first cooling liquid line, at least one second cooling liquid line, a cooling liquid circulator, at least one fan, and a cooling liquid; The liquid-cooled vapor chamber is a liquid cooling cover including an upper portion and a side wall connected to the upper portion, the side wall surrounding the upper portion to form a first accommodation space, the side wall being provided with at least one first liquid supply port and at least one first liquid drain port, the first liquid supply port and the first liquid drain port being in communication with the first accommodation space; A metal top cover plate including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface having a plurality of first heat dissipation columns, and an upper frame having an appropriate height surrounding the condensation inner surface is provided around the periphery of the condensation inner surface, the upper frame is provided with an upper flow groove, the condensation inner surface has a plurality of upper grooves arranged parallel to each other, and the entirety including the first heat dissipation columns is integrally formed by a metal sheet / block; the heat absorbing outer surface and the evaporation inner surface, the heat absorbing outer surface is used for contacting with heat generating electronic components, the periphery of the evaporation inner surface is provided with a lower frame of an appropriate height surrounding the evaporation inner surface, the lower frame is provided with a lower flow groove, and the evaporation inner surface has a plurality of lower grooves arranged parallel to each other and a plurality of columnar support structures protruding between the lower grooves, the whole including the columnar support structures is integrally formed by a metal sheet / block, the lower frame is mutually joined with the upper frame of the metal top cover plate to form a working space, the columnar support structures protrude and extend from the evaporation inner surface, are connected between the upper grooves of the condensation inner surface, and are a metal bottom cover plate supporting the working space; an intake channel configured by joining the upper flow passage groove and the lower flow passage groove corresponding to each other, for sucking air into the working space and sealing the working space after sucking air, thereby maintaining a vacuum state in the working space; a capillary structure disposed in the lower groove, or in the upper groove and the lower groove; a working fluid present in the working space and the capillary structure; Including, The side wall of the liquid-cooled cover is coupled to the heat-dissipating outer surface of the metal top cover plate, and the first heat-dissipating column is disposed in the first accommodating space to form the liquid-cooled vapor chamber; The liquid-cooled heat sink comprises: a heat dissipation base plate having an inner base plate surface and an opposing outer base plate surface, the inner base plate surface being provided with a plurality of second heat dissipation columns that protrude and are arranged in a matrix pattern, at least one long groove-shaped flow guide plate groove that is formed on the inner base plate surface and protrudes between the plurality of second heat dissipation columns, and is used to attach at least one long sheet-shaped flow guide plate, and an outer lid joining groove that protrudes and is provided to surround the periphery of the inner base plate surface, the outer base plate surface being provided with a plurality of fan screw holes that protrude on the outer base plate surface and are used to fix at least one fan and perform air cooling for the outer base plate surface, and the entire heat dissipation plate is formed by integrally molding the plurality of second heat dissipation columns, the flow guide plate groove, the outer lid joining groove, and the fan screw hole from the same metal sheet / block; a heat dissipating outer lid having an outer lid side wall connected to an outer lid upper part and a bottom lid upper part, the outer lid side wall surrounding the outer lid upper part to form a second storage space, at least one second liquid supply port and at least one second liquid drain port being provided, the second liquid supply port and the second liquid drain port being in communication with the second storage space; Including, When the heat-dissipating outer cover and the heat-dissipating base plate are fitted together, the outer cover side wall of the heat-dissipating outer cover can be inserted into the outer cover joining groove of the heat-dissipating base plate and welded to each other, and the plurality of second heat-dissipating columns are installed in the second accommodating space to form the liquid-cooled heat-dissipating plate; A liquid-cooled heat dissipation system, wherein the first coolant pipe has one end connected to the first liquid supply port of the liquid-cooled vapor chamber and the other end connected to the second liquid drain port of the liquid-cooled heat sink, the second coolant pipe has one end connected to the first liquid drain port of the liquid-cooled vapor chamber and the other end connected to the second liquid supply port of the liquid-cooled heat sink, and the coolant circulator is installed between the first coolant pipes or the second coolant pipes, and pumps the coolant liquid to circulate and flow the coolant liquid between the liquid-cooled vapor chamber and the liquid-cooled heat sink to form a liquid-cooled heat dissipation system.

2. The liquid-cooled heat dissipation system according to claim 1 , wherein the heat absorbing outer surface of the metal bottom cover plate is a flat surface and contacts the heat generating electronic components.

3. 2. The liquid-cooled heat dissipation system of claim 1, wherein the heat absorbing outer surface of the metal bottom cover plate further has at least one recessed space for accommodating at least one of the heat-generating electronic components, the recessed space being recessed in a direction from the heat absorbing outer surface toward the evaporative inner surface but not protruding from the corresponding evaporative inner surface.

4. The liquid-cooling type heat dissipation system according to claim 3 , wherein the recessed spaces are plural and accommodate a plurality of the heat-generating electronic components.

5. The liquid-cooled heat dissipation system according to claim 4 , wherein each of the recessed spaces has the same or different shape and volume, and simultaneously accommodates a plurality of the heat-generating electronic components of the same or different shapes and volumes.

6. The liquid-cooled heat dissipation system of claim 1, wherein the heat-absorbing outer surface of the metal bottom cover plate further has at least one screw hole for fixing at least one of the heat-generating electronic components, the screw hole being recessed from the heat-absorbing outer surface toward the evaporative inner surface and protruding from the evaporative inner surface but not penetrating therethrough to form a screw hole protrusion, and the height of the screw hole protrusion is less than or equal to the height of the column-shaped support structure.

7. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the number of the liquid-cooled vapor chambers is two, three or four, the first coolant pipe and the second coolant pipe are branch pipes having a number of branches corresponding to the number of the liquid-cooled vapor chambers, and the coolant circulator is a refrigerant distributor.

8. 2. The liquid-cooling type heat dissipation system according to claim 1, wherein the liquid-cooling cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation base plate, and the heat dissipation outer cover are made of copper, aluminum, an aluminum alloy, or a magnesium alloy.

9. The liquid-cooled heat dissipation system according to claim 1 , wherein the working fluid is water.

10. The liquid-cooling type heat dissipation system according to claim 1 , wherein the outer lid side wall is provided with a plurality of the second liquid supply ports and a plurality of the second liquid drain ports.

11. The liquid-cooling type heat dissipation system according to claim 10 , wherein the number of the second liquid supply ports and the number of the second liquid drain ports are two, three or four, respectively.

12. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the liquid-cooled heat dissipation plate has a plate-like structure with a length of 250-600 mm, a width of 150-450 mm, and a thickness of 10-30 mm.

13. The liquid-cooled heat dissipation system according to claim 1 , wherein the cooling liquid is water.

14. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the cooling liquid is water and has a volume of about 1 to 6 liters.

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