Composition for heat transfer fluid, device with heat transfer mechanism, and heat transfer method

Abstract

To provide a heat transfer fluid which is substituted for an existing heat transfer fluid.SOLUTION: A composition for substituting a heat transfer fluid includes at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene-isomer mixture including a hexafluoropropene trimer expressed by C9F18.SELECTED DRAWING: None

Description

[Technical field]

[0001] SUMMARY The present disclosure relates to heat transfer fluid compositions, devices comprising heat transfer mechanisms, and methods of heat transfer. [Background technology]

[0002] Thermal management is required in electrical and electronic equipment. For example, in semiconductor wafer manufacturing, the process temperature needs to be controlled. Also, excess heat generated in microprocessors, data centers, power electronics, or aircraft needs to be removed. To solve these problems, heat transfer fluids are used. In general, it is desirable for such heat transfer fluids to have low kinetic viscosity and good dielectric properties.

[0003] Heat transfer fluids are also used in applications such as two-phase immersion cooling fluids, chiller fluids, or Rankine cycle working fluids.

[0004] Currently, the following are used for these purposes: Perfluorotripropylamine (or tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine) [N(CF 2 CF 2 CF 3 ) n (CF(CF 3 )CF 3 ) 3-n (n is an integer of 0 to 3)] (Patent Document 1); Perfluoropolyethers (PFPEs), such as those under the product names GALDEN® "HT135" and GALDEN® "HT110" (manufactured by Solvay), or more specifically, tetrafluoroethylene oxide polymers (Patent Document 2); and A mixture of methoxytridecafluoroheptene isomers, such as the product name "OpteonSF10" (manufactured by Chemours), or more specifically, methyl-perfluoroheptene ether (MPHE) (C 7 F 13 OCH 3 ) (Non-Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-505882 [Patent Document 2] International Publication No. 2010 / 034698 [Non-patent literature]

[0006] [Non-Patent Document 1] Aaron M. Jubb et al. and 4 others "Methyl-Perfluoroheptene-Ethers (CH3OC7F13): MeasuredOH RadicalReaction Rate Coefficients for Several Isomers and Enantiomers and Their Atmospheric Lifetimes and Global Warming Potentials", 2014, Environ. Sci. Technol., 48, 4954-4962 Summary of the Invention [Problem to be solved by the invention]

[0007] SUMMARY OF THE DISCLOSURE An object of the present disclosure is to provide a heat transfer fluid that replaces the existing heat transfer fluids mentioned above. [Means for solving the problem]

[0008] As a result of intensive research conducted by the present inventors to solve the above problems, 9 F 18The inventors have found that a compound represented by the following formula (I) can replace the above-mentioned existing heat transfer fluids. Based on this finding, the inventors have conducted further research and have completed the present disclosure.

[0009] That is, the present disclosure includes the following aspects. Item 1. A heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxy tridecafluoroheptene isomers, 9 F 18 A composition comprising a hexafluoropropene trimer represented by the formula: Section 2.C above 9 F 18 The composition according to item 1, wherein the hexafluoropropene trimer represented by the formula (I) contains at least one compound selected from the group consisting of compounds represented by the formulas (I) to (III): [ka] Item 3.C above 9 F 18 Item 3. The composition according to item 2, wherein the hexafluoropropene trimer represented by the formula (I) contains less than 85% by mass of the compound represented by the formula (I) based on the entire hexafluoropropene trimer. Item 4. The composition according to any one of Items 1 to 3, which satisfies the following conditions (i) to (vi): (i) The boiling point is 80% or more of the boiling point of the heat transfer fluid. (ii) the pour point is equal to or lower than the pour point of the heat transfer fluid; (iii) the kinetic viscosity is 200% or less of the kinetic viscosity of the heat transfer fluid; (iv) be miscible in any proportion with said heat transfer fluid; Section 5.C 9 F 18 and at least one member selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers. Item 6.C above 9 F 18Item 6. The heat transfer fluid composition according to item 5, wherein the hexafluoropropene trimer represented by the formula (I) contains at least one compound selected from the group consisting of compounds represented by the formulas (I) to (III): [ka] Item 7.C above 9 F 18 The hexafluoropropene trimer represented by the formula 9 F 18 Item 7. The heat transfer fluid composition according to item 6, comprising less than 85 mass% of the compound represented by formula (I) based on the total amount of hexafluoropropene trimers represented by formula (I). Item 8. The compound is 9 F 18 Item 7. The heat transfer fluid composition according to item 6, comprising 85 mass% or more of the compound represented by formula (I) based on the total amount of the hexafluoropropene trimer represented by the formula (I). Item 9. A device comprising a heat transfer mechanism, the device comprising: a device; and a heat transfer mechanism that transfers heat to or from the device using the composition according to any one of Items 1 to 4 or the composition for a heat transfer fluid according to any one of Items 5 to 8 as a heat transfer fluid, the heat transfer mechanism being designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture. Section 10.C 9 F 18 2. Use of a hexafluoropropene trimer represented by the formula: embedded image for replacing a heat transfer fluid containing at least one member selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers. Item 11. A method for transferring heat to or from a device including a heat transfer mechanism designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, the method comprising the step of operating the heat transfer mechanism by using the composition according to any one of items 1 to 4 or the composition for heat transfer fluid according to any one of items 5 to 8 in place of the heat transfer fluid. Effect of the Invention

[0010] The present disclosure provides a heat transfer fluid that replaces heat transfer fluids containing at least one member selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In this specification, "containing" is a concept that encompasses all of "comprise," "consist essentially of," and "consist only of." In addition, in this specification, when a numerical range is shown as "A to B," it means A or more and B or less.

[0012] 1.C 9 F 18 A composition comprising a compound represented by (1) Heat transfer fluid The compositions of the present disclosure include a heat transfer fluid compound, the heat transfer fluid compound being C 9 F 18 The compound includes a compound represented by the formula:

[0013] C 9 F 18 The compound represented by the formula (I) is preferably a hexafluoropropene (HFP) trimer.

[0014] Hexafluoropropene trimer is C 9 F 18 Any known material represented by the following formula can be widely used, and there is no particular limitation.

[0015] Specific examples of such hexafluoropropene trimers include compounds represented by the following formulas (I) to (III).

[0016] [ka]

[0017] In the present disclosure, the compound represented by the above formula (I) includes both the E and Z diastereomers, unless otherwise specified.

[0018] C of this disclosure 9 F 18 The hexafluoropropene trimer contained in the compound represented by the formula (I) to (III) may be only one of the compounds represented by the formula (I) to (III) above, or may be a mixture containing two or three of these compounds.

[0019] When the HFP trimer is a mixture, the blending ratio of the compound represented by the above formula (I) in the whole (i.e., the total of the compounds represented by formulas (I), (II) and (III) contained in the mixture) is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, particularly preferably 45% by mass or more, and even particularly preferably 50% by mass or more, based on the whole HFP trimer. The compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less (or less), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less, based on the whole HFP trimer. The blending ratio of the compound represented by the above formula (I) is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, particularly preferably 45% by mass or more, and even more preferably 50% by mass or more. 9 F 18With respect to the total amount of the compound represented by the formula (I), for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 55% by mass or more and less than 80% by mass, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, and preferably 30% by mass or more and 90% by mass or less, preferably 40% by mass or more and less than 85% by mass, more preferably 40% by mass or more and 80% by mass or less, even more preferably 45% by mass or more and 70% by mass or less, and even more preferably 50% by mass or more and 60% by mass or less.

[0020] Similarly, the compound represented by formula (II) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. The compound represented by formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on the total amount of the HFP trimer.

[0021] Similarly, the compound represented by formula (III) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. The compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on the total amount of the HFP trimer.

[0022] The mass ratio of the compound represented by formula (II) and the compound represented by formula (III) in the HFP trimer is not particularly limited, and may be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0023] C in HFP trimer 9 F 18 The content of the compound represented by the formula (I) is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass or more, based on the entire heat transfer fluid composition. 9 F 18 The content of the compound represented by the formula (I) is preferably 99.9999 mass % or less based on the entire heat transfer fluid composition.

[0024] The mass ratio of the compound represented by formula (II) and the compound represented by formula (III) in the entire HFP trimer is not particularly limited, and may be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0025] The HFP trimer is a C compound other than the compounds represented by formulas (I) to (III). 9 F 18 The hexafluoropropene may contain a hexafluoropropene trimer represented by the following formula:

[0026] The HFP trimer may include a hexafluoropropene dimer.

[0027] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0028] The HFP trimer may include a hexafluoropropene tetramer.

[0029] The hexafluoropropene tetramer can include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0030] The compounds represented by the above formulas (I) to (III) can be produced by a conventional method, for example, the method described in International Publication No. 2018 / 172919, but are not limited thereto, and can be obtained by adopting a wide range of known methods. They may also be obtained by trimerization using HFP as a raw material.

[0031] The composition of the present disclosure is 9 F 18 The heat transfer fluid may contain an additional heat transfer fluid compound different from the compound represented by the formula (I). The additional heat transfer fluid compound may be one or more. Examples of the additional heat transfer fluid include perfluorotripropylamine, perfluoropolyether, and methoxy tridecafluoroheptene isomer mixture, perfluorotributylamine, etc.

[0032] Perfluorotripropylamine, also known as tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine, has the general formula: N(CF 2 CF 2 CF 3 ) n (CF(CF 3 )CF 3 ) 3-n (n is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF 2 CF 2 CF 3 ) 3 is preferred, but N(CF) is also preferred as an impurity. 2 CF 2 CF3 ) n (CF(CF 3 )CF 3 ) 3-n (n is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0033] The perfluoropolyether preferably has the general formula: RO-Rf 1 -R' It is expressed as During the ceremony, R and R' may be the same or different and are -C m F 2m+1 where m is an integer from 1 to 8; and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeat units, said repeat units being: (i) -CFXO-, where X is F or CF 3 is); (ii)-CF 2 CFXO- (wherein X is F or CF 3 is); (iii)-CFXCF 2 O- (wherein X is F or CF 3 is); (iv)-CF 2 CF 2 CF 2 O-; or (v)-CF 2 CF 2 CF 2 CF 2 represented by O-, or Rf 1 teeth, (vi)-(CF 2 ) n -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 -CFXO-, -CF 2 CFXO-, -CF 2 CF 2 CF2 O- or -CF 2 CF 2 CF 2 CF 2 A divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by the formula: O-, where each X is the same or different and is F or CF 3 and Z is a monovalent C 1-5 It is a divalent group represented by the formula (I) (a perfluoroalkyl group).

[0034] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (manufactured by Solvay).

[0035] The methoxytridecafluoroheptene isomer mixture is specifically methyl-perfluoroheptene ether (MPHE) (C 7 F 13 OCH 3 ) Specifically, the product name is "OpteonSF10" (manufactured by Chemours) and the like.

[0036] The composition of the present disclosure has a C 9 F 18 It is preferable that the compound represented by the formula (I) is contained in an amount of 20% by mass or more, more preferably 40% by mass or more, further preferably 60% by mass or more, and most preferably 80% by mass or more. However, when perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers are contained, these and C 9 F 18 Since the properties as a heat transfer fluid are similar to those of the compound represented by the formula (I), the properties as a heat transfer fluid of the entire composition are basically unchanged regardless of the content ratio of these compounds. Therefore, in this case, the composition of the present disclosure has a content of C 9 F 18 The compound represented by the formula (I) is preferably contained in an amount of 40% by mass to 99.9% by mass, more preferably 60% by mass to 99.9% by mass, and further preferably 80% by mass to 99.9% by mass.

[0037] (2) Other ingredients The compositions of the present disclosure may further include other ingredients in addition to the heat transfer fluid compound.

[0038] The composition of the present disclosure may contain a stabilizer. The stabilizer exerts a stabilizing effect, thereby exerting a function as a so-called acid acceptor or antioxidant. The main stabilizing effects include an effect of preventing decomposition of the heat transfer fluid compound by capturing radicals generated in the system, and an acid-accepting effect of preventing further decomposition of the heat transfer fluid compound by the acid by capturing the acid generated in the system.

[0039] As the stabilizer, a wide variety of known stabilizers can be used. Among them, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol stabilizers, nitro stabilizers, amine stabilizers, phenol stabilizers, and epoxy stabilizers, because they can effectively suppress the occurrence of metal corrosion caused by the composition.

[0040] As the unsaturated alcohol-based stabilizer, a wide variety of known ones can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol and oleyl alcohol can be used.

[0041] As the nitro stabilizer, a wide variety of known stabilizers can be used. As the aliphatic nitro compound, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As the aromatic nitro compound, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0042] As the amine-based stabilizer, it is possible to widely adopt known ones. For example, it is possible to use one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine.

[0043] As the phenol-based stabilizer, a wide variety of known stabilizers can be used, for example, one or more selected from the group consisting of 2,6-ditertiarybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0044] As the epoxy stabilizer, a wide variety of known ones can be used, for example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0045] The combination of stabilizers having different stabilizing effects more effectively prevents decomposition of the heat transfer fluid compound, which may occur due to various causes. For this reason, it is preferable to use one or more stabilizers selected from the group consisting of the above-mentioned epoxy-based stabilizer, as well as unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0046] From the viewpoint of effectively suppressing acid liberation from the heat transfer fluid compound and suppressing metal corrosion caused by the liquid composition, the content ratio of the stabilizer to the entire composition is preferably 0.0001 mass% or more, more preferably 0.01 mass% or more. On the other hand, in consideration of avoiding undesirable changes in the physical properties of the liquid composition due to excessive addition of the stabilizer, the content ratio of the stabilizer to the entire composition is preferably 10 mass% or less, more preferably 5 mass% or less.

[0047] The composition of the present disclosure is m F 2m and / or C. n F (2n-2) In the formula, m is an integer of 4 or more and 12 or less except 9, and n is an integer of 4 or more and 12 or less.

[0048] In the above general formula, m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less, with the proviso that m does not include 9.

[0049] In the above general formula, n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0050] In the composition of the present disclosure, m F 2m and / or C. n F (2n-2) By including 9 F 18 The stability of the compound represented by the formula (I) is improved.

[0051] Also, C m F 2m and / or C. n F (2n-2) The content of is preferably 0.0001 mass % or more based on the entire composition of the present disclosure.

[0052] On the other hand, C m F 2m and / or C. n F (2n-2) The content of is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less, based on the entire composition of the present disclosure.

[0053] In one embodiment, in the composition of the present disclosure, m F 2m and / or C. n F (2n-2) The content of is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, based on 100 parts by mass of the total of the HFP trimer.

[0054] On the other hand, in the composition of the present disclosure, C m F 2m and / or C. n F (2n-2)The content of is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the HFP trimer.

[0055] In addition, C m F 2m and / or C. n F (2n-2) When a plurality of kinds are contained, the above content means the total amount of these.

[0056] C m F 2m and / or C. n F (2n-2) By setting the content of C in the above range, 9 F 18 This makes it possible to suppress the decomposition of the HFP trimer represented by the following formula (1): and thus makes it possible to suppress an increase in fluoride ions and an increase in acidity.

[0057] The composition of the present disclosure may contain fluoride ions. When fluoride ions are contained, the content of fluoride ions is preferably 0.0000001 to 5 mass %, and more preferably 0.000001 to 1 mass %, based on the entire composition, from the viewpoint of thermal stability of the heat transfer fluid during long-term use.

[0058] The composition of the present disclosure may contain water. When water is contained, the content of water is preferably 1 to 1000 mass ppm based on the entire composition in terms of thermal stability of the heat transfer fluid during long-term use.

[0059] In one embodiment, the water content is 9 F 18 The amount is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0060] On the other hand, the water content is C 9 F 18The amount is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0061] The composition of the present disclosure may contain a conductive material. The conductive material may be at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics, and mixtures thereof. When the conductive material is contained, the content is preferably 10,000 ppm by mass or less, more preferably 1,000 ppm by mass or less, and even more preferably 1 ppm by mass or less, based on the entire composition, in order to suppress defects such as short circuits caused by the conductive material penetrating through gaps in the device.

[0062] The composition of the present disclosure may contain insoluble matter. When the composition contains insoluble matter, the content of the insoluble matter is preferably 5000 mass ppm or less, more preferably 1000 mass ppm or less, based on the entire composition, from the viewpoint of suppressing the clogging of piping and the resistance in the circuit during repeated use.

[0063] 2. Alternative Uses for Heat Transfer Fluids The composition of the present disclosure can be used as a replacement composition for a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxy tridecafluoroheptene isomers. The composition of the present disclosure can replace the following heat transfer fluids that are currently in practical use. Perfluorotripropylamine (or tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine) [N(CF 2 CF 2 CF 3 ) n (CF(CF 3 )CF 3 ) 3-n(n is an integer between 0 and 3)]; Perfluoropolyethers (PFPEs) such as those represented by the product names GALDEN® "HT135" and GALDEN® "HT110" (manufactured by Solvay), or more specifically, compounds represented by the above general formula: RO-Rf-R', and more specifically, tetrafluoroethylene oxide polymers and hexafluoropropylene oxide; and A mixture of methoxytridecafluoroheptene isomers, such as the product name "OpteonSF10" (manufactured by Chemours), or more specifically, methyl-perfluoroheptene ether (MPHE) (C 7 F 13 OCH 3 ).

[0064] In particular, in devices designed to transfer heat using the heat transfer fluids described above, the compositions of the present disclosure can be used to replace the heat transfer fluids.

[0065] The composition of the present disclosure can be a drop-in replacement, a near drop-in replacement, or a retrofit replacement for the above heat transfer fluids. The term "drop-in replacement" means that the replacement can be performed without any changes to the equipment. The term "near drop-in replacement" means that the replacement can be performed with almost no changes to the equipment. The term "retrofit replacement" means that the replacement can be performed with minimal changes (without significant changes) to the equipment. The composition of the present disclosure is preferably a drop-in replacement or a near drop-in replacement for the above heat transfer fluids.

[0066] Whether or not the composition of the present disclosure can be a drop-in replacement, a near drop-in replacement, or a retrofit replacement can be determined based on whether or not all of the following conditions are satisfied. (i) The boiling point of the composition of the present disclosure is at least about 80% or more, and preferably at least about 85% or more, of the boiling point of the heat transfer fluid prior to exchange. (ii) the pour point of the composition of the present disclosure is equal to or less than the pour point of the heat transfer fluid prior to exchange; (iii) The kinematic viscosity of the composition of the present disclosure is at least about 200% or less, and preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid prior to exchange. (iv) The compositions of the present disclosure are compatible in all proportions with the heat transfer fluid to be replaced.

[0067] By making the boiling point of the composition of the present disclosure at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, it is possible to suppress the occurrence of cavitation and leakage from the device. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but may be, for example, at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0068] By making the pour point of the composition of the present disclosure equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures lower than the conventional use temperature, and the use temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but may be, for example, a temperature 30°C higher than the pour point of the heat transfer fluid before replacement.

[0069] By setting the kinetic viscosity of the composition of the present disclosure to at least about 200% or less, preferably at least about 150% or less, of the kinetic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. The kinetic viscosity is preferably compared at the kinetic viscosity at the operating temperature, but is not limited thereto, and can be compared at any temperature, for example, from -20°C to -40°C, specifically at -20°C.

[0070] The composition of the present disclosure is compatible with the heat transfer fluid being replaced in any proportion, making replacement easy.

[0071] Furthermore, the composition of the present disclosure is more suitable as a drop-in replacement, near drop-in replacement, or retrofit replacement by satisfying the following conditions: (v) The composition of the present disclosure has a dielectric constant that is 120% or less than that of the heat transfer fluid prior to replacement. (vi) The composition of the present disclosure has a dielectric strength that is 90% or greater than that of the heat transfer fluid prior to replacement. (vii) The composition of the present disclosure has a specific heat that is 90% or greater than that of the heat transfer fluid prior to exchange. (viii) The composition of the present disclosure has a thermal conductivity of at least 85% of the heat transfer fluid prior to replacement.

[0072] The composition of the present disclosure can be suitably used as a replacement composition by making the dielectric constant of the composition 120% or less of the dielectric constant of the heat transfer fluid before replacement. The upper limit of the dielectric constant of the heat transfer fluid is not particularly limited, but may be, for example, 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0073] The composition of the present disclosure can be suitably used as a replacement composition by making the dielectric strength of the composition 90% or more of the dielectric strength of the heat transfer fluid before replacement. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0074] The composition of the present disclosure can be suitably used as a replacement composition by making the specific heat of the composition 90% or more of the specific heat of the heat transfer fluid before replacement. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the specific heat of the heat transfer fluid before replacement.

[0075] The composition of the present disclosure can be suitably used as a replacement composition by making the thermal conductivity of the composition 85% or more of the thermal conductivity of the heat transfer fluid before replacement. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0076] The boiling point of the composition of the present disclosure may be preferably 105° C. or higher, more preferably 108° C. or higher. The upper limit of the boiling point of the composition of the present disclosure is not particularly limited, but may be, for example, 150° C. or lower, 130° C. or lower, or 120° C. or lower.

[0077] The pour point of the composition of the present disclosure may be preferably −80° C. or lower, more preferably −100° C. or lower, and even more preferably −110° C. or lower. The lower limit of the pour point of the composition of the present disclosure is not particularly limited, but may be, for example, −180° C. or higher, or −160° C. or higher.

[0078] The kinematic viscosity of the composition of the present disclosure may be preferably 6.0 cSt or less, more preferably 5.0 cSt or less, even more preferably 4.0 cSt or less, and even more preferably 3.0 cSt or less at -20° C. In addition, the lower limit of the kinematic viscosity of the composition of the present disclosure is not particularly limited, but may be, for example, 1.0 cSt or more.

[0079] The dielectric constant of the composition of the present disclosure may be preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. The lower limit of the dielectric constant of the composition of the present disclosure is not particularly limited, but may be, for example, 1.1 or more.

[0080] The dielectric strength of the composition of the present disclosure may be preferably 40 kV or more, more preferably 50 kV or more, and even more preferably 50 kV or more. The upper limit of the dielectric strength of the composition of the present disclosure is not particularly limited, but may be, for example, 150 kV or less, or 100 kV or less.

[0081] The specific heat of the composition of the present disclosure may be preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30° C. In addition, the upper limit of the specific heat of the composition of the present disclosure is not particularly limited, but may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0082] The thermal conductivity of the composition of the present disclosure may be preferably 0.055 W / mK or more, more preferably 0.060 W / mK or more, and even more preferably 0.065 W / mK or more at 30° C. In addition, the upper limit of the thermal conductivity of the composition of the present disclosure is not particularly limited, but may be, for example, 0.090 W / mK or less, or 0.080 W / mK or less.

[0083] The boiling point of the composition of the present disclosure is the temperature at which a peak resulting from endothermic heat is observed when the temperature is increased from 25° C. at 5° C. / min using DSC (differential scanning calorimetry).

[0084] The pour point of the composition of the present disclosure is the temperature at which an endothermic peak is observed when the composition is cooled to below its freezing point with liquid nitrogen and then heated at a rate of 5° C. / min using DSC.

[0085] The dielectric constant of the composition of the present disclosure is a value observed at a frequency of 1 kHz in an environment of a temperature of 25° C. and a humidity of 60% using a capacitance method.

[0086] The kinematic viscosity and density of the composition of the present disclosure are values ​​measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0087] The dielectric strength of the composition of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined distance and the voltage is increased at a constant rate. The measurement conditions are as follows: Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / sec Measurement atmosphere: In air (22°C, 57% RH)

[0088] The specific heat of the composition of the present disclosure is a value obtained using DSC under the following conditions: Measurement equipment: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen gas flow Sample container: Aluminum airtight container

[0089] The thermal conductivity of the compositions of the present disclosure is a value obtained by the transient thin wire method.

[0090] The compatibility of the composition of the present disclosure is judged based on whether or not it is compatible with a target solvent when mixed with the composition. Compatibility here means that the two are in a homogeneous state when mixed together, i.e., no phase separation occurs.

[0091] 3. Equipment containing heat transfer fluids The device of the present disclosure comprises the composition of the present disclosure.

[0092] The apparatus of the present disclosure includes a device that includes a device and a heat transfer mechanism for transferring heat to or from the device.

[0093] Specifically, the device of the present disclosure having a heat transfer mechanism is a device including a heat transfer mechanism, which comprises a device and a heat transfer mechanism that transfers heat to or from the device using a composition of the present disclosure as a heat transfer fluid, and the heat transfer mechanism is designed to transfer heat using a heat transfer fluid including at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture.

[0094] Devices include, for example, computers, servers including server computers and blade servers; disk arrays / storage systems; storage area networks; network attached storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication equipment; cell processing equipment; printers; power supplies; displays; optical devices; measurement systems including handheld systems; military electronics, and the like.

[0095] A semiconductor element is a heat-generating element mounted on a device, and examples of such elements include a CPU, a GPU, and an SSD. The semiconductor element is composed of, for example, single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0096] When the device is a server computer, a logic board or multiple logic boards are disposed within the interior space. The logic board includes a number of heat-generating electronic components, including at least one processor, such as a CPU, GPU, etc. In addition, other heat-generating computer components may be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; storage drives, such as solid state drives, mechanical hard disks, etc.

[0097] The heat transfer mechanism is a heat transfer mechanism for transferring heat between the heat transfer target object and the composition of the present disclosure, and transfers heat by thermal contact with the heat transfer target object. For example, cooling is used when heat is taken from the heat transfer target object, and heating is used when heat is supplied to the heat transfer target object. Different mechanisms may be used depending on the respective cases, but one heat transfer mechanism may be used for both cooling and heating.

[0098] Examples of heat transfer mechanisms include, but are not limited to, pumps, valves, fluid containment systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0099] More specifically, these include temperature controlled wafer chucks in plasma enhanced chemical vapor deposition (PECVD) tools, temperature controlled test heads for die performance testing, temperature controlled work areas in semiconductor processing equipment, thermal shock test bath fluid reservoirs, thermostatic chambers, etc.

[0100] The heat transfer target object that is brought into thermal contact with the heat transfer mechanism is an article, device, or atmosphere that is to be cooled, heated, or maintained at a temperature to be controlled. Such heat transfer target objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of heat transfer target objects in the present disclosure include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electric branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, heat exchangers, electrochemical cells, lasers, and missile parts.

[0101] The temperature condition of the composition of the present disclosure when using the device of the present disclosure is preferably −100 to 100° C., more preferably −90 to 90° C., and even more preferably −70 to 90° C. The composition of the present disclosure has the advantage of exhibiting low kinetic viscosity even at low temperatures of −20° C. or lower, and particularly at −70 to −60° C., so that the device can be suitably used even in the above temperature range.

[0102] Equipment of the present disclosure further includes two-phase immersion cooling fluids, chiller fluids, Rankine cycle working fluids, and the like.

[0103] 4.Heat transfer methods The heat transfer method of the present disclosure is a heat transfer method comprising a step of transferring heat in an apparatus designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, by replacing the heat transfer fluid with the composition of the present disclosure.

[0104] The equipment includes devices that include a device and a heat transfer mechanism that transfers heat to or from the device, two-phase immersion cooling fluids, chiller fluids, Rankine cycle working fluids, and the like.

[0105] In the above, the device includes the device described in "3. Equipment containing a heat transfer fluid". When the above device is used, the heat transfer method of the present disclosure is a heat transfer method comprising a step of transferring heat to or from a device including a heat transfer mechanism designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxy tridecafluoroheptene isomer mixture, by operating the heat transfer mechanism using the composition of the present disclosure in place of the heat transfer fluid.

[0106] In the heat transfer methods of the present disclosure above, heat can be transferred by placing a heat transfer mechanism in thermal contact with a device. When the heat transfer mechanism is placed in thermal contact with the device, it removes heat from the device or supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer mechanism.

[0107] Although the embodiment of the present invention has been described above, the present invention is not limited to these examples, and it is needless to say that the present invention can be embodied in various forms without departing from the gist of the present invention. EXAMPLES

[0108] Hereinafter, the embodiments of the present invention will be described more specifically based on examples, but the present invention is not limited to these.

[0109] <Example 1> The heat transfer fluid composition of Example 1 was obtained based on the method described in Chem Ber 1973, 106, 2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropene dimers and tetramers. Furthermore, the purified HFP trimer was separated into compounds represented by formulas (I), (II) and (III) by distillation. Each of the separated HFP trimers was dehydrated using silica gel.

[0110] The compounds represented by formulas (I), (II) and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II) and (III) were as shown in the table below, thereby obtaining trimer mixtures of Examples 1 to 4.

[0111] [Table 1] It was confirmed that it contained % by volume.

[0112] <Comparative Example 1> FC-3283 manufactured by 3M was prepared as Comparative Example 1. This did not contain the compounds represented by (I), (II) and (III).

[0113] <Comparative Example 2> HFE7100 manufactured by 3M was prepared as Comparative Example 2. This did not contain the compounds represented by (I), (II) and (III).

[0114] The compositions of Examples 1 to 4 and Comparative Examples 1 and 2 were evaluated for boiling point, pour point, dielectric constant, kinetic viscosity, dielectric strength, specific heat, thermal conductivity, and compatibility.

[0115] <Boiling point, pour point and dielectric constant measurement> The boiling point of the trimer mixture was measured using differential scanning calorimetry (DSC), and was taken as the temperature at which a peak due to endothermic heat was observed when the mixture was heated from 25°C at 5°C / min. The pour point was measured using differential scanning calorimetry (DSC), and was taken as the temperature at which a peak due to endothermic heat was observed when the mixture was cooled below the freezing point with liquid nitrogen and then heated at 5°C / min. The dielectric constant was measured at a frequency of 1 kHz using the capacitance method in an environment of 25°C and 60% humidity.

[0116] <Kinematic viscosity and density measurement> The kinematic viscosity and density of the trimer mixture were measured using an Anton Paar SVM3001 kinematic viscometer.

[0117] <Dielectric strength measurement> The liquid sample was immersed between spherical electrodes adjusted to a predetermined distance, and the dielectric strength of the trimer mixture was measured as the dielectric breakdown voltage when the voltage was increased at a constant rate. The detailed measurement conditions were as follows: Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / sec Measurement atmosphere: In air (22°C, 57% RH)

[0118] <Specific heat measurement> The specific heat of the trimer mixture was measured using DSC under the following conditions: Measurement equipment: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen gas flow Sample container: Aluminum airtight container

[0119] <Thermal conductivity measurement> The thermal conductivity of the trimer mixture was measured by the transient hot-wire method.

[0120] <compatibility> The compatibility of the trimer mixtures was evaluated by mixing the trimer mixtures with the following three solvents in equal amounts. Galden HT135 (Solvay) SF-10 (manufactured by Chemours) FC3283 (3M)

[0121] [Table 2]

Claims

1. A heat transfer fluid comprising at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxy tridecafluoroheptene isomers, ９ F １８ A composition comprising a hexafluoropropene trimer represented by the formula: Said C ９ F １８ The content of the hexafluoropropene trimer represented by the formula (I) is 80% by mass or more based on the total mass of the composition, Said C ９ F １８ The hexafluoropropene trimer represented by the following formulas (I) to (III): 【Chemistry 1】 The compound includes at least one compound selected from the group consisting of compounds represented by The content of the compound represented by formula (I) is ９ F １８ The composition, wherein the content of the hexafluoropropene trimer represented by the formula (I) is 30% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer represented by the formula (I).

2. The composition according to claim 1, which satisfies the following conditions (i) to (iv): (i) The boiling point is 80% or more of the boiling point of the heat transfer fluid. (ii) the pour point is equal to or less than the pour point of said heat transfer fluid; (iii) the kinetic viscosity is 200% or less of the kinetic viscosity of the heat transfer fluid; (iv) be miscible in any proportion with said heat transfer fluid;

3. C ９ F １８ and at least one member selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, Said C ９ F １８ The heat transfer fluid composition according to claim 1, wherein the content of the hexafluoropropene trimer represented by the formula (I) is 80 mass % or more.

4. Said C ９ F １８ The heat transfer fluid composition according to claim 3, wherein the hexafluoropropene trimer represented by the formula (I) comprises at least one compound selected from the group consisting of compounds represented by the formulas (I) to (III): 【Chemistry 2】

5. The compound is ９ F １８ 5. The heat transfer fluid composition according to claim 4, comprising less than 85% by mass of the compound represented by formula (I) based on the total amount of hexafluoropropene trimers represented by formula (I).

6. The compound is ９ F １８ The heat transfer fluid composition according to claim 4, comprising 85 mass % or more of the compound represented by formula (I) based on the total amount of the hexafluoropropene trimer represented by formula (I).

7. A device comprising a heat transfer mechanism, the device comprising: a device; and a heat transfer mechanism that transfers heat to or from the device using the composition described in claim 1 or the heat transfer fluid composition described in claim 3 or 4 as a heat transfer fluid, the heat transfer mechanism being designed to transfer heat using a heat transfer fluid comprising at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture.

8. C ９ F １８ Use of a hexafluoropropene trimer represented by the formula: Said C ９ F １８ The hexafluoropropene trimer represented by the following formulas (I) to (III): 【Chemistry 3】 The compound includes at least one compound selected from the group consisting of compounds represented by The content of the compound represented by formula (I) is ９ F １８ The content of the hexafluoropropene trimer represented by the formula (I) is 30% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer represented by the formula (I).

9. A method for heat transfer, comprising the steps of: in a device including a heat transfer mechanism designed to transfer heat using a heat transfer fluid comprising at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers; and transferring heat to or from the device by operating the heat transfer mechanism using the composition according to claim 1 or the composition for heat transfer fluid according to claim 3 or 4 in place of the heat transfer fluid.

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