Storage vessel, processing system and base plate

Abstract

To provide a storage container in which a consumption member can be positioned and stored, and a processing system.SOLUTION: A storage container (cassette) is a container in which an annular member (e.g., an edge ring FR) having a notch in at least one of an outer periphery and an inner periphery is stored and comprises a base plate 781 on which the annular member is mounted, and a plurality of guide pins 782 which protrude from the base plate and position the annular member. The plurality of guide pins include a pin which is engaged to a notch FRa.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present disclosure relates to a storage container 、 processing system and a base plate .

Background Art

[0002] There is known a technique in which an edge ring and a cover ring disposed around a wafer are each lifted and lowered by a single system of lifter pins and conveyed one by one on an electrostatic chuck provided in a processing container in which plasma processing is performed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for positioning and accommodating a consumable member.

Means for Solving the Problems

[0005] A storage container according to one aspect of the present disclosure is , a ring a container for storing an annular member, a base plate on which the annular member is placed , and the base plate has a placement surface for placing the annular member, the placement surface a plurality of guide pins protruding from the above, and a plurality of guide pins for positioning the annular member, an outer frame portion that protrudes upward at the outer peripheral portion of the placement surface, and the lower surface of another pace plate is separably placed on the upper surface of the outer frame portion; and has to do .

Effects of the Invention

[0006] According to the present disclosure, a consumable member can be positioned and accommodated.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23

Figure 24

Figure 25

Mode for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔Processing System〕 Referring to FIG. 1, an example of the processing system of the embodiment will be described. As shown in FIG. 1, the processing system PS is a system capable of performing various processes such as plasma processing on a substrate. The substrate may be, for example, a semiconductor wafer.

[0010] The processing system PS includes vacuum transfer modules TM1, TM2, process modules PM1 to PM12, load lock modules LL1, LL2, an atmospheric transfer module LM, a storage module SM, etc.

[0011] The vacuum transfer modules TM1 and TM2 each have a substantially rectangular shape in plan view. The vacuum transfer module TM1 has process modules PM1 to PM6 connected to two opposing side surfaces. Of the other two opposing side surfaces of the vacuum transfer module TM1, load lock modules LL1 and LL2 are connected to one side surface, and a path (not shown) for connecting to the vacuum transfer module TM2 is connected to the other side surface. The side surface of the vacuum transfer module TM1 to which the load lock modules LL1 and LL2 are connected is angled according to the two load lock modules LL1 and LL2. The vacuum transfer module TM2 has process modules PM7 to PM12 connected to two opposing side surfaces. Of the other two opposing side surfaces of the vacuum transfer module TM2, a path (not shown) for connecting to the vacuum transfer module TM1 is connected to one side surface, and a storage module SM is connected to the other side surface. The vacuum transfer modules TM1 and TM2 have vacuum chambers, and transfer robots TR1 and TR2 are respectively arranged inside them.

[0012] The transfer robots TR1 and TR2 are configured to be rotatable, extendable and retractable, and vertically movable. The transfer robot TR1 holds and transfers a substrate and a consumable member with an upper fork FK11 and a lower fork FK12 disposed at its tip. In the example of FIG. 1, the transfer robot TR1 holds a substrate and a consumable member with the upper fork FK11 and the lower fork FK12, and transfers the substrate and the consumable member between the load lock modules LL1 and LL2, the process modules PM1 to PM6, and a path (not shown). The transfer robot TR2 holds and transfers a substrate and a consumable member with an upper fork FK21 and a lower fork FK22 disposed at its tip. In the example of FIG. 1, the transfer robot TR2 holds a substrate and a consumable member with the upper fork FK21 and the lower fork FK22, and transfers the substrate and the consumable member between the process modules PM7 to PM12, the storage module SM, and a path (not shown). The consumable member is a member that is replaceably attached inside the process modules PM1 to PM12, and is a member that is consumed by performing various processes such as plasma processing inside the process modules PM1 to PM12. The consumable member includes, for example, an edge ring FR, a cover ring CR, and a top plate 121 of the upper electrode 12 described later.

[0013] The process modules PM1 to PM12 have a processing chamber and a stage (mounting table) disposed inside. After a substrate is placed on the stage in the process modules PM1 to PM12, the inside is depressurized, a processing gas is introduced, RF power is applied to generate plasma, and the substrate is subjected to plasma processing by the plasma. The vacuum transfer modules TM1 and TM2 and the process modules PM1 to PM12 are partitioned by an openable and closable gate valve G1. An edge ring FR, a cover ring CR, etc. are disposed on the stage. An upper electrode 12 for applying RF power is disposed above the stage so as to face the stage.

[0014] The load lock modules LL1 and LL2 are arranged between the vacuum transfer module TM1 and the atmospheric transfer module LM. The load lock modules LL1 and LL2 have an internal pressure variable chamber that can be switched between vacuum and atmospheric pressure. The load lock modules LL1 and LL2 have stages arranged inside. When loading a substrate from the atmospheric transfer module LM to the vacuum transfer module TM1, the load lock modules LL1 and LL2 maintain the inside at atmospheric pressure to receive the substrate from the atmospheric transfer module LM, and then reduce the pressure inside to load the substrate into the vacuum transfer module TM1. When unloading a substrate from the vacuum transfer module TM1 to the atmospheric transfer module LM, the load lock modules LL1 and LL2 maintain the inside at vacuum to receive the substrate from the vacuum transfer module TM1, and then increase the pressure to atmospheric pressure to load the substrate into the atmospheric transfer module LM. The load lock modules LL1 and LL2 and the vacuum transfer module TM1 are partitioned by an openable and closable gate valve G2. The load lock modules LL1 and LL2 and the atmospheric transfer module LM are partitioned by an openable and closable gate valve G3.

[0015] The atmospheric transfer module LM is arranged opposite to the vacuum transfer module TM1. The atmospheric transfer module LM may be, for example, an EFEM (Equipment Front End Module). The atmospheric transfer module LM is rectangular parallelepiped-shaped, equipped with an FFU (Fan Filter Unit), and is an atmospheric transfer chamber maintained in an atmospheric pressure atmosphere. Two load lock modules LL1 and LL2 are connected to one side surface along the longitudinal direction of the atmospheric transfer module LM. Load ports LP1 to LP5 are connected to the other side surface along the longitudinal direction of the atmospheric transfer module LM. Containers (not shown) for accommodating a plurality (for example, 25 sheets) of substrates are placed on the load ports LP1 to LP5. The container may be, for example, a FOUP (Front-Opening Unified Pod). Inside the atmospheric transfer module LM, a transfer robot (not shown) for transferring the substrate is arranged. The transfer robot transfers the substrate between inside the FOUP and inside the pressure variable chamber of the load lock modules LL1 and LL2.

[0016] The storage module SM is detachably connected to the vacuum transfer module TM2. The storage module SM has a storage chamber and stores consumable members. The storage module SM is connected to the vacuum transfer module TM2, for example, when replacing the consumable members in the process modules PM1 to PM12, and is removed from the vacuum transfer module TM2 after the replacement of the consumable members is completed. Thereby, the area around the processing system PS can be effectively utilized. However, the storage module SM may always be connected to the vacuum transfer module TM2. The storage module SM has a position detection sensor for detecting the position of the consumable member stored in the storage chamber. The consumable members are transferred between the process modules PM1 to PM12 and the storage module SM by the transfer robots TR1 and TR2. The vacuum transfer module TM2 and the storage module SM are partitioned by an openable and closable gate valve G4.

[0017] The processing system PS is provided with a control unit CU. The control unit CU controls each part of the processing system, for example, the transfer robots TR1 and TR2 provided in the vacuum transfer modules TM1 and TM2, the transfer robot provided in the atmospheric transfer module LM, and the gate valves G1 to G4. For example, the control unit CU is configured to select a simultaneous transfer mode in which the transfer robots TR1 and TR2 simultaneously transfer the edge ring FR and the cover ring CR, and a single transfer mode in which only the edge ring FR is transferred by the transfer robots TR1 and TR2. The simultaneous transfer mode and the single transfer mode will be described later.

[0018] The control unit CU may be, for example, a computer. The control unit CU includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device and controls each part of the processing system PS.

[0019] 〔Plasma Processing Apparatus〕 Referring to FIG. 2, an example of a plasma processing apparatus used as process modules PM1 to PM12 included in the processing system PS of FIG. 1 will be described.

[0020] The plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, an RF power supply unit 30, an exhaust system 40, a lifting mechanism 50, and a control unit 90.

[0021] The plasma processing chamber 10 includes a substrate support unit 11 and an upper electrode 12. The substrate support unit 11 is disposed in a lower region of the plasma processing space 10s within the plasma processing chamber 10. The upper electrode 12 is disposed above the substrate support unit 11 and can function as a part of the top plate of the plasma processing chamber 10.

[0022] The substrate support unit 11 supports the substrate W in the plasma processing space 10s. The substrate support unit 11 includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W on its upper surface. The ring assembly 113 includes an edge ring FR and a cover ring CR. The edge ring FR has an annular shape and is disposed around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The edge ring FR improves, for example, the uniformity of plasma processing. The cover ring CR has an annular shape and is disposed on the outer peripheral portion of the edge ring FR. The cover ring CR protects, for example, the upper surface of the insulator 115 from plasma. In the example of FIG. 2, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Thereby, when a plurality of support pins 521 described later move up and down, the cover ring CR and the edge ring FR move up and down integrally. The insulator 115 is disposed on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10 and supports the lower electrode 111 and the insulator 115. An example of the annular shape includes a circular annular shape.

[0023] The upper electrode 12, together with the insulating member 13, constitutes the plasma processing chamber 10. The upper electrode 12 supplies one or more types of processing gases from the gas supply unit 20 to the plasma processing space 10s. The upper electrode 12 includes a top plate 121 and a support 122. The lower surface of the top plate 121 defines the plasma processing space 10s. A plurality of gas inlets 121a are formed in the top plate 121. Each of the plurality of gas inlets 121a penetrates in the plate thickness direction (vertical direction) of the top plate 121. The support 122 detachably supports the top plate 121. A gas diffusion chamber 122a is provided inside the support 122. A plurality of gas inlets 122b extend downward from the gas diffusion chamber 122a. The plurality of gas inlets 122b communicate with the plurality of gas inlets 121a respectively. A gas supply port 122c is formed in the support 122. The upper electrode 12 supplies one or more processing gases from the gas supply port 122c to the plasma processing space 10s via the gas diffusion chamber 122a, the plurality of gas inlets 122b, and the plurality of gas inlets 121a.

[0024] An inlet / outlet 10p is formed in the side wall of the plasma processing chamber 10. The substrate W is transported between the plasma processing space 10s and the outside of the plasma processing chamber 10 via the inlet / outlet 10p. The inlet / outlet 10p is opened and closed by a gate valve G1.

[0025] The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 supplies one or more types of processing gases from the respective gas sources 21 to the gas supply port 122c via the respective flow controllers 22. The flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Further, the gas supply unit 20 may include one or more flow modulation devices for modulating or pulsing the flow rate of one or more processing gases.

[0026] The RF power supply unit 30 includes two RF power supplies (the first RF power supply 31a and the second RF power supply 31b) and two matching units (the first matching unit 32a and the second matching unit 32b). The first RF power supply 31a supplies the first RF power to the lower electrode 111 via the first matching unit 32a. The frequency of the first RF power may be, for example, 13 MHz to 150 MHz. The second RF power supply 31b supplies the second RF power to the lower electrode 111 via the second matching unit 32b. The frequency of the second RF power may be, for example, 400 kHz to 13.56 MHz. Note that instead of the second RF power supply 31b, a DC power supply may be used.

[0027] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbo molecular pump, a dry pump, or a combination thereof.

[0028] The elevating mechanism 50 raises and lowers the substrate W, the edge ring FR, and the cover ring CR. The elevating mechanism 50 includes a first elevating mechanism 51 and a second elevating mechanism 52.

[0029] The first elevating mechanism 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted into through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112 and can project and retract with respect to the upper surface of the electrostatic chuck 112. By projecting with respect to the upper surface of the electrostatic chuck 112, the upper ends of the plurality of support pins 511 abut against the lower surface of the substrate W to support the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. As the actuator 512, for example, a motor such as a DC motor, a stepping motor, or a linear motor, an air drive mechanism such as an air cylinder, or a piezo actuator can be used. Such a first elevating mechanism 51 raises and lowers the plurality of support pins 511, for example, when transferring the substrate W between the transfer robots TR1, TR2 and the substrate support portion 11.

[0030] The second elevating mechanism 52 includes a plurality of support pins 521 and an actuator 522. The plurality of support pins 521 are inserted into through holes H2 formed in the insulator 115 and can project and retract with respect to the upper surface of the insulator 115. By projecting with respect to the upper surface of the insulator 115, the plurality of support pins 521 abut the lower surface of the cover ring CR at their upper ends to support the cover ring CR. The actuator 522 raises and lowers the plurality of support pins 521. As the actuator 522, for example, the same one as the actuator 512 can be used. Such a second elevating mechanism 52 raises and lowers the plurality of support pins 521, for example, when delivering the edge ring FR and the cover ring CR between the transfer robots TR1, TR2 and the substrate support portion 11. In the example of FIG. 2, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Thereby, when the actuator 522 raises and lowers the plurality of support pins 521, the cover ring CR and the edge ring FR are raised and lowered integrally.

[0031] The control unit 90 controls each part of the plasma processing apparatus 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a storage unit 912, a communication interface 913, etc. The CPU 911 may be configured to perform various control operations based on programs stored in the storage unit 912. The storage unit 912 includes at least one memory type selected from a group consisting of auxiliary storage devices such as RAM, ROM, HDD (Hard Disk Drive), SSD (Solid State Drive), etc. The communication interface 913 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network). The control unit 90 may be provided separately from the control unit CU or may be included in the control unit CU.

[0032] 〔Storage module〕 With reference to FIGS. 3 and 4, an example of the storage module SM included in the processing system PS of FIG. 1 will be described.

[0033] The storage module SM has a chamber 70 installed on the frame 60 and has a machine room 81 at the upper part of the chamber 70. The chamber 70 can decompress its interior by an exhaust part 72 connected to an exhaust port 71 provided at the bottom. Also, for example, N 2 gas is supplied as a purge gas. Thereby, the pressure in the chamber 70 can be regulated. The machine room 81 is, for example, in an atmospheric pressure atmosphere.

[0034] In the chamber 70, a storage 75 having a stage 73 and a basket 74 provided below the stage 73 is installed. The storage 75 can be moved up and down by a ball screw 76. In the machine room 81, a line sensor 82 for detecting the position, orientation, etc. of a consumable member and a motor 77 for driving the ball screw 76 are installed. Between the chamber 70 and the machine room 81, a window 84 made of quartz or the like is provided so that the line sensor 82 can receive the light of a light emitting part 83 described later.

[0035] The stage 73 mounts the consumable member. The stage 73 has a light emitting part 83 facing the line sensor 82. The stage 73 is rotatable in the θ direction and rotates the mounted consumable member, for example, an edge ring FR, in a predetermined direction. That is, the stage 73 performs alignment (positioning) of the edge ring FR. In the alignment, the orientation flat (OF) of the edge ring FR is adjusted to a predetermined direction. Also, in the alignment, the center position of the edge ring FR may be adjusted.

[0036] The line sensor 82 detects the amount of light irradiated from the light emitting unit 83 and outputs the detected amount of light to the control unit CU. The control unit CU detects the orientation flat of the edge ring FR by utilizing the fact that the detected amount of light changes depending on the presence or absence of the orientation flat of the edge ring FR. The control unit CU detects the orientation of the edge ring FR based on the detected orientation flat. The line sensor 82 is a line sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), for example.

[0037] The basket 74 is provided below the stage 73. Inside the basket 74, a cassette 78 is placed. The cassette 78 is a storage container that can be taken out from the basket 74. The cassette 78 stores a plurality of consumable members with a space in the vertical direction. In the example of FIG. 3, a plurality of edge rings FR are stored in the cassette 78. The front side of the cassette 78 is open. Details of the cassette 78 will be described later.

[0038] In addition to the stage 73 and the basket 74, the storage 75 has a guide 79 supported by a ball screw 76 on its side surface. The ball screw 76 connects the upper surface and the lower surface of the chamber 70, passes through the upper surface of the chamber 70, and is connected to a motor 77 in the machine room 81. The penetration portion on the upper surface of the chamber 70 is sealed so that the ball screw 76 can rotate. The ball screw 76 can move the storage 75 in the vertical direction (Z-axis direction) by rotating by the motor 77.

[0039] The storage module SM is detachably connected to the vacuum transfer module TM2 via the gate valve G4. In the chamber 70, the upper fork FK21 and the lower fork FK22 of the transfer robot TR2 of the vacuum transfer module TM2 can be inserted via the gate valve G4. The upper fork FK21 and the lower fork FK22 are used to carry in the edge ring FR into the cassette 78, carry out the edge ring FR placed in the cassette 78, place the edge ring FR on the stage 73, and acquire the edge ring FR placed on the stage 73. The door 80 is opened and closed, for example, when taking out the cassette 78 from the inside of the chamber 70 and when installing the cassette 78 into the inside of the chamber 70.

[0040] The light emitting unit 85 and the number detection sensor 86 detect the number of edge rings FR placed on the cassette 78 when the storage 75 moves from the bottom side of the chamber 70 to the upper part such as a position facing the gate valve G4 with respect to the cassette 78. The light emitting unit 85 is, for example, an LED (Light Emitting Diode), a semiconductor laser, or the like. The number detection sensor 86 detects the amount of light irradiated from the light emitting unit 85 and outputs the detected amount of light to the control unit CU. The control unit CU measures the number of times the light irradiated from the light emitting unit 85 is blocked by the edge ring FR based on the detected amount of light, thereby detecting the number of edge rings FR. The number detection sensor 86 is, for example, a photodiode, a phototransistor, or the like. Further, the number detection sensor 86 may be a line sensor such as a CCD or a CMOS.

[0041] In the above example, the case where the control unit CU calculates the position information of the edge ring FR based on the amount of light detected by the line sensor 82 in the storage module SM has been described. However, the present disclosure is not limited to this. For example, a position detection sensor including an inner circumference sensor that detects the position of the inner circumference of the edge ring FR and an outer circumference sensor that detects the position of the outer circumference of the edge ring FR may be used. In this case, the control unit CU calculates the position information of the edge ring FR based on the position of the outer circumference of the edge ring FR detected by the inner circumference sensor and the position of the outer circumference of the edge ring FR detected by the outer circumference sensor. Further, for example, instead of the line sensor 82, another optical sensor or a camera may be used. In this case, the control unit CU calculates the position information of the edge ring FR based on the image captured by the camera, for example, by using image processing technology.

[0042] 〔Transfer Robot〕 Referring to FIGS. 5 to 8, the upper fork FK21 of the transfer robot TR2 will be described. Note that the lower fork FK22 of the transfer robot TR2 may have the same configuration as the upper fork FK21. Further, the upper fork FK11 and the lower fork FK12 of the transfer robot TR1 may also have the same configuration as the upper fork FK21 of the transfer robot TR2.

[0043] FIG. 5 is a schematic plan view showing the upper fork FK21 not holding the object to be transferred. As shown in FIG. 5, the upper fork FK21 has a substantially U-shaped configuration in plan view. The upper fork FK21 is configured to be able to hold, for example, a substrate W, a transfer jig CJ, an edge ring FR, a cover ring CR, a first assembly A1, and a second assembly A2.

[0044] The transfer jig CJ is a jig that supports the edge ring FR from below and can be used when only the edge ring FR is replaced.

[0045] The first assembly A1 is an assembly in which the edge ring FR and the cover ring CR are integrated by placing the edge ring FR on the cover ring CR.

[0046] The second assembly A2 is an assembly in which the edge ring FR is placed on the transfer jig CJ, and the transfer jig CJ and the edge ring FR are integrated.

[0047] FIG. 6 is a schematic plan view showing the upper fork FK21 holding the first assembly A1 (edge ring FR and cover ring CR). As shown in FIG. 6, the upper fork FK21 is configured to be able to hold the first assembly A1. Thereby, the transfer robot TR2 can transfer the edge ring FR and the cover ring CR simultaneously.

[0048] FIG. 7 is a schematic plan view showing the upper fork FK21 holding the second assembly A2 (transfer jig CJ and edge ring FR). As shown in FIG. 7, the upper fork FK21 is configured to be able to hold the second assembly A2. Thereby, the transfer robot TR2 can transfer the transfer jig CJ and the edge ring FR simultaneously.

[0049] FIG. 8 is a schematic plan view showing the upper fork FK21 holding only the transfer jig CJ. As shown in FIG. 8, the upper fork FK21 is configured to be able to hold the transfer jig CJ that does not support the edge ring FR. Thereby, the transfer robot TR2 can transfer the transfer jig CJ alone.

[0050] 〔Cassette〕 Referring further to FIG. 9, as an example of the cassette 78 included in the storage module SM, the cassette 78 for storing the edge ring FR will be described. FIG. 9 is a schematic perspective view showing an example of the cassette 78 in the storage module SM. Note that FIG. 9 shows the cassette 78 in a state where the edge ring FR is not stored.

[0051] The cassette 78 stores the edge ring FR. The cassette 78 has a plurality of base plates 781 and a plurality of guide pins 782.

[0052] A plurality of base plates 781 are provided in multiple stages in the vertical direction. The plurality of base plates 781 support the edge ring FR. Each base plate 781 has a substantially rectangular plate shape. Each base plate 781 is formed of, for example, resin or metal. Each base plate 781 includes a placement surface 781a, an outer frame portion 781b, and a fork insertion groove 781c.

[0053] The placement surface 781a supports the edge ring FR.

[0054] The outer frame portion 781b protrudes upward from the placement surface 781a at the outer peripheral portions of three sides out of the four sides of the placement surface 781a, excluding the front side where the upper fork FK21 and the lower fork FK22 are inserted. Another base plate 781 is placed on the outer frame portion 781b.

[0055] The fork insertion groove (recess) 781c is formed in the placement surface 781a. The fork insertion groove 781c is recessed with respect to the placement surface 781a, and when the transfer robot TR2 places the edge ring FR on the placement surface 781a, the upper fork FK21 and the lower fork FK22 are inserted.

[0056] A plurality of guide pins 782 are provided on the placement surface 781a. Each guide pin 782 may have a tapered conical shape. When the transfer robot TR2 places the edge ring FR on the placement surface 781a, the plurality of guide pins 782 come into contact with the outer peripheral portion of the edge ring FR and guide the edge ring FR to be placed at a predetermined position on the placement surface 781a. Each guide pin 782 may be formed of resin, metal, or the like. If it is made of resin, generation of particles due to rubbing when contacting the outer peripheral portion of the edge ring FR can be suppressed.

[0057] In addition, in FIG. 9, the cassette 78 for storing the edge ring FR is illustrated. However, for example, the cassette 78 for storing the transfer jig CJ, the cover ring CR, the first assembly A1, and the second assembly A2 may have a similar configuration except for the plurality of guide pins 782.

[0058] For example, in a cassette 78 for storing a covering CR, a plurality of guide pins 782 are provided at positions that come into contact with the inner peripheral portion of the covering CR placed on the placement surface 781a by the transfer robot TR2. As a result, the covering CR is guided to a predetermined position on the placement surface 781a and placed thereon.

[0059] Also, for example, in a cassette 78 for storing an edge ring FR and a covering CR, a plurality of guide pins 782 are provided at positions that come into contact with the outer peripheral portion of the edge ring FR and the inner peripheral portion of the covering CR placed on the placement surface 781a by the transfer robot TR2. As a result, the edge ring FR and the covering CR are guided to a predetermined position on the placement surface 781a and placed thereon.

[0060] Referring to FIG. 10, an example of a positioning mechanism when placing the edge ring FR conveyed into the storage module SM by the upper fork FK21 on the base plate 781 of the cassette 78 will be described. FIG. 10 is a diagram showing an example of the positioning mechanism of the edge ring FR. FIG. 10(a) is a top view when the upper fork FK21 holding the edge ring FR enters above the base plate 781. FIG. 10(b) shows a cross section taken along the dash-dotted line B1 - B1 in FIG. 10(a). FIG. 10(c) is a cross-sectional view when the edge ring FR is placed on the base plate 781 by the upper fork FK21.

[0061] First, as shown in FIGS. 10(a) and 10(b), the edge ring FR has a notch FRa on its outer periphery. The upper fork FK21 holding the edge ring FR is made to enter above the base plate 781. The notch FRa has, for example, a V shape in a plan view. The opening angle of the V shape may be set as appropriate and may be, for example, 90°. Also, the notch FRa may have a curved shape such as a U shape in a plan view.

[0062] Subsequently, as shown in FIG. 10(c), the upper fork FK21 is lowered. As a result, the edge ring FR held by the upper fork FK21 is placed on the placement surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch FRa of the edge ring FR, and the remaining two contact the outer periphery of the edge ring FR, thereby positioning the edge ring FR. As a result, the edge ring FR can be positioned with respect to the base plate 781 in the horizontal direction and the rotational direction.

[0063] In this way, by placing the edge ring FR on the base plate 781 by the upper fork FK21, the edge ring FR can be positioned. Therefore, the edge ring FR can be transported to the process modules PM1 to PM12 in a positioned state without separately providing an alignment mechanism for positioning the edge ring FR. As a result, the downtime caused by transporting the edge ring FR to the alignment mechanism can be reduced. Also, the equipment introduction cost can be reduced. In addition, the space efficiency is improved. However, an alignment mechanism may be separately provided to precisely align and transport the edge ring FR with the alignment mechanism.

[0064] In the example of FIG. 10, the case where the edge ring FR has one notch FRa on its outer periphery is shown, but the number of notches FRa is not limited to this. For example, the edge ring FR may have a plurality of notches FRa spaced apart from each other in the circumferential direction on its outer periphery. In this case, it is preferable to provide the guide pins 782 corresponding to each of the plurality of notches FRa. Thereby, the angular error can be reduced.

[0065] Also, in the example of FIG. 10, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may be used.

[0066] Referring to FIG. 11, an example of the positioning mechanism when placing the cover ring CR conveyed into the storage module SM by the upper fork FK21 onto the base plate 781 of the cassette 78 will be described. FIG. 11 is a diagram showing an example of the positioning mechanism of the cover ring CR. FIG. 11(a) is a top view when the upper fork FK21 holding the cover ring CR enters above the base plate 781. FIG. 11(b) shows a cross section taken along the dashed line B2 - B2 in FIG. 11(a). FIG. 11(c) is a cross-sectional view when the cover ring CR is placed on the base plate 781 by the upper fork FK21.

[0067] First, as shown in FIGS. 11(a) and 11(b), the cover ring CR has a notch CRa on its inner circumference. The upper fork FK21 holding the cover ring CR is made to enter above the base plate 781. The notch CRa has, for example, a V - shape in plan view. The opening angle of the V - shape may be set as appropriate and may be, for example, 90°. Also, the notch CRa may have a curved shape such as a U - shape in plan view.

[0068] Subsequently, as shown in FIG. 11(c), the upper fork FK21 is lowered. As a result, the cover ring CR held by the upper fork FK21 is placed on the placement surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch CRa of the cover ring CR, and the remaining two contact the inner circumference of the cover ring CR, thereby positioning the cover ring CR. As a result, the cover ring CR can be positioned with respect to the base plate 781 in the horizontal direction and the rotational direction.

[0069] In this way, by placing the cover ring CR on the base plate 781 with the upper fork FK21, the cover ring CR can be positioned. Therefore, the cover ring CR can be transported to the process modules PM1 to PM12 in a positioned state without separately providing an alignment mechanism for positioning the cover ring CR. As a result, the downtime caused by transporting the cover ring CR to the alignment mechanism can be reduced. Also, the device introduction cost can be reduced. Moreover, the space efficiency is improved. However, an alignment mechanism may be separately provided to precisely align and transport the cover ring CR with the alignment mechanism.

[0070] In the example of FIG. 11, the case where the cover ring CR has one notch CRa on the inner circumference is shown, but the number of notches CRa is not limited to this. For example, the cover ring CR may have a plurality of notches CRa spaced apart from each other in the circumferential direction on the inner circumference. In this case, it is preferable to provide guide pins 782 corresponding to each of the plurality of notches CRa. Thereby, the angular error can be reduced.

[0071] Also, in the example of FIG. 11, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may be used.

[0072] Referring to FIG. 12, the positioning mechanism when the edge ring FR and the cover ring CR transported into the storage module SM by the upper fork FK21 are placed on the base plate 781 of the cassette 78 will be described. FIG. 12 is a diagram showing an example of the positioning mechanism of the edge ring FR and the cover ring CR. FIG. 12(a) is a top view when the upper fork FK21 holding the edge ring FR and the cover ring CR enters above the base plate 781. FIG. 12(b) shows a cross section cut along the dashed-dotted line B3 - B3 in FIG. 12(a). FIG. 12(c) is a cross-sectional view when the edge ring FR and the cover ring CR are placed on the base plate 781 by the upper fork FK21.

[0073] First, as shown in FIGS. 12(a) and 12(b), the upper fork FK21 holding the edge ring FR and the cover ring CR is made to enter above the base plate 781. The outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR have a configuration that does not overlap in plan view. That is, the outer diameter of the edge ring FR is the same as or smaller than the inner diameter of the cover ring CR. The edge ring FR has a notch FRa on its outer periphery. The cover ring CR has a notch CRa on its inner periphery. The notches FRa and CRa have, for example, a V-shape in plan view. The opening angle of the V-shape may be set as appropriate and may be, for example, 90°. Also, the notches FRa and CRa may have a curved shape such as a U-shape in plan view, for example.

[0074] Subsequently, as shown in FIG. 12(c), the upper fork FK21 is lowered. As a result, the edge ring FR and the cover ring CR held by the upper fork FK21 are placed on the placement surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch FRa of the edge ring FR and the notch CRa of the cover ring CR, and the remaining two come into contact with the outer periphery of the cover ring CR, thereby positioning the edge ring FR and the cover ring CR. As a result, the edge ring FR and the cover ring CR can be positioned with respect to the base plate 781 in the horizontal direction and the rotational direction.

[0075] In this way, by placing the edge ring FR and the cover ring CR on the base plate 781 by means of the upper fork FK21, the edge ring FR and the cover ring CR can be positioned. Therefore, without separately providing an alignment mechanism for positioning the edge ring FR and the cover ring CR, they can be transported to the process modules PM1 to PM12 in a positioned state. As a result, the downtime caused by transporting the edge ring FR and the cover ring CR to the alignment mechanism can be reduced. Also, the device introduction cost can be reduced. Further, the space efficiency is improved. However, an alignment mechanism may be separately provided to precisely align and transport the edge ring FR and the cover ring CR with the alignment mechanism.

[0076] In the example of FIG. 12, a case where the edge ring FR has one notch FRa on the outer periphery and the cover ring CR has one notch CRa on the inner periphery is shown, but the number of notches FRa and CRa is not limited to this. For example, the edge ring FR may have a plurality of notches FRa spaced apart from each other in the circumferential direction on the outer periphery, and the cover ring CR may have a plurality of notches CRa spaced apart from each other in the circumferential direction on the inner periphery. In this case, it is preferable to provide guide pins 782 corresponding to each of the plurality of notches FRa and CRa. Thereby, the angular error can be reduced.

[0077] Also, in the example of FIG. 12, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may be used.

[0078] Also, in the example of FIG. 12, the case of positioning the edge ring FR and the cover ring CR on the outer periphery or the inner periphery is described, but it is not limited to this. For example, recesses (or protrusions) for positioning may be provided on the back surfaces (the surfaces on the side to be placed on the placement surface 781a) of the edge ring FR and the cover ring CR to perform respective positioning.

[0079] In the example of FIG. 12, a configuration in which the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR do not overlap has been described. However, the present invention is not limited to this, and the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR may have an overlapping configuration. In this case, the edge ring FR may be held in a state of being positioned with respect to the cover ring CR. In one example, the edge ring FR may be positioned by providing a positioning portion on the outer periphery of the cover ring CR to position the cover ring CR. In another example, when the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap, as shown in FIG. 13, recesses FRb and CRb (or protrusions) for positioning may be provided in the non-overlapping regions of the edge ring FR and the cover ring CR, respectively. In this case, the guide pin 782 may be provided at a position where it engages with the recesses FRb and CRb. Thereby, the edge ring FR and the cover ring CR can be positioned respectively.

[0080] As described above, with reference to FIGS. 10 to 13, an example in which the edge ring FR and / or the cover ring CR is placed on the base plate 781 of the cassette 78 using the upper fork FK21 has been illustrated. However, the present invention is not limited to this. For example, when the storage module SM is not in operation, an operator may manually place the edge ring FR and / or the cover ring CR on the base plate 781 of the cassette 78.

[0081] With reference to FIG. 14, a case where the second assembly A2 (the transfer jig CJ and the edge ring FR) transported into the storage module SM by the upper fork FK21 is placed on the base plate 781 of the cassette 78 will be described. The operation shown in FIG. 14 is, for example, a case where the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and is performed when the control unit CU selects and executes the single transfer mode described later. FIG. 14 is a schematic top view showing an example of the second assembly A2 stored in the cassette 78.

[0082] First, as shown in FIG. 14, the upper fork FK21 holding the second assembly A2 is made to enter above the base plate 781. Subsequently, the upper fork FK21 is lowered. As a result, the second assembly A2 held by the upper fork FK21 is placed on the placement surface 781a of the base plate 781.

[0083] In this way, the transfer robot TR2 can hold the second assembly A2 (transfer jig CJ and edge ring FR) with the upper fork FK21 and transfer the transfer jig CJ and the edge ring FR simultaneously.

[0084] Note that in the example of FIG. 14, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may also be used.

[0085] Referring to FIG. 15, a case where the transfer jig CJ conveyed into the storage module SM by the upper fork FK21 is placed on the base plate 781 of the cassette 78 will be described. The operation shown in FIG. 15 is a case where the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, for example, and is performed when the control unit CU selects and executes the single transfer mode described later. FIG. 15 is a schematic plan view showing an example of the transfer jig CJ stored in the cassette 78.

[0086] First, as shown in FIG. 15, the upper fork FK21 holding the transfer jig CJ is made to enter above the base plate 781. Subsequently, the upper fork FK21 is lowered. As a result, the transfer jig CJ held by the upper fork FK21 is placed on the placement surface 781a of the base plate 781.

[0087] In this way, the transfer robot TR2 can hold the transfer jig CJ with the upper fork FK21 and transfer the transfer jig CJ alone.

[0088] Note that in the example of FIG. 15, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may also be used.

[0089] Referring to FIG. 16, another example of the cassette 78 included in the storage module SM of FIGS. 3 and 4 will be described. FIG. 16 is a schematic perspective view showing another example of the cassette 78 within the storage module SM, and shows a cassette 78X for storing an edge ring FR, which is an example of a consumable member.

[0090] The cassette 78X shown in FIG. 16 differs from the cassette 78 shown in FIG. 9 in that, instead of a plurality of guide pins 782, it has an inclined block 782b having an inclined surface that abuts against the outer peripheral portion of the edge ring FR to hold the edge ring FR in a predetermined position. Note that other configurations may be the same as those of the cassette 78 shown in FIG. 9.

[0091] Further, as yet another example, the cassette 78 may have an inclined block (not shown) having an inclined surface that abuts against the inner peripheral portion of the cover ring CR to hold the cover ring CR in a predetermined position. Further, as yet another example, the cassette 78 may have an inclined block (not shown) having an inclined surface that abuts against the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR to hold the edge ring FR and the cover ring CR in a predetermined position. Also, the inclined block may be configured to abut against the inner peripheral portion of the edge ring FR to hold the edge ring FR in a predetermined position. Further, the inclined block may be configured to abut against the outer peripheral portion of the cover ring CR to hold the cover ring CR.

[0092] 〔Method of transporting consumable member〕 Referring to FIGS. 17 and 18, as an example of a method for transporting consumable members in the processing system PS of the embodiment, a case will be described in which the control unit CU selects and executes a simultaneous transport mode in which the edge ring FR and the cover ring CR are simultaneously transported by the transport robot TR2. Hereinafter, it will be described on the assumption that the control unit 90 is included in the control unit CU and the control unit CU controls the transport robot TR2 and the elevating mechanism 50. However, the control unit 90 may be provided separately from the control unit CU, the control unit CU may control the transport robot TR2, and the control unit 90 may control the elevating mechanism 50. Note that the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR have a configuration that overlaps in plan view.

[0093] As shown in FIG. 18(a), the control unit CU causes the upper fork FK21 holding the unused edge ring FR and cover ring CR to enter above the electrostatic chuck 112.

[0094] Subsequently, as shown in FIG. 18(b), the control unit CU raises the plurality of support pins 521 from the standby position to the support position. As a result, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR held by the upper fork FK21, the cover ring CR is lifted by the plurality of support pins 521, and the cover ring CR is separated from the upper fork FK21. At this time, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Therefore, when the cover ring CR is lifted by the plurality of support pins 521, the edge ring FR is also lifted together with the cover ring CR. That is, the edge ring FR and the cover ring CR are integrally separated from the upper fork FK21.

[0095] Subsequently, as shown in FIG. 18(c), the control unit CU causes the upper fork FK21 that is not holding the object to be transported to exit.

[0096] Subsequently, as shown in FIG. 18(d), the control unit CU lowers the plurality of support pins 521 from the support position to the standby position. As a result, the edge ring FR and the cover ring CR supported by the plurality of support pins 521 are placed on the electrostatic chuck 112. As described above, as shown in FIG. 17, the edge ring FR and the cover ring CR are simultaneously carried into the plasma processing chamber 10 and placed on the electrostatic chuck 112.

[0097] When the edge ring FR and the cover ring CR placed on the electrostatic chuck 112 are carried out of the plasma processing chamber 10, the control unit CU performs an operation reverse to the above-described loading of the edge ring FR and the cover ring CR.

[0098] As described above, according to the processing system PS of the embodiment, the edge ring FR and the cover ring CR can be simultaneously transported.

[0099] With reference to FIGS. 19 to 21, as another example of the method for transporting consumable members in the processing system PS of the embodiment, a case will be described in which the control unit CU selects and executes a single transport mode in which only the edge ring FR is transported to the transport robot TR2. Hereinafter, it will be described on the assumption that the control unit 90 is included in the control unit CU and the control unit CU controls the transport robot TR2 and the lifting mechanism 50. However, the control unit 90 may be provided separately from the control unit CU, the control unit CU may control the transport robot TR2, and the control unit 90 may control the lifting mechanism 50. It is assumed that the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap in plan view.

[0100] As shown in FIG. 20(a), the control unit CU causes the upper fork FK21 holding the transfer jig CJ holding the unused edge ring FR above the electrostatic chuck 112 to enter.

[0101] Subsequently, as shown in Fig. 20(b), the control unit CU raises a plurality of support pins 511 from the standby position to the support position. As a result, the upper ends of the plurality of support pins 511 abut against the lower surface of the transfer jig CJ held by the upper fork FK21, the transfer jig CJ is lifted by the plurality of support pins 511, and the transfer jig CJ is separated from the upper fork FK21. At this time, the inner peripheral portion of the edge ring FR is placed on the transfer jig CJ. Therefore, when the transfer jig CJ is lifted by the plurality of support pins 511, the edge ring FR is also lifted together with the transfer jig CJ. That is, the transfer jig CJ and the edge ring FR are separated from the upper fork FK21 integrally.

[0102] Subsequently, as shown in Fig. 20(c), the control unit CU retracts the upper fork FK21 that is not holding the object to be transferred.

[0103] Subsequently, as shown in Fig. 20(d), the control unit CU raises a plurality of support pins 521 from the standby position to the support position. As a result, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR placed on the electrostatic chuck 112, the cover ring CR is lifted by the plurality of support pins 521, and the cover ring CR is separated from the electrostatic chuck 112. Also, the outer peripheral portion of the edge ring FR placed on the transfer jig CJ is placed on the inner peripheral portion of the cover ring CR.

[0104] Subsequently, as shown in Fig. 21(a), the control unit CU inserts the upper fork FK21 that is not holding the object to be transferred between the transfer jig CJ, the edge ring FR, the cover ring CR, and the electrostatic chuck 112.

[0105] Subsequently, as shown in Fig. 21(b), the control unit CU lowers the plurality of support pins 511 from the support position to the standby position. At this time, since the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR, only the transfer jig CJ supported by the plurality of support pins 511 is placed on the upper fork FK21.

[0106] Subsequently, as shown in FIG. 21(c), the control unit CU retracts the upper fork FK21 holding the transfer jig CJ.

[0107] Subsequently, as shown in FIG. 21(d), the control unit CU lowers the plurality of support pins 521 from the support positions to the standby positions. As a result, the edge ring FR and the cover ring CR supported by the plurality of support pins 521 are placed on the electrostatic chuck 112. As described above, as shown in FIG. 19, only the edge ring FR is carried into the plasma processing chamber 10 and placed on the electrostatic chuck 112 on which the cover ring CR is placed.

[0108] When only the edge ring FR among the edge ring FR and the cover ring CR placed on the electrostatic chuck 112 is carried out of the plasma processing chamber 10, the control unit CU performs an operation reverse to the above-described loading of the edge ring FR.

[0109] As described above, according to the processing system PS of the embodiment, only the edge ring FR can be transported alone without replacing the cover ring CR.

[0110] 〔Method for replacing consumable members〕 With reference to FIG. 22, an example of the method for replacing consumable members of the embodiment will be described. FIG. 22 is a flowchart showing an example of the method for replacing consumable members of the embodiment.

[0111] Hereinafter, an example will be given to explain the case of replacing only the edge ring FR placed on the stage (electrostatic chuck 112) of the aforementioned process module PM12 alone. Specifically, the case of accommodating the edge ring FR used in the process module PM12 in the storage module SM and replacing it with an unused edge ring FR previously accommodated in the storage module SM will be described. Note that the edge ring FR placed on the stages of the process modules PM1 to PM11 other than the process module PM12 can also be replaced by the same method. Further, the method for replacing consumable members in the embodiment shown in FIG. 22 is performed by controlling each part of the processing system PS by the control unit CU.

[0112] As shown in FIG. 22, the method for replacing consumable members in the embodiment includes a wear degree determination step S10, a replaceability determination step S20, a first cleaning step S30, a carry-out step S40, a second cleaning step S50, a carry-in step S60, and a seasoning step S70. Hereinafter, each step will be described.

[0113] The consumption determination step S10 is a step for determining whether it is necessary to replace the edge ring FR placed on the stage of the process module PM12. In the consumption determination step S10, the control unit CU determines whether it is necessary to replace the edge ring FR placed on the stage of the process module PM12. Specifically, the control unit CU determines whether it is necessary to replace the edge ring FR based on, for example, the RF integrated time, the RF integrated power, and the integrated value of a specific step of the recipe. The RF integrated time is the integrated value of the time during which high-frequency power is supplied in the process module PM12 during a predetermined plasma process. The RF integrated power is the integrated value of the high-frequency power supplied in the process module PM12 during a predetermined plasma process. The integrated value of a specific step of the recipe is the integrated value of the time during which high-frequency power is supplied or the integrated value of the high-frequency power in the step in which the edge ring FR is worn out among the steps of the process performed in the process module PM12. Note that the RF integrated time, the RF integrated power, and the integrated value of a specific step of the recipe are values calculated starting from the time when the edge ring FR was replaced, such as when the device was introduced or when maintenance was performed.

[0114] When determining whether it is necessary to replace the edge ring FR based on the RF integrated time, the control unit CU determines that it is necessary to replace the edge ring FR when the RF integrated time reaches the threshold value. On the other hand, the control unit CU determines that it is not necessary to replace the edge ring FR when the RF integrated time does not reach the threshold value. Note that the threshold value is a value determined according to the type of the material of the edge ring FR or the like through preliminary experiments or the like.

[0115] When determining whether it is necessary to replace the edge ring FR based on the RF integrated power, the control unit CU determines that it is necessary to replace the edge ring FR when the RF integrated power reaches the threshold value. On the other hand, the control unit CU determines that it is not necessary to replace the edge ring FR when the RF integrated power does not reach the threshold value. Note that the threshold value is a value determined according to the type of the material of the edge ring FR or the like through preliminary experiments or the like.

[0116] When determining whether it is necessary to replace the edge ring FR based on the integrated value of specific steps of the recipe, if the RF integrated time or RF integrated power in a specific step reaches the threshold value, the control unit CU determines that it is necessary to replace the edge ring FR. In contrast, if the RF integrated time or RF integrated power in a specific step does not reach the threshold value, the control unit CU determines that it is not necessary to replace the edge ring FR. When determining whether it is necessary to replace the edge ring FR based on the integrated value of specific steps of the recipe, the timing for replacing the edge ring FR can be calculated based on the step in which high-frequency power is applied and the edge ring FR is worn. Therefore, the timing for replacing the edge ring FR can be calculated with particularly high accuracy. Note that the threshold value is a value determined according to the type of the material of the edge ring FR or the like through preliminary experiments or the like.

[0117] In the wear determination step S10, if it is determined that it is necessary to replace the edge ring FR placed on the stage of the process module PM12, the control unit CU performs the replacement determination step S20. In the wear determination step S10, if it is determined that it is not necessary to replace the edge ring FR placed on the stage of the process module PM12, the control unit CU repeats the wear determination step S10.

[0118] The exchangeability determination step S20 is a step of determining whether the state of the processing system PS is a state in which the edge ring FR can be exchanged. In the exchangeability determination step S20, the control unit CU determines whether the state of the processing system PS is a state in which the edge ring FR can be exchanged. Specifically, for example, when no processing is being performed on the substrate W in the process module PM12 that exchanges the edge ring FR, the control unit CU determines that the edge ring FR can be exchanged. In contrast, when processing is being performed on the substrate W in the process module PM12, the control unit CU determines that the edge ring FR cannot be exchanged. Also, for example, when the processing of the substrates W in the same lot as the substrate W on which processing is being performed in the process module PM12 that exchanges the edge ring FR has been completed, the control unit CU may determine that the edge ring FR can be exchanged. In this case, the control unit CU determines that the edge ring FR cannot be exchanged until the processing of the substrates W in the same lot as the substrate W on which processing is being performed in the process module PM12 is completed.

[0119] In the exchangeability determination step S20, when it is determined that the state of the processing system PS is a state in which the edge ring FR can be exchanged, the control unit CU performs the first cleaning step S30. In the exchangeability determination step S20, when it is determined that the state of the processing system PS is a state in which the edge ring FR cannot be exchanged, the control unit CU repeats the exchangeability determination step S20.

[0120] The first cleaning step S30 is a step of performing a cleaning process on the process module PM12. In the first cleaning step S30, the control unit CU controls the gas introduction system, the exhaust system, the power introduction system, etc. to perform a cleaning process on the process module PM12. The cleaning process is a process of removing deposits in the process module PM12 generated by plasma treatment with plasma of a processing gas or the like and stabilizing the inside of the process module PM12 in a clean state. By performing the first cleaning step S30, when the edge ring FR is carried out from the stage in the carry-out step S40, it is possible to suppress the deposits in the process module PM12 from being lifted up. As the processing gas, for example, oxygen (O 2 ) gas, fluorocarbon (CF) - based gas, nitrogen (N 2 ) gas, argon (Ar) gas, helium (He) gas, or a mixed gas of two or more of these can be used. Further, when performing the cleaning process on the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may be performed with a substrate W such as a dummy wafer placed on the upper surface of the electrostatic chuck 112. Note that when there are no deposits in the process module PM12 or when the deposits cannot be lifted up, the first cleaning step S30 may not be performed. Also, when the edge ring FR is adsorbed to the stage by the electrostatic chuck 112, a charge removal process is performed by the next carry-out step S40.

[0121] The unloading step S40 is a step of unloading the edge ring FR from inside the process module PM12 without opening the process module PM12 to the atmosphere. In the unloading step S40, the control unit CU controls each part of the processing system PS so as to unload the edge ring FR from inside the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the transfer robot TR2 unloads the edge ring FR placed on the stage inside the process module PM12 from the process module PM12. Subsequently, the gate valve G4 is opened, and the transfer robot TR2 stores the edge ring FR unloaded from the process module PM12 in the storage module SM.

[0122] The second cleaning step S50 is a step of cleaning the surface on which the edge ring FR of the stage of the process module PM12 is placed. In the second cleaning step S50, the control unit CU performs a cleaning process on the surface on which the edge ring FR of the stage of the process module PM12 is placed by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The cleaning process in the second cleaning step S50 can be performed, for example, in the same manner as the first cleaning step S30. That is, as the processing gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of these can be used. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may be performed with a substrate W such as a dummy wafer placed on the upper surface of the electrostatic chuck 112. Note that the second cleaning step S50 may be omitted.

[0123] The loading step S60 is a step of loading the edge ring FR into the process module PM12 and placing it on the stage without opening the process module PM12 to the atmosphere. In the loading step S60, the control unit CU controls each part of the processing system PS so as to load the edge ring FR into the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the unused edge ring FR stored in the storage module SM is unloaded by the transfer robot TR2. Subsequently, the gate valve G1 is opened, and the unused edge ring FR is loaded into the process module PM12 by the transfer robot TR2 and placed on the stage. For example, the control unit CU controls each part of the processing system PS, and places the edge ring FR stored in the storage module SM on the stage in the process module PM12 by the transfer methods shown in FIGS. 20(a) to 20(d) and FIGS. 21(a) to 21(d).

[0124] The seasoning step S70 is a step of performing seasoning processing on the process module PM12. In the seasoning step S70, the control unit CU performs seasoning processing on the process module PM12 by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The seasoning process is a process for stabilizing the temperature and the state of deposits in the process module PM12 by performing a predetermined plasma process. Also, in the seasoning step S70, after the seasoning process of the process module PM12, a quality control wafer may be loaded into the process module PM12, and a predetermined process may be performed on the quality control wafer. Thereby, it is possible to confirm whether the state of the process module PM12 is normal. Note that the seasoning step S70 may be omitted.

[0125] As described above, according to the processing system PS of the embodiment, the edge ring FR is carried out from inside the process module PM12 by the transfer robot TR2 without opening the process module PM12 to the atmosphere. Thereafter, the inside of the process module PM12 is subjected to a cleaning process, and subsequently, the edge ring FR is carried into the process module PM12 by the transfer robot TR2. As a result, only the edge ring FR can be replaced alone without an operator manually replacing the edge ring FR. Therefore, the time required for replacing the edge ring FR can be shortened, and productivity is improved. Further, by cleaning the surface on which the edge ring FR is placed before the edge ring FR is carried in, it is possible to suppress the presence of deposits between the edge ring FR and the surface on which the edge ring FR is placed. As a result, the temperature controllability of the edge ring FR can be maintained favorably by improving the contact between the two.

[0126] In addition, even when simultaneously replacing the edge ring FR and the covering CR placed on the stage (electrostatic chuck 112) of the aforementioned process module PM12, the same method as when replacing only the edge ring FR alone can be applied. In this case, in the consumption determination step S10, the control unit CU determines whether it is necessary to replace the edge ring FR and the covering CR placed on the stage of the process module PM12. In the carry-out step S40, the control unit CU controls each part of the processing system PS and carries out the edge ring FR and the covering CR placed on the internal stage of the process module PM12. In the carry-in step S60, the control unit CU controls each part of the processing system PS and places the edge ring FR and the covering CR stored in the storage module SM on the stage inside the process module PM12 by the transfer method shown in FIGS. 18(a) to 18(d).

[0127] With reference to FIGS. 23 to 25, another example of a plasma processing apparatus used as the process modules PM1 to PM12 included in the processing system PS of FIG. 1 will be described.

[0128] The plasma processing apparatus 1X includes a plasma processing chamber 10X and a lifting mechanism 50X, instead of the plasma processing chamber 10 and the lifting mechanism 50 in the plasma processing apparatus 1. Note that other configurations may be the same as those of the plasma processing apparatus 1.

[0129] The plasma processing chamber 10X includes a substrate support portion 11X and an upper electrode 12. The substrate support portion 11X is disposed in the lower region of the plasma processing space 10s in the plasma processing chamber 10X. The upper electrode 12 is disposed above the substrate support portion 11X and can function as a part of the top plate of the plasma processing chamber 10X.

[0130] The substrate support portion 11X supports the substrate W in the plasma processing space 10s. The substrate support portion 11X includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113X, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W on its upper surface. The ring assembly 113X includes an edge ring FRX and a cover ring CRX. The edge ring FRX has an annular shape and is disposed around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The edge ring FRX improves, for example, the uniformity of plasma processing. The cover ring CRX has an annular shape and is disposed on the outer peripheral portion of the edge ring FRX. The cover ring CRX protects, for example, the upper surface of the insulator 115 from plasma. In the example of FIG. 23, the outer diameter of the edge ring FRX is the same as, or smaller than, the inner diameter of the cover ring CRX. That is, in plan view, the edge ring FRX and the cover ring CRX do not overlap. Thereby, the edge ring FRX and the cover ring CRX move up and down independently. The insulator 115 is disposed on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10X and supports the lower electrode 111 and the insulator 115.

[0131] The elevating mechanism 50X raises and lowers the substrate W, the edge ring FRX, and the cover ring CRX. The elevating mechanism 50X includes a first elevating mechanism 51, a third elevating mechanism 53, and a fourth elevating mechanism 54.

[0132] The first elevating mechanism 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted into through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112 and can project and retract with respect to the upper surface of the electrostatic chuck 112. By projecting with respect to the upper surface of the electrostatic chuck 112, the upper ends of the plurality of support pins 511 abut against the lower surface of the substrate W to support the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. As the actuator 512, a motor such as a DC motor, a stepping motor, or a linear motor, an air drive mechanism such as an air cylinder, a piezo actuator, or the like can be used. Such a first elevating mechanism 51 raises and lowers the plurality of support pins 511, for example, when transferring the substrate W between the transfer robots TR1 and TR2 and the substrate support portion 11.

[0133] The third elevating mechanism 53 includes a plurality of support pins 531 and an actuator 532. The plurality of support pins 531 are inserted into through holes H3 formed in the insulator 115 and can project and retract with respect to the upper surface of the insulator 115. By projecting with respect to the upper surface of the insulator 115, the upper ends of the plurality of support pins 531 abut against the lower surface of the edge ring FRX to support the edge ring FRX. The actuator 532 raises and lowers the plurality of support pins 531. As the actuator 532, for example, the same one as the actuator 512 can be used.

[0134] The fourth lifting mechanism 54 includes a plurality of support pins 541 and an actuator 542. The plurality of support pins 541 are inserted into through holes H4 formed in the insulator 115 and can project and retract with respect to the upper surface of the insulator 115. By projecting with respect to the upper surface of the insulator 115, the upper ends of the plurality of support pins 541 abut against the lower surface of the cover ring CRX to support the cover ring CRX. The actuator 542 raises and lowers the plurality of support pins 541. As the actuator 542, for example, the same one as the actuator 512 can be used.

[0135] In such a lifting mechanism 50X, when delivering the edge ring FRX and the cover ring CRX between the transfer robots TR1 and TR2 and the substrate support portion 11, the plurality of support pins 531 and 541 are raised and lowered. For example, when the edge ring FRX and the cover ring CRX placed on the electrostatic chuck 112 are carried out by the transfer robots TR1 and TR2, as shown in FIG. 24, the plurality of support pins 531 and 541 are raised. Thereby, the edge ring FRX is lifted by the plurality of support pins 531, and the cover ring CRX is lifted by the plurality of support pins 541, and the edge ring FRX and the cover ring CRX can be carried out simultaneously by the transfer robots TR1 and TR2.

[0136] Also, in such a lifting mechanism 50X, when delivering only the edge ring FRX between the transfer robots TR1 and TR2 and the substrate support portion 11, the plurality of support pins 531 are raised and lowered. For example, when only the edge ring FRX placed on the electrostatic chuck 112 is carried out by the transfer robots TR1 and TR2, as shown in FIG. 25, the plurality of support pins 531 are raised. Thereby, only the edge ring FRX is lifted by the plurality of support pins 531, and the edge ring FRX can be carried out alone by the transfer robots TR1 and TR2.

[0137] In the above-described embodiment, the edge rings FR and FRX and the cover rings CR and CRX are examples of annular members, the edge rings FR and FRX are examples of inner rings, and the cover rings CR and CRX are examples of outer rings. Also, the transfer robots TR1 and TR2 are examples of transfer devices. Further, the support pin 521 is an example of a first support pin, the support pin 511 is an example of a second support pin, the support pin 531 is an example of a third support pin, and the support pin 541 is an example of a fourth support pin.

[0138] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

[0139] In the above embodiment, the elevating mechanisms 50 and 50X are described as mechanisms for elevating the edge ring FR and / or the cover ring CR, but the present invention is not limited thereto. For example, when the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap, a through hole is formed in the cover ring CR, and a first holding portion that fits into the through hole and a second holding portion that is connected in the axial direction of the first holding portion and has a protruding portion protruding from the outer periphery of the first holding portion are provided. The edge ring FR and the cover ring CR can be independently lifted by the support pin. For example, by passing the first holding portion through the through hole of the cover ring CR and abutting the tip of the first holding portion against the back surface of the cover ring CR, the edge ring FR can be lifted alone. Also, for example, by passing the first holding portion through the through hole of the cover ring CR and abutting the protruding portion of the second holding portion against the lower surface of the cover ring CR, the cover ring CR can be lifted alone. The details of this configuration are described in the specification of U.S. Patent Application Publication No. 2020 / 0219753.

[0140] In the above-described embodiment, the case of conveying the edge ring between the storage module and the process module has been described, but the present disclosure is not limited thereto. For example, instead of the edge ring, the present disclosure can be similarly applied to the case of conveying another consumable member attached in the process module, such as a cover ring, a top plate of the upper electrode, etc.

Explanation of Signs

[0141] 10 Plasma processing chamber 11 Substrate support part 112 Electrostatic chuck 113 Ring assembly 50 Lifting mechanism 78 Cassette 781 Base plate 782 Guide pin CR Cover ring CRa Notch CU Control unit FR Edge ring FRa Notch PS Processing system TM1,TM2 Vacuum transfer module TR1,TR2 Transfer robot W Substrate

Claims

1. A container for storing an annular member, A base plate on which the annular member is placed is provided, The base plate is a mounting surface on which the annular member is mounted; A plurality of guide pins protruding from the mounting surface, the guide pins positioning the annular member; an outer frame portion protruding upward from an outer periphery of the mounting surface, the outer frame portion having an upper surface on which a lower surface of another base plate is detachably mounted; having Storage container.

2. The base plate is provided in multiple stages. The storage container of claim 1 .

3. The base plate is a fork insertion groove that is recessed with respect to the placement surface and into which a fork of a transport robot that transports the annular member is inserted; 3. The storage container according to claim 1 or 2.

4. The plurality of guide pins have a tapered conical tip. The container according to any one of claims 1 to 3.

5. The annular member has a notch on an outer periphery, At least one of the plurality of guide pins positions the annular member by contacting the outer periphery of the annular member.

5. A storage container according to any one of claims 1 to 4.

6. The annular member has a notch on its inner circumference, At least one of the plurality of guide pins contacts the inner circumference of the annular member to position the annular member.

6. A storage container according to any one of claims 1 to 5.

7. The annular member is a member that is disposed around the substrate during plasma processing.

7. A storage container according to any one of claims 1 to 6.

8. The annular member has a plurality of notches spaced apart from one another in a circumferential direction, the plurality of guide pins includes a plurality of pins that engage with respective ones of the plurality of notches; A container according to any one of claims 1 to 7.

9. The annular member has a notch on at least one of an outer periphery and an inner periphery, The notch has a V-shape in a plan view.

9. A storage container according to any one of claims 1 to 8.

10. The annular member has a notch on at least one of an outer periphery and an inner periphery, The plurality of guide pins include a pin that engages with the notch.

10. The storage container according to any one of claims 1 to 9.

11. A storage module including a storage container for storing an annular member; a vacuum transfer module connected to the storage module, the vacuum transfer module having a transfer robot that transfers the annular member to the storage container; Equipped with the container has a base plate on which the annular member is placed, The base plate is a mounting surface on which the annular member is mounted; A plurality of guide pins protruding from the mounting surface, the guide pins positioning the annular member; an outer frame portion protruding upward from an outer periphery of the mounting surface, the outer frame portion having an upper surface on which a lower surface of another base plate is detachably mounted; having Processing system.

12. A base plate for housing an annular member, comprising: The base plate is a mounting surface on which the annular member is mounted; A plurality of guide pins protruding from the mounting surface for positioning the annular member; an outer frame portion protruding upward from an outer periphery of the mounting surface, the outer frame portion having an upper surface on which a lower surface of another base plate is detachably mounted; having Base plate.

Images