CLEANING BRUSH, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a technique for suppressing a cleaning brush from hindering discharge of cleaning liquid.SOLUTION: A cleaning brush cleans a chucking surface of a chuck. The cleaning brush includes a brush base linearly extending radially to the outside in a radial direction from a rotation center line of the chuck, and a plurality of contact portions which protrudes from the brush base and contacts the suction surface. When viewed in a direction orthogonal to the suction surface, a plurality of rows each including the plurality of contact portions arranged at intervals in the first direction, is provided at intervals in a second direction intersecting the first direction. The second direction is a longitudinal direction of the brush base. The first direction is a direction that obliquely intersects the second direction, and is a direction that inclines outward in the radial direction from a radially inner side of the chuck as the same goes from the upstream side in the rotational direction of the chuck to the downstream side in the rotational direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a cleaning brush, a substrate processing apparatus, and a substrate processing method. [Background technology]

[0002] The cleaning brush described in Patent Document 1 is provided on a machine tool for cleaning a surface on which a workpiece is placed. The cleaning brush comprises a brush base and a plurality of brush rows. The brush base is rotated about an axis line that is substantially perpendicular to the surface to be cleaned. The plurality of brush rows are disposed on the surface of the brush base facing the surface to be cleaned. Each of the brush rows is disposed along an inclined line that starts midway along a radial line extending from the axis line and is inclined with respect to the radial line. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-59881 A Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for preventing a cleaning brush from interfering with the discharge of cleaning liquid. [Means for solving the problem]

[0005] A cleaning brush according to one aspect of the present disclosure cleans an adsorption surface of a chuck. The cleaning brush includes a brush base extending linearly from a rotation centerline of the chuck radially outward, and a plurality of contact portions protruding from the brush base and contacting the adsorption surface. When viewed from a direction perpendicular to the adsorption surface, a plurality of rows of the contact portions arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction. The second direction is the longitudinal direction of the brush base. The first direction is a direction that intersects obliquely with the second direction and is a direction that inclines from the radial inner side to the radial outer side of the chuck as it moves from the upstream side in the rotation direction of the chuck to the downstream side in the rotation direction. When viewed from a direction perpendicular to the adsorption surface, a direction perpendicular to the first direction is defined as a third direction, and the distance between two adjacent rows in the third direction is greater than the distance between two adjacent contact portions in each row in the first direction. Effect of the Invention

[0006] According to one aspect of the present disclosure, it is possible to prevent the cleaning brush from interfering with the discharge of the cleaning liquid. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a side view showing an example of a chuck and a tool driving unit. [Diagram 3] FIG. 3 is a plan view showing a cleaning brush according to one embodiment. [Figure 4] FIG. 4 is an enlarged plan view of a portion of FIG. [Diagram 5] FIG. 5 is a plan view showing an example of the flow of the cleaning liquid in the vicinity of the cleaning brush of FIG. [Figure 6] FIG. 6 is a side view showing an example of a type of contact portion. [Figure 7] FIG. 7 is a plan view showing an example of a swinging portion. [Figure 8] FIG. 8 is a plan view showing an example of the swing range of the brush base. [Figure 9] FIG. 9 is a plan view showing an example of the flow of the cleaning liquid in the vicinity of the cleaning brush in FIG. [Figure 10]FIG. 10 is a plan view showing an example of a plurality of contact parts arranged on an imaginary circle. [Figure 11] FIG. 11 is a plan view showing a modification of the swing range of the brush base. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the same or corresponding configurations in each drawing are given the same reference numerals, and description thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular directions. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical directions. The U-axis direction, the V-axis direction, and the Z-axis direction are mutually perpendicular directions. The U-axis direction and the V-axis direction are horizontal directions, the U-axis direction is the longitudinal direction of the brush base 51, and the V-axis direction is the width direction of the brush base 51.

[0009] A substrate processing apparatus 1 according to one embodiment will be described with reference to Fig. 1. In this embodiment, the substrate processing apparatus 1 is a grinding apparatus that grinds a substrate W, but may also be a polishing apparatus, a cutting apparatus, a trimming apparatus, or the like. The substrate processing apparatus 1 may be any apparatus that processes a substrate W that is attracted to an attraction surface of a chuck 20. The substrate W includes a semiconductor substrate or a glass substrate. The semiconductor substrate is a silicon wafer or a compound semiconductor wafer.

[0010] The substrate processing apparatus 1 includes, for example, a turntable 10, four chucks 20, and three drive units 30. The turntable 10 holds the four chucks 20 around a rotation center line R1, and rotates about the rotation center line R1 to rotate the four chucks 20. When viewed from above, the rotation direction of the turntable 10 may be switched between a clockwise direction and a counterclockwise direction.

[0011] The four chucks 20 are disposed at equal intervals around the rotation center line R1 of the turntable 10. Each chuck 20 rotates together with the turntable 10 and moves, for example, to a first carry-in / out position A0, a first grinding position A1, a second grinding position A2, a third grinding position A3, and the first carry-in / out position A0 in this order. The first carry-in / out position A0 serves as a carry-in position where the transport device 2 transfers the substrate W to the chuck 20 and a carry-out position where the transport device 2 receives the substrate W from the chuck 20. In this embodiment, the carry-in position and the carry-out position are the same position, but the carry-in position and the carry-out position may be different positions. The first grinding position A1 is a position where the primary grinding of the substrate W is performed. The second grinding position A2 is a position where the secondary grinding of the substrate W is performed. The third grinding position A3 is a position where the tertiary grinding of the substrate W is performed.

[0012] The first loading / unloading position A0, the first grinding position A1, the second grinding position A2, and the third grinding position A3 are arranged in this order counterclockwise around the rotation center line R1 of the rotary table 10, but the technology of the present disclosure is not limited to this. For example, a second loading / unloading position may be arranged instead of the third grinding position A3. The second loading / unloading position, like the first loading / unloading position A0, serves as a loading position where the transport device 2 transfers the substrate W to the chuck 20 and a unloading position where the transport device 2 receives the substrate W from the chuck 20. In this case, for example, two substrates W are loaded into the first loading / unloading position A0 and the second loading / unloading position, then ground at the first grinding position A1 and the second grinding position A2, and then unloaded at the first loading / unloading position A0 and the second loading / unloading position.

[0013] Next, an example of the chuck 20 and the driving unit 30 will be described with reference to Fig. 2. The chuck 20 has an adsorption surface 21 that adsorbs the substrate W. The adsorption surface 21 adsorbs the substrate W from below. The adsorption surface 21 is a horizontal plane in Fig. 2, but it may be a conical surface that is symmetrical about the rotation center line R2 of the chuck 20. In the latter case, the rotation center line R2 is inclined with respect to the Z-axis direction, and the thickness distribution of the substrate W after grinding can be adjusted by adjusting the angle of inclination.

[0014] The chuck 20 has, for example, a porous body 22 on its suction surface 21. The porous body 22 is embedded in a recess in the upper surface of a base 23. When the gas inside the porous body 22 is sucked and the air pressure in the porous body 22 becomes a negative pressure lower than atmospheric pressure, the substrate W is sucked onto the porous body 22. On the other hand, when the suction of the gas is stopped and the air pressure in the porous body 22 is returned to atmospheric pressure, the suction of the substrate W is released.

[0015] The chuck 20 is attached to the rotary table 10 so as to be rotatable about a rotation center line R2. A chuck motor 25 for rotating the chuck 20 is provided for each chuck 20. The rotational driving force of the chuck motor 25 may be transmitted to the chuck 20 via a rotation transmission mechanism such as a timing belt or a gear.

[0016] The driving unit 30 drives the grinding tool D. The driving unit 30 rotates and raises and lowers the grinding tool D. The grinding tool D grinds the substrate W adsorbed to the chuck 20. Note that the tool for processing the substrate W is not limited to the grinding tool D, and may be, for example, a polishing tool, a cutting tool, or a trimming tool.

[0017] The driving unit 30 includes a movable unit 31 to which a grinding tool D is attached. The grinding tool D is pressed against the substrate W to grind the substrate W. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grindstones D2 arranged in a ring shape on the lower surface of the grinding wheel D1. The grindstones D2 may be fixed to the entire lower surface of the grinding wheel D1.

[0018] The movable part 31 has a flange 32 on which the grinding tool D is attached, a spindle shaft 33 on whose lower end the flange 32 is provided, and a spindle motor 34 that rotates the spindle shaft 33. The flange 32 is arranged horizontally, and the grinding tool D is attached to its lower surface. The spindle shaft 33 is arranged vertically. The spindle motor 34 rotates the spindle shaft 33 to rotate the grinding tool D attached to the flange 32. A rotation center line R3 of the grinding tool D is the rotation center line of the spindle shaft 33.

[0019] The drive unit 30 further has a lifting unit 35 that raises and lowers the movable unit 31. The lifting unit 35 has, for example, a vertical Z-axis guide 36, a Z-axis slider 37 that moves along the Z-axis guide 36, and a Z-axis motor 38 that moves the Z-axis slider 37. The movable unit 31 is fixed to the Z-axis slider 37, and the movable unit 31 and the grinding tool D rise and fall together with the Z-axis slider 37. The lifting unit 35 further has a position detector 39 that detects the position of the grinding tool D. The position detector 39 detects, for example, the rotation of the Z-axis motor 38 to detect the position of the grinding tool D.

[0020] The lifting unit 35 lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, comes into contact with the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting unit 35 stops the lowering of the grinding tool D. Thereafter, the lifting unit 35 raises the grinding tool D to the standby position.

[0021] The substrate processing apparatus 1 processes a plurality of substrates W in sequence. When a particle gets caught between the chucking surface 21 of the chuck 20 and the substrate W, the substrate W is locally deformed. When the substrate W is ground in this state, a local concave defect called a dimple is formed on the surface of the substrate W. The particles that cause the dimples are, for example, a transfer product transferred from the substrate W, processing waste generated by processing the substrate W, or fragments generated by damage to the porous body 22.

[0022] Therefore, the substrate processing apparatus 1 includes a cleaning brush 50 as shown in Fig. 1. The cleaning brush 50 cleans the suction surface 21 of the rotating chuck 20 and removes particles adhering to the suction surface 21. The cleaning brush 50 cleans the suction surface 21 after removing one substrate W from the suction surface 21 and before adsorbing another substrate W to the suction surface 21. The cleaning brush 50 is provided, for example, at the first loading / unloading position A0. When the second loading / unloading position is provided instead of the third grinding position A3, the cleaning brush 50 may be provided at both the first loading / unloading position A0 and the second loading / unloading position.

[0023] The substrate processing apparatus 1 also includes a nozzle 80 that supplies a cleaning liquid to the suction surface 21 of the chuck 20. The nozzle 80 is provided, for example, at the first loading / unloading position A0. When the second loading / unloading position is arranged instead of the third grinding position A3, the nozzle 80 may be provided at both the first loading / unloading position A0 and the second loading / unloading position. The nozzle 80 supplies a cleaning liquid to the suction surface 21 of the rotating chuck 20, for example. The cleaning liquid is supplied to the rotation center line R2 of the suction surface 21 or its vicinity, and spreads over the entire radial direction of the suction surface 21 by centrifugal force. For example, DIW (deionized water) is used as the cleaning liquid. The nozzle 80 may be a two-fluid nozzle that mixes and discharges a cleaning liquid and a gas.

[0024] The substrate processing apparatus 1 includes a control unit 90. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the substrate processing apparatus 1. The control unit 90 controls the operation of the substrate processing apparatus 1 by causing the CPU 91 to execute the programs stored in the storage medium 92.

[0025] Next, a cleaning brush 50 according to an embodiment will be described with reference to Figs. 3 to 5. In Fig. 3, only the outline of the brush base 51 is shown to show the arrangement of the contact portions 52. The cleaning brush 50 includes the brush base 51 and a plurality of contact portions 52. The brush base 51 extends linearly radially outward from the rotation center line R2 of the chuck 20. The brush base 51 has a length approximately equal to the radius of the attraction surface of the chuck 20, for example, and extends above the periphery of the attraction surface 21 of the chuck 20. The brush base 51 may be fixed during cleaning of the chuck 20, or may be swung as described later.

[0026] Each contact portion 52 protrudes from the lower surface of the brush base 51 and contacts the adsorption surface 21. Each contact portion 52 scrapes off or peels off particles adhering to the adsorption surface 21. Each contact portion 52 is, for example, a bristle bundle formed by bundling multiple bristles. The bristle bundle is implanted in a hole provided in the lower surface of the brush base 51.

[0027] In this embodiment, each contact portion 52 is a bristle bundle, but may be a sponge or a pin. Each contact portion 52 may be any material that can remove particles adhering to the suction surface 21 of the chuck 20 without damaging the suction surface 21. Each contact portion 52 is preferably made of resin so as not to damage the suction surface of the chuck 20.

[0028] 3, when viewed from a direction perpendicular to the suction surface 21 (Z-axis direction), a plurality of rows 53 each consisting of a plurality of contact portions 52 arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction. The second direction is the longitudinal direction (U-axis direction) of the brush base 51. The longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20 in FIG. 3. The number of rows 53 provided at intervals in the second direction is not particularly limited.

[0029] The first direction is the extension direction of the row 53. The first direction is, for example, a direction that obliquely intersects with the second direction. For example, the first direction is a direction that inclines from the radially inner side to the radially outer side of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction. In other words, the first direction is a direction that inclines radially outward with respect to the rotation center line R2 of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction. Note that the first direction may be a direction that inclines in the opposite direction, or may be a direction that intersects with the second direction perpendicularly.

[0030] When viewed from the Z-axis direction, a plurality of rows 54 each consisting of a plurality of contact portions 52 arranged at intervals in the second direction (U-axis direction) are provided in a fourth direction perpendicular to the second direction. The fourth direction is the width direction (V-axis direction) of the brush base 51. The number of rows 54 is not limited to three, and may be two, or four or more.

[0031] 5, the cleaning liquid L is supplied upstream of the cleaning brush 50 in the rotation direction of the chuck 20. The cleaning liquid L rotates together with the chuck 20 and reaches the cleaning brush 50. The cleaning brush 50 has a discharge path 55 between two adjacent rows 53 for discharging the cleaning liquid L.

[0032] The discharge path 55 extends in a first direction. If the first direction is a direction that inclines from the radially inner side to the radially outer side of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction, the cleaning liquid containing particles discharged from the cleaning brush 50 flows from the radially inner side to the radially outer side of the chuck 20 and is discharged outside the adsorption surface 21 in a short time. Therefore, the time that the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the adsorption surface 21 can be shortened. In addition, the area where the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the adsorption surface 21 can be narrowed.

[0033] Each row 53 includes n contact portions 52 lined up in the first direction. n is a natural number of 2 or more, and preferably a natural number of 3 or more. n is preferably a natural number of 7 or less. In each row 53, the mth (m is a natural number of 1 to n) contact portion 52 located from the upstream side of the chuck 20 in the rotation direction to the downstream side of the rotation direction is referred to as the mth contact portion 52-m.

[0034] 4, when viewed from the Z-axis direction, if a direction perpendicular to the first direction is defined as a third direction, a distance G1 between two adjacent rows 53 in the third direction is larger than a distance G2 between two adjacent contact portions (e.g., first contact portion 52-1 and second contact portion 52-2) in each row 53 in the first direction. The distance G1 between two adjacent rows 53 in the third direction is the width of the discharge path 55. If the distance G1 is larger than the distance G2, the width of the discharge path 55 is wide, and the cleaning liquid L can easily pass through the discharge path 55.

[0035] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 are arranged at equal intervals in the first direction. This can reduce uneven discharge of the cleaning liquid L. Note that in each row 53, the interval in the first direction between the first contact portion 52-1 and the second contact portion 52-2 and the interval in the first direction between the second contact portion 52-2 and the third contact portion 52-3 may be different. The interval G1 in the third direction between two adjacent rows 53 may be larger than the maximum value of the interval G2 in the first direction between two adjacent contact portions 52 in each row 53.

[0036] The multiple rows 53 are arranged at equal intervals in the U-axis direction. This can reduce uneven discharge of the cleaning liquid L. The multiple rows 53 may be arranged at unequal intervals in the U-axis direction. In this case, the interval G1 in the third direction between two adjacent rows 53, i.e., the width of the discharge path 55, varies depending on the combination of rows 53. The width of the discharge path 55 only needs to be larger than the maximum value of the interval G2 in the first direction between two adjacent contact portions in each of the two rows 53 sandwiching the discharge path 55.

[0037] When viewed from the V-axis direction, in two adjacent rows 53, the first contact portion 52-1 of one row 53 and the second contact portion 52-2 of the other row 53 do not overlap in the U-axis direction even in the closest combination, but are separated in the U-axis direction. Compared to the case where they overlap in the U-axis direction, the interval G1 between the two adjacent rows 53 can be made larger, and the width of the discharge path 55 can be made wider. Therefore, the cleaning liquid L can easily pass through the discharge path 55. The second contact portion in this embodiment corresponds to the (n-1)th contact portion recited in the claims.

[0038] When viewed from the V-axis direction, two adjacent rows 53 overlap in the U-axis direction, and a first contact portion 52-1 of one row 53 overlaps with a third contact portion 52-3 of another row in the U-axis direction. There is no gap between the two adjacent rows 53 in the U-axis direction. When viewed from the V-axis direction, multiple contact portions 52 are continuously present in the U-axis direction, and no gaps exist between the multiple contact portions 52. This makes it possible to prevent areas from being left unwashed. The third contact portion in this embodiment corresponds to the nth contact portion described in the claims.

[0039] When viewed from the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have the same dimensions and the same shape. For example, when viewed from the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have a circular shape with the same diameter. Although not shown, when viewed from the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 may have different dimensions or different shapes.

[0040] Next, an example of the type of the contact portion 52 will be described with reference to Fig. 6. In Fig. 6, gaps are illustrated between the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 to clarify the boundaries between them, but there may be no gaps. When viewed from the U-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 overlap each other, and there may be no gaps.

[0041] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 are of different types. As described above, particles of various sizes or materials adhere to the suction surface 21 of the chuck 20. In addition, the suction surface 21 of the chuck 20 has many protrusions and recesses (suction holes), and the adhesion strength of particles differs between the protrusions and the recesses. By using multiple types of contact portions 52, particles of various sizes, materials, and adhesion strengths can be efficiently removed.

[0042] If at least two of the contact portions 52 in each row 53 are of different types, multiple types of particles can be efficiently removed. For example, when the first contact portion 52-1 and the second contact portion 52-2 are of different types, the second contact portion 52-2 and the third contact portion 52-3 may be of the same type. Also, when the second contact portion 52-2 and the third contact portion 52-3 are of different types, the first contact portion 52-1 and the second contact portion 52-2 may be of the same type.

[0043] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have bristles with different wire diameters, for example. The smaller the wire diameter of the bristles, the more flexible the bristles are, and the easier it is to scrape out fine particles that have entered recesses in the adsorption surface 21. Also, the larger the wire diameter of the bristles, the more rigid the bristles are, and the easier it is to peel off particles that have adhered to the adsorption surface 21. When the wire diameters of the bristles are different, the material of the bristles may be the same.

[0044] The bristles may be made of different materials. The first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 may have bristles made of different materials. The lower the bristles' hardness, the higher the flexibility of the bristles, and the easier it is to scrape out fine particles that have entered the recesses of the adsorption surface 21. The higher the bristles' hardness, the higher the rigidity of the bristles, and the easier it is to peel off particles that have adhered to the adsorption surface 21. The hardness of the bristles is determined by the bristles' material. When the bristles are made of resin, the hardness of the resin is expressed, for example, by Shore hardness. When the bristles are made of different materials, the bristles may have the same wire diameter. The bristles may be made of different materials and have different wire diameters.

[0045] In each row 53, the contact portion 52 on the upstream side in the rotation direction of the chuck 20 has bristles with a larger wire diameter than the contact portion 52 on the downstream side in the rotation direction. For example, the first contact portion 52-1 has bristles with a larger wire diameter than the second contact portion 52-2. The second contact portion 52-2 has bristles with a larger wire diameter than the third contact portion 52-3. The wire diameter of the bristles of the contact portion 52 decreases from the upstream side to the downstream side in the rotation direction of the chuck 20. After the particles stuck to the chuck 20 are peeled off with the highly rigid bristles, fine particles that have entered the recesses can be scraped out, improving the particle removal efficiency.

[0046] As described above, the materials of the bristles may be different. The contact portion 52 on the upstream side of the rotation direction of the chuck 20 has bristles made of a harder material than the contact portion 52 on the downstream side of the rotation direction. For example, the first contact portion 52-1 has bristles made of a harder material than the second contact portion 52-2. The second contact portion 52-2 has a diameter made of a harder material than the third contact portion 52-3. The harder the bristles of the contact portion 52 are, the lower the hardness becomes from the upstream side of the rotation direction of the chuck 20 to the downstream side of the rotation direction. After the particles stuck to the chuck 20 are peeled off with the bristles having high rigidity, the fine particles that have entered the recesses can be scraped out, and the particle removal efficiency can be improved.

[0047] As described above, each contact portion 52 is not limited to a bristle bundle of multiple bristles, and may be a sponge or a pin. When each contact portion 52 is a sponge or a pin, if the diameters of the sponge or the pin are different or the materials of the sponge or the pin are different, multiple types of particles can be efficiently removed.

[0048] In each row 54, all of the contact portions 52 may be of the same type, but at least two of the contact portions 52 may be of different types. For example, all of the first contact portions 52-1 may be of the same type, but at least two of the first contact portions 52-1 may be of different types. However, it is preferable that the types of the contact portions 52 and the number of each type are the same between one column 53 and the other columns 53.

[0049] Next, an example of the swinging part 60 will be described with reference to Fig. 7. The cleaning brush 50 includes a swinging part 60 that swings the brush base 51. The swinging part 60 swings the brush base 51, for example, around a swing center line R4 that is perpendicular to the suction surface 21 of the chuck 20. The swing center line R4 of the brush base 51 is provided outside the suction surface 21 of the chuck 20, for example.

[0050] The oscillating unit 60 includes, for example, a first driving source 61, a rotating shaft 62, and a connecting bar 63. The first driving source 61 rotates the rotating shaft 62. The first driving source 61 is, for example, an electric motor. Although a pneumatic actuator may be used as the first driving source 61, if an electric motor is used, the rotating speed and the rotating range can be controlled with high precision. The rotating shaft 62 is disposed vertically. The connecting bar 63 extends linearly from the lower end of the rotating shaft 62 radially outward from the rotating shaft 62. The brush base 51 is connected to the tip of the connecting bar 63 so as to be freely raised and lowered.

[0051] The brush base 51 is provided below the connecting bar 63. The brush base 51 is pressed against the suction surface 21 of the chuck 20 by, for example, the elastic restoring force of a spring 64. The spring 64 is provided between the brush base 51 and the connecting bar 63. There is no particular limitation on the type of spring 64. The spring 64 may be a coil spring, a leaf spring, a disc spring, a bar spring, a ring spring, or the like. The brush base 51 may be pressed against the suction surface 21 of the chuck 20 by its own weight. A weight may be provided on the brush base 51. The pressing pressure can be adjusted by the weight of the weight.

[0052] The swinging unit 60 may include a second driving source 65. The second driving source 65 raises and lowers the brush base 51 by raising and lowering the first driving source 61. The second driving source 65 is, for example, an electric motor. The electric motor is used in combination with a ball screw. Although a pneumatic actuator may be used as the second driving source 65, using an electric motor can reduce impact.

[0053] Next, an example of the swing range of the brush base 51 will be described with reference to Figs. 8 and 9. The brush base 51 is repeatedly rotated between, for example, a first cleaning position indicated by a two-dot chain line in Fig. 8 and a second cleaning position indicated by a solid line in Fig. 8 during cleaning of the chuck 20. When the brush base 51 is located at the second cleaning position, the longitudinal direction (U-axis direction) of the brush base 51 is inclined with respect to the radial direction of the chuck 20 as shown in Fig. 8. Note that while the brush base 51 returns from the second cleaning position to the first cleaning position, the brush base 51 may be raised so that the contact portion 52 does not come into contact with the adsorption surface 21. The contact portion 52 may come into contact with the adsorption surface 21 only while the brush base 51 moves from the first cleaning position to the second cleaning position. The swing of the brush base 51 is performed under the control of the control unit 90.

[0054] The first cleaning position is a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, but may be a position where it does not coincide. In the latter case, the brush base 51 may pass a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20 during oscillation. When the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20.

[0055] 9, even when the brush base 51 is located at the second cleaning position, the first direction in which the discharge passage 55 extends is inclined radially outward of the chuck 20 as it approaches the downstream side in the rotation direction of the chuck 20. The same is true when the brush base 51 is located at the first cleaning position (see FIG. 5).

[0056] While the brush base 51 is oscillated between the first cleaning position and the second cleaning position, the first direction, which is the extension direction of the discharge path 55, is always inclined radially outward of the chuck 20 as it approaches the downstream side in the rotation direction of the chuck 20. As a result, the cleaning liquid containing particles discharged from the cleaning brush 50 always flows from the radially inner side to the radially outer side of the chuck 20 and is discharged outside the adsorption surface 21 in a short time. Therefore, the time that the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the adsorption surface 21 can be shortened. In addition, the area where the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the adsorption surface 21 can be narrowed.

[0057] As shown in Fig. 8, while the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is turned. The first contact portion 52-1A of the second row 53 from the turning center line R4 of the brush base 51 moves in the radial direction of the chuck 20 from the dashed line L1 to the dashed line L2. The moving distance MD is equal to or greater than the interval G3 (MD = G3 in Fig. 8). The interval G3 is the interval between two adjacent rows 53 in the second direction (the longitudinal direction of the brush base), for example, the interval between the first contact portions in the second direction.

[0058] The oscillating unit 60 oscillates the brush base 51 so that the moving distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3. The same location on the suction surface 21 can be cleaned by the multiple contact portions 52, improving the uniformity of cleaning. This is particularly effective when at least two of the contact portions 52 in each row 53 are different types.

[0059] As described above, the swinging part 60 rotates the brush base 51 about the rotation center line R4 perpendicular to the attraction surface 21 of the chuck 20. This makes it possible to maintain a constant distance between the brush base 51 and the attraction surface 21 while the brush base 51 is rotating, and to press the contact part 52 against the attraction surface 21 with a constant pressure.

[0060] While the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is turned. The farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R2 of the chuck 20, the faster the peripheral speed of the chuck 20. The farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R4 of the brush base 51, the faster the peripheral speed of the brush base 51.

[0061] At the contact position of the chuck 20 and the contact portion 52, the greater the relative speed difference between the chuck 20 and the brush base 51, the greater the impact force when the particles adhering to the chuck 20 collide with the contact portion 52. Therefore, in order to make the impact force uniform over the entire radial direction of the adsorption surface 21, the rotation center line R4 of the brush base 51 is provided outside the adsorption surface 21 of the chuck 20. In this case, the farther the contact position of the chuck 20 and the contact portion 52 is from the rotation center line R2 of the chuck 20, the faster the circumferential speed of the chuck 20 becomes, but the slower the circumferential speed of the brush base 51 becomes.

[0062] 10, a plurality of contact portions 52 may be provided on a virtual circle 56 whose center is the rotation center line R4 of the brush base 51 and passes through the rotation center line R2 of the chuck 20. When the brush base 51 rotates, the plurality of contact portions 52 pass through the center of the adsorption surface 21. The center of the adsorption surface 21 can be cleaned by the plurality of contact portions 52, improving the uniformity of cleaning.

[0063] At least two of the contact parts 52 arranged on the imaginary circle 56 may be of different types. By using a plurality of types of contact parts 52, a plurality of types of particles can be efficiently removed from the center of the adsorption surface 21. At least two of the contact parts 52 arranged on the imaginary circle 56 may be made of different materials or have bristles with different wire diameters.

[0064] Next, a modified example of the swing range of the brush base 51 will be described with reference to Fig. 11. During cleaning of the chuck 20, the brush base 51 may be repeatedly moved linearly between, for example, a first cleaning position indicated by a two-dot chain line in Fig. 11 and a second cleaning position indicated by a solid line in Fig. 11.

[0065] The brush base 51 is moved linearly in the longitudinal direction (U-axis direction) of the brush base 51. During this movement, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20. The brush base 51 is oscillated so that the movement distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3 between two adjacent rows 53 in the second direction (the longitudinal direction of the brush base).

[0066] The cleaning brush, the substrate processing device, and the substrate processing method according to the present disclosure have been described above, but the present disclosure is not limited to the above-mentioned embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0067] 20 Chuck 21 Adsorption surface 50 Cleaning Brush 51 Brush stand 52 Contact part 53 columns W substrate

Claims

1. A cleaning brush for cleaning the suction surface of the chuck, a brush base extending linearly radially outward from a rotation center line of the chuck; and a plurality of contact portions protruding from the brush base and contacting the suction surface, When viewed from a direction perpendicular to the attraction surface, a plurality of rows of the contact portions arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction, the second direction being a longitudinal direction of the brush base, the first direction is a direction obliquely intersecting the second direction and inclined from a radially inner side to a radially outer side of the chuck as it moves from an upstream side in a rotation direction of the chuck to a downstream side in the rotation direction of the chuck, When viewed from a direction perpendicular to the adsorption surface, a direction perpendicular to the first direction is defined as a third direction. A cleaning brush, wherein the distance between two adjacent rows in the third direction is greater than the distance between two adjacent contact portions in each row in the first direction.

2. The cleaning brush of claim 1 , wherein the rows are arranged at equal intervals in the second direction.

3. The cleaning brush according to claim 1 or 2, wherein in each row, three or more of the contact portions are arranged at equal intervals in the first direction.

4. Each of the rows includes n (n is a natural number equal to or greater than 3) contact portions arranged in the first direction, In each row, the contact portion located at an m-th position (m is a natural number equal to or greater than 1 and equal to or less than n) from the upstream side in the rotation direction of the chuck to the downstream side in the rotation direction is defined as an m-th contact portion, A cleaning brush as described in any one of claims 1 to 3, wherein, when viewed in the width direction of the brush base, in two adjacent rows, the first contact portion of one row and the (n-1)th contact portion of another row do not overlap in the second direction.

5. Each of the rows includes n (n is a natural number equal to or greater than 3) of the contact portions aligned in the first direction, In each row, the contact portion located at an m-th position (m is a natural number equal to or greater than 1 and equal to or less than n) from the upstream side in the rotation direction of the chuck to the downstream side in the rotation direction is defined as an m-th contact portion, A cleaning brush as described in any one of claims 1 to 4, wherein, when viewed from the width direction of the brush base, in two adjacent rows, a first contact portion of one row and an nth contact portion of another row overlap in the second direction.

6. The cleaning brush according to any one of claims 1 to 5, wherein the contact portion is a tuft of bristles, a sponge, or a pin.

7. A cleaning brush according to any one of claims 1 to 6; The chuck; a nozzle for supplying a cleaning liquid to the suction surface of the chuck; a drive unit that drives a tool that processes the substrate that is attracted to the attraction surface of the chuck; A substrate processing apparatus comprising:

8. Processing a plurality of the substrates in sequence using the substrate processing apparatus according to claim 7; After removing one of the substrates from the suction surface, cleaning the suction surface with the cleaning brush before suctioning another of the substrates onto the suction surface; A substrate processing method comprising:

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